Vibration analysis method and vibration analysis system

Abstract

The present invention relates to a vibration analysis method comprising: a three-dimensional model generation step for generating a three-dimensional model (200) of a target device (100); a vibration data collection step for operating the target device (100) and collecting actual measurement values of vibration data of the target device (100); and a three-dimensional animation generation step for generating a three-dimensional animation in which the three-dimensional model (200) and the actual measurement values of the vibration data are combined.

Description

Vibration analysis method and vibration analysis system

[0001] The present invention relates to a vibration analysis method and a vibration analysis system. This application claims priority to Japanese Patent Application No. 2024-100183, filed on June 21, 2024, the contents of which are incorporated herein by reference.

[0002] Japanese Patent Application Laid-Open No. 2006-144994 describes a method for calculating the dynamic characteristics of a machine tool, including its dynamic rigidity, by detecting vibrations generated when a tool in the machine tool is excited. If the dynamic characteristics of the machine tool can be obtained, it will be possible to determine machining conditions for improving the machining accuracy of a workpiece and to identify the cause of chatter vibrations and the like.

[0003] Japanese Patent Application Publication No. 2016-005858

[0004] When evaluating the dynamic rigidity of a target device, there are two methods: one is to apply an impact force using an impulse hammer or the like while the device is stationary, and the other is to apply a force by moving the device. Both of these methods can evaluate the dynamic rigidity of the target device in a specific state. However, when the target device moves, the position of each element changes, and the dynamic rigidity of the target device also changes, requiring re-evaluation in that state.

[0005] The present invention has been made in view of the above-mentioned problems, and has as its object to evaluate the dynamic stiffness of a target device in an arbitrary posture during a series of operations.

[0006] A first aspect of the present invention is a vibration analysis method comprising: a three-dimensional model generation step of generating a three-dimensional model of a target device; a vibration data collection step of operating the target device and collecting actual measured values ​​of vibration data of the target device; and a three-dimensional animation generation step of generating a three-dimensional animation that combines the three-dimensional model and the actual measured values ​​of the vibration data.

[0007] A second aspect of the present invention is the vibration analysis method of the first aspect, wherein the target device comprises a fixed part and a moving part that moves relative to the fixed part, and in the vibration data collection step, a plurality of vibration sensors are attached to each of the fixed part and the moving part to collect actual measured values ​​of the vibration data.

[0008] A third aspect of the present invention is the vibration analysis method according to the second aspect, wherein the vibration data collecting step continuously collects measured values ​​of the vibration data until the moving part moves from the start point to the end point.

[0009] A fourth aspect of the present invention is the vibration analysis method of the second or third aspect, wherein in the three-dimensional animation, the movement of the target device is represented by the movement of the three-dimensional model, and the vibration of the target device is represented by the displacement of the multiple vibration sensors attached to each of the fixed part and the movable part.

[0010] A fifth aspect of the present invention is the vibration analysis method of the fourth aspect, wherein in the three-dimensional animation, the movement of the three-dimensional model can be stopped at any timing between the time when the moving part moves from the start point to the end point, and the displacement of the plurality of vibration sensors can be observed.

[0011] A sixth aspect of the present invention is a vibration analysis system having a three-dimensional model generation unit that generates a three-dimensional model of a target device, a vibration data collection unit that operates the target device and collects actual measured values ​​of vibration data of the target device, and a three-dimensional animation generation unit that generates a three-dimensional animation that combines the three-dimensional model and the actual measured values ​​of the vibration data.

[0012] According to the present invention, it is possible to evaluate the dynamic stiffness of a target device in any posture during a series of operations.

[0013] FIG. 1 is a schematic diagram of a vibration analysis method according to an embodiment; FIG. 2 is a perspective view of a target device according to an embodiment; FIG. 3 is a configuration diagram of a vibration analysis system according to an embodiment; FIG. 4 is an explanatory diagram of a vibration analysis method according to an embodiment; FIG. 5 is a screen diagram of a three-dimensional animation displayed on a display unit according to an embodiment; and FIG. 6 is a process diagram of a vibration analysis method according to an embodiment.

[0014] Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

[0015] Fig. 1 is a schematic diagram of a vibration analysis method according to one embodiment. A target device 100 shown in part (a) of Fig. 1 is a table device that supports and moves a tool and a workpiece in a machine tool. Note that the target device 100 is not limited to this table device. The target device 100 may also be, for example, an articulated robot such as a robot arm.

[0016] The target device 100 includes a fixed unit 101 and two movable units 102 that move relative to the fixed unit 101. The number of movable units 102 may be one or may be three or more. In this method, first, as shown in part (b) of FIG. 1 , a plurality of vibration sensors 103 are attached to each of the fixed unit 101 and the movable units 102.

[0017] An example of the vibration sensor 103 is an acceleration sensor. The vibration sensor 103 may be a displacement sensor, a velocity sensor, or the like, as long as it can detect vibration. After the vibration sensor 103 is attached to the target device 100, the target device 100 is then operated (driven) as shown in part (c) of FIG. 1 to collect actual measured vibration data. Additionally, when the target device 100 is in a specific posture, an impact force may be applied by an impulse hammer 104 in a stationary state to collect vibration data of the target device 100.

[0018] Once the vibration data has been collected, a three-dimensional animation is generated by combining the vibration data with a three-dimensional model 200 of the target device 100, as shown in part (d) of Figure 1. The three-dimensional model 200 includes a fixed part model 201 that models the fixed part 101, a moving part model 202 that models the moving part 102, and a vibration sensor model 203 that models the vibration sensor 103.

[0019] In the three-dimensional animation, a series of movements of the target device 100 are represented by the movements of the fixed unit model 201 and the moving unit model 202, and the vibrations of the target device 100 at that time are represented by the displacement of the vibration sensor model 203. In other words, vibrations are represented by the displacement of the vibration sensor model 203 relative to the fixed unit model 201 and the moving unit model 202. In addition, in this three-dimensional animation, the movement of the three-dimensional model 200 can be stopped at any timing while the moving unit model 202 (moving unit 102) moves from the start point to the end point, and the displacements (vibration behavior) of the multiple vibration sensors 103 at that time can be observed (described later).

[0020] Fig. 2 is a perspective view of a target device 100 according to one embodiment. The target device 100 shown in Fig. 2 includes a base 110 serving as a fixed unit 101, and a first table 120 and a second table 130 serving as a moving unit 102. The first table 120 supports, for example, a workpiece. The second table 130 supports, for example, a tool for machining the workpiece.

[0021] In the following description, an XYZ Cartesian coordinate system is set, and the positional relationships of the components are sometimes described with reference to this XYZ Cartesian coordinate system. The X-axis direction is set as a first horizontal direction. The Y-axis direction is set as a second horizontal direction that is perpendicular to the first horizontal direction. The Z-axis direction is a vertical direction that is perpendicular to both the first horizontal direction and the second horizontal direction.

[0022] The base 110 is a pedestal that forms the bottom of the target device 100 and extends along the XY plane. A first table 120 is attached to the upper surface of the base 110 so as to be movable along the XY plane. A wall 111 stands on the end of the base 110 in the Y-axis direction. A second table 130 is attached to the front of the wall 111 so as to be movable along the Z-axis direction.

[0023] The first table 120 is formed in the shape of a rectangular plate. The first table 120 is guided along the XY plane by a first linear guide device 140 and a second linear guide device 141. The first linear guide devices 140 are provided in pairs on the upper surface of the base 110. The first linear guide device 140 includes a first rail extending in the Y-axis direction and a first moving block that moves along the first rail.

[0024] A plurality of rolling elements, such as balls or rollers, are interposed between the first rail and the first moving block. The first moving block of each of the pair of first linear guide devices 140 is fixed to the lower surface side of the intermediate member 121. The intermediate member 121 is connected to a first ball screw drive device 150 provided on the base 110, and moves in the Y-axis direction while being guided by the pair of first linear guide devices 140.

[0025] The second linear guide devices 141 are provided in pairs on the upper surface of the intermediate member 121. The second linear guide devices 141 include a second rail extending in the X-axis direction and a second moving block that moves along the second rail. A plurality of rolling elements, such as balls or rollers, are interposed between the second rail and the second moving block.

[0026] The second moving blocks of each of the pair of second linear guide devices 141 are fixed to the underside of the first table 120. The first table 120 is connected to a second ball screw drive device 151 provided on the intermediate member 121, and moves in the X-axis direction while being guided by the pair of second linear guide devices 141.

[0027] The second table 130 is formed in the shape of a rectangular plate. The second table 130 is guided along the Z-axis direction by a third linear guide device 142. The third linear guide devices 142 are provided in pair on the front surface of the wall portion 111. The third linear guide device 142 includes a third rail extending in the Z-axis direction and a third moving block that moves along the third rail.

[0028] A plurality of rolling elements, such as balls or rollers, are interposed between the third rail and the third moving block. The third moving blocks of each of the pair of third linear guide devices 142 are fixed to the rear side of the second table 130. The second table 130 is connected to a third ball screw drive device 152 provided on the wall portion 111, and moves in the Z-axis direction while being guided by the pair of third linear guide devices 142.

[0029] The vibration sensors 103 are attached to each element of the target device 100. The vibration sensors 103 include a first vibration sensor group 103A attached to the base 110, a second vibration sensor group 103B attached to the wall portion 111, a third vibration sensor group 103C attached to the first table 120, a fourth vibration sensor group 103D attached to the intermediate member 121, and a fifth vibration sensor group 103E attached to the second table 130.

[0030] Although not shown, the vibration sensors 103 are also attached to each element of the first linear guide device 140 to the third linear guide device 142 and each element of the first ball screw drive device 150 to the third ball screw drive device 152. The vibration sensors 103 are attached to corner portions of each surface of the elements of the target device 100. The attachment locations of the vibration sensors 103 and the number of installed vibration sensors 103 shown in Fig. 2 are merely examples and are not limited to these.

[0031] Fig. 3 is a configuration diagram of a vibration analysis system 1 according to one embodiment. As shown in Fig. 3, the vibration analysis system 1 includes a three-dimensional model generation unit 10, a three-dimensional model storage unit 11, a vibration data collection unit 12, a vibration data analysis unit 13, a three-dimensional animation generation unit 14, and a display unit 15.

[0032] The vibration analysis system 1 is configured with a computer including, for example, a CPU and memories such as RAM and ROM. The functions of the 3D model generation unit 10, vibration data analysis unit 13, and 3D animation generation unit 14 are realized, for example, by computer programs. The functions of the 3D model storage unit 11 and vibration data collection unit 12 are realized, for example, by memories. The function of the display unit 15 is realized, for example, by a display.

[0033] The three-dimensional model generation unit 10 generates a three-dimensional model 200 of the target device 100. The three-dimensional model generation unit 10 generates the three-dimensional model 200 from, for example, three-dimensional data (CAD data, etc.) of the target device 100 input from outside. The three-dimensional model generation unit 10 deletes unnecessary elements of the target device 100, replaces complex shapes, sets various parameters, sets boundary conditions, and creates a mesh model for FEM analysis.

[0034] The three-dimensional model storage unit 11 stores the three-dimensional model generated by the three-dimensional model generation unit 10. The vibration data collection unit 12 collects actual measured values ​​of vibration data output from vibration sensors 103 attached to the target device 100. The vibration data collection unit 12 receives input of actual measured values ​​of vibration data from a first vibration sensor group 103A to a fifth vibration sensor group 103E attached to each element of the target device 100.

[0035] The vibration data analysis unit 13 performs vibration analysis based on the vibration data collected by the vibration data collection unit 12. The vibration data analysis unit 13 performs, for example, a nonlinear analysis (static stiffness analysis) or a linear analysis (dynamic stiffness analysis) to output natural frequencies, frequency response functions, natural modes, and the like.

[0036] The three-dimensional animation generation unit 14 generates a three-dimensional animation by combining the three-dimensional model 200 generated by the three-dimensional model generation unit 10 with the actual measurement values ​​of the vibration data collected by the vibration data collection unit 12. The display unit 15 displays the three-dimensional animation generated by the three-dimensional animation generation unit 14 and the data analyzed by the vibration data analysis unit 13 (described later).

[0037] Next, the vibration analysis method of this embodiment will be described with reference to FIGS.

[0038] Fig. 4 is an explanatory diagram of a vibration analysis method according to one embodiment. Fig. 5 is a screen shot of a three-dimensional animation displayed on the display unit 15 according to one embodiment. Fig. 6 is a process diagram of a vibration analysis method according to one embodiment. As shown in Fig. 6, in this method, first, a model of the target device 100 (CAD data of the target device 100, a three-dimensional model 200) is created (step S1).

[0039] Next, in this method, an actual target device 100 is manufactured (step S2). After the target device 100 is manufactured, measurement points for attaching vibration sensors 103 are considered (step S3). After the measurement points are considered, the vibration sensors 103 are attached to the measurement points (step S4).

[0040] Next, in this method, the target device 100 to which the vibration sensor 103 is attached is driven (step S5). For example, as shown in Fig. 4, the first table 120 is moved from the left (starting point) to the right (ending point), and the second table 130 is moved from the top (starting point) to the bottom (ending point). Then, actual measured values ​​of vibration data (e.g., acceleration data) are continuously collected until the moving unit 102 (first table 120, second table 130) moves from the starting point to the ending point (step S6).

[0041] Next, in this method, data analysis is performed based on the collected vibration data (step S7). The created 3D model 200 is then combined with the measurement data (actual measurements) from the vibration sensor 103 (step S8). The results (3D animation, analysis data) are then output to the display unit 15 (step S9).

[0042] As shown in FIG. 5, the display unit 15 configures a GUI (Graphical User Interface) including a three-dimensional animation display unit 20 and a vibration data display unit 30 .

[0043] The three-dimensional animation display unit 20 expresses the movement of the target device 100 as the movement of the three-dimensional model 200, and expresses the vibration of the target device 100 as the displacement of the vibration sensor 103. For example, the movement of the first table 120 from left (starting point) to right (ending point) and the movement of the second table 130 from up (starting point) to down (ending point) shown in FIG. 4 are expressed by the movement of two moving part models 202.

[0044] The vibrations of first table 120 and second table 130 at that time are expressed as the displacement (indicated by the arrow in FIG. 5 ) of vibration sensor model 203 (a spherical model). The displacement of vibration sensor model 203 can be displayed at any magnification. Therefore, even if the actual measured value of the vibration data is small, the vibration can be displayed in a visually easy-to-understand manner.

[0045] The three-dimensional model 200 is semi-transparent except for the vibration sensor model 203 (spherical model) to improve the visibility of the displacement of the vibration sensor model 203. Although Fig. 5 shows a side view of the three-dimensional model 200, by dragging the three-dimensional animation display unit 20 with a mouse or the like, the three-dimensional model 200 can be rotated and the vibration behavior can be observed from any angle.

[0046] The vibration data display unit 30 displays the analysis results of the vibration data in conjunction with the 3D animation of the 3D animation display unit 20. Specifically, the vibration data display unit 30 displays a graph of a frequency response function, with compliance (m / N) set on the vertical axis and frequency (Hz) set on the horizontal axis. The analysis results of all the vibration sensors 103 are displayed on the vibration data display unit 30. The number of vibration data display units 30 is not limited to one, and multiple units may be provided so that the analysis results of multiple vibration sensor groups can be observed in parallel.

[0047] The vibration data display unit 30 displays a seek bar 36 that can be moved in the horizontal direction, and by moving the seek bar 36 with a mouse or the like, a 3D animation at the target frequency can be reflected on the 3D animation display unit 20. In other words, the behavior of the target device 100 at any frequency can be visualized on the 3D animation display unit 20.

[0048] As described above, in this method, as shown in FIG. 4 , actual measured vibration data (e.g., acceleration data) is continuously collected as the moving unit 102 moves from the start point to the end point. Then, a 3D animation is generated that combines the 3D model 200 and the actual measured vibration data. This 3D animation can be stopped at any timing. Then, by analyzing the vibration data at the time the animation is stopped, the dynamic stiffness of the target device 100 in any posture can be analyzed. For example, if chatter vibration or the like is detected in a certain posture, simply changing the 3D model 200 to that posture allows the dynamic stiffness of that posture to be analyzed without having to change the posture of the target device 100 and collect and evaluate data again.

[0049] In this way, according to this technique, it is possible to evaluate the dynamic stiffness at any posture during a series of operations of the target device 100. For example, if the posture of the target device 100 at any timing is set to "verification position A," and vibration data is to be analyzed at that verification position A, the vibration data can be analyzed by changing the three-dimensional model 200 to verification position A as shown in step S10 of FIG. 6. Also, if the posture of the target device 100 at another timing is set to "verification position B," and vibration data is to be analyzed at that verification position B, the vibration data can be analyzed by changing the three-dimensional model 200 to verification position B as shown in step S11 of FIG.

[0050] As described above, the vibration analysis method of this embodiment includes a three-dimensional model generation step of generating a three-dimensional model 200 of the target device 100, a vibration data collection step of operating the target device 100 and collecting actual measured values ​​of vibration data of the target device 100, and a three-dimensional animation generation step of generating a three-dimensional animation that combines the three-dimensional model 200 and the actual measured values ​​of the vibration data. This makes it possible to evaluate the dynamic stiffness of the target device 100 in any posture during a series of operations.

[0051] In this embodiment, the target device 100 includes a fixed part 101 and a moving part 102 that moves relative to the fixed part 101, and in the vibration data collection step, a plurality of vibration sensors 103 are attached to each of the fixed part 101 and the moving part 102 to collect actual measured values ​​of vibration data of the target device 100. This makes it possible to evaluate the dynamic stiffness of each of the fixed part 101 and the moving part 102.

[0052] In the present embodiment, the vibration data collection step continuously collects actual measured vibration data values ​​from the time when the moving unit 102 moves from the start point to the end point, thereby making it possible to visualize the vibration behavior of the target device 100 during a series of operations.

[0053] Furthermore, in the present embodiment, in the three-dimensional animation, the movement of the target device 100 is represented by the movement of the three-dimensional model 200, and the vibration of the target device 100 is represented by the displacement of the multiple vibration sensors 103 attached to each of the fixed unit 101 and the moving unit 102. This makes it possible to visualize the vibration behavior of the target device 100, separate from the movement of the target device 100.

[0054] Furthermore, in this embodiment, in the 3D animation, it is possible to stop the movement of the 3D model 200 at any timing while the moving unit 102 moves from the start point to the end point, and observe the displacements of the multiple vibration sensors 103. This makes it possible to visualize the vibration behavior of the target device 100 while stopping the movement of the target device 100 at any timing.

[0055] Furthermore, in this embodiment, the displacements of the multiple vibration sensors 103 can be observed at any magnification in the three-dimensional animation, which makes it easier to visually understand the behavior of minute vibrations of the target device 100.

[0056] The vibration analysis system of this embodiment also includes a 3D model generation unit 10 that generates a 3D model 200 of the target device 100, a vibration data collection unit 12 that operates the target device 100 and collects actual measured values ​​of vibration data of the target device 100, and a 3D animation generation unit 14 that generates a 3D animation that combines the 3D model 200 and the actual measured values ​​of the vibration data. With this configuration, it is possible to evaluate the dynamic rigidity of the target device 100 in any posture during a series of movements.

[0057] Although the preferred embodiments of the present invention have been described above with reference to the drawings, the present invention is not limited to the above-described embodiments. The shapes and combinations of the components shown in the above-described embodiments are merely examples, and various modifications can be made based on design requirements, etc., without departing from the spirit of the present invention. Furthermore, errors in dimensions and inclination are naturally permitted within the scope of the effects of the present invention.

[0058] According to the present invention, it is possible to evaluate the dynamic stiffness of a target device in any posture during a series of operations.

[0059] 1 Vibration analysis system 10 Three-dimensional model generation unit, 11 Three-dimensional model storage unit 12 Vibration data collection unit 13 Vibration data analysis unit 14 Three-dimensional animation generation unit 15 Display unit 20 Three-dimensional animation display unit 30 Vibration data display unit 36 ​​Seek bar 100 Target device 101 Fixed unit 102 Moving unit 103 Vibration sensor 103A First vibration sensor group 103B Second vibration sensor group 103C Third vibration sensor group 103D Fourth vibration sensor group 103E Fifth vibration sensor group 104 Impulse hammer 110 Base 111 Wall unit 120 First table 121 Intermediate member 130 Second table 140 First linear motion guiding device 141 Second linear motion guiding device 142 Third linear motion guiding device 150 Drive device 151 Drive device 152 Driving device 200 Three-dimensional model 201 Fixed part model 202 Moving part model 203 Vibration sensor model A Verification position B Verification position

Claims

1. A vibration analysis method comprising: a three-dimensional model generation step of generating a three-dimensional model of a target device; a vibration data collection step of operating the target device and collecting actual measured vibration data of the target device; and a three-dimensional animation generation step of generating a three-dimensional animation that combines the three-dimensional model and the actual measured vibration data.

2. The vibration analysis method according to claim 1, wherein the target device comprises a fixed part and a moving part that moves relative to the fixed part, and wherein the vibration data collection step comprises attaching a plurality of vibration sensors to each of the fixed part and the moving part to collect actual measured values ​​of the vibration data.

3. The vibration analysis method according to claim 2, wherein in the vibration data collection step, actual measured values ​​of the vibration data are collected continuously until the moving part moves from the start point to the end point.

4. A vibration analysis method according to claim 2 or 3, wherein in the three-dimensional animation, the movement of the target device is represented by the movement of the three-dimensional model, and the vibration of the target device is represented by the displacement of the plurality of vibration sensors attached to each of the fixed part and the movable part.

5. The vibration analysis method according to claim 4, wherein in the three-dimensional animation, the movement of the three-dimensional model can be stopped at any timing between the time when the moving part moves from the start point to the end point, and the displacement of the plurality of vibration sensors can be observed.

6. A vibration analysis system comprising: a three-dimensional model generation unit that generates a three-dimensional model of a target device; a vibration data collection unit that operates the target device and collects actual measured vibration data of the target device; and a three-dimensional animation generation unit that generates a three-dimensional animation that combines the three-dimensional model and the actual measured vibration data.

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