Bone conduction packaging structure

Abstract

Provided in the present utility model is a bone conduction packaging structure, comprising: a base board, a housing covering the base board to form an accommodating space, and a bone conduction MEMS chip and an ASIC chip which are disposed in the accommodating space. The bone conduction MEMS chip comprises a substrate having a cavity, a vibration diaphragm supported on the substrate, and a back plate spaced apart from the side of the vibration diaphragm away from the substrate; a first cavity is formed between the vibration diaphragm and the back plate; a second cavity is formed between the vibration diaphragm and the substrate and the base board; a third cavity is formed between the back plate, and the housing, the substrate and the base board; and the first cavity is configured as a low-pressure region the pressure of which is lower than atmospheric pressure. The bone conduction packaging structure of the present utility model configures the region between the vibration diaphragm and the back plate as the low-pressure region, so as to reduce damping between the vibration diaphragm and the back plate, thereby improving the performance of the bone conduction packaging structure.

Description

Bone conduction packaging structure TECHNICAL FIELD

[0001] The utility model relates to the field of sound -electric conversion especially relates to a bone conduction packaging structure. BACKGROUND

[0002] The bone conduction microphone is the slight vibration of the head and neck caused by the speech of people into electric signal, because it is different from the traditional microphone through air conduction to collect sound, so even in noisy environment can restore the sound high definition, thereby avoiding the noise interference produced by air propagation sound, very high guarantee sound quality. TECHNICAL PROBLEM

[0003] In the related art, the bone conduction packaging structure includes a shell, a circuit board surrounded by the shell to form a receiving space, a vibration assembly and a MEMS chip arranged in the receiving space, the vibration assembly includes a vibrating piece arranged opposite and spaced apart from the circuit board, a frame connecting the vibrating piece and the circuit board, and a mass block arranged on the vibration assembly. When the bone conduction packaging structure works, the shell receives a vibration signal or a pressure signal, the vibrating piece and the mass block are excited by the vibration signal or the pressure signal, the mass block and the vibrating piece vibrate, so that the gas in the receiving space vibrates to change the air pressure in the receiving space. The MEMS detects the air pressure change and converts the sensed information into an electric signal that can be detected and transmitted to the circuit board. However, the bone conduction packaging structure of the related art has a large volume and poor performance.

[0004] Therefore, it is necessary to provide a new bone conduction packaging structure to solve the above technical problems. TECHNICAL SOLUTION

[0005] The utility model discloses a kind of bone conduction packaging structures with better performance.

[0006] To achieve the above purpose, the technical scheme of the utility model is as follows: a bone conduction packaging structure, the bone conduction packaging structure includes: a substrate, a shell forming a receiving space with the substrate cover, a bone conduction MEMS chip and an ASIC chip arranged in the receiving space, the bone conduction MEMS chip includes a substrate with a cavity, a diaphragm supported on the substrate, and a back plate spaced apart from the diaphragm away from the substrate side, the diaphragm and the back plate form a first cavity, the diaphragm and the substrate, the substrate form a second cavity, the back plate and the shell, the substrate, the substrate form a third cavity, and the first cavity is set to be a low-pressure area lower than atmospheric pressure.

[0007] Preferably, the diaphragm and the back plate are complete and air-tight structures.

[0008] Preferably, the vibrating diaphragm is provided with a first air vent hole, the first air vent hole being in communication with the first cavity and the second cavity, and the second cavity is set as a low pressure area lower than the atmospheric pressure.

[0009] Preferably, the back plate is provided with a second air vent hole, the second air vent hole being in communication with the first cavity and the third cavity, and the third cavity is set as a low pressure area lower than the atmospheric pressure.

[0010] Preferably, the vibrating diaphragm is provided with a first air vent hole, the first air vent hole being in communication with the first cavity and the second cavity, and the second cavity is set as a low pressure area lower than the atmospheric pressure, and the back plate is provided with a second air vent hole, the second air vent hole being in communication with the first cavity and the third cavity, and the third cavity is set as a low pressure area lower than the atmospheric pressure.

[0011] Preferably, the vibrating diaphragm is provided with a mass block on the side away from the back plate.

[0012] Preferably, the bone conduction MEMS chip further comprises a connecting column connecting the mass block to the vibrating diaphragm on the side away from the back plate.

[0013] Preferably, the back plate is provided with an anti-sticking protrusion on the side close to the vibrating diaphragm. Beneficial effects

[0014] Compared with the related art, the bone conduction packaging structure provided by the utility model has the advantages that the bone conduction packaging structure comprises a substrate, a shell forming a containing space in combination with the substrate, a bone conduction MEMS chip and an ASIC chip arranged in the containing space, the bone conduction MEMS chip comprises a substrate with a cavity, a vibrating diaphragm supported on the substrate and a back plate arranged on the side of the vibrating diaphragm away from the substrate, a first cavity is formed between the vibrating diaphragm and the back plate, a second cavity is formed between the vibrating diaphragm and the substrate and the substrate, a third cavity is formed between the back plate and the shell, the substrate and the substrate, and the first cavity is set as a low pressure area lower than the atmospheric pressure. The bone conduction packaging structure of the utility model does not additionally set a vibrating diaphragm and a mass block to detect the air pressure change, but directly detects the air pressure change through the bone conduction MEMS chip, so that the volume of the bone conduction packaging structure is reduced, and the area between the vibrating diaphragm and the back plate is set as a low pressure area, so that the damping between the vibrating diaphragm and the back plate is reduced, and the performance of the bone conduction packaging structure is improved. BRIEF DESCRIPTION OF DRAWINGS

[0015] In order to more clearly illustrate the technical scheme in the embodiments of the present application, the drawings needed to be used in the embodiment description will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained without creative labor on the basis of these drawings.

[0016] Fig. 1 is a perspective structural schematic view of a bone conduction MEMS chip in a bone conduction packaging structure of the present application;

[0017] Fig. 2 is an exploded view of the bone conduction MEMS chip shown in Fig. 1;

[0018] Fig. 3 is a sectional view of a bone conduction packaging structure of a first embodiment of the present application;

[0019] Fig. 4 is a sectional view of a bone conduction packaging structure of a second embodiment of the present application;

[0020] Fig. 5 is a sectional view of a bone conduction packaging structure of a third embodiment of the present application;

[0021] Fig. 6 is a sectional view of a bone conduction packaging structure of a fourth embodiment of the present application. Best mode of the present application

[0022] The technical scheme in the embodiments of the present application will be described clearly and completely in combination with the drawings of the embodiments of the present application. Obviously, the described embodiments are only some embodiments of the present application, rather than all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the present application.

[0023] Please refer to Figs. 1 to 3, which are a bone conduction packaging structure 100 of a first embodiment provided by the present application, the bone conduction packaging structure 100 comprising: a substrate 1, a shell 2 forming a receiving space 10 in combination with the substrate 1, a bone conduction MEMS chip 3 and an ASIC chip 4 arranged in the receiving space 10.

[0024] The substrate 1 is a circuit board, and the shell 2 can be a metal shell.

[0025] The bone conduction MEMS chip 3 comprises a substrate 31 with a cavity 310, a diaphragm 32 supported on the substrate 31, and a back plate 33 arranged at a side of the diaphragm 32 away from the substrate 31, and a mass block 34 arranged at a side of the diaphragm 32 away from the back plate 33. The mass block 34 is made of the same material as the substrate 31, and the bone conduction MEMS chip 3 further comprises a connecting column 35 connecting the mass block 34 to the side of the diaphragm 32 away from the back plate 33, which can be a whole structure or multiple.

[0026] The bone conduction MEMS chip 3 comprises a substrate 31 with a cavity 310, a diaphragm 32 supported on the substrate 31, and a back plate 33 arranged at a side of the diaphragm 32 away from the substrate 31, and a mass block 34 arranged at a side of the diaphragm 32 away from the back plate 33. The mass block 34 is made of the same material as the substrate 31, and the bone conduction MEMS chip 3 further comprises a connecting column 35 connecting the mass block 34 to the side of the diaphragm 32 away from the back plate 33, which can be a whole structure or multiple.

[0027] The diaphragm 32 and the back plate 33 form a first cavity 36 therebetween, the diaphragm 32 and the substrate 31 and the substrate 1 form a second cavity 37 therebetween, and the back plate 33 and the shell 2 and the substrate 31 and the substrate 1 form a third cavity 38 therebetween. In the embodiment, the diaphragm 32 and the back plate 33 are complete and air-tight structures to seal the first cavity 36, and the first cavity 36 is arranged as a low-pressure area lower than the atmospheric pressure, so that the damping between the diaphragm 32 and the back plate 33 is reduced, and the performance of the bone conduction packaging structure 100 is improved.

[0028] Please refer to Fig. 4, the bone conduction packaging structure 100a provided by the second embodiment of the utility model, the difference between the second embodiment and the first embodiment lies in, in the second embodiment, the diaphragm 32a is equipped with first air hole 322a, first air hole 322a links together first cavity 36a with second cavity 37a, second cavity 37a is also further arranged as low-pressure area lower than the atmospheric pressure, so that the damping between the diaphragm 32a and the back plate 33a is reduced, and the performance of the bone conduction packaging structure 100a is improved.

[0029] Please refer to Figure 5, the third embodiment of the utility model provides the bone conduction encapsulation structure 100b, the difference between the third embodiment and the first embodiment lies in, the second air hole 332b of the back plate 33b is equipped with in the third embodiment, the second air hole 332b is connected with the first cavity 36b and the third cavity 38b, the third cavity 38b is also further set as the low pressure area lower than the atmospheric pressure, so setting can reduce the damping between the diaphragm 32b and the back plate 33b, improved the performance of bone conduction encapsulation structure 100b.

[0030] Please refer to Figure 6, the fourth embodiment of the utility model provides the bone conduction encapsulation structure 100c, the difference between the fourth embodiment and the first embodiment lies in, the first air hole 322c of the diaphragm 32c is equipped with in the fourth embodiment, the first air hole 322c is connected with the first cavity 36c and the second cavity 37c, the second air hole 332c of the back plate 33c is equipped with, the second air hole 332c is connected with the first cavity 36c and the third cavity 38c, in this way, the first cavity 36c, the second cavity 37c and the third cavity 38 together are connected, the second cavity 37c is also further set as the low pressure area lower than the atmospheric pressure, the third cavity 38c is also further set as the low pressure area lower than the atmospheric pressure, so setting can reduce the damping between the diaphragm 32c and the back plate 33c, improved the performance of bone conduction encapsulation structure 100c.

[0031] Compared with the related art, the bone conduction encapsulation structure provided by the utility model, the bone conduction encapsulation structure includes: a substrate, a shell forming a containing space with the substrate, a bone conduction MEMS chip and an ASIC chip arranged in the containing space, the bone conduction MEMS chip includes a substrate with a cavity, a diaphragm supported on the substrate, and a back plate arranged apart from the diaphragm away from the substrate, a first cavity is formed between the diaphragm and the back plate, a second cavity is formed between the diaphragm and the substrate and the substrate, and a third cavity is formed between the back plate and the shell, the substrate and the substrate, the first cavity is set as a low pressure area lower than the atmospheric pressure. The bone conduction encapsulation structure of the utility model does not additionally set the vibration piece and the mass block to detect the air pressure change, but directly detects the air pressure change through the MEMS chip, which reduces the volume of the bone conduction encapsulation structure, and at the same time, the area between the diaphragm and the back plate is set as a low pressure area to reduce the damping between the diaphragm and the back plate, thereby improving the performance of the bone conduction encapsulation structure.

[0032] The above-mentioned is only the embodiment of the utility model, it should be pointed out here that, for ordinary skilled person in the art, under the premise of not departing from the creative concept of the utility model, improvement can be made, but these all belong to the protection scope of the utility model.

Claims

1. A bone conduction package structure, the bone conduction package structure comprising: A substrate, a shell forming a containing space with the substrate, a bone conduction MEMS chip and an ASIC chip arranged in the containing space, the bone conduction MEMS chip comprising a substrate with a cavity, a diaphragm supported on the substrate, and a back plate arranged apart from the diaphragm away from the substrate, characterized in that a first cavity is formed between the diaphragm and the back plate, a second cavity is formed between the diaphragm and the substrate, a third cavity is formed between the back plate and the shell, the substrate, and the substrate, and the first cavity is arranged as a low-pressure area lower than atmospheric pressure.

2. The bone conduction package structure of claim 1, wherein, Both the diaphragm and the back plate are complete and air-tight structures.

3. The bone conduction package structure of claim 1, wherein, The diaphragm is provided with a first air hole, and the first air hole communicates the first cavity with the second cavity, and the second cavity is arranged as a low-pressure area lower than atmospheric pressure.

4. The bone conduction package structure of claim 1, wherein, The back plate is provided with a second air hole, and the second air hole communicates the first cavity with the third cavity, and the third cavity is arranged as a low-pressure area lower than atmospheric pressure.

5. The bone conduction package structure of claim 1, wherein, The diaphragm is provided with a first air hole, and the first air hole communicates the first cavity with the second cavity, and the second cavity is arranged as a low-pressure area lower than atmospheric pressure, and the back plate is provided with a second air hole, and the second air hole communicates the first cavity with the third cavity, and the third cavity is arranged as a low-pressure area lower than atmospheric pressure.

6. The bone conduction package structure of claim 1, wherein, The diaphragm is provided with a first air hole, and the first air hole communicates the first cavity with the second cavity, and the second cavity is arranged as a low-pressure area lower than atmospheric pressure, and the back plate is provided with a second air hole, and the second air hole communicates the first cavity with the third cavity, and the third cavity is arranged as a low-pressure area lower than atmospheric pressure.

7. The bone conduction package structure of claim 6, wherein, The diaphragm is provided with a first air hole, and the first air hole communicates the first cavity with the second cavity, and the second cavity is arranged as a low-pressure area lower than atmospheric pressure, and the back plate is provided with a second air hole, and the second air hole communicates the first cavity with the third cavity, and the third cavity is arranged as a low-pressure area lower than atmospheric pressure.

8. The bone conduction package structure of claim 1, wherein, The diaphragm is provided with a first air hole, and the first air hole communicates the first cavity with the second cavity, and the second cavity is arranged as a low-pressure area lower than atmospheric pressure, and the back plate is provided with a second air hole, and the second air hole communicates the first cavity with the third cavity, and the third cavity is arranged as a low-pressure area lower than atmospheric pressure. The diaphragm is provided with a first air hole, and the first air hole communicates the first cavity with the second cavity, and the second cavity is arranged as a low-pressure area lower than atmospheric pressure, and the back plate is provided with a second air hole, and the second air hole communicates the first cavity with the third cavity, and the third cavity is arranged as a low-pressure area lower than atmospheric pressure. The diaphragm is provided with a first air hole, and the first air hole communicates the first cavity with the second cavity, and the second cavity is arranged as a low-pressure area lower than atmospheric pressure, and the back plate is provided with a second air hole, and the second air hole communicates the first cavity with the third cavity, and the third cavity is arranged as a low-pressure area lower than atmospheric pressure. The diaphragm is provided with a first air hole, and the first air hole communicates the first cavity with the second cavity, and the second cavity is arranged as a low-pressure area lower than atmospheric pressure, and the back plate is provided with a second air hole, and the second air hole communicates the first cavity with the third cavity, and the third cavity is arranged as a low-pressure area lower than atmospheric pressure. The diaphragm is provided with a first air hole, and the first air hole communicates the first cavity with the second cavity, and the second cavity is arranged as a low-pressure area lower than atmospheric pressure, and the back plate is provided with a second air hole, and the second air hole communicates the first cavity with the third cavity, and the third cavity is arranged as a low-pressure area lower than atmospheric pressure. The diaphragm is provided with a first air hole, and the first air hole communicates the first cavity with the second cavity, and the second cavity is arranged as a low-pressure area lower than atmospheric pressure, and the back plate is provided with

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