Camera module comprising actuator

The camera module employs a carrier with offset magnets and coils, guided by balls or a shaft, to electromagnetically couple with yokes, addressing autofocus precision challenges in existing camera modules.

WO2025250001A1PCT designated stage Publication Date: 2025-12-04SAMSUNG ELECTRONICS CO LTD
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Patent Information

Application Number
PCT/KR2025/099746
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-06-19
Filing Date
2025-03-13
Publication Date
2025-12-04

AI Technical Summary

Technical Problem

Existing camera modules face challenges in efficiently implementing autofocus mechanisms, particularly in moving the lens along the optical axis using actuators like springs or shape-memory alloy wires, which may not provide optimal control and precision.

Method used

A camera module design incorporating a carrier with offset magnets and coils, guided by balls or a shaft, to electromagnetically couple with yokes, allowing precise movement of the lens along the optical axis.

Benefits of technology

Enables precise and controlled autofocus by electromagnetically guiding the lens movement, enhancing the accuracy and efficiency of autofocus operations.

✦ Generated by Eureka AI based on patent content.

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Abstract

This camera module comprises a lens having an optical axis, a carrier configured to carry the lens in a direction along the optical axis, a camera housing accommodating the carrier, a first magnet which is in the carrier and is offset from the optical axis in a first direction substantially orthogonal to the optical axis, a second magnet which is in the carrier and is offset from the optical axis in a second direction substantially orthogonal to the optical axis, a first coil configured to be electromagnetically coupled to the first magnet, a second coil configured to be electromagnetically coupled to the second magnet, a first yoke facing the first magnet, a second yoke facing the second magnet, and at least three balls which are between the carrier and the camera housing and are configured to support the carrier with respect to the camera housing and to guide the carrier in the direction along the optical axis.
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Description

Camera module including actuator

[0001] The disclosure generally relates to a camera module, for example, a camera module including an actuator, and to an electronic device including the camera module.

[0002] To implement autofocus in camera modules, actuators are being developed to move the lens along the optical axis. For example, the lens can be actuated using a spring, a ball, a shape-memory alloy (SMA) wire, or any other actuator.

[0003] The related art mentioned above is possessed or acquired in the process of deriving the present disclosure and cannot necessarily be said to be prior art disclosed to the general public prior to the filing of the present disclosure.

[0004] According to one aspect of the disclosure, a camera module may include a lens having an optical axis. The camera module may include a carrier configured to carry the lens in a direction along the optical axis. The camera module may include a camera housing configured to receive the carrier. The camera module may include a first magnet in the carrier and offset from the optical axis in a first direction substantially orthogonal to the optical axis. The camera module may include a second magnet in the carrier and offset from the optical axis in a second direction different from the first direction and substantially orthogonal to the optical axis. The camera module may include a first coil in the camera housing and configured to electromagnetically couple with the first magnet. The camera module may include a second coil in the camera housing and configured to electromagnetically couple with the second magnet. The camera module may include a first yoke in the camera housing and facing the first magnet. The camera module may include a second yoke that is disposed in the camera housing and faces the second magnet. The camera module may include at least three balls disposed between the carrier and the camera housing. The at least three balls may be configured to support the carrier relative to the camera housing and guide the carrier in the direction along the optical axis.

[0005] According to one aspect of the disclosure, a camera module may include a lens having an optical axis. The camera module may include a carrier configured to carry the lens in a direction along the optical axis. The camera module may include a camera housing configured to receive the carrier. The camera module may include a first magnet on the carrier and offset from the optical axis in a first direction substantially orthogonal to the optical axis. The camera module may include a second magnet on the carrier and offset from the optical axis in a second direction different from the first direction and substantially orthogonal to the optical axis. The camera module may include a first coil on the camera housing and configured to electromagnetically couple with the first magnet. The camera module may include a second coil on the camera housing and configured to electromagnetically couple with the second magnet. The camera module may include a first yoke on the camera housing and facing the first magnet. The camera module may include a second yoke that is located in the camera housing and faces the second magnet. The camera module may include at least one ball configured to guide the carrier relative to the camera housing in a direction along the optical axis. The camera module may include a shaft configured to guide the carrier relative to the camera housing in a direction along the optical axis.

[0006] According to one aspect of the disclosure, an electronic device may include a memory storing one or more commands. The electronic device may include at least one processor configured to execute the one or more commands. The camera module may include a camera module. The camera module may include a lens having an optical axis. The camera module may include a carrier configured to carry the lens in a direction along the optical axis. The camera module may include a camera housing configured to receive the carrier. The camera module may include a first magnet in the carrier and offset from the optical axis in a first direction substantially orthogonal to the optical axis. The camera module may include a second magnet in the carrier and offset from the optical axis in a second direction different from the first direction and substantially orthogonal to the optical axis. The camera module may include a first coil in the camera housing and configured to electromagnetically couple with the first magnet. The camera module may include a second coil in the camera housing and configured to electromagnetically couple with the second magnet. The camera module may include a first yoke in the camera housing and facing the first magnet. The camera module may include a second yoke in the camera housing and facing the second magnet. The camera module may include at least three balls between the carrier and the camera housing. The camera module may include an image sensor configured to acquire an image by converting light received through the lens into an electrical signal. The at least three balls may be configured to support the carrier relative to the camera housing and to guide the carrier in the direction along the optical axis.The at least one command, when executed by the at least one processor, may cause the electronic device to control movement of the carrier in the direction along the optical axis by controlling current applied to the first coil and the second coil.

[0007] The above and other aspects, features and advantages of specific embodiments of the present disclosure will become apparent from the following detailed description with reference to the accompanying drawings.

[0008] FIG. 1 is a block diagram of an electronic device within a network environment according to one or more embodiments.

[0009] FIG. 2 is a block diagram illustrating a camera module according to one or more embodiments.

[0010] FIG. 3 is a perspective view of a one-way electronic device according to one or more embodiments.

[0011] FIG. 4 is a perspective view of an electronic device in another orientation according to one or more embodiments.

[0012] FIG. 5 is a perspective view of a camera module according to one or more embodiments.

[0013] FIG. 6 is a plan view of a camera module according to one or more embodiments.

[0014] FIG. 7 is a side view of a camera module according to one or more embodiments.

[0015] FIG. 8 is an exploded perspective view of a camera module according to one or more embodiments.

[0016] FIG. 9 is a cross-sectional view of a camera module taken along line 9-9 of FIG. 6 according to one or more embodiments.

[0017] FIG. 10 is a cross-sectional view of a camera module taken along line 10-10 of FIG. 7 according to one or more embodiments.

[0018] FIG. 11 is a cross-sectional view of a camera module according to one or more embodiments.

[0019] FIG. 12 is a side view of a camera module according to one or more embodiments.

[0020] FIG. 13 is a plan view of a camera module according to one or more embodiments.

[0021] FIG. 14 is a cross-sectional view of a damper of a camera module according to one or more embodiments.

[0022] FIG. 15 is a perspective view of a magnet and yoke of a camera module according to one or more embodiments.

[0023] FIG. 16 is a perspective view of a magnet and yoke of a camera module according to one or more embodiments.

[0024] FIG. 17 is a cross-sectional view of a camera module according to one or more embodiments.

[0025] Hereinafter, specific embodiments will be described in detail with reference to the accompanying drawings. When describing the embodiments with reference to the accompanying drawings, the same reference numerals designate the same elements, and repeated descriptions thereof will be omitted.

[0026] FIG. 1 is a block diagram of an electronic device within a network environment according to one or more embodiments.

[0027] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one or more embodiments, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one or more embodiments, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In one or more embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In one or more embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0028] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one or more embodiments, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one or more embodiments, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0029] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one or more embodiments, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). According to one or more embodiments, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0030] The memory (130) can store various data used by at least one component (e.g., a processor (120) or a sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., a program (140)) and input data or output data for commands related thereto. The memory (130) can include a volatile memory (132) or a non-volatile memory (134).

[0031] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0032] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0033] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one or more embodiments, the receiver can be implemented separately from the speaker or as part of the speaker.

[0034] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one or more embodiments, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0035] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one or more embodiments, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0036] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one or more embodiments, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0037] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). According to one or more embodiments, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0038] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., the electronic device (102)). According to one or more embodiments, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0039] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one or more embodiments, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0040] The camera module (180) can capture still images and videos. According to one or more embodiments, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0041] The power management module (188) can manage power supplied to the electronic device (101). According to one or more embodiments, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0042] A battery (189) may power at least one component of the electronic device (101). According to one or more embodiments, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0043] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one or more embodiments, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0044] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one or more embodiments, the wireless communication module (192) may support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL) each, or 1 ms or less for round trip) for URLLC realization.

[0045] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). According to one or more embodiments, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one or more embodiments, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the at least one selected antenna. According to one or more embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0046] According to one or more embodiments, the antenna module (197) may form a mmWave antenna module. According to one or more embodiments, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band.

[0047] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0048] According to one or more embodiments, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one or more embodiments, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one or more embodiments, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network.According to one or more embodiments, an external electronic device (104) or server (108) may be included within the second network (199). The electronic device (101) may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0049] Electronic devices according to the embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments disclosed in this document are not limited to the aforementioned devices.

[0050] The embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" can each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish the corresponding component from other corresponding components, and do not limit the corresponding components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as being “coupled” or “connected” to another component (e.g., a second component), with or without the terms “functionally” or “communicatively,” it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0051] The term "module" used in the embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one or more embodiments, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0052] Embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0053] According to one or more embodiments, a method according to one or more embodiments disclosed in the present document may be provided as a computer program product. The computer program product may be traded as a commodity between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0054] According to one or more embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0055] FIG. 2 is a block diagram illustrating a camera module according to one or more embodiments.

[0056] Referring to FIG. 2, the camera module (180) may include a lens assembly (210), a flash (220), an image sensor (230), an image stabilizer (240), a memory (250) (e.g., a buffer memory), or an image signal processor (260). The lens assembly (210) may collect light emitted from a subject that is a target of image capturing. The lens assembly (210) may include one or more lenses. According to one or more embodiments, the camera module (180) may include a plurality of lens assemblies (210). In this case, the camera module (180) may form, for example, a dual camera, a 360-degree camera, or a spherical camera. Some of the plurality of lens assemblies (210) may have the same lens properties (e.g., angle of view, focal length, autofocus, f-number, or optical zoom), or at least one lens assembly may have one or more lens properties that are different from the lens properties of the other lens assemblies. A lens assembly (210) may include, for example, a wide-angle lens or a telephoto lens.

[0057] The flash (220) can emit light used to enhance light emitted or reflected from a subject. According to one or more embodiments, the flash (220) can include one or more light-emitting diodes (e.g., red-green-blue (RGB) LEDs, white LEDs, infrared LEDs, or ultraviolet LEDs), or a xenon lamp. The image sensor (230) can acquire an image corresponding to the subject by converting light emitted or reflected from the subject and transmitted through the lens assembly (210) into an electrical signal. According to one or more embodiments, the image sensor (230) can include one image sensor selected from among image sensors having different properties, such as, for example, an RGB sensor, a black and white (BW) sensor, an IR sensor, or a UV sensor, a plurality of image sensors having the same property, or a plurality of image sensors having different properties. Each image sensor included in the image sensor (230) can be implemented using, for example, a CCD (charged coupled device) sensor or a CMOS (complementary metal oxide semiconductor) sensor.

[0058] The image stabilizer (240) may move at least one lens or image sensor (230) included in the lens assembly (210) in a specific direction or control the operating characteristics of the image sensor (230) (e.g., adjusting the read-out timing, etc.) in response to movement of the camera module (180) or the electronic device (101) including the same. This allows compensating for at least some of the negative effects of the movement on the captured image. According to one or more embodiments, the image stabilizer (240) may detect such movement of the camera module (180) or the electronic device (101) using a gyro sensor or an acceleration sensor disposed inside or outside the camera module (180). According to one or more embodiments, the image stabilizer (240) may be implemented as, for example, an optical image stabilizer. The memory (250) can temporarily store at least a portion of an image acquired through the image sensor (230) for the next image processing task. For example, when image acquisition is delayed due to a shutter, or when multiple images are acquired at high speed, the acquired original image (e.g., a Bayer-patterned image or a high-resolution image) is stored in the memory (250), and a corresponding copy image (e.g., a low-resolution image) can be previewed through the display module (160). Thereafter, when a specified condition is satisfied (e.g., a user input or a system command), at least a portion of the original image stored in the memory (250) can be acquired and processed, for example, by an image signal processor (260). According to one or more embodiments, the memory (250) may be configured as at least a portion of the memory (130), or as a separate memory that operates independently therefrom.

[0059] The image signal processor (260) can perform one or more image processing operations on an image acquired through an image sensor (230) or an image stored in a memory (250). The one or more image processing operations may include, for example, depth map generation, 3D modeling, panorama generation, feature point extraction, image synthesis, or image compensation (e.g., noise reduction, resolution adjustment, brightness adjustment, blurring, sharpening, or softening). Additionally or alternatively, the image signal processor (260) may perform control (e.g., exposure time control, read-out timing control, etc.) on at least one of the components included in the camera module (180) (e.g., image sensor (230)). The image processed by the image signal processor (260) may be stored back in the memory (250) for further processing or provided to an external component of the camera module (180) (e.g., memory (130), display module (160), electronic device (102), electronic device (104), or server (108)). According to one or more embodiments, the image signal processor (260) may be configured to perform a control operation on the processor (120). It may be configured as a separate processor that is at least partially composed of, or operates independently of, the processor (120). If the image signal processor (260) is configured as a separate processor from the processor (120), at least one image processed by the image signal processor (260) may be displayed through the display module (160) by the processor (120) as is or after undergoing additional image processing.

[0060] According to one or more embodiments, the electronic device (101) may include a plurality of camera modules (180), each having different properties or functions. In this case, for example, at least one of the plurality of camera modules (180) may be a wide-angle camera, and at least another may be a telephoto camera. Similarly, at least one of the plurality of camera modules (180) may be a front camera, and at least another may be a rear camera.

[0061] FIG. 3 is a perspective view of an electronic device in one direction according to one or more embodiments. FIG. 4 is a perspective view of an electronic device in another direction according to one or more embodiments.

[0062] Referring to FIGS. 3 and 4, an electronic device (301) (e.g., the electronic device (101) of FIG. 1) may include a housing (310) having a first side (310A) (e.g., a front side), a second side (310B) (e.g., a back side), and a third side (310C) (e.g., a side side) surrounding a space between the first side (310A) and the second side (310B). The first side (310A) may be formed by a first plate (311A) that is at least partially transparent. For example, the first plate (311A) may include a glass plate or a polymer plate that includes at least one coating layer. The second side (310B) may be formed by a second plate (311B) that is substantially opaque. For example, the second plate (311B) may be formed of coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination thereof. The third surface (310C) may be formed by a frame (311C) that is joined to the first plate (311A) and the second plate (311B) and includes a metal and / or polymer. The second plate (311B) and the frame (311C) may be formed monolithically. The second plate (311B) and the frame (311C) may be formed of substantially the same material (e.g., aluminum).

[0063] The electronic device (301) may include an input module (350) (e.g., the input module (150) of FIG. 1). The input module (350) may be disposed on the third surface (310C). The input module (350) may include at least one key input device. For example, the key input device may include one or more mechanical actuators (e.g., buttons), one or more capacitors, and / or one or more inductors.

[0064] The electronic device (301) may include an audio output module (355) (e.g., the audio output module (155) of FIG. 1). The audio output module (355) may be disposed on the third surface (310C). The audio output module (355) may include one or more holes.

[0065] The electronic device (301) may include a display module (361) (e.g., the display module (160) of FIG. 1). The display module (361) may be disposed on the first surface (310A). The display module (361) may be visible through at least a portion of the first plate (311A). The display module (361) may have a shape substantially the same as the shape of the outer edge of the first plate (311A). The edge of the display module (361) may substantially coincide with the outer edge of the first plate (311A). The display module (361) may include a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic stylus pen. The display module (361) may include a screen display area (361A) that is visually exposed and displays content through pixels. The display area (361A) may include a sensing area (361A-1). The sensing area (361A-1) may overlap with at least a portion of the display area (361A). The sensing area (361A-1) may allow transmission of an input signal related to the sensor module (376) (e.g., the sensor module (176) of FIG. 1 ). The sensing area (361A-1) may display content similarly to the display area (361A) that does not overlap with the sensing area (361A-1). For example, the sensing area (361A-1) may display content while the sensor module (376) is not operating. At least a portion of the camera area (361A-2) may overlap with the display area (361A). The display area (361A) may include the camera area (361A-2). The camera area (361A-2) may allow transmission of an optical signal associated with a first camera module (380A) (e.g., the camera module (180) of FIG. 1 and / or the camera module (180) of FIG. 2). The camera area (361A-2) may also be referred to as a “display hole.”The camera area (361A-2) may have a substantially circular or oval shape. In one or more embodiments, the display module (361) may include one or more of an audio module (370), a sensor module (376), a first camera module (380A), or a light-emitting element on the back surface (e.g., the -Z-direction surface) of the screen display area (361A). For example, the electronic device (301) may be arranged on the back surface of at least one of the first surface (310A) (e.g., the front surface) or the third surface (310C) (e.g., the side surface), such that a camera module (e.g., the first camera module (380A)) faces the first surface (310A) and / or the third surface (310C). For example, the first camera module (380A) may not be visually exposed to the screen display area (361A) and may include an under display camera (UDC), which may also be referred to as an under panel camera (UPC).

[0066] The electronic device (301) may include an audio module (370) (e.g., the audio module (170) of FIG. 1). The audio module (370) may be positioned on the third surface (310C). The audio module (370) may obtain sound through at least one hole.

[0067] The electronic device (301) may include a sensor module (376). The sensor module (376) may be disposed on the first surface (310A). The sensor module (376) may form a sensing area (361A-1) in at least a portion of the screen display area (361A). The sensor module (376) may receive an input signal passing through the sensing area (361A-1) and generate an electrical signal based on the received input signal. For example, the input signal may have a specified physical quantity (e.g., heat, light, temperature, sound, pressure, ultrasound). The input signal may include a signal related to a user's biometric information (e.g., a fingerprint).

[0068] The electronic device (301) may include a connection terminal (378) (e.g., the connection terminal (178) of FIG. 1). The connection terminal (378) may be positioned on the third surface (310C). For example, when the electronic device (301) is viewed in one direction (e.g., the Y-axis direction), the connection terminal (378) may be positioned substantially in the center of the third surface (310C), and the audio output module (355) may be positioned on one side (e.g., the right) with respect to the connection terminal (378).

[0069] The electronic device (301) may include a first camera module (380A) (e.g., the camera module (180) of FIG. 1 and / or the camera module (180) of FIG. 2). The first camera module (380A) may be disposed on the first surface (310A). At least a portion of the first camera module (380A) may be disposed below the display module (361). The first camera module (380A) may receive an optical signal that passes through the camera area (361A-2).

[0070] The electronic device (301) may include a plurality of second camera modules (380B) (e.g., the camera module (180) of FIG. 1 and / or the camera module (180) of FIG. 2). The plurality of second camera modules (380B) may be arranged on the second surface (310B). The plurality of second camera modules (380B) may be arranged in a first row in one direction (e.g., the Y-axis direction) of the second plate (311B). The plurality of second camera modules (380B) may have different fields of view. For example, the plurality of second camera modules (380B) may include an ultra wide-angle camera, a wide-angle camera, and / or a tele camera.

[0071] The electronic device (301) may include an optical module (380C) (e.g., a flash (220) of FIG. 2). The optical module (380C) may be arranged in a second row substantially parallel to the first row of the plurality of second camera modules (380B) on the second surface (310B). The optical module (380C) may include one or more light-emitting diodes or xenon lamps. The optical module (380C) may include a sensor configured to detect external light. For example, the sensor may include a flicker sensor.

[0072] The electronic device (301) may include a third camera module (380D). The pixels, magnification, and / or field of view of the third camera module (380D) may be different from the pixels, magnification, and / or field of view of at least one second camera module (380B). The third camera module (380D) may be arranged in a second row substantially parallel to the first row of the plurality of second camera modules (380B) on the second surface (310B).

[0073] The electronic device (301) may include a fourth camera module (380E). The fourth camera module (380E), which may also be referred to as a "depth camera" or a "time-of-flight (ToF) camera," may be configured to measure a distance between the fourth camera module (380E) and a subject. For example, the fourth camera module (380E) may be configured to measure the distance using at least one or a combination of ultrasound, infrared, or laser. The fourth camera module (380E) may be arranged in a second row substantially parallel to the first row of the plurality of second camera modules (380B) on the second surface (310B).

[0074] The aspects and features described in this document can be applied to electronic devices of various shapes / forms (e.g., foldable electronic devices, slideable electronic devices, rollable electronic devices, digital cameras, digital video cameras, tablets, note-shaped electronic devices, and other electronic devices) in addition to the electronic devices illustrated in FIGS. 3 and 4.

[0075] In this document, terms such as "substantially," "approximately," "typically," and "about" when referring to a given parameter, property, or condition may include the extent to which a person of ordinary skill in the art would understand the given parameter, property, or condition to be satisfied with a small degree of variance, such as within acceptable manufacturing tolerances. For example, a particular parameter that is substantially satisfied may be satisfied at least 90% of the time, at least 95% of the time, or at least 99% of the time.

[0076] FIG. 5 is a perspective view of a camera module according to one or more embodiments. FIG. 6 is a plan view of a camera module according to one or more embodiments. FIG. 7 is a side view of a camera module according to one or more embodiments. FIG. 8 is an exploded perspective view of a camera module according to one or more embodiments. FIG. 9 is a cross-sectional view of a camera module taken along line 9-9 of FIG. 6 according to one or more embodiments. FIG. 10 is a cross-sectional view of a camera module taken along line 10-10 of FIG. 7 according to one or more embodiments.

[0077] Referring to FIGS. 5 to 10 , a camera module (400) (e.g., the camera module (180) of FIG. 1 , the camera module (180) of FIG. 2 , and / or the second camera module (380B) of FIGS. 3 and 4 ) may include a lens assembly (410) (e.g., the lens assembly (210) of FIG. 2 ). The lens assembly (410) may include at least one lens (411) having an optical axis (A) defined therein. A portion of the optical axis (A) may be defined as a line connecting a center of curvature of a first surface and a center of curvature of an Nth surface (N is a natural number) of at least one lens (411). The lens assembly (410) may include a lens housing (412) configured to accommodate at least one lens (411). The lens housing (412) may also be referred to as a “lens barrel.”

[0078] The camera module (400) may include a camera housing (420). The camera housing (420) may be configured to accommodate one or more camera-related components. The camera housing (420) may include a base frame (421) and a cover frame (422) configured to cover the base frame (421).

[0079] The base frame (421) may include a bottom portion (421A) and a plurality of side walls (421B, 421C, 421D, 421E) connected to the bottom portion (421A). The plurality of side walls (421B, 421C, 421D, 421E) include a first side wall (421B) (e.g., a +X-direction side wall), a second side wall (421C) opposite the first side wall (421B) (e.g., a -X-direction side wall), a third side wall (421D) connecting the first side wall (421B) and the second side wall (421C) and located between the first side wall (421B) and the second side wall (421C) (e.g., a +Y-direction side wall), and a fourth side wall (421E) connecting the first side wall (421B) and the second side wall (421C) and located between the first side wall (421B) and the second side wall (421C) and opposite the third side wall (421D) (e.g., a -Y-direction side wall). Can be.

[0080] The bottom portion (421A) may include a first center hole (421F) that allows light passing through at least one lens (411) to pass through to the image sensor. The first side wall (421B) may include a first hole (421G) defined within the first side wall (421B). The third side wall (421D) may include a second hole (421H) defined within the third side wall (421D).

[0081] The base frame (421) may include a first guide (G11) configured to guide the first ball (B1) and the third ball (B3). The first guide (G11) may be positioned in a corner region between the first side wall (421B) and the fourth side wall (421E). The first guide (G11) may be open toward the second side wall (421C). For example, the first guide (G11) may include a generally V-shaped groove that contacts the first ball (B1) and the third ball (B3) at a first indentation angle (e.g., about 45 degrees).

[0082] The base frame (421) may include a second guide (G12) configured to guide a plurality of second balls (B2) and a fourth ball (B4). The second guide (G12) may be positioned in a corner region between the second side wall (421C) and the third side wall (421D). The second guide (G12) may be open toward the fourth side wall (421E). For example, the second guide (G12) may include a generally V-shaped groove that contacts the plurality of second balls (B2) and the fourth ball (B4) at a second inward angle (e.g., about 45 degrees).

[0083] The camera housing (420) may include a cover frame (422), which may be referred to as a “shield can.” The cover frame (422) may include a top portion (422A), a plurality of second side walls (422B) connected to the top portion (422A), and a third hole (422C) disposed in the top portion (422A). The lens housing (412) may at least partially pass through the third hole (422C).

[0084] The camera module (400) may include an image sensor and a printed circuit board configured to transmit an electrical signal converted from the image sensor to another component (e.g., the processor (120) of FIG. 1 and / or the image signal processor (260) of FIG. 2).

[0085] The camera module (400) may include an actuator (440) configured to drive at least one lens (411) in a direction along the optical axis (A) (e.g., in the Z-axis direction). The actuator (440) may be referred to as an “auto focus (AF) actuator.”

[0086] The actuator (440) may include a carrier (441) configured to carry the lens housing (412) in a direction along the optical axis (A) (e.g., in the Z-axis direction). The carrier (441) may be referred to as an “AF carrier.” The carrier (441) may include a first carrier face (441A) (e.g., a +Z-direction carrier face), a second carrier face (441B) opposite to the first carrier face (441A) (e.g., a -Z-direction carrier face), and a plurality of outer side carrier faces (441C, 441D, 441E, 441F) between the first carrier face (441A) and the second carrier face (441B). The plurality of outer side carrier faces (441C, 441D, 441E, 441F) may include a first outer side carrier face (441C) facing in a first direction substantially orthogonal to the optical axis (A) (e.g., X-axis direction), a second outer side carrier face (441D) facing in a second direction substantially orthogonal to the optical axis (A) and different from the first direction (e.g., Y-axis direction), a third outer side carrier face (441E) opposite to the first outer side carrier face (441C), and a fourth outer side carrier face (441F) opposite to the second outer side carrier face (441D).

[0087] The carrier (441) may include a first recess (R1) recessed in the first outer side carrier face (441C), and a second recess (R2) recessed in the second outer side carrier face (441D).

[0088] The carrier (441) may include a second center hole (441G) passing through the first carrier face (441A) and the second carrier face (441B). The lens housing (412) may at least partially pass through the second center hole (441G). In one or more embodiments, the lens housing (412) and the carrier (441) may be formed as an integral component. The integral component may be referred to as a lens holder, a lens housing, or a carrier.

[0089] The carrier (441) may include a third guide (G21) configured to guide the first ball (B1) and the third ball (B3) together with the first guide (G11). The third guide (G21) may be positioned in a corner region between the first outer side carrier face (441C) and the fourth outer side carrier face (441F). The third guide (G21) may be open toward the first side wall (421B). For example, the third guide (G21) may include a generally V-shaped groove that contacts the first ball (B1) and the third ball (B3) at a third indentation angle (e.g., about 45 degrees).

[0090] The carrier (441) may include a fourth guide (G22) configured to guide a plurality of second balls (B2) and a fourth ball (B4) together with the second guide (G12). The fourth guide (G22) may be positioned in a corner region between the second outer side carrier face (441D) and the third outer side carrier face (441E). The fourth guide (G22) may be open toward the third side wall (421D). For example, the fourth guide (G22) may include a generally V-shaped groove configured to guide the plurality of second balls (B2) and the fourth ball (B4) at a fourth inscribed angle (e.g., about 45 degrees).

[0091] The actuator (440) may include a first magnet (442A). The first magnet (442A) may be a unipolar magnet magnetized in a direction along the optical axis (A). The first magnet (442A) may be disposed in a first recess (R1). The actuator (440) may include a second magnet (442B). The second magnet (442B) may be a unipolar magnet magnetized in a direction along the optical axis (A). The second magnet (442B) may be disposed in a second recess (R2).

[0092] The actuator (440) may include a first coil (443A) configured to be electromagnetically coupled with a first magnet (442A). When current flows through the first coil (443A), a driving force may be generated in the first magnet (442A) in a direction substantially parallel to the optical axis (A). The first coil (443A) may be disposed in the first hole (421G). The actuator (440) may include a second coil (443B) configured to be electromagnetically coupled with a second magnet (442B). When current flows through the second coil (443B), a driving force may be generated in the second magnet (442B) in a direction substantially parallel to the optical axis (A). The second coil (443B) may be disposed in the second hole (421H). An actuator (440) including multiple pairs of driving units, including a first magnet (442A) and a first coil (443A) and a second magnet (442B) and a second coil (443B), can maintain or reduce current consumption during image acquisition. Since it is easy to achieve a desired driving force of the actuator (440), the height of the camera module (400) can be maintained or reduced.

[0093] The actuator (440) may include a sensor (444) configured to detect the magnetic flux density of the first magnet (442A). For example, the sensor (444) may include a Hall sensor or a tunnel magneto-resistance sensor. The sensor (444) may be disposed on the inside of the first coil (443A). In one or more embodiments, the sensor (444) may be configured to detect the magnetic flux density of the second magnet (442B). The sensor (444) may be disposed on the inside of the second coil (443B).

[0094] The actuator (440) may include a first back yoke (YB1) configured to attract a first magnet (442A). The first back yoke (YB1) may allow the first magnet (442A) to be fixed to a first recess (R1). The first back yoke (YB1) may be disposed between the first recess (R1) and the first magnet (442A). The actuator (440) may include a second back yoke (YB2) configured to attract a second magnet (442B). The second back yoke (YB2) may allow the second magnet (442B) to be fixed to the second recess (R2). The second back yoke (YB2) can be placed between the second recess (R2) and the second magnet (442B).

[0095] The actuator (440) may include a first yoke (Y1) configured to attract a first magnet (442A) in a first direction substantially orthogonal to the optical axis (A), e.g., the +X direction. The first yoke (Y1) may be disposed on a first substrate area (470A) of a flexible printed circuit board (470) so as to face the first magnet (442A) with a first coil (443A) positioned between the first yoke (Y1) and the first magnet (442A).

[0096] The actuator (440) may include a second yoke (Y2) configured to attract a second magnet (442B) in a first direction substantially orthogonal to the optical axis (A) and a second direction (e.g., +Y direction) that is different (e.g., orthogonal to the first direction). The second yoke (Y2) may be disposed on a second substrate area (470B) of a flexible printed circuit board (470) such that the second coil (443B) is positioned between the second yoke (Y2) and the second magnet (442B) and faces the second magnet (442B).

[0097] The first attractive force (F1) between the first magnet (442A) and the first yoke (Y1) and the second attractive force (F2) between the second magnet (442B) and the second yoke (Y2) can reduce the shaking (e.g., tilting) of the carrier (441) in a direction other than the direction along the optical axis (A) (e.g., Z-axis direction), thereby enabling the implementation of an actuator (440) having a high spring constant and high driving force. When an external impact is applied to the camera module (400), since the control of the actuator (440) is easier, the quality of the acquired image can be improved.

[0098] The actuator (440) may include a metal piece (445). Depending on the position and / or area of ​​the metal piece (445), the attractive force between the metal piece (445) and the first magnet (442A) may vary. Accordingly, the position of the attractive center (SC) on which the attractive force (Fn) of the first attractive force (F1) between the first magnet (442A) and the first yoke (Y1) and the second attractive force (F2) between the second magnet (442B) and the second yoke (Y2) acts may vary. The metal piece (445) may be disposed inside the first coil (443A). The metal piece (445) may be fixed to the first substrate area (470A) of the flexible printed circuit board (470). In one or more embodiments, the metal piece (445) may be disposed inside the second coil (443B). The metal piece (445) may be fixed to the second substrate area (470B) of the flexible printed circuit board (470). In one or more embodiments, the actuator (440) may include a plurality of metal pieces (445). The plurality of metal pieces (445) may be respectively disposed inside the first coil (443A) and inside the second coil (443B). The plurality of metal pieces (445) may be respectively fixed to the first substrate area (470A) and the second substrate area (470B) of the flexible printed circuit board (470).

[0099] The camera module (400) may include a first ball (B1) configured to guide a carrier (441) relative to a base frame (421) in a direction along the optical axis (A) (e.g., in the Z-axis direction). The first ball (B1) may be arranged in a first guide (G11) and a third guide (G21). The camera module (400) may include a plurality of second balls (B2) configured to guide a carrier (441) relative to the base frame (421) in a direction along the optical axis (A) (e.g., in the Z-axis direction). The plurality of second balls (B2) may be arranged in a second guide (G12) and a fourth guide (G22). The first ball (B1) and the plurality of second balls (B2) may be configured to support the carrier (441) with respect to the base frame (421) in a direction opposite to the suction resultant force (Fn) of the first suction force (F1) and the second suction force (F2) with a first support force (SF1) and a second support force (SF2), respectively. A suction center (SC) on which the suction resultant force (Fn) acts may be offset from the optical axis (A) and may be located within a virtual shape (P) (e.g., a triangle) which may be referred to as a “virtual support surface” connecting the first ball (B1) and the plurality of second balls (B2). The virtual shape (P) may intersect at least a portion of the lens (411). This can reduce the distance between the center of gravity and the center of attraction (SC) of the carrier (441), and reduce the shaking (e.g., tilting) of the carrier (441) in a direction different from the direction along the optical axis (A) when the carrier (441) is driven in a direction along the optical axis (A) (e.g., the Z-axis direction).

[0100] The camera module (400) may include a third ball (B3). The third ball (B3) may be positioned on the first guide (G11) and the third guide (G21). The third ball (B3) may be sized to define a desired operating distance of the first ball (B1). For example, the size of the third ball (B3) may be substantially the same as or smaller than the size of the first ball (B1).

[0101] The camera module (400) may include a fourth ball (B4). The fourth ball (B4) may be disposed on the second guide (G21) and the fourth guide (G22). The fourth ball (B4) may be disposed between adjacent second balls (B2) to define a gap between the plurality of second balls (B2). The fourth ball (B4) may increase the gap between the second balls (B2), thereby increasing the size of the virtual shape (P) connecting the first ball (B1) and the plurality of second balls (B2), and reducing the possibility of shaking (e.g., tilting) of the carrier (441). For example, the size of the fourth ball (B4) may be substantially the same as or smaller than the size of the second ball (B2).

[0102] The camera module (400) may include a plurality of dampers (460) configured to damp movement of the carrier (441) in a direction along the optical axis (A) with respect to the base frame (421) (e.g., in the Z-axis direction). The plurality of dampers (460) may include a viscoelastic material. For example, the plurality of dampers (460) may include a high-viscosity gel-like elastomer material. The plurality of dampers (460) may be arranged in a plurality of clearance spaces between the base frame (421) and the carrier (441). For example, the plurality of dampers (460) may be arranged between clearance spaces around the first guide (G11) and the third guide (G21) and clearance spaces around the second guide (G12) and the fourth guide (G22).

[0103] A plurality of dampers (460) may be arranged close to the virtual shape (P). For example, the plurality of dampers (460) may be arranged in a clearance space between the base frame (421) and the carrier (441) between the virtual shape (P) and a first virtual contact surface (V1) that is substantially parallel to the virtual shape (P) and contacts the lens housing (412). The plurality of dampers (460) may be arranged in a clearance space between the base frame (421) and the carrier (441) between the virtual shape (P) and a second virtual contact surface (V2) that is opposite to the first virtual contact surface (V1) with respect to the virtual shape (P) and is substantially parallel to the virtual shape (P) and contacts the lens housing (412). A structure in which a plurality of dampers (460) are arranged close to a virtual shape (P) can reduce or prevent tilting of the lens (411) due to the plurality of dampers (460).

[0104] A plurality of dampers (460) can be arranged substantially symmetrically with respect to a virtual shape (P). This can reduce or prevent tilting of the lens (411) due to the plurality of dampers (460).

[0105] The camera module (400) may include a flexible printed circuit board (470). The flexible printed circuit board (470) may at least partially surround a side of the base frame (421). The flexible printed circuit board (470) may include a first substrate area (470A) disposed on a first side wall (421B), and a second substrate area (470B) facing a third side wall (421D). A first coil (443A), a sensor (444), and a metal piece (445) may be disposed on the first substrate area (470A), and a second coil (443B) may be disposed on the second substrate area (470B). The first coil (443A) may be electrically connected to the first substrate area (470A), and the second coil (443B) may be electrically connected to the second substrate area (470B).

[0106] FIG. 11 is a cross-sectional view of a camera module according to one or more embodiments.

[0107] Referring to FIG. 11, a camera module (400-1) (e.g., the camera module (180) of FIG. 1, the camera module (180) of FIG. 2, the second camera module (380B) of FIGS. 3 and 4, and / or the camera module (400) of FIGS. 5 to 10) may include a lens assembly (410), a camera housing (420), and an actuator (440). The camera housing (420) may include a base frame (421) and a cover frame (422). The base frame (421) may include a first guide (G11) and a second guide (G12). The actuator (440) may include a carrier (441). The carrier (441) may include a third guide (G21) and a fourth guide (G22).

[0108] The camera module (400-1) may include a plurality of first balls (B1) arranged on a first guide (G11) and a third guide (G21), and a plurality of second balls (B2) and a fourth ball (B4) arranged on a second guide (G12) and a fourth guide (G22). A virtual shape (P) connecting the plurality of first balls (B1) and the plurality of second balls (B2) may include a trapezoidal shape. The center of attraction (SC) may be located inside the virtual shape (P) of the trapezoidal shape.

[0109] FIG. 12 is a side view of a camera module according to one or more embodiments.

[0110] Referring to FIG. 12, a camera module (400-2) (e.g., the camera module (180) of FIG. 1, the camera module (180) of FIG. 2, the second camera module (380B) of FIGS. 3 and 4, the camera module (400) of FIGS. 5 to 10, and / or the camera module (400-1) of FIG. 11) may include a lens assembly (410), a camera housing (420), and an actuator (440-2) (e.g., the actuator (440) of FIGS. 5 to 10 and / or the actuator (440) of FIG. 11). The actuator (440-2) may include a carrier (441), a first magnet (442A), a second magnet (442B), a first coil (443A), a second coil (443B), a sensor (444), a metal piece (445-2) (e.g., the metal piece (445) of FIGS. 5 to 10) and at least one ball (e.g., the first ball (B1)).

[0111] The sensor (444) may be positioned outside the first coil (443A). The metal piece (445-2) may extend along the longitudinal direction (e.g., Y-axis direction) of the central slot of the first coil (443A). The metal piece (445-2) may be positioned on one side (e.g., +Z-direction side) of the central slot of the first coil (443A).

[0112] FIG. 13 is a plan view of a camera module according to one or more embodiments.

[0113] Referring to FIG. 13, a camera module (400-3) (e.g., the camera module (180) of FIG. 1, the camera module (180) of FIG. 2, the second camera module (380B) of FIGS. 3 and 4, the camera module (400) of FIGS. 5 to 10, the camera module (400-1) of FIG. 11, and / or the camera module (400-2) of FIG. 12) includes a lens assembly (410), a camera housing (420-3) (e.g., the camera housing (420) of FIGS. 5 to 10, the camera housing (420) of FIG. 11, and / or the camera housing (420) of FIG. 12), and an actuator (440-3) (e.g., the actuator (440) of FIGS. 5 to 10, the actuator (440) of FIG. 11, and / or the actuator (440) of FIG. 12). It may include an actuator (440-2)).

[0114] The camera housing (420-3) may include a base frame (421-3) (e.g., the base frame (421) of FIGS. 5 to 10 and / or the base frame (421) of FIG. 11). The base frame (421-3) may include a first side wall (421B), a second side wall (421C), a third side wall (421D), and a fourth side wall (421E). The base frame (421-3) may include a first guide (G11) disposed inside the fourth side wall (421E) and open toward the first side wall (421B) and the third side wall (421D), and a second guide (G12) disposed inside the third side wall (421D) and open toward the second side wall (421C) and the fourth side wall (421E).

[0115] The actuator (440-3) may include a carrier (441-3) (e.g., the carrier (441) of FIGS. 5-10, the carrier (441) of FIG. 11, and / or the carrier (441) of FIG. 12). The carrier (441-3) may include a first outer side carrier face (441C), a second outer side carrier face (441D), a third outer side carrier face (441E), and a fourth outer side carrier face (441F). The carrier (441-3) may include a third guide (G21) disposed in a corner region between the first outer side carrier face (441C) and the fourth outer side carrier face (441F) and open toward the fourth side wall (421E), and a fourth guide (G22) disposed in a corner region between the second outer side carrier face (441D) and the third outer side carrier face (441E) and open toward the third side wall (421D). The carrier (441-3) may include a first recess (R1) recessed in the first outer side carrier face (441C), and a second recess (R2) recessed in the third outer side carrier face (441E).

[0116] The camera module (400-3) may include a first ball (B1) arranged on a first guide (G11) and a third guide (G21), and a plurality of second balls (B2) arranged on a second guide (G21) and a fourth guide (G22).

[0117] The actuator (440-3) may include a first magnet (442A) disposed in a first recess (R1), a second magnet (442B) disposed in a second recess (R2) opposite to the first magnet (442A), a first coil (443A) disposed on a first side wall (421B) and facing the first magnet (442A), and a second coil (443B) disposed on a second side wall (421C) and facing the second magnet (442B). The symmetrical structure of the first magnet (442A) and the second magnet (442B) allows the center of gravity of the optical axis (A) and the carrier (441-3) to pass through a virtual shape (P) connecting the first ball (B1) and a plurality of second balls (B2).

[0118] The first magnet (442A) can be offset adjacent to the second outer side face (441D) in a direction substantially orthogonal to the direction along the optical axis (A) (e.g., the Z-axis direction) and the direction between the first magnet (442A) and the second magnet (442B) (e.g., the X-axis direction) (e.g., the Y-axis direction). The second magnet (442B) can be offset adjacent to the fourth outer side face (441F) in a direction substantially orthogonal to the direction along the optical axis (A) (e.g., the Z-axis direction) and the direction between the first magnet (442A) and the second magnet (442B) (e.g., the X-axis direction). The offset structure of the first magnet (442A) and the second magnet (442B) can cause rotation of the carrier (441-3) about the optical axis (A) (e.g., clockwise rotation or counterclockwise rotation about the Z-axis). To reduce or prevent rotation of the carrier (441-3), the first ball (B1) can support the carrier (441-3) with respect to the base frame (421-3) with a first support force (SF1) in an opposite direction to the rotation, and a plurality of second balls (B2) can support the carrier (441-3) with respect to the base frame (421-3) with a second support force (SF2) in an opposite direction to the rotation.

[0119] FIG. 14 is a cross-sectional view of a damper of a camera module according to one or more embodiments.

[0120] Referring to FIG. 14, a camera module (400-4) (e.g., the camera module (180) of FIG. 1, the camera module (180) of FIG. 2, the second camera module (380B) of FIGS. 3 and 4, the camera module (400) of FIGS. 5 to 10, the camera module (400-1) of FIG. 11, the camera module (400-2) of FIG. 12, and / or the camera module (400-3) of FIG. 13) comprises a camera housing (420), an actuator (440-4) (e.g., the actuator (440) of FIGS. 5 to 10, the actuator (440) of FIG. 11, the actuator (440-2) of FIG. 12, and / or the actuator (440-3) of FIG. 13), and a damper (460-4) (e.g., the actuator (440) of FIGS. 5 to 10 A damper (460) may be included. The camera housing (420) may include a base frame (421).

[0121] The actuator (440-4) may include a carrier (441-4) (e.g., the carrier (441) of FIGS. 5 to 10, the carrier (441) of FIG. 11, the carrier (441) of FIG. 12, and / or the carrier (441-3) of FIG. 13). The carrier (441-4) may include a pocket (PC) configured to at least partially accommodate the damper (460-4). The pocket (PC) may be configured as an enclosure that is closed by four faces overall (e.g., a +Z-direction face, a -Z-direction face, a +X-direction face, and a -X-direction face). The damper (460-4) may include a viscoelastic material (VE) disposed inside a pocket (PC), and a damper pin (DP) connected to a carrier (441-4) and a base frame (421) through a hole disposed in the pocket (PC) and penetrating the viscoelastic material (VE) along an optical axis (e.g., Z-axis) and across the pocket (PC). In one or more embodiments, the base frame (421) may also include the pocket (PC).

[0122] The damper (460-4) described in Fig. 14 is not limited to the illustrated embodiment and may be implemented in various structures / methods.

[0123] FIG. 15 is a perspective view of a magnet and yoke of a camera module according to one or more embodiments.

[0124] Referring to FIG. 15, a camera module (400-5) (e.g., the camera module (180) of FIG. 1, the camera module (180) of FIG. 2, the second camera module (380B) of FIGS. 3 and 4, the camera module (400) of FIGS. 5 to 10, the camera module (400-1) of FIG. 11, the camera module (400-2) of FIG. 12, the camera module (400-3) of FIG. 13, and / or the camera module (400-4) of FIG. 14) is connected to an actuator (440-5) (e.g., the actuator (440) of FIGS. 5 to 10, the actuator (440) of FIG. 11, the actuator (440-2) of FIG. 12, the actuator (440-3) of FIG. 13, and / or the actuator (440-4) of FIG. 14). May include. The actuator (440-5) may include a first magnet (442A), a second magnet (442B), a first coil (443A), a second coil (443B), a first back yoke (YB1), a second back yoke (YB2), a first yoke (Y1), and a second yoke (Y2). The magnetization direction of the first magnet (442A) and the magnetization direction of the second magnet (442B) may be the same when viewed in the direction along the optical axis. The first magnet (442A) and the second magnet (442B) may be physically coupled to each other. This may simplify inspection and assembly of the components of the actuator (440-5). The first back yoke (YB1) and the second back yoke (YB2) can be seamlessly connected to each other as one body. This can simplify inspection and assembly of components of the actuator (440-5).

[0125] FIG. 16 is a perspective view of a magnet and yoke of a camera module according to one or more embodiments.

[0126] Referring to FIG. 16, a camera module (400-6) (e.g., the camera module (180) of FIG. 1, the camera module (180) of FIG. 2, the second camera module (380B) of FIGS. 3 and 4, the camera module (400) of FIGS. 5 to 10, the camera module (400-1) of FIG. 11, the camera module (400-2) of FIG. 12, the camera module (400-3) of FIG. 13, and / or the camera module (400-4) of FIG. 14) has an actuator (440-6) (e.g., the actuator (440) of FIGS. 5 to 10, the actuator (440) of FIG. 11, the actuator (440-2) of FIG. 12, the actuator (440-3) of FIG. 13, and / or the actuator (440-4) of FIG. 14). May include. The actuator (440-6) may include a first magnet (442A), a second magnet (442B), a first coil (443A), a second coil (443B), a back yoke (YB), a first yoke (Y1), and a second yoke (Y2). The back yoke (YB) may be configured as an integral structure that absorbs both the first magnet (442A) and the second magnet (442B). The magnetization direction of the first magnet (442A) and the magnetization direction of the second magnet (442B) may be opposite to each other when viewed in the direction along the optical axis. This may reduce the leakage flux of the actuator (440-6).

[0127] FIG. 17 is a cross-sectional view of a camera module according to one or more embodiments.

[0128] Referring to FIG. 17, a camera module (400-7) (e.g., the camera module (180) of FIG. 1, the camera module (180) of FIG. 2, the second camera module (380B) of FIGS. 3 and 4, the camera module (400) of FIGS. 5 to 10, the camera module (400-1) of FIG. 11, the camera module (400-2) of FIG. 12, the camera module (400-3) of FIG. 13, the camera module (400-4) of FIG. 14, the camera module (400-5) of FIG. 15, and / or the camera module (400-6) of FIG. 16) may include a lens assembly (410), a camera housing (420), and an actuator (440). The camera housing (420) may include a base frame (421), and a cover frame (422). The base frame (421) may include a first guide (G11) and a second guide (G12). The actuator (440) may include a carrier (441). The carrier (441) may include a third guide (G21) and a fourth guide (G22).

[0129] The camera module (400-7) may include a first ball (B1) and a third ball (B3) arranged on a first guide (G11) and a third guide (G21). The camera module (400-7) may include a shaft (S). The shaft (S) may extend from the base frame (421) toward the cover frame (422). The shaft (S) may be arranged on the second guide (G12) and the fourth guide (G22). The shaft (S) may ensure linear movement of the carrier (441) along the optical axis (A). Partially guiding the carrier (441) with the shaft (S) may reduce the frictional force applied to the carrier (441) while reducing the shaking (e.g., tilt) of the carrier (441) when the carrier (441) moves in the direction along the optical axis (A), thereby reducing the driving load due to the frictional force.

[0130] One aspect of the present disclosure is to provide an actuator that reduces vibrations that may occur in a camera module when an external impact is applied to the camera module, and a camera module including the actuator. The technical problems to be solved by the present disclosure are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art to which the present disclosure pertains.

[0131] A camera module (400) may include a lens (411) having an optical axis (A). The camera module (400) may include a carrier (441) configured to transport the lens (411) in a direction along the optical axis (A). The camera module (400) may include a camera housing (420) configured to accommodate the carrier (441). The camera module (400) may include a first magnet (442A) disposed on the carrier (441) in a first direction substantially orthogonal to the optical axis (A). The camera module (400) may include a second magnet (442B) disposed on the carrier (441) in a second direction substantially orthogonal to the optical axis (A) and different from the first direction. The camera module (400) may include a first coil (443A) configured to be electromagnetically coupled with the first magnet (442A) and disposed in the camera housing (420). The camera module (400) may include a second coil (443B) configured to be electromagnetically coupled with the second magnet (442B) and disposed in the camera housing (420). The camera module (400) may include a first yoke (Y1) facing the first magnet (442A) and disposed in the camera housing (420). The camera module (400) may include a second yoke (Y2) facing the second magnet (442B) and disposed in the camera housing (420). The camera module (400) may include at least three balls (B1, B2) arranged between the carrier (441) and the camera housing (420). The at least three balls (B1, B2) may be configured to support the carrier (441) with respect to the camera housing (420) and guide the carrier (441) in a direction along the optical axis (A).

[0132] The at least three balls (B1, B2) may be configured to support the carrier (441) with respect to the camera housing (420) in a direction opposite to the direction in which the attractive force (Fn) of the first attractive force (F1) acting between the first magnet (442A) and the first yoke (Y1) and the second attractive force (F2) acting between the second magnet (442B) and the second yoke (Y2) acts.

[0133] The first direction and the second direction may be substantially orthogonal to each other.

[0134] The at least three balls (B1, B2) may include a first ball (B1) disposed in a first corner area of ​​the camera housing (420), and a plurality of second balls (B2) disposed in a second corner area of ​​the camera housing (420) that is not adjacent to the first corner area. A virtual shape (P) connecting the first ball (B1) and the plurality of second balls (B2) may cross at least a portion of the lens (411).

[0135] The camera housing (420) may include a first guide (G11) configured to guide the first ball (B1), and a second guide (G12) configured to guide the plurality of second balls (B2). The carrier (441) may include a third guide (G21) configured to guide the first ball (B1), and a fourth guide (G22) configured to guide the plurality of second balls (B2). At least one of the first guide (G11), the second guide (G12), the third guide (G21), or the fourth guide (G22) may include a generally V-shaped groove.

[0136] The above at least three balls (B1, B2) may further include an additional first ball (B1) arranged in a first corner area of ​​the camera housing (420).

[0137] The above camera module (400) may further include a sensor (444) arranged inside at least one of the first coil (443A) or the second coil (443B).

[0138] The above camera module (400) may further include a metal piece (445) arranged on the inside of at least one of the first coil (443A) or the second coil (443B).

[0139] The above camera module (400-2) may further include a sensor (444) arranged on the outside of at least one of the first coil (443A) or the second coil (443B).

[0140] The above first direction may be opposite to the above second direction.

[0141] The first magnet (442A) may be offset in a third direction substantially orthogonal to the first and second directions. The second magnet (442B) may be offset in a fourth direction opposite to the third direction.

[0142] The above optical axis (A) can pass through a virtual shape (P) connecting at least three balls (B1, B2, B3).

[0143] The camera module (400) may further include a first damper (460) disposed in a clearance space between the camera housing (420) and the carrier (441) between the virtual shape (P) and a first virtual contact surface (V1) that is substantially parallel to the virtual shape (P) and contacts the lens housing (412) configured to accommodate the lens (411).

[0144] The camera module (400) may further include a second damper (460) disposed in a clearance space between the camera housing (420) and the carrier (441) between the virtual shape (P) and a second virtual contact surface (V2) that is opposite to the first virtual contact surface (V1) with respect to the virtual shape (P) and is substantially parallel to the virtual shape (P) and contacts the lens housing (412). The first damper (460) and the second damper (460) may be disposed substantially symmetrically with respect to the virtual shape (P).

[0145] The magnetization direction of the first magnet (442A) may be the same as the magnetization direction of the second magnet (442B).

[0146] The magnetization direction of the first magnet (442A) may be opposite to the magnetization direction of the second magnet (442B).

[0147] The above first magnet (442A) can be physically connected to the above second magnet (442B).

[0148] The above camera module (400-6) may further include a single back yoke (YB) facing the first magnet (442A) and the second magnet (442B).

[0149] A camera module (400-7) may include a lens (411) having an optical axis (A). The camera module (400-7) may include a carrier (441) configured to transport the lens (411) in a direction along the optical axis (A). The camera module (400-7) may include a camera housing (420) configured to accommodate the carrier (441). The camera module (400-7) may include a first magnet (442A) disposed on the carrier (441) in a first direction substantially orthogonal to the optical axis (A). The camera module (400-7) may include a second magnet (442B) disposed on the carrier (441) in a second direction substantially orthogonal to the optical axis (A) and different from the first direction. The camera module (400-7) may include a first coil (443A) configured to be electromagnetically coupled with the first magnet (442A) and disposed in the camera housing (420). The camera module (400-7) may include a second coil (443B) configured to be electromagnetically coupled with the second magnet (442B) and disposed in the camera housing (420). The camera module (400-7) may include a first yoke (Y1) facing the first magnet (442A) and disposed in the camera housing (420). The camera module (400-7) may include a second yoke (Y2) facing the second magnet (442B) and disposed in the camera housing (420). The camera module (400-7) may include at least one ball (B1) configured to guide the carrier (441) relative to the camera housing (420) in a direction along the optical axis (A). The camera module (400-7) may include a shaft (S) configured to guide the carrier (441) relative to the camera housing (420) in a direction along the optical axis (A).

[0150] The electronic device (101; 301) may include a camera module (400; 400-1; 400-2; 400-3; 400-4; 400-5; 400-6; 400-7).

[0151] According to one or more embodiments, an actuator having a high spring constant and a high driving force is implemented, so that when an external impact is applied to the camera module, the actuator can be easily controlled, thereby improving the quality of the acquired image. According to one or more embodiments, the current consumed during image acquisition can be maintained or reduced. According to one or more embodiments, the height of the camera module can be reduced. The effects of the camera module according to the embodiments are not limited to those mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the specification.

[0152] The embodiments described herein are intended to be illustrative and not restrictive. Various modifications to the details of the disclosure, including those included within the scope of the appended claims and their equivalents, may be made. Any of the embodiments described herein may be used in combination with any of the embodiments described herein.

Claims

1. A lens (411) having an optical axis (A), A carrier (441) configured to transport the lens (411) in a direction along the optical axis (A); A camera housing (420) configured to accommodate the carrier (441), A first magnet (442A) located on the carrier (441) and offset from the optical axis (A) in a first direction substantially orthogonal to the optical axis (A), A second magnet (442B) located on the carrier (441) and offset from the optical axis (A) in a second direction that is different from the first direction and substantially orthogonal to the optical axis (A), A first coil (443A) located in the camera housing (420) and configured to be electromagnetically coupled with the first magnet (442A), A second coil (443B) located in the camera housing (420) and configured to be electromagnetically coupled with the second magnet (442B), A first yoke (Y1) located in the above camera housing (420) and facing the first magnet (442A), A second yoke (Y2) located in the above camera housing (420) and facing the second magnet (442B), and Containing at least three balls (B1, B2) between the carrier (441) and the camera housing (420), A camera module (400) wherein the at least three balls (B1, B2) are configured to support the carrier (441) with respect to the camera housing (420) and guide the carrier (441) in the direction along the optical axis (A).

2. In paragraph 1, The first attractive force (F1) acting between the first magnet (442A) and the first yoke (Y1) and the second attractive force (F2) acting between the second magnet (442B) and the second yoke (Y2) generate an attractive force (Fn), A camera module in which the at least three balls (B1, B2) are configured to support the carrier (441) relative to the camera housing (420) in a direction opposite to the direction in which the suction force (Fn) acts.

3. In paragraph 1 or 2, A camera module wherein the first direction and the second direction are substantially orthogonal to each other.

4. In any one of paragraphs 1 to 3, At least three balls (B1, B2) above, A first ball (B1) placed in the first corner area of ​​the above camera housing (420), and It includes a plurality of second balls (B2) arranged in the second corner area of ​​the above camera housing (420), The second corner area is not adjacent to the first corner area, The virtual shape (P) connecting the first ball (B1) and the plurality of second balls (B2) crosses at least a portion of the lens (411), Preferably, the camera housing (420) A first guide (G11) configured to guide the first ball (B1), and A second guide (G12) configured to guide the plurality of second balls (B2), The above carrier (441) is, A third guide (G21) configured to guide the first ball (B1), and Including a fourth guide (G22) configured to guide the plurality of second balls (B2), At least one of the first guide (G11), the second guide (G12), the third guide (G21) or the fourth guide (G22) includes a V-shaped groove, Preferably, the camera module further comprises an additional first ball (B1) in the first corner area of ​​the camera housing (420) of the at least three balls (B1, B2).

5. In any one of paragraphs 1 to 4, A camera module further comprising a sensor (444) located on the inner side of at least one of the first coil (443A) or the second coil (443B).

6. In any one of paragraphs 1 to 5, A camera module further comprising a metal piece (445) on the inner side of at least one of the first coil (443A) or the second coil (443B).

7. In any one of paragraphs 1 to 6, A camera module further comprising a sensor (444) located on the outside of at least one of the first coil (443A) or the second coil (443B).

8. In any one of paragraphs 1 to 7, The above first direction is opposite to the above second direction, Preferably, the first magnet (442A) is offset from the optical axis (A) in a third direction substantially orthogonal to the first direction and the second direction, The second magnet (442B) is offset from the optical axis (A) in a fourth direction opposite to the third direction, Preferably, the optical axis (A) passes through a virtual shape (P) connecting at least three balls (B1, B2, B3), Preferably, the camera module (400) includes a lens housing (412) configured to accommodate the lens (411), The above camera module (400) further includes a first damper (460) in a clearance space between the camera housing (420) and the carrier (441), The above first damper (460) is between the virtual shape (P) and the first virtual contact surface (V1), The first virtual contact surface (V1) is substantially parallel to the virtual shape (P) and contacts the lens housing (412), Preferably, it further includes a second damper (460) in the clearance space between the camera housing (420) and the carrier (441), The second damper (460) is located between the virtual shape (P) and the second virtual contact surface (V2) on the opposite side of the virtual shape (P) from the first virtual contact surface (V1), The second virtual contact surface (V2) is substantially parallel to the virtual shape (P) and contacts the lens housing (412), A camera module in which the first damper (460) and the second damper (460) are arranged substantially symmetrically with respect to the virtual shape (P).

9. In any one of paragraphs 1 to 8, A camera module in which the magnetization direction of the first magnet (442A) is the same as the magnetization direction of the second magnet (442B).

10. In any one of paragraphs 1 to 8, A camera module in which the magnetization direction of the first magnet (442A) is opposite to the magnetization direction of the second magnet (442B).

11. In any one of paragraphs 1 to 10, The above first magnet (442A) is a camera module physically connected to the above second magnet (442B).

12. In any one of paragraphs 1 to 11, A camera module further comprising a single back yoke (YB) facing the first magnet (442A) and the second magnet (442B).

13. A lens (411) having an optical axis (A), A carrier (441) configured to transport the lens (411) in a direction along the optical axis (A); A camera housing (420) configured to accommodate the carrier (441), A first magnet (442A) located on the carrier (441) in a first direction substantially orthogonal to the optical axis (A) and offset from the optical axis (A), A second magnet (442B) located in the carrier (441) and offset from the optical axis (A) in a second direction that is different from the first direction and substantially orthogonal to the optical axis (A), A first coil (443A) located in the camera housing (420) and configured to be electromagnetically coupled with the first magnet (442A), A second coil (443B) located in the camera housing (420) and configured to be electromagnetically coupled with the second magnet (442B), A first yoke (444A) located in the above camera housing (420) and facing the first magnet (442A), A second yoke (444B) located in the above camera housing (420) and facing the second magnet (442B), At least one ball (B1) configured to guide the carrier (441) relative to the camera housing (420) in the direction along the optical axis (A), and A camera module (400-7) including a shaft (S) configured to guide the carrier (441) relative to the camera housing (420) in a direction along the optical axis (A).

14. In the electronic device (101; 301), Memory (130) for storing one or more commands; At least one processor (120) configured to execute one or more of the above instructions, and A camera module (400; 400-1; 400-2; 400-3; 400-4; 400-5; 400-6; 400-7) according to any one of claims 1 to 13, An electronic device (101; 301) that controls movement of the carrier (441) in the direction along the optical axis (A) by controlling current applied to the first coil (443A) and the second coil (443B) when the at least one command is executed by the at least one processor (120).

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