Display device

Abstract

According to the present invention, an organic EL display device (1) has a frame region (FA) around a display region. The frame region is provided with a first power supply trunk line (52), a second power supply trunk line (54), a lead-out line (60), and a flattened film (66) covering the first power supply trunk line, the second power supply trunk line, and the lead-out line. A potential difference exists between a first thin line part (52b) forming the first power supply trunk line and a second lead-out line (64) forming the lead-out line and between a second thin line part (54b) forming the second power supply trunk line and the second lead-out line. A plurality of partition holes (67) extending so as to partition the first thin line portion and the second lead-out line and partition the second thin line part and the second lead-out line in a plan view are formed in the flattened film.

Description

display device

[0001] The present disclosure relates to a display device.

[0002] In recent years, organic electroluminescence (EL) display devices using organic electroluminescence (hereinafter referred to as EL) elements have been put to practical use as display devices. A plurality of organic EL elements are arranged in a predetermined array to form a display area for displaying an image. A frame area is provided outside the display area as a non-display area. The frame area is provided with a large number of wirings together with a drive circuit for controlling the display of the image (see, for example, Patent Document 1).

[0003] Special table 2023-518630 ​​publication

[0004] The numerous wirings provided in the frame region of an organic EL display device include power lines for applying current to the organic EL elements and source lines for transmitting source signals to pixel circuits that control the light emission of the organic EL elements. As images become increasingly finer, these wirings become more densely packed in the frame region. When the organic EL display device is in operation, a potential difference occurs between adjacent wirings of different types.

[0005] The numerous wirings in the frame region are often covered and protected by an organic insulating film. This organic insulating film contains impurity ions such as ammonia ions during the film formation process. Furthermore, moisture penetrates the organic insulating film over time. When moisture penetrates the organic insulating film, a chemical reaction called galvanic action occurs between the wirings, which generates a potential difference, and the impurity ions present in the organic insulating film and the moisture, causing corrosion of the wiring.

[0006] An object of the present disclosure is to suppress corrosion of wirings provided in the frame region of a display device due to battery action between the wirings.

[0007] The present disclosure relates to a display device. The display device according to the present disclosure has a display area for displaying an image and a frame area surrounding the display area. The frame area is provided with first and second wirings adjacent to each other, and an organic insulating film covering the first and second wirings. A partition hole is formed in the organic insulating film, extending between the first and second wirings in a plan view.

[0008] According to the display device of the present disclosure, the partition holes extending between the first wiring and the second wiring in a plan view are formed in the organic insulating film, so that even if a potential difference occurs between the first wiring and the second wiring, the exchange of ions between the first wiring and the second wiring is blocked or reduced, thereby eliminating or reducing the battery action between the first wiring and the second wiring and suppressing corrosion of the first wiring and the second wiring.

[0009] FIG. 1 is a plan view illustrating a schematic configuration of an organic EL display device according to an embodiment. FIG. 2 is a cross-sectional view of the organic EL display device taken along line II-II in FIG. 1. FIG. 3 is a plan view illustrating pixels and various wirings constituting a display region of the organic EL display device according to an embodiment. FIG. 4 is a cross-sectional view of the organic EL display device taken along line IV-IV in FIG. 3. FIG. 5 is a cross-sectional view illustrating a schematic configuration of TFTs and capacitors constituting pixel circuits. FIG. 6 is an enlarged plan view illustrating a portion of the organic EL display device surrounded by VI in FIG. 1. FIG. 7 is an enlarged plan view illustrating a main portion of the organic EL display device surrounded by VII in FIG. 6. FIG. 8 is a cross-sectional view of the main portion of the organic EL display device taken along line VIII-VIII in FIG. 7. FIG. 9 is a cross-sectional view of the main portion of the organic EL display device taken along line IX-IX in FIG. 7. FIG. 10 is a cross-sectional view of the main portion of the organic EL display device taken along line X-X in FIG. 7. FIG. 11 is a cross-sectional view of the main portion of the organic EL display device taken along line XI-XI in FIG. 7. Fig. 12 is a plan view of a portion of an organic EL display device according to another embodiment, which corresponds to Fig. 7. Fig. 13 is a plan view of a portion of an organic EL display device according to another embodiment, which corresponds to Fig. 10. Fig. 14 is a plan view of a portion of an organic EL display device according to another embodiment, which corresponds to Fig. 11.

[0010] Exemplary embodiments will be described in detail below with reference to the drawings. In the following embodiments, an organic EL display device will be described as an example of a display device according to the present disclosure. Note that the drawings are intended to conceptually explain the technology of the present disclosure. Therefore, in the drawings, dimensions, ratios, or numbers may be exaggerated or simplified to facilitate understanding of the technology of the present disclosure.

[0011] In the following embodiments, the "first direction" refers to the horizontal direction of the screen when the display device is oriented in a predetermined state of use. The "second direction" refers to the direction perpendicular to the first direction and to the vertical direction of the screen when the display device is oriented in a predetermined state of use. A row of subpixels refers to a row of subpixels in the first direction. A column of subpixels refers to a row of subpixels in the second direction.

[0012] In the following embodiments, when a component such as a film, layer, or element is provided or formed on another component such as another film, layer, or element, it does not only mean that the other component exists directly on top of the other component, but also includes cases where a component such as a film, layer, or element other than the one component is interposed between the two components.

[0013] In the following embodiments, a description that a certain component is connected to another component means that the components are electrically connected unless otherwise specified. This description not only means a direct connection, but also an indirect connection via other components, within the scope of the spirit of the technology of the present disclosure. This description also includes a case where another component is integrated with a certain component, that is, a part of a certain component constitutes the other component.

[0014] In the following embodiments, a description that a certain component is in the same layer as another component means that the certain component is formed in the same process as the other component. A description that a certain component is a lower layer than the other component means that the certain component is deposited in an earlier process than the other component or is formed from a film deposited in an earlier process. A description that a certain component is an upper layer than the other component means that the certain component is deposited in a later process than the other component or is formed from a film deposited in a later process.

[0015] The organic EL display device 1 of this embodiment is used as a display for a mobile device such as a multi-function phone called a smartphone or a tablet terminal. The organic EL display device 1 may also be used as a display for various other devices such as a personal computer (PC) or a television set.

[0016] -Configuration of Organic EL Display Device- The organic EL display device 1 is a display device that uses organic EL elements 71, also known as OLEDs (Organic Light Emitting Diodes). The organic EL display device 1 employs an active matrix drive system and is configured to provide full-color display. As shown in Figure 1, the organic EL display device 1 has a display area DA and a frame area FA.

[0017] The display area DA is an area for displaying an image and constitutes a screen. The display area DA is provided, for example, in a rectangular shape. The display area DA may be a substantially rectangular shape, such as a shape with at least one arc-shaped side, a shape with at least one arc-shaped corner, or a shape with a notch on at least one side, or may be any other shape.

[0018] The frame area FA is an area that constitutes the non-display portion other than the screen. The frame area FA is provided around the display area DA in, for example, a rectangular shape. The frame area FA may have a frame shape other than a rectangle. The frame area FA includes a terminal portion TP and a bending portion BP. The terminal portion TP and the bending portion BP are provided in portions that constitute the same side of the frame area FA.

[0019] The terminal portion TP is a portion for connecting to an external circuit. The terminal portion TP is provided at an end portion of the frame area FA. Specifically, the terminal portion TP is located near the outer edge of one side of the frame area FA and extends along that side. A plurality of terminals (not shown) are provided in a predetermined pattern on the terminal portion TP. A wiring board CB such as an FPC (Flexible Printed Circuit) is connected to the terminal portion TP.

[0020] The bent portion BP is provided between the terminal portion TP and the display area DA in the frame area FA, extending in the first direction Dx. The bent portion BP is a portion bent around an axis extending in the first direction Dx. The bent portion BP extends horizontally across the entire frame area FA in the first direction Dx. The inorganic insulating film (interlayer insulating film 32) included in the TFT layer 20 is removed from the bent portion BP, resulting in higher flexibility than other portions ( FIGS. 8 and 9 ).

[0021] The frame area FA of the organic EL display device 1 is bent at a bending portion BP by, for example, about 180° to form a U-shape (shown by a two-dot chain line in FIG. 2 ), so that the terminal portion TP and the wiring board CB are disposed on the rear side of the organic EL display device 1. A display control circuit such as a source driver is mounted on the wiring board CB as an integrated circuit (IC) chip or is connected via another circuit board.

[0022] A driving circuit Dc is provided in the frame area FA. The driving circuit Dc is arranged in a portion of the frame area FA that forms a side (either the left or right side in FIG. 1 ) adjacent to the side on which the terminal portion TP is provided. The driving circuit Dc is monolithically formed as part of the TFT layer 20. The driving circuit Dc includes a gate driver and an emission driver.

[0023] The frame area FA is further provided with a large number of various wirings such as power supply lines 50 and lead lines 60. The power supply lines 50 are wirings for applying current to the organic EL elements 71 by the pixel circuits Pc. The power supply lines 50 include a first power supply trunk line 52 (for convenience, indicated by diagonal hatching slanting upward to the left in FIG. 1 ) and a second power supply trunk line 54 (for convenience, indicated by diagonal hatching slanting upward to the right in FIG. 1 ).

[0024] The first power supply trunk line 52 is provided to extend in the first direction Dx between the display area DA and the terminal portion TP. On both sides of the first power supply trunk line 52 in the first direction Dx, portions are provided that extend to the terminal portion TP via bent portions BP. A high-level power supply voltage (ELVDD) is supplied to the first power supply trunk line 52 at the terminal portion TP via the wiring board CB.

[0025] The second power supply trunk line 54 is provided in a generally C-shape so as to surround the first power supply trunk line 52 and the display area DA. Both ends of the second power supply trunk line 54 extend to the terminal portion TP via the bent portion BP so as to follow the first power supply trunk line 52. A low-level power supply voltage (ELVSS) is supplied to the second power supply trunk line 54 at the terminal portion TP via the wiring board CB.

[0026] A plurality of lead-out lines 60 are provided between the display area DA and the terminal portion TP. The lead-out lines 60 are led from the display area DA through the bent portion BP to the terminal portion TP. The lead-out lines 60 are connected to the source lines 58 on the display area DA side. The lead-out lines 60 are part of the source lines 58. The end of each lead-out line 60 located at the terminal portion TP and the ends of the first power supply trunk line 52 and the second power supply trunk line 54 each form a terminal at the terminal portion TP.

[0027] <Display Area> As shown in Fig. 3, the display area DA is composed of a plurality of pixels PX. The plurality of pixels PX are arranged in a matrix. Each pixel PX is composed of three subpixels SP. The three subpixels SP are a red subpixel SPr that emits red light, a green subpixel SPg that emits green light, and a blue subpixel SPb that emits blue light. These red subpixels SPr, green subpixels SPg, and blue subpixels SPb are arranged, for example, in a striped pattern.

[0028] The display area DA is provided with a plurality of organic EL elements 71 and a plurality of pixel circuits Pc. The organic EL elements 71 are an example of a light-emitting element. The plurality of organic EL elements 71 are provided corresponding to a plurality of sub-pixels SP. Each organic EL element 71 constitutes a sub-pixel SP. The pixel circuit Pc is a circuit for each sub-pixel, and controls the light emission of the organic EL element 71 that constitutes the corresponding sub-pixel SP.

[0029] The display area DA is further provided with various wirings related to the operation of the pixel circuits Pc. The wirings provided in the display area DA include a plurality of gate lines 48, a plurality of light-emission control lines 49, a plurality of power supply branch lines 56, and a plurality of source lines 58. The gate lines 48, the light-emission control lines 49, the power supply branch lines 56, and the source lines 58 are each connected to the pixel circuits Pc.

[0030] Each of the gate lines 48 is a wiring that transmits a gate signal to the pixel circuit Pc. The gate lines 48 are arranged at intervals in the second direction Dy and extend parallel to each other in the first direction Dx. A gate line 48 is provided for each row of sub-pixels SP. Each gate line 48 is drawn out to the frame area FA and connected to a gate driver of the drive circuit Dc.

[0031] Each of the multiple light-emission control lines 49 is a wiring that transmits an emission signal to the pixel circuit Pc. The multiple light-emission control lines 49 are arranged at intervals from one another in the second direction Dy and extend parallel to one another in the first direction Dx. One light-emission control line 49 is provided for each row of sub-pixels SP. Each light-emission control line 49 is drawn out to the frame area FA and connected to an emission driver of the drive circuit Dc.

[0032] Each of the multiple power supply branch lines 56 is part of the power supply line 50 and is wiring that supplies a predetermined high-level power supply voltage (ELVDD) to the pixel circuits Pc. The multiple power supply branch lines 56 are arranged at intervals from one another in the first direction Dx and extend parallel to one another in the second direction Dy. A power supply branch line 56 is provided for each column of subpixels SP. Each power supply branch line 56 is drawn out to the frame area FA on the terminal portion TP side and connected to the first power supply trunk line 52.

[0033] Each of the multiple source lines 58 is a wiring that transmits a source signal to the pixel circuit Pc. The multiple source lines 58 are arranged at intervals from one another in the first direction Dx and extend parallel to one another in the second direction Dy. A source line 58 is provided for each column of subpixels SP. Each source line 58 is drawn out to a terminal portion TP as a lead line 60 and connected to a source driver via a wiring substrate CB.

[0034] The pixel circuits Pc operate based on signals and voltages supplied by the gate lines 48, the light-emitting control lines 49, the power supply branch lines 56, and the source lines 58, and supply drive currents to the corresponding organic EL elements 71. The pixel circuits Pc include a plurality of thin film transistors (hereinafter referred to as TFTs) 24 and a capacitor 42.

[0035] <Layer Structure of Organic EL Display Device> As shown in FIG. 2, the organic EL display device 1 includes a substrate layer 10, a TFT layer 20, a light emitting element layer 70, and a sealing film 80.

[0036] <Substrate Layer> The substrate layer 10 is a layer that forms the base of the organic EL display device 1. The substrate layer 10 is an example of a substrate. The substrate layer 10 is flexible. The substrate layer 10 is made of an organic resin material such as polyimide resin, polyamide resin, or epoxy resin. A protective film 12 is attached to the back surface of the substrate layer 10.

[0037] <TFT Layer> As also shown in Figure 4, the TFT layer 20 is provided on the substrate layer 10. The TFT layer 20 includes a drive circuit Dc, the various wiring lines described above (not shown in Figure 4), a plurality of TFTs 24 and capacitors 42 that form pixel circuits Pc, and a planarization film 66. The planarization film 66 is an example of an organic insulating film. A base coat film 22 is provided on the surface of the substrate layer 10. The TFTs 24 and capacitors 42 are provided on the base coat film 22.

[0038] 5, the TFT 24 is configured as a top-gate type and includes a semiconductor layer 26, a gate insulating film 28, a gate electrode 30, an interlayer insulating film 32, a first terminal electrode 38, and a second terminal electrode 40.

[0039] The semiconductor layer 26 is provided in an island shape on the base coat film 22. The semiconductor layer 26 includes a channel region 26a and a pair of conductor regions 26b. The channel region 26a is provided between the pair of conductor regions 26b. The semiconductor layer 26 is made of, for example, polysilicon such as low temperature polycrystalline silicon (LTPS), or an oxide semiconductor such as an In—Ga—Zn—O-based semiconductor.

[0040] The gate insulating film 28 is provided in a continuous manner across the plurality of TFTs 24 so as to cover the plurality of semiconductor layers 26. The gate insulating film 28 may be provided in an island shape on each semiconductor layer 26 and may be separated individually for each TFT 24. The gate electrode 30 is provided on the gate insulating film 28. The gate electrode 30 overlaps with the channel region 26a of the semiconductor layer 26 via the gate insulating film 28.

[0041] The interlayer insulating film 32 is provided in a continuous manner across the multiple TFTs 24 so as to cover the multiple gate electrodes 30. The interlayer insulating film 32 is configured by stacking a first interlayer insulating film 34 and a second interlayer insulating film 36 in this order on the gate insulating film 28. A plurality of first contact holes Ha are formed in the interlayer insulating film 32. A pair of the first contact holes Ha is provided for each TFT 24. The pair of first contact holes Ha penetrates different conductor regions 26b of the corresponding semiconductor layer 26.

[0042] The first terminal electrode 38 and the second terminal electrode 40 are provided at positions spaced apart from each other on the interlayer insulating film 32 and are connected to the conductor region 26b of the semiconductor layer 26 via different first contact holes Ha. The first contact holes Ha may be formed only in the first interlayer insulating film 34. In this case, the first terminal electrode 38 or the second terminal electrode 40 connected to the semiconductor layer 26 via the first contact hole Ha is provided between the first interlayer insulating film 34 and the second interlayer insulating film 36.

[0043] As shown on the right side of FIG. 5, the capacitor 42 includes a first capacitance electrode 44, a second capacitance electrode 46, and a first interlayer insulating film 34.

[0044] The first capacitance electrode 44 is formed of the same material in the same layer as the gate electrode 30, and is provided on the gate insulating film 28. When the gate insulating film 28 is separated into individual TFTs 24, the first capacitance electrode 44 may be provided on the base coat film 22. The second capacitance electrode 46 is provided on the first interlayer insulating film 34. The first capacitance electrode 44 and the second capacitance electrode 46 overlap each other with the first interlayer insulating film 34 interposed therebetween.

[0045] The base coat film 22, the gate insulating film 28, the first interlayer insulating film 34, and the second interlayer insulating film 36 are each made of an inorganic insulating material such as silicon oxide, silicon nitride, silicon oxynitride, etc. These various inorganic insulating films may be composed of a single layer film or a multilayer film.

[0046] The gate electrode 30, the first terminal electrode 38, the second terminal electrode 40, and the various wirings are each made of a metal such as aluminum (Al), tungsten (W), molybdenum (Mo), tantalum (Ta), chromium (Cr), titanium (Ti), copper (Cu), etc. These electrodes and wirings may be made of a single layer film or a laminated film.

[0047] In this example, the source line 58, the power supply branch line 56, the first terminal electrode 38, and the second terminal electrode 40 have a laminated structure in which a plurality of metal layers 57 are stacked. The specific laminated structure of the laminated films forming these source line 58, the power supply branch line 56, the first terminal electrode 38, and the second terminal electrode 40 is the same as that of the first power supply trunk line 52 and the second power supply trunk line 54, which will be described later.

[0048] 4, the planarization film 66 is provided so as to cover the drive circuit Dc, various wirings (not shown in FIG. 4), the plurality of TFTs 24, and the plurality of capacitors 42. The planarization film 66 is provided over the entire display area DA and extends into the frame area FA. The surface of the TFT layer 20 is planarized by the planarization film 66. The planarization film 66 may be formed of a single layer film or a laminated film.

[0049] A second contact hole Hb is formed for each sub-pixel SP in the planarization film 66. The second contact hole Hb penetrates to the first terminal electrode 38, the second terminal electrode 40, or a wiring connected to either of them, which constitutes the TFT 24 of the corresponding pixel circuit Pc. The planarization film 66 is made of, for example, an organic resin material such as polyimide resin or acrylic resin, or a polysiloxane-based SOG (Spin On Glass) material.

[0050] <Light Emitting Element Layer> The light emitting element layer 70 is provided on the TFT layer 20. The light emitting element layer 70 includes a plurality of organic EL elements 71 and an edge cover 74. Each organic EL element 71 is connected to a separate pixel circuit Pc. The light emission of each organic EL element 71 is controlled by the operation of the corresponding pixel circuit Pc.

[0051] Each of the organic EL elements 71 is configured as a top-emission type. Light emitted from each organic EL element 71 is extracted to the sealing film 80 side. Each organic EL element 71 has a pixel electrode 72, an organic EL layer 76, and a common electrode 78.

[0052] The pixel electrodes 72 are provided on the planarization film 66. The pixel electrodes 72 are provided in a predetermined arrangement so as to correspond to a plurality of sub-pixels SP. Each pixel electrode 72 is connected to a predetermined TFT 24 via a second contact hole Hb. The pixel electrodes 72 have the property of reflecting light and function as anodes. It is preferable that the pixel electrodes 72 be made of a conductive material with a large work function.

[0053] The material of the pixel electrode 72 may be a metal such as silver (Ag) or nickel (Ni), or may be a metal compound or alloy. The material of the pixel electrode 72 may be a conductive oxide such as indium tin oxide (ITO) or indium zinc oxide (IZO). The pixel electrode 72 may be formed of a single layer film or a laminated film.

[0054] The edge covers 74 are provided on the planarization film 66 so as to separate the plurality of pixel electrodes 72. The edge covers 74 are formed in a lattice shape overall, extending between adjacent pixel electrodes 72 and around the periphery of the display area DA, and covering the outer edges (peripheral portions) of each pixel electrode 72. The edge covers 74 are made of, for example, an organic resin material such as polyimide resin or acrylic resin, or a polysiloxane-based SOG material.

[0055] The organic EL layer 76 is provided on each pixel electrode 72 within the opening in the edge cover 74. The organic EL layer 76 has a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, and an electron injection layer, which are provided in this order on the pixel electrode 72. These functional layers are made of well-known compounds suitable for their respective functions. Some of the multiple functional layers may be provided in common as a continuous layer for multiple subpixels SP.

[0056] The common electrode 78 is provided as a continuous part of the plurality of sub-pixels SP. The common electrode 78 is disposed on each organic EL layer 76, covering the edge covers 74, and overlaps each pixel electrode 72 via the organic EL layer 76. The common electrode 78 is made of a material that transmits light and functions as a cathode. It is preferable that the common electrode 78 be made of a conductive material with a small work function.

[0057] The material of the common electrode 78 may be a metal such as magnesium (Mg) or aluminum (Al), an alloy such as magnesium silver alloy (MgAg), or a metal compound, or a conductive oxide such as indium tin oxide (ITO) or indium zinc oxide (IZO). The material of the common electrode 78 may be a single layer film or a laminated film.

[0058] <Sealing Film> The sealing film 80 is provided on the light-emitting element layer 70. The sealing film 80 covers and seals the plurality of organic EL elements 71, protecting each organic EL element 71 (particularly the organic EL layer 76) from moisture, oxygen, and the like. The sealing film 80 is provided over the entire display area DA and extends into the frame area FA. The sealing film 80 has a first inorganic layer 82, an organic layer 84, and a second inorganic layer 86.

[0059] The first inorganic layer 82 is provided to cover the common electrode 78. The organic layer 84 is provided on the first inorganic layer 82. The second inorganic layer 86 is provided to cover the organic layer 84. The first inorganic layer 82 and the second inorganic layer 86 overlap each other in the frame area FA. The organic layer 84 is enveloped by the first inorganic layer 82 and the second inorganic layer 86.

[0060] The first inorganic layer 82 and the second inorganic layer 86 are each made of an inorganic insulating material such as silicon oxide, silicon nitride, silicon oxynitride, etc. The organic layer 84 is made of an organic resin material such as an acrylic resin, an epoxy resin, a silicone resin, a polyurea resin, a parylene resin, a polyimide resin, or a polyamide resin.

[0061] 8 and 9 , the base coat film 22, the gate insulating film 28, the first interlayer insulating film 34, and the second interlayer insulating film 36 also extend in the frame area FA. At the bending portion BP, a first slit Sa is formed in the stacked insulating film 37 made up of the base coat film 22, the gate insulating film 28, the first interlayer insulating film 34, and the second interlayer insulating film 36.

[0062] The first slit Sa extends along the bent portion BP and is formed in a groove shape penetrating in the direction of extension of the bent portion BP (first direction). The first slit Sa penetrates the interlayer insulating film 32 and exposes the surface of the gate insulating film 28 from the interlayer insulating film 32. The first slit Sa may also penetrate the stacked insulating film 37 and expose the surface of the substrate layer 10 from the stacked insulating film 37. A buried layer 68 is provided inside the first slit Sa.

[0063] The first slits Sa are filled with a filling layer 68. The filling layer 68 is formed so as to cover both end edges of the first slits Sa in the width direction (second direction Dy), that is, both the edge of the first slits Sa on the display area DA side and the edge on the terminal portion TP side. The filling layer 68 is formed from an organic insulating material such as polyimide resin, acrylic resin, or polysiloxane resin.

[0064] 6 , the first power supply trunk line 52, the second power supply trunk line 54, and the plurality of lead-out lines 60 are densely packed in a portion of the frame area FA. The first power supply trunk line 52 and the second power supply trunk line 54 are each an example of a first wiring. The lead-out line 60 is an example of a second wiring. The first power supply trunk line 52, the second power supply trunk line 54, and the lead-out line 60 each have portions that are adjacent to each other.

[0065] The first power supply trunk line 52 is arranged so as to intersect with the bending portion BP (see FIG. 1). The first power supply trunk line 52 has two first wide portions 52a and a plurality of first thin line portions 52b. The first wide portions 52a are wider than the first thin line portions 52b. The first wide portions 52a are divided into two by the bending portion BP. That is, the first wide portions 52a are divided into two on the display area DA side and the terminal portion TP side of the bending portion BP in the frame area FA.

[0066] The first thin line portion 52b is a relatively thin linear portion of the first power supply trunk line 52. The multiple first thin line portions 52b are arranged at intervals in the first direction Dx and extend parallel to each other in the second direction Dy. The first thin line portions 52b extend on the buried layer 68 and are provided between the two first wide portions 52a so as to cross the bent portion BP. Both ends of the first thin line portion 52b are connected to different first wide portions 52a.

[0067] The second power supply trunk line 54 is arranged so as to intersect with the bending portion BP (see FIG. 1). The second power supply trunk line 54 has two second wide portions 54a and multiple second thin line portions 54b. The second wide portions 54a are wider than the second thin line portions 54b. The second wide portions 54a are divided into two by the bending portion BP. That is, the second wide portions 54a are divided into two on the display area DA side and the terminal portion TP side of the bending portion BP in the frame area FA.

[0068] The second thin wire portion 54b is a relatively thin linear portion of the second power supply trunk line 54. The multiple second thin wire portions 54b are arranged at intervals in the first direction Dx and extend parallel to each other in the second direction Dy. The second thin wire portions 54b extend on the buried layer 68 and are provided between the two second wide portions 54a so as to cross the bent portion BP. Both ends of the second thin wire portion 54b are connected to different second wide portions 54a.

[0069] The first power supply trunk line 52 and the second power supply trunk line 54 are each formed of the same material in the same layer as the source line 58, the power supply branch line 56, the first terminal electrode 38, and the second terminal electrode 40, and are provided on the surface of the interlayer insulating film 32 (strictly speaking, the second interlayer insulating film 36). As shown in FIG. 11 , the second power supply trunk line 54 has a layered structure in which multiple metal layers 57 are stacked. Although not shown, the first power supply trunk line 52 also has the same layered structure of metal layers 57 as the second power supply trunk line 54. The multiple metal layers 57 are a lower metal layer 57a, an intermediate metal layer 57b, and an upper metal layer 57c.

[0070] The lower metal layer 57a is laminated on the surface of the second interlayer insulating film 36. The intermediate metal layer 57b is laminated on the surface of the lower metal layer 57a. The upper metal layer 57c is laminated on the surface of the intermediate metal layer 57b. The lower metal layer 57a and the upper metal layer 57c are each made of titanium (Ti) or a titanium alloy. The intermediate metal layer 57b is made of aluminum (Al) or an aluminum alloy. The intermediate metal layer 57b is exposed on the side surfaces of the first power supply trunk line 52 and the second power supply trunk line 54.

[0071] 6 , the plurality of lead-out lines 60 are spaced apart from one another in the first direction Dx and extend parallel to one another in the second direction Dy. Each lead-out line 60 is arranged to intersect with a bent portion BP. In part of the frame area FA, the lead-out lines 60 are arranged so as to partially overlap the first power supply trunk line 52 (first wide portion 52 a) or so as to partially overlap both the first power supply trunk line 52 (first wide portion 52 a) and the second power supply trunk line 54 (second wide portion 54 a).

[0072] Each lead line 60 has a first lead line 62 and a second lead line 64. The first lead line 62 and the second lead line 64 are formed in different layers. The first lead line 62 is formed in the same layer as the second capacitance electrode 46 from the same material, and extends between the first interlayer insulating film 34 and the second interlayer insulating film 36. The first lead line 62 is provided on the display area DA side and the terminal portion TP side of the bent portion BP in the frame area FA.

[0073] The first lead line 62 on the display area DA side, which constitutes the predetermined lead line 60, extends between the bent portion BP and the display area DA so as to pass under the first wide portion 52a or under the first wide portion 52a and the second wide portion 54a, and is connected to the source line 58. The end of the first lead line 62 on the bent portion BP side is located at a position corresponding to a position between the first thin line portions 52b or a position corresponding to a position between the second thin line portions 54b.

[0074] The first lead 62 on the terminal TP side of the given lead 60 extends between the bent portion BP and the terminal TP so as to pass under the first wide portion 52 a or under the first wide portion 52 a and the second wide portion 54 a, and forms a terminal at the terminal TP. The end of the first lead 62 on the bent portion BP side is located at a position corresponding to a position between the first thin wire portions 52 b or a position corresponding to a position between the second thin wire portions 54 b.

[0075] The second lead-out line 64 is formed of the same material in the same layer as the first power supply trunk line 52 and the second power supply trunk line 54, and is provided on the surface of the interlayer insulating film 32 (strictly speaking, the second interlayer insulating film 36). The second lead-out line 64 has a layered structure in which the same multiple metal layers 57 as the first power supply trunk line 52 and the second power supply trunk line 54 are stacked (see FIG. 11). The second lead-out line 64 extends on the buried layer 68 and is provided between the corresponding first lead-out lines 62 so as to cross the bent portion BP in the second direction Dy.

[0076] Some of the second lead lines 64 constituting a given lead line 60 extend through gaps 50g formed between adjacent first thin line portions 52b. Both ends of the some of the second lead lines 64 are located closer to different first wide portions 52a. Other second lead lines 64 constituting a given lead line 60 extend through gaps 50g formed between adjacent second thin line portions 54b. Both ends of the other second lead lines 64 are located closer to different second wide portions 54a.

[0077] 7 and 8, third contact holes Hc are formed in portions of the second interlayer insulating film 36 corresponding to the ends of the first lead lines 62 on the bent portion BP side. One end of the second lead line 64 is connected to one of the first lead lines 62 via the third contact hole Hc, and the other end of the second lead line 64 is connected to the other first lead line 62 via the third contact hole Hc.

[0078] In this way, the first thin line portion 52b of the first power supply trunk line 52 and the second lead-out line 64 of the lead-out line 60 are arranged adjacent to each other, and the second thin line portion 54b of the second power supply trunk line 54 and the second lead-out line 64 of the lead-out line 60 are arranged adjacent to each other. When the organic EL display device 1 is in operation, a potential difference is generated between the first thin line portion 52b and the second lead-out line 64, and between the second thin line portion 54b and the second lead-out line 64, which are positioned adjacent to each other.

[0079] 6 to 8, the planarization film 66 also extends to the frame area FA. The planarization film 66 contains ammonium ions (NH ４ ＋ The planarization film 66 includes impurity ions such as ions of argon, argon, and the like. The planarization film 66 has portions exposed from the first inorganic layer 82 and the second inorganic layer 86 that form the sealing film 80 (see FIG. 8). Moisture penetrates into the planarization film 66 from these exposed portions.

[0080] A second slit Sb is formed in a portion of the planarization film 66 corresponding to the bent portion BP. Similar to the first slit Sa, the second slit Sb extends along the bent portion BP and is formed as a groove penetrating in the direction of extension of the bent portion BP (first direction). The second slit Sb penetrates the planarization film 66 and exposes the first thin wire portion 52b, the second thin wire portion 54b, and the second lead wire 64 from the planarization film 66, together with the surface of the buried layer 68.

[0081] The planarizing film 66 is provided so as to cover the first power supply trunk line 52, the second power supply trunk line 54, and the lead-out line 60 in areas other than the bent portions BP. The portions of the planarizing film 66 closer to the second slits Sb cover both end portions of the first thin line portion 52b, both end portions of the second thin line portion 54b, and both end portions of the second lead-out line 64. A plurality of partition holes 67 are formed in the portions of the planarizing film 66 closer to the second slits Sb.

[0082] The partition holes 67 are formed in a portion of the planarization film 66 on the display area DA side and a portion on the terminal portion TP side. The partition holes 67 are formed in a portion of the planarization film 66 corresponding to the gap between the first thin line portion 52 b and the second lead-out line 64, and extend so as to separate the first thin line portion 52 b from the second lead-out line 64 in plan view. The partition holes 67 are also formed in a portion of the planarization film 66 corresponding to the gap between the second thin line portion 54 b and the second lead-out line 64, and extend so as to separate the second thin line portion 54 b from the second lead-out line 64 in plan view.

[0083] Each partition hole 67 is formed in a notch shape with one end opening to the second slit Sb. Each partition hole 67 penetrates the planarization film 66 to expose the second interlayer insulating film 36 from the planarization film 66. As shown in FIGS. 10 and 11 , the planarization film 66 is divided by the partition holes 67 at a location where the first thin line portion 52 b and the second lead line 64 are adjacent to each other and at a location where the second thin line portion 54 b and the second lead line 64 are adjacent to each other. A first inorganic layer 82 constituting the sealing film 80 is provided in the partition hole 67. A second inorganic layer 86 may also fit into the partition hole 67 together with the first inorganic layer 82.

[0084] -Method of Manufacturing Organic EL Display Device- To manufacture the organic EL display device 1, first, an organic resin material is applied to the surface of a glass substrate and baked, thereby forming a substrate layer 10 on the glass substrate.

[0085] Next, the TFT layer 20, the light-emitting element layer 70, and the sealing film 80 are formed in this order on the substrate layer 10 using a known film formation method such as plasma CVD (Chemical Vapor Deposition), sputtering, or vacuum deposition, a known coating method such as spin coating or slit coating, or a known patterning technique such as photolithography.

[0086] Thereafter, the glass substrate is peeled off from the substrate layer 10 by, for example, irradiating the rear surface of the substrate layer 10 with laser light from the glass substrate side. Next, a protective film 12 is attached to the rear surface of the substrate layer 10. A polarizing plate and a cover panel are attached to the surface of the sealing film 80. Furthermore, a wiring board CB is connected to terminal portions TP provided in the frame area FA, and display control circuits such as a source driver are mounted.

[0087] In this manner, the organic EL display device 1 can be manufactured.

[0088] -Features of the embodiment- In the organic EL display device 1 of this embodiment, a plurality of partition holes 67 are formed in the planarizing film 66. Some of the partition holes 67 extend so as to separate the first thin line portion 52b constituting the first power supply trunk line 52 and the second lead-out line 64 constituting the lead-out line 60 in a planar view. These partition holes 67 separate the planarizing film 66 between the first thin line portion 52b and the second lead-out line 64. Therefore, even if a potential difference occurs between the first thin line portion 52b and the second lead-out line 64, the exchange of ions in the planarizing film 66 between the first thin line portion 52b and the second lead-out line 64 is blocked or reduced. This makes it possible to eliminate or reduce battery action between the first thin line portion 52b and the second lead-out line 64.

[0089] Another partition hole 67 extends to separate the second thin wire portion 54b constituting the second power supply trunk line 54 from the second lead-out line 64 constituting the lead-out line 60 in plan view. This partition hole 67 separates the planarizing film 66 between the second thin wire portion 54b and the second lead-out line 64. Therefore, even if a potential difference occurs between the second thin wire portion 54b and the second lead-out line 64, the exchange of ions in the planarizing film 66 between the second thin wire portion 54b and the second lead-out line 64 is blocked or reduced. This eliminates or reduces the galvanic action between the second thin wire portion 54b and the second lead-out line 64. Therefore, corrosion of the first power supply trunk line 52, the second power supply trunk line 54, and the lead-out line 60 can be suppressed.

[0090] Other Embodiments In the above embodiment, each partition hole 67 has a notch shape that is open toward the second slit Sb, but this is not limited to this. As shown in Fig. 12, each partition hole 67 may be formed in a slit shape that is closed at both ends, including the end on the second slit Sb side. The slit-shaped partition hole 67 may be only a partition hole 67 formed in one of the planarization films 66 that is located closer to the display area DA or the terminal portion TP than the second slit Sb.

[0091] In the above embodiment, each partition hole 67 penetrates the planarization film 66, but this is not limited to this. As shown in FIGS. 13 and 14 , each partition hole 67 does not have to penetrate the planarization film 66. Although a thin film of the planarization film 66 remains at the bottom of each partition hole 67, the exchange of ions between the first thin wire portion 52 b of the first power supply trunk line 52 and the second lead-out wire 64, or between the second thin wire portion 54 b of the second power supply trunk line 54 and the second lead-out wire 64, is reduced. This eliminates or reduces the galvanic action between the first thin wire portion 52 b and the second lead-out wire 64, and between the second thin wire portion 54 b and the second lead-out wire 64, thereby suppressing corrosion of the first thin wire portion 52 b, the second thin wire portion 54 b, and the second lead-out wire 64.

[0092] In the above embodiment, the display device according to the present disclosure has been described using an example in which the first power supply trunk line 52 and the second power supply trunk line 54 are the first wiring and the lead-out line 60 is the second wiring, but this is not limiting. As long as at least a portion of the wiring is adjacent to each other and a potential difference occurs between the two, the technology of the present disclosure can be applied by treating various wirings as the first wiring and the second wiring.

[0093] In the above embodiment, each pixel PX is configured with sub-pixels SP of three colors, but this is not limited to this. The sub-pixels SP that configure each pixel PX may be of four or more colors. Furthermore, although the sub-pixels SP that configure each pixel PX are arranged in a stripe pattern, this is not limited to this. The arrangement of the multiple sub-pixels SP may be a Pentile arrangement or other arrangement.

[0094] Each pixel PX may not be divided into a plurality of sub-pixels SP, but may be formed by a single organic EL element 71. An organic EL display device 1 having such a configuration performs monochrome display such as grayscale.

[0095] In the above embodiment, the organic EL layer 76 is provided individually for each subpixel SP, but this is not limited to this. The organic EL layer 76 may be provided as a single layer common to multiple subpixels SP. In this case, the organic EL display device 1 may be provided with a color filter or the like to express color tones in each subpixel SP.

[0096] In the above embodiment, the number of TFTs 24 constituting the pixel circuit Pc is three, but this is not limited to three. The number of TFTs 24 constituting the pixel circuit Pc may be two or less, or may be four or more. Furthermore, each TFT 24 is not limited to a top-gate type, and may be configured as a bottom-gate type.

[0097] In the above embodiment, the pixel electrode 72 functions as an anode and the common electrode 78 functions as a cathode, but this is not limiting. The organic EL display device 1 may be configured so that the pixel electrode 72 functions as a cathode and the common electrode 78 functions as an anode. In this case, the organic EL layer 76 has an inverted stacked structure.

[0098] In the above embodiment, the organic EL layer 76 has a five-layer structure consisting of a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, and an electron injection layer, but is not limited to this. The organic EL layer 76 may have a three-layer structure consisting of a hole injection / transport layer, a light-emitting layer, and an electron injection / transport layer, or any other laminated structure may be adopted.

[0099] In the above embodiment, the substrate of the organic EL display device 1 is the substrate layer 10 made of a thin film made of resin, but this is not limiting. The substrate may be made of any material, such as a plastic substrate made of polyethylene terephthalate (PET) or a glass substrate.

[0100] In the above embodiment, an organic EL display device 1 is illustrated as an example of a display device according to the present disclosure, but the present disclosure is not limited thereto. The technology of the present disclosure can be applied to a display device in which a large number of wirings are provided in a frame area FA and covered with an organic insulating film. For example, such a display device can be a quantum dot display device equipped with QLEDs (Quantum-dot Light Emitting Diodes), which are light-emitting elements using a quantum dot-containing layer. The technology of the present disclosure can also be applied to liquid crystal display devices and plasma display devices.

[0101] As described above, preferred embodiments have been described as examples of the technology of the present disclosure. However, the technology of the present disclosure is not limited to these, and can be applied to embodiments in which appropriate modifications, substitutions, additions, omissions, etc. are made. It will be understood by those skilled in the art that various modifications are possible to the above-described embodiments without departing from the spirit of the technology of the present disclosure, and that such modifications also fall within the scope of the technology of the present disclosure.

[0102] It should be noted that the terms "first," "second," etc. mentioned above are merely used to distinguish the terms to which these terms are attached, and do not limit the number or order of the terms.

[0103] As described above, the present disclosure is useful for display devices.

[0104] BP: Bending portion DA: Display area FA: Frame area Pc: Pixel circuit TP: Terminal portion 1: Organic EL display device (display device) 36: Second interlayer insulating film (inorganic insulating film) 52: First power supply main line (first wiring) 54: Second power supply main line (first wiring) 57b: Intermediate metal layer (metal layer) 58: Source line 60: Lead line (second wiring) 66: Planarization film (organic insulating film) 67: Partition hole 71: Organic EL element (light-emitting element)

Claims

1. A display device having a display area for displaying an image and a frame area provided around the display area, wherein the frame area is provided with first and second wirings positioned adjacent to each other, and an organic insulating film covering the first and second wirings, and wherein the organic insulating film has a partition hole formed in it that extends between the first and second wirings in a planar view.

2. A display device according to claim 1, wherein the frame region includes an inorganic insulating film, the first wiring and the second wiring are provided on the surface of the inorganic insulating film, and the partition hole penetrates the organic insulating film and exposes the inorganic insulating film from the organic insulating film.

3. A display device according to claim 1 or 2, wherein a terminal section is provided at an end of the frame area, a bent section is provided between the display area and the terminal section so as to extend in one direction, and the first wiring and the second wiring are provided so as to intersect with the bent section.

4. A display device according to claim 3, wherein a slit extending along the bent portion is formed in the organic insulating film in a portion corresponding to the bent portion, and the partition hole is formed in the organic insulating film in a portion on the display area side and a portion on the terminal portion side, respectively.

5. A display device according to any one of claims 1 to 4, wherein the first wiring and the second wiring each include a metal layer made of aluminum or an aluminum alloy.

6. A display device according to any one of claims 1 to 5, wherein the display area is provided with a plurality of light-emitting elements and pixel circuits that control the light emission of the light-emitting elements, the first wiring is a power supply line for applying a current to the light-emitting elements by the pixel circuit, and the second wiring is a source line for transmitting a source signal to the pixel circuit.

7. The display device according to claim 6, wherein the light-emitting element is an organic electroluminescence element.

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