Server and cabinet system

Abstract

The present application relates to the technical field of servers, and discloses a server and a cabinet system. The server comprises: a chassis, which comprises a top plate and a bottom plate; a mainboard, which is arranged in the middle of the chassis, wherein a first layout space is formed between the front surface of the mainboard and the top plate, and a second layout space is formed between the back surface of the mainboard and the bottom plate; first components, which are arranged on the back surface of the mainboard and located in the second layout space; and a first heat sink, which is arranged on at least one of the first components and located in the second layout space. Both the front and back surfaces of the mainboard have sufficient space for component layout, so that the size of the mainboard can be reduced, and the power density of the mainboard is improved. Since the size of the mainboard is reduced, under the same configuration, the size of the chassis in the server is correspondingly reduced.

Description

Server and rack systems

[0001] Cross-reference to related applications

[0002] This application claims priority to Chinese Patent Application No. 202410688399.0, filed on May 30, 2024, entitled “Server and Cabinet System”, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application relates to the field of server technology, and in particular to a server and rack system. Background Technology

[0004] A server consists of a server chassis and a motherboard. Currently, the motherboard is located at the bottom of the server chassis.

[0005] Key components such as the CPU (Central Processing Unit), PCH (Platform Controller Hub), memory module, and BMC (Baseboard Management Controller) are all located on the front of the motherboard.

[0006] However, the motherboards in the aforementioned servers are relatively large, have low power density, and result in larger server sizes. Summary of the Invention

[0007] This application provides a server and rack system, which aims to at least solve the technical problems of large motherboard size, low power density of motherboard, and large server size in the prior art.

[0008] In a first aspect of this application, a server is provided, comprising:

[0009] The chassis, including the top plate and the bottom plate;

[0010] The motherboard is located in the middle of the chassis. The front of the motherboard and the top plate form the first layout space, and the back of the motherboard and the bottom plate form the second layout space.

[0011] The first component is located on the back of the motherboard and within the second layout space;

[0012] The first heat sink is disposed on at least one first component and located within the second layout space.

[0013] In some embodiments, the first heat sink includes a first fin portion, and at least one first receiving groove is provided at one end of the first fin portion away from the first component, and the at least one first receiving groove is used for embedding a first liquid cooling pipe.

[0014] The first fin portion is detachably connected to at least one first leveling member, which is used to level at least one first receiving groove.

[0015] The first radiator includes a first fin portion, the first fin portion includes a plurality of first fins, and the first fins include at least two first main body plates spaced apart along a first direction, and two adjacent first main body plates are connected by a first connecting plate.

[0016] Each first fin has at least one cavity, and at least one first body plate in each first fin extends into the cavity of the adjacent first fin.

[0017] In some embodiments, two adjacent first fins form a first heat dissipation channel, the first heat dissipation channel includes a plurality of first main channels spaced apart along a first direction, two adjacent first main channels in the first heat dissipation channel are connected by a first connecting channel, and two adjacent first connecting channels in the first heat dissipation channel are respectively located on both sides of the first main channel.

[0018] In some embodiments, the system further includes a fan circuit board, which is flush with the motherboard, and a first fan module and a second fan module are connected to the front and back sides of the fan circuit board, respectively.

[0019] In some embodiments, the first component includes at least one voltage regulation module, and the first heat sink is disposed on at least one voltage regulation module;

[0020] The front of the motherboard has a second component located within the first layout space. The second component includes a central processing unit, and at least one voltage regulation module is located below the central processing unit.

[0021] In some embodiments, the central processing unit is further provided with a second heat sink, the structure of which is the same as that of the first heat sink.

[0022] In some embodiments, the first component further includes at least one of an integrated southbridge chip, a memory module, a substrate management controller, a complex programmable logic device, a flash memory chip, and a battery module.

[0023] In some embodiments, when the first component includes an integrated southbridge chip, the server further includes a third heat sink disposed on the integrated southbridge chip, the third heat sink being located within the second layout space.

[0024] In some embodiments, the first liquid cooling pipe has a circular cross-sectional shape, and the first receiving groove has a semi-circular cross-sectional shape.

[0025] In some embodiments, a first fan connector group and a second fan connector group are respectively provided on the front and back of the fan circuit board, and the first fan module and the second fan module are respectively pluggable and detachable connected to the first fan connector group and the second fan connector group.

[0026] In some embodiments, the second fan connector group includes at least one second fan connector, and the second fan module includes at least one second fan;

[0027] The second fan connector includes a second latch, and the second fan has a second slot corresponding to the second latch; or, the second fan connector has a second slot, and the second fan has a second latch corresponding to the second slot.

[0028] In some embodiments, the first fan connector group includes at least one first fan connector, and the first fan module includes at least one first fan;

[0029] The first fan connector includes a first latch, and the first fan has a first slot corresponding to the first latch; or, the first fan connector has a first slot, and the first fan has a first latch corresponding to the first slot.

[0030] In a second aspect of this application, a rack system is also provided, which includes a rack and a server as described above.

[0031] In some embodiments, a liquid cooling device is also included, which is connected to a first liquid cooling pipe in the server and is used to provide coolant to the first liquid cooling pipe.

[0032] In some embodiments, there is sufficient space on both the front and back of the motherboard to accommodate components, thereby reducing the motherboard's size and increasing its power density. With a smaller motherboard, the server chassis size can also be reduced for the same configuration, thus decreasing the data center's footprint, lowering operating costs, and aligning with the trend towards miniaturization and portability. Furthermore, a smaller motherboard size allows for more space within a chassis of the same size to accommodate hard drives, PCIe devices, and other components, accommodating larger and more diverse configurations. Additionally, since the first component and the first heatsink are located within the second layout space, the heat dissipation effect of the first component is not affected by components located on the front of the motherboard, resulting in better heat dissipation for the first component. Attached Figure Description

[0033] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below.

[0034] Figure 1 is a schematic diagram of the structure of a server in the prior art;

[0035] Figure 2 is a schematic diagram of the structure of a server provided in some embodiments;

[0036] Figure 3 is a schematic diagram of the structure in which the first receiving groove on the first fin portion cooperates with the first liquid cooling pipe in some embodiments;

[0037] Figure 4 is a schematic diagram of the structure in which the first receiving groove on the first fin portion cooperates with the first filling member in some embodiments;

[0038] Figure 5 is a schematic diagram of the structure of the first fin portion in the first radiator provided in some embodiments;

[0039] Figure 6 is a structural schematic diagram of the first filling element provided in some embodiments;

[0040] Figure 7 is a schematic diagram of another server structure provided in some embodiments.

[0041] Attached label: 1-Server chassis, 2-Motherboard, 3-CPU cooler; 11-Motherboard, 111-Front end, 112-Rear end, 12-Chassis, 121-Top plate, 122-Bottom plate, 123-First layout space 124-Second layout space, 13-First component, 131-Voltage regulation module, 132-Integrated southbridge chip, 14-First heat sink, 141-First fin section, 142-First receiving slot, 143-First fin, 1431-First main board, 1432-First connecting board, 144-First heat dissipation channel, 1441-First main channel, 1442-First connecting channel, 145-First filling part, 1451-Connecting part, 1452-Filling part, 1453-Attaching part, 1454-Mounting part, 15-First liquid cooling pipe, 16-Fan circuit board, 17-First fan module, 18-Second fan module, 19-Second component, 191-Central processing unit, 20-Second heat sink, 21-Third heat sink, 22-Power supply module. Detailed Implementation

[0042] The technical solutions in some embodiments will now be described with reference to the accompanying drawings.

[0043] The embodiments described herein are for illustrative purposes only and are not intended to limit the scope of this application. The following paragraphs describe this application by way of example with reference to the accompanying drawings. It should be noted that the drawings are all in a very simplified form and use non-precise proportions, and are only used to facilitate and clarify the illustration of the embodiments of this application.

[0044] Referring to Figure 1, the server includes a server chassis 1 and a motherboard 2, currently located at the bottom of the server chassis 1. Key components such as the CPU, PCH chip, storage module, and BMC are all located on the front of the motherboard 2. A CPU heatsink 3 is mounted on the CPU. However, the motherboard 2 in the above-mentioned server is relatively large, has a low power density, and results in a large overall server size. To address these issues, this application provides a server and rack system, which will be described below.

[0045] In a first aspect, referring to FIG2, the server provided in the embodiment of this application includes: a chassis 12, including a top plate 121 and a bottom plate 122; a motherboard 11, disposed in the middle of the chassis 12, a first layout space 123 is formed between the front side 111 of the motherboard 11 and the top plate 121, and a second layout space 124 is formed between the back side 112 of the motherboard 11 and the bottom plate 122; a first component 13, disposed on the back side 112 of the motherboard 11 and located within the second layout space 124; and a first heat sink 14, disposed on at least one first component 13 and located within the second layout space 124.

[0046] In some embodiments, the motherboard 11 is disposed in the middle of the chassis 12 along its height direction. A first layout space 123 is formed between the front side 111 and the top plate 121 of the motherboard 11, and a second layout space 124 is formed between the back side 112 and the bottom plate 122 of the motherboard 11. This ensures that both the front side 111 and the back side 112 of the motherboard 11 have sufficient space to arrange chips, heat sinks, resistors, capacitors, and other electronic components. In some embodiments, components can be arranged on both the front side and the back side 112 of the motherboard 11, changing the current situation where components can only be arranged in a flat layout on the front side of the motherboard.

[0047] The chassis 12 can be a 2U chassis. The front 111 of the motherboard 11 can refer to the side facing upwards when the motherboard 11 is installed inside the chassis 12, and the back 112 of the motherboard 11 can refer to the side facing downwards when the motherboard 11 is installed inside the chassis 12. After the first component 13 and the first heat sink 14 are installed on the back 112 of the motherboard 11, there is a certain gap between the first heat sink 14 and the base plate 122.

[0048] The first component 13 generates heat during operation. The first heat sink 14 dissipates heat from the first component 13. Furthermore, since the first component 13 and the first heat sink 14 are located within the second layout space 124, the heat dissipation effect of the first component 13 is not affected by the components arranged on the front side 111 of the motherboard 11, resulting in good heat dissipation for the first component 13. The first component 13 may include at least one of the following: a voltage regulation module 131, an integrated southbridge chip 132, a memory module, a baseboard management controller, a complex programmable logic device, a flash memory chip, and a battery module.

[0049] With the increasing demand for high-performance applications such as artificial intelligence, machine learning, and big data mining, the requirements for servers are becoming increasingly stringent. To provide high-performance and highly reliable computing power to support massive amounts of data, the performance of processors such as CPUs and GPUs (Graphics Processing Units) is constantly being upgraded, and the signal design, power supply design, heat dissipation design, storage capacity, and configuration diversity of servers are also continuously improving. Server clusters form data centers. The operating costs of large data centers include site rental, heat dissipation equipment maintenance, and power consumption. The operating costs of large data centers are constrained by various factors such as server size, heat dissipation efficiency, and power conversion efficiency.

[0050] In some embodiments, both the front side 111 and the back side 112 of the motherboard 11 have sufficient space to accommodate components, thereby reducing the size of the motherboard 11 and increasing its power density. With the reduced size of the motherboard 11, the size of the server chassis 12 in the same configuration is also reduced, thereby decreasing the data center's footprint, lowering its operating costs, and aligning with the trend towards miniaturization and portability. Furthermore, with the reduced size of the motherboard 11, more space can be allocated within the chassis 12 of the same size to accommodate hard drives, PCIe (Peripheral Component Interconnect Express) devices, and other components, to accommodate larger and more diverse configurations. In addition, since the first component 13 and the first heatsink 14 are located within the second layout space 124, the heat dissipation effect of the first component 13 is not affected by the components arranged on the front side 111 of the motherboard 11, resulting in better heat dissipation for the first component 13.

[0051] It should be noted that by reducing the size of the motherboard 11, the size of the server chassis 12 can be reduced by at least one-third under the same configuration.

[0052] Currently, the upper space of a server chassis is only used for planning heat dissipation and ventilation paths, cable plugging and unplugging routes, and after-sales maintenance operation space, and cannot effectively contribute to server configuration upgrades, resulting in low space utilization of the server chassis. In some embodiments, both the upper and lower spaces of the chassis 12 can be used to arrange components, thereby improving the space utilization of the chassis 12.

[0053] In some embodiments, referring to Figures 3 and 4, the first heat sink 14 includes a first fin portion 141, and at least one first receiving groove 142 is provided at one end of the first fin portion 141 away from the first component 13. The first receiving groove 142 is used for embedding the first liquid cooling pipe 15. The first fin portion 141 is detachably connected to at least one first filling member 145, and the at least one first filling member 145 is used to fill at least one first receiving groove 142.

[0054] In some embodiments, the first fin portion 141 includes a plurality of first fins 143, and a first receiving groove 142 extends through the plurality of first fins 143 in the first fin portion 141. The extending direction of the first receiving groove 142 is parallel to a first direction. The first direction can be the direction indicated by arrow A in FIG5. The number of first receiving grooves 142 can be one, two, three, etc. The number of first receiving grooves 142 can be two, and both first receiving grooves 142 are used for embedding a first liquid cooling tube 15. The first liquid cooling tube 15 includes two parallel liquid cooling sections, the ends of the two liquid cooling sections are connected, and the two first receiving grooves 142 are respectively used for embedding the two liquid cooling sections.

[0055] The first liquid cooling pipe 15 is used to supply coolant. The chassis 12 is provided with an inlet and an outlet, and the first liquid cooling pipe 15 is connected to both. When the first liquid cooling pipe 15 is embedded in the first receiving groove 142, the first liquid cooling pipe 15 is in close contact with the first fin portion 141, thereby effectively transferring heat from the first fin portion 141 to the first liquid cooling pipe 15. The first fin portion 141 is made of metals such as copper or aluminum.

[0056] The number of first filling members 145 is equal to the number of first receiving slots 142. The shape and size of the first filling members 145 match the shape and size of the first receiving slots 142. The material of the first filling members 145 is the same as the material of the first fin portion 141. In an air-cooled scenario, the first filling members 145 are connected to the first fin portion 141, and the first filling members 145 fill the first receiving slots 142 to ensure the integrity of the first fin portion 141, thereby ensuring the heat dissipation effect of the first heat sink 14.

[0057] In a liquid cooling scenario, the first filler 145 can be removed, and the first liquid cooling pipe 15 can be embedded into the first receiving groove 142. In some embodiments, the first filler 145 is detachably connected to the first fin portion 141, allowing the first heat sink 14 to adapt to both air cooling and liquid cooling methods. Depending on the cooling method, the user can flexibly install and remove the first filler 145.

[0058] In some embodiments, referring to FIG6, the first filling member 145 includes a connecting portion 1451 and a plurality of filling portions 1452 connected to the connecting portion 1451. The plurality of filling portions 1452 are spaced apart along a first direction. The number of filling portions 1452 is equal to the number of first fins 143, and the plurality of filling portions 1452 correspond one-to-one with the plurality of first fins 143. The plurality of filling portions 1452 are used to fill the first receiving grooves 142 penetrating the plurality of first fins 143. The connecting portion 1451 is connected to two fitting portions 1453 at both ends along the first direction. Each fitting portion 1453 is connected to a mounting portion 1454 at one end away from the connecting portion 1451. The two fitting portions 1453 are respectively used to contact the two sides of the first fin portion 141. The first heat sink 14 also includes a substrate. When the first filling member 145 is connected to the first fin portion 141, the mounting portion 1454 contacts the substrate. The mounting portion 1454 has a slot, and the substrate has a corresponding buckle. Alternatively, the substrate has a slot, and the mounting portion 1454 has a corresponding buckle. In some embodiments, the first filling member 145 is limited in the vertical direction by the contact between the mounting portion 1454 and the substrate and the cooperation between the slot and the buckle. Furthermore, the first filling member 145 is limited in the first direction by the arrangement of the two fitting portions 1453 contacting the two sides of the first fin portion 141 respectively.

[0059] In some embodiments, referring to FIG5, the first radiator 14 includes a first fin portion 141, the first fin portion 141 includes a plurality of first fins 143, the first fins 143 include at least two first body plates 1431 spaced apart along a first direction; each first fin 143 has at least one cavity, and at least one first body plate 1431 of each first fin 143 extends into the cavity of the adjacent first fin 143.

[0060] In some embodiments, the first fin portion 141 is the main part of the first heat sink 14. The first body plate 1431 may be perpendicular to the first connecting plate 1432. A plurality of first fins 143 include edge first fins located at two edges of the first fin portion 141 along a first direction. The edge first fins may include two first body plates 1431 and a first connecting plate 1432 connected to the two first body plates 1431. The plurality of first fins 143 also include intermediate first fins located between the two edge first fins. The intermediate first fins may include three first body plates 1431 and two first connecting plates 1432, with two adjacent first connecting plates 1432 in the intermediate first fin located on both sides of the first body plate 1431.

[0061] In the first fin 143, two first main body plates 1431 and a first connecting plate 1432 connecting the two first main body plates 1431 form a cavity. The edge first fin has one cavity. The middle first fin has two cavities. In some embodiments, the above arrangement increases the specific surface area of ​​the first heat sink 14, improves the heat dissipation efficiency and effect of the first heat sink 14, and thus enhances the working performance of the first component 13.

[0062] In some embodiments, referring to FIG5, two adjacent first fins 143 form a first heat dissipation channel 144. The first heat dissipation channel 144 includes a plurality of first main channels 1441 spaced apart along a first direction. Two adjacent first main channels 1441 in the first heat dissipation channel 144 are connected by a first connecting channel 1442. Two adjacent first connecting channels 1442 in the first heat dissipation channel 144 are respectively located on both sides of the first main channel 1441.

[0063] In some embodiments, the first heat dissipation channel 144 is a space enclosed by two adjacent first fins 143, and the first heat dissipation channel 144 is used to guide airflow. The first fin portion 141 is close to the second fan module 18 on one side along a second direction, which is perpendicular to the first direction. The first heat sink 14 may include at least one first fin portion 141. The first heat dissipation channel 144 may include three first main channels 1441 and two first connecting channels 1442.

[0064] In some embodiments, referring to FIG7, the server further includes a fan circuit board 16, which is flush with the motherboard 11, and a first fan module 17 and a second fan module 18 are respectively connected to the front and back of the fan circuit board 16.

[0065] In some embodiments, when the first fan module 17 and the second fan module 18 rotate, airflow passes through both the first layout space 123 and the second layout space 124. The fan circuit board 16 is located on one side of the motherboard 11 along the length of the server. The space inside the chassis 12 also includes a front window and a rear window located on both sides of the motherboard 11 along the length of the server, with the first fan module 17 and the second fan module 18 both located in the front window.

[0066] The fan circuit board 16 is electrically connected to the first fan module 17 and the second fan module 18, and is used to control the operation of the first fan module 17 and the second fan module 18. When the fan circuit board 16 is flush with the motherboard 11, there is space on both the front and back of the fan circuit board 16 to accommodate the fan modules. The front of the fan circuit board 16 refers to the side facing upwards when the fan circuit board 16 is installed inside the chassis 12, and the back of the fan circuit board 16 refers to the side facing downwards when the fan circuit board 16 is installed inside the chassis 12.

[0067] The first fan module 17 includes multiple first fans, and the second fan module 18 includes multiple second fans. The first fan module 17 and the second fan module 18 are independent of each other, and their control methods can differ. For example, the speed of the first fan module 17 can be controlled based on the temperature of the second component 19, while the speed of the second fan module 18 can be controlled based on the temperature of the first component 13. The speeds of the first fan module 17 and the second fan module 18 can also be different.

[0068] In some embodiments, the configuration of connecting a first fan module 17 and a second fan module 18 to the front and back of the fan circuit board 16 respectively satisfies the overall heat dissipation requirements of the server. Simultaneously, the first fan module 17 and the second fan module 18 are independent of each other to meet the different heat dissipation requirements of the first layout space 123 and the second layout space 124 within the chassis 12. Furthermore, both the first fan module 17 and the second fan module 18 can be replaced individually.

[0069] In some embodiments, the server further includes an air guide assembly, which includes a first air guide located in a first layout space 123 and a second air guide located in a second layout space 124.

[0070] In some embodiments, referring to FIG7, the first component 13 includes at least one voltage regulation module 131, and the first heat sink 14 is disposed on at least one voltage regulation module 131; the front side 111 of the motherboard 11 is provided with a second component 19, the second component 19 is located in the first layout space 123, the second component 19 includes a central processing unit 191, and at least one voltage regulation module 131 is located below the central processing unit 191.

[0071] In some embodiments, at least one voltage regulation module 131 is used to regulate the input voltage to provide a stable operating voltage for the central processing unit 191. The number of voltage regulation modules 131 disposed on the back side 112 of the motherboard 11 can be one, two, three, four, etc. A first heat sink 14 is used for heat dissipation of at least one voltage regulation module 131. The second component 19 may also include a memory module, a baseboard management controller, at least one voltage regulation module 131, etc.

[0072] Currently, central processing units (CPUs) are increasingly exhibiting trends of high current, high current slope, high power density, and low voltage. High power consumption and high current lead to increasingly higher transmission losses and reduced conversion efficiency. In some embodiments, when at least one voltage regulation module 131 is disposed on the back 112 of the motherboard 11, and at least one voltage regulation module 131 is located below the CPU 191, a vertical power delivery (VPD) architecture can be implemented. This VPD architecture can meet the power supply requirements of CPUs with high current, high current slope, high power density, and low voltage. Furthermore, at least one voltage regulation module 131 directly supplies power vertically to the CPU 191 along the height of the server, shortening the power supply path, reducing transmission impedance, and thus improving conversion efficiency.

[0073] In some embodiments, referring to FIG7, a second heat sink 20 is also provided on the central processing unit 191, and the structure of the second heat sink 20 is the same as that of the first heat sink 14.

[0074] In some embodiments, the second heat sink 20 includes a second fin portion, and at least one second receiving groove is provided at one end of the second fin portion away from the central processing unit 191. The second receiving groove is used for embedding a second liquid cooling pipe. The second fin portion is detachably connected to at least one second leveling member, and the at least one second leveling member is used to level at least one second receiving groove.

[0075] The second fin section includes a plurality of second fins, and each second fin includes at least two second main body plates spaced apart along a first direction. Two adjacent second main body plates are connected by a second connecting plate. Two adjacent second connecting plates in the second fin are located on both sides of the second main body plate, and two adjacent second fins form a second heat dissipation channel.

[0076] The second heat dissipation channel includes a plurality of second main channels spaced apart along the first direction. Two adjacent second main channels in the second heat dissipation channel are connected by a second connecting channel. Two adjacent second connecting channels in the second heat dissipation channel are located on both sides of the second main channel.

[0077] In some embodiments, the structure of the second heat sink 20 is the same as that of the first heat sink 14, which increases the specific surface area of ​​the second heat sink 20, improves its heat dissipation efficiency and effect, and thus enhances the performance of the central processing unit 191. Furthermore, the second heat sink 20 is also compatible with both air cooling and liquid cooling methods.

[0078] In some embodiments, referring to FIG7, the first component 13 further includes at least one of an integrated southbridge chip 132, a memory module, a substrate management controller, a complex programmable logic device (CPLD), a flash memory chip, and a battery module.

[0079] In some embodiments, the storage module can be a DIMM (Dual Inline Memory Module). The battery module is used to supply power to the motherboard 11 in the event of a power outage. When the server loses power, the battery module ensures that the server continues to operate for a certain period of time to ensure that the server's data is not lost.

[0080] In some embodiments, referring to FIG7, when the first component 13 includes an integrated southbridge chip 132, the server further includes a third heat sink 21 disposed on the integrated southbridge chip 132, and the third heat sink 21 is located within the second layout space 124. In some embodiments, the structure of the third heat sink 21 may be the same as the structure of the first heat sink 14, or it may be different from the structure of the first heat sink 14. By setting the third heat sink 21, the heat dissipation effect of the integrated southbridge chip 132 can be improved. When the structure of the third heat sink 21 is the same as the structure of the first heat sink 14, the specific surface area of ​​the third heat sink 21 is increased, the heat dissipation efficiency and heat dissipation effect of the third heat sink 21 are improved, thereby improving the working performance of the integrated southbridge chip 132. In addition, the third heat sink 21 can also be adapted to both air cooling and liquid cooling methods.

[0081] In some embodiments, referring to FIG3, the cross-sectional shape of the first liquid cooling pipe 15 is circular, and the cross-sectional shape of the first receiving groove 142 is semi-circular. The radius of the first receiving groove 142 can be equal to the radius of the first liquid cooling pipe 15. By setting the cross-sectional shape of the first liquid cooling pipe 15 to be circular and the cross-sectional shape of the first receiving groove 142 to be semi-circular, sufficient contact between the first liquid cooling pipe 15 and the first fin portion 141 is ensured, thereby improving the heat dissipation effect.

[0082] In some embodiments, a first fan connector group and a second fan connector group are respectively provided on the front and back of the fan circuit board 16, and the first fan module 17 and the second fan module 18 are respectively pluggable and detachable to the first fan connector group and the second fan connector group.

[0083] In some embodiments, the first fan connector group includes a plurality of first fan connectors, and the first fan module 17 includes a plurality of first fans, each of which is pluggable and detachable to the plurality of first fan connectors. The second fan connector group includes a plurality of second fan connectors, and the second fan module 18 includes a plurality of second fans, each of which is pluggable and detachable to the plurality of second fan connectors. The model of the first fan can be determined based on the heat loss of the second component 19 and the upper space of the chassis 12. The model of the second fan can be determined based on the heat loss of the first component 13 and the lower space of the chassis 12. In some embodiments, the pluggable and detachable connection of the first fan module 17 and the second fan module 18 to the first fan connector group and the second fan connector group, respectively, facilitates the maintenance and replacement of the first fan module 17 and the second fan module 18.

[0084] In some embodiments, the second fan connector group includes at least one second fan connector, and the second fan module 18 includes at least one second fan; the second fan connector includes a second snap-fit, and the second fan has a second slot corresponding to the second snap-fit; or, the second fan connector has a second slot, and the second fan has a second snap-fit ​​corresponding to the second slot.

[0085] In some embodiments, the second fan module 18 may include five second fans, and the second fan connector assembly includes five second fan connectors. When the second fan is mounted on the fan circuit board 16, the second latch engages with the second slot. In some embodiments, the second latch and the second slot prevent the second fan from falling off, and even if the second fan is suspended upside down on the fan circuit board 16, the connection between the second fan and the second fan connector remains secure.

[0086] In some embodiments, the first fan connector group includes at least one first fan connector, and the first fan module 17 includes at least one first fan; the first fan connector includes a first snap-fit, and the first fan has a first slot corresponding to the first snap-fit; or, the first fan connector has a first slot, and the first fan has a first snap-fit ​​corresponding to the first slot.

[0087] In some embodiments, the first fan module 17 may include five first fans, and in this case, the first fan connector group includes five first fan connectors. When the first fan is mounted on the fan circuit board 16, the first latch engages with the first slot. In some embodiments, the arrangement of the first latch and the first slot prevents the connection between the first fan and the first fan connector from becoming loose.

[0088] In some embodiments, the server is a 2U server, configured with: a central processing unit (CPU) 191, 16 dual in-line storage modules, 12 NVMe (NVM Express) HDDs (Hard Disk Drives), 8 PCIe devices, 10 fans, and a power supply unit (PSU). The server must be compatible with both air cooling and liquid cooling. Based on the above configuration, the server requires a motherboard with 11 and 12 hard drive backplanes, an adapter board with three PCIe slots, and an adapter board with two PCIe slots.

[0089] The central processing unit 191 is located on the front side 111 of the motherboard 11. Connectors for eight dual in-line memory (DIP) modules can also be located on the front side 111 of the motherboard 11. A baseboard management controller can also be located on the front side 111 of the motherboard 11. At least one voltage regulator module is located on the front side 111 of the motherboard 11. Connectors for the hard drive backplane and adapter boards are also located on the front side 111 of the motherboard 11. A PSU connector is also provided on the motherboard 11.

[0090] The connectors for eight dual in-line memory modules can be located on the back panel 112 of the motherboard 11. The integrated southbridge chip 132, flash memory chips, battery module, and at least one voltage regulator module are also located on the back panel 112 of the motherboard 11. A third heatsink 21 for cooling the integrated southbridge chip 132 and a first heatsink 14 for cooling the at least one voltage regulator module are both located on the back panel 112 of the motherboard 11. This motherboard 11 is significantly smaller than existing motherboards and achieves higher power density.

[0091] The fan circuit board 16 has five first fan connectors on its front side and five second fan connectors on its back side. Each second fan connector includes a second latch, and the second fan has a second slot corresponding to the second latch; alternatively, the second fan connector has a second slot, and the second fan has a second latch corresponding to the second slot. Each first fan connector includes a first latch, and the first fan has a first slot corresponding to the first latch; alternatively, the first fan connector has a first slot, and the first fan has a first latch corresponding to the first slot.

[0092] The first radiator 14 includes a first fin portion 141. At least one first receiving groove 142 is provided at the end of the first fin portion 141 away from the first component 13. The first receiving groove 142 is used for embedding the first liquid cooling pipe 15. The first fin portion 141 is detachably connected to at least one first filling member 145. The first filling member 145 is used to fill at least one first receiving groove 142.

[0093] Based on the above configuration and design, when assembling the server, the motherboard 11 is placed in the middle of the chassis 12 and fixed; then, five first fans and five second fans are installed on the front and back of the fan circuit board 16 respectively, and the fan circuit board 16, the first fans and the second fans are placed in the front window; then, the 12-port hard drive backplane is placed between the motherboard 11 and the fan circuit board 16; then, the adapter board is placed in the rear window; then, the power supply module 22 is inserted from the rear window and connected to the PSU connector on the motherboard 11.

[0094] Secondly, referring to FIG4, an embodiment of this application provides a rack system, which includes a rack and a server provided in any of the first aspects. The server includes: a chassis 12, including a top plate 121 and a bottom plate 122; a motherboard 11, disposed in the middle of the chassis 12, with a first layout space 123 formed between the front side 111 of the motherboard 11 and the top plate 121, and a second layout space 124 formed between the back side 112 of the motherboard 11 and the bottom plate 122; a first component 13, disposed on the back side 112 of the motherboard 11 and located within the second layout space 124; and a first heat sink 14, disposed on at least one first component 13 and located within the second layout space 124.

[0095] In some embodiments, both the front side 111 and the back side 112 of the motherboard 11 have sufficient space to accommodate components, thereby reducing the size of the motherboard 11 and increasing its power density. With the reduced size of the motherboard 11, the size of the server chassis 12 in the same configuration is also reduced, thereby decreasing the data center's footprint, lowering its operating costs, and aligning with the trend towards miniaturization and portability. Furthermore, with the reduced size of the motherboard 11, more space can be freed up within the chassis 12 of the same size to accommodate hard drives, PCIe devices, and other components, allowing for larger and more diverse configurations. Moreover, since the first component 13 and the first heatsink 14 are located within the second layout space 124, the heat dissipation effect of the first component 13 is not affected by the components arranged on the front side 111 of the motherboard 11, resulting in better heat dissipation for the first component 13.

[0096] In some embodiments, the rack system further includes a liquid cooling device connected to a first liquid cooling pipe 15 in the server, the liquid cooling device being used to provide coolant to the first liquid cooling pipe 15.

[0097] The liquid cooling system includes a manifold located within the server rack. The manifold is also connected to a Coolant Distribution Unit (CDU), located outside the server rack, which distributes coolant to the various server racks in the data center. The manifold has a main inlet, a main outlet, multiple first branch outlets, and multiple first return outlets. The first branch outlets are connected to the main inlet, and the first return outlets are connected to the main outlet. The first branch outlets are connected to the inlets of the servers, and the first return outlets are connected to the outlets of the servers. Coolant flows into the manifold from the main inlet, flows from the first branch outlets to the inlets of the servers, flows from the inlets of the servers to the first liquid cooling pipes 15, and after heat exchange, the coolant flows from the first liquid cooling pipes 15 to the outlets of the servers, then flows back to the manifold through the first return outlets, and finally exits the manifold through the main outlet. The coolant can be a non-conductive solution to prevent damage to the servers in the event of a leak. The coolant can be water.

[0098] In some embodiments, referring to Figures 3 and 4, the first heat sink 14 includes a first fin portion 141, and at least one first receiving groove 142 is provided at one end of the first fin portion 141 away from the first component 13. The first receiving groove 142 is used for embedding the first liquid cooling pipe 15. The first fin portion 141 is detachably connected to at least one first filling member 145, and the at least one first filling member 145 is used to fill at least one first receiving groove 142.

[0099] In some embodiments, referring to FIG5, the first radiator 14 includes a first fin portion 141, the first fin portion 141 includes a plurality of first fins 143, the first fins 143 include at least two first body plates 1431 spaced apart along a first direction; each first fin 143 has at least one cavity, and at least one first body plate 1431 of each first fin 143 extends into the cavity of the adjacent first fin 143.

[0100] In some embodiments, referring to FIG5, two adjacent first fins 143 form a first heat dissipation channel 144. The first heat dissipation channel 144 includes a plurality of first main channels 1441 spaced apart along a first direction. Two adjacent first main channels 1441 in the first heat dissipation channel 144 are connected by a first connecting channel 1442. Two adjacent first connecting channels 1442 in the first heat dissipation channel 144 are respectively located on both sides of the first main channel 1441.

[0101] In some embodiments, referring to FIG7, the server further includes a fan circuit board 16, which is flush with the motherboard 11, and a first fan module 17 and a second fan module 18 are respectively connected to the front and back of the fan circuit board 16.

[0102] In some embodiments, referring to FIG7, the first component 13 includes at least one voltage regulation module 131, and the first heat sink 14 is disposed on at least one voltage regulation module 131; the front side 111 of the motherboard 11 is provided with a second component 19, the second component 19 is located in the first layout space 123, the second component 19 includes a central processing unit 191, and at least one voltage regulation module 131 is located below the central processing unit 191.

[0103] In some embodiments, referring to FIG7, a second heat sink 20 is also provided on the central processing unit 191, and the structure of the second heat sink 20 is the same as that of the first heat sink 14.

[0104] In some embodiments, referring to FIG7, the first component 13 further includes at least one of an integrated southbridge chip 132, a memory module, a substrate management controller, a complex programmable logic device, a flash memory chip, and a battery module.

[0105] In some embodiments, referring to FIG7, when the first component 13 includes an integrated southbridge chip 132, the server further includes a third heat sink 21 disposed on the integrated southbridge chip 132, and the third heat sink 21 is located within the second layout space 124.

[0106] In some embodiments, referring to FIG3, the cross-sectional shape of the first liquid cooling pipe 15 is circular, and the cross-sectional shape of the first receiving groove 142 is semi-circular.

[0107] In some embodiments, a first fan connector group and a second fan connector group are respectively provided on the front and back of the fan circuit board 16, and the first fan module 17 and the second fan module 18 are respectively pluggable and detachable to the first fan connector group and the second fan connector group.

[0108] In some embodiments, the second fan connector group includes at least one second fan connector, and the second fan module 18 includes at least one second fan; the second fan connector includes a second snap-fit, and the second fan has a second slot corresponding to the second snap-fit; or, the second fan connector has a second slot, and the second fan has a second snap-fit ​​corresponding to the second slot.

[0109] In some embodiments, the first fan connector group includes at least one first fan connector, and the first fan module 17 includes at least one first fan; the first fan connector includes a first snap-fit, and the first fan has a first slot corresponding to the first snap-fit; or, the first fan connector has a first slot, and the first fan has a first snap-fit ​​corresponding to the first slot.

[0110] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes the element.

[0111] It should be noted that when a component is described as "fixed to" another component, it can be directly on the other component or may have a component in between. When a component is considered "connected to" another component, it can be directly connected to the other component or may have a component in between. When a component is considered "set on" another component, it can be directly set on the other component or may have a component in between. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0112] The various embodiments in this specification are described in a related manner. Similar or identical parts between embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, the system embodiments are basically similar to the method embodiments, so the description is relatively simple; relevant parts can be referred to the descriptions of the method embodiments.

[0113] The above are merely preferred embodiments of this application and are not intended to limit the scope of protection of this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application are included within the scope of protection of this application.

[0114] The server and rack system provided in this application have been described in detail above. Examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the above embodiments are only for the purpose of helping to understand the structure and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A server, characterized in that, include: The chassis, including the top plate and the bottom plate; The motherboard is located in the middle of the chassis. A first layout space is formed between the front of the motherboard and the top plate, and a second layout space is formed between the back of the motherboard and the bottom plate. The first component is disposed on the back of the motherboard and located within the second layout space; A first heat sink is disposed on at least one of the first components and located within the second layout space.

2. The server according to claim 1, characterized in that, The first heat sink includes a first fin portion, and at least one first receiving groove is provided at the end of the first fin portion away from the first component, and at least one first receiving groove is used for embedding a first liquid cooling pipe. The first fin portion is detachably connected to at least one first leveling member, and the at least one first leveling member is used to level at least one first receiving groove.

3. The server according to claim 1 or 2, characterized in that, The first radiator includes a first fin portion, the first fin portion includes a plurality of first fins, the first fin includes at least two first main body plates distributed at intervals along a first direction, and two adjacent first main body plates are connected by a first connecting plate. Each of the first fins has at least one cavity, and at least one first body plate in each of the first fins extends into the cavity of the adjacent first fin.

4. The server according to claim 3, characterized in that, Two adjacent first fins form a first heat dissipation channel. The first heat dissipation channel includes a plurality of first main channels spaced apart along the first direction. Two adjacent first main channels in the first heat dissipation channel are connected by a first connecting channel. Two adjacent first connecting channels in the first heat dissipation channel are located on both sides of the first main channel.

5. The server according to claim 1 or 2, characterized in that, It also includes a fan circuit board, which is flush with the motherboard, and a first fan module and a second fan module are connected to the front and back of the fan circuit board, respectively.

6. The server according to claim 1 or 2, characterized in that, The first component includes at least one voltage regulation module, and the first heat sink is disposed on at least one of the voltage regulation modules; The motherboard has a second component on its front side, which is located within the first layout space. The second component includes a central processing unit, and at least one voltage regulation module is located below the central processing unit.

7. The server according to claim 6, characterized in that, The central processing unit is also provided with a second heat sink, the structure of which is the same as that of the first heat sink.

8. The server according to claim 6, characterized in that, The first component also includes at least one of an integrated southbridge chip, a memory module, a baseboard management controller, a complex programmable logic device, a flash memory chip, and a battery module.

9. The server according to claim 8, characterized in that, When the first component includes the integrated southbridge chip, the server further includes a third heat sink disposed on the integrated southbridge chip, and the third heat sink is located within the second layout space.

10. The server according to claim 2, characterized in that, The first liquid cooling pipe has a circular cross-sectional shape, and the first receiving groove has a semi-circular cross-sectional shape.

11. The server according to claim 5, characterized in that, The front and back of the fan circuit board are respectively provided with a first fan connector group and a second fan connector group, and the first fan module and the second fan module are respectively pluggable and detachable connected to the first fan connector group and the second fan connector group.

12. The server according to claim 11, characterized in that, The second fan connector assembly includes at least one second fan connector, and the second fan module includes at least one second fan; The second fan connector includes a second latch, and the second fan has a second slot corresponding to the second latch; or, the second fan connector has a second slot, and the second fan has a second latch corresponding to the second slot.

13. The server according to claim 11, characterized in that, The first fan connector group includes at least one first fan connector, and the first fan module includes at least one first fan; The first fan connector includes a first latch, and the first fan has a first slot corresponding to the first latch; or, the first fan connector has a first slot, and the first fan has a first latch corresponding to the first slot.

14. The server according to claim 2, characterized in that, The first fin portion has at least one first receiving groove.

15. The server according to claim 1, characterized in that, The first component includes at least one of a voltage regulation module, an integrated southbridge chip, a memory module, a baseboard management controller, a complex programmable logic device, a flash memory chip, and a battery module.

16. The server according to claim 2, characterized in that, The first liquid cooling pipe includes two parallel liquid cooling sections with their ends connected, and two first receiving grooves for embedding the two liquid cooling sections.

17. The server according to claim 2, characterized in that, The chassis is provided with a liquid inlet and a liquid outlet, and the first liquid cooling pipe is connected to the liquid inlet and the liquid outlet.

18. The server according to claim 1, characterized in that, The server also includes an air guide assembly, which includes a first air guide located in the first layout space and a second air guide located in the second layout space.

19. A cabinet system, characterized in that, Includes server racks and servers as described in any one of claims 1 to 18.

20. The cabinet system according to claim 19, characterized in that, It also includes a liquid cooling device, which is connected to a first liquid cooling pipe in the server and is used to provide coolant to the first liquid cooling pipe.

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