Earphone

Abstract

The present application relates to the technical field of electronic devices, and specifically relates to an earphone. The earphone comprises a main control circuit board and a capacitor plate. The capacitor plate is arranged in the region of the earphone close to the skin of a user in a worn state, and is configured to generate a corresponding electrical signal on the basis of whether the user has worn the earphone. The capacitor plate comprises a first main body part electrically connected to the main control circuit board, a second main body part spaced apart from the first main body part, and a first connecting part for connecting the first main body part and the second main body part in the spacing region between the first main body part and the second main body part. The area of the first connecting part is smaller than the area of the first main body part and the area of the second main body part, and the first connecting part is bent relative to at least one of the first main body part and the second main body part, so that the first main body part and the second main body part are non-coplanar.

Description

A headset

TECHNICAL FIELD

[0001] The application relates to the technical field of electronic devices, in particular to a headset.

BACKGROUND

[0002] The wearing state detection function of the headset is realized by an infrared light sensor. The infrared light sensor needs to be always turned on, and has large power consumption. In addition, the infrared light has a trace amount of radiation to the human body, and long-term use may pose a threat to human health.

[0003]

SUMMARY

[0004] The application provides a headset, which comprises a master control circuit board and a capacitor plate. The capacitor plate is arranged at a region of the headset close to the skin of a user in a wearing state, and is arranged to generate a corresponding electrical signal based on whether the user wears the headset. The capacitor plate comprises a first main body part electrically connected to the master control circuit board, a second main body part arranged in a spaced manner with the first main body part, and a first connecting part connecting the first main body part and the second main body part in a spacing region between the first main body part and the second main body part. The area of the first connecting part is smaller than the areas of the first main body part and the second main body part, and the first connecting part is arranged to be bent relative to at least one of the first main body part and the second main body part, so that the first main body part and the second main body part are arranged to be non-coplanar.

[0005] In some embodiments, the capacitor plate further comprises a second connecting part connected to the first main body part. The area of the second connecting part is smaller than the areas of the first main body part and the second main body part. The first main body part, the second main body part and the first connecting part are located on the outer side of the master control circuit board and are electrically connected to the master control circuit board through the second connecting part.

[0006] In some embodiments, the first main body part, the second main body part, the first connecting part and the second connecting part are integrally formed by a plate material or a sheet material.

[0007] In some embodiments, the second connecting part is arranged to be bent relative to the first main body part.

[0008] In some embodiments, the area of the capacitor plate is 35-50mm 2 .

[0009] In some embodiments, the earphone further includes a core housing and a hook-shaped structure connected to the core housing. The core housing has a connecting end connected to the hook-shaped structure and a free end not connected to the hook-shaped structure. When worn, the core housing is located on the front side of the ear, and the free end extends into or covers the concha cavity. At least a portion of the hook-shaped structure is located on the back side of the ear when worn. The capacitor plates are disposed within the core housing and close to the free end.

[0010] In some embodiments, the free end is tapered in the direction away from the connection end, and the capacitor plate further includes a second connection portion connected to the first main body portion and electrically connected to the main control circuit board through the second connection portion. The second connection portion is closer to the free end than the first connection portion, and the area of ​​the second connection portion is smaller than the area of ​​the first connection portion.

[0011] In some embodiments, the inner wall surface of the free end has a first wall region and a second wall region that are not coplanar, and the first connecting portion is bent such that the first main body portion is adjacent to the first wall region, and the second main body portion is adjacent to the second wall region.

[0012] In some embodiments, the curvature of the first wall region is less than that of the second wall region, the first main body is fitted and fixed to the first wall region, and the second main body and the second wall region maintain at least a partial clearance fit.

[0013] In some embodiments, the area of ​​the first connecting portion is smaller than the area of ​​the first main body portion and smaller than the area of ​​the second main body portion.

[0014] In some embodiments, the first connecting portion has a first side, a second side, a third side, and a fourth side connected end to end in sequence. The first side and the second side are arranged opposite to each other, and the third side and the fourth side are arranged opposite to each other. The first side is connected to the first main body portion, and the second side is connected to the second main body portion. The length of the first side and the length of the second side are both less than the length of the third side and both are less than the length of the fourth side.

[0015] In some embodiments, the earphone further includes an electrode plate support for supporting the first main body portion, so that the first main body portion is fitted and fixed to the first wall surface region.

[0016] In some embodiments, the earphones further include a speaker disposed within the housing of the mechanism, with the main control circuit board overlapping a portion of the speaker near the connection end along the axial direction of the speaker, and the capacitor plate overlapping another portion of the speaker near the free end.

[0017] In some embodiments, the headphones further include a cavity support disposed around the speaker, and the second main body is attached to the cavity support.

[0018] In some embodiments, the earphone further includes a polar plate bracket for supporting the first main body and a sound cavity bracket disposed around the speaker, one end of the polar plate bracket being fixed relative to the main control circuit board, and the other end of the polar plate bracket being fixed relative to the sound cavity bracket.

[0019] In some embodiments, the earphone further includes a reinforcing liner that is attached to the main control circuit board, one end of the electrode bracket is supported on the reinforcing liner, and the other end of the electrode bracket is supported on the acoustic cavity bracket. [Attached Image Description]

[0020] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 is a schematic diagram of the front outline of the ear of a user or simulator in some embodiments;

[0022] Figure 2 is a schematic diagram of the headphone structure in some embodiments of this application;

[0023] Figure 3 is a schematic diagram of the headphones shown in Figure 2 in some embodiments in a wearing state;

[0024] Figure 4 is a structural schematic diagram of the headphones shown in Figure 2 from another perspective in some embodiments;

[0025] Figure 5 is a structural schematic diagram of the headphones shown in Figure 2 from another perspective in some embodiments;

[0026] Figure 6 is a cross-sectional view of the earphone along line VI-VI in Figure 2;

[0027] Figure 7 is a cross-sectional view of the earphone along line VII-VII in Figure 2;

[0028] Figure 8 is a structural schematic diagram of the first housing in Figure 6 in some embodiments;

[0029] Figure 9 shows the explosion intent of the second casing in Figure 6 in some embodiments;

[0030] Figure 10 is a partial structural schematic diagram of the earphone in some embodiments of Figure 6;

[0031] Figure 11 is a partial structural schematic diagram of the acoustic cavity support in Figure 6 in some embodiments;

[0032] Figure 12 is a partial structural schematic diagram of the earphone in some embodiments of Figure 6;

[0033] Figure 13 is a schematic diagram of the capacitor plates in Figure 12 in some embodiments.

Detailed Implementation Methods

[0034] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It should be noted that the following embodiments are for illustrative purposes only and do not limit the scope of the application. Similarly, the following embodiments are only some, not all, embodiments of the present application, and all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of the present application.

[0035] The reference to "embodiment" in this application means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described in this application can be combined with other embodiments.

[0036] Please refer to Figure 1, which is a schematic diagram of the anterior contour of the ear of a user or simulator in some embodiments. The ear 100 may include physiological parts such as the external auditory canal 101, the concha 102, the cymba conchae 103, the triangular fossa 104, the antihelix 105, the scaphoid fossa 106, the helix 107, and the antitragus 108. The external auditory canal 101 has a certain depth and can extend to the tympanic membrane; however, for ease of description, unless otherwise specified, the external auditory canal 101 may specifically refer to the ear opening of the ear 100. Additionally, the physiological parts such as the concha 102, the cymba conchae 103, and the triangular fossa 104 may also have a certain volume and depth. The concha 102 may be directly connected to the external auditory canal 101; that is, it can be simply regarded as the ear opening located at the bottom of the concha 102.

[0037] Understandably, individual differences may exist between users, leading to variations in the shape, size, and other dimensions of the earpiece 100. To facilitate description and reduce (or even eliminate) these individual differences, a simulator containing the head and its earpiece (generally a left and right earpiece, used here as an example) 100 can be manufactured based on ANS: S3.36, S3.25, and IEC: 60318-7 standards. Examples include the GRAS 45BC KEMAR, HEAD Acoustics, B&K 4128 series, or B&K 5128 series, to simulate the typical headphone wearing scenario for most users. Using the GRAS KEMAR as an example, the earpiece 100 simulator can be any of the GRAS 45AC, GRAS 45BC, GRAS 45CC, or GRAS 43AG models. Taking HEAD Acoustics as an example, the ear 100 simulator can be any one of HMS II.3, HMS II.3LN, or HMS II.3LN HEC.

[0038] It should be noted that in fields such as medicine and anatomy, three basic planes—the sagittal plane, the coronal plane, and the horizontal plane—and three basic axes—the sagittal axis, the coronal axis, and the vertical axis—can be defined for the human body or human simulator. The sagittal plane is a plane perpendicular to the ground along the anteroposterior direction of the body, dividing the human body or human simulator into left and right parts. The coronal plane is a plane perpendicular to the ground along the left and right direction of the body, dividing the human body or human simulator into anterior and posterior parts. The horizontal plane is a plane parallel to the ground along the vertical direction of the body, dividing the human body or human simulator into superior and inferior parts. Correspondingly, the sagittal axis is the axis along the anteroposterior direction of the body and perpendicular to the coronal plane; the coronal axis is the axis along the left and right direction of the body and perpendicular to the sagittal plane; and the vertical axis is the axis along the vertical direction of the body and perpendicular to the horizontal plane. Furthermore, the "front side of the ear" mentioned in this application is a concept relative to "back side of the ear." The former refers to the side of the ear that is away from the head, while the latter refers to the side of the ear that faces the head. Both refer to the ear 100 of the user or simulator. The ear 100 of the human body or human simulator viewed along the coronal axis can be shown in Figure 1.

[0039] Please refer to Figures 2, 3, 4, and 5. Figure 2 is a structural schematic diagram of the earphone in some embodiments of this application; Figure 3 is a schematic diagram of the earphone shown in Figure 2 in a wearing state in some embodiments; Figure 4 is a structural schematic diagram of the earphone shown in Figure 2 from another perspective in some embodiments; and Figure 5 is a structural schematic diagram of the earphone shown in Figure 2 from yet another perspective in some embodiments. The earphone 200 may include a mechanism module 10 and a hook-shaped structure 20 connected to the mechanism module 10. The mechanism module 10 is located on the front side of the ear 100 in the wearing state. At least a portion of the hook-shaped structure 20 is located on the rear side of the ear 100 in the wearing state, so that the earphone 200 is hung on the ear 100 in the wearing state.

[0040] In this application, descriptions of the process or action of wearing headphones 200, such as "wearing headphones 200," "headphones 200 being worn," and "in the wearing state," all refer to headphones 200 being worn on the ear 100. Of course, due to individual differences among users, the way headphones 200 are worn by different users may differ from how they are worn on the ear 100 of a simulator; however, such differences should be tolerable.

[0041] In some embodiments, the mechanism module 10 may have a connection end CE connected to the hook structure 20 and a free end FE not connected to the hook structure 20. The mechanism module 10 may be configured not to block the external ear canal 101 when worn, thus making the earphone 200 an "open-back earphone". It is understood that due to individual differences among users, when the earphone 200 is worn by different users, the mechanism module 10 may partially cover the external ear canal 101, but the external ear canal 101 will still not be blocked.

[0042] Specifically, to improve the stability of the earphone 200 during wear, the earphone 200 can adopt any one or a combination of the following methods: First, at least a portion of the hook-shaped structure 20 is configured as a conformal structure that fits against at least one of the back of the ear 100 and the head, thereby increasing the contact area between the hook-shaped structure 20 and the ear 100 and / or the head, thus increasing the resistance to the earphone 200 falling off the ear 100. Second, at least a portion of the hook-shaped structure 20 is configured as an elastic structure, giving it a certain deformation during wear, thereby increasing the positive pressure of the hook-shaped structure 20 on the ear 100 and / or the head, thus increasing the resistance to the earphone 200 falling off the ear 100. Third, at least a portion of the hook-shaped structure 20 is configured to rest against the head during wear, creating a reaction force that holds the ear 100, causing the core module 10 to be held against the front of the ear 100, thereby increasing the resistance to the earphone 200 falling off the ear 100. Fourth, the mechanism module 10 and the hook structure 20 are configured to clamp the physiological parts such as the antihelix 105 and the concha 102 from the front and back sides of the ear 100 when worn, thereby increasing the resistance to the earphone 200 falling off the ear 100. Fifth, the mechanism module 10 or the auxiliary structure connected to it is configured to extend at least partially into the physiological parts such as the concha 102, cymba concha 103, triangular fossa 104, and scaphoid fossa 106, thereby increasing the resistance to the earphone 200 falling off the ear 100.

[0043] Optionally, referring to Figure 3, in the wearing state, the free end FE of the mechanism module 10 can at least partially extend into the concha 102. The mechanism module 10 and the hook structure 20 can be configured to clamp the ear 100 from both the front and rear sides of the ear 100 region corresponding to the concha 102, thereby increasing the resistance to the earphone 200 falling off the ear 100 and improving the stability of the earphone 200 in the wearing state. For example, the free end FE is pressed into the concha 102 in the thickness direction X. As another example, the free end FE abuts against the concha 102 in the length direction Y and the width direction Z.

[0044] It should be noted that, when worn, the free end FE of the movement module 10 can not only extend into the concha 102, but also project orthogonally onto the antihelix 105, or onto the left and right sides of the head and be positioned in front of the ear 100 on the sagittal axis. In other words, the hook structure 20 can support the movement module 10 when worn in the concha 102, antihelix 105, and in front of the ear 100.

[0045] Optionally, referring to Figures 3, 4, and 5, when worn and viewed along the coronal axis, the movement module 10 can be shaped as a circle, ellipse, rounded square, or rounded rectangle. The movement module 10 can have a length direction Y and a width direction Z that are perpendicular to the thickness direction X and orthogonal to each other. The length direction Y can be defined as the direction in which the movement module 10 approaches or moves away from the back of the head when worn, and the width direction Z can be defined as the direction in which the movement module 10 approaches or moves away from the top of the head when worn. Therefore, for ease of description, this embodiment uses a rounded rectangle as an example for illustrative purposes. Furthermore, in some embodiments, the length of the movement module 10 in the length direction Y can be greater than the width of the movement module 10 in the width direction Z.

[0046] Optionally, the mechanism module 10 may have an inner surface IS facing the ear 100 along the thickness direction X and an outer surface OS facing away from the ear 100 in the wearing state, as well as connecting surfaces such as a lower surface LS, an upper surface US, and a rear surface RS connecting the inner surface IS and the outer surface OS. Specifically, when the mechanism module 10 is in the wearing state, the upper surface US connects the inner surface IS and the outer surface OS and faces away from the external auditory canal 101 along the width direction Z; the lower surface LS connects the inner surface IS and the outer surface OS and faces the external auditory canal 101; and the rear surface RS connects the upper surface US and the lower surface LS, and may also connect the inner surface IS and the outer surface OS. The thickness direction X can also be defined as the direction in which the mechanism module 10 approaches or moves away from the ear 100 in the wearing state. At least a portion of the connecting surfaces, such as the rear surface OS, is located within the concha 102 in the wearing state and forms a first contact area with the front of the ear 100 region. That is, the rear surface RS may be located at one end in the length direction Y facing the back of the head in the wearing state and is at least partially located within the concha 102. In some embodiments, the hook structure 20 forms a second contact area with the rear side of the ear 100 region during the wearing state. The second contact area and the first contact area at least partially overlap in the ear thickness direction of the ear 100 region. Furthermore, the mechanism module 10 and the hook structure 20 can jointly clamp the ear 100 from both the front and rear sides, and the clamping force formed is mainly compressive stress, which is beneficial to improving the stability and comfort of the earphone 200 during the wearing state. In some embodiments, when the mechanism module 10 is configured in a circular, elliptical, or other shape, the connecting surface may also refer to the arcuate side surface of the mechanism module 10.

[0047] Optionally, please refer to Figures 6 and 7. Figure 6 is a cross-sectional view of the earphone 200 along line VI-VI in Figure 2, and Figure 7 is a cross-sectional view of the earphone 200 along line VII-VII in Figure 2. The core module 10 may include a core housing 11, a speaker 12, a sound cavity support 13, a main control circuit board 14, a microphone 15, and a sensor 16. The core housing 11 may be connected to the hook-shaped structure 20. The core housing 11 may have an installation space 201 for mounting the speaker 12, the sound cavity support 13, the main control circuit board 14, the microphone 15, and the sensor 16, etc., and may also be used to mount other structures such as batteries, which will not be elaborated further. The speaker 12, the sound cavity support 13, the main control circuit board 14, the microphone 15, and the sensor 16 may all be disposed within the core housing 11, for example, the installation space 201. The speaker 12 and the sound cavity support 13 may be arranged to form an acoustic cavity 202. The main control circuit board 14 can be electrically connected to the speaker 12, microphone 15, and sensor 16 respectively. The main control circuit board 14 can be used to control the operation of the speaker 12 and / or microphone 15. The main control circuit board 14 can receive electrical signals generated by the sensor 16 and generate corresponding control commands based on the electrical signals to allow the headphones 200 to perform preset functions. The acoustic cavity 202 is located within the installation space 201.

[0048] Optionally, referring to Figures 6 and 7, the movement housing 11 may include a first housing 111 and a second housing 112 that snap together along the thickness direction X to form a mounting space 201. The second housing 112 is closer to the ear 100 than the first housing 111 when worn. A parting surface 203 is provided between the first housing 111 and the second housing 112 to simplify the structure of the movement housing 11 and reduce manufacturing costs. The second housing 112 is closer to the ear 100 than the first housing 111 when worn.

[0049] Preferably, please refer to Figures 6, 7, and 8. Figure 8 is a structural schematic diagram of the first housing 111 in Figure 6 in some embodiments. In some embodiments, the first housing 111 can be a plastic part, but it can also be a housing structure made of other materials. The first housing 111 may include a bottom wall 1111 and a first side wall 1112 connected to the bottom wall 1111 and extending towards the side near the second housing 112. When wearing the earphone 200, the bottom wall 1111 may face the skin at the ear 100, and a portion of it may fit in contact with the skin.

[0050] Preferably, a sound outlet 1101 communicating with the mounting space 201 may be provided on the bottom wall 1111. The sound outlet 1101 can cooperate with the speaker 12, so that the sound waves generated by the speaker 12 can propagate through the sound outlet 1101. Further, in some embodiments, the sound outlet 1101 may not be provided on the bottom wall 1111, but may be provided on the side of the first side wall 1112 corresponding to the lower side LS, or may be provided at the corner between the first side wall 1112 and the bottom wall 1111. In some embodiments, the sound outlet 1101 may not communicate with the acoustic cavity 202. Further, in some embodiments, the bottom wall 1111 may be provided with a sound-absorbing mesh and / or a protective steel mesh at the sound outlet 1101.

[0051] The first sidewall 1112 may extend from the edge of the bottom wall 1111 toward the side closer to the second housing 112, so that it can be integrally formed with the bottom wall 1111 for ease of processing; of course, it may not be integrally formed. In some embodiments, viewed along the width direction Z, and in the reference direction from the connecting end CE to the free end FE, the portion of the first sidewall 1112 near the free end FE gradually approaches the bottom wall 1111 in the thickness direction X.

[0052] Preferably, in some embodiments, the first sidewall 1112 can be used to house the sensor 16, that is, the sensor 16 can be housed in the first sidewall 1112.

[0053] It is worth noting that when the core module 10 is set in the shape of a rounded square, a rounded rectangle, etc., the sensor 16 may be at least partially located on the upper side US or the surface of the upper side US near the rear side RS, or the sensor 16 may be at least partially located on the lower side LS or the surface of the upper side US near the rear side RS, or the sensor 16 may be set opposite to the rear side RS in the length direction Y.

[0054] In addition, when the sensor 16 is located on the surface of the lower side LS near the rear side RS or on the surface of the upper side US near the rear side RS, the sensor 16 is more easily triggered when the free end FE extends into the concha cavity 102 in the wearing state, which is beneficial to improving the user experience of the earphone 200.

[0055] Please refer to Figures 6, 7, and 9. Figure 9 is an exploded view of the second housing 112 in Figure 6 in some embodiments. The second housing 112 may include an inner housing 113 that is engaged with the first housing 111, such as the first sidewall 1112, along the thickness direction X to form a mounting space 201; a flexible insert 114 disposed on the inner housing 113 and located outside the mounting space 201; and a flexible covering 115 disposed on the inner housing 113 and located outside the mounting space 201. The flexible insert 114 may be at least partially sandwiched between the inner housing 113 and the flexible covering 115.

[0056] The inner housing 113 can be made of plastic, or other materials. The parting surface 203 between the inner housing 113 and the first housing 111 (e.g., the first sidewall 1112) is inclined towards the side of the first housing 111 in the direction near the free end FE. In some scenarios, when viewed along the width direction Z, the portion of the inner housing 113 near the free end FE is inclined towards the side of the first housing 111 (e.g., the first sidewall 1112), and the portion of the first housing 111 (e.g., the first sidewall 1112) near the free end FE gradually moves away from the inner housing 113 in the thickness direction X, allowing the first housing 111 and the inner housing 113 to match at the parting surface 203 and achieve a snap-fit. In some scenarios, the inclination of the inner housing 113 towards the side of the first housing 111 (e.g., the first sidewall 1112) creates a concave shape, providing space for the flexible insert 114. This reduces the impact of the flexible insert 114 on the appearance of the second housing 112 while minimizing the installation space 201. In some scenarios, the inner case 113 of the movement is tilted towards the side closer to the first case 111, such as the first sidewall 1112. This allows the inner case 113 to support the flexible insert 114 as much as possible, reducing the design complexity of both the flexible insert 114 and the inner case 113. In some scenarios, when viewed along the width direction Z, the portion of the inner case 113 near the free end FE is tilted towards the side closer to the first case 111, such as the first sidewall 1112. This allows the inner case 113 to accommodate the flexible insert 114 in the region corresponding to the free end FE as much as possible, while minimizing the increase in the thickness of the inner case 113 in the X direction.

[0057] The inner housing 113 of the movement may include a top wall 1131 disposed opposite to the first housing 111, such as the bottom wall 1111, and a second side wall 1132 connected to the top wall 1131 and engaged with the first housing 111, such as the first side wall 1112.

[0058] Antenna patterns and touch patterns, as well as their respective metallized holes, may be provided on the top wall 1131. In some embodiments, a pickup hole that cooperates with the microphone 15 may be provided on the top wall 1131.

[0059] Observed along the width direction Z, and in the reference direction from the connecting end CE to the free end FE, the portion of the second sidewall 1132 near the free end FE gradually moves away from the top wall 1131 in the thickness direction X, so that the scoring mold surface 203 is inclined towards the side of the first housing 111, such as the first sidewall 1112, in the direction near the free end FE, so as to cooperate with the first housing 111, such as the first sidewall 1112, and also realizes the concavity of the inner housing 113 of the movement.

[0060] The second sidewall 1132 may include a first sub-sidewall segment 1133, a second sub-sidewall segment 1134 connected to the first sub-sidewall segment 1133, and a third sub-sidewall segment 1135 connected to the second sub-sidewall segment 1134 and engaged with the first housing 111, for example, the first sidewall 1112. The first sub-sidewall segment 1133 is closer to the top wall 1131 in the thickness direction X than the second sub-sidewall segment 1134. The second sub-sidewall segment 1134 is closer to the top wall 1131 in the thickness direction X than the third sub-sidewall segment 1135. The third sub-sidewall segment 1135 protrudes outward from the movement housing 11 compared to the second sub-sidewall segment 1134. The second sub-sidewall segment 1134 protrudes outward from the movement housing 11 compared to the first sub-sidewall segment 1133. In short, the second sidewall 1132 may have a stepped structure, achieving an inward concavity of the inner housing 113 of the movement. In some embodiments, at least one of the first sub-sidewall segment 1133 and the second sub-sidewall segment 1134 may be omitted.

[0061] Please refer to Figure 10, which is a partial structural schematic diagram of the earphone 200 in some embodiments of Figure 6. The first sub-sidewall segment 1133 has a wall region 1136 that serves as the inner wall surface of the second sidewall 1132. The second sub-sidewall segment 1134 has a wall region 1137 that serves as the inner wall surface of the second sidewall 1132. The third sub-sidewall segment 1135 has a wall region 1138 that serves as the inner wall surface of the second sidewall 1132. In some embodiments, wall region 1137 may be referred to as the first wall region, and wall region 1138 may be referred to as the second wall region. In some embodiments, wall region 1136 may be referred to as the first wall region, and wall region 1137 may be referred to as the second wall region. In some embodiments, wall region 1136 may be referred to as the first wall region, and wall region 1138 may be referred to as the second wall region. In some embodiments, when the second sidewall 1132 can form any two of the wall regions 1136, 1137, and 1138, it is not limited to the second sidewall 1132 being composed of a first sub-sidewall segment 1133, a second sub-sidewall segment 1134, and a third sub-sidewall segment 1135; it can also be formed by other structural forms. In some embodiments, any two of the wall regions 1136, 1137, and 1138 formed by the second sidewall 1132 are not coplanar. In some embodiments, the curvature of wall region 1136 is less than that of wall region 1137. In some embodiments, the curvature of wall region 1136 is greater than that of wall region 1137. In some embodiments, the curvature of wall region 1137 is less than that of wall region 1138. In some embodiments, the curvature of wall region 1136 is less than that of wall region 1138.

[0062] In some embodiments, the first housing 111 may be integral with the inner housing 113 of the movement.

[0063] The hardness of the flexible insert 114 is less than that of the first housing 111 and the inner housing 113 of the mechanism, so as to improve the wearing comfort of the earphone 200. In some embodiments, the flexible insert 114 can be made of silicone or rubber, and can be formed on a predetermined area of ​​the inner housing 113 of the mechanism by injection molding, or even disposed on a predetermined area of ​​the first housing 111. In some embodiments, the flexible insert 114 can at least partially cover the area of ​​the first housing 111 and / or the inner housing 113 corresponding to the free end FE, so that the mechanism module 10 at least partially abuts against the concha 102 through the flexible insert 114. In other words, the portion of the first housing 111 and / or the inner housing 113 that extends into the concha 102 and contacts the concha 102 can be covered by the flexible insert 114. Thus, when the mechanism module 10 abuts against the concha cavity 102, for example, when the mechanism module 10 and the hook structure 20 are configured to clamp the ear 100 from both the front and rear sides of the area of ​​the ear 100 corresponding to the concha cavity 102, the flexible insert 114 acts as a buffer between the mechanism housing 11 and the ear 100 to alleviate the pressure of the earphone 200 on the ear 100, which helps to improve the comfort of the earphone 200 when worn. In some embodiments, since the flexible insert 114 at least partially covers the area of ​​the first housing 111 and / or the inner housing 113 corresponding to the free end FE, and the parting surface 203 between the inner housing 113 and the first housing 111, for example, the first sidewall 1112, is inclined towards the side where the first housing 111 is located in the direction close to the free end FE, the flexible insert 114 can be disposed on the inner housing 113 as much as possible, reducing the design difficulty of the inner housing 113. In addition, the flexible insert 114, in conjunction with the concave inner case 113 of the movement, will more reasonably reduce the installation space 201, make full use of the various positions and spaces of the movement case 11, and enhance the appearance.

[0064] In some embodiments, the flexible insert 114 may continuously cover at least a portion of the first housing 111 and / or the inner housing 113 of the movement corresponding to the rear side RS, the upper side US and the lower side LS.

[0065] In some embodiments, the flexible insert 114, in conjunction with the concavity of the inner shell 113 of the movement, can control the area of ​​the outer surface of the flexible insert 114, so that the area is not too small, thereby preventing the comfort of the movement module 10 from deteriorating when worn, and preventing the area of ​​the flexible insert 114 abutting against the concha 102 from being too small, thus deviating from the original intention of setting the flexible insert 114, and preventing the area from being too large, thereby preventing the size of the movement module 10 from being too large.

[0066] In some embodiments, when viewed along the thickness direction X, the flexible insert 114 may be arranged in a U-shape.

[0067] In some embodiments, the portion of the flexible insert 114 corresponding to the lower side LS can abut against the tragus 108. The thickness of the portion of the flexible insert 114 corresponding to the rear side RS can be less than the thickness of the portions corresponding to the upper side US and the lower side LS, respectively, to achieve good comfort even when the mechanism module 10 abuts against an uneven position within the concha 102.

[0068] In some embodiments, the flexible inserts 114 are all located in the region of the inner casing 113 corresponding to the free end FE, in order to simplify the structure of the movement module 10 and reduce processing costs.

[0069] In some embodiments, the flexible insert 114 is at least partially disposed on the second sidewall 1132. Of course, in addition to being disposed on the second sidewall 1132, it may also be partially disposed on the top wall 1131.

[0070] In some embodiments, the outer surface of the flexible insert 114 can transition continuously with the outer surface of the area of ​​the inner casing 113 not covered by the flexible insert 114. This helps improve the appearance quality of the movement module 10 and avoids a bumpy or uneven surface on the movement module 10.

[0071] In some embodiments, the flexible insert 114 may accumulate on the inner shell 113 of the mechanism during injection molding due to the provision of the second sidewall 1132, preventing spillage and allowing the mechanism module 10 to better abut against the concha 102 through the flexible insert 114, thereby improving the comfort of the earphone 200 when worn.

[0072] In some embodiments, the flexible insert 114 may be omitted.

[0073] The hardness of the flexible coating 115 is less than that of the first housing 111 and the inner housing 113 of the mechanism, so as to improve the wearing comfort of the earphone 200. In some embodiments, the flexible coating 115 may be silicone, rubber, etc., and may be formed on a predetermined area of ​​the first housing 111, the inner housing 113 of the mechanism, and / or the flexible insert 114 by means of injection molding, adhesive bonding, etc. In some embodiments, the thickness of the flexible coating 115 is less than the thickness of the inner housing 113 of the mechanism.

[0074] In some embodiments, the flexible overlay 115 may integrally cover at least a portion of the outer surface of the flexible insert 114 and at least a portion of the outer surface of the first housing 111 and / or at least a portion of the inner housing 113 of the movement that is not covered by the flexible insert 114, which is beneficial to enhance the consistency of the movement module 10 in appearance.

[0075] In some embodiments, the stiffness of the flexible cladding 115 is greater than that of the flexible insert 114 to allow the flexible insert 114 to be sufficiently flexible. In addition, the flexible cladding 115 can also improve the comfort of the headphones 200 when worn and has a certain structural strength to protect the flexible insert 114.

[0076] In some embodiments, the flexible cladding 115 may be omitted.

[0077] Understandably, due to the arrangement of the second sidewall 1132, the free end FE is arranged in a tapering shape in the direction away from the connecting end CE.

[0078] Referring to Figures 6 and 7, the speaker 12 generates sound waves after being powered on, which propagate through the sound outlet 1101 to enter the external auditory canal 101. The speaker 12 can be coupled to the main control circuit board 14 to allow it to operate under the control of the main control circuit board 14. In some embodiments, the speaker 12 can be adaptively adjusted to be a bone conduction speaker based on electronic devices such as headphones or smart glasses based on the bone conduction principle. The basic structure of a bone conduction speaker is well known to those skilled in the art and will not be described in detail here.

[0079] The speaker 12 may be oriented toward the first housing 111, for example, the bottom wall 1111. The axis of the speaker 12 may be the thickness direction X, or it may be arranged to intersect with the thickness direction X.

[0080] The speaker 12 can be fixed to the first housing 111, such as the bottom wall 1111, or it can be fixed to the first housing 111 with the cooperation of the acoustic cavity bracket 13, or it can be fixed to the second housing 112.

[0081] The speaker 12 can partially overlap with the second sub-side wall segment 1134 in the thickness direction X, so as to facilitate the placement of a sufficiently large speaker 12 in the first housing 111, thereby enhancing the sound volume generated by the headphones 200, that is, optimizing the arrangement and improving space utilization.

[0082] The space on the side of the speaker 12 away from the first housing 111, such as the bottom wall 1111, can be connected to the external environment through an acoustic aperture, which helps to reduce the resistance of the speaker 12's diaphragm during vibration. In some embodiments, the space on the side of the speaker 12 away from the first housing 111, such as the bottom wall 1111, such as the acoustic cavity 202, can be connected to the external environment through an acoustic aperture, which helps to reduce the resistance of the speaker 12's diaphragm during vibration. That is, the acoustic cavity 202 may not be connected to the sound outlet 1101.

[0083] Please refer to Figures 6, 7, and 11. Figure 11 is a partial structural schematic diagram of the acoustic cavity support 13 in some embodiments of Figure 6. The acoustic cavity support 13 and the speaker 12 can be arranged to form an acoustic cavity 202, so that the acoustic cavity 202 is separated from other structures (such as the main control circuit board 14) within the first housing 111. This is beneficial to improving the acoustic performance of the mechanism module 10. In addition, the acoustic cavity 202 can also be made not to communicate with the sound outlet 1101.

[0084] The acoustic cavity support 13 is fitted and connected to the first housing 111, and may even be sealed. In some embodiments, the acoustic cavity support 13 is provided with an acoustic channel 1301 that connects the acoustic hole and the acoustic cavity 202, so that the acoustic cavity 202 can communicate with the external environment.

[0085] The acoustic cavity support 13 may include an annular main body 131 and a mating portion 132 connected to the annular main body 131. The annular main body 131 is fitted around the periphery of the speaker 12 to form an acoustic cavity 202, and an acoustic channel 1301 can pass through the mating portion 132 and the annular main body 131. The annular main body 131 can be connected to the first housing 111. Because the acoustic cavity support 13 is annular, the side of the speaker 12 facing the main control circuit board 14 is exposed, which helps to reduce the thickness of the core module 10 in the thickness direction X.

[0086] In some embodiments, the mating portion 132 is located between the annular main body portion 131 and the first housing 111, and surrounds at least a portion of the acoustic hole. Accordingly, the mating portion 132 is provided in a one-to-one correspondence with the acoustic hole.

[0087] In some embodiments, the acoustic cavity support 13 may be omitted.

[0088] Please refer to Figures 6, 7, and 12. Figure 12 is a partial structural schematic diagram of the earphone 200 in some embodiments of Figure 6. The main control circuit board 14 can be connected to the inner shell 113 of the mechanism, for example, fixed to a thermoplastic pillar connected to the top wall 1131, and can partially overlap with the first side wall 1132, such as the first sub-side wall segment 1133, or even partially overlap with the second sub-side wall segment 1134 in the thickness direction X. This facilitates the placement of a sufficiently large speaker 12 within the mechanism shell 11, thereby enhancing the sound volume generated by the earphone 200, i.e., optimizing the layout and improving space utilization. In some embodiments, the main control circuit board 14 may not overlap with the first side wall 1132 in the thickness direction X.

[0089] In some embodiments, the thickness direction of the main control circuit board 14 can be the thickness direction X, or it can be arranged to intersect with the thickness direction X.

[0090] Since the main control circuit board 14 is located inside the mechanism housing 11, for example, the main control circuit board 14 is connected to the inner housing 113 of the mechanism, such as the top wall 1131, so that the main control circuit board 14 can be electrically connected to the antenna pattern and the touch pattern through elastic metal parts 41 such as pogo pins and metal springs.

[0091] In some embodiments, the main control circuit board 14 is located on the side of the speaker 12 near the inner housing 113 of the mechanism. In some embodiments, the main control circuit board 14 may be stacked with the speaker 12 in the thickness direction of the main control circuit board 14 or in the axial direction of the speaker 12. In some embodiments, along the axial direction of the speaker 12, the main control circuit board 14 may overlap with a portion of the speaker 12 or the acoustic cavity support 13 near the connection end CE to optimize the arrangement and improve space utilization.

[0092] In some embodiments, a reinforcing liner 17 may be provided between the main control circuit board 14 and the speaker 12. Furthermore, the reinforcing liner 17 may also be part of the mechanism module 10. The reinforcing liner 17 facilitates the separation between the main control circuit board 14 and the speaker 12, reducing the impact of the speaker 12 on the main control circuit board 14. In some embodiments, the reinforcing liner 17 may also be fixedly connected to the main control circuit board 14 to fix the main control circuit board 14. In some embodiments, the reinforcing liner 17 may also separate the main control circuit board 14 from the acoustic cavity support 13, reducing the impact of the acoustic cavity support 13 on the main control circuit board 14. In some embodiments, the reinforcing liner 17 may also be disposed on the side of the acoustic cavity support 13 closer to the main control circuit board 14. In some embodiments, the reinforcing liner 17 may be fitted snugly to the main control circuit board 14, improving the fixing effect and reducing assembly difficulty.

[0093] Referring to Figure 6, the microphone 15 can be directly soldered onto the main control circuit board 14 and can be located on the side of the main control circuit board 14 near the inner housing 113 of the mechanism, such as the top wall 1131, to pick up voice and ambient sound through the pickup hole. In some embodiments, the main control circuit board 14 can press the microphone 15 onto the inner housing 113 of the mechanism, such as the top wall 1131. In some embodiments, the microphone 15 can be omitted.

[0094] Optionally, referring to Figures 6, 10, and 12, sensor 16 can be used to detect whether the user is wearing the headphones 200 and generate a corresponding electrical signal, thereby allowing the control structure of the headphones 200 (e.g., the main control circuit board 14) to perform preset functions, such as wear detection. Preferably, in some embodiments, sensor 16 may include a capacitive sensor. The working principle and specific structure of capacitive sensors are well known to those skilled in the art and will not be described in detail here.

[0095] Optionally, in some embodiments, wearing a single earphone 200 triggers a sensor 16 disposed on the single earphone 200 to generate an electrical signal, thereby allowing the control structure of the single earphone 200 (e.g., the main control circuit board 14) to generate corresponding control commands based on the electrical signal. Alternatively, wearing a single earphone 200 triggers multiple sensors 16 disposed on the single earphone 200 to generate multiple electrical signals, thereby allowing the control structure of the single earphone 200 (e.g., the main control circuit board 14) to perform differential operations on the multiple electrical signals to further generate corresponding control commands.

[0096] Optionally, in some embodiments, wearing at least two earphones 200 triggers the sensors 16 disposed on the at least two earphones 200 to generate multiple electrical signals, thereby allowing the control structure (e.g., main control circuit board 14) of the at least two earphones 200 to perform differential operations on the multiple electrical signals and further generate corresponding control commands.

[0097] Specifically, the control structure of the earphone 200 (e.g., the main control circuit board 14) transmits electrical signals to a mobile terminal, such as a mobile phone or MP3 player, that is communicatively connected to the earphone 200. The mobile terminal then generates corresponding control commands based on the electrical signals. In other words, the electrical signals allow the mobile terminal to perform preset functions, such as wear detection.

[0098] Optionally, in some embodiments, the sensor 16 may be disposed within the housing 11 in a region of skin near the ear 100, allowing the sensor 16 to be triggered when worn. Specifically, the sensor 16 may be fixed in a preset position using an adhesive such as double-sided tape or glue, or it may be formed in a preset position using laser direct forming technology. The preset position may be a location within the housing 11.

[0099] Optionally, in some embodiments, the sensor 16 may include a capacitor plate 161 electrically connected to the main control circuit board 14 and a plate support 162 supporting the capacitor plate 161. Specifically, the sensor 16 can generate electrical signals through the capacitor plate 161, that is, the sensor 16 can detect the wearing status through the capacitor plate 161. The plate support 162 can maintain the capacitor plate 161 in a specific shape while supporting the capacitor plate 161, and can also make the capacitor plate 161 as close as possible to the skin area of ​​the ear 100, thereby improving the accuracy of the wearing status detection.

[0100] Preferably, in some embodiments, the capacitor plate 161 can be integrally formed from a plate or sheet for ease of processing. Consequently, the thickness of the capacitor plate 161 can be neglected, and correspondingly, the surface area on one side of the capacitor plate 161 in the thickness direction can be considered as the area of ​​the capacitor plate 161.

[0101] Optionally, in some embodiments, when worn, the free end FE of the mechanism module 10 extends into the concha cavity 102, meaning that when worn, the free end FE contacts or is close to the skin. Therefore, the capacitor plate 161 can be disposed within the mechanism housing 11 and near the free end FE, cooperating with the skin area for wearing status detection. This arrangement allows the capacitor plate 161 to be closer to the skin area, thereby improving detection accuracy and reducing the possibility of false detections. Of course, in other embodiments, if conditions permit, the capacitor plate 161 can also be disposed in other locations within the mechanism housing 11 that can cooperate with the skin area. It is understood that the area where the mechanism module 10 cooperates with the skin area varies depending on the wearing method, but the capacitor plate 161 should be disposed as close to the skin area as possible to improve detection accuracy.

[0102] Preferably, in some embodiments, the capacitor plate 161 can be disposed between the speaker 12 and the free end FE, making full use of the gap between the speaker 12 and the free end FE to optimize the arrangement and improve space utilization. Furthermore, it can also allow the capacitor plate 161 to be closer to the skin area and to align with it. Further, in some embodiments, the capacitor plate 161 can at least partially overlap with the speaker 12 along the axial direction of the speaker 12. Further, in some embodiments, along the axial direction of the speaker 12, the capacitor plate 161 can be partially overlapped with a portion of the speaker 12 near the free end FE to optimize the arrangement and improve space utilization.

[0103] Optionally, in some embodiments, the capacitor plate 161 may extend from the gap between the structures in the housing 11 to one side of the inner housing 113, such as the top wall 1131, and may extend to a position electrically connected to the main control circuit board 14 to realize the detection function of the capacitor plate 161.

[0104] Optionally, in some embodiments, the capacitor plate 161 may include a first main body portion 1611, a second main body portion 1612 spaced apart from the first main body portion 1611, a first connecting portion 1613 connecting the first main body portion 1611 and the second main body portion 1612 within a gap region 1601 between the first main body portion 1611 and the second main body portion 1612, and a second connecting portion 1614 connecting the first main body portion 1611 and the main control circuit board 14. The capacitor plate 161 can be arbitrarily bent with at least the cooperation of the first connecting portion 1613 to better match the shape of the mounting space 201 within the movement housing 11, so that the capacitor plate 161 can be arranged over a large area within the limited space of the mounting space 201, thereby improving the accuracy of wearing status detection. Specifically, the cooperation of the first main body 1611, the second main body 1612, the first connecting part 1613, and the second connecting part 1614 enhances the adaptability of the capacitor plate 161 within a smaller space, allowing for better arrangement within the gaps between structures in the movement housing 11. This facilitates the capacitor plate 161 opening as wide as possible within the movement housing 11, increasing the area and thus improving the accuracy of wear status detection. Furthermore, it allows the capacitor plate 161 to be integrally formed and presented as a single piece, with the first main body 1611 and the second main body 1612 serving as extensions to reach into different gaps, further increasing the area. Understandably, increasing the area improves the accuracy of wear status detection, thereby allowing the capacitor plate 161 to appropriately increase the distance between itself and the skin area while maintaining the accuracy of wear status detection. With increased distance, the wearing method can be more diversified and more suitable for different ears 100, so as to reduce the wearing status detection error caused by the differences between the ears 100, expand the usage scenarios of the headphones 200, and improve the adaptability of the headphones 200.

[0105] Preferably, in some embodiments, the area of ​​the capacitor plate 161 can be set to 35-50 mm². 2 This ensures that the capacitor plate 161 has sufficient capability for wear detection. Furthermore, it is precisely the unique structural design of the capacitor plate 161 that allows for a larger area.

[0106] Preferably, referring to Figures 6 and 10, the first main body 1611 can be located outside the main control circuit board 14, that is, on one side of the main control circuit board 14, reducing the space occupied by the main control circuit board 14 and also reducing the electromagnetic influence of the main control circuit board 14 on the first main body 1611. Optionally, in some embodiments, the first main body 1611 can be located on one side of the main control circuit board 14 in a direction perpendicular to the thickness of the main control circuit board 14 to optimize the layout and improve space utilization. Optionally, in some embodiments, the first main body 1611 can be located on the side of the main control circuit board 14 near the second sidewall 1132 to facilitate the layout optimization of the capacitor plates 161, improve space utilization, and the second sidewall 1132 is closer to the free end FE, thereby making the first main body 1611 closer to the skin area. Optionally, in some embodiments, the first main body 1611 may be disposed adjacent to the second sidewall 1132 (e.g., the first sub-sidewall segment 1133 or the second sub-sidewall segment 1134), that is, the first main body 1611 may be disposed adjacent to the wall area 1136 or the wall area 1137. This can improve the structural stability of the capacitor plate 161 by selecting a wall area with a small degree of curvature. At the same time, it can also allow the first main body 1611 to open up as much as possible, increase the area that cooperates with the skin area, improve the accuracy of wearing status detection, and appropriately expand the distance that the first main body 1611 can cooperate with the skin area, making the wearing method more diverse, expanding the application scenarios of the earphone 200, and improving the adaptability of the earphone 200. Optionally, in some embodiments, the first main body 1611 may be attached to or electroplated on the second sidewall 1132, such as the second sub-sidewall segment 1134, to be closer to the skin area. That is, the first main body 1611 may be attached to the wall area 1136 or the wall area 1137. Optionally, in some embodiments, the first main body 1611 may be fitted and fixed to the second sub-side wall segment 1134, such as the wall region 1137, to improve the fixing effect and reduce the assembly difficulty. It is understood that the fitting can be achieved through bonding or electroplating.

[0107] Preferably, referring to Figures 6 and 10, in some embodiments, the second main body 1612 may be located outside the main control circuit board 14, i.e., on one side of the main control circuit board 14, reducing the space occupied by the main control circuit board 14 and also reducing the electromagnetic influence of the main control circuit board 14 on the second main body 1612. Optionally, in some embodiments, the second main body 1612 may be located on one side of the main control circuit board 14 in a direction perpendicular to the thickness of the main control circuit board 14, to optimize the layout and improve space utilization. Optionally, in some embodiments, the second main body 1612 may be located on the side of the acoustic cavity support 13, such as the annular main body 131, near the second sidewall 1132, to facilitate the optimization of the capacitor plate 161 layout and improve space utilization. The second sidewall 1132 is closer to the free end FE, thereby making the second main body 1612 closer to the skin area. Optionally, in some embodiments, the second main body 1612 may be closer to the first housing 111, such as the bottom wall 1111, than the first main body 1611. Optionally, in some embodiments, the second main body 1612 may be disposed adjacent to the second sidewall 1132 (e.g., the second sub-sidewall segment 1134 or the third sub-sidewall segment 1135) to improve detection sensitivity. That is, the second main body 1612 may be disposed adjacent to the wall area 1137 or the wall area 1138. The second main body 1612 may be matched with a wall area with a small degree of curvature to improve the structural stability of the capacitor plate 161. At the same time, the second main body 1612 can be opened as much as possible to increase the area that matches the skin area, thereby improving the accuracy of wearing status detection. The distance that the second main body 1612 can match the skin area can also be appropriately increased to make the wearing method more diverse, expand the application scenarios of the earphone 200, and improve the adaptability of the earphone 200. Optionally, in some embodiments, the second main body portion 1612 may be attached to or electroplated onto the second sidewall 1132, such as the third sub-sidewall segment 1135; that is, the second main body portion 1612 may be attached to the wall surface region 1137 or the wall surface region 1138. Optionally, in some embodiments, the second main body portion 1612 may be fitted and fixed to the third sub-sidewall segment 1135, such as the wall surface region 1138, to improve the fixing effect and reduce the assembly difficulty. Optionally, in some embodiments, the second main body portion 1612 may overlap the acoustic cavity support 13, such as the annular main body portion 131, and use the acoustic cavity support 13 for support. Optionally, in some embodiments, the second main body portion 1612 may be attached to the acoustic cavity support 13, such as the annular main body portion 131. Optionally, in some embodiments, the second main body 1612 may be abutted against the second sidewall 1132 (e.g., the second sub-sidewall segment 1134 or the third sub-sidewall segment 1135) by the abutment of the acoustic cavity support 13, such as the annular main body 131, in order to improve the accuracy of wear detection. Furthermore, it can also reduce the assembly difficulty and assembly cost, as it is not necessary to fix the second main body 1612 with other structures or adhesives.Optionally, in some embodiments, the second main body 1612 may at least partially maintain a clearance fit with the second sidewall 1132 (e.g., the second sub-sidewall segment 1134 or the third sub-sidewall segment 1135) to reduce the assembly difficulty of the capacitor plate 161 in the selected wall area with a large degree of curvature. At the same time, it can also reduce the curvature of the second main body 1612, increase the opening area of ​​the second main body 1612, and improve the accuracy of wearing status detection. In this way, while ensuring the accuracy of wearing status detection, the distance between the second main body 1612 and the skin area can be appropriately expanded, making the wearing method more diversified and more suitable for different ears 100. This reduces the wearing status detection error caused by the differences between the various ears 100, expands the application scenarios of the earphone 200, and improves the adaptability of the earphone 200.

[0108] Optionally, in some embodiments, the first connecting portion 1613 is located within the spacing region 1601, serving to connect the first main body portion 1611 and the second main body portion 1612. It can be bent relative to at least one of the first main body portion 1611 and the second main body portion 1612, so that the first main body portion 1611 and the second main body portion 1612 are not coplanar. This allows the first main body portion 1611 and the second main body portion 1612 to fit within the limited space of the mounting space 201, better adapting to the gaps between structures within the movement housing 11. Furthermore, in some embodiments, the first connecting portion 1613 can be located outside the main control circuit board 14, i.e., on one side of the main control circuit board 14, reducing the space occupied by the main control circuit board 14.

[0109] Optionally, in some embodiments, the area of ​​the first connecting portion 1613 is smaller than the area of ​​the first main body portion 1611 and the second main body portion 1612. This makes the first connecting portion 1613 easier to bend, allowing the first main body portion 1611 and / or the second main body portion 1612 to open as wide as possible, increasing the area and enabling it to bend and extend into different gaps. While ensuring the integrity of the capacitor plate 161, this maximizes the use of space within the mechanism housing 11 and improves adaptability. In some embodiments, the area of ​​the first connecting portion 1613 is smaller than the area of ​​the first main body portion 1611 and smaller than the area of ​​the second main body portion 1612.

[0110] Preferably, please refer to Figure 13, which is a schematic diagram of the capacitor plate 161 in Figure 12 in some embodiments. The first connecting portion 1613 may be a rectangular or rectangular structure. The first connecting portion 1613 may have a first side 1615, a third side 1617, a second side 1616, and a fourth side 1618 connected end to end in sequence. The first side 1615 and the second side 1616 are arranged opposite each other, and the third side 1617 and the fourth side 1618 are arranged opposite each other. The first side 1615 is connected to the first main body portion 1611, and the second side 1616 is connected to the second main body portion 1612. The side lengths of the first side 1615 and the second side 1616 are both smaller than the side length of the third side 1617 and both are smaller than the length of the fourth side 1618. The side length of the long side (i.e., the third side 1617 and the fourth side 1618) of the first connecting part 1613 is greater than the side length of the short side (i.e., the first side 1615 and the second side 1616), which further facilitates the first main body part 1611 and / or the second main body part 1612 to extend and bend into different gaps as much as possible.

[0111] Preferably, in some embodiments, the first connecting portion 1613 may include at least two sub-connecting portions, the at least two sub-connecting portions may be arranged side by side, and each sub-connecting portion may be connected to the first main body portion 1611 and the second main body portion 1612 respectively, so as to improve the relative stability of the first main body portion 1611 and the second main body portion 1612.

[0112] Preferably, in some embodiments, the first connecting portion 1613 extends from the portion connecting the first main body portion 1611 to the portion connecting the second main body portion 1612, and in the extension direction, the distance between the two long sides can first gradually decrease and then gradually increase, so as to improve the bending ability of the first connecting portion 1613 and its adaptability within the earphone 200.

[0113] Preferably, in some embodiments, the first connecting portion 1613 can be bent such that the first main body portion 1611 is disposed adjacent to the wall area 1137 and the second main body portion 1612 is disposed adjacent to the wall area 1138. At the same time, the first connecting portion 1613 can be fully utilized to increase the area that mates with the skin area.

[0114] Optionally, in some embodiments, the second connecting portion 1614 may be bent relative to the first main body portion 1611 so that it can extend to a position that mates with the main control circuit board 14, thereby electrically connecting with the main control circuit board 14. This allows the capacitor plate 161 to be electrically connected to the main control circuit board 14, which is beneficial for optimizing the layout of the capacitor plate 161 and the main control circuit board 14 and improving space utilization. Of course, when the first main body portion 1611 is electrically connected to the main control circuit board 14 directly or through other structures, the second connecting portion 1614 can be omitted.

[0115] Optionally, in some embodiments, the second connecting portion 1614 is further away from the free end FE than the first connecting portion 1613. Furthermore, in some embodiments, the area of ​​the second connecting portion 1614 is smaller than the area of ​​the first connecting portion 1613, so that it is easier to fit into the concha 102 when placed within the free end FE, and it is more conducive to the spatial arrangement of the capacitor plates 161.

[0116] Optionally, in some embodiments, the second connection portion 1614 is electrically connected to the main control circuit board 14 on the side of the main control circuit board 14 away from the acoustic cavity support 13, such as the annular main body portion 131.

[0117] Optionally, in some embodiments, the first main body 1611 can be bent to better accommodate a large area within the limited space of the mounting space 201, and the bending can better utilize the gaps between the various structures within the mounting space 201, making full use of the space within the mounting space 201. Further, in some embodiments, the middle portion of the first main body 1611 can be positioned opposite to the free end FE, and at least one end of the first main body 1611 can be bent towards the connection end CE in a direction perpendicular to the thickness of the main control circuit board 14, to match the curvature of the inner surface of the second sidewall 1132, achieving a large-area arrangement of the first main body 1611. Further, in some embodiments, at least one end of the first main body 1611 can be bent to extend into the gaps between different structures, maximizing the area.

[0118] Optionally, in some embodiments, the second main body 1612 can be bent to better accommodate a large area within the limited space of the mounting space 201, and the bending can better utilize the gaps between the various structures within the mounting space 201, making full use of the space within the mounting space 201. Further, in some embodiments, the middle portion of the second main body 1612 can be positioned opposite to the free end FE, and at least one end of the second main body 1612 can be bent towards the connection end CE in a direction perpendicular to the thickness of the main control circuit board 14, to match the curvature of the inner surface of the second sidewall 1132, achieving a large-area arrangement of the second main body 1612. Further, in some embodiments, at least one end of the second main body 1612 can be bent to extend into the gaps between different structures, maximizing the area.

[0119] Optionally, in some embodiments, the electrode plate bracket 162 can be used to support the capacitor electrode plate 161, such as the first main body portion 1611, so that the first main body portion 1611 cooperates with the second sidewall 1132. In some embodiments, one end of the electrode plate bracket 162 can be relatively fixed to the main control circuit board 14, while the other end can be relatively fixed to the acoustic cavity bracket 13, such as the annular main body portion 131, thereby limiting the extension of the capacitor electrode plate 161. Further, in some embodiments, one end of the electrode plate bracket 162 can be supported on the reinforcing liner 17 to maintain relative fixation with the main control circuit board 14. Further, in some embodiments, the first main body portion 1611 can be abutted against the second sidewall 1132 (e.g., the second sub-sidewall segment 1134 or the first sub-sidewall segment 1133) by the abutment of the electrode plate bracket 162, thereby improving the accuracy of wear detection. Furthermore, it can also reduce the assembly difficulty and assembly cost, as it is not necessary to fix the first main body portion 1611 with other structures or adhesives. Furthermore, in some embodiments, the electrode plate support 162 may be part of the acoustic cavity support 13, or in some embodiments, the electrode plate support 162 may be part of the reinforcing liner 17.

[0120] It is understood that the above description of sensor 16 is not the entirety of this application. The sensor 16 described above may also be disposed between the flexible insert 114 and the inner casing 113 and / or the flexible cover 115, or between the flexible cover 115 and the inner casing 113 and / or the first casing 111. It may also extend to be electrically connected to the main control circuit board 14 via circuit wiring.

[0121] In the several embodiments provided in this application, it should be understood that the disclosed methods and devices can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For instance, the division of modules or units is only a logical functional division, and there may be other division methods in actual implementation. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed.

[0122] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment, depending on actual needs.

[0123] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0124] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. An earphone, wherein, The earphone includes a main control circuit board and a capacitor plate. The capacitor plate is disposed in the area of ​​the earphone close to the user's skin when the earphone is worn, and is configured to generate a corresponding electrical signal based on whether the user is wearing the earphone. The capacitor plate includes a first main body portion electrically connected to the main control circuit board, a second main body portion spaced apart from the first main body portion, and a first connecting portion connecting the first main body portion and the second main body portion in the spaced area between the first main body portion and the second main body portion. The area of ​​the first connecting portion is smaller than the area of ​​the first main body portion and the second main body portion, and is bent relative to at least one of the first main body portion and the second main body portion, so that the first main body portion and the second main body portion are not coplanar.

2. The headphones according to claim 1, wherein, The capacitor plate further includes a second connecting portion connected to the first main body portion. The area of ​​the second connecting portion is smaller than the areas of the first main body portion and the second main body portion. The first main body portion, the second main body portion, and the first connecting portion are located outside the main control circuit board and are electrically connected to the main control circuit board through the second connecting portion.

3. The headphones according to claim 2, wherein, The first main body, the second main body, the first connecting part, and the second connecting part are integrally formed from sheet or plate.

4. The headphones according to claim 2, wherein, The second connecting portion is bent relative to the first main body portion.

5. The headphones according to claim 1, wherein, The area of ​​the capacitor plates is 35-50 mm². 2 .

6. The headphones according to claim 1, wherein, The earphone also includes a core housing and a hook-shaped structure connected to the core housing. The core housing has a connecting end connected to the hook-shaped structure and a free end not connected to the hook-shaped structure. When worn, the core housing is located on the front side of the ear. The free end extends into or covers the concha cavity. At least part of the hook-shaped structure is located on the back side of the ear when worn. The capacitor plate is disposed inside the core housing and close to the free end.

7. The earphone according to claim 6, wherein, The free end is tapered in the direction away from the connecting end. The capacitor plate also includes a second connecting part connected to the first main body and electrically connected to the main control circuit board through the second connecting part. The first connecting part is closer to the free end than the second connecting part, and the area of ​​the second connecting part is smaller than the area of ​​the first connecting part.

8. The headphones according to claim 6, wherein, The inner wall surface of the free end has a first wall area and a second wall area that are not coplanar. The first connecting part is bent such that the first main body part is adjacent to the first wall area, and the second main body part is adjacent to the second wall area.

9. The headphones according to claim 8, wherein, The curvature of the first wall region is less than that of the second wall region. The first main body is fitted and fixed to the first wall region, and the second main body and the second wall region maintain at least a partial clearance fit.

10. The headphones according to claim 9, wherein, The area of ​​the first connecting portion is smaller than the area of ​​the first main body portion and smaller than the area of ​​the second main body portion.

11. The headphones according to claim 9, wherein, The first connecting portion has a first side, a second side, a third side, and a fourth side connected end to end in sequence. The first side and the second side are arranged opposite to each other, and the third side and the fourth side are arranged opposite to each other. The first side is connected to the first main body portion, and the second side is connected to the second main body portion. The length of the first side and the length of the second side are both less than the length of the third side and both are less than the length of the fourth side.

12. The headphones according to claim 9, wherein, The earphone also includes an electrode plate bracket, which supports the first main body so that the first main body fits and is fixed to the first wall area.

13. The headphones according to claim 6, wherein, The earphone also includes a speaker disposed within the housing of the mechanism. Along the axial direction of the speaker, the main control circuit board overlaps with a portion of the speaker near the connection end, and the capacitor plate overlaps with another portion of the speaker near the free end.

14. The headphones according to claim 13, wherein, The headphones also include a sound cavity support disposed around the speaker, and the second main body is attached to the sound cavity support.

15. The headphones according to claim 14, wherein, The earphone also includes a polar plate bracket for supporting the first main body and a sound cavity bracket disposed around the speaker. One end of the polar plate bracket is fixed relative to the main control circuit board, and the other end of the polar plate bracket is fixed relative to the sound cavity bracket.

16. The headphones according to claim 15, wherein, The earphone also includes a reinforcing liner that is attached to the main control circuit board, one end of the electrode bracket is supported on the reinforcing liner, and the other end of the electrode bracket is supported on the acoustic cavity bracket.

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