Die attaching machine

Abstract

A die attaching machine, comprising: a frame, the frame comprising a carrying platform and a fixed frame located above the carrying platform; a pressing platform located at the top of the carrying platform, the pressing platform comprising a vacuum plate used for placing a panel, a displacement adjustment support member used for adjusting the position of the vacuum plate, and a plurality of vacuum switches arranged at intervals on the vacuum plate; and a pressing head assembly movably mounted on the fixed frame, the pressing head assembly being used for suctioning a die and bonding the die to the panel. When the vacuum switches which are subjected to a pressure from the panel are automatically turned on to suction the panel, the vacuum switches which are not subjected to the pressure from the panel remain in a turned-off state. The plurality of vacuum switches arranged at intervals can enable suction functions of different regions of the vacuum plate according to the coverage area of the panel, so as to adapt to panels of different sizes.

Description

Chip bonding machine

[0001] The present application is based on the Chinese patent application No. 202410865052.9, filed on June 28, 2024, and claims the priority of the Chinese patent application, the whole content of which is incorporated herein by reference. TECHNICAL FIELD

[0002] The present application relates to the technical field of chip bonding, and particularly relates to a chip bonding machine. BACKGROUND

[0003] When bonding a chip to a panel, the panel needs to be fixed by vacuum adsorption through a vacuum platform, and then the chip is bonded to the bonding area of the panel through a pressure head.

[0004] Considering that the size of the panel is different, when the size of the panel is smaller than the size of the vacuum platform, part of the vacuum ports on the vacuum platform needs to be sealed, and the sealing port needs to be adjusted every time a panel of different size is replaced, which is time-consuming and laborious.

[0005] Therefore, it is necessary to provide a chip bonding machine to solve the above technical problems. SUMMARY

[0006] In order to achieve the above purpose, the present application provides a chip bonding machine, which comprises: a rack comprising a bearing platform and a fixing frame located above the bearing platform; a pressing platform located at the top of the bearing platform, the pressing platform comprising a vacuum plate for placing a panel, a displacement adjusting support for adjusting the position of the vacuum plate, and a plurality of vacuum switches arranged at intervals on the vacuum plate, the vacuum plate or the vacuum switch being provided with an adsorption port, the vacuum switch comprising a protruding part, the vacuum switch having a closed state in which the protruding part exceeds the plane of the vacuum plate to seal the adsorption port, and an open state in which the protruding part is retracted into the vacuum switch to open the adsorption port; a pressure head assembly movably mounted on the fixing frame, the pressure head assembly being used for adsorbing a chip and bonding the chip to the panel.

[0007] In some embodiments, the vacuum plate comprises an upper plate, a lower plate, and a first vacuum groove located between the upper plate and the lower plate, and the vacuum switches are arranged at intervals in the first vacuum groove.

[0008] In some embodiments, the vacuum switch comprises a housing having a cavity therein, a first communication groove is formed on the housing to communicate the first vacuum groove and the cavity; a sealing cover plate is fixed in the cavity, a through hole is formed in the middle of the sealing cover plate as the adsorption port; a sealing member comprises a bottom plate abutting against the bottom of the sealing cover plate and an abutting block on the top of the bottom plate, the abutting block passes through the through hole, and the height of the abutting block is greater than the height of the sealing cover plate, the part of the abutting block protruding from the sealing cover plate forms the protruding part; an elastic member is arranged at the bottom of the cavity, and the top end of the elastic member abuts against the bottom plate.

[0009] In some embodiments, the sealing cover plate comprises a first cylindrical part, a second cylindrical part, a third cylindrical part between the first cylindrical part and the second cylindrical part, a communication hole formed on the second cylindrical part, the radius of the third cylindrical part is smaller than the radius of the first cylindrical part and the second cylindrical part, a sealing ring cavity is formed between the third cylindrical part and the cavity, and the first communication groove communicates the first vacuum groove and the sealing ring cavity; the bottom plate abuts against the second cylindrical part, and the sealing member further comprises a sealing ring between the bottom plate and the second cylindrical part.

[0010] In some embodiments, the top of the upper plate is provided with a second vacuum groove, the sealing cover plate is flush with the upper plate, and the top of the sealing cover plate is provided with a second communication groove communicating the second vacuum groove and the through hole.

[0011] In some embodiments, the top of the first cylindrical part is flush with the top of the housing, the radius of the first cylindrical part and the second cylindrical part is the same as the inner diameter of the cavity, and the outer peripheral surface of the first cylindrical part and the second cylindrical part is provided with a sealing ring.

[0012] In some embodiments, the radius of the through hole gradually increases from top to bottom.

[0013] In some embodiments, the pressure head assembly comprises a sliding rail unit in the fixing frame, a pneumatic unit slidingly installed on the sliding rail unit in a first direction, and a pressure head unit connected to the pneumatic unit, the pneumatic unit drives the pressure head unit to move in the height direction.

[0014] In some embodiments, the pressure head unit comprises a fixing block fixed to the pneumatic unit, a horizontal adjusting member connected to the fixing block, and a pressure head connected to the horizontal adjusting member, the horizontal adjusting member is provided with a heating rod and a vacuum tube, and the bottom of the pressure head is provided with a vacuum adsorption port communicating with the vacuum tube.

[0015] In some embodiments, the chip bonding machine further comprises a tray bearing assembly on top of the bearing platform, the pressing platform and the tray bearing assembly are arranged along a first direction, the tray bearing assembly comprises a tray fixing member, a first three-axis sliding table for adjusting the position of the tray fixing member, and a pneumatic bearing table for supporting the first three-axis sliding table.

[0016] In some embodiments, the tray fixing member comprises a fixing plate provided with adjacent first and second stop edges and a mounting groove extending along a diagonal line, a guide member comprising a guide plate fixed in the mounting groove, a guide groove provided in the guide plate, and a spring in the guide groove, a limiting member movably mounted in the guide groove, one end of the limiting member being connected with the spring and the other end having a limiting portion extending outside the guide groove.

[0017] In some embodiments, the chip bonding machine further comprises an auxiliary support assembly on top of the bearing platform, the auxiliary support assembly being arranged along a second direction with the pressing platform; the auxiliary support assembly comprises a first frame, a second frame slidingly connected with the first frame along a height direction, and a transparent support strip fixed on top of the second frame.

[0018] In some embodiments, the first frame comprises a first main body, a rotating rod rotatably connected with the first main body, a first helical gear on the rotating rod, a second helical gear meshing with the first helical gear, and a screw rod connected with the second helical gear, the screw rod extending along the height direction; the second frame comprises a second main body slidingly connected with the first main body, a nut connected with the screw rod, and a window provided on top of the second main body; the transparent support strip is opposite to the window, and the transparent support strip is a quartz strip.

[0019] In some embodiments, the chip bonding machine further comprises an alignment assembly on top of the bearing platform, the auxiliary support assembly being located between the pressing platform and the alignment assembly, the alignment assembly comprising a camera module and a second three-axis sliding table for adjusting the position of the camera module, the camera module extending directly below the transparent support strip.

[0020] The chip bonding machine of the present application has the following advantages: the vacuum switch is automatically opened to adsorb the panel when the panel presses the vacuum switch, and the vacuum switch remains closed when the panel does not press the vacuum switch. By arranging a plurality of vacuum switches at intervals, the corresponding vacuum switch can be opened according to the coverage area of the panel, and the panel can be adsorbed in different areas of the vacuum plate to adaptively adsorb panels of different sizes. BRIEF DESCRIPTION OF DRAWINGS

[0021] The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiments of the application and together with the description serve to explain the application. In the drawings:

[0022] Fig. 1 is a schematic diagram of the overall structure of the chip pre-pressing machine of the present application.

[0023] Fig. 2 is a schematic diagram of the internal structure of the chip pre-pressing machine of the present application.

[0024] Fig. 3 is a schematic diagram of the top view of the chip pre-pressing machine of the present application with the hidden fixing frame.

[0025] Fig. 4 is a schematic diagram of the arrangement of the pressing platform-assisted support assembly-alignment assembly of the present application.

[0026] Fig. 5 is a schematic diagram of the overall structure of the pressing platform of the present application.

[0027] Fig. 6 is a schematic diagram of the top view of the vacuum plate of the present application.

[0028] Fig. 7 is a schematic diagram of the bottom view of the upper plate of the present application.

[0029] Fig. 8 is a schematic diagram of the overall structure of the vacuum switch of the present application.

[0030] Fig. 9 is a schematic diagram of the exploded structure of the vacuum switch of the present application.

[0031] Fig. 10 is a schematic diagram of the structure of the vacuum switch of the present application in the closed state.

[0032] Fig. 11 is a schematic diagram of the structure of the vacuum switch of the present application in the open state.

[0033] Fig. 12 is a schematic diagram of the overall structure of the pressing head assembly of the present application.

[0034] Fig. 13 is a schematic diagram of the structure of the pressing head unit of the present application.

[0035] Fig. 14 is a schematic diagram of the structure of the horizontal adjusting member of the present application.

[0036] Fig. 15 is a schematic diagram of the structure of the pressing head of the present application.

[0037] Fig. 16 is a schematic diagram of the overall structure of the tray bearing assembly of the present application.

[0038] Fig. 17 is a schematic diagram of the structure of the tray fixing member of the present application.

[0039] Fig. 18 is a schematic diagram of the connection structure of the guide member-limiting member of the present application.

[0040] Fig. 19 is a schematic diagram of the arrangement of the assisted support assembly-alignment assembly of the present application.

[0041] Fig. 20 is a schematic diagram of the overall structure of the auxiliary support assembly of the present application.

[0042] Fig. 21 is a schematic diagram of the structure of the first frame of the present application.

[0043] Fig. 22 is a schematic diagram of the structure of the second frame of the present application. DETAILED DESCRIPTION

[0044] In order to make the objectives, technical solutions and advantages of the present application clearer, the technical solutions of the present application will be described clearly and completely below in conjunction with specific embodiments of the present application and corresponding drawings. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0045] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the drawings, in which the same or similar notations represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are only used to explain the present application, and cannot be understood as a limitation of the present application.

[0046] In the description of the present application, it should be understood that the terms "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only used to facilitate the description of the present application and simplify the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0047] In the description of the present application, unless otherwise specified and limited, it should be noted that the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be a mechanical connection or an electrical connection, or a communication between two elements inside, or a direct connection, or an indirect connection through an intermediate medium, and those skilled in the art can understand the specific meaning of the above terms according to the specific circumstances.

[0048] As shown in FIGS. 1-22, a chip bonder is provided. The chip bonder includes a frame 100, a pressing platform 200, and a pressing head assembly 300. The frame 100 forms a frame structure of the chip bonder. The pressing platform 200 is used to place and adsorb a panel. The pressing head assembly 300 is used to adsorb a chip and bond the chip to the panel. In some embodiments, the chip bonder further includes a tray carrying assembly 400, which is used to carry a tray with chips. In some embodiments, the chip bonder further includes an auxiliary support assembly 500, which is used to ensure stability during bonding of the panel and the chip. In some embodiments, the chip bonder further includes an alignment assembly 600, which is used to align a bonding area on the panel and the chip.

[0049] The frame 100 includes a carrying platform 101 and a fixed frame 102 above the carrying platform 101. The carrying platform 101 is used to mount the pressing platform 200, the tray carrying assembly 400, the auxiliary support assembly 500, and the alignment assembly 600. The pressing platform 200, the tray carrying assembly 400 are arranged in a first direction, and the pressing platform 200, the auxiliary support assembly 500, and the alignment assembly 600 are arranged in a second direction. The first direction is perpendicular to the second direction. The fixed frame 102 is used to mount the pressing head assembly 300, and a control panel is mounted on the fixed frame 102.

[0050] Referring to FIGS. 5-11, the pressing platform 200 is used to place and adsorb a panel. The pressing platform 200 includes a vacuum plate 202, a displacement adjustment support 201 used to adjust the position of the vacuum plate 202, and a plurality of vacuum switches 203 arranged in a spaced manner on the vacuum plate 202. The vacuum plate 202 is used to place a panel. The vacuum plate 202 or the vacuum switches 203 are provided with adsorption ports. The vacuum switches 203 include protruding portions and have a closed state and an open state. When the vacuum switches 203 are in the closed state, the protruding portions protrude out of the plane of the vacuum plate 202 to seal the adsorption ports. When the vacuum switches 203 are in the open state, the protruding portions are retracted into the vacuum switches 203 to open the adsorption ports.

[0051] When the vacuum plate 202 is not placed with a panel, the vacuum switch 203 is in a non-pressurized state, the protruding part is beyond the plane where the vacuum plate 202 is located, the vacuum switch 203 is in a closed state and seals the suction port. When a panel is placed on the vacuum plate 202, the protruding part is contracted into the vacuum switch 203 under the pressure of the panel, the vacuum switch 203 opens the suction port to suck the panel so as to fix the panel. In this way, the automatic suction of the panel can be realized.

[0052] Due to the different sizes of the panel, the vacuum switches 203 are arranged at intervals on the vacuum plate 202 to realize the zoning of the vacuum plate 202. When the size of the panel is smaller than the size of the vacuum plate 202, only part of the vacuum switches 203 is opened under the pressure of the panel and the other vacuum switches 203 are in a closed state. Thus, the vacuum switches 203 covered by the panel can be opened according to the size of the panel, and the panel of any size can be adapted, and the vacuum suction and fixing effect is good.

[0053] Referring to FIG. 6, in a specific embodiment, the vacuum switches 203 are arranged at intervals in 7 groups, including 4 groups of vacuum switches 203 located at the four top corner positions of the vacuum plate 202, and 3 groups of vacuum switches 203 arranged at intervals along the central axis of the vacuum plate 202 in the first direction.

[0054] Specifically, the displacement adjustment support 201 is used to adjust the position of the panel located at the top of the vacuum plate 202. The displacement adjustment support 201 can adjust the displacement of the panel in X, Y and Z directions and can be rotated, so as to ensure that the chip is aligned with the bonding area of the panel. Among them, the X direction is the first direction, the Y direction is the second direction, and the Z direction is the height direction.

[0055] The displacement adjustment support 201 can adopt an existing adjustable sliding table, such as a displacement fine adjustment sliding table with a model of LTP125-LM-2.

[0056] The vacuum plate 202 includes an upper plate 202a, a lower plate 202b and a first vacuum groove 202c located between the upper plate 202a and the lower plate 202b. The upper plate 202a is slotted at the bottom and / or the lower plate 202b is slotted at the top, and the upper plate 202a and the lower plate 202b are spliced so that the foregoing slots form the first vacuum groove 202c.

[0057] The first vacuum groove 202c communicates all the vacuum switches 203. In an embodiment, the vacuum switches 203 are arranged at intervals in the first vacuum groove 202c.

[0058] Referring to FIG. 7, preferably, the first vacuum groove 202c is provided in two groups, one part of the vacuum switch 203 is located in one group of the first vacuum groove 202c, and another part of the vacuum switch 203 is located in another group of the first vacuum groove 202c. Both groups of the first vacuum groove 202c are equipped with a vacuum pipe 204, so as to ensure that all the vacuum switches 203 can generate sufficient negative pressure.

[0059] Referring to FIG. 6, in some embodiments, the upper plate 202a is provided at the top with a plurality of second vacuum grooves 202a-1 corresponding to the vacuum switch 203. The vacuum switch 203 is in communication with the first vacuum groove 202c and the second vacuum groove 202a-1 in the open state, so as to form a negative pressure adsorption panel in the second vacuum groove 202a-1. The second vacuum groove 202a-1 can increase the negative pressure forming area, thereby increasing the adsorption degree of the panel.

[0060] The upper plate 202a is also provided at the top with a third vacuum groove 202a-2 in direct communication with the first vacuum groove 202c, that is, the area where the third vacuum groove 202a-2 is located is always in a negative pressure state, thereby achieving preliminary adsorption of the panel. The third vacuum groove 202a-2 is located in the middle of the side of the vacuum plate 202 close to the auxiliary support assembly 500.

[0061] Referring to FIGS. 8 to 11, the vacuum switch 203 comprises a shell 203a, a sealing cover plate 203b located in the shell 203a, a sealing element 203c and an elastic element 203d. The sealing element 203c has a part extending beyond the sealing cover plate 203b, and the part of the sealing element 203c extending beyond the sealing cover plate 203b forms the protruding part.

[0062] When the protruding part is in a non-pressurized state, under the action of the elastic element 203d, the sealing element 203c is attached to the sealing cover plate 203b to seal the adsorption port of the sealing cover plate 203b, and the vacuum switch 203 is in a closed state. When the protruding part is pressurized, the protruding part is retracted into the shell 203a, the elastic element 203d is synchronously pressurized and compressed, the sealing element 203c is separated from the sealing cover plate 203b, the sealing effect of the sealing cover plate 203b disappears, and the vacuum switch 203 is opened.

[0063] Specifically, the shell 203a is tubular, has a cavity 203a-1 in the shell 203a, the bottom end of the cavity 203a-1 is sealed, and the top end has an opening. The shell 203a is circumferentially provided with a first communication groove 203a-2 in communication with the first vacuum groove 202c and the cavity 203a-1.

[0064] The sealing cover plate 203b is dumbbell-shaped, and has a through hole 203b-1 in the middle of the sealing cover plate 203b, which penetrates the sealing cover plate 203b along the axial direction and serves as the suction port. In an embodiment, the through hole 203b-1 has a gradually increasing radius from top to bottom, and is conical as a whole.

[0065] The sealing cover plate 203b comprises a first cylindrical portion 203b-2, a second cylindrical portion 203b-3, a third cylindrical portion 203b-4 between the first cylindrical portion 203b-2 and the second cylindrical portion 203b-3, and a communication hole 203b-5 provided in the third cylindrical portion 203b-4. The radius of the third cylindrical portion 203b-4 is smaller than the radii of the first cylindrical portion 203b-2 and the second cylindrical portion 203b-3, and a sealing ring cavity 203e is formed between the third cylindrical portion 203b-4 and the cavity 203a-1. The first communication groove 203a-2 communicates the first vacuum groove 202c and the sealing ring cavity 203e.

[0066] The top of the first cylindrical portion 203b-2 is flush with the top of the shell 203a. The radii of the first cylindrical portion 203b-2 and the second cylindrical portion 203b-3 are the same as the inner diameter of the cavity 203a-1, and the outer periphery of the first cylindrical portion 203b-2 and the second cylindrical portion 203b-3 is provided with a sealing ring, so as to realize the sealed connection between the sealing cover plate 203b and the cavity 203a-1. The radius of the third cylindrical portion 203b-4 is smaller than the inner diameter of the cavity 203a-1, so as to form a sealing ring cavity 203e in the cavity 203a-1.

[0067] The communication hole 203b-5 is located outside the through hole 203b-1 in the radial direction, and is used to communicate the sealing ring cavity 203e and the conical through hole 203b-1.

[0068] It should be particularly noted that, in the case where the first cylindrical portion 203b-2 is flush with the upper plate 202a, the top of the first cylindrical portion 203b-2 is provided with a second communication groove 203b-6 that communicates the second vacuum groove 202a-1 and the through hole 203b-1. In this way, when the panel is attached to the first cylindrical portion 203b-2, the second vacuum groove 202a-1 can form a negative pressure.

[0069] In other embodiments, the sealing cover plate 203b can be integrally provided with the vacuum plate 202, and the suction port is provided on the vacuum plate 202.

[0070] The sealing member 203c comprises a bottom plate 203c-1 abutting against the second cylindrical part 202b-3, an abutting block 203c-2 on the top of the bottom plate 203c-1, and a sealing ring 203c-3 between the bottom plate 203c-1 and the second cylindrical part 203b-3. The sealing ring 203c-3 is fixed on the bottom plate 203c-1.

[0071] The abutting block 203c-2 has the same shape as the through hole 203b-1, the abutting block 203c-2 passes through the through hole 203b-1, and the height of the abutting block 203c-2 is greater than the height of the sealing cover plate 203b, the part of the abutting block 203c-2 beyond the sealing cover plate 203b forms the protruding part.

[0072] One end of the elastic member 203d is fixed on the bottom of the cavity 203a-1, and the other end is fixed on the bottom of the bottom plate 203c-1. The elastic member 203d is always in a compressed state, thereby pressing the bottom plate 203c-1 to make the sealing ring 203c-3 tightly abut against the second cylindrical part 202b-3, thereby sealing the communication hole 203b-5. The elastic member 203d preferably adopts a spring.

[0073] When the vacuum plate 202 is not placed on the panel, the abutting block 203c-2 passes through the through hole 203b-1, and under the action of the elastic member 203d, the sealing ring 203c-3 tightly abuts against the second cylindrical part 202b-3, thereby sealing the communication hole 203b-5. The sealing ring cavity 203e and the through hole 203b-1 are not in communication.

[0074] The communication hole 203b-5 is in a negative pressure state, thereby adsorbing the sealing ring 203c-3 to further seal the communication hole 203b-5. The vacuum switch 203 is kept in a closed state under the double action of the elastic member 203d and the negative pressure. At the same time, the abutting block 203c-2 abuts against the inner wall of the through hole 203b-1, which also plays a sealing role.

[0075] When the panel is placed on the vacuum plate 202, the top of the abutting block 203c-2 first contacts the panel. Under the gravity of the panel, the abutting block 203c-2 is pressed to move into the cavity 203a-1 against the supporting force of the elastic member 203d, and the elastic member 203d is further compressed. The abutting block 203c-2 moves downward, and the sealing ring 203c-3 is separated from the second cylindrical part 202b-3, the sealing effect of the communication hole 203b-5 is cancelled, and the sealing ring cavity 203e and the through hole 203b-1 are connected.

[0076] When the vacuum switch 203 is opened, the first vacuum groove 202c is connected with the second vacuum groove 202a-1 through the first communication groove 203a-2, the sealing ring cavity 203e, the communication hole 203b-5, the through hole 203b-1, and the second communication groove 203b-6.

[0077] When the panel is bonded with the chip, the vacuum pump 204 is closed, the negative pressure state in the second vacuum groove 202a-1 disappears, and the panel is removed. The pressure on the abutting block 203c-2 disappears, and the abutting block 203c-2 is popped out again under the action of the elastic member 203d, the sealing ring 203c-3 is tightly attached to the second cylindrical part 202b-3 to reseal the communication hole 203b-5. The vacuum switch 203 is closed.

[0078] In some embodiments, the vacuum plate 202 is further connected with a PCB tray 202d on one side close to the auxiliary support assembly 500, which is used to support the panel together with the vacuum plate 202 during the bonding process to protect the panel from being damaged. The PCB tray 202d and the vacuum plate 202 are provided with a through hole 202e therebetween.

[0079] Referring to FIGS. 12-15, the pressure head assembly 300 includes a sliding rail unit 301 located in the fixed frame 102, a pneumatic unit 302 slidingly installed in the sliding rail unit 301 in a first direction, and a pressure head unit 303 connected to the pneumatic unit 302. The sliding rail unit 301 is used to drive the pressure head unit 303 to move in the first direction, the pneumatic unit 302 is used to drive the pressure head unit 303 to move in a height direction, and the pressure head unit 303 is used to adsorb a chip and bond the chip to a panel.

[0080] Specifically, the fixed frame 102 is provided with a moving groove extending in a first direction, and the pressing head unit 303 extends from the moving groove. The slide rail unit 301 comprises a slide rail 301a extending in the first direction, a motor 301b located on one side of the slide rail 301a, a drive screw 301c connected with the output end of the motor 301b, and a moving block 301d threadedly connected with the drive screw 301c, and the pneumatic unit 302 is fixed on the moving block 301d.

[0081] The motor 301b drives the drive screw 301c to rotate, thereby driving the moving block 301d threadedly connected with the drive screw 301c to move along the drive screw 301c, and further driving the pneumatic unit 302 and the pressing head unit 303 to move in the first direction.

[0082] The pneumatic unit 302 comprises a first connecting block, a second connecting block slidingly connected with the first connecting block in a height direction, and a drive cylinder for driving the second connecting block to slide. The first connecting block is fixedly connected with the moving block 301d, the pressing head unit 303 is fixed on the second connecting block, and the pressing head unit 303 is driven by the drive cylinder to move in the height direction.

[0083] The pressing head unit 303 comprises a fixed block 303a fixed on the second connecting block, a horizontal adjusting member 303b connected with the fixed block 303a, and a pressing head 303c connected with the horizontal adjusting member 303b. The horizontal adjusting member 303b is used for adjusting the pressing head 303c to keep it in a horizontal state, thereby ensuring that the chip is pressed onto the panel horizontally, and the pressing head 303c is used for adsorbing the chip.

[0084] The fixed block 303a is provided with locking screws 303a-1 on both sides in a second direction, and is further provided with a plurality of first stop screws 303a-2 located between the two groups of locking screws 303a-1. The top of the horizontal adjusting member 303b is provided with a convex step 303b-1. The first stop screws 303a-2 and the locking screws 303a-1 are arranged in a front-rear direction. The locking screws 303a-1, the first stop screws 303a-2 and the convex step 303b-1 are matched to adjust the pressing head 303c to keep it horizontal in the second direction (or front-rear direction).

[0085] The horizontal adjusting member 303b is provided with second stop screws 303b-2 on both sides in a first direction, which are used to adjust the pressing head 303c to keep it horizontal in the first direction (or left-right direction).

[0086] The horizontal adjusting member 303b is further provided with a heating rod 303b-3 and a vacuum tube 303b-4. The heating rod 303b-3 is used to heat the pressing head 303c, and the vacuum tube 303b-4 is used to provide vacuum adsorption for the pressing head 303c. The bottom of the pressing head 303c is provided with a vacuum adsorption port in communication with the vacuum tube 303b-4 to adsorb the chip.

[0087] The horizontal adjusting member 303b is further provided with heat insulation ceramic to prevent heat of the heating rod 303b-3 from being transferred to the fixing block 303a.

[0088] The pressing head unit 303 further includes a pressing block 303d used to fix the pressing head 303c on the horizontal adjusting member 303b. The pressing head 303c is located between the horizontal adjusting member 303b and the pressing block 303d, and the three are fixed by bolts.

[0089] The tray carrying assembly 400 is located on the top of the carrying platform 101, and is used to fix a tray carrying chips. The pressing platform 200 and the tray carrying assembly 400 are arranged along the first direction, so that the pressing head unit 303 moving along the first direction adsorbs the chips on the tray and moves to the pressing platform 200 to be bonded with the panel.

[0090] Referring to FIGS. 16-18, the tray carrying assembly 400 includes a pneumatic carrying table 401, a first three-axis sliding table 402 located on the top of the pneumatic carrying table 401, and a tray fixing member 403 located on the top of the first three-axis sliding table 402.

[0091] The pneumatic carrying table 401 has the same structure as the pneumatic unit 302, and when the pressing head unit 303 touches the tray to suck the chips in the tray, the pressure of the pressing head unit 303 is greater than the cylinder force of the pneumatic carrying table 401, so that the tray is pressed to a certain extent, ensuring that the pneumatic unit 302 can suck the chips without damaging the chips.

[0092] The first three-axis sliding table 402 is used to adjust the position of the tray to cooperate with the pneumatic unit 302. The first three-axis sliding table 402 can displace the tray in X, Y, and Z directions to adjust the position of the chips to be taken to align with the pressing head unit 303. The first three-axis sliding table 402 can adopt an existing adjustable sliding table, such as a three-axis fine adjustment displacement platform with a model of LD80.

[0093] The tray fixing member 403 is used to carry and fix the tray with chips. The tray carrying member 403 includes a fixing plate 403a, a guide member 403b, and a limiting member 403c.

[0094] The fixed plate 403a is fixed on the top of the first three-axis slide table 402. The fixed plate 403a is a rectangular plate with a bearing surface for bearing a tray. Two adjacent edges of the fixed plate 403a are provided with a first stop edge 403a-1 and a second stop edge 403a-2, which exceed the bearing surface. The bearing surface of the fixed plate 403a is provided with a mounting groove 403a-3 extending along a diagonal line, and the diagonal line where the mounting groove 403a-3 is located is the angle bisector of the first stop edge 403a-1 and the second stop edge 403a-2.

[0095] The guide 403b includes a guide plate 403b-1 fixed in the mounting groove 403a-3, a guide groove 403b-2 provided in the guide plate 403b-1, and a spring 403b-3 provided in the guide groove 403b-2. The height of the guide plate 403b-1 is the same as the depth of the mounting groove 403a-3, so that the guide plate 403b-1 is flush with the bearing surface and does not affect the fixing of the tray. The end of the guide plate 403b-1 is provided with a fixed part 403b-11, and the mounting groove 403a-3 is provided with a mounting part 403a-31 spaced apart from the fixed part 403b-11, so that the mounting position of the guide 403b can be adjusted according to the size of the tray. The guide groove 403b-2 extends from the fixed part 403b-11 to an end away from the fixed part 403b-11, and the end of the guide groove 403b-2 away from the fixed part 403b-11 has an opening.

[0096] The limiting part 403c is inserted into the guide groove 403b-2 from the opening, one end of the spring 403b-3 is fixed in the guide groove 403b-2, and the other end is connected with the limiting part 403c, so as to pull the limiting part 403c to move into the guide groove 403b-2. The end of the limiting part 403c away from the spring 403b-3 has a limiting part 403c-1, and the height of the limiting part 403c-1 is greater than the height of the guide plate 403b-1, so that the limiting part 403c-1 cannot enter the guide groove 403b-2. The limiting part 403c-1 has an L-shaped abutting surface to cooperate with the first stop edge 403a-1 and the second stop edge 403a-2 to fix the tray.

[0097] It should be particularly noted that when the limiting part 403c-1 abuts against the guide plate 403b-1, the spring 403b-3 is in a stretched state.

[0098] In some embodiments, the guide slot 403b-2 is provided with a connecting rod 403b-21 at one end of the fixing portion 403b-11, the limiting member 403c is provided with a connecting hole 403c-2 at one end away from the limiting portion 403c-1, and the two ends of the spring 403b-3 are connected to the connecting rod 403b-21 and the connecting hole 403c-2 respectively by hooks. The bottom of the guide plate 403b-1 is provided with a dismounting slot corresponding to the spring 403b-3 and communicating with the guide slot 403b-2, through which the spring 403b-3 or the limiting member 403c can be dismounted and replaced.

[0099] During installation, first, the guide member 403b with the limiting member 403c is installed in the appropriate position in the mounting slot 403a-3 according to the size of the tray. The limiting member 403c is pulled out of the guide slot 403b-2, the tray is placed on the bearing surface of the fixing plate 403a and brought into contact with the first and second stop edges 403a-1 and 403a-2. The limiting member 403c is released and moved into the guide slot 403b-2 under the action of the spring 403b-3 until the limiting portion 403c-1 abuts against the tray. The tray is fixed by the limiting portion 403c-1, the first and second stop edges 403a-1 and 403a-2 under the action of the spring 403b-3.

[0100] The limiting member 403c movably installed in the guide member 403b can fix trays of different sizes, and the installation and dismounting are convenient and fast.

[0101] The auxiliary support assembly 500 is located on the top of the bearing platform 101, and is used to directly support the panel, thereby ensuring the stability of the panel when the chip is bonded to the panel. The auxiliary support assembly 500 is arranged along the second direction with the pressing platform 200. It should be particularly pointed out that the auxiliary support assembly 500 is located directly below the pressing head assembly 300.

[0102] The auxiliary support assembly 500 comprises a first frame 501, a second frame 502 slidably connected to the first frame 501 along the height direction (or the up-down direction), and a transparent support strip 503 fixed to the top of the second frame 502. The second frame 502 is movable along the height direction to adjust the support height of the auxiliary support assembly 500, and the transparent support strip 503 is used to support the panel.

[0103] Specifically, the first frame 501 comprises a first body 501a, a rotating rod 501b connected to the first body 501a, a first helical gear 501c on the rotating rod 501b, a second helical gear 501d engaged with the first helical gear 501c, and a screw rod 501e connected to the second helical gear 501d and extending in the height direction. The rotating rod 501b is perpendicular to the screw rod 501e.

[0104] The second frame 502 comprises a second body 502a slidingly connected to the first body 501a, a nut 502b connected to the screw rod 501e, and a window 502c on the top of the second body 502a. The nut 502b is fixed to the bottom of the second body 502a. One of the first body 501a and the second body 502a is provided with a sliding groove, and the other is provided with a sliding block, so that the second body 502a moves in the height direction relative to the first body 501a.

[0105] When it is necessary to adjust the support height of the auxiliary support assembly 500, the rotating rod 501b is rotated to drive the first helical gear 501c to rotate synchronously, the first helical gear 501c drives the second helical gear 501d engaged therewith to rotate synchronously, and the second helical gear 501d drives the screw rod 501e to rotate synchronously, so that the nut 502b on the screw rod 501e moves up and down along the screw rod 501e, thereby driving the second body 502a to move in the height direction.

[0106] The transparent support strip 503 is opposite to the window 502c, so that the alignment assembly 600 can shoot the pressing head 303c and the adsorbed chip through the transparent support strip 503 through the window 502c. Preferably, the transparent support strip 503 is a quartz strip.

[0107] The alignment assembly 600 is located on the top of the bearing platform 101 and is used for shooting the chip and aligning the bonding area on the panel with the chip. The auxiliary support assembly 500 is located between the pressing platform 200 and the alignment assembly 600. The alignment assembly 600 comprises a second three-axis sliding table 601 and a camera module 602 on the top of the second three-axis sliding table 601, which extends directly below the transparent support strip 503.

[0108] The second three-axis sliding table 601 is the same as the first three-axis sliding table 402, and is used for adjusting the position of the camera module 602 to make the shooting picture clear. The camera module 602 extends directly below the transparent support strip 503 to shoot the chip and align the bonding area on the panel with the chip.

[0109] The following detailed description of the specific use steps of the device is as follows:

[0110] The tray with the chip is fixed on the top of the tray bearing assembly 400, and the limiting piece 403c can realize the fixation of trays of different sizes.

[0111] The pressing head unit 303 is moved along the first direction so as to move to the top of the tray bearing assembly 400. The pressing head unit 303 is lowered to suck the chip on the tray through the pressing head 303c.

[0112] The pressing head unit 303 is raised and moved along the first direction to the top of the auxiliary support assembly 500. The pressing head unit 303 is lowered and the position of the camera module 602 is adjusted through the second three-axis slide 601 so that the captured chip image is clear.

[0113] The pressing head unit 303 is raised, and the panel is placed on the top of the pressing platform 200. The vacuum switch 203 is automatically opened under the pressure of the panel to adsorb and fix the panel. When placing, the bonding area of the panel is kept as much as possible above the auxiliary support assembly 500.

[0114] The position of the vacuum plate 202 and the panel thereon is fine-tuned through the displacement adjustment support 201. The camera module 602 captures the panel in real time and aligns the captured panel image with the captured chip image until the bonding area of the panel completely coincides with the chip image, and the alignment is completed.

[0115] The auxiliary support assembly 500 is raised to support the panel. The transparent support strip 503 passes through the through hole 202e between the PCB tray 202d and the vacuum plate 202 to support the panel.

[0116] The pressing head unit 303 is lowered to bond the chip to the bonding area of the panel. After the bonding is completed, the vacuum switch 203 is closed, the pressing head unit 303 is raised, and the panel is removed.

[0117] As described above, the vacuum switch 203 can realize the opening of different areas of the vacuum according to the coverage area of the panel. When the vacuum switch 203 is pressed by the panel, it is automatically opened to adsorb the panel. The vacuum switch 203 not pressed by the panel remains in the closed state. The tray bearing assembly 400 can realize the fixation of trays of different sizes, which is convenient and fast to disassemble and assemble. The auxiliary support assembly 500 ensures the stability of the panel when the chip is bonded to the panel. The alignment assembly 600 aligns the bonding area on the panel with the chip. The bonding efficiency and bonding reliability are greatly improved.

[0118] It should be understood that although the present specification describes each example as comprising a single independent technical solution, the specification is merely for the sake of clarity and those skilled in the art should consider the specification as a whole, and the technical solutions in each example can also be combined appropriately to form other examples that those skilled in the art can understand.

[0119] The above series of detailed descriptions are merely specific descriptions of feasible embodiments of the present application, and are not intended to limit the protection scope of the present application, and equivalent embodiments or changes made without departing from the spirit of the present application should be included in the protection scope of the present application.

Claims

1. A chip mounter characterized by comprising: The application relates to a chip bonding device. The device comprises a rack, a pressing platform on the top of the rack, and a pressing head assembly movably mounted on the rack. The pressing platform comprises a vacuum plate for placing a panel, displacement adjustment supports for adjusting the position of the vacuum plate, and a plurality of vacuum switches arranged on the vacuum plate. The vacuum plate or the vacuum switch is provided with a suction port.

2. The chip mounter according to Claim 1, characterized by: The vacuum switch comprises a protruding part.

3. The chip mounter according to Claim 2, characterized by: The vacuum switch has a closed state in which the protruding part protrudes out of the plane of the vacuum plate to seal the suction port, and an open state in which the protruding part is retracted into the vacuum switch to open the suction port. The pressing head assembly is used for sucking a chip and bonding the chip to the panel. The vacuum plate comprises an upper plate, a lower plate, and a first vacuum groove between the upper plate and the lower plate. The vacuum switches are arranged in the first vacuum groove. The vacuum switch comprises a shell with a cavity, a first communication groove on the shell for connecting the first vacuum groove and the cavity, a sealing cover plate fixed in the cavity, a through hole in the middle of the sealing cover plate as the suction port, a sealing element comprising a bottom disc abutting against the bottom of the sealing cover plate and an abutting block on the top of the bottom disc, the abutting block passing through the through hole, the height of the abutting block being greater than the height of the sealing cover plate, and the part of the abutting block protruding out of the sealing cover plate forming the protruding part, and an elastic element at the bottom of the cavity abutting against the top of the bottom disc.

4. The chip mounter according to Claim 3, characterized by: The sealing cover plate comprises a first cylindrical part, a second cylindrical part, a third cylindrical part between the first cylindrical part and the second cylindrical part, and a communication hole in the second cylindrical part. The third cylindrical part has a smaller radius than the first cylindrical part and the second cylindrical part.

5. The chip mounter according to Claim 3, characterized by: The third cylindrical part and the cavity form a sealing ring cavity.

6. The chip mounter according to Claim 5, characterized by: The bottom disc abuts against the second cylindrical part.

7. The chip mounter according to Claim 3, characterized by: The sealing element further comprises a sealing ring between the bottom disc and the second cylindrical part.

8. The chip mounter according to Claim 1, characterized by: The top of the upper plate is provided with a second vacuum groove. The sealing cover plate is flush with the upper plate. The top of the sealing cover plate is provided with a second communication groove connecting the second vacuum groove and the through hole. The top of the first cylindrical part is flush with the top of the shell. The radii of the first cylindrical part and the second cylindrical part are the same as the inner diameter of the cavity. The outer circumferential surface of the first cylindrical part and the second cylindrical part is provided with a sealing ring. The radius of the through hole gradually increases from top to bottom. The pressing head assembly comprises a slide rail unit in the rack, a pneumatic unit slidably mounted on the slide rail unit in a first direction, and a pressing head unit connected to the pneumatic unit. The pneumatic unit drives the pressing head unit to move in the height direction.

9. The chip mounter according to Claim 8, characterized by: The pressure head unit comprises a fixed block fixed to the pneumatic unit, a horizontal adjusting member connected to the fixed block, and a pressure head connected to the horizontal adjusting member, wherein a heating rod and a vacuum tube are arranged on the horizontal adjusting member, and the bottom of the pressure head is provided with a vacuum suction port in communication with the vacuum tube.

10. The chip mounter according to Claim 1, characterized by: The chip bonding machine further comprises a tray bearing assembly on the top of the bearing platform, the bonding platform and the tray bearing assembly are arranged along a first direction, and the tray bearing assembly comprises a tray fixing member, a first three-axis sliding table for adjusting the position of the tray fixing member, and a pneumatic bearing table for supporting the first three-axis sliding table.

11. The chip mounter according to Claim 10, wherein: The tray fixing member comprises: a fixed plate provided with adjacent first and second stop edges and a mounting groove extending along a diagonal line; a guide member comprising a guide plate fixed in the mounting groove, a guide groove arranged in the guide plate, and a spring in the guide groove; a limiting member movably mounted in the guide groove, one end of the limiting member being connected with the spring, and the other end of the limiting member having a limiting portion extending to the outside of the guide groove.

12. The chip mounter according to Claim 1, characterized by: The chip bonding machine further comprises an auxiliary support assembly on the top of the bearing platform, and the auxiliary support assembly is arranged along a second direction with the bonding platform; The auxiliary support assembly comprises a first frame, a second frame in sliding connection with the first frame along a height direction, and a transparent support strip fixed to the top of the second frame.

13. The chip mounter according to Claim 12, characterized by: The first frame comprises a first main body, a rotating rod rotatably connected to the first main body, a first helical gear on the rotating rod, a second helical gear meshing with the first helical gear, and a screw rod connected with the second helical gear, the screw rod extending along the height direction; The second frame comprises a second main body in sliding connection with the first main body, a nut connected to the screw rod, and a window arranged on the top of the second main body; The transparent support strip is opposite to the window, and the transparent support strip is a quartz strip.

14. The chip mounter according to Claim 12, characterized by: The chip bonding machine further comprises an alignment assembly on the top of the bearing platform, the auxiliary support assembly is located between the bonding platform and the alignment assembly, the alignment assembly comprises a camera module and a second three-axis sliding table for adjusting the position of the camera module, and the camera module extends directly below the transparent support strip.

Images