Vibration-isolated support

Abstract

The present invention relates to a support arrangement for an optical imaging device for microlithography, in particular for use with light in the extreme UV range (EUV), the support arrangement comprising at least one optical unit (108.1), a support structure (108.2), and a support device (108.3), the at least one optical unit (108.1) comprising at least one optical element of the imaging device (101). The support device (108.3) generates a supporting force which counteracts the gravitational force and by means of which the optical unit (108.1) is supported on the support structure (108.2). The support device (108.3) comprises at least one vibration isolation device (108.4) by means of which an at least substantially vibration-isolated connection between the optical unit (108.1) and the support structure (108.2) is achieved. The vibration isolation device (108.4) comprises a diamagnetic device (108.5), the diamagnetic device (108.5) being designed to generate at least a diamagnetic portion of the supporting force by means of a diamagnetic effect. The diamagnetic portion of the supporting force is 90% to 100%, preferably 95% to 100%, more preferably 99% to 100%, of the weight of the optical unit (108.1).

Description

[0001] VIBRATION DECOUPLED SUPPORT

[0002] CROSS-REFERENCE TO RELATED REGISTRATIONS

[0003] This application claims priority pursuant to 35 USC §119 of German patent application No. 102024 205205.1, filed on June 6, 2024, the entire contents of which are hereby incorporated by reference.

[0004] BACKGROUND OF THE INVENTION

[0005] The present invention relates to a support arrangement or a method for supporting an optical unit for an optical imaging device for microlithography, which is suitable for the use of UV light, in particular light in the extreme ultraviolet (EUV) range. The invention further relates to an optical imaging device with such a support arrangement. The invention can be used in conjunction with any optical imaging process. It is particularly advantageous for use in the manufacture or inspection of microelectronic circuits and the optical components used therefor (for example, optical masks).

[0006] Typically, the optical systems used in the fabrication of such microelectronic circuits comprise a variety of optical element modules, including optical elements such as lenses, mirrors, gratings, etc., arranged in the path of light. These optical elements usually work together in an exposure process to illuminate a pattern formed on a mask, reticulum, or the like, and transfer an image of this pattern onto a substrate such as a wafer. The optical elements are commonly grouped into one or more functionally distinct optical element groups, which may be contained within different optical element units.

[0007] The ongoing miniaturization of semiconductor devices leads to a constantly growing need for higher resolution in the optical systems used to manufacture these devices. This need for higher resolution necessitates increased numerical aperture (NA) and imaging accuracy in the optical systems.

[0008] One approach to achieving increased optical resolution is to reduce the wavelength of the light used in the imaging process. In recent years, there has been a significant focus on developing systems that utilize light in the so-called extreme ultraviolet (EUV) range, typically at wavelengths from 5 nm to 20 nm, and in most cases at around 13 nm. In this EUV range, it is no longer possible to use conventional refractive optical systems. This is because the materials used for refractive optical systems in this EUV range have an absorption coefficient that is too high to achieve acceptable imaging results with the available light power. Consequently, reflective optical systems must be used for imaging in this EUV range.

[0009] This transition to purely reflective optical systems with high numerical aperture (e.g. NA > 0.4 to 0.5) in the EUV range leads to significant challenges with regard to the design of the imaging device.

[0010] The factors mentioned above lead to very strict requirements regarding the position and / or orientation of the optical elements involved in the imaging process, relative to each other, as well as regarding the deformation of the individual optical elements, in order to achieve the desired imaging accuracy. Furthermore, it is necessary to maintain this high imaging accuracy throughout the entire operating period, ultimately over the system's lifetime.

[0011] Consequently, the components of the optical imaging system (e.g., the optical elements of the illumination system, the mask, the optical elements of the projection system, and the substrate), which interact during imaging, must be supported in a well-defined manner to maintain a predetermined, well-defined spatial relationship between these components and to minimize unwanted deformation of these components, ultimately achieving the highest possible image quality. Accordingly, considerable effort must be invested in the vibration-isolated support of the optical elements to keep them as free as possible from vibrations and parasitic stresses, which could otherwise lead to unwanted misalignment and deformation of the optical elements.A common challenge is that the optical systems, especially the optical elements, are subject to vibrations transmitted through their support structure. For this reason, the optical units of the imaging system are typically supported by vibration isolation devices, which are designed to decouple vibrations from the support structure.

[0012] The problem here is that the accuracy requirements increase continuously with the ongoing miniaturization of the circuits to be produced, meaning that the degree of vibration decoupling achievable with currently existing decoupling systems is no longer sufficient. Such decoupling systems are often constructed from mechanical springs that are subject to internal dynamic effects (such as effects resulting from the occurrence of harmonics at the resonant frequency).

[0013] BRIEF SUMMARY OF THE INVENTION

[0014] The invention is therefore based on the objective of providing a support arrangement for an imaging device for microlithography, a corresponding optical imaging device, a method for supporting an optical unit of such an imaging device, and an optical imaging method, which does not have the aforementioned disadvantages or at least to a lesser extent, and in particular enables improved vibration decoupling of the optical components.

[0015] The invention solves this problem with the features of the independent claims.

[0016] The invention is based on the technical teaching that improved vibration decoupling is achieved when at least a large portion of the weight force, in particular 90% to 100% of the weight force, of the at least one optical unit is absorbed or compensated contactlessly by means of a diamagnetic effect. By utilizing a diamagnetic effect, it is advantageously possible to avoid the unfavorable internal dynamic effects of conventional decoupling springs. Thus, the at least largely purely magnetic coupling can be considered a perfect, albeit potentially non-linear, spring. It is understood that, if necessary, the components of the support device must be designed with sufficient rigidity.In any case, it can be achieved that the optical unit with the vibration decoupling according to the invention behaves (at least in the area of ​​a linearized operating point) as if it were supported by an ideal spring decoupling without imaging performance-limiting internal dynamic effects of the springs themselves.

[0017] This also significantly reduces disturbances in system performance caused by the superposition of natural oscillations of several coupled optical units (so-called multi-frame resonances, which can occur in conventional systems, especially at higher-order resonance frequencies).

[0018] Furthermore, it is possible in a relatively simple way, for example by specifically configuring appropriate permanent magnet assemblies of the support device, to detune the resonance frequency of the diamagnetic vibration decoupling accordingly and to adapt it specifically to the respective application.

[0019] According to one aspect, the invention therefore relates to a support arrangement for an optical imaging device for microlithography, in particular for the use of light in the extreme ultraviolet (EUV) range, comprising at least one optical unit, a support structure, and a support device, wherein the at least one optical unit includes at least one optical element of the imaging device. The support device generates a support force that counteracts the force of gravity and by means of which the optical unit is supported on the support structure. The support device includes at least one vibration isolation device by means of which at least a substantial degree of vibration decoupling between the optical unit and the support structure is achieved.The vibration isolation device comprises a diamagnetic element, wherein the diamagnetic element is configured to achieve at least a diamagnetic component of the support force by means of a diamagnetic effect. The diamagnetic component of the support force is 90% to 100%, preferably 95% to 100%, and more preferably 99% to 100%, of the weight of the optical unit.

[0020] The diamagnetic device can generate the diamagnetic component of the supporting force between the optical unit and the support structure in any suitable non-contact manner, wherein its non-contacting components can be connected to the optical unit on one side and to the support structure on the other in any suitable manner. In preferred, simpler versions, the diamagnetic device comprises at least one first magnetic component and at least one second magnetic component, wherein one of the at least one first and second magnetic component is arranged on the support structure, while the other of the at least one first and second magnetic component is arranged on the at least one optical unit. The at least one first magnetic component is then associated with the at least one second magnetic component to generate the diamagnetic component of the supporting force.

[0021] Preferably, the at least one first magnetic component comprises at least one diamagnetic material, wherein the following variants can then be advantageously implemented individually or in any combination. For example, the at least one diamagnetic material can be a material from a diamagnetic material group, wherein the diamagnetic material group consists of yttrium barium copper oxide (YBaCuO or YBCO), bismuth strontium calcium copper oxide (BSCCO), in particular Bi₂₁₂ (Bi₂Sr₂CaCu₂₀s) or Bi₂₂₂₃ (Bi₂Sr₂Ca₂Cu₃₀s), niobium tin (NbaSn), niobium titanium (NbTi), and combinations thereof. Likewise, the at least one diamagnetic material can be a superconducting material, in particular a high-temperature superconducting material. The latter has the advantage of being easier to cool. Liquid nitrogen (N) can usually be used, which is relatively easy to handle and relatively inexpensive.It can be further advantageous if the at least one diamagnetic material is a superconducting material having a transition temperature of 80 K to 120 K, preferably 85 K to 115 K, and more preferably 90 K to 110 K. The transition temperature is then sufficiently above the boiling point of liquid nitrogen (N₂), so that the latter can be used easily for cooling. It can also be advantageous if the at least one diamagnetic material is a superconducting material having a transition temperature of 6 K to 30 K, preferably 8 K to 25 K, and more preferably 10 K to 20 K. The transition temperature is then sufficiently above the boiling point of liquid helium (He), so that the latter can be used easily for cooling.

[0022] In certain advantageous embodiments, the at least one diamagnetic material of the at least one first magnetic component is a superconducting material arranged in a superconducting section of the first magnetic component, and the at least one first magnetic component comprises at least one cooling device, wherein the following embodiments can then be advantageously implemented individually or in any combination. For example, it can be provided that this at least one first magnetic component is arranged on the support structure. This has the advantage, for instance, that the thermal influence from the cooling or measures to minimize this influence can initially be essentially limited to the support structure. In particular, the impact on an undesirable, thermally induced deformation of the associated optical unit can be kept as low as possible.This effect can be achieved particularly when, in certain variants, at least one cooling device is arranged on the side of the first magnetic component facing away from the second magnetic component. It can be especially advantageous if the at least one cooling device is arranged on the side of the superconductor section facing away from the second magnetic component. However, the cooling device can also extend on both sides of the superconductor section or, if necessary, surround it completely or partially. It can be particularly advantageous if a thermal shield is arranged between the cooling device of the first magnetic component and the second magnetic component in order to minimize the thermal influence of the cooling on the optical unit.

[0023] It can be particularly advantageous if the at least one first magnetic component comprises at least one diamagnetic magnetic element made of the at least one diamagnetic material in a simple manner, whereby the following variants can then be advantageously implemented individually or in any combination. For example, the at least one diamagnetic magnetic element can be arranged between the at least one cooling device and the second magnetic component. This also allows the thermal influence of the cooling on the optical unit to be kept to a minimum. The same is possible if, in certain variants, a thermal shielding device is arranged between the at least one diamagnetic magnetic element and the second magnetic component, wherein the at least one diamagnetic magnetic element is arranged, in particular, between the at least one cooling device and the thermal shielding device.

[0024] The cooling system can be designed in any suitable way; in particular, it can be single- or multi-stage and / or based on any suitable operating principles to achieve, for example, reliable cooling below the transition temperature of a superconducting material used. In certain variants, the at least one cooling device is configured to use at least one liquid coolant for cooling the first magnetic component, whereby the following variants can then be advantageously implemented individually or in any combination.The at least one liquid coolant can have a boiling point where the transition temperature of the superconducting material is above the boiling point of the at least one liquid coolant, in particular by at least 3 K to 110 K, preferably 10 K to 40 K, and more preferably 12 K to 35 K. This ensures sufficient cooling to a temperature that allows for reliable use of the diamagnetic effect. The at least one liquid coolant can, in principle, be any suitable medium that enables appropriate cooling. Preferably, it is a medium from a group of coolants, wherein the group of coolants consists of helium (He), nitrogen (N), and combinations thereof.

[0025] The counterpart to the diamagnetic material of the first magnetic component can be any passive or active magnetic unit that generates a corresponding magnetic field. In preferred, particularly simple, variants, the at least one second magnetic component comprises at least one permanent magnetic material, wherein the following variants can then be advantageously implemented individually or in any combination. Thus, the at least one permanent magnetic material can, in principle, be any suitable material. Preferably, it is a material from a group of permanent magnetic materials, wherein the group of permanent magnetic materials consists of samarium-cobalt (SmCo), in particular SmCos or Sm₂Co₆₇, a neodymium compound, in particular neodymium-iron-boron (NdFeB), in particular Nd₂Fe₄B, aluminum-nickel-cobalt (A₄Co₇), and combinations thereof.This allows for particularly advantageous configurations. In principle, a single magnet unit made of at least one permanent magnetic material may suffice. Likewise, it is possible for the at least one second magnet component to comprise several magnet units made of the same permanent magnetic material, wherein the magnet units are arranged, in particular, with differing polarities and / or in a Hallbach array configuration. This results in particularly advantageous configurations with exceptionally high support forces.

[0026] In principle, a single second magnetic component can suffice to achieve the desired support force. However, it can be particularly advantageous to provide a plurality N of second magnetic components in order to easily achieve a distribution of the support force adapted to the application, especially the mass distribution of the optical unit. The following variants can then be advantageously implemented individually or in any combination. The plurality N can have the value 3 to 10, preferably 3 to 8, and more preferably 3 to 5, which may allow for a particularly simple or cost-effective distribution of the support force. Each second magnetic component can be assigned to its own first magnetic component.Similarly, several of the second magnetic components, in particular all second magnetic components, can be assigned to a common first magnetic component, which can simplify the design of the first magnetic component or reduce the effort required to implement the first magnetic component.

[0027] In certain variants, it can be advantageous if the support structure includes at least one damping device for damping vibrations between the at least one optical unit and the support structure, whereby the following variants can then be advantageously implemented individually or in any combination. In principle, any suitable vibration damping can be provided, which, for example, acts via mechanical or internal friction. Preferably, the damping device is designed for contactless damping of vibrations between the at least one optical unit and the support structure in order to introduce as few parasitic disturbances as possible into the vibration system of the decoupling.

[0028] Any suitable non-contact passive and / or active damping mechanisms can be used. Particularly simple designs result when the damping device comprises at least one first damping unit arranged on the at least one optical unit and a second damping unit arranged on the support structure, wherein the first and second damping units are designed to interact non-contact by generating eddy currents which dampen vibrations between the at least one optical unit and the support structure.

[0029] It can be particularly advantageous if the damping device comprises at least a first damping unit, which includes a metal, in particular copper (Cu), and a second damping unit, which includes a damping magnet unit. The first and second damping units are then configured to interact without contact, generating eddy currents in the first damping unit, which dampen vibrations between the at least one optical unit and the support structure.

[0030] In certain variants, it can be advantageous if the support structure includes at least one position control device for adjusting a relative position between the at least one optical unit and the support structure and / or a reference structure in at least one degree of freedom up to all six degrees of freedom in space, whereby the following variants can then be advantageously implemented individually or in any combination. For example, the position control device can be configured to adjust a relative position and / or a relative orientation between the at least one optical unit and the support structure and / or the reference structure in at least one degree of freedom, in order to achieve a suitable active adjustment and thus advantageously reduce the imaging error in degrees of freedom that are particularly relevant to the imaging error of the imaging device.The actuating force can, in principle, be generated in any suitable way. It is particularly advantageous if the position control device for contactless adjustment of the relative position is designed in at least one degree of freedom, in order to introduce as few parasitic disturbances as possible into the decoupling vibration system.

[0031] In certain variants, the position control device comprises at least one non-contact actuator, in particular a Lorentz actuator, which allows for particularly simple and cost-effective configurations. It is preferred that an active part of the actuator is arranged on the support structure in order to minimize the thermal effects on the optical unit.

[0032] In certain variants, the position control device includes at least one detection device for sensing the relative position between the at least one optical unit and the support structure and / or a reference structure in the at least one degree of freedom, in order to enable simple position control via the position control device. The detection device is preferably designed for non-contact detection of the relative position in order to introduce as few parasitic disturbances as possible into the vibration system of the decoupling.

[0033] In certain variants, the at least one optical unit has at least one interference-sensitive imaging component that is susceptible to disturbances caused by magnetic fields. In these cases, the support device can preferably be arranged and designed such that any disturbance of the at least one interference-sensitive imaging component by the magnetic field of the support device is below a value that leads to a non-negligible imaging error of the imaging device. In certain variants, a magnetic shielding device can be arranged between the support device and the at least one interference-sensitive imaging component. All these variants (individually or in combination) make it possible to keep any image-error-relevant magnetic disturbance caused by the support device as low as possible.

[0034] The present invention further relates to an optical imaging device, particularly for microlithography, comprising an illumination device with a first optical element group, an object device for receiving an object, a projection device with a second optical element group, and an image device, wherein the illumination device is configured for illuminating the object and the projection device is configured for projecting an image of the object onto the image device. The illumination device and / or the projection device comprises at least one support arrangement according to the invention. The variants and advantages described above can thus be realized to the same extent, so reference is made to the above descriptions in this respect.

[0035] The at least one optical unit can comprise at least one optical element of the first optical element group, in particular the entire first optical element group. Additionally or alternatively, the at least one optical unit can comprise at least one optical element of the second optical element group, in particular the entire second optical element group. It is therefore possible, for example, to support the entire first and / or second optical element group via a suitable support device. Likewise, the respective optical elements of the lighting device and / or the projection device can also be supported individually and / or in groups via suitable support devices.

[0036] The present invention further relates to a method for supporting at least one optical unit of an optical imaging device for microlithography, particularly for the use of light in the extreme ultraviolet (EUV) range, wherein the at least one optical unit is supported on a support structure, the at least one optical unit comprising at least one optical element of the imaging device. A support force is generated which counteracts the force of gravity and by means of which the optical unit is supported on the support structure. This achieves at least a substantial degree of vibration decoupling between the optical unit and the support structure.For vibration decoupling, at least a diamagnetic component of the support force is achieved by means of a diamagnetic effect, wherein the diamagnetic component of the support force amounts to 90% to 100%, preferably 95% to 100%, and more preferably 99% to 100%, of the weight of the optical unit. The variants and advantages described above can thus be realized to the same extent, so reference is made to the above explanations in this respect.

[0037] In certain variants, at least one first magnetic component and at least one second magnetic component are assigned to each other to generate the diamagnetic part of the supporting force. A superconducting material, in particular a high-temperature superconducting material, can be used for the at least one first magnetic component. Likewise, at least one permanent magnetic material can be used for the at least one second magnetic component.

[0038] Finally, the present invention relates to an optical imaging method, particularly for microlithography, in which an illumination device comprising a first optical element group illuminates an object, and a projection device comprising a second optical element group projects an image of the object onto an image display. In normal operation, at least one optical unit of the illumination device and / or at least one optical unit of the projection device is supported by a method according to the invention. The variants and advantages described above can be realized to the same extent with this method, so reference is made to the above explanations in this respect.

[0039] Further aspects and embodiments of the invention will become apparent from the dependent claims and the following description of preferred embodiments, which refers to the accompanying figures. All combinations of the disclosed features, regardless of whether they are the subject of a claim or not, are within the scope of protection of the invention.

[0040] BRIEF DESCRIPTION OF THE DRAWINGS

[0041] Figure 1 is a schematic representation of a preferred embodiment of a projection exposure system according to the invention, in which a preferred embodiment of the support arrangement according to the invention is used.

[0042] Figure 2 is a schematic view of a preferred embodiment of the support arrangement according to the invention, as it can be used in Figure 1. Figure 3 is a schematic view of another variant of the support arrangement from Figure 2.

[0043] Figure 4 is a schematic view of another variant of the support arrangement from Figure 2.

[0044] DETAILED DESCRIPTION OF THE INVENTION

[0045] In the following, a preferred embodiment of a projection exposure system 101 for microlithography according to the invention is described with reference to Figures 1 to 4. This embodiment includes a preferred embodiment of a control arrangement according to the invention. To simplify the following explanations, an x,y,z coordinate system is shown in the drawings, wherein the z-direction is parallel to the direction of the gravitational force. The x-direction and the y-direction are accordingly horizontal, with the x-direction in Figure 1 extending perpendicularly into the plane of the drawing. Of course, in further embodiments, it is possible to choose any orientation of the x,y,z coordinate system that deviates from this.

[0046] The following section describes, by way of example, the essential components of a projection exposure system 101, with reference to Figure 1. The description of the basic structure of the projection exposure system 101 and its components is not intended to be restrictive.

[0047] A lighting device or lighting system 102 of the projection exposure system 101 comprises, in addition to a radiation source 102.1, an optical element group in the form of a lighting optic 102.2 for illuminating an object field 103.1 (schematically represented). The object field 103.1 lies in an object plane 103.2 of an object device 103. A reticle 103.3 (also referred to as a mask) arranged in the object field 103.1 is illuminated. The reticle 103.3 is held by a reticle holder 103.4. The reticle holder 103.4 can be moved, in particular in one or more scanning directions, by means of a reticle displacement drive 103.5. In this example, one such scanning direction runs parallel to the y-axis. The projection exposure system 101 further comprises a projection device 104 with another optical element group in the form of a projection optic 104.1. The projection optic 104.1 serves to image the object field 103.1 into a (schematically represented) image field 105.1, which lies in an image plane 105.2 of an image device 105. The image plane 105.2 runs parallel to the object plane 103.2. Alternatively, an angle other than 0° between the object plane 103.2 and the image plane 105.2 is also possible.

[0048] During exposure, a structure of the reticulum 103.3 is imaged onto a photosensitive layer of a substrate in the form of a wafer 105.3, the photosensitive layer being located in the image plane 105.2 within the image field 105.1. The wafer 105.3 is held by a substrate holder or wafer holder 105.4. The wafer holder 105.4 can be displaced, particularly along the y-direction, by means of a wafer transfer drive 105.5. The displacement of the reticulum 103.3 via the reticulum transfer drive 103.5 and of the wafer 105.3 via the wafer transfer drive 105.5 can be synchronized. This synchronization can be achieved, for example, via a common control device 106 (shown only schematically in Figure 1 without control paths).

[0049] Radiation source 102.1 is an EU radiation source (extreme ultraviolet radiation). Specifically, radiation source 102.1 emits EU radiation 107, which is also referred to as useful radiation or illumination radiation. This useful radiation has a wavelength in the range between 5 nm and 30 nm, particularly a wavelength of approximately 13 nm. Radiation source 102.1 may be a plasma source, for example, an LPP source (laser-produced plasma) or a DPP source (gas-discharged produced plasma). It may also be a synchrotron-based radiation source. Alternatively, radiation source 102.1 may be a free-electron laser (FEL).

[0050] Since the projection exposure system 101 operates with useful light in the EUV range, the optical elements used are exclusively reflective optical elements. In further embodiments of the invention, it is of course also possible (particularly depending on the wavelength of the illumination light) to use any type of optical element (refractive, reflective, diffractive) alone or in any combination. The illumination radiation 107, which originates from the radiation source 102.1, is focused by a collector 102.3. The collector 102.3 can be a collector with one or more ellipsoidal and / or hyperboloid reflective surfaces. The at least one reflective surface of the collector 102.Collector 3 can be illuminated with the illuminating radiation 107 at grazing incidence (Gl), i.e., with angles of incidence greater than 45°, or at normal incidence (NI), i.e., with angles of incidence less than 45°. Collector 11 can be structured and / or coated to optimize its reflectivity for the useful radiation and to suppress stray light.

[0051] After the collector 102.3, the illumination radiation 107 propagates through an intermediate focus in an intermediate focal plane 107.1. In certain variants, the intermediate focal plane 107.1 can represent a separation between the illumination optics 102.2 and a radiation source module 102.4, which includes the radiation source 102.1 and the collector 102.3.

[0052] The illumination optics 102.2 comprise a deflecting mirror 102.5 and a downstream first faceted mirror 102.6 along the beam path. The deflecting mirror 102.5 can be a planar deflecting mirror or, alternatively, a mirror with an effect that influences the beam shape beyond mere deflection. Alternatively or additionally, the deflecting mirror 102.5 can be designed as a spectral filter that at least partially removes so-called stray light from the illumination radiation 107, the wavelength of which deviates from the useful light wavelength. If the optically effective surfaces of the first faceted mirror 102.6 are arranged in the region of a plane of the illumination optics 102.2 that is optically conjugate to the object plane 103.2 as a field plane, the first faceted mirror 102.6 is also referred to as a field faceted mirror. The first faceted mirror 102.6 comprises a plurality of individual first facets 102.7, which are also referred to as field facets in the following. These first facets and their optical surfaces are only indicated schematically in Figure 1 by the dashed contour 102.7.

[0053] The first facets 102.7 can be configured as macroscopic facets, in particular as rectangular facets or as facets with an arcuate or semicircular edge contour. The first facets 102.7 can be configured as facets with a planar or, alternatively, with a convex or concave curved optical surface. As is known, for example, from DE 102008 009600 A1 (whose entire disclosure is included herein by reference), the first facets 102.7 themselves can each also be composed of a plurality of individual mirrors, in particular a plurality of micromirrors. The first facet mirror 102.6 can, in particular, be configured as a microelectromechanical system (MEMS system), as is described in detail, for example, in DE 102008 009600 A1.

[0054] Between the collector 102.3 and the deflecting mirror 102.5, the illumination radiation 107 in this example runs horizontally, i.e., along the y-direction. However, it is understood that a different orientation may be chosen in other variants.

[0055] In the beam path of the illumination optics 102.2, a second faceted mirror 102.8 is arranged downstream of the first faceted mirror 102.6. If the optically effective surfaces of the second faceted mirror 102.8 are located in the region of a pupil plane of the illumination optics 102.2, the second faceted mirror 102.8 is also referred to as a pupil faceted mirror. The second faceted mirror 102.8 can also be arranged at a distance from a pupil plane of the illumination optics 102.2. In this case, the combination of the first faceted mirror 102.6 and the second faceted mirror 102.8 is also referred to as a specular reflector. Such specular reflectors are known, for example, from US 2006 / 0132747 A1, EP 1 614 008 B1 or US 6,573,978 (the entire disclosures of which are incorporated herein by reference).

[0056] The second faceted mirror 102.8 comprises a plurality of second facets, which are only indicated schematically in Figure 1 by the dashed contour 102.9. In the case of a pupil faceted mirror, the second facets 102.9 are also referred to as pupil facets. The second facets 102.9 can, in principle, be designed like the first facets 102.7. In particular, the second facets 102.9 can also be macroscopic facets, which may, for example, have round, rectangular, or hexagonal borders. Alternatively, the second facets 102.9 can be composed of micromirrors. The second facets 102.9 can, in turn, have planar or, alternatively, convexly or concavely curved reflective surfaces. In this regard, reference is again made to DE 102008 009 600 A1.

[0057] In the present example, the illumination optics 102.2 thus form a double-faceted system. This basic principle is also known as a fly's eye integrator. In certain variants, it can also be advantageous not to arrange the optical surfaces of the second faceted mirror 102.8 exactly in a plane that is optically conjugate to a pupil plane of the projection optics 104.1.

[0058] In another embodiment of the illumination optics 102.2, not shown, a (highly schematic) transmission optics 102.10 can be arranged in the beam path between the second facet mirror 102.8 and the object field 103.1. This transmission optics 102.10 contributes in particular to imaging the first facets 102.7 into the object field 103.1. The transmission optics 102.10 can have exactly one mirror, or alternatively two or more mirrors, arranged one behind the other in the beam path of the illumination optics 102.2. The transmission optics 102.10 can, in particular, comprise one or two mirrors for normal incidence (Nl mirrors) and / or one or two mirrors for grazing incidence (Gl mirrors).

[0059] In the embodiment shown in Figure 1, the illumination optics 102.2 has exactly three mirrors after the collector 102.3: the deflecting mirror 102.5, the first faceted mirror 102.6 (e.g., a field faceted mirror), and the second faceted mirror 102.8 (e.g., a pupil faceted mirror). In another embodiment of the illumination optics 102.2, the deflecting mirror 102.5 can be omitted, so that the illumination optics 102.2 can then have exactly two mirrors after the collector 102.3: the first faceted mirror 102.6 and the second faceted mirror 102.8.

[0060] With the aid of the second faceted mirror 102.8, the individual first facets 102.7 are imaged onto the object field 103.1. The second faceted mirror 102.8 is the last beam-shaping, or indeed the last, mirror for the illumination radiation 107 in the beam path before the object field 103.1. The imaging of the first facets 102.7 onto the object plane 103.2 by means of the second facets 102.9, or with the second facets 102.9 and a transmission optic 102.10, is regularly only an approximation.

[0061] The projection optics 104.1 comprise a plurality of mirrors Mi, which are numbered according to their arrangement along the beam path of the projection exposure unit 101. In the example shown in Figure 1, the projection optics 104.1 comprises six mirrors M1 to M6. Alternatives with four, eight, ten, twelve, or any other number of mirrors Mi are also possible. The penultimate mirror M5 and the last mirror M6 can each have a (not shown) aperture for the illumination radiation 107. In this example, the projection optics 104.1 is a double-obscured optic. The projection optics 104.1 has an image-side numerical aperture NA greater than 0.5. In particular, the image-side numerical aperture NA can also be greater than 0.6. For example, the image-side numerical aperture NA can be 0.7 or 0.75.

[0062] The reflective surfaces of the mirrors Mi can be designed as freeform surfaces without an axis of rotational symmetry. Alternatively, the reflective surfaces of the mirrors Mi can be designed as aspherical surfaces with exactly one axis of rotational symmetry of the reflective surface shape. The mirrors Mi, like the mirrors of the illumination optics 102.2, can have highly reflective coatings for the illumination radiation 107. These coatings can be composed of several layers (multilayer coatings), in particular they can be designed with alternating layers of molybdenum and silicon.

[0063] In the present example, the projection optics 104.1 have a large object-image offset in the y-direction between a y-coordinate of the center of the object field 103.1 and a y-coordinate of the center of the image field 105.1. This object-image offset in the y-direction can be approximately as large as the distance between the object plane 103.2 and the image plane 105.2 in the z-direction.

[0064] The projection optics 104.1 can be anamorphic. In particular, they have different image scales βx, βy in the x and y directions. The two image scales βx, βy of the projection optics 104.1 are preferably (βx; βy) = (+ / - 0.25; + / - 0.125). A positive image scale β indicates an image without image inversion. A negative value for the image scale β indicates an image with image inversion. In the present example, the projection optics 104.1 thus results in a reduction ratio of 4:1 in the x direction, i.e., in the direction perpendicular to the scan direction. In contrast, the projection optics 104.1 results in a reduction ratio of 8:1 in the y direction, i.e., in the scan direction. Other image scales are also possible. It is also possible to have the same sign and absolute scales in the x and y directions, for example with absolute values ​​of 0.125 or 0.25.

[0065] The number of intermediate image planes in the x- and y-directions in the beam path between the object field 103.1 and the image field 105.1 can be the same. Likewise, the number of intermediate image planes can vary depending on the design of the projection optics 104.1. Examples of projection optics with different numbers of such intermediate images in the x- and y-directions are known, for example, from US 2018 / 0074303 A1 (whose entire disclosure is incorporated herein by reference).

[0066] In the present example, each of the pupil facets 102.9 is assigned to exactly one of the field facets 102.7 to form an illumination channel for illuminating the object field 103.1. This can result, in particular, in illumination according to Köhler's principle. The far field is divided into a multitude of object fields 103.1 by means of the field facets 102.7. The field facets 102.7 generate a plurality of images of the intermediate focus on the pupil facets 102.9 assigned to them.

[0067] The field facets 102.7 are each imaged onto the reticulum 103.3 by an associated pupil facet 102.9, with the images overlapping, resulting in superimposed illumination of the object field 103.1. The illumination of the object field 103.1 is preferably as homogeneous as possible. It preferably exhibits a uniformity error of less than 2%. Field uniformity can be achieved by superimposing different illumination channels.

[0068] The illumination of the entrance pupil of the projection optics 104.1 can be geometrically defined by the arrangement of the pupil facets 102.9. By selecting the illumination channels, in particular the subset of pupil facets 102.9 that guide light, the intensity distribution in the entrance pupil of the projection optics 104.1 can be adjusted. This intensity distribution is also referred to as the illumination setting of the illumination system 102. A preferred pupil uniformity in the area of ​​defined illuminated sections of an illumination pupil of the illumination optics 102.2 can also be achieved by redistributing the illumination channels. For actively adjustable facets, the aforementioned settings can be made by means of appropriate control via the control unit 106.

[0069] Further aspects and details of the illumination of the object field 103.1 and, in particular, the entrance pupil of the projection optics 104.1 are described below.

[0070] The projection optics 104.1 can, in particular, have a homocentric entrance pupil. This pupil can be accessible or inaccessible. The entrance pupil of the projection optics 104.1 often cannot be illuminated exactly by the pupil facet mirror 102.8. When the projection optics 104.1 projects the center of the pupil facet mirror 102.8 telecentrically onto the wafer 105.3, the aperture rays often do not intersect at a single point. However, a surface can be found where the pairwise determined separation of the aperture rays is minimized. This surface represents the entrance pupil or a surface conjugate to it in real space. In particular, this surface exhibits a finite curvature.

[0071] In certain variants, the projection optics 104.1 may have different entrance pupil positions for the tangential and sagittal beam paths. In this case, it is preferred to provide an imaging optical element, in particular an optical component of the transmission optics 102.10, between the second faceted mirror 102.8 and the reticle 103.3. This imaging optical element allows the different positions of the tangential and sagittal entrance pupils to be taken into account.

[0072] In the arrangement of the components of the illumination optics 102.2 as shown in Figure 1, the optical surfaces of the pupil facet mirror 102.8 are arranged in a plane conjugate to the entrance pupil of the projection optics 104.1. The first facet mirror 102.6 (field facet mirror) defines a first principal plane of extension of its optical surfaces, which in this example is tilted relative to the object plane 5. This first principal plane of extension of the first facet mirror 102.6 is, in this example, tilted relative to a second principal plane of extension defined by the optical surface of the deflecting mirror 102.5. The first principal plane of extension of the first facet mirror 102.6 is, in this example, further tilted relative to a third principal plane of extension defined by the optical surfaces of the second facet mirror 102.8.

[0073] As explained below with reference to the projection optics 104.1 and Figures 2 to 4, in the present example a support arrangement 108 is implemented in which an optical unit 108.1, formed by the projection optics 104.1, achieves improved vibration decoupling from vibrations. Such vibrations can be introduced via the associated support structure 108.2, on which the optical unit 108.1 is supported by means of a support device 108.3.

[0074] The improved vibration decoupling is achieved by absorbing or compensating at least a large portion of the weight force G acting on the projection optics 104.1 as the optical unit 108.1 without contact, using a diamagnetic effect. It can be advantageous if 90% to 100% of the weight force G is absorbed or compensated by the support structure 108.3 using a diamagnetic effect. By utilizing a diamagnetic effect, the unfavorable internal dynamic effects of conventional decoupling springs can be advantageously avoided. Thus, the largely purely magnetic coupling can be considered a perfect, albeit potentially non-linear, spring. It is understood that, if necessary, a sufficiently rigid design of the components of the support structure 108.3, the adjacent parts of the optical unit 108.1, and the support structure 108.3 is required.2. In any case, it can be achieved that the optical unit 108.1 with the vibration decoupling according to the invention behaves (at least in the region of a linearized operating point) as if it were supported by an ideal spring decoupling without image-performance-limiting internal dynamic effects of the springs themselves.

[0075] The support device 108.3 generates a support force FS by which the optical unit 108.1 is supported on the support structure 108.2. In this example, the support force FS is composed of several partial support forces. The support force FS counteracts the weight force G acting on the optical unit 108.1.

[0076] In this example, the support device 108.3 comprises a vibration isolation device 108.4, which provides at least extensive vibration decoupling between the optical unit 108.1 and the support structure 108.2. The vibration isolation device 108.4 includes a diamagnetic element 108.5 configured to generate at least a diamagnetic component FSD of the support force FS by means of a diamagnetic effect. The diamagnetic component FSD of the support force is 90% to 100% of the weight force of the optical unit 108.1. In preferred embodiments, the diamagnetic component FSD of the support force is 95% to 100%, and more preferably 99% to 100%, of the weight force G of the optical unit 108.1.

[0077] In the present example, the diamagnetic device 108.5 comprises several magnet groups 108.6, each with a first magnet component 108.7 and a second magnet component 108.8. The magnet groups 108.6 are described below using one magnet group 108.6 as an example. It should be understood that, if necessary, a single, appropriately designed magnet group 108.6 may suffice.

[0078] In the present example, the first magnetic component is 108.7 of the respective

[0079] Magnet group 108.6 is arranged on the support structure 108.2, while the associated second

[0080] Magnetic component 108.8 of the magnet group 108.6 is arranged on the optical unit 108.1. The magnetic components 108.7 and 108.8 of the magnet group 108.6 each generate (depending on the design, identical or different) diamagnetic partial support forces FSDT, which together produce the diamagnetic part FSD of the support force FS.

[0081] In the present example, the entire weight force G of the optical unit 108.1 is absorbed by the diamagnetic partial support forces FSDT; thus, 100% of the support force FS is generated diamagnetically. However, it is understood that other variants may have a different design. For example, as will be explained below, additional components may be provided that absorb a specific, smaller portion of the weight force G of the optical unit 108.1.

[0082] In the present example, the first magnetic component 108.7 comprises at least one diamagnetic material, wherein the at least one diamagnetic material can be a material from a diamagnetic material group consisting of yttrium barium copper oxide (YBaCuO or YBCO), bismuth strontium calcium copper oxide (BSCCO), in particular Bi₂₂₁₂ (Bi₂Sr₂CaCu₂₀s) and / or Bi₂₂₂₃ (Bi₂Sr₂Ca₂Cu₃₀s), niobium tin (NbaSn), niobium titanium (NbTi), and combinations thereof. In the present example, the at least one diamagnetic material is a superconducting material, preferably a high-temperature superconducting material. The latter has the advantage of being easier to cool. Liquid nitrogen (N₂) can usually be used for this purpose, which is relatively easy to handle and relatively inexpensive.It can also be advantageous if the superconducting material has a transition temperature TSP of 80 K to 120 K, preferably 85 K to 115 K, and more preferably 90 K to 110 K. The transition temperature TSP is then sufficiently above the boiling point of liquid nitrogen, so that the latter can be easily used for cooling.

[0083] In the present example, the superconducting material is arranged in a superconducting section 108.9 of the first magnetic component 108.7, the first magnetic component 108.7 further comprising a cooling device 108.10. Since the first magnetic component 108.7 is arranged on the support structure 108.2 in the present example, the thermal influence from the cooling of the cooling device 108.10, or measures to minimize this influence, can advantageously be limited primarily to the support structure 108.2. In particular, the influence on an undesirable, thermally induced deformation of the optical unit 108.1 can be kept as low as possible. This effect is also achieved in the present example by arranging the cooling device 108.10 on a side of the first magnetic component 108.7 facing away from the second magnetic component 108.8. In the present example, the cooling device 108.The cooling device 108.10 is arranged on the side of the superconductor section 108.9 facing away from the second magnetic component 108.8. However, it is understood that in other variants the cooling device 108.10 can also extend on both sides of the superconductor section 108.9 or may even surround it completely or partially. It can be particularly advantageous if a thermal shielding device is arranged between the cooling device 108.10 and the second magnetic component 108.8 (as indicated by the dashed contour 109 in Figures 2 to 4) in order to minimize the thermal influence of the cooling on the optical unit 108.1.

[0084] In the present example, the superconducting section 108.9 of the first magnetic component 108.7 is formed in a simple manner by at least one diamagnetic magnetic element made of the at least one diamagnetic material, such that the diamagnetic magnetic element 108.9 is arranged between the cooling device 108.10 and the second magnetic component 108.8.

[0085] The cooling system 108.10 can, in principle, be designed in any suitable way; in particular, it can be single- or multi-stage and / or based on any suitable operating principles to achieve, for example, reliable cooling below the transition temperature TS of the superconducting material used. In the present example, the cooling system 108.10 is configured to circulate a liquid coolant for cooling the first magnetic component 108.7 through one or more cooling channels 108.12 of the support structure 108.2 by means of a pumping device 108.11 (shown only schematically in Figures 2 to 4).

[0086] The liquid coolant preferably has a boiling point TSI, wherein the transition temperature TSP of the superconducting material is above the boiling point TSI of the coolant (i.e., TSP > TSI). It is preferred if the transition temperature TSP is at least 3 K to 110 K, preferably 10 K to 40 K, and more preferably 12 K to 35 K, above the boiling point TSI of the liquid coolant. This ensures sufficient cooling to a temperature that allows for reliable use of the diamagnetic effect. The liquid coolant can, in principle, be any suitable medium that enables appropriate cooling. Preferably, it is a medium from a group of coolants, wherein the

[0087] The coolant group consists of helium (He), nitrogen (N) and combinations thereof.

[0088] The counterpart to the diamagnetic material of the first magnetic component 108.7 can be any passive or active magnetic unit that generates a corresponding magnetic field. In the present example, the respective second magnetic component 108.8 comprises at least one permanent magnetic material, wherein the at least one permanent magnetic material can, in principle, be any suitable material. Preferably, the permanent magnetic material is a material from a group of permanent magnetic materials consisting of samrium-cobalt (SmCo), in particular SmCos or S₂Gon, a neodymium compound, in particular neodymium-iron-boron (NdFeB), in particular Nd₂Fe₄B, aluminum-nickel-cobalt (AINiCo), and combinations thereof. Particularly advantageous configurations can be achieved with these materials.

[0089] In principle, a single magnet unit made of at least one permanent magnetic material may suffice to form the respective second magnet component 108.8. Likewise, it may be provided that one or more of the second magnet components 108.8 comprise several magnet units made of the permanent magnetic material. It may be advantageous if the magnet units of the respective second magnet component 108.8 are arranged with differing polarities and / or are arranged in the manner of a Hal Ibach array. This results in particularly favorable configurations with especially high support forces.

[0090] In principle, a single second magnetic component 108.8 can suffice to achieve the desired support force. However, it can be particularly advantageous to provide a plurality N of second magnetic components 108.8 in order to easily achieve a distribution of the support force adapted to the application, in particular the mass distribution of the optical unit 108.1. The plurality N can have the value 3 to 10, preferably 3 to 8, and more preferably 3 to 5, which may allow for a particularly simple or favorable distribution of the support force. Each second magnetic component 108.8 can be assigned to its own first magnetic component 108.7, as in the present example. Likewise, several of the second magnetic components 108.8, in particular all second magnetic components, can be assigned to a common first magnetic component 108.7 (not shown in the figures), which simplifies the design of the first magnetic component 108.7 or reduces the effort required to implement it. The lateral guidance of the optical unit 108.1 transverse to the direction of the weight force G (i.e., in the xy-plane in Figures 2 to 4) can, in principle, be achieved in any suitable manner. Any suitable devices that provide the corresponding guidance can be used for this purpose. It is, of course, also preferred to generate this guidance without contact in order not to impair vibration decoupling. In the present example, the lateral guidance of the optical unit 108.1 is generated by guide magnet units 108.13, which comprise guide magnet elements assigned to each other in pairs on the optical unit 108.1 and the support structure 108.2.

[0091] In certain variants of the support arrangement 108, it may be advantageous if the support device 108.3 includes a damping device 108.14 for damping vibrations between the optical unit 108.1 and the support structure 108.2, as shown in Figure 3. Unless otherwise specified below, the support arrangement 108 is otherwise identical to the support arrangement 108 shown in Figure 2.

[0092] In principle, any suitable vibration damping can be provided, for example, via mechanical or internal friction. Preferably, the damping device 108.14 is designed, as in the present example, for contactless damping of vibrations between the optical unit 108.1 and the support structure 108.2 in order to introduce as few parasitic disturbances as possible into the vibration system of the decoupling.

[0093] Any suitable non-contact passive and / or active damping mechanisms can be used. In the present example, a particularly simple design is achieved by the damping device 108.14 comprising one or more damping groups 108.15. Each damping group 108.15 comprises a first damping unit 108.16 arranged on the optical unit 108.1 and a second damping unit 108.17 arranged on the support structure 108.2, wherein the damping units 108.16 and 108.17 are configured to interact non-contact by generating eddy currents that dampen vibrations between the optical unit 108.1 and the support structure 108.2.

[0094] It can be particularly advantageous if the first damping unit 108.16, as in the present example, comprises a metal, in particular copper (Cu), preferably high-purity copper, while the second damping unit 108.17 comprises a damping magnet unit. The damping units 108.16 and 108.17 are then configured to interact without contact, generating eddy currents in the first damping unit 108.16, which dampen vibrations between the optical unit 108.1 and the support structure 108.2. For this purpose, the first damping unit 108.16, as in the present example, can be rod-shaped or sword-shaped and extend into a gap formed on the second damping unit 108.17, in which a corresponding damping magnetic field is established.

[0095] In certain variants, it can be advantageous if the support device 108.3 includes a position control device 108.18 for setting a relative position between the optical unit 108.1 and the support structure 108.2 in at least one degree of freedom up to all six degrees of freedom in space, as shown in Figure 4. Unless otherwise specified below, the support arrangement 108 is otherwise identical to the support arrangement 108 from Figure 2. In particular, a combination with the damping device 108.14 from Figure 3 may be provided.

[0096] In the present example, the position control device 108.18 can be configured in at least one degree of freedom to set a relative position and / or a relative orientation between the optical unit 108.1 and the support structure 108.2 and / or a reference structure 108.19. This allows for suitable active adjustment of the optical unit 108.1 in degrees of freedom that are particularly relevant to the imaging error of the imaging device 101, thereby advantageously reducing the imaging error. The actuating force for the active adjustment of the optical unit

[0097] The position control device 108.18 can, in principle, be generated in any suitable way. It is particularly advantageous if the position control device 108.18 is designed for contactless adjustment of the relative position in at least one degree of freedom, in order to introduce as few parasitic disturbances as possible into the decoupling vibration system.

[0098] In the present example, the position control device 108.18 comprises one or more non-contact actuators 108.20, in particular one or more Lorentz actuators, thus realizing a particularly simple and cost-effective configuration. It is preferred that an active part 108.21 of the actuator 108.20 is attached to the support structure.

[0099] The optical unit 108.1 is arranged in 108.2 to minimize thermal influences on the optical unit 108.1. In the present example, the position control device 108.18 further comprises a detection device 108.22 for detecting the relative position between the optical unit 108.1 and the support structure 108.2 and / or the reference structure 108.19 in at least one degree of freedom, in order to enable simple position control via the position control device 108.18. The detection device 108.21 is preferably designed for contactless detection of the relative position in order to introduce as few parasitic disturbances as possible into the vibration system of the decoupling.

[0100] Any suitable sensing unit can be used to detect the relative position. For example, optical and / or capacitive sensors 108.23 can be used. Motion or acceleration sensors 108.24 can also be used. The sensors 108.23 and 108.24 then transmit their sensor signals to the control unit 106, which then controls the actuators 108.20 and, if applicable, the cooling unit 108.10 accordingly.

[0101] In the examples described above, the optical unit 108.1 comprises one or more interference-sensitive imaging components that are sensitive to disturbances caused by magnetic fields. In the present example, the support device 108.3 is therefore arranged and designed such that any disturbance of the at least one interference-sensitive imaging component by the magnetic field of the support device 108.3 is below a value that would lead to a non-negligible imaging error of the imaging device 101.

[0102] In certain variants, a magnetic shielding device can be arranged between the support device 108.3 and the relevant interference-sensitive imaging component, as indicated by the dashed contour 110 in Figure 2. All these variants (individually or in combination) make it possible to keep imaging-error-relevant magnetic interference from the support device 108.3 as low as possible.

[0103] The present invention has been described above exclusively with reference to the example of the optical unit 108.1 in the form of the projection optics 104.1. However, it is understood that the invention can be applied in connection with the illumination optics 102.2 and / or with individual optical elements or subgroups of the optical elements of the illumination optics 102.2 and / or the projection optics 104.1.

[0104] The present invention has been described above exclusively with reference to examples from the field of microlithography. However, it is understood that the invention can also be used in connection with any other optical applications, in particular imaging techniques at other wavelengths, where similar problems arise with regard to vibration isolation.

[0105] Furthermore, the invention can be used in connection with the inspection of objects, such as mask inspection, in which the masks used for microlithography are examined for their integrity, etc. In Figure 1, for example, a sensor unit replaces the wafer 105.1, capturing the image of the projection pattern of the reticle 104.1 (for further processing). This mask inspection can then be performed essentially at the same wavelength used in the subsequent microlithography process. However, any other wavelength can also be used for the inspection.

[0106] The present invention has been described above with reference to specific embodiments, which demonstrate concrete combinations of the features defined in the following claims. It should be expressly noted here that the subject matter of the present invention is not limited to these combinations of features, but also includes all other combinations of features as they arise from the following claims.

Claims

REQUIREMENTS 1. Support arrangement for an optical imaging device for microlithography, in particular for the use of light in the extreme ultraviolet (EUV) range, with - at least one optical unit (108.1), - a support structure (108.2) and - a support device (108.3), wherein - comprising at least one optical unit (108.1) or at least one optical element of the imaging device (101), - the support device (108.3) generates a support force which counteracts the weight force and by means of which the optical unit (108.1) is supported on the support structure (108.2), - the support device (108.3) at least a vibration isolation device (108.4) comprises, by means of which at least a far-reaching vibration decoupling between the optical unit (108.1) and the support structure (108.2) is realized, characterized in that - the vibration isolation device (108.4) a diamagnetic device (108.5) includes, - the diamagnetic device (108.5) is designed to achieve at least a diamagnetic part of the support force by means of a diamagnetic effect, wherein - the diamagnetic part of the support force is 90% to 100%, preferably 95% to 100%, more preferably 99% to 100%, of the weight force of the optical unit (108.1).

2. Support arrangement according to claim 1, wherein - the diamagnetic device (108.5) comprises at least a first magnetic component (108.7) and at least a second magnetic component (108.8), - one of which at least one first and second magnetic component (108.8) is arranged on the support structure (108.2), - the other of the at least one first and second magnetic component (108.8) is arranged on the at least one optical unit (108.1), and - which is assigned to at least one first magnetic component (108.7) of at least one second magnetic component (108.8) for generating the diamagnetic part of the support force.

3. Support arrangement according to claim 2, wherein - comprising at least one first magnetic component (108.7) comprising at least one diamagnetic material, wherein in particular at least one of the following holds: - the at least one diamagnetic material is a material from a diamagnetic material group, wherein the diamagnetic material group consists of yttrium barium copper oxide (YBaCuO or YBCO), bismuth strontium calcium copper oxide (BSCCO), in particular Bi2212 (Bi2Sr2CaCu20s) and / or Bi2223 (Bi2Sr2Ca2Cu30), niobium tin (NbaSn), niobium titanium (NbTi) and combinations thereof; - at least one diamagnetic material is a superconducting material, in particular a high-temperature superconducting material; - the at least one diamagnetic material is a superconducting material with a transition temperature of 80 K to 120 K, preferably 85 K to 115 K, more preferably 90 K to 110 K.

4. Support arrangement according to claim 3, wherein - that at least one diamagnetic material of the at least one first magnetic component (108.7) is a superconducting material arranged in a superconducting section (108.9) of the first magnetic component (108.7), and - comprising at least one first magnetic component (108.7) and at least one cooling device (108.10), wherein in particular at least one of the following applies: - at least one first magnetic component (108.7) is arranged on the support structure (108.2); - at least one cooling device (108.10) is located on the side of the first magnetic component facing away from the second magnetic component (108.8). (108.7) ordered; - at least one cooling device (108.10) is arranged on one side of the superconductor section (108.9) facing away from the second magnetic component (108.8); - a thermal shielding device (109) is arranged between the cooling device (108.10) of the first magnetic component (108.7) and the second magnetic component (108.8).

5. Support arrangement according to claim 4, wherein - comprising at least one first magnetic component (108.7) comprising at least one diamagnetic magnetic element (108.9) made of at least one diamagnetic material, wherein in particular at least one of the following holds: - the at least one diamagnetic magnetic element (108.9) is located between the at least one cooling device (108.10) and the second magnetic component (108.8) ordered; - a thermal shielding device is arranged between the at least one diamagnetic magnetic element (108.9) and the second magnetic component (108.8), wherein the at least one diamagnetic magnetic element (108.9) is arranged in particular between the at least one cooling device (108.10) and the thermal shielding device.

6. Support arrangement according to one of claims 4 to 5, wherein - the at least one cooling device (108.10) is configured to use at least one liquid coolant for cooling the first magnet component (108.7), wherein in particular at least one of the following applies: the at least one liquid coolant has a boiling point, wherein the transition temperature of the superconducting material is above the boiling point of the at least one liquid coolant is located, in particular by at least 3 K to 110 K, preferably 10 K to 40 K, more preferably 12 K to 35 K, above the boiling temperature of the at least one liquid coolant; - at least one liquid coolant is a refrigerant from a group of refrigerants, the group of which consists of helium (He), nitrogen (N) and combinations thereof; 7. Support arrangement according to one of claims 2 to 6, wherein - comprising at least one second magnetic component (108.8) comprising at least one permanent magnetic material, wherein in particular at least one of the following holds: - the at least one permanent magnetic material is a material from a permanent magnetic material group, wherein the permanent magnetic material group consists of samarium-cobalt (SmCo), in particular SmCos or Sm2Coi7, a neodymium compound, in particular neodymium-iron-boron (NdFeB), in particular Nd2Fei4B, aluminium-nickel-cobalt (AINiCo) and combinations thereof; - the at least one second magnetic component (108.8) comprises several magnetic units made of the at least one permanent magnetic material, wherein the magnetic units are in particular arranged with different polarizations and / or in the manner of a Hallbach array.

8. Support arrangement according to claim 7, wherein - a plurality N of second magnetic components (108.8) is provided, wherein in particular at least one of the following applies: - the plural N is the value 3 to 10, preferably 3 to 8, more preferably 3 to 5; - several of the second magnetic components (108.8), in particular all second magnetic components (108.8), are assigned to a common first magnetic component (108.7).

9. Support arrangement according to one of claims 1 to 8, wherein - the support device (108.3) comprises at least one damping device (108.14) for damping vibrations between the at least one optical unit (108.1) and the support structure (108.2), wherein in particular at least one of the following applies: - the damping device (108.14) is designed for contactless damping of vibrations between the at least one optical unit (108.1) and the support structure (108.2); - the damping device (108.14) comprises at least one first damping unit (108.16) arranged on the at least one optical unit (108.1) and a second damping unit (108.17) arranged on the support structure (108.2), wherein the first and second damping units (108.16, 108.17) are configured to interact without contact by generating eddy currents which dampen vibrations between the at least one optical unit (108.1) and the support structure (108.2); - the damping device (108.14) comprises at least a first damping unit (108.16) comprising a metal, in particular copper (Cu), and a second damping unit (108.17) comprising a damping magnet unit, wherein the first and second damping units (108.16, 108.17) are configured to interact without contact by generating eddy currents in the first damping unit (108.16), which dampen vibrations between the at least one optical unit (108.1) and the support structure (108.2).

10. Support arrangement according to any one of claims 1 to 9, wherein - the support device (108.3) comprises at least one position control device (108.18) for setting a relative position between the at least one optical unit (108.1) and the support structure (108.2) and / or a reference structure (108.19) in at least one degree of freedom up to all six degrees of freedom in space, wherein in particular at least one of the following applies: - the position control device (108.18) is designed for contactless adjustment of the relative position in at least one degree of freedom; - the position control device (108.18) comprises at least one non-contact actuator (108.20), in particular a Lorentz actuator, wherein an active part of the actuator is arranged in particular on the support structure (108.2). - the position control device (108.18) comprises at least one detection device (108.22) for detecting the relative position in the at least one degree of freedom, wherein the detection device (108.22) is designed in particular for non-contact detection of the relative position.

11. Support arrangement according to one of claims 1 to 10, wherein - comprising at least one optical unit (108.1) comprising at least one interference-sensitive imaging component which is sensitive to disturbances caused by magnetic fields, wherein at least one of the following applies: - the support device (108.3) is arranged and designed such that a disturbance of the at least one disturbance-sensitive imaging component by the magnetic field of the support device (108.3) is below a value that leads to a non-negligible imaging error of the imaging device; - a magnetic shielding device is arranged between the support device (108.3) and the at least one interference-sensitive imaging component.

12. Optical imaging device, especially for microlithography, with - a lighting device (102) with a first optical element group (102.2), - an object device (103) for receiving an object (103.3), - a projection device (104) with a second optical element group (104.1) and - a picture device (105) - the lighting device (102) is designed to illuminate the object (103.3) and - the projection device (104) is designed to project an image of the object (103.3) onto the image device (105), characterized by the fact that - the lighting device (102) and / or the projection device (104) comprises at least one support arrangement according to one of claims 1 to 11, wherein in particular at least one of the following applies: - the at least one optical unit (108.1) comprises at least one optical element of the first optical element group (102.2), in particular the entire first optical element group (102.2); - the at least one optical unit (108.1) comprises at least one optical element of the second optical element group (104.1), in particular the entire second optical element group (104.1).

13. Method for supporting at least one optical unit (108.1) of an optical imaging device for microlithography, in particular for the use of light in the extreme ultraviolet (EUV) range, wherein - the at least one optical unit (108.1) is supported on a support structure (108.2), wherein - comprising at least one optical unit (108.1) or at least one optical element (108) of the imaging device (101), - a supporting force is generated which counteracts the weight force and by means of which the optical unit (108.1) is supported on the support structure (108.2), - an at least extensive vibration decoupling between the optical unit (108.1) and the support structure (108.2) is realized, characterized in that - for vibration decoupling at least a diamagnetic part of the supporting force is achieved by means of a diamagnetic effect, wherein - the diamagnetic part of the support force is 90% to 100%, preferably 95% to 100%, more preferably 99% to 100%, of the weight force of the optical unit (108.1).

14. Method according to claim 13 - at least one first magnetic component (108.7) and at least one second magnetic component (108.8) are assigned to each other for generating the diamagnetic part of the support force, wherein in particular at least one of the following holds: - for at least one first magnetic component (108.7) a superconducting material, in particular a high-temperature superconducting material, is used; - for at least one second magnetic component (108.8) at least one permanent magnetic material is used.

15. Optical imaging method, especially for microlithography, in which - a lighting device (102) comprising a first optical element group (102.2), which illuminates an object (103.3) and - a projection device (104) comprising a second optical element group (104.1) that projects an image of the object (103.3) onto an image device (105), characterized in that - at least one optical unit (108.1) of the lighting device (102) and / or at least one optical unit (108.1) of the projection device (104) is supported in normal operation by a method according to one of claims 13 to 14. * * * * *

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