A pane for a vehicle having a connection element comprising a solder material layer

Abstract

The invention relates to a pane for a vehicle having an electrical connection element (30), the pane comprising a substrate (10) of glass and an electrically conductive structure (20) on a region of the substrate (10). The pane comprises a solder material layer (40) wherein the connection element (30) comprises a metal and is connected to subregions of the electrically conductive structure (20) so as to provide electrical transmission, said solder material layer containing lead in the range of 1-1000 ppm and carbon up to 5% by weight.

Description

[0001] A PANE FOR A VEHICLE HAVING A CONNECTION ELEMENT COMPRISING A SOLDER MATERIAL LAYER

[0002] TECHNICAL FIELD

[0003] The present invention relates to a pane comprising a glass connected to an electrical connection element and a method for producing the pane.

[0004] PRIOR ART

[0005] In the technical field, pane structures with an electrical connection element are used for vehicles having electrically conductive structures, such as heating conductors or antenna conductors. The electrically conductive structuresl are conventionally connected to the on-board electrical system via soldered electrical connection elements. Due to the different coefficients of thermal expansion of the materials used, mechanical stresses occur, which strain the panes and can cause breakage of the pane during manufacture and operation.

[0006] Lead-containing solders have high ductility that can compensate2 for the mechanical stresses occurring between an electrical connection element and the pane by plastic deformation. However, because of the End-of-Life Vehicles3 (ELV) Directive 2000 / 53 / EC, lead-containing solders within the EC must be replaced with reduced-lead solders. The directive is referred to, in summary, by the acronym ELV (End-of-Life Vehicles). The objective is to ban from products extremely problematic components resulting from the massive increase in disposable electronics.

[0007] EP2708091 B1 discloses a disc having at least one electrical connection element, comprising a substrate, an electrically conductive structure on a region of the substrate, and4 a connection element. The connection element comprises at least a chromium- containing steel and a layer of a solder material, which electrically connects the connection element to subregions of the electrically conductive structure. BRIEF DESCRIPTION OF THE INVENTION

[0008] The object of the invention is to provide a pane for a vehicle which has an electrical connection element and in which shining defects are prevented.

[0009] In order to achieve the aforementioned object, the invention relates to a pane for vehicles having an electrical connection element, comprising a substrate of glass and an electrically conductive structure on a region of the substrate. The pane comprises a layer of a solder material, wherein the connection element comprises an iron-containing steel and is connected to subregions of the electrically conductive structure so as to provide electrical transmission, said solder material layer containing lead in the range of 1 -1000 ppm and carbon up to 5% by weight. By this means, the connection element is soldered onto the substrate on the pane by virtue of the solder material layer. Thanks to the content of the solder material layer, shining defects on the pane are prevented and its mechanical properties are improved through the use of carbon.

[0010] In a preferred embodiment of the invention, the connection element comprises a solder material layer containing up to 3% carbon by weight. The mechanical and electrical properties of the solder material layer are therefore improved.

[0011] In a preferred embodiment of the invention, the carbon contained within the solder material layer is in the form of graphene. This also provide improved mechanical and electrical properties of the solder material layer.

[0012] In a preferred embodiment of the invention, the substrate comprises flat glass, quartz glass, borosilicate glass, or soda-lime glass. A glass with high structural strength is therefore obtained.

[0013] In a preferred embodiment of the invention, the difference between the coefficient of thermal expansion of the substrate and the coefficient of thermal expansion of the6 connection element is 5*10-6°C.7 Thus, the adhesion of the connection element onto the glass substrate is improved.

[0014] In a preferred embodiment of the invention, the connection element comprises 50%-89.5% iron, 10.5%-20% chromium, 0%-1 % carbon, 0%-5% nickel, 0%-2% manganese, 0%-2.5% molybdenum, and / or 0%-1% titanium by weight. By this means, a connection element with a long product life is used.

[0015] In a preferred embodiment of the invention, the connection element comprises 75%-84% iron, 16%-18.5% chromium, 0%-0.1% carbon, 0%-2% manganese, and / or 0%-1% titanium by weight. By this means, a connection element with a long product life is used.

[0016] In a preferred embodiment of the invention, the conductive structure comprises silver. By this means, an increase in electrical conductivity is achieved.

[0017] In a preferred embodiment of the invention, the thickness of the solder material layer is at most 10 microns. Thus, the adhesion of the connection element to the substrate is ensured and high structural strength is provided.

[0018] In a preferred embodiment of the invention, the solder material layer, containing lead in the range of 1-1000 ppm and carbon up to 5% by weight, comprises tin and bismuth, indium, zinc, copper, silver, lead, or combinations thereof. By this means, a solder material layer is obtained that prevents shining defects and adheres the electrical connection element to the substrate.

[0019] In a preferred embodiment of the invention, the solder material layer comprises a micronized metal. The tensile strength of the solder material layer is therefore increased.

[0020] In a preferred embodiment of the invention, the solder material layer comprises 38%-42% tin and 55%-58% bismuth, 0.1 %-1 % silver, and 0.1%-3% carbon by weight, and 1-1000 ppm lead. Such a solder material layer prevents shining defects and adheres the electrical connection element to the substrate. In a preferred embodiment of the invention, the D50 particle distribution size of the solder material layer is in the range of 10 to 45 pm. This allows the solder material to exhibit good fluidity, thus ensuring better coverage between the connection elements and the conductive surfaces during soldering.

[0021] In a preferred embodiment of the invention, the connection element is coated with nickel, tin, copper, and / or silver, in particular coated with 0.1 pm to 0.3 pm of nickel and / or 3 pm to 20 pm in thickness of silver. Thus, it improves the current-carrying capacity and corrosion stability of the connection element.

[0022] In a preferred application of the invention, the method comprises the process steps of applying the solder material as a layer (platelet) with a fixed layer thickness, volume, shape, and arrangement onto at least one contact surface of the connection element, applyingthe electrically conductive structure onto the substrate, placingthe connection element with the solder material onto the electrically conductive structure, and soldering the connection element to the electrically conductive structure. By this means, a pane with improved electrical and mechanical properties that prevents shining defects is obtained.

[0023] Another object of the invention is to provide a pane for a vehicle which has an electrical connection element and in which shining defects are prevented.

[0024] In order to achieve the above objective, the invention relates to a pane for a vehicle having an electrical connection element, comprising a substrate of glass and an electrically conductive structure on a region of the substrate. The pane is wherein the connection element comprises a metal, and the weight of a solder material layer, which connects to the sub-regions of the electrically conductive structure to provide electrical transmission and contains lead in the range of 0-1000 ppm and carbon up to 5% by weight, is at least 25 mg. By this means, the connection element is soldered onto the substrate on the pane by virtue of the solder material layer. Thanks to the content of the solder material layer, the shining defect of the pane is prevented and its mechanical properties are improved through its use within the specified weight range. In a preferred embodiment of the invention, the weight of the solder material layer is in the range of 30 to 50 mg for each connection leg of the connection element that contacts the conductive structure. This specified weight range of the solder material provides ideal thermal performance when applied to the substrate, preventing overheating and ensuring the longevity of the connection elements and the electrically conductive structure.

[0025] In a preferred embodiment of the invention, the thickness of the solder material layer is at least 10 microns. A thickness of 10 microns ensures that the solder material provides a reliable electrical connection between the connection elements and the electrically conductive structures.

[0026] In a preferred embodiment of the invention, the contact surface area of the connection element to which the solder material layer is applied is in the range of 20-30 mm2. This size of the contact surface area ensures sufficient electrical connection between the connection elements and the conductive structures and minimizes electrical resistance.

[0027] In a preferred embodiment of the invention, the soldering pull-off force of the solder material layer is at least 42 N. This degree of pull-off force indicates that the connection will be more resistant to physical stress and impacts, which increases the durability of the device.

[0028] In a preferred embodiment of the invention, the connection element comprises a solder material layer containing up to 3% carbon by weight. By this means, the mechanical and electrical properties of the solder material layer are improved.

[0029] In a preferred embodiment of the invention, the substrate comprises flat glass, quartz glass, borosilicate glass, or soda-lime glass. By this means, a glass with high structural strength is obtained.

[0030] In a preferred embodiment of the invention, the difference between the coefficient of thermal expansion of the substrate and the coefficient of thermal expansion of the8 connection element is 5*10-6°C.9 Thus, the adhesion of the connection element onto the glass substrate is improved.

[0031] In a preferred embodiment of the invention, the connection element comprises 50%-89.5% iron, 10.5%-20% chromium, 0%-1 % carbon, 0%-5% nickel, 0%-2% manganese, 0%-2.5% molybdenum, and / or 0%-1% titanium by weight. By this means, a connection element with a long product life is used.

[0032] In a preferred embodiment of the invention, the connection element (30) comprises 75%- 84% iron, 16%-18.5% chromium, 0%-0.1% carbon, 0%-2% manganese, and / or 0%-1% titanium by weight. By this means, a connection element with a long product life is used.

[0033] In a preferred embodiment of the invention, the solder material layer comprises tin and bismuth, indium, zinc, copper, silver, lead, or combinations thereof. By this means, a solder material layer is obtained that prevents shining defects and adheres the electrical connection element to the substrate.

[0034] In a preferred application of the invention, the method comprises the process steps of applying the solder material as a layer (platelet) with a fixed layer thickness, volume, shape, and arrangement onto at least one contact surface of the connection element, applyingthe electrically conductive structure onto the substrate, placingthe connection element with the solder material onto the electrically conductive structure, and soldering the connection element to the electrically conductive structure. By this means, a pane with improved electrical and mechanical properties that prevents shining defects is obtained.

[0035] In a preferred application of the invention, the process temperature for soldering the connection element to the conductive structure is at most 200 °C. By this means, sensitive substrates such as glass and other components mounted thereon are protected by soldering at a lower process temperature, which reduces the risk of deformation and damage that could be caused by thermal stress. In a preferred application of the invention, the viscosity value of the solder material layer before soldering is in the range of 150-250 Pa-s. This facilitates its application in the production steps. The solder is enabled to be spread on the application surface by an operator with any application apparatus.

[0036] BRIEF DESCRIPTION OF THE FIGURES

[0037] Figure 1 is a schematic view of the pane subject to the invention.

[0038] Figure 2 is a cross-sectional view of the pane subject to the invention.

[0039] DETAILED DESCRIPTION OF THE INVENTION

[0040] In this detailed description, the development subject to the invention is described with reference to examples for the sole purpose of better explaining the subject, without any limitation.

[0041] In Figure 1 , the pane subjectto the invention is shown schematically. The pane comprises a glass substrate (10) consisting of a 3-mm-thick thermally prestressed single-pane safety glass made of soda-lime glass. The width of the substrate (10) is 150 cm and its height is 80 cm. An electrically conductive structure (20) in the form of a heating conductor structure is printed on the glass substrate (10). The electrically conductive structure (20) contains silver particles and glass frits. In the edge region of the substrate (10), the conductive structure (20) is widened to a width of 10 mm and forms a contact surface for an electrical connection element (30). In the edge region of the substrate (10), there is also a covering serigraph (not shown). The connection element is coated with 0.1 pm to 0.3 pm of nickel and / or 3 pm to 20 pm of silver. Thus, the use of silver and / or nickel improves the current-carrying capacity and corrosion stability of the connection element. In the region of the contact surface between the electrical connection element (30) and the electrically conductive structure (20), a solder material layer (40) is applied, which provides a durable electrical and mechanical connection between the electrical connection element (30) and the electrically conductive structure (20). The solder material layer contains 38%-42% tin and 55%-58% bismuth, 0.1 %-1 % silver, and 0.1 %-3% carbon by weight, and 1-1000 ppm lead; in an exemplary structure, it contains 36.7% tin and 57.2% bismuth, 0.34% silver, and 3% carbon in the form of graphene and other additives. The solder material layer contains lead in an amount compliant with GADSL standards. The solder material layer (40) is arranged between the electrical connection element (30) and the electrically conductive structure (20) in a completely predefined volume and shape. The electrical connection element (30) has a coefficient of thermal expansion of 10.0*10-6°C, and the electrical connection element (30) is designed in the form of a bridge and has a width of 4 mm and a length of 24 mm. The solder material layer (40) comprises a micronized metal. The D50 particle distribution size of the solder material layer (40) is in the range of 10 to 45 pm. The solder material layer (40) has a viscosity of 150,000 - 250,000 CPS (150-250 Pa-s) according to the Malcolm PCU-205 method.

[0042] The electrical connection element comprises 75%-84% iron, 16%-18.5% chromium, 0%- 0.1% carbon, 0%-2% manganese, or 0%-1% titanium by weight, and other components.

[0043] Table 1

[0044] The table above shows the values by weight percentage of the solder material layer (40) of the pane used for a vehicle. The solder material layer (40) shown in Example 1 in Table 1 contains by weight percentage 38% tin, 58% bismuth, 0.1 % silver, 2% carbon in graphene form, 0.0004% copper, 0.0021 % calcium, 0.013% sodium, and at the ppm level, 50 ppm lead, 4 ppm magnesium, 28.6 ppm indium, and 4.21 ppm iron. The solder material layer in Example 1 was determined to maintain temperature values at the desired level during 10-minute and 20-minute holding periods according to the TL 82045: 2014-10 temperature test. In tests conducted for Example 3 to meet the necessary conditions for preventing the shining defect, the adhesion strength was determined to be 38.6 N.

[0045] The solder material layer (40) in Example 2 shown in Table 1 contains by weight percentage 39% tin, 56.2% bismuth, 0.289% silver, 3% carbon in graphene form, 0.0006% copper, 0.0054% calcium, 0.014% sodium, and at the ppm level, 50 ppm lead, 4 ppm magnesium, 28.6 ppm indium, and 4.21 ppm iron. The solder material layer in Example 2 was determined to maintain temperature values at the desired level during 10-minute and 20-minute holding periods accordingto the TL 82045: 2014-10 temperature test. In tests conducted for Example 3 to meet the necessary conditions for preventing the shining defect, the adhesion strength was determined to be 35 N.

[0046] The solder material layer (40) in Example 3 shown in Table 1 contains by weight percentage 36.7% tin, 57.2% bismuth, 0.34% silver, 3% carbon in graphene form, 0.0014% copper, 0.0022% calcium, 0.015% sodium, and at the ppm level, 20 ppm lead, 4 ppm magnesium, 28.6 ppm indium, and 4.21 ppm iron. The solder material layer in Example 3 was determined to maintain temperature values at the desired level during 10-minute and 20-minute holding periods accordingto the TL 82045: 2014-10 temperature test. In tests conducted for Example 3 to meet the necessary conditions for preventing the shining defect, the adhesion strength was determined to be 35.6 N. The solder material in Example 4 shown in Table 1 contains by weight percentage 41 % tin, 57% bismuth, 0.3% silver, 1 % Carbon (graphene), 0.0007% copper, 0.0034% calcium, 0.014% sodium, and at the ppm level, 20 ppm lead, 4 ppm magnesium, 28.6 ppm indium, and 4.21 ppm iron. The solder material layer in Example 4 was determined to maintain temperature values at the desired level during 10-minute and 20-minute holding periods accordingto the TL 82045: 2014-10 temperature test. In tests conducted for Example s to meet the necessary conditions for preventing the shining defect, the adhesion strength was determined to be 33.8 N.

[0047] The solder material in Example s shown in Table 1 contains by weight percentage 42% tin, 56% bismuth, 0.4% silver, 1 % Carbon (graphene), 0.0009% copper, 0.0044% calcium, 0.013% sodium, and at the ppm level, 20 ppm lead, 4 ppm magnesium, 28.6 ppm indium, and 4.21 ppm iron. The solder material layer in Example 3 was determined to maintain temperature values at the desired level during 10-minute and 20-minute holding periods accordingto the TL 82045: 2014-10 temperature test. In tests conducted for Example 5 to meet the necessary conditions for preventing the shining defect, the adhesion strength was determined to be 36.7 N.

[0048] An exemplary pane structure comprises a substrate (10) (thickness 3 mm, width 150 cm, and height 80 cm), and an electrically conductive structure (20) in the form of a heating conductor structure, situated between the electrical connection element (30) and the glass substrate (10) accordingto Figure 2. In Figure 1 , a silver layer and the solder material are located on the connection element (30). The material thickness of the connection element (30) is 0.8 mm. The width of the contact surface of the connection element (30) is 4 mm and its length is 4 mm. The solder material layer (40) was pre-applied in the form of a platelet with a fixed layer thickness, volume, and shape onto the contact surface of the connection element (30). The connection element (30) is soldered to the electrically conductive structure (20) with the solder material layer (40) applied on the connection element (30). The connection element (30) was soldered to the electrically conductive structure (20) at 140-200 °C and a processing time of 2 seconds. Due to the difference in the coefficient of thermal expansion between the connection element (30) and the glass substrate (10), as the glass substrate (10) shrinks during cooling after the soldering process, a micro-crack may occur on the application surface, causing reflection of incoming light from different angles, which leads to the formation of a shining defect. To prevent this shining defect, the soldering process is carried out at a temperature up to 200°C to keep the temperature change to a minimum during the cooling of the glass substrate (10) after the soldering process, thereby preventing the formation of microcracks caused by shrinkage. Outflow of the solder material (40) from the intermediate space between the electrical connection element (30) and the electrically conductive structure (20), which exceeds a layer thickness of 50 pm, was observed only up to a maximum outflow width of b=0.5 mm. The composition and alternative embodiments of the solder material layer (40) on the contact surfaces of the electrical connection element (30) are found in Table 1 above.

[0049] REFERENCE NUMBERS

[0050] 10 Substrate

[0051] 20 Conductive Structure

[0052] 30 Connection Element

[0053] 40 Solder Material Layer

Claims

CLAIMS1. A pane for a vehicle having an electrical connection element (30), the pane comprising a substrate (10) of glass and an electrically conductive structure (20) on a region of the substrate (10), characterized in that the connection element (30) comprises a metal, and the pane further comprises a solder material layer (40) containing lead in a range of 1 -1000 ppm and carbon up to 5% by weight, said layer connecting to subregions of the electrically conductive structure (20) so as to provide electrical transmission.

2. A pane according to Claim 1 , wherein the solder material layer (40) contains carbon up to 3% by weight.

3. A pane according to Claim 2, wherein the carbon contained within the solder material layer (40) is in the form of graphene.

4. A pane according to any one of the preceding claims, wherein the substrate (10) comprises flat glass, quartz glass, borosilicate glass, or soda-lime glass.

5. A pane according to any one of the preceding claims, wherein the difference between the coefficient of thermal expansion of the substrate (10) and the coefficient of thermal expansionl O of the connection element (30) is 5x10-6°C.

6. A pane according to any one of the preceding claims, wherein the connection element (30) comprises 50%-89.5% iron, 10.5%-20% chromium, 0%-1% carbon, 0%-5% nickel, 0%-2% manganese, 0%-2.5% molybdenum, and / or 0%-1% titanium by weight.

7. A pane according to Claim 6, wherein the connection element (30) comprises 75%-84% iron, 16%-18.5% chromium, 0%-0.1% carbon, 0%-2% manganese, and / or 0%-1 % titanium by weight.

8. A pane according to any one of the preceding claims, wherein the conductive structure (20) comprises silver.

9. A pane according to any one of the preceding claims, wherein the thickness of the solder material layer (40) is at most 10 microns.

10. A pane according to Claim 9, wherein the solder material layer (40), containing lead in a range of 1 -1000 ppm and carbon up to 5% by weight, comprises tin and bismuth, indium, zinc, copper, silver, or combinations thereof.11 . A pane according to Claim 10, wherein the solder material layer (40) comprises a micronized metal.

12. A pane according to Claims 10-1 1 , wherein the solder material layer (40) comprises 38%-42% tin and 55%-58% bismuth, 0.1 %-1 % silver, and 0.1%-3% carbon by weight, and 1 -1000 ppm lead.

13. A pane according to Claims 10-12, wherein the D50 particle distribution size of the solder material layer (40) is in the range of 10 to 45 pm.

14. A pane according to any one of the preceding claims, wherein the connection element (30) is coated with nickel, tin, copper, and / or silver, in particular coated with 0.1 pm to 0.3 pm of nickel and / or 3 pm to 20 pm in thickness of silver.

15. A method for producing a pane according to any one of the preceding claims, characterized by the steps of: applying the solder material (40) as a layer (platelet) with a fixed layer thickness, volume, shape, and arrangement onto at least one contact surface of the connection element (30), applying the electrically conductive structure (20) to the substrate (10), placing the connection element (30) with the solder material layer (40) onto the electrically conductive structure (20), and solderingthe connection element (30) to the electrically conductive structure

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