Electronic device comprising speaker module

Abstract

An electronic device according to various embodiments disclosed in the present document is provided. The electronic device according to one embodiment of the disclosure may comprise: a housing including an acoustic hole; a speaker housing which includes an acoustic conduit having one end connected to the acoustic hole and which is disposed in the housing; a speaker module which includes a first speaker and a second speaker that is spaced apart from the first speaker so as to be encompassed by the first speaker and that outputs an acoustic signal having a band higher than that of the first speaker, and which is disposed in the acoustic conduit; and an acoustic guide member which is disposed on one surface of the speaker module so that at least a portion thereof overlaps an area located between the first speaker and the second speaker when one surface of the speaker module is substantially viewed vertically, and which is opened toward the acoustic hole. Other various embodiments are possible.

Description

Electronic device including a speaker module

[0001] Various embodiments disclosed in this document relate to an electronic device including a speaker module.

[0002] Speaker modules for playing sound can be incorporated into electronic devices. As more and more content is played through electronic devices, user interest in sound performance is also growing.

[0003] Meanwhile, a portable electronic device may be equipped with a speaker that outputs a low-frequency sound signal and a speaker that outputs a high-frequency sound signal.

[0004] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0005] A portable electronic device may be provided with a first speaker that outputs low-pitched audio signals and a second speaker that outputs high-pitched audio signals. If the first and second speakers are separately arranged within the electronic device, the space available for arranging other electronic components may be reduced. Furthermore, high-pitched sounds have a higher frequency per second and a longer wavelength, which may result in lower diffraction compared to low-pitched sounds. Therefore, the second speaker, which outputs relatively high-pitched sounds compared to the first speaker, may be arranged adjacent to an audio hole formed in the electronic device so that the length of the conduit connecting the audio hole and the second speaker is shortened. For example, the second speaker may be arranged adjacent to an audio hole formed on a side surface of a housing that constitutes the exterior of the electronic device. Meanwhile, since the side surface of the housing can be used as an antenna radiator, the antenna radiation performance may be deteriorated if the second speaker is arranged adjacent to the side surface.

[0006] The technical tasks to be achieved in this document are not limited to the technical tasks mentioned above, and other technical tasks not mentioned will be clearly understood by those with ordinary skill in the technical field to which this document pertains from the description below.

[0007] According to one embodiment of the present disclosure, an electronic device may include a housing including an acoustic hole, a speaker housing disposed in the housing including an acoustic conduit having one end connected to the acoustic hole, a first speaker, and a second speaker spaced apart from and wrapped around the first speaker and outputting an acoustic signal of a higher frequency than that of the first speaker, and a speaker module disposed in the acoustic conduit, and an acoustic guide member disposed on one surface of the speaker module such that at least a portion overlaps with an area located between the first speaker and the second speaker when one surface of the speaker module is viewed substantially vertically, and open toward the acoustic hole.

[0008] According to one embodiment of the present disclosure, an electronic device may include a housing including an acoustic hole formed on one surface thereof, a speaker housing including an acoustic conduit having one end connected to the acoustic hole and disposed in the housing, a first speaker, and a second speaker spaced apart from and wrapped around the first speaker and outputting an acoustic signal of a higher frequency than that of the first speaker, and a speaker module disposed in the acoustic conduit, and an inclined structure facing the second speaker between the housing and the speaker module. A space between the inclined structure and the speaker module may become wider as it moves from the speaker module toward the acoustic hole.

[0009] According to one embodiment of the present disclosure, a portable communication device comprises a housing including an acoustic hole;

[0010] A portable communication device may include a display disposed in the housing and a speaker module disposed under the display in the housing, the first speaker including a first diaphragm configured to face a first direction substantially perpendicular to a rear surface of the portable communication device and output a first acoustic signal corresponding to a first frequency range, and a second speaker including a second diaphragm configured to face the first direction and output a second acoustic signal corresponding to a second frequency range at least a portion higher than the first frequency range, wherein the second diaphragm is disposed to be spaced apart from the first diaphragm and substantially surrounded by the first diaphragm when viewed from the rear surface, and may include an acoustic conduit formed in the housing to extend at least a portion in a second direction substantially parallel to the rear surface of the portable communication device and to be connected to the speaker module and the acoustic hole, and an acoustic guide member disposed between the rear surface of the portable communication device and the second speaker within the acoustic conduit so that at least a portion of the second acoustic signal is guided from the first direction to the second direction.

[0011] According to various embodiments disclosed in this document, a speaker module may include a first speaker and a second speaker. The first speaker may output a lower-pitched sound than the second speaker, and the second speaker may output a higher-pitched sound than the first speaker. The speaker module may be formed such that the second speaker is positioned within the first speaker. Accordingly, the space for arranging electronic components within the electronic device may be expanded compared to when the first speaker and the second speaker are separately positioned within the electronic device.

[0012] Additionally, an acoustic guide member may be arranged on one side of the speaker module to guide sound output from the second speaker into the acoustic hole and reduce scattering in the conduit connecting the sound hole of the electronic device to the second speaker. Accordingly, the electronic device can secure a certain level of acoustic performance through the second speaker as the sound output from the second speaker is not scattered within the conduit.

[0013] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0014] In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar components.

[0015] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments of the present disclosure.

[0016] FIG. 2A is a perspective view of the front of an electronic device according to one embodiment of the present disclosure.

[0017] FIG. 2B is a perspective view of the rear surface of the electronic device of FIG. 2A, according to one embodiment of the present disclosure.

[0018] FIG. 3 is an exploded perspective view of the electronic device of FIG. 2a, according to one embodiment of the present disclosure.

[0019] FIG. 4 is a front view of an electronic device according to one embodiment of the present disclosure.

[0020] FIG. 5A is a perspective view of a speaker module according to one embodiment of the present disclosure.

[0021] FIG. 5b is a perspective view of a speaker housing and a speaker module coupled together according to one embodiment of the present disclosure, and is a drawing of an acoustic guide member arranged in a mounting portion of the speaker module.

[0022] FIGS. 6A and 6B are perspective views showing a speaker housing having a speaker module coupled thereto, coupled to a rear plate of an electronic device, and an acoustic guide member disposed between the rear plate and the speaker module, according to one embodiment of the present disclosure.

[0023] Figure 7 is a cross-sectional view taken along line P1-P1 of Figure 6b.

[0024] FIGS. 8A and 8B are perspective views of a speaker housing having a speaker module coupled thereto, coupled with a metal plate, and an acoustic guide member disposed between the metal plate and the speaker module, according to one embodiment of the present disclosure.

[0025] FIG. 9 is a cross-sectional view taken along line P2-P2 of FIG. 8b according to one embodiment of the present disclosure.

[0026] FIGS. 10A and 10B are drawings showing a speaker module disposed inside a speaker housing and an acoustic guide member disposed between the speaker module and the speaker housing, according to one embodiment of the present disclosure.

[0027] Figure 11 is a cross-sectional view taken along line P3-P3 of Figure 10a.

[0028] FIGS. 12a and 12b are perspective views showing a speaker module placed in a speaker housing formed by bending an acoustic conduit according to one embodiment of the present disclosure and coupled to a rear plate.

[0029] Fig. 13 is a rear view of the speaker housing and speaker module arranged in 12b, and is a drawing of a state in which at least a portion of the sound guide member arranged between the speaker module and the rear plate is open toward the sound hole formed in the rear plate.

[0030] FIGS. 14a and 14b are drawings of various shapes of an acoustic guide member according to one embodiment of the present disclosure.

[0031] FIGS. 15a and 15b are drawings of various shapes of an acoustic guide member according to one embodiment of the present disclosure.

[0032] FIG. 16 is a diagram illustrating the acoustic performance of an electronic device through a speaker module when an acoustic guide member is disposed on a mounting portion of the speaker module and when it is not disposed, according to one embodiment of the present disclosure.

[0033] In the following description, various embodiments of this document are described with reference to the attached drawings. It should be understood that the various embodiments of this document and the terminology used herein are not intended to limit the technical features described herein to specific embodiments, but rather encompass various modifications, equivalents, or alternatives of the embodiments.

[0034] In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of the noun corresponding to an item may include one or more of said items, unless the context clearly indicates otherwise.

[0035] In this document, the phrases "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" can each include any one of the items listed together in that phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish the corresponding component from other corresponding components and do not limit the corresponding components in any other respect (e.g., importance or order). When a component (e.g., a first) is referred to as "coupled" or "connected" to another (e.g., a second) component, with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0036] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments. Referring to FIG. 1, in the network environment (100), the electronic device (101) may communicate with the electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of the electronic device (104) or the server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0037] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0038] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0039] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0040] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0041] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0042] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0043] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0044] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0045] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0046] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0047] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0048] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0049] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0050] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0051] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0052] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0053] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0054] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the at least one selected antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0055] According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0056] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0057] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0058] FIG. 2A is a perspective view of a front side of an electronic device according to an embodiment of the present disclosure. FIG. 2B is a perspective view of a rear side of the electronic device of FIG. 2A according to an embodiment of the present disclosure.

[0059] The electronic device (200) described below may include at least one of the components of the electronic device (101) described above in FIG. 1.

[0060] Referring to FIGS. 2A and 2B , an electronic device (200) according to one embodiment may include a housing (210) that includes a first side (or front side) (210A), a second side (or back side) (210B), and a side surface (210C) that surrounds a space between the first side (210A) and the second side (210B). In one embodiment (not shown), the housing may refer to a structure that forms a portion of the first side (210A), the second side (210B), and the side surface (210C) of FIG. 2A . According to one embodiment, the first side (210A) may be formed by a front plate (202) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (210B) may be formed by a substantially opaque back plate (211). The rear plate (211) may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side surface (210C) may be formed by a side bezel structure (218) (or “side member”) that is coupled to the front plate (202) and the rear plate (211) and comprises a metal and / or polymer. In some embodiments, the rear plate (211) and the side bezel structure (218) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0061] In the illustrated embodiment, the front plate (202) may include a first region (210D) that extends seamlessly from the first surface (210A) toward the rear plate, at both ends of a long edge of the front plate. In the illustrated embodiment (see FIG. 2B), the rear plate (211) may include a second region (210E) that extends seamlessly from the second surface (210B) toward the front plate, at both ends of a long edge. In some embodiments, the front plate (202) or the rear plate (211) may include only one of the first region (210D) or the second region (210E). In some embodiments, the front plate (202) may not include the first region and the second region, but may only include a flat plane that is arranged parallel to the second surface (210B). In the above embodiments, when viewed from the side of the electronic device, the side bezel structure (218) may have a first thickness (or width) on the side that does not include the first region (210D) or the second region (210E), and may have a second thickness that is thinner than the first thickness on the side that includes the first region (210D) or the second region (210E).

[0062] According to one embodiment, the electronic device (200) may include at least one of a display (201), an input device (203), an audio output device (207, 214), a sensor module (204, 219), a camera module (205, 212), a key input device (217), an indicator (not shown), and a connector (208). In some embodiments, the electronic device (200) may omit at least one of the components (e.g., the key input device (217) or the indicator) or may additionally include other components.

[0063] The display (201) may be visually exposed, for example, through a substantial portion of the front plate (202). In some embodiments, at least a portion of the display (201) may be exposed through the front plate (202), which forms the first side (210A) and the first region (210D) of the side surface (210C). The display (201) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer for detecting a magnetic field-type stylus pen. In some embodiments, at least a portion of the sensor modules (204, 219), and / or at least a portion of the key input device (217), may be disposed in the first region (210D), and / or the second region (210E).

[0064] The input device (203) may include a microphone (203). In some embodiments, the input device (203) may include a plurality of microphones (203) arranged to detect the direction of sound. The audio output device (207, 214) may include speakers (207, 214). The speakers (207, 214) may include an external speaker (207) and a call receiver (214). In some embodiments, the microphone (203), the speakers (207, 214), and the connector (208) may be arranged at least partially in the internal space of the electronic device (200) and may be exposed to the external environment through at least one hole formed in the housing (210). In some embodiments, the hole formed in the housing (210) may be used jointly for the microphone (203) and the speakers (207, 214). In some embodiments, the audio output device (207, 214) may include a speaker (e.g., a piezo speaker) that operates without the hole formed in the housing (210).

[0065] The sensor module (204, 219) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. The sensor module (204, 219) may include, for example, a first sensor module (204) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or a third sensor module (219) (e.g., a heart rate monitor (HRM) sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor may be disposed on the first surface (210A) of the housing (210) (e.g., a home key button), a portion of the second surface (210B), and / or under the display (201). The electronic device (200) may further include at least one of a sensor module not shown, for example, a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, a proximity sensor, or an illuminance sensor.

[0066] The camera modules (205, 212) may include a first camera module (205) disposed on a first side (210A) of the electronic device (200), a second camera module (212) disposed on a second side (210B), and / or a flash (213). The camera modules (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (213) may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (a wide-angle lens, an ultra-wide-angle lens, or a telephoto lens) and image sensors may be disposed on one side of the electronic device (200).

[0067] The key input device (217) may be positioned on a side surface (210C) of the housing (210). In one embodiment, the electronic device (200) may not include some or all of the above-mentioned key input devices (217), and the key input devices (217) that are not included may be implemented in another form, such as a soft key, on the display (201). In one embodiment, the key input device (217) may be implemented using a pressure sensor included in the display (201).

[0068] The indicator may be disposed, for example, on the first surface (210A) of the housing (210). The indicator may provide, for example, status information of the electronic device (200) in the form of light (e.g., a light-emitting element). In one embodiment, the light-emitting element may provide, for example, a light source that is linked to the operation of the camera module (205). The indicator may include, for example, a light emitting diode (LED), an infrared (IR) LED, and / or a xenon lamp.

[0069] The connector hole (208) may include a first connector hole (208) that can accommodate a connector (e.g., a universal serial bus (USB) connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (or earphone jack) (not shown) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.

[0070] Some of the camera modules (205, 212), some of the sensor modules (204, 219), or indicators may be arranged to be visually exposed through the display (201). For example, the camera module (205), the sensor module (204), or the indicator may be arranged to be in contact with the external environment through an opening or transparent area perforated from the internal space of the electronic device (200) to the front plate (202) of the display (201). According to one embodiment, an area where the display (201) and the camera module (205) face each other may be formed as a transparent area having a certain transmittance as part of an area for displaying content. According to one embodiment, the transparent area may be formed to have a transmittance in a range of about 5% to about 20%. Such a transparent area may include an area overlapping with an effective area (e.g., a field of view area) of the camera module (205) through which light passes to be imaged by the image sensor to create an image. For example, the transparent area of ​​the display (201) may include an area having a lower pixel density than the surrounding area. For example, the transparent area may replace the opening. For example, the camera module (205) may include an under-display camera (UDC). In one embodiment, some of the sensor modules (204) may be arranged to perform their functions without being visually exposed through the front plate (202) in the internal space of the electronic device. For example, in such a case, the area of ​​the display (201) facing the sensor module may not require a perforated opening.

[0071] According to one embodiment, the electronic device (200) has a bar-type or plate-type appearance, but the present invention is not limited thereto. For example, the illustrated electronic device (200) may be part of a foldable electronic device, a slidable electronic device, a stretchable electronic device, and / or a rollable electronic device. The terms "foldable electronic device", "slidable electronic device", "stretchable electronic device" and / or "rollable electronic device" may refer to an electronic device that is capable of bending deformation of a display (e.g., a display (330) of FIG. 3) so that at least a portion thereof is folded, wound or rolled, at least a portion thereof is expanded, and / or can be housed inside a housing (e.g., a housing (210) of FIGS. 2A and 2B). The foldable electronic device, the slidable electronic device, the stretchable electronic device and / or the rollable electronic device can be used by expanding the screen display area by unfolding the display or exposing a wider area of ​​the display to the outside, depending on the needs of the user.

[0072] FIG. 3 is an exploded perspective view of the electronic device of FIG. 2a, according to one embodiment of the present disclosure.

[0073] The electronic device (300) of FIG. 3 may be at least partially similar to the electronic device (200) of FIGS. 2A and 2B, or may include other embodiments of the electronic device.

[0074] Referring to FIG. 3, the electronic device (300) (e.g., the electronic device (200) of FIG. 2A or FIG. 2B) may include a side member (310) (e.g., a side bezel structure), a first support member (311) (e.g., a bracket or a support structure), a front plate (320) (e.g., a front cover) (e.g., the front plate (202) of FIG. 2A), a display (330) (e.g., the display (201) of FIG. 2A), a substrate (340) (e.g., a printed circuit board (PCB), a flexible PCB (FPCB), or a rigid-flexible PCB (RFPCB)), a battery (350), a second support member (360) (e.g., a rear case), an antenna (370), and a rear plate (380) (e.g., a rear cover) (e.g., the rear plate (211) of FIG. 2B). In some embodiments, the electronic device (300) may omit at least one of the components (e.g., the first support member (311) or the second support member (360)) or may additionally include other components. At least one of the components of the electronic device (300) may be identical to or similar to at least one of the components of the electronic device (200) of FIG. 2A or FIG. 2B, and any redundant description thereof will be omitted below.

[0075] The first support member (311) may be disposed inside the electronic device (300) and connected to the side member (310), or may be formed integrally with the side member (310). The first support member (311) may be formed of, for example, a metallic material and / or a non-metallic (e.g., a polymer) material. The first support member (311) may have a display (330) coupled to one surface and a substrate (340) coupled to the other surface. A processor (e.g., the processor (120) of FIG. 1), a memory (e.g., the memory (130) of FIG. 1), and / or an interface (e.g., the interface (177) of FIG. 1) may be mounted on the substrate (340). The processor may include, for example, one or more of a central processing unit, an application processor, a graphic processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0076] The memory may include, for example, volatile memory or non-volatile memory.

[0077] The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (300) to an external electronic device, for example, and may include a USB connector, an SD card / MMC (multimedia card) connector, or an audio connector.

[0078] The battery (350) is a device for supplying power to at least one component of the electronic device (300), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (350) may be disposed substantially on the same plane as, for example, the substrate (340). The battery (350) may be integrally disposed within the electronic device (300). In one embodiment, the battery (350) may be disposed so as to be detachably attached to the electronic device (300).

[0079] The antenna (370) may be positioned between the rear plate (380) and the battery (350). The antenna (370) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna (370) may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In one embodiment, the antenna structure may be formed by a part or a combination of the side bezel structure (310) and / or the first support member (311).

[0080] FIG. 4 is a front view of an electronic device according to one embodiment of the present disclosure.

[0081] According to one embodiment, the electronic device (e.g., portable communication device) (400) illustrated in FIG. 4 may be an example of the electronic device (101) illustrated in FIG. 1, the electronic device (200) illustrated in FIGS. 2A and 2B, and / or the electronic device (300) illustrated in FIG. 3. The electronic device (400) described below uses the same reference numerals for all components that are identical or similar to those illustrated in FIGS. 1, 2A, 2B, and 3, except where otherwise indicated.

[0082] According to one embodiment, the electronic device (400) may include a housing (410) (e.g., the housing (210) of FIG. 2A) that supports various mechanical and electrical components (e.g., the display (401)) that constitute the electronic device (400) and at least a portion of which constitutes the exterior of the electronic device (400) (e.g., the side bezel structure (218) of FIG. 2A). Here, the electrical components may be understood to collectively refer to components that transmit or receive electrical signals. The housing (410) may be composed of a single component, or may be composed in a manner in which a plurality of components are combined. For example, the housing (410) may include a mechanical component formed of a metal material and a non-metallic mechanical component combined with the mechanical component formed of the metal material through an injection molding process.

[0083] According to one embodiment, as illustrated in FIG. 4, a speaker module (500) (e.g., a speaker module, an audio output module (155) of FIG. 1 and / or an audio output device (214) of FIG. 2A) may be disposed in a housing (410) of an electronic device (400). In one embodiment, the speaker module (500) may refer to a component that outputs sound according to a command of a processor (120) when an application is executed. In one embodiment, the speaker module (500) may include a speaker that outputs sound and / or a receiver that outputs call sound when an application is operated. In one embodiment, the speaker module (500) may output receiver sound, which is a call sound, during a call, and may output speaker sound when an application such as a video or a game is operated.

[0084] In one embodiment, there may be at least one speaker module (500). In one embodiment, the speaker module (500) may be disposed inside the housing (410) adjacent to a sound hole (420) formed in the electronic device (400) so as to emit sound output from the speaker module (500) through the sound hole (420) to the outside of the electronic device (400). In one embodiment, at least one speaker module (500) may be disposed adjacent to a side of the housing (410) and connected to the sound hole (420). For example, a plurality of speaker modules (500) may be disposed in the housing (410) so as to be adjacent to sound holes (420) located in the -X direction and the +X direction based on FIG. 4. Therefore, the electronic device (400) may secure stereo performance through the plurality of speaker modules (500) to provide synesthetic sound to the user. Meanwhile, the positions of the speaker modules (500) illustrated in FIG. 4 are merely examples, and the speaker modules (500) may be placed in various positions inside the electronic device (400).

[0085] In one embodiment, the sound hole (420) may be formed in a component constituting the electronic device (400). In one embodiment, the sound hole (420) may be formed in a side surface (e.g., side surface (210C) of FIG. 2A) of a housing (410) constituting the exterior of the electronic device (400). In one embodiment, referring to FIG. 6B described below, the sound hole (420) may be formed in a rear plate (430) disposed on the rear surface of the housing (410). The sound hole (420) formed in the rear plate (430) may face the side surface of the housing (410). In addition, the sound hole (420) may be formed in at least one of various components constituting the electronic device (400).

[0086] In one embodiment, a foreign matter prevention member (not shown) including a mesh may be placed in the sound hole (420) to prevent external foreign matter from entering through the sound hole (420). The foreign matter prevention member may be placed in the housing (410) to cover the entrance portion of the sound hole (420) or a portion of the sound hole (420).

[0087] According to one embodiment, sound (e.g., an acoustic signal) radiated from the speaker module (500) may be transmitted to the acoustic hole (420) through an acoustic conduit (531) (e.g., an acoustic space) formed in the housing (410) and / or a mechanism (e.g., the speaker housing (530) of FIG. 5B) disposed inside the housing (410) and may be emitted to the outside of the electronic device (400). In one embodiment, the acoustic space may be a space formed when the acoustic conduit (531) formed in the speaker housing (530) is covered by the rear plate (430), the metal plate (440) (e.g., a support member), and / or one surface of the housing (410). In one embodiment, referring to FIG. 11 described below, the acoustic conduit (531) formed inside the speaker housing (530) may be an acoustic space. In one embodiment, in which the speaker housing (530) is omitted from the electronic device (400), the acoustic channel (531) may be formed as an engraved groove on one surface of the rear plate (430) in which the speaker module (500) is disposed or on one surface of the housing in which the speaker module (500) is disposed. In this case, the acoustic channel (531) guides sound output from the speaker module (500) to the acoustic hole (420) and may constitute a part of an acoustic space. The term “acoustic channel” or “acoustic space” may refer to a path that guides the transmission of sound (sound waves, sound). For example, the acoustic channel or acoustic space may refer to a physical space. The acoustic channel or acoustic space may include a space filled with a medium (e.g., air) capable of transmitting sound waves. Hereinafter, sound being transmitted through the acoustic channel (531) or acoustic space may refer to sound being transmitted via a specific space.

[0088] In one embodiment, the sound conduit (531) can guide sound output from the speaker module (500) to the sound hole (420) of the electronic device (400). The sound output from the speaker module (500) can be emitted to the outside of the electronic device (400) through the sound conduit (531) - the sound hole (420). In one embodiment, the sound conduit (531) can be formed in a speaker housing (530) at least a portion of which is disposed in the housing (410). For example, the sound conduit (531) can be formed to extend in one direction from the speaker housing (530). In one embodiment, in which the speaker housing (530) is omitted from the electronic device (400), the sound conduit (531) can be formed as an engraved groove on one surface of the rear plate (430) on which the speaker module (500) is disposed or on one surface of the housing on which the speaker module (500) is disposed.

[0089] In one embodiment, referring to FIG. 7 described below, sound output from the speaker module (500) may be emitted into the sound hole (420) through an acoustic space formed by covering the acoustic conduit (531) formed in the speaker housing (530) with the rear plate (430). In one embodiment, referring to FIG. 9 described below, sound output from the speaker module (500) may be emitted into the sound hole (420) through an acoustic space formed by covering the acoustic conduit (531) formed in the speaker housing (530) with the metal plate (440). In one embodiment, referring to FIG. 11 described below, the acoustic space may be an acoustic conduit (531) formed inside the speaker housing (530). The structure of the acoustic space described above is merely an example, and the acoustic space may be a space formed by another device disposed in the housing (410) or by the housing (410). For example, the sound conduit (531) may be formed as a concave groove on one surface (e.g., the back surface) of the housing (410) where the speaker module (500) is placed or on one surface of the rear plate (430) where the speaker module (500) is placed, and may constitute part of an acoustic space connecting the speaker module (500) and the sound hole (420).

[0090] FIG. 5A is a perspective view of a speaker module according to an embodiment of the present disclosure. FIG. 5B is a perspective view of a speaker housing and a speaker module coupled according to an embodiment of the present disclosure, and a drawing showing an acoustic guide member arranged on a mounting portion of the speaker module. FIGS. 6A and 6B are perspective views of a speaker housing coupled with a speaker module according to an embodiment of the present disclosure, wherein an acoustic guide member is arranged between the rear plate and the speaker module. FIG. 7 is a cross-sectional view taken along line P1-P1 of FIG. 6B.

[0091] According to one embodiment, as illustrated in FIG. 5A, the speaker module (500) may include a first speaker (510) and a second speaker (520). In one embodiment, the first speaker (510) may be an audio output device that outputs a first audio signal corresponding to a first frequency range. The second speaker (520) may be an audio output device that outputs a second audio signal corresponding to a second frequency range. In one embodiment, at least a portion of the second frequency range may be higher than the first frequency range. According to one embodiment, the second speaker (520) may be an audio output device that outputs higher-frequency sounds than the first speaker (510). For example, the first speaker (510) may be a woofer speaker (or bass speaker), and the second speaker (520) may be a tweeter speaker.

[0092] In one embodiment, the second speaker (520) may be positioned inside the first speaker (510). For example, at least some of the components constituting the first speaker (510) may surround at least some of the components constituting the second speaker (520) and may be positioned outside the second speaker (520). For example, the second diaphragm (521) of the second speaker (520) may be positioned spaced apart from the first diaphragm (511) of the first speaker (510) and substantially surrounded by the first diaphragm (511). However, some of the components constituting the first speaker (510) may be positioned outside the components constituting the second speaker (520), while other components constituting the first speaker (510) may overlap with the components constituting the second speaker (520) when viewed vertically from the speaker module (500).

[0093] Referring to FIGS. 7, 9 and 11 described below, the first speaker (510) and the second speaker (520) can be configured as follows.

[0094] In one embodiment, referring to FIGS. 7, 9 and 11 described below, the first speaker (510) may include a first diaphragm (511), a first coil (512), a first magnet (513), a first dust cap (514), a first plate (515) and / or a second plate (516). The first speaker (510) may omit at least one of the above-described components or may add another component.

[0095] In one embodiment, the first magnet (513) of the first speaker (510) may include a permanent magnet that is related to the magnetic field strength of the first speaker (510). For example, the first magnet (513) may be various, such as a neodymium magnet, an alnico magnet, or a ferrite magnet. In one embodiment, the first magnet (513) may be a square annulus (or square loop shape) or a circular annulus (or circular loop shape) so as to surround the second magnet (523) of the second speaker (520).

[0096] In one embodiment, the first magnet (513) may be disposed between the first plate (515) and the second plate (516). In one embodiment, the first plate (515) and the second plate (516) of the first speaker (510) may include a magnetic material (e.g., a material that is magnetized in a magnetic field) that facilitates the passage of a magnetic force. In one embodiment, the first plate (515) and the second plate (516) may contribute to forming a magnetic field distribution of the first magnet (513). In one embodiment, at least one of the first plate (515) and the second plate (516) may be a yoke.

[0097] In one embodiment, the first coil (512) may be connected to a first vibration plate (511) (e.g., a cone-shaped vibration plate or a dome-shaped vibration plate). As current is applied to the first coil (512), an electromagnetic force may be applied between the first coil (512) and the first magnet (513). Accordingly, the first vibration plate (511) may be connected to the first coil (512) and vibrate to output a first acoustic signal in a first frequency range.

[0098] In one embodiment, the first speaker (510) may include a first dust cap (514). In one embodiment, the first dust cap (514) may block or reduce external foreign substances, such as dust or moisture, from entering the interior of the first speaker (510).

[0099] In one embodiment, referring to FIGS. 7, 9 and 11 described below, the second speaker (520) may include a second diaphragm (521), a second coil (522), a second magnet (523), a second dust cap (524), a third plate (525) and / or a cover member (526). The second speaker (520) may omit at least one of the above-described components or may add another component.

[0100] In one embodiment, the second magnet (523) of the second speaker (520) may include a permanent magnet that is related to the magnetic field strength of the second speaker (520). For example, the second magnet (523) may be a neodymium magnet, an alnico magnet, or a ferrite magnet. In one embodiment, the second magnet (523) may be a square annulus (or square loop shape) or a circular annulus (or circular loop shape).

[0101] In one embodiment, the second magnet (523) may be positioned between the second plate (516) of the first speaker (510) and the third plate (525) of the first speaker (510). In one embodiment, the third plate (525) may include a magnetic material that facilitates the passage of a magnetic force (e.g., a material that is magnetized in a magnetic field). In one embodiment, the third plate (525) may contribute to forming a magnetic field distribution of the second magnet (523). In one embodiment, the third plate (525) may be a yoke.

[0102] In one embodiment, the cover member (526) of the second speaker (520) may be positioned to cover the second coil (522). In one embodiment, a second dust cap (524) may be positioned inside the cover member (526). In one embodiment, the second dust cap (524) may block or reduce external foreign substances, such as dust or moisture, from entering the interior of the second speaker (520).

[0103] In one embodiment, the second coil (522) may be connected to a second vibration plate (521) (e.g., a cone-shaped vibration plate or a dome-shaped vibration plate). As current is applied to the second coil (522), an electromagnetic force may be applied between the second coil (522) and the second magnet (523). Accordingly, the second vibration plate (521) may be connected to the second coil (522) and vibrate to output a second acoustic signal in a second frequency range.

[0104] In one embodiment, referring to FIGS. 7, 9, and 11 described below, some components of the second speaker (520) may be wrapped around components of the first speaker (510) as described above. According to one embodiment, some components of the first speaker (510) may be located outside components of the second speaker (520). For example, the second magnet (523) of the second speaker (520) may be wrapped around the first magnet (513) of the first speaker (510) and may not overlap with the first magnet (513) when the speaker module (500) is viewed substantially perpendicularly. In one embodiment, the second coil (522) of the second speaker (520) may be wrapped around the first coil (512) of the first speaker (510) and may not overlap with the first coil (512) when the speaker module (500) is viewed substantially perpendicularly. In one embodiment, the second diaphragm (521) of the second speaker (520) may be surrounded by the first diaphragm (511) of the first speaker (510) and may not overlap with the first diaphragm (511) when viewed substantially perpendicularly to the speaker module (500). In one embodiment, the third plate (525) of the second speaker (520) may be surrounded by the first plate (515) of the first speaker (510) and may not overlap with the first plate (515) when viewed substantially perpendicularly to the speaker module (500).

[0105] According to one embodiment, as illustrated in FIG. 5b, the speaker module (500) may be placed in the speaker housing (530). In one embodiment, the speaker module (500) may be placed in an acoustic conduit (531) formed in the speaker housing (530). In one embodiment, the speaker module (500) may be placed such that the first diaphragm (511) of the first speaker (510) and the second diaphragm (521) of the second speaker (520) are not covered on one surface of the speaker module (500). For example, the speaker module (500) may be arranged so that the first vibration plate (511) of the first speaker (510) and the second vibration plate (521) of the second speaker (520) face the metal plate (440) arranged between the rear plate (430) of FIG. 6a, which will be described later, or the speaker housing (530) and the rear plate (430) of FIG. 8a, which will be described later.

[0106] According to one embodiment, sound output from the speaker module (500) may be scattered in the sound duct (531). For example, sound output from the second speaker (520), which outputs relatively high-frequency sounds compared to the first speaker (510), may be scattered in the sound duct (531). For example, as the sound output from the second speaker (520) is radiated in a direction away from the inner surface of the speaker housing (530) or the sound hole (420) (e.g., the + Y direction, the -X direction, and / or the + X direction in FIG. 5B), the magnitude of the sound emitted through the sound hole (420) may be reduced, thereby causing sound degradation for the second speaker (520). Therefore, a sound guide member (600) may be disposed in the speaker module (500) to guide the sound output from the second speaker (520) to the sound hole (420).

[0107] According to one embodiment, as illustrated in FIG. 5B, the sound guide member (600) may be placed on the mounting portion (501) of the speaker module (500). The mounting portion (501) may be one surface of the speaker module (500) and may be a surface facing the -Z direction based on FIG. 5B. In one embodiment, the mounting portion (501) may be located in an overlapping area of ​​a first region where the first speaker (510) is placed and a second region where the second speaker (520) is placed, or between the first region and the second region, when the speaker module (500) is viewed substantially vertically (e.g., in the Z-axis direction of FIG. 5B). In one embodiment, the first region may be a region or space where components constituting the first speaker (510) are placed. The second region may be a region or space where components constituting the second speaker (520) are placed.

[0108] In one embodiment, referring to FIG. 7 to be described later, the sound guide member (600) is disposed on the mounting portion (501) of the speaker module (500) and may not overlap the first diaphragm (511) of the first speaker (510) when the speaker module (500) is viewed in a vertical direction (e.g., the Z-axis direction of FIG. 7). In one embodiment, the sound guide member (600) may at least partially surround the second diaphragm (521) of the second speaker (520). According to one embodiment, the second diaphragm (521) from which sound is output from the second speaker (520) may at least partially be surrounded by the sound guide member (600). According to one embodiment, the sound guide member (600) is arranged on one side of the speaker module (500), and at least a portion thereof may be arranged to protrude in the sound output direction more than the first diaphragm (511) of the first speaker (510) and the second diaphragm (521) of the second speaker (520).

[0109] In one embodiment, referring to FIG. 5B, the sound guide member (600) may be in a form that is open toward the sound hole (420) of the electronic device (400). For example, the sound guide member (600) may be in a form that surrounds the second speaker (520) so that the sound output from the second speaker (520) is radiated toward the sound hole (420) while reducing scattering within the speaker housing (530), but is partially open toward the sound hole (420).

[0110] In one embodiment, the sound guide member (600) may be formed in various shapes. In a specific embodiment, referring to FIG. 5B, the sound guide member (600) includes a first portion (e.g., a first side wall) (601) facing the sound hole (420), a second portion (e.g., a second side wall) (602) bent at one end of the first portion (601), and a third portion (e.g., a third side wall) (603) bent at the other end of the first portion (601) and having at least a portion facing the second portion (602), and may be formed in a shape such as a 'ㄷ' or a 'U'. In one embodiment, the portion of the sound guide member (600) that is open toward the sound hole (420) may be a space between the second portion (602) and the third portion (603). In one embodiment, the sound guide member (600) may be formed in a curved shape in which at least a portion is formed in a circular shape. In one embodiment, the first part (601), the second part (602), and the third part (603) of the sound guide member (600) can block or reduce the sound output from the second speaker (520) from being radiated in a direction away from the sound hole (420) or the inner surface of the speaker housing (530) or the sound hole (420) (e.g., the + Y direction, the -X direction, and / or the + X direction in FIG. 5b). Accordingly, the sound output from the second speaker (520) can be guided to the sound hole (420) through the sound guide member (600).

[0111] In one embodiment, the sound guide member (600) may have at least a portion that is curved. For example, at least one of the first portion (e.g., the first partition wall) (601), the second portion (e.g., the second partition wall) (602), and the third portion (e.g., the third partition wall) (603) of the sound guide member (600) may be curved to have a curvature.

[0112] According to one embodiment, as illustrated in FIGS. 6A, 6B, and 7, the speaker module (500) may be arranged such that the first speaker (510) and the second speaker (520) face a first direction (e.g., the Z-axis direction of FIG. 6A) that is substantially perpendicular to one surface (e.g., the back surface) of the electronic device (400) or one surface of the rear plate (430). Accordingly, the first diaphragm (511) of the first speaker (510) and the second diaphragm (521) of the second speaker (520) may face one surface (e.g., the back surface) of the electronic device (400) or one surface of the rear plate (430).

[0113] According to one embodiment, as illustrated in FIGS. 6A, 6B, and 7, the sound conduit (531) may be formed so that at least a portion thereof is parallel to a second direction (e.g., the Y-axis direction of FIG. 6B) that is perpendicular to the first direction. In one embodiment, the sound guide member (600) may be arranged to overlap the sound conduit (531) between the speaker module (500) and the housing (410) to guide sound output from the speaker module (500) in the second direction.

[0114] According to one embodiment, as illustrated in FIGS. 6A, 6B, and 7, sound output from the speaker module (500) may be emitted to the sound hole (420) through an acoustic space formed by covering the acoustic conduit (531) of the speaker housing (530) with the rear plate (430). In one embodiment, the acoustic space may be a space formed by covering the acoustic conduit (531) formed in the speaker housing (530) with one surface of the rear plate (430). For example, the speaker housing (530) may include an acoustic conduit (531) formed to be open on a surface facing the rear plate (430). Accordingly, the speaker housing (530) may form an acoustic space that guides sound output from the speaker module (500) to the sound hole (420) by covering the acoustic conduit (531) with the rear plate (430).

[0115] According to one embodiment, as illustrated in FIGS. 6A, 6B, and 7, the sound guide member (600) may be disposed between the mounting portion (501) of the speaker module (500) and the rear plate (430). In one embodiment, the first vibration plate (511) and the second vibration plate (521) of the speaker module (500) may face the rear plate (430). In one embodiment, the sound guide member (600) may be formed integrally with the speaker module (500) or the rear plate (430). Alternatively, in one embodiment, the sound guide member (600) may be formed as a separate configuration from the speaker module (500) and the rear plate (430) and may be adhered to one surface of the mounting portion (501) of the speaker module (500) and the rear plate (430) through an adhesive member (e.g., adhesive tape, bond).

[0116] In one embodiment, referring to FIGS. 6b and 7, an acoustic guide member (600) is disposed between the speaker module (500) and the rear plate (430), and the acoustic guide member (600) may be in a form that is open toward the acoustic hole (420). Accordingly, the phenomenon of sound being scattered within the acoustic duct (531) and / or the acoustic space may be reduced or alleviated compared to when the acoustic guide member (600) is not disposed between the speaker module (500) and the rear plate (430).

[0117] In one embodiment, the sound guide member (600) may be formed of various materials. In one embodiment, the sound guide member (600) may be formed of a metallic or non-metallic material. The metallic material may include an alloy of aluminum, stainless steel (STS, SUS), iron, magnesium, and titanium, and the non-metallic material may include a synthetic resin, ceramic, or engineering plastic. In one embodiment, the sound guide member (600) may be formed of an elastic material. For example, the sound guide member (600) may be formed of at least one material selected from the group consisting of rubber, urethane, silicone, and sponge. In addition, the sound guide member (600) may be formed of various materials to guide high-pitched sounds generated from the second speaker (520) to the sound hole (420).

[0118] FIGS. 8A and 8B are perspective views of a speaker housing having a speaker module coupled thereto, coupled with a metal plate, and an acoustic guide member positioned between the metal plate and the speaker module, according to one embodiment of the present disclosure. FIG. 9 is a cross-sectional view taken along line P2-P2 of FIG. 8B, according to one embodiment of the present disclosure.

[0119] The following description may be an embodiment in which a metal plate (440) formed of a metal material (e.g., an alloy of aluminum, stainless steel (STS, SUS), iron, magnesium, and titanium) is placed between a speaker housing (530) and a rear plate (430). Descriptions of configurations identical or similar to those described with reference to FIGS. 4 to 7 will be omitted.

[0120] According to one embodiment, as illustrated in FIGS. 8A and 8B, sound output to the speaker module (500) may be emitted to the sound hole (420) through an acoustic space formed by covering the acoustic conduit (531) of the speaker housing (530) with a metal plate (440). In one embodiment, the metal plate (440) may be disposed between the speaker housing (530) and the rear plate (430). In one embodiment, the acoustic space may be a space formed by covering the acoustic conduit (531) formed in the speaker housing (530) with one surface of the metal plate (440). For example, the speaker housing (530) may include an acoustic conduit (531) formed to be open at a surface facing the metal plate (440). Accordingly, the speaker housing (530) can form an acoustic space that guides sound output from the speaker module (500) to the acoustic hole (420) as the acoustic conduit (531) is covered by the metal plate (440).

[0121] According to one embodiment, as illustrated in FIGS. 8A, 8B, and 9, the sound guide member (600) may be disposed between the mounting portion (501) of the speaker module (500) and the metal plate (440). In one embodiment, the first vibration plate (511) and the second vibration plate (521) of the speaker module (500) may face the metal plate (440). In one embodiment, the sound guide member (600) may be formed integrally with the speaker module (500) or the metal plate (440). Alternatively, in one embodiment, the sound guide member (600) may be formed as a separate configuration from the speaker module (500) and the metal plate (440) and may be bonded to the mounting portion (501) of the speaker module (500) and one surface of the metal plate (440) through an adhesive member (e.g., an adhesive tape, a bond).

[0122] In one embodiment, referring to FIGS. 8B and 9, an acoustic guide member (600) is disposed between the speaker module (500) and the metal plate (440), and the acoustic guide member (600) may be in a form that is open toward the acoustic hole (420). Accordingly, the phenomenon of sound being scattered within the acoustic conduit (531) and / or the acoustic space may be reduced or alleviated compared to when the acoustic guide member (600) is not disposed between the speaker module (500) and the metal plate (440).

[0123] FIGS. 10A and 10B are drawings showing a speaker module positioned inside a speaker housing and an acoustic guide member positioned between the speaker module and the speaker housing, according to one embodiment of the present disclosure. FIG. 11 is a cross-sectional view taken along line P3-P3 of FIG. 10A.

[0124] The following description may be an embodiment in which an acoustic conduit (531) is formed inside a speaker housing (530). For example, the acoustic conduit (531) may be wrapped around parts of the speaker housing (530) inside the speaker housing (530). Descriptions of configurations identical or similar to those described with reference to FIGS. 4 to 9 will be omitted.

[0125] According to one embodiment, as illustrated in FIGS. 10A, 10B, and 11, sound output to the speaker module (500) may be emitted to the sound hole (420) through an acoustic conduit (531) formed inside the speaker housing (530). In this case, the sound guide member (600) may be disposed between the mounting portion (501) of the speaker module (500) and the inner surface of the speaker housing (530). In one embodiment, the sound guide member (600) may be integrally formed on the inner surface of the speaker module (500) or the speaker housing (530). Alternatively, in one embodiment, the sound guide member (600) may be formed as a separate configuration from the speaker module (500) and the speaker housing (530) and may be adhered to the mounting portion (501) of the speaker module (500) and the inner surface of the speaker housing (530) through an adhesive member (e.g., adhesive tape, bond).

[0126] In one embodiment, referring to FIGS. 10b and 11, an acoustic guide member (600) is disposed between the inner surface of the speaker module (500) and the speaker housing (530), and the acoustic guide member (600) may be in a form that is open toward the acoustic hole (420). Accordingly, the phenomenon of sound being scattered within the acoustic duct (531) and / or acoustic space may be reduced or alleviated compared to when the acoustic guide member (600) is not disposed between the inner surface of the speaker module (500) and the speaker housing (530).

[0127] FIGS. 12A and 12B are perspective views showing a speaker module arranged in a speaker housing formed by bending an acoustic conduit according to one embodiment of the present disclosure and coupled to a rear plate. FIG. 13 is a rear view of the speaker housing and speaker module arranged in FIG. 12B, and is a drawing showing a state in which at least a portion of an acoustic guide member arranged between the speaker module and the rear plate is open toward an acoustic hole formed in the rear plate.

[0128] The following description may be an example of a speaker housing (730) and an acoustic conduit (731) having a different shape from the speaker housing (530) and the acoustic conduit (531) formed in the speaker housing (530) described through FIGS. 4 to 11 described above. Descriptions of configurations identical or similar to those described through FIGS. 4 to 11 will be omitted.

[0129] According to one embodiment, as illustrated in FIGS. 12a, 12b, and 13, the speaker module (500) may be arranged to be spaced apart from the sound hole (420) depending on the arrangement structure of the electronic components inside the housing (410). For example, the speaker module (500) may be spaced apart from the sound hole (420) in the -X direction of FIG. 12b. In this case, the speaker housing (730) may include an acoustic conduit (731) having a bent shape so that sound output from the speaker module (500) can be transmitted to the sound hole (420). In this case, the speaker housing (730) may be formed to have a bent shape similar to the acoustic conduit (731).

[0130] In one embodiment, referring to FIGS. 12A, 12B, and 13, the sound conduit (731) may include a first conduit (7311) extending substantially perpendicularly to a portion where the sound hole (420) is formed (e.g., one surface of the housing (410) or one surface of the rear plate (430)) and a second conduit (7312) bent relative to the first conduit (7311) to connect the first conduit (7311) and the sound hole (420). In one embodiment, the speaker module (500) may be positioned at least partially in the first conduit (7311) of the sound conduit (731).

[0131] According to one embodiment, as illustrated in FIGS. 12A, 12B, and 13, sound output from the speaker module (500) may be emitted to the sound hole (420) through an acoustic space formed by covering the acoustic conduit (731) of the speaker housing (730) with the rear plate (430). In one embodiment, the acoustic space may be a space formed by covering the acoustic conduit (731) formed in the speaker housing (730) with one surface of the rear plate (430). For example, the speaker housing (730) may include an acoustic conduit (731) formed to be open on a surface facing the rear plate (430). Accordingly, the speaker housing (730) may form an acoustic space that guides sound output from the speaker module (500) to the sound hole (420) by covering the acoustic conduit (731) with the rear plate (430). In the above description, the acoustic space is described as being formed through the rear plate (430) and the speaker housing (730), but may not be limited thereto. In one embodiment, the acoustic space may be formed as the acoustic conduit (731) of the speaker housing (730) is covered by one surface of the housing (410). In one embodiment, as shown in FIGS. 8A and 8B described above, the acoustic space may be formed as the acoustic conduit (731) of the speaker housing (730) is covered by the metal plate (440). In one embodiment, as shown in FIGS. 10A and 10B described above, the acoustic space may be the acoustic conduit (731) formed inside the speaker housing (730).

[0132] In one embodiment, referring to FIGS. 12A, 12B, and 13, an acoustic guide member (700) is disposed between the speaker module (500) and the rear plate (430), and the acoustic guide member (700) may be in a shape that is open toward the acoustic hole (420). In one embodiment, the acoustic guide member (700) may be formed in a shape different from the acoustic guide member (600) of FIGS. 4 to 11 described above, since the acoustic conduit (731) has a bent shape. In one embodiment, the acoustic guide member (700) may be in a shape that is open toward the acoustic hole (420). In a specific embodiment, the sound guide member (700) may include a first portion (e.g., a first side wall) (701) facing the sound hole (420), a second portion (e.g., a second side wall) (702) bent relative to the first portion (701), and a third portion (e.g., a third side wall) (703) bent relative to the first portion (701). In one embodiment, the sound guide member (700) may be formed in an 'L' shape. For example, the third portion (703) may be formed to have a substantially shorter length than the second portion (702). The open portion of the sound guide member (700) may be a space between the second portion (702) and the third portion (703). In one embodiment, the sound guide member (700) may have a structure in which a side wall is not formed on the opposite side of the first portion (701).

[0133] In one embodiment, the first part (701), the second part (702), and the third part (703) of the sound guide member (700) can block or reduce the sound output from the second speaker (520) from being radiated in a direction away from the sound hole (420) or the inner surface of the speaker housing (530) or the sound hole (420) (e.g., the + Y direction and / or the - X direction in FIG. 5B). Accordingly, the sound output from the second speaker (520) can be guided to the sound hole (420) through the sound guide member (700). Accordingly, the phenomenon of sound being scattered within the sound duct (531) and / or the sound space can be reduced or alleviated compared to when the sound guide member is not arranged in the speaker module (500). In addition, the sound intensity of the second speaker (520) emitted into the sound hole (420) can be increased.

[0134] FIGS. 14a and 14b are drawings of various shapes of an acoustic guide member according to one embodiment of the present disclosure.

[0135] In the following description, a sound guide member (800) having a different shape from the sound guide member (600, 700) described through FIGS. 4 to 13 will be described. A description of a configuration identical or similar to the configuration described through FIGS. 4 to 13 will be omitted.

[0136] Additionally, the sound guide member (800) of FIGS. 14a and 14b may be disposed between the speaker module (500) and the rear plate (430), between the speaker module (500) and the metal plate (440), between the speaker module (500) and one side of the housing (410), and / or between the speaker module (500) and the inner surface of the speaker housing (530) within the speaker housing (530).

[0137] In one embodiment, the drawings of (a) of FIG. 14a and (a) of FIG. 14b may be sound guide members (800) applied to embodiments in which the sound conduit (531) of the speaker housing (530) is not bent, as in FIG. 6a, FIG. 8a, and FIG. 10a. The drawings of (b) of FIG. 14a and (b) of FIG. 14b may be sound guide members (800) applied to embodiments in which the sound conduit (731) of the speaker housing (730) is bent, as in FIG. 12a.

[0138] According to one embodiment, as illustrated in FIG. 14A, the sound guide member (800) may include a cover member (e.g., an inclined plate) (801) and a partition wall member (802). In one embodiment, the partition wall member (802) may include a first portion (e.g., a first side wall) (8021) facing the sound hole (420), a second portion (e.g., a second side wall) (8022) bent or extended substantially perpendicularly to one end of the first portion (8021), and a third portion (e.g., a third side wall) (8023) bent or extended substantially perpendicularly to the other end of the first portion (8021), at least a portion of which faces the second portion (8022). In one embodiment, referring to FIGS. 14A and 14B, the sound guide member (800) may have a structure in which no side wall is formed on the opposite side of the first portion (8021). In one embodiment, referring to (a) of FIG. 14A and (a) of FIG. 14B, the second portion (8022) and the third portion (8023) may be formed to have substantially the same length. In one embodiment, referring to (b) of FIG. 14A and (b) of FIG. 14B, the third portion (8023) may be formed to have a substantially shorter length than the second portion (8022). In one embodiment, the cover portion (801) may define portions corresponding to the first portion (8021), the second portion (8022), and the third portion (8023) as a first side, a second side, and a third side, respectively. In one embodiment, the first portion (8021), the second portion (8022), and the third portion (8023) may protrude from the first side, the second side, and the third side of the cover portion (801), respectively, toward the second vibration plate (521).

[0139] In one embodiment, the cover portion (801) may be a portion that covers the second speaker (520) when one side of the speaker module (500) is viewed vertically (e.g., in the Z-axis direction of FIG. 3). In one embodiment, the partition portion (802) may extend from the cover portion (801) and be positioned on the mounting portion (501) of the speaker module (500) and at least a portion thereof may surround the second speaker (520). In one embodiment, when the speaker module (500) is viewed substantially vertically (e.g., in the Z-axis direction of FIG. 3), the partition portion (802) may be positioned between the first diaphragm (511) of the first speaker (510) and the second diaphragm (521) of the second speaker (520).

[0140] In one embodiment, referring to FIGS. 14A and 14B, one surface of the cover portion (801) (e.g., the surface facing the speaker module (500)) may be formed to be inclined with respect to one surface of the housing (410). For example, the inclined surface of the cover portion (801) may be formed to have a gradually increasing inclination in the second direction (e.g., the Y-axis direction of FIG. 5B). In one embodiment, referring to FIG. 14B, the cover portion (801) of the sound guide member (800) may be inclined with respect to one surface of the housing (410), and a plurality of step-shaped single-layers may be formed. The cover portion (801) may be inclined so that the space between the speaker module (500) and the cover portion becomes wider as it moves toward the sound hole (420). Accordingly, the sound output from the second speaker (520) can have the phenomenon of sound scattering within the sound duct (531) and / or sound space reduced or alleviated compared to when the sound guide member (800) is not arranged in the speaker module (500). In addition, the sound intensity of the second speaker (520) emitted into the sound hole (420) can be increased.

[0141] FIGS. 15a and 15b are drawings of various shapes of an acoustic guide member according to one embodiment of the present disclosure.

[0142] The following description may be a description of an embodiment in which an inclined structure (900) (e.g., an inclined plate) is placed between a speaker module (500) and a mechanism (e.g., a rear plate (430), a metal plate (e.g., a support member) (440), a speaker housing (530), and / or a housing (410)), rather than the sound guide member (600, 700, 800) described through FIGS. 4 to 14b.

[0143] In one embodiment, the drawings of (a) of FIG. 15a and (a) of FIG. 15b may be an inclined structure (900) applied to an embodiment in which the sound conduit (531) of the speaker housing (530) is not bent, as in FIG. 6a, FIG. 8a, and FIG. 10a. The drawings of (b) of FIG. 15a and (b) of FIG. 15b may be an inclined structure (900) applied to an embodiment in which the sound conduit (731) of the speaker housing (730) is bent, as in FIG. 12a.

[0144] According to one embodiment, as illustrated in FIG. 15a, the inclined structure (900) may be a portion that covers the second speaker (520) when one side of the speaker module (500) is viewed vertically (e.g., in the Z-axis direction of FIG. 3). In one embodiment, one side of the inclined structure (900) (e.g., the side facing the speaker module (500)) may be formed to be inclined with respect to one side of the housing (410). For example, the inclined surface of the inclined structure (900) may be formed to have a degree of inclination that gradually increases in the second direction (e.g., in the Y-axis direction of FIG. 5b). In one embodiment, referring to FIG. 15b, the inclined structure (900) may be inclined with respect to one side of the housing (410), and the inclined surface may be formed as a plurality of step-shaped single-layers. The inclined structure (900) may be inclined such that the space between the speaker module (500) and the cover portion becomes wider as it moves toward the sound hole (420). Accordingly, the sound output from the second speaker (520) can have the phenomenon of sound scattering within the acoustic duct (531) and / or acoustic space reduced or alleviated compared to when the inclined structure (900) is not arranged in the speaker module (500). In addition, the sound intensity of the second speaker (520) emitted into the acoustic hole (420) can be increased.

[0145] FIG. 16 is a diagram illustrating the acoustic performance of an electronic device through a speaker module when an acoustic guide member is disposed on a mounting portion of the speaker module and when it is not disposed, according to one embodiment of the present disclosure.

[0146] In one embodiment, the graph illustrated in FIG. 16 may be a graph showing an improvement in the acoustic performance of the speaker module (500) measured outside the electronic device (400) when the acoustic guide member (600) is disposed between the mounting portion (501) of the speaker module (500) and the rear plate (430), as in FIGS. 6A and 7. In one embodiment, referring to FIG. 16A, it can be confirmed that the acoustic performance (1002) of the speaker module (500) measured when the acoustic guide member (600) is disposed between the mounting portion (501) of the speaker module (500) and the rear plate (430) is improved in the second frequency range (e.g., high frequency range) compared to the acoustic performance (1001) of the speaker module (500) measured when the acoustic guide member (600) is not disposed between the mounting portion (501) of the speaker module (500) and the rear plate (430). Accordingly, the sound performance of the electronic device (400) can be improved as the sound output from the second speaker (520) that outputs high-frequency sounds is concentrated and radiated to the sound hole (420) as the sound guide member is placed between the speaker module (500) and the rear plate (430).

[0147] According to one embodiment of the present disclosure, an electronic device may include a housing (210, 410) including an acoustic hole (420), a speaker housing (530, 730) disposed in the housing including an acoustic conduit (531, 731) having one end connected to the acoustic hole, a first speaker (510) and a second speaker (520) spaced apart from and wrapped around the first speaker and outputting a higher-frequency acoustic signal than the first speaker, a speaker module (500) disposed in the acoustic conduit, and an acoustic guide member (600, 700, 800) disposed on one surface (501) of the speaker module such that at least a portion overlaps with an area located between the first speaker and the second speaker when one surface of the speaker module is viewed substantially vertically, and is open toward the acoustic hole.

[0148] In one embodiment, the sound guide member may include a first portion (601), a second portion (602) extending from the first portion, and a third portion (603) extending from the first portion and facing the second portion. In one embodiment, the portion of the sound guide member that is open toward the sound hole may be a space between the second portion and the third portion.

[0149] In one embodiment, the sound guide member may include a partition wall portion (802) that overlaps an area between the first speaker and the second speaker when looking vertically at one side of the speaker module, and a cover portion (801) that faces the second speaker.

[0150] In one embodiment, the cover portion of the sound guide member is formed to be inclined with respect to one surface of the housing, and the space between the cover portion and the speaker module may become wider as it moves toward the sound hole in the speaker module.

[0151] In one embodiment, the cover portion of the sound guide member is formed with a plurality of step-shaped single layers that are inclined with respect to one surface of the housing, and the space between the cover portion and the speaker module may become wider as it moves toward the sound hole in the speaker module.

[0152] According to one embodiment of the present disclosure, an electronic device (101, 200, 300, 400) may include a housing (210, 410) including an acoustic hole (420) formed on one surface, a speaker housing (530, 730) including an acoustic conduit (531, 731) having one end connected to the acoustic hole and disposed in the housing, a first speaker (510), and a second speaker (520) spaced apart from and wrapped around the first speaker and outputting an acoustic signal of a higher frequency than that of the first speaker, and may include a speaker module (500) disposed in the acoustic conduit and an inclined structure (900) facing the second speaker between the housing and the speaker module. A space between the inclined structure and the speaker module may become wider as it moves toward the acoustic hole from the speaker module.

[0153] In one embodiment, the inclined structure may be formed of a plurality of step-shaped single layers that are inclined with respect to one surface of the housing.

[0154] According to one embodiment of the present disclosure, a portable communication device (101, 200, 300, 400) may include a housing (210, 410) including an acoustic hole (420), a display (160, 201, 330, 401) disposed in the housing, and a speaker module (500) disposed below the display in the housing, the first speaker (510) including a first diaphragm (511) configured to face a first direction substantially perpendicular to a rear surface of the portable communication device and output a first acoustic signal corresponding to a first frequency range, and a second speaker (520) including a second diaphragm (521) configured to face the first direction and output a second acoustic signal corresponding to a second frequency range at least partially higher than the first frequency range. In one embodiment, the second diaphragm may be disposed so as to be spaced apart from the first diaphragm and substantially surrounded by the first diaphragm when viewed from the rear surface. In one embodiment, the portable communication device may include an acoustic conduit (531, 731) formed in the housing so as to extend at least partially in a second direction substantially parallel to the rear surface of the portable communication device and be connected to the speaker module and the sound hole, and an acoustic guide member (600, 700, 800) disposed between the rear surface of the portable communication device and the second speaker within the acoustic conduit so as to guide at least a portion of the second acoustic signal from the first direction to the second direction.

[0155] In one embodiment, the sound guide member comprises lateral walls (601, 602, 603), at least a portion of which is bendable.

[0156] In one embodiment, the sound guide member includes a first lateral wall (601) facing at least a portion of the sound hole, a second lateral wall (602) bent from one end of the first lateral wall to the first lateral wall, and a third lateral wall (603) bent from the other end opposite to the one end of the first lateral wall to the first lateral wall, and no lateral wall may be formed in the opposite direction of the first lateral wall.

[0157] In one embodiment, the length of the third side wall may be substantially shorter than the length of the second side wall.

[0158] In one embodiment, the sound guide member comprises an inclined plate (801) substantially opposite the second diaphragm, and one surface of the inclined plate can be inclined to have a gradually increasing inclination in the second direction.

[0159] In one embodiment, one side of the inclined plate may be formed in a step shape.

[0160] In one embodiment, the sound guide member includes a first lateral wall (8021), a second lateral wall (8022), and a third lateral wall (8023) protruding toward the second diaphragm from a first side of the inclined plate, a second side extending from one end of the first side, and a third side extending from the other end opposite to the one end of the first side, respectively, and no lateral wall may be formed in the opposite direction of the first lateral wall.

[0161] In one embodiment, the length of the third sidewall may be substantially shorter than the length of the second sidewall.

[0162] In one embodiment, the sound guide member may be in at least partial contact with the rear surface of the portable communication device.

[0163] In one embodiment, the housing further comprises a support member (440) attached to an inner surface of a rear surface of the portable communication device to define at least a portion of the acoustic conduit, wherein the acoustic guide member can be in at least partial contact with the support member.

[0164] In one embodiment, the sound guide member may be formed as part of the speaker module.

[0165] In one embodiment, the sound guide member may be positioned substantially along a portion of an edge of the second diaphragm.

[0166] In one embodiment, the acoustic conduit comprises a first conduit (7311) extending substantially perpendicularly to a surface of the housing in which the acoustic hole is formed when viewed from the rear of the portable communication device, and a second conduit (7312) extending at least partially at an angle with respect to the first conduit, and the acoustic guide member can be disposed in the first conduit.

[0167] According to various embodiments disclosed in this document, the speaker module (500) may include a first speaker (510) and a second speaker (520). The first speaker (510) may output a lower-pitched sound than the second speaker (520), and the second speaker (520) may output a higher-pitched sound than the first speaker (510). The speaker module (500) may be formed in a form in which the second speaker (520) is arranged inside the first speaker (510). Accordingly, the space for arranging electronic components inside the electronic device (400) may be expanded compared to a case in which the first speaker (510) and the second speaker (520) are separately arranged inside the electronic device (400) (e.g., the electronic device (101) of FIG. 1, the electronic device (200) of FIG. 2A, and / or the electronic device (300) of FIG. 3).

[0168] In addition, a sound guide member (600, 700, 800) (e.g., the inclined structure of FIGS. 15A and 15B) may be arranged on one side of the speaker module (500) to reduce scattering of the sound output from the second speaker (520) in the sound conduit (531) connecting the sound hole (420) of the electronic device and guide the sound to the sound hole (420). Accordingly, the electronic device (400) can secure a certain level of sound performance through the second speaker (520) since the sound output from the second speaker (520) is not scattered inside the conduit.

[0169] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0170] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and arranged in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0171] It will be appreciated that the present invention contemplates and encompasses embodiments based on any combination of two or more of the disclosed embodiments, as well as embodiments comprising any combination of the features disclosed herein. That is, the absence of an explicit indication that two features or two embodiments can be combined does not imply that such a combination is not envisioned, but rather that such a combination is intended to be included herein.

Claims

1. In a portable communication device (101, 200, 300, 400), A housing (210, 410) including an acoustic hole (420); A display (160, 201, 330, 401) arranged in the above housing; and As a speaker module (500) placed under the display in the above housing, A first speaker (510) including a first diaphragm (511) facing a first direction substantially perpendicular to the rear surface of the portable communication device and configured to output a first acoustic signal corresponding to a first frequency range, and A second speaker (520) including a second diaphragm (521) configured to face the first direction and output a second acoustic signal corresponding to a second frequency range at least a portion higher than the first frequency range, The second vibration plate is arranged so as to be spaced apart from the first vibration plate and substantially surrounded by the first vibration plate when viewed from the rear side, An acoustic conduit (531, 731) formed in the housing so as to extend at least partly in a second direction substantially parallel to the rear surface of the portable communication device and to be connected to the speaker module and the acoustic hole; and A portable communication device comprising an acoustic guide member (600, 700, 800) disposed between the rear surface of the portable communication device and the second speaker within the acoustic conduit so that at least a portion of the second acoustic signal is guided from the first direction to the second direction.

2. In paragraph 1, A portable communication device, wherein the sound guide member comprises a side wall (601, 602, 603), and at least a portion of the side wall is curved.

3. In paragraph 1, A portable communication device in which the sound guide member comprises a first lateral wall (601) facing at least a portion of the sound hole, a second lateral wall (602) bent from one end of the first lateral wall to the first lateral wall, and a third lateral wall (603) bent from the other end opposite to the one end of the first lateral wall to the first lateral wall, and no lateral wall is formed in the opposite direction of the first lateral wall.

4. In paragraph 3, A portable communication device, wherein the length of the third side wall is substantially shorter than the length of the second side wall.

5. In paragraph 1, A portable communication device, wherein the sound guide member includes an inclined plate (801) substantially opposite to the second vibration plate, and one side of the inclined plate is inclined so as to have a gradually increasing inclination in the second direction.

6. In paragraph 5, A portable communication device, wherein one side of the above inclined plate is formed in a step shape.

7. In paragraph 5, A portable communication device in which the sound guide member includes a first lateral wall (8021), a second lateral wall (8022), and a third lateral wall (8023) protruding toward the second vibration plate from a first side of the inclined plate, a second side extending from one end of the first side, and a third side extending from the other end opposite to the one end of the first side, respectively, and no lateral wall is formed in the opposite direction of the first lateral wall.

8. In paragraph 7, A portable communication device, wherein the length of the third side wall is substantially shorter than the length of the second side wall.

9. In paragraph 1, A portable communication device, wherein the sound guide member is in at least partial contact with the rear surface of the portable communication device.

10. In paragraph 1, A portable communication device, wherein the housing further comprises a support member (440) attached to an inner surface of a rear surface of the portable communication device to define at least a portion of the acoustic duct, wherein the acoustic guide member is in at least a portion of contact with the support member.

11. In paragraph 1, A portable communication device, wherein the above sound guide member is formed as a part of the speaker module.

12. In paragraph 1, A portable communication device wherein the sound guide member is disposed substantially along a portion of the edge of the second vibration plate.

13. In paragraph 1, The above sound conduit comprises a first conduit (7311) extending substantially perpendicularly to a surface of the housing in which the sound hole is formed when viewed from the rear of the portable communication device, and a second conduit (7312) extending at least partly at an angle to the first conduit, and the sound guide member is disposed in the first conduit, the portable communication device 14. In electronic devices (101, 200, 300, 400), A housing (210, 410) including an acoustic hole (420) formed on one side; A speaker housing (530, 730) disposed in the housing, which includes an acoustic pipe (531, 731) connected to the above-mentioned sound hole; A speaker module (500) including a first speaker (510) and a second speaker (520) spaced apart from and wrapped around the first speaker and outputting a higher-frequency sound signal than the first speaker, and arranged in the sound duct; and Including an inclined structure (900) facing the second speaker between the housing and the speaker module; The space between the above-mentioned inclined structure and the above-mentioned speaker module is An electronic device that becomes wider as it moves toward the sound hole in the above speaker module.

15. In paragraph 14, The above slope structure is, An electronic device in which a plurality of step-shaped single-layers are formed on one side of the housing.

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