Production of a semiconductor component, and semiconductor component

Abstract

The invention relates to a method for producing a semiconductor component. The method comprises providing a carrier having an alignment structure, and arranging at least one first semiconductor chip on the carrier laterally with respect to the alignment structure using a flowable adhesive. On account of the carrier being wetted with the adhesive used, a flowing movement of the adhesive in the direction of the alignment structure occurs, with the result that the first semiconductor chip is moved in the direction of the alignment structure and aligned with the alignment structure. The invention also relates to a semiconductor component.

Description

[0001] MANUFACTURING A SEMICONDUCTOR COMPONENT AND

[0002] SEMICONDUCTOR COMPONENT

[0003] DESCRIPTION

[0004] The present invention relates to a method for manufacturing a semiconductor device and a semiconductor device.

[0005] This patent application claims priority from German patent application 10 2024 115 055 . 6, the disclosure content of which is hereby incorporated by reference.

[0006] A semiconductor device can have a substrate and at least one semiconductor chip mounted on the substrate. An example is an optoelectronic semiconductor device with several LED chips (light-emitting diodes) mounted on a substrate. The LED chips can be configured to generate different colored light. During the manufacturing of such devices, the LED chips can be placed at a certain distance from each other on their respective substrates to avoid collisions during placement. Tolerances of the machines used for placement and of the substrates can be factored in and accommodated. In this way, a distance of, for example, 100 pm between the LED chips of a semiconductor device can be maintained.Such a distance can hinder the achievement of specifications regarding parameters such as the color-over-angle distribution (CoA, Color over Angle) or color-over-location distribution (CoL, Color over Location).

[0007] The object of the present invention is to provide a solution for an improved semiconductor device.

[0008] This problem is solved by the features of the independent claims. Further advantageous embodiments of the invention are specified in the dependent claims. According to one aspect of the invention, a method for manufacturing a semiconductor device is proposed. The method comprises providing a substrate with an alignment structure and arranging at least one first semiconductor chip on the substrate laterally to the alignment structure using a flowable adhesive. Due to wetting of the substrate with the adhesive, a flow movement of the adhesive occurs in the direction of the alignment structure, so that the first semiconductor chip is moved in the direction of the alignment structure and is aligned with the alignment structure.

[0009] The proposed method is based on not only placing at least one semiconductor chip on the substrate, but also utilizing a flow motion of the adhesive to move the first semiconductor chip along with the adhesive after the actual placement process, thereby causing a lateral movement of the semiconductor chip on the substrate. For this purpose, the substrate has an alignment structure in the direction of which the flow motion of the adhesive and the movement of the semiconductor chip occur, and to which the semiconductor chip is accordingly aligned. The flow motion of the adhesive is based on the wetting or changing wetting of the substrate by the adhesive, which may include the occurrence of a capillary effect in the area of ​​the alignment structure. For this purpose, the adhesive has a suitable, low viscosity.

[0010] In this method, the first semiconductor chip is initially positioned on the substrate. It is then aligned with the alignment structure by the adhesive causing it to move closer to the structure, a process also known as "floating." This method allows at least one semiconductor chip to be positioned close to the alignment structure. This saves space and enables the creation of a compact semiconductor device. Furthermore, the method allows for a small distance between the first and at least one other semiconductor chip on the substrate, and enables the creation of a semiconductor device with multiple chips arranged close together.Lateral chip spacing can be in the double-digit micrometer range at most.

[0011] The following describes further possible details and implementations that may be considered for the process and the semiconductor device produced using it. It should be noted that features described in relation to one implementation may also apply to other implementations.

[0012] When arranging the first semiconductor chip on the carrier to the side of the alignment structure, the first semiconductor chip can be placed at a distance from the alignment structure on the carrier.

[0013] The first semiconductor chip is positioned on the substrate using adhesive. This can be achieved by first applying the adhesive to the substrate alongside the alignment structure and then placing the first semiconductor chip onto the adhesive. The adhesive can be applied using a process such as dispensing, printing / jetting, or stamping. A suitable application device, such as a dispensing device, a printing device / jetter, or a stamping device, can be used. The subsequent positioning of the first semiconductor chip on the adhesive can be accomplished with the aid of a suitable placement machine. Similar details can be applied to the placement of further semiconductor chips. The adhesive used may spread in different directions after application to the substrate.The alignment structure can ensure that the flow movement of the adhesive occurs predominantly in the direction of the alignment structure, and accordingly the first semiconductor chip is pulled over the adhesive to the alignment structure.

[0014] The adhesive used can be made of a polymer material. A possible example is a silicone material, so the adhesive could be a silicone adhesive.

[0015] As stated above, the adhesive used has a low viscosity and can therefore be a thin, liquid adhesive. A viscosity suitable for reliably carrying out the process can range from 30 Pa*s to 50 Pa*s, and may, for example, be 40 Pa*s.

[0016] The semiconductor device produced by the process can be a light-emitting optoelectronic semiconductor device. In this sense, the first semiconductor chip can be a light-emitting optoelectronic semiconductor chip, for example, an LED chip (Light-Emitting Diode). The same applies to at least one further semiconductor chip arranged on the substrate as part of the process. Therefore, the semiconductor device can be a multi-LED device. With multiple light-emitting semiconductor chips or LED chips, the semiconductor chips can be configured to generate different light beams or light beams of different colors. It is also possible for the semiconductor chips to be configured to generate identical light beams or light beams of the same color.

[0017] The support used can be any type of support.

[0018] The substrate can be, for example, a printed circuit board (PCB), a ceramic substrate, or a conductor frame, or it can comprise one of the aforementioned components. The substrate can also be a conductor frame-based substrate. In this case, the substrate can have a conductor frame formed with a plastic material. Furthermore, the substrate can have a semi-open cavity, for example, designed as a reflector, within which the alignment structure is located and the at least one first semiconductor chip is arranged on the substrate.

[0019] In another embodiment, the alignment structure is a raised area. Viewed from above, the raised area can have a rectangular or square contour. In this configuration, the flow of the adhesive, and thus the movement of the first semiconductor chip, can be at least partially due to a capillary effect acting on the adhesive and drawing it towards the raised area. The cause of this effect can be a gap or space between the raised area and the first semiconductor chip, in the area of ​​which the raised area and the first semiconductor chip can be wetted by the adhesive that is drawn upwards at this point.

[0020] In another embodiment, after the first semiconductor chip has been positioned, a second semiconductor chip is placed on the substrate to the side of the protrusion and the first semiconductor chip using a flowable adhesive. Due to the adhesive wetting the substrate, which may include the first semiconductor chip, the adhesive flows towards the protrusion and the first semiconductor chip, causing the second semiconductor chip to move towards and align with it. In this way, the second semiconductor chip can be positioned and aligned close to the protrusion and the first semiconductor chip.The flow of the adhesive is used to move the second semiconductor chip along with the adhesive after it has been placed on the first, not only in the direction of the raised alignment structure, but also in the direction of the first semiconductor chip. The flow of the adhesive, which can occur predominantly in the direction of the alignment structure and the first semiconductor chip, can be at least partially based on a capillary effect acting on the adhesive. This can be caused by a gap or space both between the raised area and the second semiconductor chip, and between the first and second semiconductor chips, in which the raised area and the semiconductor chips can be wetted by the adhesive as it rises.

[0021] In another embodiment, a further or additional semiconductor chip is placed on the raised area before the first semiconductor chip is positioned. In this way, by moving the first semiconductor chip towards the raised area, which serves as an alignment structure, the first semiconductor chip can be positioned close to the additional semiconductor chip. This can apply analogously to the second semiconductor chip (if provided).

[0022] In another embodiment, the additional semiconductor chip arranged on the raised section protrudes laterally from the raised section. This lateral protrusion can extend across the entire circumference of both the additional semiconductor chip and the raised section. For this purpose, the additional semiconductor chip can have larger lateral dimensions than the raised section. Due to this lateral protrusion, the additional semiconductor chip can act as a mechanical stop for the first semiconductor chip, allowing the first semiconductor chip, moving towards the raised section and thus also towards the additional semiconductor chip, to abut the additional semiconductor chip laterally and be adjacent to it with zero clearance. In another embodiment, which can be considered for the alignment structure in the form of the raised section, the first, second, and additional semiconductor chips are light-emitting optoelectronic semiconductor chips, such as LED chips.Furthermore, when arranged together, the three semiconductor chips form a rectangular light-emitting area when viewed from above. The first and subsequent semiconductor chips can have a square or substantially square outline and identical lateral dimensions, while the second semiconductor chip can have a non-square rectangular outline with lateral dimensions twice that of the first and subsequent semiconductor chips. Additionally, the three semiconductor chips can be configured to generate different light radiations, such as red, green, and blue light, so that the semiconductor device can be an RGB device. In this case, the subsequent semiconductor chip on the raised section can be configured to generate the red light radiation, the first semiconductor chip can be configured to generate the green light radiation, and the second semiconductor chip can be configured to generate the blue light radiation.Due to the manufacturing process, the three semiconductor chips can be positioned close to each other. This facilitates efficient mixing of the light emitted by the semiconductor chips during illumination, resulting in the semiconductor chips not being perceived as separate light sources, or only imperceptibly so, but instead appearing as a single, unified light source. Therefore, the semiconductor device can meet specifications regarding parameters such as color-over-angle distribution (CoA) and color-over-location distribution (CoL).

[0023] The additional semiconductor chip can be placed on the raised area using the same adhesive as is used to mount the first (and second) semiconductor chip. Furthermore, the following is possible: In another embodiment, the raised area is made of a metallic material. This can be used to at least thermally connect the additional semiconductor chip and to dissipate heat energy generated during operation from the additional semiconductor chip via the raised area. In addition, the raised area can be used as an electrical contact structure for the additional semiconductor chip. The additional semiconductor chip can have a rear contact on a surface that allows it to be mounted on the raised area.

[0024] Correspondingly, the additional semiconductor chip can be positioned on the protrusion using a different adhesive, which differs from the adhesive used to position the first (and second) semiconductor chips. This additional semiconductor chip can be positioned on the protrusion using a particle-filled adhesive containing metallic particles. The adhesive itself can also be made of a polymer material such as silicone. The particle-filled adhesive allows the additional semiconductor chip to be thermally and electrically connected to the metallic protrusion.

[0025] When placing the additional semiconductor chip on the raised area, the relevant adhesive can first be applied to the raised area (for example, by dispensing or one of the other processes mentioned above), and then the additional semiconductor chip can be placed on it. This adhesive can then be cured before the first (and second) semiconductor chip is placed on the substrate. Afterward, the adhesive used for placing the first (and second) semiconductor chip can be cured again. This curing can be carried out using a heating device or an oven. In another embodiment, the raised area has a circumferential recess on a front surface intended for chip mounting, on which the additional semiconductor chip is placed.The recess can serve to hold some of the adhesive used when attaching the additional semiconductor chip to the raised area. This allows for a small gap between the raised area and the additional semiconductor chip. This facilitates the thermal bonding of the additional semiconductor chip to the raised area as described above. Furthermore, it prevents the adhesive from being squeezed out laterally, which could potentially impair the close positioning of the first (and second) semiconductor chip to the raised area or the additional semiconductor chip.

[0026] In another embodiment, the alignment structure is not a raised area, but rather a depression. In this configuration, the flow of the adhesive, and thus the movement of the first semiconductor chip, can be at least partially based on a capillary effect acting on the adhesive and drawing it towards the depression. Here, the adhesive can wet the substrate in the area of ​​the depression and thereby be drawn into the depression, which is present as a free space or gap.

[0027] In another embodiment, a second semiconductor chip is positioned on the substrate to the side of the recess using the flowable adhesive. This can be done after the first semiconductor chip has been positioned. Due to the adhesive wetting the substrate, the adhesive flows towards the recess, causing the second semiconductor chip to move towards and align with it. Depending on the mounting of the first semiconductor chip, the flow of the adhesive and the movement of the second semiconductor chip can be at least partially due to a capillary effect acting on the adhesive and drawing it towards and into the recess.

[0028] It is possible that the adhesive flows towards the first semiconductor chip, and thus the second semiconductor chip is also moved towards and aligned with the first semiconductor chip due to this flow. For this to occur, the second semiconductor chip can be positioned laterally to the first semiconductor chip on the substrate, and the adhesive wetting of the substrate can extend to include the first semiconductor chip. Furthermore, the adhesive flow can be at least partially based on a capillary effect acting on the adhesive in the area of ​​the first semiconductor chip. This can be caused by a gap or space between the first and second semiconductor chips, in which the two semiconductor chips can be wetted by the adhesive wicking up into the space.

[0029] In another embodiment, a third semiconductor chip is arranged on the substrate using the flowable adhesive or another flowable adhesive. This can be done after the first and second semiconductor chips have been arranged. Due to the substrate being wetted with the adhesive, the adhesive flows towards the depression, thus moving the third semiconductor chip towards and aligning it with the depression. Similarly, the flow of the adhesive and the movement of the third semiconductor chip can be based, at least in part, on a capillary effect acting on the adhesive and drawing it towards and into the depression. For this purpose, the third semiconductor chip can be arranged laterally to the depression on the substrate.

[0030] With regard to the third semiconductor chip, the following can also apply. Here, the wetting of the substrate with the adhesive used, which can include the first and second semiconductor chips, leads to a flow of the adhesive towards the first and second semiconductor chips, so that the third semiconductor chip is moved towards the first and second semiconductor chips and aligned with them. The flow of the adhesive and the movement of the third semiconductor chip can be at least partially due to a capillary effect acting on the adhesive. This can be caused by a gap or space between both the first and third semiconductor chips and between the second and third semiconductor chips, in which the semiconductor chips can be wetted by the adhesive wicking up into this space.For this purpose, the third semiconductor chip can be positioned to the side of the other two semiconductor chips on the substrate.

[0031] The aforementioned use of a different flowable adhesive for the third semiconductor chip can be considered if the third semiconductor chip has a rear contact surface that allows it to be mounted on the substrate. In this case, the adhesive used for the third semiconductor chip can be an electrically conductive adhesive filled with metallic particles, and an electrical connection can be established via this adhesive with a contact surface of the substrate. The adhesive itself can also be made of a polymer material such as silicone.

[0032] It is also conceivable to cure the adhesive used after arranging the first and second semiconductor chips and aligning them (using a heating device or oven), and only then to arrange the third semiconductor chip on the substrate, followed by curing the adhesive used here. If the same flowable adhesive is used for all three semiconductor chips, curing can take place after arranging the three semiconductor chips.

[0033] The recess serving as an alignment structure can be created on the substrate in various ways. The recess can be produced after the substrate has been initially manufactured without a recess, for example, by etching, a mechanical process such as stamping or embossing, or by laser ablation. Furthermore, the recess can be incorporated from the outset during the substrate's manufacturing process, for example, through a forming process.

[0034] In another embodiment, the recess, viewed from above, is L-shaped with a first recess section and a second recess section extending perpendicular to the first recess section. This configuration can be advantageous for manufacturing the semiconductor device with the first semiconductor chip and at least one further semiconductor chip, or the second and third semiconductor chips (if provided), as described above.

[0035] With a corresponding arrangement of the relevant semiconductor chips on the substrate and due to the flow movement of the adhesive used, the following can occur: The first semiconductor chip can be moved towards the first and second depression sections and aligned with them. The second semiconductor chip can be moved towards the first depression section and the first semiconductor chip and aligned with them.

[0036] In another embodiment, the recess, viewed from above, is T-shaped with a first recess section and a second recess section extending perpendicularly from the first recess section. This design can also be advantageous for manufacturing the semiconductor device with the first semiconductor chip and at least one further semiconductor chip, or the second and third semiconductor chips, as described above.

[0037] The first, second, and third semiconductor chips can be arranged such that, viewed from above, the first recess is located between the first and second chips and between the first and third chips, and the second recess is located between the second and third chips. Due to the flow of the adhesive used, the following can occur: The first semiconductor chip can be moved towards the first recess and aligned with it. The second and third semiconductor chips can each be moved towards the first and second recesses, respectively, and aligned with them.

[0038] In another embodiment, which can be considered in the orientation structure in the form of a recess, the first, second, and third semiconductor chips are light-emitting optoelectronic semiconductor chips, such as LED chips. Furthermore, when arranged together, the three semiconductor chips form a rectangular light-emitting area when viewed from above. For this purpose, the second and third semiconductor chips can have a square or substantially square outline and identical lateral dimensions, while the first semiconductor chip can have a non-square rectangular outline with lateral dimensions twice as large as those of the second and third semiconductor chips. Additionally, the three semiconductor chips can be configured to generate different light radiations, such as red, green, and blue light radiation, so that the semiconductor device can be an RGB device.In this arrangement, the first semiconductor chip can be configured to generate blue light, the second to generate green light, and the third to generate red light. The manufacturing process allows the three semiconductor chips to be positioned close to each other. This facilitates efficient mixing of the light emitted by the semiconductor chips during operation, ensuring that the chips are not perceived as separate light sources, or only imperceptibly so, but instead appear as a single, unified light source. The semiconductor device can thus meet specifications regarding parameters such as color-over-angle distribution (CoA) and color-over-location distribution (CoL).

[0039] According to a further aspect of the invention, a semiconductor device is proposed. The semiconductor device comprises a substrate with an alignment structure, a first semiconductor chip arranged on the substrate using an adhesive in the region of the alignment structure, and at least one further semiconductor chip arranged on the substrate laterally to the first semiconductor chip. The distance between the first and further semiconductor chips is at most in the double-digit micrometer range.

[0040] The semiconductor device can be manufactured by carrying out the method described above or by one or more of the embodiments of the method described above. In this respect, features and details described above with regard to the method can apply accordingly to the semiconductor device. Likewise, features and details described with regard to the semiconductor device can also apply to the method.

[0041] In this sense, the semiconductor device can be a light-emitting optoelectronic semiconductor device. The first semiconductor chip and at least one subsequent semiconductor chip can be light-emitting optoelectronic semiconductor chips, such as LED chips. Furthermore, the semiconductor chips can be configured to generate different or differently colored light emissions. It is also possible for the semiconductor chips to be configured to generate identical light emissions of the same color. The semiconductor device can be characterized by its small size. The semiconductor device can be used in various fields, for example, in the automotive sector, for industrial applications, consumer applications, medical applications, etc.

[0042] The first semiconductor chip can be aligned with the alignment structure. At least one further semiconductor chip can also be aligned with the alignment structure.

[0043] The lateral distance between the first and subsequent semiconductor chips is at most in the double-digit micrometer range. This includes a distance of zero, which is the case when the first and subsequent semiconductor chips are directly adjacent. The distance between the first and subsequent semiconductor chips can also be at most in the single-digit micrometer range. If the semiconductor device has more than two semiconductor chips, the above specifications can refer to the chip spacing between any two adjacent semiconductor chips.

[0044] In another embodiment, the alignment structure is a raised area. Furthermore, the additional semiconductor chip is arranged on the raised area. In this context, at least one of the following may also be present.

[0045] The additional semiconductor chip can protrude laterally from the raised area. The raised area can be made of a metallic material. The raised area can be used for heat dissipation. The raised area can serve as an electrical contact structure for the additional semiconductor chip. The additional semiconductor chip can have a back side facing the raised area, with which the semiconductor chip can be positioned on the raised area, and an opposite front side. The additional semiconductor chip can have a rear contact on its back side. The front side of the additional semiconductor chip and a front side of the first semiconductor chip can lie in a common plane. A second semiconductor chip can be positioned on the substrate to the side of the first and additional semiconductor chips. Here, too, the front sides of the first, second, and additional semiconductor chips can lie in a common plane.The second semiconductor chip can be mounted on the substrate using the same adhesive as the first semiconductor chip. Furthermore, the second semiconductor chip can be aligned with the raised area and the first semiconductor chip. The three semiconductor chips, or rather their front faces, can together form a rectangular illuminated area.

[0046] In another form of implementation, the alignment structure is a deepening. In this context, at least one of the following may also be present.

[0047] The second semiconductor chip can be aligned with the recess, similar to the first semiconductor chip. Two further semiconductor chips, i.e., a second and third semiconductor chip, can be arranged to the side of the first semiconductor chip. The second and third semiconductor chips can be aligned with the recess. It is also possible for the second semiconductor chip to be aligned with the recess and the first semiconductor chip, and for the third semiconductor chip to be aligned with the first and second semiconductor chips. Viewed from above, the recess can be L-shaped or T-shaped. The three semiconductor chips, or rather their front faces, can together form a rectangular illumination area. The front faces of the first, second, and third semiconductor chips can lie in a common plane.

[0048] The advantageous embodiments and further developments of the invention described above and / or described in the dependent claims can be used individually or in any combination with each other, except, for example, in cases of clear dependencies or incompatible alternatives.

[0049] The properties, features, and advantages of this invention described above, as well as the manner in which they are achieved, will become clearer and more readily understandable in connection with the following description of exemplary embodiments, which are explained in more detail in conjunction with the schematic drawings. These show:

[0050] Figures 1 to 13 show the fabrication of a semiconductor device based on side and top views, in which an alignment structure in the form of a raised element is used;

[0051] Figures 14 to 18 show the manufacture of a semiconductor device according to further embodiments of elevations;

[0052] Figures 19 to 28 show the fabrication of a semiconductor device based on side and top views, using an alignment structure in the form of an L-shaped recess;

[0053] Figure 29 shows a side view of a semiconductor device according to a further embodiment; and

[0054] Figures 30 to 32 show the fabrication of a semiconductor device based on top views, in which an alignment structure in the form of a T-shaped recess is used.

[0055] Based on the schematic figures, embodiments of a method for manufacturing a light-emitting optoelectronic semiconductor device 100 are described. It should be noted that the schematic figures cannot be drawn to scale. Therefore, components and structures shown in the figures may be exaggerated in size or reduced in size for better understanding. Furthermore, it should be noted that features and details mentioned in relation to one embodiment also apply to other embodiments, and that several embodiments and their features can be combined. Corresponding features can only be described in detail with respect to one embodiment. Some of the top views contain section lines that refer to the section planes of side views.Regarding the top-down views, it should also be noted that some hidden structures are indicated by dashed lines. Furthermore, components such as adhesive (170, 171) are omitted from the top-down views.

[0056] Figures 1 to 13 show, by means of lateral sectional views and top views, a possible method for manufacturing a light-emitting optoelectronic semiconductor device 100 with three light-emitting optoelectronic semiconductor chips 140, 141, 142. The semiconductor chips 140, 141, 142 have a back side 152 for mounting and a corresponding front side 151. Light emission from the semiconductor chips 140, 141, 142 can occur at least via the front side 151, and optionally via lateral flanks connecting the front and back sides 151, 152. The semiconductor chips 140, 141, 142 can be LED chips. Furthermore, the semiconductor chips 140, 141, 142 can be designed to generate different colored light radiation, i.e. red, green and blue light radiation, so that the semiconductor device 100 is an RGB device.In the present case, the semiconductor chip 140 can be configured to generate red light radiation, the semiconductor chip 141 to generate green light radiation, and the semiconductor chip 142 to generate blue light radiation. Accordingly, the semiconductor chips 140, 141, and 142 are hereinafter also referred to as red semiconductor chip 140, green semiconductor chip 141, and blue semiconductor chip 142. In the method, as shown in Figures 1 and 8, a carrier 110 is provided. The carrier 110 has a front surface 111, located at the top in Figure 1, which is intended for chip mounting. The carrier 110 also has a raised area 120 on the front surface 111, which serves, among other things, as an alignment structure. The elevation 120, which can also be referred to as a pedestal, has a flat and unstructured front surface 121 and, viewed from above, a rectangular or square contour.

[0057] The raised section 120 of the carrier 110 can be made of a metallic material. In this way, the raised section 120 is suitable for efficient heat dissipation. The raised section 120 can also be used as an electrical contact structure. The metallic raised section 120 can, for example, be produced by electroplating.

[0058] The carrier 110 can be a printed circuit board (PCB), a ceramic substrate, a metallic conductor frame, or a conductor frame-based carrier. In the latter configuration, the carrier 110 can comprise a conductor frame formed with a plastic material. The carrier 110 can optionally have a cavity open at the front 111, within which the protrusion 120 is located and the semiconductor chips 140, 141, 142 can be mounted on the carrier 110. The cavity can serve as a reflector for the semiconductor component 100 (not shown).

[0059] In the process, as shown in Figures 1, 2, and 9, the red semiconductor chip 140 is arranged on the front surface 121 of the protrusion 120 using a flowable adhesive 171. First, the adhesive 171 is applied to the front surface 121 of the protrusion 120, as shown in Figure 1. Then, the semiconductor chip 140 is placed, as shown in Figures 2 and 9, with its back surface 152 facing the protrusion 120 and the adhesive 171 present there. During this process, the adhesive 171, by wetting the semiconductor chip 140 and the protrusion 120, allows the semiconductor chip 140 to be positioned and aligned centrally. to the elevation 120, unless the semiconductor chip 140 is already positioned in the center of the elevation 120 when it is placed.

[0060] The application of the adhesive 171 to the protrusion 120 can be carried out, for example, by dosing or dispensing using a dosing device or a dispenser. The subsequent positioning of the semiconductor chip 140 can be carried out with a placement device or placement machine (neither of which are shown).

[0061] Viewed from above, the red semiconductor chip 140 has a rectangular or square contour. Furthermore, the semiconductor chip 140 has larger lateral dimensions than the protrusion 120, so that, as shown in Figures 2 and 9, the semiconductor chip 140 laterally extends beyond the protrusion 120 along its entire circumference. In this way, the semiconductor chip 140 can serve as a mechanical stop for the subsequently mounted green semiconductor chip 141.

[0062] The adhesive 171 is made of a polymer material such as silicone and can therefore be a silicone adhesive. With regard to the metallic protrusion 120, the adhesive 171 can also be filled with metallic particles (not shown) and thus be a thermally and electrically conductive adhesive. In this way, heat energy generated during operation can be efficiently conducted from the semiconductor chip 140 to the protrusion 120 via the adhesive 171 and dissipated via the protrusion 120 and the support 110. As indicated above, the protrusion 120 can also be used as an electrical contact structure. In this case, the semiconductor chip 140 can have a rear contact on its back side 152, which can be electrically connected to the protrusion 120 via the adhesive 171 (not shown).After mounting the red semiconductor chip 140 onto the protrusion 120, and before arranging the further semiconductor chips 141, 142 onto the carrier 110 as described below, the adhesive 171 can be cured to fix the semiconductor chip 140 to the protrusion 120. A heating device or an oven can be used for this purpose (not shown).

[0063] Subsequently, as shown in Figures 3, 4, and 10, the green semiconductor chip 141 is positioned on the carrier 110 laterally to the protrusion 120, and thus also laterally to the red semiconductor chip 140, using a flowable adhesive 170. Like the red semiconductor chip 140, the green semiconductor chip 141 has a rectangular or square contour when viewed from above, and lateral dimensions corresponding to those of the semiconductor chip 140. When positioning the green semiconductor chip 141, the adhesive 170 is first applied to the carrier 110 laterally to the protrusion 120, for example, by dispensing, as shown in Figure 3. Then, the semiconductor chip 141 is placed, as shown in Figures 4 and 10, with its back side 152 facing the adhesive 170 laterally and relatively close to the protrusion 120.The same devices can be used here as in the previous assembly of the red semiconductor chip 140 with the adhesive f 171 (dispenser, placement machine, not shown).

[0064] The adhesive 170 used to arrange the green semiconductor chip 141 has a low viscosity and is therefore in a thin, liquid state. This, as well as the wetting or changing wetting of the substrate 110 with the adhesive 170, results in the adhesive 170 flowing towards the protrusion 120, so that the green semiconductor chip 141, as shown in Figures 4, 5, 10 and 11, is moved laterally over the adhesive 170 towards the protrusion 120 and the semiconductor chip 140 located thereon. In this way, the green semiconductor chip 141 is positioned close to the protrusion 120 and the semiconductor chip 140, and is thus aligned with them.The green semiconductor chip 141 is thus initially placed in a temporary position by being placed on the adhesive 170, and then, with the help of the adhesive 170, floats itself into a position closer to the protrusion 120 and the semiconductor chip 140 located on it.

[0065] After being applied to the carrier 110, the adhesive 170 can spread out in different directions. The raised section 120, which serves as an alignment structure, ensures that the adhesive 170 flows predominantly in the direction of the raised section 120, thereby moving the green semiconductor chip 141 towards the raised section 120 and the semiconductor chip 141 as intended. In this process, the flow of the adhesive 170 is at least partially due to a capillary effect that draws the adhesive 170 towards the raised section 120. This is caused by a gap or space between the raised section 120 and the semiconductor chip 141, in which the adhesive 170 can laterally wet the raised section 120 and the semiconductor chip 141 and, as shown in Figures 4 and 5, be drawn up the raised section 120 and the semiconductor chip 141.

[0066] The adhesive 170 is made of a polymer material such as silicone and can therefore be a silicone adhesive. Unlike the adhesive 171 used for mounting the red semiconductor chip 140, the adhesive 170 is unfilled and contains no particles. To allow the green semiconductor chip 141 to float into place, the adhesive 170 has a low viscosity, as indicated above. A suitable low viscosity for the adhesive 170 can be in the range of 30 Pa*s to 50 Pa*s and, for example, 40 Pa*s.

[0067] In the present embodiment, the red semiconductor chip 140 protrudes laterally from the projection 120. This allows the semiconductor chip 140 to serve as a mechanical stop for the green semiconductor chip 141, so that the semiconductor chip 141, moved towards the projection 120 and the semiconductor chip 140, can, as shown in Figure 5, directly abut and be adjacent to the semiconductor chip 140. In this respect, a lateral distance 180° from zero can exist between the two semiconductor chips 140 and 141.

[0068] Figure 5 further illustrates that the red and green semiconductor chips 140, 141 and the protrusion 120 are designed with vertical dimensions such that the front faces 151 of the semiconductor chips 140, 141 are at the same height and can therefore lie in a common plane. The same applies to the blue semiconductor chip 142 subsequently arranged on the carrier 142, which has a vertical chip thickness corresponding to that of the green semiconductor chip 141.

[0069] The blue semiconductor chip 142 is arranged in a manner corresponding to the green semiconductor chip 141. As shown in Figures 6 and 12, the blue semiconductor chip 142 is arranged on the substrate 110 using the flowable, low-viscosity adhesive 170, laterally to the protrusion 120 and the red semiconductor chip 140, as well as laterally to the green semiconductor chip 141. Viewed from above, the blue semiconductor chip 142 has a non-square rectangular contour with lateral dimensions twice as large as those of the other semiconductor chips 140 and 141. When arranging the blue semiconductor chip 142, the adhesive 170 is first applied, for example, by dispensing or...The dispenser is applied to the carrier 110 laterally to the protrusion 120 and the green semiconductor chip 141, and then the semiconductor chip 142, as shown in Figures 6 and 12, is placed with its back side 152 on the adhesive 170 laterally and relatively close to the protrusion 120 and the green semiconductor chip 141. The devices used for mounting the other semiconductor chips 140, 141 (dispenser, placement machine, not shown) can also be used here.

[0070] According to the mounting of the green semiconductor chip 141, the wetting or changing wetting of the carrier 110 with the low-viscosity adhesive 170 results in a flow movement of the adhesive 170 and thus a movement of the blue semiconductor chip 142. This occurs in the direction of the protrusion 120 with the red semiconductor chip 140 mounted on it and in the direction of the green semiconductor chip 141, so that after placement, as shown in Figures 6, 7, 12 and 13, the blue semiconductor chip 142 automatically floats into a position closer to the protrusion 120 and the semiconductor chips 140, 141 and is thereby aligned with them.

[0071] After being applied to the substrate 110, the adhesive 170 can spread out in different directions. The raised area 120 and the green semiconductor chip 141 ensure that the adhesive 170 flows predominantly in the direction of the raised area 120 and the semiconductor chip 141, thereby moving the blue semiconductor chip 142 towards the raised area 120 and the semiconductor chips 140, 141 as intended. This process is based at least partially on a capillary effect acting on the adhesive 170, caused by a gap or space both between the raised area 120 and the blue semiconductor chip 142 and between the green and blue semiconductor chips 141, 142. In this area, the adhesive 170 can laterally wet the elevation 120 and the semiconductor chips 141, 142 and, as shown in Figures 6 and 7 for the semiconductor chips 141, 142, pull itself upwards here.

[0072] Figure 7 further shows that after the blue semiconductor chip 142 is floated into place, a narrow gap exists between the green and blue semiconductor chips 141 and 142, resulting in a non-zero lateral distance 180 between them. This distance 180 can be at most in the double-digit micrometer range, and may only be a few micrometers (i.e., in the single-digit micrometer range). Such a distance 180 can also exist between the red and blue semiconductor chips 140 and 142 (not shown).

[0073] The adhesive 170 used in arranging the green and blue semiconductor chips 141 and 142 can then be cured to fix the semiconductor chips 141 and 142 to the substrate 110. The heating device or oven used for curing the other adhesive 171 can be used for this purpose (not shown).

[0074] As described above, the red semiconductor chip 140 can have a rear contact via the protrusion 120. The semiconductor chip 140 can also have a front contact on its front surface 151. The green and blue semiconductor chips 141 and 142 can each have two front contacts on their front surfaces 151. During or at the end of the process, contact structures such as bond wires (not shown) can be connected to the front contacts of the semiconductor chips 140, 141, and 142, and to contact elements or contact surfaces of the carrier 110.

[0075] In the semiconductor device 100 manufactured in this way, the three semiconductor chips 140, 141, 142, or rather their front faces 151, together form a rectangular or square illuminating area 155 (see Figure 13), in which light can be emitted from the semiconductor chips 140, 141, 142. Due to the manufacturing process, the semiconductor chips 140, 141, 142 are arranged relatively close to one another. This allows for efficient mixing of the light emitted by the semiconductor chips 140, 141, 142 during illumination. Furthermore, the semiconductor chips 140, 141, 142 do not appear, or only imperceptibly appear, as separate light sources, but instead as a single light source. In this way, the semiconductor device can meet 100 specifications regarding parameters such as the color-over-angle distribution (CoA) and color-over-location distribution (CoL).

[0076] Further variants and configurations that may be considered for the manufacturing process and semiconductor device 100 described here are explained below. Similar features and aspects, as well as identical and functionally equivalent components, are not described in detail again below. For details, please refer to the description above.

[0077] The process described above with reference to Figures 1 to 13 can be modified such that, instead of the raised section 120 with the unstructured front surface 121, where the semiconductor chip 140 arranged thereon protrudes laterally from the raised section 120 (see Figures 2 and 9), a different configuration is provided. For example, the raised section 120 can have a structured front surface 121 with a circumferential recess 122 and / or the raised section 120 and the semiconductor chip 140 can be designed with such lateral dimensions that the semiconductor chip 140 does not project laterally beyond the raised section 120.

[0078] An embodiment realized in this sense is shown in Figure 14, which depicts a side view of the carrier 110 corresponding to Figure 2, showing the projection 120 and the red semiconductor chip 140 mounted thereon using the adhesive 171. The projection 120 and the semiconductor chip 140 have identical lateral dimensions, so that the semiconductor chip 140 does not project laterally beyond the projection 120, and the side flanks or side walls of the semiconductor chip 140 and the projection 120 are congruent when viewed from above. The projection 120 also has a circumferential recess 122 on its front face 121. The recess 122 has a frame-like or rectangular shape, as is clearly visible in the top view of the projection 120 in Figure 15. In this configuration, the recess 122 can accommodate part of the adhesive 171 used when arranging the semiconductor chip 140 on the protrusion 120.This makes it possible to set a small vertical distance 181 between the protrusion 120 and the semiconductor chip 140. This promotes the thermal connection of the semiconductor chip 140 to the protrusion 120 and efficient heat dissipation. It also prevents any lateral squeezing of the adhesive 171, which might otherwise hinder the close placement of the other semiconductor chips 141, 142 on the protrusion 120 or the semiconductor chip 140.

[0079] Figure 16 shows a side view of the carrier 110, corresponding to Figure 14, after the green semiconductor chip 141 has been mounted laterally to the protrusion 120 using the low-viscosity adhesive fs 170. Since the red semiconductor chip 140 does not protrude laterally from the protrusion 120, the green semiconductor chip 141 does not come into contact with the semiconductor chip 140 as a result of floating into place. Instead, due to the adhesive fs 170 being located laterally between the protrusion 120 and the semiconductor chip 141, and being drawn up at this point by capillary action, a narrow gap exists between the protrusion 120 and the semiconductor chip 141, and also between the semiconductor chips 140 and 141. Accordingly, a non-zero lateral distance 180 exists between the semiconductor chips 140 and 141. The distance of 180 can again be at most in the double-digit micrometer range or only a few micrometers.

[0080] It is possible to design the protrusion 120 with larger lateral dimensions than the red semiconductor chip 140. This is the case in the embodiment shown in a side view in Figure 17. As a result, the protrusion 120 projects laterally beyond the semiconductor chip 140. As shown in Figure 14, the protrusion 120 has the front circumferential recess 122 for receiving a portion of the adhesive 171, allowing a small vertical gap 181 to be established between the semiconductor chip 140 and the protrusion 120. Figure 18 shows a side view corresponding to Figure 17 after the green semiconductor chip 141 has been mounted. Here, too, there is a non-zero gap 180 between the semiconductor chips 140 and 141, which can be at most in the double-digit micrometer range or only a few micrometers.The gap 180 results from the adhesive 170 located laterally between the protrusion 120 and the semiconductor chip 141, and thus from a gap present here, and additionally from the protrusion 120 extending laterally opposite the semiconductor chip 140.

[0081] With reference to the embodiment described above, in which the semiconductor chip 140 projects laterally beyond the projection 120 (see Figures 2 and 9), a design with a front-facing recess 122 can also be provided for the projection 120. Similarly, in the embodiments described with reference to Figures 14 to 18, the projection 120 can be implemented without a recess 122 (not shown in each case).

[0082] Figures 19 to 28 illustrate, using lateral and top-view views, a further process for manufacturing a light-emitting optoelectronic semiconductor device 100 with three light-emitting optoelectronic semiconductor chips 241, 242, 243. These also have a back side 152 and a corresponding front side 151, whereby light emission can occur at least via the front side 151, and optionally via lateral side faces. The semiconductor chips 241, 242, 243 can be LED chips and can be configured to generate different colored light radiation, specifically red, green, and blue light radiation. Semiconductor chip 241 can be configured to generate blue light radiation, semiconductor chip 242 can be configured to generate green light radiation, and semiconductor chip 243 can be configured to generate red light radiation.Accordingly, the designations blue semiconductor chip 241, green semiconductor chip 242 and red semiconductor chip 243 will also be used in the following.

[0083] In the process, as shown in Figures 19 and 24, a carrier 110 is provided. The carrier 110 has a front surface 111 intended for chip mounting, on which a recess 130 serving as an alignment structure is located. Viewed from above, the recess 130 is L-shaped with a first recess section 131 and a second recess section 132 extending perpendicular to the first recess section 131.

[0084] The semiconductor chips 241, 242, 243 are arranged on the carrier 110 in an area bordered by both recessed sections 131, 132.

[0085] The substrate 110 can be designed as a printed circuit board, ceramic substrate, etc., as described above. The recess 130 can be created, after the substrate 110 has initially been manufactured without the recess 130, by various processes, for example etching, with the aid of a mechanical process such as punching or embossing, or by a laser process. It is also possible to provide the recess 130 from the outset during the manufacturing of the substrate 110, for example, by a forming process.

[0086] In the process, as shown in Figures 19, 20 and 25, the blue semiconductor chip 241 is arranged on the carrier 110 laterally to the recess 130 using a flowable adhesive 170. Viewed from above, the blue semiconductor chip 241 has a non-square rectangular contour. The lateral dimensions of the blue semiconductor chip 241 are twice as large as those of the two other semiconductor chips 242 and 243 subsequently arranged on the carrier 110.

[0087] When arranging the blue semiconductor chip 241, the adhesive 170, as shown in Figure 19, is first applied, for example by metering or dispensing, onto the carrier 110 to the side of the recess 130. Subsequently, the semiconductor chip 241, as shown in Figures 20 and 25, is placed with its back side 152 onto the adhesive 170 to the side and relatively close to the recess 130, i.e., to both recess sections 131 and 132 of the recess 130. The application of the adhesive 170 can be carried out by a metering device or dispenser, and the placement of the semiconductor chip 241 can be carried out by a placement machine (neither of which are shown).

[0088] As described above, the adhesive 170 is made of a polymer material such as silicone and has a suitable, low viscosity, which is in the range of 30 Pa*s to 50 Pa*s and can, for example, be 40 Pa*s. Wetting or changing wetting of the carrier 110 with the low-viscosity adhesive 170 causes the adhesive 170 to flow towards the recess 130, so that the blue semiconductor chip 241, as shown in Figures 20, 21, 25, and 26, is moved laterally by the adhesive 170 towards the recess sections 131 and 132 of the recess 130. In this way, the blue semiconductor chip 241 is positioned close to the recess sections 131 and 132 of the recess 130 and is thus aligned accordingly.

[0089] The adhesive 170 can spread out in different directions after being applied to the carrier 110. The recess 130, which serves as an alignment structure, ensures that the adhesive 170 flows predominantly in the direction of the recess sections 131 and 132 of the recess 130, thereby moving the blue semiconductor chip 241 towards the recess 130 as intended. This process is based at least partially on a capillary effect acting on the adhesive 170, caused by the recess 130, which acts as a free space or gap into which the adhesive 170 is drawn, as shown in Figures 20 and 21. Contrary to the schematic representation in Figure 21 (and other figures), it is possible that the recess 130 is not completely filled with the adhesive 170 in cross-section.

[0090] The blue semiconductor chip 241 is thus initially placed in a temporary position on the adhesive 170. Subsequently, the semiconductor chip 241 floats independently into a position closer to the recess 130 and its recess sections 131, 132. As shown in the schematic representations of Figures 21 and 26, the semiconductor chip 241 can be moved so close to the recess 130 that, viewed from above, the recess 130 is not obscured by the semiconductor chip 241, and the side walls or sidewalls of the semiconductor chip 241 located in the area of ​​the recess 130 are congruent with the inner walls of the recess sections 131, 132 of the recess 130. It is also possible that the semiconductor chip 241 at least partially covers the depression 130 and its depression sections 131, 132.

[0091] Subsequently, as shown in Figures 22, 23, 26 and 27, the green semiconductor chip 242 is arranged on the carrier 110 laterally to the recess 130 or its first recess section 131, and laterally to the blue semiconductor chip 241, using the low-viscosity adhesive fs 170. Viewed from above, the green semiconductor chip 242 has a rectangular or square contour. The arrangement of the green semiconductor chip 242 is carried out in a manner corresponding to that of the blue semiconductor chip 241, by first applying the adhesive 170, for example by dispensing or... Dispensing on the carrier 110 laterally of the recess 130 and the blue semiconductor chip 241, and subsequently the semiconductor chip 242, as shown in Figures 22 and 26, with its back side 152 placed laterally on the adhesive 170 relatively close to the recess 130 or to the recess section 131 and the blue semiconductor chip 241.The aforementioned devices (dispenser, placement machine, not shown) can be used for this purpose. Following the mounting of the blue semiconductor chip 241, the wetting or changing wetting of the carrier 110 with the low-viscosity adhesive 170 results in a flow movement of the adhesive 170 and thus a movement of the green semiconductor chip 242. In this case, this occurs in the direction of the first recess section 131 of the recess 130 and in the direction of the blue semiconductor chip 241, so that the green semiconductor chip 242, as shown in Figures 22, 23, 26 and 27, automatically floats into a position closer to the recess section 131 and the semiconductor chip 241 after placement and is thereby aligned with it.

[0092] The adhesive 170 can spread out in different directions after being applied to the carrier 110. The recess 130 and the blue semiconductor chip 241 ensure that the adhesive 170 flows predominantly towards the recess 130, or rather the first recess section 131, and the semiconductor chip 241, thereby moving the green semiconductor chip 242 towards the recess 130 and the semiconductor chip 241 as intended. This process is based at least partially on a capillary effect that draws the adhesive 170 into the recess 130, as well as on a further capillary effect caused by a free space or... Gap between the blue and green semiconductor chips 241, 242, in the area of ​​which the adhesive 170 can laterally wet the semiconductor chips 241, 242 and, as shown in Figures 22 and 23, can rise up here.

[0093] As further shown in Figure 23, the semiconductor chips can

[0094] 241, 242 after the green semiconductor chip was floated in

[0095] The semiconductor chips 241, 242 are separated by a narrow gap and consequently by a non-zero distance 180 due to the adhesive s 170 present laterally between them. The distance 180 can be at most in the double-digit micrometer range and may only be a few micrometers (i.e., in the single-digit micrometer range). Figure 23 further illustrates that the blue and green semiconductor chips 241, 242 have corresponding vertical thicknesses. The red semiconductor chip 243, subsequently arranged on the carrier 110, also has a thickness corresponding to the other semiconductor chips 241, 242, so that the front faces 151 of the three semiconductor chips 241, 242, 243 are at the same height and can therefore lie in a common plane.

[0096] The arrangement of the red semiconductor chip 243, as shown in top view in Figures 27 and 28, can be carried out in a manner corresponding to the semiconductor chips 241, 242, using the low-viscosity adhesive fs 170, wherein the red semiconductor chip 243 is arranged laterally to the semiconductor chips 241, 242 on the carrier 110. Viewed from above, the red semiconductor chip 243 has a rectangular or square contour and lateral dimensions corresponding to the green semiconductor chip 242. The arrangement of the red semiconductor chip 243 is carried out such that the adhesive 170 is first applied, for example by dispensing or... Dispensing is applied to the carrier 110 laterally to the other semiconductor chips 241, 242, and then the semiconductor chip 243 is placed with its back side 152 on the adhesive 170 laterally and relatively close to the semiconductor chips 241, 242.The aforementioned devices (dispenser, placement machine, not shown) can be used. Here too, the wetting or changing wetting of the carrier 110 with the low-viscosity adhesive 170 leads to a flow movement of the adhesive 170 and a corresponding movement of the red semiconductor chip 243. In this case, this occurs in the direction of the blue and green semiconductor chips 241 and 242, so that the red semiconductor chip 243, as shown in Figures 27 and 28, automatically floats into a position closer to the other semiconductor chips 241 and 242 after placement and is thereby aligned with them.

[0097] After application, the adhesive 170 can spread in different directions. The blue and green semiconductor chips 241, 242 cause the adhesive 170 to spread predominantly in the direction of the semiconductor chips 241, 242.

[0098] 242 flows and thereby moves the red semiconductor chip 243 towards the semiconductor chips 241, 242 as intended. This process is based at least partially on a capillary effect in the area of ​​the blue and green semiconductor chips 241, 242, caused by a free space or gap between the blue and red semiconductor chips 241, 243 and between the green and red semiconductor chips 242, 243. At these points, the adhesive 170 can adhere to the respective semiconductor chips 241,

[0099] 243 and 242, 243 are laterally coated and drawn upwards. Viewed from the side, the floating of the red semiconductor chip 243 to the other semiconductor chips 241, 242 can occur as shown in Figures 22 and 23. According to Figure 23, after the floating of the red semiconductor chip 243, the semiconductor chips 241, 243 and 242, 243 can be separated from each other by a narrow gap and a non-zero distance 180 due to the adhesive 170 located laterally between them, which may be at most in the double-digit micrometer range and may only be a few micrometers.

[0100] The adhesive 170 used in arranging the semiconductor chips 241, 242, 243 can then be cured to fix the semiconductor chips 241, 242, 243 to the substrate 110. This can be done using a heating device or an oven (not shown).

[0101] The semiconductor chips 241, 242, 243 can each have two front-side contacts on their front faces 151. During or at the end of the process, contact structures such as bond wires (not shown) can be connected to the front-side contacts of the semiconductor chips 241, 242, 243 and to contact elements or contact surfaces of the carrier 110.

[0102] The semiconductor component produced in this way

[0103] The three semiconductor chips 241, 242, 243, or rather their front faces 151, together form a rectangular or square illuminating area 155 (see Figure 28) in which light emission can take place. Due to the manufacturing process, the semiconductor chips 241, 242, 243 are arranged relatively close to each other. This allows, during illumination operation, efficient mixing of the light emitted by the semiconductor chips 241,

[0104] The emitted light radiations 242, 243 are achieved. Furthermore, the semiconductor chips 241, 242, 243 can appear not as separate light sources, or only imperceptibly, but instead as a single light source. Consequently, the semiconductor device 100 can meet specifications regarding parameters such as the color-over-angle distribution (CoA) and color-over-location distribution (CoL).

[0105] One possible modification of the process described above with reference to Figures 19 to 28 is to use a form factor for the red semiconductor chip 243 corresponding to that of the red semiconductor chip 140, with a rear contact on its back side 152 and a front contact on its front side 151 (not shown). The red semiconductor chip 243 can be arranged in the same manner using a particle-containing and electrically conductive adhesive 171, as described above with reference to the red semiconductor chip 140.

[0106] For carrying out a process sequence corresponding to Figures 19 to 28, the adhesive 171 has a suitably low viscosity, which is also in the range of 30 Pa*s to 50 Pa*s and can be higher than that of the unfilled adhesive 170. After arranging the blue and green semiconductor chips 241, 242 as described above, and before arranging the red semiconductor chip

[0107] 243, the adhesive 170 (with the heating device, not shown) used in arranging the semiconductor chips 241, 242 can be cured to fix the semiconductor chips 241, 242. Afterwards, the red semiconductor chip 243 is arranged as described above, now using the adhesive 171 instead of the adhesive 170. The adhesive 171 is applied, for example, by dispensing, onto the carrier 110 laterally to the semiconductor chips 241, 242, and then the red semiconductor chip 243 is placed with its back side 152 onto the adhesive 171 laterally and relatively close to the semiconductor chips 241, 242. The wetting or...Changing wetting of the carrier 110 with the flowable adhesive 171 is associated with a flow movement of the adhesive 171 and a corresponding movement of the red semiconductor chip 243, in this case in the direction of the other semiconductor chips 241, 242, so that the semiconductor chip 243 floats independently into a position closer to the semiconductor chips 241, 242. This process is also based at least partially on a capillary effect in the area of ​​the blue and green semiconductor chips 241, 242, caused by a free space or gap between the blue and red semiconductor chips 241, 243 and between the green and red semiconductor chips 242, 243. At these points, the adhesive 171 can laterally wet the respective semiconductor chips 241, 243 and 242, 243 and be drawn upwards. This is illustrated in Figure 29 with respect to the semiconductor chips 241, 243.After the red semiconductor chip 243 has been floated in, the semiconductor chips 241, 243 and 242, 243 can be separated from each other by a narrow gap and a non-zero distance 180 due to the adhesive fs 171 located laterally between them, which again can be at most in the double-digit micrometer range, and only a few micrometers.

[0108] The adhesive 171 can then be cured (using the heating device, not shown). This allows the red semiconductor chip 243 to be fixed to the carrier 110. The carrier 110 can have a contact surface in the area of ​​the red semiconductor chip 243. An electrical connection can be established between the rear contact of the semiconductor chip 243 and the contact surface via the adhesive 171. Furthermore, bond wires can be connected to the front contacts of the semiconductor chips 241, 242, 243 and to contact surfaces of the carrier 110 (each not shown).

[0109] Another possible modification of the process sequence shown in Figures 19 to 28 involves the use of a recess 130 with a different shape. This is the case in the process sequence explained below with reference to the top views in Figures 30 to 32. Here, the provided carrier 110 has a recess 130 on its front face 111, serving as an alignment structure. Viewed from above, this recess is T-shaped, with a first recess section 131 and a second recess section 132 extending perpendicularly from it. As shown in Figure 30, the second recess section 132 can extend away from the first recess section 131 in the region of its center.

[0110] The semiconductor chips 241, 242, 243 are then successively arranged using the low-viscosity adhesive 170. For each semiconductor chip 241, 242, 243, the adhesive 170 is first applied, for example by dispensing, to the substrate 110 laterally to the recess 130. The respective semiconductor chip 241, 242, 243 is then placed with its back side 152 onto the adhesive 170 laterally and relatively close to the recess 130. According to the process sequence shown in Figures 19 to 28, the blue semiconductor chip 241 can be arranged first, followed by the green semiconductor chip 242, and then the red semiconductor chip 243.The semiconductor chips 241, 242, 243 are arranged such that, viewed from above, the first depression 131 is located between the blue and green semiconductor chips 241, 242 and between the blue and red semiconductor chips 241, 243, and the second depression 132 is located between the green and red semiconductor chips 242, 243. The wetting or changing wetting of the substrate 110 with the adhesive 170 is accompanied by a flow movement of the adhesive 170 and a corresponding movement of the semiconductor chips 241, 243.

[0111] 242, 243 are connected in the direction of the recess 130, as shown in Figure 31 for all semiconductor chips 241, 242, 243 together, so that the semiconductor chips 241, 242, 243 automatically float into a position closer to the recess 130 and are aligned accordingly. As shown in Figures 31 and 32, the blue semiconductor chip 241 is moved to the first recess section 131, and the other semiconductor chips 242, 243 are moved to the first and second recess sections 131, 132. It is possible that the semiconductor chips 241, 242, 243, as shown in Figure 32, partially cover the recess 130 and its recess sections 131, 132.

[0112] According to the process sequence shown in Figures 19 to 28, the movements of the semiconductor chips 241, 242, 243 can be based, at least in part, on a capillary effect acting on the adhesive 170 due to the recess 130, which acts as a free space or gap and into which the adhesive 170 can be drawn in a manner corresponding to Figures 20 and 21. With regard to the green semiconductor chip 242, its movement can also be based on a further capillary effect due to the blue semiconductor chip 240 already positioned at the recess 130, and with regard to the red semiconductor chip 243, its movement can additionally be based on a further capillary effect due to the two other semiconductor chips 241, 242 already positioned at the recess 130. In each case, a free space or gap can exist between the respective semiconductor chips 241, 242, 243, in the area of ​​which the adhesive 170 draws the semiconductor chips 241, 242

[0113] 243, laterally wetted and can pull itself upwards in a manner corresponding to Figure 23. The green semiconductor chip 242 can be aligned in addition to the blue semiconductor chip 241, and the red semiconductor chip 243 can be aligned in addition to the other two semiconductor chips 241, 242. Subsequently, the adhesive 170 can be cured to fix the semiconductor chips 241, 242, 243 to the carrier 110, and bond wires can be connected to the front contacts of the semiconductor chips 241, 242, 243 and contact surfaces of the carrier 110 (each not shown). In the semiconductor device 100 produced in this way, the three semiconductor chips 241, 242, 243 together form a rectangular or... square luminous area 155 (see Figure 32) in which light emission can take place. The semiconductor chips 241, 242, 243 are arranged relatively close to each other (again with chip spacings at most in the double digits or ).single-digit micrometer range), so that the semiconductor device can meet 100 specifications regarding parameters such as the color-over-angle distribution (CoA) and color-over-location distribution (CoL).

[0114] In addition to the implementation forms described above and illustrated in the figures, further implementation forms are conceivable, which may include further variations and / or combinations of features.

[0115] For example, materials other than those specified above can be used. The same applies to numerical specifications and specifications regarding the color of light radiation, which can be replaced by other specifications or colors (including white).

[0116] In this respect, it is possible, for example, to use a semiconductor chip designed to generate ultraviolet (UV) light radiation instead of one emitting blue light. This allows for the realization of an RGUV component, which is suitable, for example, for health monitoring. With regard to the embodiments shown in the figures, the semiconductor chip 142, 241 can be configured as a UV-emitting semiconductor chip or LED chip. With regard to the red semiconductor chip 140 described above, arranged on the raised area 120, this chip, like the other semiconductor chips 141, 142, can only have front-facing contacts that can be connected via bond wires.

[0117] Regarding the process described with reference to Figures 30 to 32, a modification consists in mounting the red semiconductor chip 243 using the particle-containing and electrically conductive adhesive fs 171, provided the semiconductor chip 243 has a rear contact. The adhesive f 171 can be drawn into the recess 130 in the same way as the other adhesive f 170.

[0118] Furthermore, it is possible to implement a semiconductor device 100 with several semiconductor chips which are configured to generate matching light radiations or light radiations of the same color. Accordingly, the semiconductor devices 100 described with reference to the figures can be implemented as monochromatic devices by configuring the semiconductor chips used to generate matching light radiations.

[0119] In a further modification, a monochrome or multicolored semiconductor device 100 can be manufactured with a different or larger number of semiconductor chips than described above. According to the approaches above, the semiconductor chips can be arranged on a substrate using a flowable adhesive, and the semiconductor chips in question can, by means of a flowing movement of the adhesive used, independently float into a position closer to an alignment structure and / or at least one other semiconductor chip and be aligned accordingly.

[0120] Further variations may involve applying the adhesive used (fs 170, 171) by a different process instead of dosing or dispensing. Examples include stamping, printing, or jetting. A stamping device, a printing device, or a jetter may be used for such processes.

[0121] Further variations may consist of realizing an alignment structure or a raised area 120 or recessed area 130 with other geometric shapes and top-view forms that differ from the figures.

[0122] Reference is also made to the possibility of carrying out the above-described process sequences and their variations in such a way that several semiconductor devices 100 are manufactured together in a single assembly. For this purpose, carriers 110 with correspondingly larger lateral dimensions can be provided, on which semiconductor chips for several semiconductor devices 100 can be mounted. The carriers 110 can accordingly have several alignment structures in the form of protrusions 120 or depressions 130. At the end of the process, singulation into several separate semiconductor devices 100 can also be carried out.

[0123] Although the invention has been further illustrated and described in detail by means of preferred embodiments, the invention is not limited by the disclosed examples and other variations can be derived from them by the person skilled in the art without leaving the scope of protection of the invention.

[0124] REFERENCE MARK LIST

[0125] Semiconductor device

[0126] carrier

[0127] front

[0128] Survey

[0129] front

[0130] recess

[0131] in-depth

[0132] In-depth section

[0133] In-depth section

[0134] semiconductor chip

[0135] semiconductor chip

[0136] semiconductor chip

[0137] front

[0138] back

[0139] Illuminated area

[0140] adhesive

[0141] adhesive

[0142] Distance

[0143] Distance

[0144] semiconductor chip

[0145] semiconductor chip

[0146] semiconductor chip

Claims

PATENT CLAIMS 1. Method for manufacturing a semiconductor device (100) comprehensive: Providing a carrier (110) with an orientation structure (120, 130); Arranging at least one first semiconductor chip (141, 241) on the support (110) laterally of the alignment structure (120, 130) using a flowable adhesive (170), wherein, due to wetting of the support (110) with the adhesive used (170), a flow movement of the adhesive occurs in the direction of the alignment structure (120, 130), so that the first semiconductor chip (141, 241) is moved in the direction of the alignment structure (120, 130) and is aligned on the alignment structure (120, 130).

2. Method according to claim 1, wherein the alignment structure is a raised section (120).

3. The method of claim 2, wherein, after arranging the first semiconductor chip (141), a second semiconductor chip (142) is arranged on the carrier (110) laterally to the protrusion (120) and the first semiconductor chip (141) using the flowable adhesive (170), wherein, due to wetting of the carrier (110) with the adhesive (170), a flow movement of the adhesive occurs in the direction of the protrusion (120) and the first semiconductor chip (141), so that the second semiconductor chip (142) is moved in the direction of the protrusion (120) and the first semiconductor chip (141) and is aligned with the protrusion (120) and the first semiconductor chip (141). becomes .

4. Method according to one of claims 2 or 3, wherein a further semiconductor chip (140) is arranged on the protrusion (120) before the first semiconductor chip (141) is arranged.

5. Method according to claim 4, wherein the further semiconductor chip (140) protrudes laterally opposite the protrusion (120).

6. Method according to one of claims 4 or 5, insofar as it relates back to claim 3, wherein the first, second and further semiconductor chip (140, 141, 142) are light-emitting optoelectronic semiconductor chips and, when arranged together, form a rectangular illuminating area (155) when viewed from above.

7. Method according to any one of claims 2 to 6, wherein the protrusion (120) is formed from a metallic material.

8. Method according to any one of claims 2 to 7, wherein the protrusion (120) on a front side (121) provided for chip mounting has a circumferential recess (122).

9. Method according to claim 1, wherein the alignment structure is a recess (130).

10. The method of claim 9, wherein a second semiconductor chip (242) is arranged on the carrier (110) laterally to the recess (130) using the flowable adhesive (170), wherein due to wetting of the carrier (110) with the The adhesive used (170) causes a flow movement of the adhesive in the direction of the depression (130), so that the second semiconductor chip (242) is moved in the direction of the depression (130) and aligned with the depression (130).

11. Method according to claim 10, wherein the second semiconductor chip (242) is moved towards the first semiconductor chip (241) due to the flow movement of the adhesive (170) and is aligned with the first semiconductor chip (241).

12. A method according to claim 10 or 11, wherein a third semiconductor chip (243) is arranged on the carrier (110) using the flowable adhesive (170) or a further flowable adhesive (171), wherein, due to wetting of the carrier (110) with the adhesive (170, 171), a flow movement of the adhesive occurs in the direction of the recess (130), so that the third semiconductor chip (243) is moved in the direction of the recess (130) and is aligned with the recess (130), and / or wherein, due to wetting of the carrier (110) with the adhesive (170, 171), a flow movement of the adhesive occurs in the direction of the first and second semiconductor chips (241, 242), so that the third semiconductor chip (243) is moved in the direction of the first and second semiconductor chips (241, 242) and is aligned with the first and second semiconductor chips (241, 242) is aligned.

13. Method according to any one of claims 9 to 12, wherein the recess (130), viewed in plan view, is L-shaped with a first recess section (131) and a perpendicular to the first recess section. is currently in the second advanced training section (132).

14. Method according to claim 13, insofar as it refers back to claim 10, wherein the first semiconductor chip (241) is moved in the direction of the first and second recessed section (131, 132) and is aligned with the first and second recessed section (131, 132), and wherein the second semiconductor chip (242) is moved in the direction of the first recessed section (131) and the first semiconductor chip (241) and is aligned with the first recessed section (131) and the first semiconductor chip (241).

15. Method according to any one of claims 9 to 12, wherein the depression, viewed from above, is T-shaped with a first depression section (131) and a second depression section (132) extending perpendicularly from the first depression section.

16. The method of claim 15, insofar as it refers back to claim 12, wherein the first, second and third semiconductor chips (241, 242, 243) are arranged such that, viewed from above, the first recessed section (131) is located between the first and second semiconductor chips (241, 242) and between the first and third semiconductor chips (241, 243), and the second recessed section (132) is located between the second and third semiconductor chips (242, 243), wherein the first semiconductor chip (241) is moved in the direction of the first recessed section (131) and aligned with the first recessed section (131), and wherein the second and third semiconductor chips (242, 243) are each moved in the direction of the first and second depression section (131, 132) and aligned with the first and second depression section (131, 132).

17. Method according to any one of claims 9 to 16, insofar as it relates back to claim 12, wherein the first, second and third semiconductor chip (241, 242, 243) are light-emitting optoelectronic semiconductor chips and, when arranged together, form a rectangular illuminating area (155) when viewed from above.

18. Semiconductor device (100) comprising: a carrier (110) with an alignment structure (120, 130); a first semiconductor chip (141, 241) arranged on the carrier (110) using an adhesive (170) in the area of ​​the alignment structure (120, 130); at least one further semiconductor chip (140, 142, 242, 243) arranged on the carrier (110) laterally to the first semiconductor chip (141, 241), wherein a distance (180) between the first and further semiconductor chips is at most in the double-digit micrometer range.

19. Semiconductor device according to claim 18, wherein the alignment structure is a protrusion (120) , and wherein the further semiconductor chip (140) is arranged on the protrusion (120).

20. Semiconductor device according to claim 19, wherein the alignment structure is a recess (130) is .

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