Electronic device comprising grip sensor

Abstract

An electronic device according to an embodiment of the present disclosure may comprise: an antenna; a printed circuit board formed with at least two layers and electrically connected to the antenna; a first processor mounted on the printed circuit board; a second processor mounted on the printed circuit board and connected to the antenna to transmit or receive radio frequency (RF) signals through the antenna; a grip sensor mounted on the printed circuit board and electrically connected to the antenna and the first processor so as to detect, using the antenna, whether the body of a user body is in contact; and a coupling pad which is formed on the printed circuit board, is electrically connected to the antenna, the second processor, and the grip sensor, and provides capacitance for tuning the antenna to correspond to the RF signal.

Description

Electronic device including a grip sensor

[0001] The present disclosure relates to an electronic device including a grip sensor.

[0002] A grip sensor is a sensor that can detect the presence of surrounding objects without physical contact. An electronic device can use a grip sensor to determine whether a user is approaching the electronic device. The electronic device can then control various functions based on whether the user is approaching the electronic device. For example, an electronic device including an antenna that emits a transmit signal (Tx) can use a grip sensor to determine whether a user is approaching the electronic device to control the specific absorption rate (SAR).

[0003] Typically, grip sensors can detect changes in capacitance or dielectric constant within a predetermined capacitance range to determine whether an object has approached an electronic device. Therefore, to improve the detection performance of grip sensors, it is desirable to reduce the capacitance consumed in the grip sensor's circuit configuration (e.g., base capacitance).

[0004] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0005] An electronic device according to an embodiment of the present disclosure may include an antenna. The electronic device according to an embodiment may include a printed circuit board formed of at least two layers and electrically connected to the antenna. The electronic device according to an embodiment may include a first processor mounted on the printed circuit board. The electronic device according to an embodiment may include a second processor mounted on the printed circuit board and connected to the antenna, and configured to transmit or receive a radio frequency (RF) signal through the antenna. The electronic device according to an embodiment may include a grip sensor mounted on the printed circuit board and electrically connected to the antenna and the first processor, and configured to detect whether a user's body is in contact using the antenna. The electronic device according to an embodiment may include a coupling pad formed on the printed circuit board and electrically connected to the antenna, the second processor, and the grip sensor, and providing a capacitance for tuning the antenna to correspond to the RF signal.

[0006] An electronic device according to one embodiment of the present disclosure may include a printed circuit board formed of at least two layers. The electronic device according to one embodiment may include an antenna mounted on the printed circuit board. The electronic device according to one embodiment may include a first processor mounted on the printed circuit board. The electronic device according to one embodiment may include a second processor mounted on the printed circuit board and connected to the antenna, and configured to transmit or receive a radio frequency (RF) signal through the antenna. The electronic device according to one embodiment may include a grip sensor mounted on the printed circuit board and electrically connected to the antenna and the first processor, and configured to detect whether a user's body is in contact using the antenna. The electronic device according to one embodiment may include a coupling pad formed on the printed circuit board and electrically connected to the antenna, the second processor, and the grip sensor, and providing a capacitance for antenna tuning corresponding to the RF signal.

[0007] In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar components.

[0008] FIG. 1 is a block diagram of an exemplary electronic device capable of performing the operations described within the present disclosure.

[0009] FIG. 2 is a drawing showing an electronic device according to one embodiment of the present disclosure.

[0010] FIG. 3 is a drawing showing an electronic device according to one embodiment of the present disclosure.

[0011] FIG. 4 is a three-dimensional drawing showing an electronic device according to one embodiment of the present disclosure.

[0012] FIG. 5 is a three-dimensional drawing showing an electronic device according to one embodiment of the present disclosure.

[0013] FIG. 6 is a three-dimensional drawing showing an electronic device according to one embodiment of the present disclosure.

[0014] FIG. 7 is a graph showing the capacitance and current of a coupling pad according to a frequency band according to one embodiment of the present disclosure.

[0015] FIG. 8a is a drawing showing an electrical connection state of a first conductive pad according to one embodiment of the present disclosure.

[0016] FIG. 8b is a drawing showing an electrical connection state of a second conductive pad according to one embodiment of the present disclosure.

[0017] FIG. 8c is a drawing showing an electrical connection state of a second conductive pad according to one embodiment of the present disclosure.

[0018] FIG. 8d is a drawing showing an electrical connection state of a second conductive pad according to one embodiment of the present disclosure.

[0019] FIG. 9 is a diagram illustrating an electronic device according to one embodiment of the present disclosure.

[0020] FIG. 10 is a graph showing the radiation efficiency of an antenna according to a frequency band of an electronic device according to an embodiment of the present disclosure.

[0021] The grip sensor can be operated by being connected to an antenna that transmits and receives RF (radio frequency) signals. When the grip sensor is operated by being connected to an antenna, it is difficult to reduce the capacitance consumed in the circuit configuration of the grip sensor (e.g., base capacitance) due to the capacitance required for matching between the RF signal and the antenna.

[0022] The electronic device of the present disclosure is intended to secure matching performance between an antenna and an RF signal and detection performance of a grip sensor in a grip sensor electrically connected to an antenna.

[0023] The electronic device of the present disclosure can perform a tuning operation between an antenna and an RF signal without affecting the base capacitance of the grip sensor by including a coupling capacitance.

[0024] The electronic device of the present disclosure can secure matching performance between an antenna and an RF signal and detection performance of a grip sensor by including coupling capacitance.

[0025] FIG. 1 is a block diagram of an exemplary electronic device (100) capable of performing the operations described within the present disclosure.

[0026] Referring to FIG. 1, the electronic device (100) may be one of various forms of electronic devices, such as a notebook (190), smartphones (191) having various form factors (e.g., a bar-type smartphone (191-1), a foldable-type smartphone (191-2), or a sliderable (or rollable) type smartphone (191-3)), a tablet (192), a cellular phone (not shown), and other similar computing devices (not shown). The components, their relationships, and their functions illustrated in FIG. 1 are exemplary only and do not limit the implementations described or claimed within the present disclosure. The electronic device (100) may be referred to as a mobile device, a user device, a multi-function device, a portable device, or a server.

[0027] The electronic device (100) may include components including at least one processor (110) (hereinafter referred to as processor (110)), at least one memory (120) (hereinafter referred to as memory (120)), at least one display (140) (hereinafter referred to as display (140)), at least one image sensor (150) (hereinafter referred to as image sensor (150)), at least one communication circuit (160) (hereinafter referred to as communication circuit (160)), and / or at least one sensor (170) (hereinafter referred to as sensor (170)). The above components are merely exemplary. For example, the electronic device (100) may include other components (e.g., power management integrated circuitry (PMIC), audio processing circuitry, an antenna, a rechargeable battery, or an input / output interface). For example, some components may be omitted from the electronic device (100). For example, some components may be integrated into one component.

[0028] The processor (110) may be implemented as one or more IC (integrated circuit (or circuitry)) chips and may perform various data processing. The processor (110) may include at least one electrical circuit and may individually or collectively perform distributed processing of instructions (or programs, data, etc.) stored in the memory (120). The processor (110) may include a processor assembly including one or more processing circuits. The processor (110) may include any processing circuit operative to control the performance and operations of one or more components (e.g., the memory (120), the display (140), the image sensor (150), the communication circuit (160), and / or the sensor (170)) of the electronic device (100). For example, the processor (110) (e.g., the application processor (AP)) may be implemented as a system on chip (SoC) (e.g., a single chip or a chipset). For example, the processor (110) may be implemented with multiple cores (or at least one core circuit), multiple chips, or multiple chipsets. For example, the processor (110) may include one or more processing circuits. For example, the processor (110) may include one or more processing circuits configured to individually and / or collectively perform various functions of the present disclosure. As a non-limiting example, at least a portion of the processor (110) may be included in a first chip of the electronic device (100), and at least another portion of the processor (110) may be included in a second chip of the electronic device (100) that is different from the first chip of the electronic device (100).

[0029] For example, the processor (110) may include a central processing unit (CPU) (111), a graphics processing unit (GPU) (112), a neural processing unit (NPU) (113), an image signal processor (ISP) (114), a display controller (115), a memory controller (116), a storage controller (117), a communication processor (CP) (118), and / or a sensor interface (119). These components of the processor (110) are merely exemplary. For example, the processor (110) may further include other components. For example, some components of the processor (110) may be omitted from the processor (110). For example, some components of the processor (110) may be included as separate components of the electronic device (100) outside the processor (110). For example, some components of the processor (110) (e.g., memory controller (116)) may be included within other components (e.g., at least a portion of memory (120), an interface (e.g., available for connection to at least one component of the electronic device (100)), a display (140) and / or an image sensor (150)).

[0030] The processor (110) may cause other components of the electronic device (100) to perform various operations by executing instructions stored in the memory (120). The CPU (111) (or central processing circuit) may be configured to control components of the processor (110) based on the execution of instructions stored in the memory (120) (e.g., volatile memory (121) and / or non-volatile memory (122)). The GPU (112) (or graphics processing circuit) may be configured to execute parallel operations (e.g., rendering). The NPU (113) (or neural processing circuit, or artificial intelligence (AI) chip) may be configured to execute operations for an artificial intelligence model (e.g., convolution computation). The ISP (114) (or image signal processing circuit) may be configured to process a raw image acquired through the image sensor (150) into a format suitable for a component within the electronic device (100) or a component of the processor (110). The display controller (115) (or display control circuit, or display processing unit (DPU)) may be configured to process an image acquired from the CPU (111), the GPU (112), the ISP (114), or the memory (120) (e.g., the volatile memory (121)) into a format suitable for the display (140). The memory controller (116) (or memory control circuit) may be configured to control reading data from the volatile memory (121) and writing data to the volatile memory (121). The storage controller (117) (or storage control circuit) may be configured to control reading data from the nonvolatile memory (122) and writing data to the nonvolatile memory (122).The CP (118) (communication processing circuit) may be configured to process data acquired from a component of the processor (110) into a format suitable for transmission to another electronic device via the communication circuit (160), or to process data acquired from another electronic device via the communication circuit (160) into a format suitable for processing by the component of the processor (110). For example, the communication circuit (160) may include one or more communication circuits. The sensor interface (119) (or sensing data processing circuit, sensor hub) may be configured to process data about the state of the electronic device (100) and / or the state of the surroundings of the electronic device (100), acquired via the sensor (170), into a format suitable for the component of the processor (110).

[0031] The memory (120) may include one or more storage media (or one or more storage devices). For example, the memory (120) may include a memory assembly including one or more storage media. For example, the one or more storage media may include permanent memory (e.g., non-volatile memory (122)) such as a hard drive, flash memory, read-only memory (ROM), semi-permanent memory (e.g., volatile memory (121)) such as random access memory (RAM), any other suitable type of storage (or storage assembly), or any combination thereof. The memory (120) may include cache memory, which is one or more different types of memory used to temporarily store data for a function or feature of the electronic device (100). As a non-limiting example, the cache memory may be included within the processor (110). The memory (120) may be fixedly embedded within the electronic device (100) or incorporated into one or more suitable types of components (e.g., a subscriber identity module (SIM) card and / or a secure digital (SD) card) that may be repeatedly inserted into and removed from the electronic device (100).

[0032] For example, the memory (120) may store one or more software applications, such as an operating system (or system) software application, a firmware software application, a driver software application, a plug-in (e.g., add-in, add-on, and / or applet) software application, and / or any other suitable software applications. For example, the one or more software applications may include instructions executable by the processor (110). For example, the memory (120) may store instructions callable by an application programming interface (API). For example, the memory (120) may store instructions within a library.

[0033] FIG. 2 is a drawing showing an electronic device (100) according to one embodiment of the present disclosure.

[0034] In one embodiment, the electronic device (100) may include a printed circuit board (PCB) (410), a first processor (211), a second processor (212), an antenna (220), a grip sensor (230), and a coupling pad (240).

[0035] In one embodiment, the printed circuit board (410) may mount a first processor (211), a second processor (212), an antenna (220), a grip sensor (230), and / or a coupling pad (240).

[0036] In one embodiment, the printed circuit board (410) may include a dielectric. The printed circuit board (410) may form capacitance between layers.

[0037] In one embodiment, the printed circuit board (410) may be formed of at least two layers.

[0038] In one embodiment, a printed circuit board (410) including at least two layers may have a first processor (211), a second processor (212), an antenna (220), a grip sensor (230), and / or a coupling pad (240) mounted on the top layer.

[0039] In one embodiment, the antenna (220) may not be mounted on the printed circuit board (410), but may be electrically connected to the printed circuit board (410).

[0040] In one embodiment, the antenna (220) may be electrically connected to a grip sensor (230), a second processor (212), and a coupling pad (240). The grip sensor (230), the second processor (212), and the coupling pad (240) may be connected in parallel to the antenna (220).

[0041] In one embodiment, the first processor (211) may include an application processor (AP). However, the present invention is not limited thereto, and the first processor (211) may include at least one of an application processor, a CPU (111), a GPU (112), or an NPU (113).

[0042] In one embodiment, the second processor (212) may include a communication processor (CP) (118). However, the present invention is not limited thereto, and the second processor (212) may include circuitry for processing communication signals. For example, the second processor (212) may include at least one of the CP (118), communication circuitry, a modem, or a front end module circuitry.

[0043] In one embodiment, the grip sensor (230) can measure a change in capacitance or permittivity when an external object (e.g., a user) approaches the antenna (220). The grip sensor (230) can transmit the measured change in capacitance or permittivity to the first processor (211). The first processor (211) can determine whether an external object (e.g., a user) has approached the electronic device (100) based on the change in measured capacitance or measured permittivity transmitted from the grip sensor (230).

[0044] In one embodiment, the grip sensor (230) can detect a change in capacitance or permittivity within a predetermined range of capacitance (e.g., total capacitance) to determine whether an object has approached the electronic device. For example, to improve the detection performance of the grip sensor (230), it is desirable to reduce the capacitance consumed in the circuit configuration of the grip sensor (230) (e.g., base capacitance).

[0045] In one embodiment, the second processor (212) may radiate a radio frequency (RF) signal through the antenna (220). At least one tuning circuit or matching circuit for matching between the RF signal and the antenna (220) may be included between the second processor (212) and the antenna (220). The second processor (212) may control the tuning circuit or the matching circuit to match the frequency of the RF signal with the frequency band of the antenna (220). The tuning circuit or the matching circuit may include a capacitance.

[0046] In one embodiment, the coupling pad (240) may include a coupling capacitor. The coupling pad (240) may include a capacitor based on a coupling phenomenon between layers of a printed circuit board (410) including at least two layers. The coupling pad (240) may include a conductive pad formed on one layer of the printed circuit board (410) and a conductive pad formed on another layer of the printed circuit board (410). The electrical characteristics of the coupling pad (240) may vary depending on the frequency band.

[0047] In one embodiment, Equation 1 represents the relationship between frequency, capacitance, and reactance at the coupling pad (240), and Equation 2 represents the relationship between reactance and current at the coupling pad (240).

[0048]

[0049] In mathematical expression 1, Xc can represent capacitance reactance, f can represent frequency, and C can represent capacitance.

[0050]

[0051] Referring to mathematical expressions 1 and 2, the coupling pad (240) may have a characteristic of blocking current in a frequency band having a direct current component and allowing current to flow in a frequency band having an alternating current component.

[0052] For example, the operating frequency of the grip sensor (230) may include a specific Khz band, and the frequency band of the RF signal may include a band from about 600 MHz to 3.8 GHz. The operating frequency of the grip sensor (230) may be close to direct current, and the frequency band of the RF signal may include characteristics close to alternating current.

[0053] In one embodiment, when the grip sensor (230) is operating, the coupling pad (240) may be electrically open from a circuit perspective of the grip sensor (230).

[0054] In one embodiment, when the second processor (212) is operating or when an RF signal is radiated, the coupling pad (240) may be in a state that includes electrical capacitance from the circuit perspective of the second processor (212).

[0055] FIG. 3 is a diagram illustrating an electronic device (100) according to one embodiment of the present disclosure. The electronic device (100) of FIG. 3 may further include a filter and a capacitor compared to the electronic device (100) of FIG. 2. In FIG. 3, descriptions of components overlapping with those of FIG. 2 may be omitted.

[0056] In one embodiment, an antenna (220) may be connected to a first node (N1). A first capacitor (C1) may be connected between a first node (N2) and a second node. A sixth capacitor (C6) may be connected between the first node (N1) and a coupling pad (240). The coupling pad (240) may be connected to the sixth capacitor (C6). A first inductor (L1) may be connected between the first node (N1) and a third node (N3). A second inductor (L2) may be connected between the second node (N2) and ground. The second capacitor (C2) may be connected between the second node (N2) and a second processor (212). A first resistor (R1) may be connected between the third node (N3) and a fourth node (N4). A third capacitor (C3) may be connected between a third node (N3) and ground. A second resistor (R2) may be connected between a fourth node (N4) and ground. A third inductor (L3) may be connected between a fourth node (N4) and a fifth node (N5). A fourth capacitor (C4) may be connected between the fifth node (N5) and a grip sensor (230). The grip sensor (230) may be connected to the first processor (211) and may operate based on a voltage of a sixth node (N6) to which a driving voltage (VDD) is distributed. The fourth inductor (L4) may be connected between the driving voltage (VDD) and the sixth node (N6), and the fifth capacitor (C5) may be connected between the sixth node (N6) and ground.

[0057] In one embodiment, the first capacitor (C1), the third capacitor (C3), and the fourth capacitor (C4) may act as base capacitances of the grip sensor (230). For example, the first capacitor (C1) may act as a matching constant for tuning the antenna (220) and may affect a predetermined capacitance (e.g., total capacitance) of the grip sensor (230).

[0058] In one embodiment, when the grip sensor (230) is in operation, if the coupling pad (240) is electrically open from the circuit perspective of the grip sensor (230), the capacitance of the sixth capacitor (C6) and the coupling pad (240) cannot affect the base capacitance of the grip sensor (230) or a predetermined capacitance (e.g., total capacitance).

[0059] In one embodiment, when the second processor (212) is operating or when an RF signal is radiated, the coupling pad (240) may operate as a matching constant, tuning circuit, or matching circuit to the second processor (212).

[0060] FIG. 4 is a drawing showing a three-dimensional view of an electronic device (100) according to one embodiment of the present disclosure.

[0061] FIG. 5 is a drawing showing a three-dimensional view of an electronic device (100) according to one embodiment of the present disclosure.

[0062] FIG. 6 is a drawing showing a three-dimensional view of an electronic device (100) according to one embodiment of the present disclosure.

[0063] In FIGS. 4, 5 and 6, descriptions of configurations overlapping with FIG. 2 may be omitted.

[0064] Referring to FIGS. 4, 5 and 6, the electronic device (100) may include a printed circuit board (410), a first processor (211), a second processor (212), an antenna (220), a grip sensor (230) and a coupling pad (240).

[0065] Referring to FIG. 4, a printed circuit board (410) may mount a first processor (211), a second processor (212), a grip sensor (230), and / or a coupling pad (240) on a first layer (201).

[0066] However, it is not limited thereto, and referring to FIG. 5, the coupling pad (240) need not be exposed to the top layer (e.g., the first layer (201)) of the printed circuit board (410), and may be included in an inner layer (e.g., the second layer (202)) of the printed circuit board (410).

[0067] In one embodiment, the printed circuit board (410) may be formed of at least two layers.

[0068] In one embodiment, the printed circuit board (410) may include a first layer (201), a second layer (202), a third layer (203), a fourth layer (204), and a fifth layer (205).

[0069] In one embodiment, the antenna (220) may not be mounted on the printed circuit board (410), but may be electrically connected to the printed circuit board (410).

[0070] In one embodiment, the antenna (220) may be electrically connected to a grip sensor (230), a second processor (212), and a coupling pad (240). The grip sensor (230), the second processor (212), and the coupling pad (240) may be connected in parallel to the antenna (220).

[0071] In one embodiment, the coupling pad (240) may include a plurality of conductive pads. The coupling pad (240) may include a first conductive pad (241) formed on a first layer (201) and a second conductive pad (242) formed on a second layer (202) to overlap the first conductive pad (241). The first layer (201) may be adjacent to the second layer (202).

[0072] In one embodiment, the first conductive pad (241) may be electrically connected to the antenna (220) and electrically disconnected from the ground of the electronic device (100). The second conductive pad (242) may be electrically disconnected from the antenna (220) and electrically connected to the ground of the electronic device (100).

[0073] Referring to FIG. 4, the first conductive pad (241) electrically connected to the antenna (220) is disposed on a higher layer of the printed circuit board (410) than the second conductive pad (242) electrically disconnected from the antenna (220), but is not limited thereto. Referring to FIG. 5, the first conductive pad (241) electrically connected to the antenna (220) may be disposed on a lower layer than the second conductive pad (242) electrically disconnected from the antenna (220).

[0074] In one embodiment, the coupling pad (240) may include a conductive pad (e.g., a first conductive pad (241)) electrically connected to the antenna (220) and a conductive pad (e.g., a second conductive pad (242)) electrically disconnected from the antenna (220).

[0075] In one embodiment, the coupling pad (240) may electrically connect conductive pads arranged on each layer via a through-electrode (e.g., a through silicon via (TSV)) (420). The through-electrode (420) may be electrically connected to the antenna (220), the grip sensor (230), and the second processor (212).

[0076] In one embodiment, the coupling pad (240) may include a conductive pad (e.g., a first conductive pad (241)) electrically connected to the antenna (220) and a conductive pad (e.g., a second conductive pad (242)) electrically disconnected from the antenna (220) alternately arranged in layers on each of the printed circuit boards (410).

[0077] Mathematical expression 3 represents the capacitance of the coupling pad (240).

[0078]

[0079] Referring to mathematical expression 3, the capacitance of the coupling pad (240) may be proportional to the area of ​​the conductive pad and inversely proportional to the distance between electrodes (or the distance between layers).

[0080] Referring to FIG. 5, the coupling pad (240) can be implemented using two conductive pads, for example, including a first conductive pad (241) and a second conductive pad (242).

[0081] However, the present invention is not limited thereto, and with reference to FIGS. 4 and 6, the coupling pad (240) may be composed of a plurality of conductive pads. The coupling pad (240) composed of a plurality of conductive pads may include a conductive pad (e.g., a first conductive pad (241)) electrically connected to the antenna (220) alternately arranged in layers on each of the printed circuit boards (410) and a conductive pad (e.g., a second conductive pad (242)) electrically disconnected from the antenna (220).

[0082] In one embodiment, the coupling pad (240) may be affected by signals (e.g., noise) generated from electronic components placed around the printed circuit board (410), so that the electronic components may be placed at a predetermined distance from the coupling pad (240) during design.

[0083] In one embodiment, a gap of a specific distance may be included between the coupling pad (240) and the printed circuit board (410) to reduce the influence of signals (e.g., noise) induced from electronic components placed around the printed circuit board (410).

[0084] FIG. 7 is a graph showing the capacitance and current of a coupling pad (240) according to a frequency band according to one embodiment of the present disclosure.

[0085] The 701 frequency band represents the operating frequency band of the grip sensor (230), and the 703 frequency band represents the frequency band of the RF signal output from the second processor (212).

[0086] Referring to mathematical expressions 1 and 2, the coupling pad (240) may have a characteristic of blocking current in a frequency band having a direct current component and allowing current to flow in a frequency band having an alternating current component.

[0087] Referring to FIG. 7, the operating frequency of the grip sensor (230) may include a 701 frequency band (e.g., several hundred Khz), and the frequency band of the RF signal may include a 703 frequency band (e.g., from about 600 Mhz to about 3.8 Ghz). The operating frequency of the grip sensor (230) may be close to direct current, and the frequency band of the RF signal may include characteristics close to alternating current.

[0088] In one embodiment, when the grip sensor (230) is operating, the coupling pad (240) may be electrically open from a circuit perspective of the grip sensor (230).

[0089] In one embodiment, when the second processor (212) is operating or when an RF signal is radiated, the coupling pad (240) may be in a state that includes electrical capacitance from the circuit perspective of the second processor (212).

[0090] FIG. 8a is a drawing showing the electrical connection state of the first conductive pad (241) according to one embodiment of the present disclosure.

[0091] Referring to FIG. 3 and FIG. 8A, a first conductive pad (241) formed on a first layer (201) of a printed circuit board (410) may be electrically connected to an antenna (220) and electrically disconnected from a ground of an electronic device (100). The first conductive pad (241) may be electrically connected to an antenna connector (810) and a sixth capacitor (C6). The first conductive pad (241) may be spaced apart from the first layer (201) by a first distance (D1). The antenna connector (810) may be electrically connected to the antenna (220). The sixth capacitor (C6) may be electrically connected to the antenna (220) through the antenna connector (810).

[0092] FIG. 8b is a drawing showing the electrical connection state of the second conductive pad (242) according to one embodiment of the present disclosure.

[0093] Referring to FIG. 8B, the second conductive pad (242) may be electrically disconnected from the antenna (220) and electrically connected to the ground of the electronic device (100). The second conductive pad (242) may be spaced apart from the second layer (202) by a second distance (D2). The second conductive pad (242) may be electrically connected to the ground of the electronic device (100) through an internal wiring (801). The internal wiring (801) may be arranged inside the second layer (202). When forming a gap between the second conductive pad (242) and the second layer (202), the internal wiring (801) may be formed in a manner in which the second conductive pad (242) and the second layer (202) are attached to each other without a gap at a specific point. The first distance (D1) and the second distance (D2) may be equal to each other. However, this is not limited to the first distance (D1) and the second distance (D2) may be different from each other.

[0094] FIG. 8c is a drawing showing the electrical connection state of the second conductive pad (242) according to one embodiment of the present disclosure.

[0095] Referring to FIG. 8C, the second conductive pad (242) may be electrically disconnected from the antenna (220) and electrically connected to the ground of the electronic device (100). The second conductive pad (242) may be spaced apart from the second layer (202) by a third distance (D3). The second conductive pad (242) may be electrically connected to the ground of the electronic device (100) through an external wiring (803). The external wiring (803) may include a through-hole electrode (e.g., TSV). The first distance (D1) and the third distance (D3) may be the same. However, the present invention is not limited thereto, and the first distance (D1) and the third distance (D3) may be different from each other.

[0096] FIG. 8d is a drawing showing the electrical connection state of the second conductive pad (242) according to one embodiment of the present disclosure.

[0097] Referring to FIG. 8D, the second conductive pad (242) may be electrically disconnected from the antenna (220) and electrically connected to the ground of the electronic device (100). The second conductive pad (242) may be spaced apart from the second layer (202) by a fourth distance (D4). The second conductive pad (242) may be electrically connected to the ground of the electronic device (100) through a plurality of internal wires (804). The plurality of internal wires (804) may be arranged inside the second layer (202). When the plurality of internal wires (804) form a gap between the second conductive pad (242) and the second layer (202), a specific point may be formed in a manner in which the second conductive pad (242) and the second layer (202) are attached to each other without a gap. The first distance (D1) and the fourth distance (D4) may be the same. However, this is not limited to the first distance (D1) and the fourth distance (D4) may be different.

[0098] FIG. 9 is a diagram illustrating an electronic device (100) according to one embodiment of the present disclosure. The electronic device (100) of FIG. 9 may include a tuner circuit and a plurality of coupling pads, more than the electronic device (100) of FIG. 2. In describing the electronic device (100) of FIG. 9, descriptions that overlap with the components described above may be omitted.

[0099] In one embodiment, the electronic device (100) may include a printed circuit board (410), a first processor (211), a second processor (212), an antenna (220), a grip sensor (230), a first tuner circuit (911), a first coupling pad (912), a second tuner circuit (921), and a second coupling pad (922).

[0100] In one embodiment, the printed circuit board (410) may mount a first processor (211), a second processor (212), an antenna (220), a grip sensor (230), a first tuner circuit (911), a first coupling pad (912), a second tuner circuit (921), and a second coupling pad (922).

[0101] In one embodiment, the printed circuit board (410) may be formed of at least two layers.

[0102] In one embodiment, a printed circuit board (410) including at least two layers may mount a first processor (211), a second processor (212), an antenna (220), a grip sensor (230), a first tuner circuit (911), a first coupling pad (912), a second tuner circuit (921), and a second coupling pad (922) on the top layer.

[0103] In one embodiment, the antenna (220) may not be mounted on the printed circuit board (410), but may be electrically connected to the printed circuit board (410).

[0104] In one embodiment, the antenna (220) may be electrically connected to a second processor (212), a grip sensor (230), a first tuner circuit (911), a first coupling pad (912), a second tuner circuit (921), and a second coupling pad (922). The second processor (212), the grip sensor (230), the first tuner circuit (911), the first coupling pad (912), the second tuner circuit (921), and the second coupling pad (922) may be connected in parallel to the antenna (220).

[0105] In one embodiment, the second processor (212) can match the first RF signal to the antenna (220) using the first tuner circuit (911) and the first coupling pad (912).

[0106] In one embodiment, the second processor (212) can match the second RF signal to the antenna (220) using the second tuner circuit (921) and the second coupling pad (922).

[0107] In one embodiment, the electronic device (100) can match multiple RF signals to the antenna (220) based on multiple tuner circuits (e.g., first tuner circuit (911), second tuner circuit (921)) and multiple coupling pads (e.g., first coupling pad (912), second coupling pad (922)).

[0108] In one embodiment, the first tuner circuit (911) or the second tuner circuit (921) may share a coupling pad (e.g., the first coupling pad (912) or the second coupling pad (922)).

[0109] FIG. 10 is a graph showing the radiation efficiency of an antenna according to a frequency band of an electronic device (100) according to one embodiment of the present disclosure.

[0110] Table 1 is a table comparing the performance of an electronic device (100) including a coupling pad (240) according to one embodiment of the disclosure and a general electronic device.

[0111] General electronic device Electronic device of the present disclosure (100) Antenna radiation efficiency (frequency band 3.2 Ghz ~ 3.5 Ghz) -5.3 dB -5.5 dB Base capacitance of grip sensor 139 pF 39 pF Grip sensor detection distance 3 mm 7 mm

[0112] In FIG. 10, 1001 is a graph showing the radiation efficiency of the antenna (220) according to the frequency band of the electronic device (100) including the coupling pad (240) according to one embodiment of the present disclosure, and 1003 is a graph showing the radiation efficiency of the antenna (220) according to the frequency band of a general electronic device. Referring to FIG. 10 and Table 1, it can be confirmed that the electronic device (100) including the coupling pad (240) according to one embodiment of the present disclosure has an increased range of detectable electrostatic capacitance because the base capacitance of the grip sensor is lower than the capacitance of a general electronic circuit. In addition, it can be confirmed that the electronic device (100) including the coupling pad (240) according to one embodiment of the present disclosure has dramatically improved the detection distance of the grip sensor. In terms of radiation efficiency of an RF signal, it can be confirmed that the electronic device (100) including the coupling pad (240) according to one embodiment of the present disclosure has a radiation efficiency of an antenna (220) according to a frequency band similar to that of a general electronic device (100).

[0113] In one embodiment, the electronic device (100) may include an antenna (220), a printed circuit board (410) formed of at least two layers and electrically connected to the antenna (220), a first processor (211) mounted on the printed circuit board (410), a second processor (212) mounted on the printed circuit board (410) and connected to the antenna (220) to transmit or receive a radio frequency (RF) signal through the antenna (220), a grip sensor (230) mounted on the printed circuit board (410) and electrically connected to the antenna (220) and the first processor (211) to detect whether a user's body is in contact using the antenna (220), and a coupling pad (240) formed on the printed circuit board (410) and electrically connected to the antenna (220), the second processor (212) and the grip sensor (230), and providing a capacitance for tuning the antenna (220) to respond to the RF signal. there is.

[0114] In one embodiment, the coupling pad (240) may include a first conductive pad (241) formed in a first layer of at least two layers, and a second conductive pad (242) formed in a second layer adjacent to the first layer of at least two layers to overlap the first conductive pad (241).

[0115] In one embodiment, the first conductive pad (241) may be electrically connected to the antenna (220) and electrically disconnected from the ground of the electronic device (100).

[0116] In one embodiment, the second conductive pad (242) may be electrically isolated from the antenna (220) and electrically connected to ground.

[0117] In one embodiment, the second conductive pad (242) may be electrically connected to ground via external wiring.

[0118] In one embodiment, the second conductive pad (242) may be connected to ground via a plurality of internal wirings.

[0119] In one embodiment, at least two layers may each be electrically connected via silicon through-hole electrodes.

[0120] In one embodiment, the electronic device (100) may include a first tuning circuit for tuning the antenna (220), and a first coupling pad electrically connected to the antenna (220), the first tuning circuit, the second processor (212), and the grip sensor (230), the first coupling pad providing a capacitance for tuning the antenna (220) to correspond to a first RF signal.

[0121] In one embodiment, the electronic device (100) may include a second tuning circuit for tuning the antenna (220), and a second coupling pad electrically connected to the antenna (220), the first tuning circuit, the second tuning circuit, the second processor (212), and the grip sensor (230), and providing a capacitance for tuning the antenna (220) to correspond to a second RF signal.

[0122] In one embodiment, the first conductive pads (241) may be spaced apart by a specific distance on the first layer.

[0123] In one embodiment, the second conductive pads (242) may be spaced apart by a specific distance on the second layer.

[0124] In one embodiment, the coupling pad (240) can be electrically opened in response to the operating frequency of the grip sensor (230).

[0125] In one embodiment, the first conductive pad (241) may be electrically connected to the antenna (220) based on internal or external wiring.

[0126] In one embodiment, the capacitance of the coupling pad (240) may increase in proportion to the area of ​​the first conductive pad (241) and the second conductive pad (242), and the capacitance of the coupling pad (240) may decrease in proportion to the distance between the first conductive pad (241) and the second conductive pad (242).

[0127] In one embodiment, the coupling pad (240) may include a plurality of first conductive pads (241) and a plurality of second conductive pads (242).

[0128] In one embodiment, the electronic device (100) may include a printed circuit board (410) formed of at least two layers, an antenna (220) mounted on the printed circuit board (410), a first processor (211) mounted on the printed circuit board (410), a second processor (212) mounted on the printed circuit board (410) and connected to the antenna (220) to transmit or receive a radio frequency (RF) signal through the antenna (220), a grip sensor (230) mounted on the printed circuit board (410) and electrically connected to the antenna (220) and the first processor (211) to detect whether a user's body is in contact using the antenna (220), and a coupling pad (240) formed on the printed circuit board (410) and electrically connected to the antenna (220), the second processor (212) and the grip sensor (230), and providing a capacitance for tuning the antenna (220) corresponding to the RF signal.

[0129] In one embodiment, the coupling pad (240) may include a first conductive pad (241) formed in a first layer of at least two layers, and a second conductive pad (242) formed in a second layer adjacent to the first layer of at least two layers to overlap the first conductive pad (241).

[0130] In one embodiment, the first conductive pad (241) may be electrically connected to the antenna (220) and electrically disconnected from the ground of the electronic device (100).

[0131] In one embodiment, the second conductive pad (242) may be electrically isolated from the antenna (220) and electrically connected to ground.

[0132] In one embodiment, the second conductive pad (242) may be electrically connected to ground through a silicon through-hole electrode.

[0133] An electronic device according to an embodiment disclosed in this document may take various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. The electronic device according to an embodiment of this document is not limited to the aforementioned devices.

[0134] It should be understood that the embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to specific embodiments, but include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0135] The term "module" used in one embodiment of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0136] An embodiment of the present document may be implemented as software (e.g., a program) including one or more instructions stored in a storage medium (e.g., built-in memory or external memory) readable by a machine (e.g., an electronic device (100)). For example, a processor (e.g., processor (110)) of the machine (e.g., electronic device (100)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0137] According to one embodiment, the method according to one embodiment disclosed in the present document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0138] According to one embodiment, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to one embodiment, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to one embodiment, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In electronic devices, antenna; A printed circuit board formed of at least two layers and electrically connected to the antenna; A first processor mounted on the printed circuit board; A second processor mounted on the printed circuit board and connected to the antenna, for transmitting or receiving an RF (radio frequency) signal through the antenna; A grip sensor mounted on the printed circuit board and electrically connected to the antenna and the first processor, the grip sensor detecting whether the user's body is in contact using the antenna; and An electronic device comprising a coupling pad formed on the printed circuit board and electrically connected to the antenna, the second processor and the grip sensor, the coupling pad providing capacitance for tuning the antenna to respond to the RF signal.

2. In paragraph 1, The above coupling pad, a first conductive pad formed on a first layer among the at least two layers; and An electronic device comprising a second conductive pad formed to overlap the first conductive pad in a second layer adjacent to the first layer among the at least two layers.

3. In paragraph 2, The above first conductive pad An electronic device electrically connected to the antenna and electrically disconnected from the ground of the electronic device.

4. In paragraph 2, The above second conductive pad An electronic device electrically isolated from the antenna and electrically connected to the ground.

5. In paragraph 4, The above second conductive pad An electronic device electrically connected to the ground through external wiring.

6. In paragraph 4, The above second conductive pad An electronic device connected to the ground through multiple internal wiring.

7. In paragraph 1, At least two layers above Electronic devices each electrically connected through a silicon penetrating electrode.

8. In paragraph 1, a first tuning circuit for tuning the antenna; and An electronic device comprising a first coupling pad electrically connected to the antenna, the first tuning circuit, the second processor and the grip sensor, the first coupling pad providing a capacitance for tuning the antenna to correspond to the first RF signal.

9. In paragraph 8, a second tuning circuit for tuning the antenna; and An electronic device comprising a second coupling pad electrically connected to the antenna, the first tuning circuit, the second tuning circuit, the second processor, and the grip sensor, the second coupling pad providing a capacitance for tuning the antenna to correspond to the second RF signal.

10. In paragraph 2, The above first conductive pad Electronic devices spaced apart by a specific interval on the first layer.

11. In paragraph 2, The above second conductive pad Electronic devices spaced apart by a specific interval on the second layer.

12. In paragraph 1, The above coupling pad An electronic device that electrically opens in response to the operating frequency of the grip sensor.

13. In paragraph 2, The above first conductive pad An electronic device electrically connected to said antenna based on internal or external wiring.

14. In paragraph 2, The above coupling pad The capacitance of the coupling pad increases in proportion to the area of ​​the first conductive pad and the second conductive pad, An electronic device in which the capacitance of the coupling pad decreases in proportion to the distance between the first conductive pad and the second conductive pad.

15. In paragraph 2, The above coupling pad An electronic device comprising a plurality of the first conductive pads and a plurality of the second conductive pads.

Images