Liquid cooled data center

Abstract

Provided is a liquid cooled data center, comprising: a plurality of server rooms which are arranged vertically, each comprising at least one group of computing devices; a plurality of heat dissipation devices, arranged on the outer sides of the server rooms and corresponding to the computing devices, wherein each heat dissipation device comprises a first cooling tower, a first gas inlet and a first gas outlet, each first heat dissipation channel comprises a first heat dissipation outlet, a first gas enters the heat dissipation device from the first gas inlet and is converted into a second gas after passing through the first cooling tower, and the second gas enters a first heat dissipation inlet from the first gas outlet and is discharged by means of the first heat dissipation outlet; and a plurality of first cooling liquid pipes, wherein the first cooling liquid pipes pass through the first cooling towers, a first cooling liquid and a second cooling liquid flow in the first cooling liquid pipes, the first cooling liquid absorbs heat from the computing devices and is then converted into the second cooling liquid, and the second cooling liquid exchanges heat with the first gas and is then converted into the first cooling liquid. The present invention can maximize the heat dissipation efficiency of a liquid cooling system, and avoid adverse effects of an air cooling system on the liquid cooling system.

Description

Liquid-cooled data center

[0001] This application claims priority to Chinese Patent Application No. 202410666472.4, filed May 27, 2024, entitled “Liquid-cooled data center and heat dissipation method, device, equipment and medium thereof,” and to Chinese Patent Application No. 202411178227.5, filed August 26, 2024, entitled “Liquid-cooled data center,” the contents of both of which are incorporated herein by reference in their entirety. TECHNICAL FIELD

[0002] The present application relates to the field of heat dissipation technology, and in particular to a liquid-cooled data center. BACKGROUND

[0003] There are facilities and equipment in the field for dissipating heat from computing devices (such as servers and the like) in data centers or computer rooms. As the performance of computing devices continues to improve, the demand for heat dissipation capacity of computing devices is also increasing, and the heat dissipation method has gradually developed from air cooling to liquid cooling. However, the design of the existing heat dissipation system is mainly based on air cooling, and the liquid cooling system is established on the basis of the air cooling system as an additional system, which limits the liquid cooling capacity of the existing heat dissipation system. Therefore, there is an urgent need in the field for a data center heat dissipation system based on a liquid cooling system, which can maximize the heat dissipation efficiency of the liquid cooling system and avoid the adverse effects of the air cooling system on the liquid cooling system. SUMMARY

[0004] To this end, the present application is committed to providing a liquid-cooled data center that can maximize the heat dissipation efficiency of the liquid cooling system and avoid the adverse effects of the air cooling system on the liquid cooling system.

[0005] In one aspect, the application provides a liquid-cooled data center, comprising: a plurality of machine rooms arranged in layers, each of the machine rooms comprising at least one group of computing devices; a plurality of heat dissipation devices arranged outside the machine rooms, wherein each of the heat dissipation devices is arranged corresponding to each of the at least one group of computing devices; the heat dissipation device comprises a first cooling tower, a first gas inlet and a first gas outlet, the first gas outlet is connected with a first heat dissipation inlet of a first heat dissipation channel, the first heat dissipation channel is arranged on the top of the heat dissipation device and further comprises a first heat dissipation outlet, the first gas inlet is connected with the outside, the first gas enters the heat dissipation device from the first gas inlet, the first gas becomes second gas after passing through the first cooling tower, the temperature of the second gas is higher than that of the first gas, the second gas enters the first heat dissipation inlet from the first gas outlet and is discharged through the first heat dissipation outlet; a plurality of first cooling liquid pipes, the first cooling liquid pipes pass through the first cooling tower, the first cooling liquid pipes flow with first cooling liquid and second cooling liquid whose temperature is higher than that of the first cooling liquid, the first cooling liquid becomes the second cooling liquid after absorbing heat from the computing devices in the first cooling liquid pipes, and the second cooling liquid becomes the first cooling liquid after exchanging heat with the first gas in the first cooling tower.

[0006] According to the present aspect, the liquid-cooled data center has a plurality of heat dissipation devices, which cool the computing devices in a liquid-cooled manner. In the arrangement of the heat dissipation devices, one heat dissipation device is arranged corresponding to one group of computing devices, so that the failure domain of the heat dissipation device is concentrated in the area of one group of computing devices. When a heat dissipation device fails, only one group of computing devices is affected, and other groups of computing devices are not affected. In addition, by arranging a plurality of heat dissipation devices for each layer of machine rooms, the failure domain of the heat dissipation devices is reduced, so that the failure of the heat dissipation system at a certain position only affects the heat dissipation of one or more groups of computing devices in one layer, and does not affect the entire machine room. In addition, the heat dissipation devices are arranged outside the machine rooms instead of being arranged on the top of the machine rooms, so that the cold air for cooling the hot liquid can enter from the side of the machine room, and the hot air after exchanging heat with the hot liquid can be discharged from the top of the machine room. In this way, the cold air and the hot air do not affect each other, so as to reduce the heat dissipation capacity of the heat dissipation device.

[0007] In one possible implementation of the application, the first gas inlet is arranged on the side of the heat dissipation device away from the machine room, and the first heat dissipation outlet is arranged above the machine room on the top layer.

[0008] According to the present implementation, the first gas inlet is arranged on the side vertical surface of the machine room, and the first heat dissipation outlet is arranged on the top vertical surface of the machine room, so that the hot air and the cold air are separated, and the cold air and the hot air do not affect each other, especially the hot air is not sucked into the cold air, which reduces the heat dissipation capacity of the cold air, thereby improving the heat dissipation efficiency of the heat dissipation system.

[0009] In a possible implementation of the present application, the heat dissipation device further comprises a second gas inlet and a second gas outlet, the machine room comprises a third gas inlet, the second gas outlet is in communication with the third gas inlet, the first heat dissipation channel further comprises a second heat dissipation inlet, the second heat dissipation inlet is in communication with the machine room, the heat dissipation device introduces the third gas from the outside through the second gas inlet, the third gas leaves the heat dissipation device through the second gas outlet and enters the machine room through the third gas inlet, the third gas becomes the fourth gas with a higher temperature than the third gas after heat exchange with the computing device in the machine room, the fourth gas enters the first heat dissipation channel through the second heat dissipation inlet and is discharged through the first heat dissipation outlet.

[0010] According to the present implementation, the heat dissipation device further has an air cooling part, so that the heat dissipation device has both liquid cooling and air cooling functions, thereby improving the integration of the heat dissipation device.

[0011] In a possible implementation of the present application, the heat dissipation device further comprises a fan, and the fan is configured to suck the first gas from the outside.

[0012] According to the present implementation, the fan is configured to suck the cold air, so that the speed and intensity of the cold air suction can be improved, and the heat dissipation capacity of the heat dissipation device can be improved.

[0013] In a possible implementation of the present application, the heat dissipation device further comprises a filter screen, and the filter screen is configured to filter the first gas from the outside.

[0014] According to the present implementation, the filter screen is configured to filter the cold air from the outside, so that the computing device in the machine room can be protected from the influence of impurities in the air.

[0015] In a possible implementation of the present application, in the first cooling tower, the first gas is in direct contact with the second cooling liquid.

[0016] According to the present implementation, when the first gas is in direct contact with the second cooling liquid, the heat in the second cooling liquid can be more easily dissipated into the first gas, so that the heat exchange speed can be improved, and the heat exchanger has a simple structure.

[0017] In a possible implementation of the present application, the liquid-cooled data center further comprises a plurality of second cooling liquid pipes passing through the computer room and in contact with the computing devices, and the heat dissipation device further comprises a plate heat exchanger connected with the first cooling liquid pipes and the second cooling liquid pipes, the first cooling liquid in the first cooling liquid pipes exchanges heat with the third cooling liquid in the second cooling liquid pipes in the plate heat exchanger in an indirect contact manner, and the first cooling liquid becomes the second cooling liquid after heat exchange, and the third cooling liquid becomes the fourth cooling liquid with a lower temperature than the third cooling liquid.

[0018] According to the present implementation, since the second cooling liquid is in direct contact with the first gas, impurities in the air may be mixed into the liquid, causing the liquid to become dirty. By arranging the plate heat exchanger, the liquid mixed with impurities will not directly flow to the computing devices, which is conducive to protecting the computing devices from dirty water and ensuring that the heat dissipation system does not negatively affect the performance of the computing devices.

[0019] In a possible implementation of the present application, in the first cooling tower, the first gas is in indirect contact with the second cooling liquid.

[0020] According to the present implementation, the second cooling liquid is in indirect contact (i.e., not in direct contact) with the first gas, so that impurities in the air outside will not be mixed into the second cooling liquid, which is conducive to ensuring water quality. Such liquid can be directly supplied to the computing devices without the need to install a plate heat exchanger, which is conducive to reducing system manufacturing costs and reducing the structure and process of primary heat exchange.

[0021] In a possible implementation of the present application, the first cooling liquid pipes pass through the computer room and are in contact with the computing devices.

[0022] According to the present implementation, by arranging the first cooling liquid pipes to pass through the computer room and be in contact with the computing devices, the first cooling liquid can absorb heat from the computing devices in the computer room and dissipate the heat in the first cooling tower. This arrangement enables the first cooling liquid to directly enter the computer room and exchange heat with the computing devices, thereby reducing the number of heat exchange stages of the cooling liquid, which is conducive to simplifying the structure and improving heat exchange efficiency.

[0023] In a possible implementation of the present application, the liquid-cooled data center further comprises a second cooling tower and a plurality of air walls, the plurality of air walls are arranged on the side walls of the computer room, each air wall is arranged corresponding to each group of computing devices, the second cooling tower is arranged on the top of the computer room on the top floor, the air wall comprises a fourth gas inlet and a fourth gas outlet, a fifth gas from the computer room enters the air wall through the fourth gas inlet, exchanges heat with a fifth cooling liquid from the second cooling tower in the air wall and becomes a sixth gas with a lower temperature than the fifth gas, and the sixth gas is sent into the computer room through the fourth gas outlet.

[0024] According to the present embodiment, the air cooling effect is provided to the machine room by the wind wall, so that the air cooling effect is enhanced. In the second cooling tower, the fifth gas is cooled by the cold liquid, so that the heat of the high-temperature gas can be absorbed more quickly, thereby making the hot air in the machine room become cold air more quickly, and the air cooling effect is improved. BRIEF DESCRIPTION OF DRAWINGS

[0025] Hereinafter, a specific embodiment of the present application will be described in detail with reference to the accompanying drawings, in which:

[0026] Fig. 1 shows a schematic diagram of a piping structure of a liquid-cooled data center according to an embodiment of the present application;

[0027] Fig. 2 shows a schematic diagram of a structure of a liquid-cooled data center according to an embodiment of the present application;

[0028] Fig. 3 shows a schematic diagram of a structure of a liquid-cooled data center according to the embodiment of Fig. 2;

[0029] Fig. 4 shows a schematic diagram of a structure of a liquid-cooled data center according to another embodiment of the present application;

[0030] Fig. 5 shows a schematic diagram of a structure of a liquid-cooled data center according to the embodiment of Fig. 4;

[0031] Fig. 6 shows a schematic diagram of a side view of a structure of a liquid-cooled data center according to an embodiment of the present application;

[0032] Fig. 7 shows a schematic diagram of a top view of a structure of a liquid-cooled data center according to the embodiment of Fig. 6;

[0033] Fig. 8 shows a schematic diagram of a structure of a heat dissipation device according to an embodiment of the present application;

[0034] Fig. 9 shows a schematic diagram of a structure of a closed tower used in the heat dissipation device according to the embodiment of Fig. 8;

[0035] Fig. 10 shows a schematic diagram of a structure of a heat dissipation device according to another embodiment of the present application;

[0036] Fig. 11 shows a schematic diagram of a structure of an open tower used in the heat dissipation device according to the embodiment of Fig. 10;

[0037] Fig. 12 shows a schematic diagram of a side view of a structure of a liquid-cooled data center according to an embodiment of the present application;

[0038] Fig. 13 shows a schematic diagram of a top view of a structure of a liquid-cooled data center according to the embodiment of Fig. 12;

[0039] Fig. 14 shows a schematic diagram of a side view of a structure of a liquid-cooled data center according to another embodiment of the present application;

[0040] Fig. 15 shows a schematic diagram of a top view of a structure of a liquid-cooled data center according to the embodiment of Fig. 14;

[0041] FIG. 16 shows a side view structural schematic diagram of a liquid-cooled data center according to another embodiment of the present application;

[0042] FIG. 17 shows a top view structural schematic diagram of the liquid-cooled data center according to the embodiment of FIG. 16;

[0043] FIG. 18 shows a side view structural schematic diagram of a liquid-cooled data center according to another embodiment of the present application;

[0044] FIG. 19 shows a top view structural schematic diagram of the liquid-cooled data center according to the embodiment of FIG. 18;

[0045] FIG. 20 shows a side view structural schematic diagram of a liquid-cooled data center according to another embodiment of the present application;

[0046] FIG. 21 shows a top view structural schematic diagram of the liquid-cooled data center according to the embodiment of FIG. 20. DETAILED DESCRIPTION

[0047] In order to make the concept and thought of the present application more clearly understood by those skilled in the art, the present application is described in detail below in conjunction with specific embodiments. It should be understood that the embodiments given herein are only a part of all the embodiments that the present application can have. Those skilled in the art can make improvements, modifications, or replacements to part or whole of the following embodiments after reading the description of the present application, and these improvements, modifications, or replacements are also included in the scope of protection that the present application requires.

[0048] In this document, the terms "one", "a", and other similar words are not intended to mean that only one of the described things exists, but that the description is directed to only one of the described things, which can have one or more. In this document, the terms "contain", "include", and other similar words are intended to mean logical interrelation, and cannot be regarded as indicating spatial structural relation. For example, "A includes B" is intended to mean that B logically belongs to A, and does not mean that B is located inside A in space. In addition, the meaning of the terms "contain", "include", and other similar words should be regarded as open, rather than closed. For example, "A includes B" is intended to mean that B belongs to A, but B does not necessarily constitute all of A, and A can also include C, D, E, and other elements.

[0049] In this document, the terms "first", "second", and other similar terms are not intended to imply any order, quantity, or importance, but are merely used to distinguish different elements. In this document, the terms "embodiment", "this embodiment", "one embodiment", "an embodiment", and the like do not mean that the description only applies to one particular embodiment, but also means that the description can also apply to another or more embodiments. Those skilled in the art should understand that any description made for one embodiment in this document can be replaced, combined, or otherwise combined with the description of another or more embodiments, and the new embodiments generated by the replacement, combination, or other combination are within the scope of protection of the present application.

[0050] The following introduces the definitions of some terms related to the present application.

[0051] Liquid-cooled data center: A data center that uses a liquid medium to dissipate or remove heat. A data center can refer to a facility or building that houses data processing, storage, or computing equipment, where multiple computers, servers, and the like are densely placed to implement large-scale computing or data processing. The equipment in the data center generates a large amount of heat when working, and the liquid-cooled data center absorbs the heat generated by the computing equipment and dissipates it to the outside through the liquid working medium, thereby ensuring the long-term normal operation of the computing equipment.

[0052] Machine room: A room or building in which computing equipment is installed. The machine room can be a data center, disaster recovery center, computing power center, and the like commonly used in the art.

[0053] Computing equipment: Equipment with computing, data processing, or data storage functions, such as smartphones, computers, servers, storage devices, and the like.

[0054] Machine room cooling system: A system for providing cooling functions to a machine room and computing equipment in the machine room. The machine room cooling system usually includes refrigeration or cooling equipment and piping components. The machine room cooling system can include air-cooled and / or liquid-cooled parts.

[0055] Working medium: Working substance for heat and work conversion. In a cooling device or system, the working medium is an intermediate substance or medium that absorbs or releases heat, and heat dissipation and transfer are achieved through the flow and heat transfer of the working medium.

[0056] Cooling tower: A device that uses the contact between water and air to dissipate waste heat generated in industry or refrigeration and air conditioning through evaporation. The cooling tower exchanges heat from the liquid to the air, reducing the temperature of the water supplied to the machine room. According to different implementation methods, it is divided into open tower and closed tower.

[0057] CHU: Coolant Handling Units, a heat dissipation device. Coolant Handling Units achieve heat transfer and dissipation through the delivery and processing of coolant, which can be air or coolant.

[0058] AHU: Air Handling Units, a device for achieving air cooling. Air Handling Units achieve heat transfer and dissipation of target objects through the delivery and processing of air, usually with a fan or other device to drive air movement or expansion / contraction.

[0059] CDU: Coolant Distribution Unit, a device for distributing coolant to heat sources or heat-generating objects to achieve thermal effects. Through the driving and delivery of the Coolant Distribution Unit, the coolant exchanges heat with the heat source, thereby transferring the heat of the heat source to other places or dissipating it.

[0060] Traditional server CPU (Central Processing Unit) power is relatively low, generally air-cooled server, CPU will be installed on the radiator, fan group to provide cold wind blowing through the radiator to take away the heat generated by the CPU, while the memory, hard disk, network card and other components are also the same through the wind to take away the heat dissipation. Such servers are deployed in air-cooled machine rooms, which only need to send cold air and exhaust hot air.

[0061] With the increasing power of server CPU, starting through the wind cooling has not been able to meet the requirements of CPU, so there are liquid-cooled servers. The current stage is the most typical cold plate liquid-cooled server, which replaces the radiator of the air-cooled server with a cold plate. Cold water enters the cold plate and exchanges heat with the cold plate to become hot water, which is discharged to take away the heat of the CPU to achieve heat dissipation. Since water has a larger specific heat capacity than air, the heat dissipation capacity is greatly improved. But the hard disk, memory, network card and other components do not have a cold plate, so they still need to be cooled by the wind. Such servers are generally deployed in liquid-cooled machine rooms, which need to supply both cold water and cold air.

[0062] As shown in FIG. 1, the liquid cooling part of the machine room generally has three sets of pipe networks (for reliability, the design is ring-shaped, which is also called ring pipe) due to the difference of working medium. The water of the primary pipe network directly exchanges heat with air, and the water quality is the worst. The secondary pipe network circulates heat in the closed pipe inside the machine room, and the water quality is better. The water in the tertiary pipe network enters the cold plate of the server, and the water quality requirement is very high. The liquid in the liquid-cooled server is first connected with the CDU through the three pipe networks, exchanges heat with the liquid in the secondary pipe network through the CDU, the liquid in the secondary pipe network exchanges heat with the liquid in the primary pipe network through the plate heat exchanger (abbreviated as plate), and finally the liquid in the primary pipe network exchanges heat with air through the cooling tower, and the heat of the CPU of the server is finally transmitted to the air.

[0063] FIGS. 2 and 3 show a structural schematic diagram of a liquid-cooled data center according to an embodiment of the present application.

[0064] As shown in FIG. 2, the present embodiment adopts an AHU+cooling tower scheme. Taking a three-story machine room as an example, the AHU 210 is deployed on the left side to supply air to the server 230, and the cooling tower 220 is placed at the top end of the machine room to supply liquid to the server 230.

[0065] As shown in FIG. 3, the problem of such a liquid-cooled data center is that: (1) the cooling tower is deployed at the top of the machine room. If the spacing of the cooling tower is not large enough, it will cause air duct disorder, and the hot air from the cooling tower will be sucked into the cooling tower, thereby reducing the cooling capacity of the cooling tower. If the spacing of the cooling tower is relatively large, the number of cooling towers deployed in the limited area on the roof will be reduced, which also reduces the total liquid cooling capacity; (2) the fault domain of the primary pipe network 240 and the secondary pipe network 250 is the entire machine room level. Once the pipe bursts, all the servers below will not be able to run, and the pipe and the machine room are very coupled, which requires to be installed together when building the house; (3) the heat exchange stages from the cooling tower to the server are many. If the cooling tower supplies water at 32°C, the actual water supply temperature to the server may have reached 40°C, which is not conducive to server heat dissipation; (4) the air inlet and outlet of the AHU are on the same side, and the exhaust well blocks the air inlet channel, thereby reducing the capacity of the AHU. At the same time, the exhaust air of the AHU goes to the top of the machine room, which will also be sucked into the cooling tower, thereby reducing the cooling capacity of the cooling tower.

[0066] FIGS. 4 and 5 show a structural schematic diagram of a liquid-cooled data center according to an embodiment of the present application.

[0067] As shown in FIG. 4, the present embodiment adopts a "wind wall+cooling tower" scheme. The difference between the "wind wall+cooling tower" scheme and the "AHU+cooling tower" scheme is that the wind part of the AHU is replaced by the wind wall 410.

[0068] As shown in FIG. 5, the problem of such a liquid-cooled data center is that: the first to third problems of the embodiments of FIG. 2 and FIG. 3 also exist; in addition, the wind side relative to the "AHU + cooling tower" scheme increases the problem of large failure domain of the primary header. Specifically, the primary header 420 is in communication with the entire air wall 410 of the machine room, and once a failure occurs, the entire air wall 410 of the machine room must stop running, causing the failure loss to increase.

[0069] FIGS. 6 and 7 show structural schematic diagrams of a liquid-cooled data center according to an embodiment of the present application.

[0070] In the embodiment, the liquid-cooled data center comprises a plurality of machine rooms 610, a plurality of heat dissipation devices 630 and a plurality of first cooling liquid pipes 640. The plurality of machine rooms 610 are arranged in up-down direction, and each of the plurality of machine rooms 610 comprises at least one group of computing devices 620. The plurality of heat dissipation devices 630 are arranged outside the plurality of machine rooms 610, and each of the plurality of heat dissipation devices 630 is arranged corresponding to each of the at least one group of computing devices 620. The heat dissipation device 630 comprises a first cooling tower 631, a first gas inlet 632 and a first gas outlet 633, the first gas outlet 633 is connected with a first heat dissipation inlet 651 of a first heat dissipation channel 650, the first heat dissipation channel 650 is arranged on top of the heat dissipation device 630 and further comprises a first heat dissipation outlet 652, the first gas inlet 632 is connected with the outside, the first gas enters the heat dissipation device 630 from the first gas inlet 632, the first gas becomes second gas after passing through the first cooling tower 631, the temperature of the second gas is higher than that of the first gas, the second gas enters the first heat dissipation inlet 651 from the first gas outlet 633 and is discharged through the first heat dissipation outlet 652. The first cooling liquid pipe passes through the first cooling tower 631, and the first cooling liquid pipe flows with first cooling liquid and second cooling liquid whose temperature is higher than that of the first cooling liquid, the first cooling liquid becomes the second cooling liquid after absorbing heat from the computing devices 620 in the first cooling liquid pipe, and the second cooling liquid becomes the first cooling liquid after exchanging heat with the first gas in the first cooling tower 631. The liquid-cooled data center has a plurality of heat dissipation devices 630, and the computing devices 620 are cooled by liquid cooling. In the arrangement of the heat dissipation device, one heat dissipation device 630 corresponds to one group of computing devices 620, so that the failure domain of the heat dissipation device 630 is concentrated in the area of one group of computing devices. When one heat dissipation device 630 fails, only one group of computing devices 620 is affected, and other groups of computing devices 620 are not affected. In addition, by arranging a plurality of heat dissipation devices 630 for each layer of machine room, the failure domain of the heat dissipation device 630 is reduced, so that the failure of the heat dissipation system in a certain part only affects the heat dissipation of one or more groups of computing devices 620 in one layer, and does not affect the whole machine room 610. In addition, the heat dissipation device 630 is arranged outside the machine room 610 instead of being arranged on top of the machine room 610, so that the cold air for cooling the hot liquid can enter from the side of the machine room 610, and the hot air after exchanging heat with the hot liquid can be discharged from the top of the machine room 610, so that the cold air and the hot air do not affect each other and thus the heat dissipation capacity of the heat dissipation device 630 is reduced.

[0071] In this embodiment, the first gas inlet 632 is arranged on the side of the heat dissipation device 630 away from the computer room 610, and the first heat dissipation outlet 652 is arranged above the computer room 610 on the top floor. The first gas inlet 632 is arranged on the side vertical surface of the computer room 610, and the first heat dissipation outlet 652 is arranged on the top vertical surface of the computer room 610, so that the hot gas and the cold gas are separated, so that the cold gas and the hot gas do not affect each other, especially the hot gas is not sucked into the cold gas, causing the heat dissipation capacity of the cold gas to be reduced, thereby improving the heat dissipation efficiency of the heat dissipation system.

[0072] As shown in FIG. 6, the heat dissipation device 630 is arranged outside the computer room 610 (arranged on the left side in the figure), that is, arranged on one side outside the computer room. In some embodiments, the outside of the computer room 610 only includes one side in the horizontal direction, such as the left side, the right side, the front side, and the back side, and does not include one side in the vertical direction, such as the top side and the bottom side.

[0073] As shown in FIG. 7, three groups of computing devices 620 are arranged in the computer room 610, and three heat dissipation devices 630 are arranged outside the computer room, and each group of computing devices 620 is arranged in correspondence with each heat dissipation device 630. Those skilled in the art should know that although the group of computing devices 620 shown in FIG. 7 is a group of computing devices 620 arranged in a row in the vertical direction, the arrangement of the group of computing devices can be in various forms, such as arranged in a row in the horizontal direction, arranged in a circle, etc. In addition, although three heat dissipation devices 630 are arranged in a row in the horizontal direction in FIG. 7, corresponding to the vertically arranged computing devices 620, those skilled in the art should know that the correspondence between the heat dissipation device 630 and the group of computing devices can also be in other forms, such as the heat dissipation device 630 arranged in a row in the vertical direction on the left side or the right side (relative to the position relationship in FIG. 7) of the computer room 610 and corresponding to multiple groups of computing devices 620.

[0074] FIG. 8 shows a structural schematic diagram of a heat dissipation device of a liquid-cooled data center according to an embodiment of the present application.

[0075] In the embodiment, the heat dissipation device 800 comprises a first cooling tower 810, a first gas inlet 820, a first gas outlet 830, a second gas inlet 840 and a second gas outlet 850. The first gas inlet 820 is in communication with the outside, the first gas enters the heat dissipation device from the first gas inlet 820, the first gas becomes the second gas after passing through the first cooling tower 810, the temperature of the second gas is higher than that of the first gas, and the second gas leaves the heat dissipation device 800 through the first gas outlet 830. The heat dissipation device 800 introduces the third gas from the outside through the second gas inlet 840, and the third gas leaves the heat dissipation device 800 through the second gas outlet 850 and enters the computer room. The liquid cooling data center further comprises a first cooling liquid pipeline 860, the first cooling liquid pipeline 860 passes through the first cooling tower 810, and the first cooling liquid and the second cooling liquid with a higher temperature than the first cooling liquid flow in the first cooling liquid pipeline 860, the first cooling liquid becomes the second cooling liquid after absorbing heat from the computing device in the first cooling liquid pipeline 860, and the second cooling liquid becomes the first cooling liquid after heat exchange with the first gas in the first cooling tower 810.

[0076] In the embodiment, the heat dissipation device 800 further comprises a fan 870, and the fan 870 is used to suck the first gas from the outside. By sucking the cold air through the fan 870, the suction speed and intensity of the cold air can be improved, and the heat dissipation capacity of the heat dissipation device can be enhanced.

[0077] In the embodiment, the heat dissipation device 800 further comprises a filter screen 880, and the filter screen 880 is used to filter the first gas from the outside. By filtering the cold air from the outside through the filter screen 880, the impurities and pollutants in the outside air can be avoided to affect the computing device in the computer room, and the computing device can be protected from the influence of air impurities.

[0078] In the embodiment, in the first cooling tower 810, the first gas is in indirect contact with the second cooling liquid. The indirect contact (i.e. not direct contact) between the second cooling liquid and the first gas ensures that impurities in the outside air are not mixed into the second cooling liquid, and the water quality is guaranteed. Such liquid can be directly supplied to the computing device, and a plate heat exchanger does not need to be installed, which is conducive to reducing the system manufacturing cost and reducing the structure and process of primary heat exchange.

[0079] In the embodiment, the first cooling liquid pipeline 860 passes through the computer room and is in contact with the computing device. By making the first cooling liquid pipeline 860 pass through the computer room and be in contact with the computing device, the first cooling liquid can absorb the heat of the computing device in the computer room and dissipate the heat in the first cooling tower 810. This arrangement can make the first cooling liquid directly enter the computer room and exchange heat with the computing device, thereby reducing the heat exchange stages of the cooling liquid, simplifying the structure and improving the heat exchange efficiency.

[0080] As shown in FIG. 8, the first cooling tower 810 in this embodiment is a closed tower, i.e. the liquid and gas in the first cooling tower 810 exchange heat with each other without direct contact. The first cooling tower 810 introduces hot water from the computer room and cold air from the outside. After the heat exchange between the hot water and the cold air in the first cooling tower 810, the hot water becomes cold water and is supplied to the computer room, and the cold air becomes hot air and is discharged from the top. The fan 870 is arranged on the right side of the heat dissipation device 800 and blows air outward, thereby sucking the outside air into the heat dissipation device 800 from the left side of the heat dissipation device 800. The filter screen 880 is arranged in the air channel in the heat dissipation device 800 and filters the outside air sucked by the fan 870.

[0081] FIG. 9 shows a structural schematic diagram of the closed tower used in the heat dissipation device according to the embodiment of FIG. 8.

[0082] As shown in FIG. 9, the closed tower is independent of the water supply to the computer room, and the water for spraying cooling in the cooling tower (which is in contact with the outside and is relatively dirty) is isolated from the water supplied to the computer room.

[0083] FIG. 10 shows a structural schematic diagram of the heat dissipation device of the liquid-cooled data center according to an embodiment of the present application.

[0084] In this embodiment, the heat dissipation device 1000 includes a first cooling tower 1010, a first gas inlet 1020, a first gas outlet 1030, a second gas inlet 1040, and a second gas outlet 1050. The first gas inlet 1020 is in communication with the outside, the first gas enters the heat dissipation device 1000 from the first gas inlet 1020, the first gas becomes the second gas after passing through the first cooling tower 1010, the temperature of the second gas is higher than that of the first gas, and the second gas leaves the heat dissipation device 1000 through the first gas outlet 1030. The heat dissipation device 1000 introduces the third gas from the outside through the second gas inlet 1040, the third gas leaves the heat dissipation device 1000 through the second gas outlet 1050 and enters the computer room. The liquid-cooled data center further includes a first cooling liquid pipeline 1060, the first cooling liquid pipeline 1060 passes through the first cooling tower 1010, and the first cooling liquid pipeline 1060 flows with the first cooling liquid and the second cooling liquid whose temperature is higher than that of the first cooling liquid, the first cooling liquid becomes the second cooling liquid after absorbing heat from the computing device in the first cooling liquid pipeline 1060, and the second cooling liquid becomes the first cooling liquid after exchanging heat with the first gas in the first cooling tower 1010.

[0085] In this embodiment, the first gas is in direct contact with the second cooling liquid in the first cooling tower 1010. When the first gas is in direct contact with the second cooling liquid, the heat in the second cooling liquid is more easily dissipated into the first gas, so that the heat exchange speed is accelerated, and such a heat exchanger has a simple structure. When a cooling tower is used, the first cooling tower 1010 in which the hot liquid is in direct contact with the cold air is an open tower, and the open tower has the advantages of fast heat exchange speed and simple structure.

[0086] In the embodiment, the liquid-cooled data center further comprises a plurality of second cooling liquid pipes 1070 passing through the machine room and in contact with the computing devices, and the heat dissipation device further comprises a plate heat exchanger 1080 connected with the first cooling liquid pipes 1060 and the second cooling liquid pipes 1070, the first cooling liquid in the first cooling liquid pipes 1060 exchanges heat with the third cooling liquid in the second cooling liquid pipes 1070 in the plate heat exchanger in indirect contact, and after the heat exchange, the first cooling liquid becomes the second cooling liquid and the third cooling liquid becomes the fourth cooling liquid with a lower temperature than the third cooling liquid. Since the second cooling liquid is in direct contact with the first gas, impurities in the air can be mixed into the liquid, causing the liquid to become dirty. By providing the plate heat exchanger, the liquid mixed with impurities will not directly flow to the computing devices, which is conducive to protecting the computing devices from sewage and ensuring that the heat dissipation system will not have a negative impact on the performance of the computing devices. As shown in FIG. 10, the first cooling tower 1010 used in the embodiment is, for example, an open tower, that is, the liquid and gas in the first cooling tower 1010 exchange heat directly. Since the liquid is in direct contact with the external air, impurities in the external air can contaminate the liquid in the first cooling tower 1010, and therefore the plate heat exchanger 1080 is added in the embodiment. In the plate heat exchanger 1080, the liquid in the first cooling tower 1010 and the liquid supplied to the machine room exchange heat without direct contact, thereby ensuring that the cooling liquid supplied to the machine room will not be seriously contaminated.

[0087] FIG. 11 shows a structural schematic diagram of an open tower used in the heat dissipation device according to the embodiment of FIG. 10.

[0088] As shown in FIG. 11, the open tower is combined with the water for spraying cooling, so the water supplied to the machine room is relatively dirty, and a plate heat exchanger needs to be added in actual application.

[0089] FIGS. 12 and 13 show structural schematic diagrams of a liquid-cooled data center according to an embodiment of the present application, wherein FIG. 12 shows a side view and FIG. 13 shows a top view.

[0090] In the embodiment, the liquid-cooled data center comprises a plurality of machine rooms 1210, a plurality of heat dissipation devices 1230 and a plurality of first cooling liquid pipes 1240. The plurality of machine rooms 1210 are arranged in up-down direction, and each of the plurality of machine rooms 1210 comprises at least one group of computing devices 1220. The plurality of heat dissipation devices 1230 are arranged outside the plurality of machine rooms 1210, wherein each of the plurality of heat dissipation devices 1230 is arranged corresponding to each of the at least one group of computing devices 1220. The heat dissipation device 1230 comprises a first cooling tower 1231, a first gas inlet 1232 and a first gas outlet 1233, the first gas outlet 1233 is connected with a first heat dissipation inlet 1251 of a first heat dissipation channel (comprising a first floor exhaust pipe 1201, a second floor exhaust pipe 1202 and a third floor exhaust pipe 1203), the first heat dissipation channel is arranged on top of the heat dissipation device 1230 and further comprises a first heat dissipation outlet (comprising a first floor heat dissipation device exhaust port 1204a, a second floor heat dissipation device exhaust port 1205a, a third floor heat dissipation device exhaust port 1206a, a first floor machine room exhaust port 1204b, a second floor machine room exhaust port 1205b and a third floor machine room exhaust port 1206b), the first gas inlet 1232 is connected with the outside, the first gas enters the heat dissipation device 1230 from the first gas inlet 1232, the first gas becomes second gas after passing through the first cooling tower 1231, the temperature of the second gas is higher than that of the first gas, the second gas enters the first heat dissipation inlet 1251 from the first gas outlet 1233 and is discharged through the first heat dissipation outlet. The first cooling liquid pipe passes through the first cooling tower 1231, the first cooling liquid pipe flows with first cooling liquid and second cooling liquid whose temperature is higher than that of the first cooling liquid, the first cooling liquid becomes the second cooling liquid after absorbing heat from the computing device 1220 in the first cooling liquid pipe, and the second cooling liquid becomes the first cooling liquid after exchanging heat with the first gas in the first cooling tower 1231. In the embodiment, the first gas inlet 1232 is arranged on the side of the heat dissipation device 1230 away from the machine room 1210, and the first heat dissipation outlet is arranged above the machine room 1210 located on the top floor.

[0091] In the embodiment, the heat dissipation device further comprises a second gas inlet 1234 and a second gas outlet 1235, the machine room comprises a third gas inlet 1211, the second gas outlet 1234 is in communication with the third gas inlet 1211, the first heat dissipation channel further comprises a second heat dissipation inlet 1253, the second heat dissipation inlet 1253 is in communication with the machine room, the heat dissipation device 1230 introduces the third gas from the outside through the second gas inlet 1234, the third gas leaves the heat dissipation device 1230 through the second gas outlet 1235 and enters the machine room 1210 through the third gas inlet 1211, the third gas becomes the fourth gas with a higher temperature than the third gas after heat exchange with the computing device 1220 in the machine room 1210, the fourth gas enters the first heat dissipation channel through the second heat dissipation inlet 1253 and is discharged through the first heat dissipation outlet. The heat dissipation device 1230 further has an air cooling part, so that it has both liquid cooling and air cooling heat dissipation functions, thereby making the heat dissipation device 1230 of the application have higher integration. By arranging the air cooling part in the heat dissipation device 1230, the second gas inlet 1234 of the air cooling part can also be arranged on the side of the machine room 1210, so that the third gas from the outside enters from the side, thereby avoiding the hot air (the fourth gas) discharged from the machine room 1210 from affecting the cold air (the third gas) sucked, and greatly improving the heat dissipation efficiency.

[0092] As shown in FIG. 12, the first heat dissipation channel comprises a first floor exhaust pipe 1201, a second floor exhaust pipe 1202 and a third floor exhaust pipe 1203. The first floor exhaust pipe 1201 is in communication with the heat dissipation device 1210 and the server cabinet 1220 on the first floor. The second floor exhaust pipe 1202 is in communication with the heat dissipation device 1210 and the server cabinet 1230 on the second floor. The third floor exhaust pipe 1203 is in communication with the heat dissipation device 1210 and the server cabinet 1220 on the third floor. The part of the exhaust pipe in communication with the heat dissipation device 1210 is the first heat dissipation inlet 1251, and the part of the exhaust pipe in communication with the server cabinet 1220 is the second heat dissipation inlet 1253. The first heat dissipation outlet of the exhaust pipe is arranged at the top of the third floor of the machine room 1210, and the first heat dissipation outlet in communication with the heat dissipation device 1230 comprises a first floor heat dissipation device exhaust port 1204a, a second floor heat dissipation device exhaust port 1205a and a third floor heat dissipation device exhaust port 1206a, and the first heat dissipation outlet in communication with the machine room comprises a first floor machine room exhaust port 1204b, a second floor machine room exhaust port 1205b and a third floor machine room exhaust port 1206b. In FIG. 12, the exhaust pipe of the heat dissipation device 1210 and the exhaust pipe of the server cabinet 1220 are arranged in the same pipe (i.e. the exhaust pipes on the first to third floors). In actual arrangement, the exhaust pipe of the heat dissipation device 1210 and the exhaust pipe of the server cabinet 1220 can be arranged separately, thereby forming separate exhaust ports (i.e. the heat dissipation device exhaust port and the machine room exhaust port are separate) as shown in FIG. 13.

[0093] As shown in FIG. 12, the heat dissipation device 1210 is mainly composed of CHU (including a cooling tower, a plate exchanger, and a wind wall fan) and an exhaust air pipeline. In order to prevent the exhaust air of different floors from affecting each other, the vertical exhaust air part is designed as an independent exhaust air pipeline. In some embodiments, the first floor exhaust air pipeline 1231, the second floor exhaust air pipeline 1232, and the third floor exhaust air pipeline 1233 can also be designed as a whole. In some embodiments, the first floor heat dissipation device exhaust port 1231a, the second floor heat dissipation device exhaust port 1232a, the third floor heat dissipation device exhaust port 1233a, the first floor machine room exhaust port 1231b, the second floor machine room exhaust port 1232b, and the third floor machine room exhaust port 1233b can also be designed as a whole first heat dissipation outlet.

[0094] As shown in FIG. 13, the server cabinets 1220 are arranged in 8 rows, and each row of server cabinets 1220 constitutes a micro module, and a liquid cooling ring pipe 1260 is arranged in the micro module. Each row of server cabinets 1220 corresponds to a heat dissipation device 1210. Therefore, there are 8 heat dissipation devices for daily work. In FIG. 13, a total of 9 heat dissipation devices are shown, and the rightmost heat dissipation device is a standby heat dissipation device. An air equalization cavity 1270 is arranged between the heat dissipation device 1210 and the server cabinet 1220.

[0095] The liquid cooling part in the embodiment is described as follows. The cold air enters from the side of the machine room, enters the cooling tower in the heat dissipation device 1210, and becomes high-temperature air containing humid hot vapor after heat exchange with the liquid in the cooling tower. The high-temperature air is discharged from the top, enters the horizontal exhaust air pipeline, and is finally discharged from the machine room by the vertical air pipeline, thereby taking out the heat from the machine room and outputting low-temperature water. The low-temperature water provided by the heat dissipation device 1210 is sent to the nearest server cabinet 1220 through the pipeline ring network, becomes hot water after heat exchange with the liquid cooling server, and returns to the heat dissipation device 1210. After being cooled by the cooling tower of the heat dissipation device 1210, the hot water enters the next cycle.

[0096] The air cooling part in the embodiment is described as follows. The air cooling AHU (in the form of straight-through air in the figure, which can be designed as a separate part together with the cooling tower, etc.) is integrated in the heat dissipation device 1210. The external cold air passes through the filter screen and is blown into the cold channel of the micro module of the machine room by the fan, is sucked from the front by the server cabinet 1220, becomes hot air after being heated by the server cabinet 1220, is discharged to the hot channel of the micro module of the machine room by the rear of the server cabinet 1220, and is then discharged to the vertical air pipeline to be discharged from the top of the machine room, thereby taking out the heat from the machine room. In some embodiments, in order to prevent the hot air from affecting the cold plate, the hot channel and the cold channel are isolated.

[0097] In the embodiment, the cooling towers in the heat dissipation devices 1210 are arranged close to the server cabinets 1220, each heat dissipation device 1210 corresponds to each row of server cabinets 1220, which solves the problem of large failure domain of the pipe network in the computer room and the large coupling with the computer room, reduces the failure domain to the micro-module level, and can be deployed on demand. In the embodiment, the two-stage heat exchange of the cooling tower + plate heat exchanger is adopted, compared with the three-stage heat exchange of the cooling tower + plate heat exchanger + CDU adopted in the embodiments of FIG. 2 and FIG. 3 and the embodiments of FIG. 4 and FIG. 5, which solves the problem of high water supply temperature caused by multiple heat exchange stages, and is expected to reduce the temperature by 3-5°C. In the embodiment, the overall air duct of the computer room is side air inlet and top air outlet, which solves the problem of air duct disorder at the top of the computer room, which limits the liquid cooling heat dissipation capacity, solves the problem of air cooling affecting liquid cooling, and improves the liquid cooling heat dissipation capacity by about 100%. In the embodiment, the exhaust pipe of the multi-layer computer room air duct is arranged in layers, which solves the problem of deployment in a multi-story building.

[0098] FIG. 14 and FIG. 15 show the structural schematic diagram of the liquid-cooled data center according to an embodiment of the present application, wherein FIG. 14 shows a side view and FIG. 15 shows a top view.

[0099] In the embodiment, the liquid-cooled data center further includes a second cooling tower 1440 and a plurality of air walls 1430, the plurality of air walls 1430 are arranged on the side walls of the computer room, each air wall 1430 is arranged corresponding to each group of computing devices, and the second cooling tower 1440 is arranged on the top of the computer room on the top floor. The air wall includes a fourth gas inlet and a fourth gas outlet, the fifth gas from the computer room enters the air wall through the fourth gas inlet, exchanges heat with the fifth cooling liquid from the second cooling tower 1440 in the air wall 1430 and becomes the sixth gas with a lower temperature than the fifth gas, and the sixth gas is sent into the computer room through the fourth gas outlet. The air wall 1430 provides the computer room with air cooling effect, so that the air cooling effect is enhanced. In the second cooling tower 1440, the fifth gas is cooled by the cooling liquid, so that the heat of the high-temperature gas can be absorbed faster, so that the hot air in the computer room can become cold air faster, and the air cooling effect is improved.

[0100] As shown in FIG. 14, since the CHU (i.e. heat dissipation device) that accounts for more than 80% of the total power is deployed to the side, the top of the computer room will be relatively empty, and a small amount of cooling tower deployment will not cause air duct disorder, so the embodiment adopts the scheme of air wall + cooling tower.

[0101] As shown in FIG. 14, the heat dissipation device 1410 is arranged on the left side outside the machine room, and each layer of the heat dissipation device 1410 is provided with a first heat dissipation channel. In the embodiment, the first heat dissipation channel includes a first heat dissipation inlet in communication with the first gas outlet of the heat dissipation device, and the first heat dissipation channel is not in communication with the machine room. The first heat dissipation channel further includes a first heat dissipation outlet (including the first-floor heat dissipation device exhaust port 1451, the second-floor heat dissipation device exhaust port 1452 and the third-floor heat dissipation device exhaust port 1453). In the embodiment, the heat dissipation device 1410 still adopts the design form of side air inlet and top air outlet, which is conducive to avoiding the mutual interference of hot air and cold air. Each layer of the server cabinet 1420 is provided with a wind wall 1430. Specifically, the hot air (fifth gas) generated by the server cabinet 1420 enters the wind wall 1430, exchanges heat with the cold liquid in the wind wall to become cold air (sixth gas), and is again supplied to the server cabinet 1420. The cold liquid (fifth cooling liquid) in the wind wall 1430 exchanges heat to become hot liquid, which is sent into the second cooling tower 1440, exchanges heat with the cold air outside the second cooling tower 1440 to become cold liquid, and is again sent into the wind wall 1430.

[0102] As shown in FIG. 15, the server cabinets 1420 are arranged into 8 groups, and each row of server cabinets 1420 is provided with a corresponding heat dissipation device 1410. In FIG. 15, 9 heat dissipation devices 1410 are shown, of which the rightmost heat dissipation device 1410 is a standby heat dissipation device, which is used when the other 8 normally operating heat dissipation devices 1410 fail. Each heat dissipation device 1410 corresponds to an exhaust port, and the hot gas generated by the first-floor heat dissipation device 1410 is discharged through the first-floor heat dissipation device exhaust port 1451, the hot gas generated by the second-floor heat dissipation device 1410 is discharged through the second-floor heat dissipation device exhaust port 1452, and the hot gas generated by the third-floor heat dissipation device 1410 is discharged through the third-floor heat dissipation device exhaust port 1453.

[0103] FIGS. 16 and 17 show structural schematic diagrams of a liquid-cooled data center according to an embodiment of the present application, wherein FIG. 16 shows a side view and FIG. 17 shows a top view.

[0104] As shown in FIGS. 16 and 17, the difference between the embodiment and other embodiments is that the exhaust pipe of the third floor is arranged nearby, i.e., the third-floor heat dissipation device exhaust port 1643 is directly arranged above the heat dissipation device 1610 of the third floor, and the third-floor machine room exhaust port 1633 is directly arranged above the server cabinet 1620 of the third floor. The advantage of such arrangement is that since the top of the machine room is no longer provided with a cooling tower, the top is relatively empty, the exhaust port of the hot air can be arranged, the side air inlet is not affected, and the length of the exhaust pipe is shortened, and the manufacturing cost is reduced.

[0105] In addition, the first-floor heat dissipation device exhaust port 1641 is still arranged on the right side of the machine room, and the second-floor heat dissipation device exhaust port 1642 is still arranged on the right side of the machine room; the first-floor machine room exhaust port 1631 is also arranged on the right side of the machine room, and the second-floor machine room exhaust port 1632 is also arranged on the right side of the machine room.

[0106] FIGS. 18 and 19 show structural schematic diagrams of a liquid-cooled data center according to an embodiment of the present application, in which FIG. 18 shows a side view and FIG. 19 shows a top view.

[0107] As shown in FIGS. 18 and 19, the difference between the present embodiment and other embodiments is that the exhaust pipes in communication with the heat dissipation device 1810 and the exhaust pipes in communication with the machine room are arranged separately, and the first heat dissipation outlets of the first heat dissipation channel (including the first-floor heat dissipation device exhaust port 1831, the second-floor heat dissipation device exhaust port 1832, the third-floor heat dissipation device exhaust port 1833, the first-floor machine room exhaust port 1841, the second-floor machine room exhaust port 1842, and the third-floor machine room exhaust port 1843) are arranged on the side close to the air inlet of the machine room (i.e., the left side in FIG. 18). This arrangement has the advantage that, when the first cooling tower in the heat dissipation device 1810 adopts an open tower, the hot gas discharged is high-temperature water vapor generated after hot liquid is mixed with cold air, and the high-temperature water vapor contains water vapor and small liquid droplets. The hot gas generated by the server cabinet 1820 in the machine room is dry hot air and does not contain water vapor and liquid droplets. In order to avoid the influence of the high-temperature water vapor on the hot air generated by the machine room, the pipe discharging the high-temperature water vapor is separated from the pipe discharging the hot air. Since the present embodiment still adopts the scheme of air inlet on the side of the machine room and air outlet on the top, the hot gas discharged and the cold gas entering will not affect each other.

[0108] FIGS. 20 and 21 show structural schematic diagrams of a liquid-cooled data center according to an embodiment of the present application, in which FIG. 20 shows a side view and FIG. 21 shows a top view.

[0109] As shown in FIGS. 20 and 21, the difference between the present embodiment and other embodiments is that the exhaust pipes on the third floor (including the third-floor heat dissipation device exhaust port 2033 and the third-floor machine room exhaust port 2043) are arranged close to the air inlet, and the exhaust pipes in communication with the heat dissipation device 2010 and the exhaust pipes in communication with the machine room are separated and arranged close to the air inlet.

[0110] In the present embodiment, the exhaust pipe in communication with the heat dissipation device 2010 on the third floor is directly arranged above the heat dissipation device 2010, and the exhaust pipe in communication with the machine room on the third floor is directly arranged above the server cabinet 2020, which helps to reduce the length of the exhaust pipe. In addition, the heat dissipation device exhaust port 2031 on the first floor and the heat dissipation device exhaust port 2032 on the second floor are arranged on the side close to the air inlet (left side in FIG. 20), and the machine room exhaust port 2041 on the first floor and the machine room exhaust port 2042 on the second floor are also arranged on the side close to the air inlet. In addition, since the cold tower is no longer arranged on the top of the machine room, some first heat dissipation outlets of the first heat dissipation channel (including the heat dissipation device exhaust port 2031 on the first floor, the heat dissipation device exhaust port 2032 on the second floor, the heat dissipation device exhaust port 2033 on the third floor, the machine room exhaust port 2041 on the first floor, the machine room exhaust port 2042 on the second floor, and the machine room exhaust port 2043 on the third floor) can be arranged, so that the space on the top can be utilized without significantly affecting the air inlet on the side of the machine room (left side in FIG. 20).

[0111] The concepts, principles and ideas of the present application are described in detail above in combination with the specific embodiments (including examples and examples). Those skilled in the art should understand that the embodiments of the present application are not only the above-mentioned forms, and those skilled in the art can make any possible improvements, replacements and equivalents to the steps, methods, devices and components in the above-mentioned embodiments after reading the present application file, which should be regarded as falling within the scope of the present application. The protection scope of the present application is only subject to the claims.

Claims

1. A liquid-cooled data center, characterized by, The liquid-cooled data center comprises: a plurality of machine rooms arranged in up and down directions, each of the machine rooms comprising at least one group of computing devices; a plurality of heat dissipation devices arranged outside the plurality of machine rooms, wherein each of the heat dissipation devices is arranged corresponding to each of the at least one group of computing devices; the heat dissipation device comprises a first cooling tower, a first gas inlet and a first gas outlet, the first gas outlet is connected with a first heat dissipation inlet of a first heat dissipation channel, the first heat dissipation channel is arranged on the top of the heat dissipation device and further comprises a first heat dissipation outlet, the first gas inlet is connected with the outside, the first gas enters the heat dissipation device from the first gas inlet, the first gas becomes second gas by passing through the first cooling tower, the temperature of the second gas is higher than that of the first gas, the second gas enters the first heat dissipation inlet from the first gas outlet and is discharged through the first heat dissipation outlet; a plurality of first cooling liquid pipes passing through the first cooling tower, the first cooling liquid and the second cooling liquid with a higher temperature than the first cooling liquid flow in the first cooling liquid pipes, the first cooling liquid becomes the second cooling liquid after absorbing heat from the computing devices in the first cooling liquid pipes, and the second cooling liquid becomes the first cooling liquid after exchanging heat with the first gas in the first cooling tower.

2. The liquid-cooled data center of claim 1, wherein, The first gas inlet is arranged on the side of the heat dissipation device away from the machine room, and the first heat dissipation outlet is arranged above the machine room located on the top layer.

3. The liquid-cooled data center of claim 1, wherein, The heat dissipation device further comprises a second gas inlet and a second gas outlet, the machine room comprises a third gas inlet, the second gas outlet is connected with the third gas inlet, the first heat dissipation channel further comprises a second heat dissipation inlet, the second heat dissipation inlet is connected with the machine room, the heat dissipation device introduces third gas from the outside through the second gas inlet, the third gas exits the heat dissipation device through the second gas outlet and enters the machine room through the third gas inlet, the third gas becomes fourth gas with a higher temperature than the third gas after exchanging heat with the computing devices in the machine room, the fourth gas enters the first heat dissipation channel through the second heat dissipation inlet and is discharged through the first heat dissipation outlet.

4. The liquid-cooled data center of any of claims 1 to 3, wherein, The heat dissipation device further comprises a fan for sucking the first gas from the outside.

5. The liquid-cooled data center of any of claims 1 to 4, wherein, The heat dissipation device further comprises a filter screen for filtering the first gas from the outside.

6. The liquid-cooled data center of any of claims 1 to 5, wherein, In the first cooling tower, the first gas is in direct contact with the second cooling liquid.

7. The liquid-cooled data center of claim 6, wherein, The liquid-cooled data center further comprises a plurality of second cooling liquid pipes passing through the computer room and in contact with the computing devices, and the heat dissipation device further comprises a plate heat exchanger connected with the first cooling liquid pipes and the second cooling liquid pipes, the first cooling liquid in the first cooling liquid pipes exchanges heat with a third cooling liquid in the second cooling liquid pipes in the plate heat exchanger in an indirect contact manner, the first cooling liquid becomes the second cooling liquid after heat exchange, and the third cooling liquid becomes a fourth cooling liquid with a lower temperature than the third cooling liquid.

8. The liquid-cooled data center of any of claims 1 to 5, wherein, In the first cooling tower, the first gas is in indirect contact with the second cooling liquid.

9. The liquid-cooled data center of claim 8, wherein, The first cooling liquid pipes pass through the computer room and are in contact with the computing devices.

10. The liquid-cooled data center of any of claims 1 to 5, wherein, The liquid-cooled data center further comprises a second cooling tower and a plurality of air walls, the plurality of air walls are arranged on the side walls of the computer room, each of the air walls is arranged corresponding to each group of the computing devices, the second cooling tower is arranged on the top of the computer room on the top floor, and the air wall comprises a fourth gas inlet and a fourth gas outlet. A fifth gas from the computer room enters the air wall through the fourth gas inlet, exchanges heat with a fifth cooling liquid from the second cooling tower in the air wall, and becomes a sixth gas with a lower temperature than the fifth gas. The sixth gas is sent into the computer room through the fourth gas outlet.

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