Resin molding device and method for manufacturing resin molded products

Abstract

The present invention prevents a temperature decrease of a molding die that has slid to the outside of a press part, and is provided with: a molding die 14 that is provided so as to be slidable to the outside of a press part 15; heating parts 21, 22 that heat the molding die 14 that has slid to the outside of the press part 15; and a temperature control part 3 that controls the heating parts 21, 22 to compensate for the temperature decrease of the molding die 14 that has slid to the outside of the press part 15.

Description

Resin molding device and method for manufacturing resin molded product

[0001] The present invention relates to a resin molding apparatus and a method for manufacturing a resin molded product.

[0002] Conventionally, as shown in Patent Document 1, in a compression molding device, a fixed mold (lower mold) supported by a fixed platen is considered to be movable between a mold clamp position and a removal position outside the mold.

[0003] In this compression molding device, the lower mold is moved from the mold clamping position to the removal position and left waiting, and then the loader transports the substrate to the discharge position and supplies liquid resin to the substrate, and then the substrate with the supplied liquid resin is transported to the lower mold at the removal position.

[0004] Japanese Patent Application Laid-Open No. 2003-165134

[0005] However, when the loader starts moving and transfers the substrate to the lower mold while the lower mold is waiting at the removal position, the temperature of the lower mold drops. As a result, after the lower mold is moved to the mold clamping position, molding operations cannot be performed until the lower mold reaches the set temperature suitable for molding. Furthermore, the temperature change of the lower mold can adversely affect the resin material, potentially reducing the quality of the resin molded product.

[0006] The present invention has been made to solve the above problems, and its main object is to prevent a drop in temperature of the mold that has slid outside the press section.

[0007] In other words, the resin molding apparatus of the present invention is characterized by comprising a molding die that is slidably arranged outside a press section, a heating section that heats the molding die that has slid outside the press section, and a temperature control section that controls the heating section to compensate for the temperature drop of the molding die that has slid outside the press section.

[0008] According to the present invention configured in this manner, it is possible to prevent a drop in temperature of the mold that has slid outside the press section.

[0009] It is a schematic diagram showing the configuration of a resin molding apparatus of an embodiment according to the present invention. It is a schematic diagram showing the configuration of a resin molding module of the same embodiment. It is a schematic diagram showing the configuration of a molding die slide mechanism of the same embodiment. It is a flowchart showing a method of adjusting the temperature of the molding die in the same embodiment. It is a flowchart showing a method of adjusting the temperature of the molding die in the same embodiment.

[0010] Next, the technology according to the present invention will be described in more detail with reference to examples, although the present invention is not limited to the following technology.

[0011] A resin molding apparatus according to a first aspect of the present invention includes a mold slidably mounted outside a press unit, a heating unit for heating the mold when it slides outside the press unit, and a temperature control unit for controlling the heating unit to compensate for a temperature drop in the mold when it slides outside the press unit. This resin molding apparatus includes a heating unit for heating the mold when it slides outside the press unit and controls the heating unit to compensate for a temperature drop in the mold when it slides outside the press unit, thereby preventing a temperature drop in the mold when it slides outside the press unit. As a result, the time required for the mold to reach a set temperature after returning to the press unit can be shortened, improving resin molding efficiency, such as takt time. Furthermore, temperature changes in the mold can be reduced, reducing adverse effects on the resin material and preventing a decrease in the quality of the resin molded product.

[0012] In addition to the configuration of the above-described technology 1, a resin molding apparatus according to technology 2 of the present invention is preferably configured such that the heating unit is provided in the mold and slides out of the press unit together with the mold. With this configuration, the heating unit slides together with the mold, so that a temperature drop in the mold can be compensated for simultaneously with or before the mold starts to slide out of the press unit.

[0013] A resin molding apparatus according to a third aspect of the present invention has the same configuration as that of the first or second aspect, and further has a temperature sensor provided in the molding die, and the temperature control unit controls the heating unit so that the temperature detected by the temperature sensor becomes a target temperature. Here, the target temperature may be a set temperature, or may be a set temperature and an allowable range for the set temperature. With this configuration, the temperature of the molding die can be detected, and a temperature drop in the molding die that has slid out of the press unit can be accurately compensated for.

[0014] As a specific mode of control by the temperature control unit, in the resin molding device of Technology 4 according to the present invention, in addition to the configuration of Technology 3 described above, it is desirable that the temperature control unit controls the heating unit so that the detected temperature becomes the target temperature at the same time as or before the molding die starts to slide out of the press unit.

[0015] When the molding die is slid outside the press unit, the amount of heat dissipated to the surroundings increases compared to when the molding die is inside the press unit. Therefore, in addition to the configuration of the above-mentioned techniques 3 or 4, the resin molding device of technique 5 according to the present invention is preferably such that the temperature control unit sets the target temperature of the detected temperature higher than a target clamping temperature, which is the target temperature of the molding die when clamped by the press unit.

[0016] In order to simplify the temperature control by the heating unit, it is desirable that the resin molding device of Technology 6 according to the present invention has the configuration of any one of Technologies 3 to 5 above, and that the temperature control unit switches between supplying and stopping current to the heating unit so that the detected temperature becomes the target temperature.

[0017] In addition to the configuration of the above-mentioned Technology 1 or 2, the resin molding apparatus of Technology 7 according to the present invention preferably has the temperature control unit supplying a preset current to the heating unit simultaneously with or before the molding die begins to slide out of the press unit. With this configuration, it is possible to compensate for the temperature drop of the molding die that has slid out of the press unit without providing a temperature sensor on the molding die.

[0018] As a specific embodiment, the resin molding apparatus of Technology 8 according to the present invention has, in addition to the configuration of any one of Technologies 1 to 7 above, the press section has a mold clamping mechanism that clamps the molding mold via a base member, and the resin molding apparatus further includes a mold slide mechanism that slides the molding mold to a transfer position outside the press section where the transported object is transferred, the heating section heats the molding mold at the transfer position, and the temperature control section controls the heating section to compensate for a drop in temperature of the molding mold at the transfer position.

[0019] In addition, the method for manufacturing a resin molded product according to Technology 9 of the present invention is also a method for manufacturing a resin molded product in which resin is molded onto a molding object using a resin molding device of any one of Technologies 1 to 8 above, which is also one aspect of the present invention.

[0020] <One embodiment of the present invention> Hereinafter, one embodiment of a resin molding apparatus according to the present invention will be described with reference to the drawings. Note that in all of the drawings shown below, parts are appropriately omitted or exaggerated for clarity. Identical components are given the same reference numerals, and descriptions thereof will be omitted as appropriate.

[0021] <Overall Configuration of Resin Molding Apparatus> The resin molding apparatus 100 of this embodiment resin-seals a substrate W, which is a molding object having electronic components Wx fixed to one surface, by resin molding using a resin material J to manufacture a resin-molded product P. Note that, hereinafter, the molding object (substrate W) before resin molding is referred to as a "pre-molding substrate W," and the molding object (substrate W) after resin molding is referred to as a "molded substrate W" or a "resin-molded product P."

[0022] Here, the substrate W is rectangular in plan view, and examples thereof include a metal substrate, a resin substrate, a glass substrate, a ceramic substrate, a circuit board, a semiconductor substrate, a lead frame, a silicon wafer, a glass wafer, etc. Alternatively, the substrate W may be a carrier without wiring.

[0023] Examples of the resin material J include powdered or granular resin (including granular resin), liquid resin, etc. Examples of the electronic component Wx include electronic elements such as semiconductor chips, resistor elements, and capacitor elements, or electronic components in which at least one of these electronic elements is sealed with resin.

[0024] 1, the resin molding apparatus 100 includes, as its components, a substrate supply and storage module A, two resin molding modules B, and a resin material supply module C. Each component (each of modules A to C) is detachable and replaceable with respect to the other components.

[0025] The substrate supply / storage module A has a substrate receiving section 10a that receives pre-molded substrates W from the outside, a substrate storage section 10b that stores molded substrates W (resin molded products P), a substrate transport mechanism 11 that transports the pre-molded substrates W and the resin molded products P, and a transfer mechanism 12, such as a transport robot, that transports, i.e., transfers, the pre-molded substrates W and the resin molded products P to the substrate transport mechanism 11.

[0026] The substrate transport mechanism 11 transports the pre-molding substrate W from the substrate supply and storage module A to the resin molding module B, and supplies the pre-molding substrate W to the molding die 14 in the resin molding module B. After the pre-molding substrate W has been resin molded, the substrate transport mechanism 11 receives a resin molded product P, which is the molded substrate W after resin molding, from the molding die 14 in the resin molding module B, and transports it to the substrate supply and storage module A. In addition, the transfer mechanism 12 transfers the pre-molding substrate W from the substrate receiving unit 10a to the substrate transport mechanism 11, and transfers the resin molded product P from the substrate transport mechanism 11 to the substrate storage unit 10b.

[0027] 1, the substrate transport mechanism 11 has a substrate supply unit 111 that supplies a substrate W to the upper mold 141, and a substrate receiving unit 112 that receives a resin molded product P from the upper mold 141. The substrate supply unit 111 and the substrate receiving unit 112 are arranged side by side in the left-right direction. The substrate transport mechanism 11 successively performs a receiving operation of the substrate receiving unit 112 and a supply operation of the substrate supply unit 111 with respect to the upper mold 141.

[0028] As shown in FIG. 2, each resin molding module B has a molding die 14 and a press unit 15 that presses and clamps the molding die 14 .

[0029] The forming mold 14 is composed of an upper mold 141 that adsorbs and holds the substrate W, and a lower mold 142 in which a cavity 142C is formed. The upper mold 141 is provided on the lower surface of a fixed platen 151 directly or via another member, and the lower mold 142 is provided on the upper surface of a movable platen 152 directly or via another member.

[0030] The press section 15 of this embodiment includes a fixed platen 151, which is a base member on which the upper mold 141 is provided, a movable platen 152, which is a base member that is movable up and down relative to the fixed platen 151, and a mold clamping mechanism 153 that raises and lowers the movable platen 152 relative to the fixed platen 151.

[0031] The fixed platen 151 is supported by a pair of sidewall members 154 and 155, and the movable platen 152 is supported slidably relative to the pair of sidewall members 154 and 155 by an elevation slide mechanism (not shown).

[0032] The mold clamping mechanism 153 is of a linear motion type that uses a ball screw mechanism that converts the rotation of a servo motor or the like into linear movement to raise and lower the movable platen 152. Note that the mold clamping mechanism 153 may also be of a link type that transmits a power source such as a servo motor to the movable platen using a link mechanism such as a toggle link.

[0033] The resin material supply module C has a moving table 17, a resin material accommodation unit 18 placed on the moving table 17, a resin material supply mechanism 19 that measures and supplies resin material J to the resin material accommodation unit 18, and a resin material transport mechanism 20 that transports the resin material accommodation unit 18 and supplies resin material J to the cavity 142C of the lower mold 142. Here, the resin material accommodation unit 18 is configured using a holding frame that holds a release film F, and the resin material J is supplied by the resin material supply mechanism 19 onto the release film F held in the holding frame.

[0034] The moving table 17 moves within the resin material supplying module C between a resin charging position where a resin material charging mechanism 19 charges the resin material and a transfer position where the resin material accommodation unit 18 is handed over to the resin material transfer mechanism 20. The resin material transfer mechanism 20 also transfers the resin material accommodation unit 18 containing the resin material J from the resin material supplying module C to the resin molding module B, where it supplies the release film F and the resin material J to the lower die 142 of the molding die 14. The resin material transfer mechanism 20 then transfers the resin material accommodation unit 18, after the resin material J has been supplied, from the resin molding module B to the resin material supplying module C.

[0035] 1, the resin material conveying mechanism 20 has a resin material supplying section 201 that supplies resin material J and an unused release film F to the lower mold 142, and a film collecting section 202 that collects used release film F from the lower mold 142. The resin material supplying section 201 and the film collecting section 202 are arranged side by side in the left-right direction. The resin material conveying mechanism 20 successively performs the collecting operation of the film collecting section 202 and the supply operation of the resin material supplying section 201 with respect to the lower mold 142.

[0036] <Temperature adjustment mechanism for sliding mold 14> In the resin molding apparatus 100 of this embodiment, the upper mold 141 and the lower mold 142 of the mold 14 are each configured to be slidable in a direction intersecting the mold clamping direction (specifically, the front-to-rear direction) by the mold slide mechanism 16, as shown in Figures 1 and 3.

[0037] As shown in Figure 3, this mold slide mechanism 16 has an upper mold support frame 161 that supports the upper mold 141, a lower mold support frame 162 that supports the lower mold 142, and a frame drive unit 163 that moves the upper mold support frame 161 and the lower mold support frame 162 in the slide direction.

[0038] The upper die support frame 161 and the lower die support frame 162 are slidable in the front-rear direction by a guide mechanism (not shown) relative to the pair of side wall members 154, 155. A frame drive unit 163 selectively moves either the upper die support frame 161 or the lower die support frame 162. This frame drive unit 163 may be configured, for example, using a ball screw mechanism, a rack and pinion, or an air cylinder. The frame drive unit 163 may be provided on each of the upper die support frame 161 and the lower die support frame 162.

[0039] Specifically, the mold slide mechanism 16 slides the upper mold 141 and the lower mold 142 between a mold clamping position Q where the molds are clamped in the press unit 15 and a transfer position R located outside the press unit 15 in the sliding direction. The transfer position R is a position outside the fixed platen 151, the movable platen 152, and the pair of side wall members 154, 155 in the press unit 15, and is a position where a transported object is transferred to the mold 14. Note that FIG. 3 shows a state in which the upper mold 141 has moved to the transfer position R.

[0040] The substrate W and the resin molded product P are transported by the substrate transport mechanism 11 to the upper mold 141 located at the transfer position R. The resin material J and the release film F are transported by the resin material transport mechanism 20 to the lower mold 142 located at the transfer position R.

[0041] In addition, the resin molding apparatus 100 of this embodiment is equipped with heating sections 21, 22 (see Figures 2 and 3) that heat the molding die 14 that has slid to the transfer position R outside the press section 15, and a temperature control section 3 (see Figure 1) that controls the heating sections 21, 22 to compensate for the temperature drop of the molding die 14 that has slid to the transfer position R outside the press section 15.

[0042] 2 and 3, the heating units 21 and 22 of this embodiment are provided on the molding die 14 and slide together with the molding die 14 by the molding die slide mechanism 16. Specifically, the heating units 21 and 22 have an upper mold heating unit 21 provided on the upper mold 141 and a lower mold heating unit 22 provided on the lower mold 142.

[0043] The upper mold heating section 21 slides together with the upper mold 141 between the mold clamping position Q and the transfer position R, and heats the upper mold 141 not only at the transfer position R but also at the mold clamping position Q.

[0044] Here, the upper mold 141 has a cavity block 141a, the surface of which faces the lower mold 142, and a heating plate 141b provided on the back surface of the cavity block 141a. The upper mold 141 also has a base plate 141c on which the cavity block 141a and the heating plate 141b are provided. The base plate 141c is provided with a sealing structure 141d, which includes a sidewall for evacuating the periphery of the cavity block 141a during resin molding, and a sealing member such as an O-ring. The sealing structure 141d is not shown in FIG. 3.

[0045] The upper mold heating section 21 is built into the heating plate 141b. The upper mold heating section 21 is, for example, a rod-shaped cartridge heater, and the temperature is controlled by controlling the current supplied to the heating wire of the cartridge heater.

[0046] In addition, the lower mold heating section 22 slides together with the lower mold 142 between the mold clamping position Q and the transfer position R, and not only heats the lower mold 142 at the transfer position R, but also heats the lower mold 142 at the mold clamping position Q.

[0047] The lower mold 142 includes a cavity block 142a having a cavity 142C formed on its surface and a heating plate 142b attached to the back surface of the cavity block 142a. As shown in FIG. 2, the cavity block 142a includes a bottom block 142a1 that forms the bottom surface of the cavity 142C and a side block 142a2 that surrounds the bottom block 142a1 and forms the side surface of the cavity 142C. The side block 142a2 is supported by an elastic member 142a3 so that it can be raised and lowered relative to the bottom block 142a1. The lower mold 142 also includes a base plate 142c on which the cavity block 142a and the heating plate 142b are mounted. The base plate 142c is provided with a sealing structure 142d, which includes a sidewall for evacuating the area around the cavity block 142a during resin molding, and a sealing member such as an O-ring. In FIG. 3, the sealing structure 142d is not shown.

[0048] The lower mold heating unit 22 is built into the heating plate 142b. The lower mold heating unit 22 is, for example, a rod-shaped cartridge heater, and the temperature is controlled by controlling the current supplied to the heating wire of the cartridge heater.

[0049] 2, the forming die 14 is provided with temperature sensors 41 and 42. Specifically, the temperature sensors 41 and 42 include an upper die temperature sensor 41 provided in the upper die 141 and a lower die temperature sensor 42 provided in the lower die 142. The upper die temperature sensor 41 is built into the heating plate 141b of the upper die 141. The lower die temperature sensor 42 is built into the heating plate 142b of the lower die 142.

[0050] The temperature control unit 3 controls the heating units 21 and 22 so that the temperatures detected by the temperature sensors 41 and 42 reach the target temperatures when the molding die 14 slides to the transfer position R. The temperature control unit 3 is provided, for example, in the substrate supply / storage module A, and its functions are fulfilled by a control unit COM (see FIG. 1) that controls each unit of the resin molding apparatus 100. The control unit COM is a dedicated or general-purpose computer that has a CPU, internal memory, an input / output interface, an AD converter, etc.

[0051] Specifically, the temperature control unit 3 controls the upper mold heating unit 21 so that the temperature detected by the upper mold temperature sensor 41 becomes the target temperature when the upper mold 141 slides to the transfer position R. In addition, the temperature control unit 3 controls the lower mold heating unit 22 so that the temperature detected by the lower mold temperature sensor 42 becomes the target temperature when the lower mold 142 slides to the transfer position R.

[0052] Here, the target temperatures detected by the temperature sensors 41, 42 consist of a set temperature and an allowable range for the set temperature. The set temperatures for the target temperatures of the temperature sensors 41, 42 may be the same or different. The allowable ranges for the target temperatures of the temperature sensors 41, 42 may be the same or different.

[0053] Specifically, temperature control unit 3 controls upper mold heating unit 21 so that the temperature detected by upper mold temperature sensor 41 reaches the target temperature simultaneously with or before upper mold 141 starts to slide out of press unit 15. Temperature control unit 3 also controls lower mold heating unit 22 so that the temperature detected by lower mold temperature sensor 42 reaches the target temperature simultaneously with or before lower mold 142 starts to slide out of press unit 15.

[0054] Here, when the upper mold 141 slides to the transfer position R, the temperature control unit 3 sets the target temperature (specifically, the set temperature) of the temperature detected by the upper mold temperature sensor 41 to be higher than the target temperature (specifically, the set temperature) of the upper mold 141 when the press unit 15 clamps the molds. Also, when the lower mold 142 slides to the transfer position R, the temperature control unit 3 sets the target temperature (specifically, the set temperature) of the temperature detected by the lower mold temperature sensor 42 to be higher than the target temperature (specifically, the set temperature) of the lower mold 142 when the press unit 15 clamps the molds. For example, if the set temperatures of the upper mold 141 and the lower mold 142 when clamping the molds are 170°C, when the upper mold 141 and the lower mold 142 slide to the transfer position R, the set temperature of the temperature detected by the upper mold temperature sensor 41 is set to, for example, 205°C, and the set temperature of the temperature detected by the lower mold temperature sensor 42 is set to, for example, 205°C.

[0055] Specifically, the temperature control unit 3 feedback controls the current to each of the heating units 21, 22 so that the temperatures detected by each of the temperature sensors 41, 42 become the target temperatures. In other words, the temperature control unit 3 controls each of the heating units 21, 22 by adjusting the amount of current to each of the heating units 21, 22. The temperature control unit 3 of this embodiment switches between supplying and stopping current to the heating wires of each of the heating units 21, 22 so that the temperatures detected by each of the temperature sensors 41, 42 become the target temperatures.

[0056] <Method for Adjusting Temperature of Molding Mold 14> Next, a method for adjusting the temperature of the molding mold 14 in the resin molding apparatus 100 of this embodiment will be described with reference to Figures 4 and 5. For convenience, in Figures 4 and 5, the temperature adjustment of the upper mold 141 and the temperature adjustment of the lower mold 142 are shown without distinction.

[0057] Before resin molding by the resin molding apparatus 100 starts, the temperature control unit 3 supplies current to each heating unit 21, 22 to heat the upper mold 141 and the lower mold 142 (step S1). At this time, the upper mold 141 and the lower mold 142 are in the mold clamping position Q, and the target temperatures detected by each temperature sensor 41, 42 are the target temperatures of the upper mold 141 and the lower mold 142 at mold clamping (e.g., 170°C ± 2°C). Hereinafter, the target temperatures of the upper mold 141 and the lower mold 142 at mold clamping are referred to as first target temperatures. The first target temperature is an example of the target temperature at mold clamping in the present invention.

[0058] When the temperatures detected by the temperature sensors 41, 42 reach the first target temperature (step S2), the temperature control unit 3 adjusts the currents to the heating units 21, 22 (step S3) so that the temperatures detected by the temperature sensors 41, 42 fall within the allowable range of the first target temperature. Then, when the temperatures detected by the temperature sensors 41, 42 fall within the allowable range of the first target temperature (step S4), the current values ​​to the heating units 21, 22 at that time are maintained (step S5).

[0059] <When moving the upper mold 141 to the transfer position R> When the casting mold slide mechanism 16 starts moving the upper mold 141 from the mold clamping position Q toward the transfer position R (step S6), the temperature control unit 3 first sets the target temperature detected by the temperature sensor 41 to be higher than the first target temperature (step S7). Hereinafter, a target temperature set higher than the first target temperature will be referred to as the second target temperature. Specifically, when the temperature control unit 3 receives a movement command to the casting mold slide mechanism 16, it sets the target temperature detected by the temperature sensor 41 to the second target temperature. Note that the target temperature detected by the temperature sensor 42 of the lower mold 142 remains the first target temperature.

[0060] Then, the temperature control unit 3 adjusts the current of the heating unit 21 so that the temperature detected by the temperature sensor 41 becomes the second target temperature (step S8).Then, the temperature control unit 3 adjusts the current of the heating unit 21 so that the temperature detected by the temperature sensor 41 falls within the allowable range of the second target temperature (step S9).

[0061] Thereafter, when the transfer of the pre-molding substrate W and the resin molded product P to the upper mold 141 is completed, the mold slide mechanism 16 moves the upper mold 141 from the transfer position R toward the mold clamping position Q. During this time, the temperature control unit 3 adjusts the current of the heating unit 21 so that the temperature detected by the temperature sensor 41 falls within the allowable range of the second target temperature. As a result, while the upper mold 141 is moving from the mold clamping position Q toward the transfer position R, while it is stopped at the transfer position R, and while it is moving from the transfer position R toward the mold clamping position Q, the heating unit 21 heats the upper mold 141 to compensate for the temperature drop of the upper mold 141.

[0062] When the upper mold 141 returns to the mold clamping position Q (step S10), the temperature control unit 3 returns the target temperature detected by the temperature sensor 41 to the first target temperature (step S11). Specifically, when the temperature control unit 3 acquires a movement completion signal from the casting mold slide mechanism 16, it sets the target temperature detected by the temperature sensor 41 to the first target temperature.

[0063] Thereafter, if there is a command to supply power to the heating units 21 and 22 (YES in step S12), the temperature control unit 3 stops the current supply to the heating units 21 and 22 (step S13). On the other hand, if there is no command to supply power to the heating units 21 and 22 (NO in step S12), the temperature control unit 3 adjusts the current to the heating unit 22 so that the temperature detected by the temperature sensor 42 becomes the first target temperature (step S3), and so that the temperature detected by the temperature sensor 42 falls within the allowable range of the first target temperature (step S4).

[0064] <When moving the lower mold 142 to the transfer position R> Meanwhile, when the casting mold slide mechanism 16 starts to move the lower mold 142 from the mold clamping position Q toward the transfer position R (step S6), the temperature control unit 3 sets the target temperature detected by the temperature sensor 42 to be higher than the first target temperature (step S7). Specifically, when the temperature control unit 3 receives a movement command to the casting mold slide mechanism 16, it sets the target temperature detected by the temperature sensor 42 to the second target temperature. Note that the target temperature detected by the temperature sensor 41 of the upper mold 141 remains the first target temperature.

[0065] Then, the temperature control unit 3 adjusts the current of the heating unit 22 so that the temperature detected by the temperature sensor 42 becomes the second target temperature (step S8).Then, the temperature control unit 3 adjusts the current of the heating unit 22 so that the temperature detected by the temperature sensor 42 falls within the allowable range of the second target temperature (step S9).

[0066] Thereafter, when the collection of used release film F and the supply of resin material J and unused release film F to lower mold 142 are completed, mold slide mechanism 16 moves lower mold 142 from transfer position R toward mold clamping position Q. During this time, temperature control unit 3 adjusts the current of heating unit 22 so that the temperature detected by temperature sensor 42 falls within the allowable range of the second target temperature. As a result, while lower mold 142 is moving from mold clamping position Q toward transfer position R, while it is stopped at transfer position R, and while it is moving from transfer position R toward mold clamping position Q, heating unit 22 heats lower mold 142 to compensate for the temperature drop of lower mold 142.

[0067] When the lower mold 142 returns to the mold clamping position Q (step S10), the temperature control unit 3 returns the target temperature detected by the temperature sensor 41 to the first target temperature (step S11). Specifically, when the temperature control unit 3 receives a movement completion signal from the casting mold slide mechanism 16, it sets the target temperature detected by the temperature sensor 42 to the first target temperature.

[0068] Thereafter, if a power supply command to the heating units 21 and 22 is received (YES in step S12), the temperature control unit 3 stops the current supply to the heating units 21 and 22 (step S13). On the other hand, if a power supply command to the heating units 21 and 22 is not received (NO in step S12), the temperature control unit 3 adjusts the current of the heating unit 22 so that the temperature detected by the temperature sensor 42 becomes the first target temperature (step S3), and the temperature detected by the temperature sensor 42 falls within the allowable range of the first target temperature (step S4). After the supply of the pre-molding substrate W to the upper mold 141 and the supply of the resin material J and the unused release film F to the lower mold 142 are completed and the temperatures detected by the temperature sensor 41 of the upper mold 141 and the temperature sensor 42 of the lower mold 142 have reached the first target temperature, the press unit 15 clamps the molding die 14 and resin molds the pre-molding substrate W to produce the resin molded product P.

[0069] <Effects of this embodiment> According to the resin molding apparatus 100 of this embodiment, heating units 21 and 22 are provided to heat the molding dies 14 (upper die 141, lower die 142) that have slid out of the press unit 15, and the heating units 21 and 22 are controlled to compensate for a temperature drop in the molding dies 14 that have slid out of the press unit 15, thereby preventing a drop in temperature of the molding dies 14 that have slid out of the press unit 15. As a result, the time required for the molding dies 14 to reach the set temperature after returning to the press unit 15 can be shortened, improving resin molding efficiency such as takt time. Furthermore, temperature change in the molding dies 14 can be reduced, reducing adverse effects on the resin material J and preventing a decrease in the quality of the resin molded product P.

[0070] Other Modified Embodiments The present invention is not limited to the above-described embodiments.

[0071] For example, the resin molding module B may be configured to have a plurality of molding dies 14 (upper dies 141 and lower dies 142) arranged vertically. In this case, it is conceivable to provide an upper die heating section 21 for each of the plurality of upper dies 141, and a lower die heating section 22 for each of the plurality of lower dies 142. With this configuration, it is possible to compensate for temperature drops in each of the plurality of upper dies 141 and the plurality of lower dies 142.

[0072] In the above embodiment, the heating units 21 and 22 are provided in the mold 14, but the heating units 21 and 22 may be provided outside the mold 14, and the mold 14 may be heated from the outside as it moves to the delivery position R. In this case, the upper mold heating unit 21 that heats the upper mold 141 and the lower mold heating unit 22 that heats the lower mold 142 may be formed by a common heating unit.

[0073] The temperature control unit 3 that controls the heating units 21, 22 may be configured to feedback-control the heating units 21, 22 based on the temperatures detected by the temperature sensors 41, 42, or may be configured to supply a preset current to the heating units 21, 22 simultaneously with or before the forming die 14 starts to slide out of the press unit 15. Here, the preset current may be determined in advance by experiment or calculation as a current necessary to keep the temperature of the forming die 14 constant without decreasing while the forming die 14 is out of the press unit 15.

[0074] Temperature control unit 3 may also be configured to control heating units 21 and 22 so that the detected temperature reaches the second target temperature at the same time as forming mold 14 reaches transfer position R or around the same time.

[0075] Furthermore, the second target temperature is not limited to a fixed value, but may be variable depending on the position of the forming mold 14 between the mold clamping position Q and the transfer position R.

[0076] Furthermore, the present invention is not limited to the above-described embodiment, and it goes without saying that various modifications are possible without departing from the spirit of the present invention.

[0077] According to the present invention, it is possible to prevent a decrease in temperature of the mold that has slid out of the press section.

[0078] DESCRIPTION OF SYMBOLS 100: Resin molding apparatus W: Pre-molded substrate (molding object) Wx: Electronic component P: Resin molded product (molding object) 15: Press section 14: Mold 21, 22: Heating section 3: Temperature control section 41, 42: Temperature sensor 151: Fixed platen (base member) 152: Movable platen (base member) 153: Mold clamping mechanism R: Delivery position 16: Mold slide mechanism

Claims

1. A resin molding device comprising: a molding die that is slidably mounted outside a press section; a heating section that heats the molding die that has slid outside the press section; and a temperature control section that controls the heating section to compensate for a drop in temperature of the molding die that has slid outside the press section.

2. The resin molding device according to claim 1, wherein the heating section is provided in the molding die and slides out of the press section together with the molding die.

3. A resin molding device according to claim 1 or 2, wherein the molding die is provided with a temperature sensor, and the temperature control unit controls the heating unit so that the temperature detected by the temperature sensor becomes a target temperature.

4. A resin molding device as described in claim 3, wherein the temperature control unit controls the heating unit so that the detected temperature reaches the target temperature at or before the molding die begins to slide outside the press unit.

5. A resin molding device as described in claim 3 or 4, wherein the temperature control unit sets the target temperature higher than a target mold clamping temperature, which is the target temperature of the molding mold when the mold is clamped by the press unit.

6. A resin molding device according to any one of claims 3 to 5, wherein the temperature control unit switches between supplying and stopping current to the heating unit so that the detected temperature becomes the target temperature.

7. A resin molding device as described in claim 1 or 2, wherein the temperature control unit supplies a preset current to the heating unit simultaneously with or before the molding die starts to slide out of the press unit.

8. A resin molding apparatus as described in any one of claims 1 to 7, wherein the press section has a mold clamping mechanism that clamps the molding mold via a base member, the resin molding apparatus further comprises a mold slide mechanism that slides the molding mold to a transfer position outside the press section where the transported object is transferred, the heating section heats the molding mold at the transfer position, and the temperature control section controls the heating section to compensate for a drop in temperature of the molding mold at the transfer position.

9. A method for manufacturing a resin molded product, comprising molding a resin onto a molding object using the resin molding device according to any one of claims 1 to 8.

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