Method for laying wires on a substrate

Abstract

The invention relates to a method for laying wires (1) on a substrate (5), wherein: a laying head is used for guiding the wires, laying the wire and / or establishing contact of the wire; the substrate (5) is fastened to a substrate holder; a substrate (5) is used which has a respective cut-out (4) at at least one intersection point of two or more wires (1), such that the laying head, when laying a wire (1) at the intersection point, is guided over at least one already laid wire (1) without stopping and / or without performing a movement in a z-direction (Z) out of a plane of the substrate (5) and / or without jumping; the at least one already laid wire (1) is displaced into the cut-out (4). Alternatively, the cut-out (4) can be formed in the substrate holder.

Description

[0001] Method for laying wires on a substrate

[0002] DESCRIPTION

[0003] The invention relates to laying or embedding wires in a substrate (wire embedding).

[0004] Functional units, such as antennas, inductive or capacitive sensors, heating elements, or electrical conductors, can be formed by laying wires on foils or other substrates. It may be necessary for the wires to cross within the structure.

[0005] According to current technology, the laying head must be briefly lifted to jump over the already laid wire, preventing the embedded wire from being displaced, damaged, or broken. This movement slows down the process.

[0006] DE 10 2016 212 763 describes a method for laying a wire on a substrate and / or for contacting the wire with an electronic component, wherein a laying head is used for guiding, laying, and / or contacting the wire. The laying head is arranged at least partially on and / or in a rotary unit and / or is designed as a rotary unit and is rotated continuously or at a predetermined frequency about its own axis during the laying and / or contacting of the wire, wherein a continuous rotational speed or the predetermined frequency of a rotational movement to be performed by the laying head is set by means of the rotary unit and / or a direction of rotation is set by means of the rotary unit.

[0007] The invention is based on the objective of providing a novel method for laying wires on a substrate designed as a film, a novel substrate, a novel substrate receptacle and a novel functional unit.

[0008] The object is solved according to the invention by a method for laying wires on a substrate designed as a film with the features of claim 1 or 3, by a substrate with the features of claim 6, by a substrate receptacle with the features of claim 7 and by a functional unit with the features of claim 9.

[0009] Advantageous embodiments of the invention are the subject of the dependent claims.

[0010] According to one aspect of the present invention, a method for laying wires on a substrate is proposed, wherein a laying head is used for guiding, laying, and / or contacting the wires, wherein the substrate is attached to a substrate receptacle, wherein a substrate is used which has a respective recess at at least one intersection point of two or more wires, such that when laying a wire at the intersection point, the laying head is guided over at least one already laid wire without lifting off and / or without moving out of a plane of the substrate in a z-direction and / or without jumping, wherein the at least one already laid wire is displaced into the recess.

[0011] In one embodiment, the substrate is designed as a solid body, in particular as a thermoplastic plastic sheet, an injection-molded part, or a film.

[0012] According to one aspect of the present invention, a method for laying wires on a substrate designed as a film is proposed, wherein a laying head is used for guiding, laying, and / or contacting the wires, wherein the substrate is attached to a substrate receptacle, wherein a substrate receptacle is used which has a respective recess at at least one intersection point of two or more wires, such that when laying a wire at the intersection point, the laying head is guided over at least one already laid wire without lifting off and / or without moving out of a plane of the substrate in a z-direction and / or without jumping, wherein the at least one already laid wire and the substrate are displaced into the recess.

[0013] In one embodiment, the recesses are or are provided with rounded edges and / or soft contours.

[0014] In one embodiment, the wire is laid and / or contacted by ultrasonic welding.

[0015] According to one aspect of the present invention, a substrate for producing a functional unit by laying wires on the substrate, in particular by means of one of the methods described above, is proposed, wherein the substrate has a respective recess at at least one intersection point of two or more wires.

[0016] According to one aspect of the present invention, a substrate receptacle for the production of a functional unit by laying wires on a substrate using one of the methods described above is proposed, wherein the substrate receptacle has a recess at at least one intersection point of two or more wires.

[0017] In one embodiment, the recess is provided with rounded edges and / or soft contours.

[0018] Furthermore, a functional unit is proposed comprising a substrate as described above, on which wires are laid using one of the methods described above. The solution according to the invention enables a smooth process for laying and / or embedding wires in a film or other substrate without additional movements of the laying head.

[0019] Exemplary embodiments of the invention are explained in more detail below with reference to a drawing.

[0020] It shows:

[0021] Figure 1 shows a schematic view of an arrangement of wires laid on a substrate.

[0022] Figure 1 is a schematic view of an arrangement of wires 1 laid on a substrate 5. Several intersections 3 are present, where each of the wires 1 involved is guided in an arc 2 over or under the other wire 1.

[0023] In the direction of the arc 2, a recess 4 or pocket is arranged in the substrate 5, which can, for example, be designed as a film. The recess 4 thus receives the arc 2. In an alternative embodiment, the recess 4 or pocket is not arranged in the substrate 5 designed as a film, but in a substrate receptacle used as a tool, for example an injection-molded part, on which the substrate 5 is placed for laying the wires 1, so that the substrate 5 designed as a film, together with the wire 1, can yield at this point.

[0024] The film on which the wire 1 is laid can be made, for example, of a thermoplastic and / or coated material (e.g., hot melt), a textile, or another material. In one embodiment, the film is stretched on a substrate holder designed as a vacuum table. Alternatively, the film can also be tensioned and / or mechanically clamped.

[0025] In the substrate intake, a recess 4 or pocket or depression can be provided at each intersection point.

[0026] In one embodiment, the recess 4 is free of sharp edges to avoid damaging the wire 1. For example, the recesses 4 can have rounded edges and / or soft contours.

[0027] In the wire laying process, the wire 1 is embedded on the substrate 5, which is designed as a film, in a predetermined geometry using a laying head, for example as in the disclosed document.

[0028] DE 10 2016 212 763 Al described, which is hereby fully incorporated by reference into the present application.

[0029] When two or more wires 1 cross, the laying head simply moves over the already embedded wire(s) 1 without pausing, without needing to move in a z-direction Z, and without jumping. The z-direction Z here refers to a direction perpendicular to a plane in which the wires 1 are at least substantially laid.

[0030] The recess 4 below the intersection point in the substrate 5 allows the already laid wire 1 to move into the recess 4. If the recess 4 is located below the intersection point in the substrate holder, then the already laid wire 1, along with the substrate 5 (which is designed as a foil), can move into the recess 4.

[0031] 1 wire

[0032] 2 sheets

[0033] 3 Intersection

[0034] 4 recesses

[0035] 5 Substrat

[0036] Z z-direction

Claims

PATENT CLAIMS E. Method for laying wires (1) on a substrate (5), wherein a laying head is used for guiding, laying and / or contacting the wires, wherein the substrate (5) is attached to a substrate holder, wherein a substrate (5) is used which has a respective recess (4) at at least one intersection point of two or more wires (1), such that when laying a wire (1) at the intersection point the laying head is guided over at least one already laid wire (1) without lifting off and / or without moving out of a plane of the substrate (5) in a z-direction (Z) and / or without jumping, wherein the at least one already laid wire (1) is displaced into the recess (4).

2. Method according to claim 1, wherein the substrate (5) is designed as a solid body, in particular as a thermoplastic plastic sheet or as an injection molded part or as a film.

3. A method for laying wires (1) on a substrate (5) designed as a film, wherein a laying head is used for guiding, laying, and / or contacting the wires, wherein the substrate (5) is attached to a substrate holder, wherein a substrate holder is used which has a respective recess (4) at at least one intersection point of two or more wires (1), such that when laying a wire (1) at the intersection point, the laying head is guided over at least one already laid wire (1) without lifting off and / or without moving out of a plane of the substrate (5) in a z-direction (Z) and / or without jumping, wherein the at least one already The laid wire (1) and the substrate (5) are displaced into the recess (4).

4. Method according to one of the preceding claims, wherein the recess is or is provided with rounded edges and / or soft contours.

5. Method according to one of the preceding claims, characterized in that the laying and / or contacting of the wire (1) is carried out by ultrasonic welding.

6. Substrate (5) for producing a functional unit by laying wires (1) on the substrate (5) by means of a method according to one of claims 1, 2, 4 or 5, wherein the substrate (5) has a respective recess (4) at at least one intersection point of two or more wires (1).

7. Substrate receiving for the production of a functional unit by laying wires (1) on a substrate (5) by means of a method according to one of claims 3, 4 or 5, wherein the substrate receiving has a respective recess (4) at at least one intersection point of two or more wires (1).

8. Substrate receptacle according to claim 7, wherein the recess is provided with rounded edges and / or soft contours.

9. Functional unit comprising a substrate (5) according to claim 6, on which wires (1) are laid by means of the method according to claim 1, 2, 4 or 5.

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