Cell production method and production apparatus, and cell

Abstract

Provided in the embodiments of the present application are a cell production method and production apparatus and a cell. The cell production method comprises the following steps: providing a silicon wafer; dispensing an adhesive onto a first surface and / or a second surface of the silicon wafer, wherein the first surface and the second surface are arranged opposite each other; arranging a solder ribbon on the silicon wafer, wherein the solder ribbon corresponds to the dispensing positions; performing a curing treatment on the dispensing positions so as to pre-fix the solder ribbon; and soldering the pre-fixed solder ribbon to the silicon wafer to form a cell. In the cell production method provided in the present application, the solder ribbon is fixed to the silicon wafer by means of bonding followed by soldering, thereby improving the connection strength between the solder ribbon and the silicon wafer, and preventing the risk of the solder ribbon being prone to detaching during the transfer process of the silicon wafer.

Description

Battery piece production method, production equipment and battery piece

[0001] The present application claims priority to the Chinese patent application No. 202421340901.0, filed on June 12, 2024, and entitled "Battery piece production equipment and battery piece", the content of which is incorporated herein by reference in its entirety.

[0002] The present application claims priority to the Chinese patent application No. 202421341615.6, filed on June 12, 2024, and entitled "Battery piece stringer", the content of which is incorporated herein by reference in its entirety.

[0003] The present application claims priority to the Chinese patent application No. 202411249016.6, filed on September 06, 2024, and entitled "Battery piece production method, production equipment and battery piece", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0004] Embodiments of the present application relate to the technical field of photovoltaic panel processing, and more particularly, to a battery piece production method, production equipment and battery piece. BACKGROUND

[0005] In the related art, the solder strip of the battery piece is fixed on the silicon wafer by the method of welding first and then dispensing. The solder strip is welded first, and the firmness of the welding is actually weak, and there is a risk of solder strip falling off during the process of handling and turning the silicon wafer.

[0006] Therefore, it is necessary to provide a new technical solution to solve the above technical problems. SUMMARY

[0007] The purpose of the present application is to provide a new technical solution of a battery piece production method, production equipment and battery piece.

[0008] In a first aspect, embodiments of the present application provide a battery piece production method. The battery piece production method comprises the following steps:

[0009] providing a silicon wafer;

[0010] dispensing on a first surface and / or a second surface of the silicon wafer to form a dispensing position; the first surface and the second surface are arranged opposite to each other;

[0011] arranging a solder strip on the silicon wafer, the solder strip corresponding to the dispensing position;

[0012] solidifying the dispensing position to pre-fix the solder strip;

[0013] The pre-fixed solder strip and the silicon wafer are welded to form a battery wafer.

[0014] Optionally, the providing the silicon wafer specifically comprises:

[0015] A set of silicon wafers is provided, the set of silicon wafers comprising a first silicon wafer and a second silicon wafer, a first surface of the first silicon wafer and a second surface of the second silicon wafer being in the same horizontal plane.

[0016] Optionally, the first surface of the first silicon wafer and the second surface of the second silicon wafer being in the same horizontal plane specifically comprises:

[0017] One of the first silicon wafer and the second silicon wafer is flipped by 180°, so that the first surface of the first silicon wafer and the second surface of the second silicon wafer are in the same horizontal plane.

[0018] Optionally, the dispensing glue on the first surface and the second surface of the silicon wafer specifically comprises:

[0019] The first surface of the silicon wafer is dispensed with glue first, and then the second surface of the silicon wafer is dispensed with glue.

[0020] Optionally, the dispensing glue on the first surface and the second surface of the silicon wafer specifically comprises:

[0021] The silicon wafer is placed on a dispensing platform, wherein the second surface of the silicon wafer is attached to the dispensing platform, and the long side of the silicon wafer extends along a first direction;

[0022] The first surface of the silicon wafer is dispensed with glue;

[0023] The silicon wafer dispensed with glue on one side is transferred from a first conveying line to a second conveying line, wherein the silicon wafer is transferred to the second conveying line, the long side of the silicon wafer extends along a second direction, and the first direction and the second direction are perpendicular;

[0024] The silicon wafer dispensed with glue on one side is transferred from the second conveying line to a third conveying line, wherein the silicon wafer is transferred to the third conveying line, the silicon wafer is flipped by 180°, so that the first surface of the silicon wafer is attached to the third conveying line;

[0025] The silicon wafer on the third conveying line is transferred to the dispensing platform, and the long side of the silicon wafer extends along the first direction;

[0026] The second surface of the silicon wafer is dispensed with glue.

[0027] Optionally, the first conveying line, the second conveying line and the third conveying line are each provided with a glue-avoiding tooling.

[0028] Optionally, the dispensing on the first surface and / or the second surface of the silicon wafer specifically comprises:

[0029] The dispensing sites are arranged in a rectangular array on the first surface and / or the second surface of the silicon wafer, and adjacent dispensing sites are arranged with a spacing.

[0030] Optionally, the arranging of the solder strip on the silicon wafer specifically comprises:

[0031] providing a solder strip with a preset length;

[0032] providing the solder strip with flux;

[0033] transferring the silicon wafer with completed dispensing to a solder strip arranging platform;

[0034] arranging the solder strip provided with flux on the surface with the dispensing sites.

[0035] Optionally, in the case that the first surface and the second surface of the silicon wafer both have dispensing sites, the arranging of the solder strip provided with flux on the surface with the dispensing sites specifically comprises:

[0036] firstly, laying the solder strip provided with flux on the solder strip arranging platform;

[0037] secondly, placing the silicon wafer on the solder strip arranging platform with the solder strip arranged thereon, the solder strip corresponding to the dispensing sites of one surface of the silicon wafer;

[0038] thirdly, cutting the solder strip at a preset position;

[0039] finally, arranging the cut solder strip on the other surface of the silicon wafer, the solder strip corresponding to the dispensing sites of the other surface of the silicon wafer.

[0040] Optionally, the transferring of the silicon wafer with completed dispensing to the solder strip arranging platform specifically comprises:

[0041] transferring the silicon wafer with completed dispensing from the dispensing platform to a fourth conveying line, and then transferring the silicon wafer through the fourth conveying line to a first preset position;

[0042] transferring the silicon wafer at the first preset position to the solder strip arranging platform.

[0043] Optionally, after the arranging of the solder strip provided with flux on the surface with the dispensing sites, further comprising:

[0044] placing a pressing net at the second preset position on the solder strip, and transferring the silicon wafer provided with the pressing net to a curing platform.

[0045] Optionally, the first preset position and the second preset position are arranged with a spacing along a second direction.

[0046] Optionally, the curing process on the dispensing position further comprises:

[0047] rotating the pressing net from the curing platform to the second preset position.

[0048] Optionally, welding the pre-fixed solder strip and the silicon wafer to form a battery piece specifically comprises:

[0049] carrying the silicon wafer from the curing platform to a welding platform;

[0050] a heating device located below the welding platform and a pressing head located above the welding platform cooperate to weld the pre-fixed solder strip and the silicon wafer.

[0051] In a second aspect, the embodiments of the present application further provide a battery piece production device. The battery piece production device is prepared by using the battery piece production method of the first aspect.

[0052] Optionally, the battery piece production device comprises:

[0053] a feeding device, the feeding device being configured to provide a silicon wafer;

[0054] a dispensing device, the dispensing device being configured to dispense on a first surface and / or a second surface of the silicon wafer;

[0055] a solder strip processing device, the solder strip processing device being configured to dispose a solder strip on the silicon wafer, the solder strip corresponding to the dispensing position;

[0056] a curing device, the curing device being configured to cure the dispensing position to pre-fix the solder strip;

[0057] a welding device, the welding device being configured to weld the pre-fixed solder strip and the silicon wafer to form a battery piece.

[0058] In a third aspect, the embodiments of the present application further provide a battery piece. The battery piece is prepared by using the battery piece production method of the first aspect.

[0059] According to the embodiments of the present application, the solder strip is fixed on the battery piece by using the method of screen printing and dispensing first and then welding, which avoids the risk that the solder strip is easily detached from the battery piece during the transfer process.

[0060] Other features and advantages of the present application will become apparent from the following detailed description of exemplary embodiments thereof, taken in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0061] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiments will be briefly introduced as follows. Obviously, the drawings in the following description only constitute some embodiments of the present application, and for those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0062] The accompanying drawings constituting a part of the specification illustrate the embodiments of the present specification, and are used to explain the principles of the present specification together with the description thereof.

[0063] Fig. 1 is a flow chart of a battery piece production method provided by the embodiments of the present application.

[0064] Fig. 2 is a frame diagram of a battery piece production device provided by the embodiments of the present application.

[0065] Fig. 3 is a battery piece production flow chart I provided by the embodiments of the present application.

[0066] Fig. 4 is a battery piece production flow chart II provided by the embodiments of the present application.

[0067] Fig. 5 is a battery piece production flow chart III provided by the embodiments of the present application.

[0068] Legend of reference signs: 60, feeding device; 61, first transfer device; 62, dispensing device; 621, dispensing platform; 622, first conveying line; 623, second conveying line; 624, third conveying line; 63, solder strip processing device; 631, solder strip pulling device; 632, solder strip laying platform; 633, six-axis robot; 634, fourth conveying line; A, first preset position; B, second preset position; 64, curing device; 641, curing platform; 642, fifth conveying line; 65, welding device. DETAILED DESCRIPTION

[0069] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. Note that the relative arrangement, numerical expressions, and numerical values of the components and steps set forth in these embodiments are not limiting to the scope of the present application unless otherwise specifically stated.

[0070] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way limiting to the scope of the application or its applications or uses.

[0071] Techniques and equipment known to those skilled in the relevant art can not be discussed in detail, but should be considered as part of the specification where appropriate.

[0072] In all of the examples shown and discussed herein, any specific values should be interpreted as merely exemplary and not as a limitation. Thus, other examples of the exemplary embodiments can have different values.

[0073] It should be noted that like reference numerals and letters refer to like items throughout the attached drawings, and as a result, once an item is defined in one drawing, it is not necessary to discuss it further in subsequent drawings.

[0074] At present, the connection mode of the solder strip and the silicon wafer is welding first and then bonding. If the solder strip is fixed by using the welding first and then bonding mode, the bonding force of welding is usually less than the bonding force of bonding. After the solder strip is welded, the solder strip may fall off in the subsequent wafer transfer process. In addition, if the welding first and then bonding mode is used, the bonding mode can only be realized by the dispensing machine dispensing mode. The dispensing position and the dispensing amount are not easy to control. As a result, the dispensing quality is uneven, which increases the overall thickness of the battery wafer to a certain extent.

[0075] Based on the above technical problems, the embodiment of the present application provides a battery wafer production method. Referring to FIG. 1, the battery wafer production method comprises the following steps:

[0076] S1: providing a silicon wafer;

[0077] S2: dispensing glue on a first surface and / or a second surface of the silicon wafer to form a dispensing position; the first surface and the second surface are arranged opposite to each other;

[0078] S3: arranging a solder strip on the silicon wafer, the solder strip corresponding to the dispensing position;

[0079] S4: curing the dispensing position to pre-fix the solder strip;

[0080] S5: welding the pre-fixed solder strip and the silicon wafer to form a battery wafer.

[0081] In the embodiment of the present application, a battery wafer production method is provided, which comprises steps S1-S5.

[0082] In step S1, the silicon wafer is mainly loaded to facilitate the normal progress of subsequent processes. During the loading of the silicon wafer, a single silicon wafer can be continuously loaded or a group of silicon wafers (at least two silicon wafers) can be continuously loaded.

[0083] The silicon wafer is the basic material of the solar cell. In this step, the bare board of the battery wafer, that is, the silicon wafer, is subjected to loading treatment. For example, the silicon wafer can be loaded by using a loading device 60.

[0084] In the process of battery piece production, two silicon wafers are often connected together by solder strips, so in this step, the two silicon wafers can be regarded as a group of silicon wafers, and the silicon wafers are fed in groups.

[0085] For example, in the process of battery piece production, two silicon wafers are often arranged in a positive-negative manner and connected together by solder strips. In this case, the feeding device 60 can include a turnover mechanism, which turns one of the two silicon wafers by 180°, so that when dispensing glue on a group of silicon wafers, the two silicon wafers are arranged in a positive-negative manner.

[0086] In a specific embodiment, step S1 specifically includes sub-step S10:

[0087] S10: providing a group of silicon wafers, the group of silicon wafers including a first silicon wafer and a second silicon wafer, a first surface of the first silicon wafer and a second surface of the second silicon wafer being arranged on the same horizontal plane.

[0088] In step S10, two silicon wafers are regarded as a group of silicon wafers, that is, when feeding the silicon wafers, the adjacent two silicon wafers are regarded as a group of silicon wafers and fed at the same time.

[0089] A group of silicon wafers includes a first silicon wafer and a second silicon wafer, and the first surface of the first silicon wafer (i.e. the front surface of the first silicon wafer) and the second surface of the second silicon wafer (i.e. the back surface of the second silicon wafer) are arranged on the same horizontal plane, i.e. the first silicon wafer and the second silicon wafer are arranged in a positive-negative manner, which is a preparation for the smooth progress of subsequent processing steps.

[0090] For example, to describe in more detail how to arrange the first surface of the first silicon wafer and the second surface of the second silicon wafer on the same horizontal plane, sub-step S101 is introduced. The following is an explanation for step S101:

[0091] S101: turning one of the first silicon wafer and the second silicon wafer by 180°, so that the first surface of the first silicon wafer and the second surface of the second silicon wafer are arranged on the same horizontal plane.

[0092] In step S101, a specific operation is taken: one of the first silicon wafer and the second silicon wafer is turned by 180°.

[0093] The purpose of the turning is to adjust the position of the silicon wafers so that the first surface of the first silicon wafer (i.e. the front surface of the first silicon wafer) and the second surface of the second silicon wafer (i.e. the back surface of the second silicon wafer) can be arranged on the same horizontal plane. Turning by 180° means turning the silicon wafer completely upside down, so that the originally upward surface becomes downward and the originally downward surface becomes upward.

[0094] Through such a turning operation, it can be ensured that the two silicon wafers are arranged in a positive-negative manner, meeting the requirements of subsequent processing steps.

[0095] In step S2, the first surface and / or the second surface of the silicon wafer is glued, for example, the first surface of the silicon wafer (i.e. the front surface of the silicon wafer) can be glued, i.e. single-sided gluing; or the second surface of the silicon wafer (i.e. the back surface of the silicon wafer) can be glued, i.e. single-sided gluing; or the first surface of the silicon wafer (i.e. the front surface of the silicon wafer) and the second surface of the silicon wafer (i.e. the back surface of the silicon wafer) can be glued, i.e. double-sided gluing.

[0096] Preferably, in the process of producing battery pieces, it is often necessary to lay the busbar on both the front and back surfaces of each silicon wafer, so double-sided gluing of the silicon wafer is more common.

[0097] The gluing refers to applying adhesive on the surface of the silicon wafer. This step is to better pre-fix the busbar in the subsequent steps, so as to avoid the risk of the busbar falling off during the transfer process of the silicon wafer.

[0098] In addition, in this step, the gluing scheme can be various, for example, it can be head gluing or jet gluing or silk-screen gluing. Taking the silk-screen gluing as an example, the silk-screen mesh cover is arranged on the surface of the silicon wafer which needs to be glued, the doctor blade dips the adhesive, and the adhesive is printed on the surface of the silicon wafer, so that the amount of gluing can be better controlled.

[0099] In a specific embodiment, taking the double-sided gluing of the silicon wafer as an example, step S2 specifically comprises sub-step S20 of gluing the first surface and the second surface of the silicon wafer.

[0100] Step S20: gluing one surface of the silicon wafer first, and then gluing the other surface of the silicon wafer.

[0101] In this step, by gluing one surface of the silicon wafer first and then gluing the other surface of the silicon wafer, it can be ensured that both the front and back surfaces of the silicon wafer are uniformly covered with the welding device 65, thereby providing a good basis for the laying and fixing of the busbar in the subsequent steps.

[0102] For example, taking the gluing of the first silicon wafer as an example, the first surface (i.e. the front surface of the first silicon wafer) of the first silicon wafer is glued first, and then the second surface (i.e. the back surface of the first silicon wafer) of the first silicon wafer is glued.

[0103] For example, taking the gluing of the second silicon wafer as an example, the second surface (i.e. the back surface of the second silicon wafer) of the second silicon wafer is glued first, and then the first surface (i.e. the front surface of the second silicon wafer) of the second silicon wafer is glued.

[0104] Further, referring to FIG. 5 and FIG. 3, step S20 specifically comprises sub-steps S201-S206 of gluing the first surface of the silicon wafer first, and then gluing the second surface of the silicon wafer.

[0105] S201: placing the silicon wafer on the dispensing platform 621, wherein the second surface of the silicon wafer is attached to the dispensing platform 621, and the long side of the silicon wafer extends along the first direction;

[0106] S202: dispensing on the first surface of the silicon wafer;

[0107] S203: transferring the single-side-dispensed silicon wafer from the first conveying line 622 to the second conveying line 623, wherein the silicon wafer is transferred to the second conveying line 623, the long side of the silicon wafer extends along the second direction, and the first direction and the second direction are perpendicular;

[0108] S204: transferring the single-side-dispensed silicon wafer from the second conveying line 623 to the third conveying line 624, wherein the silicon wafer is transferred to the third conveying line 624, the silicon wafer is turned over by 180°, and the first surface of the silicon wafer is attached to the third conveying line 624;

[0109] S205: transferring the silicon wafer on the third conveying line 624 to the dispensing platform 621, and the long side of the silicon wafer extends along the first direction;

[0110] S206: dispensing on the second surface of the silicon wafer.

[0111] In this embodiment, the double-side dispensing on the first silicon wafer is taken as an example for illustration.

[0112] In step S201, the silicon wafer is first placed on the dispensing platform 621. Specifically, the first silicon wafer is placed on the dispensing platform 621, and the second surface (back surface) of the first silicon wafer is attached to the dispensing platform 621, so as to prepare for the subsequent dispensing on the first surface of the first silicon wafer.

[0113] It should be noted that when the double-side dispensing on the second silicon wafer is performed, the second silicon wafer also needs to be placed on the dispensing platform 621. The difference from the placement of the first silicon wafer is that the first surface (front surface) of the second silicon wafer is attached to the dispensing platform 621, so as to prepare for the subsequent dispensing on the second surface of the second silicon wafer.

[0114] Whether the first silicon wafer or the second silicon wafer is dispensed, after the silicon wafer is placed on the dispensing platform 621, the long side of the silicon wafer extends along the first direction, which sets a direction reference for the subsequent operation.

[0115] It should be noted that the main purpose of limiting the placement direction of the silicon wafer on the dispensing platform 621 is to facilitate the dispensing process of the silicon wafer. Alternatively, those skilled in the art can adjust the placement position and direction of the silicon wafer on the dispensing platform 621 according to the specific position of the dispensing equipment and the type of the dispensing equipment.

[0116] In S202, after the first wafer is placed, the first surface of the first wafer is glued.

[0117] Alternatively, after the first wafer and the second wafer are placed, the first surface of the first wafer and the second surface of the second wafer can be glued simultaneously; or the first surface of the first wafer can be glued first and then the second surface of the second wafer is glued; or the second surface of the second wafer can be glued first and then the first surface of the first wafer is glued.

[0118] In S203, the single-surface glued first wafer is transferred to the second conveying line 623. Alternatively, the single-surface glued first wafer and the second wafer are both transferred to the second conveying line 623.

[0119] It should be noted that, whether the single-surface glued first wafer is transferred to the second conveying line 623 or the single-surface glued first wafer and the second wafer are both transferred to the second conveying line 623, the wafer placed on the second conveying line 623 is rotated by 90° compared with the wafer placed on the first conveying line 622, and the long side of the wafer extends along the second direction, and the first direction and the second direction are perpendicular.

[0120] It should be noted that the main purpose of limiting the placement direction of the wafer on the second conveying line 623 is to combine the arrangement direction of the second conveying line 623 to facilitate the conveying of the wafer. Alternatively, the person skilled in the art can adjust the placement direction of the wafer on the second conveying line 623 according to the arrangement direction and position of the second conveying line 623.

[0121] In S204, the single-surface glued first wafer is continuously transferred to the third conveying line 624, and the wafer placed on the third conveying line 624 is flipped by 180° compared with the wafer placed on the second conveying line 623, so as to prepare for gluing the unglued surface. The wafer is transferred from the second conveying line 623 to the third conveying line 624.

[0122] Alternatively, the single-surface glued first wafer and the second wafer are both transferred to the third conveying line 624, the first surface of the first wafer placed on the third conveying line 624 is attached to the third conveying line 624, i.e. the second surface of the first wafer is arranged upward, and the second surface of the first wafer is prepared for gluing, and the second surface of the second wafer placed on the third conveying line 624 is attached to the third conveying line 624, i.e. the first surface of the second wafer is arranged upward, and the first surface of the second wafer is prepared for gluing.

[0123] In S205, the wafer on the third conveying line 624 is transferred back to the gluing platform 621, i.e. the flipped wafer is transferred from the third conveying line 624 back to the gluing platform 621. For example, the wafer on the third conveying line 624 can be carried to the gluing platform 621 by a four-jaw device.

[0124] At this time, the long side of the silicon wafer on the dispensing platform 621 is again extended along the first direction, preparing for dispensing on the other surface, i.e., preparing for dispensing on the first surface of the first silicon wafer and dispensing on the second surface of the second silicon wafer.

[0125] In step S206, dispensing on the first surface of the first silicon wafer and dispensing on the second surface of the second silicon wafer are completed, and the double-sided dispensing of the first silicon wafer and the double-sided dispensing of the second silicon wafer are completed.

[0126] This process realizes efficient and accurate double-sided dispensing of silicon wafers through precise steps and the cooperation of the conveying line. Each step ensures that the silicon wafer is dispensed in the correct position and direction, thereby improving production efficiency and product quality.

[0127] In an embodiment, the first conveying line 622, the second conveying line 623, and the third conveying line 624 are each provided with a glue-avoiding tool.

[0128] In this embodiment, in order to ensure that the silicon wafer is not affected by the dispensing operation during the conveying process while maintaining its cleanliness and integrity, the first conveying line 622, the second conveying line 623, and the third conveying line 624 are each equipped with a glue-avoiding tool. The structure of the first conveying line 622, the second conveying line 623, and the third conveying line 624 includes but is not limited to a conveying belt.

[0129] It should be noted that after dispensing the silicon wafer and before curing the dispensing position, the conveying line conveying the silicon wafer needs to be equipped with a glue-avoiding tool during the conveying process.

[0130] The design of the glue-avoiding tool aims to prevent the splashing or flowing of glue during the dispensing process onto the conveying line, thereby contaminating the silicon wafer or affecting the normal operation of the conveying line. These tools may use shielding, flow guiding, or adsorption, etc., to effectively prevent the contact of glue with the conveying line and the non-dispensing area of the silicon wafer.

[0131] Alternatively, the glue-avoiding function can be achieved through physical isolation, air flow control, or other means to ensure that the printed adhesive remains clean during the conveying process. For example, the glue-avoiding device can use a tool held by four corners combined with a support structure with a grid to avoid the glue point position.

[0132] Alternatively, the glue-avoiding device can be a glue-avoiding tool or a glue-avoiding conveying belt, for example, a gap, a hole, or other avoiding structure can be provided on the glue-avoiding tool or the glue-avoiding conveying belt to avoid the glue point position.

[0133] It should be noted that the specific structure of the glue-avoiding device in the embodiments of the present application is not limited, as long as it can achieve the purpose of preventing the adhesive from being contaminated and damaged during the conveying process of the battery wafer.

[0134] Through such a design, it can be ensured that the silicon wafer is always kept clean during transportation and turning, providing a good basis for subsequent welding and other processing. At the same time, the use of the adhesive removal tooling also helps to prolong the service life of the conveying line and reduce the maintenance requirements due to glue pollution.

[0135] In one embodiment, the dispensing on the first surface and / or the second surface of the silicon wafer further specifically comprises: the dispensing sites are arranged in a rectangular array on the first surface and / or the second surface of the silicon wafer, and adjacent dispensing sites are arranged with a spacing.

[0136] In this embodiment, the dispensing sites on the first surface and the second surface of the silicon wafer are arranged in a rectangular array. This arrangement means that there is a certain spacing between adjacent dispensing sites.

[0137] The rectangular array arrangement of the dispensing sites can ensure the uniformity and stability of the solder strip when laid on the silicon wafer. Since the solder strip needs to correspond to the dispensing sites, the precise arrangement of the dispensing sites is crucial for the fixation of the solder strip and the success of the subsequent welding step.

[0138] In addition, the spacing arrangement between adjacent dispensing sites can prevent the spread or overflow of glue on the surface of the silicon wafer, thereby maintaining the cleanliness of the silicon wafer and the accuracy of the dispensing. This spacing also helps to control the heat-affected zone of the solder strip during welding (such as welding the solder strip between adjacent dispensing sites), preventing damage to the silicon wafer due to overheating.

[0139] In step S3, after forming the dispensing sites on the surface of the silicon wafer, the solder strip is then laid on the silicon wafer, corresponding to the dispensing sites, to achieve the purpose of pre-fixing the solder strip.

[0140] The solder strip is a metal strip used to connect battery pieces, usually made of copper or aluminum. In this step, the solder strip is precisely placed on the silicon wafer, corresponding to the previously dispensed positions.

[0141] In a specific embodiment, step S3 of laying the solder strip on the silicon wafer specifically comprises sub-steps S30-S33.

[0142] S30: providing a solder strip of a predetermined length;

[0143] S31: providing flux on the solder strip;

[0144] S32: transferring the silicon wafer with completed dispensing to the solder strip laying platform 632;

[0145] S33: laying the solder strip with flux on the surface with the dispensing sites.

[0146] In step S30, a solder strip of a preset length can be provided, for example, by the solder strip processing device 63.

[0147] Exemplarily, the solder strip processing device 63 comprises a solder strip pulling device 631 and a solder strip laying platform 632. The solder strip pulling device 631 comprises a solder strip stretching assembly for laying a solder strip on the surface of a silicon wafer.

[0148] The main function of the solder strip stretching assembly is to pass the solder strip through a certain mechanical force and technical operation to achieve the required length. The stretched solder strip needs to be accurately laid on the dispensing position of the silicon wafer.

[0149] Optionally, the solder strip pulling device 631 can further comprise a solder strip unwinding module, a solder strip buffer module, a flux module and a cutter module, etc. Through the cooperation of these modules, the solder strip is arranged on the battery sheet.

[0150] This step involves preparing a solder strip of appropriate length to ensure that it can cover all dispensing positions on the silicon wafer.

[0151] In step S31, flux is provided on the solder strip. It can be understood that the solder strip released by the solder strip unwinding module and the solder strip buffer module passes through the flux module, and the flux is applied to the solder strip. For example, the flux can be applied to the solder strip by dipping or smearing the flux.

[0152] To help improve the wettability and flowability during the welding process, thereby improving the welding quality and reliability.

[0153] In step S32, the silicon wafer with completed dispensing is transferred to the solder strip laying platform 632. Specifically, the silicon wafer with completed dispensing is transferred to the solder strip laying platform 632, preparing for the laying of the solder strip. This step ensures that the silicon wafer is in the correct position for subsequent solder strip laying operation.

[0154] In step S33, the solder strip is accurately laid on the surface of the silicon wafer with dispensing position. Since the flux has been provided on the solder strip, it will help the welding process between the solder strip and the silicon wafer.

[0155] Through these sub-steps, step S3 ensures that the solder strip can be accurately laid on the dispensing position of the silicon wafer, providing a good foundation for the welding process in the subsequent steps.

[0156] It should be noted that the above sub-steps S30 to S33 define one specific implementation of laying a solder strip on a silicon wafer. Alternatively, step S32 and step S33 can be exchanged.

[0157] Further, in the case where the first surface and the second surface of the silicon wafer both have dispensing positions, the step S33 of arranging the solder tape provided with flux on the surface having the dispensing position specifically includes the following sub-steps S331-S33:

[0158] S331: First, arrange the solder tape provided with flux on the solder tape arranging platform 632;

[0159] S332: Then, place the silicon wafer on the solder tape arranging platform 632 with the solder tape corresponding to the dispensing position of one surface of the silicon wafer;

[0160] S333: Then, cut the solder tape at a predetermined position;

[0161] S334: Finally, arrange the cut solder tape on the other surface of the silicon wafer, which corresponds to the dispensing position of the other surface of the silicon wafer.

[0162] In step S331, the solder tape is pre-placed on the solder tape arranging platform 632, ready for alignment with one surface of the silicon wafer.

[0163] In step S332, the silicon wafer is placed on the platform with the solder tape already arranged, ensuring that the solder tape is accurately aligned with the dispensing position of one surface of the silicon wafer.

[0164] In step S333, the solder tape is cut at the appropriate position to provide a new solder tape segment for the other surface of the silicon wafer.

[0165] In step S334, the cut solder tape segment is repositioned and arranged on the other surface of the silicon wafer, ensuring that it is also aligned with the dispensing position of that surface.

[0166] Through these sub-steps, step S33 ensures that the solder tape can be accurately arranged on the dispensing positions of the first and second surfaces of the silicon wafer. This double-sided solder tape arrangement is crucial for the subsequent welding and electrical connection of the battery wafer, as it ensures that the battery wafer can have good electrical conductivity and mechanical stability.

[0167] In one specific embodiment, referring to FIG. 3, the step S32 of transferring the silicon wafer with completed dispensing to the solder tape arranging platform 632 specifically includes the following sub-steps S321-S322.

[0168] S321: Transfer the silicon wafer with completed dispensing from the dispensing platform 621 to the fourth conveying line 634, and then through the fourth conveying line 634 to the first predetermined position A;

[0169] S322: Transfer the silicon wafer located at the first predetermined position A to the solder tape arranging platform 632.

[0170] In step S321, first, the silicon wafer with completed dispensing is transferred from the dispensing platform 621 to the fourth conveying line 634. This step is completed by a mechanical arm, a conveyor belt, or other automated equipment, with the purpose of transferring the silicon wafer from the dispensing process to the next process. The silicon wafer moves steadily on the fourth conveying line 634 until it reaches a specific position.

[0171] It should be noted that the fourth conveying line 634 also needs to be provided with a glue-avoiding tool.

[0172] Specifically, the silicon wafer with double-sided dispensing located on the dispensing platform 621 can be transferred to the first conveying line 622, and then transferred to the fourth conveying line 634 through the first conveying line 622. For example, a transfer mechanism can be provided between the first conveying line 622 and the fourth conveying line 634, and the silicon wafer with double-sided dispensing is transferred from the first conveying line 622 to the fourth conveying line 634 through the transfer mechanism.

[0173] In step S322, then, the silicon wafer located at the first preset position A is transferred to the solder strip laying platform 632. At the first preset position A, the position of the silicon wafer can be identified by a sensor or a marker to ensure that it is accurately transferred to the solder strip laying platform 632. This transfer is also completed by a mechanical arm, a conveyor belt, or other automated equipment.

[0174] Through these sub-steps, step S32 ensures that the silicon wafer with completed dispensing can be smoothly and accurately transferred from the dispensing platform 621 to the solder strip laying platform 632, preparing for the subsequent solder strip laying process.

[0175] In one embodiment, with reference to FIG. 4, after the solder strip provided with the flux is laid on the surface with the dispensing site in step S33, step S34 is further included:

[0176] S34: Place the pressing net at the second preset position B on the solder strip, and transfer the silicon wafer provided with the pressing net to the curing platform 641.

[0177] In step S34, first, a pressing net at a preset position is placed on the solder strip, for example, by a mechanical arm, a conveyor belt, or other automated equipment to complete the placement process of the pressing net.

[0178] The function of the pressing net is to apply a certain pressure to the solder strip, so that it is more closely attached to the dispensing site of the silicon wafer. At the same time, the pressing net can also help to remove the bubbles between the solder strip and the silicon wafer, improving the welding quality.

[0179] Then, the silicon wafer provided with the pressing net is transferred to the curing platform 641. On the curing platform 641, the solder strip and the glue will be cured under certain time and temperature conditions, so that the solder strip is firmly adhered to the silicon wafer. This step is crucial to ensure the connection strength between the solder strip and the silicon wafer.

[0180] Through step S34, the adhesion of the solder strip on the silicon wafer and the welding quality can be further improved, providing a solid foundation for the subsequent cell processing and electrical connection.

[0181] Optionally, in the case where the pressing net cover is provided on the solder strip, the solder strip can also be fitted with the glue point by the magnetic attraction device and the pressing net.

[0182] Specifically, the magnetic attraction device is used in cooperation with the pressing net. When the pressing net cover is provided on the solder strip, the magnetic attraction device ensures the close contact between the pressing net and the solder strip through magnetic force, so that the solder strip is firmly pressed on the solder strip.

[0183] For example, through precise control of magnetic force, the magnetic attraction device can ensure the accurate fitting position of the solder strip and the glue point, avoiding the offset or misalignment problems that may occur in traditional methods.

[0184] For example, when the first surface (front surface) of the cell needs to be cured, the solder strip can be well attached to the glue point by using the pressing net in combination with the magnetic attraction device. When the second surface (back surface) of the cell needs to be cured, the cell is pressed downward as much as possible by the magnetic attraction force, so that the solder strip and the silicon wafer are attached.

[0185] In one embodiment, referring to FIG. 3, the first preset position A and the second preset position B are arranged along the second direction.

[0186] In this embodiment, the positions of the first preset position A and the second preset position B are limited, so that a mechanical arm or the like mechanism can be arranged between the first preset position A and the second preset position B, and the placement of the silicon wafer and the placement of the pressing net are realized by the same mechanical arm.

[0187] Optionally, the mechanical arm can be a six-axis mechanical hand 633.

[0188] In the S4 step, the glue point is cured to pre-fix the solder strip, so as to improve the mechanical connection strength of the solder strip and the silicon wafer. The curing process refers to hardening the solder device 65 by heating or other methods, so as to firmly fix the solder strip on the silicon wafer. This step is a pre-fixing process, which ensures that the solder strip will not move in the subsequent welding step.

[0189] In this step, the glue point on which the solder strip is arranged is cured, which on the one hand fixes and enhances the connection of the solder device 65 and the silicon wafer, and on the other hand fixes and improves the connection reliability of the solder strip and the adhesive.

[0190] Optionally, the curing method can use thermal curing, UV curing or other curing techniques. The specific curing method and parameters (such as temperature, time, light intensity, etc.) can be adjusted according to the properties of the adhesive and the solder strip used.

[0191] In one embodiment, referring to FIG. 4, after the step S4 of curing the dispensing position to pre-fix the solder strip, the step S4 further includes a step S41:

[0192] S41: rotate the screen from the curing platform 641 to the second preset position B.

[0193] Specifically, in this step, after completing its curing and pressing function, the screen needs to be removed from the curing platform 641 and rotated to its original second preset position B. This operation is to prepare for the processing of the next silicon wafer or battery piece, to ensure that the screen can be reused, and the space on the curing platform 641 is released for subsequent processing steps. For example, the screen is rotated from the curing platform 641 to the second preset position B through the fifth conveying line 642.

[0194] Through step S41, the effective recycling and reuse of the screen are realized, and the production efficiency and resource utilization are improved. At the same time, it also ensures that the curing platform 641 can process the next silicon wafer in time, thereby maintaining the continuity and efficiency of the production line.

[0195] In step S5, the solder strip and the silicon wafer are permanently connected together using welding technology (such as pressure welding, laser welding, ultrasonic welding or other welding technology). After welding, a complete battery piece is formed, which can be further used for the assembly of solar panels.

[0196] In one specific embodiment, step S5 of welding the pre-fixed solder strip and the silicon wafer to form a battery piece specifically includes the following sub-steps S51-S52.

[0197] S51: move the silicon wafer from the curing platform 641 to the welding platform;

[0198] S52: the heating device located below the welding platform and the pressing head located above the welding platform cooperate to weld the pre-fixed solder strip and the silicon wafer.

[0199] In step S51, first, the silicon wafer is moved from the curing platform 641 to the welding platform. This step is usually completed by automated equipment, such as a robotic arm or a conveyor belt, to ensure that the silicon wafer can be accurately and stably transferred to the welding platform.

[0200] In step S52, after the silicon wafer reaches the welding platform, the heating device located below the welding platform starts to work to heat the solder tape on the silicon wafer. At the same time, the pressure head located above the welding platform is lowered to contact the solder tape and apply a certain pressure. The combined action of heating and pressure makes the solder between the solder tape and the silicon wafer melt and flow to fill the weld and form a firm welding joint.

[0201] Through sub-steps S51 and S52, step S5 realizes the process of welding the pre-fixed solder tape and the silicon wafer to form a battery wafer. This process ensures that both the electrical connection and the mechanical connection between the solder tape and the silicon wafer meet the requirements, laying a solid foundation for subsequent battery wafer testing and assembly.

[0202] Optionally, in order to ensure the reliability of the welding of the solder tape and the silicon wafer, the pressure head is located between two adjacent dispensing positions, and through the cooperation of the heating device and the pressure head, one or more welding positions are formed between the two adjacent dispensing positions.

[0203] Therefore, in this embodiment, a battery wafer production method is provided, which adjusts the fixing method of the solder tape fixed to the silicon wafer, i.e., adopts the method of dispensing the adhesive first and then welding the solder tape to fix the solder tape. In this way, after the adhesive is cured, the bonding force between the solder tape and the adhesive is strong during the turnover of the silicon wafer, and the solder tape is not easy to fall off. In addition, the adhesive is formed on the battery wafer through the dispensing method first, so that the thickness and dosage of the adhesive can be better controlled, so as to better control the overall thickness of the battery wafer.

[0204] The embodiment of the present application also provides a battery wafer production device. The battery wafer production device is used to prepare a battery wafer by using the battery wafer production method as described above.

[0205] In this embodiment, the battery wafer production device is used to prepare a battery wafer by using the battery wafer production method as described above, i.e., the battery wafer production device dispenses the adhesive first and then welds the solder tape to fix the solder tape on the silicon wafer.

[0206] In one embodiment, referring to FIG. 2, the battery wafer production device comprises:

[0207] a feeding device 60, which is used to provide a silicon wafer;

[0208] a dispensing device 62, which is used to dispense an adhesive on a first surface and / or a second surface of the silicon wafer;

[0209] a solder tape processing device 63, which is used to arrange a solder tape on the silicon wafer, the solder tape corresponding to the dispensing position;

[0210] a curing device 64, which is used to perform curing treatment on the dispensing position to pre-fix the solder tape;

[0211] A welding device 65 is configured to weld the pre-fixed solder tape and the silicon wafer to form a battery piece.

[0212] In this embodiment, the battery piece production equipment includes a feeding device 60, which is responsible for automatically and accurately conveying the battery piece to the dispensing device 62 for subsequent processing.

[0213] Optionally, the feeding device 60 includes a turnover mechanism to turn one of the silicon wafers in a group of silicon wafers (two silicon wafers) by 180°.

[0214] The battery piece production equipment also includes a dispensing device 62, which forms a specific adhesive (i.e., dispensing position) on the silicon wafer by dispensing. The dispensing scheme can be various, such as dispensing head dispensing or jet dispensing or screen printing dispensing. Taking screen printing dispensing as an example, a screen cover is placed on the silicon wafer, and a doctor blade is dipped in the welding device 65 to print the welding device 65 on the silicon wafer where the adhesive needs to be printed. By processing the battery piece by dispensing first and then welding on the silicon wafer, the dispensing amount can be better controlled.

[0215] The dispensing device 62 can realize single-sided dispensing of the silicon wafer, i.e., the adhesive is formed on one surface of the silicon wafer. Alternatively, the dispensing device 62 can realize double-sided dispensing of the silicon wafer, i.e., the adhesive is formed on two opposite surfaces of the silicon wafer. When the dispensing device 62 realizes double-sided dispensing of the silicon wafer, the first surface of the silicon wafer is first dispensed, then processed by the turnover mechanism, and then the second surface of the silicon wafer is dispensed.

[0216] Optionally, the dispensing device 62 includes a dispensing platform 621, which mainly functions to carry the battery piece and provide stable support for the battery piece during dispensing. For example, during dispensing, the platform needs to ensure the accurate and stable position of the battery piece, so that the doctor blade dipped in the welding device 65 can accurately apply the welding device 65 on the battery piece according to the preset pattern or path.

[0217] Optionally, according to the actual application of the battery piece, the dispensing device 62 can simultaneously process a group of silicon wafers (two silicon wafers). When processing a group of silicon wafers simultaneously, the first surface (i.e., the front surface) of one silicon wafer and the second surface (i.e., the back surface) of the other silicon wafer can be processed simultaneously.

[0218] Optionally, a first transfer device 61 is provided between the feeding device 60 and the dispensing device 62, and the first transfer device 61 is configured to transfer the silicon wafer to the dispensing device 62. The silicon wafer can be a double-sided non-dispensed silicon wafer (i.e., the silicon wafer from the feeding device 60 is transferred to the dispensing device 62) or a single-sided dispensed battery piece (i.e., the silicon wafer from the third conveying line 624 is transferred to the dispensing position).

[0219] Optionally, the side of the dispensing platform 621 is also provided with a second transfer device to ensure the normal flow of the battery piece in the process line. The main function of the second transfer device is to accurately transfer the battery piece after dispensing to the first conveying line 622. Specifically, whether to transfer the silicon wafer from the first conveying line 622 to the second conveying line 623 or directly from the first conveying line 622 to the fourth conveying line 634 depends on the dispensing state of the battery piece (single-sided adhesive or double-sided adhesive).

[0220] The battery piece production equipment also includes a solder strip processing device 63, which can include one or more solder strip spools and precise control mechanisms to ensure that the solder strip is uniformly laid on the silicon wafer according to the preset route and density.

[0221] Specifically, the solder strip processing device 63 is used to lay solder strips on the battery piece, where the solder strips are in contact with the surface of the dispensing site, i.e., the height of the solder strip is higher than the height of the welding device 65. In this way, the solder strip becomes a protective structure that isolates the adhesive, preventing the adhesive from coming into contact with other components during transportation.

[0222] Optionally, the solder strip processing device 63 can lay solder strips on a group of silicon wafers or multiple groups of silicon wafers simultaneously. That is, in the embodiment of the present application, the dispensing site is first formed on the silicon wafer, and then the solder strip is laid on the silicon wafer in combination with the arrangement of the dispensing site.

[0223] The battery piece production equipment also includes a curing device 64, which is used to cure the adhesive on which the solder strip is laid. On the one hand, it fixes and enhances the connection between the welding device 65 and the battery piece. On the other hand, it fixes and enhances the connection reliability between the solder strip and the adhesive.

[0224] Optionally, the curing device 64 can use thermal curing, UV curing, or other curing techniques. The specific curing method and parameters (such as temperature, time, light intensity, etc.) may be adjusted according to the properties of the adhesive and solder strip used.

[0225] The battery piece production equipment also includes a welding device 65, which typically uses pressure welding, laser welding, ultrasonic welding, or other welding techniques. The parameters and conditions of welding (such as welding temperature, welding time, welding pressure, etc.) will ensure a firm connection between the solder strip and the silicon wafer.

[0226] Therefore in this embodiment, a battery piece production device is provided, the fixing mode of the solder strip to the silicon piece is adjusted, that is, the solder strip is fixed by the mode of first dispensing and then welding, so that after the adhesive is cured, the bonding force between the solder strip and the adhesive is strong, and the solder strip is not easy to fall off. In addition, the adhesive is formed on the battery piece by the first dispensing mode, so as to better control the thickness and dosage of the adhesive, so as to better control the overall thickness of the battery piece.

[0227] The application also provides a battery piece. The battery piece is prepared by the battery piece production method as described above. For example, the battery piece can be a photovoltaic battery piece.

[0228] Specifically, the battery piece includes a silicon piece, a solder strip, an adhesive, and a welding portion, wherein the solder strip connected with the adhesive is at least partially exposed, and the welding portion connects the solder strip and the silicon piece.

[0229] In this embodiment, the silicon piece is the main structure of the battery piece, and provides support and foundation for the whole battery piece. The solder strip is usually used as a conductive circuit in the battery piece, and is used for transmitting the current generated by the photovoltaic effect. The solder strip needs to have good conductivity, mechanical strength, and corrosion resistance. Common solder strip materials include metals or alloys such as copper, silver, and aluminum.

[0230] In this embodiment, the adhesive is cured by the mode of first setting the adhesive on the silicon piece and then adhering the solder strip to the adhesive, so that the solder strip connected with the adhesive is at least partially exposed. The adhesive is used to fix the solder strip on the battery piece, and ensures the close adhesion and stable connection between the solder strip and the battery piece. The welding portion connects the solder strip and the battery piece by welding, and enhances the electrical connection strength and stability between the solder strip and the battery piece.

[0231] The above embodiments mainly describe the differences between the embodiments, and the different optimization features between the embodiments can be combined to form a better embodiment as long as they are not contradictory. Considering the brevity of the writing, it will not be repeated here.

[0232] Although some specific embodiments of the application have been described in detail by examples, those skilled in the art should understand that the above examples are only for illustration, and are not intended to limit the scope of the application. Those skilled in the art should understand that the above embodiments can be modified without departing from the scope and spirit of the application. The scope of the application is defined by the appended claims.

Claims

1. A method of producing a battery sheet, characterized by, The method comprises the following steps: providing a silicon wafer; pointing glue on the first surface and / or the second surface of the silicon wafer to form a glue point; the first surface and the second surface are oppositely arranged; arranging a solder strip on the silicon wafer, the solder strip corresponding to the glue point; solidifying the glue point to pre-fix the solder strip; welding the pre-fixed solder strip and the silicon wafer to form a battery wafer.

2. The method of claim 1, wherein, The silicon wafer is specifically provided by: providing a group of silicon wafers, the group of silicon wafers comprising a first silicon wafer and a second silicon wafer, the first surface of the first silicon wafer and the second surface of the second silicon wafer being in the same horizontal plane.

3. The method of claim 2, wherein the step of applying the conductive paste is performed by screen printing. The first surface of the first silicon wafer and the second surface of the second silicon wafer are specifically in the same horizontal plane by: turning one of the first silicon wafer and the second silicon wafer by 180°, so that the first surface of the first silicon wafer and the second surface of the second silicon wafer are in the same horizontal plane.

4. The battery sheet production method according to any one of claims 1 to 3, characterized by, The pointing glue on the first surface and the second surface of the silicon wafer specifically comprises: pointing glue on one surface of the silicon wafer first, and then pointing glue on the other surface of the silicon wafer.

5. The method of claim 4, wherein the step of applying the conductive paste is performed by screen printing. The pointing glue on the first surface of the silicon wafer first, and then pointing glue on the second surface of the silicon wafer specifically comprises: placing the silicon wafer on a glue pointing platform (621), wherein the second surface of the silicon wafer is attached to the glue pointing platform (621), and the long side of the silicon wafer extends along a first direction; pointing glue on the first surface of the silicon wafer; transferring the single-surface-glued silicon wafer from the first conveying line (622) to the second conveying line (623), wherein the silicon wafer is transferred to the second conveying line (623), the long side of the silicon wafer extends along a second direction, and the first direction and the second direction are perpendicular; transferring the single-surface-glued silicon wafer from the second conveying line (623) to the third conveying line (624), wherein the silicon wafer is transferred to the third conveying line (624), the silicon wafer is turned by 180°, so that the first surface of the silicon wafer is attached to the third conveying line (624); transferring the silicon wafer on the third conveying line (624) to the glue pointing platform (621), the long side of the silicon wafer extending along the first direction; pointing glue on the second surface of the silicon wafer.

6. The method of claim 5, wherein the step of applying the conductive paste is performed by screen printing. The first conveying line (622), the second conveying line (623) and the third conveying line (624) are all provided with glue-avoiding tools.

7. The method of claim 1-6, wherein, The pointing glue on the first surface and / or the second surface of the silicon wafer specifically comprises: The glue points are arranged in a rectangular array on the first surface and / or the second surface of the silicon wafer, and adjacent glue points are arranged with a spacing.

8. The battery sheet production method according to any one of claims 1 to 7, characterized by, The arrangement of the solder strip on the silicon wafer specifically comprises: providing a solder strip with a predetermined length; providing a soldering flux on the solder strip; transferring the silicon wafer with completed glue pointing to a solder strip arranging platform (632); arranging the solder strip with the soldering flux on the surface with the glue points.

9. The method of claim 8, wherein the step of applying the conductive paste is performed by screen printing. In the case that the first surface and the second surface of the silicon wafer both have glue points, the arrangement of the solder strip with the soldering flux on the surface with the glue points specifically comprises: firstly laying the solder strip with the soldering flux on the solder strip arranging platform (632); Then the silicon wafer is placed on a solder strip laying platform (632) provided with a solder strip, the solder strip corresponding to the dispensing position of one surface of the silicon wafer; Then the solder strip is cut off at a preset position; Finally, the cut-off solder strip is laid on the other surface of the silicon wafer, the solder strip corresponding to the dispensing position of the other surface of the silicon wafer.

10. The method of claim 8 or 9, wherein the method further comprises: The process of transferring the silicon wafer with completed dispensing to the solder strip laying platform (632) specifically includes: The silicon wafer with completed dispensing is transferred from the dispensing platform (621) to the fourth conveying line (634), and then transferred to the first preset position (A) through the fourth conveying line (634); The silicon wafer at the first preset position (A) is transferred to the solder strip laying platform (632).

11. The method of claim 7-10, wherein, After the solder strip provided with the flux is laid on the surface with the dispensing position, the process further includes: The second preset position (B) is placed on the solder strip, and the silicon wafer provided with the screen is transferred to the curing platform (641).

12. The method of claim 11, wherein the step of applying the conductive paste is performed by screen printing. The first preset position (A) and the second preset position (B) of the silicon wafer are spaced apart along the second direction.

13. The method of claim 11, wherein the step of applying the conductive paste is performed by screen printing. After the curing treatment of the dispensing position to pre-fix the solder strip, the process further includes: The screen is rotated from the curing platform (641) to the second preset position (B).

14. The method of claim 1-13, wherein, The process of welding the pre-fixed solder strip and the silicon wafer to form a battery piece specifically includes: The silicon wafer is transferred from the curing platform (641) to the welding platform; The pre-fixed solder strip and the silicon wafer are welded by the cooperation of the heating device below the welding platform and the pressure head above the welding platform.

15. A cell sheet production apparatus characterized by comprising: The battery piece production equipment adopts the battery piece production method of any one of claims 1-14 to prepare a battery piece.

16. The cell production apparatus according to claim 15, wherein The battery piece production equipment includes: A feeding device (60) for providing a silicon wafer; A dispensing device (62) for dispensing a first surface and / or a second surface of the silicon wafer; A solder strip processing device (63) for laying a solder strip on the silicon wafer, the solder strip corresponding to the dispensing position; A curing device (64) for curing treatment of the dispensing position to pre-fix the solder strip; A welding device (65) for welding the pre-fixed solder strip and the silicon wafer to form a battery piece.

17. A battery cell, characterized by The battery piece is prepared by the battery piece production method of any one of claims 1-14. The battery piece is prepared by the battery piece production method of any one of claims 1-14.

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