Earphone

Abstract

The present application mainly relates to an earphone. The earphone comprises a shell assembly, wherein the shell assembly comprises a first shell, and the first shell comprises a first side wall portion and a second side wall portion, which are arranged opposite each other at an interval. The earphone is further provided with a deformable member and a sensor, wherein the deformable member is arranged between the first side wall portion and the second side wall portion; when the first side wall portion and / or the second side wall portion are / is subjected to an opposite-direction squeezing force applied from the outside in the direction of the interval between the first side wall portion and the second side wall portion, the first side wall portion and / or the second side wall portion deform(s), and same jointly squeeze the deformable member, so that the deformable member bends laterally in the direction of the interval; and the sensor is arranged in a bending area of the deformable member, and generates a corresponding electrical signal when the bending degree of the bending area exceeds a preset bending threshold. In this way, the touch-control accuracy of the earphone and the anti-interference capability of a touch-control function can be effectively improved; in addition, in this way, the touch-control sensitivity of the earphone can be further effectively enhanced, and the cost of manufacturing the earphone can be effectively reduced.

Description

earphone [Technical Field]

[0001] This application relates to the technical field of electronic devices, specifically to a pair of headphones. [Background Technology]

[0002] With the increasing prevalence of electronic devices, they have become indispensable social and entertainment tools in people's daily lives, and people's demands for these devices are also rising. Headphones and smart glasses, for example, are widely used in daily life, working in conjunction with mobile phones, computers, and other terminal devices to provide users with an auditory feast. Traditional headphones use mechanical buttons to generate control commands; however, with the increasing complexity of headphone control functions, simple mechanical buttons can no longer meet the growing control needs.

[0003] [Summary of the Invention]

[0004] This application provides an earphone, which includes a housing assembly. The housing assembly includes a first housing, which includes a first sidewall portion and a second sidewall portion disposed opposite to each other and spaced apart. The earphone also includes a deformable element and a sensor. The deformable element is disposed between the first sidewall portion and the second sidewall portion. When the first sidewall portion and / or the second sidewall portion are subjected to opposing compressive forces applied from the outside along the spaced direction of the first sidewall portion and the second sidewall portion, the first sidewall portion and / or the second sidewall portion deform and jointly compress the deformable element, causing the deformable element to bend laterally in the spaced direction. The sensor is disposed in the bending area of ​​the deformable element and generates a corresponding electrical signal when the bending degree of the bending area is greater than a preset bending threshold.

[0005] In some embodiments, the deformable member has a plate-like region configured to laterally bend toward the main surface of the plate-like region under the compression of the first sidewall portion and the second sidewall portion, and the sensor is disposed on the plate-like region.

[0006] In some implementations, the deformable component is a circuit board, the sensor is mounted on the circuit board, and the circuit board is equipped with a main control circuit that is electrically connected to the sensor. The main control circuit performs corresponding control functions based on electrical signals.

[0007] In some embodiments, the main surface of the circuit board is arranged along the interval direction, and the first sidewall portion and the second sidewall portion squeeze the opposite two side edges of the circuit board under the action of opposing extrusion force, so that the main surface of the circuit board is laterally bent, and the sensor is disposed on the main surface of the circuit board.

[0008] In some embodiments, in its natural state and along the spacing direction, at least one of the first sidewall portion and the second sidewall portion maintains a first gap between itself and the side edge of its adjacent circuit board.

[0009] In some embodiments, the first gap is set to be greater than the deformation of the first sidewall portion and the second sidewall portion when the opposing extrusion force is a first pressure threshold, and less than the deformation of the first sidewall portion and the second sidewall portion when the opposing extrusion force is a second pressure threshold, wherein the first pressure threshold is not less than 0.5 N, and the second pressure threshold is between 1 N and 5 N.

[0010] In some embodiments, the housing assembly further includes a second housing that mates with the first housing along a preset mating direction, the mating direction being intersected with the spacing direction. The second housing includes a third sidewall portion and a fourth sidewall portion that are opposite to each other and spaced apart along the spacing direction. The third sidewall portion and the fourth sidewall portion are inserted between the first sidewall portion and the second sidewall portion along the mating direction and partially overlap. In the natural state and along the spacing direction, a second gap is maintained between the first sidewall portion and the adjacent third sidewall portion, and between the second sidewall portion and the adjacent fourth sidewall portion, respectively. The second gap is larger than the first gap.

[0011] In some embodiments, the first housing further includes a first top wall connecting the first side wall and the second side wall, and the second housing further includes a second top wall connecting the third side wall and the fourth side wall. The first top wall and the second top wall are opposite to each other and spaced apart along the mating direction. The circuit board is located between the first top wall and the second top wall. Along the mating direction, one edge of the circuit board further overlaps with the overlapping portion of the first side wall and the third side wall, and the other edge of the circuit board further overlaps with the overlapping portion of the second side wall and the fourth side wall.

[0012] In some embodiments, the earphone further includes a circuit board disposed within the housing assembly, the deformable element being independent of the circuit board, and a main control circuit electrically connected to the sensor being disposed on the circuit board, the main control circuit performing corresponding control functions based on electrical signals.

[0013] In some embodiments, along the spacing direction, the deformable member includes an arched portion and two abutting portions respectively connected to both ends of the arched portion and extending away from the arched portion. The arched portion is arranged in a raised shape from both ends of the arched portion along the vertical direction of the spacing direction. The sensor is disposed on the arched portion, and the two abutting portions abut against the first sidewall portion and the second sidewall portion respectively.

[0014] In some embodiments, the sensor is located in the middle of the arch along the spacing direction.

[0015] In some embodiments, the deformable part is formed by bending a sheet or plate, and the arched part is arranged in a U-shape, U-shape or C-shape.

[0016] In some embodiments, the headphones also include a speaker disposed within the housing assembly, the main surface of the circuit board overlapping the speaker along the axial direction of the speaker, and a deformable element disposed laterally to the speaker along the radial direction of the speaker, with the main surface of the deformable element and the main surface of the circuit board intersecting each other.

[0017] In some embodiments, the headphones further include an ear hook connected to the housing assembly, the ear hook being used to position the housing assembly in front of the user's auricle in the wearing state, and a deformable element disposed radially along the speaker on the side of the speaker near the ear hook.

[0018] In some embodiments, the headphones also include a speaker disposed within the housing assembly, wherein the main surface of the circuit board and the main surface of the deformable element overlap with the speaker along the axial direction of the speaker and overlap with each other.

[0019] In some embodiments, the first housing further includes a first top wall portion connecting the first side wall portion and the second side wall portion, and the deformable element is the first top wall portion; or the housing assembly further includes a second housing portion cooperating with the first housing, and the deformable element is the second housing portion.

[0020] In some embodiments, the housing assembly further includes a second housing that cooperates with the first housing, and the headphones further include a speaker disposed within the housing assembly and an ear hook connected to the housing assembly, the ear hook being used to position the housing assembly in front of the user's auricle when worn, and the speaker being located at least substantially or entirely within the first housing.

[0021] In some embodiments, the housing assembly includes a connecting end connected to the ear hook portion and a free end away from the connecting end. The housing assembly further has a length direction, a width direction and a thickness direction orthogonal to each other, wherein the length direction is defined as the direction from the free end toward or away from the connecting end, the thickness direction is defined as the direction toward or away from the auricle in the wearing state, and the first sidewall portion and the second sidewall portion are spaced apart from each other along the width direction.

[0022] In some embodiments, the dimensions of the first sidewall portion and the second sidewall portion along the length direction are larger than the dimensions along the thickness direction.

[0023] The beneficial effects of this application are as follows: By transmitting touch operations to the sensor through opposing compression of the first housing, the touch accuracy and anti-interference capability of the earphone's touch function can be effectively improved. Furthermore, the sensor is positioned on the curved area of ​​the deformable component. This configuration allows the sensor to directly sense the deformation of the component, receiving touch operations from the user on the first and second sidewalls. With the same sensing accuracy, the sensor can detect finer deformations on the component, thereby effectively improving the earphone's touch sensitivity while also significantly reducing manufacturing costs. [Attached Image Description]

[0024] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 is a schematic diagram of the front outline of the user's ear as described in this application;

[0026] Figure 2 is a structural schematic diagram of an embodiment of the earphone provided in this application;

[0027] Figure 3 shows a schematic diagram of the headphones in the wearing state as shown in Figure 2;

[0028] Figure 4 shows an exploded structure diagram of the earphone in the embodiment where the circuit board is used as a deformable component, as shown in Figure 2.

[0029] Figure 5 shows an exploded structural diagram of the earphone in an embodiment where a component independent of the circuit board is used as a deformable part.

[0030] Figure 6 shows an exploded structural diagram of the earphone embodiment shown in Figure 2, in which the second shell serves as a deformable component.

[0031] Figure 7 is a schematic diagram of one embodiment of the circuit board in Figure 2;

[0032] Figure 8 is a schematic cross-sectional view of the core module along the A1-A1 cutting direction in the embodiment of the earphone shown in Figure 2, where the circuit board is used as the deformable component.

[0033] Figure 9 is a partial structural diagram of module B of the movement shown in Figure 8;

[0034] Figure 10 is a schematic diagram of the mechanism module shown in Figure 5 after the second housing has been removed;

[0035] Figure 11 is a schematic cross-sectional view of the core module along the A2-A2 cutting direction in the embodiment of the earphone shown in Figure 2, where the second shell is used as a deformable component.

Detailed Implementation Methods

[0036] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It should be noted that the following embodiments are for illustrative purposes only and do not limit the scope of the application. Similarly, the following embodiments are only some, not all, embodiments of the present application, and all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of the present application.

[0037] The reference to "embodiment" in this application means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described in this application can be combined with other embodiments.

[0038] Referring to Figure 1, the user's ear 100 may include physiological parts such as the external auditory canal 101, the concha 102, the cymba conchae 103, the triangular fossa 104, the antihelix 105, the scaphoid fossa 106, the helix 107, and the antitragus 108. While the external auditory canal 101 has a certain depth and extends to the tympanic membrane, for ease of description and in conjunction with Figure 1, unless otherwise specified, the external auditory canal 101 specifically refers to its entrance (i.e., the ear canal) away from the tympanic membrane. Furthermore, the physiological parts such as the concha 102, the cymba conchae 103, and the triangular fossa 104 have a certain volume and depth; and the concha 102 is directly connected to the external auditory canal 101, meaning the aforementioned ear canal can be simply considered as being located at the bottom of the concha 102.

[0039] Furthermore, individual differences may exist among different users, resulting in variations in ear shape, size, and other dimensional differences. To facilitate description and reduce (or even eliminate) these individual differences, a simulator containing the head and its (left and right) ears can be manufactured based on ANSI:S3.36, S3.25 and IEC:60318-7 standards. Examples include the GRAS 45BC KEMAR, HEAD Acoustics, B&K 4128 series, or B&K 5128 series, to represent the scenario of most users wearing headphones 10. Taking the GRAS KEMAR as an example, the ear simulator can be any one of the GRAS 45AC, GRAS 45BC, GRAS 45CC, or GRAS 43AG; taking HEAD Acoustics as an example, the ear simulator can be any one of the HMS II.3, HMS II.3LN, or HMS II.3LN HEC. Therefore, in this application, descriptions such as "the user is wearing the earphone 10," "the earphone 10 is in a wearing state," and "in a wearing state" can refer to the earphone 10 being worn on the ears of the aforementioned simulator. Of course, due to individual differences among users, the earphone 10 may differ from the earphone 10 being worn on the ears of the aforementioned simulator when worn by different users, but such differences should be tolerable.

[0040] It should be noted that in medicine, anatomy, and other fields, the human body can be defined by three basic planes: the sagittal plane, the coronal plane, and the horizontal plane; and three basic axes: the sagittal axis, the coronal axis, and the vertical axis. The sagittal plane is a section perpendicular to the ground along the anteroposterior direction of the body, dividing the body into left and right parts. The coronal plane is a section perpendicular to the ground along the left-right direction of the body, dividing the body into anterior and posterior parts. The horizontal plane is a section parallel to the ground along the vertical direction of the body, dividing the body into superior and inferior parts. Correspondingly, the sagittal axis is the axis along the anteroposterior direction of the body and perpendicular to the coronal plane; the coronal axis is the axis along the left-right direction of the body and perpendicular to the sagittal plane; and the vertical axis is the axis along the vertical direction of the body and perpendicular to the horizontal plane. Furthermore, the "front side of the ear" mentioned in this application is a concept relative to "back side of the ear." The former refers to the side of the ear that faces away from the head, while the latter refers to the side of the ear that faces the head. Both refer to the user's ear. Specifically, by observing the ear of the simulator along the direction of the human coronal axis, a schematic diagram of the front side outline of the ear shown in Figure 1 can be obtained.

[0041] As an example, referring to Figures 2 to 6, the earphone 10 may include a mechanism module 11 and an ear hook portion 12 connected to the mechanism module 11. When worn, the mechanism module 11 is located at the front of the ear, and at least part of the ear hook portion 12 is located at the back of the ear, so that the earphone 10 is hung on the ear when worn. The mechanism module 11 may have a connection end CE connected to the ear hook portion 12 and a free end FE not connected to the ear hook portion 12. Furthermore, the mechanism module 11 may be configured not to block the external auditory canal when worn, making the earphone 10 an "open-back earphone." Due to individual differences among users, when the earphone 10 is worn by different users, the mechanism module 11 may partially cover the external auditory canal, but the external auditory canal will still not be blocked.

[0042] Optionally, in some embodiments, the mechanism module 11 includes a housing assembly 110 (in some embodiments of this application, the housing assembly is also referred to as the mechanism housing), a speaker 111, and a circuit board 112. Further, the speaker 111 and the circuit board 112 can be stacked within the housing assembly 110. This arrangement effectively improves the space utilization within the mechanism module 11 and facilitates optimization of the overall size of the earphone 10. Specifically, without changing the size of the mechanism module 11, the stacked arrangement allows the circuit board 112 to have a larger and more complete surface area without interference from the speaker 111, facilitating processing and effectively increasing the surface area of ​​the circuit board 112. This further allows the circuit board 112 to integrate more circuits, such as a main control circuit and a sensor control circuit. In some embodiments, the circuit board 112 integrates any one or more of the main control circuit, sensor control circuit, etc. Preferably, in this embodiment, the circuit board 112 integrates at least the main control circuit of the earphone 10 and a sensor control circuit for connection with the sensor 15. The speaker 111 is a component that converts electrical signals into corresponding sound signals under the control of the circuit board 112. In this embodiment, the speaker 111 is an air conduction speaker 111; in other embodiments, the speaker 111 may also be a bone conduction speaker 111.

[0043] It should be noted that the speaker 111 and the circuit board 112 are stacked in the housing assembly 110, meaning that the speaker 111 and the circuit board 112 are arranged vertically in space along the axial direction z1 of the speaker 111.

[0044] Optionally, in some embodiments, the earphone 10 further includes a battery assembly connected to the end of the ear hook 12 away from the mechanism module 11. The battery assembly includes a battery housing 13, within which a battery coupled to the mechanism module 11 is disposed. The orthographic projection of the battery housing 13 on a reference plane partially overlaps with the orthographic projection of the free end FE on the same reference plane. Thus, when the free end FE is at least partially inserted into the concha, the battery housing 13 can support the ear from the back, which helps improve the stability of the earphone 10 during wear.

[0045] Optionally, as shown in Figures 4-6, in some embodiments, the earphone 10 further includes a housing assembly 110, a deformable element 14, and a sensor 15 disposed on the deformable element 14. The deformable element 14 is provided with a bending region that can bend laterally when subjected to a counter-pressure F1 applied along the interval direction. The sensor 15 is disposed in the bending region to generate a corresponding electrical signal when the degree of bending of the bending region is greater than a preset bending threshold, and transmits the corresponding electrical signal to the corresponding component of the earphone 10, such as the circuit board 112, so that the circuit board 112 executes the corresponding control function based on the corresponding electrical signal, thereby controlling the earphone 10 to perform the corresponding earphone 10 functions, such as switching tracks, pausing playback, and starting playback.

[0046] It should be noted that the bending region is a part of the deformable part 14, and the bending region is a region on the deformable part 14 that can undergo lateral bending deformation when subjected to opposing compressive force F1, and the bending amount is relatively large compared to other parts of the deformable part 14. In its natural state, the bending region can be any structural shape.

[0047] Optionally, in some embodiments, a preset bending threshold can be set. The electrical signal generated by the sensor 15 when the bending degree of the bending area exceeds the preset bending threshold can be used as the electrical signal to trigger the headphone function. This allows the circuit board 112 to better avoid electrical signals generated by accidental touches by the user, thereby effectively improving the control accuracy and anti-interference capability of the headphone 10. For example, in some embodiments, the sensor 15 generates a corresponding level of electrical signal based on the deformation of the deformable element 14. The circuit board 112 does not execute the control function when the signal level of the electrical signal does not exceed the preset threshold (when the signal level is less than or equal to the preset threshold, it indicates that the electrical signal is caused by accidental touch). Specifically, the preset bending threshold can be determined by statistical analysis methods or by the user based on their usage habits.

[0048] Further, as shown in Figures 4-6, in some embodiments, the housing assembly 110 includes a first housing 1101, which includes a first sidewall portion US1 and a second sidewall portion LS1 disposed opposite to each other. A counter-pressing force F1 applied to the outer sides of the first sidewall portion US1 and the second sidewall portion LS1 along the spacing direction of the first sidewall portion US1 and the second sidewall portion LS1 causes the first sidewall portion US1 and the second sidewall portion LS1 to deform, and indirectly or directly transmits the pressing or squeezing pressure to the deformable member 14, further causing the deformable member 14 to deform, which is detected by the sensor 15. The first housing 1101 serves as the outer shell of the earphone 10, which is also the overall structural support of the earphone 10. Therefore, as a structural support, the first housing 1101 has sufficient structural strength to resist the force when the force acting on the first side wall portion US1 and / or the second side wall portion LS1 is small. This effectively reduces the probability of deformation of the first side wall portion US1 and / or the second side wall portion LS1 due to accidental touch operations such as slight collisions or slight pressure. Consequently, it effectively reduces the risk of deformation of the deformable part 15 due to accidental touch operations such as slight collisions or slight pressure, thereby effectively improving the touch accuracy and anti-interference capability of the earphone 10.

[0049] It should be noted that when the first sidewall portion US1 and the second sidewall portion LS1 are subjected to a counter-compression force F1 applied from the outside along the interval direction, either or both of the first sidewall portion US1 and the second sidewall portion LS1 deform, causing at least a portion of the first sidewall portion US1 and at least a portion of the second sidewall portion LS1 to exhibit a small displacement that moves closer to each other along the interval direction. This allows the compression force to be transmitted to the deformation member 14 by contacting or pulling with it. For example, in some embodiments, when the first sidewall portion US1 and the second sidewall portion LS1 are subjected to a counter-compression force F1 applied from the outside along the interval direction, both the first sidewall portion US1 and the second sidewall portion LS1 undergo corresponding deformation displacements under the action of the counter-compression force F1, thereby causing the first sidewall portion US1 and the second sidewall portion LS1 as a whole to exhibit a small displacement that moves closer to each other along the interval direction. For example, in some embodiments, when the first sidewall portion US1 and the second sidewall portion LS1 are subjected to a counter-pressure F1 applied from the outside along the interval direction, only the first sidewall portion US1 or the second sidewall portion LS1 undergoes a corresponding deformation displacement, but the first sidewall portion US1 and the second sidewall portion LS1 as a whole still exhibit a small displacement of moving closer to each other along the interval direction. Of course, in this embodiment, the first sidewall portion US1 and the second sidewall portion LS1 are configured to undergo corresponding deformation displacements when subjected to the counter-pressure F1, and the deformation displacement of the first sidewall portion US1 and the deformation displacement of the second sidewall portion LS1 are nearly equal. This can effectively improve the comfort of the user when pressing the earphone 10, and can also effectively prevent the earphone 10 from falling off the user's ear due to an imbalance of force when subjected to the user's counter-pressure.

[0050] Furthermore, in some embodiments, the sensor 15 is directly disposed on the deformable member 14 and located within the bending area of ​​the deformable member 14. For example, the resistance sensor is directly attached to the surface of the bending area. With this arrangement, the sensor 15 can directly sense the deformation of the deformable member 14 to receive the user's touch operation on the first sidewall portion US1 and the second sidewall portion LS1. Under the same sensing accuracy, the sensor 15 can sense more subtle deformations on the deformable member 14, thereby effectively improving the touch sensitivity of the earphone 10 while also effectively reducing the manufacturing cost of the earphone 10.

[0051] Preferably, in some embodiments, the housing assembly 110 is the housing of the mechanism module 11. Since the mechanism module 11 is located in front of the ear when the earphone 10 is worn, compared to earphone components located behind the ear, such as the ear hook 12, the spatial position of the mechanism module 11 in the wearing state is more convenient for the user to operate the earphone 10. Therefore, setting the housing assembly 110 as a trigger element for the deformation of the trigger deformation element 14 to control the function of the earphone 10 can effectively improve the convenience of touch operation of the earphone 10. Further, in some embodiments, in ear hook earphones, the mechanism module 11 is usually the part with the largest overall structural size of the earphone 10. Using the housing assembly 110 as a component that bends laterally to trigger the deformation element 14 conforms to the operating habits of the human hand and effectively improves the convenience of touch operation of the earphone 10. Optionally, in some embodiments, along the thickness direction X, the distance between the first sidewall portion US1 and the second sidewall portion LS1 is less than or equal to the maximum thickness of the housing assembly 110. This setting can effectively improve the convenience of touch operation of the earphone 10. Preferably, in some implementations, the distance between the first sidewall portion US1 and the second sidewall portion LS1 along the thickness direction X is equal to the maximum thickness dimension of the housing assembly 110.

[0052] Optionally, in some embodiments, the spacing direction is defined as an operational direction that allows the user to apply opposing pressure on opposite sides of the housing assembly 110 when the earphone 10 is worn. Specifically, the housing assembly 110 includes a length direction Y, a width direction Z, and a thickness direction X that are orthogonal to each other. The length direction Y is defined as the direction from the free end FE toward or away from the connecting end CE, and the thickness direction X is defined as the direction toward or away from the auricle when worn. In this embodiment, the spacing direction is set to be parallel to the width direction Z, that is, the first sidewall portion US1 and the second sidewall portion LS1 are the sidewalls of the first housing 1101 along the thickness direction X. This arrangement ensures that when the earphone 10 is worn, the first sidewall portion US1 and the second sidewall portion LS1 are not completely blocked by the user's ears and head, making it convenient for the user to press the first sidewall portion US1 and the second sidewall portion LS1 to control the earphone 10 function.

[0053] Optionally, in some embodiments, the dimensions of the first sidewall portion US1 and the second sidewall portion US2 along the length direction Y are larger than the dimensions along the thickness direction X. This arrangement makes it easier for the first sidewall portion US1 and the second sidewall portion US2 to deform, thereby effectively improving the pressure control comfort of the earphone 10.

[0054] Optionally, as shown in Figures 4-6, in some embodiments, the housing assembly 110 further includes a second housing 1102 that mates with the first housing 1101 along a preset mating direction. The mating direction and the spacing direction are intersected, which effectively improves the ease of assembly of the earphone 10. In this embodiment, the mating direction is parallel to the thickness direction X.

[0055] Further, as shown in Figures 4-6, in some embodiments, the first housing 1101 includes a sidewall and a first top wall portion OS1, and the second housing 1102 includes a sidewall and a second top wall portion OS2 connected to the sidewall. The first sidewall portion OS1 and the second sidewall portion OS1 are two sidewall portions spaced apart along the spacing direction from the sidewall of the first housing 1101.

[0056] Optionally, in some embodiments, the sidewall of the first housing 1101, away from the first top wall OS1, is provided with a first ring portion 1101a recessed outward from the inner side of the sidewall of the first housing 1101, and the sidewall of the second housing 1102, away from the second top wall OS2, is provided with a second ring portion 1102a recessed inward from the outer side of the sidewall of the second housing 1102. In the mating direction, the second ring portion 1102a is inserted into the inner side of the first ring portion 1101a, and at least in the spacing direction, a small amount of adhesive is pre-formed between the first ring portion 1101a and the second ring portion 1102a. The gap (in some embodiments herein, the dispensing gap includes a second gap Jx1) is used to connect and fix the first ring portion 1101a and the second ring portion 1102a by dispensing adhesive, thereby effectively improving the connection stability between the first housing 1101 and the second housing 1102. Furthermore, the first housing 1101 and the second housing 1102, through the cooperation of the first ring portion 1101a and the second ring portion 1102a, allow for a smooth transition connection between the outer surfaces of the sidewalls of the first housing 1101 and the second housing 1102, thereby effectively improving the aesthetics of the earphone 10. Optionally, in some embodiments, the earphone 10 includes an elastic sealant disposed in the dispensing gap for connecting and fixing the first housing 1101 and the second housing 1102.

[0057] Optionally, as shown in Figures 7 and 11, in some embodiments, the deformable member 14 has a plate-shaped region 16. When the outer sides of the first sidewall portion US1 and the second sidewall portion LS1 are subjected to opposing compressive forces, the plate-shaped region 16 receives the indirect or direct compressive or pressing force transmitted to the deformable member 14, thereby causing lateral bending. The sensor 15 is disposed on the plate-shaped region 16. It should be noted that the plate-shaped region 16 is a portion of the deformable member 14 that is plate-shaped, and does not directly restrict the overall structure of the deformable member 14 to a plate-shaped structure. In other words, the overall structure of the deformable member 14 can be rod-shaped, bar-shaped, plate-shaped, etc. Therefore, providing a plate-shaped region 16 on the deformable member 14 enables the deformable member 14 to better "sense" the opposing forces exerted by the user on the first sidewall portion US1 and the second sidewall portion LS1, and to undergo corresponding deformation, so that the sensor 15 can better receive the user's touch operation signals, thereby effectively improving the control sensitivity of the earphone 10. The bending region includes a plate-shaped region 16. In other words, the plate-shaped region 16 is located within the bending region of the deformable member 14, and its area is less than or equal to the area of ​​the bending region.

[0058] Optionally, as shown in Figures 4, 7, and 8, in some embodiments, the deformable element 14 can be a circuit board 112, and the sensor 15 is directly disposed on the circuit board 112. The circuit board 112 is provided with a sensing control circuit electrically connected to the sensor 15. The sensing control circuit executes corresponding control functions based on electrical signals. With this arrangement, on the one hand, the sensor 15 can be directly connected to the sensing control circuit through the circuit board 112. On the other hand, the circuit board 112 serves as a circuit board for laying out the earphone 10, and also serves as a deformable element 14 to transmit the user's touch signals to the sensor 15, effectively simplifying the internal wiring and internal structure of the earphone 10, thereby effectively improving the space utilization of the earphone 10.

[0059] Optionally, as shown in FIG8, in some embodiments, the side edges (i.e., side edges 1122 and 1123) of the circuit board 112 along the interval direction abut against the inner walls of the first sidewall portion US1 and the second sidewall portion LS1, or are spaced apart by a certain gap. Under the action of the opposing compressive force F1, the first sidewall portion US1 and the second sidewall portion LS1 compress the opposite side edges (i.e., side edges 1122 and 1123) of the circuit board 112, so that the main surface 1121 of the circuit board 112 is laterally bent, and the sensor 15 is disposed on the main surface 1121 of the circuit board 112. Furthermore, the overall structure of the circuit board 112 is a plate-like structure. The main surface 1121 of the circuit board 112 is the plate surface of the circuit board 112. The main surface 1121 of the circuit board 112 is set at a certain preset angle with the spacing direction. The preset angle is greater than or equal to 0° and less than or equal to 5°. For example, the preset angle can be 5°. This setting makes it easier for the circuit board 112 to deform under the pressure of the first side wall portion US1 and the second side wall portion LS1, thereby effectively improving the control sensitivity of the earphone 10.

[0060] Specifically, in some embodiments, in the natural state, the side edges (i.e., side edges 1122 and 1123) of the circuit board 112 along the interval direction abut against the inner walls of the first side wall portion US1 and the second side wall portion LS1. With this configuration, when the first side wall portion US1 and the second side wall portion LS1 are subjected to opposing compressive force F1, the first side wall portion US1 and the second side wall portion LS1 can transmit the opposing compressive force F1 to the circuit board 112 in the first time, thereby effectively improving the control response speed of the earphone 10 and thus effectively improving the user experience.

[0061] Specifically, as shown in Figure 9, in some embodiments, in the natural state and along the spacing direction, the first sidewall portion US1 and the second sidewall portion LS1 maintain a first gap Jx2 between themselves and the side edges of the adjacent circuit board 112. Specifically, along the spacing direction, the circuit board 112 includes two oppositely arranged side edges (i.e., side edge 1122 and side edge 1123), wherein one side edge 1123 is adjacent to the first sidewall portion US1 with a first gap Jx2, and the other side edge 1122 is adjacent to the second sidewall portion LS1 with a first gap Jx2. With this arrangement in the natural state, the first sidewall portion US1 and the second sidewall portion LS1 can maintain a distance and not come into contact, thereby preventing the first sidewall portion US1 and the second sidewall portion LS1 from deforming due to accidental touch operation by the user, causing the earphone 10 to randomly execute some earphone 10 functions that do not conform to the user's wishes, thereby effectively improving the control accuracy of the earphone 10 and the anti-interference capability of the control function. Wherein, the first gap Jx2 is the minimum distance from the inner side of the first sidewall portion US1 to the circuit board 112 (that is, the distance between the inner side of the first sidewall portion US1 and the side edge 1123), and the first gap Jx2 is the minimum distance from the inner side of the second sidewall portion LS1 to the circuit board 112 (that is, the distance between the inner side of the second sidewall portion LS1 and the side edge 1122). In other words, the minimum distance from the inner side of the first sidewall portion US1 to the circuit board 112 and the minimum distance from the inner side of the second sidewall portion LS1 to the circuit board 112 are both set to the first gap Jx2. This can effectively ensure that the first sidewall portion US1 and the second sidewall portion LS1 can maintain good force stability when subjected to opposing pressure, and prevent the earphone 10 from falling off the user's ear due to unbalanced force when subjected to opposing pressure from the user.

[0062] Of course, in some embodiments, the minimum distance between the inner side of the first sidewall portion US1 and the circuit board 112 and the minimum distance between the second sidewall portion LS1 and the circuit board 112 can also be set to be unequal. For example, one of the first sidewall portion US1 and the second sidewall portion LS1 can directly abut against the circuit board 112, while the other maintains a first gap Jx2 with the circuit board 112. In this way, even if the user accidentally touches the earphone 10, the other of the first sidewall portion US1 and the second sidewall portion LS1 can still maintain a distance from the circuit board 112 through the first gap Jx2, thereby preventing the first sidewall portion US1 and the second sidewall portion LS1 from simultaneously squeezing the circuit board 112, causing the circuit board 112 to deform. This can still improve the control accuracy and anti-interference capability of the control function of the earphone 10 to a certain extent. In other words, in a natural state and along the spacing direction, as long as one of the first sidewall portion US1 and the second sidewall portion LS1 is spaced from the circuit board 112 by a minimum distance of the first gap Jx2, the circuit board 112 can be effectively prevented from deforming due to accidental touch operation by the user, thereby effectively improving the operating accuracy and anti-interference capability of the headphone 10. This paper mainly uses an embodiment where the minimum distance from the inner side of the first sidewall portion US1 to the circuit board 112 and the minimum distance from the inner side of the second sidewall portion LS1 to the circuit board 112 are both set to the first gap Jx2 to describe the headphone 10 of this application in detail.

[0063] Optionally, in some embodiments, the first gap Jx2 is set to be greater than the deformation of the first sidewall US1 and the second sidewall LS1 when the opposing compressive force F1 is a first pressure threshold, and less than the deformation of the first sidewall US1 and the second sidewall LS1 when the opposing compressive force F1 is a second pressure threshold. The first pressure threshold is not less than 0.5 N, and the second pressure threshold is between 1 N and 5 N. The first pressure threshold is a limit value of the opposing compressive force F1 acting on the first sidewall US1 and the second sidewall LS1 due to accidental user touch. Therefore, setting the first gap Jx2 to be greater than the deformation of the first sidewall US1 and the second sidewall LS1 when the opposing compressive force F1 is the first pressure threshold can effectively improve the control accuracy and anti-interference capability of the headphone 10. Furthermore, the second pressure threshold can be a minimum value that triggers the headphone 10's function. Setting the first gap Jx2 to be less than the deformation of the first sidewall US1 and the second sidewall LS1 when the opposing compressive force F1 is the second pressure threshold can effectively improve the pressure control comfort of the headphone 10. Setting the first pressure threshold to not less than 0.5 Newtons can further improve the control precision and anti-interference capability of the headphone 10's control function. Setting the second pressure threshold to between 1 Newton and 5 Newtons can further improve the pressure control comfort of the headphone 10.

[0064] Optionally, as shown in Figures 8 and 9, in some embodiments, as described above, the housing assembly 110 includes a second housing 1102 that mates with the first housing 1101 along a predetermined mating direction. The second housing 1102 includes a third sidewall portion US2 and a fourth sidewall portion LS2 that are spaced apart from each other along a spacing direction. The third sidewall portion US2 and the fourth sidewall portion LS2 are inserted between the first sidewall portion US1 and the second sidewall portion LS1 along the mating direction and partially overlap. In their natural state and along the spacing direction, a second gap Jx1 is maintained between the first sidewall portion US1 and the adjacent third sidewall portion US2, and between the second sidewall portion LS1 and the adjacent fourth sidewall portion LS2, respectively. The second gap Jx1 is greater than the first gap Jx2. Specifically, as described above, the third sidewall portion US2 and the fourth sidewall portion LS2 are two sidewall portions spaced apart along the spacing direction of the sidewall of the second housing 1102. Specifically, the third sidewall portion US2 and the fourth sidewall portion LS2 are inserted between the first sidewall portion US1 and the second sidewall portion LS1 along the mating direction and partially overlap. This can be understood as follows: after the first housing 1101 and the second housing 1102 are mated along the mating direction, the portions of the third sidewall portion US2 and the third sidewall portion US2 with the second ring portion 1102a are inserted into the inner side of the first ring portion 1101a and overlap with the first ring portion 1101a. In the natural state and along the interval direction, the first sidewall portion US1 and the adjacent third sidewall portion US2, and the second sidewall portion LS1 and the adjacent fourth sidewall portion LS2, respectively maintain a second gap Jx1. The second gap Jx1 is greater than the first gap Jx2. This can be understood as follows: in the natural state and along the interval direction, the first ring portion 1101a and the second ring portion 1102a have a second gap Jx1, which is the dispensing gap described above. The first housing 1101 is the main component that receives the opposing pressure F1 from the user, and the second housing 1102 is in contact with the first housing 1101 along the interval direction. Therefore, the second housing 1102 will cause a certain resistance to the deformation of the first side wall portion US1 and the second side wall portion LS1. Therefore, the second gap Jx1 is set to be greater than the first gap Jx2, which effectively reduces the resistance of the second housing 1102 to the first side wall portion US1 and the second side wall portion LS1 during the deformation stroke of the first side wall portion US1 and the second side wall portion LS1 pressing the circuit board 112. This ensures that the first side wall portion US1 and the second side wall portion can smoothly contact the circuit board 112, thereby effectively improving the stability of the pressure control function of the earphone 10.

[0065] Optionally, as shown in FIG8, in some embodiments, as described above, the first housing 1101 further includes a first top wall portion OS1 connecting the first side wall portion US1 and the second side wall portion LS1, and the second housing 1102 further includes a second top wall portion OS2 connecting the third side wall portion US2 and the fourth side wall portion LS2. The first top wall portion OS1 and the second top wall portion OS2 are arranged opposite to each other and spaced apart along the mating direction, and the circuit board 112 is located between the first top wall portion OS1 and the second top wall portion OS2. Specifically, along the mating direction, one side edge 1123 of the circuit board 112 further overlaps with the overlapping portions of the first side wall portion US1 and the third side wall portion US2, and the other side edge 1122 of the circuit board 112 further overlaps with the overlapping portions of the second side wall portion LS1 and the fourth side wall portion LS2. Specifically, as described above, along the mating direction, the first top wall is located at one end of the first side wall portion US1 and the second side wall portion LS1, and is respectively connected to the first side wall portion US1 and the second side wall portion LS1. This arrangement results in a cantilevered arrangement between the first side wall portion US1, the second side wall portion LS1, and the first top wall portion OS1, that is, the first side wall portion US1 and the second side wall portion LS1 are similarly suspended on the first top wall portion OS1. Based on this, the first side wall portion US1 and the second side wall portion LS1 are located at the end opposite to the first top wall portion OS1 (that is, along the mating direction, closer to the first side wall portion US1). The portion overlapping with the third sidewall portion US2, and the portion overlapping near the second sidewall portion LS1 and the fourth sidewall portion LS2, is more prone to deformation. Therefore, along the spacing direction, one side edge 1123 of the circuit board 112 is further overlapped with the overlapping portions of the first sidewall portion US1 and the third sidewall portion US2, and the other side edge 1122 of the circuit board 112 is further overlapped with the overlapping portions of the second sidewall portion LS1 and the fourth sidewall portion LS2. This is more conducive to the compression of the first sidewall portion US1 and the second sidewall portion LS1 with the circuit board 112, thereby effectively improving the stability of the pressure control function of the earphone 10.Of course, in some embodiments, along the spacing direction, the two side edges (i.e., side edges 1122 and side edges 1123) of the circuit board 112 can also be configured to overlap with the third side wall portion US2 and the fourth side wall portion LS2 respectively. Furthermore, the minimum distance between the inner side of the third side wall portion US2 and the circuit board 112 is also the first gap Jx2, and the minimum spacing distance between the inner side of the fourth side wall portion LS2 and the circuit board 112 is also the first gap Jx2. With this configuration, when the first side wall portion US1 and the second side wall portion LS1 are subjected to opposing compressive force F1, the first side wall portion US1 and the third side wall portion US2 can together compress one side edge 1123 of the main control board circuit, and the second side wall portion LS1 and the fourth side wall portion LS2 can together compress the other side edge 1122 of the circuit board 112. This effectively prevents the first side wall portion US1 and the third side wall portion US2 from misaligning and the second side wall portion LS1 and the fourth side wall portion LS2 from misaligning, which would cause the first housing 1101 and the second housing 1102 to become loose.

[0066] Optionally, as shown in Figures 5 and 10, in some embodiments, as described above, the earphone 10 further includes a circuit board 112 disposed within the housing assembly 110. The deformable element 14 is independent of the circuit board 112, and the circuit board 112 is provided with a main control circuit electrically connected to the sensor 15. The main control circuit executes corresponding control functions based on electrical signals. Specifically, the deformable element 14 is disposed as an independent component within the housing assembly 110, and the sensor 15 is disposed on the deformable element 14. This effectively reduces the space occupied by the sensor 15 on the main control board circuit and lowers the design complexity of the circuit board 112.

[0067] Optionally, as shown in Figures 5 and 10, in some embodiments, along the spacing direction, the deformable member 14 includes two opposing abutment portions 141. Both the first sidewall portion US1 and the second sidewall portion LS1 are provided with abutment grooves, and the two abutment portions 141 are respectively disposed in the corresponding abutment grooves. In some embodiments, the abutment portions 141 can be fixedly connected to the abutment grooves by dispensing adhesive. This arrangement can effectively improve the connection stability between the deformable member 14 and the housing assembly 110, so as to ensure the touch stability of the earphone 10.

[0068] Preferably, as shown in Figures 5 and 10, the deformable member 14 further includes an arched portion 142, wherein two abutting portions 141 are respectively connected to both ends of the arched portion 142 and extend away from the arched portion 142 to form a complete deformable member 14. The arched portion 142 is arranged in a raised shape from both ends of the arched portion 142 along the vertical direction of the spacing direction. The sensor 15 is disposed on the arched portion 142. The two abutting portions 141 abut against the first sidewall portion US1 and the second sidewall portion LS1, respectively. Specifically, in some embodiments, along the spacing direction, the sensor 15 is disposed in the middle of the arched portion 142. In other words, along the spacing direction, at least the middle region of the arched portion 142 is configured as a plate-like region 16, and the sensor 15 is disposed in the plate-like region 16. The arched portion 142 is arched from both ends along the perpendicular direction of the spacing direction. When the first sidewall portion US1 and the second sidewall portion LS1 are subjected to opposing compressive force F1, they deform and compress the two abutment portions 141, causing the arched portion 142 to deform. This arrangement allows the arched portion 142 to deform more effectively when compressed by the two abutment portions 141, thereby effectively improving the control accuracy of the earphone 10.

[0069] Optionally, in some embodiments, the deformable member 14 is formed by bending a sheet or plate, and the arched portion 142 is U-shaped, U-shaped, or C-shaped. Of course, in other embodiments, the deformable member 14 can also be formed by bending a rod-shaped member, a stick-shaped member, or the like.

[0070] Optionally, as shown in Figures 5 and 10, in some embodiments, as described above, the earphone 10 further includes a speaker 111 disposed within the housing assembly 110. The main surface 1121 of the circuit board 112 overlaps with the speaker 111 along the axial direction z1 of the speaker 111. A deformable member 14 is disposed laterally to the speaker 111 along the radial direction of the speaker 111. The main surface 143 of the deformable member 14 and the main surface 1121 of the circuit board 112 are intersected. This arrangement can effectively improve the space utilization rate inside the housing assembly 110. In some embodiments, the thickness of the arched portion 142 is set to 0.2 mm, the width is set to 1.9 mm, and the length is set to 11.5 mm. The width of the arched portion 142 is the structural length along the axial direction z1 of the speaker 111, the length of the arched portion 142 is the structural length along the spacing direction, and the thickness of the arched portion 142 is the structural length along the length direction Y of the housing assembly 110. Optionally, in other embodiments, the main surface 1121 of the circuit board 112 and the main surface 143 of the deformable member 14 overlap with the speaker 111 along the axial direction z1 of the speaker 111. The axial direction z1 of the speaker 111 is parallel to the thickness direction X of the mechanism module 11.

[0071] Optionally, in some embodiments, the earphone 10 further includes an ear hook portion 12 connected to the housing assembly 110. The ear hook portion 12 is used to place the housing assembly 110 in front of the user's auricle when worn. The deformable member 14 is arranged radially along the speaker 111 on the side of the speaker 111 near the ear hook. This arrangement can effectively improve the space utilization of the housing assembly 110.

[0072] Optionally, as shown in Figures 6 and 11, in some embodiments, the deformable element 14 can also be a second housing 1102. Specifically, the second housing 1102 includes a third side wall portion US2, a fourth side wall portion LS2, and a second top wall portion OS2. The second housing 1102 cooperates with the first housing 1101 in the manner described in the above embodiments. The sensor 15 is disposed on the second top wall portion OS2. When the first side wall portion US1 and the second side wall portion LS1 are subjected to opposing compressive force F1 and deform, the first side wall portion US1 and the second side wall portion LS1 respectively compress the third side wall portion US2 and the fourth side wall portion LS2, so that the third side wall portion US2 and the fourth side wall portion LS2 pull the second top wall portion OS2 and cause the second top wall portion OS2 to deform. The sensor 15 disposed on the second top wall portion OS2 detects the deformation of the second top wall portion OS2 and generates an electrical signal. The sensor 15 is electrically connected to the circuit board 112 via a flexible circuit board 17 / wire assembly, thereby transmitting electrical signals to the main control circuit of the circuit board 112. This arrangement effectively simplifies the structure of the earphone 10 and optimizes its space utilization.

[0073] Furthermore, in some embodiments, the circuit board 112 is located between the speaker 111 and the second top wall portion OS2. This arrangement allows the sensor 15 to be as close as possible to the circuit board 112, thereby reducing the length of the flexible circuit board 17 and effectively improving the utilization rate of the internal space of the housing assembly 110.

[0074] Alternatively, in some embodiments, the deformable member 14 may also be the top wall of the first housing 1101, for example, the first top wall portion OS1.

[0075] The above description is only a part of the embodiments of this application and does not limit the scope of protection of this application. Any equivalent device or equivalent process transformation made based on the content of this application specification and drawings, or direct or indirect application in other related technical fields, are similarly included in the patent protection scope of this application.

Claims

1. An earphone, characterized in that, The earphone includes a housing assembly, which includes a first housing. The first housing includes a first sidewall portion and a second sidewall portion that are spaced apart from each other. The earphone also includes a deformable element and a sensor. The deformable element is disposed between the first sidewall portion and the second sidewall portion. When the first sidewall portion and / or the second sidewall portion are subjected to opposing compressive forces applied from the outside along the spacing direction of the first sidewall portion and the second sidewall portion, the first sidewall portion and / or the second sidewall portion deform and jointly compress the deformable element, causing the deformable element to bend laterally in the spacing direction. The sensor is disposed in the bending area of ​​the deformable element and generates a corresponding electrical signal when the bending degree of the bending area is greater than a preset bending threshold.

2. The earphone according to claim 1, characterized in that, The deformable component has a plate-shaped region, which is configured to laterally bend toward the main surface of the plate-shaped region under the compression of the first sidewall portion and the second sidewall portion, and the sensor is disposed on the plate-shaped region.

3. The earphone according to claim 2, characterized in that, The deformable component is the main control circuit board, the sensor is disposed on the circuit board, and the circuit board is provided with a main control circuit electrically connected to the sensor. The main control circuit performs corresponding control functions based on the electrical signal.

4. The earphone according to claim 3, characterized in that, The main surface of the circuit board is arranged along the interval direction. The first sidewall portion and the second sidewall portion are pressed against the opposite side edges of the circuit board under the action of the opposing extrusion force, so that the main surface of the circuit board is laterally bent. The sensor is disposed on the main surface of the circuit board.

5. The earphone according to claim 4, characterized in that, In its natural state and along the spacing direction, at least one of the first sidewall portion and the second sidewall portion maintains a first gap with the side edge of its adjacent circuit board.

6. The earphone according to claim 5, characterized in that, The first gap is set to be greater than the deformation of the first sidewall and the second sidewall when the opposing extrusion force is a first pressure threshold, and less than the deformation of the first sidewall and the second sidewall when the opposing extrusion force is a second pressure threshold. The first pressure threshold is not less than 0.5 N, and the second pressure threshold is between 1 N and 5 N.

7. The earphone according to claim 5, characterized in that, The housing assembly further includes a second housing that mates with the first housing along a preset mating direction, the mating direction being intersected by the interval direction. The second housing includes a third sidewall portion and a fourth sidewall portion spaced apart along the interval direction. The third sidewall portion and the fourth sidewall portion are inserted between the first sidewall portion and the second sidewall portion along the mating direction and partially overlap. In the natural state and along the interval direction, the first sidewall portion and the adjacent third sidewall portion, as well as the second sidewall portion and the adjacent fourth sidewall portion, respectively maintain a second gap, the second gap being larger than the first gap.

8. The earphone according to claim 7, characterized in that, The first housing further includes a first top wall connecting the first side wall and the second side wall, and the second housing further includes a second top wall connecting the third side wall and the fourth side wall. The first top wall and the second top wall are positioned opposite each other and spaced apart along the mating direction. The circuit board is located between the first top wall and the second top wall. Along the mating direction, one edge of the circuit board further overlaps with the overlapping portion of the first side wall and the third side wall, and the other edge of the circuit board further overlaps with the overlapping portion of the second side wall and the fourth side wall.

9. The earphone according to claim 2, characterized in that, The earphone further includes a circuit board disposed within the housing assembly, the deformable element being independent of the circuit board, and a main control circuit electrically connected to the sensor being disposed on the circuit board, the main control circuit performing corresponding control functions based on the electrical signal.

10. The earphone according to claim 9, characterized in that, Along the interval direction, the deformable member includes an arched portion and two abutting portions respectively connected to both ends of the arched portion and extending away from the arched portion. The arched portion is arranged in a raised shape from both ends of the arched portion along the vertical direction of the interval direction. The sensor is disposed on the arched portion. The two abutting portions abut against the first sidewall portion and the second sidewall portion respectively.

11. The earphone according to claim 10, characterized in that, Along the interval direction, the sensor is located in the middle of the arched portion.

12. The earphone according to claim 10, characterized in that, The deformable component is formed by bending a plate or sheet, and the arched part is arranged in a U-shape, U-shape or C-shape.

13. The earphone according to claim 10, characterized in that, The earphone also includes a speaker disposed within the housing assembly, the main surface of the circuit board overlaps with the speaker along the axial direction of the speaker, the deformable member is disposed laterally to the speaker along the radial direction of the speaker, and the main surface of the deformable member and the main surface of the circuit board are intersecting each other.

14. The earphone according to claim 13, characterized in that, The earphone further includes an ear hook connected to the housing assembly, the ear hook being used to position the housing assembly in front of the user's auricle when worn, and the deformable member being disposed radially along the speaker on the side of the speaker near the ear hook.

15. The earphone according to claim 10, characterized in that, The headphones also include a speaker disposed within the housing assembly, wherein the main surface of the circuit board and the main surface of the deformable member overlap with the speaker along the axial direction of the speaker and are also overlapped with each other.

16. The earphone according to claim 2, characterized in that, The first housing further includes a first top wall portion connecting the first side wall portion and the second side wall portion, and the deformable member is the first top wall portion; or the housing assembly further includes a second housing portion that cooperates with the first housing, and the deformable member is the second housing portion.

17. The headphones according to any one of claims 1-16, characterized in that, The housing assembly further includes a second housing that cooperates with the first housing, and the earphone further includes a speaker disposed within the housing assembly and an ear hook connected to the housing assembly. The ear hook is used to position the housing assembly in front of the user's auricle when worn. The speaker is located at least mostly or entirely within the first housing.

18. The earphone according to claim 17, characterized in that, The housing assembly includes a connecting end connected to the ear hook portion and a free end away from the connecting end. The housing assembly further has a length direction, a width direction and a thickness direction orthogonal to each other, wherein the length direction is defined as the direction from the free end toward or away from the connecting end, and the thickness direction is defined as the direction toward or away from the auricle in the wearing state. The first sidewall portion and the second sidewall portion are spaced apart from each other along the width direction.

19. The headphones according to claim 18, characterized in that, The dimensions of the first sidewall portion and the second sidewall portion along the length direction are greater than the dimensions along the thickness direction.

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