Vapor chamber and electronic device

Abstract

Embodiments of the present application provide a vapor chamber and an electronic device. The vapor chamber of the present application comprises a first cover, a second cover, and capillary structures located in a cavity formed by the first cover and the second cover. Because the maximum area of the cross section of an intermediate capillary structure of each capillary structure in a direction parallel to the first cover is larger than the contact area between a first powder ring and the first cover, the intermediate capillary structure can temporarily store part of a liquid medium, so that in a high heat input situation, the liquid medium temporarily stored by the intermediate capillary structure implements heat exchange with the returning liquid; and because the intermediate capillary structure is in direct contact with a non-heat source region of the first cover, the non-heat source region and the intermediate capillary structure implement heat exchange with each other, such that during gas-liquid circulation of the working medium of the vapor chamber, the intermediate capillary structure and the non-heat source region can implement heat exchange with each other, and the intermediate capillary structure and the non-heat source region work in conjunction to enable the working medium to return to the non-heat source region, thereby achieving continuous gas-liquid circulation and further avoiding drying of a heat source region caused by insufficient liquid return.

Description

Vapor chamber and electronic device

[0001] The present application claims priority to the Chinese patent application No. 202421535063.2, filed on June 28, 2024, and entitled "Vapor chamber and electronic device", the entire content of which is incorporated herein by reference. TECHNICAL FIELD

[0002] The present application relates to the field of heat dissipation technology, in particular to a vapor chamber and an electronic device. BACKGROUND

[0003] With the heat dissipation of heat sources in the field of communication and terminals gradually becoming a problem restricting system performance, how to solve the heat dissipation problem of heat sources becomes the key. In order to solve the heat dissipation problem of electronic devices, vapor chambers (VC) are widely used. The vapor chamber includes an outer shell, a capillary structure and a working medium. A closed cavity is formed inside the outer shell, and the liquid working medium in the cavity is heated and evaporated in the heat source area, absorbs heat and becomes a gas state, and then fills the entire cavity. The gas state working medium runs to the condensation area and condenses into a liquid, and releases the heat accumulated during evaporation.

[0004] However, in the case of large heat input, the vaporization speed of the working medium at the end of the vapor chamber close to the heat source is greater than the liquid return speed of the working medium, which may cause insufficient liquid return of the working medium and cause dry burning. SUMMARY

[0005] The present application provides a vapor chamber and an electronic device, which avoids the dry burning phenomenon caused by insufficient liquid return of the working medium in the vapor chamber under the condition of large heat input.

[0006] To achieve the above purpose, the present application adopts the following technical solutions:

[0007] In a first aspect, a vapor chamber is provided, comprising:

[0008] a first cover body;

[0009] a second cover body, disposed opposite to the first cover body, the first cover body and the second cover body being sealingly connected and forming a sealed cavity, the cavity being used to accommodate a working medium, the first cover body including a heat source area and a non-heat source area;

[0010] The capillary structure includes an intermediate capillary structure, a first powder ring group and a second powder ring group. The first powder ring group includes at least one first powder ring, and the second powder ring group includes at least one second powder ring. One end of the first powder ring is connected to a heat source area of the first cover body, and the other end of the first powder ring is connected to the intermediate capillary structure. One end of the second powder ring is connected to the intermediate capillary structure, and the other end of the second powder ring is connected to the second cover body. The maximum cross-sectional area of the intermediate capillary structure along the direction parallel to the first cover body is greater than the contact area of the second powder ring and the first cover body. The intermediate capillary structure is at least partially in direct contact with the non-heat source area of the first cover body. Thus, because the maximum cross-sectional area of the intermediate capillary structure along the direction parallel to the first cover body is greater than the contact area of the first powder ring and the first cover body, the intermediate capillary structure can buffer part of the liquid medium, so that in the case of large heat input, the liquid medium buffered by the intermediate capillary structure exchanges heat with the backflow liquid, and because the intermediate capillary structure is in direct contact with the non-heat source area of the first cover body, the non-heat source area exchanges heat with the intermediate capillary structure, so that in the gas-liquid circulation of the working medium, the intermediate capillary structure and the non-heat source area can exchange heat, and the two cooperate to enable the working medium to backflow to the non-heat source area, realizing continuous circulation between the gas and the liquid, thereby avoiding the heat source area being burned dry due to insufficient backflow.

[0011] In some embodiments, the average cross-sectional area of the intermediate capillary structure along the direction parallel to the first cover body is less than the maximum area. That is, the intermediate capillary structure is a non-equal-area structure, so that the intermediate capillary structure is uniform in cross-sectional area, thereby buffering sufficient liquid medium in the intermediate capillary structure.

[0012] Further, the maximum cross-sectional area of the intermediate capillary structure along the direction parallel to the first cover body is at least one, that is, there are more uniform maximum cross-sectional areas, thereby buffering sufficient liquid medium in the intermediate capillary structure.

[0013] Optionally, from the first cover body to the second cover body, the cross-sectional area of the intermediate capillary structure along the direction parallel to the first cover body is not equal, that is, the intermediate capillary structure is a non-equal cross-sectional area structure. The intermediate capillary structure can be an irregular structure, and the intermediate capillary structure can also be a regular structure, for example, the intermediate capillary structure is a side-laying trapezoidal prism or a laid-down trapezoidal prism.

[0014] In some embodiments, the vapor chamber includes a plurality of the capillary structures and at least one first connecting portion, one end of the first connecting portion is connected to a middle capillary structure of one of the capillary structures, and the other end of the first connecting portion is connected to a middle capillary structure of another capillary structure. In this way, the liquid working medium can be stored in the first connecting portion, so that the stored liquid working medium exchanges heat with the returned liquid working medium during the return of the liquid working medium, and the dry-out phenomenon of the cover body close to the heat source is avoided.

[0015] In some embodiments, the first connecting portion is provided with a protrusion portion facing the second cover body, and the working medium of the first connecting portion flows back along the outside of the protrusion portion towards the first cover body. In this way, when the working medium flows back from the side close to the second cover to the first cover, it moves to the contact position of the middle capillary structure and the first powder ring along the outside of the protrusion portion, and the return distance is shortened, thereby reducing the time required for return and improving the return speed.

[0016] In some embodiments, the vapor chamber includes a plurality of first connecting portions and at least one second connecting portion, one end of the second connecting portion is connected to one of the first connecting portions, and the other end of the second connecting portion is connected to another first connecting portion. By increasing the number of connecting portions and storing more working medium in the connecting portions.

[0017] In some embodiments, the maximum area of the cross section of the middle capillary structure in the direction parallel to the first cover body is located at at least one of the position close to the first cover body, the position close to the second cover body, and the center in the direction perpendicular to the first cover body.

[0018] In some embodiments, the vapor chamber further includes a plurality of support columns, each of the capillary structures has a corresponding support column, and the support column passes through the middle capillary structure of the corresponding capillary structure.

[0019] In some embodiments, the first cover body includes a first cover plate and a lower capillary structure attached to the side of the first cover plate facing the second cover body, and the other end of the first powder ring is connected to the lower capillary structure of the first cover body. The thickness of the lower capillary structure ranges from 0.01 mm to 1.5 mm.

[0020] In some embodiments, the maximum area of the cross section of the middle capillary structure in the direction parallel to the first cover body is greater than 1.2 times the contact area of the second powder ring and the first cover body.

[0021] In a second aspect, an electronic device is provided, including the vapor chamber of any one of the first aspect.

[0022] The second aspect of the embodiments of the present application provides the beneficial effects brought by each possible implementation manner of the electronic device, which can be referred to the description of the various possible implementation manners in the first aspect, and will not be repeated here. BRIEF DESCRIPTION OF DRAWINGS

[0023] FIG. 1 is an application scenario diagram of a vapor chamber provided by the embodiments of the present application;

[0024] FIG. 2 is a three-dimensional schematic diagram of a vapor chamber provided by the embodiments of the present application;

[0025] FIG. 3 is a three-dimensional schematic diagram of a partial structure of the vapor chamber shown in FIG. 2;

[0026] FIG. 4 is a cross-sectional view of the vapor chamber shown in FIG. 3 along A-A;

[0027] FIG. 5 is a cross-sectional schematic diagram of a capillary structure provided by the embodiments of the present application;

[0028] FIG. 6 is a cross-sectional schematic diagram of a capillary structure provided by the embodiments of the present application;

[0029] FIG. 7 is a cross-sectional schematic diagram of a capillary structure provided by the embodiments of the present application;

[0030] FIG. 8 is a cross-sectional schematic diagram of a capillary structure provided by the embodiments of the present application;

[0031] FIG. 9 is a top view of a capillary structure provided by the embodiments of the present application;

[0032] FIG. 10 is a top view of a capillary structure provided by the embodiments of the present application;

[0033] FIG. 11 is a top view of a capillary structure provided by the embodiments of the present application;

[0034] FIG. 12 is a top view of a capillary structure provided by the embodiments of the present application;

[0035] FIG. 13 is a schematic diagram of a connection between two adjacent intermediate capillary structures provided by the embodiments of the present application;

[0036] FIG. 13 is a schematic diagram of a connection between two adjacent intermediate capillary structures provided by the embodiments of the present application; DETAILED DESCRIPTION

[0037] In order to make the purposes, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the drawings.

[0038] Hereinafter, the terms "first", "second" and the like are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second" and the like can explicitly or implicitly include one or more of the features. In the description of the present application, unless otherwise stated, the meaning of "a plurality of" is two or more.

[0039] In addition, in the present application, the orientation terms such as "upper", "lower" and the like are defined with respect to the orientation of the components shown in the drawings, and it should be understood that these directional terms are relative concepts, which are used for relative description and clarification, and can be changed accordingly according to the change of the orientation of the components placed in the drawings.

[0040] Vapor Chamber (VC): also known as a heat spreader, is a vacuum cavity with microstructure on the inner wall and filled with working medium. The working principle of the vapor chamber is roughly the same as that of the heat pipe, which specifically includes four main steps of conduction, evaporation, convection and condensation. When the heat generated by the heat source enters the vapor chamber through heat conduction, the working medium near the heat source in the vapor chamber absorbs heat and vaporizes rapidly, while carrying away a large amount of heat. By using the latent heat of the steam, when the steam in the vapor chamber diffuses from the high pressure area to the low pressure area (i.e. low temperature area), the steam contacts the inner wall with lower temperature and quickly condenses into liquid and releases heat energy; the condensed working medium returns to the heat source by the capillary force of the microstructure (capillary structure), thus completing a heat conduction cycle and forming a two-way circulation system of working medium vapor-liquid two-phase coexistence. The commonly used material of the vapor chamber is copper, and the working medium inside is pure water.

[0041] Capillary structure: because the liquid surface has surface tension, when the wetting liquid is in the capillary hole, the liquid surface is concave, so that the liquid surface exerts a pulling force on the liquid below, making the liquid move upward along the pipe wall of the capillary hole. Thus, the capillary phenomenon is caused. The capillary structure can include a plurality of capillary holes or similar fine grooves and the like. In this way, when the liquid working medium enters the capillary hole or fine groove in the capillary structure, it will flow to the other end of the capillary hole by capillary action, completing the transfer and return of the working medium.

[0042] Figure 1 is an application scenario diagram of a vapor chamber provided by an embodiment of the present application. The vapor chamber 100 can be applied in electronic devices, such as mobile phones, tablet computers, notebook computers. In Figure 1, the vapor chamber 100 is attached to the heat source 200 of the electronic device, and is used for heat dissipation of the electronic device.

[0043] The uniform temperature plate 100 comprises a first cover 10 and a second cover 20, the first cover 10 and the second cover 20 are oppositely arranged, the first cover 10 and the second cover 20 are sealingly connected and form a sealed cavity 40, the cavity 40 is used for accommodating a working medium, the first cover 10 comprises a heat source area 12 and a non-heat source area 14. The heat source area 12 is attached to a heat source 200, and the non-heat source area 14 is located on the side of the heat source area 12.

[0044] Optionally, the heat dissipation fins 300 are attached to the other side of the uniform temperature plate 100. The uniform temperature plate 100 absorbs the heat generated by the electronic device and transmits the heat to the heat dissipation fins 300, and the heat is transmitted to the air through the heat dissipation fins 300.

[0045] FIG. 2 is a perspective view of a uniform temperature plate according to an embodiment of the present application. In FIG. 2, the first cover 10 and the second cover 20 are oppositely arranged, and the first cover 10 and the second cover 20 are sealingly connected and form a sealed cavity (not shown in FIG. 2).

[0046] FIG. 3 is a perspective view of part of the structure of the uniform temperature plate shown in FIG. 2. The uniform temperature plate 100 further comprises a plurality of capillary structures 30, and the plurality of capillary structures 30 are located in the cavity 40 formed by the first cover 10 and the second cover 20. In this way, when the heat source is in a working state, the heat generated by the heat source is transmitted to the heat source area 12 of the first cover 10, the working medium in the cavity 40 is heated, the temperature of the working medium is raised, and the gasification phenomenon occurs, and the gas phase working medium is formed. The gas phase working medium diffuses to the entire cavity 40. When the gas phase working medium contacts a structure with a lower temperature, for example, the second cover 20 oppositely arranged with the first cover 10, the gas phase working medium will condense into liquid and release energy, the released energy is transmitted to the second cover 20 and eventually diffused to the environment. The capillary structure 30 acts as a return channel for the working liquid, and the condensed working medium returns to the heat source area 12 through the capillary structure 30 and is re-heated and gasified, continuously taking away the heat generated by the heat source, forming a continuous cycle between gas and liquid.

[0047] Figure 4 is a cross-sectional view of the vapor chamber shown in Figure 3 along A-A, in which the capillary structure 30 includes an intermediate capillary structure 32, a first group of powder rings 34, and a second group of powder rings 36, the first group of powder rings 34 includes at least one first powder ring 342, the second group of powder rings 36 includes at least one second powder ring 362, one end of the first powder ring 342 is connected to the heat source area 12 of the first cover 10, the other end of the first powder ring 342 is connected to the intermediate capillary structure 32; one end of the second powder ring 362 is connected to the intermediate capillary structure 32, the other end of the second powder ring 362 is connected to the second cover 20; the maximum area of the cross section of the intermediate capillary structure 32 along the direction parallel to the first cover 10 is greater than the contact area of the first powder ring 342 and the first cover 10; the intermediate capillary structure 32 is at least partially in direct contact with the non-heat source area 14 of the first cover 10. In this way, when the vapor chamber 100 is in use, the heat source area 12 of the first cover 10 is attached to the heat source (such as a high-power chip), when the heat source is in the working state, the heat generated by the heat source is transferred to the heat source area 12 of the first cover 10, heating the working medium in the cavity 40, so that the temperature of the working medium rises, and vaporization occurs, forming a gas phase working medium. The gas phase working medium diffuses throughout the cavity 40. When the gas phase working medium comes into contact with a structure with a lower temperature, such as the second cover 20 arranged opposite the first cover 10, the gas phase working medium will condense into liquid and release energy, the released energy is transferred to the second cover 20 and eventually diffuses into the environment. The intermediate capillary structure 32, the first powder ring 342 and the second powder ring 362 form a return flow channel for the working liquid, and the condensed working medium flows through each second powder ring 362 to collect in the intermediate capillary structure 32. The working medium in the intermediate capillary structure 32 flows back to the heat source area 12 through the first powder ring 342 and is re-heated and vaporized to continue to carry away the heat generated by the heat source, forming a continuous cycle between gas and liquid. In the above cycle, when the heat input of the vapor chamber 100 increases, if the return flow speed of the working medium is not sufficient to meet the evaporation speed, it may cause local dry-out.

[0048] In this application, because the maximum area of the cross section of the intermediate capillary structure 32 along the direction parallel to the first cover 10 is greater than the contact area of the first powder ring 342 and the first cover 10, the intermediate capillary structure 32 can buffer part of the liquid medium, so that in the case of large heat input, the liquid medium buffered by the intermediate capillary structure 32 exchanges heat with the return flow liquid, and because the intermediate capillary structure 32 is in direct contact with the non-heat source area 14 of the first cover 10, the non-heat source area 14 exchanges heat with the intermediate capillary structure 32, so that in the above cycle, the intermediate capillary structure 32 and the non-heat source area 14 can exchange heat, and the two cooperate to enable the working medium to return to the non-heat source area 14, realizing a continuous cycle between gas and liquid, thereby avoiding the dry-out of the heat source area 12 caused by insufficient return of the liquid.

[0049] In some embodiments, the maximum cross-sectional area of the intermediate capillary structure 32 along a direction parallel to the first cover 10 is greater than 1.2 times the contact area of the first powder ring 342 with the first cover 10.

[0050] Optionally, when the number of the first powder rings 342 is more than one, the plurality of first powder rings 342 are arranged with a gap spacing. When the number of the second powder rings 362 is more than one, the plurality of second powder rings 362 are arranged with a gap spacing.

[0051] Optionally, the heat spreader 100 in FIG. 3 includes a plurality of capillary structures 30, at least one intermediate capillary structure 32 of the plurality of capillary structures 30 is in direct contact with the non-heat source area 14. It is understood that in other embodiments, the intermediate capillary structure 32 of all the capillary structures 30 is in direct contact with the non-heat source area 14.

[0052] In FIG. 4, the heat source area 12 is substantially square, the plurality of capillary structures 30 are arranged corresponding to the heat source area 12, the non-heat source area 14 is located at the side of the heat source area 12, the plurality of capillary structures 30 are arranged in an array, the plurality of capillary structures 30 include capillary structures 30 at the outer side and capillary structures 30 at the inner side. The intermediate capillary structure 32 of the capillary structure 30 at the outer side is in direct contact with the non-heat source area 14, and the intermediate capillary structure 32 of the capillary structure 30 at the inner side is not in contact with the non-heat source area 14.

[0053] In other embodiments, the capillary structure 30 further includes a powder column array (not shown in the figure), the powder column array includes a plurality of powder columns arranged with a gap spacing, each powder column has one end connected to the first cover and the other end connected to the intermediate capillary structure. In the embodiments of the present application, the powder column can be a porous structure, for example, a sintered copper powder structure, a sintered copper mesh structure, etc. The powder column can be tightly combined with the heat source area 12 and the intermediate capillary structure 32 by sintering, diffusion welding or other processes.

[0054] Optionally, the first cover 10 and the second cover 20 can be welded together by welding tools such as diffusion welding or brazing to form the above-mentioned sealed cavity 40. During the welding process, the cavity to be formed can be subjected to vacuumizing treatment, so that the cavity has a certain degree of vacuum after being sealed.

[0055] In some embodiments, the intermediate capillary structure 32 is a porous structure, for example, a sintered copper powder structure, a sintered copper mesh structure, a foamed copper structure or a porous copper structure, etc.

[0056] In some embodiments, referring again to FIG. 4, the first cover 10 includes the first cover plate 16 and the lower capillary structure 18 attached to the inner side of the first cover plate 16. That is, the lower capillary structure 18 is attached to the side of the first cover plate 16 close to the second cover 20, and one end of the first powder ring 342 is connected to the lower capillary structure 18 of the heat source area 12 of the first cover 10.

[0057] Optionally, the lower capillary structure 18 is a porous structure, and the inside of the lower capillary structure 18 is densely covered with small holes or grids that can adsorb and contain the flow of working liquid, such as a sintered copper powder structure sintered by copper alloy powder at high temperature, a sintered copper mesh structure sintered by copper mesh at high temperature, etc. The lower capillary structure 18 can be attached to the first cover plate 16 by sintering, diffusion welding or other processes, so as to be closely combined with the first cover plate 16.

[0058] Optionally, the material of the lower capillary structure 18 can be copper or copper alloy, aluminum or aluminum alloy, steel material, and the forming method of the lower capillary structure 18 includes sintering, etching, laser processing, electrodeposition, foaming.

[0059] In some embodiments, the thickness of the lower capillary structure 18 of the heat source area 12 in the direction perpendicular to the first cover plate 16 is less than the thickness of the lower capillary structure 18 of the non-heat source area 14 in the direction perpendicular to the first cover plate 16. Therefore, the capillary structure of the heat source area 12 has better evaporation performance compared with the capillary structure of the non-heat source area 14, and the capillary structure of the non-heat source area 14 has smaller backflow resistance compared with the capillary structure of the heat source area 12.

[0060] It is easy to understand that in some embodiments, the second cover 20 can have a similar structure to the first cover 10, that is, the second cover 20 includes a second cover plate and an upper capillary structure attached to the inner side of the second cover plate. That is, the upper capillary structure is attached to the side of the second cover plate close to the first cover 10, and the other end of the second powder ring 362 is connected to the upper capillary structure of the second cover 20. Of course, in other embodiments, the second cover 20 can have a different structure from the first cover 10, for example, one of the covers is not provided with a capillary structure, and the other is provided with a capillary structure. For example, the first cover 10 includes the first cover plate 16, and the second cover 20 includes the second cover plate and the upper capillary structure, that is, the first cover 10 is not provided with a capillary structure. For another example, the second cover 20 includes the second cover plate, and the first cover 10 includes the first cover plate 16 and the lower capillary structure 18, that is, the inner side of the second cover is not provided with a capillary structure. That is, in some implementations, one of the first cover 10 and the second cover 20 is provided with a capillary structure, and the other is provided with a capillary structure, for example, the uniform plate 100 has an upper capillary structure and does not have a lower capillary structure 18, or the uniform plate 100 does not have an upper capillary structure but has a lower capillary structure 18.

[0061] In some embodiments, the thickness of the lower capillary structure 18 ranges from 0.01 mm to 0.15 mm. By setting a smaller thickness of the lower capillary structure, the thermal resistance is reduced, so that the first cover 10 has better evaporation performance. In the process of returning the liquid, the liquid medium stored in the intermediate capillary structure 32 exchanges heat with the returning liquid, and since the intermediate capillary structure 32 is in direct contact with the non-heat source area 14 of the first cover 10, the intermediate capillary structure 32 and the non-heat source area 14 can exchange heat in the above-mentioned cycle. After the evaporation performance is improved, the heat source area 12 is prevented from being burned dry due to insufficient return of the liquid. Thus, sufficient return of the liquid is achieved while reducing the thermal resistance. Alternatively, the thickness of the lower capillary structure 18 ranges from (0.15 mm, 0.35 mm). By setting the thickness of the lower capillary structure 18, the first cover 10 has better evaporation performance, and the heat source area 12 is prevented from being burned dry. Thus, sufficient return of the liquid is achieved while reducing the thermal resistance.

[0062] In some embodiments, the thickness of the lower capillary structure 18 ranges from (0.35 mm, 1.5 mm). By setting the thickness of the lower capillary structure 18, the first cover 10 has better evaporation performance, and the heat source area 12 is prevented from being burned dry. Thus, sufficient return of the liquid is achieved while reducing the thermal resistance.

[0063] Alternatively, the vapor chamber 100 further comprises at least one support column 50, one end of the support column 50 being connected with the first cover 10, and the other end of the support column 50 being connected with the second cover 20. In FIG. 4, the support column 50 passes through the intermediate capillary structure 32. The first powder ring 342 and the second powder ring 362 are arranged around the support column 50 and wrap the support column 50.

[0064] In some embodiments, the thickness of the upper capillary structure 18 ranges from 0.01 mm to 1.5 mm.

[0065] Alternatively, each support column 50 has a corresponding capillary structure 30, that is, the first powder ring 342, the second powder ring 362, and the intermediate capillary structure 32 of each capillary structure 30 are arranged around the corresponding support column 50, which is convenient to implement, and the vapor chamber 100 comprises a plurality of capillary structures 30, each capillary structure 30 has a corresponding support column 50, and the stability of the vapor chamber 100 is improved by the plurality of support columns 50.

[0066] It is easy to understand that in FIG. 4, the first powder ring 342 and the second powder ring 362 are attached to the surface of the support column 50 and are in close contact with the support column 50. In other implementations, the first powder ring 342 and the second powder ring 362 can also have a certain gap with the support column 50, or form non-tight contact with the support column 50.

[0067] Alternatively, the support column 50 can be made of copper or copper alloy, aluminum or aluminum alloy, etc. high thermal conductivity material.

[0068] Please see Fig. 5, a cross-sectional view of the capillary structure 30 provided by the embodiment of the present application, i.e. a cross-sectional view of the capillary structure 30 along the direction perpendicular to the first cover 10. As shown in Fig. 5, the middle capillary structure 32 of the capillary structure 30 is irregularly shaped, and along the direction perpendicular to the first cover 10, the cross-sectional area of the middle capillary structure 32 along the direction parallel to the first cover 10 is not the same, i.e. the cross-sectional area of the middle capillary structure 32 along the direction parallel to the first cover 10 is not the same, the middle capillary structure 32 is not a structure with equal cross-sectional area, and the maximum cross-sectional area of the middle capillary structure 32 along the direction parallel to the first cover 10 in Fig. 5 is greater than the average cross-sectional area of the middle capillary structure 32. The maximum cross-sectional area of the middle capillary structure 32 in Fig. 5 is at M, and M can buffer the working liquid medium.

[0069] The maximum cross-sectional area of the middle capillary structure 32 in Fig. 5 is located on the side close to the first cover 10.

[0070] Optionally, the maximum cross-sectional area of the capillary structure 32 along the direction parallel to the first cover 10 is 2-4 times the contact area of the first powder ring 342 and the first cover 10, so that by increasing the maximum cross-sectional area of the capillary structure 32 along the direction parallel to the first cover 10 and the contact area of the first powder ring 342 and the first cover 10, and limiting it to 2-4 times, the manufacturing of the middle capillary structure 32 is facilitated, and by limiting the multiple, it is ensured that the liquid medium buffered in the middle capillary structure 32 can make the working medium in the middle capillary structure 32 flow back to the heat source area 12 through the first powder ring 342.

[0071] It is easy to understand that the middle capillary structure 32 in Fig. 5 is an irregular structure, and the maximum cross-sectional area of the middle capillary structure 32 along the direction parallel to the first cover 10 is greater than the average cross-sectional area of the middle capillary structure 32, and the middle capillary structure 32 is a structure with unequal cross-sectional area. It is easy to understand that in other embodiments, the middle capillary structure 32 can also be a regular structure, for example, the middle capillary structure 32 is a side-laying trapezoidal prism or a laid-down trapezoidal prism, as long as the maximum cross-sectional area of the middle capillary structure 32 along the direction parallel to the first cover 10 is greater than the average cross-sectional area of the middle capillary structure 32.

[0072] Please refer to FIG. 6, which is a cross-sectional view of the capillary structure 30 provided by the embodiment of the present application, and FIG. 6 is a cross-sectional view of the middle capillary structure 32 along a direction perpendicular to the first cover 10. As shown in FIG. 6, the middle capillary structure 32 of the capillary structure 30 has an approximately elliptical cross section, and the maximum cross-sectional area of the middle capillary structure 32 in FIG. 6 is at M1, and M1 is located at the middle of the middle capillary structure 32 along a direction perpendicular to the first cover 10, i.e., the cross-sectional area of the middle capillary structure 32 along a direction parallel to the first cover 10 gradually decreases from the middle of the middle capillary structure 32 towards the first cover 10 or the second cover.

[0073] Optionally, in FIG. 6, the support column 50 passes through the center of the middle capillary structure 32. That is, the middle capillary structure 32 is attached to the surface of the support column 50 and is in close contact with the support column 50.

[0074] Please refer to FIG. 7, which is a cross-sectional view of the capillary structure 30 provided by the embodiment of the present application, and FIG. 7 is a cross-sectional view of the capillary structure 30 along a direction perpendicular to the first cover 10. As shown in FIG. 7, the middle capillary structure 32 of the capillary structure 30 includes a first part 322, a connecting part 324 and a second part 326, the cross section of the first part 322, the connecting part 324 and the second part 326 along a direction perpendicular to the first cover 10 is square, and the cross-sectional area of the first part 322 and the second part 326 along a direction parallel to the first cover 10 is greater than that of the connecting part 324. The cross-sectional area of the first part 322 along a direction parallel to the first cover 10 is the same as that of the second part 326. That is, the first part 322, the second part 326 and the connecting part 324 are equal cross-sectional area structures, and the maximum cross-sectional area of the middle capillary structure 32 parallel to the first cover 10 is at M2, and M2 is located at the first part 322 and the second part 326.

[0075] It is easy to understand that, in other embodiments, the cross-sectional length of the first part 322 and the second part 326 along a direction parallel to the first cover 10 is not the same and is greater than that of the connecting part 324. In this way, in the liquid return circulation process, the first part 322 and the second part 326 of the middle capillary structure 32 can buffer liquid medium, so that when a large amount of heat is input by the heat source, the liquid medium buffered by the first part 322 and the second part 326 exchanges heat with the working medium flowing back in the middle capillary structure 32, so that the normal flow of the working medium is realized.

[0076] Optionally, the maximum cross section of the middle capillary structure 32 along a direction parallel to the first cover 10 can include two or more than two.

[0077] In FIG. 7, the support column 50 passes through the first portion 322, the connecting portion 324 and the second portion 326 of the intermediate capillary structure 32. That is, the first portion 322, the connecting portion 324 and the second portion 326 of the intermediate capillary structure 32 are attached to the surface of the support column 50 and are in close contact with the support column 50.

[0078] Please refer to FIG. 8, which is a cross-sectional view of a capillary structure 30 according to an embodiment of the present application. The capillary structure 30 in FIG. 8 has the same structure as the capillary structure 30 in FIG. 7, except that the capillary structure 30 in FIG. 8 is independent of the support column 50, that is, the capillary structure 30 and the support column 50 are arranged adjacently.

[0079] Optionally, the maximum cross-sectional area of the intermediate capillary structure 32 along the direction parallel to the first cover 10 is greater than 3-5 times the contact area of the first powder ring 342 and the first cover 10.

[0080] Please refer to FIG. 9, which is a top view of a capillary structure of a vapor chamber according to an embodiment of the present application. The vapor chamber 100 includes a plurality of capillary structures 30 and at least one first connecting portion L. The intermediate capillary structures 32 of at least two adjacent capillary structures 30 in the plurality of capillary structures 30 are connected by the first connecting portion L. One end of the first connecting portion L is connected to the intermediate capillary structure 32 of one of the capillary structures 30, and the other end of the first connecting portion L is connected to the intermediate capillary structure 32 of the other capillary structure 30. After the intermediate capillary structures 32 of the at least two adjacent capillary structures 30 are connected, the first connecting portion L between the two intermediate capillary structures 32 can store part of the working fluid. Thus, during the return of the working medium through the capillary structure 30, if the heat source inputs a large amount of heat, causing the working medium returning to the heat source area 12 of the first cover 10 to evaporate rapidly, the part of the working fluid stored in the first connecting portion L between the two intermediate capillary structures 32 exchanges heat with the returning working medium, preventing the heat source area 12 of the first cover 10 from being dried out.

[0081] In FIG. 9, the vapor chamber 100 includes nine capillary structures 30. Among the nine capillary structures 30, the intermediate capillary structures 32 of three adjacent capillary structures 30 are connected. It is easy to understand that FIG. 9 is only an example of a connection mode between the intermediate capillary structures 32 of two adjacent capillary structures 30.

[0082] In FIG. 9, each capillary structure 30 has a corresponding support column 50, and the support column 50 passes through the intermediate capillary structure 32 of the corresponding capillary structure 30.

[0083] Please refer to FIG. 10, which is a top view of a capillary structure according to an embodiment of the present application. The uniform temperature plate 100 in FIG. 10 includes a plurality of capillary structures 30, in which: each capillary structure 30 can be independently arranged, i.e., the middle capillary structure 32 of the capillary structure 30 is not connected or there is no first connecting portion L between the middle capillary structure 32 of the capillary structure 30 and the middle capillary structure 32 of an adjacent capillary structure 30; the middle capillary structure 32 of each capillary structure 30 can be connected to the middle capillary structure 32 of an adjacent capillary structure 30 through a first connecting portion L, forming a connection of two capillary structures 30; and the middle capillary structure 32 of each capillary structure 30 can be connected to the middle capillary structure 32 of two adjacent capillary structures 30 through a first connecting portion L.

[0084] Please refer to FIG. 11, which is a top view of a capillary structure according to an embodiment of the present application. The uniform temperature plate 100 in FIG. 11 includes a plurality of capillary structures 30 and at least one first connecting portion L, in which: the middle capillary structure 32 of each capillary structure 30 is connected to the middle capillary structure 32 of at least one adjacent capillary structure 30 through the first connecting portion L.

[0085] Optionally, if the connection of the middle capillary structures 32 of two capillary structures 30 is located on the side close to the non-heat source area 14, the connection is a thin connecting portion L1; if the connection of the middle capillary structures 32 of two capillary structures 30 is located on the side away from the non-heat source area 14, the connection is a thick connecting portion L2. It is easy to understand that in other embodiments, the first connecting portion L between any two middle capillary structures 32 can be a thin connecting portion L1 or a thick connecting portion L2.

[0086] Optionally, if the connection of the middle capillary structures 32 of two capillary structures 30 is located on the side close to the non-heat source area 14, the connection is a thin connecting portion L1; if the connection of the middle capillary structures 32 of two capillary structures 30 is located on the side away from the non-heat source area 14, the connection is a thick connecting portion L2. It is easy to understand that in other embodiments, the first connecting portion L between any two middle capillary structures 32 can be a thin connecting portion L1 or a thick connecting portion L2.

[0087] Please refer to FIG. 12, which is a top view of a capillary structure according to an embodiment of the present application. The connection mode of the plurality of capillary structures 30 in FIG. 12 is similar to that in FIG. 11, and the difference is that the uniform temperature plate in FIG. 12 further includes at least two first connecting portions L and at least one second connecting portion Q, one end of the second connecting portion Q is connected to one of the first connecting portions L, and the other end of the second connecting portion Q is connected to another of the first connecting portions L.

[0088] Optionally, if the two connected first connecting portions L are thick connecting portions, the two first connecting portions L can be connected through the second connecting portion Q.

[0089] Optionally, if two first connection portions L can be connected by a second connection portion Q, the second connection portion Q is a thin connection portion. By adding new connection portions at the connection of the plurality of capillary structures 30, more connection portions are formed, and the connection portions can store liquid medium, so that when the working medium circulates, the liquid medium stored in the connection portions exchanges heat with the circulating working medium, so that the normal return of the working medium is realized.

[0090] It is easy to understand that the thick connection and the thin connection can be converted into the same connection mode according to actual needs, for example, both are thin connections, or both are thick connections, wherein thick and thin are only relative, and the cross-sectional area of the connection portion perpendicular to the first direction can be adjusted according to actual scenes.

[0091] Please refer to FIG. 13, which is a schematic diagram of the connection of two adjacent intermediate capillary structures provided in the embodiments of the present application. The connection L of the two adjacent intermediate capillary structures 32 has a protruding portion N facing the second cover 20 on the side close to the first cover 10, and the working medium of the connection L returns to the direction close to the first cover 10 along the outer side of the protruding portion N. The protruding portion N is used to define the return direction of the working medium. In this way, during the return of the working medium, when the working medium returns from the side close to the second cover 20 to the side close to the first cover 10, it moves to the contact between the intermediate capillary structure 32 and the first powder ring along the outer side of the protruding portion N (i.e., route 1 in FIG. 13), compared with the working medium moving from the side close to the second cover 20 of the intermediate capillary structure 32 to the side close to the first cover 10; and then moving from the side close to the first cover 10 of the intermediate capillary structure 30 to the contact between the intermediate capillary structure 32 and the first powder ring (i.e., route 2 in FIG. 13), the distance is shortened, thereby reducing the time required for return of liquid and improving the speed of return of liquid.

[0092] The protruding portion N in FIG. 13 is roughly semicircular. It is easy to understand that in other embodiments, the protruding portion N can also have other shapes, for example, triangular, as long as it can define the return direction of the working medium.

[0093] The protruding portion N in FIG. 13 is formed by a recess of the connection L. It is easy to understand that in other embodiments, a protruding portion facing the second cover 20 is arranged inside the connection L, and the working medium can move along the outer side of the protruding portion N, so as to define the return direction of the working medium by the protruding portion N.

[0094] It should be noted that in this document, the terms "comprising", "including", or any other variant thereof are intended to cover non-exclusive inclusion, so that processes, methods, articles, or equipment including a series of elements not only include those elements, but also include other elements not explicitly listed, or inherent to such processes, methods, articles, or equipment.

[0095] Other embodiments of the application will be apparent to those skilled in the art from consideration of the specification and practice of the application disclosed herein. It is intended that the specification and examples be considered as exemplary only, with the true scope and spirit of the application being indicated by the following claims.

[0096] It is to be understood that the application is not limited to the precise construction herein described and as shown in the attached drawings, and that various modifications and changes can be made by those skilled in the art without departing from the scope of the application. The scope of the application is limited only by the claims that follow.

Claims

1. A vapor chamber, characterized by, The even temperature plate comprises: a first cover body; a second cover body, which is arranged opposite to the first cover body, the first cover body and the second cover body are sealingly connected and form a sealed cavity, the cavity is used for containing working medium, the first cover body comprises a heat source area and a non-heat source area; a capillary structure, which comprises an intermediate capillary structure, a first powder ring group and a second powder ring group, the first powder ring group comprises at least one first powder ring, the second powder ring group comprises at least one second powder ring, one end of the first powder ring is connected with the heat source area of the first cover body, the other end of the first powder ring is connected with the intermediate capillary structure; one end of the second powder ring is connected with the intermediate capillary structure, the other end of the second powder ring is connected with the second cover body; the maximum area of the cross section of the intermediate capillary structure along the direction parallel to the first cover body is greater than the contact area of the second powder ring and the first cover body; the intermediate capillary structure is at least partially in direct contact with the non-heat source area of the first cover body.

2. The vapor chamber of claim 1, wherein, The average cross-sectional area of the intermediate capillary structure along the direction parallel to the first cover body is less than the maximum area.

3. The vapor chamber of claim 2, wherein, The even temperature plate comprises a plurality of capillary structures and at least one first connecting part, one end of the first connecting part is connected with the intermediate capillary structure of one of the capillary structures, and the other end of the first connecting part is connected with the intermediate capillary structure of another capillary structure.

4. The vapor chamber of claim 3, wherein, The first connecting part is provided with a protruding part towards the second cover body, and the working medium of the first connecting part flows back along the outside of the protruding part towards the direction close to the first cover body.

5. The uniform heat spreader of claim 3 or 4, wherein, The even temperature plate comprises a plurality of first connecting parts and at least one second connecting part, one end of the second connecting part is connected with one of the first connecting parts, and the other end of the second connecting part is connected with another first connecting part.

6. The uniform heat spreader of claim 1 or 2, wherein, The maximum area of the cross section of the intermediate capillary structure along the direction parallel to the first cover body is located at at least one of the following positions: the position close to the first cover body of the intermediate capillary structure, the position close to the second cover body of the intermediate capillary structure, and the center of the intermediate capillary structure along the direction perpendicular to the first cover body.

7. The vapor chamber of claim 1, wherein, The even temperature plate further comprises a plurality of support columns, each capillary structure has a corresponding support column, and the support column passes through the intermediate capillary structure of the corresponding capillary structure.

8. The vapor chamber of claim 1, wherein, The first cover body comprises a first cover plate and a lower capillary structure, the lower capillary structure is attached to the side of the first cover plate towards the second cover body, the other end of the first powder ring is connected with the lower capillary structure of the first cover body, and the thickness of the lower capillary structure ranges from 0.01 mm to 1.5 mm.

9. The vapor chamber of claim 1, wherein, The maximum area of the cross section of the intermediate capillary structure along the direction parallel to the first cover body is greater than 1.2 times the contact area of the second powder ring and the first cover body.

10. An electronic device, comprising: The even temperature plate comprises the even temperature plate according to any one of claims 1-9.

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