Camera module including OIS carrier and electronic device including same

Abstract

The camera module may comprise: a lens assembly including lenses having an optical axis; a shield can spaced apart from the lens assembly and including an opening laterally surrounding the lens assembly; an OIS carrier configured to move in a direction perpendicular to the optical axis of the lenses and including a sidewall defining a space for accommodating the lens assembly; and an AF carrier configured to move along the optical axis of the lenses and including a sidewall defining a space for accommodating the lens assembly and the OIS carrier, wherein the sidewall of the AF carrier includes an accommodation portion, and a portion of the sidewall of the OIS carrier is configured to be accommodated in the accommodation portion of the sidewall of the AF carrier so as to at least partially overlap the sidewall of the AF carrier.

Description

Camera module including an OS carrier and electronic device including the same

[0001] The present disclosure relates to a camera module including an OIS carrier and an electronic device including the same.

[0002] The camera module may have optical image stabilization (OIS) and auto focus (AF) functions to provide users with clear images. Multiple mechanisms may be moved within the camera module to enable OIS movement and AF movement.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0004] In one embodiment, a camera module may include a lens assembly including lenses having an optical axis. The camera module may include the OIS carrier. The OIS carrier may be configured to move in a direction perpendicular to the optical axis of the lens. The OIS carrier may include a sidewall defining an internal space for accommodating the lens assembly and may be configured to move along the optical axis. The camera module may include an AF (auto focus) carrier including a sidewall defining an internal space for accommodating the lens assembly and the OIS carrier, the sidewall including a receiving portion. A portion of the sidewall of the OIS carrier may be configured to be received in the receiving portion of the sidewall of the AF carrier such that, when viewed from above, the sidewall at least partially overlaps with the sidewall of the AF carrier.

[0005] According to one embodiment, an electronic device may include a housing and a camera module disposed within the housing. The camera module may include a lens assembly having an optical axis. The camera module may include an OIS carrier. The OIS carrier may be configured to move perpendicular to the optical axis. The OIS carrier may include a side wall fastened to a side surface of the lens assembly. The camera module may include an AF carrier. The AF carrier may be configured to move along the optical axis. The AF carrier may include a side wall separated from a side wall of the OIS carrier. The OIS carrier may extend from the side wall of the OIS carrier and overlap the side wall of the AF carrier.

[0006] According to one embodiment, a camera module may include a base housing, a lens assembly at least partially surrounded by the base housing, a substrate disposed below the base housing, an image sensor disposed on the substrate so as to be at least partially aligned with an optical axis of the lens assembly, an autofocus (AF) housing received in the base housing and configured to move along a first direction corresponding to the optical axis, the AF housing having a plurality of sidewalls including a first sidewall having a cut area formed therein. The camera module may include an optical image correction (OIS) housing received in the AF housing, receiving the lens assembly, and configured to move along a second direction substantially perpendicular to the optical axis, wherein a second sidewall of the OIS housing may be disposed to at least partially overlap the cut area of ​​the first sidewall when viewed from above.

[0007] FIG. 1A is a diagram illustrating an electronic device according to one embodiment.

[0008] FIG. 1b is an exploded perspective view of an electronic device according to one embodiment.

[0009] FIG. 2 is a perspective view illustrating a camera module of an electronic device according to one embodiment.

[0010] FIG. 3 is an exploded perspective view of a camera module of an electronic device according to one embodiment.

[0011] FIG. 4 is a perspective view illustrating carriers within a camera module of an electronic device, according to one embodiment.

[0012] FIG. 5A is a cross-sectional view of the camera module of FIG. 3 taken along line A-A' of FIG. 2, according to one embodiment.

[0013] FIG. 5b is a cross-sectional view showing an OIS carrier moving in a first direction according to one embodiment.

[0014] FIG. 5C is a cross-sectional view of an exemplary camera module with the OIS carrier moved in a second direction, according to one embodiment.

[0015] FIG. 6 is a cross-sectional view of a camera module with an OIS carrier moved in a first direction, according to one embodiment.

[0016] FIG. 7 is a cross-sectional view of a camera module with an OIS carrier moved in a second direction, according to one embodiment.

[0017] FIG. 8 is a cross-sectional view of the camera module of FIG. 3 taken along line B-B' of FIG. 2, according to one embodiment.

[0018] FIG. 9 is a cross-sectional view of an exemplary camera module with an OIS carrier moved in a third direction, according to one embodiment.

[0019] FIG. 10 is a cross-sectional view of an exemplary camera module including a stopper configured to accommodate a portion of an OIS carrier, according to one embodiment.

[0020] FIG. 11 is a perspective view illustrating an exemplary stopper according to one embodiment.

[0021] FIG. 12 is a cross-sectional view of an exemplary camera module including a stopper having an opening through which a portion of an OIS carrier can pass, according to one embodiment.

[0022] FIG. 13 is a perspective view illustrating an exemplary stopper according to one embodiment.

[0023] FIG. 14 is an exploded perspective view illustrating a camera module including a modified OIS carrier according to one embodiment.

[0024] FIG. 15 is a cross-sectional view of the camera module of FIG. 14, taken along line A-A' of FIG. 2, with the OIS carrier moved in the first direction, according to one embodiment.

[0025] FIG. 16 is a cross-sectional view showing an aligned state of an OIS carrier according to one embodiment.

[0026] FIG. 17 is a cross-sectional view of an exemplary camera module with an OIS carrier moved in a second direction, according to one embodiment.

[0027] FIG. 18 is a cross-sectional view of a camera module with a protrusion of an OIS carrier positioned below, according to one embodiment.

[0028] FIGS. 19 and 20 are cross-sectional views of a camera module including a magnet and a magnet support portion configured to accommodate a protrusion of an OIS carrier, according to one embodiment.

[0029] FIGS. 21 and 22 are cross-sectional views of a camera module including a magnet support portion having a flange, according to one embodiment.

[0030] Figures 23 and 24 are cross-sectional views of a camera module with the stopper omitted, according to one embodiment.

[0031] FIG. 25 is an exploded perspective view of a camera module including an OIS carrier including a receiving portion that accommodates a portion of an AF carrier, according to one embodiment.

[0032] FIGS. 26 and 27 are cross-sectional views of a camera module including an OIS carrier including a receiving portion, according to one embodiment.

[0033] FIG. 28 is an exploded perspective view of a camera module including an OIS carrier including a receiving portion for receiving a portion of a stopper, according to one embodiment.

[0034] FIGS. 29 and 30 are cross-sectional views of a camera module including an OIS carrier including a receiving portion that receives a portion of a stopper, according to one embodiment.

[0035] FIG. 31 is a block diagram of an electronic device within a network environment according to one embodiment.

[0036] FIG. 32 is a block diagram illustrating a camera module according to various embodiments.

[0037] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings so that those skilled in the art can easily implement the present disclosure. However, the present disclosure may be implemented in various different forms and is not limited to the embodiments described herein. In connection with the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Furthermore, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0038] FIG. 1A is a diagram illustrating an electronic device according to one embodiment.

[0039] Referring to FIG. 1A, an electronic device (100) according to one embodiment may include a housing (110) forming an exterior of the electronic device (100). For example, the housing (110) may include a first side (or front side) (100A), a second side (or back side) (100B), and a third side (or side surface) (100C) surrounding a space between the first side (100A) and the second side (100B). In one embodiment, the housing (110) may also refer to a structure (e.g., a frame structure (140) of FIG. 1B) forming at least a portion of the first side (100A), the second side (100B), and / or the third side (100C).

[0040] An electronic device (100) according to one embodiment may include a substantially transparent front plate (102). In one embodiment, the front plate (102) may form at least a portion of the first surface (100A). In one embodiment, the front plate (102) may include, but is not limited to, a glass plate or a polymer plate including various coating layers, for example.

[0041] An electronic device (100) according to one embodiment may include a substantially opaque back plate (111). In one embodiment, the back plate (111) may form at least a portion of the second surface (100B). In one embodiment, the back plate (111) may be formed of a coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials.

[0042] An electronic device (100) according to one embodiment may include a side bezel structure (or side member) (118) (e.g., a side wall (141) of a frame structure (140) of FIG. 1B). In one embodiment, the side bezel structure (118) may be combined with a front plate (102) and / or a rear plate (111) to form at least a portion of a third side (100C) of the electronic device (100). For example, the side bezel structure (118) may form the entire third side (100C) of the electronic device (100), or, for another example, the side bezel structure (118) may form the third side (100C) of the electronic device (100) together with the front plate (102) and / or the rear plate (111).

[0043] Unlike the illustrated embodiment, when the third side (100C) of the electronic device (100) is partially formed by the front plate (102) and / or the rear plate (111), the front plate (102) and / or the rear plate (111) may include a region that extends seamlessly from its edge toward the rear plate (111) and / or the front plate (102). The extending region of the front plate (102) and / or the rear plate (111) may be located at both ends of a long edge of the electronic device (100), for example, but is not limited to the above-described example.

[0044] In one embodiment, the side bezel structure (118) may comprise a metal and / or a polymer. In one embodiment, the back plate (111) and the side bezel structure (118) may be formed integrally and may comprise the same material (e.g., a metal material such as aluminum), but is not limited thereto. For example, the back plate (111) and the side bezel structure (118) may be formed as separate components and / or may comprise different materials.

[0045] In one embodiment, the electronic device (100) may include at least one of a display (101), an audio module (103, 104, 107), a sensor module (not shown), a camera module (105, 112, 113), a key input device (117), a light emitting element (not shown), and / or a connector hole (108). In one embodiment, the electronic device (100) may omit at least one of the above components (e.g., the key input device (117) or the light emitting element (not shown)) or may additionally include other components.

[0046] In one embodiment, the display (101) (e.g., the display module (3160) of FIG. 31) may be visually exposed through a substantial portion of the front plate (102). For example, at least a portion of the display (101) may be visible through the front plate (102) forming the first side (100A). In one embodiment, the display (101) may be disposed on the back surface of the front plate (102).

[0047] In one embodiment, the outer shape of the display (101) may be formed to be substantially the same as the outer shape of the front plate (102) adjacent to the display (101). In one embodiment, in order to expand the area where the display (101) is visually exposed, the gap between the outer shape of the display (101) and the outer shape of the front plate (102) may be formed to be substantially the same.

[0048] In one embodiment, the display (101) (or the first surface (100A) of the electronic device (100)) may include a screen display area (101A). In one embodiment, the display (101) may provide visual information to a user through the screen display area (101A). In the illustrated embodiment, when the first surface (100A) is viewed from the front (e.g., viewed from +z), the screen display area (101A) is depicted as being positioned on the inside of the first surface (100A) and spaced apart from the periphery of the first surface (100A), but is not limited thereto. In one embodiment, when the first surface (100A) is viewed from the front, at least a portion of an edge of the screen display area (101A) may substantially coincide with an edge of the first surface (100A) (or the front plate (102)).

[0049] In one embodiment, the screen display area (101A) may include a sensing area (101B) configured to acquire biometric information of the user. Here, the meaning of "the screen display area (101A) includes the sensing area (101B)" may be understood to mean that at least a portion of the sensing area (101B) may overlap the screen display area (101A). For example, the sensing area (101B) may be an area capable of displaying visual information by the display (101) like other areas of the screen display area (101A) and additionally capable of acquiring biometric information of the user (e.g., a fingerprint). In one embodiment, the sensing area (101B) may also be formed in the key input device (117).

[0050] In one embodiment, the display (101) may include an area where a first camera module (105) (e.g., camera module (3180) of FIG. 31) is positioned. In one embodiment, an opening is formed in the area of ​​the display (101), and the first camera module (105) (e.g., a punch hole camera) may be at least partially positioned within the opening so as to face the first surface (100A). In this case, the screen display area (101A) may surround at least a portion of an edge of the opening. In one embodiment, the first camera module (105) (e.g., an under display camera (UDC)) may be positioned under the display (101) so as to overlap the area of ​​the display (101). In this case, the display (101) can provide visual information to the user through the above area, and additionally, the first camera module (105) can obtain an image corresponding to the direction toward the first surface (100A) through the above area of ​​the display (101).

[0051] In one embodiment, the display (101) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic field-type stylus pen.

[0052] In one embodiment, the audio module (103, 104, 107) (e.g., audio module (3170) of FIG. 31) may include a microphone hole (103, 104) and a speaker hole (107).

[0053] In one embodiment, the microphone holes (103, 104) may include a first microphone hole (103) formed in a portion of the third surface (100C) and a second microphone hole (104) formed in a portion of the second surface (100B). A microphone (not shown) for acquiring external sound may be placed inside the microphone holes (103, 104). The microphone may include multiple microphones to detect the direction of the sound.

[0054] In one embodiment, the second microphone hole (104) formed in a portion of the second surface (100B) may be positioned adjacent to the camera module (105, 112, 113). For example, the second microphone hole (104) may acquire sound according to the operation of the camera module (105, 112, 113). However, the present invention is not limited thereto.

[0055] In one embodiment, the speaker hole (107) may include an external speaker hole (107) and a call receiver hole (not shown). The external speaker hole (107) may be formed on a part of the third surface (100C) of the electronic device (100). In one embodiment, the external speaker hole (107) may be implemented as a single hole with the microphone hole (103). Although not shown, the call receiver hole (not shown) may be formed on another part of the third surface (100C). For example, the call receiver hole may be formed on the opposite side of the external speaker hole (107) on the third surface (100C). For example, based on the city of FIG. 1A, the external speaker hole (107) may be formed on the third surface (100C) corresponding to the lower portion of the electronic device (100), and the call receiver hole may be formed on the third surface (100C) corresponding to the upper portion of the electronic device (100). However, this is not limited thereto, and in one embodiment, the call receiver hole may be formed at a location other than the third surface (100C). For example, the call receiver hole may be formed by a spaced space between the front plate (102) (or, display (101)) and the side bezel structure (118).

[0056] In one embodiment, the electronic device (100) may include at least one speaker (not shown) configured to output sound to the outside of the housing (110) through an external speaker hole (107) and / or a call receiver hole (not shown).

[0057] In one embodiment, a sensor module (not shown) (e.g., sensor module (3176) of FIG. 31) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (100) or an external environmental state. For example, the sensor module may include at least one of a proximity sensor, an HRM sensor, a fingerprint sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0058] In one embodiment, a camera module (105, 112, 113) (e.g., camera module (3180) of FIG. 31) may include a first camera module (105) positioned to face a first side (100A) of the electronic device (100), a second camera module (112) positioned to face a second side (100B), and a flash (113).

[0059] In one embodiment, the second camera module (112) may include multiple cameras (e.g., dual cameras, triple cameras, or quad cameras). The second camera module (112), for example, the second microphone hole (104), may include a camera such as a camera, a wide-angle camera, an ultra-wide-angle camera, or a TOF (time of flight) camera. However, the second camera module (112) is not limited to including multiple cameras and may include one camera. The second camera module (112) and the flash (113) may be arranged together with the second microphone hole (104).

[0060] In one embodiment, the first camera module (105) and the second camera module (112) may include one or more lenses, image sensors, and / or image signal processors.

[0061] In one embodiment, the flash (113) may include, for example, a light emitting diode or a xenon lamp. In one embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be arranged on one side of the electronic device (100).

[0062] In one embodiment, a key input device (117) (e.g., input module (3150) of FIG. 31) may be disposed on a third side (100C) of the electronic device (100). In one embodiment, the electronic device (100) may not include some or all of the key input devices (117), and the key input devices (117) that are not included may be implemented in another form, such as a soft key, on the display (101).

[0063] In one embodiment, a connector hole (108) may be formed on the third surface (100C) of the electronic device (100) so that a connector of an external device can be accommodated. A connection terminal (e.g., a connection terminal (3178) of FIG. 31) electrically connected to the connector of the external device may be arranged within the connector hole (108). The electronic device (100) according to one embodiment may include an interface module (e.g., an interface (3177) of FIG. 31) for processing electrical signals transmitted and received through the connection terminal.

[0064] In one embodiment, the electronic device (100) may include a light-emitting element (not shown). For example, the light-emitting element (not shown) may be disposed on a first surface (100A) of the housing (110). The light-emitting element (not shown) may provide status information of the electronic device (100) in the form of light. In one embodiment, the light-emitting element (not shown) may provide a light source that is linked to the operation of the first camera module (105). For example, the light-emitting element (not shown) may include an LED, an IR LED, and / or a xenon lamp.

[0065] FIG. 1b is an exploded perspective view of an electronic device according to one embodiment.

[0066] In the following, redundant descriptions of configurations having the same reference numerals as the configurations described above are omitted.

[0067] Referring to FIG. 1B, an electronic device (100) according to one embodiment may include a frame structure (140), a first printed circuit board (150), a second printed circuit board (152), a cover plate (160), and a battery (170).

[0068] In one embodiment, the frame structure (140) may include a side wall (141) forming an exterior of the electronic device (100) (e.g., the third side (100C) of FIG. 1A) and a support portion (143) extending inwardly from the side wall (141). In one embodiment, the frame structure (140) may be disposed between the display (101) and the back plate (111). In one embodiment, the side wall (141) of the frame structure (140) may surround a space between the back plate (111) and the front plate (102) (and / or the display (101)), and the support portion (143) of the frame structure (140) may extend from the side wall (141) within the space. According to one embodiment, a side wall (141) forming a side surface of an electronic device (100) (e.g., a third surface (100C) of FIG. 1A) may include a speaker hole (107) connecting the inside and the outside of the electronic device (100). The speaker hole (107) may penetrate the side wall (141).

[0069] In one embodiment, the frame structure (140) may support or accommodate other components included in the electronic device (100). For example, a display (101) may be disposed on one side of the frame structure (140) facing one direction (e.g., +z direction), and the display (101) may be supported by a support portion (143) of the frame structure (140). For another example, a first printed circuit board (150), a second printed circuit board (152), a battery (170), and a second camera module (112) may be disposed on the other side of the frame structure (140) facing the opposite direction (e.g., -z direction). The first printed circuit board (150), the second printed circuit board (152), the battery (170), and the second camera module (112) can each be mounted in a recess defined by a side wall (141) and / or a support portion (143) of the frame structure (140).

[0070] In one embodiment, the first printed circuit board (150), the second printed circuit board (152), and the battery (170) may be respectively coupled to the frame structure (140). For example, the first printed circuit board (150) and the second printed circuit board (152) may be fixedly disposed to the frame structure (140) via a coupling member such as a screw. For example, the battery (170) may be fixedly disposed to the frame structure (140) via an adhesive member (e.g., double-sided tape). However, the present invention is not limited to the above-described examples.

[0071] In one embodiment, the cover plate (160) may be disposed between the first printed circuit board (150) and the back plate (111). In one embodiment, the cover plate (160) may be disposed on the first printed circuit board (150). For example, the cover plate (160) may be disposed on a surface of the first printed circuit board (150) facing the -z direction.

[0072] In one embodiment, the cover plate (160) may at least partially overlap the first printed circuit board (150) with respect to the z-axis. In one embodiment, the cover plate (160) may cover at least a portion of the first printed circuit board (150). In this way, the cover plate (160) may protect the first printed circuit board (150) from physical impact or prevent detachment of a connector coupled to the first printed circuit board (150).

[0073] In one embodiment, the cover plate (160) may be fixedly positioned on the first printed circuit board (150) via a joining member (e.g., a screw), or may be joined to the frame structure (140) together with the first printed circuit board (150) via the joining member.

[0074] In one embodiment, the display (101) may be positioned between a frame structure (140) and a front plate (102). For example, the front plate (102) may be positioned on one side (e.g., in the +z direction) of the display (101), and the frame structure (140) may be positioned on the other side (e.g., in the -z direction).

[0075] In one embodiment, the front plate (102) may be coupled with the display (101). For example, the front plate (102) and the display (101) may be bonded to each other via an optically clear adhesive (e.g., optically clear adhesive (OCA) or optically clear resin (OCR)) disposed therebetween.

[0076] In one embodiment, the front plate (102) may be coupled with a frame structure (140). For example, the front plate (102) may include an outer portion extending outside the display (101) when viewed in the z-axis direction, and may be adhered to the frame structure (140) through an adhesive member (e.g., double-sided tape) disposed between the outer portion of the front plate (102) and the frame structure (140) (e.g., side wall (141)). However, the present invention is not limited to the above-described example.

[0077] In one embodiment, the first printed circuit board (150) and / or the second printed circuit board (152) may be equipped with a processor (e.g., processor (3120) of FIG. 31), memory (e.g., memory (3130) of FIG. 31), and / or an interface (e.g., interface (3177) of FIG. 31). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (100) to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector. In one embodiment, the first printed circuit board (150) and the second printed circuit board (152) may be operatively or electrically connected to each other via a connecting member (e.g., a flexible printed circuit board).

[0078] In one embodiment, a battery (170) (e.g., battery (3189) of FIG. 31 ) may power at least one component of the electronic device (100). For example, the battery (170) may include a rechargeable secondary battery or a fuel cell. At least a portion of the battery (170) may be disposed substantially coplanar with the first printed circuit board (150) and / or the second printed circuit board (152).

[0079] An electronic device (100) according to one embodiment may include an antenna module (not shown) (e.g., antenna module (3197) of FIG. 31). In one embodiment, the antenna module may be disposed between the rear plate (111) and the battery (170). The antenna module may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna module may, for example, perform short-range communication with an external device or wirelessly transmit and receive power with an external device.

[0080] In one embodiment, the housing (110) of the electronic device (100) may refer to a configuration or structure that forms at least a portion of the exterior of the electronic device (100). In this respect, at least a portion of the front plate (102), the frame structure (140), and / or the rear plate (111) that form the exterior of the electronic device (100) may be referred to as the housing (110) of the electronic device (100).

[0081] FIG. 2 is a perspective view illustrating a camera module of an electronic device according to one embodiment. FIG. 3 is an exploded perspective view of a camera module of an electronic device according to one embodiment. FIG. 4 is a perspective view illustrating carriers within a camera module of an electronic device according to one embodiment.

[0082] In one embodiment, within this document, "B disposed on (or upon) A" may refer to "B disposed over A." For example, within this document, "B disposed on (or upon) A" may refer to "B facing A and spaced apart from A." For example, when an element is referred to as being "on" another element, it should be understood that it may be directly on the other element or there may be intervening elements between them. Conversely, when an element is referred to as being "directly on" another element, there may not be any intervening elements.

[0083] Referring to FIG. 2, the camera module (300) may be substantially the same as or similar to the camera module included in the electronic device (100) of FIG. 1A (e.g., the camera module (112) of FIG. 1A). The camera module (300) may include a lens assembly (310), a shield can (330), and a printed circuit board (390). The lens assembly (310) may be disposed within an internal space defined by the shield can (330). The lens assembly (310) may be partially visually exposed to the outside of the shield can (330) through an opening (331) of the shield can (330). For example, a portion of the lens assembly (310) may be disposed within the internal space of the shield can (330), and another portion of the lens assembly (310) may visually protrude to the outside of the shield can (330) through the opening (331) of the shield can (330). The lens assembly (310) may include at least one lens. The lens of the lens assembly (310) may be moved along the optical axis (OA) (e.g., the Z-axis) by an AF carrier (e.g., the AF carrier (430) of FIG. 4). For example, the lens of the lens assembly (310) may be moved by the AF carrier (430) in a direction toward the front of the camera module (300) (e.g., the +Z-axis direction) or in a direction toward the rear of the camera module (300) (e.g., the -Z-axis direction). The lens of the lens assembly (310) may be moved along the optical axis (OA) to change the focal position of the lens. By changing the focal position of the lens, the camera module (300) may obtain a clear image of the subject.

[0084] The lens of the lens assembly (310) can be moved on a plane (e.g., XY plane) perpendicular to the optical axis (OA) by an OIS carrier (e.g., OIS carrier (410) of FIG. 4).

[0085] Information about light incident through the lens of the lens assembly (310) may be converted into an electrical signal through an image sensor (e.g., the image sensor (490) of FIG. 3) and transmitted to an image signal processor. However, the present invention is not limited thereto. The image sensor (490) may be disposed on an upper surface (e.g., a surface in the +z direction) of a substrate (391) of a printed circuit board (390). The image sensor (490) may be disposed below the lens assembly (310) to obtain the information about the light. The printed circuit board (390) may include a printed circuit board (PCB), a printed circuit assembly (PBA), a flexible PCB (FPCB), or a rigid-flexible PCB (RFPCB). The image sensor (490) may be electrically connected to the image signal processor by a connector (393). The connector (393) can be electrically connected to an image sensor (490) disposed on a printed circuit board (390) via an FPCB (392). Although the printed circuit board (390) is described as an RFPCB having a PCB and an FPCB (392), it is not limited thereto. The FPCB (392) can be replaced with a rigid PCB or a cable. The image sensor (490) can be a complementary metal oxide semiconductor (CMOS) sensor or a charged coupled device (CCD) sensor. A plurality of pixels can be integrated into the image sensor. The plurality of pixels can include a micro lens, a color filter, and a photodiode. Each pixel can include a photodiode. The pixels can convert optical data into an electrical signal via the photodiode.

[0086] The image sensor (490) may provide a distorted image due to light other than the light transmitted through the lens assembly (310) among the light transmitted to the image sensor (490). The other light may enter through a gap between a mechanism (e.g., an OIS carrier) configured to move the lens of the lens assembly (310) in a plane perpendicular to the optical axis (OA) (e.g., an XY plane) and another mechanism (e.g., an AF carrier, a shield can). In one embodiment, the camera module (300) may, through a modified mechanism or an additional structure, impede or reduce the transmission of light through the gap between the mechanism (e.g., an OIS carrier) configured to move the lens of the lens assembly (310) in a plane perpendicular to the optical axis (OA) and another mechanism (e.g., an AF carrier, a shield can). A structure that impedes the transmission of light through the gap or reduces the transmitted light is described below in FIG. 5A.

[0087] Referring to FIGS. 3 and 4, the camera module (300) may include a lens assembly (310), a shield can (330), a housing (401), an OIS carrier (410), an AF carrier (430), a stopper (440), an FPCB assembly (460), a printed circuit board (390), and an image sensor (490).

[0088] The housing (401) can provide an internal space for accommodating the OIS carrier (410), the AF carrier (430), the stopper (440), and the lens assembly (310) together with the shield can (330). For example, the housing (401) can be assembled with the shield can (330). The assembled housing (401) and the shield can (330) can be formed in a box shape including the internal space. The housing (401) can be formed to surround a side wall of the AF carrier (430).

[0089] The OIS carrier (410) can accommodate at least a portion of the lens assembly (310). The OIS carrier (410) can be coupled to the lens assembly (310). For example, the OIS carrier (410) can be fastened or attached to a portion of a side surface of the lens assembly (310). The lens assembly (310) accommodated in the OIS carrier (410) can be moved in a plane (e.g., XY plane) perpendicular to the optical axis (OA) by the OIS carrier (410). The OIS carrier (410) can include an opening (412) to expose a portion of the lens assembly (310). The OIS carrier (410) can include a side wall (411) defining the opening (412). The OIS carrier (410) can have a polyhedral (e.g., rectangular parallelepiped) shape perforated by the opening (412). The opening (412) of the OIS carrier (410) may be aligned with the opening (441) of the stopper (440). The side wall (411) of the OIS carrier (410) may define outer surfaces corresponding to the side surfaces of a rectangular parallelepiped. For example, the side wall (411) of the OIS carrier (410) may define a first side surface (411a), a second side surface (411b), a third side surface (411c), and a fourth side surface (411d). The first side surface (411a) and the second side surface (411b) may be surfaces facing the side wall (431) of the AF carrier (430). The third side surface (411c) and the fourth side surface (411d) may be surfaces on which the OIS magnets (416a, 416b) are arranged. For example, the first side (411a) may extend along the y-axis direction, and the second side (411a) may extend along the -x-axis direction that is substantially perpendicular to the first side (411a). The first side (411a) may face in the x-axis direction, and the first side (411a) may face a part of the side wall (431) of the AF carrier (430). The second side (411b) may face in the y-axis direction, and may face a side wall on which the AF magnet (436) is arranged among the side walls (431) of the AF carrier (430).

[0090] The OIS carrier (410) may further include a structure (420) (or a portion, an area) protruding toward the side wall (431) of the AF carrier (430). The structure (420) of the OIS carrier (410) may at least partially cover a gap between the OIS carrier (410) and the AF carrier (430) (e.g., a gap formed between the OIS carrier (410) and the AF carrier (430) when viewed in the z-axis direction). The structure (420) of the OIS carrier (410) may be disposed on the gap.

[0091] The third side (411c) may extend from one end of the second side (411b) along the -y-axis direction that is substantially parallel to the first side (411a). The fourth side (411d) may extend from one end of the third side (411c) along the x-axis direction that is substantially perpendicular to the first side (411a). The OIS carrier (410) may include a first OIS magnet (416a) arranged on the third side (411c) and a second OIS magnet (416b) arranged on the fourth side (411d). Although the OIS magnets (416a, 416b) are described as being arranged on the outer surface of the OIS carrier (410) in FIGS. 3 and 4, the present invention is not limited thereto. For example, an OIS coil may be placed on the third side (411c) and the fourth side (411d) of the OIS carrier (410).

[0092] The AF carrier (430) can accommodate at least a portion of the OIS carrier (410). The OIS carrier (410) can be movably coupled to the AF carrier (430) so as to move along a plane perpendicular to the optical axis (OA) within the AF carrier (430). The AF carrier (430) can move in a direction corresponding to the optical axis (OA) (e.g., the Z-axis direction). As the AF carrier (430) moves, the lens assembly (310) fastened to the OIS carrier (410) can move along the optical axis (OA). The AF carrier (430) can include a side wall (431) defining an internal space (432) in which the OIS carrier (410) is accommodated. The outer surface of the side wall (431) may include one side (431a) of the AF carrier (430) corresponding to the first side (411a) of the OIS carrier (410) and the other side (431b) of the AF carrier (430) corresponding to the second side (411b) of the OIS carrier (410). An AF magnet (436) may be arranged on the other side (431b) of the AF carrier (430). The side wall (431) of the AF carrier (430) is illustrated as facing the side wall on which the OIS magnets (416a, 416b) of the OIS carrier (410) are not arranged, but is not limited thereto.

[0093] The AF carrier (430) may further include a receiving portion (435) (or receiving portion, recessed area) that at least partially receives the structure (420) of the OIS carrier (410). The receiving portion (435) may include a groove, opening, or notch capable of receiving the structure (420).

[0094] The structure (420) of the OIS carrier (410), the receiving portion (435) of the AF carrier (430) and the opening (441) of the stopper (440) are explained through FIGS. 5a, 5b, and 5c.

[0095] The FPCB assembly (460) may be arranged along three sides so as to face the sides on which the OIS magnets (416a, 416b) and the AF magnet (436) are arranged, with flexibility. For example, the FPCB assembly (460) may include two sides facing the OIS magnets (416a, 416b) and one side facing the AF magnet (436). The FPCB assembly (460) may include coils arranged on each side. For example, the FPCB assembly (460) may include an OIS coil corresponding to the OIS magnets (416a, 416b) and an AF coil corresponding to the AF magnet (436).

[0096] FIG. 5A is a cross-sectional view of the camera module of FIG. 3 taken along line A-A' of FIG. 2, according to one embodiment. FIG. 5B is a cross-sectional view showing an OIS carrier moved in a first direction, according to one embodiment. FIG. 5C is a cross-sectional view of an exemplary camera module in which an OIS carrier moved in a second direction, according to one embodiment. FIG. 6 is a cross-sectional view of a camera module in which an OIS carrier moved in a first direction, according to one embodiment. FIG. 7 is a cross-sectional view of a camera module in which an OIS carrier moved in a second direction, according to one embodiment.

[0097] Referring to FIGS. 5a, 5b, 5c, 6, and 7, the AF carrier (430) can be placed in an internal space of the camera module (300) defined by the housing (401) and the shield can (330). The OIS carrier (410) can be placed in an internal space (432) defined by a side wall (431) of the AF carrier (430). The OIS carrier (410) can include a structure (420) protruding from the side wall (411) having a first side surface (411a) facing a side where the AF magnet (e.g., the AF magnet (436) of FIG. 4) of the AF carrier (430) is not placed. The structure (420) of FIGS. 5A, 5B, and 5C may protrude or extend from an end of a side wall (411) of the OIS carrier (410) to a side wall (431) of the AF carrier (430). However, the structure is not limited thereto, and may protrude from the first surface (411a) of the OIS carrier (410) toward the side wall (431) of the AF carrier (430), such as the structure (420-1) of FIGS. 6 and 7. The structure (420) may be positioned over a gap (g) between the side wall (411) of the OIS carrier (410) and the side wall (431) of the AF carrier (430). For example, the structure (420) may be disposed over a gap (g) between a first surface (411a) of a sidewall (411) of the OIS carrier (410) and one surface of a sidewall (431) of the AF carrier (430). The structure (420) may cover the gap (g). For example, the structure (420) may overlap the gap (g) when viewed from above. The structure (420) may extend from the first surface (411a) of the sidewall (411) of the OIS carrier (410) onto one surface of the sidewall (431) of the AF carrier (430) in a direction (e.g., in the x-axis direction) toward the sidewall (431).

[0098] The AF carrier (430) may include a receiving portion (435) formed on a portion of the side wall (431) that is disposed on a side facing the first side (411a) of the side wall (411) of the OIS carrier (410). The receiving portion (435) may include a cutout portion in which a portion of the side wall (431) of the AF carrier (430) is removed. For example, the receiving portion (435) may be a notch-shaped cutout portion in which a portion of the side wall (431) is removed. The receiving portion (435) may be a recessed or dug groove that extends from the inner surface of the side wall (431) of the AF carrier (430) toward the outer surface of the side wall (431) (e.g., toward the x-axis direction). The receiving portion (435) may receive at least a portion of the structure (420) of the side wall (411) of the OIS carrier (410).

[0099] Among the light transmitted from the outside of the camera module (300), light transmitted to the lens assembly (310) can be transmitted to the image sensor (490) through at least one lens of the lens assembly (310). The light data transmitted to the image sensor (490) can be converted into an electrical signal. Some of the light transmitted from the outside of the camera module (300) can be transmitted into the camera module (300) through the gap between the lens assembly (310) and the opening (331) of the shield can (330). If the light transmitted into the camera module (300) is reflected by a mechanism inside the camera module (300) and transmitted to the image sensor (490), a distorted image may be provided.

[0100] The OIS carrier (410) and the AF carrier (430) can be configured to control (or block) light traveling toward the image sensor (490), excluding light transmitted through the lens assembly (310). A structure (420) disposed on a side wall (411) of the OIS carrier (410) can block or reduce transmission of light entering through the opening (331) of the shield can (330) and the opening (441) of the stopper (440) to the image sensor (490). For example, the structure (420) disposed on the side wall (411) of the OIS carrier (410) can be positioned on a path of light entering through the opening (331) of the shield can (330) and the opening (441) of the stopper (440). The structure (420) arranged on the side wall (411) of the OIS carrier (410) is positioned on the path of light, thereby reflecting light transmitted from the outside and limiting it from traveling to the image sensor (490). The stopper (440) may partially cover the upper portion of the OIS carrier (410) to limit the OIS carrier (410) from moving away in the z-axis direction. The stopper (440) may be fastened to the AF carrier (430) and may move together with the AF carrier (430).

[0101] The OIS carrier (410) can move linearly in the X-axis direction by the first OIS magnet (416a). FIG. 5a shows that the OIS carrier (410) is placed at a reference point, FIG. 5b and FIG. 6 show that the OIS carrier (410) moves in the +X-axis direction, and FIG. 5c and FIG. 7 show that the OIS carrier (410) moves in the -X-axis direction.

[0102] Depending on the OIS correction angle (Θ) of the lenses included in the lens assembly (310) and the effective focal length (EFL) (EF) of the lenses, the movement stroke (St) of the lenses can be defined as Θ = tan-1 (St / EF). For example, when the effective focal length is approximately 6 mm and the OIS correction angle (Θ) is approximately 1.5 degrees, the movement stroke (st) of the lenses can be approximately 0.15 mm. Considering the tolerance of the assembly or mechanism (e.g., approximately 0.1 mm), the movement range of the OIS carrier can be approximately 0.25 mm.

[0103] FIG. 5A illustrates that the OIS carrier (410) can be placed at a reference point. The reference point can indicate a position where the OIS carrier (410) is aligned with the AF carrier (430). Movement in the first direction of FIGS. 5B and 6 can indicate that the OIS carrier has moved in a first direction (e.g., +X-axis direction) from the reference point. Movement in the second direction of FIGS. 5C and 7 can indicate that the OIS carrier has moved in a second direction (e.g., -X-axis direction) opposite to the first direction from the reference point.

[0104] Referring to FIGS. 5b and 6, the OIS carrier (410) can be moved in the +X-axis direction by the movement stroke (St) of the lens by the interaction between the first OIS magnet (416a) and the electromagnet or coil included in the FPCB assembly (460).

[0105] When the OIS carrier (410) moves along the +X axis, a state in which the distance between the first surface (411a) of the side wall (411) including the structure (420, 420-1) among the side walls (411) of the OIS carrier (410) and one surface of the side wall (431) of the AF carrier (430) is minimum may be a first state of the camera module (300). Within the first state of the camera module (300), the distance between the inner circumference of the opening (331) of the lens assembly (310) and the shield can (330) and the inner circumference of the opening (441) of the lens assembly (310) and the stopper (440) may be minimum. In the first state of the camera module (300), light transmitted into the interior of the camera module (300) through parts other than the lens assembly (310) (e.g., the gaps) may be reflected or scattered by internal mechanisms due to the narrow gap and may be restricted from being transmitted to the image sensor (490).

[0106] In the first state of the camera module (300) in which the OIS carrier (410) is moved in the +X-axis, the third surface (411c) of the side wall (411) of the OIS carrier (410) is moved in the +X-axis direction, but the first OIS magnet (416a) arranged on the third surface (411c) can block the path through which light transmitted from the outside of the camera module (300) can be transmitted to the image sensor (490).

[0107] Referring to FIGS. 5c and 7, the OIS carrier (410) can be moved in the -X-axis direction by the movement stroke (St) of the lens by the interaction between the first OIS magnet (416a) and the electromagnet or coil included in the FPCB assembly (460).

[0108] When the OIS carrier (410) moves along the -X axis, a state in which the distance between the first surface (411a) of the side wall (411) including the structure among the side walls (411) of the OIS carrier (410) and one surface of the side wall (431) of the AF carrier (430) is at a maximum may be a second state of the camera module (300). Within the second state of the camera module (300), a gap between the inner circumference of the opening (331) of the lens assembly (310) and the shield can (330) and a distance between the inner circumference of the opening (441) of the lens assembly (310) and the stopper (440) may be at a maximum. Within the second state of the camera module (300), light transmitted into the interior of the camera module (300) through parts other than the lens assembly (310) (e.g., the gaps) may increase. Within the second state of the camera module (300), a structure (420, 420-1) may be positioned on the path of the light to reduce or prevent light transmitted through the gaps from being transmitted to the image sensor (490).

[0109] The structure (420, 420-1) may be a portion protruding from the side wall (411) of the OIS carrier (410). For example, it may protrude in the X-axis direction (e.g., +X-axis direction) from the first side (411a) of the side wall (411) of the OIS carrier (410) toward one side (e.g., one side (431a)) of the side wall (431) of the AF carrier (430) among the side walls (411) of the OIS carrier (410). The structure (420, 420-1) may be referred to as a protruding structure, a protruding portion, a protruding area, or a flange in terms of protruding or extending in a direction substantially perpendicular to the side wall (411) from an end of the side wall (411). In the second state of the camera module (300), as the distance between the first side (411a) of the side wall (411) of the OIS carrier (410) and one side of the side wall (431) of the AF carrier (430) increases, the amount of light entering from the outside into the space between the first side (411a) of the side wall (411) of the OIS carrier (410) and one side of the side wall (431) of the AF carrier (430) may increase. Some of the light other than the light transmitted to the lens assembly (310) may enter the interior of the camera module (300) along the optical path (pl). Light can enter the interior of the camera module (300) along the optical path (pl) through the gap between the inner surface of the opening (331) of the lens assembly (310) and the shield can (330) and the gap between the inner surface of the opening (441) of the lens assembly (310) and the stopper (440). If there is no structure (420, 420-1) of the side wall (411) of the OIS carrier (410), light entering through the first surface (411a) of the side wall (411) of the OIS carrier (410) and one surface of the side wall (431) of the AF carrier (430) can be reflected on one surface of the side wall (431) of the AF carrier (430) and transmitted to the image sensor (490) through the gap between the lower portion of the side wall (411) of the OIS carrier (410) and the lower portion of the side wall (431) of the AF carrier (430).

[0110] In the second state of the camera module (300), the structure (420, 420-1) disposed on the side wall (411) of the OIS carrier (410) may be positioned on the optical path (pl) of light entering the camera module (300). The structure (420, 420-1) of the side wall (411) of the OIS carrier (410) positioned on the optical path (pl) may reflect or absorb light. The structure (420, 420-1) of the side wall (411) may reflect the entered light so as to prevent or limit the light from escaping from the optical path (pl) and being transmitted to the image sensor (490). The light reflected from the structure (420, 420-1) of the side wall (411) may be transmitted to the inner surface of the stopper (440) and may be absorbed or reflected. Light reflected from the structure (420, 420-1) of the side wall (411) may travel outside the optical path and be absorbed by other structures, thereby reducing the amount of light.

[0111] Although the structure (420, 420-1) is described as being arranged on the side wall (411) of the OIS carrier (410), it is not limited thereto. For example, the structure (420, 420-1) may be a part of the side wall of the AF carrier (430). It may be a structure extending from the side wall of the AF carrier (430) to the side wall of the OIS carrier (410). The related structure will be described later in FIG. 25 and below.

[0112] When the OIS carrier (410) moves in the -X axis, the third surface (411c) of the side wall (411) including the structure (420, 420-1) among the side walls (411) of the OIS carrier (410) can move in the -X axis. The gap between the inner surface of the opening (331) of the shield can (330) adjacent to the third surface (411c) of the side wall (411) of the OIS carrier (410) and the lens assembly (310) and the gap between the inner surface of the opening (441) of the stopper (440) and the lens assembly (310) can be minimized. As the above gaps are minimized, in the second state of the camera module (300), light entering the third face (411c) of the side wall (411) of the OIS carrier (410) is reduced, and even if light enters the camera module (300) through the gaps, the transmission of light to the image sensor (490) may be limited and reduced by the first OIS magnet (416a) disposed on the third face (411c) of the side wall (411) of the OIS carrier (410).

[0113] FIG. 8 is a cross-sectional view of the camera module of FIG. 3 taken along line B-B' according to one embodiment. FIG. 9 is a cross-sectional view of an exemplary camera module with an OIS carrier moved in a third direction according to one embodiment.

[0114] Referring to FIGS. 8 and 9, the OIS carrier (410) can be moved in the Y-axis direction by interaction between the second OIS magnet (416b) and the electromagnet or coil included in the FPCB assembly (460).

[0115] Among the side walls (411) of the OIS carrier (410), the side walls where the OIS magnets (416a, 416b) are arranged may be thickened by the OIS magnets (416a, 416b). The OIS magnets (416a, 416b) and the stopper (440) may block a path through which light transmitted from the outside of the camera module (300) may be transmitted to the image sensor (490), regardless of the position of the OIS carrier (410).

[0116] Movement in the third direction of FIG. 9 may indicate that the OIS carrier has moved in a third direction (e.g., -Y-axis direction) perpendicular to the first direction and the second direction from the reference point.

[0117] As shown in Fig. 9, when the OIS carrier (410) moves in the -Y-axis direction, the distance between the second surface (411b) of the side wall (411) of the OIS carrier (410) and the AF magnet (436) and AF magnet holder (437) arranged in the AF carrier (430) may be at a maximum. The state in which the distance between the second surface (411b) of the side wall (411) of the OIS carrier (410) and the AF magnet (436) and AF magnet holder (437) arranged in the AF carrier (430) is at a maximum may be the third state of the camera module (300). Within the third state of the camera module (300), the distance between the inner circumference of the opening (331) of the lens assembly (310) and the shield can (330) and the inner circumference of the opening (441) of the stopper (440) may be at a maximum. Within the third state of the camera module (300), light transmitted into the interior of the camera module (300) through parts other than the lens assembly (310) (e.g., the gaps) may increase. The transmitted light may be reflected by the AF magnet holder (437), but the second surface (411b) of the side wall (411) of the carrier (410) and the bottom portion of the AF carrier (430) where the AF magnet (436) is disposed may overlap (e.g., overlap in the Z-axis direction), which may hinder the light transmitted into the interior from being transmitted to the image sensor (490). The camera module (300) may further include a structure for preventing light from being transmitted to the bottom portion of the AF carrier (430) between the second surface (411b) of the side wall (411) of the carrier (410) and the bottom portion of the AF carrier (430) where the AF magnet (436) is arranged. The structure will be described later with reference to FIGS. 19, 20, 23, and 24.

[0118] FIG. 10 is a cross-sectional view of an exemplary camera module including a stopper configured to receive a portion of an OIS carrier, according to one embodiment. FIG. 11 is a perspective view illustrating an exemplary stopper, according to one embodiment. FIG. 12 is a cross-sectional view of an exemplary camera module including a stopper including an opening through which a portion of an OIS carrier can pass, according to one embodiment. FIG. 13 is a perspective view illustrating an exemplary stopper, according to one embodiment.

[0119] Referring to FIGS. 10 and 11, the stopper (440) may be configured to prevent the OIS carrier (410) from being dislodged in the Z-axis direction. The stopper (440) may be configured to surround at least a portion of an upper surface (e.g., a surface facing the Z-axis) of the OIS carrier (410). The stopper (440) may include structures (1191, 1192, 1193, 1194) for being fastened to the AF carrier (430). The stopper (440) may be fastened to the AF carrier (430) through the fastening structures (1191, 1192, 1193, 1194) and may move together with the AF carrier (430). The stopper (440) may define a space in which the OIS carrier (410) is accommodated together with the AF carrier (430).

[0120] The stopper (440) may further include a bending portion (1101) to reinforce rigidity. The bending portion (1101) may extend in the -Z-axis direction from a portion (449) of the stopper (440) that overlaps a structure (420) extending or protruding from a side wall (411) of the OIS carrier (410) when viewed from above (e.g., in the +Z-axis direction), and may be bent again to extend in the -X-axis direction.

[0121] The stopper (440) of FIG. 11 may include a bending portion (1101) more than the stopper (440) of FIG. 3 or FIG. 4, so that it can come into contact with the receiving portion (435) of the AF carrier (430) through the bending portion (1101). The bending portion (1101) of the stopper (440) supported by the receiving portion (435) may have its rigidity reinforced.

[0122] The stopper (440) has a bending portion (1101), thereby allowing the structure (420) formed on the side wall (411) of the OIS carrier (410) to be received in the receiving portion (435) even while the OIS carrier (410) reciprocates in the X-axis direction.

[0123] According to the above-described embodiment, the stopper (440) can primarily block light transmitted from the outside of the camera module (300) from being transmitted into the inside of the camera module (300). The stopper (440) can improve the rigidity of the stopper (440) by being supported by the receiving portion (435) through the bending portion (1101). The stopper (440) can improve the rigidity by having the bending portion (1101) while allowing the structure (420) of the OIS carrier (410) to be received in the receiving portion (435), thereby stably providing the OIS operation of the OIS carrier (410).

[0124] Referring to FIGS. 12 and 13, the stopper (440) may further include an opening (1202) to avoid interference with a structure (420) formed on a side wall (411) of the OIS carrier (410). For example, the stopper (440) may include an extension portion (1201) extending in the -Z-axis direction from a portion (449) of the stopper (440) that overlaps a structure (420) extending or protruding from the side wall (411) of the OIS carrier (410). The extension portion (1201) of the stopper (440) may include an opening (1202) corresponding to the protruding structure (420) of the OIS carrier (410). The above opening (1202) is aligned with the structure (420) of the OIS carrier (410) so that the protruding structure (420) of the OIS carrier (410) can be inserted, and may have a shape and / or size corresponding to the cross-sectional shape of the structure (420) of the OIS carrier (410).

[0125] In the first state of the camera module (300) in which the OIS carrier (410) is moved in the X-axis direction (e.g., +X-axis direction), the movement distance of the OIS carrier (410) can be secured. The structure (420) of the OIS carrier (410) can penetrate the opening (1202) of the stopper (440) in the first state of the camera module (300). The structure (420) of the OIS carrier (410) can be spaced apart from the opening (1202) of the stopper (440) in the second state of the camera module (300). The structure (420) of the OIS carrier (410) can be extended past the stopper (440), so that the length by which the structure (420) of the OIS carrier (410) of FIG. 12 protrudes or extends from the side wall (411) can be increased compared to the structure (420) of FIGS. 3 and 4. As the extension length (or protrusion length) of the structure (420) increases, even if the size of the gap between the bottom portion of the AF carrier (430) and the OIS carrier (410) increases, light transmitted through the gap can be blocked.

[0126] FIG. 14 is an exploded perspective view illustrating a camera module including a modified OIS carrier according to one embodiment. FIG. 15 is a cross-sectional view taken along line A-A' of FIG. 2 of the camera module of FIG. 14 with the OIS carrier moved in a first direction according to one embodiment. FIG. 16 is a cross-sectional view illustrating an aligned state of the OIS carrier according to one embodiment. FIG. 17 is a cross-sectional view of an exemplary camera module with the OIS carrier moved in a second direction according to one embodiment.

[0127] The camera module of FIG. 14 may have the same or similar components and shapes as the camera modules (300) of FIGS. 3, 4, 5a, 5b, 5c, 6, and 7, except for the shapes of the OIS carrier and the AF carrier.

[0128] Referring to FIG. 14, the OIS carrier (1410) can accommodate at least a portion of the lens assembly (310). The OIS carrier (1410) can be coupled to the lens assembly (310). For example, the OIS carrier (1410) can be fastened or attached to a portion of a side surface of the lens assembly (310). The lens assembly (310) accommodated in the OIS carrier (1410) can be moved in a plane (e.g., XY plane) perpendicular to the optical axis (OA) by the OIS carrier (1410). The OIS carrier (1410) can include an opening (1413) such that a portion of the lens assembly (310) is visually exposed. The OIS carrier (410) can include a side wall (1411) defining the opening (1413). The configuration of the OIS carrier (410) may be identical or similar to the shape and components of the OIS carrier (410) of FIGS. 3 and 4, except for the shape of the side wall (1411) on which the first side (1411) is arranged.

[0129] A portion of the sidewall (1411) defining the first side surface (1411a) of the OIS carrier (1410) may be thicker than other portions of the sidewall (1411). For example, among the sidewalls (1411) of the OIS carrier (1410), a first sidewall (1412) forming (or configuring) the first side surface (1411a) may be thicker than the other sidewalls. For example, the thick first sidewall (1412) may cover a gap between the OIS carrier (1410) and the AF carrier (1430). For example, the first sidewall (1412) of the OIS carrier (1410) may be disposed over the gap between the OIS carrier (1410) and the AF carrier (1430).

[0130] The AF carrier (1430) can accommodate at least a portion of the OIS carrier (1410). The AF carrier (1430) can include a bottom portion (1433) that supports the OIS carrier (1410). The OIS carrier (1410) can be movably coupled to the AF carrier (1430) so as to move along a plane perpendicular to the optical axis (OA) within the AF carrier (430). The AF carrier (1430) can move in a direction corresponding to the optical axis (OA) (e.g., the Z-axis direction). As the AF carrier (1430) moves, the lens assembly (310) attached to the OIS carrier (1410) can move along the optical axis (OA). The AF carrier (1430) can include a side wall (1431) that defines an internal space (1432) in which the OIS carrier (1410) is to be accommodated.

[0131] The AF carrier (1430) may further include a receiving portion (1435) that at least partially receives the first side wall (1412) of the OIS carrier (1410). The receiving portion (1435) may include a groove, an opening, or a notch that can receive the first side wall (1412) of the OIS carrier (1410). The configuration of the AF carrier (1430) may be the same as or similar to the shape and components of the AF carrier (430) of FIGS. 3 and 4, except for the shape of the side wall (1431) on which one surface (1431a) is disposed.

[0132] The receiving portion (1435) may be sized and / or shaped to receive the first side wall (1412) of the OIS carrier (1410). For example, the OIS carrier (1410) may be configured to receive all or a portion of the first side wall (1412) (e.g., a portion protruding from the first side wall (1412)). The receiving portion (1435) may include a groove or notch dug downward from the top of the side wall (1431) of the AF carrier (1430) (e.g., in the -Z-axis direction).

[0133] The first side wall (1412) of the OIS carrier (1410) and the receiving portion (1435) of the AF carrier (1430) are described with reference to FIGS. 15, 16, and 17.

[0134] Referring to FIGS. 15, 16, and 17, the AF carrier (1430) may be placed in an internal space of the camera module (300) defined by the housing (401) and the shield can (330). The OIS carrier (1410) may be placed in an internal space (1432) defined by a side wall (1431) of the AF carrier (1430). Among the side walls (1411) of the OIS carrier (1410), a first side wall (1412) may be included that defines (or forms or configures) a first side surface (1411a) facing the receiving portion (1435) of the AF carrier (1430). The first side wall (1412) may be placed on an edge of an opening (1432) next to a bottom portion (1433) of the AF carrier (1430). For example, the structure (1420) can cover a gap (g1) between the opening (1432) of the AF carrier (1430) and the lens assembly (310). For example, the first side wall (1412) can overlap the gap (g1) when viewed from above (e.g., in the +Z-axis direction). The first side wall (1412) can be positioned within a receiving portion (1435) formed in the side wall (1431) of the AF carrier (1430).

[0135] The AF carrier (1430) may include a receiving portion (1435) formed in a side wall (1431) disposed on one side facing the first side wall (1412) of the OIS carrier (1410). The receiving portion (1435) may include a cutout portion in which a portion of the side wall (1431) of the AF carrier (1430) is removed. For example, the receiving portion (1435) may be a notch-shaped cutout portion in which a portion of the side wall (1431) is removed. The receiving portion (1435) may be a recessed or dug groove that extends from the inner surface of the side wall (1431) of the AF carrier (1430) toward the outer surface of the side wall (1431) (e.g., toward the x-axis direction). The receiving portion (1435) may receive at least a portion of the structure (1420) of the side wall (1411) of the OIS carrier (1410).

[0136] The OIS carrier (1410) can move linearly in the X-axis direction by the first OIS magnet (e.g., the first OIS magnet (416a) of FIG. 4). FIG. 15 shows that the OIS carrier (1410) moves in the +X-axis direction from a reference point, FIG. 16 shows that the OIS carrier (1410) is placed at the reference point, and FIG. 17 shows that the OIS carrier (1410) moves in the -X-axis direction.

[0137] Referring to FIG. 15, the OIS carrier (1410) can be moved in the +X axis direction from the reference point by interaction between the first OIS magnet (e.g., the first OIS magnet (416a) of FIG. 4) and the electromagnet or coil included in the FPCB assembly (e.g., the FPCB assembly (460) of FIG. 4).

[0138] A state in which the OIS carrier (1410) moves along the +X axis and the first side wall (1412) of the OIS carrier (1410) is placed in the cut-out receiving portion (1435) corresponding to the first surface (1431a) of the side wall (1431) of the AF carrier (1430) may be a first state of the camera module (300). In the first state of the camera module (300), the gap between the inner circumference of the opening (331) of the lens assembly (310) and the shield can (330) and the distance between the inner circumference of the opening (441) of the lens assembly (310) and the stopper (440) may be the minimum. In the first state of the camera module (300), light transmitted into the interior of the camera module (300) through parts other than the lens assembly (310) (e.g., the gaps) may be reflected or scattered by internal mechanisms due to the narrow gap and may be restricted from being transmitted to the image sensor (490).

[0139] Referring to FIG. 16, the OIS carrier (1410) may be positioned at a reference point. For example, the reference point may indicate the position of the OIS carrier (1410) when the OIS carrier (1410) and the AF carrier (1430) are aligned.

[0140] When the OIS carrier (1410) is positioned at a reference point or moved in a first direction (e.g., +X-axis direction) as shown in FIG. 15, some of the light other than the light transmitted to the lens assembly (310) may enter the interior of the camera module (300) along the optical path (pl). The light that enters the interior of the camera module (300) along the optical path (pl) through the gap between the lens assembly (310) and the inner surface of the opening (331) of the shield can (330) and the gap between the lens assembly (310) and the inner surface of the opening (441) of the stopper (440) may be restricted (or prevented) from proceeding into the interior of the camera module (300) along the optical path (pl) blocked by the first side wall (1412) of the OIS carrier (1410).

[0141] Referring to FIG. 17, the OIS carrier (1410) can be moved in the -X-axis direction by interaction between the first OIS magnet (416a) and the electromagnet or coil included in the FPCB assembly (460).

[0142] When the OIS carrier (1410) moves along the -X axis, the first side wall (1412) of the OIS carrier (1410) may be partially detached from the receiving portion (1435) of the AF carrier (1430). A state in which the distance between the first side wall (1412) of the OIS carrier (1410) and the side wall (1431) of the AF carrier (1430) in which the receiving portion (1435) is formed is at a maximum may be a second state of the camera module (300). Within the second state of the camera module (300), the distance between the inner circumference of the opening (331) of the lens assembly (310) and the shield can (330) and the inner circumference of the opening (441) of the stopper (440) may be at a maximum. Within the second state of the camera module (300), light transmitted into the interior of the camera module (300) through parts other than the lens assembly (310), such as the gaps, may increase. Within the second state of the camera module (300), a first side wall (1412) of the OIS carrier (1410) may be positioned on the path of the light to reduce or prevent light transmitted through the gaps from being transmitted to the image sensor (490).

[0143] The first side wall (1412) of the OIS carrier (1410) may be a thick portion of the side wall (1411) of the OIS carrier (1410). The first side wall (1412) of the OIS carrier (1410) may face one side (1431a) of the side wall (1431) of the AF carrier (1430) where the receiving portion (1435) is formed. In the second state of the camera module (300), as the first side wall (1412) of the OIS carrier (1410) moves in the -X-axis direction on the bottom portion (1433) of the AF carrier (1430), the amount of light entering from the outside into the space between the first side wall (1411a) of the OIS carrier (1410) and one side (1431a) of the side wall (1431) of the AF carrier (1430) (or the receiving portion (1435) of the AF carrier (1430)) may increase. Some of the light other than the light transmitted to the lens assembly (310) may enter the interior of the camera module (300) along the optical path (pl). Light can be introduced into the camera module (300) along the optical path (pl) through the gap between the inner surface of the opening (331) of the lens assembly (310) and the shield can (330) and the gap between the inner surface of the opening (441) of the lens assembly (310) and the stopper (440). If the first side wall (1412) of the OIS carrier (1410) is thin, light introduced into one surface of the first side wall (1412) of the OIS carrier (1410) and the side wall (1431) of the AF carrier (1430) can be introduced into the camera module along the optical path (pl) through the opening (1432) formed in the bottom portion (1433) of the AF carrier (1430).

[0144] Within the second state of the camera module (300), the first sidewall (1412) of the OIS carrier (1410) may be positioned on the optical path (pl) of light entering the camera module (300). For example, the thickness of the first sidewall (1412) may be t, and the movement distance of the OIS carrier for OIS correction may be s as illustrated in FIG. 17. The movement distance (s) of the OIS carrier may be shorter than the thickness (t) of the first sidewall (1412). The first sidewall (1412) having a thickness (t) greater than the movement distance (s) may be positioned on the optical path (pl) even within the second state. The first sidewall (1412) of the OIS carrier (1410) positioned on the optical path (pl) may reflect or absorb light. The first side wall (1412) of the OIS carrier (1410) can reflect the incoming light so as to prevent or limit the light from traveling away from the optical path (pl) and being transmitted to the image sensor (490). The light reflected from the first side wall (1412) of the OIS carrier (1410) can be transmitted to the inner surface of the stopper (440) and be absorbed or reflected. The light reflected from the first side wall (1412) of the OIS carrier (1410) can travel away from the optical path and be absorbed by other structures, thereby reducing the amount of light.

[0145] FIG. 18 is a cross-sectional view of a camera module with a protrusion of an OIS carrier positioned below, according to one embodiment.

[0146] Referring to FIG. 18, the AF carrier (1830) may be placed in an internal space of the camera module (300) defined by the housing (401) and the shield can (330). The OIS carrier (1810) may be placed in an internal space defined by a side wall (1831) of the AF carrier (1830). The OIS carrier (1810) may include a structure (1820) protruding from the side wall (1811) having a first side (1811a) facing the receiving portion (1835) of the AF carrier (1830). The structure (1820) may be placed under a gap (g) between the side wall (1811) of the OIS carrier (1810) and the side wall (1831) of the AF carrier (1830). For example, the structure (1820) can be positioned below a gap (g) between a first side (1811a) of a sidewall (1811) of the OIS carrier (1810) and a side (1831a) of a sidewall (1831) of the AF carrier (1830). The structure (1820) can occupy at least a portion of the gap (g). For example, the structure (1820) can overlap the gap (g) when viewed from above. The structure (1820) can extend from the first side (1811a) of the sidewall (1811) of the OIS carrier (1810) to a receiving portion (1835) formed in the sidewall (1831) of the AF carrier (1830).

[0147] The AF carrier (1830) may include a receiving portion (1835) formed on a side wall (1831) that is disposed on a side (1831a) facing the first side (1811a) of the side wall (1811) of the OIS carrier (1810). The receiving portion (1835) may include an opening (or hole) formed through a portion of the side wall (1831) of the AF carrier (1830). The receiving portion (1835) may receive at least a portion of the structure (1820) of the side wall (1811) of the OIS carrier (1810).

[0148] The OIS carrier (1810) and the AF carrier (1830) may be configured to impede the propagation of light, excluding light transmitted through the lens assembly (310), among light traveling toward the image sensor (490). A structure (1820) disposed on a side wall (1811) of the OIS carrier (1810) may impede or reduce the transmission of light entering through the opening (331) of the shield can (330) and the opening (441) of the stopper (440) to the image sensor (490). For example, the structure (1820) disposed on the side wall (1811) of the OIS carrier (1810) may be positioned on the path of light entering through the opening (331) of the shield can (330) and the opening (441) of the stopper (440). The structure (1820) arranged on the side wall (1811) of the OIS carrier (1810) is positioned on the path of light, thereby reflecting light transmitted from the outside and limiting it from traveling to the image sensor.

[0149] FIGS. 19 and 20 are cross-sectional views of a camera module including a magnet and a magnet support portion configured to accommodate a protrusion of an OIS carrier, according to one embodiment.

[0150] Referring to FIGS. 19 and 20, the OIS carrier (1910) may include a structure (1920) extending or protruding from a side wall (1911b) of the OIS carrier (1910) facing the AF magnet (1936). The AF carrier (1930) may include an AF magnet (1936) and an AF magnet holder (1937). The AF magnet (1936) and / or the AF magnet holder (1937) may further include a receiving portion (1935) for receiving the structure (1920) of the OIS carrier (1910) when the OIS carrier (1910) moves in the Y-axis direction.

[0151] Referring to FIG. 19, when the OIS carrier (1910) moves in the +Y-axis direction, the distance between a portion of the side wall (1911b) corresponding to (or defining) the second side (e.g., the second side (411b) of FIG. 4) of the side wall of the OIS carrier (1910) and the AF magnet (1936) and AF magnet holder (1937) arranged in the AF carrier (1930) may be minimum. Since the distance between the AF magnet (1936) and the AF magnet holder (1937) and the side wall (1910) of the OIS carrier (1910) is minimum, and the distance between the inner circumference of the opening (331) of the lens assembly (310) and the shield can (330) and the inner circumference of the opening (441) of the stopper (440) is minimum, light can be restricted from being transmitted to the image sensor (490) through the gap between the AF magnet (1936) and the AF magnet holder (1937) and a portion of the side wall (1911b) corresponding to (or defining) the second surface of the side wall (1911) of the OIS carrier (1910).

[0152] Referring to FIG. 20, when the OIS carrier (1910) moves in the -Y-axis direction, the distance between the second surface (e.g., the second surface (411b) of FIG. 4) of the side wall (1911) of the OIS carrier (1910) and the AF magnet (1936) and AF magnet holder (1937) arranged in the AF carrier (1930) may be at a maximum. Within a state where the distance between the second surface (e.g., the second surface (411b) of FIG. 4) of the side wall (1911) of the OIS carrier (1910) and the AF magnet (1936) and the AF magnet holder (1937) arranged in the AF carrier (1930) is at a maximum, the distance between the inner circumference of the opening (331) of the lens assembly (310) and the shield can (330) and the inner circumference of the opening (441) of the stopper (440) may be at a maximum. Within the state of FIG. 20, light transmitted into the interior of the camera module (300) through parts other than the lens assembly (310) (e.g., the gaps) may increase. In order to limit the transmitted light from being reflected by the AF magnet holder (1937) and transmitted to the image sensor (490), the structure (1920) of the OIS carrier (1910) can prevent the light from being transmitted to the AF magnet holder (1937). The structure (1920) of the OIS carrier (1910) can be arranged on the optical path (pl) of light transmitted from the outside of the camera module (300). The structure (1920) of the OIS carrier (1910) can prevent the light from being reflected by the AF magnet holder (1937) and transmitted to the image sensor (490) through the opening formed in the bottom portion of the AF carrier (1930) by limiting the light from being transmitted to the AF magnet holder (1937).

[0153] FIGS. 21 and 22 are cross-sectional views of a camera module including a magnet support portion having a flange, according to one embodiment.

[0154] Referring to FIGS. 21 and 22, the OIS carrier (2110) may include a groove (2115) disposed on a side wall (2111) of the OIS carrier (2110) facing the AF magnet (2136). The AF carrier (2130) may include an AF magnet (2136) and an AF magnet holder (2137). The AF magnet holder (2137) supporting the AF magnet (2136) may further include a protrusion (2120) for being accommodated into the groove (2115) of the OIS carrier (2110) when the OIS carrier (2110) moves in the Y-axis direction. The protrusion (2120) may protrude from one side of the AF magnet holder (2137) toward a groove (2115) formed in the side wall (2111) of the OIS carrier (2110).

[0155] Referring to FIG. 21, when the OIS carrier (2110) moves in the +Y-axis direction, the distance between the second surface (e.g., the second surface (411b) of FIG. 4) of the side wall (2111) of the OIS carrier (2110) and the AF magnet (2136) and AF magnet holder (2137) arranged in the AF carrier (2130) may be minimum. Since the distance between the AF magnet (2136) and the AF magnet holder (2137) and the side wall (2111) of the OIS carrier (2110) is minimal, and the gap between the inner circumference of the opening (331) of the lens assembly (310) and the shield can (330) and the inner circumference of the opening (441) of the stopper (440) is minimal, light can be restricted from being transmitted to the image sensor (490) through the gap between the AF magnet (2136) and the AF magnet holder (2137) and the side wall (2111) of the OIS carrier (2110).

[0156] Referring to FIG. 22, when the OIS carrier (2110) moves in the -Y-axis direction, the distance between the second surface (e.g., the second surface (411b) of FIG. 4) of the side wall (2111) of the OIS carrier (2110) and the AF magnet (2136) and AF magnet holder (2137) arranged in the AF carrier (2130) may be at a maximum. Within a state where the distance between the second surface (e.g., the second surface (411b) of FIG. 4) of the side wall (2111) of the OIS carrier (2110) and the AF magnet (2136) and the AF magnet holder (2137) arranged in the AF carrier (2130) is at a maximum, the distance between the inner circumference of the opening (331) of the lens assembly (310) and the shield can (330) and the inner circumference of the opening (441) of the stopper (440) may be at a maximum. Within the state of FIG. 22, light transmitted into the interior of the camera module (300) through parts other than the lens assembly (310) (e.g., the gaps) may increase. In order to limit the transmitted light from being reflected by the AF magnet holder (2137) and transmitted to the image sensor (490), a protrusion (2120) protruding from the AF magnet holder (2137) can be placed on the light path (pl) transmitted to the inside of the camera module (300). The protrusion (2120) of the AF magnet holder (2137) can prevent light from being reflected by the AF magnet holder (2137) and transmitted to the image sensor (490) through the opening formed in the bottom portion of the AF carrier (2130) by limiting the transmission of light below the protrusion (2120).

[0157] FIGS. 23 and 24 are cross-sectional views of a camera module with the stopper omitted, according to one embodiment.

[0158] Referring to FIG. 23, the camera module (300) may omit the stopper (440) from the camera modules of FIGS. 3, 4, 5a, 5b, 5c, 6, and 7.

[0159] The AF carrier (2330) can be placed in the internal space of the camera module (300) defined by the housing (401) and the shield can (330). The OIS carrier (2310) can be placed in the internal space defined by the side wall (2331) of the AF carrier (2330). The OIS carrier (2310) can include a structure (2320) protruding from the side wall (2311) having a first side surface (2311a) (e.g., the first side surface (411a) of FIG. 4) facing the receiving portion (2335) of the AF carrier (2330) among the side walls (2311). The protruding structure (2320) may be further extended than the structure (420) of FIGS. 3, 4, 5A, 5B, 5C, 6, and 7 to block light blocked by the stopper (440) since the stopper (440) is omitted. For example, the protruding structure (2320) may further protrude or extend across the receiving portion (2335) formed on the side wall (2331) of the AF carrier (2330) toward the side wall of the shield can (330) or the housing (401) when the OIS carrier (410) is moved in the +X-axis direction and positioned adjacent to the AF carrier (2330).

[0160] A structure (2320) protruding from a side wall (2311) of an OIS carrier (2310) may be positioned over a gap (g) between the side wall (2311) of the OIS carrier (2310) and the side wall (2331) of the AF carrier (2330). For example, the structure (2320) protruding from the side wall (2311) of the OIS carrier (2310) may overlap the gap (g) when viewed from above.

[0161] The AF carrier (2330) may include a receiving portion (2335) formed on a side wall (2331) that is disposed on a side surface (2331a) facing the first side surface (2311a) of the side wall (2311) of the OIS carrier (2310). The receiving portion (2335) may include a cutout portion in which a portion of the side wall (2331) of the AF carrier (2330) is removed. For example, the receiving portion (2335) may be a notch-shaped cutout portion in which a portion of the side wall (2331) is removed. The receiving portion (2335) may be an opening portion in which a portion of the side wall (2331) is opened. The receiving portion (2335) may receive at least a portion of the structure (2320) of the side wall (2311) of the OIS carrier (2310).

[0162] The OIS carrier (2310) and the AF carrier (2330) may be configured to block light traveling toward the image sensor (490), except for light transmitted through the lens assembly (310). A structure (2320) protruding from a side wall (2311) of the OIS carrier (2310) may block or reduce transmission of light entering through an opening (331) of the shield can (330) to the image sensor (490). For example, the structure (2320) protruding from a side wall (2311) of the OIS carrier (2310) may be positioned on a path of light entering through an opening (331) of the shield can (330). A structure (2320) protruding from the side wall (2311) of the OIS carrier (2310) is positioned on the path of light, thereby reflecting light transmitted from the outside and limiting its progress to the image sensor (490). The role of the omitted stopper can be achieved by limiting the movement of the OIS carrier (2310) and / or the AF carrier (2330) in the Z-axis direction within a specified range through a structure (not shown) added to the shield can (330).

[0163] The OIS carrier (2310) can move linearly in the X-axis direction by the first OIS magnet (e.g., the first OIS magnet (416a) of FIG. 4). FIG. 23 shows that the OIS carrier (2310) moves in the +X-axis direction, and FIG. 24 shows that the OIS carrier (2310) moves in the -X-axis direction.

[0164] Referring to FIG. 23, the OIS carrier (2310) can be moved in the +X axis direction by interaction between the first OIS magnet (416a) and an electromagnet or coil included in the FPCB assembly (e.g., the FPCB assembly (460) of FIG. 4).

[0165] When the OIS carrier (2310) moves in the +X-axis direction, a state in which the distance between the first surface (2311a) of the side wall (2311) including the structure (2320) protruding from the side wall (2311) of the OIS carrier (2310) and one surface (2331a) of the side wall (2331) of the AF carrier (2330) is minimum may be a first state of the camera module (300). Within the first state of the camera module (300), the distance between the lens assembly (310) and the inner circumference of the opening (331) of the shield can (330) may be minimum. Within the first state of the camera module (300), light transmitted into the interior of the camera module (300) through parts other than the lens assembly (310) (e.g., the gaps) may be reflected or scattered by internal mechanisms due to the narrow gap and may be restricted from being transmitted to the image sensor (490).

[0166] Referring to FIG. 24, the OIS carrier (2310) can be moved in the -X-axis direction by interaction between the first OIS magnet (416a) and the electromagnet or coil included in the FPCB assembly (460).

[0167] When the OIS carrier (2310) moves in the -X-axis direction, a state in which the distance between the first surface (2311a) of the side wall (2311) including the structure among the side walls (2311) of the OIS carrier (2310) and one surface (2331a) of the side wall (2331) of the AF carrier (2330) is at its maximum may be a second state of the camera module (300). Within the second state of the camera module (300), the distance between the lens assembly (310) and the inner periphery of the opening (331) of the shield can (330) may be at its maximum. Within the second state of the camera module (300), light transmitted into the interior of the camera module (300) through parts other than the lens assembly (310) (e.g., the gaps) may increase. In the second state of the camera module (300), a structure (2320) protruding from the side wall (2311) of the OIS carrier (2310) may be positioned on the path of the light to reduce or prevent light transmitted through the gaps from being transmitted to the image sensor (490).

[0168] The structure (2320) protruding from the side wall (2311) of the OIS carrier (2310) may be a portion protruding from the side wall (2311) of the OIS carrier (2310) toward the receiving portion (2335) of the AF carrier (430). For example, the structure (2320) protruding from the side wall (2311) of the OIS carrier (2310) may protrude in the X-axis direction from the first side (2311a) of the side wall (2311) of the OIS carrier (2310) toward the receiving portion (2335) of the side wall (2331) of the AF carrier (2330) among the side walls (2311) of the OIS carrier (2310). The structure (2320) protruding from the side wall (2311) of the OIS carrier (2310) may be referred to as a protruding structure, a protruding portion, a protruding area, or a flange in terms of protruding or extending in a direction substantially perpendicular to the side wall (2311) from an end of the side wall (2311). In the second state of the camera module (300), as the distance between the first side (2311a) of the side wall (2311) of the OIS carrier (2310) and one side of the side wall (2331) of the AF carrier (2330) increases, the amount of light entering from the outside into the space between the first side (2311a) of the side wall (2311) of the OIS carrier (2310) and one side of the side wall (2331) of the AF carrier (2330) may increase. Some of the light other than the light transmitted to the lens assembly (310) may be transmitted into the interior of the camera module (300) along the optical path (pl). Light may enter the interior of the camera module (300) along the optical path (pl) through the gap between the lens assembly (310) and the inner surface of the opening (331) of the shield can (330).

[0169] In the second state of the camera module (300), a structure (2320) protruding from the side wall (2311) of the OIS carrier (2310) may be positioned on the optical path (pl) of light entering the camera module (300). The structure (2320) protruding from the side wall (2311) of the OIS carrier (2310) positioned on the optical path (pl) may reflect or absorb light. The structure (2320) of the side wall (2311) may reflect the entered light so as to prevent or limit the light from escaping from the optical path (pl) and being transmitted to the image sensor (490). The light reflected from the structure (2320) of the side wall (2311) may be absorbed or reflected by the internal structure of the camera module (300). Light reflected from a structure (2320) protruding from a side wall (2311) may travel beyond the optical path (pl) and be absorbed by other structures, thereby reducing the amount of light.

[0170] FIG. 25 is an exploded perspective view of a camera module including an OIS carrier including a receiving portion that accommodates a portion of an AF carrier, according to one embodiment. FIGS. 26 and 27 are cross-sectional views of a camera module including an OIS carrier including a receiving portion, according to one embodiment.

[0171] Referring to FIG. 25, the camera module (300) may include an OIS carrier (2510) and an AF carrier (2530). The camera module (300) of FIG. 25 may have the same or similar components and shapes as the camera modules (300) of FIGS. 3, 4, 5a, 5b, 5c, 6, and 7, except for the shapes of the OIS carrier and the AF carrier.

[0172] The OIS carrier (2510) may include an opening (2512) for receiving at least a portion of the lens assembly (310). The lens assembly (310) may be coupled to the OIS carrier (2510). For example, the OIS carrier (2510) may be fastened or attached to a portion of a side surface of the lens assembly (310). The lens assembly (310) received in the OIS carrier (2510) may be moved in a plane (e.g., XY plane) perpendicular to the optical axis (OA) by the OIS carrier (2510). The OIS carrier (2510) may include an opening (2512) such that a portion of the lens assembly (310) is visually exposed. The OIS carrier (2510) may include a side wall (2511) defining the opening (2512). The configuration of the OIS carrier (2510) may be identical or similar to the shape and components of the OIS carrier (410) of FIGS. 3 and 4, except for the shape of the side wall (2511) of the OIS carrier (2510) facing one side (2531a) of the AF carrier (2530).

[0173] A portion of a side wall (2511) forming (or configuring) a first side surface (2511a) of the OIS carrier (2510) may include a structure (2515) having a slope from a surface extending from the first side surface (2511a) toward a bottom portion of the OIS carrier (2510) (e.g., toward the -Z-axis direction). The AF carrier (2530) may include a structure (2535) of the AF carrier (2530) corresponding to the structure (2515) of the OIS carrier (2510) and an opening (2532) in which a portion of the AF carrier (2530) is received. Even during movement of the OIS carrier (2510), when viewed from above, the structure (2535) of the AF carrier (2530) and the structure (2515) of the OIS carrier (2510) may be configured to partially overlap. For example, the structure (2515) of the OIS carrier (2510) may be formed to correspond, at least in part, to the structure (2535) of the AF carrier (2530). The configuration of the AF carrier (2530) may be identical or similar to the shape and components of the AF carrier (430) of FIGS. 3 and 4, except for the shape of the side wall (2531) on which one surface (2531a) is arranged.

[0174] Referring to FIG. 26, the OIS carrier (2510) can be moved in the +X-axis direction by interaction between the first OIS magnet (e.g., the first OIS magnet (416a) of FIG. 4) and the electromagnet or coil included in the FPCB assembly (e.g., the FPCB assembly (460) of FIG. 4).

[0175] The state in which the OIS carrier (2510) moves in the +X-axis direction and the inclined surface of the structure (2515) of the OIS carrier (2510) and the inclined surface of the structure (2535) of the AF carrier (2530) are arranged adjacent to each other may be a first state of the camera module (300). In the first state of the camera module (300), the gap between the inner circumference of the opening (331) of the lens assembly (310) and the shield can (330) and the distance between the inner circumference of the opening (441) of the lens assembly (310) and the stopper (440) may be minimum. In the first state of the camera module (300), light transmitted into the interior of the camera module (300) through parts other than the lens assembly (310) (e.g., the gaps) may be reflected or scattered by internal mechanisms due to the narrow gap and may be restricted from being transmitted to the image sensor (490).

[0176] Referring to FIG. 27, the OIS carrier (2510) can be moved in the -X-axis direction by interaction between the first OIS magnet (416a) and the electromagnet or coil included in the FPCB assembly (460).

[0177] When the OIS carrier (2510) moves in the -X-axis direction, it may move away from the structure (2515) of the OIS carrier (2510) and the structure (2535) of the AF carrier (2530). A state in which the distance between the slope of the structure (2515) of the OIS carrier (2510) and the slope of the structure (2535) of the AF carrier (2530) is at its maximum may be a second state of the camera module (300). Within the second state of the camera module (300), a gap between the inner circumference of the opening (331) of the lens assembly (310) and the shield can (330) and a distance between the inner circumference of the opening (441) of the lens assembly (310) and the stopper (440) may be at its maximum. Within the second state of the camera module (300), light transmitted into the interior of the camera module (300) through parts other than the lens assembly (310) (e.g., the gaps) may increase. Within the second state of the camera module (300), a structure (2515) of the OIS carrier (2510) may be positioned on the path of the light to reduce or prevent the light transmitted through the gaps from being transmitted to the image sensor (490). The structure (2515) has a cross-section of a polygon (e.g., an inverted trapezoidal shape) and represents a side wall (2511) of the OIS carrier (2510) facing the structure (2535) of the AF carrier (2530). The structure (2535) of the AF carrier (2530) has a cross-section of a polygon (e.g., trapezoidal shape) corresponding to the structure (2515) of the OIS carrier (2510), and represents a side wall (2531) of the AF carrier (2530) facing the structure (2515) of the OIS carrier (2510).

[0178] In the second state of the camera module (300), as the structure (2515) of the OIS carrier (2510) moves in the -X-axis direction on the bottom part (2536) of the AF carrier (2530), the amount of light flowing in from the outside toward the structure (2515) of the OIS carrier (2510) and the structure (2535) of the AF carrier (2530) may increase. Some of the light other than the light transmitted to the lens assembly (310) may be transmitted into the interior of the camera module (300) along the optical path (pl). Light may be introduced into the interior of the camera module (300) along the optical path (pl) through the gap between the lens assembly (310) and the inner surface of the opening (331) of the shield can (330) and the gap between the lens assembly (310) and the inner surface of the opening (441) of the stopper (440).

[0179] In the second state of the camera module (300), the structure (2515) of the OIS carrier (2510) can be positioned on the optical path (pl) of light entering the camera module (300). The structure (2515) of the OIS carrier (2510) positioned on the optical path (pl) can reflect or absorb light. The structure (2515) of the OIS carrier (2510) can reflect light entering from the outside so as to prevent or limit light from traveling away from the optical path (pl) and being transmitted to the image sensor (490). The light reflected from the structure (2515) of the OIS carrier (2510) can be transmitted to the inner surface of the stopper (440) and be absorbed or reflected. The light reflected from the structure (2515) of the OIS carrier (2510) can travel away from the optical path (pl) and be absorbed by other structures, thereby reducing the amount of light.

[0180] FIG. 28 is an exploded perspective view of a camera module including an OIS carrier including a receiving portion for receiving a portion of a stopper, according to one embodiment. FIGS. 29 and 30 are cross-sectional views of a camera module including an OIS carrier including a receiving portion for receiving a portion of a stopper, according to one embodiment.

[0181] Referring to FIG. 28, the camera module (300) may include a stopper (2840), an OIS carrier (2810), and an AF carrier (2830). The camera module (300) of FIG. 28 may have the same or similar components and shapes as the camera modules (300) of FIGS. 3, 4, 5a, 5b, 5c, 6, and 7, except for the shapes of the OIS carrier and the AF carrier.

[0182] The OIS carrier (2810) may include an opening (2812) for receiving at least a portion of the lens assembly (310). The lens assembly (310) may be coupled to the OIS carrier (2810). The lens assembly (310) received in the OIS carrier (2810) may be moved in a plane (e.g., XY plane) perpendicular to the optical axis (OA) by the OIS carrier (2810). The OIS carrier (2810) may include a side wall (2811) defining the opening (2812). The configuration of the OIS carrier (2810) may be the same as or similar to the shape and components of the OIS carrier (410) of FIGS. 3 and 4, except for the shape of the side wall (2811) facing one side (2831a) of the AF carrier (2830).

[0183] A portion of a side wall (2811) forming (or configuring) a first side surface (2811a) of the OIS carrier (2810) may include a structure (2815) having a slope from a surface extending from the first side surface (2811a) toward a bottom portion (2816) of the OIS carrier (2810). The bottom portion (2816) may extend from the lower portion of the OIS carrier (2810) toward one side surface (2831a) of the AF carrier (2830) (e.g., in the X-axis direction). The AF carrier (2830) may provide a receiving space (2835) in which a receiving portion (2841) of a stopper (2840) surrounding the structure (2815) of the OIS carrier (2810) and the structure (2815) of the OIS carrier (2810) are arranged. Even during movement of the OIS carrier (2810), when viewed from above, the receiving portion (2841) of the stopper (2840) and the structure (2815) of the OIS carrier (2810) may be configured to partially overlap. For example, the structure (2815) of the OIS carrier (2810) may be at least partially disposed within the receiving portion (2841) of the stopper (2840). The configuration of the AF carrier (2830) may be identical or similar to the shape and components of the AF carrier (430) of FIGS. 3 and 4, except for the shape of the side wall (2831) on which one surface (2831a) is disposed.

[0184] The stopper (2840) may further include a receiving portion (2841) configured to at least partially surround the structure (2815) of the OIS carrier (2810). The receiving portion (2841) may extend substantially parallel to the slope of the structure (2815) of the side wall (2811) of the OIS carrier (2810) from a portion (2849) of the stopper (2840) that overlaps the structure (2815) of the side wall (2811) of the OIS carrier (2810) when viewed from above.

[0185] Referring to FIG. 29, the OIS carrier (2810) can be moved in the +X-axis direction by interaction between the first OIS magnet (e.g., the first OIS magnet (416a) of FIG. 4) and the electromagnet or coil included in the FPCB assembly (e.g., the FPCB assembly (460) of FIG. 4).

[0186] The state in which the OIS carrier (2810) moves in the +X-axis direction, and the inclined surface of the structure (2815) of the OIS carrier (2810) and the receiving portion (2841) of the stopper (2840) are arranged adjacent to each other may be a first state of the camera module (300). In the first state of the camera module (300), the distance between the inner circumference of the opening (331) of the lens assembly (310) and the shield can (330) and the inner circumference of the opening (2842) of the stopper (2840) may be minimum. In the first state of the camera module (300), light transmitted into the interior of the camera module (300) through parts other than the lens assembly (310) (e.g., the gaps) may be reflected or scattered by internal mechanisms due to the narrow gap, and may be restricted from being transmitted to the image sensor (490).

[0187] Referring to FIG. 30, the OIS carrier (2810) can be moved in the -X-axis direction by interaction between the first OIS magnet (416a) and the electromagnet or coil included in the FPCB assembly (460).

[0188] When the OIS carrier (2810) moves in the -X-axis direction, the structure (2815) of the OIS carrier (2810) may be partially detached from the receiving portion (2841) of the stopper (2840). A state in which the distance between the structure (2815) of the OIS carrier (1410) and the receiving portion (2841) of the stopper (2840) is at its maximum may be a second state of the camera module (300). Within the second state of the camera module (300), the distance between the inner circumference of the opening (331) of the lens assembly (310) and the shield can (330) and the inner circumference of the opening (2841) of the lens assembly (310) and the stopper (240) may be at its maximum. Within the second state of the camera module (300), light transmitted into the interior of the camera module (300) through parts other than the lens assembly (310), such as the gaps, may increase. Within the second state of the camera module (300), a structure (2815) of the OIS carrier (2810) may be positioned on the path of the light to reduce or prevent light transmitted through the gaps from being transmitted to the image sensor (490).

[0189] The structure (2815) of the OIS carrier (2810) may face the receiving portion (2835) of the side wall (2831) of the AF carrier (2830). In the second state of the camera module (300), as the structure (2815) of the OIS carrier (2810) moves in the -X-axis direction on the AF carrier (2830), the amount of light entering from the outside toward the structure (2815) of the OIS carrier (2810), the inside of the stopper (2840), or the inside of the camera module (300) may increase. Some of the light other than the light transmitted to the lens assembly (310) may be transmitted to the inside of the camera module (300). Light can enter the interior of the camera module (300) along the optical path (pl) through the gap between the inner surface of the opening (331) of the lens assembly (310) and the shield can (330) and the gap between the inner surface of the opening (2841) of the lens assembly (310) and the stopper (2840).

[0190] In the second state of the camera module (300), the structure (2815) of the OIS carrier (2810) can be positioned on the optical path (pl) of light entering the camera module (300). The structure (2815) of the OIS carrier (2810) positioned on the optical path (pl) can reflect or absorb the light. The structure (2815) of the OIS carrier (2810) can reflect the incoming light so as to prevent or limit the light from traveling away from the optical path (pl) and being transmitted to the image sensor (490). The light reflected from the structure (2815) of the OIS carrier (2810) can be transmitted to the inner surface of the stopper (2840) and be absorbed or reflected. The light reflected from the structure (2815) of the OIS carrier (2810) can travel away from the optical path and be absorbed by other structures, thereby reducing the amount of light.

[0191] The technical problems to be achieved in the present disclosure are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by a person having ordinary knowledge in the technical field to which the present disclosure pertains.

[0192] According to the above-described embodiment, a camera module (e.g., camera module (300) of FIG. 3) may include a lens assembly (e.g., lens assembly (310) of FIG. 3) including lenses having an optical axis, a shield can (e.g., shield can 330) spaced apart from the lens assembly and including an opening that laterally surrounds the lens assembly, an optical image stabilization (OIS) carrier (e.g., OIS carrier (410) of FIG. 3) configured to move in a direction perpendicular to the optical axis of the lens and including a side wall defining an internal space for accommodating the lens assembly, and an auto focus (AF) carrier (e.g., AF carrier (430) of FIG. 3) configured to move along the optical axis of the lens and including a side wall defining a space for accommodating the lens assembly and the OIS carrier. The side wall of the AF carrier may include a receiving portion. A portion of the side wall of the OIS carrier may be accommodated in a receiving portion of the side wall of the AF carrier so as to partially overlap the side wall of the AF carrier when viewed from above.

[0193] In one embodiment, the portion of the side wall of the OIS carrier corresponding to the horizontally extending portion may be configured to block light when the OIS carrier is moved in a first direction away from the side wall of the AF carrier. The horizontally extending portion of the side wall of the OIS carrier may be configured to partially overlap the side wall of the AF carrier when the OIS carrier is moved in a second direction opposite to the first direction when viewed from above.

[0194] According to one embodiment, the camera module may further include an image sensor (e.g., image sensor (490) of FIG. 3) disposed below the lens assembly and configured to acquire image data by light from outside the electronic device through the lens assembly. The portion of the side wall of the OIS carrier may be configured to obstruct light traveling to the image sensor through a gap between the side wall of the OIS carrier and the side wall of the AF carrier.

[0195] In one embodiment, the portion of the sidewall of the OIS carrier may cover a gap between the sidewall of the OIS carrier and the sidewall of the AF carrier.

[0196] According to one embodiment, the receiving portion of the AF carrier includes a recessed portion dug from an outer surface facing the portion of the side wall of the AF carrier, and the portion of the side wall of the OIS carrier can partially overlap one side of the recessed portion of the AF carrier that is perpendicular to the optical axis when viewed in a direction parallel to the optical axis.

[0197] According to one embodiment, the portion of the side wall of the OIS carrier includes a protruding portion protruding toward the side wall of the AF carrier, and the protruding portion of the OIS carrier can be partially inserted into the recessed portion of the AF carrier while the OIS carrier moves in the second direction.

[0198] In one embodiment, the protruding portion may protrude substantially perpendicular to the optical axis.

[0199] In one embodiment, the camera module may further include a stopper disposed over a portion of the AF carrier and a portion of the OIS carrier. The stopper may be coupled to the AF carrier and may partially cover the portion of the side wall of the OIS carrier.

[0200] According to one embodiment, the side wall of the AF carrier includes a first magnet (e.g., AF magnet (436) of FIG. 4) disposed within a portion of the side wall of the AF carrier spaced apart from the receiving portion of the side wall of the AF carrier, and the first magnet of the AF carrier can be configured to move the AF carrier in the first direction. The side wall of the OIS carrier includes a second magnet (e.g., OIS magnets (416a, 416b) of FIG. 4) disposed within another portion of the OIS carrier spaced apart from the portion of the side wall of the OIS carrier, and the second magnet of the OIS carrier can be configured to move the OIS carrier in the second direction.

[0201] In one embodiment, the side wall of the AF carrier may include a first magnet. The receiving portion may be contained within the first magnet.

[0202] In one embodiment, the sidewall of the OIS carrier may include a sidewall coupled to a side of the lens assembly. The AF carrier may be spaced apart from the sidewall of the OIS carrier.

[0203] According to one embodiment, the OIS carrier may further include a shield can (e.g., shield can (330) of FIG. 3) spaced apart from the lens assembly and including an opening (e.g., opening (331) of FIG. 3) that laterally surrounds the lens assembly, and an image sensor (e.g., image sensor (490) of FIG. 3) disposed below the lens assembly. The portion of the OIS carrier may extend from the sidewall of the OIS carrier to the sidewall of the AF carrier to reduce light passing through the opening of the shield can from being transmitted to the image sensor through a gap between the sidewall of the OIS carrier and the sidewall of the AF carrier.

[0204] The receiving portion of the side wall of the AF carrier may include an opening that opens a portion of the side wall.

[0205] The shield can further include a shield can that is spaced apart from the AF carrier and includes an opening that laterally surrounds the lens assembly. The portion of the side wall of the OIS carrier can penetrate through the opening of the side wall toward the inner surface of the shield can.

[0206] According to one embodiment, the AF carrier may further include a stopper coupled to the AF carrier, wherein the stopper may be configured to be inserted into the opening when the OIS carrier is moved toward the side wall of the AF carrier.

[0207] According to the above-described embodiment, an electronic device (e.g., an electronic device (100) of FIG. 1A) may include a housing (e.g., a housing (110) of FIG. 1A), a camera module (e.g., a camera module (300) of FIG. 3) disposed within the housing, a lens assembly having an optical axis (e.g., a lens assembly (310) of FIG. 3), a shield can (e.g., a shield can (330) of FIG. 3) including an opening that laterally surrounds the lens assembly, and an OIS carrier configured to move perpendicular to the optical axis. The OIS carrier may include a side wall (e.g., a side wall (411) of FIG. 3) coupled to a side of the lens assembly. The camera module may include an AF carrier (e.g., an AF carrier (430) of FIG. 3) configured to move along the optical axis and including a side wall spaced apart from a side wall of the OIS carrier. The OIS carrier may include a portion extending from the side wall of the OIS carrier and overlapping the side wall of the AF carrier.

[0208] According to one embodiment, the camera module may further include an image sensor (e.g., image sensor (490) of FIG. 3) disposed below the lens assembly. The portion of the side wall of the OIS carrier may extend from the side wall of the OIS carrier to the side wall of the AF carrier to reduce light passing through the opening of the shield can from being transmitted to the image sensor through a gap between the side wall of the OIS carrier and the side wall of the AF carrier.

[0209] According to one embodiment, the AF carrier may include a recessed portion recessed from an upper portion of a side wall of the AF carrier, and the portion of the OIS carrier may include a protruding portion protruding toward the side wall of the AF carrier. The protruding portion of the OIS carrier may partially overlap the recessed portion of the AF carrier when viewed from above.

[0210] According to one embodiment, the protruding portion of the OIS carrier may be configured to temporarily detach from the recessed portion according to the OIS movement of the OIS carrier. The protruding portion of the OIS carrier may protrude substantially perpendicular to the optical axis.

[0211] According to one embodiment, the device further comprises a stopper coupled to the AF carrier, wherein the stopper may be positioned over at least a portion of the AF carrier and at least a portion of the OIS carrier. The stopper may be positioned to cover the portion according to the OIS movement of the OIS carrier.

[0212] According to one embodiment, a camera module (e.g., camera module (300) of FIG. 3) may include a base housing (e.g., housing (401) of FIG. 3), a lens assembly (e.g., lens assembly (310) of FIG. 3) at least partially surrounded by the base housing, a printed circuit board (e.g., printed circuit board (390) of FIG. 3) disposed below the base housing, an image sensor (e.g., lens assembly (490) of FIG. 3) disposed on the substrate so as to be at least partially aligned with an optical axis of the lens assembly, and an autofocus (AF) housing (e.g., AF carrier (430) of FIG. 3) accommodated in the base housing and configured to move along a first direction corresponding to the optical axis. The AF housing may include a plurality of sidewalls including a first sidewall having a cut area formed thereon. The camera module includes an optical image correction (OIS) housing (e.g., an OIS carrier (410) of FIG. 3) accommodated in the AF housing, accommodates the lens assembly, and is configured to move along a second direction substantially perpendicular to the optical axis, wherein a second side wall of the OIS housing can be arranged to at least partially overlap the cut area of ​​the first side wall when viewed from above.

[0213] In one embodiment, the cut region of the first side wall may include a recessed region in which at least a portion of the upper portion of the first side wall is recessed toward the substrate. The second side wall may include a protruding region protruding toward the first side wall. A portion of the protruding region may be arranged to at least partially overlap the recessed region when viewed from above.

[0214] The above portion of the above protruding area can be set to be temporarily dislocated from the above recessed area according to the OIS movement of the OIS housing.

[0215] According to one embodiment, the OIS housing may be configured to substantially cover a gap between an inner surface of the first side wall and an outer surface of the second side wall, which are opposite to each other, when viewed from above, even when the portion of the protruding area is temporarily displaced from the recessed area.

[0216] The above protruding region may protrude substantially perpendicularly to the optical axis.

[0217] According to one embodiment, the AF housing includes a magnet, the first side wall includes a magnet support member that supports the magnet, and at least a portion of the cut area can be formed on the magnet support member.

[0218] According to one embodiment, one side of the magnet may include a magnet cut area formed in a shape corresponding to an edge of the cut area and corresponding to an upper portion of the protrusion.

[0219] According to one embodiment, the cut region of the first side wall includes an opening formed in a direction substantially perpendicular to the optical axis, and a portion of the protruding region can be set to pass through the opening.

[0220] According to one embodiment, the device further comprises a stopper coupled to the AF housing and positioned over at least a portion of the AF housing and at least a portion of the OIS housing, wherein a side of the stopper can be positioned to cover the protruding area during OIS movement of the OIS housing.

[0221] According to one embodiment, said one side of said stopper includes a third side wall extending substantially toward said substrate, and said protruding region of said OIS carrier can protrude substantially opposite said third side wall.

[0222] In one embodiment, an ending portion of the third side wall may extend toward the second side wall to form a recessed region of the third side wall. The protruding region may be configured to be accommodated in the recessed region of the third side wall according to movement of the OIS housing.

[0223] According to one embodiment, the third side wall includes an opening formed therein, and a portion of the protruding region can be configured to pass through the opening in accordance with movement of the OIS housing.

[0224] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned will be clearly understood by a person having ordinary skill in the art to which the present disclosure pertains.

[0225] FIG. 31 is a block diagram of an electronic device within a network environment according to one embodiment.

[0226] Referring to FIG. 31, in a network environment (3100), an electronic device (3101) may communicate with an electronic device (3102) via a first network (3198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (3104) or a server (3108) via a second network (3199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (3101) may communicate with the electronic device (3104) via the server (3108). According to one embodiment, the electronic device (3101) may include a processor (3120), a memory (3130), an input module (3150), an audio output module (3155), a display module (3160), an audio module (3170), a sensor module (3176), an interface (3177), a connection terminal (3178), a haptic module (3179), a camera module (3180), a power management module (3188), a battery (3189), a communication module (3190), a subscriber identification module (3196), or an antenna module (3197). In some embodiments, the electronic device (3101) may omit at least one of these components (e.g., the connection terminal (3178)), or may have one or more other components added. In some embodiments, some of these components (e.g., sensor module (3176), camera module (3180), or antenna module (3197)) may be integrated into a single component (e.g., display module (3160)).

[0227] The processor (3120) may, for example, execute software (e.g., a program (3140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (3101) connected to the processor (3120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (3120) may store commands or data received from other components (e.g., a sensor module (3176) or a communication module (3190)) in a volatile memory (3132), process the commands or data stored in the volatile memory (3132), and store result data in a non-volatile memory (3134). According to one embodiment, the processor (3120) may include a main processor (3121) (e.g., a central processing unit or an application processor) or an auxiliary processor (3123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (3121). For example, when the electronic device (3101) includes the main processor (3121) and the auxiliary processor (3123), the auxiliary processor (3123) may be configured to use less power than the main processor (3121) or to be specialized for a given function. The auxiliary processor (3123) may be implemented separately from the main processor (3121) or as a part thereof.

[0228] The auxiliary processor (3123) may control at least a portion of functions or states associated with at least one component (e.g., the display module (3160), the sensor module (3176), or the communication module (3190)) of the electronic device (3101), for example, on behalf of the main processor (3121) while the main processor (3121) is in an inactive (e.g., sleep) state, or together with the main processor (3121) while the main processor (3121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (3123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (3180) or a communication module (3190)). In one embodiment, the auxiliary processor (3123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (3101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (3108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0229] The memory (3130) can store various data used by at least one component (e.g., the processor (3120) or the sensor module (3176)) of the electronic device (3101). The data can include, for example, software (e.g., the program (3140)) and input data or output data for commands related thereto. The memory (3130) can include volatile memory (3132) or non-volatile memory (3134).

[0230] The program (3140) may be stored as software in memory (3130) and may include, for example, an operating system (3142), middleware (3144), or an application (3146).

[0231] The input module (3150) can receive commands or data to be used in a component of the electronic device (3101) (e.g., a processor (3120)) from an external source (e.g., a user) of the electronic device (3101). The input module (3150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0232] The audio output module (3155) can output audio signals to the outside of the electronic device (3101). The audio output module (3155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0233] The display module (3160) can visually provide information to an external party (e.g., a user) of the electronic device (3101). The display module (3160) may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling the device. In one embodiment, the display module (3160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0234] The audio module (3170) can convert sound into an electrical signal, or vice versa. According to one embodiment, the audio module (3170) can acquire sound through the input module (3150), output sound through the sound output module (3155), or an external electronic device (e.g., electronic device (3102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (3101).

[0235] The sensor module (3176) can detect the operating status (e.g., power or temperature) of the electronic device (3101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (3176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0236] The interface (3177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (3101) with an external electronic device (e.g., the electronic device (3102)). In one embodiment, the interface (3177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0237] The connection terminal (3178) may include a connector through which the electronic device (3101) may be physically connected to an external electronic device (e.g., the electronic device (3102)). In one embodiment, the connection terminal (3178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0238] The haptic module (3179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (3179) may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0239] The camera module (3180) can capture still images and videos. According to one embodiment, the camera module (3180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0240] The power management module (3188) can manage the power supplied to the electronic device (3101). According to one embodiment, the power management module (3188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0241] A battery (3189) may power at least one component of the electronic device (3101). In one embodiment, the battery (3189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0242] The communication module (3190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (3101) and an external electronic device (e.g., electronic device (3102), electronic device (3104), or server (3108)), and the performance of communication through the established communication channel. The communication module (3190) may operate independently from the processor (3120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (3190) may include a wireless communication module (3192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (3194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, a corresponding communication module can communicate with an external electronic device (3104) via a first network (3198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (3199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (3192) can verify or authenticate the electronic device (3101) within a communication network such as the first network (3198) or the second network (3199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (3196).

[0243] The wireless communication module (3192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimizing terminal power and connecting multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency communications (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (3192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (3192) can support various technologies for securing performance in high-frequency bands, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (3192) can support various requirements specified in the electronic device (3101), an external electronic device (e.g., the electronic device (3104)), or a network system (e.g., the second network (3199)). According to one embodiment, the wireless communication module (3192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0244] The antenna module (3197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (3197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (3197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (3198) or the second network (3199), may be selected from the plurality of antennas by, for example, the communication module (3190). A signal or power may be transmitted or received between the communication module (3190) and an external electronic device via the at least one selected antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (3197).

[0245] According to various embodiments, the antenna module (3197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band.

[0246] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0247] According to one embodiment, commands or data may be transmitted or received between the electronic device (3101) and an external electronic device (3104) via a server (3108) connected to a second network (3199). Each of the external electronic devices (3102 or 3104) may be the same or a different type of device as the electronic device (3101). According to one embodiment, all or part of the operations executed in the electronic device (3101) may be executed in one or more of the external electronic devices (3102, 3104, or 3108). For example, when the electronic device (3101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (3101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (3101). The electronic device (3101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (3101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (3104) may include an Internet of Things (IoT) device. The server (3108) may be an intelligent server utilizing machine learning and / or a neural network.According to one embodiment, an external electronic device (3104) or server (3108) may be included within the second network (3199). The electronic device (3101) may be applied to intelligent services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology and IoT-related technology.

[0248] FIG. 32 is a block diagram illustrating a camera module according to various embodiments.

[0249] Referring to FIG. 32, the camera module (3180) may include a lens assembly (3210), a flash (3220), an image sensor (3230), an image stabilizer (3240), a memory (3250) (e.g., a buffer memory), or an image signal processor (3260). The lens assembly (3210) may collect light emitted from a subject that is a target of image capturing. The lens assembly (3210) may include one or more lenses. According to one embodiment, the camera module (3180) may include a plurality of lens assemblies (3210). In this case, the camera module (3180) may form, for example, a dual camera, a 360-degree camera, or a spherical camera. Some of the plurality of lens assemblies (3210) may have the same lens properties (e.g., angle of view, focal length, autofocus, f-number, or optical zoom), or at least one lens assembly may have one or more lens properties that are different from the lens properties of the other lens assemblies. A lens assembly (3210) may include, for example, a wide-angle lens or a telephoto lens.

[0250] The flash (3220) can emit light used to enhance light emitted or reflected from a subject. In one embodiment, the flash (3220) can include one or more light-emitting diodes (e.g., red-green-blue (RGB) LEDs, white LEDs, infrared LEDs, or ultraviolet LEDs), or a xenon lamp. The image sensor (3230) can convert light emitted or reflected from a subject and transmitted through the lens assembly (3210) into an electrical signal, thereby acquiring an image corresponding to the subject. In one embodiment, the image sensor (3230) can include one image sensor selected from among image sensors having different properties, such as an RGB sensor, a black and white (BW) sensor, an IR sensor, or a UV sensor, a plurality of image sensors having the same property, or a plurality of image sensors having different properties. Each image sensor included in the image sensor (3230) may be implemented using, for example, a CCD (charged coupled device) sensor or a CMOS (complementary metal oxide semiconductor) sensor.

[0251] The image stabilizer (3240) can move at least one lens or image sensor (3230) included in the lens assembly (3210) in a specific direction or control the operating characteristics of the image sensor (3230) (e.g., adjusting the read-out timing, etc.) in response to the movement of the camera module (3180) or the electronic device (3101) including the same. This allows compensating for at least some of the negative effects of the movement on the captured image. In one embodiment, the image stabilizer (3240) can detect the movement of the camera module (3180) or the electronic device (3101) using a gyro sensor (not shown) or an acceleration sensor (not shown) disposed inside or outside the camera module (3180). In one embodiment, the image stabilizer (3240) can be implemented as an optical image stabilizer. The memory (3250) can temporarily store at least a portion of an image acquired through the image sensor (3230) for the next image processing task. For example, when image acquisition is delayed due to a shutter, or when multiple images are acquired at high speed, the acquired original image (e.g., a Bayer-patterned image or a high-resolution image) is stored in the memory (3250), and a corresponding copy image (e.g., a low-resolution image) can be previewed through the display module (3160). Thereafter, when a specified condition is satisfied (e.g., a user input or a system command), at least a portion of the original image stored in the memory (3250) can be acquired and processed, for example, by the image signal processor (3260). According to one embodiment, the memory (3250) can be configured as at least a portion of the memory (3130) or as a separate memory that operates independently therefrom.

[0252] The image signal processor (3260) can perform one or more image processing operations on an image acquired through an image sensor (3230) or an image stored in a memory (3250). The one or more image processing operations may include, for example, depth map generation, 3D modeling, panorama generation, feature extraction, image synthesis, or image compensation (e.g., noise reduction, resolution adjustment, brightness adjustment, blurring, sharpening, or softening). Additionally or alternatively, the image signal processor (3260) may perform control (e.g., exposure time control, read-out timing control, etc.) on at least one of the components included in the camera module (3180) (e.g., image sensor (3230)). An image processed by the image signal processor (3260) may be stored back in the memory (3250) for further processing or provided to an external component of the camera module (3180) (e.g., memory (3130), display module (3160), electronic device (3102), electronic device (3104), or server (3108). According to one embodiment, the image signal The processor (3260) may be configured as at least a part of the processor (3120), or may be configured as a separate processor that operates independently of the processor (3120). If the image signal processor (3260) is configured as a separate processor from the processor (3120), at least one image processed by the image signal processor (3260) may be displayed through the display module (3160) by the processor (3120) as is or after undergoing additional image processing.

[0253] According to one embodiment, the electronic device (3101) may include a plurality of camera modules (3180), each having different properties or functions. For example, at least one of the plurality of camera modules (3180) may be a wide-angle camera, and at least one of the plurality of camera modules (3180) may be a telephoto camera. Similarly, at least one of the plurality of camera modules (3180) may be a front-facing camera, and at least one of the plurality of camera modules (3180) may be a rear-facing camera.

[0254] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0255] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0256] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0257] Various embodiments of the present document may be implemented as software (e.g., a program (3140)) including one or more instructions stored in a storage medium (e.g., an internal memory (3136) or an external memory (3138)) readable by a machine (e.g., an electronic device (3101)). For example, a processor (e.g., a processor (3120)) of the machine (e.g., an electronic device (3101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0258] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0259] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In the camera module, A lens assembly comprising lenses having an optical axis (OA); A shield can spaced apart from the lens assembly and including an opening that laterally surrounds the lens assembly; An optical image stabilization (OIS) carrier configured to move in a direction perpendicular to the optical axis (OA) of the lens and including side walls defining a space for accommodating the lens assembly; and An AF carrier configured to move along the optical axis (OA) of the lens and including a side wall defining a space for accommodating the lens assembly and the OIS carrier, The side wall of the above AF carrier includes a receiving portion, A portion of the side wall of the OIS carrier is configured to be received in a receiving portion of the side wall of the AF carrier so as to at least partially overlap the side wall of the AF carrier when viewed from above. Camera module.

2. In paragraph 1, The portion of the side wall of the OIS carrier corresponds to a horizontally extending portion configured to block light when the OIS carrier moves in a first direction away from the side wall of the AF carrier, The horizontally extending portion of the side wall (411) of the OIS carrier (410) is configured to partially overlap the side wall of the AF carrier when the OIS carrier is moved in a second direction opposite to the first direction when viewed from above. Camera module.

3. In paragraph 1, Further comprising an image sensor arranged under the lens assembly and configured to acquire image data by light from outside the electronic device through the lens assembly; A portion of the side wall of the OIS carrier obstructs light traveling to the image sensor through a gap between the side wall of the OIS carrier and the side wall of the AF carrier. Camera module.

4. In paragraph 1, A portion of the side wall of the OIS carrier covers a gap between the side wall of the OIS carrier and the side wall of the AF carrier. Camera module.

5. In paragraph 1, The receiving portion of the AF carrier includes a recessed portion dug from the outer surface facing the portion of the side wall of the AF carrier, A portion of the side wall of the OIS carrier, when viewed in a direction parallel to the optical axis (OA), at least partially overlaps one side of the recessed portion of the AF carrier that is perpendicular to the optical axis (OA). Camera module.

6. In paragraph 5, The part of the side wall of the OIS carrier includes a protruding part protruding toward the side wall of the AF carrier, and the protruding part of the OIS carrier is at least partially inserted into the recessed part of the AF carrier while the OIS carrier moves in a direction perpendicular to the optical axis (OA). Camera module.

7. In paragraph 1, The above camera module comprises a part of the AF carrier and the OIS. Further comprising a stopper placed on a portion of the carrier, The stopper is coupled to the AF carrier and at least partially covers a portion of the side wall of the OIS carrier. Camera module.

8. In paragraph 1, The side wall of the AF carrier includes a first magnet disposed within a portion of the side wall of the AF carrier other than the receiving portion of the side wall of the AF carrier, and the first magnet of the AF carrier is configured to move the AF carrier along the optical axis (OA). The side wall of the OIS carrier includes a second magnet disposed within another portion of the OIS carrier, other than the portion of the side wall of the OIS carrier, and the second magnet of the OIS carrier is configured to move the OIS carrier in a direction perpendicular to the optical axis (OA). Camera module.

9. In paragraph 1, The side wall of the above AF carrier includes a first magnet, The above-mentioned receiving portion is included within the first magnet, Camera module.

10. In paragraph 1, The side wall of the OIS carrier is coupled to the side of the lens assembly, The side wall of the above AF carrier is spaced apart from the side wall of the above OIS carrier. Camera module.

11. In paragraph 1, further comprising an image sensor disposed under the lens assembly; The part of the OIS carrier extends from the side wall of the OIS carrier to the side wall of the AF carrier to reduce light passing through the opening of the shield can from being transmitted to the image sensor through the gap between the side wall of the OIS carrier and the side wall of the AF carrier. Camera module.

12. In paragraph 1, The receiving portion of the side wall of the AF carrier is an opening that opens a part of the side wall. Camera module.

13. In paragraph 12, Further comprising a shield can spaced apart from the AF carrier and including an opening that laterally surrounds the lens assembly; A portion of said side wall of said OIS carrier is configured to penetrate an opening in said side wall when moved toward the inner surface of said shield can. Camera module.

14. In paragraph 12, Further comprising a stopper coupled to the above AF carrier, The stopper includes an opening aligned with the opening of the side wall, A portion of the side wall of the OIS carrier is configured to be inserted into the opening when the OIS carrier is moved toward the side wall of the AF carrier. Camera module.

15. In electronic devices, Housing; and A camera module disposed within the housing; A lens assembly having an optical axis (OA); A shield can including an opening that laterally surrounds the lens assembly; An OIS carrier configured to move perpendicular to the optical axis (OA), the OIS carrier including a side wall coupled to a side of the lens assembly; and An AF carrier configured to move along the optical axis (OA) and including a side wall spaced apart from the side wall of the OIS carrier; The OIS carrier extends from the side wall of the OIS carrier and includes a portion that is overlappable with the side wall of the AF carrier. Electronic devices.

Images