Coil module and electronic device

Abstract

The present application provides a coil module and an electronic device, and relates to the technical field of circuit boards. A high-speed signal line and a wireless charging coil are integrated in the same coil module. The coil module can comprise a substrate and a metal layer formed on one side of the substrate, wherein the metal layer comprises a thick metal region, a thin metal region, and a transition region located at a junction region between the thick metal region and the thin metal region; a wireless charging coil is arranged in the thick metal region, and a high-speed signal line is arranged in the thin metal region; a first nanocrystal and a second nanocrystal are arranged opposite each other on two sides of the substrate; at least part of the periphery of the wireless charging coil is covered by the first nanocrystal, and the first nanocrystal extends above the transition region; and at least part of the wireless charging coil is covered by the second nanocrystal. Thus, the integration level can be improved, space resources are saved on, and a transition region is used to keep a high-speed signal line and a wireless charging coil spaced apart, without affecting the signal quality of either.

Description

Coil modules, electronic devices

[0001] This application claims priority to Chinese Patent Application No. 202410679011.0, filed with the State Intellectual Property Office of China on May 28, 2024, entitled "Coil Module, Electronic Device", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of circuit board technology, and more particularly to a coil module that can integrate a wireless charging coil and a high-speed signal line, and an electronic device containing the coil module. Background Technology

[0003] With the development of communication technology, some electronic devices have wireless charging capabilities. Wireless charging coils are large and thick, and flexible printed circuit boards (FPCs) for other functions need to be placed away from the wireless charging coils, making the overall architecture space tight and the integration low.

[0004] For example, in order to reduce magnetic interference to high-speed signals, FPCs with high-speed signal capabilities need to be kept at a greater distance from FPCs with wireless charging coils, resulting in a shortage of overall system resources. Summary of the Invention

[0005] This application provides a coil module and an electronic device having the coil module. Integrating a high-speed signal line and a wireless charging coil into the same coil module improves integration, saves space resources, does not affect the signal quality of each component, reduces magnetic interference to the high-speed signal, and ensures wireless charging efficiency.

[0006] To achieve the above objectives, the embodiments of this application adopt the following technical solutions:

[0007] In one aspect, this application provides a coil module that integrates a high-speed signal line and a wireless charging coil.

[0008] The coil module may include: a substrate, a first metal layer, a first nanocrystal, and a second nanocrystal; the first metal layer and the first nanocrystal are located on a first side of the substrate, and the second nanocrystal is located on a second side of the substrate, with the first side and the second side opposite to each other.

[0009] Furthermore, the first metal layer includes: a first thick metal region and a first thin metal region, and a first transition region located at the boundary between the first thick metal region and the first thin metal region; the coil module further includes: a first wireless charging coil and a first high-speed signal line, the first wireless charging coil being located in the first thick metal region and the first high-speed signal line being located in the first thin metal region; in the first metal layer, at least a portion of the periphery of the first wireless charging coil is covered by a first nanocrystal, and the first nanocrystal extends above the first transition region; the projection of a second nanocrystal onto the first wireless charging coil covers at least a portion of the first wireless charging coil.

[0010] The coil module provided in this application integrates the wireless charging coil and the high-speed signal line into the same module. Furthermore, placing the wireless charging coil in the thick metal area can reduce the wireless charging impedance and improve charging efficiency; placing the high-speed signal line in the thin metal area can achieve impedance control and ensure the quality of the high-speed signal.

[0011] A transition zone is provided at the boundary between the thick metal area with the wireless charging coil and the thin metal area with the high-speed signal line. The transition zone increases the distance between the wireless charging coil and the high-speed signal line, reduces the interference of the magnetic field on the high-speed signal, and ensures the quality of the high-speed signal.

[0012] The second nanocrystal provided in this application can cover at least a portion of the wireless charging coil. The second nanocrystal is used to concentrate the magnetic field and improve the wireless charging efficiency. The first nanocrystal can cover at least a portion of the periphery of the wireless charging coil and can extend to the transition region. In this way, the first nanocrystal can shield the magnetic field and avoid magnetic field interference with surrounding signals, such as avoiding magnetic field interference with high-speed signals located on one side of the transition region.

[0013] Therefore, this application integrates the high-speed signal line and the wireless charging coil into one module, improving the integration level, and effectively suppressing the interference between the high-speed signal line and the wireless charging coil, thus ensuring their respective working performance.

[0014] In one possible implementation, the coil module further includes a first trace; the first trace includes at least one of a ground wire, a power line, or a low-speed signal line. The power line may include a wired charging cable.

[0015] In other words, in this example, the high-speed signal line, wireless charging coil, and wired charging cable can be integrated into a single module, further improving integration, saving space resources, and freeing up more space in the overall system architecture.

[0016] In one possible implementation, the first trace is located in a first thick metal region, the first trace is located between a first wireless charging coil and a first high-speed signal line, and a first nanocrystal extends from the periphery of the first wireless charging coil and covers at least a portion of the first trace.

[0017] In this example, the first trace is placed in the thick metal region and is located between the high-speed signal line and the wireless charging coil. This first trace further increases the distance between the high-speed signal line and the wireless charging coil, reducing interference from the coil's magnetic field on the high-speed signal. Furthermore, if the first nanocrystal covers at least a portion of the trace, for example, if the first trace includes a wired charging line, the above structure can reduce eddy current losses in the coil's magnetic field on the wired charging line, thereby improving wireless charging efficiency.

[0018] In this implementation structure, the first nanocrystal only needs to cover the first trace close to the wireless charging coil, making the first nanocrystal smaller in size and lower in cost.

[0019] In one feasible approach, the first trace is also located in the first transition zone.

[0020] In the transition zone, for example, when the metal is copper, the copper area in the transition zone is relatively large and can be referred to as a large copper sheet. For example, the first trace includes a wired charging cable, which is laid on the large copper sheet to make full use of the transition zone and the plane space to make the trace wider, effectively reducing the wired charging impedance.

[0021] In one possible implementation, the first metal layer further includes: a second thick metal region and a second transition region, the second transition region being located at the boundary between the second thick metal region and the first thin metal region; a first trace being located in the second thick metal region; and a first nanocrystal extending from the periphery of the first wireless charging coil and covering at least a portion of the first transition region and at least a portion of the first thin metal region.

[0022] In this example, the first trace is placed in another thick metal region, and a transition region is set at the boundary between the thick metal region and the adjacent thin metal region. In order to reduce the interference of the magnetic field on the high-speed signal and ensure the quality of the high-speed signal, the first nanocrystal can cover at least a portion of the first transition region and at least a portion of the first thin metal region with the high-speed signal line.

[0023] In one possible implementation, the first nanocrystal extends from the periphery of the first wireless charging coil and can cover at least a portion of the first transition region, at least a portion of the first thin metal region having the first high-speed signal line, at least a portion of the second transition region, and at least a portion of the second thick metal region.

[0024] This reduces eddy current losses and improves wireless charging efficiency.

[0025] In one possible implementation, the second thick metal region is located on the side of the first thin metal region away from the first thick metal region.

[0026] In one feasible approach, the first trace is also located in the second transition zone.

[0027] For example, the first trace includes a wired charging cable, which is laid in the second transition area of ​​the large copper sheet. This second transition area is fully utilized to make the trace wider and effectively reduce the wired charging impedance.

[0028] In one possible implementation, a first trace is located in a first thick metal region, and a first wireless charging coil is located between the first trace and a first high-speed signal line; a first nanocrystal extends from the periphery of the first wireless charging coil and covers at least a portion of the first transition region and at least a portion of the first thin metal region, as well as at least a portion of the first trace.

[0029] In this embodiment, the first trace and the wireless charging coil are integrated in the same thick metal region, and the first nanocrystal covers at least a portion of the first transition region and at least a portion of the first thin metal region to reduce the interference of the magnetic field on the high-speed signal. The first nanocrystal covers at least a portion of the first trace, such as the first trace including a wired charging line, which can reduce the eddy current loss of the coil magnetic field on the wired charging line and improve the wireless charging efficiency.

[0030] In one possible implementation, a first trace is located in a first thin metal region, a first high-speed signal line is located between the first trace and the first wireless charging coil, and a first nanocrystal extends from the periphery of the first wireless charging coil and covers at least a portion of the first transition region and at least a portion of the first high-speed signal line.

[0031] In this example, the first trace is integrated into the thin metal area.

[0032] In one possible implementation, the first trace is located in a first thin metal region, between a first high-speed signal line and a first wireless charging coil, and the first nanocrystal extends from the periphery of the first wireless charging coil and covers at least a portion of the first transition region, at least a portion of the first trace, and at least a portion of the first high-speed signal line.

[0033] In this example, the first trace is integrated into a thin metal area, and the distance between the high-speed signal line and the wireless charging coil is increased using the first trace.

[0034] In one possible implementation, the power line of the first trace includes a wired charging cable.

[0035] In one possible implementation, the first nanocrystal includes: a first effective region and a first edging, the first edging being disposed around the outer periphery of the first effective region, the thickness of the first effective region being greater than the thickness of the first edging; a first transition region includes a convex hull, the convex hull protruding relative to the surface of the first thick metal region; the first edging is located above the convex hull.

[0036] In this embodiment, a convex hull is provided in the transition region, and the edge of the first nanocrystal is positioned above the convex hull. In this way, the area of ​​the first nanocrystal can be maximized without local over-thickness of the entire coil module, thereby improving the magnetic shielding effect.

[0037] In one possible implementation, the first bulge located above the convex hull has a dimension of d1 in a first direction, 0.1mm≤d1≤0.5mm, and the first direction is parallel to the width direction of the first bulge.

[0038] For example, the overlap width of the first edge on the convex hull can be 0.2mm or 0.3mm.

[0039] In one possible implementation, the first rim extends above the first wireless charging coil.

[0040] In one possible implementation, the first rim located above the first wireless charging coil has a dimension d2 in a first direction, 0.1mm≤d2≤0.5mm, and the first direction is parallel to the width direction of the first rim.

[0041] For example, the overlap width of the first edge on the first wireless charging coil can be 0.2mm or 0.3mm.

[0042] In one possible implementation, the second nanocrystal includes: a second effective region and a second edging, the second edging being disposed around the outer periphery of the second effective region, the thickness of the second effective region being greater than the thickness of the second edging; the orthographic projection of the first edging located above the first wireless charging coil onto the reference plane is the first projection, the orthographic projection of the second edging near the first transition region onto the reference plane is the second projection, the first projection and the second projection overlap, and the reference plane is parallel to the substrate surface.

[0043] In this way, the effective regions of the first and second nanocrystals can be extended and brought closer together to the maximum extent, avoiding magnetic leakage and improving the magnetic shielding effect.

[0044] In one possible implementation, a second metal layer is further disposed on the second side of the substrate. The second metal layer includes a third thick metal region and a third thin metal region, and a third transition region located at the boundary between the third thick metal region and the third thin metal region. The third thick metal region is opposite to the first thick metal region, the third thin metal region is opposite to the first thin metal region, and the third transition region is opposite to the first transition region. The coil module also includes a second wireless charging coil and a second high-speed signal line. The second wireless charging coil is located in the third thick metal region, and the second high-speed signal line is located in the third thin metal region. At least a portion of the second wireless charging coil is covered by a second nanocrystal.

[0045] This application provides an example of a module integrating double-sided high-speed signal lines and wireless charging coils. In some structures, the wireless charging coils on both sides can be electrically connected through conductive vias penetrating the substrate, and the high-speed signal lines on both sides can be electrically connected through conductive vias penetrating the substrate.

[0046] In one possible implementation, the coil module further includes a second trace, which includes at least one of a ground wire, a power wire, or a low-speed signal wire; the second trace is located in a third thick metal area, between the second wireless charging coil and the second high-speed signal wire; and a second edging extends above the second trace.

[0047] In one possible implementation, the second edging located above the second routing line has a dimension of d3 in the first direction, 0.1mm≤d3≤0.5mm, and the first direction is parallel to the width direction of the second edging.

[0048] For example, the overlap width of the second edge above the second wiring can be 0.2mm or 0.3mm.

[0049] In one feasible manner, a first metal layer is provided under a first effective region, and a second metal layer is provided under a second effective region; the orthographic projection of the first effective region onto the reference plane is a third projection, and the orthographic projection of the second effective region onto the reference plane is a fourth projection, wherein the third projection and the fourth projection do not overlap.

[0050] Since there is a metal layer under both the first and second effective regions, the projections of the first and second effective regions do not overlap, thus avoiding local overthickness of the coil module.

[0051] In one possible implementation, the first side of the substrate further includes: a metal-free region located around the first wireless charging coil; the orthographic projection of the first nanocrystal onto the metal-free region is a fifth projection, and the orthographic projection of the second nanocrystal onto the metal-free region is a sixth projection, with the fifth and sixth projections overlapping.

[0052] In the metal-free region, the projections of the two nanocrystals on opposite sides overlap, which helps to prevent magnetic leakage.

[0053] In one possible implementation, the first nanocrystal includes: a first effective region and a first edging, the first edging being disposed around the outer periphery of the first effective region; the overlap width of the fifth projection and the sixth projection in a first direction is S1, S1≥1.6mm, and the first direction is parallel to the width direction of the first edging.

[0054] In one possible implementation, the coil module further includes: a thick cover layer and a thin cover layer, and a connecting cover layer located at the junction of the thick cover layer and the thin cover layer; the thick cover layer is formed on a first thin metal region, the thin cover layer is formed on a first thick metal region, and the connecting cover layer is formed on a first transition region.

[0055] Covering high-speed signal lines with a thick covering layer can fill the gaps between lines with insulating dielectric material, preventing air bubbles in the covering layer or short circuits between lines; to ensure that the surface of the coil module is basically flat and that the thick metal area is not too thick, a thin covering layer can be applied to the thick metal area.

[0056] In one possible implementation, the first transition region includes an edge metal layer that protrudes relative to a first thick metal region, and a connecting cover layer on the edge metal layer protrudes to form a first protrusion; the connecting cover layer includes a stacked thick cover layer and a thin cover layer, and a connecting cover layer on the stacked thick cover layer and thin cover layer protrudes to form a second protrusion; the first protrusion is closer to the first thick metal region than the second protrusion.

[0057] In feasible processes, when preparing the metal layer in the transition region, the metal layer thickness is uneven due to the high current density. The metal layer in the thicker metal region will protrude. Thus, after covering with the cover layer, the connecting cover layer will protrude to form the first protrusion. In order to completely cover the transition region with the cover layer, the thick cover layer and the thin cover layer need to be stacked in some positions, which will form the second protrusion. This application sets the two protrusions separately to avoid local overthickness of the coil module.

[0058] In one possible implementation, the first nanocrystal extends above the first protrusion.

[0059] The first nanocrystal extends above the first protrusion, which can increase the area of ​​the first nanocrystal without locally making the coil module too thick, thereby reducing eddy current loss and suppressing magnetic interference to other signals.

[0060] In one possible implementation, the first protrusion and the second protrusion are spaced apart.

[0061] That is, the first protrusion and the second protrusion are staggered. This can avoid stress concentration. For example, when the gap area is a bending area, by reducing stress concentration, the performance of the coil module can be improved.

[0062] In one feasible approach, the edge metal layer is covered by a thin overlay.

[0063] In one possible implementation, the edge metal layer includes a first edge metal layer and a second edge metal layer, the second edge metal layer being located on the side of the first edge metal layer facing away from the substrate; the first edge metal layer protrudes toward the first thin metal region relative to the second edge metal layer.

[0064] In this implementation, the first edge metal layer and the second edge metal layer are staggered, which can reduce the height difference at the same location and alleviate stress concentration at a certain location.

[0065] In one possible implementation, the substrate includes a first substrate and a second substrate, which are disposed opposite to each other and connected by a connecting layer having a cavity; a first metal layer and a first nanocrystal are disposed on the side of the first substrate opposite to the second substrate; and a second nanocrystal is disposed on the side of the second substrate opposite to the first substrate.

[0066] This type of coil module can be used in folding devices, where the cavity allows the rotating shaft structure to pass through.

[0067] In one feasible approach, the cavity corresponds to the position of the first thin metal region.

[0068] Secondly, this application provides an electronic device that may include a processor and a coil module in any of the above implementations, wherein the coil module and the processor are connected.

[0069] The electronic device provided in this application integrates a wireless charging coil and a high-speed signal line into the same coil module. Placing the wireless charging coil in the thick metal region reduces wireless charging impedance and improves charging efficiency; placing the high-speed signal line in the thin metal region enables impedance control and ensures high-speed signal quality. Furthermore, a transition region is provided, which increases the distance between the wireless charging coil and the high-speed signal line, reducing magnetic field interference with the high-speed signal. The first nanocrystal in this electronic device can cover at least a portion of the periphery of the wireless charging coil and extend into the transition region. Thus, the first nanocrystal can shield the magnetic field, preventing magnetic field interference with surrounding signals, such as preventing magnetic field interference with high-speed signals located on one side of the transition region.

[0070] In one possible implementation, the electronic device may include a candybar electronic device or a foldable electronic device.

[0071] In one possible implementation, the electronic device includes a foldable electronic device, the foldable electronic device including a hinge structure; the substrate includes a first substrate and a second substrate, the first substrate and the second substrate being disposed opposite to each other, the first substrate and the second substrate being connected by a connecting layer having a cavity, the connecting layer having a cavity through which the hinge structure passes; a first metal layer and a first nanocrystal are disposed on the side of the first substrate opposite to the second substrate; a second nanocrystal is disposed on the side of the second substrate opposite to the first substrate.

[0072] Thirdly, this application provides a method for manufacturing a coil module, the method comprising:

[0073] A first metal layer is formed on a first side of the substrate. The first metal layer includes a first thick metal region and a first thin metal region, and a first transition region located at the junction of the first thick metal region and the first thin metal region.

[0074] The first metal layer is etched to form the first wireless charging coil and the first high-speed signal line, wherein the first wireless charging coil is located in the first thick metal region and the first high-speed signal line is located in the first thin metal region.

[0075] A first nanocrystal is disposed on the side of the first metal layer away from the substrate, at least a portion of the periphery of the first wireless charging coil is covered by the first nanocrystal, and the first nanocrystal extends to the first transition region.

[0076] A second nanocrystal is disposed on the other side of the substrate, and the projection of the second nanocrystal onto the first wireless charging coil covers at least a portion of the first wireless charging coil.

[0077] In the coil module fabricated using this method, integrating high-speed signal lines into a thin metal region enables impedance control, ensuring high-speed signal quality. Integrating the wireless charging coil into a thick metal region reduces wireless charging impedance and improves charging efficiency. Furthermore, utilizing nanocrystals extending into the transition region reduces magnetic field interference with high-speed signals, guaranteeing both high-speed signal quality and wireless charging efficiency.

[0078] In one feasible approach, when forming the first wireless charging coil in the first thick metal region, the following is also included:

[0079] A first trace is formed in a first thick metal region. The first trace is located between the first wireless charging coil and the first high-speed signal line. The first trace includes at least one of the following: a ground line, a power line, or a low-speed signal line. The power line may include a wired charging cable.

[0080] The first trace increases the distance between the wireless charging coil and the high-speed signal line, reducing interference from the coil's magnetic field on the high-speed signal. For example, the first trace includes a wired charging line, and the first nanocrystal covers at least a portion of the wired charging line, which can reduce eddy current losses of the coil's magnetic field on the wired charging line and improve wireless charging efficiency.

[0081] In one possible implementation, the first transition region includes a metal layer, and the first trace is located on the metal layer.

[0082] In one feasible approach, after forming the first wireless charging coil in the first thick metal region and before setting the first high-speed signal line in the first thin metal region, the fabrication method may further include:

[0083] A thick capping layer and a thin capping layer are formed, as well as a connecting capping layer located at the junction of the thick capping layer and the thin capping layer. The thick capping layer is formed on a first thin metal region, the thin capping layer is formed on a first thick metal region, and the connecting capping layer is formed on a first transition region.

[0084] The thin metal area includes high-speed signal lines. Covering these lines with a thick overlay allows the gaps between the lines to be filled with insulating material, preventing air bubbles in the overlay or short circuits between lines. To ensure a relatively flat surface for the coil module without making the thick metal area too thick, a thin overlay can be placed over it.

[0085] In one possible implementation, the first transition region includes a bulge that protrudes relative to the first thick metal region, and the first nanocrystal includes: a first effective region and a first edging, the first edging being disposed around the outer periphery of the first effective region; when the first nanocrystal is disposed, the first edging extends above the bulge.

[0086] The transition region has a convex hull. By placing the edge of the first nanocrystal above the convex hull, the area of ​​the first nanocrystal can be increased without the coil module becoming excessively thick in some areas, thereby reducing eddy current losses and suppressing magnetic interference to other signals.

[0087] In one feasible approach, the preparation method may further include, prior to setting the second nanocrystal:

[0088] A second metal layer is disposed on the other side of the substrate. The second metal layer includes a third thick metal region and a third thin metal region, as well as a third transition region located at the junction of the third thick metal region and the third thin metal region.

[0089] A second metal layer is etched to form a second wireless charging coil and a second high-speed signal line, as well as a second trace. The second trace includes at least one of a ground line, a power line, or a low-speed signal line. The second wireless charging coil and the second trace are located in a third thick metal region, the second high-speed signal line is located in a third thin metal region, and the second trace is located between the second wireless charging coil and the second high-speed signal line.

[0090] In one possible implementation, the second nanocrystal includes: a second effective region and a second edging, the second including being disposed around the periphery of the second effective region; when the second nanocrystal is disposed, the second edging extends above a second trace of a third thick metal region. Attached Figure Description

[0091] Figure 1 is a partial structural schematic diagram of a coil module provided in an embodiment of this application;

[0092] Figure 2 is a partial structural schematic diagram of a coil module provided in an embodiment of this application;

[0093] Figure 3 is a front view of a coil module provided in an embodiment of this application;

[0094] Figure 4 is a rear view of a coil module provided in an embodiment of this application;

[0095] Figure 5 is a side view of a coil module provided in an embodiment of this application;

[0096] Figure 6 is a diagram showing the layout of the wireless charging coil, high-speed signal line and wired charging cable in the coil module provided in the embodiment of this application;

[0097] Figure 7A is a diagram showing the layout of the wireless charging coil, high-speed signal line and wired charging cable in the coil module provided in the embodiment of this application;

[0098] Figure 7B is a diagram showing the layout of the wireless charging coil, high-speed signal line and wired charging cable in the coil module provided in the embodiment of this application.

[0099] Figure 8 is a diagram showing the layout of the wireless charging coil, high-speed signal line and wired charging cable in the coil module provided in the embodiment of this application;

[0100] Figure 9 is a diagram showing the layout of the wireless charging coil, high-speed signal line and wired charging cable in the coil module provided in the embodiment of this application;

[0101] Figure 10 is a diagram showing the layout of the wireless charging coil, high-speed signal line and wired charging cable in the coil module provided in the embodiment of this application;

[0102] Figure 11 is a partial structural schematic diagram of a coil module provided in an embodiment of this application;

[0103] Figure 12 is a partial structural schematic diagram of a coil module provided in an embodiment of this application;

[0104] Figure 13 is a partial structural schematic diagram of a coil module provided in an embodiment of this application;

[0105] Figure 14 is a flowchart of a method for preparing a coil module according to an embodiment of this application;

[0106] Figures 15A to 15F are schematic diagrams of the structure after each step is completed in the manufacturing process of a coil module provided in the embodiments of this application.

[0107] Figures 16A to 16G are schematic diagrams of the structure after each step is completed in the manufacturing process of a coil module provided in the embodiments of this application.

[0108] Figure 17 is a schematic diagram of the structure of a first nanocrystal provided in an embodiment of this application;

[0109] Figure 18 is a cross-sectional view AA of Figure 17;

[0110] Figure 19 is a schematic diagram of the structure of a second nanocrystal provided in an embodiment of this application;

[0111] Figure 20 is a BB cross-sectional view of Figure 19;

[0112] Figure 21 is a front view of a coil module provided in an embodiment of this application;

[0113] Figure 22 is a CC cross-sectional view of Figure 21;

[0114] Figure 23 is a partial structural schematic diagram of a coil module provided in an embodiment of this application;

[0115] Figure 24 is a rear view of a coil module provided in an embodiment of this application;

[0116] Figure 25 is a DD cross-sectional view of Figure 24;

[0117] Figure 26 is a partial structural schematic diagram of a coil module provided in an embodiment of this application;

[0118] Figure 27 is a partial structural schematic diagram of a coil module provided in an embodiment of this application;

[0119] Figure 28 is a partial structural schematic diagram of a coil module provided in an embodiment of this application;

[0120] Figure 29 is a partial structural schematic diagram of a coil module provided in an embodiment of this application. Detailed Implementation

[0121] The solutions involved in the embodiments of this application will be described below with reference to the accompanying drawings.

[0122] This application provides an electronic device that may include a mobile phone, tablet computer, smart wearable products (e.g., smartwatches, smart bracelets), virtual reality (VR) devices, augmented reality (AR) devices, drones, or other terminal devices, or it may be a base station, television, router, automobile, or other devices. This application does not impose any special limitations on the specific form of the aforementioned electronic device.

[0123] Electronic devices such as those described above may have wireless charging capabilities, wired charging capabilities, and the ability to transmit high-speed signals.

[0124] In some examples, such as in digital circuits, when the transmission path length of a digital signal is greater than 1 / 6 of the wavelength of the transmitted signal, the signal can be considered a high-speed signal.

[0125] Common high-speed signal interface protocols include Universal Serial Bus (USB), Mobile Industry Processor Interface (MIPI), Double Data Rate SDRAM (DDR), PCI Express (PCIe), and High Definition Multimedia Interface (HDMI).

[0126] Signal lines can include high-speed signal lines and low-speed signal lines. Signal lines other than high-speed signal lines can be called low-speed signal lines.

[0127] As the internal structure and electronic components of electronic devices become increasingly integrated, challenges arise in the deployment of wireless charging coils and high-speed signal lines, as high-speed signal lines are easily affected by magnetic interference from wireless charging coils, thus impacting signal quality.

[0128] This application provides a coil module that integrates a wireless charging coil and a high-speed signal line. This not only integrates the wireless charging coil circuit board and the high-speed signal circuit board into a single circuit board, reducing the number of circuit boards and achieving miniaturization, but also ensures wireless charging efficiency and reduces the risk of magnetic interference to the high-speed signal from the wireless charging coil.

[0129] Figure 1 illustrates an exemplary cross-sectional view of a coil module. As shown in Figure 1, the coil module includes a substrate having opposing first and second sides. On the first side, a first metal layer is included. The first metal layer may be a single layer of metal or may include multiple stacked metal layers. For example, in the example of Figure 1, the first metal layer includes multiple stacked metal layers.

[0130] In some examples, as shown in Figure 1, the first metal layer can be directly disposed on the surface of the substrate. Alternatively, in other examples, other film structures can be disposed between the substrate and the first metal layer.

[0131] As shown in Figure 1, the first metal layer includes a first thick metal region and a first thin metal region, as well as a first transition region located at the boundary between the first thick metal region and the first thin metal region. The thickness H1 of the metal layer in the first thick metal region is greater than the thickness H2 of the metal layer in the first thin metal region.

[0132] In some examples, see Figure 1, the first transition region may include a metal layer.

[0133] As shown in Figures 2, 3, 4, and 5, Figure 2 exemplarily shows a cross-sectional view of another coil module, Figure 3 exemplarily shows a front view of the coil module, Figure 4 exemplarily shows a rear view of the coil module, and Figure 5 exemplarily shows a side view of the coil module. It can be understood that Figure 3 is a view along the M1 direction of Figure 5, and Figure 4 is a view along the M2 direction of Figure 5.

[0134] As shown in Figure 2, the coil module includes a substrate, a first metal layer on a first side of the substrate, and a second metal layer on a second side of the substrate. That is, metal layers are provided on both opposite sides of the substrate.

[0135] Either the first metal layer or the second metal layer may be a single layer of metal, or may include multiple stacked metal layers. For example, in the example of Figure 2, either the first metal layer or the second metal layer may include multiple stacked metal layers.

[0136] As shown in Figure 2, the first metal layer includes a first thick metal region and a first thin metal region, as well as a first transition region located at the boundary between the first thick metal region and the first thin metal region.

[0137] The thickness H1 of the metal layer in the first thick metal region is greater than the thickness H2 of the metal layer in the first thin metal region.

[0138] The second metal layer includes a third thick metal region and a third thin metal region, as well as a third transition region located at the boundary between the third thick metal region and the third thin metal region.

[0139] The thickness H1 of the metal layer in the third thick metal region is greater than the thickness H2 of the metal layer in the third thin metal region.

[0140] In some examples, the third thick metal region is opposite to the first thick metal region, the third thin metal region is opposite to the first thin metal region, and the third transition region is opposite to the first transition region.

[0141] In some examples, as shown in Figure 2, the third transition region may include a metal layer.

[0142] As shown in Figure 1, in the first metal layer, the first thick metal region includes the first wireless charging coil, and the first thin metal region includes the first high-speed signal line; or, as shown in Figure 2, in the first metal layer, the first thick metal region includes the first wireless charging coil, the first thin metal region includes the first high-speed signal line, and in the second metal layer, the third thick metal region includes the second wireless charging coil, and the third thin metal region includes the second high-speed signal line. That is, in the coil module of this application example, the wireless charging coil is disposed in the thick metal region, the high-speed signal line is disposed in the thin metal region, and the wireless charging coil and the high-speed signal line are separated by a transition region.

[0143] This can be understood as follows: In the coil module provided in this application, the metal layer thickness requirements for each signal are met in different regions. For example, high-speed signals are placed in the thin metal region, and impedance control can be achieved using the thin metal, thus improving the quality of high-speed signals. The wireless charging coil is placed in the thick metal region, which can reduce the wireless charging impedance and improve the wireless charging efficiency. In addition, by using the transition region located between the high-speed signal line and the wireless charging coil, the distance between the high-speed signal line and the wireless charging coil is increased, which can weaken the interference of the magnetic field on the high-speed signal and improve the quality of the high-speed signal.

[0144] In some examples, conductive vias can be provided in the substrate. A first conductive via is used to electrically connect a first wireless charging coil in a first metal layer and a second wireless charging coil in a second metal layer. A second conductive via is used to electrically connect a first high-speed signal line in the first metal layer and a second high-speed signal line in the second metal layer.

[0145] Continuing with Figure 1, the coil module of this application example may further include a first nanocrystal and a second nanocrystal. The first nanocrystal and the first metal layer are located on a first side of the substrate. The first nanocrystal is disposed on the side of the first metal layer opposite to the substrate, and the second nanocrystal is located on a second side of the substrate.

[0146] As shown in Figure 1, at least a portion of the periphery of the first wireless charging coil is covered by first nanocrystals in the first metal layer. The projection of second nanocrystals onto the first wireless charging coil covers at least a portion of the first wireless charging coil.

[0147] In the examples of Figures 2 to 5, the coil module of this application example may further include a first nanocrystal and a second nanocrystal. The first nanocrystal and the first metal layer are located on a first side of the substrate. The first nanocrystal is disposed on the side of the first metal layer away from the substrate. The second nanocrystal and the second metal layer are located on a second side of the substrate. The second nanocrystal is disposed on the side of the second metal layer away from the substrate.

[0148] As shown in Figure 3, at least a portion of the periphery of the first wireless charging coil in the first metal layer is covered by first nanocrystals.

[0149] As shown in Figure 4, at least a portion of the second wireless charging coil is covered by second nanocrystals in the second metal layer. Alternatively, the second nanocrystals may completely cover the second wireless charging coil.

[0150] For example, in electronic devices, the first nanocrystal is positioned near the back cover, while the second nanocrystal is positioned near the display screen. The second nanocrystal is used to concentrate the magnetic field, improving wireless charging efficiency, while the first nanocrystal can shield the magnetic field, preventing it from interfering with surrounding signals. For instance, it can prevent magnetic fields from interfering with the quality of high-speed signals, and also reduce eddy current losses in the coil's magnetic field on the wired charging cable, thus improving wireless charging efficiency.

[0151] Referring to Figures 1 and 2, the first nanocrystal in this application example can extend above the first transition region. Since the first high-speed signal line is located on one side of the first transition region, the nanocrystal extending above the first transition region can suppress interference from the coil magnetic field on the high-speed signal and improve the quality of the high-speed signal.

[0152] In some examples, the substrate in the coil module can be made of a flexible material, such as polyimide (PI) or polyethylene terephthalate (PET). Such a coil module can also be referred to as an FPC containing a wireless charging coil and high-speed signal lines.

[0153] This application integrates the wireless charging coil and high-speed signal line into a single FPC, saving space and reducing overall system footprint. Furthermore, the wireless charging coil and high-speed signal can guarantee their respective signal quality, effectively suppressing mutual interference, and simplifying the number of FPCs, thus reducing assembly costs.

[0154] The coil module provided in this application embodiment can be electrically connected to a processor, which is used to process the data of the coil module.

[0155] In this application example, other traces can also be integrated into the coil module. For example, the trace can include at least one of a ground wire, a power wire, or a low-speed signal wire. For instance, the power wire can include a wired charging cable.

[0156] This integrates the wireless charging coil, high-speed signal lines, and other traces (such as at least one of ground lines, power lines, and low-speed signal lines) into a single module, further improving integration and saving space.

[0157] This application uses a wired charging cable as an example, integrating the wired charging cable into the coil module. In other examples, the ground wire and power wire (such as the wired charging cable) can also be integrated into the coil module, or the ground wire and low-speed signal wire can be integrated into the coil module, or the ground wire, power wire, and low-speed signal wire can all be integrated into the coil module.

[0158] There are several ways to deploy wireless charging coils, high-speed signal lines, and wired charging cables, some of which are exemplified below.

[0159] See Figure 6, which exemplarily illustrates one arrangement of the wireless charging coil, high-speed signal line, and wired charging cable. The first wired charging cable and the first wireless charging coil are located in the first thick metal region, with the first wireless charging coil being further away from the first high-speed signal line than the first wired charging cable; the first high-speed signal line is located in the first thin metal region.

[0160] In other words, the wired charging cable and the wireless charging coil can be laid out in the thick metal area, with the wired charging cable located between the wireless charging coil and the high-speed signal line. In this way, the distance between the wireless charging coil and the high-speed signal line can be further increased by using the wired charging cable, which can improve the quality of the high-speed signal.

[0161] Integrating the wired charging cable into the thick metal area effectively reduces wired charging impedance and improves wired charging efficiency.

[0162] The first nanocrystal extends from the periphery of the first wireless charging coil, covering at least a portion of the first wired charging cable and extending into a first transition region. In some examples, the first nanocrystal may cover the entire first wired charging cable.

[0163] Since the first nanocrystal covers at least a portion of the first wired charging line, it can reduce eddy current losses in the coil magnetic field on the first wired charging line and improve wireless charging efficiency.

[0164] In some examples, as shown in Figure 6, the first wired charging line is also located in the first transition region. This makes full use of the transition region space. The copper thickness in the transition region is uneven, making it unsuitable for networks with strict requirements on line width, copper thickness stability, and signal integrity, such as high-speed signal networks. However, it can be used for networks with less stringent requirements on line width and copper thickness stability, such as wired charging lines. This maximizes the copper area of ​​the wired charging circuit, fully utilizes the plane space of the transition region to make the traces wider, and effectively reduces the wired charging impedance.

[0165] In the example of Figure 6, the first nanocrystal covers the first wired charging line close to the first wireless charging coil. The first nanocrystal is small in size and has a low manufacturing cost.

[0166] In some examples, the line width of the first wired charging cable located in the first thick metal region may be different from or the same as the line width of the first wired charging cable located in the first transition region. The line thickness of the first wired charging cable located in the first thick metal region may be different from or the same as the line thickness of the first wired charging cable located in the first transition region.

[0167] See Figures 7A and 7B, which exemplarily illustrate another arrangement of the wireless charging coil, high-speed signal line, and wired charging cable. The first metal layer includes a first thick metal region and a first thin metal region, and a first transition region located at the boundary between the first thick metal region and the first thin metal region. Additionally, it includes a second thick metal region and a second transition region, the second transition region being located at the boundary between the second thick metal region and the first thin metal region.

[0168] Alternatively, the second metal layer may include a fourth thick metal region and a fifth transition region, with the fifth transition region located at the boundary between the fourth thick metal region and the third thin metal region. For example, the fourth thick metal region may be located on the side of the third thin metal region away from the third thick metal region.

[0169] The first wireless charging coil is located in the first thick metal region, the first high-speed signal line is located in the first thin metal region, and the first wired charging cable is located in the second thick metal region. That is, the wired charging cable is laid in another thick metal region, and a second transition region is used to separate the second thick metal region from the first thin metal region.

[0170] In some examples, as shown in Figures 7A and 7B, the first wired charging cable may also be located in the second transition zone.

[0171] To ensure high-speed signal quality, as shown in Figure 7A, the first nanocrystal extends from the periphery of the first wireless charging coil and can cover at least a portion of the first transition region and at least a portion of the first thin metal region having the first high-speed signal line.

[0172] In other examples, as shown in Figure 7B, a first nanocrystal extends from the periphery of the first wireless charging coil, covering at least a portion of the first transition region and at least a portion of the first thin metal region having the first high-speed signal line, as well as at least a portion of the second transition region and at least a portion of the second thick metal region. This reduces eddy current losses in the coil's magnetic field on the wired charging line, thereby improving wireless charging efficiency.

[0173] See Figure 8, which exemplarily illustrates another arrangement of the wireless charging coil, high-speed signal line, and wired charging cable. The first wired charging cable and the first wireless charging coil are located in the first thick metal area, while the first high-speed signal line is located in the first thin metal area. The first wired charging cable is further away from the first high-speed signal line than the first wireless charging coil. This can be understood as the first wireless charging coil being located between the first wired charging cable and the first high-speed signal line.

[0174] In this example, the wireless charging coil and the wired charging cable are integrated into the same thick metal area, so that the high-speed signal line and the wired charging cable are located on both sides of the wireless charging coil.

[0175] In the example shown in Figure 8, the first nanocrystal extends from the periphery of the first wireless charging coil and can cover at least a portion of the first transition region and at least a portion of the first thin metal region. This can reduce the interference of the coil's magnetic field on high-speed signals and ensure the quality of high-speed signals.

[0176] As shown in Figure 8, the first nanocrystal extends from the periphery of the first wireless charging coil and can also cover at least a portion of the first wired charging line, which can reduce the eddy current loss of the coil magnetic field on the adjacent wired charging line.

[0177] See Figure 9, which exemplarily illustrates another arrangement of the wireless charging coil, high-speed signal line, and wired charging cable. The first wireless charging coil is located in the first thick metal area, and the first high-speed signal line and the first wired charging cable are located in the first thin metal area. The first wired charging cable is further away from the first wireless charging coil than the first high-speed signal line; that is, the first high-speed signal line is located between the first wired charging cable and the first wireless charging coil.

[0178] The high-speed signal line and the wired charging line are integrated into the same thin metal area. The high-speed signal line is located between the wireless charging coil and the wired charging line.

[0179] In this example, the first nanocrystal extends from the periphery of the wireless first charging coil and can cover at least a portion of the first transition region, at least a portion of the first high-speed signal line, and at least a portion of the first wired charging line. This reduces interference from the magnetic field on the high-speed signal, ensuring high-speed signal quality; it also reduces eddy current losses on the wired charging copper layer, improving wireless charging efficiency.

[0180] See Figure 10, which exemplarily illustrates another arrangement of the wireless charging coil, high-speed signal line, and wired charging cable. The first wireless charging coil is located in the first thick metal area, and the first high-speed signal line and the first wired charging cable are located in the first thin metal area. The first high-speed signal line is further away from the first wireless charging coil than the first wired charging cable; that is, the first wired charging cable is located between the first high-speed signal line and the first wireless charging coil.

[0181] The high-speed signal line and the wired charging cable are integrated into the same thin metal area. The wired charging cable is located between the high-speed signal line and the wireless charging coil.

[0182] In this example, the first nanocrystal extends from the periphery of the first wireless charging coil and can cover at least a portion of the first transition region, at least a portion of the first wired charging line, and at least a portion of the first high-speed signal line. This reduces interference from the magnetic field on the high-speed signal, ensuring high-speed signal quality; it also reduces eddy current losses on the wired charging copper foil, improving wireless charging efficiency.

[0183] As shown in Figure 11, the coil module provided in this application may further include a thick cover layer, a thin cover layer, and a connecting cover layer, with the connecting cover layer located at the boundary between the thick cover layer and the thin cover layer. The thick cover layer is formed on a first thin metal region, the thin cover layer is formed on a first thick metal region, and the connecting cover layer is formed on a first transition region.

[0184] The thickness h2 of the thicker capping layer is greater than the thickness h1 of the thinner capping layer. For example, the thickness h2 of the thicker capping layer can be greater than or equal to 0.7 times the thickness of the thinner metal layer.

[0185] Among the selectable materials, the thick cover layer, thin cover layer, and connecting cover layer may include an insulating substrate and an adhesive, wherein the insulating substrate may be polyimide (PI) or polyethylene terephthalate (PET).

[0186] These coverings can be used to prevent contamination, soldering, and fill circuits to prevent short circuits between signals.

[0187] In this application example, the high-speed signal line is placed in the thin metal area, and a thick covering layer as shown in Figure 11 can be placed on the high-speed signal line.

[0188] As shown in Figure 11, a thin covering layer can be applied to the first thick metal area containing the first wireless charging coil, thereby reducing the thickness of the entire coil module in the thick metal area and ensuring that the coil module FPC is not excessively thick in the thick metal area. This makes the surface of the entire coil module relatively flat.

[0189] Figure 12 exemplarily illustrates a cross-sectional view of one possible structure of a coil module, and shows a portion of the structure of the coil module. Figure 12 shows a first thick metal region and a first thin metal region, as well as a first transition region located at the boundary between the first thick metal region and the first thin metal region, and also shows a thick cover layer, a thin cover layer, and a connecting cover layer.

[0190] In Figure 12, a metal layer is present in the first transition region, near the location of the first thick metal region.

[0191] In feasible processes, a metal layer can be manufactured from the first transition zone to the first thick metal zone. For example, an electroplating process can be used to prepare the metal layer. Due to the edge effect, the current density is relatively large. When electroplating metal in the first transition zone, a protruding metal layer as shown in Figure 12 can be obtained in the first transition zone. This metal layer can be called an edge metal layer. The surface of the edge metal layer protrudes compared to the surface of the thick metal zone. In this way, the connecting cover layer located on the edge metal layer protrudes to form a first protrusion.

[0192] In some feasible structures, the width of the first transition zone in the example of Figure 12 can be from 0.5 mm to 4 mm, and the width of the edge metal layer can be from 0.2 mm to 2 mm.

[0193] The width dimensions of the first transition region and the width dimensions of the edge metal layer can be understood as follows: the first thin metal region, the first transition region and the first thick metal region are arranged along the first direction, and the width dimensions of the first transition region and the edge metal layer are both dimensions along the first direction, as shown in Figure 12. The first thin metal region, the first transition region and the first thick metal region are arranged along the L direction, and the width dimensions of the first transition region and the edge metal layer are both dimensions along the L direction.

[0194] In some manufacturing processes, when a thick coating layer is applied over a first thin metal region, a thick coating layer can be applied over a first transition region; when a thin coating layer is applied over a first thick metal region, a thin coating layer can be applied over a first transition region.

[0195] As shown in Figure 12, in order to ensure that the first transition area is completely covered by the covering layer, thick and thin covering layers can be stacked at certain locations in the first transition area. This forms a second protrusion as shown in Figure 12, where the thick and thin covering layers are stacked. Thus, as shown in Figure 12, a first protrusion and a second protrusion can be formed on the surface of the coil module at locations corresponding to the first transition area.

[0196] In some examples, the width of the second protrusion can be between 0.2 mm and 1.5 mm. In this example, the width of the second protrusion is along the L direction.

[0197] To prevent localized excessive thickness in the coil module, in some examples, such as Figure 12, the first and second protrusions are spaced apart, which can be understood as having a gap between them. This not only prevents localized excessive thickness in the coil module but also avoids stress concentration and improves the bendability of the coil module.

[0198] In some feasible structures, the width of the gap between the first protrusion and the second protrusion can be from 0.1 mm to 1.5 mm. In this example, the width of the gap is along the L direction.

[0199] Continuing with Figure 12, in some implementations, the first protrusion is closer to the first thick metal region than the second protrusion.

[0200] In some structures, as shown in Figure 12, the surface of the second protrusion is more convex than the surface of the first protrusion. Alternatively, the surface of the first protrusion is more convex than the surface of the second protrusion.

[0201] See Figures 12 and 13. The edge metal layer includes a stacked first edge metal layer and a second edge metal layer. The second edge metal layer is located on the side of the first edge metal layer away from the substrate. The first edge metal layer protrudes towards the first thin metal region compared to the second edge metal layer.

[0202] This can be understood as follows: along the stacking direction of the first and second edge metal layers, i.e., the thickness direction of the coil module, the second edge metal layer is recessed towards the thicker metal area compared to the first edge metal layer. This reduces the height difference at the same location, alleviating stress concentration at that location.

[0203] Figures 12 and 13 exemplarily illustrate how a thick cover layer, a thin cover layer, and a connecting cover layer are disposed on a first metal layer on one side of the substrate. In some examples, a second metal layer located on the other side of the substrate may also be configured with a thick cover layer, a thin cover layer, and a connecting cover layer, as illustrated in Figures 12 and 13.

[0204] In the above example, the area where the first wired charging cable is laid can also be used to lay other first traces. For example, the first traces may include at least one of ground wire, power line, or low-speed signal line.

[0205] The following exemplarily provides a method for manufacturing a coil module. The coil module prepared by this method can not only ensure wireless charging efficiency, but also reduce the risk of high-speed signals being affected by magnetic interference from the wireless charging coil.

[0206] Figure 14 is a process flow diagram of a coil module manufacturing method according to an embodiment of this application. The steps are as follows:

[0207] Step 1: A first metal layer is formed on the first side of the substrate. The first metal layer includes a first thick metal region and a first thin metal region, as well as a first transition region located at the junction of the first thick metal region and the first thin metal region.

[0208] Step 2: Etch the first metal layer to obtain the first wireless charging coil and the first high-speed signal line, wherein the first wireless charging coil is located in the first thick metal region and the first high-speed signal line is located in the first thin metal region.

[0209] Step 3: A first nanocrystal is disposed on the side of the first metal layer away from the substrate, at least a portion of the periphery of the first wireless charging coil is covered by the first nanocrystal, and the first nanocrystal extends to the first transition region.

[0210] Step 4: Place a second nanocrystal on the other side of the substrate, the projection of the second nanocrystal onto the first wireless charging coil covering at least a portion of the first wireless charging coil.

[0211] In some processes, steps 3 and 4 can be interchanged or performed simultaneously. For example, the second nanocrystal can be set first, followed by the first nanocrystal; or the first and second nanocrystals can be set simultaneously.

[0212] In one feasible approach, when forming the first wireless charging coil in the first thick metal region, the following is also included:

[0213] A first trace is formed in a first thick metal area. The first trace is located between the first wireless charging coil and the first high-speed signal line. The first trace includes at least one of the following: a ground line, a power line, or a low-speed signal line.

[0214] In some structures, the first transition region includes a metal layer, and the first trace is located in the metal layer.

[0215] In one feasible approach, the preparation method may further include, prior to setting the second nanocrystal:

[0216] A second metal layer is disposed on the other side of the substrate. The second metal layer includes a third thick metal region and a third thin metal region, as well as a third transition region located at the junction of the third thick metal region and the third thin metal region.

[0217] The second metal layer is etched to form a second wireless charging coil and a second high-speed signal line, as well as a second trace. The second wireless charging coil and the second wired charging line are located in a third thick metal region, the second high-speed signal line is located in a third thin metal region, and the second trace is located between the second wireless charging coil and the second high-speed signal line. The second trace includes at least one of a ground line, a power line, or a low-speed signal line.

[0218] In one possible implementation, the second nanocrystal includes: a second effective region and a second edging, the second including being disposed around the periphery of the second effective region; when the second nanocrystal is disposed, the second edging extends above a second trace of a third thick metal region.

[0219] In one possible implementation, the first transition region includes a convex hull that protrudes relative to the first thick metal region, and the first nanocrystal includes a first effective region and a first edging edge, the first edging edge being disposed around the outer periphery of the first effective region; when the first nanocrystal is disposed, the first edging edge extends above the convex hull.

[0220] The following describes in detail the process steps of a substrate comprising a first metal layer and a second metal layer, which can be implemented in the following ways.

[0221] Figures 15A to 15F show one implementation method, and the process structure diagrams corresponding to the completion of each process step are shown in Figures 15A to 15F.

[0222] As shown in Figure 15A, a flexible copper clad laminate (FCCL) is obtained. This flexible copper clad laminate can be a double-sided flexible copper clad laminate. For example, as shown in Figure 15A, the double-sided flexible copper clad laminate includes a substrate and substrates disposed on both sides of the substrate. The substrate can be polyimide (PI), and the substrate can be Cu.

[0223] For example, the thickness of the substrate Cu on each side can be 12 μm.

[0224] As shown in Figure 15B, metal is plated onto the entire substrate. For example, Cu is plated onto the entire board, which increases the overall Cu thickness of the board.

[0225] As shown in Figure 15C, Cu is locally electroplated in the transition region and the area used to form the wireless charging coil. This creates a thin copper region with a relatively thin copper layer, a thick copper region with a relatively thick copper layer, and a transition region between the thin and thick copper regions.

[0226] In some processes, Cu can be locally electroplated from the transition zone shown in Figure 15C to the thick copper zone. Due to the edge effect, the current density is relatively large. When electroplating Cu in the transition zone, a protruding Cu layer as shown in Figure 15C can be obtained in the transition zone.

[0227] In some feasible processes, the copper thickness H1 of the thick copper region in the example of Figure 15C is 35 μm to 65 μm. The copper thickness H2 of the thin copper region is 12 μm to 30 μm.

[0228] Because high-speed signal lines require impedance control, the copper thickness on one side can be less than or equal to 30µm; otherwise, the impedance will be too low. To ensure wireless charging power, the copper thickness on one side must be at least 35µm. This application can achieve the different copper thickness requirements for the two signals through local electroplating technology.

[0229] As shown in Figure 15D, the wireless charging coil is etched in the thick copper area, and the high-speed signal line is etched in the thin copper area.

[0230] In some examples, as shown in Figure 15D1, the thick copper area includes the wireless charging coil, and the thin copper area includes the high-speed signal line.

[0231] In other examples, as shown in Figure 15D2, the thick copper area includes the wireless charging coil and the wired charging cable, the transition area includes the wired charging cable, and the thin copper area includes the high-speed signal line.

[0232] As shown in Figure 15D2, a gap can be set between the wired charging cable and the wireless charging coil. In some examples, the gap between the wired charging cable and the wireless charging coil can be 0.1 mm to 1 mm.

[0233] As shown in Figure 15E, a thick cover layer is set on the thin copper area, a thin cover layer is set on the thick copper area, and a connection cover layer is set on the transition area.

[0234] In one process, when a thick capping layer is applied to a thin copper area, a thick capping layer can be applied to the transition area; when a thin capping layer is applied to a thick copper area, a thin capping layer can be applied to the transition area.

[0235] To ensure that the transition area is completely covered by the overlay layer, thick and thin overlay layers can be stacked at certain locations within the transition area. For example, in Figure 15E, thin overlay layers are stacked on top of thick overlay layers at certain locations within the transition area; or, in other examples, thick overlay layers are stacked on top of thin overlay layers.

[0236] For example, a thick overlay layer with a total thickness of about 25um to 50um can be applied to the thin copper area, and a thin overlay layer with a total thickness of about 10um to 25um can be applied to the thick copper area, thereby reducing the thickness of the thick copper area and making the surface of the coil module relatively flat.

[0237] As shown in Figure 15F, a first nanocrystal and a second nanocrystal are provided. At least a portion of the periphery of the wireless charging coil is covered by the first nanocrystal, and the first nanocrystal extends above the transition region. At least a portion of the wireless charging coil is covered by the second nanocrystal.

[0238] In this way, the first nanocrystal can shield the magnetic field, preventing it from interfering with surrounding signals, such as high-speed signals located on the transition region side. The second nanocrystal is used to concentrate the magnetic field, improving wireless charging efficiency.

[0239] The coil modules made using Figures 15A to 15F can be applied in candybar electronic devices, such as candybar mobile phones and candybar tablets.

[0240] Table 1 below is an embodiment provided in this application, which illustrates the materials used and thickness dimensions in each process step shown in Figures 15A to 15F.

[0241] Table 1

[0242] See Table 1 above. Table 1 shows the thin copper area, thick copper area, and transition area, as well as the thin and thick capping layers, formed on opposite sides of the flexible copper clad laminate. The structures on the two sides are symmetrically arranged.

[0243] The flexible copper-clad laminate illustrated in this application uses an adhesive-free substrate copper-clad laminate as an example. However, actual flexible copper-clad laminates can also be adhesive-based. Adhesive-based copper-clad laminates include sequentially stacked metal foils, adhesive, and an insulating base film; adhesive-free substrate copper-clad laminates include stacked metal foils and an insulating base film. In other examples, the flexible copper-clad laminate may also have other structures.

[0244] In the example of this application, as shown in Table 1, the materials of both the thin and thick capping layers include polyimide (PI) and adhesive (AD). The thickness of the capping layer can be increased by increasing the thickness of the adhesive. For example, in the thin capping layer, the thickness of the adhesive can be 5-15 μm, and in the thick capping layer, the thickness of the adhesive can be 15-33 μm.

[0245] When a thick overlay is placed in a thin copper area, a thick overlay can be placed in the transition area; when a thin overlay is placed in a thick copper area, a thin overlay can be placed in the transition area. Some locations in the transition area include stacked thick and thin overlays.

[0246] The process steps shown in Figure 14 above are implemented in another way, as shown in Figures 16A to 16G, and Figures 16A to 16G show the corresponding process structure diagram after each process step is completed.

[0247] As shown in Figure 16A, the first flexible copper-clad laminate and the second flexible copper-clad laminate are obtained.

[0248] The first and second flexible copper-clad laminates in this application can be copper-clad laminates with adhesive substrates or copper-clad laminates without adhesive substrates. For example, Figure 16A illustrates a copper-clad laminate without adhesive substrates.

[0249] The first and second flexible copper-clad laminates can be single-sided flexible copper-clad laminates. For example, as shown in Figure 16A, a single-sided flexible copper-clad laminate includes a substrate and a base material disposed on one side of the substrate. The substrate can be polyimide (PI), and the base material can be a Cu substrate.

[0250] As shown in Figure 16B, the first flexible copper-clad laminate and the second flexible copper-clad laminate are connected by a connecting layer. For example, the substrate of the first flexible copper-clad laminate substrate is connected to the substrate of the second flexible copper-clad laminate substrate through the connecting layer. For example, this connecting layer can be an adhesive layer, such as a polymeric insulating adhesive (booding sheet).

[0251] If the coil module of this application example is applied in a foldable electronic device, such as a foldable mobile phone, as shown in Figure 16B, a cavity can be opened in the connecting layer. This cavity can be set in the area passing through the pivot structure in order to improve the bending performance at this point and facilitate passing through the pivot structure.

[0252] As shown in Figure 16C, metal is plated onto the entire substrate. For example, Cu is plated onto the entire board, which increases the overall Cu thickness of the board.

[0253] As shown in Figure 16D, Cu is locally electroplated in the transition region and the area used to form the wireless charging coil. This creates a thin copper region with a relatively thin copper layer, a thick copper region with a relatively thick copper layer, and a transition region between the thin and thick copper regions.

[0254] In some processes, Cu can be locally electroplated from the transition zone shown in Figure 16D to the thick copper zone. Due to the edge effect, the current density is relatively large. When electroplating Cu in the transition zone, a protruding Cu layer as shown in Figure 16D can be obtained in the transition zone.

[0255] In some feasible processes, the copper thickness H1 of the thick copper region in the example of Figure 16D is 35 μm to 60 μm. The copper thickness H2 of the thin copper region is 12 μm to 30 μm.

[0256] In some examples, as shown in Example 16D, the cavity for the shaft structure to pass through can correspond to the location of the thin copper area. Because the thin copper area is relatively thin and has high flexibility, placing the cavity for the shaft structure to pass through at this location makes it easier for the shaft structure to pass through.

[0257] In other examples, the cavity through which the shaft structure passes may correspond to a thick copper region or a transition region.

[0258] As shown in Figure 16E, the wireless charging coil is etched in the thick copper area, and the high-speed signal line is etched in the thin copper area.

[0259] In some examples, such as Figure 16E, wireless charging coils and wired charging lines can be etched in the thick copper area, with the wired charging lines closer to the transition area. High-speed signal lines can also be etched in the thin copper area, and wired charging lines can also be formed in the transition area.

[0260] As shown in Figure 16F, a thick cover layer is set on the thin copper area, a thin cover layer is set on the thick copper area, and a connection cover layer is set on the transition area.

[0261] In one process, when a thick capping layer is applied to a thin copper area, a thick capping layer can be applied to the transition area; when a thin capping layer is applied to a thick copper area, a thin capping layer can be applied to the transition area.

[0262] To ensure that the transition area is completely covered by the overlay, thick and thin overlays can be stacked at certain locations within the transition area.

[0263] For example, a thick overlay layer with a total thickness of about 25um to 50um can be applied to the thin copper area, and a thin overlay layer with a total thickness of about 10um to 25um can be applied to the thick copper area, thereby reducing the thickness of the thick copper area and making the surface of the coil module relatively flat.

[0264] As shown in Figure 16G, a first nanocrystal and a second nanocrystal are provided. At least a portion of the periphery of the wireless charging coil is covered by the first nanocrystal, and the first nanocrystal extends above the transition region. At least a portion of the wireless charging coil is covered by the second nanocrystal.

[0265] The first and second nanocrystals in this application have a variety of achievable structures.

[0266] See Figures 17 and 18. Figure 17 exemplarily shows a front view of the first nanocrystal, and Figure 18 is a cross-sectional view (AA) of Figure 17. In this example, the first nanocrystal includes a first effective region and a first edging. The first edging is disposed around the outer periphery of the first effective region, as shown in Figure 18. The thickness of the first effective region (dimension along the P direction) is greater than the thickness of the first edging (dimension along the P direction).

[0267] For example, the thickness of the first effective region is about 90 μm, and the thickness of the first edge can be less than or equal to 15 μm.

[0268] In this application example, the nanocrystal is an alloy soft magnetic material, and the portion comprising the alloy soft magnetic material can be referred to as the effective region. In some examples, the surface of the nanocrystal is covered by a capping film, which extends to the periphery of the effective region, forming an edging.

[0269] See Figures 19 and 20. Figure 19 exemplarily shows a front view of the second nanocrystal, and Figure 20 is a BB cross-sectional view of Figure 19. In this example, the second nanocrystal includes a second effective region and a second edging, the second edging being disposed around the outer periphery of the second effective region, as shown in Figure 19. The thickness of the second effective region (dimension along the P direction) is greater than the thickness of the second edging (dimension along the P direction).

[0270] For example, the thickness of the second effective region is about 90 μm, and the thickness of the second edging can be less than or equal to 15 μm.

[0271] The placement of the first and second nanocrystals in this application example can be varied. Several examples are given below.

[0272] As shown in Figure 21, in this embodiment, the coil module includes a first thick metal region and a first thin metal region, as well as a first transition region located at the boundary between the first thin metal region and the first thick metal region. A first wireless charging coil is located in the first thick metal region, a first high-speed signal line is located in the first thin metal region, and a first wired charging line is located in the first transition region; alternatively, the first wired charging line can be understood as being located between the first wireless charging coil and the first high-speed signal line. The first wired charging line in the first thick metal region is closer to the first transition region than the first wireless charging coil. A first nanocrystal covers at least a portion of the first wired charging line in the first thick metal region and extends above the first transition region.

[0273] Figure 22 is a CC cross-sectional view of Figure 21, showing the positional relationship between the first nanocrystal and the first transition region. The first transition region has a bulge that protrudes beyond the surface of the first thick metal region, and the first edge of the first nanocrystal can be located above the bulge of the first transition region.

[0274] In some examples, as shown in Figure 23, a protruding edge metal layer is provided in the first transition region, such that a first protrusion is formed on the surface of the first transition region, and the first edge of the first nanocrystal can overlap the first protrusion.

[0275] In other words, this application overlaps the edge of the first nanocrystal onto the first transition region, and also overlaps the edge onto the first protrusion adjacent to the thick metal region. In this way, the first nanocrystal achieves magnetic field shielding, preventing magnetic field interference with surrounding signals. Compared to overlapping the effective area onto the transition region, it can also reduce the overall thickness of the coil module.

[0276] As shown in Figure 22, the dimension of the first edge above the convex hull in the first direction is d1, 0.1mm≤d1≤0.5mm, and the first direction is parallel to the width direction of the first edge.

[0277] For example, the dimension d1 of the first edge in the first direction can be: the width of the first edge of the first nanocrystal minus the bonding tolerance of the first nanocrystal. For example, if the width of the first edge of the first nanocrystal is 0.5 mm and the bonding tolerance of the first nanocrystal is 0.3 mm, then d1 = 0.5 - 0.3 = 0.2 mm; or d1 = 0.3 mm; or d1 = 0.1 mm; or d1 = 0.4 mm.

[0278] In some examples, the first thin metal region includes the first high-speed signal line, the first thick metal region includes the first wireless charging coil, and the first transition region is a metal-free region. In this case, the first transition region is relatively thin, and the first nanocrystal extends into the first transition region; for example, the first nanocrystal can cover the entire first transition region. Alternatively, the first effective area of ​​the first nanocrystal can cover the first transition region.

[0279] In other examples, the first thin metal region includes a first high-speed signal line, the first thick metal region includes a first wireless charging coil, and the first transition region has a metal layer; for example, the first transition region may include a first wired charging line. The first nanocrystal may extend into the first transition region; for example, the first nanocrystal may cover the entire first transition region. To avoid localized overthickness, as shown in Figure 22, the first nanocrystal may overlap over the bulge, such that the first edge of the first nanocrystal overlaps over the bulge.

[0280] As shown in Figures 24 and 25, which illustrate the placement of the second nanocrystal, Figure 25 is a DD cross-sectional view of Figure 24. The second nanocrystal covers at least a portion of the second wireless charging coil and can extend above the second wired charging line in the third thick metal region.

[0281] In some selectable nanocrystalline structures, the effective regions of the first and second nanocrystals have a thickness of approximately 90 μm, while the edge thickness is less than 15 μm. To minimize the overall thickness of the coil module, it is undesirable for the effective regions of the first and second nanocrystals to overlap on the opposite sides of the same metal layer.

[0282] As shown in Figure 26, regarding the first nanocrystal, the orthographic projection of the first edge above the first wireless charging coil onto the reference plane is the first projection. Regarding the second nanocrystal, the orthographic projection of the second edge above the second wired charging line extending to the third thick metal region onto the reference plane is the second projection. The first and second projections overlap. The reference plane in the example of Figure 26 is parallel to the substrate surface.

[0283] In the example of Figure 26, the first effective region of the first nanocrystal has a first metal layer, such as a wired charging cable, and the second effective region of the second nanocrystal has a second metal layer, such as a wireless charging coil. This can be understood as a thick metal region beneath the first effective region of the first nanocrystal, and also a thick metal region beneath the second effective region of the second nanocrystal.

[0284] The orthographic projection of the first effective region of the first nanocrystal onto the reference plane is the third projection, and the orthographic projection of the second effective region of the second nanocrystal onto the reference plane is the fourth projection. The third and fourth projections do not overlap.

[0285] A first metal layer is present beneath a first effective region of the first nanocrystal, the first metal layer not including metal-free gaps between traces. A second metal layer is present beneath a second effective region of the second nanocrystal, the second metal layer not including metal-free gaps between traces.

[0286] As shown in Figure 26, since the projections of the first and second nanocrystals on the front and back sides overlap, the projections of the effective areas do not overlap. This prevents the projections of the effective areas of the first and second nanocrystals on the same metal layer from overlapping, which would lead to local over-thickness of the module. Furthermore, it also avoids magnetic leakage.

[0287] In some structures, there is a gap between the wired charging line and the wireless charging coil located in the thick metal region. This gap is relatively large, for example, it can be greater than or equal to 0.6 mm. In this case, the projection of the first effective region of the first nanocrystal and the projection of the second effective region of the second nanocrystal can overlap at the gap position, and the phenomenon of local overthickness will basically not occur.

[0288] As shown in Figure 27, in the first nanocrystal, the first edge above the first wireless charging coil has a dimension of d2 in the first direction, 0.1mm≤d2≤0.5mm, and the first direction is parallel to the width direction of the first edge.

[0289] For example, the dimension d2 of the first edge in the first direction can be: the width of the first edge of the first nanocrystal minus the bonding tolerance of the first nanocrystal. For example, if the width of the first edge of the first nanocrystal is 0.5 mm and the bonding tolerance of the first nanocrystal is 0.3 mm, then d2 = 0.5 - 0.3 = 0.2 mm; or d2 = 0.3 mm; or d2 = 0.1 mm; or d2 = 0.4 mm.

[0290] Continuing with Figure 27, in the second nanocrystal, the second edging located above the second wired charging line has a dimension of d3 in the first direction, 0.1mm≤d3≤0.5mm, and the first direction is parallel to the width direction of the second edging.

[0291] For example, the dimension d3 of the second edge in the first direction can be: the width of the second edge of the second nanocrystal minus the bonding tolerance of the second nanocrystal. For example, the width of the second edge of the second nanocrystal is 0.5mm, and the bonding tolerance of the first nanocrystal is 0.3mm. For instance, d3 = 0.5 - 0.3 = 0.2mm; or d3 = 0.3mm; or d3 = 0.1mm; or d3 = 0.4mm.

[0292] As shown in Figure 28, the coil module of this application example may also include a metal-free area, which may be located around the wireless charging coil. For example, there may be a metal-free area around the first wireless charging coil, or around the second wireless charging coil.

[0293] In some examples, the metal-free area around the first wireless charging coil may be opposite to the metal-free area around the second wireless charging coil.

[0294] As shown in Figure 29, the orthographic projection of the first nanocrystal in the metal-free region is the fifth projection, and the orthographic projection of the second nanocrystal in the metal-free region is the sixth projection. The fifth and sixth projections overlap.

[0295] In other words, in the metal-free region, the projections of the two nanocrystals on opposite sides need to overlap to avoid magnetic leakage.

[0296] In some examples, the area of ​​the second nanocrystal is larger. For example, in the example of Figure 29, the second nanocrystal not only covers the second wireless charging coil of the second metal layer, but also covers the metal-free area around the second wireless charging coil. The overlap width S between the orthographic projection of the first nanocrystal in the metal-free area and the orthographic projection of the second nanocrystal in the metal-free area can be S1 and S2. The overlap width S can be a dimension parallel to the first edge width direction of the first nanocrystal.

[0297] The minimum overlap widths S1 and S2 should be: 2 * (nanocrystalline edge width + nanocrystalline bonding tolerance). For example, if the edge width of the first and second nanocrystalline crystals is 0.5 mm and the bonding tolerance of the nanocrystalline crystals is 0.3 mm, then the first nanocrystalline crystal needs to cover at least 0.8 * 2 = 1.6 mm in the metal-free area, and the second nanocrystalline crystal needs to cover at least 0.8 * 2 = 1.6 mm in the metal-free area.

[0298] As shown in Figure 29, S1 can be greater than or equal to 1.6 mm, and S2 can be greater than or equal to 1.6 mm. This avoids gaps and non-overlapping of the effective areas of the first and second nanocrystals under the condition of maximum bonding tolerance, thus preventing serious magnetic leakage and improving wireless charging efficiency.

[0299] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0300] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A coil module, characterized by include: Base; First metal layer, first nanocrystal, and second nanocrystal; A first wireless charging coil and a first high-speed signal line; The first metal layer and the first nanocrystal are located on a first side of the substrate, and the second nanocrystal is located on a second side of the substrate, with the first side and the second side opposite to each other. The first metal layer includes: a first thick metal region and a first thin metal region, and a first transition region located at the boundary between the first thick metal region and the first thin metal region; The first wireless charging coil is located in the first thick metal region, and the first high-speed signal line is located in the first thin metal region; At least a portion of the periphery of the first wireless charging coil is covered by the first nanocrystal, and the first nanocrystal extends above the first transition region; The projection of the second nanocrystal onto the first wireless charging coil covers at least a portion of the first wireless charging coil.

2. The coil module of claim 1, wherein, The coil module also includes a first wiring; The first trace includes at least one of the following: ground wire, power line, or low-speed signal line.

3. The coil module of claim 2, wherein, The first trace is located in the first thick metal area, and the first trace is located between the first wireless charging coil and the first high-speed signal line; The first nanocrystal extends from the periphery of the first wireless charging coil and covers at least a portion of the first trace.

4. The coil module of claim 2 or 3, wherein, The first trace is also located in the first transition zone.

5. The coil module of claim 2, wherein, The first metal layer further includes: a second thick metal region and a second transition region, wherein the second transition region is located at the boundary between the second thick metal region and the first thin metal region; The first trace is located in the second thick metal region; The first nanocrystal extends from the periphery of the first wireless charging coil and covers at least a portion of the first transition region and at least a portion of the first thin metal region.

6. The coil module of claim 5, wherein, The first trace is also located in the second transition zone.

7. The coil module of claim 2, wherein, The first trace is located in the first thick metal area, and the first wireless charging coil is located between the first trace and the first high-speed signal line. The first nanocrystal extends from the periphery of the first wireless charging coil and covers at least a portion of the first transition region and at least a portion of the first thin metal region, as well as at least a portion of the first trace.

8. The coil module according to any one of claims 2-7, characterized in that, The power cord includes a wired charging cable.

9. The coil module according to any one of claims 1-8, characterized in that, The first nanocrystal includes: a first effective region and a first periphery, wherein the first periphery is disposed around the outer periphery of the first effective region; The first transition region includes a convex hull that protrudes beyond the surface of the first thick metal region; The first rim is located above the convex hull.

10. The coil module of claim 9, wherein, The first edge located above the convex bulge has a dimension d1 in the first direction, 0.1mm≤d1≤0.5mm, and the first direction is parallel to the width direction of the first edge.

11. The coil module of claim 9 or 10, characterized in that The first edging extends above the first wireless charging coil.

12. The coil module of claim 11, wherein, The first edge, located above the first wireless charging coil, has a dimension d2 in the first direction, where 0.1mm≤d2≤0.5mm, and the first direction is parallel to the width direction of the first edge.

13. The coil module according to claim 11 or 12, characterized in that, The second nanocrystal includes: a second effective region and a second periphery, wherein the second periphery is disposed around the outer periphery of the second effective region; The orthographic projection of the first edge above the first wireless charging coil onto the reference surface is the first projection, and the orthographic projection of the second edge near the first transition zone onto the reference surface is the second projection. The first projection and the second projection overlap, and the reference surface is parallel to the substrate surface.

14. The coil module according to claim 13, characterized in that, A second metal layer is also provided on the second side of the substrate. The second metal layer includes a third thick metal region and a third thin metal region, as well as a third transition region located at the junction of the third thick metal region and the third thin metal region. The third thick metal region is opposite to the first thick metal region, the third thin metal region is opposite to the first thin metal region, and the third transition region is opposite to the first transition region; The coil module also includes a second wireless charging coil and a second high-speed signal line; The second wireless charging coil is located in the third thick metal region, and the second high-speed signal line is located in the third thin metal region. At least a portion of the second wireless charging coil is covered by the second nanocrystal.

15. The coil module according to claim 13, characterized in that, The coil module also includes: a second wiring; The second trace includes at least one of: ground wire, power line, or low-speed signal line; The second trace is located in the third thick metal area, and the second trace is located between the second wireless charging coil and the second high-speed signal line; The second edging extends above the second routing line.

16. The coil module according to claim 15, characterized in that, The second edge, located above the second routing line, has a dimension of d3 in the first direction, where 0.1mm≤d3≤0.5mm, and the first direction is parallel to the width direction of the second edge.

17. The coil module according to any one of claims 14-16, characterized in that, The first effective region has the first metal layer underneath, and the second effective region has the second metal layer underneath; The orthographic projection of the first effective region onto the reference plane is the third projection, and the orthographic projection of the second effective region onto the reference plane is the fourth projection. The third projection and the fourth projection do not overlap.

18. The coil module according to any one of claims 1-17, characterized in that, The first side of the substrate further includes a metal-free region located around the first wireless charging coil; The first nanocrystal's orthographic projection in the metal-free region is the fifth projection, and the second nanocrystal's orthographic projection in the metal-free region is the sixth projection. The fifth projection and the sixth projection overlap.

19. The coil module according to claim 18, characterized in that, The first nanocrystal includes: a first effective region and a first periphery, wherein the first periphery is disposed around the outer periphery of the first effective region; The overlap width between the fifth projection and the sixth projection in the first direction is S, where S ≥ 1.6 mm, and the first direction is parallel to the width direction of the first edging.

20. The coil module according to any one of claims 1-19, characterized in that, The coil module further includes: a thick cover layer and a thin cover layer, and a connecting cover layer located at the junction of the thick cover layer and the thin cover layer; The thick capping layer is formed on the first thin metal region, the thin capping layer is formed on the first thick metal region, and the connecting capping layer is formed on the first transition region.

21. The coil module according to claim 20, characterized in that, The first transition region includes an edge metal layer that protrudes beyond the first thick metal region, and the connecting cover layer on the edge metal layer protrudes to form a first protrusion. The connecting cover layer includes the stacked thick cover layer and the thin cover layer, and the connecting cover layer located on the stacked thick cover layer and the thin cover layer protrudes to form a second protrusion; The first protrusion is closer to the first thick metal region than the second protrusion.

22. The coil module according to claim 21, characterized in that, The first nanocrystal extends above the first protrusion.

23. The coil module according to claim 21 or 22, characterized in that, The first protrusion and the second protrusion are spaced apart.

24. The coil module according to any one of claims 21-23, characterized in that, The edge metal layer includes a first edge metal layer and a second edge metal layer, wherein the second edge metal layer is located on the side of the first edge metal layer opposite to the substrate; The first edge metal layer protrudes towards the first thin metal region compared to the second edge metal layer.

25. The coil module according to any one of claims 1-24, characterized in that, The substrate includes a first substrate and a second substrate, which are disposed opposite to each other and connected by a connecting layer having a cavity. The first metal layer and the first nanocrystal are disposed on the side of the first substrate opposite to the second substrate; The second nanocrystal is disposed on the side of the second substrate opposite to the first substrate.

26. The coil module according to claim 25, characterized in that, The cavity corresponds to the position of the first thin metal region.

27. An electronic device, characterized in that, include: processor; A coil module, comprising the coil module according to any one of claims 1-26, wherein the coil module is connected to the processor.

28. The electronic device according to claim 27, characterized in that, The electronic device includes a candybar electronic device or a foldable electronic device.

29. The electronic device according to claim 27 or 28, characterized in that, The electronic device includes a foldable electronic device, which includes a hinge structure; The substrate includes a first substrate and a second substrate, which are disposed opposite to each other and connected by a connecting layer. The connecting layer has a cavity, and the rotating shaft structure passes through the cavity. The first metal layer and the first nanocrystal are disposed on the side of the first substrate opposite to the second substrate; The second nanocrystal is disposed on the side of the second substrate opposite to the first substrate.

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