Server

Abstract

The present application relates to the technical field of computers. Disclosed is a server, comprising: a support structure, wherein an accommodating cavity is formed in the support structure; a mainboard arranged in the accommodating cavity; and a bearing assembly arranged in the accommodating cavity, wherein the bearing assembly is provided with a connection structure, the connection structure can be detachably connected to at least one test module, the test module is connected to the mainboard by means of a cable, the bearing assembly is movably arranged on the support structure and has a first position and a second position relative to the support structure, and the bearing assembly can completely coincide with the mainboard when in the first position, and can partially coincide with the mainboard or completely expose the mainboard when in the second position. An operator can switch the bearing assembly to enable the server to adapt to various test conditions, and the length of the cable can be minimized, so that a wiring scenario of the server is closer to an actual usage scenario of the server, thereby supporting better research and development verification tests, and saving a space occupied by the server.

Description

Server

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority from Chinese Patent Application No. 202410782847.3, filed on June 18, 2024, and entitled "Server", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0003] The present application relates to the technical field of computers, and in particular, relates to a server. BACKGROUND

[0004] An open server usually adopts a non-standard case, which is mainly used for verifying related functions in a research and development process or a test process. In actual use, a technician adjusts the configuration in the case at any time according to actual test conditions.

[0005] In addition, because the open server needs to be plugged on the mainboard during use, the mainboard needs to be exposed, so that the test module can only be arranged outside the case of the server, which causes the cable connecting the test module and the mainboard to be too long, resulting in large loss and deviation of the test result, and the open server occupies a large space during use. SUMMARY

[0006] Therefore, the present application provides a server to solve the problems of deviation of the test result and large space occupation of the server in the prior art.

[0007] The present application provides a server, which comprises:

[0008] A support structure, wherein a receiving cavity is formed in the support structure;

[0009] A mainboard arranged in the receiving cavity;

[0010] A bearing assembly arranged in the receiving cavity, wherein the bearing assembly is provided with a connecting structure, the connecting structure is detachably connected with at least one test module, the test module is connected with the mainboard through a cable, the bearing assembly is movably arranged on the support structure and has a first position and a second position relative to the support structure, the bearing assembly is completely overlapped with the mainboard when being in the first position, and the bearing assembly is partially overlapped with the mainboard or completely exposes the mainboard when being in the second position.

[0011] Beneficial effects: in the use process of the server of the embodiment of the application, the operator can first switch the bearing assembly to the second position and expose the mainboard, thereby providing sufficient space for the operator to insert the cable on the mainboard and install the accessories for testing. Then the operator can switch the bearing assembly to the first position. When the bearing assembly is in the first position, the distance between the bearing assembly and the mainboard is the smallest, and the cable between the upper test module and the lower mainboard can be simply and conveniently interconnected to realize lower-loss wiring, thereby greatly shortening the length of the cable between the test module and the mainboard, avoiding excessive loss caused by the excessively long length of the cable, and avoiding deviation of the test result.

[0012] In addition, since the bearing assembly is located inside the server case, in the testing process of the server of the embodiment of the application, the computing module and the test module can also be arranged in the accommodating cavity of the support structure, avoiding that the computing module and the test module are exposed outside the support structure and occupy a large space.

[0013] Therefore, in the use process of the server of the embodiment of the application, the operator can switch the bearing assembly to adapt the server to various test conditions, greatly shorten the length of the cable, avoid increasing the power consumption of the module due to the excessively long length of the cable, make the server wiring scene closer to the actual use scene of the server, avoid deviation of the test result, support better research and development verification testing, and save the space occupied by the server.

[0014] In one embodiment, the bearing assembly is in sliding connection with the support structure and is arranged opposite to the mainboard and can slide relative to the support structure in a specified direction.

[0015] Beneficial effects: sliding the bearing assembly in the specified direction can adjust the relative position of the bearing assembly and the mainboard. After the operator connects one end of the cable to the mainboard, the operator can slide the bearing assembly in the specified direction to move the corresponding test module to the position directly above the corresponding position of the mainboard, thereby greatly shortening the length of the cable to meet the testing requirements of the test module (such as a bus module) with high requirements for the length of the cable and further improve the accuracy of the test result.

[0016] In one embodiment, the support structure comprises:

[0017] a base, the mainboard being connected to the base;

[0018] a first opening, arranged opposite to the base and capable of exposing the mainboard, the bearing assembly being in sliding connection with the support structure through the first opening;

[0019] a second opening, adjacent to the base, the bearing assembly being capable of at least partially penetrating through the second opening when being in the second position.

[0020] Beneficial effects: the first opening can be used to expose the mainboard and facilitate the sliding connection of the bearing assembly and the support structure, and the second opening can provide a larger space for test operation and can also allow the bearing assembly disposed in the accommodating cavity to pass outwards, thereby exposing the mainboard.

[0021] In one embodiment, the bearing assembly comprises:

[0022] a bottom plate for bearing the test module;

[0023] a lap joint edge, the lap joint edges are arranged in pairs and are respectively connected to the two sides of the bottom plate, and the lap joint edges are connected to the support structure through the sliding connection structure.

[0024] In one embodiment, the sliding connection structure comprises:

[0025] a strip-shaped hole formed on one of the support structure and the lap joint edge and extending in a specified direction;

[0026] a fixing pin formed on the other of the support structure and the lap joint edge and passing through the strip-shaped hole.

[0027] Beneficial effects: when the bearing assembly is subjected to external force, the strip-shaped hole can move relative to the fixing pin until the fixing pin abuts against one side hole wall of the strip-shaped hole, and the bearing assembly is moved to the position. On this basis, the fixing pin can also avoid the situation that the volume of the part of the bearing assembly passing out of the second opening is too large after the bearing assembly is moved to the second position, causing the center of the server to deviate.

[0028] In one embodiment, a first connecting hole is formed on the test module, and the connecting structure comprises:

[0029] a second connecting hole;

[0030] a first fastener capable of passing through the first connecting hole and the second connecting hole and connecting the test module and the bottom plate.

[0031] Beneficial effects: by such arrangement, the test module can be reliably connected to the bearing assembly, and the connecting structure occupies a smaller space.

[0032] In one embodiment, the second connecting hole comprises at least one first hole, the distance between the first hole and the first side of the bottom plate is d1, the test module comprises a first test module, the first test module comprises a PCIe module, the length of the PCIe module is L1, L1≤d1≤1.2L1, and the first connecting hole on the first test module can be matched with the first hole.

[0033] Beneficial effects: the above ratio range is the best ratio range obtained after counting the size information of a large number of first test modules. When the size ratio of d1 to L1 is within the above range, the first hole can be used for connecting with a plurality of test modules with large length, i.e. the first test module, which is but not limited to a PCIe module or a graphics processor module. It can not only ensure that the bearing assembly is compatible with a plurality of test modules with large length, but also avoid wasting space due to the too large distance between the first hole and the first edge of the bottom plate.

[0034] In an embodiment, the first hole is a plurality of first holes, the plurality of first holes are arranged at intervals along the extension direction of the first edge, the interval of the plurality of first holes is d2, the width of the PCIe module is b1, and 0.2b1≤d2≤0.3b1.

[0035] Beneficial effects: by such arrangement, the plurality of first test modules connected to the bottom plate can be arranged side by side. The above ratio range is the best ratio range obtained after counting the size information of a large number of first test modules. When the size ratio of d2 to b1 is within the above range, it can ensure that the adjacent first test modules do not interfere with each other, and also avoid wasting space due to the too large distance between the first test modules.

[0036] In an embodiment, the bottom plate comprises adjacent first and second edges, the second connecting hole comprises a second hole group, the second hole group comprises at least two pairs of second holes, each pair of second holes is arranged at intervals along the extension direction of the first edge, and two pairs of second holes are arranged at intervals along the extension direction of the second edge. The interval between the adjacent two second holes is d3, the test module comprises a second test module, the second test module comprises a hard disk module, the width of the hard disk module is b2, 0.6b2≤d3<b2, the interval between the adjacent two pairs of second holes is d4, the length of the hard disk module is L2, d4≥1.3L2, and the first connecting hole on the second test module can be matched with the second hole group.

[0037] Beneficial effects: the above ratio range is the best ratio range obtained after counting the size information of a large number of second test modules. When d3 and d4 are within the above range, the second hole group can be used to connect the second test module, such as SATA / SAS module, NVMe module and e3.s module.

[0038] In an embodiment, the second hole group is a plurality of second hole groups, the plurality of second hole groups are arranged at intervals along the extension direction of the first edge, the interval between the adjacent two second hole groups is d5, the length of the first edge is L3, the bottom plate is provided with n second hole groups along the extension direction of the first edge, and d5=(L3-nd3) / n.

[0039] Beneficial effects: By so arranging, the adjacent second hole groups can be evenly distributed on the bottom plate, without interference, and also help the second test module to dissipate heat.

[0040] In one embodiment, the bottom plate is recessed towards the direction close to the mainboard to form a receiving groove, and the connecting structure is arranged in the receiving groove.

[0041] Beneficial effects: By so arranging, the bearing assembly is located in the receiving cavity, and the test module carried thereon is also located in the receiving cavity, so that the structure of the server is more compact, and the length of the cable connected between the test module and the bearing assembly is shortened.

[0042] In one embodiment, a wire passing hole is formed on the plate surface of the bottom plate.

[0043] Beneficial effects: The cable of part of the test module (such as PCIe module) with higher cable length requirement can pass through the wire passing hole and be connected with the mainboard, so that the cable can be extended downward and connected with the mainboard without extending to the edge of the bottom plate, thereby ensuring that the size of the bottom plate can be set larger to meet the test requirements of the mainboard, and further shortening the length of the cable and reducing the loss caused by the cable.

[0044] In one embodiment, a reinforcing rib extending along the length direction of the bottom plate is formed on the plate surface of the bottom plate.

[0045] The reinforcing rib is used to improve the structural strength of the bearing assembly to ensure that the bearing assembly can support the test module required for testing.

[0046] In one embodiment, the server further comprises:

[0047] The first air cooling module is used to blow air towards the mainboard, and the first air cooling module is rotationally connected with the support structure and can rotate along a preset axis, and an included angle is formed between the extension direction of the preset axis and the specified direction.

[0048] Beneficial effects: By so arranging, during the test process, the operator can first switch the bearing assembly to the second position to expose the interface on the mainboard, and at the same time, switch the first air cooling module to the end of the support structure away from the bearing assembly to maximize the exposure of the mainboard, so as to facilitate the operator to plug the cable on the mainboard or install accessories such as heat sinks. At the same time, the first air cooling module and the bearing assembly are respectively located at the two ends of the support structure, so as to balance the center of the support structure and avoid the server from tipping over.

[0049] Thus, sufficient space is provided for the operator to plug the cable on the mainboard and install accessories for testing.

[0050] When the test module connection ends, the first air-cooled module can be reversely rotated to reduce the distance between the first air-cooled module and the central processor in need of heat dissipation, so as to ensure that the first air-cooled module can fully dissipate heat for the mainboard, so as to avoid the influence of the test result caused by the overheating of the mainboard.

[0051] In one embodiment, the first air-cooled module comprises:

[0052] The first module body comprises a plurality of first fans arranged in sequence along the extension direction of the preset axis.

[0053] The rocker arms are arranged in pairs and are respectively arranged at both ends of the first module body, one end of the rocker arm is hinged to the support structure, and the second end of the rocker arm is hinged to the first module body.

[0054] Beneficial effect: the rocker arm can be used to expand the movement range of the first air-cooled module, the first air-cooled module is hinged to the rocker arm, and the blowing position and angle of the first air-cooled module can be adjusted through such arrangement, so as to ensure that even if there is an obstruction above the mainboard during the test, the mainboard can be fully cooled by adjusting the position and blowing angle of the first air-cooled module.

[0055] In one embodiment, the first air-cooled module further comprises:

[0056] The fixed support is connected to the support structure, the rocker arm is hinged to the fixed support, a third connecting hole is formed on the rocker arm, and a plurality of fourth connecting holes are formed on the fixed support and are arranged at intervals along the movement track of the third connecting hole.

[0057] The second fastener passes through the third connecting hole and the fourth connecting hole and connects the rocker arm and the fixed support.

[0058] Beneficial effect: when the operator needs to limit the first air-cooled module at a certain angle, the connection between the second fastener and the third connecting hole and the fourth connecting hole can be first released, then the rocker arm is driven to rotate relative to the fixed support to the appropriate angle, then the second fastener is passed through the third connecting hole and the corresponding fourth connecting hole, and the rocker arm is limited at the appropriate angle.

[0059] By changing the fourth connecting hole connected with the third connecting hole, the rocker arm can be fixed at the appropriate angle, so that the rocker arm can be fixed at multiple gears.

[0060] In one embodiment, the server further comprises:

[0061] The second air-cooled module is slidably connected to the support structure and can slide in a specified direction to blow air towards the test module on the carrier assembly.

[0062] Beneficial effects: By driving the second air-cooling module to slide in a specified direction, not only can the position of the second air-cooling module be adjusted to expose the motherboard, but the distance between the second air-cooling module and the supporting component can also be adjusted so that the second air-cooling module can provide sufficient heat dissipation to the supporting component.

[0063] In one embodiment, the second air-cooled module includes:

[0064] The bearing seat has two ends that are slidably connected to the supporting structure.

[0065] The second module body includes multiple second fans mounted on a support base, with the multiple second fans arranged sequentially along the support base.

[0066] In one embodiment, the support structure includes:

[0067] Side supports are provided in pairs and are connected to both sides of the base respectively, forming a receiving cavity between the base and the side supports.

[0068] Beneficial effects: The base primarily serves as a universal load-bearing platform, capable of withstanding significant weight without deformation. It can support the motherboard and, together with the side supports, forms a simple support frame structure, facilitating motherboard assembly and disassembly. Furthermore, the base and the two side supports create a first and a second opening, providing ample space for testing operations.

[0069] In one embodiment, the side support includes:

[0070] The first and second columns are spaced apart along the length of the base;

[0071] A support beam connects the first column and the second column, and a load-bearing component is slidably connected to the support beam.

[0072] Beneficial effects: This design not only supports and protects the hardware within the support structure but also allows for sliding connections with the load-bearing components, resulting in a more compact server structure. Furthermore, openings can be formed between the first column, second column, support beam, and base, enabling operators to access and manipulate the motherboard from multiple angles during testing. Additionally, these openings facilitate heat dissipation during server movement, maintaining the server's normal operating temperature.

[0073] In one embodiment, a first support surface is formed on the side of the base away from the motherboard, and a second support surface is formed on the side bracket. When the server is in a flat position, the first support surface can serve as the bottom surface, and when the server is in a side-standing position, the second support surface can serve as the bottom surface. Beneficial effects:

[0074] With this configuration, the side support can not only support the load-bearing components and the first air-cooling module, but also serve as the bottom support for the entire server, enabling the server to have both a side-standing and a flat position, and allowing for human-machine collaborative operation from multiple angles.

[0075] In one embodiment, a plurality of first feet are formed on the base, and the plurality of first feet form a first support surface; and / or,

[0076] Multiple second feet are formed on the side support, and the multiple second feet form a second support surface.

[0077] Beneficial effects: The first and second feet provide stable support for the server and facilitate air circulation within the server, accelerating heat dissipation and thus maintaining the normal operating temperature of the server equipment.

[0078] In one embodiment, the server is characterized by further comprising a motherboard tray disposed within a receiving cavity, the motherboard being disposed on the motherboard tray; and / or

[0079] The support structure is equipped with handles.

[0080] Beneficial effects: The motherboard tray is mainly used to fix and protect the motherboard, ensuring its stability and security inside the chassis. The handle facilitates server handling and installation, allowing users to more easily grasp and move the server during transport and installation, thus improving the work efficiency of maintenance personnel. The server in this embodiment has a standardized installation structure. Attached Figure Description

[0081] To more clearly illustrate the technical solutions in the specific embodiments or related technologies of this application, the drawings used in the description of the specific embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0082] Figure 1 is a perspective view of a server according to an embodiment of this application, in which the carrier component is located in the first position;

[0083] Figure 2 is a top view of a server according to an embodiment of this application with the carrying component in a first position;

[0084] Figure 3 is a side view of a server according to an embodiment of this application with the carrying component in a first position;

[0085] Figure 4 is a perspective view of a server's carrying component in a second position according to an embodiment of this application;

[0086] Figure 5 is a top view of a server's carrying component in a second position according to an embodiment of this application;

[0087] Figure 6 is a side view of a server's carrying component in a second position according to an embodiment of this application;

[0088] Figure 7 is a top view of a server carrying component according to an embodiment of this application;

[0089] Figure 8 shows a specific embodiment of a server carrying component according to an embodiment of this application;

[0090] Figure 9 is an enlarged view of the sliding connection structure of a server according to an embodiment of this application;

[0091] Figure 10 shows a test module of a server according to an embodiment of this application;

[0092] Figure 11 shows another test module of a server according to an embodiment of this application;

[0093] Figure 12 schematically shows a configuration of the test module on a server carrying component according to an embodiment of this application;

[0094] Figure 13 schematically shows another configuration of the test module on a server carrying component in an embodiment of this application;

[0095] Figure 14 shows a first air-cooling module of a server according to an embodiment of this application;

[0096] Figure 15 is an exploded view of the support structure of a server according to an embodiment of this application;

[0097] Figure 16 is a schematic diagram of a server in a side-standing state according to an embodiment of this application.

[0098] Explanation of reference numerals in the attached drawings: 1. Support structure; 101. Base; 102. Side bracket; 1021. First column; 1022. Second column; 1023. Support beam; 103. First opening; 104. Second opening; 105. First foot; 106. Second foot; 2. Main board; 3. Load-bearing component; 301. Base plate; 3011. First hole; 3012. Second hole group; 30121. Second hole; 3013. Receiving groove; 3014. Through hole; 3015. Reinforcing rib; 3016. First side; 3017. Second side; 302. Overlapping edge; 4. Sliding connection structure; 401. Strip hole; 402. Fixing pin; 5. Test module; 501. First connecting hole; 7. First air-cooled module; 701. First module body; 702. Rocker arm; 7021. Third connecting hole; 703. Fixed support; 7031. Fourth connecting hole; 8. Second air-cooled module; 801. Bearing seat; 802. Second module body; 9. Handle. Detailed Implementation

[0099] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0100] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0101] Open servers with non-standard chassis are primarily used for functional verification in R&D or testing processes, such as CPU (Central Processing Unit), circuit boards, and connections. Because open servers lack fixed usage scenarios and even fixed usage methods, users may perform different verification operations on the device at any time. Different verification and testing scenarios or testers may have different configuration and usage methods. Therefore, although open servers do not have the strict structural size limitations of general-purpose chassis, their high degree of freedom in actual use scenarios requires them to accommodate more configurations or flexible combinations. The lack of strict design standards and the potential for free combination bring great freedom to open servers. As a result, current open server structural designs are highly varied, but most designs are relatively loose. All required modules or components need to be externally connected via cables, resulting in a large test platform footprint, long cable lengths, messy connections, and uncontrollable connection reliability, introducing adverse factors into the entire testing process.

[0102] Since there is currently no universally applicable methodology for open server design, development generally relies on the experience of structural engineers, and no effective set of technologies and evaluation methods have been established. Therefore, it is particularly important to propose a compact open server design methodology that allows for highly flexible configuration and adaptability to most verification and testing scenarios.

[0103] Traditional open servers often address multi-configuration needs by temporarily adding peripheral modules. These modules are connected directly via long cables, resulting in haphazard placement, large test space requirements, unstable signals, and significant signal loss due to excessive cable length. This can lead to substantial discrepancies between the test process and the results.

[0104] The embodiments of this application are described below with reference to Figures 1 to 16.

[0105] According to an embodiment of this application, a server is provided, including a support structure 1, a motherboard 2, and a carrier component 3. The support structure 1 has a receiving cavity. The motherboard 2 is disposed within the receiving cavity. The carrier component 3 is disposed within the receiving cavity and has a connection structure. The connection structure is detachably connected to at least one test module 5. The test module 5 is connected to the motherboard 2 via a cable. The carrier component 3 is movably disposed on the support structure 1 and has a first position and a second position relative to the support structure 1. The carrier component 3 can completely overlap with the motherboard 2 when in the first position and partially overlap with or completely expose the motherboard 2 when in the second position.

[0106] During use, as shown in Figure 4, the operator can first switch the carrier component 3 to the second position, exposing the motherboard 2 (see Figure 5), thus providing ample space for the operator to connect cables and install test accessories on the motherboard 2. Next, as shown in Figures 1 to 3, the operator can switch the carrier component 3 to the first position. When the carrier component 3 is in the first position, the distance between the carrier component 3 and the motherboard 2 is minimized, allowing for simple and convenient interconnection of the cables between the upper test module 5 and the lower motherboard 2, achieving lower-loss wiring. This minimizes the cable length between the test module and the motherboard 2, avoiding excessive loss due to excessive cable length and potential deviations in test results.

[0107] Furthermore, since the supporting component 3 is located inside the server chassis, the computing module and the testing module 5 can also be placed inside the cavity of the supporting structure 1 during the testing process of the server in this embodiment, thus avoiding the computing module and the testing module 5 being exposed outside the supporting structure 1 and occupying a large amount of space.

[0108] Therefore, during use, the operator can switch the bearing component 3 to enable the server to adapt to various test conditions and minimize the length of the cable, avoiding increased power consumption of the module due to excessive cable length. This makes the server cabling scenario closer to the actual use scenario of the server, preventing deviations in test results, thereby supporting better R&D verification testing and saving the space occupied by the server.

[0109] The server in this application embodiment is used to test the number of test modules 5 that the developed product can be compatible with during the research and development process of the central processing unit, as well as its performance when paired with different test modules 5. In this application embodiment, the test module 5 is a hardware module used to connect to the product under test via a physical connection or communication protocol, including but not limited to PCIe (Peripheral Component Interconnect Express) modules, GPU (Graphics Processing Unit) modules, hard disk modules, data acquisition test modules, etc. Hard disk modules include but are not limited to SATA (Serial ATA) modules, SAS (Serial Attached SCSI) modules, NVMe (Non-Volatile Memory Express) modules, and e3.s modules, etc.

[0110] It should be noted that, in this embodiment of the application, as shown in Figure 2, "completely overlapping" of the support component 3 and the motherboard 2 means that the orthographic projection of the support component 3 toward the motherboard 2 is completely contained within the motherboard 2. As shown in Figure 5, "partially overlapping" of the support component 3 and the motherboard 2 means that the orthographic projection of the support component 3 toward the motherboard 2 is partially contained within the motherboard 2. "Completely exposing the motherboard 2" means that the orthographic projection of the support component 3 toward the motherboard 2 is not contained within the area of ​​the motherboard 2.

[0111] Furthermore, in some embodiments of this application, the carrier component 3 is slidably connected to the support structure 1 and is disposed opposite to the motherboard 2, and can slide relative to the support structure 1 in a specified direction.

[0112] By sliding the drive component 3 along a specified direction, the relative position of the drive component 3 and the motherboard 2 can be adjusted. After the operator connects one end of the cable to the motherboard 2, the operator can move the corresponding test module 5 to the position directly above its corresponding position on the motherboard 2 by sliding the drive component 3 along a specified direction. This minimizes the cable length to meet the testing requirements of test modules 5 (such as bus modules) with high cable length requirements and further improves the accuracy of test results.

[0113] In other embodiments of this application, the load-bearing component 3 is hinged to the support structure 1 and has a first state in which it overlaps the support structure 1 and a second state in which the free segment rotates away from the support structure 1. The load-bearing component 3 is capable of being in a first position when switched to the first state and in a second position when switched to the second state.

[0114] Furthermore, in some embodiments of this application, the support structure 1 includes a base 101, a first opening 103, and a second opening 104. The main board 2 is connected to the base 101. The first opening 103 is disposed opposite to the base 101, exposing the main board 2, and the support component 3 passes through the first opening 103 and is slidably connected to the support structure 1. The second opening 104 is adjacent to the base 101, and as shown in Figures 5 and 6, the support component 3 can at least partially pass through the second opening 104 when in the second position.

[0115] The first opening 103 can be used to expose the motherboard 2 and facilitate the sliding connection between the carrier component 3 and the support structure 1. The second opening 104 can provide a larger space for testing operations and allow the carrier component 3, which is set in the receiving cavity, to extend outward, thereby exposing the motherboard 2.

[0116] Furthermore, in some embodiments of this application, the specified direction is the length direction of the motherboard 2, and the support component 3 is connected between the two sides of the support structure 1 along the width direction. With this arrangement, the support component 3 can cover the area on the motherboard 2 where the connectors are densely packed when it is in the first position.

[0117] In some other embodiments of this application, the specified direction is the width direction of the motherboard 2, and the bearing component 3 is connected between the two sides of the support structure 1 along the length direction.

[0118] Furthermore, in some embodiments of this application, as shown in FIG7, the supporting component 3 includes a base plate 301 and overlapping edges 302. The base plate 301 is used to support the test module 5. The overlapping edges 302 are arranged in pairs and are respectively connected to both sides of the base plate 301. The overlapping edges 302 are slidably connected to the support structure 1 through a sliding connection structure 4.

[0119] Furthermore, in some embodiments of this application, the sliding connection structure 4 includes a strip hole 401 and a fixing pin 402. The strip hole 401 is formed on one of the support structure 1 and the overlapping edge 302 and extends in a specified direction. The fixing pin 402 is formed on the other of the support structure 1 and the overlapping edge 302 and passes through the strip hole 401.

[0120] For example, in the embodiment shown in Figure 7, a strip hole 401 is formed on the overlapping edge 302, and a fixing pin 402 is formed on the support structure 1. When the bearing component 3 is subjected to external force, the strip hole 401 can move relative to the fixing pin 402 until the fixing pin 402 abuts against one side wall of the strip hole 401, and the bearing component 3 moves into position. Furthermore, the fixing pin 402 can also prevent the portion of the bearing component 3 protruding from the second opening 104 after moving to the second position from becoming too large, thus avoiding a shift in the center of the server.

[0121] Furthermore, in some embodiments of this application, the supporting component 3 is a sheet metal structure. In other embodiments, the supporting component 3 may also be a wooden board or a plastic board, etc.

[0122] Furthermore, in some embodiments of this application, the fixing pin 402 includes a locking head and a connecting pin connected in sequence. The connecting pin passes through the strip hole 401 and connects to the support structure 1. The locking head is located on the side of the bearing component 3 away from the support structure 1, which can constrain the bearing component 3 to the support structure 1 to prevent the bearing component 3 from tipping over when it is switched to the second position.

[0123] In some other embodiments of this application, a retaining pin 402 is formed on the overlapping edge 302, and a strip hole 401 is formed on the support component 3.

[0124] In some embodiments of this application, the sliding connection structure 4 is a slide rail.

[0125] Furthermore, in some embodiments of this application, a first connection hole 501 is formed on the test module 5, and the connection structure includes a second connection hole and a first fastener. The first fastener can pass through the first connection hole 501 and the second connection hole, and connect the test module 5 and the base plate 301.

[0126] With this configuration, the first connecting hole 501, the second connecting hole, and the first fastener can cooperate with each other to reliably connect the test module 5 to the support component 3, and the connection structure occupies a small space. In one embodiment, the first fastener is, but is not limited to, a bolt or a rivet. In another embodiment, the connection structure can also be a riveting structure, a snap-fit ​​structure, or an adhesive structure, etc.

[0127] Furthermore, in some embodiments of this application, as shown in Figures 7 and 8, the second connection hole includes a group of first holes 3011 and a group of second holes 3012. The second connection hole includes at least one first hole 3011, the distance between the first hole 3011 and the first edge 3016 of the base plate 301 is d1, the test module 5 includes a first test module, the first test module includes a PCIe module, the length of the PCIe module is L1, L1≤d1≤1.2L1, and the first connection hole 501 on the first test module can mate with the first hole 3011.

[0128] The aforementioned ratio range is the optimal range obtained after statistically analyzing a large amount of dimensional information of the first test modules. When the ratio of d1 to L1 is within the aforementioned range, the first hole 3011 can be used to connect with various test modules 5 of longer length, i.e., the first test modules. In one embodiment, the first test module is, but is not limited to, a PCIe module or a graphics processor module. This ensures that the supporting component 3 is compatible with various test modules 5 of longer length, without wasting space due to an excessively large distance between the first hole 3011 and the first side 3016 of the base plate 301. It should be understood that, in this embodiment, a PCIe module whose dimensions are compatible with the dimensions of the base plate 301 should be selected to obtain its dimensional information.

[0129] For example, in one embodiment, L1 = 270mm, d1 = 160mm, the first hole 3011 group includes at least one first hole 3011, and the minimum distance between the first hole 3011 and a designated side of the base plate 301 is d1, 285mm≤d1≤300mm.

[0130] Furthermore, in some embodiments of this application, d1 is 293.64 mm.

[0131] When there are multiple first holes 3011, the multiple first holes 3011 are arranged at intervals along the extension direction of the first side 3016. The distance between two adjacent first holes 3011 is d2, and the width of the PCIe module is b1, where 0.2b1 ≤ d2 ≤ 0.3b1.

[0132] By setting it like this, the multiple first holes 3011 are arranged along the length direction of the first side 3016, enabling the multiple first test modules connected to the bottom plate 301 to be arranged side by side. The above ratio range is the optimal ratio range obtained after statistically analyzing the size information of a large number of first test modules. When the size ratio of d2 to b1 is within the above range, it can be ensured that there is no interference between adjacent first test modules, and it will not cause waste of space due to the excessive distance between the first test modules.

[0133] Exemplarily, in one embodiment, b1 = 160 mm, 35 mm ≤ d2 ≤ 45 mm. The multiple first holes 3011 are arranged along the length direction of the first side 3016, enabling the multiple first test modules connected to the bottom plate 301 to be arranged side by side. When the distance between two adjacent first holes 3011 is within the above range, it can be ensured that there is no interference between adjacent first test modules, and it will not cause waste of space due to the excessive distance between the first test modules.

[0134] In one embodiment, d2 = 40.64 mm.

[0135] Further, in some embodiments of the present application, the bottom plate 301 includes adjacent first side 3016 and second side 3017, and the second connection holes include second hole groups 3012. The second hole groups 3012 include at least two pairs of second holes 30121. Each pair of second holes 30121 is arranged at intervals along the extension direction of the first side 3016. The distance between two adjacent second holes 30121 is d3, the test module 5 includes a second test module, the second test module includes a hard disk module, the width of the hard disk module is b2, 0.6b2 ≤ d3 < b2, the distance between two adjacent pairs of second holes 30121 is d4, the length of the hard disk module is L2, d4 ≥ 1.3L2, and the first connection holes 501 on the second test module can cooperate with the second hole groups 3012.

[0136] The above ratio range is the optimal ratio range obtained after statistically analyzing the size information of a large number of second test modules. When d3 and d4 are within the above range, the second hole groups 3012 can be used to connect second test modules, such as SATA / SAS modules, NVMe modules, and e3.s modules, etc. It should be understood that in the embodiments of the present application, a hard disk module adapted to the size of the bottom plate 301 should be selected to obtain its size information.

[0137] For example, in one embodiment, L2 = 137 mm, b2 = 134 mm, 90 mm ≤ d3 ≤ 130 mm. Two pairs of second holes 30121 are spaced apart along the extension direction of the second side 3017, and the distance between two adjacent pairs of second holes 30121 is d4, where d4 ≥ 180 mm.

[0138] In one embodiment, d3 = 126 mm.

[0139] In one embodiment, there are multiple sets of second hole groups 3012, which are spaced apart along the extension direction of the first side 3016, and can be used to connect multiple sets of second test modules. The distance between two adjacent second hole groups 3012 is d5, the length of the first side 3016 is L3, and the base plate 301 is provided with n second hole groups 3012 along the extension direction of the first side 3016, where d5 = L3 - nd3 / n.

[0140] This arrangement allows adjacent second hole groups 3012 to be evenly distributed on the base plate 301, minimizing interference and facilitating heat dissipation for the second test module. For example, in one embodiment, L3 = 473.1 mm, and the base plate 301 has three second hole groups 3012 extending along the first side 3016, with a spacing of 22 mm between adjacent second hole groups 3012.

[0141] Therefore, the first hole group 3011 and the second hole group 3012 of the second connection hole in this embodiment can be connected to various test modules 5, thereby achieving compatibility with common test modules 5 with a smaller number of openings, and enabling the carrier component 3 to be compatible with diverse configuration combinations such as graphics processors, PCIe modules, and hard disk modules, and maximizing compatibility with the number of test modules 5 through a modular structure. Therefore, the carrier component 3 in this embodiment has a standardized opening and positioning pin structure, which enables free assembly and combination of modular modules.

[0142] Among them, the first side and the second side are respectively the long side of the base plate 301 and the wide side of the base plate 301.

[0143] In one embodiment, the first side is the long side of the base plate 301, and the second side is the wide side of the base plate 301.

[0144] Figure 8 shows the distances between each hole on the server's support component 3 and the first side 3016 and the second side 3017 of the support component 3, in millimeters. It should be noted that Figure 8 shows only one specific implementation of the support component 3 in this application, and not the only implementation of the support component 3 in this application. Those skilled in the art can also make adaptive adjustments to the size of the support component 3 and the distances between each hole and the first side 3016 and the second side 3017 of the support component 3 according to the size of the server and the model of the central processing unit under test.

[0145] In one embodiment, the test module 5 further includes a third test module, the size of which differs from the first and second test modules. The second connection hole also includes a third hole group, which can mate with the first connection hole 501 on the third test module. When a very small number of test modules 5 that need to be tested cannot be connected to the support component 3 using the first hole group 3011 and the second hole group 3012, a first connection hole 501 is opened on the third test module according to the size information of the third test module, and a third hole group matching the first connection hole 501 on the base plate 301 is then opened to achieve the connection of the third test module.

[0146] Furthermore, in some embodiments of this application, the first hole 3011 and the second hole group 3012 are formed in the same mounting area on the base plate 301. With this arrangement, the same mounting area on the base plate 301 can be used to mount both the first test module and the second test module, allowing the operator to flexibly mount the test module 5 on the support component 3 according to test requirements during the testing process, so that the server of this embodiment can meet diverse testing needs.

[0147] It should be noted that in this embodiment, the type and number of test modules 5 mounted on the carrier component 3 are not limited. The type and number of test modules 5 mounted on the carrier component 3 can be adaptively adjusted according to the actual usage requirements during the motherboard 2 testing process. For example, in the embodiment shown in FIG12, the carrier component 3 is equipped with 8 NVMe (Non-Volatile Memory Express) modules and 8 PCIe modules.

[0148] In the embodiment shown in Figure 13, 24 NVMe modules are mounted on the carrier component 3.

[0149] In this embodiment, the support component 3 is also provided with a fixing pin 402, which can cooperate with the second connection hole to make the connection between the support component 3 and the test module 5 more reliable.

[0150] In actual use, it can be freely matched according to needs. At the same time, new configuration modules can be developed according to actual needs. It is only necessary for the positioning pin structure and fixing hole on the bearing component 3 to match the configuration module.

[0151] In the description of this application, it should be understood that the terms "first," "second," "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. In the description of this application, "a plurality of" means two or more, unless otherwise explicitly defined.

[0152] Furthermore, in some embodiments of this application, the base plate 301 is recessed towards the motherboard 2 to form a receiving groove 3013, and the connection structure is disposed within the receiving groove 3013. With this arrangement, the carrier component 3 can be located within the receiving cavity, and the test module 5 mounted on it can also be located within the receiving cavity, thereby making the server structure more compact and helping to shorten the length of the cable connecting the test module 5 and the carrier component 3.

[0153] Furthermore, in some embodiments of this application, through holes 3014 are formed on the surface of the base plate 301. Cables of some test modules 5 (such as PCIe modules) with high cable length requirements can pass through the through holes 3014 and connect to the motherboard 2. This allows the cables to extend downwards and connect to the motherboard 2 without extending to the edge of the base plate 301. Thus, while ensuring that the size of the base plate 301 can be set to be large enough to meet the testing requirements of the motherboard 2, the cable length is further shortened, reducing cable losses.

[0154] Furthermore, in some embodiments of this application, reinforcing ribs 3015 extending along the length direction of the base plate 301 are formed on the plate surface of the base plate 301. The reinforcing ribs 3015 are used to improve the structural strength of the load-bearing component 3 to ensure that the load-bearing component 3 can support the test module 5 required for testing.

[0155] Furthermore, in some embodiments of this application, the reinforcing rib 3015 is a bent portion formed by stamping on the base plate 301. By setting it in this way, not only can the strength of the base plate 301 be improved without increasing the material of the base plate 301, but the processing of the reinforcing rib 3015 is also simpler and faster.

[0156] In one embodiment, the reinforcing rib 3015 is a reinforcing protrusion formed on the surface of the base plate 301.

[0157] Furthermore, in some embodiments of this application, as shown in FIG14, the server further includes a first air-cooling module 7. The first air-cooling module 7 is used to blow air toward the motherboard 2. The first air-cooling module 7 is rotatably connected to the support structure 1 and can rotate along a preset axis. The extension direction of the preset axis forms an angle with the specified direction. By rotating the first air-cooling module 7 along the preset axis, during the test, as shown in FIG6, the operator can first switch the bearing component 3 to the second position and expose the interface on the motherboard 2, while simultaneously switching the first air-cooling module 7 to the end of the support structure 1 away from the bearing component 3, so as to expose the motherboard 2 to the greatest extent, making it convenient for the operator to plug cables into the motherboard 2 or install accessories such as heat sinks. At the same time, the first air-cooling module 7 and the bearing component 3 are located at opposite ends of the support structure 1, thereby balancing the center of the support structure 1 and preventing the server from tipping over.

[0158] This provides ample space for the operator to connect cables to the motherboard 2 and install and test accessories.

[0159] After the test module 5 is connected, the first air-cooling module 7 can be rotated in the opposite direction to reduce the distance between the first air-cooling module 7 and the central processing unit that needs to be cooled, so as to ensure that the first air-cooling module 7 can provide sufficient cooling for the motherboard 2 and avoid the motherboard 2 overheating and affecting the test results.

[0160] In one embodiment, the extension direction of the preset axis is perpendicular to the specified direction.

[0161] Furthermore, in some embodiments of this application, the first air-cooled module 7 includes a first module body 701 and a rocker arm 702. The first module body 701 includes a plurality of first fans, which are arranged sequentially along the extension direction of a preset axis. The rocker arms 702 are arranged in pairs and respectively located at both ends of the first module body 701. One end of the rocker arm 702 is hinged to the support structure 1, and the second end of the rocker arm 702 is hinged to the first module body 701.

[0162] The rocker arm 702 can be used to expand the range of motion of the first air-cooling module 7. The first air-cooling module 7 is hinged to the rocker arm 702. With this setting, the blowing position and angle of the first air-cooling module 7 can be adjusted, ensuring that even if there is an obstruction above the motherboard 2 during the test, the motherboard 2 can still be adequately cooled by adjusting the position and blowing angle of the first air-cooling module 7.

[0163] In some other embodiments of this application, the first air-cooled module 7 is hinged to the support structure 1 via a hinge.

[0164] Furthermore, in some embodiments of this application, the first air-cooled module 7 further includes a fixed support 703 and a second fastener. The fixed support 703 is connected to the support structure 1, and the rocker arm 702 is hinged to the fixed support 703. A third connecting hole 7021 is formed on the rocker arm 702, and a plurality of fourth connecting holes 7031 are formed on the fixed support 703. The plurality of fourth connecting holes 7031 are spaced apart along the movement trajectory of the third connecting hole 7021. The second fastener passes through the third connecting hole 7021 and the fourth connecting holes 7031, and connects the rocker arm 702 to the fixed support 703.

[0165] When the operator needs to limit the first air-cooled module 7 to a certain angle, he can first disconnect the second fastener from the third connecting hole 7021 and the fourth connecting hole 7031, then drive the rocker arm 702 to rotate relative to the fixed support 703 to a suitable angle, then pass the second fastener through the third connecting hole 7021 and the corresponding fourth connecting hole 7031, and limit the rocker arm 702 to a suitable angle.

[0166] By changing the fourth connecting hole 7031 connected to the third connecting hole 7021, the rocker arm 702 can be fixed at a suitable angle, allowing the rocker arm 702 to be fixed in multiple positions. In one embodiment, the second fastener is, but is not limited to, bolts, rivets, or locating pins. To facilitate the operator switching the angle of the rocker arm 702, the second fastener can also be a hand-tightening screw. In other embodiments of this application, there is significant damping between the rocker arm 702 and the fixed support 703. When it is necessary to adjust the angle of the first air-cooling module 7, the operator can overcome the damping to drive the rocker arm 702 to rotate. When the rocker arm 702 loses external force, it can remain relatively stationary with respect to the fixed support 703, thereby constraining the first air-cooling module 7 at a suitable angle.

[0167] Furthermore, in some embodiments of this application, the fixed support 703 is connected to the side of the support structure 1, which can avoid occupying the area of ​​the base 101, so that the space on the base 101 can be mainly used to accommodate the motherboard 2, making the server structure more compact.

[0168] In some other embodiments of this application, the fixed support 703 may also be the base 101 connected to the server.

[0169] In this embodiment, a sliding pin is formed on the rocker arm 702, and a strip-shaped hole 401 is also provided on the fixed support 703. The strip-shaped hole 401 is fitted onto the sliding pin and extends along the movement direction of the sliding pin. The strip-shaped hole 401 and the sliding pin cooperate with each other to constrain the rotation range of the rocker arm 702 and prevent the hinge bearing between the rocker arm 702 and the fixed support 703 from being subjected to excessive load.

[0170] Furthermore, in some embodiments of this application, the server further includes a second air-cooling module 8. The second air-cooling module 8 is slidably connected to the support structure 1 and is capable of sliding in a specified direction to blow air toward the test module 5 on the carrier component 3.

[0171] By driving the second air-cooling module 8 to slide in a specified direction, not only can the position of the second air-cooling module 8 be adjusted to expose the motherboard 2, but the distance between the second air-cooling module 8 and the supporting component 3 can also be adjusted so that the second air-cooling module 8 can provide sufficient heat dissipation for the supporting component 3.

[0172] In one embodiment, the second air-cooling module 8 and the support structure 1 are slidably connected via a slide rail, or they can be slidably connected via a mating strip hole 401 and a fixing pin 402. In one embodiment, the second air-cooling module 8 has a first flange and a second flange on each side for overlapping with the support structure 1, allowing for slidable connection with the support structure 1 via the first flange and the second flange. When the operator needs to perform operations such as plugging in cables or installing accessories on the motherboard 2, the operator can directly remove the second air-cooling module 8 from the support structure 1, thereby maximizing the exposure of the motherboard 2 and providing ample space for testing operations.

[0173] Furthermore, in some embodiments of this application, the second air-cooled module 8 includes a support base 801 and a second module body 802. The two ends of the support base 801 are slidably connected to the support structure 1. The second module body 802 includes a plurality of second fans disposed on the support base 801, the plurality of second fans being arranged sequentially along the support base 801.

[0174] Furthermore, in some embodiments of this application, the support structure 1 includes side brackets 102. The side brackets 102 are arranged in pairs and respectively connected to both sides of the base 101, forming a receiving cavity between the base 101 and the side brackets 102. The base 101 mainly serves as a universal load-bearing platform, capable of withstanding significant weight without deformation, and can be used to support the motherboard 2. It forms a simple support frame structure with the side brackets 102 on both sides, facilitating the assembly and disassembly of the motherboard 2. Simultaneously, a first opening 103 and a second opening 104 can be formed between the base 101 and the two side brackets 102 to provide sufficient space for testing operations.

[0175] In one embodiment, the base 101 and the side bracket 102 are detachably connected to each other and can be combined and installed according to actual usage requirements.

[0176] Furthermore, in some embodiments of this application, as shown in FIG15, the side support 102 includes a first column 1021, a second column 1022, and a support beam 1023. The first column 1021 and the second column 1022 are spaced apart along the length of the base 101. The support beam 1023 connects the first column 1021 and the second column 1022, and the load-bearing assembly 3 is slidably connected to the support beam 1023.

[0177] With this configuration, the support beam 1023 not only supports and protects the hardware within the support structure 1, but also allows for a sliding connection with the load-bearing component 3, making the server structure more compact. Furthermore, an opening can be formed between the first column 1021, the second column 1022, the support beam 1023, and the base 101, allowing operators to pass through the opening to manipulate the motherboard 2 during testing, thus enabling multi-angle human-machine collaborative operation. In addition, the opening facilitates the dissipation of heat generated during server movement, thereby maintaining the normal operating temperature of the server equipment.

[0178] In some other embodiments of this application, the side support 102 is a first side wall and a second side wall respectively disposed on both sides of the base 101.

[0179] Furthermore, as shown in Figure 16, in some embodiments of this application, a first support surface is formed on the side of the base 101 away from the motherboard 2, and a second support surface is formed on the side bracket 102. When the server is in a flat position, the first support surface can serve as the bottom surface, and when the server is in a side-standing position, the second support surface can serve as the bottom surface.

[0180] With this configuration, the side bracket 102 can not only support the load-bearing component 3 and the first air-cooling module 7, but also serve as the bottom support for the entire server, so that the server can have a side-standing state and a flat state, enabling human-machine collaborative operation from multiple angles.

[0181] Furthermore, in some embodiments of this application, a plurality of first feet 105 are formed on the base 101, and the plurality of first feet 105 form a first support surface; and / or,

[0182] Multiple second feet 106 are formed on the side support 102, and the multiple second feet 106 form a second support surface.

[0183] The first foot 105 and the second foot 106 can provide stable support for the server and facilitate air circulation within the server, accelerating heat dissipation and thus maintaining the normal operating temperature of the server equipment.

[0184] Furthermore, in some embodiments of this application, the server also includes a motherboard tray, which is disposed within a receiving cavity, and the motherboard 2 is disposed on the motherboard tray. The motherboard tray is mainly used to fix and protect the motherboard 2, ensuring its stability and security inside the chassis.

[0185] A handle 9 is provided on the support structure 1. The handle 9 facilitates the handling and installation of the server, making it easier for users to grasp and move the server during transport and installation, thereby improving the work efficiency of maintenance personnel. The server in this embodiment has a standardized installation structure.

[0186] In summary, during use, the operator can switch the bearer component 3 to enable the server to adapt to various test conditions, and minimize the length of the cable to avoid increasing the power consumption of the module due to excessive cable length. This makes the server cabling scenario closer to the actual use scenario of the server, preventing deviations in test results, thereby supporting better R&D verification testing, and saving the space occupied by the server.

[0187] This application proposes a generalized and standardized open server design. The server's support structure 1 has a simple support frame structure. Secondly, the base 101 mainly supports the motherboard 2 and the motherboard tray structure, which allows for easy assembly and disassembly. Thirdly, the server includes a support component 3, is compatible with diverse configurations such as graphics processors, PCIe modules, and hard disk storage, and achieves maximum compatibility through a modular structure. Finally, the structure includes a first air-cooling module 7, which allows for height and angle adjustment and heat dissipation between upper and lower layers. The server in this application has a compact structure, and the combination of various modules is close to that of a general-purpose enclosed chassis, enabling a more reasonable cabling scheme, providing a higher degree of freedom of movement, and improving the human-machine interface of the failure testing process.

[0188] Furthermore, the server described in this application embodiment can also be applied to servers and high-performance computing environments that require frequent upgrades or customization. For example, research institutions, data centers, and enterprise server rooms often require such a design to adapt to constantly changing computing needs. In these environments, the server described in this application embodiment provides a cost-effective way to update and maintain hardware resources, avoiding the cost and time overhead of frequently replacing the entire machine.

[0189] The above description is merely a preferred embodiment of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily make changes or modifications within the technical scope disclosed in this application, and such changes or modifications should be covered within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims. As long as there is no structural conflict, the various technical features mentioned in the various embodiments can be combined in any way. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A server, characterized in that, include: A support structure (1) is provided, wherein a receiving cavity is formed within the support structure (1); The motherboard (2) is disposed within the receiving cavity; A support component (3) is disposed within the receiving cavity. The support component (3) is provided with a connection structure, which can be detachably connected to at least one test module (5). The test module (5) is connected to the motherboard (2) via a cable. The support component (3) is movably disposed on the support structure (1) and has a first position and a second position relative to the support structure (1). The support component (3) can completely overlap with the motherboard (2) when it is in the first position, and partially overlap with the motherboard (2) or completely expose the motherboard (2) when it is in the second position.

2. The server according to claim 1, characterized in that, The bearing component (3) is slidably connected to the support structure (1) and is disposed opposite to the motherboard (2), and can slide relative to the support structure (1) in a specified direction.

3. The server according to claim 2, characterized in that, The supporting structure (1) includes; The base (101) is to which the motherboard (2) is connected; A first opening (103) is disposed opposite to the base (101) and can expose the main board (2). The supporting component (3) passes through the first opening (103) and is slidably connected to the support structure (1). The second opening (104) is adjacent to the base (101), and the support assembly (3) is able to pass through the second opening (104) at least partially when in the second position.

4. The server according to claim 2, characterized in that, The carrier component (3) includes: The base plate (301) is used to support the test module (5); The overlapping edges (302) are arranged in pairs and respectively connected to both sides of the base plate (301). The overlapping edges (302) are slidably connected to the support structure (1) through the sliding connection structure (4).

5. The server according to claim 4, characterized in that, The sliding connection structure (4) includes: A strip-shaped hole (401) is formed on one of the support structure (1) and the overlapping edge (302) and extends in a specified direction; A fixing pin (402) is formed on the other of the support structure (1) and the overlapping edge (302) and passes through the strip hole (401).

6. The server according to claim 5, characterized in that, The test module (5) has a first connection hole (501) formed thereon, and the connection structure includes: Second connecting hole; The first fastener is able to pass through the first connecting hole (501) and the second connecting hole, and connect the test module (5) and the base plate (301).

7. The server according to claim 6, characterized in that, The second connection hole includes at least one first hole (3011), the distance between the first hole (3011) and the first side (3016) of the base plate (301) is d1, the test module (5) includes a first test module, the first test module includes a PCIe module, the length of the PCIe module is L1, L1≤d1≤1.2L1, and the first connection hole (501) on the first test module can cooperate with the first hole (3011).

8. The server according to claim 7, characterized in that, The first holes (3011) are multiple, and the multiple first holes (3011) are arranged at intervals along the extension direction of the first side (3016). The distance between the multiple first holes (3011) is d2, the width of the PCIe module is b1, and 0.2b1 ≤ d2 ≤ 0.3b1.

9. The server according to claim 6, characterized in that, The bottom plate (301) includes an adjacent first side (3016) and a second side (3017). The second connection holes include a second hole group (3012). The second hole group (3012) includes at least two pairs of second holes (30121). Each pair of the second holes (30121) is arranged at intervals along the extension direction of the first side (3016). The two pairs of the second holes (30121) are arranged at intervals along the extension direction of the second side (3017). The distance between adjacent two second holes (30121) is d3. The test module (5) includes a second test module. The second test module includes a hard disk module. The width of the hard disk module is b2, and 0.6b2 ≤ d3 < b2. The distance between adjacent two pairs of the second holes (30121) is d4, and the length of the hard disk module is L2, and d4 ≥ 1.3L2. The first connection holes (501) on the second test module can cooperate with the second hole group (3012).

10. The server according to claim 9, characterized in that, The second hole group (3012) is multiple; The multiple second hole groups (3012) are arranged at intervals along the extension direction of the first side (3016). The distance between adjacent two second hole groups (3012) is d5. The length of the first side (3016) is L3. There are n second hole groups (3012) arranged along the extension direction of the first side (3016) on the bottom plate (301), and d5 = (L3 - nd3) / n.

11. The server according to claim 6, characterized in that, The second connection holes include a second hole group (3012) and at least one first hole (3011). The first hole (3011) and the second hole group (3012) are formed in the same installation area on the bottom plate (301).

12. The server according to claim 6, characterized in that, The test module (5) includes a third test module. The second connection holes include a third hole group. The third hole group can cooperate with the first connection holes (501) on the third test module.

13. The server according to any one of claims 4 to 12, characterized in that, The bottom plate (301) is recessed towards the direction close to the main board (2) to form a receiving groove (3013). The connection structure is arranged in the receiving groove (3013).

14. The server according to any one of claims 4 to 12, characterized in that, Through holes for wires (3014) are formed on the plate surface of the bottom plate (301).

15. The server according to any one of claims 4 to 12, characterized in that, Reinforcing ribs (3015) extending along the length direction of the bottom plate (301) are formed on the plate surface of the bottom plate (301).

16. The server according to any one of claims 2 to 12, characterized in that, The server further includes: A first air-cooling module (7) for blowing air towards the main board (2). The first air-cooling module (7) is rotationally connected to the support structure (1) and can rotate along a preset axis. An included angle is formed between the extension direction of the preset axis and the specified direction.

17. The server according to claim 16, characterized in that, The first air-cooling module (7) includes: A first module main body (701) including multiple first fans. The multiple first fans are arranged in sequence along the extension direction of the preset axis; Rocker arms (702) are arranged in pairs and respectively located at both ends of the first module body (701). One end of the rocker arm (702) is hinged to the support structure (1), and the second end of the rocker arm (702) is hinged to the first module body (701).

18. The server according to claim 17, characterized in that, The first air-cooled module (7) also includes: A fixed support (703) is connected to the support structure (1). A rocker arm (702) is hinged to the fixed support (703). A third connecting hole (7021) is formed on the rocker arm (702). A plurality of fourth connecting holes (7031) are formed on the fixed support (703). The plurality of fourth connecting holes (7031) are spaced apart along the movement trajectory of the third connecting hole (7021). The second fastener passes through the third connecting hole (7021) and the fourth connecting hole (7031) and connects the rocker arm (702) to the fixed support (703).

19. The server according to any one of claims 2 to 12, characterized in that, Also includes: The second air-cooled module (8) is slidably connected to the support structure (1) and can slide along the specified direction for blowing air toward the test module (5) on the bearing assembly (3).

20. The server according to claim 19, characterized in that, The second air-cooled module (8) includes: A bearing seat (801) is provided, the two ends of which are slidably connected to the support structure (1); The second module body (802) includes a plurality of second fans disposed on the support base (801), and the plurality of second fans are arranged sequentially along the support base (801).

21. The server according to claim 3, characterized in that, The supporting structure (1) includes: Side brackets (102) are arranged in pairs and are respectively connected to both sides of the base (101), forming the receiving cavity between the base (101) and the side brackets (102).

22. The server according to claim 21, characterized in that, The side support (102) includes: The first column (1021) and the second column (1022) are spaced apart along the length of the base (101); A support beam (1023) is connected between the first column (1021) and the second column (1022), and the load-bearing component (3) is slidably connected to the support beam (1023).

23. The server according to claim 21, characterized in that, The base (101) forms a first support surface on the side away from the motherboard (2), and a second support surface is formed on the side bracket (102). When the server is in a flat position, the first support surface can serve as the bottom surface, and when the server is in a side-standing position, the second support surface can serve as the bottom surface.

24. The server according to claim 23, characterized in that, The base (101) has a plurality of first feet (105) formed thereon, and the plurality of first feet (105) form the first support surface; and / or, The side support (102) has a plurality of second feet (106) formed thereon, and the plurality of second feet (106) form the second support surface.

25. The server according to claim 1, characterized in that, The load-bearing component (3) is hinged to the support structure (1) and has a first state of overlapping the support structure (1) and a second state of rotating the free segment away from the support structure (1). The load-bearing component (3) is configured to be in a first position when switched to the first state and in a second position when switched to the second state.

26. The server according to any one of claims 1 to 12, characterized in that, It also includes a motherboard tray, which is disposed within the receiving cavity, and the motherboard (2) is disposed on the motherboard tray; and / or, The support structure (1) is provided with a handle (9).

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