Deposition assembly and manufacturing method therefor

Abstract

At least one embodiment of the present disclosure provides a deposition assembly and a manufacturing method therefor. The deposition assembly comprises: a metal frame; a plurality of support masks mounted on the metal frame, wherein a gap extending in a first direction is formed between two adjacent support masks; and first metal strips extending in the first direction to be mounted on the metal frame, wherein the first metal strips are configured to block the gaps. The deposition assembly can meet the coating requirements of large-sized substrates, realize mass production, improve the production efficiency, and meet the yield and accuracy requirements of light-emitting diode display devices in the mass production process.

Description

E-vaporization assembly and preparation method thereof

[0001] The present application claims priority to Chinese Patent Application No. 202410809030.0, filed on June 21, 2024, the disclosure of which is incorporated herein in its entirety as part of the present application. TECHNICAL FIELD

[0002] Embodiments of the present disclosure relate to an e-vaporization assembly and a preparation method thereof. BACKGROUND

[0003] An organic light-emitting diode (OLED) display device is also known as an organic electroluminescent display device or an organic light-emitting semiconductor display device. OLED has many characteristics such as low driving voltage, active light-emitting, wide viewing angle, high efficiency, fast response speed, easy realization of full-color large-area wall-mounted display and flexible display, and has become a hot spot for researchers in the display field to study.

[0004] An OLED display device usually includes various film layers, such as an anode, a cathode, and a light-emitting layer. When preparing an OLED display device, each film layer in the OLED display device needs to be evaporated onto a glass substrate to be evaporated by an evaporation process. For the evaporation of some of the film layers, a fine metal mask (FMM) is used, that is, the evaporation material is evaporated to the designed position through the through holes on the FMM to form the designed film layer pattern. For example, the fine metal mask technology directly affects the quality and manufacturing cost of the OLED product. Generally, the mask plate has at least one mask pattern, and in order to mass-produce, the mask patterns on the mask plate are usually multiple and distributed in a matrix. When performing film plating processing by using the mask plate, the same number of thin film patterns can be formed on the glass substrate by using these mask patterns, and then the glass substrate can be cut according to the number of thin film patterns to form multiple light-emitting diode display devices. SUMMARY

[0005] At least one embodiment of the present disclosure provides an e-vaporization assembly and a preparation method thereof. The e-vaporization assembly includes a metal frame, a plurality of support mask plates arranged on the metal frame, and a first metal strip arranged on the metal frame in a first direction and configured to shield a gap between two adjacent support mask plates. The e-vaporization assembly provided by the embodiments of the present disclosure can not only meet the film plating requirements of large-size substrates, realize mass production, and improve production efficiency, but also meet the yield and precision requirements of light-emitting diode display devices during mass production, and the service life of the finally formed light-emitting diode display devices is longer.

[0006] The at least one embodiment of the present disclosure provides an evaporation assembly, comprising: a metal frame; a plurality of support masks arranged on the metal frame, wherein two adjacent support masks have a gap extending in a first direction; and a first metal strip extending in the first direction and arranged on the metal frame, wherein the first metal strip is configured to shield the gap.

[0007] For example, the evaporation assembly provided by at least one embodiment of the present disclosure further comprises a plurality of precision metal masks arranged on the plurality of support masks, wherein edges of the precision metal masks are zigzagged.

[0008] For example, in the evaporation assembly provided by at least one embodiment of the present disclosure, a direction perpendicular to the first direction is a second direction, and a width of the first metal strip in the second direction is greater than a width of the gap in the second direction.

[0009] For example, in the evaporation assembly provided by at least one embodiment of the present disclosure, the first metal strip and the two adjacent support masks are in contact, and a thickness of a portion of the support mask in contact with the first metal strip is less than a thickness of a portion of the support mask not in contact with the first metal strip.

[0010] For example, in the evaporation assembly provided by at least one embodiment of the present disclosure, a position of a portion of the support mask in contact with the first metal strip close to a surface of the metal frame is higher than a position of a portion of the support mask not in contact with the first metal strip close to the surface of the metal frame.

[0011] For example, in the evaporation assembly provided by at least one embodiment of the present disclosure, a position of a portion of the support mask in contact with the first metal strip away from the surface of the metal frame is lower than a position of a portion of the support mask not in contact with the first metal strip away from the surface of the metal frame.

[0012] For example, in the evaporation assembly provided by at least one embodiment of the present disclosure, the number of the support masks is at least three, the gap comprises a first gap and a second gap, and a width of the first gap in the second direction is different from a width of the second gap in the second direction.

[0013] For example, the evaporation assembly provided by at least one embodiment of the present disclosure further comprises a second metal strip, wherein the second metal strip extends in the second direction and is arranged on the metal frame.

[0014] For example, in the evaporation assembly provided by at least one embodiment of the present disclosure, a thickness of the first metal strip is greater than a thickness of the gap.

[0015] The disclosure at least one embodiment further provides a preparation method of an evaporation assembly, the preparation method comprising: providing a metal frame; forming a first metal strip and a plurality of support mask plates on the metal frame, wherein two adjacent support mask plates have a gap extending in a first direction, the first metal strip extends in the first direction to be arranged on the metal frame, and the first metal strip shields the gap.

[0016] For example, the preparation method provided by the disclosure at least one embodiment further comprises forming a plurality of precision metal mask plates on the plurality of support mask plates, wherein the edges of the precision metal mask plates are zigzag.

[0017] For example, the preparation method provided by the disclosure at least one embodiment further comprises forming a second metal strip, wherein the second metal strip extends in a second direction perpendicular to the first direction to be arranged on the metal frame.

[0018] For example, in the preparation method provided by the disclosure at least one embodiment, the first metal strip and the second metal strip are both formed on the metal frame by welding.

[0019] The disclosure at least one embodiment further provides an evaporation assembly, comprising: a metal frame; a plurality of support mask plates arranged on the metal frame, wherein two adjacent support mask plates are connected by clamping.

[0020] For example, in the evaporation assembly provided by the disclosure at least one embodiment, the plurality of support mask plates comprises a first support mask plate and a second support mask plate arranged adjacently, and a first part of the first support mask plate and a second part of the second support mask plate are clamped and connected, the position of the first part close to the surface of the metal frame is higher than the position of the part of the first support mask plate not in contact with the second support mask plate close to the surface of the metal frame; the position of the second part away from the surface of the metal frame is lower than the position of the part of the second support mask plate not in contact with the first support mask plate away from the surface of the metal frame. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the disclosure, the drawings of the embodiments will be briefly introduced below. Obviously, the drawings in the following description only relate to some embodiments of the disclosure, and are not a limitation on the disclosure.

[0022] FIG. 1 is a schematic diagram of the planar structure of a small and medium-sized evaporation assembly;

[0023] FIG. 2 is a schematic diagram of the planar structure of an evaporation assembly provided by the disclosure at least one embodiment;

[0024] Fig. 3 is a schematic diagram of a planar structure of a plurality of support mask plates according to at least one embodiment of the present disclosure;

[0025] Fig. 4 is a schematic diagram of a planar structure of a first metal strip disposed on a metal frame according to at least one embodiment of the present disclosure;

[0026] Fig. 5 is a schematic diagram of a planar structure of a precision metal mask plate according to at least one embodiment of the present disclosure;

[0027] Fig. 6 is a schematic diagram of a partial cross-sectional structure of a first metal strip and two support mask plates adjacent to the first metal strip according to at least one embodiment of the present disclosure;

[0028] Fig. 7 is a schematic diagram of a partial cross-sectional structure of a first metal strip and two support mask plates adjacent to the first metal strip according to at least one embodiment of the present disclosure;

[0029] Fig. 8 is a schematic diagram of a partial cross-sectional structure of a first metal strip and two support mask plates adjacent to the first metal strip according to at least one embodiment of the present disclosure;

[0030] Fig. 9 is a schematic diagram of a planar structure of a first metal strip and a second metal strip disposed on a metal frame according to at least one embodiment of the present disclosure;

[0031] Fig. 10 is a flowchart of a method for manufacturing a vapor deposition assembly according to at least one embodiment of the present disclosure;

[0032] Fig. 11 is a schematic diagram of another planar structure of a vapor deposition assembly according to at least one embodiment of the present disclosure;

[0033] Fig. 12 is a schematic diagram of a connection structure of two support mask plates adjacent to each other in the vapor deposition assembly shown in Fig. 11; and

[0034] Fig. 13 is a schematic diagram of another connection structure of two support mask plates adjacent to each other in the vapor deposition assembly shown in Fig. 11. DETAILED DESCRIPTION

[0035] In order to make the objects, technical solutions, and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be described clearly and completely below with reference to the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are some but not all of the embodiments of the present disclosure. Based on the described embodiments of the present disclosure, all other embodiments obtained by a person of ordinary skill in the art without creative effort belong to the scope of the present disclosure.

[0036] Unless otherwise defined, technical terms or scientific terms used in the present disclosure shall have the meanings as commonly understood by one of ordinary skill in the art to which the present disclosure belongs. The terms "first", "second", and similar terms are used to distinguish one element from another, and are not necessarily used to describe a sequential or chronological order. The terms "comprises", "comprising", or any other variation thereof are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus. The terms "connected", "coupled", or any other variation thereof are intended to cover a physical or mechanical connection, an electrical connection, whether direct or indirect, or any other possible connections between two or more elements. The terms "upper", "lower", "left", "right", and the like are used only to denote relative positions for ease of description, and can change accordingly when the absolute positions of the described objects are changed.

[0037] Unless otherwise defined, the terms "parallel", "perpendicular", and "same" used in the embodiments of the present application include the strict "parallel", "perpendicular", and "same" cases, as well as the "approximately parallel", "approximately perpendicular", and "approximately same" cases with certain errors. For example, the "approximately" mentioned above can mean that the difference between the compared objects is within 10% or 5% of the average value of the compared objects. In the following description of the embodiments of the present application, when the number of a component or element is not specifically indicated, it means that the component or element can be one or more, or can be understood as at least one. "At least one" means one or more, and "multiple" means at least two. In the embodiments of the present application, "same layer" refers to the relationship between multiple film layers formed by the same material after the same step (for example, one patterning process). Here, "same layer" does not always mean that the thicknesses of the multiple film layers are the same or the heights of the multiple film layers in the cross-sectional view are the same.

[0038] At present, the production of small and medium-sized light-emitting diode display devices requires the use of a whole evaporation assembly, which includes a combination structure of a metal frame, a whole plate etching material, and a precision metal mask plate. For example, FIG. 1 is a schematic diagram of the planar structure of a small and medium-sized evaporation assembly. As shown in FIG. 1, the evaporation assembly 01 includes a metal frame 03, a whole plate etching material 02 formed on the metal frame 03, and a precision metal mask plate 04 formed on the whole plate etching material 02. The evaporation assembly 01 can be used to evaporate and form various film layers of a small and medium-sized organic light-emitting diode display device. However, when the whole evaporation assembly for small and medium-sized shown in FIG. 1 is applied to a large-sized evaporation assembly, due to the limitation of the width of the whole plate etching material, it is impossible to produce a large-sized light-emitting diode display device.

[0039] Generally, the larger the size of the mask plate, the more display devices can be produced in batch after a complete set of process steps is completed when the mask plate is used to coat a large-size glass substrate. However, the larger the size of the mask plate, the more difficult it is to achieve the precision of the display devices formed, thereby resulting in the precision and resolution of the display devices produced not meeting the expected requirements, and thus resulting in a high rate of defective products. Conversely, in order to ensure the precision of the display devices formed, the size of the evaporation assembly used to form each film layer of the display device has to be reduced, thereby resulting in a decrease in the production efficiency of the corresponding display devices.

[0040] The inventors of the present disclosure have found that a large-size evaporation assembly can be made by combining a plurality of evaporation assemblies based on a small or medium-size whole plate etching material. However, gaps can occur between adjacent evaporation assemblies during the combining process, thereby resulting in poor quality of the film layers evaporated. Therefore, a metal strip can be arranged in the gap between adjacent evaporation assemblies to fill the gap, thereby ensuring the quality of each film layer in the light-emitting diode display device formed.

[0041] At least one embodiment of the present disclosure provides an evaporation assembly, which comprises: a metal frame; a plurality of support mask plates arranged on the metal frame, and a gap extending in a first direction between adjacent two support mask plates; and a first metal strip extending in the first direction to be arranged on the metal frame, and the first metal strip is configured to shield the gap. The gap between adjacent two support mask plates is shielded by the first metal strip, thereby forming a large-size evaporation assembly, and thus the production efficiency can be improved while ensuring the precision of the display devices produced.

[0042] For example, FIG. 2 is a plan view of an evaporation assembly according to at least one embodiment of the present disclosure, and FIG. 3 is a plan view of a plurality of support mask plates according to at least one embodiment of the present disclosure. As shown in FIGS. 2 and 3, the evaporation assembly 100 comprises a metal frame 101, a plurality of support mask plates 102, and a first metal strip 103. The plurality of support mask plates 102 are arranged on the metal frame 101, and a gap 104 extending in a first direction X is formed between adjacent two support mask plates 102. The first metal strip 103 extends in the first direction X to be arranged on the metal frame 101, and the first metal strip 103 is configured to shield the gap 104. Thus, a complete large-size evaporation assembly can be formed, and the production efficiency of the display devices can be improved while ensuring the precision of the organic light-emitting diode display devices produced when the large-size evaporation assembly is used as a mask structure to form each film layer of the organic light-emitting diode display device.

[0043] For example, the direction perpendicular to the first direction X is the second direction Y, and the plurality of support mask plates 102 are arranged in sequence in the second direction Y, that is, the plurality of support mask plates 102 can form a planar splicing structure, so that there is a gap 104 extending in the first direction X between adjacent support mask plates 102. For example, in one example, the first direction X is a horizontal direction, and the second direction Y is a vertical direction, of course, embodiments of the present disclosure are not limited thereto, and the first direction X and the second direction Y can also be other directions.

[0044] For example, although only three support mask plates 102 and two gaps 104 extending in the first direction X are shown in FIG. 3, embodiments of the present disclosure are not limited thereto, and more support mask plates can be provided to form a larger size evaporation assembly.

[0045] For example, the support mask plate 102 can support the precision metal mask plate mentioned later. Since the precision metal mask plate will sag under its own gravity, especially for large-size precision metal mask plates, they are more prone to sagging due to their longer length. Supporting the precision metal mask plate with the support mask plate 102 can keep the precision metal mask plate horizontal, thereby improving its precision, and the first metal strip 103 can cover the gaps formed by splicing the support mask plates 102. Since there is a gap when splicing, the gas-phase luminescent material can be evaporated through the gap to the substrate during the film plating process, thereby causing product defects. Therefore, by covering each gap with the first metal strip 103, it can be ensured that the gas-phase luminescent material can only be evaporated to the substrate through the precision metal mask plate during the film plating process, thereby ensuring reliable and effective film plating during the formation of the light-emitting diode display device.

[0046] For example, FIG. 4 is a planar structure schematic diagram of setting a first metal strip on a metal frame according to at least one embodiment of the present disclosure. As shown in FIG. 4, the first metal strip 103 is formed on the metal frame 101 by welding, and the first metal strip 103 is long and extends in the first direction X. Although only two first metal strips 103 are shown in FIGS. 2 and 4, embodiments of the present disclosure are not limited thereto, and the number of first metal strips is limited according to the number of support mask plates.

[0047] For example, FIG. 5 is a planar structure schematic diagram of a precision metal mask plate according to at least one embodiment of the present disclosure. As shown in FIG. 5, the evaporation assembly 100 further includes a plurality of precision metal mask plates 105 disposed on the plurality of support mask plates 102. The edges of the precision metal mask plate 105 are sawtooth-shaped to facilitate placing the precision metal mask plate 105 on the support mask plate 102.

[0048] For example, in combination with FIGS. 2-4, the width of the first metal strip 103 in the second direction Y is greater than the width of the gap 104 in the second direction Y, so that the first metal strip 103 can sufficiently shield the gap 104 to improve the accuracy of the final light-emitting diode display device.

[0049] For example, FIG. 6 is a schematic diagram of a partial cross-sectional structure of a first metal strip and two support mask plates adjacent thereto, according to at least one embodiment of the present disclosure. In combination with FIGS. 2 and 6, the first metal strip 103 and the two support mask plates 102 adjacent thereto are in contact, and the thickness of the portion of the first metal strip 103 and the two support mask plates 102 adjacent thereto in contact is equal to the thickness of the portion of the first metal strip 103 and the two support mask plates 102 adjacent thereto not in contact.

[0050] For example, FIG. 7 is a schematic diagram of another partial cross-sectional structure of a first metal strip and two support mask plates adjacent thereto, according to at least one embodiment of the present disclosure. In combination with FIGS. 2 and 7, the first metal strip 103 and the two support mask plates 102 adjacent thereto are in contact, and the thickness of the portion of the support mask plates 102 in contact with the first metal strip 103 is less than the thickness of the portion of the support mask plates 102 not in contact with the first metal strip 103, and the position of the surface of the portion of the support mask plates 102 in contact with the first metal strip 103 near the metal frame 101 is higher than the position of the surface of the portion of the support mask plates 102 not in contact with the first metal strip 103 near the metal frame 101, so that the overall thickness of the portion of the support mask plates 102 in contact with the first metal strip 103 can be reduced, and thus the step between the portion of the support mask plates 102 in contact with the first metal strip 103 and the portion of the first metal strip 103 can be reduced.

[0051] For example, FIG. 8 is a schematic diagram of a partial cross-sectional structure of a first metal strip and two support mask plates adjacent to the first metal strip according to another embodiment of the present disclosure. In combination with FIGS. 2 and 8, the first metal strip 103 and the two support mask plates 102 adjacent to the first metal strip 103 are in contact, and the thickness of the portion of the support mask plate 102 in contact with the first metal strip 103 is less than the thickness of the portion of the support mask plate 102 not in contact with the first metal strip 103. The position of the portion of the support mask plate 102 in contact with the first metal strip 103 near the surface of the metal frame 101 is higher than the position of the portion of the support mask plate 102 not in contact with the first metal strip 103 near the surface of the metal frame 101. The position of the portion of the support mask plate 102 in contact with the first metal strip 103 away from the surface of the metal frame 101 is lower than the position of the portion of the support mask plate 102 not in contact with the first metal strip 103 away from the surface of the metal frame 101. In this way, the overall thickness of the portion of the support mask plate 102 in contact with the first metal strip 103 can be further reduced from the top side to offset the height of the first metal strip 103 that can protrude away from the metal frame 101, thereby further reducing the step difference between the portion of the support mask plate 102 in contact with the first metal strip 103 and the portion of the first metal strip 103, so that the surface of the entire evaporation assembly is more flat.

[0052] For example, the number of support mask plates 102 in the structure shown in FIG. 2 is three, but embodiments of the present disclosure are not limited thereto, and the number of support mask plates 102 can be more. In combination with FIGS. 2 and 3, the gap 104 includes a first gap 1041 and a second gap 1042, the width of the first gap 1041 in the second direction Y is different from the width of the second gap 1042 in the second direction Y, and the width of the first gap 1041 in the second direction Y is greater than the width of the second gap 1042 in the second direction Y. In this way, the size of the final evaporation assembly can be flexibly adjusted.

[0053] For example, when preparing a large-size organic light-emitting diode display device, a large-size substrate needs to be used. The larger the size of the substrate, the higher the production efficiency of the light-emitting diode display device. When a large-size substrate is used, a corresponding large-size support mask plate needs to be used. The larger the size of the support mask plate, the greater the probability of deformation due to environmental factors such as gravity and temperature. Therefore, the support mask plate, especially the large-size support mask plate corresponding to the large-size substrate, deforms due to its own gravity, which leads to poor yield and low production efficiency of the final light-emitting diode display device. The present inventors have noticed that a second metal strip extending in the second direction can be arranged on the metal frame to support the support mask plate in the second direction, thereby avoiding the problem of poor yield and low production efficiency caused by the deformation of the support mask plate due to its own gravity.

[0054] For example, the evaporation assembly further comprises a second metal strip extending in the second direction to be arranged on the metal frame, so as to support the mask plate in the second direction, thereby avoiding the problem of yield reduction and production efficiency reduction caused by deformation of the mask plate due to its own gravity. FIG. 9 is a schematic diagram of a planar structure of arranging the first metal strip and the second metal strip on the metal frame according to at least one embodiment of the present disclosure. As shown in FIG. 9, the first metal strip 103 and the second metal strip 106 are formed on the metal frame 101 by welding. The first metal strip 103 is in a long strip shape and extends in the first direction X. The second metal strip 106 is in a long strip shape and extends in the second direction Y. Although only two first metal strips 103 and two second metal strips 106 are shown in FIG. 9, the number of the first metal strips and the second metal strips is not limited to this, and is limited according to the number of the mask plates.

[0055] For example, in the structure shown in FIG. 2, the thickness of the first metal strip 103 is greater than the thickness of the gap 104, so that the rigidity of the mask plate can be ensured to be substantially the same at the position with the gap 104 and at the position without the gap, so as to realize stable support of the precision metal mask plate subsequently.

[0056] At least one embodiment of the present disclosure further provides a preparation method of an evaporation assembly. The preparation method comprises: providing a metal frame; forming a first metal strip and a plurality of mask plates on the metal frame. Adjacent two mask plates have a gap extending in a first direction. The first metal strip extends in the first direction to be arranged on the metal frame, and the first metal strip shields the gap. The first metal strip shielding the gap between the adjacent two mask plates can form a large-size evaporation assembly, so as to improve the production efficiency while ensuring the precision of the prepared display device.

[0057] For example, FIG. 10 is a flowchart of a preparation method of an evaporation assembly according to at least one embodiment of the present disclosure. As shown in FIG. 10, the preparation method comprises:

[0058] S101: providing a metal frame;

[0059] For example, the material of the metal frame can refer to the conventional metal material used for the evaporation assembly, and the embodiments of the present disclosure are not limited thereto.

[0060] S102: forming a first metal strip and a plurality of mask plates on the metal frame. Adjacent two mask plates have a gap extending in a first direction. The first metal strip extends in the first direction to be arranged on the metal frame, and the first metal strip shields the gap.

[0061] For example, the first metal strip and the structure of the plurality of support mask plates formed on the metal frame can refer to the related description of FIG. 2, which will not be repeated here.

[0062] For example, in one example, the preparation method of the evaporation assembly further includes forming a plurality of precision metal mask plates on the plurality of support mask plates, the edges of the precision metal mask plates are serrated, which can facilitate the placement of the precision metal mask plates on the support mask plates, thereby improving production efficiency and the yield of the final formed light emitting diode display device.

[0063] For example, in one example, the preparation method of the evaporation assembly further includes forming a second metal strip, the second metal strip extends in a second direction perpendicular to the first direction to be arranged on the metal frame, thereby supporting the support mask plate in the second direction, thereby avoiding the problem of yield deterioration and production efficiency reduction caused by the deformation of the support mask plate due to its own gravity.

[0064] For example, in the embodiments of the present disclosure, the first metal strip and the second metal strip are both formed on the metal frame by welding, thereby reducing the production cost as much as possible on the basis of ensuring that the first metal strip and the second metal strip are stably formed on the metal frame, but the embodiments of the present disclosure are not limited thereto, and other ways can also be used to stably form the first metal strip and the second metal strip on the metal frame.

[0065] Another embodiment of the present disclosure also provides an evaporation assembly, for example, FIG. 11 is a planar structure schematic diagram of another evaporation assembly provided by at least one embodiment of the present disclosure, and FIG. 12 is a connection structure schematic diagram of two adjacent support mask plates in the evaporation assembly shown in FIG. 11. In combination with FIGS. 11 and 12, the evaporation assembly 200 includes: a metal frame 201; a plurality of support mask plates 202 arranged on the metal frame 201, and the two adjacent support mask plates 202 are connected by clamping. The evaporation assembly of this structure can keep the state flat at the position where the two adjacent support mask plates are connected under the condition of avoiding the appearance of gaps, so as to improve the quality and production efficiency of the final formed light emitting diode display device.

[0066] For example, as shown in FIG. 11, the plurality of support mask plates 202 include a first support mask plate 2021 and a second support mask plate 2022 arranged adjacently. In combination with FIG. 11 and FIG. 12, the first portion 2021a of the first support mask plate 2021 and the second portion 2022a of the second support mask plate 2022 are connected in a snap-fit manner. The position of the first portion 2021a of the first support mask plate 2021 close to the surface of the metal frame 201 is higher than the position of the portion of the first support mask plate 2021 not in contact with the second support mask plate 2022 close to the surface of the metal frame 201. The position of the second portion 2022a of the second support mask plate 2022 away from the surface of the metal frame 201 is lower than the position of the portion of the second support mask plate 2022 not in contact with the first support mask plate 2021 away from the surface of the metal frame 201. In this way, the surface of the whole of the first portion 2021a of the first support mask plate 2021 and the second portion 2022a of the second support mask plate 2022 away from the metal frame after the snap-fit is flat.

[0067] FIG. 13 is another connection structure diagram of the connection of two adjacent support mask plates in the evaporation assembly shown in FIG. 11. In combination with FIG. 11 and FIG. 13, the first portion 2021a of the first support mask plate 2021 and the second portion 2022a of the second support mask plate 2022 are connected in a snap-fit manner. The position of the first portion 2021a of the first support mask plate 2021 close to the surface of the metal frame 201 is higher than the position of the portion of the first support mask plate 2021 not in contact with the second support mask plate 2022 close to the surface of the metal frame 201, and the position of the first portion 2021a of the first support mask plate 2021 away from the surface of the metal frame 201 is lower than the position of the portion of the first support mask plate 2021 not in contact with the second support mask plate 2022 close to the surface of the metal frame 201. The position of the second portion 2022a of the second support mask plate 2022 away from the surface of the metal frame 201 is lower than the position of the portion of the second support mask plate 2022 not in contact with the first support mask plate 2021 away from the surface of the metal frame 201, and the position of the second portion 2022a of the second support mask plate 2022 close to the surface of the metal frame 201 is flush with the position of the portion of the second support mask plate 2022 not in contact with the first support mask plate 2021 close to the surface of the metal frame 201. In this way, the surface of the whole of the first portion 2021a of the first support mask plate 2021 and the second portion 2022a of the second support mask plate 2022 close to the metal frame after the snap-fit is flat.

[0068] The evaporation assembly and the preparation method thereof provided by at least one embodiment of the present disclosure have at least the following beneficial technical effects: the evaporation assembly can meet the film coating requirements of large-size substrates, realize mass production, improve production efficiency, meet the yield and precision requirements of light-emitting diode display devices in the process of mass production, and prolong the service life of the finally formed light-emitting diode display devices.

[0069] The following points need to be explained:

[0070] (1) The drawings of the embodiments of the present disclosure only relate to the structures involved in the embodiments of the present disclosure, and other structures can be referred to the general design.

[0071] (2) In the drawings used to describe the embodiments of the present disclosure, the thickness of a layer or region is exaggerated or reduced for clarity, that is, the drawings are not drawn according to the actual proportion.

[0072] (3) In the case of no conflict, the embodiments of the present disclosure and the features in the embodiments can be combined with each other to obtain new embodiments.

[0073] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto, and the protection scope of the present disclosure should be subject to the protection scope of the claims.

Claims

1. A vapor deposition assembly, comprising: Metal frame; Multiple support mask plates are mounted on the metal frame, wherein there is a gap extending in a first direction between two adjacent support mask plates; A first metal strip extends in the first direction to be mounted on the metal frame, and the first metal strip is configured to cover the gap.

2. The vapor deposition assembly according to claim 1 further includes a plurality of precision metal masks disposed on the plurality of supporting mask templates, wherein, The edges of the precision metal mask are serrated.

3. The vapor deposition assembly according to claim 1 or 2, wherein, The direction perpendicular to the first direction is the second direction, and the width of the first metal strip in the second direction is greater than the width of the gap in the second direction.

4. The vapor deposition assembly according to claim 3, wherein, The first metal strip and the two adjacent supporting mask plates are in contact, and the thickness of the portion of the supporting mask plate in contact with the first metal strip is less than the thickness of the portion not in contact with the first metal strip.

5. The vapor deposition assembly according to claim 4, wherein, The position of the portion of the supporting mask that contacts the first metal strip near the surface of the metal frame is higher than the position of the portion of the supporting mask that does not contact the first metal strip near the surface of the metal frame.

6. The vapor deposition assembly according to claim 5, wherein, The position of the portion of the supporting mask that contacts the first metal strip on the surface away from the metal frame is lower than the position of the portion of the supporting mask that does not contact the first metal strip on the surface away from the metal frame.

7. The vapor deposition assembly according to any one of claims 3-6, wherein, The number of supporting mask plates is at least three, and the gap includes a first gap and a second gap, wherein the width of the first gap in the second direction and the width of the second gap in the second direction are different.

8. The vapor deposition assembly according to any one of claims 3-6, further comprising a second metal strip, wherein, The second metal strip extends in the second direction to be mounted on the metal frame.

9. The vapor deposition assembly according to any one of claims 1-8, wherein, The thickness of the first metal strip is greater than the thickness of the gap.

10. A method for preparing a vapor deposition component, comprising: Metal frame provided; A first metal strip and multiple supporting mask plates are formed on the metal frame. There is a gap extending in a first direction between two adjacent support mask plates, the first metal strip extends in the first direction to be mounted on the metal frame, and the first metal strip covers the gap.

11. The preparation method according to claim 10 further comprises forming a plurality of precision metal mask plates on the plurality of supporting mask templates, wherein, The edges of the precision metal mask are serrated.

12. The preparation method according to claim 10 or 11 further comprises forming a second metal strip, wherein, The second metal strip extends in a second direction perpendicular to the first direction to be mounted on the metal frame.

13. The preparation method according to claim 12, wherein, Both the first metal strip and the second metal strip are formed on the metal frame by welding.

14. A vapor deposition assembly, comprising: Metal frame; Multiple support mask plates are mounted on the metal frame, wherein two adjacent support mask plates are connected by a snap-fit ​​mechanism.

15. The vapor deposition assembly according to claim 14, wherein, The plurality of support masks include a first support mask and a second support mask arranged adjacent to each other, and a first portion of the first support mask and a second portion of the second support mask are engaged and connected. The position of the first portion near the surface of the metal frame is higher than the position of the portion of the first support mask that is not in contact with the second support mask near the surface of the metal frame; the position of the second portion away from the surface of the metal frame is lower than the position of the portion of the second support mask that is not in contact with the first support mask away from the surface of the metal frame.

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