Heat dissipation film, display module, and display device

Abstract

A heat dissipation film (10) comprises a heat dissipation assembly (11) and a buffer bonding layer (12). The outer side of the periphery of the heat dissipation assembly (11) is provided with a plurality of straight edge portions (111). The side of the heat dissipation assembly (11) facing a display substrate (20) is provided with a region (100). The boundary of the orthographic projection of the region (100) on the heat dissipation assembly (11) at least partially overlaps the orthographic projection of each straight edge portion (111) on the heat dissipation assembly (11), and the side of the region (100) facing the display substrate (20) has a first color. The buffer bonding layer (12) is disposed on the side of the heat dissipation assembly (11) facing the display substrate (20) and is connected between the heat dissipation assembly (11) and the display substrate (20), the side of the buffer bonding layer (12) facing the display substrate (20) has a second color, and the first color and the second color are identical.

Description

Heat dissipation film, display module and display device TECHNICAL FIELD

[0001] The present disclosure relates to, but is not limited to, the technical field of display, in particular to a heat dissipation film, a display module and a display device. BACKGROUND

[0002] With the acceleration of the upgrading speed of electronic equipment, electronic equipment such as mobile phones and watches with OLED (Organic Light Emitting Diode) display substrates as display components are becoming more and more popular. Moreover, as the electronic equipment tends to be smaller, the requirements for integration and performance are becoming higher and higher, resulting in more and more heat generated during the operation of the OLED display substrate. Therefore, a heat dissipation film (SCF) needs to be attached to the OLED display substrate to dissipate heat from the OLED display substrate.

[0003] At present, in order to meet the demand for thinner display modules, the heat dissipation film is generally thinned, and at the same time, the mechanical properties such as resistance to mold printing of the display module need to be ensured, especially the wiring of the display device needs to pass through the heat dissipation film, and the resistance to mold printing is particularly important. Therefore, at present, many display modules often use a relatively hard metal layer on the heat dissipation film to replace the copper foil in the original heat dissipation film.

[0004] SUMMARY

[0005] The following is a summary of the subject matter of the detailed description of the present disclosure. This summary is not intended to limit the protection scope of the claims.

[0006] In one aspect, the present disclosure provides a heat dissipation film, comprising:

[0007] a heat dissipation component, a periphery of the heat dissipation component has a plurality of straight edge portions, a side of the heat dissipation component facing a display substrate has a region, a boundary of a projection of the region on the heat dissipation component at least partially overlaps with a projection of each of the straight edge portions on the heat dissipation component, and a side of the region facing the display substrate has a first color; and

[0008] a buffer bonding layer disposed on a side of the heat dissipation component facing the display substrate and connected between the heat dissipation component and the display substrate;

[0009] a side of the buffer bonding layer facing the display substrate has a second color, and the first color and the second color are the same.

[0010] In some embodiments of the heat dissipation film, the heat dissipation component includes a support layer, and the plurality of straight edge portions are located on the support layer.

[0011] a side of the support layer facing the display substrate has the region.

[0012] In some embodiments of the heat dissipation film, the side of the support layer facing the display substrate is formed with the regions by blackening treatment by oxidation.

[0013] In some embodiments of the heat dissipation film, the heat dissipation assembly comprises a support layer, a heat dissipation layer and a sealing structure, the plurality of straight edge portions are located on the support layer, the heat dissipation layer is disposed on the side of the support layer facing the display substrate, and the sealing structure is disposed on the side of the support layer facing the display substrate and annularly arranged outside the periphery of the heat dissipation layer.

[0014] The sealing structure extends to each of the straight edge portions to form the regions.

[0015] In some embodiments of the heat dissipation film, the sealing structure comprises a body and a plurality of first planar portions, the body is annularly arranged outside the periphery of the heat dissipation layer, and the plurality of first planar portions are connected to the side of the body away from the heat dissipation layer.

[0016] The plurality of first planar portions correspond to the plurality of straight edge portions one-to-one and extend to the corresponding straight edge portions.

[0017] In some embodiments of the heat dissipation film, the body and the plurality of first planar portions are interconnected or arranged at intervals.

[0018] In some embodiments of the heat dissipation film, the boundary of the orthographic projection of the first planar portion on the heat dissipation assembly at least partially overlaps with the orthographic projection of the corresponding straight edge portion on the heat dissipation assembly.

[0019] In some embodiments of the heat dissipation film, the sealing structure further comprises a plurality of edge wrapping portions, the plurality of edge wrapping portions are interconnected one-to-one with the plurality of first planar portions, and the plurality of edge wrapping portions are arranged at the corresponding straight edge portions.

[0020] In some embodiments of the heat dissipation film, the sealing structure further comprises a plurality of second planar portions, the plurality of second planar portions are interconnected one-to-one with the plurality of edge wrapping portions, and the plurality of second planar portions are arranged on the side of the support layer away from the display substrate.

[0021] In some embodiments of the heat dissipation film, the boundary of the orthographic projection of the second planar portion on the heat dissipation assembly at least partially overlaps with the orthographic projection of the corresponding straight edge portion on the heat dissipation assembly.

[0022] In some embodiments of the heat dissipation film, the orthographic projection of the second planar portion on the heat dissipation assembly is within the range of the orthographic projection of the corresponding first planar portion on the heat dissipation assembly.

[0023] In some embodiments of the heat dissipation film, a projection of the second planar portion on the heat dissipation component partially overlaps with a projection of the body on the heat dissipation component.

[0024] In some embodiments of the heat dissipation film, a boundary of a projection of the buffer bonding layer on the support layer is within a range of a projection of the body on the support layer.

[0025] In some embodiments of the heat dissipation film, a boundary of a projection of the buffer bonding layer on the support layer is within a range of a projection of the first planar portion on the support layer.

[0026] In some embodiments of the heat dissipation film, a boundary of a projection of the buffer bonding layer on the support layer is within a range of a projection of the first planar portion on the support layer.

[0027] In some embodiments of the heat dissipation film, a boundary of a projection of the buffer bonding layer on the support layer is within a range of a projection of the first planar portion on the support layer.

[0028] In some embodiments of the heat dissipation film, the support layer is made of stainless steel.

[0029] In some embodiments of the heat dissipation film, the first color and the second color are black.

[0030] In some embodiments of the heat dissipation film, the buffer bonding layer comprises a buffer structure layer and a bonding structure layer, the buffer structure layer is arranged on a side of the heat dissipation component facing the display substrate, and the bonding structure layer is arranged on a side of the buffer structure layer facing the display substrate and connected between the buffer structure layer and the display substrate; or

[0031] The buffer bonding layer is made of adhesive polymer or gel.

[0032] In another aspect, the present disclosure also provides a display module, comprising:

[0033] a display substrate having a display area; and

[0034] a heat dissipation film as described above, the buffer bonding layer of the heat dissipation film being arranged on a side of the display substrate away from a display side of the display substrate;

[0035] a projection of the display area on the display substrate is within a range of a projection of the heat dissipation film on the display substrate and a projection of the buffer bonding layer on the display substrate.

[0036] In some embodiments of the display module, the boundary of the orthographic projection of the heat dissipation film on the display substrate is located inside the periphery of the display substrate, and the distance from the boundary of the display substrate is 0.25mm to 0.30mm.

[0037] In some embodiments of the display module, the display substrate further has a visual area located outside the periphery of the display area, and the boundary of the orthographic projection of the heat dissipation component of the heat dissipation film on the display substrate is located outside the periphery of the visual area.

[0038] The boundary of the orthographic projection of the buffer adhesive layer on the display substrate is located between the boundary of the orthographic projection of the heat dissipation component on the display substrate and the periphery of the visual area, or between the periphery of the display area and the periphery of the visual area, or outside the boundary of the orthographic projection of the heat dissipation component on the display substrate.

[0039] In another aspect, the present disclosure further provides a display device comprising the display module as described above.

[0040] Other aspects can become apparent from a review of the drawings and detailed description.

[0041] SUMMARY

[0042] The accompanying drawings are included to provide a further understanding of the present disclosure and constitute a part of the specification, which together with the detailed description, serve to explain the technical solutions of the present disclosure, but do not constitute a limitation on the technical solutions of the present disclosure.

[0043] Fig. 1 is an exploded structural schematic diagram of a display module, wherein the heat dissipation film is a heat dissipation film using a copper foil;

[0044] Fig. 2 is a structural schematic diagram of a display module, wherein the heat dissipation film is a heat dissipation film using a copper foil;

[0045] Fig. 3 is a structural schematic diagram of a display module, wherein the heat dissipation film is a heat dissipation film using a relatively hard metal layer;

[0046] Fig. 4 is a photo of a heat dissipation film using a relatively hard metal layer in a qualified state;

[0047] Fig. 5 is a photo of a heat dissipation film using a relatively hard metal layer in an unqualified state;

[0048] Fig. 6 is an exploded structural schematic diagram of a display module in an embodiment of the present disclosure;

[0049] Fig. 7 is an enlarged structural schematic diagram of part A in Fig. 6;

[0050] Fig. 8 is a structural schematic diagram of the buffer bonding layer side of the display module in an embodiment of the present disclosure;

[0051] Fig. 9 is a structural schematic diagram of the display module in an embodiment of the present disclosure;

[0052] Fig. 10 is a structural schematic diagram of the display module in an embodiment of the present disclosure, in which the buffer bonding layer is in an inner limit offset position;

[0053] Fig. 11 is a structural schematic diagram of the display module in an embodiment of the present disclosure, in which the buffer bonding layer is in an outer limit offset position;

[0054] Fig. 12 is a photo of the buffer bonding layer side of the heat dissipation film in the display module in an embodiment of the present disclosure;

[0055] Fig. 13 is a photo of the heat dissipation assembly side of the heat dissipation film in the display module in an embodiment of the present disclosure;

[0056] Fig. 14 is a structural schematic diagram of the display module in another embodiment of the present disclosure, in which the arrow in the figure is the light passing through the display side.

[0057] Legend of reference signs: 10', heat dissipation film; 11', copper foil; 12', graphite layer; 13', foam; 14', grid adhesive; 15', edge sealing structure; 16', harder metal layer; 10, heat dissipation film; 11, heat dissipation assembly; 111, straight edge part; 112, corner part; 113, support layer; 114, heat dissipation layer; 115, edge sealing structure; 1151, body; 1152, first planar part; 1153, edge covering part; 1154, second planar part; 12, buffer bonding layer; 20, display substrate; 30, optical adhesive layer; 40, cover plate; 50, ink; 60, transparent adhesive film layer; 100, area.

[0058] Detailed description

[0059] To make the objectives, technical solutions and advantages of the present disclosure clearer, the following will describe the embodiments of the present disclosure in detail with reference to the drawings. It should be noted that the embodiments can be implemented in many different forms. Those skilled in the art can easily understand that the manners and contents can be changed into various forms without departing from the spirit and scope of the present disclosure. Therefore, the present disclosure should not be interpreted as being limited to the contents described in the following embodiments. The embodiments in the present disclosure and the features in the embodiments can be combined with each other arbitrarily without conflict.

[0060] The scale of the drawings in the present disclosure can be used as a reference in the actual process, but is not limited thereto. For example, the width-length ratio of the channel, the thickness and spacing of each film layer, and the width and spacing of each signal line can be adjusted as needed. The number of pixels in the display substrate and the number of sub-pixels in each pixel are also not limited to the number shown in the drawings. The drawings described in the present disclosure are only schematic diagrams, and one embodiment of the present disclosure is not limited to the shapes or values shown in the drawings.

[0061] In the present disclosure, ordinal numbers such as "first", "second", "third" and the like are provided in order to avoid confusion of components, and are not intended to be limiting in terms of number.

[0062] In the present disclosure, in order to facilitate the description, words indicating the orientation or positional relationship such as "middle", "upper", "lower", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like are used to describe the positional relationship of the components with reference to the drawings, which are only for the convenience of describing the present disclosure and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present disclosure. The positional relationship of the components is appropriately changed according to the direction of describing each component. Therefore, it is not limited to the words described in the specification, and can be appropriately changed according to the situation.

[0063] In the present disclosure, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection" should be broadly understood. For example, it can be fixedly connected, or detachably connected, or integrally connected; it can be mechanically connected, or electrically connected; it can be directly connected, or indirectly connected through an intermediate piece, or the communication between two elements inside. For those skilled in the art, the specific meaning of the above terms in the present disclosure can be understood according to the specific circumstances.

[0064] In the present disclosure, "electrically connected" includes the case where the components are connected together through an element having a certain electrical effect. The "element having a certain electrical effect" is not particularly limited as long as it can perform the transmission of electrical signals between the connected components. Examples of the "element having a certain electrical effect" include not only electrodes and wiring, but also switching elements such as transistors, resistors, inductors, capacitors, other elements having various functions, and the like.

[0065] In the present disclosure, "parallel" means that the angle formed by two straight lines is -10° or more and 10° or less, and therefore also includes the case where the angle is -5° or more and 5° or less. In addition, "perpendicular" means that the angle formed by two straight lines is 80° or more and 100° or less, and therefore also includes the case where the angle is 85° or more and 95° or less.

[0066] In the present disclosure, "film" and "layer" can be interchanged. For example, "conductive layer" can be sometimes replaced by "conductive film". Similarly, "insulating film" can be sometimes replaced by "insulating layer".

[0067] In the present disclosure, triangle, rectangle, trapezoid, pentagon, or hexagon, etc. are not strictly, and can be approximately triangle, rectangle, trapezoid, pentagon, or hexagon, etc. There can be some small deformation caused by tolerance, and there can be an angle, an arc edge, and deformation, etc.

[0068] In the present disclosure, "about" means not strictly limited, and allows values within the range of process and measurement errors.

[0069] With the increasing speed of upgrading and replacing electronic devices, electronic devices such as mobile phones and watches using OLED (Organic Light Emitting Diode) display substrates 20 as display components are becoming more and more popular. Moreover, as the above electronic devices tend to be smaller, the requirements for integration and performance are becoming higher and higher, resulting in more and more heat generated during the operation of the OLED display substrate 20. Therefore, it is also necessary to attach a heat dissipation film 10` (SCF) to the OLED display substrate 20 to dissipate heat from the OLED display substrate 20. As shown in FIGS. 1 and 2, a display module generally includes a heat dissipation film 10`, a display substrate 20 (Panel), an optical adhesive (OCA) layer 30, and a cover plate 40 (CG) arranged in sequence. The heat dissipation film 10` generally includes a copper foil 11`, a graphite layer 12`, a foam 13` (FOAM), and a mesh adhesive 14` (EMBO). The graphite layer 12` has an edge sealing structure 15` on the outer side of the periphery. In the frame area of the display module, ink 50 is coated between the cover plate 40 and the optical adhesive layer 30.

[0070] At present, in order to meet the increasingly thin requirements of display modules, the heat dissipation film 10` is generally thinned, and at the same time, the mechanical properties such as resistance to mold printing of the display module need to be ensured, especially the wiring of the display device needs to pass through the heat dissipation film 10`, and the resistance to mold printing is particularly important. Therefore, at present, many display modules often use a relatively hard metal layer 16` on the heat dissipation film 10` to replace the original copper foil 11` in the heat dissipation film 10`.

[0071] The inventors of the present disclosure found that the heat dissipation film 10' using the copper foil 11' can be cut by a conventional die-cutting process due to the low hardness of the copper foil 11'. After cutting, the copper foil 11', the foam 13' and the mesh adhesive 14' have the same size and there is no offset, as shown in FIG. 2. However, the heat dissipation film 10' using the hard metal layer 16' needs to be etched or die-stamped, and the other structures of the heat dissipation film 10' (e.g., the foam 13', the graphite layer 12' and the edge sealing structure 15') need to be transferred to the surface of the hard metal layer 16' by equipment, and need to be designed to be inwardly recessed relative to the hard metal layer 16' (according to the tolerance chain calculation, the single side needs to be inwardly recessed by 0.2 mm or more), as shown in FIGS. 3 and 4. In the case of extreme offset of the other structures of the heat dissipation film 10', the other structures of the heat dissipation film 10' may exceed or be flush with the boundary of the hard metal layer 16', resulting in a certain yield loss and leading to an increase in the unit price of the material. The extreme offset of the other structures of the heat dissipation film 10' refers to that the relative position of the boundary of the normal projection of the other structures of the heat dissipation film 10' on the hard metal layer 16' is within the range allowed by the tolerance, but close to the upper or lower limit of the tolerance range.

[0072] In addition, in the transfer process, the equipment is positioned and grabbed from the straight edge of the hard metal layer 16' on the side of the foam 13'. FIG. 4 is a photo of the heat dissipation film 10' using the hard metal layer 16' in a qualified state, which can be seen that the other structures of the heat dissipation film 10' are designed to be inwardly recessed relative to the single side of the hard metal layer 16', and a circle of bright edges (edges of the hard metal layer 16') is exposed around the heat dissipation film 10', so that the equipment can normally position and grab the straight edge.

[0073] In the case of extreme offset of the other structures of the heat dissipation film 10', the hard metal layer 16' is partially blocked by the other structures of the heat dissipation film 10' from the side of the foam 13', and the other part of the edge of the hard metal layer 16' is exposed, so that the edge color of the heat dissipation film 10' is inconsistent. FIG. 5 is a photo of the heat dissipation film 10' using the hard metal layer 16' in an unqualified state, which can be seen that the upper side, the lower side and the right side of the heat dissipation film 10' can see the exposed edges of the hard metal layer 16'. The left side of the heat dissipation film 10', the other structures of the heat dissipation film 10' block the edges of the hard metal layer 16', so that the edge color of the heat dissipation film 10' is inconsistent, which leads to the equipment being unable to identify, resulting in the equipment error, the equipment being unable to position and grab the straight edge of the hard metal layer 16', causing the equipment to discard the material, and affecting the production line.

[0074] In some other technical solutions for preparing the heat dissipation film 10' by equipment transfer, the foam 13' may also be in the case of extreme offset.

[0075] Please combine with FIG. 6, FIG. 8 and FIG. 9, the display module provided by the embodiment of the present disclosure. The display module includes a display substrate 20 and a heat dissipation film 10. The heat dissipation film 10 is attached to the side of the display substrate 20 away from the display side of the display substrate 20, which can play a role in heat dissipation, helping to quickly dissipate the heat generated by the display substrate 20 during operation, and also plays a role in light shielding.

[0076] The heat dissipation film 10 includes a heat dissipation assembly 11 and a buffer bonding layer 12. The heat dissipation assembly 11 has a plurality of straight edge portions 111 on the outer side of the periphery. The display module is generally rectangular, and correspondingly, the number of straight edge portions 111 is four. It can be understood that in other embodiments, the display module is triangular or polygonal, and correspondingly, the number of straight edge portions 111 is consistent with the number of edges of the actual module. Adjacent straight edge portions 111 have a corner portion 112. The corner portion 112 includes but is not limited to a right angle corner portion and a round corner portion.

[0077] The side of the heat dissipation assembly 11 facing the display substrate 20 has a region 100. The boundary of the orthographic projection of the region 100 on the heat dissipation assembly 11 at least partially overlaps the orthographic projection of each straight edge portion 111 on the heat dissipation assembly 11, and the side of the region 100 facing the display substrate 20 has a first color.

[0078] The buffer bonding layer 12 is provided on the side of the heat dissipation assembly 11 facing the display substrate 20 and connected between the heat dissipation assembly 11 and the display substrate 20, so that the buffer bonding layer 12 can facilitate the connection of the heat dissipation assembly 11 and the display substrate 20, and improve the tightness of the attachment of the heat dissipation assembly 11 and the display substrate 20. Moreover, the buffer bonding layer 12 can also buffer external force, which can prevent the display substrate 20 from being damaged by the bonding pressure during the bonding process of the heat dissipation film 10 and the display substrate 20.

[0079] The second color of the side of the buffer bonding layer 12 facing the display substrate 20 is the same as the first color. Since the area 100 is arranged close to the straight edge part 111, the edge color of the side of the heat dissipation assembly 11 facing the display substrate 20 and close to the straight edge part 111 is the same as the first color of the area 100, the second color of the side of the buffer bonding layer 12 facing the display substrate 20 is the same as the first color, and in the transfer process, the device is aligned and grabbed from the side of the buffer bonding layer 12 to the straight edge of the heat dissipation assembly 11, so that the buffer bonding layer 12 is designed to be retracted inwardly, the edge of the heat dissipation film 10 is exposed to a circle of the edge of the heat dissipation assembly 11, and the area 100 close to the straight edge part 111 is exposed, so that the edge color of the heat dissipation film 10 corresponding to each straight edge part 111 is consistent, and the device can normally align and grab the straight edge. In the case of extreme deviation of the buffer bonding layer 12, the buffer bonding layer 12 exceeds or is flush with the boundary of the heat dissipation assembly 11, part of the edge of the heat dissipation assembly 11 is shielded, another part of the edge is exposed to the edge of the heat dissipation assembly 11, and the area 100 close to the straight edge part 111 is exposed. Since the color of the area 100 and the buffer bonding layer 12 is the same, the edge color of the heat dissipation film 10 corresponding to each straight edge part 111 is consistent in the case of extreme deviation of the buffer bonding layer 12, and the device can normally align and grab the straight edge, thereby reducing yield loss, avoiding the rise of the unit price of materials, improving the recognition and grabbing rate of the device to the straight edge part 111 of the heat dissipation assembly 11, and reducing the rejection rate.

[0080] In the case of extreme deviation of the buffer bonding layer 12, the boundary of the normal projection of the buffer bonding layer 12 on the heat dissipation assembly 11 is within the tolerance range, but close to the upper limit or lower limit of the tolerance range.

[0081] As shown in FIG. 2, the heat dissipation film 10` using a copper foil 11` can be cut by a conventional cutter die. After cutting, the copper foil 11`, the foam 13` and the mesh adhesive 14` have the same size, and there is no deviation. The heat dissipation film 10` using the copper foil 11` is retracted inwardly by about 0.25-0.3 mm from the display substrate 20, and the foam 13` can still shield the light from the display side of the display area (AA) of the display substrate 20.

[0082] The inventors of the present disclosure found that when the heat dissipation film 10` using a harder metal layer 16` is cut by a cutter die of c-d-2e-f-(b-a), e is about 0.2 mm, and the display area (AA) of the display substrate 20 has no risk of light transmission. When c-d-2e-f-(b-a) < 0, the display area (AA) of the display substrate 20 has no risk of light transmission.

[0083] Wherein, a is the distance from the boundary of the orthographic projection of the foam 13` on the display substrate 20 to the visible area (VA); b is the distance from the boundary of the orthographic projection of the foam 13` on the display substrate 20 to the display area (AA); c is the edge size of the display substrate 20; d is the inward shrinkage value of the foam 13` relative to the display substrate 20; e is the inward shrinkage value of the foam 13` relative to the relatively hard metal layer 16`; f is the device fitting tolerance, generally about 0.15 mm; b-a = about 0.25 mm.

[0084] In the case that the heat dissipation film 10` is attached to the display substrate 20 with the limit of the fitting tolerance, there will be a gap between the boundary of the other structures (for example, the foam 13`, the graphite layer 12`, and the edge sealing structure 15`) of the heat dissipation film 10` and the boundary of the display area (AA) of the display substrate 20, which cannot completely block the light from the display side of the display area (AA) of the display substrate 20. Since the display side of the display area (AA) of the display substrate 20 needs to be used for display, it cannot be blocked from the cover plate 40 side, and therefore, the light can pass through the display area (AA). The display area (AA) is exposed to the light for a long time, and the display substrate 20 will appear to have uneven display brightness and form various traces (MURA), thereby affecting the display effect, as shown in FIGS. 3-5. The limit of the fitting tolerance of the heat dissipation film 10` attached to the display substrate 20 means that the relative position between the boundary of the orthographic projection of the heat dissipation film 10` on the display substrate 20 and the boundary of the display substrate 20 is within the range allowed by the tolerance, but close to the upper limit or lower limit of the tolerance range.

[0085] In the exemplary embodiments, please refer to FIGS. 9-11 and 14, the display substrate 20 has a display area (AA). The buffer adhesive layer 12 is arranged on the side of the display substrate 20 away from the display side of the display substrate 20. The orthographic projection of the display area (AA) on the display substrate 20 is located within the range of the orthographic projection of the region 100 of the heat dissipation film 10 on the display substrate 20 and the orthographic projection of the buffer adhesive layer 12 on the display substrate 20. In this way, the light from the display side of the display area (AA) can be completely blocked by the region 100 and the buffer adhesive layer 12, avoiding the light passing through the display area (AA), causing the display area (AA) to be exposed to the light for a long time, avoiding the phenomenon of uneven display brightness of the display substrate 20 and the formation of various traces, thereby improving the display effect of the display substrate 20.

[0086] In an exemplary embodiment, referring to Figures 6 to 11, the heat dissipation assembly 11 includes a support layer 113, a heat dissipation layer 114, and an edge sealing structure 115. Multiple straight edges 111 are located on the support layer 113. The heat dissipation layer 114 is disposed on the side of the support layer 113 facing the display substrate 20, and the edge sealing structure 115 is disposed on the side of the support layer 113 facing the display substrate 20 and surrounds the outer periphery of the heat dissipation layer 114. The support layer 113 can serve as a carrier, facilitating the transfer of other structures of the heat dissipation film 10 and ensuring the overall structural stability of the heat dissipation film 10. The heat dissipation layer 114 can be a graphite layer containing graphite microparticles. The heat dissipation layer 114 can also be a layer structure containing other thermally conductive microparticles.

[0087] The edge sealing structure 115 can prevent micro powder particles from falling off the edge of the heat dissipation layer 114, and avoid micro powder particles from falling to other parts of the display module, causing short circuits and affecting the display effect of the display substrate 20.

[0088] The edge sealing structure 115 extends to each straight edge 111, forming region 100. That is, the edge sealing structure 115 prevents micro-powder particles from falling off the edge of the heat dissipation layer 114, and also forms region 100, facilitating the formation of region 100 simultaneously with edge sealing of the heat dissipation layer 114. This can be completed in a single process without affecting the production efficiency of the display module. Figure 12 is a photograph of the buffer adhesive layer 12 side of the heat dissipation film 10 in the display module. It can be seen that the heat dissipation film 10 has a uniform color around its perimeter, indicating that the equipment can perform straight edge alignment and gripping normally.

[0089] In an exemplary embodiment, the edge sealing structure 115 may be, but is not limited to, polyethylene terephthalate (PET) tape or polyimide (PI) tape. The edge sealing structure 115 may be the same color as the heat dissipation layer 114, both being black, thereby making both the first color and the second color black.

[0090] In an exemplary embodiment, as shown in FIG7, the edge sealing structure 115 includes a body 1151 and a plurality of first planar portions 1152. The body 1151 is disposed around the outer periphery of the heat dissipation layer 114, and is capable of sealing the heat dissipation layer 114.

[0091] Multiple first planar portions 1152 are connected to the side of the body 1151 away from the heat dissipation layer 114, such that the multiple first planar portions 1152 are located on the outer periphery of the body 1151 and connected to the body 1151.

[0092] Multiple first planar portions 1152 correspond one-to-one with multiple straight edge portions 111 and extend to the corresponding straight edge portions 111. In this way, a region 100 containing multiple sub-regions can be formed. And the boundary of the orthographic projection of each sub-region on the heat dissipation assembly 11 at least partially overlaps with the orthographic projection of the corresponding straight edge portion 111 on the heat dissipation assembly 11.

[0093] In an exemplary embodiment, the first planar portion 1152 can be in a regular shape such as a triangle, a square, a rectangle, a trapezoid, a semicircle, or a semi-ellipse, or in an irregular shape. The length direction of the rectangle is parallel to the straight edge portion 111. The straight edge of the semicircle is located at the straight edge portion 111. The straight edge of the semi-ellipse is located at the straight edge portion 111.

[0094] In an exemplary embodiment, the first planar portion 1152 has a boundary of a front projection on the heat dissipation assembly 11 that at least partially overlaps with a front projection of the corresponding straight edge portion 111 on the heat dissipation assembly 11.

[0095] In an exemplary embodiment, the first planar portion 1152 located at one side of the straight edge portion 111 can fully or partially coincide with the straight edge portion 111. The side of the first planar portion 1152 connected to the body 1151 coincides with the body 1151.

[0096] In an exemplary embodiment, the heat dissipation layer 114, the body 1151, and the first planar portion 1152 have the same thickness. The thickness refers to the dimension in the direction perpendicular to the display substrate 20.

[0097] In an exemplary embodiment, the body 1151 is interconnected or spaced apart from the plurality of first planar portions 1152.

[0098] In an exemplary embodiment, the body 1151 and the plurality of first planar portions 1152 can be black. The first planar portion 1152 can be black. The body 1151 can also be in other colors.

[0099] In an exemplary embodiment, please refer to FIGS. 7 and 9-11, the edge sealing structure 115 further includes a plurality of edge covering portions 1153. The plurality of edge covering portions 1153 are interconnected one by one with the plurality of first planar portions 1152 and are arranged at the corresponding straight edge portions 111. In this way, the arrangement of the edge covering portions 1153 can increase the connection area between the edge sealing structure 115 and the support layer 113, improve the connection stability between the edge sealing structure 115 and the support layer 113, and avoid the first planar portion 1152 from being warped or wrinkled during the process of attaching the heat dissipation film 10 to the display substrate 20, which affects the connection precision between the heat dissipation film 10 and the display substrate 20 and the display effect of the display substrate 20. In addition, during the installation of the display module, the periphery of the display substrate 20 also needs to be subjected to a dispensing process to prevent moisture from entering. The arrangement of the edge covering portions 1153 can also prevent the adhesive used in the above dispensing process from entering between the first planar portion 1152 and the support layer 113, which affects the connection precision between the heat dissipation film 10 and the display substrate 20 and the display effect of the display substrate 20.

[0100] In an exemplary embodiment, the edge wrapping portion 1153 is parallel to the straight edge portion 111, and one end of the edge wrapping portion 1153 is connected to one side of the first planar portion 1152 away from the body 1151.

[0101] In an exemplary embodiment, the edge wrapping portion 1153 can be a regular shape such as a rectangle or a semi-ellipse, or can be an irregular shape. The length direction of the rectangle is parallel to the straight edge portion 111. The straight edge of the semi-ellipse is located on the straight edge portion 111.

[0102] In an exemplary embodiment, the edge wrapping portion 1153 can include a plurality of sub-edge wrapping portions, and the plurality of sub-edge wrapping portions of the same edge wrapping portion 1153 are connected to the same first planar portion 1152. The plurality of sub-edge wrapping portions are arranged along the length direction of the corresponding straight edge portion 111.

[0103] In an exemplary embodiment, the sub-edge wrapping portion can be a regular shape such as a triangle, a square, a rectangle, a trapezoid, a semi-circle, or a semi-ellipse, or can be an irregular shape. The length direction of the rectangle is parallel to the straight edge portion 111. The straight edge of the semi-circle is located on the straight edge portion 111. The straight edge of the semi-ellipse is located on the straight edge portion 111.

[0104] In an exemplary embodiment, the edge wrapping portion 1153 has substantially the same thickness as the heat dissipation layer 114. The thickness of the edge wrapping portion 1153 refers to the dimension in the direction perpendicular to the straight edge portion 111. The thickness of the heat dissipation layer 114 refers to the dimension in the direction perpendicular to the display substrate 20. The thickness of the edge wrapping portion 1153 at the connection position with the first planar portion 1152 can be the same as or slightly greater than the thickness of the heat dissipation layer 114. The thickness of the edge wrapping portion 1153 opposite to the straight edge portion 111 can be greater than the thickness of the heat dissipation layer 114.

[0105] In an exemplary embodiment, the edge wrapping portion 1153 and the first planar portion 1152 can be black. The edge wrapping portion 1153 can also be other colors.

[0106] In the example embodiment, please refer to FIGS. 7 and 9-11, the edge sealing structure 115 further comprises a plurality of second planar portions 1154, which are connected to the plurality of edge wrapping portions 1153 one by one, and are arranged on the side of the support layer 113 away from the display substrate 20. Thus, the second planar portions 1154 can further increase the connection area between the edge sealing structure 115 and the support layer 113, improve the connection stability between the edge sealing structure 115 and the support layer 113, and avoid the first planar portion 1152 from being warped or wrinkled during the process of attaching the heat dissipation film 10 to the display substrate 20, which affects the connection precision between the heat dissipation film 10 and the display substrate 20 and the display effect of the display substrate 20. In addition, the periphery of the display substrate 20 needs to be subjected to a dispensing process during the installation of the display module to prevent moisture from entering. The arrangement of the second planar portions 1154 can also make the gap between the edge sealing structure 115 and the support layer 113 away from the glue used in the dispensing process, reduce the risk of the glue entering the gap between the edge sealing structure 115 and the support layer 113, and ensure the connection precision between the edge sealing structure 115 and the support layer 113 and the display effect of the display substrate 20. FIG. 13 is a photo of the side of the heat dissipation assembly 11 of the heat dissipation film 10 in the display module, from which it can be seen that the second planar portions 1154 are arranged on the side of the support layer 113 away from the display substrate 20.

[0107] In the example embodiment, one end of the second planar portion 1154 is connected to the side of the edge wrapping portion 1153 away from the first planar portion 1152.

[0108] In the example embodiment, the second planar portion 1154 can be a regular geometric shape such as a triangle, a square, a rectangle, a trapezoid, a semicircle, or a semi-ellipse, or can be an irregular geometric shape.

[0109] In the example embodiment, the second planar portion 1154 can comprise a plurality of sub-second planar portions, and the plurality of sub-second planar portions of the same second planar portion 1154 are connected to the same edge wrapping portion 1153. The plurality of sub-second planar portions are arranged along the length direction of the corresponding straight edge portion 111.

[0110] In the example embodiment, the second planar portion 1154 can comprise a plurality of sub-second planar portions, and the edge wrapping portion 1153 comprises a plurality of sub-edge wrapping portions. Each edge wrapping portion 1153 is connected to at least one sub-second planar portion.

[0111] In the example embodiment, the sub-second planar portion can be a regular geometric shape such as a triangle, a square, a rectangle, a trapezoid, a semicircle, or a semi-ellipse, or can be an irregular geometric shape. The length direction of the rectangle is parallel to the straight edge portion 111. The straight edge of the semicircle is located on the straight edge portion 111. The straight edge of the semi-ellipse is located on the straight edge portion 111.

[0112] In an exemplary embodiment, the thicknesses of the second planar portion 1154, the heat dissipation layer 114, the body 1151, and the first planar portion 1152 are the same. The thickness of the second planar portion 1154, the heat dissipation layer 114, the body 1151, and the first planar portion 1152 refers to the dimension in the direction perpendicular to the display substrate 20. The thickness of the connecting position of the beaded portion 1153 and the second planar portion 1154 can be the same as or slightly greater than the thickness of the heat dissipation layer 114. The thickness of the beaded portion 1153 refers to the dimension in the direction perpendicular to the straight edge portion 111.

[0113] In an exemplary embodiment, the color of the second planar portion 1154 and the first planar portion 1152 can both be black. The second planar portion 1154 can also be other colors.

[0114] In an exemplary embodiment, in combination with FIGS. 9-11, the boundary of the orthographic projection of the second planar portion 1154 on the heat dissipation assembly 11 at least partially overlaps the orthographic projection of the corresponding straight edge portion 111 on the heat dissipation assembly 11.

[0115] In an exemplary embodiment, the second planar portion 1154 located on one side of the straight edge portion 111 can completely or partially coincide with the straight edge portion 111.

[0116] In an exemplary embodiment, the orthographic projection of the second planar portion 1154 on the heat dissipation assembly 11 is located within the range of the orthographic projection of the corresponding first planar portion 1152 on the heat dissipation assembly 11.

[0117] In an exemplary embodiment, the orthographic projection of the second planar portion 1154 on the heat dissipation assembly 11 partially overlaps the orthographic projection of the body 1151 on the heat dissipation assembly 11, so that the connecting surface area of the second planar portion 1154 and the support layer 113 is larger, further improving the connection stability between the sealing structure 115 and the support layer 113.

[0118] In an exemplary embodiment, in combination with FIGS. 9 and 10, the boundary of the orthographic projection of the buffer adhesive layer 12 on the support layer 113 is located within the range of the orthographic projection of the body 1151 on the support layer 113, so that the support layer 113, the body 1151, and the buffer adhesive layer 12 can wrap the heat dissipation layer 114, which can further prevent the heat dissipation layer 114 from falling off of the fine powder particles.

[0119] In an exemplary embodiment, the boundary of the orthographic projection of the buffer adhesive layer 12 on the support layer 113 is located within the range of the orthographic projection of the first planar portion 1152 on the support layer 113, so that the buffer adhesive layer 12 can prevent the heat dissipation layer 114 from falling off of the fine powder particles, and can increase the connecting surface area between the buffer adhesive layer 12 and the heat dissipation assembly 11, improving the connection stability.

[0120] In an exemplary embodiment, please refer to FIG. 9 and FIG. 10, the boundary of the normal projection of the buffer bonding layer 12 on the support layer 113 is located inside the periphery of the support layer 113, and the distance from the boundary of the support layer 113 can be about 0.07mm to 0.09mm. For example, the distance from the boundary of the normal projection of the buffer bonding layer 12 on the support layer 113 to the boundary of the support layer 113 can be about 0.08mm. In this way, the buffer bonding layer 12 has a small amount of inward shrinkage relative to the periphery of the support layer 113, and the edge of the display substrate 20 can be locally narrow. In this case, the buffer bonding layer 12 can overflow or exceed the edge of the heat dissipation assembly 11, and the buffer bonding layer 12 can avoid exceeding the boundary of the display substrate 20. In addition, the small amount of inward shrinkage of the buffer bonding layer 12 relative to the periphery of the support layer 113 can also increase the area of the heat dissipation film 10 blocking the display substrate 20, and prevent light from penetrating from the display side of the display area (AA) of the display substrate 20.

[0121] In an exemplary embodiment, as shown in FIG. 11, the boundary of the normal projection of the buffer bonding layer 12 on the plane of the support layer 113 is located outside the range of the normal projection of the first plane portion 1152 on the support layer 113. In this way, the connection area between the heat dissipation assembly 11 and the display substrate 20 can be increased, and the connection stability can be improved. The heat dissipation film 10 has an inward shrinkage design relative to the display substrate 20, so that the normal projection of the buffer bonding layer 12 on the display substrate 20 does not exceed the boundary of the display substrate 20. In addition, during the installation of the display module, the periphery of the display substrate 20 also needs to be subjected to a dispensing process to prevent moisture from entering. Therefore, the part of the buffer bonding layer 12 that exceeds the support layer 113 will not cause other adverse effects on the production line bonding and the display module.

[0122] In an exemplary embodiment, the buffer bonding layer 12 includes a buffer structure layer and a bonding structure layer. The buffer structure layer is arranged on the side of the heat dissipation assembly 11 facing the display substrate 20, and the bonding structure layer is arranged on the side of the buffer structure layer facing the display substrate 20 and connected between the buffer structure layer and the display substrate 20. The buffer structure layer can be a foam layer. The bonding structure layer can be a grid adhesive layer.

[0123] In an exemplary embodiment, the material of the buffer bonding layer 12 is a viscous polymer or a gel. In this way, the buffer bonding layer 12 is a substrate-free integrally formed structure, which has both elastic properties and bonding properties, and plays the roles of buffering, impact resistance, and bonding. The buffer bonding layer 12 can be more closely attached to the display substrate 20, and air bubbles can be avoided between the buffer bonding layer 12 and the display substrate 20. In addition, compared with the buffer bonding layer 12 including a buffer structure layer and a bonding structure layer, the substrate-free integrally formed buffer bonding layer 12 can further simplify the display module preparation process and improve production efficiency.

[0124] In addition, the cushioning bonding layer 12 integrally formed without a substrate also eliminates the problem of cotton debris falling off when the cushioning bonding layer 12 exceeds the boundary of the support layer 113. When the cushioning bonding layer 12 is flush with the boundary of the support layer 113 or exceeds the boundary of the support layer 113, the device can directly grab the edge of the cushioning bonding layer 12 for alignment and bonding, thereby reducing the possibility of material being thrown by the device.

[0125] In an example embodiment, the overall color of the cushioning bonding layer 12 is uniform, so that the color of the side of the cushioning bonding layer 12 facing the display substrate 20 is not affected after deformation due to flow or other reasons when the cushioning bonding layer 12 is attached to the display substrate 20. Therefore, it is not necessary to adjust the position of the side of the cushioning bonding layer 12 facing the display substrate 20 according to whether the cushioning bonding layer 12 is deformed, thereby ensuring that the color is consistent with the preset color. In an embodiment of the present disclosure, the overall color of the cushioning bonding layer 12 can be black.

[0126] In an example embodiment, the adhesive polymer can be pressure sensitive adhesive (PSA) or other types of adhesive prepared by adding a foaming agent.

[0127] In an example embodiment, the gel can be a silicone gel.

[0128] In an example embodiment, as shown in FIG. 14, the heat dissipation assembly 11 includes a support layer 113. A plurality of straight edge portions 111 are located on the support layer 113. In an embodiment of the present disclosure, the cushioning bonding layer 12 can be directly arranged on the side of the support layer 113 facing the display substrate 20.

[0129] The side of the support layer 113 facing the display substrate 20 has an area 100. The area 100 can include a plurality of sub-areas. The plurality of sub-areas correspond one-to-one to the plurality of straight edge portions 111. Moreover, the boundary of the orthographic projection of each sub-area on the heat dissipation assembly 11 at least partially overlaps the orthographic projection of the corresponding straight edge portion 111 on the heat dissipation assembly 11.

[0130] In an example embodiment, the sub-area can be a regular shape such as a triangle, a square, a rectangle, a trapezoid, a semicircle, or a semi-ellipse. The sub-area can also be an irregular shape. The length direction of the rectangle is parallel to the straight edge portion 111. The straight edge of the semicircle is located on the straight edge portion 111. The straight edge of the semi-ellipse is located on the straight edge portion 111.

[0131] In an example embodiment, the sub-area located on one side of the straight edge portion 111 can completely or partially coincide with the straight edge portion 111. The area of the sub-area covering the side of the support layer 113 facing the display substrate 20 can be set according to the recognition accuracy of the device.

[0132] In an example embodiment, the plurality of sub-areas are independent of each other.

[0133] In an exemplary embodiment, the plurality of sub-regions can be connected to form a ring shape.

[0134] In an exemplary embodiment, the region 100 can be a unitary structure covering the entire side of the support layer 113 facing the display substrate 20.

[0135] In an exemplary embodiment, the side of the support layer 113 facing the display substrate 20 is formed with the region 100 by blackening treatment by oxidation. That is, the first color is black. The second color is the same as the first color, which is also black. It can be understood that in other embodiments, the first color and the second color can also be other colors capable of blocking light. In the embodiments of the present disclosure, the region 100 is a unitary structure covering the entire side of the support layer 113 facing the display substrate 20, that is, the entire side of the support layer 113 facing the display substrate 20 is formed with the region 100 by blackening treatment by oxidation. It can be understood that in other embodiments, the blackening treatment by oxidation can also only form a plurality of sub-regions independent of each other or form a ring shape connected to each other at the position close to the straight edge portion 111, so as to reduce the reduction of the conductivity and heat dissipation of the support layer 113 caused by oxidation.

[0136] In an exemplary embodiment, the side of the support layer 113 facing the display substrate 20 can also be formed with the region 100 by deposition, coating, etc.

[0137] In an exemplary embodiment, the material of the support layer 113 can be, but is not limited to, stainless steel or copper, aluminum, gold, or silver, etc. single element or alloy. And the hardness of the support layer 113 is greater than that of the copper foil 11`.

[0138] In an exemplary embodiment, please refer to FIGS. 9 to 11 and 14, the boundary of the orthographic projection of the heat dissipation film 10 on the display substrate 20 is located inside the periphery of the display substrate 20, and the distance from the boundary of the display substrate 20 can be about 0.25mm to 0.30mm. For example, the distance from the boundary of the orthographic projection of the heat dissipation film 10 on the display substrate 20 to the boundary of the display substrate 20 can be about 0.28mm or so.

[0139] In an exemplary embodiment, please refer to FIGS. 9 to 11 and 14, the display substrate 20 also has a visual area (VA) located outside the periphery of the display area (AA), and the boundary of the orthographic projection of the heat dissipation assembly 11 of the heat dissipation film 10 on the display substrate 20 is located outside the periphery of the visual area (VA).

[0140] In an exemplary embodiment, as shown in FIG. 9, the boundary of the normal projection of the buffer bonding layer 12 on the display substrate 20 is located between the boundary of the normal projection of the heat dissipation component 11 on the display substrate 20 and the outer side of the periphery of the visual area (VA). The distance X1 from the boundary of the normal projection of the buffer bonding layer 12 on the display substrate 20 to the display area (AA) can be about 0.33mm to 0.53mm, for example, the distance X1 from the boundary of the normal projection of the buffer bonding layer 12 on the display substrate 20 to the display area (AA) can be about 0.43mm or so.

[0141] In an exemplary embodiment, as shown in FIG. 10, the boundary of the normal projection of the buffer bonding layer 12 on the display substrate 20 is located between the periphery of the display area (AA) and the inner side of the periphery of the visual area (VA). The distance X2 from the boundary of the normal projection of the buffer bonding layer 12 on the display substrate 20 to the display area (AA) can be about 0.03mm to 0.23mm, for example, the distance X2 from the boundary of the normal projection of the buffer bonding layer 12 on the display substrate 20 to the display area (AA) can be about 0.13mm or so.

[0142] In an exemplary embodiment, as shown in FIG. 11, the boundary of the normal projection of the buffer bonding layer 12 on the display substrate 20 is located on the outer side of the boundary of the normal projection of the heat dissipation component 11 on the display substrate 20. The distance X3 from the boundary of the normal projection of the buffer bonding layer 12 on the display substrate 20 to the display area (AA) can be about 0.38mm to 0.58mm, for example, the distance X3 from the boundary of the normal projection of the buffer bonding layer 12 on the display substrate 20 to the display area (AA) can be about 0.48mm or so.

[0143] In an exemplary embodiment, please refer to FIG. 6, FIG. 8 to FIG. 11 and FIG. 14 together, the display module further comprises a transparent adhesive film layer 60 and a cover plate 40 (CG). The transparent adhesive film layer 60 is arranged on the display side of the display substrate 20. The cover plate 40 is arranged on the side of the transparent adhesive film layer 60 away from the display substrate 20.

[0144] In the frame area of the display module, ink 50 is coated between the cover plate 40 and the transparent adhesive film layer 60. The transparent adhesive film layer 60 can be, but is not limited to, an optical adhesive layer or a thermosetting optical transparent adhesive film (TOCA). The cover plate 40 can be a glass cover plate 40. The ink 50 defines the peripheral boundary of the visual area (VA).

[0145] The embodiments of the present disclosure also provide a display device, which comprises the display module as above.

[0146] In an exemplary embodiment, the display device can be a mobile phone, a notebook computer, a tablet computer, a television, a display, a digital photo frame, a navigator, a touch display all-in-one machine, or the like device having a display function.

[0147] While the embodiments disclosed in the present disclosure are as described above, it should be noted that the above-described embodiments are merely exemplary, and are not intended to be limiting. Accordingly, the present disclosure is not limited to what is specifically shown and described herein. Various modifications, substitutions, and omissions can be made without departing from the scope of the present disclosure.

Claims

1. A heat dissipation film, comprising: a heat dissipation component, a periphery of the heat dissipation component having a plurality of straight edge portions, a side of the heat dissipation component facing a display substrate having a region, a boundary of a footprint of the region on the heat dissipation component at least partially overlapping a footprint of each of the straight edge portions on the heat dissipation component, the side of the region facing the display substrate having a first color; and a cushioning adhesive layer disposed on the side of the heat dissipation component facing the display substrate and connected between the heat dissipation component and the display substrate; the side of the cushioning adhesive layer facing the display substrate having a second color, the first color being the same as the second color. the heat dissipation component comprising a support layer, the plurality of straight edge portions being located on the support layer; 2. The heat dissipating film according to claim 1, wherein, the side of the support layer facing the display substrate having the region. the side of the support layer facing the display substrate having the region formed by an oxidation blackening process.

3. The heat dissipating film of claim 2, wherein, the heat dissipation component comprising a support layer, a heat dissipation layer, and an edge sealing structure, the plurality of straight edge portions being located on the support layer, the heat dissipation layer being disposed on the side of the support layer facing the display substrate, the edge sealing structure being disposed on the side of the support layer facing the display substrate and annularly disposed on a periphery of the heat dissipation layer; 4. The heat dissipating film of claim 1, wherein, the edge sealing structure extending to each of the straight edge portions to form the region. the edge sealing structure comprising a body and a plurality of first planar portions, the body annularly disposed on the periphery of the heat dissipation layer, the plurality of first planar portions being connected to a side of the body away from the heat dissipation layer; 5. The heat dissipation film according to claim 4, wherein, the plurality of first planar portions corresponding to the plurality of straight edge portions one-to-one and extending to the corresponding straight edge portions. the body and the plurality of first planar portions being interconnected or spaced apart.

6. The heat dissipating film according to claim 5, wherein, a boundary of a footprint of the first planar portion on the heat dissipation component at least partially overlapping a footprint of the corresponding straight edge portion on the heat dissipation component.

7. The heat dissipating film according to claim 5, wherein, the edge sealing structure further comprising a plurality of edge wrapping portions, the plurality of edge wrapping portions being interconnected corresponding to the plurality of first planar portions one-to-one, the plurality of edge wrapping portions being disposed on the corresponding straight edge portions.

8. The heat dissipating film according to claim 5, wherein, the edge sealing structure further comprising a plurality of second planar portions, the plurality of second planar portions being interconnected corresponding to the plurality of edge wrapping portions one-to-one, the plurality of second planar portions being disposed on a side of the support layer away from the display substrate.

9. The heat dissipating film according to claim 8, wherein, a boundary of a footprint of the second planar portion on the heat dissipation component at least partially overlapping a footprint of the corresponding straight edge portion on the heat dissipation component.

10. The heat dissipating film according to claim 9, wherein, a footprint of the second planar portion on the heat dissipation component being within a range of a footprint of the corresponding first planar portion on the heat dissipation component.

11. The heat dissipating film according to claim 9, wherein, the footprint of the second planar portion on the heat dissipation component partially overlapping the footprint of the body on the heat dissipation component.

12. The heat dissipating film of claim 9, wherein, a boundary of a footprint of the cushioning adhesive layer on the support layer being within a range of a footprint of the body on the support layer.

13. The heat dissipating film according to claim 5, wherein, a boundary of a footprint of the cushioning adhesive layer on the support layer being within a range of a footprint of the first planar portion on the support layer.

14. The heat dissipating film according to claim 5, wherein, a boundary of a footprint of the cushioning adhesive layer on the support layer being within a periphery of the support layer, and a distance from a boundary of the support layer being 0.07mm to 0.09mm.

15. The heat dissipating film according to claim 13 or 14, wherein, ​ 16. The heat dissipating film according to claim 5, wherein, A boundary of a normal projection of the buffer bonding layer on a plane where the support layer is located is located outside a range of a normal projection of the first plane portion on the support layer.

17. The heat dissipating film according to claim 2 or 4, wherein, A material of the support layer is stainless steel.

18. The heat dissipating film of claim 1, wherein, The first color and the second color are black.

19. The heat dissipating film of claim 1, wherein, The buffer bonding layer comprises a buffer structure layer and a bonding structure layer, the buffer structure layer is arranged on a side of the heat dissipation assembly facing the display substrate, and the bonding structure layer is arranged on a side of the buffer structure layer facing the display substrate and connected between the buffer structure layer and the display substrate; or A material of the buffer bonding layer is a viscous polymer or a gel.

20. A display module, comprising: a display substrate having a display area; and The display substrate according to any one of claims 1 to 19, wherein the buffer bonding layer of the heat dissipation film is arranged on a side of the display substrate away from a display side of the display substrate. A normal projection of the display area on the display substrate is located within a range of a normal projection of the heat dissipation film on the display substrate and a normal projection of the buffer bonding layer on the display substrate.

21. The display module of claim 20, wherein, A boundary of a normal projection of the heat dissipation film on the display substrate is located within a periphery of the display substrate, and a distance from the boundary of the display substrate is 0.25 mm to 0.30 mm.

22. The display module of claim 21, wherein, The display substrate further has a viewable area located outside a periphery of the display area, and a boundary of a normal projection of the heat dissipation assembly of the heat dissipation film on the display substrate is located outside a periphery of the viewable area. A boundary of a normal projection of the buffer bonding layer on the display substrate is located between an inner side of the boundary of the normal projection of the heat dissipation assembly on the display substrate and an outer side of the periphery of the viewable area; or a boundary of a normal projection of the buffer bonding layer on the display substrate is located between an outer side of the periphery of the display area and an inner side of the periphery of the viewable area; or a boundary of a normal projection of the buffer bonding layer on the display substrate is located outside the boundary of the normal projection of the heat dissipation assembly on the display substrate.

23. A display device comprising the display module according to any one of claims 20 to 22.

Images