Smart heating element with reduced connection wires

Abstract

A medical heating device system comprising a heating pad with at least one heating element; a plurality of sensors, capable of sensing temperature, disposed in different regions thereof; integrated electronics on-board the heating pad for selectively providing power transmission, digital data exchange, or both; and a control unit off-board the heating pad for selectively providing power transmission, digital data exchange, or both.

Description

SMART HEATING ELEMENT WITH REDUCED CONNECTION WIRESCROSS REFERENCE TO RELATED APPLICATION(S)

[0001] This application claims priority to U.S. Provisional Application No. 63 / 658,909 (filed June 12, 2024), which is incorporated herein by reference in its entirety.FIELD

[0002] The present application relates to a medical heating device system including a heating pad with integrated electronics a number of associated external connection wires, and a method of manufacturing the same.BACKGROUND

[0003] Heating devices (e.g., blankets) are used in medical settings to regulate the body temperature of patients, such as to avoid or correct hypothermia. Such hypothermia may be a risk flowing from surgical procedures, unconsciousness of a patient, or adverse environmental exposure.

[0004] In the context of medical settings, increasingly stringent requirements are placed on such heating devices, relating to their technical specifications and their cost-effective manufacturability. It is desirable to make the heating device inexpensive to manufacture, easy to handle, safe for use, reliable, and available in sterile condition.

[0005] In regards to safety, a mechanism for sensing and / or controlling temperature to within a desired range (e.g., between a minimum temperature that is significant enough to provide desirable physiological effects in a patient and a maximum temperature beyond which potential harm, such as burning, may be realized by the patient). In some circumstances, multiple such mechanisms may be included in a heating device to monitor / control different regions thereof, or provide for redundancies.

[0006] One challenge with conventional heating devices is the number of electrical connections, to both the heating elements and any temperature sensors on-board the heating device. Generally, the number of connection wires increases with the number of temperature sensors on-board the heating element, e.g., a heating device with 8 temperature sensors may have 18 connection wires, including at least two for the resistors of the heating device. In this case a thick (e.g., diameter of about 12 mm or more) and heavy connection cable must be connected to a control unit for operation.

[0007] Another challenge with conventional heating devices is the potential for electromagnetic interference (“EMI”), by the heating device or to the heating device. Such interference can be concerning in a medical setting where multiple electronic devices(e.g., monitors, pumps, instruments, etc.) are typically operated, which are important to the health of a patient. Accordingly, there is a need to address EMI in heating devices.

[0008] An exemplary heating device is described in U.S. Patent Application Publication No. 2023 / 0301824 A1, which is incorporated by reference herein for all purposes. Other heating devices are described in U.S. Patent No. 11,691,350 B2 and U.S. Patent Application Publication No. 2010 / 0200558 A1.SUMMARY

[0009] The present teachings provide for a medical heating device system, which may address at least some of the needs identified above.

[0010] The medical heating device system may comprise a heating pad with at least one heating element.

[0011] The medical heating device system may comprise a plurality of sensors disposed in different regions of the at least one heating element and capable of sensing a temperature thereof in said different regions.

[0012] The medical heating device system may comprise integrated electronics on-board the heating pad, and adapted and configured to selectively provide for power transmission, digital data exchange, or both, with the at least one heating element, the plurality of sensors, or both.

[0013] The medical heating device system may comprise a control unit off-board the heating pad, and adapted and configured to provide for power transmission, digital data exchange, or both, with the integrated electronics.

[0014] The plurality of sensors may be free from wired connection, such as a direct wired connection, to the control unit.

[0015] The control unit may comprise a memory storage medium having one or more setpoint temperatures, one or more operating parameters, or both, for operation of the at least one heating element.

[0016] The integrated electronics may comprise a processor that determines one or more power characteristics provided to the at least one heating element based on the one or more setpoint temperatures, the one or more operating parameters, or both in view of reported temperatures from the plurality of sensors. The integrated electronics may comprise a memory storage medium having a default basic heating function, which operates at least in an event where signal communication with the control unit is interrupted.

[0017] The integrated electronics may have a two-wire interface for connection with the control unit.

[0018] The control unit may have an integrated power supply or the medical heating device system comprises a power supply separate from the control unit.

[0019] The control unit may have a wireless data interface and the integrated electronics may have a wireless data interface for said digital data exchange therebetween.

[0020] The integrated electronics may use phase-fired control (PFC) or pulse-width modulation (PWM) to regulate the temperature of the at least one heating element.

[0021] Such phase-fired control or pulse-width modulation may be adjusted in view of a pre-determined resistance of the at least one heating element to arrive at a desired power density.

[0022] The power density may be about 100 W / m2to about 250 W / m2, more preferably about 150 W / m2to about 200 W / m2.

[0023] The at least one heating element may function as a resistive heating element. The at least one heating element may be fabricated from at least carbon fibers. The carbon fibers may be formed into a woven pattern.

[0024] Any wired connection of the plurality of sensors, downstream of the integrated electronics, may be discrete from any wired connection of the at least one heating element.

[0025] At least two of the plurality of sensors may each have separate wired connection to the integrated electronics.

[0026] Each of the plurality of sensors may have separate wired connection to the integrated electronics.

[0027] The plurality of sensors may be disposed upon the at least one heating element, as a separate layer from the at least one heating element.

[0028] The integrated electronics may be located upon the at least one heating element.

[0029] The integrated electronics may be located directly upon the at least one heating element.

[0030] The integrated electronics may be formed as a thin film.

[0031] The medical heating device system may further comprise at least two electrodes. A first of the at least two electrodes may be proximally located and a second of the at least two electrodes may be distally located from connected to the integrated electronics via a wire. The first of the at least two electrodes may be directly connected to the integrated electronics.

[0032] The integrated electronics may comprise or communicate with a light source adapted and configured to indicate an operating status of the heating pad.

[0033] The plurality of sensors may include a wireless data interface for signal communication with the integrated electronics, the control unit, or both.

[0034] The plurality of sensors may comprise a light source for visually indicating a location of the plurality of sensors.

[0035] The medical heating device system may further comprise one or more additional sensors adapted and configured to measure one or more biometric characteristics of a patient using the medical heating device system.

[0036] The one or more additional sensors may signally communicate with the integrated electronics, the control unit, or both. The one or more additional sensors may contribute to the determination of one or more power characteristics provided to the at least one heating element by the integrated electronics.

[0037] The medical heating device system may further comprise one or more additional heating pads wiredly or wirelessly connected to the control unit.

[0038] In one aspect, a medical heating device system may comprise: a heating pad with a heating element comprised of a weaving pattern and a number of carbon filaments and includes one or more sensors. An electronic device (integrated electronics) may be disposed within the heating pad and provide a hub for power transmission, digital data exchange, or both for the heating pad. The medical heating device system may further comprise a separate (e.g., remote) electronic control unit (control unit) in digital communication with the electronic device, the one or more sensors, or both. The medical heating device may comprise a set of two wires: electrically connected to at least the electronic device, electrically connected to a power supply for providing power transmission, for digital data exchange, or any combination thereof.

[0039] The one or more sensors may include a plurality of temperature sensors.

[0040] The heating pad may provide a basic heating function.

[0041] The power supply may be disposed in an operation room bed or near said bed.

[0042] The electronic device may include a wireless data interface (e.g., Wi-Fi, Bluetooth, NFC, or the like) to connect to a plurality of different types of devices (e.g., control unit, host, service unit, smartphones, or the like).

[0043] The electronic device may be applied directly on the heating element.

[0044] The separate electronic control unit or the electronic device may control the power transmission such that the power is provided as a phase-fired control (PFC) or a pulsewidth modulation (PWM).

[0045] The electronic device may provide an adjustable power density for the heating pad.

[0046] The digital data exchange between the heating element and control unit may take place via a wireless data interface.

[0047] The separate electronic control unit may operate multiple heating pads.

[0048] The electronic device may indicate the operating status of the heating pad (e.g., statuses such as Run, Stop, or Failure).

[0049] The electronic device may indicate the operating status of the heating pad via a light source (e.g., an LED indicator lamp) disposed on the heating pad.

[0050] The electronic device may indicate the position of each of the plurality of sensors, which is envisioned to be useful for performing x-ray images.

[0051] The plurality of sensors may include at least one LED that can be illuminated to indicate its position.

[0052] The electronic device may provide additional data to exchange with the interface (e.g., current heat transfer, calibration data, hours in operation, operation status, failures, others).

[0053] The electronic device may communicate or process additional data from sensors external to the medical heating device system.

[0054] The electronic device may provide a default basic heating function if the separate electronic control unit is not present or not functioning.

[0055] The electronic device may provide a default basic heating function.

[0056] There may be a plurality of sensors disposed on the heating pad.

[0057] At least one of the one or more sensors or the plurality of sensors is a temperature sensor.

[0058] At least one of the one or more sensors or the plurality of sensors is a biometric sensor (e.g., adapted and configured to measure patient temperature data, patient heart rate, 02 levels, etc.).BRIEF DESCRIPTION OF THE DRAWINGS

[0059] FIG. 1 is a schematic view of a medical heating device system according to the present teachings.

[0060] FIG. 2 is a schematic view of a medical heating device system according to the present teachings.

[0061] FIG. 3 is a schematic view of a medical heating device system according to the present teachings.DETAILED DESCRIPTION

[0062] The present teachings provide for a medical heating device system. The medical heating device system may effectuate a controlled and monitorable heating of a patient. The medical heating device system may have an improved ease of use relative to convention. Other functions and benefits will be realized by the present description.

[0063] The medical heating device system may comprise one or more sensors capable of sensing a temperature of a heating pad. In some aspects the medical heating device system may comprise a plurality of sensors, such as a plurality of sensors capable of sensing a temperature of a heating pad. The plurality of sensors may be disposed in multiple different regions of the heating pad, to ensure that the multiple different regions are maintained at a pre-determined temperature or within a pre-determined temperature range.

[0064] As described herein, each of the one or more sensors may have a wired connection involved in digital data exchange for at least the purpose of controlling the heating pad. In this regard, the present teachings contemplate that some electronics involved in controlling the heating pad may be located on-board the heating pad, and some other electronics involved in controlling the heating pad may be located off-board the heating pad. Thus, wired connection to electronics on-board the heating pad may eliminate lengths of wiring compared to convention. Any wired connection off-board from the heating pad may only include that which provides power transmission (e.g., a hot, a neutral, and optionally a ground wire).

[0065] It is further contemplated that power transmission and digital data exchange may be performed with the same wire(s). Byway of example, the system described herein may operate according to the 1-wire protocol. The foregoing may be applicable to wired connections between any sensors and integrated electronics, between integrated electronics and a control unit, or both.

[0066] Such an arrangement may provide a variety of benefits. In some aspects, the reduction in wiring, wiring connections, wiring harnesses, wiring insulation, and the like can reduce manufacturing costs. In some aspects, reduced wiring extending from the heating pad may mitigate at least some electromagnetic interference (EMI), of the wires to other devices or of other devices to the wires. Accordingly, the more costly EMI wire sheathing may be at least partially eliminated.

[0067] In some aspects of the present teachings, it is contemplated that wiring may be replaced partially or entirely with the introduction of wireless data interfaces. In some conventional circumstances, control units or other similar devices may be located on portable poles or the like, to allow the same to be readily moved or adjusted throughout the environment in which the medical heating device system is employed (e.g., an operating room). It is envisioned that elimination of some or all wires may allow a greater degree of movement for the portable poles and mitigate, if not eliminate, trip hazards flowing therefrom.

[0068] In these regards, a control unit may have an integrated power source or a power source may be provided separately from the control unit. With respect to the latter, theseparate power source may maintain a wired connection to the heating pad (e.g., a hot, a neutral, and optionally a ground wire). The separate power source may be located remote from the control unit. The control unit may be moved throughout an environment in which the medical heating device system is employed, and the power source may remain proximate to the heating pad.

[0069] Typically, there may be no need for visual monitoring of or physical interaction with a separate (standalone) power source. Thus, such a power source may be stored proximate to the heating pad, such as on or in an operating table. It is further envisioned by the present teachings that conventional operating tables include a power source of their own, which may be tapped into to provide power to the medical heating device system. Although, the present teachings are not intended to be limited to the medical heating device system being used in conjunction with an operating table. The medical heating device system may be used in any suitable environment. For example, in an examination room of a medical facility, an emergency medical vehicle, or even carried afield (e.g., to an individual with hypothermia, at a site where the hypothermia was induced).

[0070] Some or any combination of these features may be realized by the medical heating device system of the present teachings. These and other benefits may be further realized by skilled artisans from the below description.

[0071] The medical heating device system may include a heating pad. The heating pad may be in the form of or incorporated into a blanket, a wrap, a mattress, a garment, or any combination thereof.

[0072] Although some examples discussed herein describe one heating pad. The system described herein may include a plurality of heating pads. The plurality of heating pads may cooperate with the same power supply, the same control unit, or both. The plurality of heating pads may be used on the same patient, such as one to cover the legs of the patient and one to cover the torso of the patient.

[0073] The heating pad may comprise at least one heating element. The at least one heating element may be a resistive heating element. Power may be applied to the resistive heating element to cause its temperature to increase based on a resistance thereof. The resistive heating element may or may not vary its resistance as a function of temperature. Preferably, the resistive heating element may not substantially vary its resistance as a function of temperature (no more than 5% variation across the range of normal operating temperatures, or even more preferably no more than 1% variation across the range of normal operating temperatures).

[0074] As described herein, at least one benefit of the present teachings is the power density modulation of the at least one heating element, which may be possible due tosubstantially no variation (negligible variation) in resistance as a function of temperature. The resistance of a heating element may be measured after fabrication, and is a function of its build (e.g., heating element size (e.g., carbon fiber bundle diameter, as a function of the quantity of filaments in a bundle), weave pattern, and the like). While these properties may be adjusted to some extent to arrive at a desired power density, it is not possible or practical to construct a heating element with a desired power density at any selected dimension (e.g., sheet length and sheet width). There are practical limitations on manufacturing abilities and cost considerations. With a known resistance, various power characteristics may be provided to the heating element, as described in greater detail below, to modulate the power density thereof to arrive at a desired power density.

[0075] The power density may be about 100 W / m2to about 250 W / m2, more preferably about 110 W / m2to about 240 W / m2, more preferably about 120 W / m2to about 230 W / m2, more preferably about 130 W / m2to about 220 W / m2, more preferably about 140 W / m2to about 210 W / m2, or even more preferably about 150 W / m2to about 200 W / m2.

[0076] The power density described herein, unless otherwise stated, may refer to the power density delivered to the patient, in consideration of the insulation between the heating element and the patient. The desired power density may be modulated based on a patient’s physiology.

[0077] The at least one heating element may be fabricated from carbon fiber. The carbon fiber may be arranged as carbon filaments (single stranded) or bundles of carbon filaments (bundles of single strands). The at least one heating element may be formed into a woven pattern. The woven pattern may produce a generally flat sheet. The resulting woven pattern may be flexible. A plurality of bundles may be woven together to form the heating element. An exemplary material may include Carbotex®, commercially available from Gentherm Incorporated. An exemplary material is described in U.S. Patent No. 8,288,693 B2, incorporated herein by reference in its entirety for all purposes.

[0078] The heating pad may comprise one or more outer layers. The one or more outer layers may be disposed over the at least one heating element. The one or more outer layers may function to preclude direct contact of a patient’s skin with the at least one heating element, to provide a desired heat transfer rate, to provide comfort to the patient, to protect the at least one heating element from contact with liquids, or any combination thereof.

[0079] Although the one or more outer layers may be disposed on one side of the at least one heating element, typically the one or more outer layers include at least two outer layers each disposed respectively on the opposing sides of the at least one heating element. Thus, the at least two outer layers may form an outer shell that encapsulates the at least one heating element.

[0080] The one or more outer layers may include an area where external connection wires protrude from the heating pad, to connect to a power supply, a control unit, or both. The one or more outer layers may include a reinforcement to secure the external connection wires and strengthen their connection thereto.

[0081] The heating pad may comprise two or more electrodes. The two or more electrodes may be electrically conductive. The two or more electrodes may be flexible. The two or more electrodes may include an electrode functioning as a cathode, and an electrode functioning as an anode. The cathode and anode may be disposed on opposing ends of the resistive heating element, or proximate to said opposing ends. In this regard, power may be supplied to the resistive heating element via the two or more electrodes.

[0082] In some aspects, the integrated electronics described herein may be connected to the two or more electrodes to provide power thereto. The integrated electronics may be located on-board the heating pad, as discussed in greater detail herein. The integrated electronics may connect to one or more of the electrodes via one or more wires. In another aspect, it is contemplated that the integrated electronics may be directly connected to an electrode.

[0083] The medical heating device system may include one or more sensors. The medical heating device system may include a plurality of sensors. At least some of the benefits discussed herein may be better realized where the medical heating device system include a plurality of sensors.

[0084] The one or more sensors may be capable of sensing temperature. The one or more sensors may function to sense a temperature of the at least one heating element. The sensed temperature may be used in controlling the at least one heating element. Although one sensor is contemplated, typically a plurality of sensors may be disposed in different regions of the at least one heating element to measure the temperature in those regions. In this regard, redundancies in the sensing is provided for, and it can be determined whether or not even heating is realized. Any reference herein to one or more sensors may be replaced with plurality of sensors, and vice versa.

[0085] Exemplary sensors may include thermistors, thermocouples, or the like. A combination of different types of sensors is also contemplated.

[0086] The plurality of sensors may be free from a wired connection to a control unit. The plurality of sensors may be free from a direct wired connection to a control unit. Conventionally, such wired connection may extend from the heating pad and require additional length(s) of wire, thus increasing the size of a cable extending from the heating pad, increasing the cost, and exposing a greater extent of wire to electromagnetic interference. The present teachings contemplate that this wire associated with theplurality of sensors and extending from the heating pad may be reduced or eliminated. The integrated electronics discussed herein may cooperate to this effect.

[0087] The plurality of sensors may be disposed upon the at least one heating element. The plurality of sensors may be provided as a separate layer from the at least one heating element.

[0088] At least two of the plurality of sensors may each have a separate wired connection to the integrated electronics. Each and every one of the plurality of sensors may each have a separate wired connection to the integrated electronics. One or more of the plurality of sensors may be wired in series. A combination of these approaches is also contemplated. Any wired connection of the plurality of sensors, downstream of the integrated electronics, may be discrete from any wired connection of the at least one heating element.

[0089] The plurality of sensors may comprise a light source. An exemplary light source is a light emitting diode (LED) light. The light source may function to indicate a location of the plurality of sensors. In this regard, the heating pad may be adjusted on a patient so that the plurality of sensors do not interfere with images taken by radiological instruments (e.g., X-ray machines). The light source may be illuminated at all times when the heating pad is operated or only when commanded to illuminate (e.g., commanded via a user input into a control unit).

[0090] The plurality of sensors may comprise a wireless data interface. The wireless data interface may be adapted and configured for communication over a wireless network, such as a Wi-Fi network, a Bluetooth network, a near-field communication network, or any combination thereof. The plurality of sensors may exchange digital data with integrated electronics, one or more control units, or both, via the wireless data interface. In this regard, wires may be reduced in quantity or eliminated from the heating pad. For example, any wires connecting the plurality of sensors to integrated electronics, described in some illustrative aspects herein, may be eliminated.

[0091] The heating pad may comprise one or more additional sensors. The one or more additional sensors may be adapted and configured to measure one or more biometric characteristics of a patient. Exemplary and non-limiting biometric characteristics may include body temperature (basal body temperature or skin temperature), heart rate, blood oxygen, blood pressure, pulse, cardiovascular electric activity, perspiration, patient movement, the like, or any combination thereof.

[0092] The one or more additional sensors may be on-board the heating pad or off- board the heating pad. Typically, the one or more additional sensors may be separate from the heating pad. The one or more additional sensors may exchange digital data with the integrated electronics, the control unit, or both. Such digital data exchange may bevia a wired connection or wireless network. The one or more additional sensors may contribute to the determination of one or more power characteristics provides to the at least one heating element. In this regard, the one or more additional sensors may cooperate with the plurality of (temperature) sensors to determine the one or more power characteristics.

[0093] The heating pad may comprise integrated electronics. The integrated electronics may function to provide for power transmission, digital data exchange, or both. The power transmission and / or digital data exchange may be with the at least one heating element, the plurality of sensors, the control unit, or any combination thereof. The integrated electronics may perform at least a portion of control and / or power provision functions. The integrated electronics may cooperate with a control unit, which may perform another portion of control and / or power provision functions.

[0094] The integrated electronics may be on-board the heating pad. The integrated electronics may be connected to the at least one heating element, the one or more outer layers, or both.

[0095] The integrated electronics may have a wired connection to a control unit, a wireless connection to a control unit, or both. The integrated electronics may have a two- wire (e.g., hot and neutral), optionally a three-wire interface (e.g., hot, neutral, and ground) interface for connection with a control unit.

[0096] As referred to herein, a cable may include two or more wires. By way of example, a two-wire interface described herein may be comprised by a cable.

[0097] The integrated electronics may be located upon the at least one heating element. The integrated electronics may be located directly upon the at least one heating element. The integrated electronics may be formed as an integrated circuit board. The integrated electronics may be formed as a thin film. Thin film, as referred to herein, may include any arrangement of one or more, more preferably two or more layers of material, each having a nanometer or micrometer magnitude of thickness. The layers may be formed by processes such as thin-film deposition processes. The layers may include electrically conductive layers, electrically non-conductive layers, semi-conductor layers, or any combination thereof.

[0098] The integrated electronics may comprise one or more processors. The one or more processors may determine one or more power characteristics provided to the at least one heating element. The one or more power characteristics may be determined by inputs from the one or more sensors, one or more additional sensors, a control unit, or any combination thereof, as described herein.

[0099] The integrated electronics may cooperate with a control unit in these regards. The control unit may provide one or more setpoint temperatures, one or more operating parameters, or both, as discussed in greater detail below.

[0100] The integrated electronics may comprise one or more memory storage mediums. The one or more memory storage mediums may be non-transitory. The memory storage medium may store data relating to inputs from sensors and / or additional sensors, calibration, failure events, default basic heating functions, operation records (e.g., historical temperatures, time in operation, operating statuses, etc.), or any combination thereof. Additionally, some or all of this data may be communicated to a control unit. Some or all of this data may be stored on one or more memory storage mediums of a control unit.

[0101] A default basic heating function may be employed where signal communication of the integrated electronics with the control unit, the plurality of sensors, or both are interrupted (e.g., not present or not functioning). Stated differently, the default basic heating function may continue operation of the at least one heating element while there is a fault in the system, until such fault is corrected. The default basic heating function may operate the at least one heating element at a lower temperature, compared to a scenario without a system fault, to avoid overheating the patient or injuring the patient.

[0102] The integrated electronics may comprise or communicate with one or more light sources. An exemplary light source is a light emitting diode (LED) light. The one or more light sources may function to indicate an operating status of the heating pad. Such operating status may include whether the heating pad is running, whether the heating pad is stopped, whether there is a failure, the like, or any combination thereof.

[0103] The integrated electronics may operate the at least one heating element by controlling one or more power characteristics provided to the at least one heating element. Power may be provided to the at least one heating element by phase-fired control (PFC) or pulse-width modulation (PWM).

[0104] In the context of phase-fired control (PFC), the one or more power characteristics may include the phase angle of the applied waveform. In the context of pulse-width modulation (PWM), the one or more power characteristics may include the duty cycle. The one or more power characteristics may further include current, voltage, or both.

[0105] With a known resistance of a heating element, one or more power characteristics may be adjusted to arrive at a desired power density. The resistance of the heating element may be stored in any memory storage medium described herein.

[0106] The integrated electronics may include a wireless data interface The wireless data interface may be adapted and configured for communication over a wirelessnetwork, such as a Wi-Fi network, a Bluetooth network, a near-field communication network, or any combination thereof. The integrated electronics may exchange digital data with the plurality of sensors, a control unit, or both, via the wireless data interface. In this regard, wires may be reduced in quantity or eliminated from the heating pad. For example, any wires connecting the integrated electronics to a control unit, described in some illustrative aspects herein, may be eliminated.

[0107] The integrated electronics may provide additional data to exchange with the control unit (e.g., current heat transfer, calibration data, hours in operation, operation status, failures, others).

[0108] The medical heating device system may comprise a control unit. The control unit may function to provide for power transmission, digital data exchange, or both, with the integrated electronics, the plurality of sensors, the one or more additional sensors, or any combination thereof. The control unit may be located off-board the heating pad.

[0109] The control unit may be a dedicated device, a tablet, a laptop computer, a desktop computer, a smartphone, or other suitable computing device. The control unit may have one or more data ports for wired connection to the heating pad. The control unit may have a graphical user interface. The control unit may have a human-machine interface (e.g., buttons, dials, levers, or the like). Users may select one or more setpoint temperatures via the human-machine interface. Typically, the temperature may be selected from a range of about 32°C to about 39°C, although a greater temperature range is also contemplated (e.g., about 28 °C to about 42 °C). The temperature may be adjusted in increments (e.g., about 0.5 °C increments).

[0110] Operating parameters, as referred to herein, may include pre-determined programs, temperature change rates, safety thresholds, or any combination thereof.

[0111] The control unit may comprise one or more memory storage mediums. The memory storage mediums may be non-transitory. The one or more memory storage mediums may store the one or more setpoint temperatures, the one or more operating parameters, or both. Additionally the one or more memory storage mediums may store any data discussed herein that is communicated from the integrated electronics. For example, sensor-reported temperatures may be communicated to the control unit.

[0112] The control unit may include a wireless data interface The wireless data interface may be adapted and configured for communication over a wireless network, such as a Wi-Fi network, a Bluetooth network, a near-field communication network, or any combination thereof. The control unit may exchange digital data with the plurality of sensors, integrated electronics, or both, via the wireless data interface. In this regard, wires may be reduced in quantity or eliminated from the heating pad. For example, anywires connecting the control unit to integrated electronics, described in some illustrative aspects herein, may be eliminated.

[0113] The medical heating device system may comprise one or more power supplies. The power supply may be integrated into the control unit. The power supply may be separate from the control unit. In any event, the power supply may be connected to the integrated electronics. The integrated electronics may adjust one or more power characteristics of the power supplied by the power supply.

[0114] With the power supply separate from the control unit, the control unit may be readily moved around the environment that the medical heating device system is being used in. That is, the power supply may remain proximate to the heating pad, and the control unit may be moved around a room, building unit, or building.

[0115] FIG. 1 illustrates a medical heating device system 100 according to the present teachings. The medical heating device system 100 comprises a heating pad 102, including a resistive heating element 104 and two electrodes 106 functioning to provide power to the resistive heating element 104. In this regard, the two electrodes 106 include one electrode that functions as an anode and one electrode that functions as a cathode. Thus, a resistance of the resistive heating element 104, in conjunction with the said power provision, may cause the temperature of the heating element 104 to rise.

[0116] Internal connection wires 108 connect the electrodes 106 to integrated electronics 110. The internal connection wires 108 additionally connect sensors 112 (e.g., temperature sensors) to the integrated electronics 110. The integrated electronics 110 can provide power to the electrodes 106 in accordance with one or more power characteristics described herein. Such power characteristics may be determined, at least in part, by data input from the sensors 112.

[0117] A control unit 114 with integrated power supply 116 is included, which provides power transmission to the integrated electronics 110 and digital data exchange via the external connection cable 118a, 118b. The power transmission may ultimately be provided to the electrodes of the heating pad 102 via the integrated electronics 110.

[0118] FIG. 2 illustrates another medical heating device system 200 according to the present teachings, which has a heating pad 202, resistive heating element 204, electrodes 206, internal connection wires 208, and an external connection cable 218 in similar arrangement as described above. The integrated electronics 210, sensors 212, and control unit 214 further comprise light sources 220 (e.g., LED lights).

[0119] The light sources 220 of the sensors 212 can function to indicate the locations of the sensors 212. That is, the present teachings contemplate that the sensors 212 may be hidden under a cover layer of the medical heating device system 200. This may be useful in the context of radiological images, such as X-rays, taken of the patient when themedical heating device system 200 is in use, to allow a technician to reposition the medical heating device system 200 relative to the patient, to avoid the sensors 212 from obfuscating the image captured by radiology instruments.

[0120] The light sources 220 of the integrated electronics 210 and the control unit 214 can function to indicate an operating status thereof. For instance, such operating status may indicate if the heating pad 202 is running, stopped, or experiencing a failure. It is also contemplated that other statuses may be ascertained, such as a general temperature level of the heating pad 202, disconnection of communication between the integrated electronics 210 and the control unit 214, or the like. The light source 220 of the integrated electronics 210 may be particularly advantageous in the event it loses data exchange connection with the control 214. Continued operation of the heating pad 202 may be continued, such as according to a default basic heating function as described herein, while a fix for the data exchange connection is sought. In another aspect, if it is desired or programmed for the heating pad 202 to cease operation in such an event, the light source 220 may confirm ceased operation. These scenarios are merely exemplary, and other functionality is contemplated.

[0121] FIG. 3 illustrates a medical heating device system 300 according to the present teachings, which has a heating pad 302, resistive heating element 304, and electrodes 306, in similar arrangement as described above. The internal connection wire 308 connects the electrode 306 to the integrated electronics 310. The sensors 312 each comprise a light source 314, as described above, and wireless data interface 316.

[0122] Additionally, the integrated electronics 310 and the control unit 318 comprise a wireless data interface 316. In this regard, the sensors 312, the integrated electronics 310, the control unit 318, or any combination thereof may exchange digital data. Accordingly, wires may be eliminated from the medical heating device system 300 to further realize the benefits described herein. For instance, wires connecting sensors and integrate electronics can be eliminated, wires or cables connecting the integrated electronics and control unit can be eliminated.

[0123] Where the wireless data interfaces 316 provide for digital data exchange between the integrated electronics 310 and the control unit 318, a power source 320 can be provided separate from the control unit 318, and the power source 320 can be connected to the integrated electronics 310 via an external connection cable 322.

[0124] Accordingly, the specific embodiments of the present teachings as set forth are not intended as being exhaustive or limiting. The scope of the teachings should, therefore, be determined not with reference to this description, but should instead be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled. The omission in the following claims of any aspect of subjectmatter that is disclosed herein is not a disclaimer of such subject matter, nor should it be regarded that the inventors did not consider such subject matter to be part of the disclosed inventive subject matter.

[0125] Plural elements can be provided by a single integrated element. Alternatively, a single element might be divided into separate plural elements.

[0126] The disclosure of "a" or "one" to describe an element is not intended to foreclose additional elements. For example, disclosure of “a heating pad” does not limit the teachings to a single heating pad. Instead, for example, disclosure of “a heating pad” may include “one or more heating pads.”

[0127] While the terms first, second, third, etc., may be used herein to describe various elements, components, regions, layers, and / or sections, these elements, components, regions, layers, and / or sections should not be limited by these terms. These terms may be used to distinguish one element, component, region, layer, and / or section from another region, layer, and / or section. Terms such as “first,” “second,” and other numerical terms when used herein do not imply a sequence or order unless clearly indicated by the context. Thus, a first element, component, region, layer, and / or section discussed herein could be termed a second element, component, region, layer, and / or section without departing from the teachings.

[0128] Spatially relative terms, such as “inner,” “outer,” “beneath,” “below,” “lower,” “above,” “upper,” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s), such as illustrated in the figures. Spatially relative terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as “below” or “beneath” other elements or features would then be oriented “above” the other elements or features. Thus, the example term “below” can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

[0129] The teachings illustratively disclosed herein may suitably be practiced in the absence of any element which is not specifically disclosed herein.

[0130] Any of the elements, components, regions, layers, and / or sections disclosed herein are not necessarily limited to a single embodiment. Instead, any of the elements, components, regions, layers, and / or sections disclosed herein may be substituted, combined, and / or modified with any of the elements, components, regions, layers, and / or sections disclosed herein to form one or more embodiments that may be or may not be specifically illustrated or described herein.

[0131] The disclosures of all articles and references, including patent applications and publications, testing specifications, are incorporated by reference for all purposes.

[0132] Other combinations are also possible as will be gleaned from the following claims, which are also hereby incorporated by reference into this written description.

[0133] REFERENCE NUMERALS

[0134] 100 medical heating device system

[0135] 102 heating pad

[0136] 104 resistive heating element

[0137] 106 electrodes

[0138] 108 internal connection wire(s)

[0139] 110 integrated electronics

[0140] 112 sensors

[0141] 114 control unit

[0142] 116 power supply

[0143] 118 external connection cable

[0144] 200 medical heating device system

[0145] 202 heating pad

[0146] 204 resistive heating element

[0147] 206 electrodes

[0148] 208 internal connection wire(s)

[0149] 210 integrated electronics

[0150] 212 sensors

[0151] 214 control unit

[0152] 216 power supply

[0153] 218 external connection cable

[0154] 220 light source

[0155] 300 medical heating device system

[0156] 302 heating pad

[0157] 304 resistive heating element

[0158] 306 electrodes

[0159] 308 internal connection wire

[0160] 310 integrated electronics

[0161] 312 sensors

[0162] 314 light source

[0163] 316 wireless data interface

[0164] 318 control unit

[0165] 320 power source

[0166] 322 external connection cable

Claims

CLAIMSClaim 1 : A medical heating device system comprising: a heating pad with at least one heating element; a plurality of sensors disposed in different regions of the at least one heating element and capable of sensing a temperature thereof in said different regions; integrated electronics on-board the heating pad, and adapted and configured to selectively provide for power transmission, digital data exchange, or both, with the at least one heating element, the plurality of sensors, or both; and a control unit off-board the heating pad, and adapted and configured to provide for power transmission, digital data exchange, or both, with the integrated electronics.Claim 2: The medical heating device system according to Claim 1 , wherein the plurality of sensors are free from wired connection, such as a direct wired connection, to the control unit.Claim 3: The medical heating device system according to Claim 1 or Claim 2, wherein the control unit comprises a memory storage medium having one or more setpoint temperatures, one or more operating parameters, or both, for operation of the at least one heating element.Claim 4: The medical heating device system according to Claim 3, wherein the integrated electronics comprise a processor that determines one or more power characteristics provided to the at least one heating element based on the one or more setpoint temperatures, the one or more operating parameters, or both in view of reported temperatures from the plurality of sensors; and optionally wherein the integrated electronics comprise a memory storage medium having a default basic heating function, which operates at least in an event where signal communication with the control unit is interrupted.Claim 5: The medical heating device system according to any one of the preceding claims, wherein the integrated electronics have a two-wire interface for connection with the control unit.Claim 6: The medical heating device system according to any one of Claims 1 through 4, wherein the control unit has an integrated power supply or the medical heating device system comprises a power supply separate from the control unit.Claim 7: The medical heating device system according to Claim 6, wherein the control unit has a wireless data interface and the integrated electronics have a wireless data interface for said digital data exchange therebetween.Claim 8: The medical heating device system according to any one of the preceding claims, wherein the integrated electronics uses phase-fired control (PFC) or pulse-width modulation (PWM) to regulate the temperature of the at least one heating element; and wherein such phase-fired control or pulse-width modulation are adjusted in view of a predetermined resistance of the at least one heating element to arrive at a desired power density; and wherein the power density is about 100 W / m2to about 250 W / m2, more preferably about 150 W / m2to about 200 W / m2.Claim 9: The medical heating device system according to any one of the preceding claims, wherein the at least one heating element functions as a resistive heating element and is fabricated from at least carbon fibers.Claim 10: The medical heating device system according to Claim 9, wherein the carbon fibers are formed into a woven pattern.Claim 11 : The medical heating device system according to any one of the preceding claims, wherein any wired connection of the plurality of sensors, downstream of the integrated electronics, is discrete from any wired connection of the at least one heating element.Claim 12: The medical heating device system according to any one of the preceding claims, wherein at least two of the plurality of sensors each have separate wired connection to the integrated electronics.Claim 13: The medical heating device system according to any one of the preceding claims, wherein each of the plurality of sensors have separate wired connection to the integrated electronics.Claim 14: The medical heating device system according to any one of the preceding claims, wherein the plurality of sensors are disposed upon the at least one heating element, as a separate layer from the at least one heating element.Claim 15: The medical heating device system according to any one of the preceding claims, wherein the integrated electronics are located upon the at least one heating element.Claim 16: The medical heating device system according to any one of the preceding claims, wherein the integrated electronics are located directly upon the at least one heating element.Claim 17: The medical heating device system according to any one of the preceding claims, wherein the integrated electronics are formed as a thin film.Claim 18: The medical heating device system according to any one of the preceding claims, further comprising at least two electrodes; and wherein a first of the at least two electrodes is proximally located and optionally directly connected to the integrated electronics and a second of the at least two electrodes is distally located from connected to the integrated electronics via a wire.Claim 19: The medical heating device system according to any one of the preceding claims, wherein the integrated electronics comprise or communicate with a light source adapted and configured to indicate an operating status of the heating pad.Claim 20: The medical heating device system according to any one of the preceding claims, wherein the plurality of sensors include a wireless data interface for signal communication with the integrated electronics, the control unit, or both.Claim 21: The medical heating device system according to any one of the preceding claims, wherein the plurality of sensors comprise a light source for visually indicating a location of the plurality of sensors.Claim 22: The medical heating device system according to any one of the preceding claims, further comprising one or more additional sensors adapted and configured to measure one or more biometric characteristics of a patient using the medical heating device system.Claim 23: The medical heating device system according to Claim 22, wherein the one or more additional sensors signally communicate with the integrated electronics, the control unit, or both; and wherein the one or more additional sensors contribute to the determination of one or more power characteristics provided to the at least one heating element by the integrated electronics.Claim 24: The medical heating device system according to any one of the preceding claims, further comprising one or more additional heating pads wiredly or wirelessly connected to the control unit.

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