Display panel and display apparatus

By setting an organic isolation structure and an inorganic groove overlapping in the bezel area of ​​the OLED display panel, the problem of film peeling or breakage in the sealing process is solved, improving the bending stability and display effect of the display panel.

WO2025260544A1PCT designated stage Publication Date: 2025-12-26BOE TECHNOLOGY GROUP CO LTD +1
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Patent Information

Application Number
PCT/CN2024/121827
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-06-17
Filing Date
2024-09-27
Publication Date
2025-12-26

AI Technical Summary

Technical Problem

Existing OLED display panels are prone to film peeling or breakage during the encapsulation process in the bezel area, which affects the display effect.

Method used

An organic isolation structure is set in the bezel area of ​​the display panel, which overlaps with the inorganic groove portion of the composite inorganic insulating layer, covering the inorganic edge to improve the film layer peeling or breakage when bending.

Benefits of technology

By setting an organic isolation structure, the stability of the film layer in the bending area is improved, avoiding peeling or breakage of the film layer and enhancing the display effect.

✦ Generated by Eureka AI based on patent content.

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Abstract

A display panel, comprising: a substrate, a composite inorganic insulating layer, a plurality of organic insulating layers, an inorganic encapsulation layer, and an organic isolation structure. The substrate comprises a display region and a first frame region located on at least one side of the display region, the first frame region containing a bending region. The composite inorganic insulating layer is located on a side of the substrate and comprises an inorganic trench located in the first frame region, the orthographic projection of the inorganic trench on the substrate covering the orthographic projection of the bending region on the substrate. The plurality of organic insulating layers are located on the side of the composite inorganic insulating layer away from the substrate. The inorganic encapsulation layer is located on the side of the plurality of organic insulating layers away from the substrate. The organic isolation structure is located in the first frame region and on the side of the inorganic encapsulation layer away from the substrate, the orthographic projection of the organic isolation structure on the substrate at least partially overlapping the orthographic projection of the inorganic trench on the substrate.
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Description

Display panel and display device

[0001] This application claims priority to Chinese Patent Application No. 202410781626.4, filed on June 17, 2024, entitled “Display Panel and Display Device”, the contents of which are to be understood as incorporated herein by reference. Technical Field

[0002] This article relates to, but is not limited to, the field of display technology, and in particular to a display panel and display device. Background Technology

[0003] Organic light-emitting diodes (OLEDs) and quantum dot light-emitting diodes (QLEDs) are active light-emitting display devices with advantages such as self-illumination, wide viewing angle, high contrast, low power consumption, extremely high response speed, thinness, flexibility, and low cost.

[0004] Summary of the Invention

[0005] The following is an overview of the subject matter described in detail herein. This overview is not intended to limit the scope of the claims.

[0006] This application provides a display panel and a display device.

[0007] On one hand, this embodiment provides a display panel, including: a substrate, a composite inorganic insulating layer, a plurality of organic insulating layers, an inorganic encapsulation layer, and an organic isolation structure. The substrate includes a display area and a first border area located on at least one side of the display area, the first border area including a bending region. The composite inorganic insulating layer is located on one side of the substrate and includes an inorganic groove located in the first border area, the orthographic projection of the inorganic groove onto the substrate covering the orthographic projection of the bending region onto the substrate. The plurality of organic insulating layers are located on the side of the composite inorganic insulating layer away from the substrate. The inorganic encapsulation layer is located on the side of the plurality of organic insulating layers away from the substrate. The organic isolation structure is located in the first border area and on the side of the inorganic encapsulation layer away from the substrate; the orthographic projection of the organic isolation structure onto the substrate at least partially overlaps with the orthographic projection of the inorganic groove onto the substrate.

[0008] In some exemplary embodiments, the inorganic groove has a first inorganic edge and a second inorganic edge, the first inorganic edge being located on the side of the bending region closer to the display area, and the second inorganic edge being located on the side of the bending region away from the display area; the orthographic projection of the organic isolation structure onto the substrate covers the orthographic projection of the first inorganic edge onto the substrate.

[0009] In some exemplary embodiments, the organic isolation structure has a first isolation edge away from the display area, and the minimum distance between the first isolation edge and the first inorganic edge along the direction away from the display area is greater than or equal to 5 micrometers.

[0010] In some exemplary embodiments, the organic isolation structure includes: a first isolation pillar and a second isolation pillar disposed independently, the first isolation pillar and the second isolation pillar being located on the side of the bending region near the display area, the first isolation pillar being located on the side of the second isolation pillar near the bending region, and the orthographic projection of the first isolation pillar on the substrate at least partially overlapping the orthographic projection of the inorganic trench on the substrate.

[0011] In some exemplary embodiments, the inorganic groove has a first inorganic edge and a second inorganic edge, the first inorganic edge being located on the side of the bending region closer to the display area, and the second inorganic edge being located on the side of the bending region away from the display area; the orthographic projection of the first isolation pillar on the substrate covers the orthographic projection of the first inorganic edge on the substrate.

[0012] In some exemplary embodiments, the display panel further includes: at least one touch conductive layer and a plurality of first bent connecting lines. The at least one touch conductive layer is located on the side of the inorganic encapsulation layer away from the substrate and on the side of the organic isolation structure near the substrate, including a plurality of touch leads located in the first frame region. The plurality of first bent connecting lines are located in the first frame region and on the side of the composite inorganic insulating layer away from the substrate. At least one of the plurality of organic insulating layers is provided with a plurality of first adapter holes, the first adapter holes being configured to electrically connect the corresponding touch leads and the first bent connecting lines. The plurality of first adapter holes are located on the side of the inorganic slot near the display area. The orthographic projection of the organic isolation structure onto the substrate covers the orthographic projection of the plurality of first adapter holes onto the substrate.

[0013] In some exemplary embodiments, the display panel further includes: a plurality of display leads and a plurality of second bent connecting lines. The plurality of display leads are located in the first frame region and on the side of the inorganic encapsulation layer closest to the substrate. The plurality of second bent connecting lines are located in the first frame region and on the side of the plurality of display leads furthest from the substrate. At least one of the plurality of organic insulating layers has a plurality of second adapter holes configured to electrically connect corresponding display leads and second bent connecting lines. The orthographic projection of the organic insulating structure onto the substrate at least partially overlaps with the orthographic projection of the plurality of second adapter holes onto the substrate.

[0014] In some exemplary embodiments, the orthographic projection of the organic isolation structure onto the substrate covers the orthographic projection of the plurality of second adapter holes onto the substrate.

[0015] In some exemplary embodiments, the organic isolation structure includes: a first isolation pillar having a first main body and a plurality of extensions connected to the side of the first main body near the display area, the plurality of extensions being spaced apart along the extension direction of the first main body. The orthographic projection of the first main body onto the substrate at least partially overlaps with the orthographic projection of the inorganic trench onto the substrate, and the orthographic projection of at least one of the plurality of extensions onto the substrate covers the orthographic projection of at least one of the plurality of first adapter holes onto the substrate.

[0016] In some exemplary embodiments, the first main body includes a plurality of main blocks spaced apart along the extension direction; the plurality of main blocks are offset from the plurality of extensions in a direction away from the display area; the orthographic projection of each of the plurality of main blocks on the substrate overlaps with the orthographic projection of the inorganic groove on the substrate.

[0017] In some exemplary embodiments, the organic isolation structure includes: a first isolation pillar and a second isolation pillar disposed independently, the first isolation pillar and the second isolation pillar being located on the side of the bending area near the display area, the first isolation pillar being located on the side of the second isolation pillar near the bending area, the orthographic projection of the first isolation pillar on the substrate at least partially overlapping the orthographic projection of the inorganic trench on the substrate, and the orthographic projection of the second isolation pillar on the substrate covering the orthographic projection of the plurality of first adapter holes on the substrate.

[0018] In some exemplary embodiments, the orthographic projection of the organic isolation structure onto the substrate covers the orthographic projection of the edge of the inorganic encapsulation layer away from the display area onto the substrate.

[0019] In some exemplary embodiments, in a direction perpendicular to the display panel, the display area of ​​the display panel may include a display structure layer and a touch structure layer disposed on the substrate. The touch structure layer includes a plurality of touch units and a protective layer located on the side of the plurality of touch units away from the display structure layer; the organic isolation structure and the protective layer of the touch structure layer are of the same layer.

[0020] In some exemplary embodiments, the display structure layer includes: a semiconductor layer, a first gate insulating layer, a first gate metal layer, a second gate insulating layer, a second gate metal layer, and an interlayer insulating layer disposed on the substrate; the composite inorganic insulating layer of the first frame region includes: a first gate insulating layer, a second gate insulating layer, and an interlayer insulating layer stacked sequentially.

[0021] In some exemplary embodiments, the display structure layer further includes: a first source / drain metal layer, a first planarization layer, a second source / drain metal layer, a second planarization layer, a first electrode of a plurality of light-emitting elements, and a pixel definition layer disposed along a distance from the interlayer insulating layer; the plurality of organic insulating layers in the first border region include: a first planarization layer, a second planarization layer, and a pixel definition layer disposed sequentially.

[0022] On the other hand, this embodiment provides a display device, including the display panel as described above.

[0023] Other features and advantages of this application will be set forth in the following description, and will be apparent in part from the description, or may be learned by practicing the application. Other advantages of this application can be realized and obtained by means of the solutions described in the description and the accompanying drawings.

[0024] Overview of the attached figures

[0025] The accompanying drawings are used to provide an understanding of the technical solutions of this application and constitute a part of the specification. They are used together with the embodiments of this application to explain the technical solutions of this application and do not constitute a limitation on the technical solutions of this application.

[0026] Figure 1 is a schematic diagram of a display panel according to at least one embodiment of the present disclosure;

[0027] Figure 2 is a partial cross-sectional schematic diagram of the display area of ​​a display panel according to at least one embodiment of the present disclosure;

[0028] Figure 3 is a partial structural schematic diagram of the first border area of ​​a display panel according to at least one embodiment of the present disclosure;

[0029] Figure 4A is a partial cross-sectional view along the Q-Q' direction in Figure 3;

[0030] Figure 4B is a partial cross-sectional view along the R-R' direction in Figure 3;

[0031] Figure 5 is a schematic diagram of another partial structure of the first border region according to at least one embodiment of the present disclosure;

[0032] Figure 6 is a schematic diagram of another partial structure of the first border region according to at least one embodiment of the present disclosure;

[0033] Figure 7 is a schematic diagram of another partial structure of the first border region according to at least one embodiment of the present disclosure;

[0034] Figure 8 is a schematic diagram of another partial structure of the first border region according to at least one embodiment of the present disclosure;

[0035] Figure 9 is a schematic diagram of another partial structure of the first border region according to at least one embodiment of the present disclosure;

[0036] Figure 10 is a schematic diagram of a display device according to at least one embodiment of the present disclosure.

[0037] Detailed Explanation

[0038] The embodiments of this disclosure will now be described in detail with reference to the accompanying drawings. The implementation can be carried out in many different forms. Those skilled in the art will readily understand that the methods and content can be transformed into other forms without departing from the spirit and scope of this disclosure. Therefore, this disclosure should not be construed as limited to the content described in the following embodiments. Unless otherwise specified, the embodiments and features in the embodiments of this disclosure can be arbitrarily combined with each other.

[0039] In the accompanying drawings, the size of one or more constituent elements, the thickness of layers, or areas are sometimes exaggerated for clarity. Therefore, this disclosure is not necessarily limited to these dimensions, and the shape and size of one or more parts in the drawings do not reflect true proportions. Furthermore, the drawings schematically illustrate ideal examples, and this disclosure is not limited to the shapes or values ​​shown in the drawings.

[0040] The ordinal numbers such as "first," "second," and "third" used in this specification are used to avoid confusion among the constituent elements, not to limit the quantity. The term "multiple" in this disclosure refers to two or more quantities.

[0041] In this specification, for convenience, terms such as "middle," "upper," "lower," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," and "outer" are used to indicate orientation or positional relationships in conjunction with the accompanying drawings. This is solely for the purpose of facilitating the description and simplification, and does not imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation of this disclosure. The positional relationships of the constituent elements may be appropriately varied depending on the orientation of the constituent elements being described. Therefore, the use of terms not limited to those described in the specification may be appropriately replaced as needed.

[0042] In this specification, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; a mechanical connection or joint; a direct connection, an indirect connection via an intermediate component, or a connection within two components. Those skilled in the art will understand the meaning of these terms in this disclosure as appropriate. "Joining" can include "electrical connection," which can include situations where constituent elements are connected together by a component having some electrical function. There are no particular limitations on "components having some electrical function," as long as they enable the transmission of electrical signals between the connected constituent elements. Examples of "components having some electrical function" include not only electrodes and wiring, but also switching elements such as transistors, resistors, inductors, capacitors, and other multifunctional components.

[0043] In this specification, a transistor is a device that includes at least three terminals: a gate (gate electrode), a drain, and a source. A transistor has a channel region between its drain (drain electrode terminal, drain region, or drain electrode) and its source (source electrode terminal, source region, or source electrode), and current can flow through the drain, the channel region, and the source. In this specification, the channel region refers to the region through which current primarily flows.

[0044] In this specification, the first terminal can be the drain and the second terminal can be the source, or vice versa. Additionally, the gate can also be called the control terminal. In cases where transistors with opposite polarities are used or where the current direction changes during circuit operation, the functions of the "source" and "drain" are sometimes interchanged. Therefore, in this specification, the "source" and "drain" can be interchanged.

[0045] In this specification, "parallel" refers to the state where the angle formed by two straight lines is greater than or equal to -10° and less than 10°, and therefore also includes the state where the angle is greater than or equal to -5° and less than 5°. Similarly, "perpendicular" refers to the state where the angle formed by two straight lines is greater than or equal to 80° and less than 100°, and therefore also includes the state where the angle is greater than or equal to 85° and less than 95°.

[0046] In this specification, circles, ellipses, triangles, rectangles, trapezoids, pentagons, or hexagons are not strictly defined. They can be approximate circles, ellipses, triangles, rectangles, trapezoids, pentagons, or hexagons. Small deformations due to tolerances are possible, such as chamfers, curved edges, and other variations.

[0047] In this specification, "approximately" and "about" mean without strictly defined limits, allowing for errors in the process and measurement. In this disclosure, "same" includes values ​​differing by less than 10%, such as values ​​differing by less than 5%.

[0048] In this specification, "A extends along direction B" means that A may include a main part and a secondary part connected to the main part. The main part is a line, line segment, or strip-shaped solid. The main part extends along direction B, and the length of the main part extending along direction B is greater than the length of the secondary part extending along other directions. In this specification, "A extends along direction B" refers to "the main part of A extends along direction B".

[0049] The phrase "A and B are of the same layer" in this specification means that A and B are formed simultaneously through the same patterning process. "Same layer" does not always mean that the layer thickness or layer height is the same in the cross-sectional view. "The orthographic projection of A includes the orthographic projection of B" means that the orthographic projection of B falls within the orthographic projection area of ​​A, or the orthographic projection of A covers the orthographic projection of B.

[0050] With the development of display technology, narrow-bezel display products are receiving increasing attention, and people have higher and higher requirements for the performance of display products. Taking OLED display panels as an example, the encapsulation process of narrow-bezel OLED display panels requires high panel strength. For example, in the bezel area (such as the bending area), the film layer is prone to peeling or cracking due to the stretching of the encapsulation, which can lead to poor display quality.

[0051] This embodiment provides a display panel and display device that can improve the situation of film peeling or breakage in the frame area.

[0052] This embodiment provides a display panel, including: a substrate, a composite inorganic insulating layer, multiple organic insulating layers, an inorganic encapsulation layer, and an organic isolation structure. The substrate includes a display area and a first border area located on at least one side of the display area, the first border area including a bending region. The composite inorganic insulating layer is located on one side of the substrate and includes an inorganic groove located in the first border area; the orthographic projection of the inorganic groove onto the substrate overlaps the orthographic projection of the bending region onto the substrate. The multiple organic insulating layers are located on the side of the composite inorganic insulating layer away from the substrate. The inorganic encapsulation layer is located on the side of the multiple organic insulating layers away from the substrate. The organic isolation structure is located in the first border area and on the side of the inorganic encapsulation layer away from the substrate; the orthographic projection of the organic isolation structure onto the substrate at least partially overlaps the orthographic projection of the inorganic groove onto the substrate.

[0053] The display panel provided in this embodiment improves the display effect by setting an organic isolation structure, wherein the orthographic projection of the organic isolation structure on the substrate and the orthographic projection of the inorganic groove of the composite inorganic insulating layer on the substrate at least partially overlap.

[0054] In some exemplary embodiments, the inorganic trench may have a first inorganic edge and a second inorganic edge, the first inorganic edge being located on the side of the bending region closer to the display area, and the second inorganic edge being located on the side of the bending region farther from the display area; the orthographic projection of the organic isolation structure onto the substrate covers the orthographic projection of the first inorganic edge onto the substrate. This example, by covering the first inorganic edge of the inorganic trench with an organic isolation structure, can improve the problem of film peeling or breakage that occurs when the bending region is bent.

[0055] In some exemplary embodiments, the display panel further includes: at least one touch conductive layer and a plurality of first bent connecting lines. The at least one touch conductive layer is located on the side of the inorganic encapsulation layer away from the substrate and on the side of the organic isolation structure near the substrate, including a plurality of touch leads located in the first bezel region. The plurality of first bent connecting lines are located in the first bezel region and on the side of the composite inorganic insulating layer away from the substrate. At least one of the plurality of organic insulating layers is provided with a plurality of first transition holes, the first transition holes being configured to electrically connect the corresponding touch leads and the first bent connecting lines. The plurality of first transition holes are located on the side of the inorganic slot near the display area. The orthographic projection of the organic isolation structure onto the substrate covers the orthographic projection of the plurality of first transition holes onto the substrate. This example, by completely covering the plurality of first transition holes with the organic isolation structure, can improve the problem of film peeling or breakage that occurs when bending the bending area.

[0056] In some exemplary embodiments, the display panel further includes: a plurality of display leads and a plurality of second bent connecting lines. The plurality of display leads are located in the first frame region and on the side of the inorganic encapsulation layer closest to the substrate. The plurality of second bent connecting lines are located in the first frame region and on the side of the plurality of display leads away from the substrate. At least one of the plurality of organic insulating layers is provided with a plurality of second transition holes, the second transition holes being configured to electrically connect the corresponding display leads and second bent connecting lines. The orthographic projection of the organic isolation structure on the substrate at least partially overlaps with the orthographic projection of the plurality of second transition holes on the substrate. This example, by partially or completely covering the plurality of second transition holes with an organic isolation structure, can improve the problem of film peeling or breakage that occurs when bending the bending area.

[0057] The following examples illustrate the solution of this embodiment.

[0058] Figure 1 is a schematic diagram of a display panel according to at least one embodiment of the present disclosure. Figure 1 shows a plan view of the display panel before the bending process. In some examples, as shown in Figure 1, the display panel may include: a display area AA, and a peripheral area BB surrounding the display area AA. For example, the peripheral area BB may include: a first border area B1 located on one side of the display area AA, and border areas located on other sides of the display area AA (e.g., may include a second border area B2, a third border area B3, and a fourth border area B4). Wherein, the first border area B1 may be the bottom border of the display panel, the second border area B2 may be the top border of the display panel, the third border area B3 may be the left border of the display panel, and the fourth border area B4 may be the right border of the display panel.

[0059] In some examples, as shown in Figure 1, the display area AA can be a flat area comprising multiple sub-pixels PX that make up a pixel array. These sub-pixels PX can be configured to display moving or still images. The display area AA can be referred to as the active area. In some examples, the display area AA can be rectangular. However, this embodiment is not limited to this. For example, the display area AA can be other shapes such as circular or elliptical. In some examples, the display panel can be a flexible panel, and therefore the display panel can be deformable, such as rolled, bent, folded, or rolled up.

[0060] In some examples, as shown in Figure 1, the display area AA may include at least: multiple sub-pixels PX, multiple gate lines GL, and multiple data lines DL. The multiple gate lines GL may extend along a first direction X, and the multiple data lines DL may extend along a second direction Y. The orthogonal projections of the multiple gate lines GL and the multiple data lines DL onto the substrate may intersect to form multiple sub-pixel regions, each of which may contain one sub-pixel PX. The multiple data lines DL may be electrically connected to the multiple sub-pixels PX, and the multiple data lines DL may be configured to provide data signals to the multiple sub-pixels PX. The multiple gate lines GL may be electrically connected to the multiple sub-pixels PX, and the multiple gate lines GL may be configured to provide gate control signals to the multiple sub-pixels PX. In some examples, the gate control signals may include scan signals and light emission control signals, or may include scan signals, or may include scan signals, reset control signals, and light emission control signals.

[0061] In some examples, as shown in Figure 1, the first direction X can be the extension direction of the grid line GL in the display area AA (e.g., the row direction), and the second direction Y can be the extension direction of the data line DL in the display area AA (e.g., the column direction). The first direction X and the second direction Y can intersect each other, for example, they can be perpendicular to each other.

[0062] In some examples, a pixel unit of the display area AA may include three sub-pixels, namely a red sub-pixel, a green sub-pixel, and a blue sub-pixel. However, this embodiment is not limited to this. In some examples, a pixel unit may include four sub-pixels, namely a red sub-pixel, a green sub-pixel, a blue sub-pixel, and a white sub-pixel.

[0063] In some examples, the shape of the subpixels can be rectangular, rhomboid, pentagonal, or hexagonal. When a pixel unit includes three subpixels, the three subpixels can be arranged horizontally side-by-side, vertically side-by-side, or in a triangular arrangement; when a pixel unit includes four subpixels, the four subpixels can be arranged horizontally side-by-side, vertically side-by-side, or in a square arrangement. However, this embodiment is not limited in this respect.

[0064] In some examples, a sub-pixel may include a pixel circuit and a light-emitting element electrically connected to the pixel circuit. The pixel circuit may include multiple transistors and at least one capacitor. For example, the pixel circuit may be a 3T1C, 4T1C, 5T1C, 5T2C, 6T1C, 7T1C, or 8T1C structure. In these circuit structures, T refers to a thin-film transistor, C refers to a capacitor, the number before T represents the number of thin-film transistors in the circuit, and the number before C represents the number of capacitors in the circuit. In some examples, the multiple transistors in the pixel circuit may be P-type transistors or N-type transistors. Using the same type of transistors in the pixel circuit can simplify the manufacturing process, reduce the manufacturing difficulty of the display panel, and improve product yield. In other examples, the multiple transistors in the pixel circuit may include both P-type and N-type transistors.

[0065] In some examples, the multiple transistors in the pixel circuit can be low-temperature polysilicon (LTPS) thin-film transistors (TFTs), oxide thin-film transistors (OPTs), or a combination of both. The active layer of the LTPS TFT is made of low-temperature polysilicon (LTPS), while the active layer of the OPT TFT is made of oxide. LTPS TFTs offer advantages such as high mobility and fast charging, while OPTs offer advantages such as low leakage current. Integrating LTPS and OPTs onto a single display panel—an LTPS+Oxide (LTPO) display panel—leverages the advantages of both, enabling low-frequency driving, reducing power consumption, and improving display quality.

[0066] In some examples, the light-emitting element can be any of the following: a light-emitting diode (LED), an organic light-emitting diode (OLED), a quantum dot light-emitting diode (QLED), or a micro-LED (including mini-LED or micro-LED). For example, the light-emitting element can be an OLED, which can emit red, green, blue, or white light under the drive of its corresponding pixel circuit. The color of the light emitted by the light-emitting element can be determined as needed. In some examples, the light-emitting element may include an anode, a cathode, and an organic light-emitting layer located between the anode and cathode. The anode of the light-emitting element can be electrically connected to the corresponding pixel circuit. However, this embodiment is not limited in this respect.

[0067] Figure 2 is a partial cross-sectional schematic diagram of the display area of ​​a display panel according to at least one embodiment of the present disclosure. Figure 2 illustrates the structure of a sub-pixel of the display area as an example. In this example, it is described that the multiple transistors in the pixel circuit are of the same type; for example, the multiple transistors in the pixel circuit may all be low-temperature polycrystalline silicon thin-film transistors (LTPS) or all be oxide thin-film transistors (OPS). In other examples, the multiple transistors in the pixel circuit may be both LPS and OPS. Furthermore, this example illustrates a display panel integrating a mutual capacitance touch structure to form a flexible multi-layer on-cell (FMLOC) structure.

[0068] In some examples, as shown in Figure 2, the display area of ​​the display panel may include a substrate 10, and a circuit structure layer 20, a light-emitting structure layer 30, an encapsulation structure layer 40, and a touch structure layer 50 sequentially disposed on the substrate 10. The display structure layer may include at least the circuit structure layer 20 and the light-emitting structure layer 30. The circuit structure layer 20 may include at least pixel circuits for multiple sub-pixels, each sub-pixel's pixel circuit including multiple transistors and at least one capacitor. The light-emitting structure layer 30 may include at least light-emitting elements for multiple sub-pixels.

[0069] In some examples, Figure 2 illustrates a subpixel comprising a thin-film transistor 21 and a capacitor 22. In some examples, the circuit structure layer 20 of the display area may include a semiconductor layer, a first gate metal layer, a second gate metal layer, a first source / drain metal layer, and a second source / drain metal layer disposed on the substrate 10. In this example, the multiple display metal layers of the display structure layer may include a first gate metal layer, a second gate metal layer, a first source / drain metal layer, and a second source / drain metal layer. A first gate insulating layer 101 may be disposed between the semiconductor layer and the first gate metal layer; a second gate insulating layer 102 may be disposed between the first and second gate metal layers; an interlayer insulating layer 103 may be disposed between the second gate metal layer and the first source / drain metal layer; a first planarization layer 104 may be disposed between the first and second source / drain metal layers; and a second planarization layer 105 may be disposed on the side of the second source / drain metal layer away from the substrate 10. In this embodiment, the first gate insulating layer 101, the second insulating layer 102, and the interlayer insulating layer 103 can be inorganic insulating layers, while the first planarization layer 104 and the second planarization layer 105 can be organic insulating layers. However, this embodiment is not limited to these. In other examples, a buffer layer can also be provided on the side of the semiconductor layer near the substrate. The buffer layer can prevent harmful substances in the substrate from penetrating the interior of the display panel and can also increase the adhesion of the film layers in the display panel to the substrate. In other examples, a bottom shielding metal layer (BSM) can be provided on the side of the buffer layer near the substrate. The bottom shielding metal layer can be configured to at least partially cover the active layer of the thin-film transistor of the pixel circuit to avoid external light affecting the performance of the thin-film transistor. In other examples, a passivation layer can also be provided between the first source / drain metal layer and the second source / drain metal layer, with the passivation layer located on the side of the first planarization layer near the substrate.

[0070] In some examples, as shown in FIG2, the semiconductor layer of the display area may include at least the active layer 210 of the thin-film transistor 21. The active layer 210 of the thin-film transistor 21 may include a first region 2101, a second region 2102, and a channel region 2100 located between the first region 2101 and the second region 2102. The first gate metal layer may include at least the gate 213 of the thin-film transistor 21 and the first electrode 221 of the capacitor 22. The orthographic projection of the gate 213 of the thin-film transistor 21 onto the substrate 10 may cover the orthographic projection of the channel region 2100 of the active layer 210 onto the substrate 10. The second gate metal layer may include at least the second electrode 222 of the capacitor 22. The orthographic projections of the second electrode 222 and the first electrode 221 of the capacitor 22 onto the substrate 10 may at least partially overlap, for example, they may coincide. The first source-drain metal layer may include at least the source 211 and the drain 212 of the thin-film transistor 21. The interlayer insulating layer 103 may have multiple vias (e.g., including a first pixel via and a second pixel via) in the display area. The interlayer insulating layer 103, the second gate insulating layer 102, and the first gate insulating layer 101 within the first pixel via can be removed, exposing at least a portion of the surface of the first region 2101 of the active layer 210. The interlayer insulating layer 103, the second gate insulating layer 102, and the first gate insulating layer 101 within the second pixel via can be removed, exposing at least a portion of the surface of the second region 2102 of the active layer 210. The source 211 of the thin-film transistor 21 can be electrically connected to the first region 2101 of the active layer 210 through the first pixel via, and the drain 212 can be electrically connected to the second region 2102 of the active layer 210 through the second pixel via. The second source-drain metal layer may include at least a first transition electrode 231. The first transition electrode 231 can be electrically connected to the drain 212 of the thin-film transistor 21 of the pixel circuit through a third pixel via formed in the first planarization layer 104. This example demonstrates the electrical connection between the pixel circuit and the light-emitting element via the first adapter electrode 231.

[0071] In some examples, the gate lines of the display area may be located in the first gate metal layer, the data lines of the display area may be located in the second source-drain metal layer, and the high-potential power lines of the display area may be located in the second source-drain metal layer. This embodiment is not limited in this respect.

[0072] In some examples, as shown in Figure 2, the light-emitting structure layer 30 of the display area may include a pixel definition layer 304 and multiple light-emitting elements. For example, each light-emitting element may include a stacked first electrode 301, an organic light-emitting layer 302, and a second electrode 303. The first electrode 301 of the light-emitting element can be an anode, and the first electrode 301 can be disposed on the second planarization layer 105 and electrically connected to the first transition electrode 231 through a fourth pixel via formed in the second planarization layer 105. The pixel definition layer 304 is disposed on the first electrode 301 and the second planarization layer 105, and the pixel definition layer 304 may have multiple pixel openings, one pixel opening exposing at least a portion of the surface of a corresponding first electrode 301. At least a portion of the organic light-emitting layer 302 can be disposed within a pixel opening and connected to the corresponding first electrode 301. The second electrode 303 can be disposed on the organic light-emitting layer 302 and connected to the organic light-emitting layer 302. The organic light-emitting layer 302 can emit light of a corresponding color under the drive of the first electrode 301 and the second electrode 303. A display isolation pillar layer can also be provided on the side of the pixel definition layer 304 away from the substrate 10. The display isolation pillar layer may include multiple display isolation pillars (PS).

[0073] In some examples, the organic light-emitting layer 302 of the light-emitting element may include an emitting layer (EML) and one or more films selected from the following: a hole injection layer (HIL), a hole transport layer (HTL), a hole block layer (HBL), an electron block layer (EBL), an electron injection layer (EIL), and an electron transport layer (ETL). Under the voltage drive of the first electrode 301 and the second electrode 303, the light-emitting properties of the organic material can be utilized to emit light at the required grayscale.

[0074] In some examples, the light-emitting layers of different colored light-emitting elements can be different. For example, a red light-emitting element includes a red light-emitting layer, a green light-emitting element includes a green light-emitting layer, and a blue light-emitting element includes a blue light-emitting layer. To reduce process complexity and improve yield, the hole injection layer and hole transport layer on one side of the light-emitting layer can be common layers, as can the electron injection layer and electron transport layer on the other side. In some examples, any one or more of the hole injection layer, hole transport layer, electron injection layer, and electron transport layer can be fabricated in a single process (single vapor deposition process or single inkjet printing process), and isolation can be achieved through surface steps of the formed film layers or through surface treatment. For example, any one or more of the hole injection layer, hole transport layer, electron injection layer, and electron transport layer corresponding to adjacent sub-pixels can be isolated. In some examples, the organic light-emitting layer can be formed by vapor deposition using a fine metal mask (FMM) or an open mask, or by inkjet printing.

[0075] In some examples, as shown in Figure 2, the encapsulation structure layer 40 may include a first encapsulation layer 401, a second encapsulation layer 402, and a third encapsulation layer 403 stacked together. The first encapsulation layer 401 and the third encapsulation layer 403 may be made of inorganic materials, while the second encapsulation layer 402 may be made of organic materials. The second encapsulation layer 402 may be disposed between the first encapsulation layer 401 and the third encapsulation layer 403 to prevent external moisture from entering the light-emitting element. However, this embodiment is not limited to this. For example, the encapsulation structure layer may employ a five-layer stacked structure of inorganic / organic / inorganic / organic / inorganic.

[0076] In some examples, as shown in Figure 2, the touch structure layer 50 of the display area may include, in the direction perpendicular to the display panel, a touch buffer layer (TBL) 501, a first touch conductive layer 511, a touch interlayer insulating layer (TLD) 502, a second touch conductive layer 512, and a protective layer 503, arranged sequentially. For example, the touch buffer layer 501 and the touch interlayer insulating layer 502 may be inorganic insulating layers, and the protective layer 503 may be an organic insulating layer.

[0077] In some examples, the touch structure layer 50 of the display area may include a plurality of touch units (e.g., a plurality of first touch units and a plurality of second touch units). The first touch units may extend along a first direction X, and the plurality of first touch units may be arranged sequentially along a second direction Y. The second touch units may extend along the second direction Y, and the plurality of second touch units may be arranged sequentially along the first direction X. Each first touch unit may include a plurality of first touch electrodes and a first connecting portion arranged sequentially along the first direction X. The first touch electrodes and the first connecting portions may be alternately arranged and sequentially connected. Each second touch unit may include a plurality of second touch electrodes arranged sequentially along the second direction Y. The plurality of second touch electrodes may be spaced apart, and adjacent second touch electrodes may be connected to each other through second connecting portions. In some examples, the film layer containing the second connecting portion may be different from the film layers containing the first touch electrodes and the second touch electrodes.

[0078] In some examples, as shown in Figure 2, multiple first touch electrodes, multiple second touch electrodes, and multiple first connecting portions can be disposed on the same layer of the first touch conductive layer 511 and formed through the same patterning process. The first touch electrodes and the first connecting portions can be an integral structure interconnected with each other. Second connecting portions can be disposed on the second touch conductive layer 512 and can be interconnected with adjacent second touch electrodes through vias formed in the interlayer insulating layer 502. In other examples, multiple first touch electrodes, multiple second touch electrodes, and multiple second connecting portions can be disposed on the same layer of the first touch conductive layer 511. The second touch electrodes and second connecting portions can be an integral structure interconnected with each other. First connecting portions can be disposed on the second touch conductive layer 512 and can be interconnected with adjacent first touch electrodes through vias formed in the interlayer insulating layer 502. In some examples, the first touch electrode can be a driving (Tx) electrode, and the second touch electrode can be a sensing (Rx) electrode. Alternatively, the first touch electrode can be a sensing (Rx) electrode, and the second touch electrode can be a driving (Tx) electrode. This embodiment does not limit this.

[0079] In some examples, as shown in Figure 1, the touch structure layers of the third bezel area B3 and the fourth bezel area B4 of the display panel may each include multiple touch leads 252. The multiple touch leads 252 can be electrically connected to the first touch unit and the second touch unit of the display area AA, respectively. The multiple touch leads 252 may all be located in the first touch conductive layer, or all in the second touch conductive layer; or the multiple touch leads 252 may be alternately arranged in the first touch conductive layer and the second touch conductive layer. However, this embodiment is not limited to this.

[0080] In some examples, as shown in Figure 1, the first bezel area B1 of the display panel may include: a first wiring area B11, a bending area B12, and a second wiring area B13 arranged sequentially along a direction away from the display area AA. The first wiring area B11 can be connected to the display area AA, and the first wiring area B11 may be provided with at least a first power line, a second power line, multiple display leads, and multiple touch leads 252. The first power line may be configured as a high-potential power line connected to the display area AA, and the second power line may be configured as a low-potential power line connected to the third bezel area B13 and the fourth bezel area B14. The multiple display leads may include at least: multiple data leads 281 and multiple drive leads (not shown). The multiple data leads 281 can be electrically connected to multiple data lines DL of the display area AA; for example, the multiple data leads 281 and the multiple data lines DL can be electrically connected one-to-one. Multiple data leads 281 can be arranged in a fan-out routing pattern in the first routing area B11 and extend to the bending area B12. Multiple drive leads can extend from the third border area B3 and the fourth border area B4 to the first routing area B11. The multiple drive leads can be electrically connected to the gate drive circuits in the third border area B3 and the fourth border area B4. The multiple drive leads can be configured to provide control signals to the gate drive circuits, such as start signals, clock signals, etc. Multiple touch leads 252 can extend from the third border area B3 and the fourth border area B4 to the first routing area B11 and can be located on the side of the multiple display leads away from the substrate.

[0081] In some examples, as shown in Figure 1, the bending area B12 connects between the first wiring area B11 and the second wiring area B13, and can be configured such that the second wiring area B13 bends to the back of the display area AA. The bending area B12 can have multiple bent connecting lines, such as multiple first bent connecting lines 261, multiple second bent connecting lines 262, a first power bent connecting line (not shown), and a second power bent connecting line (not shown). The first power bent connecting line can be electrically connected to a first power line, and the second power bent connecting line can be electrically connected to a second power line. The multiple second bent connecting lines 262 can be electrically connected to multiple display leads (e.g., multiple data leads 281 and multiple drive leads), and the multiple first bent connecting lines 261 can be electrically connected to multiple touch leads 252. For example, in the edge area of ​​the first wiring area B11 near the bending area B12, the first bent connecting line 261 can be electrically connected to the corresponding touch lead 252 through the first adapter hole V1, and the second bent connecting line 262 can be connected to the corresponding display lead (e.g., data lead 281) through the second adapter hole V2.

[0082] In some examples, as shown in Figure 1, multiple bent connecting lines may all extend along the second direction Y. In some examples, the multiple bent connecting lines may be of the same layer. In some examples, multiple first bent connecting lines 261 may be located on opposite sides of multiple second bent connecting lines 262 in the first direction X. This embodiment is not limited in this respect. In other examples, multiple second bent connecting lines connected to multiple data leads may be located in the middle of multiple first bent connecting lines, and multiple second bent connecting lines connected to multiple drive leads may be located on the side of multiple first bent connecting lines closer to the edge of the display panel.

[0083] In some examples, as shown in Figure 1, the second wiring area B13 can be provided with multiple adapter cables, such as multiple display adapter cables and multiple touch adapter cables 271. The multiple display adapter cables may include, for example, multiple data adapter cables 272 and multiple drive adapter cables (not shown). The multiple display adapter cables can be electrically connected to multiple second bent connection cables 262, for example, in a one-to-one correspondence. Data adapter cables 272 can be connected to corresponding data leads 281 via second bent connection cables 262, and drive adapter cables can be connected to corresponding drive leads via second bent connection cables 262. The multiple touch adapter cables 271 can be electrically connected to multiple first bent connection cables 261, for example, in a one-to-one correspondence. For example, in the edge area of ​​the second wiring area B13 near the bend area B12, touch adapter cables 271 can be electrically connected to first bent connection cables 261 via adapter holes, and display adapter cables can be connected to second bent connection cables 262 via adapter holes.

[0084] In some examples, as shown in Figure 1, the second wiring area B13 may include at least one first signal access area B131 and at least one second signal access area B132. This example illustrates one first signal access area B131 and one second signal access area B132. In other examples, the display panel may be a large-size panel, which may include multiple first signal access areas B131 and multiple second signal access areas B132. The multiple first signal access areas B131 may be arranged sequentially along the first direction X, and the multiple second signal access areas B132 may be arranged sequentially along the first direction X. The first signal access area B131 may be located on the side of the second signal access area B132 closer to the display area AA. In other words, the second signal access area B132 may be located on the side of the first signal access area B131 away from the bending area B12 in the second direction Y. The first signal access area B131 may be provided with multiple first contact pads, which may be connected to multiple data transfer cables 272 for transmitting data signals. The second signal access area B132 may be provided with multiple second contact pads, which can be connected to multiple touch adapter cables 271. The first signal access area B131 may also be called the driver chip setting area, configured to be connected to the driver chip; the second signal access area B132 may also be called the circuit bonding area, configured to be bonded to an external circuit board (e.g., a flexible circuit board).

[0085] In some examples, the second wiring area B13 may further include a first circuit area located on the side of the first signal access area B131 near the bend area B12. This first circuit area may contain multiple test circuits (not shown). The test circuits may be configured to be electrically connected to multiple data leads 281 via a data transfer cable 272 and a second bend connection cable 262, providing test data signals to multiple data lines DL in the display area AA during the testing phase. The first circuit area may also include multiple electrostatic discharge circuits to provide paths for electrostatic discharge.

[0086] Figure 3 is a partial structural schematic diagram of the first bezel region of a display panel according to at least one embodiment of the present disclosure. Figure 4A is a partial cross-sectional schematic diagram along the Q-Q' direction in Figure 3. Figure 4B is a partial cross-sectional schematic diagram along the R-R' direction in Figure 3. In Figures 4A and 4B, the third direction Z can be perpendicular to the plane containing the first direction X and the second direction Y, and the plane containing the first direction X and the second direction Y can be parallel to the plane containing the substrate.

[0087] In some examples, as shown in Figures 3 to 4B, the first border region includes a composite inorganic insulating layer 61 disposed on the substrate 10. For example, the composite inorganic insulating layer 61 may include a first gate insulating layer, a second gate insulating layer, and an interlayer insulating layer stacked sequentially extending from the display area AA to the first wiring area B11. An inorganic groove 610 is formed in the first border region of the composite inorganic insulating layer 61. For example, the composite inorganic insulating layer 61 within the inorganic groove 610 may be removed, exposing a portion of the surface of the substrate 10. The orthographic projection of the inorganic groove 610 onto the substrate may cover the orthographic projection of the bending area B12 onto the substrate. In other words, the composite inorganic insulating layer 61 within the bending area B12 may be completely removed. In other examples, the first gate insulating layer, the second gate insulating layer, the interlayer insulating layer, and a portion of the inorganic film layer of the substrate within the inorganic groove 610 may be removed. In this example, the thickness of the bending area can be reduced by etching the inorganic film layer of the bending area, thereby reducing the bending stress of the display panel.

[0088] In some examples, as shown in Figure 3, the inorganic groove 610 may have a first inorganic edge 610a and a second inorganic edge 610b. The first inorganic edge 610a may be located on the side of the bending region B12 closer to the display area AA, and the second inorganic edge 610b may be located on the side of the bending region B12 away from the display area AA. For example, the orthographic projection of the first inorganic edge 610a and the second inorganic edge 610b onto the substrate may be a straight line extending along the first direction X. In other examples, the orthographic projection of at least one of the first inorganic edge 610a and the second inorganic edge 610b onto the substrate may be a broken line or an arc extending along the first direction X. This example can adjust the shape of the first and second inorganic edges of the inorganic groove according to the shape of the display panel to reduce the bending stress of the display panel.

[0089] In some examples, the patterning process for trenching the bending region B12 during the fabrication of the display panel may include a first mask (Etch Bending A Mask, or EBA Mask) process and a second mask (Etch Bending B Mask, or EBB Mask) process. For instance, the first mask process can etch away the interlayer insulating layer and the second gate insulating layer of the bending region B12, and the second mask process can etch away the first gate insulating layer of the bending region B12. The first inorganic edge 610a and the second inorganic edge 610b of the inorganic trench 610 can serve as the etching boundaries for the second mask process.

[0090] In some examples, as shown in Figures 4A and 4B, the multiple organic insulating layers in the first border region may include a first planarization layer 104, a second planarization layer 105, and a pixel definition layer 304 sequentially disposed along a direction away from the substrate 10; or, they may include a first planarization layer 104, a second planarization layer 105, a pixel definition layer 304, and a display isolation pillar layer sequentially disposed along a direction away from the substrate 10. In the first border region, the second planarization layer 105 may be located on the side of the first planarization layer 104 away from the substrate 10, and the pixel definition layer 304 may be located on the side of the second planarization layer 105 away from the substrate 10. In the bending region B12, the first planarization layer 104, the second planarization layer 105, and the pixel definition layer 304 may be sequentially stacked on the substrate 10, and the second source / drain metal layer between the first planarization layer 104 and the second planarization layer 105 may include multiple bent connecting lines. In other words, the multiple bent connecting lines in the bending region B12 of this example may be located in the second source / drain metal layer. In other examples, the multiple bent connection lines of the bending region B12 may be located in the first source / drain metal layer. In other examples, the circuit structure layer of the display area may also include: a third source / drain metal layer or a third and fourth source / drain metal layer located on the side of the second source / drain metal layer away from the substrate, and the multiple bent connection lines of the bending region may be located in the third or fourth source / drain metal layer.

[0091] In some examples, as shown in Figures 3 and 4A, multiple touch leads in the first border region can be located in the first touch conductive layer or the second touch conductive layer. The touch leads can be connected to the first bent connection line 261 located in the second source / drain metal layer via the first adapter electrode 311. The first adapter electrode 311 can be located in the first touch conductive layer or the second touch conductive layer. For example, the touch leads and the connected first adapter electrode 311 can be an integral structure interconnected, or the first adapter electrode 311 can be located on the side of the connected touch leads closer to the substrate 10. The pixel definition layer 304 and the second planarization layer 105 of the first wiring area B11 can be provided with multiple first adapter holes V1. The first adapter electrode 311 can be connected to one end of the first bent connection line 261 exposed by the first adapter hole V1 to achieve electrical connection between the touch leads and the corresponding first bent connection line 261. Figure 3 only illustrates several first adapter holes V1 as an example. The orthographic projection of the first adapter hole V1 onto the substrate can be rectangular (e.g., rounded rectangle), elliptical, or circular. Multiple first adapter holes V1 can be arranged in an array, for example, arranged in one or more rows along the first direction X.

[0092] In some examples, as shown in Figures 3 and 4B, multiple display leads in the first border region can be connected to second bent connecting lines 262 located in the second source / drain metal layer via multiple second transition electrodes 312. The second transition electrodes 312 can, for example, be located in the first source / drain metal layer. The first planarization layer 104 of the first trace area B11 can be provided with multiple second transition holes V2, and the second bent connecting lines 262 can be connected to the surfaces of the second transition electrodes 312 exposed by the second transition holes V2 to achieve electrical connection between the second bent connecting lines 262 and the corresponding second transition electrodes 312. Multiple data leads among the multiple display leads can be alternately arranged in the first gate metal layer and the second gate metal layer, and the second transition electrodes 312 can be connected to the corresponding data leads via vias provided in the composite inorganic insulating layer 61; at least one drive lead among the multiple display leads can be located in the first source / drain metal layer, and the drive lead and the connected second transition electrode 312 can be an integrally connected structure. Figure 3 illustrates only a number of second adapter holes V2 as an example. The orthographic projection of the second adapter hole V2 onto the substrate can be rectangular (e.g., rounded rectangle), elliptical, or circular. Multiple second adapter holes V2 can be arranged in an array, for example, arranged in a row along the first direction X.

[0093] In some examples, as shown in Figures 3 to 4B, the first trace area B11 of the first border region can be provided with an organic isolation structure, which can be located on the side of the inorganic encapsulation layer 62 away from the substrate. The organic isolation structure can be disposed in the same layer as the protective layer 503. The inorganic encapsulation layer 62 can include a first encapsulation layer and a second encapsulation layer that extend from the display area to the first trace area B11 and are stacked thereon. The orthographic projection of the edge of the inorganic encapsulation layer 62 away from the display area AA onto the substrate 10 can overlap with the orthographic projection of the pixel definition layer 304 onto the substrate 10. For example, the edge of the inorganic encapsulation layer 62 away from the display area can cover the edge of the pixel definition layer 304 near the display area, thereby ensuring the encapsulation effect of the first border region.

[0094] In some examples, the organic isolation structure may include: a first isolation pillar 521 and a second isolation pillar 522 independently disposed and located in the first wiring area B11. The first isolation pillar 521 may be located on the side of the second isolation pillar 522 away from the display area AA and close to the side of the bending area B12. The extending direction of the first isolation pillar 521 is the same as the extending direction of the second isolation pillar 522, for example, both may extend along the first direction X. The orthographic projection of the first isolation pillar 521 and the second isolation pillar 522 onto the substrate may both be strip-shaped structures extending along the first direction X. The length of the first isolation pillar 521 along the second direction Y may be greater than the length of the second isolation pillar 522 along the second direction Y.

[0095] In some examples, the orthographic projection of the first isolation pillar 521 onto the substrate may partially overlap with the orthographic projection of the inorganic trench 610 onto the substrate. The orthographic projection of the first isolation pillar 521 onto the substrate 10 may cover the boundary between the inorganic encapsulation layer 62 and the pixel definition layer 304. The orthographic projection of the first isolation pillar 521 onto the substrate 10 may cover the orthographic projection of the first inorganic edge 610a of the inorganic trench 610 onto the substrate 10. As shown in Figures 4A and 4B, the first isolation pillar 521 may have a first isolation edge 521a that is away from the display area and close to the bending area B12. In the second direction Y, the minimum distance L1 between the first isolation edge 521a and the first inorganic edge 610a of the inorganic trench 610 may be greater than or equal to 5 micrometers, for example, it may be 5 micrometers, 7 micrometers, or 10 micrometers. The first isolation post 521 also has a second isolation edge 521b near the display area. In the second direction Y, the minimum distance between the second isolation edge 521b and the first isolation edge 521a is greater than the minimum distance between the first isolation edge 521a and the first inorganic edge 610a. For example, the minimum distance between the second isolation edge 521b and the first inorganic edge 610a of the inorganic groove 610 is greater than or equal to the minimum distance between the first isolation edge 521a and the first inorganic edge 610a. In this example, by completely covering the orthographic projection of the first inorganic edge 610a of the inorganic groove 610 with the first isolation post 521, the peeling or breakage of the film layer during bending can be improved.

[0096] In some examples, the orthographic projection of the first isolation pillar 521 onto the substrate may at least partially overlap with the orthographic projections of the plurality of first transition holes V1 and the plurality of second transition holes V2 onto the substrate. For example, the orthographic projection of the first isolation pillar 521 onto the substrate may cover the orthographic projections of the plurality of first transition holes V1 and the plurality of second transition holes V2 onto the substrate. In this example, by completely covering the plurality of first transition holes V1 and the plurality of second transition holes V2 with the first isolation pillar 521, the situation of film peeling or breakage during bending can be improved, and the situation of display abnormalities caused by signal trace breakage can be improved.

[0097] The display panel provided in this example utilizes an organic isolation structure to cover the first inorganic edge of the inorganic slot, multiple first transition holes, and multiple second transition holes. This effectively mitigates film peeling or breakage during bending and reduces display abnormalities caused by broken signal traces. Compared to display panels without an organic isolation structure covering the first inorganic edge of the inorganic slot, the flat field brightness inhomogeneity (FFBI) and temperature coefficient (TC) of this example's display panel are effectively reduced during simulation testing. This example's display panel meets the strength requirements of the encapsulation process for narrow-bezel display products.

[0098] Figure 5 is another partial structural schematic diagram of the first border region according to at least one embodiment of the present disclosure. In some examples, as shown in Figure 5, the organic isolation structure located in the first trace area B11 may include a first isolation pillar 521. The first isolation pillar 521 may have a first cutout portion 5210a. The orthographic projection of the first cutout portion 5210a onto the substrate may be a rectangle extending along a first direction X. In other examples, the orthographic projection of the first cutout portion 5210a onto the substrate may be a circle or an ellipse. In still other examples, the first isolation pillar 521 may have multiple first cutout portions, for example, the multiple first cutout portions may be arranged regularly.

[0099] In some examples, the orthographic projection of the first isolation pillar 521 onto the substrate may cover the orthographic projection of the first inorganic edge 610a of the inorganic groove 610 onto the substrate and the orthographic projection of the plurality of first transition holes V1 onto the substrate. The orthographic projection of the first cutout portion 5210a onto the substrate may overlap with or not overlap with the orthographic projection portions of the plurality of second transition holes onto the substrate.

[0100] The first isolation pillar in this example completely covers the first inorganic edge of the inorganic groove and the orthographic projection of the multiple first transition holes onto the substrate, which can improve the situation of film peeling or breakage during bending and improve the situation of display abnormality caused by touch signal trace breakage. Further descriptions of the display panel in this example can be found in the descriptions of the foregoing embodiments, and will not be repeated here.

[0101] Figure 6 is a schematic diagram of another partial structure of the first border region according to at least one embodiment of the present disclosure. In some examples, as shown in Figure 6, the organic isolation structure located in the first wiring area B11 may include a first isolation post 521. The first isolation post 521 may have a first recess 5210b. The first recess 5210b faces the display area AA. In other examples, the first isolation post 521 may have multiple first recesses, for example, the multiple first recesses may be arranged at intervals along the first direction X.

[0102] In some examples, the orthographic projection of the first isolation pillar 521 onto the substrate may cover the orthographic projection of the first inorganic edge 610a of the inorganic trench 610 onto the substrate and the orthographic projection of the plurality of first transition holes V1 onto the substrate. The orthographic projection of the first recess 5210b onto the substrate may overlap with or not overlap with the orthographic projection portions of the plurality of second transition holes onto the substrate.

[0103] The first isolation pillar in this example completely covers the first inorganic edge of the inorganic groove and the orthographic projection of the multiple first transition holes onto the substrate, which can improve the situation of film peeling or breakage during bending and improve the situation of display abnormality caused by touch signal trace breakage. Further descriptions of the display panel in this example can be found in the descriptions of the foregoing embodiments, and will not be repeated here.

[0104] Figure 7 is another partial structural schematic diagram of the first border region according to at least one embodiment of the present disclosure. In some examples, as shown in Figure 7, the organic isolation structure located in the first trace area B11 may include: a first isolation pillar 521. The first isolation pillar 521 may have a first main body portion 5211 and a plurality of extension portions 5212. The plurality of extension portions 5212 may be connected to the side of the first main body portion 5211 near the display area AA, and the plurality of extension portions 5212 may be arranged at intervals along the extension direction of the first main body portion 5211. The orthographic projection of the first main body portion 5211 onto the substrate may be approximately a strip structure extending along the first direction X. The orthographic projection of the plurality of extension portions 5212 onto the substrate may be arranged in a row along the first direction X. The shape and size of the orthographic projection of the plurality of extension portions 5212 onto the substrate may be approximately the same, and the spacing between adjacent extension portions 5212 may be the same.

[0105] In some examples, the orthographic projection of the first main body portion 5211 of the first isolation pillar 521 onto the substrate may at least partially overlap with the orthographic projection of the inorganic trench 610 onto the substrate. For example, the orthographic projection of the first main body portion 5211 onto the substrate may cover the orthographic projection of the first inorganic edge 610a of the inorganic trench 610 onto the substrate. The orthographic projection of at least one extension portion 5212 onto the substrate may cover the orthographic projection of at least one first transition hole V1 onto the substrate. For example, the orthographic projection of the extension portion 5212 onto the substrate may partially overlap with or not overlap with the orthographic projection of the second transition hole onto the substrate.

[0106] The first isolation pillar in this example completely covers the first inorganic edge of the inorganic groove and the orthographic projection of the multiple first transition holes onto the substrate, which can improve the situation of film peeling or breakage during bending and improve the situation of display abnormality caused by touch signal trace breakage. Further descriptions of the display panel in this example can be found in the descriptions of the foregoing embodiments, and will not be repeated here.

[0107] Figure 8 is a partial structural schematic diagram of the first border region according to at least one embodiment of the present disclosure. In some examples, as shown in Figure 8, the organic isolation structure located in the first trace area B11 may include a first isolation pillar 521. The first isolation pillar 521 may have a first main body portion 5211 and a plurality of extension portions 5212. The plurality of extension portions 5212 may be connected to the side of the first main body portion 5211 near the display area AA, and the plurality of extension portions 5212 may be arranged at intervals along the extension direction of the first main body portion 5211. The orthographic projections of the plurality of extension portions 5212 onto the substrate may be arranged in a row along the first direction X. The shape and size of the orthographic projections of the plurality of extension portions 5212 onto the substrate may be substantially the same, and the spacing between adjacent extension portions 5212 may be the same.

[0108] In some examples, the first main body 5211 may include a plurality of main body blocks 52111 spaced apart along an extension direction (e.g., a first direction X). In the second direction Y, the plurality of main body blocks 52111 and the plurality of extensions 5212 may be staggered. The two ends of a main body block 52111 along the first direction X may be connected to two adjacent extensions 5212 respectively. The orthographic projections of the plurality of main body blocks 52111 onto the substrate may be arranged in a row along the first direction X. The shape and size of the orthographic projections of the plurality of main body blocks 52111 onto the substrate may be substantially the same, and the spacing between adjacent main body blocks 52111 may be the same. The shape or size of the orthographic projections of the main body blocks 52111 and the extensions 5212 onto the substrate may be partially the same. For example, the shape of the orthographic projection of the main body block 52111 onto the substrate and the shape of the orthographic projection of the extension 5212 onto the substrate may be the same, and the size of the orthographic projection of the extension 5212 onto the substrate along the second direction Y may be larger than the size of the orthographic projection of the main body block 52111 onto the substrate along the second direction Y. Alternatively, the size of the orthographic projection of the extension 5212 onto the substrate along the first direction X can be greater than the size of the orthographic projection of the main block 52111 onto the substrate along the first direction X; or, the size of the orthographic projection of the extension 5212 onto the substrate along the first direction X can be greater than the size of the orthographic projection of the main block 52111 onto the substrate along the first direction X, and the size of the orthographic projection of the extension 5212 onto the substrate along the second direction Y can be greater than the size of the orthographic projection of the main block 52111 onto the substrate along the second direction Y.

[0109] In some examples, the orthographic projection of each main body block 52111 onto the substrate may partially overlap with the orthographic projection of the inorganic groove 610 onto the substrate. For example, the orthographic projection of the main body block 52111 onto the substrate may overlap with the orthographic projection of the first inorganic edge 610a of the inorganic groove 610 onto the substrate. The length of the first inorganic edge 610a of the inorganic groove 610 covered by the orthographic projection of the first main body 5211 onto the substrate along the first direction X may be greater than or equal to half the total length of the first inorganic edge 610a along the first direction X. The orthographic projection of at least one extension 5212 onto the substrate may cover the orthographic projection of at least one first transition hole V1 onto the substrate. For example, the orthographic projection of the extension 5212 onto the substrate may partially overlap with or not overlap with the orthographic projection of the second transition hole onto the substrate.

[0110] The first isolation pillar in this example partially covers the first inorganic edge of the inorganic groove and the orthographic projection of the multiple first transition holes onto the substrate. This can improve the situation of film peeling or breakage during bending, and improve the situation of display abnormalities caused by broken touch signal traces. Further descriptions of the display panel in this example can be found in the descriptions of the foregoing embodiments, and will not be repeated here.

[0111] Figure 9 is a schematic diagram of another partial structure of the first border region according to at least one embodiment of the present disclosure. In some examples, as shown in Figure 9, the organic isolation structure located in the first trace area B11 may include: independently disposed first isolation pillar 521 and second isolation pillar 522. The first isolation pillar 521 may be located on the side of the second isolation pillar 522 away from the display area AA and close to the bending area B12. The extending direction of the first isolation pillar 521 is the same as the extending direction of the second isolation pillar 522, for example, both may extend along the first direction X. The orthographic projection of the first isolation pillar 521 and the second isolation pillar 522 onto the substrate may both be strip structures extending along the first direction X. The length of the first isolation pillar 521 along the second direction Y may be less than the length of the second isolation pillar 522 along the second direction Y.

[0112] In some examples, the orthographic projection of the first isolation pillar 521 onto the substrate may at least partially overlap with the orthographic projection of the inorganic trench 610 onto the substrate. For example, the orthographic projection of the first isolation pillar 521 onto the substrate may cover the orthographic projection of the first inorganic edge 610a of the inorganic trench 610 onto the substrate. The orthographic projection of the second isolation pillar 522 onto the substrate may cover the orthographic projections of the plurality of first transition holes V1 onto the substrate. In other examples, the orthographic projection of the second isolation pillar 522 onto the substrate may cover the orthographic projections of the plurality of first transition holes and the plurality of second transition holes onto the substrate.

[0113] The first and second isolation pillars in this example completely cover the first inorganic edge of the inorganic groove and the orthographic projection of the plurality of first transition holes onto the substrate. This improves the situation of film peeling or breakage during bending and reduces display abnormalities caused by broken touch signal traces. Further descriptions of the display panel in this example can be found in the descriptions of the foregoing embodiments, and will not be repeated here.

[0114] In other examples, by adjusting the shapes of the first and second isolation pillars, partial coverage of the first inorganic edge of the inorganic trench and the orthographic projection of the plurality of first transition holes on the substrate can be achieved.

[0115] In other embodiments, the orthogonal projection of the first isolation pillar onto the substrate can be a broken line or an arc extending along the first direction X, in order to match the first inorganic edge extending in the form of a broken line or an arc, thereby achieving complete coverage of the first inorganic edge.

[0116] In other embodiments, the pattern of the orthographic projection of the first or second isolation pillar onto the substrate can be an irregular shape to match the positional arrangement of the multiple first adapter holes, achieving complete coverage of the multiple first adapter holes. Alternatively, the pattern of the orthographic projection of the first or second isolation pillar onto the substrate can be an irregular shape to match the positional arrangement of the multiple first adapter holes and the multiple second adapter holes, achieving complete coverage of the multiple first adapter holes and the multiple second adapter holes.

[0117] Figure 10 is a schematic diagram of a display device according to at least one embodiment of the present disclosure. In some examples, as shown in Figure 10, the display device 91 may include a display panel 910. The display panel 910 may be a display panel as described in the foregoing embodiments. For example, the display panel 910 may be an OLED display panel. The display device 91 may be any product or component with display function, such as an OLED display device, mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigator. However, this embodiment is not limited thereto.

[0118] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0119] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.

Claims

1. A display panel, comprising: The substrate includes a display area and a first border area located on at least one side of the display area, the first border area including a bending area; A composite inorganic insulating layer is located on one side of the substrate and includes an inorganic groove located in the first border region, wherein the orthographic projection of the inorganic groove on the substrate covers the orthographic projection of the bending region on the substrate. Multiple organic insulating layers are located on the side of the composite inorganic insulating layer away from the substrate; An inorganic encapsulation layer is located on the side of the plurality of organic insulating layers away from the substrate; An organic isolation structure is located in the first border region and on the side of the inorganic encapsulation layer away from the substrate; the orthographic projection of the organic isolation structure on the substrate at least partially overlaps with the orthographic projection of the inorganic trench on the substrate.

2. The display panel according to claim 1, wherein, The inorganic groove has a first inorganic edge and a second inorganic edge, the first inorganic edge being located on the side of the bending area closer to the display area, and the second inorganic edge being located on the side of the bending area away from the display area; the orthographic projection of the organic isolation structure on the substrate covers the orthographic projection of the first inorganic edge on the substrate.

3. The display panel according to claim 2, wherein, The organic isolation structure has a first isolation edge away from the display area, and the minimum distance between the first isolation edge and the first inorganic edge along the direction away from the display area is greater than or equal to 5 micrometers.

4. The display panel according to claim 1, wherein, The organic isolation structure includes: a first isolation pillar and a second isolation pillar that are independently disposed, the first isolation pillar and the second isolation pillar being located on the side of the bending area closer to the display area, the first isolation pillar being located on the side of the second isolation pillar closer to the bending area, and the orthographic projection of the first isolation pillar on the substrate at least partially overlapping the orthographic projection of the inorganic trench on the substrate.

5. The display panel according to claim 4, wherein, The inorganic groove has a first inorganic edge and a second inorganic edge, the first inorganic edge being located on the side of the bending area closer to the display area, and the second inorganic edge being located on the side of the bending area away from the display area; the orthographic projection of the first isolation pillar on the substrate covers the orthographic projection of the first inorganic edge on the substrate.

6. The display panel according to claim 1, further comprising: At least one touch conductive layer is located on the side of the inorganic encapsulation layer away from the substrate and on the side of the organic isolation structure close to the substrate, including multiple touch leads located in the first border region; Multiple first-bend connecting lines are located in the first frame area and on the side of the composite inorganic insulating layer away from the substrate; At least one of the plurality of organic insulating layers is provided with a plurality of first adapter holes, wherein the first adapter holes are configured to electrically connect the corresponding touch lead wire and the first bent connecting wire; The plurality of first adapter holes are located on the side of the inorganic slot near the display area; The orthographic projection of the organic isolation structure onto the substrate covers the orthographic projection of the plurality of first adapter holes onto the substrate.

7. The display panel according to claim 6, further comprising: Multiple display leads are located in the first frame area and on the side of the inorganic encapsulation layer closest to the substrate; Multiple second-bend connecting lines are located in the first frame area and are located away from the multiple display leads. One side of the bottom; At least one of the plurality of organic insulating layers is provided with a plurality of second adapter holes, the second adapter holes being configured to electrically connect the corresponding display lead wire and the second bent connecting wire; The orthographic projection of the organic isolation structure onto the substrate at least partially overlaps with the orthographic projection of the plurality of second adapter holes onto the substrate.

8. The display panel according to claim 7, wherein, The orthographic projection of the organic isolation structure onto the substrate covers the orthographic projection of the plurality of second adapter holes onto the substrate.

9. The display panel according to any one of claims 6 to 8, wherein, The organic isolation structure includes: a first isolation pillar, the first isolation pillar having a first main body and a plurality of extensions, the plurality of extensions being connected to the side of the first main body near the display area, and the plurality of extensions being spaced apart along the extension direction of the first main body; The orthographic projection of the first main body portion on the substrate at least partially overlaps with the orthographic projection of the inorganic groove on the substrate, and the orthographic projection of at least one of the plurality of extension portions on the substrate covers the orthographic projection of at least one of the plurality of first transition holes on the substrate.

10. The display panel according to claim 9, wherein, The first main body includes a plurality of main blocks arranged at intervals along the extension direction; in a direction away from the display area, the plurality of main blocks are staggered from the plurality of extensions; the orthographic projection of each of the plurality of main blocks on the substrate overlaps with the orthographic projection of the inorganic groove on the substrate.

11. The display panel according to any one of claims 6 to 8, wherein, The organic isolation structure includes: a first isolation pillar and a second isolation pillar that are independently disposed, the first isolation pillar and the second isolation pillar being located on the side of the bending area close to the display area, the first isolation pillar being located on the side of the second isolation pillar close to the bending area, the orthographic projection of the first isolation pillar on the substrate at least partially overlapping the orthographic projection of the inorganic trench on the substrate, and the orthographic projection of the second isolation pillar on the substrate covering the orthographic projection of the plurality of first adapter holes on the substrate.

12. The display panel according to claim 1, wherein, The orthographic projection of the organic isolation structure onto the substrate covers the orthographic projection of the edge of the inorganic encapsulation layer away from the display area onto the substrate.

13. The display panel according to claim 1, wherein, In a direction perpendicular to the display panel, the display area of ​​the display panel may include: a display structure layer and a touch structure layer disposed on the substrate; The touch structure layer includes: a plurality of touch units and a protective layer located on the side of the plurality of touch units away from the display structure layer; the organic isolation structure and the protective layer of the touch structure layer are of the same layer structure.

14. The display panel according to claim 13, wherein, The display structure layer includes: a semiconductor layer, a first gate insulating layer, a first gate metal layer, a second gate insulating layer, a second gate metal layer, and an interlayer insulating layer disposed on the substrate; the composite inorganic insulating layer of the first frame region includes: a first gate insulating layer, a second gate insulating layer, and an interlayer insulating layer stacked sequentially.

15. The display panel according to claim 14, wherein, The display structure layer further includes: a first source / drain metal layer, a first planarization layer, a second source / drain metal layer, a second planarization layer, a first electrode of a plurality of light-emitting elements, and a pixel definition layer disposed along the distance from the interlayer insulating layer; the plurality of organic insulating layers in the first border region include: a first planarization layer, a second planarization layer, and a pixel definition layer disposed sequentially.

16. A display device comprising a display panel as claimed in any one of claims 1 to 15.

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