Display module and display apparatus

Abstract

A display module. The display module comprises a display panel (4), wherein a non-display area of the display panel (4) is provided with a binding area (42), the binding area (42) comprises at least two binding sub-areas (421), a partition groove (422) is provided between two adjacent binding sub-areas (421), and the two adjacent binding sub-areas (421) are separated by means of the partition groove (422). Compared with the integrated binding mode in which the binding area is bent, the sum of the widths of the binding sub-areas is generally smaller, and as the sum of the widths decreases, the bending stress becomes smaller. Therefore, the bending radius of each binding sub-area can be reduced, thereby allowing for a smaller bezel in the display module. Moreover, under the same bending radius, the binding sub-area with smaller bending stress clearly exhibits a higher bending yield rate. The present disclosure further provides a display apparatus comprising the display module.

Description

Display module and display device

[0001] Cross-reference to related applications

[0002] The present disclosure claims priority to Chinese Patent Application No. 202410813815.5, filed on June 21, 2024, entitled "Display module and display device", the entire contents of which are incorporated herein by reference in its entirety. TECHNICAL FIELD

[0003] The present application relates to the technical field of display, in particular to a display module and a display device. BACKGROUND

[0004] With the development of OLED display technology, its application in vehicle information systems and entertainment devices is becoming more and more widespread, and medium and large size OLED display modules are gradually becoming more and more popular.

[0005] With the growing demand for horizontal display mode, the width of the binding area also becomes larger and larger, resulting in an increase in the bending radius, an increase in the frame of the display module, and a decrease in the yield of the binding process.

[0006] It should be noted that the information disclosed in the above background section is only used to strengthen the understanding of the background of the present application, and therefore can include information that does not constitute prior art known to those of ordinary skill in the art. SUMMARY

[0007] The present application aims to overcome the problem of an increase in the bending radius caused by an increase in the width of the binding area, an increase in the frame of the display module, and a decrease in the yield of the binding process, and to provide a display module and a display device.

[0008] According to one aspect of the present application, a display module is provided, comprising a display panel, a first control circuit board, and at least two first flexible circuit boards, the display panel being provided with a binding area, the binding area being bent to a non-display side of the display panel, the binding area comprising at least two sub-binding areas, a partition groove being provided between adjacent two sub-binding areas, each sub-binding area being provided with at least one first binding part; the first control circuit board being provided with at least two connecting parts; and the first flexible circuit boards being connected with the connecting parts and the first binding parts, respectively.

[0009] In one embodiment of the present application, the sub-binding area is provided with a driving chip, the driving chip being arranged between the display area of the display panel and the first binding part along a first direction, the display area of the display panel being provided with a signal line, the signal line being connected to different driving chips, respectively.

[0010] In one embodiment of the present application, the setting density of the signal lines of the plurality of sub-binding areas is the same, and the bending radius of any two sub-binding areas is the same.

[0011] In one embodiment of the present application, in any two sub-binding areas, the bending radius of the sub-binding area provided with the signal lines of large density is larger than the bending radius of the sub-binding area provided with the signal lines of small density.

[0012] In one embodiment of the present application, the widths of the plurality of sub-binding areas are the same.

[0013] In one embodiment of the present application, the widths of the at least two sub-binding areas are different, and the total number of the signal lines of the sub-binding area with large width is larger than the total number of the signal lines of the sub-binding area with small width.

[0014] In one embodiment of the present application, the signal lines include internal signal lines and peripheral signal lines, in any two sub-binding areas, the internal signal lines extend from the display area to the sub-binding area with large width, and the peripheral signal lines extend from the non-display area to the sub-binding area with small width.

[0015] In one embodiment of the present application, the width of the sub-binding area located at at least one side of the binding area along the second direction is smaller than the width of the sub-binding area located at the middle of the binding area, and the second direction intersects the first direction.

[0016] In one embodiment of the present application, in any two sub-binding areas, when the total number of the signal lines of the at least two sub-binding areas is the same, the width of the sub-binding area provided with the large number of heat dissipation devices is larger than the width of the sub-binding area provided with the small number of heat dissipation devices.

[0017] In one embodiment of the present application, the number of the signal lines connected by each driving chip is the same, when the bending radius of the sub-binding area is the same, in any two sub-binding areas, the number of the driving chips provided in the sub-binding area with large width is larger than the number of the driving chips provided in the sub-binding area with small width.

[0018] In one embodiment of the present application, in any two sub-binding areas, the distance between the two adjacent driving chips of the sub-binding area with large bending radius is smaller than the distance between the two adjacent driving chips of the sub-binding area with small bending radius.

[0019] In one embodiment of the present application, the binding area includes a plurality of sub-binding areas, and a partition groove is arranged between each two adjacent sub-binding areas.

[0020] In one embodiment of the present application, the binding area is located at the opposite sides of the display panel along the second direction, the two binding areas are bent to the non-display side of the display panel along the direction of approaching each other, and the first flexible circuit board is connected with the first binding part of the two binding areas respectively.

[0021] According to another aspect of the present application, a display device is provided, which includes the display module provided according to another aspect of the present application.

[0022] The display module of the present application comprises a display panel, and the non-display area of the display panel is provided with a binding area, the binding area comprises at least two sub-binding areas, and a partition groove is arranged between the adjacent two sub-binding areas to separate the adjacent two sub-binding areas. Compared with the binding mode of the integrated binding area bending, the sum of the widths of each sub-binding area is generally smaller, and the smaller sum of the widths makes the bending stress smaller, so that the bending radius of each sub-binding area can be bent smaller, thereby making the frame of the display module smaller, and with the same bending radius, the bending yield rate of the sub-binding area with smaller bending stress is higher.

[0023] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the present application. BRIEF DESCRIPTION OF DRAWINGS

[0024] The drawings incorporated into the specification and constituting a part of the specification show embodiments consistent with the present application and, together with the specification, serve to explain the principles of the present application. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained from these drawings without creative labor for those skilled in the art.

[0025] Fig. 1 is a cross-sectional schematic view of a display module related to an embodiment of the present application, in which one end of a chip on film is bound with a binding area of a display panel and is bent to a side of a support layer away from the display panel, and the other end is bound with a first flexible circuit board.

[0026] Fig. 2 is a planar schematic view of a display module related to an embodiment of the present application, in which one end of a chip on film is bound with a binding area of a display panel and is bent to a side of a support layer away from the display panel, and the other end is bound with a first flexible circuit board.

[0027] Fig. 3 is a cross-sectional schematic view of a display module related to an embodiment of the present application, in which a binding area of a display panel is directly bent to a side of a support layer away from the display panel, and two ends of a first flexible circuit board are bound with the binding area of the display panel and a first control circuit board, respectively.

[0028] Fig. 4 is a planar schematic view of a display module related to an embodiment of the present application, in which a binding area of a display panel is directly bent to a side of a support layer away from the display panel, and two ends of a first flexible circuit board are bound with the binding area of the display panel and a first control circuit board, respectively.

[0029] Fig. 5 is a schematic view of the distribution of a binding part and a connecting part on a display module related to an embodiment of the present application.

[0030] Figure 6 is a plan view of the display module according to an embodiment of the present application, when the binding portions and the connecting portions located on the same straight line in the first direction are connected by the main flexible circuit board.

[0031] Figure 7 is a plan view of the display module according to an embodiment of the present application, when the internal signal lines and the peripheral signal lines are connected with the driving chips.

[0032] Figure 8 is a perspective view of the display module according to an embodiment of the present application, when the two adjacent sub-binding areas are separated by the separation groove.

[0033] Figure 9 is a plan view of the back of the display module according to an embodiment of the present application, when the two adjacent sub-binding areas are separated by the separation groove.

[0034] Figure 10 is a plan view of the display module according to an embodiment of the present application, when the width of the first sub-binding area is equal to the width of the second sub-binding area, and the distribution density of the signal lines in the first sub-binding area is equal to the distribution density of the signal lines in the second sub-binding area.

[0035] Figure 11 is a plan view of the display module according to an embodiment of the present application, when the width of the first sub-binding area is equal to the width of the second sub-binding area, and the number of the signal lines connected with each driving chip is increased.

[0036] Figure 12 is a plan view of the display module according to an embodiment of the present application, when the width of the first sub-binding area is equal to the width of the second sub-binding area, and the distance between the two adjacent driving chips in the first sub-binding area is less than the distance between the two adjacent driving chips in the second sub-binding area.

[0037] Figure 13 is a plan view of the display module according to an embodiment of the present application, when the width of the first sub-binding area is greater than the width of the second sub-binding area, and the distribution density of the signal lines in the first sub-binding area is equal to the distribution density of the signal lines in the second sub-binding area.

[0038] Figure 14 is a plan view of the display module according to an embodiment of the present application, when the width of the first sub-binding area is greater than the width of the second sub-binding area, and the distance between the two adjacent driving chips in the first sub-binding area is less than the distance between the two adjacent driving chips in the second sub-binding area.

[0039] Figure 15 is a plan view of the display module according to an embodiment of the present application, when the width of the first sub-binding area is greater than the width of the second sub-binding area, and the distance between the two adjacent driving chips in the first sub-binding area is greater than the distance between the two adjacent driving chips in the second sub-binding area.

[0040] Fig. 16 is a plan view of the display module according to the embodiment of the present application, in which the internal signal lines extend from the display area to the driving chip connection of the first sub-bonding area, and the peripheral signal lines extend from the display area to the driving chip connection of the second sub-bonding area.

[0041] Fig. 17 is a sectional view of the display module according to the embodiment of the present application, in which the bending radius is a.

[0042] Fig. 18 is a sectional view of the display module according to the embodiment of the present application, in which the bending radius is b.

[0043] Fig. 19 is a sectional view of the display module according to the embodiment of the present application, in which the bending radius is c.

[0044] Fig. 20 is a plan view of the display module according to the embodiment of the present application, in which the bonding area includes a plurality of sub-bonding areas, and a partition groove is arranged between each two adjacent sub-bonding areas.

[0045] Fig. 21 is a sectional view of the display module according to the embodiment of the present application, in which the bonding area is arranged on the opposite sides of the display panel along the second direction.

[0046] In the figures: 1 - support layer, 2 - first double-sided adhesive layer, 3 - back film, 31 - first back film, 32 - second back film, 4 - display panel, 41 - display area, 42 - bonding area, 421 - sub-bonding area, 4211 - first sub-bonding area, 4212 - second sub-bonding area, 4213 - first bonding part, 422 - partition groove, 43 - wiring area, 44 - signal line, 441 - internal signal line, 442 - peripheral signal line, 5 - polarizer, 6 - first optically transparent adhesive layer, 7 - touch layer, 8 - second optically transparent adhesive layer, 9 - cover layer, 10 - protective film layer, 11 - first control circuit board, 111 - connection part, 12 - second double-sided adhesive layer, 13 - first flexible circuit board, 14 - driving chip, 15 - chip on film, 16 - third double-sided adhesive layer, 17 - connection line, 18 - second flexible circuit board. DETAILED DESCRIPTION

[0047] Example embodiments now will be described more fully hereinafter with reference to the accompanying drawings. Example embodiments, however, can be implemented in many different forms and should not be construed as limited to the implementations set forth herein; rather, these implementations are provided as example embodiments so that this disclosure will be thorough and complete, and will fully convey the scope thereof to those skilled in the art. Like reference numerals refer to like elements throughout the figures, and thus description of the same will be simplified or omitted. In addition, the drawings are only schematic and are non-limiting.

[0048] Although relative terms are used in this description, such as "upper," "lower," to describe one component's relationship to another component, these terms are used herein for convenience only and are not intended to be limiting. It is to be understood that if a device is turned over so that its upper surface becomes its lower surface, then the described upper component will become the described lower component. When a structure is "on" another structure, it can mean that the structure is formed integrally with the other structure or that the structure is "directly" on the other structure or that the structure is "indirectly" on the other structure via another structure.

[0049] The terms "one," "a," "an," "the," and "said" are used to mean that "at least one" or "one or more" of something is present with the understanding that plural entities are also included unless it is contextually clear otherwise. The term "includes" and "including" should be interpreted as "including but not limited to." The terms "first," "second," and "third" are used merely as labels, and are not intended to impose numerical requirements on their objects.

[0050] As shown in FIG. 1, the display module includes a support layer 1, a first double-sided adhesive layer 2, a back film 3, a display panel 4, a polarizer 5, a first optically transparent adhesive layer 6, and a cover layer 9. The first double-sided adhesive layer 2 is disposed on one side of the support layer 1. The back film 3 is disposed on the side of the first double-sided adhesive layer 2 away from the support layer 1. The display panel 4 is disposed on the side of the back film 3 away from the support layer 1. The polarizer 5 is disposed on the side of the display panel 4 away from the support layer 1. The first optically transparent adhesive layer 6 is disposed on the side of the polarizer 5 away from the support layer 1. The cover layer 9 is disposed on the side of the first optically transparent adhesive layer 6 away from the support layer 1. The display panel 4 has a display area 41, and the periphery of the display area 41 is a non-display area 41. In order to prevent the display module from having a light leakage phenomenon, an ink layer 91 is disposed on the side of the cover layer 9 close to the second optically transparent adhesive layer 8. The ink layer 91 is located in the non-display area, and the orthographic projection of the ink layer 91 on the display panel 4 covers the binding area 42 of the display panel 4, as shown in FIG. 1.

[0051] The display module further includes a first control circuit board 11, a first flexible circuit board 13, and a driving chip 14. The first control circuit board 11 is disposed on the non-display side of the display panel 4. One end of a chip on film 15 is bound to the binding area 42 of the display panel 4 and is bent to the side of the support layer 1 away from the display panel 4. The other end of the chip on film 15 is bound to the first flexible circuit board 13. The driving chip 14 is bound to the side of the chip on film 15 away from the display panel 4. One end of the first flexible circuit board 13 is bound to the chip on film 15, and the other end of the first flexible circuit board 13 is bound to the first control circuit board 11. However, due to the large bending radius of the chip on film 15, the lower frame of the display module is large, as shown in FIG. 2.

[0052] Therefore, a flexible OLED display panel 4 is considered. As shown in FIG. 3, the binding area 42 of the display panel 4 is directly bent to the side of the support layer 1 away from the display panel 4, the binding area 42 is bonded to the support layer 1 by double-sided tape, a first flexible circuit board 13 is arranged on the non-display side of the display panel 4, and the two ends of the first flexible circuit board 13 are respectively bound to the binding area 42 of the display panel 4 and the first control circuit board 11. This binding mode makes the lower frame of the display module smaller, as shown in FIG. 4. The width L2 of the lower frame in FIG. 4 is smaller than the width L1 of the lower frame in FIG. 2, so the new binding mode reduces the lower frame of the display panel 4.

[0053] As shown in FIGS. 5 and 6, the non-display area 41 includes a wiring area 43 and a binding area 42, the binding area 42 is usually located at the lower frame of the display panel 4, and the wiring area 43 is the area of the non-display area 41 except the binding area 42. The binding area 42 is provided with a plurality of first binding parts 4213, the first control circuit board 11 is provided with a plurality of connection parts 111, the centers of the plurality of connection parts 111 can be respectively arranged on the same straight line as the centers of different first binding parts 4213 in the first direction, and the connection part 111 and the first binding part 4213 arranged on the same straight line are connected together by a first flexible circuit board 13.

[0054] The centers of the connection parts 111 can be arranged on different straight lines as the centers of the first binding parts 4213 in the first direction, for example, the part of the driving chip 14 and the part of the first binding part 4213 are arranged on the same straight line. The first flexible circuit board 13 can be connected to the connection part 111 and the first binding part 4213 arranged on different straight lines, for example, in the order from left to right, the first first binding part 4213 is connected to the second connection part 111, the length of the first flexible circuit board 13 is increased, and the binding stress of the first flexible circuit board 13 can be relieved without increasing the frame of the display module.

[0055] The binding area 42 is provided with a plurality of driving chips 14, the driving chips 14 are located between the display area 41 and the first binding part 4213, and the centers of different driving chips 14 can be respectively arranged on the same straight line as the centers of different first binding parts 4213 in the first direction, so that the distance between the driving chip 14 and the first binding part 4213 in the first direction is the shortest. The display area 41 is provided with a connection line 17, the connection line 17 connects different driving chips 14 and the corresponding first binding part 4213 of the driving chip 14, and the opening or closing of the sub-pixels of different regions of the display panel 4 can be controlled by the driving chip 14. Of course, the centers of the driving chips 14 can also be arranged on different straight lines as the centers of the first binding parts 4213 in the first direction, for example, the part of the driving chip 14 and the part of the first binding part 4213 are arranged on the same straight line.

[0056] The first binding pin of the first binding part 4213 and the driving chip 14 can be connected together through different connection wires, and the first control circuit board 11 can be provided with a second binding pin, one end of the first flexible circuit board 13 is bound with the first binding pin, and the other end is bound with the second binding pin of the first control circuit board 11.

[0057] As shown in FIG. 7, each driving chip 14 is connected with multiple signal lines 44, which can include internal signal lines 441 extending from the display area 41 to the binding area 42, and peripheral signal lines 4422 extending from the wire area 43 to the binding area 42. Therefore, the first control circuit board 11 can receive feedback signals of the display panel 4 of the driving chip 14, and also can send driving signals to the display panel 4 of the driving chip 14, so as to control the display of the display panel 4.

[0058] However, with the popularization of large-size OLED display modules, especially the increasing demand for horizontal display mode, the width of the binding area 42 becomes larger and larger, which increases the bending stress of the display panel 4 and the bending radius of the display panel 4, thereby causing the frame of the display module to become larger and the binding yield of the binding process to decrease.

[0059] Based on this, the embodiment of the present application provides a display module. As shown in FIG. 3 and FIG. 9 to FIG. 20, the display module includes a display panel 4, a first control circuit board 11 and at least two first flexible circuit boards 13, the display panel 4 is provided with a binding area 42, the binding area 42 is bent to the non-display side of the display panel 4, the binding area 42 includes at least two sub-binding areas 421, a partition groove 422 is arranged between adjacent two sub-binding areas 421, and each sub-binding area 421 is provided with at least one first binding part 4213; the first control circuit board 11 is provided with at least two connection parts 111; and the first flexible circuit board 13 is connected with the connection part 111 and the first binding part 4213 respectively.

[0060] The display panel 4 is provided with a binding area 42, the binding area 42 includes at least two sub-binding areas 421, a partition groove 422 is arranged between adjacent two sub-binding areas 421, and the adjacent two sub-binding areas 421 are separated by the partition groove 422. Compared with the binding mode of the integrated binding area 42 bending, the sum of the widths of each sub-binding area 421 is usually smaller, and the smaller sum of the widths makes the bending stress smaller, and for the sub-binding area 421 with smaller width, the adsorption and bending precision of the binding equipment is higher, so the bending radius of each sub-binding area 421 can be bent smaller, thereby making the frame of the display module smaller, and for the same bending radius, the bending yield of the sub-binding area 421 with smaller bending stress is higher.

[0061] The display module related to the present application is described in detail below in combination with specific embodiments.

[0062] Referring to FIGS. 3 and 8, the display module can include a support layer 1, a first double-sided adhesive layer 2, a back film 3, a display panel 4, and a polarizer 5. The first double-sided adhesive layer 2 is arranged on one side of the support layer 1. The back film 3 is arranged on the side of the first double-sided adhesive layer 2 away from the support layer 1. The display panel 4 is arranged on the side of the back film 3 away from the support layer 1. The polarizer 5 is arranged on the side of the display panel 4 away from the support layer 1.

[0063] The display module can further include a touch layer 7. The touch layer 7 is arranged on the side of the polarizer 5 away from the support layer 1. A first optically transparent adhesive layer 6 is arranged between the touch layer 7 and the polarizer 5. The touch layer 7 and the polarizer 5 are bonded together through the first optically transparent adhesive layer 6. A second optically transparent adhesive layer 8 is arranged on the side of the touch layer 7 away from the support layer 1. A cover layer 9 is arranged on the side of the second optically transparent adhesive layer 8 away from the support layer 1. The cover layer 9 and the touch layer 7 are bonded together through the second optically transparent adhesive layer 8. A protective film layer is arranged on the side of the cover layer 9 away from the support layer 1.

[0064] The display module can further include a first control circuit board 11 and a first flexible circuit board 13. The first control circuit board 11 is bonded to the non-display side of the display panel 4 through a double-sided adhesive. The binding area 42 of the display panel 4 is bent to the side of the support layer 1 away from the display panel 4 and is bonded to the back of the support layer 1 through a third double-sided adhesive layer 16. One end of the first flexible circuit board 13 is bound to the display panel 4, and the other end is bound to the first control circuit board 11. The display module further includes a driving chip 14. The driving chip 14 is arranged on the side of the binding area 42 of the display panel 4 away from the support layer 1. The display module can further include a second flexible circuit board 13. One end of the second flexible circuit board 13 can be bound to the touch layer 7, and the other end can be bound to the first control circuit board 11.

[0065] As shown in FIG. 9, the display panel 4 is provided with a binding area 42. The binding area 42 includes at least two sub-binding areas 421. A partition groove 422 is arranged between adjacent two sub-binding areas 421 to separate the two sub-binding areas 421. Each sub-binding area 421 is bent to the non-display side of the display panel 4. Each sub-binding area 421 is provided with at least one first binding part 4213. The first control circuit board 11 is provided with at least two connecting parts 111. The multiple connecting parts 111 are respectively arranged on the same straight line with different first binding parts 4213 along a first direction. The connecting parts 111 and the first binding parts 4213 located on the same straight line are connected together through a first flexible circuit board 13.

[0066] As shown in FIGS. 10 to 16, the binding area 42 can include two sub-binding areas 421, defining the two sub-binding areas 421 as a first sub-binding area 4211 and a second sub-binding area 4212, respectively. The width of the integrated binding area 42 is defined as W, the binding yield is defined as Y, the width of the first sub-binding area 4211 is defined as W1, the width of the second sub-binding area 4212 is defined as W2, the binding yield of the first sub-binding area 4211 and the second sub-binding area 4212 is defined as Y0, W1+W2≤W, and Y0≥Y.

[0067] FIGS. 17 to 19 are cross-sectional schematic diagrams of display modules under different bending stresses. The bending stress of FIG. 17 is the largest, the bending radius is a, the bending stress of FIG. 18 is the second largest, the bending radius is b, and the bending stress of FIG. 19 is the smallest, the bending radius is c, a≥b≥c. The bending stress of the integrated binding area 42 is the largest, the bending radius R is a as shown in FIG. 17, the bending radius R1 of the first sub-binding area 4211 is b as shown in FIG. 18 or c as shown in FIG. 19, and the bending radius R2 of the second sub-binding area 4212 is b as shown in FIG. 18 or c as shown in FIG. 19. Therefore, R1≤R, and R2≤R.

[0068] As shown in FIGS. 10 and 11, the width of the first sub-binding area 4211 is equal to the width of the second sub-binding area 4212, three driving chips 14 are arranged in the first sub-binding area 4211 and the second sub-binding area 4212, respectively, each driving chip 14 in the first sub-binding area 4211 is connected to a plurality of signal lines 44, and each driving chip 14 in the second sub-binding area 4212 is connected to a plurality of signal lines 44.

[0069] As shown in FIG. 10, the total number of signal lines 44 in the first sub-binding area 4211 is n1, the total number of signal lines 44 in the second sub-binding area 4212 is n2, and n1=n2. It can be understood that the distribution density of the signal lines 44 in the first sub-binding area 4211 is the same as the distribution density of the signal lines 44 in the second sub-binding area 4212. Therefore, R1 can be set as b as shown in FIG. 18, and R2 is also b as shown in FIG. 18; or R1 can be set as c as shown in FIG. 19, and R2 is also c as shown in FIG. 19, i.e., R1=R2.

[0070] The distance between two adjacent driving chips 14 in the first binding area 42 is a first distance d1, and the distance between two adjacent driving chips 14 in the second binding area 42 is a second distance d2. Because the number of signal lines 44 is usually matched with the number of binding pins of the driving chip 14, when n1=n2, d1=d2 can be set under the condition that the number of binding pins of each driving chip 14 is unchanged.

[0071] The total number n1 of signal lines 44 of the first sub-bonding area 4211 is greater than the total number n2 of signal lines 44 of the second sub-bonding area 4212, that is, n1>n2. In the case where the width of the first sub-bonding area 4211 is the same as the width of the second sub-bonding area 4212, the increase in the total number of signal lines 44 also causes the distribution density of the signal lines 44 to increase, thereby causing the bending stress of the first sub-bonding area 4211 to be greater than the bending stress of the second sub-bonding area 4212. In order to avoid the signal lines 44 being broken in the process of bending the bonding area 42 to the non-display side of the display panel 4, R1 can be set to b as shown in FIG. 18, and R2 can be set to c as shown in FIG. 19, so that R1>R2, so as to better relieve the bending stress.

[0072] As shown in FIG. 11, after the total number n1 of signal lines 44 of the first sub-bonding area 4211 is increased, the number of signal lines 44 connected by each driving chip 14 can be increased, so that the connection requirement of the signal lines 44 is met without increasing the number of driving chips 14. As shown in FIG. 12, when n1>n2, the number of driving chips 14 can also be increased. When the width of the first sub-bonding area 4211 is equal to the width of the second sub-bonding area 4212, the setting density of the driving chips 14 of the first sub-bonding area 4211 is greater than the setting density of the driving chips 14 of the second sub-bonding area 4212, that is, the first distance d1 between the adjacent two driving chips 14 of the first sub-bonding area 4211 is less than the second distance d2 between the adjacent two driving chips 14 of the second sub-bonding area 4212.

[0073] As shown in FIG. 13, according to different bonding requirements, W1 can be set to be greater than W2. When W1>W2, n1>n2 is usually true. The distance between the two signal lines 44 closest to the adjacent two first bonding parts 4213 is set to be the same as the distance between the two signal lines 44 closest to the adjacent two second bonding parts, so that the distribution density of the signal lines 44 of the first sub-bonding area 4211 is the same as the distribution density of the signal lines 44 of the second sub-bonding area 4212, and the bending stress of the first sub-bonding area 4211 is equal to the bending stress of the second sub-bonding area 4212. At this time, R1 can be set to b as shown in FIG. 18, and R2 can also be set to b as shown in FIG. 19, that is, R1=R2.

[0074] Since the distribution density of the signal lines 44 of the first sub-bonding area 4211 is the same as the distribution density of the signal lines 44 of the second sub-bonding area 4212, and the number of signal lines 44 connected by each driving chip 14 is the same, the first distance d1 between the adjacent two driving chips 14 of the first sub-bonding area 4211 is equal to the second distance d2 between the adjacent two driving chips 14 of the second sub-bonding area 4212, and n1>n2, so the number of driving chips 14 of the first sub-bonding area 4211 needs to be greater than the number of driving chips 14 of the second sub-bonding area 4212.

[0075] As shown in FIG. 14, when n1>n2, the distance between the two signal lines 44 closest to the two adjacent first binding portions 4213 can be set to be smaller than the distance between the two signal lines 44 closest to the two adjacent second binding portions, the first distance d1 between the two adjacent driving chips 14 in the first sub-binding area 4211 can be set to be smaller than the second distance d2 between the two adjacent driving chips 14 in the second sub-binding area 4212, so that the distribution density of the signal lines 44 in the first sub-binding area 4211 is greater than the distribution density of the signal lines 44 in the second sub-binding area 4212, and the bending stress of the first sub-binding area 4211 is greater than the bending stress of the second sub-binding area 4212. At this time, R1 can be set to be b as shown in FIG. 18, and R2 can be set to be c as shown in FIG. 19, i.e., R1>R2.

[0076] The distance between the two signal lines 44 closest to the two adjacent first binding portions 4213 can also be set to be greater than the distance between the two signal lines 44 closest to the two adjacent second binding portions, the first distance d1 between the two adjacent driving chips 14 in the first sub-binding area 4211 can be set to be greater than the second distance d2 between the two adjacent driving chips 14 in the second sub-binding area 4212, so that the distribution density of the signal lines 44 in the first sub-binding area 4211 is smaller than the distribution density of the signal lines 44 in the second sub-binding area 4212, and the bending stress of the first sub-binding area 4211 is smaller than the bending stress of the second sub-binding area 4212. At this time, R1 can be set to be c as shown in FIG. 19, and R2 can be set to be b as shown in FIG. 18, i.e., R1

[0077] Generally, the driving chip 14 and the first flexible circuit board 13 are both provided with heat dissipation devices, and the distribution of the heat dissipation devices is different according to the design of the driving circuit. When n1=n2, but the number of heat dissipation devices in the first sub-binding area 4211 is greater than the number of heat dissipation devices in the second sub-binding area 4212, the width of the first sub-binding area 4211 can be set to be greater than the width of the second sub-binding area 4212, and the distance between the two adjacent driving chips 14 in the first sub-binding area 4211 can be set to be greater than the distance between the two adjacent driving chips 14 in the first sub-binding area 4211, so as to better dissipate heat in the first sub-binding area 4211. As shown in FIG. 15. The bending radius of the first sub-binding area 4211 and the bending radius of the second sub-binding area 4212 can be the same. In other realizable embodiments, the bending radius of the first sub-binding area 4211 and the bending radius of the second sub-binding area 4212 can also be different.

[0078] The display panel 4 has a display area 41, and a periphery of the display area 41 is a non-display area 41, the non-display area 41 includes a wiring area 43 and a binding area 42, the binding area 42 is usually located at the lower frame of the display panel 4, the wiring area 43 is other areas of the non-display area 41 except the binding area 42, the signal line 44 can include internal signal lines 441 and peripheral signal lines 4422, the internal signal lines 441 and the peripheral signal lines 4422 extend from the display area 41 to different sub-binding areas 421. The number of internal signal lines 441 is usually more than the number of peripheral signal lines 4422, when the density of signal lines 44 of different sub-binding areas 421 is the same, the width of the sub-binding area 421 connected with the internal signal line 441 is greater than the width of the sub-binding area 421 connected with the peripheral signal line 442. The width of the sub-binding area 421 located at least one side of the binding area 42 along the second direction is less than the width of the sub-binding area 421 located in the middle of the binding area 42, and the second direction intersects the first direction.

[0079] As shown in FIG. 16, taking the first sub-binding area 4211 and the second sub-binding area 4212 as examples for illustration. The width of the first sub-binding area 4211 is set to be greater than the width of the second sub-binding area 4212, the second sub-binding area 4212 is located outside the first sub-binding area 4211 along the second direction, the internal signal line 441 extends from the display area 41 to the driving chip 14 connected with the first sub-binding area 4211, and the peripheral signal line 442 extends from the wiring area 43 to the driving chip 14 connected with the second sub-binding area 4212. By setting the width of the first sub-binding area 4211 to be different from the width of the second sub-binding area 4212, it can be ensured that the density of the signal line 44 of the first sub-binding area 4211 is the same as the density of the signal line 44 of the second sub-binding area 4212, and further ensure that the bending radius R1 of the first sub-binding area 4211 is the same as the bending radius R2 of the second sub-binding area 4212.

[0080] It should be noted that the above-mentioned binding area 42 includes the first sub-binding area 4211 and the second sub-binding area 4212, which is only illustrative and does not form a specific limitation. The binding area 42 can also include a third sub-binding area 421, a fourth sub-binding area 421, or even a fifth sub-binding area 421. As shown in FIG. 20, the binding area 42 can include a plurality of sub-binding areas 421, and a partition groove 422 is arranged between each two adjacent sub-binding areas 421. For example, the number of binding areas 42 provided with the peripheral signal line 4422 can be two, and the number of binding areas 42 provided with the internal signal line 441 can be one. Two binding areas 42 provided with the peripheral signal line 4422 are arranged on both sides of one binding area 42 provided with the internal signal line 441.

[0081] As shown in FIG. 21, the binding areas 42 are located on opposite sides of the display panel 4 along the second direction, and the two binding areas 42 are bent to the non-display side of the display panel 4 along the direction of approaching each other, and the first flexible circuit board 13 is connected with the first binding part 421 of the two binding areas 42 respectively. Each binding area 42 includes a plurality of sub-binding areas 421 arranged along the second direction, and a partition groove 422 is arranged between the adjacent two sub-binding areas 421 of each binding area 42.

[0082] It should be noted that the first direction is the x direction in FIGS. 2, 4-8, and 10, and the second direction is the y direction in FIGS. 2, 4-8, and 10.

[0083] The display device can include the display module of any one of the embodiments of the present application. The specific structure and beneficial effects of the display device can also refer to the display module, and therefore, will not be repeated here.

[0084] It should be noted that the display device includes other necessary components and compositions in addition to the display module, such as a shell, a circuit board, a power cord, etc. Those skilled in the art can supplement accordingly according to the specific use requirements of the display device, and will not be repeated here.

[0085] When the display panel 4 is of the structure mentioned above, the display device can be a conventional electronic device, such as a mobile phone, a computer, a television, and a video recorder, or a new wearable device, such as a virtual reality device and an augmented reality device, which will not be listed one by one.

[0086] Other embodiments of the present application will be apparent to those skilled in the art from consideration of the specification and practice of the application disclosed herein. This application is intended to cover any variations, uses or adaptations of the application following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice in the art to which the application pertains. The specification and examples are to be regarded as exemplary only, and the true scope and spirit of the application are indicated by the appended claims.

Claims

1. A display module, wherein, include: The display panel has a binding area that is bent to the non-display side of the display panel. The binding area includes at least two sub-binding areas. A partition groove is provided between two adjacent sub-binding areas. Each sub-binding area has at least one first binding part. The first control circuit board has at least two connection parts; At least two first flexible circuit boards are connected to the connecting portion and the first binding portion, respectively.

2. The display module according to claim 1, wherein, The sub-binding area is provided with a driver chip, which is disposed along a first direction between the display area of ​​the display panel and the first binding part. The display area of ​​the display panel is provided with signal lines, which are respectively connected to different driver chips.

3. The display module according to claim 2, wherein, The signal lines in the multiple sub-binding areas have the same density, and the bending radii of any two sub-binding areas are the same.

4. The display module according to claim 2, wherein, In any two sub-binding regions, the bending radius of the sub-binding region with the higher signal line density is greater than that of the sub-binding region with the lower signal line density.

5. The display module according to claim 3 or 4, wherein, Multiple sub-binding areas have the same width.

6. The display module according to claim 3 or 4, wherein, At least two of the sub-binding regions have different widths, and the sub-binding region with a larger width has a greater total number of signal lines than the sub-binding region with a smaller width.

7. The display module according to claim 6, wherein, The signal lines include internal signal lines and external signal lines. In any two sub-binding areas, the internal signal lines extend from the display area to the wider sub-binding area, and the external signal lines extend from the wiring area outside the display area to the narrower sub-binding area.

8. The display module according to claim 7, wherein, The width of the sub-binding area located on at least one side of the binding area along the second direction is smaller than the width of the sub-binding area located in the middle of the binding area, and the second direction intersects with the first direction.

9. The display module according to claim 6, wherein, In any two sub-binding areas, when the total number of signal lines in at least two sub-binding areas is the same, the width of the sub-binding area with more heat dissipation devices is greater than the width of the sub-binding area with more heat dissipation devices.

10. The display module according to claim 3, wherein, The number of signal lines connected to each driver chip is the same. When the bending radius of the sub-binding areas is the same, in any two sub-binding areas, the sub-binding area with a larger width has more driver chips than the sub-binding area with a smaller width.

11. The display module according to claim 4, wherein, In any two sub-binding regions, the distance between two adjacent driver chips in the sub-binding region with a larger bending radius is less than the distance between two adjacent driver chips in the sub-binding region with a smaller bending radius.

12. The display module according to claim 1, wherein, The binding area includes multiple sub-binding areas, and a partition groove is provided between every two adjacent sub-binding areas.

13. The display module according to claim 1, wherein, The bonding areas are located on opposite sides of the display panel along the second direction, and the two bonding areas are bent towards the non-display side of the display panel in a direction that brings them closer to each other. The first flexible circuit board is connected to the first bonding portion of the two bonding areas respectively.

14. A display device, wherein, Includes the display module as described in any one of claims 1 to 13.

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