Electronic device comprising heat dissipation structure

Abstract

According to one embodiment of the present disclosure, an electronic device may comprise: a first housing; a second housing rotatably connected to the first housing and including a plate, an inner wall protruding from the plate, and an opening formed in the inner wall; a flexible display disposed on the first housing and the second housing; a circuit board disposed in the second housing; a battery disposed in the second housing and spaced apart from the circuit board with the inner wall interposed therebetween; and a heat dissipation member extending from the circuit board to the battery and including a bent region, at least a part of which is disposed in the opening of the inner wall. Various other embodiments may be possible.

Description

Electronic devices including heat dissipation structures

[0001] Various embodiments disclosed in this document relate to electronic devices, for example, electronic devices including a heat dissipation structure.

[0002] Electronic devices can refer to devices that perform specific functions based on embedded programs, such as home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, audio / video devices, desktop / laptop computers, or in-vehicle navigation systems. For example, these electronic devices can output stored information as audio or video. As electronic device integration increases and ultra-high-speed, high-capacity wireless communications become more widespread, a single electronic device, such as a mobile communication terminal, can be equipped with various functions. For example, in addition to communication functions, entertainment functions such as games, multimedia functions such as music / video playback, communication and security functions for mobile banking, or functions such as schedule management or electronic wallets are being integrated into a single electronic device.

[0003] As the use of personal or portable communication devices, such as smartphones, becomes more widespread, user demand for portability and ease of use is increasing. For example, a touchscreen display can serve as an output device, such as a screen that outputs visual information, while also providing a virtual keypad that replaces mechanical input devices (e.g., button-type input devices). This allows portable communication devices or electronic devices to be miniaturized while still offering the same or improved usability (e.g., a larger screen). On the other hand, the commercialization of flexible displays, such as those that can be folded or rolled, is expected to further enhance the portability and usability of electronic devices. Electronic devices including flexible displays can be carried in a folded or rolled state with multiple different structures (e.g., housings) and can provide a large screen when unfolded, thereby enhancing portability and usability.

[0004] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above-described matters constitute prior art related to the present disclosure.

[0005] According to one embodiment of the present disclosure, an electronic device may include a first housing, a second housing rotatably connected to the first housing and including a plate and an inner wall protruding from the plate, and an opening formed in the inner wall, a flexible display disposed on the first housing and the second housing, a circuit board disposed within the second housing, a battery disposed within the second housing and spaced apart from the circuit board with the inner wall therebetween, and a heat dissipation member extending from the circuit board to the battery and including a curved region at least partially disposed in the opening of the inner wall.

[0006] According to one embodiment of the present disclosure, an electronic device may include a first housing, a second housing including a plate and an inner wall protruding from the plate, and an opening formed in the inner wall, a hinge structure connected to the first housing and the second housing, a flexible display disposed on the first housing and the second housing, a circuit board disposed within the second housing, a battery disposed within the second housing and spaced apart from the circuit board with the inner wall interposed therebetween, and a heat dissipation member including a curved region extending from the circuit board to the battery and at least partially disposed in the opening of the inner wall.

[0007] According to one embodiment of the present disclosure, an electronic device includes a first housing including a first hole and a first plate, a second housing including a second hole and a second plate, a hinge structure connected to the first housing and the second housing, a hinge cover covering the hinge structure, a flexible printed circuit board extending from the first housing across the hinge structure to the second housing, and a heat dissipation member extending from the first housing across the hinge structure to the second housing, wherein the heat dissipation member includes a first heat dissipation area disposed on the first plate, a second heat dissipation area disposed on the second plate, and a curved area connected to the first heat dissipation area and the second heat dissipation area and disposed across the hinge structure, wherein the curved area includes a planar portion fixed to the hinge cover, a first flexible portion connecting the planar portion and the first heat dissipation area and disposed in the first hole (616), and a first flexible portion connecting the planar portion and the second heat dissipation area. and may include a second flexible portion disposed in the second hole.

[0008] According to one embodiment of the present disclosure, an electronic device may include a housing including a sidewall forming at least a portion of a side surface of the electronic device, a plate surrounded by the sidewall, an inner wall formed on the plate and disposed substantially parallel to at least one side of the sidewall, and an opening formed in the inner wall, a printed circuit board accommodated inside the housing and disposed in a first inner region positioned in a first direction with respect to the inner wall, the printed circuit board including a processor, a battery accommodated inside the housing and disposed in a second inner region positioned in a second direction opposite to the first direction with respect to the inner wall, the battery being electrically connected to the printed circuit board, and a heat diffusion member extending from the first inner region toward the second inner region, the heat diffusion member being at least partially disposed in the opening, the heat diffusion member including a heat diffusion material, and wherein at least a portion of a surface of the heat diffusion member disposed in the opening may include a curved region.

[0009] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0010] FIG. 2 is a diagram illustrating an unfolded state of an electronic device according to one embodiment of the present disclosure.

[0011] FIG. 3 is a drawing illustrating a folded state of an electronic device according to one embodiment of the present disclosure.

[0012] FIG. 4 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0013] FIG. 5 is a perspective view showing a heat dissipation member and a second housing according to one embodiment of the present disclosure.

[0014] FIG. 6 is a perspective view showing a heat dissipation member and a second housing according to one embodiment of the present disclosure.

[0015] FIG. 7 is a perspective view showing an inner wall and an opening of a second housing according to one embodiment of the present disclosure.

[0016] FIG. 8 is a perspective view showing a state in which a heat dissipation member and a guide member are arranged in an opening according to one embodiment of the present disclosure.

[0017] FIG. 9 is a plan view showing a heat dissipation member, a guide member, and an inner wall according to one embodiment of the present disclosure.

[0018] FIG. 10 is a drawing showing a guide member and a heat dissipation member according to one embodiment of the present disclosure.

[0019] FIG. 11 is a cross-sectional view taken along line AA' of FIG. 2 according to one embodiment of the present disclosure.

[0020] FIG. 12 is a cross-sectional view taken along line AA' of FIG. 2 according to one embodiment of the present disclosure.

[0021] FIG. 13 is a perspective view showing a state in which a heat dissipation member and a guide member are arranged in an opening according to one embodiment of the present disclosure.

[0022] FIG. 14 is a perspective view showing a state in which a heat dissipation member and a guide member are arranged in an opening according to one embodiment of the present disclosure.

[0023] FIG. 15 is a perspective view showing a heat dissipation member and a second housing according to one embodiment of the present disclosure.

[0024] FIG. 16 is a perspective view showing a heat dissipation member and a second housing according to one embodiment of the present disclosure.

[0025] FIG. 17 is a perspective view showing a curved region and a second plate according to one embodiment of the present disclosure.

[0026] FIG. 18 is a perspective view of a curved region and a second plate according to one embodiment of the present disclosure, viewed from a direction opposite to that of FIG. 17.

[0027] FIG. 19 is a perspective view showing a support plate according to one embodiment of the present disclosure.

[0028] FIG. 20 is a plan view showing a heat dissipation member and a second plate according to one embodiment of the present disclosure.

[0029] FIG. 21 is a plan view showing a heat dissipation member and a second plate according to one embodiment of the present disclosure, and is a view viewed from the opposite direction to FIG. 20.

[0030] FIG. 22 is a drawing showing a heat dissipation member and an opening according to one embodiment of the present disclosure.

[0031] FIG. 23 is a cross-sectional view taken along line CC' of FIG. 22 according to one embodiment of the present disclosure.

[0032] FIG. 24 is a cross-sectional view of a heat dissipation member and an electronic device according to one embodiment of the present disclosure.

[0033] FIG. 25 is a perspective view showing a heat dissipation member and an electronic device according to one embodiment of the present disclosure.

[0034] FIG. 26 is a perspective view showing an electronic device and a heat dissipation member according to one embodiment of the present disclosure.

[0035] FIG. 27 is a cross-sectional view taken along line DD' of FIG. 26 according to one embodiment of the present disclosure.

[0036] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings so that those skilled in the art can easily implement the present disclosure. However, the present disclosure may be implemented in various different forms and is not limited to the embodiments described herein. In connection with the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Furthermore, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0037] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments.

[0038] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0039] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0040] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0041] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0042] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0043] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0044] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0045] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0046] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0047] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0048] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0049] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0050] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0051] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0052] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0053] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0054] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0055] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0056] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0057] According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0058] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0059] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0060] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0061] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0062] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0063] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0064] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0065] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0066] In the detailed description below, a configuration in which a pair of housings (or, referred to as 'housing structures') are rotatably coupled by a hinge structure (or, referred to as 'hinge structure (202)') may be exemplified. However, it should be noted that this embodiment does not limit the electronic device according to various embodiments disclosed in the present document. For example, the electronic device according to the embodiment(s) of the present disclosure may include three or more housings, and the "pair of housings" in the embodiments disclosed below may refer to "two housings rotatably coupled to each other among the three or more housings." In one embodiment, the configuration of the electronic device (101) of FIG. 1 may be included in either the first housing (210) or the second housing (220) described above, in which case either the first housing (210) or the second housing (220) itself may be understood as an embodiment of the electronic device. For example, it is noted that the electronic device according to the embodiment(s) of the present disclosure is not limited by the number of housing(s) or the coupling structure implemented between the plurality of housings.

[0067] FIG. 2 is a diagram illustrating an unfolded state of an electronic device according to one embodiment of the present disclosure.

[0068] FIG. 3 is a drawing illustrating a folded state of an electronic device according to one embodiment of the present disclosure.

[0069] The embodiments of FIGS. 2 to 3 can be combined with the embodiments of FIG. 1 or the embodiments of FIGS. 4 to 27.

[0070] Referring to FIGS. 2 and 3, an electronic device (101) (e.g., the electronic device (101) of FIG. 1) may include a housing (201), a hinge cover (240) covering a foldable portion of the housing (201), and a display (230) (e.g., the display module (160) of FIG. 1) disposed within a space formed by the housing (201).

[0071] According to one embodiment, the surface on which the screen output from the display (230) is exposed may be defined as the front surface of the electronic device (101) (e.g., the first front surface (210a) and the second front surface (220a)). The surface opposite to the front surface may be defined as the back surface of the electronic device (101) (e.g., the first back surface (210b) and the second back surface (220b)). In one embodiment, the surface surrounding the space between the front surface and the back surface may be defined as the side surface of the electronic device (101) (e.g., the first side surface (210c) and the second side surface (220c)). The side surface of the electronic device (101) may be the side surface of at least one of the first housing (210) and the second housing (220). The electronic device (101) of FIGS. 2 and 3 may be referred to as a foldable electronic device, a portable electronic device, or a portable foldable electronic device. According to one embodiment, the housing (201) may be referred to as a foldable housing. The display (230) may be referred to as a “flexible display.”

[0072] According to one embodiment, the housing (201) may include a first housing (210), a second housing (220) rotatable with respect to the first housing (210), a first rear cover (280), and a second rear cover (290). The housing (201) of the electronic device (101) is not limited to the shape and combination shown in FIGS. 2 and 3, and may be implemented by other shapes or combinations and / or combinations of parts. For example, in one embodiment, the first housing (210) and the first rear cover (280) may be formed integrally, and the second housing (220) and the second rear cover (290) may be formed integrally.

[0073] According to one embodiment, the first housing (210) is connected to a hinge structure (e.g., the hinge structure (202) of FIG. 4) and may include a first front surface (210a) facing a first direction and a first rear surface (210b) facing a second direction opposite to the first direction. The second housing (220) is connected to the hinge structure and includes a second front surface (220a) facing a third direction and a second rear surface (220b) facing a fourth direction opposite to the third direction, and may rotate with respect to the first housing (210) about the hinge structure (202). Accordingly, the electronic device (101) may be variable between a folded state and an unfolded state. The folding or unfolding motion of the electronic device (101) can be understood as the rotation of the first housing (210) with respect to the hinge structure or the rotation of the second housing (220) with respect to the hinge structure. When the electronic device (101) is in a folded state, the first front side (210a) can face the second front side (220a). When the electronic device (101) is in an unfolded state, the third direction can be the same as the first direction. In the following, unless otherwise stated, the directions are described based on the unfolded state of the electronic device (101).

[0074] According to one embodiment, the first housing (210) and the second housing (220) are arranged on both sides with respect to the folding axis (Ax) as the center, and may have an overall symmetrical shape with respect to the folding axis (Ax). As described below, the angle or distance between the first housing (210) and the second housing (220) may vary depending on whether the state of the electronic device (101) is in an unfolded state, a folded state, or an intermediate state. According to one embodiment, the second housing (220) additionally includes a sensor area (224) in which sensors (e.g., a front camera) are arranged, but may have a mutually symmetrical shape in other areas.

[0075] According to one embodiment, the folding axis (Ax) may be a plurality of parallel folding axes (e.g., two). In the present disclosure, the folding axis (Ax) is provided along the longitudinal direction (Y-axis direction) of the electronic device (101), but the direction of the folding axis (Ax) is not limited thereto. For example (not shown), an embodiment may be implemented in which the electronic device (101) includes a folding axis extending along the width direction (e.g., X-axis direction).

[0076] According to one embodiment, the electronic device (101) may include a structure into which a digital pen (not shown) can be attached. For example, the electronic device (101) may include a magnetic body configured to attach the digital pen to a side of the first housing (210) or a side of the second housing (220). According to one embodiment, the electronic device (101) may include a structure into which a digital pen can be inserted. For example, a hole (not shown) into which a digital pen can be inserted may be formed in a side of the first housing (210) or a side of the second housing (220) of the electronic device (101).

[0077] According to one embodiment, at least a portion of the first housing (210) and the second housing (220) may be formed of a metallic or non-metallic material having a rigidity of a size selected to support the display (230). At least a portion formed of the metallic material may provide a ground plane of the electronic device (101) and may be electrically connected to a ground line formed on a printed circuit board (e.g., the board portion (260) of FIG. 4).

[0078] According to one embodiment, the sensor area (224) may be formed to have a predetermined area adjacent to one edge or one corner of the second housing (220). However, the arrangement, shape, and size of the sensor area (224) are not limited to the illustrated example. According to one embodiment, the sensor area (224) may be provided in another corner of the second housing (220) or any area between the upper and lower corners or in the first housing (210). In one embodiment, components for performing various functions built into the electronic device (101) may be exposed to the front of the electronic device (101) through the sensor area (224) or through one or more openings provided in the sensor area (224). In one embodiment, the components may include various types of sensors. The sensor(s) may include, for example, at least one of a front camera, a receiver, or a proximity sensor.

[0079] According to one embodiment, the first rear cover (280) is disposed on one side of the folding axis (Ax) at the rear of the electronic device (101) and may have, for example, a substantially rectangular periphery, the periphery of which may be wrapped by another structure of the first housing (210). Similarly, the second rear cover (290) is disposed on the other side of the folding axis (Ax) at the rear of the electronic device (101) and the periphery of which may be wrapped by another structure of the second housing (220).

[0080] According to one embodiment, the first rear cover (280) and / or the second rear cover (290) may have a shape that is substantially symmetrical about the folding axis (Ax). However, the first rear cover (280) and the second rear cover (290) do not necessarily have mutually symmetrical shapes, and in one embodiment, the electronic device (101) may include the first rear cover (280) and the second rear cover (290) of different shapes that are not symmetrical.

[0081] According to one embodiment, the first rear cover (280), the second rear cover (290), the first housing (210), and the second housing (220) may provide a space in which various components of the electronic device (101) (e.g., a printed circuit board or a battery) may be placed. According to one embodiment, one or more components may be placed or visually exposed on the rear surface of the electronic device (101). For example, at least a portion of the sub-display (234) may be visually exposed through at least a portion of the first rear cover (280). According to one embodiment, one or more components or sensors may be visually exposed through at least a portion of the second rear cover (290). In various embodiments, the sensors may include a proximity sensor and / or a camera module (206) (e.g., a rear camera).

[0082] According to one embodiment, a front camera exposed to the front of the electronic device (101) through one or more openings provided in the sensor area (224) or a camera module (206) exposed through at least a portion of the second rear cover (290) may include one or more lenses, image sensors, and / or image signal processors. In some embodiments, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be arranged on one side of the electronic device (101).

[0083] According to one embodiment, the hinge cover (240) may be disposed between the first housing (210) and the second housing (220) to cover internal components (e.g., the hinge structure (202) of FIG. 4). According to one embodiment, the hinge cover (240) may be covered by a portion of the first housing (210) and the second housing (220) or exposed to the outside, depending on the state of the electronic device (101) (flat state or folded state).

[0084] According to one embodiment, as illustrated in FIG. 2, when the electronic device (101) is in an unfolded state, the hinge cover (240) may be covered by the first housing (210) and the second housing (220) and may not be exposed. According to one embodiment, as illustrated in FIG. 3, when the electronic device (101) is in a folded state (e.g., a fully folded state), the hinge cover (240) may be exposed to the outside between the first housing (210) and the second housing (220). According to one embodiment, when the first housing (210) and the second housing (220) are in an intermediate state where they are folded at a certain angle, the hinge cover (240) may be partially exposed to the outside between the first housing (210) and the second housing (220). However, in this case, the exposed area may be less than that in the fully folded state. In one embodiment, the hinge cover (240) may include a curved surface.

[0085] According to one embodiment, the display (230) may be positioned on a space formed (or defined) by the housing (201). For example, the display (230) may be seated on a recess provided by the housing (201) and may form a majority of the front surface of the electronic device (101). Accordingly, the front surface of the electronic device (101) may include the display (230), a portion of the first housing (210) adjacent to the display (230) and a portion of the second housing (220). The back surface of the electronic device (101) may include a first back cover (280), a portion of the first housing (210) adjacent to the first back cover (280), a second back cover (290), and a portion of the second housing (220) adjacent to the second back cover (290).

[0086] In one embodiment, the display (230) may include a plurality of display areas spaced apart from each other. For example, the display (230) may include a first display area (231) disposed on a first housing (210), a second display area (232) disposed on a second housing (220), and a folding area (233). In one embodiment, the first display area (231) and the second display area (232) may rotate about a folding axis (Ax).

[0087] According to one embodiment, the display (230) may refer to a display in which at least a portion of the display can be transformed into a flat or curved surface. For example, the display (230) may be a foldable or flexible display. According to one embodiment, the display (230) may include a folding area (233), a first display area (231) arranged on one side (e.g., the left side of the folding area (233) illustrated in FIG. 2) with respect to the folding area (233), and a second display area (232) arranged on the other side (e.g., the right side of the folding area (233) illustrated in FIG. 2). However, the division of the areas of the display (230) is exemplary, and the display (230) may be divided into a plurality of areas (e.g., four or more or two) depending on the structure or function. For example, in the embodiment illustrated in FIG. 2, the display (230) may be divided into regions by a folding region (233) or a folding axis (Ax) extending parallel to the Y-axis. In one embodiment, the display (230) may also be divided into regions based on another folding region (e.g., a folding region parallel to the X-axis) or another folding axis (e.g., a folding axis parallel to the X-axis). In one embodiment, the display (230) may be coupled to or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer (not shown) configured to detect a magnetic field-type stylus pen.

[0088] According to one embodiment, the first display area (231) and the second display area (232) may have an overall symmetrical shape centered on the folding area (233). According to one embodiment (not shown), the second display area (232), unlike the first display area (231), may include a cut notch depending on the presence of the sensor area (224), but may have a shape that is substantially symmetrical with respect to the first display area (231) in other areas. For example, the first display area (231) and the second display area (232) may include a portion having a symmetrical shape with respect to each other and a portion having an asymmetrical shape with respect to each other.

[0089] Hereinafter, the operation of the first housing (210) and the second housing (220) and each area of ​​the display (230) according to the state of the electronic device (101) (e.g., flat state or unfolded state and folded state) will be described.

[0090] According to one embodiment, when the electronic device (101) is in a flat state (e.g., FIG. 2), the first housing (210) and the second housing (220) may be arranged to face the same direction at a substantially 180-degree angle. The surface of the first display area (231) of the display (230) and the surface of the second display area (232) may form a 180-degree angle with each other and face the same direction (e.g., toward the front of the electronic device). The folding area (233) may form the same plane as the first display area (231) and the second display area (232).

[0091] According to one embodiment, when the electronic device (101) is in a folded state (e.g., FIG. 3), the first housing (210) and the second housing (220) may be arranged to face each other. The surface of the first display area (231) of the display (230) and the surface of the second display area (232) may form a narrow angle (e.g., between about 0 and 10 degrees) with each other and may face each other. When the electronic device (101) is in a folded state, at least a portion of the folding area (233) may be formed as a curved surface having a predetermined curvature.

[0092] According to one embodiment, when the electronic device (101) is in an intermediate state (not shown), the first housing (210) and the second housing (220) may be arranged at a certain angle with respect to each other. The surface of the first display area (231) of the display (230) and the surface of the second display area (232) may form an angle that is greater than the angle in the folded state and less than the angle in the unfolded state. The folding area (233) may be formed as a curved surface having at least a certain curvature, and the curvature at this time may be less than that in the folded state.

[0093] FIG. 4 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0094] The embodiment of FIG. 4 can be combined with the embodiments of FIGS. 1 to 3, or the embodiments of FIGS. 5 to 27.

[0095] Referring to FIG. 4, an electronic device (101) (e.g., the electronic device (101) of FIGS. 2 to 3) may include a housing (201), a display (230), a hinge structure (202), a battery (250), and a circuit board (260). For example, the housing (201) may include a first housing (210), a second housing (220), a first rear cover (280), and a second rear cover (290). In one embodiment, the housing (201) may be understood to include a hinge cover (240). The configuration of the first housing (210), the second housing (220), the hinge cover (240), the first rear cover (280), and the second rear cover (290) of FIG. 4 may be all or part of the same as the configuration of the first housing (210), the second housing (220), the hinge cover (240), the first rear cover (280), and the second rear cover (290) of FIG. 2 and / or FIG. 3.

[0096] According to one embodiment, the first housing (210) and the second housing (220) can be assembled to each other so as to be coupled to both sides of the hinge structure (202). For example, the hinge structure (202) can be arranged in a hinge area between the first housing (210) and the second housing (220) to rotatably couple the first housing (210) and the second housing (220). Here, the 'hinge area' may refer to a space in which the hinge structure (202) is arranged, an area at least partially surrounded by the hinge cover (240), and / or a space between the folding area (233) of the display (230) and the hinge cover (240). In one embodiment, the hinge area may be understood as a space arranged substantially corresponding to the folding area (233).

[0097] According to one embodiment, the hinge structure (202) may connect the first housing (210) and the second housing (220) so that the first housing (210) and the second housing (220) can rotate relative to each other. The hinge structure (202) may be covered by a hinge cover (240). The electronic device (101) may include a hinge assembly including the hinge structure (202) and the hinge cover (240).

[0098] In one embodiment, the hinge structure (202) may provide a folding axis (Ax) (e.g., the folding axis (Ax) of FIG. 2). The hinge structure (202) may be connected to a first plate (212) (e.g., a first bracket) of a first housing (210) and a second plate (222) (e.g., a second bracket) of a second housing (220). The housings (210, 220) may be coupled to the hinge structure (202) and may rotate with respect to the hinge structure (202) or the hinge cover (240).

[0099] According to one embodiment, the first housing (210) may include a first plate (212) (e.g., a first support member or a first support area) capable of supporting a component of the electronic device (101) (e.g., a first circuit board (262) and / or a first battery (252)) and a first side wall (211) surrounding at least a portion of the first plate (212). The first side wall (211) may include a first side surface of the electronic device (101) (e.g., the first side surface (210c) of FIG. 2). According to one embodiment, the second housing (220) may include a second plate (222) (e.g., a second support member or a second support area) capable of supporting components of the electronic device (101) (e.g., a second circuit board (264) and / or a second battery (254)) and a second side wall (221) surrounding at least a portion of the second plate (222). The second side wall (221) may include a second side surface of the electronic device (101) (e.g., the second side surface (220c) of FIG. 2).

[0100] According to one embodiment, the first side wall (211) or the second side wall (221) may be understood as a frame shape that at least partially surrounds the space between the front and the back of the electronic device (101) (e.g., the first housing (210) or the second housing (220)). In one embodiment, the plates (212, 222) may have a structure extending from one of the side walls (211, 221). For example, for convenience of explanation, the plates (212, 222) and the side walls (211, 221) are described separately, but the embodiment(s) of the present disclosure are not limited thereto, and the plates (212 or 222) and the side walls (211 or 221) may be implemented as a single body. In one embodiment, the plates (212 or 222) and the side walls (211 or 221) may be implemented by combining an insulating material and an electrically conductive material, in which case the housings (210, 220) may be implemented by integrally forming the plates (212 or 222) and the side walls (211 or 221) through an insert injection process and / or a computer numerical control machining process.

[0101] In one embodiment, a portion of at least one of the housings (210, 220) may function as an antenna. For example, the portion of the electronic device (101) that functions as an antenna may embody at least a portion of a side surface of at least one of the housings (210, 220).

[0102] According to one embodiment, the portion functioning as an antenna of the electronic device (101) may be arranged adjacent to at least one side surface of the housings (210, 220) and / or oriented in a direction intersecting the Z-axis (e.g., X-axis direction or Y-axis direction). For example, the portion functioning as an antenna of the electronic device (101) may be implemented by a portion of the housings (210, 220), or may be manufactured as a separate component from the housings (210, 220) and arranged adjacent to an edge of the housings (210, 220). According to one embodiment, the phrase "the portion functioning as an antenna of the electronic device (101) is implemented by a portion of the housings (210, 220)" may be understood to include, for example, an example in which the portion functioning as an antenna is arranged to form a side surface of at least one of the housings (210, 220).

[0103] Although not shown, the first housing (210) may include a first waterproof member arranged on the first plate (212), and the second housing (220) may include a second waterproof member arranged on the second plate (222). The first waterproof member and / or the second waterproof member may be arranged in a gap between the display (230) and the plates (212, 222) to prevent moisture or foreign substances from entering the interior of the first housing (210) and / or the second housing (220) from the outside.

[0104] According to one embodiment, the display (230) (e.g., a flexible display or a foldable display) may include a first display area (231), a second display area (232), and / or a folding area (233). The configurations of the first display area (231), the second display area (232), and the folding area (233) of FIG. 4 may be partially or entirely identical to the configurations of the first display area (231), the second display area (232), and the folding area (233) of FIG. 2.

[0105] According to one embodiment, the electronic device (101) may further include a sub-display (234). The sub-display (234) may display a screen in a different direction from the display areas (231, 232). For example, the sub-display (234) may output a screen in a direction opposite to the first display area (231). According to one embodiment, the sub-display (234) may be disposed on the first rear cover (280). For example, the sub-display (234) may be disposed between the first rear cover (280) and the first plate (212).

[0106] According to one embodiment, the electronic device (101) may include a camera assembly (204) comprising a plurality of cameras (e.g., the camera module (206) of FIG. 2 or 3). Although not shown, the electronic device (101) may further include a camera that captures a subject by penetrating a portion of the display (230) (e.g., the first display area (231) or the second display area (232)) or a camera that captures a subject by penetrating a portion of the sub-display (234).

[0107] In one embodiment, the electronic device (101) and / or the second rear cover (290) may include a cover plate (299) arranged correspondingly to the camera assembly (204). The cover plate (299) may, for example, provide an optical path (e.g., a through hole) corresponding to the camera assembly (204) while allowing the optical path to be harmonized with the exterior of the electronic device (101). To provide aesthetic appeal to the exterior of the electronic device (101) or to realize a harmonious appearance, the cover plate (299) may include a metal material. For example, the cover plate (299) may be made of a metal material or may be finished (e.g., printed, deposited, coated, or plated) with a metal material. In one embodiment, the cover plate (299) may be understood as a part of the second rear cover (290), with a portion (e.g., an edge) disposed inside the second rear cover (290) and another portion exposed to the exterior.

[0108] In one embodiment, the battery (250) may include a first battery (252) disposed within the first housing (210) and a second battery (254) disposed within the second housing (220). In one embodiment, the first battery (252) may be connected to the first circuit board (262), and the second battery (254) may be connected to the second circuit board (264). In one embodiment, the battery (250) may supply power to at least one component of the electronic device (101). In one embodiment, the battery (250) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0109] In one embodiment, the circuit board (260) may include a first circuit board (262) disposed within a first housing (210) and a second circuit board (264) disposed within a second housing (220). In one embodiment, the first circuit board (262) and the second circuit board (264) may be electrically connected by at least one flexible printed circuit board (266). In one embodiment, at least a portion of the flexible printed circuit board (266) may be disposed across a hinge region or a hinge structure (e.g., hinge structure (202)). In one embodiment, the first circuit board (262) and the second circuit board (264) may be disposed within a space formed by the first housing (210), the second housing (220), the first rear cover (280), and the second rear cover (290). Components for implementing various functions of the electronic device (101) can be placed on the first circuit board (262) and the second circuit board (264).

[0110] According to one embodiment, the electronic device (101) may include speakers (208a, 208b). According to one embodiment, the speakers (208a, 208b) may convert electrical signals into sound. According to one embodiment, the speakers (208a, 208b) may be disposed within a space formed by the first housing (210), the second housing (220), the first rear cover (280), and the second rear cover (290). According to one embodiment, the speakers (208a, 208b) may include an upper speaker (208a) positioned at the top (+Y direction) of the electronic device (101) and a lower speaker (208b) positioned at the bottom (-Y direction) of the electronic device (101). In the present disclosure, the speakers (208a, 208b) are illustrated as being positioned within one housing (e.g., the first housing (210) of FIG. 4), but this is an optional structure. For example, the speakers (208a, 208b) may be located within at least one of the first housing (210) or the second housing (220). The configuration of the speakers (208a, 208b) of FIG. 4 may be all or part of the same as the configuration of the sound output module (155) of FIG. 1.

[0111] According to one embodiment, the electronic device (101) may include a rear member (270) (or rear case). According to one embodiment, the rear member (270) may be disposed within the housing (201) (e.g., the second housing (220)). According to one embodiment, the rear member (270) may accommodate at least one antenna (275). In one embodiment, the rear member (270) may function as a structure for disposing the antenna (275) and may function as a structure for supporting or protecting one of the circuit boards (262, 264). For example, a portion of the rear member (270) indicated by reference numeral '279' may support a portion of the circuit board (262, 264).

[0112] According to one embodiment, the electronic device (101) may include an antenna (275). The antennas (275a, 275b) may include, for example, an ultra wide band (UWB) antenna (275a), a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna (275b). The antenna (275) may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging.

[0113] In one embodiment, an antenna structure may be formed by a portion or a combination of the housing (201). For example, the antenna (275) may include a communication antenna (275c). The communication antenna (275c) may be used for communication with an external electronic device (e.g., Wi-Fi). For example, the communication antenna (275c) may be positioned on the upper portion (271a) or the lower portion (271b) of the rear member (270). In addition, the electronic device (101) may further include additional antennas positioned adjacent to portions of the side walls (211, 221) or electronic components such as the camera assembly (204).

[0114] According to one embodiment, the first plate (212) may be disposed between the first display area (231) and the first rear cover (280). The first display area (231) may be disposed on one surface of the first plate (212) (e.g., the surface facing the +Z direction in FIG. 4). The first rear cover (280) may be disposed below the other surface of the first plate (212) (e.g., the surface facing the -Z direction in FIG. 4).

[0115] According to one embodiment, the first battery (252) and the first circuit board (262) may be disposed on the other surface of the first plate (212) (e.g., the surface facing the -Z direction in FIG. 4). For example, the first battery (252) and the first circuit board (262) may be disposed between the first plate (212) and the first rear cover (280). The first plate (212) may be disposed between the first display area (231) and the first battery (252). The first plate (212) may be disposed between the first display area (231) and the first circuit board (262).

[0116] According to one embodiment, the second plate (222) may be disposed between the second display area (232) and the second rear cover (290). The second display area (232) may be disposed on one surface of the second plate (222) (e.g., the surface facing the +Z direction in FIG. 4 ). The second rear cover (290) may be disposed below the other surface of the second plate (222) (e.g., the surface facing the -Z direction in FIG. 4 ).

[0117] According to one embodiment, the second battery (254) and the second circuit board (264) may be disposed on the other surface of the second plate (222) (e.g., the surface facing the -Z direction in FIG. 4). For example, the second battery (254) and the second circuit board (264) may be disposed between the second plate (222) and the second rear cover (290). The second plate (222) may be disposed between the second display area (232) and the second battery (254). The second plate (222) may be disposed between the second display area (232) and the second circuit board (264).

[0118] According to one embodiment, at least one electrical component (e.g., a processor (120) and / or a memory (130) of FIG. 1) may be disposed on and / or mounted on a circuit board (260). The at least one electrical component may generate heat during operation. The electronic device (101) may include a heat dissipation member (e.g., a heat dissipation member (300) of FIG. 5) configured to dissipate heat generated from the at least one electrical component.

[0119] Hereinafter, the second housing (220) and the heat dissipation member (300) disposed inside the second housing (220) will be described with reference to FIGS. 5 to 27 as examples. Although not shown, the electronic device (101) may further include the first housing (210) and another heat dissipation member (not shown) disposed inside the first housing (210). The other heat dissipation member may be applied selectively and may be omitted depending on the embodiment. For example, when the electronic device (101) includes the other heat dissipation member, the description of the second housing (220) and the heat dissipation member (300) may be applied identically or similarly to the first housing (210) and the other heat dissipation member.

[0120] FIG. 5 is a perspective view showing a heat dissipation member and a second housing according to one embodiment of the present disclosure.

[0121] FIG. 6 is a perspective view showing a heat dissipation member and a second housing according to one embodiment of the present disclosure.

[0122] FIG. 7 is a perspective view showing an inner wall and an opening of a second housing according to one embodiment of the present disclosure.

[0123] FIG. 8 is a perspective view showing a state in which a heat dissipation member and a guide member are arranged in an opening according to one embodiment of the present disclosure.

[0124] FIG. 9 is a plan view showing a heat dissipation member, a guide member, and an inner wall according to one embodiment of the present disclosure.

[0125] FIG. 10 is a drawing showing a guide member and a heat dissipation member according to one embodiment of the present disclosure.

[0126] The embodiments of FIGS. 5 to 10 can be combined with the embodiments of FIGS. 1 to 4, or the embodiments of FIGS. 11 to 27.

[0127] The configurations of FIGS. 5 to 10 may be partially or entirely identical to the configurations of FIGS. 1 to 4 or the configurations of FIGS. 11 to 27.

[0128] The embodiments of FIGS. 5 to 10 can be combined with the embodiments of FIGS. 1 to 4, or the embodiments of FIGS. 11 to 27.

[0129] Referring to FIGS. 5 to 10, an electronic device (101) (e.g., the electronic device (101) of FIGS. 2 to 4) may include a first housing (e.g., the first housing (210) of FIG. 4), a second housing (220) (e.g., the second housing (220) of FIG. 4), a sub-display (234) (e.g., the sub-display (234) of FIG. 4), a first rear cover (280) (e.g., the first rear cover (280) of FIG. 4), or a heat dissipation member (300).

[0130] Referring to FIGS. 5 and 6, the second housing (220) may include a second side wall (221) (e.g., the second side wall (221) of FIG. 4) and a second plate (222) (e.g., the second plate (222) of FIG. 4).

[0131] According to one embodiment, the second plate (222) may include a front surface (e.g., a surface facing the +Z direction in FIGS. 5 and 6 ) and a back surface (222b) opposite to the front surface (e.g., a surface facing the -Z direction in FIGS. 5 and 6 ). A first display area (e.g., the first display area (231) in FIG. 4 ) of a flexible display (e.g., the display (230) in FIG. 4 ) may be disposed on the front surface (e.g., the front surface (222a) in FIGS. 11 and 12 ) of the second plate (222). A heat dissipation member (300), a second battery (e.g., the second battery (254) in FIG. 4 ), and a second circuit board (e.g., the second circuit board (264) in FIG. 4 ) may be disposed on the back surface (222b) of the second plate (222).

[0132] According to one embodiment, the second housing (220) may include an internal space defined by a second plate (222), a second side wall (221), and a second rear cover (e.g., the second rear cover (290) of FIG. 4). Various components, such as a heat dissipation member (300), a second battery, and a second circuit board, may be placed in the internal space of the second housing (220).

[0133] According to one embodiment, the second housing (220) may include an inner wall (225). The inner wall (225) may protrude from the rear surface (222b) of the second plate (222) toward the second rear cover (e.g., the second rear cover (290) of FIG. 4). The inner wall (225) may extend in a first direction (e.g., the X-axis direction of FIGS. 5 and 6). The first direction may be, but is not limited to, a direction substantially perpendicular to an axial direction (e.g., the Y-axis direction of FIG. 5) of a folding axis (e.g., the folding axis (Ax) of FIGS. 2 and 4).

[0134] According to one embodiment, the inner wall (225) may divide the inner space of the second housing (220) into a plurality of regions. For example, the inner space of the second housing (220) may include a first space (223a) and a second space (223b). The inner wall (225) may be positioned between the first space (223a) and the second space (223b).

[0135] According to one embodiment, a second circuit board (e.g., the second circuit board (264) of FIG. 4) may be placed in the first space (223a). The second circuit board may be accommodated in the first space (223a).

[0136] According to one embodiment, a second battery (e.g., the second battery (254) of FIG. 4) may be placed in the second space (223b). The second battery may be accommodated in the second space (223b).

[0137] In one embodiment, the second battery may be spaced apart from the second circuit board with an inner wall (225) therebetween. The second battery may face the second circuit board with the inner wall (225) therebetween. The inner wall (225) may be defined and / or referred to as a battery wall (225).

[0138] According to one embodiment, the second housing (220) may include a first receiving portion (2231a) formed in at least a portion of the second plate (222). The first receiving portion (2231a) may be positioned in the first space (223a). The first receiving portion (2231a) may include a recess or groove that is sunken from the rear surface (222b) of the second plate (222) toward the front surface. The first receiving portion (2231a) may include a hole or opening that penetrates from the rear surface (222b) of the second plate (222) to the front surface. The first receiving portion (2231a) may accommodate at least a portion of the first heat dissipation area (310) of the heat dissipation member (300). The edge of the first heat dissipation area (310) of the heat dissipation member (300) may be seated on the first inner edge of the second plate (222) adjacent to the first receiving portion (2231a). The first inner edge of the second plate (222) may define the first receiving portion (2231a).

[0139] According to one embodiment, the thickness of the electronic device (101) (e.g., the thickness in the Z-axis direction of FIG. 5) can be reduced as at least a portion of the first heat dissipation region (310) is disposed in the first receiving portion (2231a).

[0140] According to one embodiment, the second housing (220) may include a second receiving portion (2231b) formed in another portion of the second plate (222). The second receiving portion (2231b) may be located in the second space (223b). The second receiving portion (2231b) may include a recess or groove that is sunken from the rear surface (222b) of the second plate (222) toward the front surface. The second receiving portion (2231b) may include a hole or opening that penetrates from the rear surface (222b) of the second plate (222) to the front surface. The second receiving portion (2231b) may accommodate at least a portion of the second heat dissipation area (320) of the heat dissipation member (300). The edge of the second heat dissipation area (320) of the heat dissipation member (300) may be seated on the second inner edge of the second plate (222) adjacent to the second receiving portion (2231b). The second inner edge of the second plate (222) may define the second receiving portion (2231b).

[0141] According to one embodiment, the thickness of the electronic device (101) (e.g., the thickness in the Z-axis direction of FIG. 5) can be reduced as at least a portion of the second heat dissipation region (320) is disposed in the first receiving portion (2231a).

[0142] According to one embodiment, a heat dissipation member (300) may be disposed inside the second housing (220). The heat dissipation member (300) may include a heat dissipation material. The heat dissipation member (300) may dissipate heat generated from the second circuit board and electrical components disposed on the second circuit board. The heat dissipation member (300) may be defined and / or referred to as a heat diffusion member (300) including a heat diffusion material. For example, the heat dissipation member (300) may be configured to transfer heat generated from the second circuit board to the second battery. For example, the heat dissipation member (300) may extend from the second circuit board to the second battery.

[0143] According to one embodiment, the heat dissipation member (300) may include a vapor chamber. For example, the vapor chamber may include a flexible copper clad laminate (FCCL). The vapor chamber may include a metal plate forming an exterior (e.g., a copper layer and a polyimide (PI) film laminated on the copper layer), and a fluid contained within the metal plate.

[0144] According to one embodiment, the heat dissipation member (300) may include a first heat dissipation area (310), a second heat dissipation area (320), and a bending area (330) (e.g., a first bending area).

[0145] According to one embodiment, the first heat dissipation area (310) may be arranged in the first space (223a). The first heat dissipation area (310) may be mounted on the rear surface (222b) of the second plate (222).

[0146] According to one embodiment, the first heat dissipation area (310) can be at least partially accommodated in the first receiving portion (2231a). An edge of the first heat dissipation area (310) can be seated or positioned on a first inner edge of the second plate (222) defining the first receiving portion (2231a).

[0147] According to one embodiment, the first heat dissipation area (310) may have a flat shape. For example, the first heat dissipation area (310) may be referred to as a first planar area.

[0148] According to one embodiment, the first heat dissipation area (310) may be connected to a second circuit board (e.g., the second circuit board (264) of FIG. 4). At least a portion of the first heat dissipation area (310) may be in contact with the second circuit board.

[0149] According to one embodiment, the second heat dissipation area (320) may be arranged in the second space (223b). The second heat dissipation area (320) may be mounted on the rear surface (222b) of the second plate (222).

[0150] According to one embodiment, the second heat dissipation region (320) can be at least partially accommodated in the second receiving portion (2231b). An edge of the second heat dissipation region (320) can be seated or positioned on a second inner edge of the second plate (222) defining the second receiving portion (2231b).

[0151] According to one embodiment, the second heat dissipation area (320) may have a flat shape. For example, the second heat dissipation area (320) may be referred to as a second planar area.

[0152] According to one embodiment, the second heat dissipation area (320) may be connected to a second battery (e.g., the second battery (254) of FIG. 4). At least a portion of the second heat dissipation area (320) may be in contact with the second battery.

[0153] According to one embodiment, the flexure region (330) can be connected to the first heat dissipation region (310) and the second heat dissipation region (320). The flexure region (330) can be at least partially bendable. The flexure region (330) can be configured to be bendable.

[0154] According to one embodiment, the first heat dissipation region (310), the second heat dissipation region (320), and the bend region (330) may be integrally formed. For example, the first heat dissipation region (310), the second heat dissipation region (320), and the bend region (330) may form a single body.

[0155] According to one embodiment, the curved area (330) may have a corrugated shape. Since the curved area (330) has a corrugated shape, the curved area (330) can be easily bent or unfolded. The curved area (330) may be referred to as a connecting area, a folding area, or a flexible area.

[0156] According to one embodiment, the heat dissipation member (300) may be configured to transfer heat generated from the second circuit board to the second battery. For example, heat generated from the second circuit board may be transferred to the second battery through the first heat dissipation region (310), the bend region (330), and the second heat dissipation region (320). Accordingly, heat generated from the second circuit board and components of the second circuit board may be effectively dispersed.

[0157] In one embodiment, a curved region (330) having a wrinkled shape may be disposed on the inner wall (225). For example, at least a portion of the curved region (330) may be disposed in an opening formed in the inner wall (225) (e.g., the opening (226) of FIGS. 7 and 8). In one embodiment, a surface of at least a portion of the heat dissipation member (300) disposed in the opening (e.g., the opening (226) of FIGS. 7 and 8) may include the curved region (330).

[0158] Referring to FIG. 5, a state in which a curved region (330) of a heat dissipation member (300) is disposed in an opening of an inner wall (225) (e.g., an opening (226) of FIGS. 7 and 8) is illustrated. In addition, a state in which the heat dissipation member (300) is folded based on the curved region (330) is illustrated. For example, when assembling the heat dissipation member (300) to the second housing (220) and / or the second plate (222), the second heat dissipation region (320) may be inserted into the opening of the inner wall (225) and then passed through the opening to be positioned in the second space (223b). When the second heat dissipation region (320) passes through the opening of the inner wall (225), the curved region (330) may be disposed in the opening of the inner wall (225), and the first heat dissipation region (310) may be positioned in the first space (223a).

[0159] Referring to FIG. 6, a state in which a curved region (330) of a heat dissipation member (300) is positioned at an opening of an inner wall (225) is illustrated. In addition, an unfolded state of the heat dissipation member (300) based on the curved region (330) is illustrated. For example, when a heat dissipation member (300) in a folded state as in FIG. 5 is unfolded, the heat dissipation member (300) can be positioned on the rear surface (222b) of the second plate (222) as in FIG. 6.

[0160] According to one embodiment, since the heat dissipation member (300) includes a curved region (330), the heat dissipation member (300) can easily pass through an opening formed in the inner wall (225). In addition, the curved region (330) of the heat dissipation member (300) can be arranged or positioned in the opening formed in the inner wall (225).

[0161] According to one embodiment, since the second housing (220) includes an inner wall (225), the second housing (220) and / or the electronic device (101) can secure rigidity against dropping. For example, when the second housing (220) and / or the electronic device (101) is dropped, the inner wall (225) can limit and / or reduce distortion of the second plate (222) and / or the second housing (220).

[0162] Referring to FIG. 7, an opening (226) formed in an inner wall (225) is illustrated. The opening (226) may be referred to as a slit. The opening (226) may extend along a direction in which the inner wall (225) extends (e.g., the X-axis direction of FIG. 7). For example, the opening (226) may extend in a first direction.

[0163] According to one embodiment, the opening (226) may extend from one side of the inner wall (225) (e.g., the side facing the +Y direction in FIG. 7) to the other side (e.g., the side facing the -Y direction in FIG. 7).

[0164] Referring to FIG. 8, a state is illustrated in which at least a portion of the bending region (330) is accommodated in the opening (226).

[0165] According to one embodiment, an electronic device (e.g., the electronic device (101) of FIGS. 2 to 6) may further include a protective member (400).

[0166] According to one embodiment, the protective member (400) may surround the curved region (330). For example, the protective member (400) may have a loop shape that surrounds the curved region (330). The protective member (400) may include, but is not limited to, PTEE (Polytetrafluoroethylene), sponge, or rubber. The protective member (400) may be configured to protect the surface of the curved region (330). The protective member (400) may be defined and / or referred to as a guide member (400).

[0167] According to one embodiment, at least a portion of the bending region (330) may be disposed inside the protective member (400).

[0168] According to one embodiment, the heat dissipation member (300) can be inserted into the opening (226) with the curved region (330) inserted into the protective member (400). The protective member (400) can be placed in the opening (226). As the protective member (400) surrounds the curved region (330), the curved region (330) may not directly hit the inner edge of the inner wall (225) defining the opening (226). When assembling the heat dissipation member (300) or when the electronic device (101) is dropped, the surface of the curved region (330) can be protected by the protective member (400) and may not directly hit the inner edge of the inner wall (225) defining the opening (226). Accordingly, damage to the curved region (330) and the surface of the curved region (330) can be limited and / or reduced.

[0169] According to one embodiment, the curved region (330) may include at least one recess (331). The at least one recess (331) may include a recessed portion from at least a portion of the curved region (330). The at least one recess (331) may include a concave portion formed in at least a portion of the curved region (330). The at least one recess (331) may also be defined and / or referred to as a wrinkled portion.

[0170] According to one embodiment, at least one recess (331) may extend along the curved region (330). For example, the direction in which the inner wall (225) extends may be defined as a first direction (e.g., the X-axis direction of FIG. 8). The length of the at least one recess (331) in the first direction may be substantially equal to, but is not limited to, the length (L) of the curved region (330) in the first direction.

[0171] Referring to FIG. 9, a state in which a protective member (400) and a bending region (330) are placed in an opening of an inner wall (225) (e.g., opening (226) of FIGS. 7 and 8) is illustrated.

[0172] Referring to FIG. 10, a state in which a protective member (400) is combined with a bending region (330) is illustrated.

[0173] Referring to FIG. 9, the inner wall (225) may have a first width (e.g., the first width (t1) of FIG. 12) in a second direction (e.g., the Y-axis direction of FIG. 8). The second direction may be substantially perpendicular to the first direction. The second direction may be substantially parallel to an axial direction (e.g., the Y-axis direction of FIG. 9) of a folding axis (e.g., the folding axis (Ax) of FIGS. 2 and 4).

[0174] According to one embodiment, the protective member (400) may have a second width in the second direction (e.g., the second width (t2) of FIG. 12). The second width may be greater than the first width.

[0175] According to one embodiment, when looking at the inner wall (225) from above (e.g., when looking from the -Z direction to the +Z direction in FIGS. 8 and 9), at least a portion of the protective member (400) may overlap the inner wall (225), and remaining portions of the protective member (400) may be exposed or protrude from the inner wall (225).

[0176] Referring to FIGS. 9 and 10, since the width of the protective member (400) is greater than the width of the inner wall (225), the bending area (330) of the heat dissipation member (300) can be restricted from being excessively bent or folded during assembly. Accordingly, damage to the heat dissipation member (300) can be restricted and / or prevented.

[0177] FIG. 11 is a cross-sectional view taken along line AA' of FIG. 2 according to one embodiment of the present disclosure.

[0178] The embodiment of FIG. 11 can be combined with the embodiments of FIGS. 1 to 10, or the embodiments of FIGS. 12 to 27.

[0179] The configurations of FIG. 11 may be partially or entirely identical to the configurations of FIGS. 1 to 10, or the configurations of FIGS. 12 to 27.

[0180] Referring to FIG. 11, an electronic device (101) (e.g., the electronic device (101) of FIGS. 2 to 6) may include a second plate (222) (e.g., the second plate (222) of FIGS. 5 to 6).

[0181] According to one embodiment, a second display area (232) (e.g., the second display area (232) of FIG. 4) of a flexible display (230) (e.g., the display (230) of FIG. 4) may be arranged on the front surface (222a) of the second plate (222).

[0182] According to one embodiment, a second rear cover (290) (e.g., the second rear cover (290) of FIG. 4) may be placed on the rear surface (222b) of the second plate (222).

[0183] According to one embodiment, an opening (226) may be formed in the inner wall (225) formed in the second plate (222).

[0184] According to one embodiment, the opening (226) can accommodate a protective member (400).

[0185] According to one embodiment, the protective member (400) may include a hole (401). The hole (401) may accommodate a curved region (330) (e.g., the curved region (330) of FIGS. 5 to 6) of a heat dissipation member (300) (e.g., the heat dissipation member (300) of FIGS. 5 to 6). The hole (401) may be connected, coupled, or adhered to the curved region (330).

[0186] In one embodiment, as the curved region (330) is accommodated in the hole (401) of the protective member (400), the curved region (330) may not directly collide with the inner edge of the inner wall (225) defining the opening (226). For example, the protective member (400) may be disposed between the curved region (330) and the inner edge of the inner wall (225). The protective member (400)

[0187] FIG. 12 is a cross-sectional view taken along line AA' of FIG. 2 according to one embodiment of the present disclosure.

[0188] The embodiment of FIG. 12 can be combined with the embodiments of FIGS. 1 to 11, or the embodiments of FIGS. 13 to 27.

[0189] The configurations of FIG. 12 may be partially or entirely identical to the configurations of FIGS. 1 to 11, or the configurations of FIGS. 13 to 27.

[0190] Referring to FIG. 12, an electronic device (101) (e.g., the electronic device (101) of FIGS. 2 to 6) may include a second plate (222) (e.g., the second plate (222) of FIGS. 5 to 6).

[0191] According to one embodiment, a second display area (232) (e.g., the second display area (232) of FIG. 4) of a flexible display (230) (e.g., the display (230) of FIG. 4) may be arranged on the front surface (222a) of the second plate (222).

[0192] According to one embodiment, a heat dissipation member (300) (e.g., the heat dissipation member (300) of FIGS. 5 to 6) may be placed on the rear surface (222b) of the second plate (222).

[0193] According to one embodiment, an opening (226) may be formed in the inner wall (225) formed on the second plate (222). According to one embodiment, the opening (226) may accommodate a protective member (400).

[0194] According to one embodiment, the protective member (400) may include a hole (401). The hole (401) may accommodate a curved region (330) (e.g., the curved region (330) of FIGS. 5 to 6) of a heat dissipation member (300) (e.g., the heat dissipation member (300) of FIGS. 5 to 6). The hole (401) may be connected, coupled, or adhered to the curved region (330).

[0195] According to one embodiment, the first heat dissipation area (310) (e.g., the first heat dissipation area (310) of FIGS. 5 and 6) may be connected to a second circuit board (264) (e.g., the second circuit board (264) of FIG. 4).

[0196] According to one embodiment, the second circuit board (264) may be disposed between the second plate (222) and the second rear cover (290). The second circuit board (264) may be positioned in a first space (e.g., the first space (223a) of FIGS. 5 and 6) of a second housing (e.g., the second housing (220) of FIGS. 5 and 6).

[0197] According to one embodiment, the second circuit board (264) may include a printed circuit board (PCB), a flexible printed circuit board (FPCB), or a rigid-flexible PCB (RF-PCB).

[0198] According to one embodiment, at least one electrical component that generates heat during operation (e.g., the processor (120) and / or memory (130) of FIG. 1) may be disposed on the second circuit board (264).

[0199] According to one embodiment, the second heat dissipation area (320) (e.g., the second heat dissipation area (320) of FIGS. 5 and 6) may be connected to a second battery (254) (e.g., the second battery (254) of FIG. 4).

[0200] According to one embodiment, the second battery (254) may be positioned between the second plate (222) and the second rear cover (290). The second battery (254) may be positioned in a second space (e.g., the second space (223b) of FIGS. 5 and 6) of a second housing (e.g., the second housing (220) of FIGS. 5 and 6).

[0201] In one embodiment, the second battery (254) may be spaced apart from the second circuit board (264) with an inner wall (225) therebetween. For example, the inner wall (225) may be positioned between the second battery (254) and the second circuit board (264).

[0202] According to one embodiment, the second battery (254) may include a front surface facing the plate (222) (e.g., a surface facing the +Z direction of FIG. 12) and a back surface opposite the front surface (e.g., a surface facing the -Z direction of FIG. 12).

[0203] In one embodiment, the curved region (330) may have a wrinkled shape. For example, the curved region (330) may be formed to be wrinkled by including at least one recess (331). In one embodiment, a slit may be formed on the surface of the curved region (330) so that the curved region (330) can bend well.

[0204] According to one embodiment, the heat dissipation member (300) may be configured to transfer heat generated from the second circuit board (264) and the electrical components of the second circuit board (264) to the second battery (254).

[0205] According to one embodiment, heat generated from the second circuit board (264) and the electrical components of the second circuit board (264) can be transferred to the second battery (254) through the first heat dissipation area (310), the bend area (330), and the second heat dissipation area (320).

[0206] According to one embodiment, one side of the inner wall (225) (e.g., the side facing the +Y direction in FIG. 12) may be spaced apart from the second circuit board (264). The other side of the inner wall (225) (e.g., the side facing the -Y direction in FIG. 12) may be spaced apart from the second battery (254).

[0207] In one embodiment, the second battery (254) may be spaced apart from or facing the second circuit board (264) with the inner wall (225) therebetween.

[0208] According to one embodiment, a first gap may be formed between a second circuit board (264) and one surface of the inner wall (225). A second gap may be formed between a second battery (254) and the other surface of the inner wall (225).

[0209] According to one embodiment, the inner wall (225) may have a first width (t1). The first width (t1) may be defined as the thickness from one side of the inner wall (225) to the other side. For example, the first width (t1) may be defined as the thickness of the inner wall (225) in a second direction (e.g., the Y-axis direction of FIG. 12).

[0210] According to one embodiment, a protective member (400) (e.g., the protective member (400) of FIGS. 9 and 10) disposed in an opening (226) of an inner wall (225) may have a second width (t2). The second width (t2) may be greater than the first width (t1).

[0211] According to one embodiment, the curved region (330) may have a third width (t3). The third width (t3) may be greater than the second width (t2). For example, the second width (t2) may be greater than the first width (t1) and less than the third width (t3).

[0212] FIG. 13 is a perspective view showing a state in which a heat dissipation member and a guide member are arranged in an opening according to one embodiment of the present disclosure.

[0213] FIG. 14 is a perspective view showing a state in which a heat dissipation member and a guide member are arranged in an opening according to one embodiment of the present disclosure.

[0214] The embodiments of FIGS. 13 and 14 can be combined with the embodiments of FIGS. 1 to 12, or the embodiments of FIGS. 15 to 27.

[0215] The configurations of FIGS. 13 and 14 may be partially or entirely identical to the configurations of FIGS. 1 to 12, or the configurations of FIGS. 15 to 27.

[0216] According to one embodiment, a protective member (410) (e.g., protective member (400) of FIGS. 9 and 10) can be accommodated in the opening (226). The shape and size of the protective member (410) can be formed to correspond to the shape and size of the opening (226). The protective member (410) can be inserted into the opening (226).

[0217] According to one embodiment, the protective member (410) may include a hole (411) (e.g., hole (401) of FIGS. 11 and 12). In the hole (411), a curved region (330) of the heat dissipation member (300) may be arranged.

[0218] According to one embodiment, the hole (411) of the protective member (410) may have a sufficient size to accommodate the curved area (330). For example, the size of the hole (411) may be larger than the size of the curved area (330), but is not limited thereto.

[0219] According to one embodiment, when assembling the heat dissipation member (300), the heat dissipation member (300) may be inserted into the hole (411) of the protection member (410) fixed to the opening (226), but is not limited thereto.

[0220] According to one embodiment, the curved region (330) of the heat dissipation member (300) may include at least one recess (331).

[0221] FIG. 15 is a perspective view showing a heat dissipation member and a second housing according to one embodiment of the present disclosure.

[0222] FIG. 16 is a perspective view showing a heat dissipation member and a second housing according to one embodiment of the present disclosure.

[0223] The embodiments of FIGS. 15 and 16 can be combined with the embodiments of FIGS. 1 to 14, or the embodiments of FIGS. 17 to 27.

[0224] The configurations of FIGS. 15 and 16 may be partially or entirely identical to the configurations of FIGS. 1 to 14, or the configurations of FIGS. 17 to 27.

[0225] Referring to FIG. 15, an electronic device (101) (e.g., the electronic device (101) of FIGS. 2 to 6) may include a heat dissipation member (300) (e.g., the heat dissipation member (300) of FIGS. 5 and 6).

[0226] According to one embodiment, the heat dissipation member (300) may be placed on the second plate (222).

[0227] According to one embodiment, the heat dissipation member (300) may include a first heat dissipation region (310), a second heat dissipation region (320), or a curved region (330).

[0228] According to one embodiment, the heat dissipation member (300) may include a first extended area (312) extending from at least a portion of the first heat dissipation area (310). The heat dissipation member (300) may include a second extended area (322) extending from at least a portion of the second heat dissipation area (320).

[0229] According to one embodiment, the first extension region (312) can be folded or unfolded relative to the first heat dissipation region (310). The second extension region (322) can be folded or unfolded relative to the second heat dissipation region (320).

[0230] According to one embodiment, the first heat dissipation region (310) may be connected to an upper surface (e.g., a surface facing the +Z direction of FIG. 12) of a second circuit board (e.g., the second circuit board (264) of FIG. 12). The first extension region (312) may be connected to a lower surface (e.g., a surface facing the -Z direction of FIG. 12) of the second circuit board. The first heat dissipation region (310) and the first extension region (312) may surround at least a portion of the second circuit board.

[0231] According to one embodiment, the second heat dissipation area (320) may be connected to an upper surface (e.g., a surface facing the +Z direction in FIG. 12) of a second battery (e.g., the second battery (254) in FIG. 12).

[0232] Referring to FIG. 16, the bending region (330) can be placed in the opening (226) of the inner wall (225).

[0233] According to one embodiment, the second housing (220) may include an expanded opening (227) formed on one side of the opening (226). The expanded opening (227) may be defined as at least a portion of the opening (226). The expanded opening (227) may be connected to the opening (226). The height of the expanded opening (227) (e.g., the height in the Z-axis direction of FIGS. 5 and 6) may be greater than the height of the opening (226) (e.g., the height in the Z-axis direction of FIGS. 5 and 6).

[0234] According to one embodiment, when the heat dissipation member (300) is assembled, the folding portion (323) connecting the second heat dissipation region (320) and the second extension region (322) can pass through the expansion opening (227). The folding portion (323) may have a wrinkled shape, but is not limited thereto.

[0235] According to one embodiment, when the second extension region (322) is arranged to be folded relative to the second heat dissipation region (320) (e.g., FIGS. 15 and 16), the second extension region (322) and the folding portion (323) can pass through the opening (226) and the expansion opening (227). When the second extension region (322) is arranged to be unfolded relative to the second heat dissipation region (320) (not shown), the second extension region (322) and the folding portion (323) can be arranged to be unfolded relative to the second heat dissipation region (320). The second heat dissipation region (320), the second extension region (322), and the folding portion (323) can be connected to the front surface (e.g., the surface facing the +Z direction in FIG. 12) of the second battery (e.g., the second battery (254) in FIG. 12).

[0236] FIG. 17 is a perspective view showing a curved region and a second plate according to one embodiment of the present disclosure.

[0237] FIG. 18 is a perspective view of a curved region and a second plate according to one embodiment of the present disclosure, viewed from a direction opposite to that of FIG. 17.

[0238] FIG. 19 is a perspective view showing a support plate according to one embodiment of the present disclosure.

[0239] The embodiments of FIGS. 17 to 19 can be combined with the embodiments of FIGS. 1 to 16, or the embodiments of FIGS. 20 to 27.

[0240] The configurations of FIGS. 17 to 19 may be partially or entirely identical to the configurations of FIGS. 1 to 16, or the configurations of FIGS. 20 to 27.

[0241] Referring to FIGS. 17 and 18, the second plate (222) (e.g., the second plate (222) of FIGS. 5 and 6) may include an opening (2261) (e.g., the opening (226) of FIG. 7). The opening (2261) may be located below the inner wall (225). The opening (2261) may be formed to penetrate from the front surface (222a) to the rear surface (222b) of the second plate (222).

[0242] According to one embodiment, at least a portion of a curved region (330) of a heat dissipation member (300) (e.g., the heat dissipation member (300) of FIGS. 5 and 6) may be disposed in the opening (2261).

[0243] According to one embodiment, at least a portion of the bend region (330) may be arranged to pass through an opening (2261) formed beneath the inner wall (225).

[0244] According to one embodiment, the first heat dissipation region (310) and the second heat dissipation region (320) may be disposed on the rear surface (222b) of the second plate (222).

[0245] Referring to FIG. 19, the electronic device (e.g., the electronic device (101) of FIGS. 5 and 6) may further include a support plate (500) covering the opening (2261). The support plate (500) may be placed on the front surface (222a) of the second plate (222) to cover the opening (2261). The support plate (500) may have a sufficient size so that the opening (2261) is not exposed. The support plate (500) may include, but is not limited to, stainless steel (STS).

[0246] According to one embodiment, the rigidity of the second plate (222) can be improved as the support plate (500) is positioned to cover the opening (2261) formed in the second plate (222). Accordingly, when the electronic device is dropped, the distortion of the second plate (222) can be limited and / or reduced.

[0247] FIG. 20 is a plan view showing a heat dissipation member and a second plate according to one embodiment of the present disclosure.

[0248] FIG. 21 is a plan view showing a heat dissipation member and a second plate according to one embodiment of the present disclosure, and is a view viewed from the opposite direction to FIG. 20.

[0249] FIG. 22 is a drawing showing a heat dissipation member and an opening according to one embodiment of the present disclosure.

[0250] FIG. 23 is a cross-sectional view taken along line CC' of FIG. 22 according to one embodiment of the present disclosure.

[0251] FIG. 24 is a cross-sectional view of a heat dissipation member and an electronic device according to one embodiment of the present disclosure.

[0252] The embodiments of FIGS. 20 to 24 can be combined with the embodiments of FIGS. 1 to 19, or the embodiments of FIGS. 25 to 27.

[0253] The configurations of FIGS. 20 to 24 may be partially or entirely identical to the configurations of FIGS. 1 to 20, or the configurations of FIGS. 25 to 27.

[0254] Referring to FIGS. 20 to 22, an electronic device (101) (e.g., the electronic device (101) of FIGS. 2 to 6) may include a heat dissipation member (300) (e.g., the heat dissipation member (300) of FIGS. 5 and 6).

[0255] According to one embodiment, the heat dissipation member (300) may include a first heat dissipation region (3101) (e.g., the first heat dissipation region (310) of FIGS. 5 and 6), a second heat dissipation region (3201) (e.g., the second heat dissipation region (320) of FIGS. 5 and 6), and a curved region (3301) (e.g., the curved region (3301) of FIGS. 5 and 6).

[0256] According to one embodiment, the first heat dissipation area (3101) may be disposed on the front surface (222a) of the second plate (222). The second heat dissipation area (3201) may be disposed on the rear surface (222b) of the second plate (222).

[0257] According to one embodiment, the second plate (222) may include an opening (2261) positioned below the inner wall (225) (e.g., the opening (2261) of FIGS. 17 and 18). The bending region (3301) may be positioned in the opening (2261).

[0258] According to one embodiment, the heat dissipation member (300) may extend from the front surface (222a) of the second plate (222) through the opening (2261) to the rear surface (222b) of the second plate (222).

[0259] Referring to FIG. 23, the first heat dissipation area (3101) may be positioned between the second display area (232) of the flexible display (230) (e.g., the second display area (232) of FIG. 4) and the front surface (222a) of the second plate (222).

[0260] According to one embodiment, the second heat dissipation region (3201) may be positioned between the rear surface (222b) of the second plate (222) and the second battery (254).

[0261] According to one embodiment, the heat dissipation member (300) may extend from the front surface (222a) of the second plate (222) through the opening (2261) of the second plate (222) to the rear surface (222b) of the second plate (222).

[0262] In one embodiment, the bend region (3301) may be positioned to pass through an opening (2261) formed beneath the inner wall (225).

[0263] Referring to FIG. 24, the first heat dissipation area (3101) may be positioned between the rear surface (222b) of the second plate (222) and the second circuit board (264).

[0264] According to one embodiment, the second heat dissipation area (3201) may be positioned between the second display area (232) of the flexible display (230) (e.g., the second display area (232) of FIG. 4) and the front surface (222a) of the second plate (222).

[0265] According to one embodiment, the heat dissipation member (300) may extend from the rear surface (222b) of the second plate (222) through the opening (2261) of the second plate (222) to the front surface (222a) of the second plate (222).

[0266] In one embodiment, the bend region (3301) may be positioned to pass through an opening (2261) formed beneath the inner wall (225).

[0267] FIG. 25 is a perspective view showing a heat dissipation member and an electronic device according to one embodiment of the present disclosure.

[0268] The embodiment of FIG. 25 can be combined with the embodiments of FIGS. 1 to 24, or the embodiments of FIGS. 26 to 27.

[0269] The configurations of FIG. 25 may be partially or entirely identical to the configurations of FIGS. 1 to 24, or the configurations of FIGS. 26 to 27.

[0270] Referring to FIG. 25, an electronic device (101) (e.g., the electronic device (101) of FIGS. 2 to 6) may include a heat dissipation member (300) (e.g., the heat dissipation member (300) of FIGS. 5 and 6) disposed on a second plate (222) (e.g., the second plate (222) of FIGS. 5 and 6).

[0271] According to one embodiment, the heat dissipation member (300) may include a first heat dissipation region (310), a second heat dissipation region (320), a curved region (330), and a third heat dissipation region (340).

[0272] According to one embodiment, the third heat dissipation region (340) may extend from the first heat dissipation region (310). The third heat dissipation region (340) may extend from the first heat dissipation region (310) toward the first housing (210) (e.g., the first housing (210) of FIG. 4).

[0273] In one embodiment, the third heat dissipation area (340) may include another bending area (341) (e.g., a second bending area). The other bending area (341) may allow at least a portion of the third heat dissipation area (340) to fold or unfold.

[0274] In one embodiment, the third heat dissipation region (340) may extend from the first heat dissipation region (310) into the inner space of the first housing (210). For example, the other curved region (341) may be arranged to cross a hinge structure (e.g., hinge structure (202) of FIG. 4) or a hinge cover (e.g., hinge cover (240) of FIG. 4).

[0275] According to one embodiment, the third heat dissipation region (340) can be at least partially folded or unfolded when the state of the electronic device (101) changes (e.g., when folded or unfolded), as the other bending region (341) can be bent.

[0276] FIG. 26 is a perspective view showing an electronic device and a heat dissipation member according to one embodiment of the present disclosure.

[0277] FIG. 27 is a cross-sectional view taken along line DD' of FIG. 26 according to one embodiment of the present disclosure.

[0278] The embodiments of FIGS. 26 and 27 can be combined with the embodiments of FIGS. 1 to 25.

[0279] The configurations of FIGS. 26 and 27 may be partially or entirely identical to the configurations of FIGS. 1 to 25.

[0280] Referring to FIG. 26, the electronic device (101) (e.g., the electronic device (101) of FIGS. 2 to 6) may include a first housing (610) (e.g., the first housing (210) of FIG. 4), a second housing (620) (e.g., the second housing (220) of FIG. 4), or a heat dissipation member (700) (e.g., the heat dissipation member (300) of FIGS. 5 and 6).

[0281] According to one embodiment, the heat dissipation member (700) may include a first heat dissipation area (710) (e.g., the first heat dissipation area (310) of FIGS. 5 and 6) disposed inside the first housing (610).

[0282] According to one embodiment, the heat dissipation member (700) may include a second heat dissipation area (720) (e.g., the second heat dissipation area (320) of FIGS. 5 and 6) disposed inside the second housing (620).

[0283] According to one embodiment, the heat dissipation member (700) may include a curved region (730) (e.g., curved region (330) of FIGS. 5 and 6) connected to a first heat dissipation region (710) and a second heat dissipation region (720).

[0284] In one embodiment, the curved region (730) may include at least one recessed or wrinkled shape. The curved region (730) may be at least partially curved or unfolded. For example, the heat dissipation member (700) may fold or unfold relative to the curved region (730).

[0285] In one embodiment, the flexure region (730) may be positioned across a hinge structure (e.g., hinge structure (202) of FIG. 4) that rotatably connects the first housing (610) and the second housing (620) with respect to each other.

[0286] Referring to FIG. 27, the electronic device (101) may include a first housing (610), a second housing (620), or a flexible display (630) (e.g., the display (230) of FIG. 4).

[0287] According to one embodiment, the first housing (610) may include a first plate (612) (e.g., the first plate (212) of FIG. 4) configured to support a flexible display (630) and a first battery (752) (e.g., the first battery (252) of FIG. 4).

[0288] According to one embodiment, the second housing (620) may include a second plate (622) (e.g., the second plate (222) of FIG. 4) configured to support a flexible display (630) and a second battery (754) (e.g., the second battery (754) of FIG. 4).

[0289] According to one embodiment, the electronic device (101) may include a hinge cover (640) (e.g., hinge cover (240) of FIG. 4) and a hinge structure (not shown) (e.g., hinge structure (202) of FIG. 4). The hinge cover (640) may be defined and / or referred to as a hinge housing. The hinge structure may be defined and / or referred to as a hinge assembly. According to one embodiment, the hinge assembly may be at least partially accommodated in the hinge housing (640). The hinge assembly may rotatably connect the first housing (610) and the second housing (620) with respect to each other.

[0290] According to one embodiment, the electronic device (101) may include a flexible printed circuit board (666) (e.g., the flexible printed circuit board (266) of FIG. 4).

[0291] According to one embodiment, the flexible printed circuit board (666) may be physically and / or electrically connected to a first circuit board (e.g., the first circuit board (262) of FIG. 4) disposed within the first housing (610) and a second circuit board (e.g., the second circuit board (264) of FIG. 4) disposed within the second housing (620). At least a portion of the flexible printed circuit board (666) may be disposed across the hinge structure or hinge cover (640).

[0292] In one embodiment, the flexible printed circuit board (666) can extend from the first circuit board toward the hinge cover (640) through a first hole (616) (e.g., a first opening) formed in at least a portion of a side surface of the first housing (610) (e.g., a side facing the +X direction of FIG. 27). The first hole (616) can face the hinge structure or the hinge cover (640). The first hole (616) can be disposed adjacent to the hinge structure or the hinge cover (640). In one embodiment, the first housing (610) can include a first opening (616) formed in a first side (e.g., at least a portion of the side surface facing the +X direction of FIG. 27) adjacent to the hinge cover (640) (e.g., the hinge housing). For example, the first side may form at least a portion of a side wall of the first housing (610).

[0293] According to one embodiment, the first housing (610) may include a first plate (612) connected to a first side and perpendicular to the first side. The first plate (612) may be connected to a first heat dissipation area (710) of a heat dissipation member (700).

[0294] In one embodiment, the flexible printed circuit board (666) can extend from the second circuit board toward the hinge cover (640) through a second hole (626) (e.g., a second opening) formed in at least a portion of a side surface (e.g., a side facing the -X direction of FIG. 27) of the second housing (620). The second hole (626) can face the hinge structure or the hinge cover (640). The second hole (626) can be disposed adjacent to the hinge structure or the hinge cover (640). In one embodiment, the second housing (620) can include a second opening (626) formed in a second side (e.g., at least a portion of the side surface facing the +X direction of FIG. 27) adjacent to the hinge cover (640) (e.g., the hinge housing). For example, the second side may form at least a portion of a side wall of the second housing (620).

[0295] According to one embodiment, the second housing (620) may include a second plate (622) connected to the second side and perpendicular to the second side. The second plate (622) may be connected to a second heat dissipation area (720) of the heat dissipation member (700).

[0296] According to one embodiment, the heat dissipation member (700) may include a first heat dissipation area (710) disposed on a first plate (612). The first heat dissipation area (710) may be disposed on a front surface of the first plate (612) (e.g., a surface facing the +Z direction in FIG. 27) or a rear surface of the first plate (612) (e.g., a surface facing the -Z direction in FIG. 27). The first heat dissipation area (710) may be connected to a first battery (752) or a first circuit board.

[0297] According to one embodiment, the heat dissipation member (700) may include a second heat dissipation area (720) disposed on a second plate (622). The second heat dissipation area (720) may be disposed on a front surface of the second plate (622) (e.g., a surface facing the +Z direction in FIG. 27) or a rear surface of the second plate (622) (e.g., a surface facing the -Z direction in FIG. 27). The second heat dissipation area (720) may be connected to a second battery (754) or a second circuit board.

[0298] According to one embodiment, the heat dissipation member (700) may include a curved region (730). The curved region (730) may be connected to the first heat dissipation region (710) and the second heat dissipation region (720). The curved region (730) may be at least partially foldable or unfoldable.

[0299] According to one embodiment, the flexure region (730) may include a first flexible portion (731), a second flexible portion (732), or a planar portion (733).

[0300] In one embodiment, the planar portion (733) (e.g., a planar area) can be disposed on the hinge cover (640). For example, the planar portion (733) can be secured to the hinge cover (640). For example, the planar area (733) can be at least partially attached to the inner surface of the hinge housing (640).

[0301] According to one embodiment, at least one portion of at least one of the first flexible portion (731) and the second flexible portion (732) may include a bending region.

[0302] In one embodiment, a first flexible portion (731) (e.g., the first portion) can connect a flat portion (733) and a first heat dissipation region (710). The first flexible portion (731) can be at least partially folded or unfolded. At least a portion of the first flexible portion (731) can be disposed in a first hole (616) of the first housing (610). The first flexible portion (731) can include at least one recess or a wrinkled shape. The first flexible portion (731) can be folded or unfolded when the state of the electronic device (101) changes (e.g., when folded or unfolded). In one embodiment, the heat dissipation member (700) can include a curved region (e.g., the first curved region) formed in the first portion (731) and disposed to penetrate the first opening (616).

[0303] In one embodiment, the second flexible portion (732) (e.g., the second portion) can connect the flat portion (733) and the first heat dissipation region (710). The second flexible portion (732) can be at least partially folded or unfolded. At least a portion of the second flexible portion (732) can be disposed in the second hole (626) of the second housing (620). The second flexible portion (732) can include at least one recess or a wrinkled shape. The second flexible portion (732) can be folded or unfolded when the state of the electronic device (101) changes (e.g., when folded or unfolded). In one embodiment, the heat dissipation member (700) can include a curved region (e.g., the second curved region) formed in the second portion (732) and disposed to penetrate the second opening (626).

[0304] An electronic device may include a circuit board comprising at least one electrical component (e.g., a processor or memory). The at least one electrical component disposed on the circuit board may generate heat during operation.

[0305] Since the above heat may reduce the operating efficiency of at least one electrical component disposed on the circuit board, the electronic device may include a heat dissipation member that transfers heat generated from the electrical component to another structure or another component.

[0306] However, due to the integration and miniaturization of electronic devices, it may be difficult to place heat dissipation components large enough to achieve sufficient heat dissipation performance. Furthermore, if a portion of the electronic device's structure is removed to accommodate the heat dissipation components, it may be difficult to ensure the rigidity of the electronic device.

[0307] According to one embodiment of the present disclosure, an electronic device can be provided that includes a heat dissipation structure capable of dissipating heat generated from a circuit board and securing rigidity of the electronic device.

[0308] However, the problem to be solved in this disclosure is not limited to the problem mentioned above, and may be expanded in various ways without departing from the spirit and scope of this disclosure.

[0309] According to one embodiment of the present disclosure, an electronic device may be provided that includes a heat dissipation structure in which sufficient space for disposing a heat dissipation member inside the electronic device is secured by disposing at least a portion of the heat dissipation member in an opening formed in an inner wall (e.g., a battery wall) disposed between a battery and a circuit board.

[0310] According to one embodiment of the present disclosure, an electronic device may be provided that includes a heat dissipation structure capable of limiting and / or reducing distortion of the electronic device and / or housing upon being dropped, by including a battery wall.

[0311] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0312] According to one embodiment of the present disclosure, an electronic device (101) may include a first housing (210).

[0313] According to one embodiment, the electronic device (101) may include a second housing (220) rotatably connected to the first housing (210) and including a plate (222), an inner wall (225) protruding from the plate (222), and an opening (226) formed in the inner wall (225).

[0314] According to one embodiment, the electronic device (101) may include a flexible display (230) disposed on the first housing (210) and the second housing (220).

[0315] According to one embodiment, the electronic device (101) may include a circuit board (264) disposed within the second housing (220).

[0316] According to one embodiment, the electronic device (101) may include a battery (254) disposed within the second housing (220) and spaced apart from the circuit board (264) with the inner wall (225) therebetween.

[0317] According to one embodiment, the electronic device (101) may include a heat dissipation member (300) extending from the circuit board (264) to the battery (254) and including a curved region (330) disposed at least partially in the opening (226) of the inner wall (225).

[0318] According to one embodiment, the heat dissipation member (300) may include a first heat dissipation area (310) connected to the circuit board (264).

[0319] According to one embodiment, the heat dissipation member (300) may include a second heat dissipation area (320) connected to the battery (254).

[0320] According to one embodiment, the heat dissipation member (300) may include a bending region (330) that is connected to the first heat dissipation region (310) and the second heat dissipation region (320) and configured to be bendable.

[0321] According to one embodiment, the electronic device (101) may further include a protective member (400) disposed in the opening (226) and surrounding at least a portion of the curved area (330).

[0322] According to one embodiment, the inner wall (225) may extend along a first direction and have a first width (t1) in a second direction substantially perpendicular to the first direction.

[0323] According to one embodiment, the protective member (400) may have a second width (t2) in the second direction.

[0324] According to one embodiment, the second width (t2) may be greater than the first width (t1).

[0325] According to one embodiment, the bending region (330) may have a third width (t3) in the second direction.

[0326] According to one embodiment, the third width (t3) may be greater than the second width (t2).

[0327] According to one embodiment, the curved region (330) may include at least one recess (331) extending along the first direction.

[0328] According to one embodiment, the length of the at least one recess (331) in the first direction may be substantially equal to the length of the curved region (330) in the first direction.

[0329] According to one embodiment, the protective member (410) may include a hole (411) that is inserted into the opening (226) of the inner wall (225) and configured to accommodate the curved area (330).

[0330] According to one embodiment, the plate (222) may include a front surface (222a) facing the flexible display (230).

[0331] According to one embodiment, the plate (222) may include a back surface (222b) opposite to the front surface (222a).

[0332] According to one embodiment, the inner wall (225) may protrude from the rear surface (222b).

[0333] According to one embodiment, the first heat dissipation region (310) may be disposed between the rear surface (222b) and the circuit board (264).

[0334] According to one embodiment, the second heat dissipation area (320) may be positioned between the rear surface (222b) and the battery (254).

[0335] According to one embodiment, one of the first heat dissipation area (3101) and the second heat dissipation area (3201) may be disposed on the front surface (222a).

[0336] According to one embodiment, the other of the first heat dissipation area (3101) and the second heat dissipation area (3201) may be disposed on the rear surface (222b).

[0337] According to one embodiment, the opening (2261) may be formed in at least a portion of the plate (222) positioned below the inner wall (225).

[0338] According to one embodiment, the electronic device (101) may further include a support plate (500) arranged to cover the opening (2261).

[0339] According to one embodiment, the heat dissipation member (300) may include a first extension region (312) extending from the first heat dissipation region (310).

[0340] According to one embodiment, the first heat dissipation area (310) may be connected to the front surface of the circuit board (264).

[0341] According to one embodiment, the first extension region (312) may be connected to the rear surface of the circuit board (264).

[0342] According to one embodiment, the battery (254) may include a front surface facing the plate (222) and a back surface opposite the front surface.

[0343] According to one embodiment, the heat dissipation member (300) may include a second extension region (322) extending from the second heat dissipation region (320).

[0344] According to one embodiment, the second heat dissipation region (320) and the second extension region (322) may be connected to the front surface of the battery (254).

[0345] According to one embodiment, the opening (226) may include an expansion opening (227) formed on one side of the opening (226).

[0346] According to one embodiment of the present disclosure, an electronic device (101) may include a first housing (210).

[0347] According to one embodiment, the electronic device (101) may include a second housing (220) including a plate (222), an inner wall (225) protruding from the plate (222), and an opening (226) formed in the inner wall (225).

[0348] According to one embodiment, the electronic device (101) may include a hinge structure (202) connected to the first housing (210) and the second housing (220).

[0349] According to one embodiment, the electronic device (101) may include a flexible display (230) disposed on the first housing (210) and the second housing (220).

[0350] According to one embodiment, the electronic device (101) may include a circuit board (264) disposed within the second housing (220).

[0351] According to one embodiment, the electronic device (101) may include a battery (254) disposed within the second housing (220) and spaced apart from the circuit board (264) with the inner wall (225) therebetween.

[0352] According to one embodiment, the electronic device (101) may include a heat dissipation member (300) extending from the circuit board (264) to the battery (254) and including a curved region (330) disposed at least partially in the opening (226) of the inner wall (225).

[0353] According to one embodiment, the heat dissipation member (300) may include a first heat dissipation area (310) connected to the circuit board (264).

[0354] According to one embodiment, the heat dissipation member (300) may include a second heat dissipation area (320) connected to the battery (254).

[0355] According to one embodiment, the heat dissipation member (300) may include a bending region (330) that is connected to the first heat dissipation region (310) and the second heat dissipation region (320) and configured to be bendable.

[0356] According to one embodiment, the heat dissipation member (300) may include a third heat dissipation region (340) that is disposed across the hinge structure (202) and extends from the first heat dissipation region (310) to the interior space of the first housing (210).

[0357] According to one embodiment, the plate (222) may include a front surface (222a) facing the flexible display (230).

[0358] According to one embodiment, the plate (222) may include a back surface (222b) opposite to the front surface (222a).

[0359] According to one embodiment, the inner wall (225) may protrude from the rear surface (222b).

[0360] According to one embodiment, the inner wall (225) may extend along a first direction substantially perpendicular to the axial direction of the folding axis (Ax) provided by the hinge structure (202).

[0361] According to one embodiment of the present disclosure, the electronic device (101) may include a first housing (210; 710) including a first hole (616) and a first plate (212; 612).

[0362] According to one embodiment, the electronic device (101) may include a second housing (220; 720) including a second hole (626) and a second plate (222; 622).

[0363] According to one embodiment, the electronic device (101) may include a hinge structure (202) connected to the first housing (210; 710) and the second housing (220; 720).

[0364] According to one embodiment, the electronic device (101) may include a hinge cover (240; 740) covering the hinge structure (202).

[0365] According to one embodiment, the electronic device (101) may include a flexible printed circuit board (266; 766) extending from the first housing (210; 710) across the hinge structure (202) to the second housing (220; 720).

[0366] According to one embodiment, the electronic device (101) may include a heat dissipation member (700) extending from the first housing (210; 710) across the hinge structure (202) to the second housing (220; 720).

[0367] According to one embodiment, the heat dissipation member (700) may include a first heat dissipation area (710) disposed on the first plate (212; 612).

[0368] According to one embodiment, the heat dissipation member (700) may include a second heat dissipation area (720) disposed on the second plate (222; 622).

[0369] According to one embodiment, the heat dissipation member (700) may include a curved region (730) connected to the first heat dissipation region (710) and the second heat dissipation region (720) and arranged across the hinge structure (202).

[0370] According to one embodiment, the curved region (730) may include a planar portion (733) fixed to the hinge cover (240; 740).

[0371] According to one embodiment, the curved region (730) may include a first flexible portion (731) that connects the flat portion (733) and the first heat dissipation region (710) and is disposed in the first hole (616).

[0372] According to one embodiment, the curved region (730) may include a second flexible portion (732) that connects the flat portion (733) and the second heat dissipation region (720) and is disposed in the second hole (626).

[0373] According to one embodiment of the present disclosure, an electronic device (101) may include a housing (220) including a side wall (221) forming at least a portion of a side surface of the electronic device (101), a plate (222) surrounded by the side wall (221), an inner wall (225) formed on the plate (222) and arranged substantially parallel to at least one side of the side wall (221) (e.g., a side wall facing the +Y direction or a side wall facing the -Y direction among the side walls (221) of FIG. 5), and an opening (226) formed on the inner wall (225).

[0374] According to one embodiment, the electronic device (101) may include a printed circuit board (264) that is housed inside the housing (220) and is positioned in a first internal region (223a) (e.g., the first space (223a) of FIG. 5) positioned in a first direction (e.g., the +Y direction of FIG. 5) with respect to the inner wall (225), and includes a processor (120).

[0375] According to one embodiment, the electronic device (101) may include a battery (254) that is housed inside the housing (220) and is positioned in a second internal region (223b) (e.g., the second space (223b) of FIG. 5) opposite to the first direction (e.g., the -Y direction of FIG. 5) with respect to the inner wall (225), and is electrically connected to the printed circuit board (264).

[0376] According to one embodiment, the electronic device (101) may include a heat diffusion member (300) extending from the first internal region (223a) toward the second internal region (223b), disposed at least partially in the opening (226), and including a heat diffusion material (e.g., the heat dissipation member (300) of FIG. 5).

[0377] According to one embodiment, at least a portion of the surface of the heat spreading member (300) disposed in the opening (226) may include a curved region (330).

[0378] According to one embodiment, the curved region (330) may include at least one recess (331) formed along the longitudinal direction in which the inner wall (225) extends (e.g., the X-axis direction of FIG. 8).

[0379] According to one embodiment, the length of the at least one recess (331) in the longitudinal direction (e.g., length L in FIG. 8) may be substantially equal to the width of the at least one portion of the heat spreading member (300) in the longitudinal direction (e.g., width in the X-axis direction in FIG. 8).

[0380] According to one embodiment, the heat spreading member (300) may include a first planar area (310) extending in the first direction from the curved area (330) (e.g., the first heat dissipation area (310) of FIGS. 5 and 6), and a second planar area (320) extending in the second direction from the curved area (330) (e.g., the second heat dissipation area (320) of FIGS. 5 and 6).

[0381] According to one embodiment, the first flat area (310) may be disposed between the printed circuit board (264) and the plate (222), and the second flat area (320) may be disposed between the battery (254) and the plate (222).

[0382] According to one embodiment, the electronic device (101) may include a guide member (400) (e.g., a protective member (400) of FIG. 11) substantially disposed along the perimeter of the inner edge of the opening (226).

[0383] According to one embodiment, the guide member (400) may include a guide hole formed therein (e.g., hole (401) of FIG. 11).

[0384] According to one embodiment, the bending region (330) may be arranged to penetrate the guide hole.

[0385] According to one embodiment, the width of the guide member (400) (e.g., the width in the Y-axis direction of FIG. 9) may be greater than the width of the inner wall (225) (e.g., the width in the Y-axis direction of FIG. 9).

[0386] According to one embodiment, the width of the guide member (400) (e.g., the width in the Y-axis direction of FIG. 9) may be smaller than the width of the bending region (330) (e.g., the width in the Y-axis direction of FIG. 9).

[0387] According to one embodiment, the plate (222) may include a first side (222a) (e.g., the front side (222a) of FIG. 12) and a second side (222b) opposite the first side (222a) (e.g., the back side (222b) of FIG. 12).

[0388] According to one embodiment, the electronic device (101) may include a display (230) (e.g., the display (230) of FIG. 12) disposed on the first surface (222a).

[0389] According to one embodiment, the printed circuit board (264) and the battery (254) may be disposed on the second surface (222b).

[0390] According to one embodiment, the heat spreading member (300) may include a first planar area (310) extending in the first direction from the curved area (330) (e.g., the first heat dissipation area (310) of FIGS. 5 and 6), and a second planar area (320) extending in the second direction from the curved area (330) (e.g., the second heat dissipation area (320) of FIGS. 5 and 6).

[0391] According to one embodiment, one of the first flat area (310) and the second flat area (320) may be disposed on the first surface (222a) facing the display (230).

[0392] According to one embodiment, the other of the first flat area (310) and the second flat area (320) may be disposed on a second surface (222b) opposite to the first surface (222a).

[0393] According to one embodiment of the present disclosure, an electronic device (101) may include a housing including a first housing (610), a second housing (620), and a hinge housing (640) (e.g., a hinge cover (640) of FIG. 27) substantially disposed between the first housing (610) and the second housing (620).

[0394] According to one embodiment, the first housing (610) may include a first opening (616) (e.g., the first hole (616) of FIG. 27) formed on a first side adjacent to the hinge housing (640).

[0395] According to one embodiment, the second housing (620) may include a second opening (626) formed on a second side adjacent to the hinge housing (640) (e.g., the second hole (626) of FIG. 27).

[0396] According to one embodiment, the electronic device (101) may include a hinge assembly (e.g., hinge structure (202) of FIG. 4) that is at least partially housed in the hinge housing (640) and configured to rotatably connect the first housing (610) and the second housing (620) with respect to each other.

[0397] According to one embodiment, the electronic device (101) may include a heat spreading member (700) accommodated in the housing (e.g., the heat dissipation member (700) of FIG. 27).

[0398] According to one embodiment, the heat spreading member (700) may extend from the first housing (610) through the hinge housing (640) to the second housing (620).

[0399] According to one embodiment, the heat spreading member (700) may include a first portion (731) positioned to penetrate the first opening (616) (e.g., the first flexible portion (731) of FIG. 27) and a second portion (732) positioned to penetrate the second opening (626) (e.g., the second flexible portion (732) of FIG. 27).

[0400] According to one embodiment, at least one portion of at least one of the first portion (731) and the second portion (732) may include a curved region.

[0401] According to one embodiment, the first side of the first housing (610) may form at least a portion of a side wall of the first housing (610).

[0402] According to one embodiment, the second side of the second housing (620) may form at least a portion of a side wall of the second housing (620).

[0403] According to one embodiment, the first housing (610) may further include a first plate (612) connected to the first side, perpendicular to the second side, and in contact with at least a portion of the heat spreading member (700) (e.g., the first heat dissipation area (710) of FIG. 27).

[0404] According to one embodiment, the second housing (620) may further include a second plate (622) connected to the second side, perpendicular to the second side, and in contact with another portion of the heat spreading member (700) (e.g., the second heat dissipation area (720) of FIG. 27).

[0405] According to one embodiment, the heat spreading member (700) may further include a planar area (733) (e.g., planar portion (733) of FIG. 27) at least partially attached to the inner surface of the hinge housing (640).

[0406] According to one embodiment, the heat spreading member (700) may include a first curved region formed in the first portion (731) and positioned to penetrate the first opening (616).

[0407] According to one embodiment, the heat spreading member (700) may include a second curved region formed in the second portion (732) and positioned to penetrate the second opening (626).

[0408] Although the detailed description of this document has described specific embodiments, it will be apparent to those skilled in the art that various modifications are possible without departing from the scope of this document.

Claims

1. In an electronic device (101), First housing (210); A second housing (220) rotatably connected to the first housing (210), including a plate (222), an inner wall (225) protruding from the plate (222), and an opening (226) formed in the inner wall (225); A flexible display (230) disposed on the first housing (210) and the second housing (220); A circuit board (264) placed within the second housing (220); A battery (254) placed within the second housing (220) and spaced apart from the circuit board (264) with the inner wall (225) therebetween; and An electronic device (101) comprising a heat dissipation member (300) extending from the circuit board (264) to the battery (254) and including a curved region (330) at least partially disposed in the opening (226) of the inner wall (225).

2. In paragraph 1, The above heat dissipation member (300) is A first heat dissipation area (310) connected to the circuit board (264); A second heat dissipation area (320) connected to the above battery (254); and An electronic device (101) comprising a bending region (330) connected to the first heat dissipation region (310) and the second heat dissipation region (320) and configured to be bendable.

3. In paragraph 1 or 2, An electronic device (101) further comprising a protective member (400) disposed in the above opening (226) and surrounding at least a portion of the bending area (330).

4. In any one of paragraphs 1 to 3, The inner wall (225) above is extending along a first direction and having a first width (t1) in a second direction substantially perpendicular to the first direction, The above protective member (400) is Having a second width (t2) in the second direction, The above second width (t2) is An electronic device (101) larger than the first width (t1).

5. In any one of paragraphs 1 to 4, The above curved area (330) is Having a third width (t3) in the second direction, The above third width (t3) is An electronic device (101) larger than the second width (t2).

6. In any one of paragraphs 1 to 5, The above curved area (330) is An electronic device (101) comprising at least one recess (331) extending along the first direction.

7. In any one of paragraphs 1 to 6, The length of the at least one recess (331) in the first direction is An electronic device (101) having a length substantially equal to the length in the first direction of the above-described bending region (330).

8. In any one of paragraphs 1 to 7, The above protective member (410) is An electronic device (101) including a hole (411) inserted into the opening (226) of the inner wall (225) and configured to accommodate the curved area (330).

9. In any one of paragraphs 1 to 8, The above plate (222) is The front side (222a) facing the flexible display (230); and Including the rear side (222b) opposite to the front side (222a), The inner wall (225) is an electronic device (101) protruding from the rear surface (222b).

10. In any one of paragraphs 1 to 9, The above first heat dissipation area (310) is It is placed between the rear surface (222b) and the circuit board (264), The above second heat dissipation area (320) is An electronic device (101) positioned between the rear surface (222b) and the battery (254).

11. In any one of paragraphs 1 to 10, One of the first heat dissipation area (3101) and the second heat dissipation area (3201) It is placed on the front surface (222a), The other of the first heat dissipation area (3101) and the second heat dissipation area (3201) is An electronic device placed on the rear surface (222b).

12. In any one of paragraphs 1 to 11, The above opening (2261) is, Formed on at least a part of the plate (222) located below the inner wall (225), The above electronic device (101) is, An electronic device (101) further comprising a support plate (500) arranged to cover the above opening (2261).

13. In any one of paragraphs 1 to 12, The above heat dissipation member (300) is Includes a first extension region (312) extending from the first heat dissipation region (310), The above first heat dissipation area (310) is Connected to the front of the above circuit board (264), The above first extension area (312) is, An electronic device (101) connected to the rear of the above circuit board (264).

14. In any one of paragraphs 1 to 13, The above battery (254) includes a front side facing the plate (222) and a rear side opposite to the front side, The above heat dissipation member (300) is Includes a second extension region (322) extending from the second heat dissipation region (320), The second heat dissipation area (320) and the second extension area (322) are An electronic device (101) connected to the front of the above battery (254).

15. In any one of paragraphs 1 to 14, The above opening (226) is, An electronic device including an expansion opening (227) formed on one side of the above opening (226).

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