Manufacturing method for three-dimensional molded article

Abstract

The purpose of the present disclosure is to manufacture a three-dimensional molded article in which it is possible to wire wiring targets even when a plurality of wiring targets are located facing each other. A manufacturing method (S1) for a three-dimensional molded article according to the present disclosure comprises: a first molding step (S11) for molding a three-dimensional structure that has a hole having a shape corresponding to the three-dimensional molded article; an immersion step (S12) for immersing, in an electrolytic solution, the three-dimensional structure, a first electrode, and a second electrode having a different polarity from the first electrode; and a second molding step (S13) for molding the three-dimensional molded article from one end to the other end of the hole through electroplating.

Description

Method for manufacturing three-dimensional objects

[0001] The present invention relates to a method for manufacturing a three-dimensional object.

[0002] A technique called wire bonding and a device called a wire bonder are known for wiring metal patterns formed on the main surface of a substrate, such as a printed circuit board, or for wiring a pattern formed on such a main surface with another substrate or electronic component mounted on the main surface.

[0003] Such wiring techniques are widely known, and Patent Document 1 describes a method for manufacturing thin metal wires that can be used for such wiring, Patent Document 2 describes a technique for supplying metal wiring on the main surface of a printed circuit board, and Patent Document 3 describes a wire bonder.

[0004] Japanese Unexamined Patent Publication No. 05-185190 Japanese Unexamined Patent Publication No. 2004-134686 Unexamined Japanese Patent Application No. 09-027508

[0005] However, in such wiring technology, it is assumed that multiple wiring objects (here, metal patterns, substrates, electronic components, etc.) are located on a single plane, although slight differences in height are allowed.

[0006] Therefore, such wiring techniques cannot be used when multiple wiring objects are (1) located on planes that are parallel and facing each other, or (2) located on multiple planes that intersect with each other.

[0007] One aspect of the present invention has been made in consideration of the above-mentioned problems, and aims to provide a technology that enables wiring of multiple wiring objects even when the wiring objects are (1) located on planes that are parallel to and facing each other, or (2) located on multiple planes that intersect with each other.

[0008] In order to solve the above-mentioned problems, a manufacturing method of a three-dimensional object according to a first embodiment of the present invention includes: a first fabrication step of fabricating a three-dimensional structure having voids that are open at both ends and have a shape corresponding to the three-dimensional object; an immersion step of immersing the three-dimensional structure, a first electrode that is arranged to close one end of the void and open the other end, and a second electrode that has a polarity opposite to that of the first electrode, in an electrolyte solution containing an ionized material; and a second fabrication step of fabricating the three-dimensional object extending from one end of the void to the other end by applying a voltage between the first electrode and the second electrode to deposit the material in the void from the first electrode side.

[0009] According to one aspect of the present invention, multiple wiring objects can be wired together even when they are (1) located on planes that are parallel to and facing each other, or (2) located on multiple planes that intersect with each other.

[0010] 1 is a flowchart of a method for manufacturing a three-dimensional object according to an embodiment of the present invention. (a) to (d) are side views showing a state after or during the execution of steps included in the method for manufacturing a three-dimensional object shown in FIG. 1. (a) to (d) are perspective views of a spatial light modulation module manufactured using the application example of the method for manufacturing a three-dimensional object shown in FIG. 1. (b) to (d) are perspective views showing a state after the execution of steps included in a first application example of the method for manufacturing a three-dimensional object shown in FIG. 1. (c) to (d) are perspective views showing a state after the execution of steps included in a second application example of the method for manufacturing a three-dimensional object shown in FIG.

[0011] (Flow of Manufacturing Method) A manufacturing method S1 according to one embodiment of the present invention will be described with reference to Figures 1 and 2. Figure 1 is a flow diagram showing the flow of manufacturing method S1. Figures 2(a) to 2(d) are side views showing the state after or during the steps included in manufacturing method S1 are performed.

[0012] The manufacturing method S1 is a method for manufacturing a three-dimensional object. As shown in FIG. 1, the manufacturing method S1 includes a first manufacturing step S11, an immersion step S12, and a second manufacturing step S13.

[0013] The first modeling step S11 is a step of modeling a three-dimensional structure 10. The three-dimensional structure 10 modeled in the first modeling step S11 has holes 10a that are open at both ends and have a shape corresponding to the three-dimensionally modeled object 10b to be manufactured. The three-dimensional structure 10 may have a single hole 10a or may have a plurality of holes 10a.

[0014] FIG. 2A illustrates an example of the state after the first modeling process S11 has been performed. FIG. 2A shows a three-dimensional structure 10 having two holes 10a. In this embodiment, the three-dimensional structure 10 modeled by the first modeling process S11 is a rectangular parallelepiped block made of resin. The holes 10a are open at both ends and are through-holes that penetrate from one end to the other. In this embodiment, one end of the holes 10a is provided on one main surface of the rectangular parallelepiped three-dimensional structure 10 (the main surface located on the left side in FIG. 2A). The other end of the holes 10a is provided on the other main surface of the three-dimensional structure 10 (the main surface located on the right side in FIG. 2A). In this embodiment, the one main surface and the other main surface of the three-dimensional structure 10 form a pair of main surfaces that face each other.

[0015] The positions of the one end and the other end of the hole 10 a are not limited. For example, if one end of the hole 10 a is located on the left main surface (as shown in FIG. 2A ), the other end may be (1) located on the right main surface as in this embodiment, (2) located on one of the side surfaces (surfaces intersecting with the pair of main surfaces) that are surfaces other than the pair of main surfaces, or (3) located on the same left main surface as the one end.

[0016] The immersion step S12 is a step of immersing the three-dimensional structure 10, the first electrode 11, and the second electrode 12 formed in the first modeling step S11 in an electrolyte solution 13. In the immersion step S12, the first electrode 11 is arranged so as to close one end of the hole 10a and leave the other end open. In this embodiment, one end and the other end of the hole 10a are located on different surfaces of the three-dimensional structure 10, and therefore the plate-shaped first electrode 11 cannot close both ends at the same time. In addition, the second electrode 12 has a polarity different from that of the first electrode 11. In this embodiment, the first electrode 11 is a cathode, and the second electrode 12 is an anode. The electrolyte solution 13 contains ionized material of the three-dimensional structure 10b. In this embodiment, the material dissolved in the electrolyte solution 13 is iron (Fe) and nickel (Ni). Therefore, the electrolyte solution 13 contains iron ions (Fe ２＋ ) and nickel ions (Ni ２＋ ) is included.

[0017] The state after the immersion step S12 is illustrated in Fig. 2(b), in which the three-dimensional structure 10, the first electrode 11, and the second electrode 12 are immersed in the electrolyte solution 13 stored in the water tank 14.

[0018] The first electrode 11 covers and contacts the surface of the three-dimensional structure 10 where one end of the void 10a is formed. The second electrode 12 is arranged to face the surface of the three-dimensional structure 10 where one end of the void 10a is formed. In other words, the second electrode 12 is arranged to face the first electrode 11 across the three-dimensional structure 10. The three-dimensional structure 10 and the second electrode 12 are spaced apart. As a result, ionized material contained in the electrolyte solution 13 is guided into the void 10a in accordance with the potential difference between the first electrode 11 and the second electrode 12. However, in one embodiment of the present invention, the second electrode 12 is required to be at least partially immersed in the electrolyte solution 13, and the position of the second electrode 12 within the electrolyte solution 13 is not limited. However, it is preferable that the direction of the path from the other end of the void 10a to one end and the direction of the electric field lines generated between the second electrode 12 and the first electrode 11 are as nearly parallel as possible.

[0019] The second modeling process S13 is a process for modeling a three-dimensionally formed object 10b extending from one end of the hole 10a to the other end within the hole 10a of the three-dimensional structure 10. In the second modeling process S13, a current is passed between the first electrode 11 and the second electrode 12, thereby depositing the material of the three-dimensionally formed object 10b within the hole 10a of the three-dimensional structure 10 from the first electrode 11 side. That is, in the second modeling process S13, plating made of the material (a mixture of multiple materials in this embodiment, specifically permalloy) is formed within the hole 10a using the principle of electroplating.

[0020] Fig. 2(c) illustrates the state during the second modeling step S13, and Fig. 2(d) illustrates the state after the second modeling step S13 has been performed. Fig. 2(c) shows the state in which the material of the three-dimensionally molded object 10b has accumulated from the opening of the hole 10a on the first electrode 11 side to about the middle of the hole 10a. Fig. 2(d) also shows the state in which the material of the three-dimensionally molded object 10b has accumulated from the opening of the hole 10a on the first electrode 11 side to the opening of the hole 10a on the second electrode 12 side.

[0021] As described above, by carrying out manufacturing method S1, a three-dimensional structure 10 is obtained in which holes 10a with both ends open are formed, and which includes a three-dimensional object 10b formed by filling a predetermined material into the holes 10a, which serve as a mold.

[0022] In the first modeling step S11 of the manufacturing method S1, the resin constituting the three-dimensional structure 10 preferably has low electrical conductivity, and is more preferably an insulator. If the resin is conductive, a reduction reaction of the ionized material occurs in the representation of the three-dimensional structure 10, resulting in plating in unintended locations.

[0023] Furthermore, in the first modeling step S11, methods for forming the three-dimensional structure 10 having the voids 10a include casting using a mold, extrusion molding, and stereolithography, a form of 3D printing. Many stereolithography methods are classified as additive manufacturing (AM) because they involve irradiating the resin with modeling light to cause a polymerization reaction and harden the resin. However, some stereolithography methods, such as the Implosion Fabrication method (ImpFab method), can also be used as subtractive manufacturing (SM) depending on how they are used. Thus, the method for forming the three-dimensional structure 10 having the voids 10a may be either AM or SM. The ImpFab method is described in U.S. Patent Application Publication No. 2017 / 0081489 and Daniel Oran et al., Science 362, 1281-1285 (2018) 14 December 2018, among others.

[0024] In the ImpFab method, holes can be formed at the focal point within a hydrogel by exposing the hydrogel to light while it is swollen and contains a large amount of water. By using a multiphoton absorption method (e.g., two-photon absorption method) during this exposure, the resolution during hole patterning can be improved not only in the in-plane direction but also in the depth direction. Here, the depth direction is the direction parallel to the propagation direction of the laser light used for exposure, and the in-plane direction is the direction parallel to a plane perpendicular to the propagation direction of the laser light. By using the multiphoton absorption method, holes can be formed to a desired depth within the hydrogel. By repeatedly exposing the hydrogel while changing the focal point, a three-dimensional structure 10 having voids 10a, as shown in FIG. 2A, can be fabricated.

[0025] Furthermore, in the ImpFab method, after patterning the three-dimensional structure 10 in a swollen state containing a large amount of water, the three-dimensional structure 10 can be shrunk by dehydrating the three-dimensional structure 10. If the shrinkage rate of the hydrogel due to dehydration is, for example, 1 / 10, by dehydrating and shrinking the three-dimensional structure 10 after patterning, a resolution 10 times higher than the resolution at the time of patterning can theoretically be obtained.

[0026] As described above, the ImpFab method is suitable for fabricating objects requiring high resolution among stereolithography methods. Therefore, when the holes 10a are micro-sized holes with a diameter of less than 10 μm, it is preferable to use stereolithography in the first fabrication step S11, and it is more preferable to use the ImpFab method.

[0027] Furthermore, by adding methanol to the electrolytic solution 13, it is possible to suppress the generation of hydrogen that accompanies the electroplating in the second modeling step S13, and it is easy to increase the filling rate of the pores in the mold.

[0028] Furthermore, the pattern of the current applied during electroplating is not limited. For example, examples of the current pattern include application of a constant current, application of an alternating current, application of a multi-step current, application of a pulse current, etc. In this way, the generation of hydrogen associated with electroplating can be suppressed by devising the current application pattern.

[0029] Conversely, hydrogen can be intentionally generated near the cathode by passing a large current through the electrode during electroplating. The hydrogen generated near the cathode turns into bubbles in the electrolytic solution 13, allowing for the intentional creation of numerous small voids within the deposited three-dimensional object 10b. The technique of utilizing hydrogen generated near the cathode as bubbles is known as strike plating. Such a dense, porous (electrical or magnetic) conductor is useful because it can prevent eddy currents from occurring within the conductor when used in combination with a high-frequency signal source.

[0030] For the same purpose, composite plating technology can also be used, in which another material is dispersed in place of the voids. Examples of dispersed materials include carbides such as silicon carbide, chromium carbide, tungsten carbide, and boron carbide, oxides such as silicon dioxide, alumina, zirconia, tungsten oxide, and titanium dioxide, and fluorides such as fluororesin, boron fluoride, and graphite fluoride.

[0031] (Specific Example 1 of Three-Dimensional Shaped Object) According to the manufacturing method S1, a magnetic material is used as the material for the three-dimensional shaped object 10b, so that a magnetic conduit can be manufactured within the three-dimensional structure 10.

[0032] In this case, examples of the magnetic material include a ferromagnetic material, a ferrimagnetic material, a diamagnetic material, and a composite material thereof. When using the three-dimensionally shaped object 10b as a magnetic conductor, a certain degree of saturation magnetization is required to improve the magnetic flux transmission characteristics. Therefore, the magnetic material constituting the three-dimensionally shaped object 10b preferably has a saturation magnetization of 1 kA / m or more, more preferably 10 kA / m or more, and most preferably 100 kA / m or more.

[0033] Furthermore, depending on the application, if the direction of the magnetic flux transmitted by the conductor needs to be changed frequently, a material with low coercive force known as a soft magnetic material is preferable. Examples of such soft magnetic materials include materials containing at least nickel, iron, and cobalt. Specific examples include iron, silicon-iron, permalloy, Fe-Si-Al, permendur, electromagnetic stainless steel, amorphous magnetic materials, and nanocrystalline magnetic materials.

[0034] On the other hand, if you want to transmit a constant magnetic flux without much change in the magnetic flux, you can use a hard magnetic material with high coercivity. Specific examples of such hard magnetic materials include alnico magnets, ferrite magnets, samarium-cobalt magnets, neodymium magnets, and neodymium-iron-boron magnets.

[0035] (Specific Example 2 of Three-Dimensional Structure) According to the manufacturing method S1, an electrical conductor can be manufactured within the three-dimensional structure 10 by using a conductive material as the material for the three-dimensional structure 10b.

[0036] In this case, a conductive material is a material whose electrical resistance R can be measured (e.g., R≦100 MΩ) using a measuring instrument such as a tester (digital multimeter). Examples of such materials include metal materials such as gold, silver, copper, zinc, chromium, and nickel, as well as composites (alloys) of these materials. Another example of a conductive material is a carbon material such as graphite, carbon nanotubes, and graphene.

[0037] (Specific Example 3 of Three-Dimensional Structure) According to the manufacturing method S1, by using a light-transmitting material as the material of the three-dimensional structure 10b, an optical conductor can be manufactured within the three-dimensional structure 10.

[0038] In this case, a translucent material is a material with a certain level of transmittance in the visible light or near-infrared light region. While the transmittance varies depending on the application, a material with a transmittance of 1% or more, preferably 10% or more, and most preferably 50% or more at a film thickness of 100 nm is preferred. Examples of such materials include oxide materials such as silicon oxide, titanium oxide, and chromium oxide, and chalcogenides, which are compounds containing at least one chalcogen element and at least one metal element, such as sulfur, selenium, and tellurium. Because chalcogenides have a relatively high refractive index, the three-dimensional structure 10 can be used as an optical waveguide by using the three-dimensional structure 10b as the core and the resin constituting the three-dimensional structure 10 as the cladding. In this case, the refractive index of the chalcogenide constituting the three-dimensional structure 10b only needs to be greater than the refractive index of the resin constituting the three-dimensional structure 10.

[0039] (Application Examples of Manufacturing Method) A first application example and a second application example of manufacturing method S1 shown in Fig. 1 will be described with reference to Figs. 3 to 5. Fig. 3 is a perspective view of a spatial light modulation module 100 manufactured using the application example of manufacturing method S1. Fig. 4 is a side view showing the state after carrying out the steps included in the first application example of manufacturing method S1. Fig. 5 is a side view showing the state after carrying out the steps included in the second application example of manufacturing method S1.

[0040] As shown in FIG. 3, the spatial light modulation module 100 includes a three-dimensional structure 10 , an electrode substrate 20 , and a spatial light modulator 30 .

[0041] The three-dimensional structure 10 of this application example corresponds to the three-dimensional structure 10 shown in FIG. 1 . However, in the three-dimensional structure 10 shown in FIG. 1 , two three-dimensional objects 10b are formed inside the three-dimensional structure 10. On the other hand, in the three-dimensional structure 10 of this application example, sixteen three-dimensional objects 10b are formed inside the three-dimensional structure 10. In this application example, the material constituting the three-dimensional objects 10b is permalloy. That is, in this application example, the three-dimensional objects 10b function as magnetic conductors.

[0042] The electrode substrate 20 includes a substrate 21, an insulating layer 22, and a coil pattern 23. The substrate 21 is a metal plate-like member and functions as the first electrode 11 shown in FIG. 2. In this application example, aluminum is used as the material for the substrate 21, but the material is not limited to this. The top left diagram in FIG. 4 is a perspective view of the substrate 21.

[0043] The insulating layer 22 is an insulator layer laminated on one main surface of the substrate 21. In this application example, an insulating layer is laminated on one main surface of the substrate 21, and then circular openings are formed in a matrix of 4 rows and 4 columns. In this application example, photoresist is used as the material constituting the insulating layer 22, but this material is not limited thereto. The middle diagram in the upper row of Figure 4 is a perspective view of the substrate 21 including the insulating layer 22 after 16 openings have been formed therein.

[0044] The coil pattern 23 is an annular pattern arranged concentrically around a circular opening, and includes a partially open annular pattern, a band-shaped pattern that connects adjacent annular patterns in the same row, and electrode pads provided on both ends of each row. In this application example, the coil pattern 23 is laminated on an insulating layer 22 in which 16 openings are formed. The upper right diagram in Figure 4 is a perspective view of the substrate 21 and insulating layer 22 (i.e., the electrode substrate 20) after the coil pattern 23 has been formed.

[0045] The coil pattern 23 generates a magnetic field in the vertical direction (e.g., vertically upward) inside the partially open annular pattern by passing a current from one electrode pad (e.g., the electrode pad located on the right side in FIG. 4) to the other electrode pad (e.g., the electrode pad located on the left side in FIG. 4). The electrode pads provided at both ends of each row are connected to a switching circuit, which can control whether or not a magnetic field is generated (i.e., whether it is on or off) independently of the other rows.

[0046] In this application example, a configuration is adopted in which four annular patterns in the same row are turned on collectively by passing a current through them at the same time. However, the unit for controlling whether or not the annular patterns generate a magnetic field is not limited to this. For example, each electrode pad can be individually controlled using a switching element (e.g., a CMOS element or a TFT element) that can independently turn on and off each region arranged in a matrix.

[0047] A first application example of the manufacturing method S1 will be described below.

[0048] A rectangular parallelepiped resin block that will become the base of the three-dimensional structure 10 is placed on the electrode substrate 20 (see the bottom right diagram in FIG. 4).

[0049] The first fabrication step S11 shown in (a) of Figures 1 and 2 is carried out. In the first fabrication step S11 of this application example, 16 holes 10a are formed in the block, as shown in the lower middle diagram of Figure 4. When the ImpFab method is used to fabricate a plurality of holes 10a in a resin block, the step of placing the block on the electrode substrate 20, as shown in the lower right diagram, is omitted, and the block including a plurality of holes 10a fabricated by the ImpFab method is simply placed on the electrode substrate 20, as shown in the lower middle diagram.

[0050] By performing the immersion step S12 and the second modeling step S13 shown in FIGS. 1 and 2(b) to 2(d), a three-dimensional structure 10 placed on an electrode substrate 20 and having a plurality of three-dimensionally shaped objects 10b formed thereon can be obtained. In the second modeling step S13, the substrate 21 exposed from the insulating layer 22 functions as a first electrode. Furthermore, since the three-dimensionally shaped object 10b is formed by depositing material from the substrate 21 side, the material constituting the three-dimensionally shaped object 10b also deposits in the openings formed in the insulating layer 22. Therefore, one end of the three-dimensionally shaped object 10b (the lower end in FIG. 4) is reliably surrounded by the coil pattern 23. Therefore, the coil pattern 23 can reliably magnetize the three-dimensionally shaped object 10b.

[0051] Although not shown in Figure 4, the spatial light modulation module 100 is obtained by placing a spatial light modulator 30 on one of the pair of main surfaces of the three-dimensional structure 10, which is the main surface farthest from the electrode substrate 20 (the main surface located on the upper side in Figure 4).

[0052] 3, the spatial light modulator 30 includes a plurality of microcell groups 31 and a substrate 32. Although a detailed description of the spatial light modulator 30 will be omitted here, the configuration of the spatial light modulator 30 will be briefly described with reference to the spatial light phase modulator 13 shown in FIGS. 1 and 2 of International Publication WO2023 / 153286.

[0053] Each of the plurality of microcell groups 31 and substrates 32 included in the spatial light modulator 30 corresponds to the group of microcells C and substrate 131 included in the spatial light phase modulator 13. In addition, a metal film functioning as a mirror 14 shown in Figures 1 and 2(b) of International Publication WO2023 / 153286 is interposed between the main surface located on the upper side of the three-dimensional structure 10 and the microcell groups 31 of the spatial light modulator 30.

[0054] In the spatial light modulator 30 configured in this manner, unlike the spatial light phase modulator 13, which magnetizes each microcell by injecting a polarized spin current into the microcell, the three-dimensionally shaped object 10b formed inside the three-dimensional structure 10 is used as a magnetic conductor (or a magnetic yoke). With this configuration, when a current is passed through the coil pattern 23, the coil pattern 23 generates a magnetic field along the vertical direction, and the three-dimensionally shaped objects 10b are simultaneously magnetized by receiving this magnetic field. As a result, the three-dimensionally shaped object 10b, functioning as a magnetic conductor, can magnetize the microcells corresponding to the three-dimensionally shaped object 10b.

[0055] Next, a second application example of manufacturing method S1 will be described. The above-mentioned first application example is a manufacturing method in which the spatial light modulation module 100 is manufactured from the side of the electrode substrate 20. On the other hand, the second application example is a manufacturing method in which the spatial light modulation module 100 is manufactured from the side of the spatial light modulator 30.

[0056] In the upper left diagram of Figure 5, the spatial light modulator 30 is placed so that the substrate 32 is located on the lower side and the multiple microcell groups 31 are located on the upper side. Then, as shown in the upper left diagram of Figure 5, a metal film 33 is formed on one of a pair of bottom surfaces of the multiple microcell groups 31 that is farther from the substrate 32. The metal film 33 corresponds to the mirror 14 shown in Figures 1 and 2(b) of International Publication WO2023 / 153286. The metal film 33 also functions as a first electrode in a second application example of manufacturing method S1.

[0057] A rectangular parallelepiped resin block that will become the basis for the three-dimensional structure 10 is placed on the spatial light modulator 30 (see the middle diagram in the upper row of FIG. 5).

[0058] The first manufacturing process S11 shown in Figures 1 and 2A is carried out. As shown in the upper right diagram of Figure 5, in the second application example, 16 holes 10a are formed in the block, as in the first application example. In the second application example, multiple holes 10a may be manufactured in the block using the ImpFab method, as in the first application example.

[0059] 1 and 2(b) to 2(d), a three-dimensional structure 10 placed on the metal film 33 and having a plurality of three-dimensional objects 10b formed thereon can be obtained (see the bottom right diagram in FIG. 5). In the second modeling step S13, the metal film 33 functions as a first electrode.

[0060] As shown in the lower middle diagram of Figure 5, a soft etching process is performed on the main surface (the upper main surface in Figure 5) of the resin block that constitutes the three-dimensional structure 10, exposing the edge of the three-dimensional model 10b.

[0061] A patterned metal film is formed on the main surface of the block that has been soft-etched, thereby forming the coil pattern 23. By forming the coil pattern 23 after soft-etching the main surface of the block in this manner, it is possible to reliably surround one end of the three-dimensional object 10b (the upper end in FIG. 5 ) with the coil pattern 23, as in the first application example.

[0062] When the second application example is used, the coil pattern 23 can be formed on the main surface of the block, so that the substrate 21 and the insulating layer 22 can be omitted.

[0063] [Summary] In order to provide a technology that enables wiring of multiple wiring objects even when the multiple wiring objects are (1) located on planes that are parallel to and facing each other, or (2) located on multiple planes that intersect with each other, the method for manufacturing a three-dimensional object according to a first embodiment of the present invention includes: a first modeling step of modeling a three-dimensional structure having voids that are open at both ends and have a shape corresponding to the three-dimensional object; an immersion step of immersing the three-dimensional structure, a first electrode that is arranged so that one end of the void is closed and the other end is open, and a second electrode that has a polarity opposite to that of the first electrode, in an electrolyte solution containing an ionized material; and a second modeling step of applying a voltage between the first electrode and the second electrode to deposit the material in the voids from the first electrode side, thereby modeling the three-dimensional object extending from one end of the void to the other end.

[0064] According to the above configuration, the produced three-dimensional object is filled from one end to the other end of the hole, which is open at both ends. Therefore, by connecting one end of the three-dimensional object to a wiring object at one end of the hole and connecting the other end of the three-dimensional object to another wiring object at the other end of the hole, the three-dimensional object can connect multiple wiring objects together.

[0065] Furthermore, since each of the ends of the hole can be formed on any of the faces that make up the three-dimensional structure, even if the three-dimensional object is (1) located on planes that are parallel to and facing each other, or (2) located on multiple planes that intersect with each other, by appropriately designing the shape of the three-dimensional structure and the positions of both ends of the hole, it is possible to connect one end of the three-dimensional object to an object to be wired at one end of the hole, and to connect the other end of the three-dimensional object to another object to be wired at the other end of the hole.

[0066] Therefore, the method for manufacturing a three-dimensional object according to the first embodiment can manufacture a three-dimensional object that allows wiring between multiple wiring objects, even when the wiring objects are (1) located on planes that are parallel to and facing each other, or (2) located on multiple planes that intersect with each other.

[0067] Furthermore, in a method for manufacturing a three-dimensional structure according to a second aspect of the present invention, in addition to the configuration of the method for manufacturing a three-dimensional structure according to the first aspect described above, the pores are micro-sized pores with a pore diameter of less than 10 μm, and the three-dimensional structure is manufactured using a stereolithography method in the first manufacturing step.

[0068] According to the above configuration, because the holes are micro-sized holes, the three-dimensional object formed in the second modeling step also has a micro-sized hole diameter of less than 10 μm. Therefore, even when the size of the wiring object and the distance between adjacent wiring objects are both micro-sized, the three-dimensional object can be wired to the predetermined wiring object without short-circuiting the adjacent wiring objects.

[0069] Furthermore, in a method for manufacturing a three-dimensional structure according to a third aspect of the present invention, in addition to the configuration of the method for manufacturing a three-dimensional structure according to the first or second aspect described above, the material is a magnetic material, and the three-dimensional structure is a magnetic conductor.

[0070] According to the above configuration, magnetic order can be transmitted between a wiring object connected to one end of the three-dimensionally shaped object and a wiring object connected to the other end of the three-dimensionally shaped object.

[0071] Furthermore, in a method for manufacturing a three-dimensional structure according to a fourth aspect of the present invention, in addition to the configuration of the method for manufacturing a three-dimensional structure according to the third aspect described above, the magnetic material is a ferromagnetic material containing at least one of nickel, cobalt, and iron.

[0072] According to the above configuration, magnetic order can be reliably transmitted between a wiring object connected to one end of the three-dimensionally shaped object and a wiring object connected to the other end of the three-dimensionally shaped object.

[0073] Furthermore, in a method for manufacturing a three-dimensional object according to a fifth aspect of the present invention, in addition to the configuration of the method for manufacturing a three-dimensional object according to the first or second aspect described above, the material is a conductive material, and the three-dimensional object is an electrical conductor.

[0074] According to the above configuration, power or an electrical signal can be supplied from either a wiring object connected to one end of the three-dimensional object or a wiring object connected to the other end of the three-dimensional object to the other.

[0075] Furthermore, in a method for manufacturing a three-dimensional structure according to a sixth aspect of the present invention, in addition to the configuration of the method for manufacturing a three-dimensional structure according to the fifth aspect described above, the conductive material is a metal material or a carbon material.

[0076] According to the above configuration, it is possible to reduce losses that may occur in the conductor wire.

[0077] Furthermore, in a method for manufacturing a three-dimensional object according to a seventh aspect of the present invention, in addition to the configuration of the method for manufacturing a three-dimensional object according to any one of the third to sixth aspects described above, a composition for dispersing voids or impurities in the three-dimensional object is employed in the second modeling step.

[0078] According to the above configuration, it is possible to suppress eddy currents that may occur when a high-frequency AC magnetic field is applied to a three-dimensionally shaped object.

[0079] Furthermore, in a method for manufacturing a three-dimensional structure according to an eighth aspect of the present invention, in addition to the configuration of the method for manufacturing a three-dimensional structure according to any one of the third to seventh aspects described above, the three-dimensional structure is an adapter for connecting an integrated circuit having a plurality of terminals to a spatial light modulator having a plurality of cells, and the three-dimensional structure is a conductor for connecting any one of the plurality of terminals to any one of the plurality of cells.

[0080] According to the above configuration, the integrated circuit and the spatial light modulator can be connected using a three-dimensional object.

[0081] Furthermore, in a method for manufacturing a three-dimensional object according to a ninth aspect of the present invention, in addition to the configuration of the method for manufacturing a three-dimensional object according to the first or second aspect described above, the material is a light-transmitting material, and the three-dimensional object is an optical conductor.

[0082] According to the above configuration, an optical signal can be supplied from either a wiring target connected to one end of the three-dimensional object or a wiring target connected to the other end of the three-dimensional object to the other.

[0083] Furthermore, a tenth aspect of the present invention relates to a method for manufacturing a three-dimensional object, which includes the same components as those of the ninth aspect, and further relates to a method for manufacturing a three-dimensional object, wherein the light-transmitting material is an oxide material or a chalcogenide.

[0084] According to the above configuration, the optical conductor can be formed using electroplating in the second forming step.

[0085] [Additional Notes] The present invention is not limited to the above-described embodiments, and various modifications are possible within the scope of the claims. Embodiments obtained by appropriately combining the technical means disclosed in different embodiments are also included in the technical scope of the present invention.

[0086] 10 Three-dimensional structure 10a Hole 10b Three-dimensional structure 11 First electrode 12 Second electrode 13 Electrolyte

Claims

1. A method for manufacturing a three-dimensional object, comprising: a first fabrication step of fabricating a three-dimensional structure having holes that are open at both ends and have a shape corresponding to the three-dimensional object; an immersion step of immersing the three-dimensional structure, a first electrode that is arranged so that one end of the hole is closed and the other end is open, and a second electrode that has a polarity opposite to that of the first electrode, in an electrolyte solution containing an ionized material; and a second fabrication step of fabricating the three-dimensional object extending from one end of the hole to the other by applying a voltage between the first electrode and the second electrode to deposit the material in the hole from the first electrode side.

2. The method for manufacturing a three-dimensional object according to claim 1, characterized in that the pores are micro-sized pores with a pore diameter of less than 10 μm, and the three-dimensional structure is formed in the first modeling step using a photolithography method.

3. The method for manufacturing a three-dimensional object according to claim 1 or 2, characterized in that the material is a magnetic material, and the three-dimensional object is a magnetic conductor.

4. The method for manufacturing a three-dimensional object according to claim 3, wherein the magnetic material is a ferromagnetic material containing at least one of nickel, cobalt, and iron.

5. The method for manufacturing a three-dimensional object according to claim 1 or 2, characterized in that the material is a conductive material, and the three-dimensional object is an electrical conductor.

6. The method for manufacturing a three-dimensional object according to claim 5, wherein the conductive material is a metal material or a carbon material.

7. The method for manufacturing a three-dimensional object according to any one of claims 3 to 6, characterized in that in the second modeling step, voids or impurities are dispersed within the three-dimensional object.

8. The method for manufacturing a three-dimensionally shaped object according to any one of claims 3 to 7, characterized in that the three-dimensional structure is an adapter for connecting an integrated circuit having a plurality of terminals to a spatial light modulator having a plurality of cells, and the three-dimensionally shaped object is a conductor for connecting any one of the plurality of terminals to any one of the plurality of cells.

9. The method for manufacturing a three-dimensional object according to claim 1 or 2, characterized in that the material is a light-transmitting material, and the three-dimensional object is an optical conductor.

10. The method for manufacturing a three-dimensional object according to claim 9, wherein the light-transmitting material is an oxide material or a chalcogenide.

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