Shell assembly and electronic device

Abstract

The embodiments of the present application relate to the technical field of electronic devices. Provided are a shell assembly and an electronic device. The shell assembly comprises a substrate layer and a leather layer, which are arranged in a stacked manner, wherein the leather layer comprises a fiber layer and a polyurethane resin layer, which are arranged in a stacked manner, the fiber layer is located between the substrate layer and the polyurethane resin layer, and the fiber layer is made of fiber yarns having a tensile modulus larger than 60 GPa. By means of such arrangement, after undergoing a thinning design, a rear cover has adequate strength and puncture resistance, and can satisfy use requirements.

Description

Housing assembly and electronic device

[0001] The present application claims priority to the Chinese patent application No. 202410909873.8, filed on July 5, 2024, and entitled "Housing assembly and electronic device", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0002] Embodiments of the present application relate to the technical field of electronic devices, in particular to a housing assembly and an electronic device. BACKGROUND

[0003] With the development of mobile phone terminals and plastic back cover industries, creating a lightweight and high-strength back cover while reducing the thickness has become the industry's unified pursuit. The current back cover composition includes polyurethane (PU) material. However, the polyurethane material itself does not provide support strength, and cannot provide sufficient strength and puncture resistance for the thinned back cover, and cannot meet the use requirements. Therefore, how to make the thinned back cover have sufficient strength and puncture resistance has become a problem to be solved. SUMMARY

[0004] Embodiments of the present application provide a housing assembly and an electronic device. The back cover of the electronic device has sufficient strength and puncture resistance after being thinned, and can meet the use requirements.

[0005] The first aspect of the present application provides a housing assembly, which includes a substrate layer and a cortex layer stacked. The cortex layer includes a fiber layer and a polyurethane resin layer stacked, and the fiber layer is located between the substrate layer and the polyurethane resin layer, and the fiber layer is made of fiber yarn with a tensile modulus greater than 60 Gpa.

[0006] In the present implementation, the fiber layer is made of fiber yarn with a tensile modulus greater than 60 Gpa, so that the fiber layer has a certain strength, can enhance the strength of the cortex layer, and can support the polyurethane resin layer. In addition, while the fiber layer provides support strength, the thickness of the fiber layer is thin, so that the thickness of the cortex layer is thin, thereby the thickness of the housing assembly is thin, and the thinned design is realized. Therefore, the housing assembly is applied to the back cover, and the back cover can provide sufficient strength and puncture resistance while realizing the thinned design, and can meet the use requirements.

[0007] In some possible implementations, the tensile breaking strength of the cortex layer can be greater than 100 N / cm, so that the cortex layer provides a certain support strength and puncture resistance, so that the thinned housing assembly has sufficient strength, and the housing assembly can be thinned.

[0008] In some possible implementations, the fiber layer is made of one kind of fiber yarn, or the fiber layer is made of multiple kinds of fiber yarns. The fiber layer made of one or more kinds of fiber yarns can provide certain support strength, so that the cortex layer can provide support strength, and thus the thinned shell assembly can provide sufficient strength and puncture resistance.

[0009] In some possible implementations, the fiber layer is woven cloth, and the number of strands of the woven cloth is greater than or equal to 100D and less than or equal to 150D. By limiting the number of strands of the woven cloth to 100D-150D, not only can the fiber layer provide certain support strength, but also the thickness of the fiber layer can be controlled within a reasonable range to achieve the thinning design of the shell assembly.

[0010] In some possible implementations, the fiber layer is unidirectional cloth, and the number of strands of the unidirectional cloth is greater than or equal to 100D and less than or equal to 250D. By limiting the number of strands of the unidirectional cloth to 100D-250D, not only can the fiber layer provide certain support strength, but also the thickness of the fiber layer can be controlled within a reasonable range to achieve the thinning design of the shell assembly.

[0011] In some possible implementations, the fiber yarn includes at least one of the following fibers: glass fiber, high modulus glass fiber, poly-p-phenylene benzobisoxazole fiber, polyimide fiber, aramid fiber. The fiber yarn made of these fibers has a tensile modulus greater than 60Gpa, so that the fiber layer can provide certain support strength and achieve the thinning design of the shell assembly.

[0012] In some possible implementations, the shell assembly further includes a hot melt adhesive layer, and the hot melt adhesive layer is located between the base layer and the fiber layer, and the base layer is attached to the cortex layer through the hot melt adhesive layer. In this way, the cortex layer is bonded to the base layer through the hot melt adhesive layer, and the process is simple.

[0013] In some possible implementations, the viscosity of the hot melt adhesive layer is greater than or equal to 900cps and less than or equal to 1100cps. Since the specific surface area of the fiber layer is small, by controlling the viscosity of the hot melt adhesive layer to 900cps-1100cps, the hot melt adhesive has high flowability, so that it can penetrate more into the fiber layer when the hot melt adhesive layer dissolves, and the connection between the hot melt adhesive layer and the fiber layer is more firm.

[0014] In some possible implementations, the melting point of the hot melt adhesive layer is greater than or equal to 80℃ and less than or equal to 90℃. By controlling the melting point of the hot melt adhesive layer to 80℃-90℃, the difficulty of dissolving the hot melt adhesive layer can be reduced, and the hot melt adhesive layer can change from solid to liquid more quickly, thereby reducing the difficulty of connecting the hot melt adhesive layer and the fiber layer. In addition, it can also avoid the temperature of the hot melt adhesive layer being too high to cause the fiber layer to be deformed or damaged by heat.

[0015] In some possible implementation manners, the hot melt adhesive layer has a molecular weight greater than or equal to 5W and less than or equal to 5.5W. By controlling the molecular weight of the hot melt adhesive layer to be 5W-5.5W, the viscosity and flowability of the hot melt adhesive layer can be improved, so that the hot melt adhesive layer flows more easily and solidifies quickly. At the same time, the adhesion strength of the hot melt adhesive layer to the fiber layer can also be improved.

[0016] In some possible implementation manners, the hot melt adhesive layer is a polyurethane hot melt adhesive layer or an epoxy resin hot melt adhesive layer. By using the polyurethane hot melt adhesive layer or the epoxy resin hot melt adhesive layer, the substrate layer and the skin layer can be firmly connected.

[0017] In some possible implementation manners, the material of the substrate layer includes at least one of the following materials: glass fiber epoxy composite material, aramid fiber composite material, poly-p-phenylene benzobisoxazole fiber composite material, polyimide fiber composite material, polycarbonate composite material, or polymethyl methacrylate composite material. The substrate layer formed by the above materials has the characteristics of high strength and high modulus, and the shell assembly using the above materials has high strength and light weight.

[0018] The second aspect of the present application provides an electronic device, which includes a middle frame, a display screen, and a back cover. The back cover and the display screen are respectively connected to two opposite sides of the middle frame. The back cover includes the shell assembly of any one of the first aspect.

[0019] The third aspect of the present application provides a composite material, which is used as a skin layer of a shell assembly and includes a fiber layer and a polyurethane resin layer stacked. The fiber layer is arranged between the substrate layer and the polyurethane resin layer of the shell assembly, and the fiber layer is made of fiber yarns with a tensile modulus greater than 60Gpa.

[0020] In some possible implementation manners, the skin layer has a tensile breaking strength greater than 100N / cm.

[0021] In some possible implementation manners, the fiber layer is made of fiber yarns of one kind of material, or the fiber layer is made of fiber yarns of multiple kinds of materials.

[0022] In some possible implementation manners, the fiber layer is woven cloth, and the woven cloth has a denier greater than or equal to 100D and less than or equal to 150D.

[0023] In some possible implementation manners, the fiber layer is unidirectional cloth, and the unidirectional cloth has a denier greater than or equal to 100D and less than or equal to 250D.

[0024] In some possible implementations, the fiber yarn includes at least one of the following fibers: glass fiber, high modulus glass fiber, poly-p-phenylene benzobisoxazole fiber, polyimide fiber, aramid fiber.

[0025] The fourth aspect of the present application provides a preparation method of a shell assembly, the preparation method comprising: forming a substrate layer and a cortex layer respectively, the cortex layer comprising a fiber layer and a polyurethane resin layer stacked;

[0026] In some possible implementations, the adhering of the substrate layer to the side of the fiber layer away from the polyurethane resin layer comprises:

[0027] The fiber layer is adhered to the substrate layer through a hot melt adhesive layer.

[0028] In some possible implementations, the forming of the cortex layer comprises:

[0029] providing a polyurethane resin stack and a fiber layer, the polyurethane resin stack comprising a polyurethane resin layer and a release paper stacked;

[0030] adhering the polyurethane resin layer to a side of the fiber layer to form the cortex layer.

[0031] In some possible implementations, after the adhering of the polyurethane resin layer to the fiber layer and the forming of the cortex layer, the method further comprises:

[0032] forming a pattern on a side of the polyurethane resin layer away from the fiber layer. BRIEF DESCRIPTION OF DRAWINGS

[0033] FIG. 1 is a cross-sectional view of a rear cover in the related art;

[0034] FIG. 2 is an exploded view of an electronic device according to an embodiment of the present application;

[0035] FIG. 3 is a cross-sectional view of a shell assembly according to an embodiment of the present application;

[0036] FIG. 4 is a flowchart of a preparation method of a shell assembly according to an embodiment of the present application;

[0037] FIG. 5 is a flowchart of a preparation method of a cortex layer according to an embodiment of the present application;

[0038] FIG. 6 is a schematic diagram of a preparation process of a polyurethane resin stack according to an embodiment of the present application.

[0039] Explanation of reference signs: 100, electronic device; 110, display screen; 111, optical aperture area; 120, middle frame; 121, middle plate; 122, frame; 130, back cover; 131, through hole; 140, battery; 150, circuit board; 160, front camera module; 170, rear camera module; 200, shell assembly; 10, base layer; 20, cortex layer; 21, polyurethane resin layer; 211, first polyurethane resin coating; 212, second polyurethane resin coating; 213, third polyurethane resin coating; 22, fiber layer; 221, fiber yarn; 30, hot melt adhesive layer; 300, release paper. DETAILED DESCRIPTION

[0040] FIG. 1 is a cross-sectional view of a back cover in the related art. Referring to FIG. 1, a back cover 600 of an electronic device includes a cortex layer 620 and a base layer 610, and the cortex layer 620 is located on a side of the base layer 610 away from a battery. The cortex layer 620 includes a polyurethane resin layer 621 and a polyester fabric layer 622, and the material of the polyurethane resin layer 621 is polyurethane (PU) material, and the polyester fabric layer 622 is connected to the base layer 610. The cortex layer 620 makes the electronic device have a leather appearance effect and a hand feel, and improves the texture.

[0041] Since the polyurethane resin material does not provide support strength, in order to ensure the safety of the battery, in an embodiment, the cortex layer 620 has a thickness of 0.3-0.4 mm, and the base layer 610 has a thickness greater than 0.5 mm, so that the back cover 600 provides sufficient strength and puncture resistance to meet the use requirements. However, the thickness of the back cover 600 in this embodiment is greater than 0.7 mm, resulting in a relatively thick thickness of the back cover 600, which cannot achieve thinning design.

[0042] Therefore, in order to reduce the thickness of the back cover 600, the thickness of the cortex layer 620 and / or the base layer 610 can be reduced, so that the thickness of the back cover 600 is thinned, that is, the thickness of the back cover 600 is made to be less than 0.7 mm. However, after the thickness of the base layer 610 is reduced, the increased strength and puncture resistance of the back cover 600 are also reduced, which cannot meet the use requirements. Therefore, how to make the thinned back cover 600 provide sufficient strength and puncture resistance has become a problem to be solved.

[0043] Therefore, the shell assembly has a leather appearance and effect, and the quality of the electronic device with the shell assembly is improved. The composite material is composed of a fiber layer and a polyurethane resin layer. The fiber layer can provide a certain support strength and support the polyurethane resin layer. Therefore, after the shell assembly is designed to be thin, the composite material can provide a certain support strength, so that the shell assembly has sufficient strength and puncture resistance to meet the use requirements.

[0044] The electronic device can be a tablet computer, a mobile phone, an electronic reader, a remote controller, a personal computer (PC), a notebook computer, a personal digital assistant (PDA), a vehicle-mounted device, a network television, a wearable device, a television, and the like, and a smart watch, a smart bracelet, and the like. The form of the electronic device is not limited in the embodiments of the present application.

[0045] The following embodiments are exemplarily described by taking a mobile phone as an example. The mobile phone can be a foldable mobile phone, or a straight mobile phone, or a sliding mobile phone. The straight mobile phone is exemplarily described.

[0046] FIG. 2 is an exploded schematic view of an electronic device according to an embodiment of the present application.

[0047] Referring to FIG. 2, the electronic device 100 includes a middle frame 120, a display screen 110, and a back cover 130 (or a back shell). The middle frame 120 is located between the display screen 110 and the back cover 130. The back cover 130 and the display screen 110 are connected to two opposite sides of the middle frame 120, respectively.

[0048] The display screen 110 is used to display images. The display screen 110 can also integrate a touch function.

[0049] Continuing to refer to FIG. 2, the middle frame 120 can include a middle plate 121 and a frame 122 surrounding an outer edge of the middle plate 121. An inner wall of the frame 122 can be connected to an outer edge of the middle plate 121 to form an integral structure. The material of the middle plate 121 can be aluminum or an aluminum alloy, or the material of the middle plate 121 can be a stainless steel material.

[0050] Continuing to refer to FIG. 2, the electronic device 100 can further include a battery 140 and a circuit board 150, which can be disposed on the middle plate 121, and the battery 140 and the circuit board 150 can be disposed on a side of the middle plate 121 facing the back cover 130. Alternatively, in some embodiments, the battery 140 and the circuit board 150 can also be disposed on a side of the middle plate 121 facing the display screen 110. Alternatively, in some embodiments, the battery 140 is located on a side of the middle plate 121 facing the back cover 130, and the circuit board 150 is located on a side of the middle plate 121 facing the display screen 110.

[0051] Continuing to refer to FIG. 2, the electronic device 100 can further include a front camera module 160 and a rear camera module 170. The display screen 110 is provided with an optical hole area 111 cooperating with the front camera module 160, and the front camera module 160 realizes functions such as shooting or photographing through the optical hole area 111. The back cover 130 is provided with a through hole 131, and a part of the rear camera module 170 is located between the middle frame 120 and the back cover 130, and the other part is located outside the electronic device 100 through the through hole 131.

[0052] The back cover 130 is connected with the middle frame 120 to form a containing cavity for containing the above-mentioned electronic devices such as the circuit board 150, the battery 140, the front camera module 160 and the rear camera module 170, so as to prevent the water vapor and dust from the outside from entering the containing cavity, and avoid affecting the performance of the above-mentioned electronic devices.

[0053] Continuing to refer to FIG. 2, the back cover 130 includes a shell assembly 200. The orthographic projection of the battery 140 on the thickness direction Z of the electronic device 100 is located inside the orthographic projection of the shell assembly 200 on the thickness direction Z of the electronic device 100, that is, the shell assembly 200 covers the battery 140.

[0054] The material of the shell assembly 200 includes a polyurethane leather material having a polyurethane resin material, so that the shell assembly 200 has the appearance effect and the hand feeling of leather, thereby improving the texture of the back cover 130. In addition, the polyurethane leather material supports the polyurethane resin material by the fiber material having a certain support strength, so that the polyurethane leather material can provide a certain support strength, so that the shell assembly 200 can improve sufficient strength and anti-piercing performance after thinning, and then the back cover 130 can improve sufficient strength and anti-piercing performance after thinning, to ensure the safety of the battery 140.

[0055] It should be noted that in addition to including the shell assembly 200, the back cover 130 can also include other parts, for example, in some embodiments, the back cover 130 can also include an edge assembly (not shown in the figure) surrounding the shell assembly 200.

[0056] In the embodiments of the present application, the thickness of the shell assembly 200 is not limited. For example, the thickness of the shell assembly 200 can be less than or equal to 0.65 mm. For example, the thickness of the shell assembly 200 can be 0.65 mm, 0.6 mm, 0.55 mm, 0.5 mm, etc.

[0057] FIG. 3 is a cross-sectional view of a shell assembly according to an embodiment of the present application.

[0058] Referring to FIG. 3, the shell assembly 200 includes a base layer 10 and a cortex layer 20 stacked. The cortex layer 20 includes a fiber layer 22 and a polyurethane resin layer 21 stacked. The polyurethane resin layer 21 is formed of a polyurethane resin material, and the polyurethane resin layer 21 is used to give the shell assembly 200 a cortex appearance and a texture, so that the shell assembly 200 is applied to the back cover 130, and the back cover 130 has a cortex texture. The fiber layer 22 is located between the base layer 10 and the polyurethane resin layer 21, and the fiber layer 22 is made of a fiber yarn 221 having a tensile modulus greater than 60 Gpa, so that the fiber layer 22 can provide a certain support strength while supporting the polyurethane resin layer 21, thereby playing a reinforcing role, and thus the cortex layer 20 can also provide a certain strength and puncture resistance.

[0059] It can be understood that the cortex layer 20 is made of a composite material capable of providing support strength and puncture resistance, and the composite material is formed by stacking the fiber layer 22 and the polyurethane resin layer 21.

[0060] When the shell assembly 200 is designed to be thinned, the thickness of the base layer 10 is reduced, and at this time, the support strength and puncture resistance provided by the base layer 10 are also reduced. However, the fiber layer 22 can provide a certain support strength, so that the cortex layer 20 can provide a certain support strength to make up for the part of the strength reduction of the shell assembly 200 due to the reduction of the thickness of the base layer 10, so that the thinned shell assembly 200 can provide sufficient strength and puncture resistance, thereby meeting the use requirements. In addition, while the fiber layer 22 provides a certain support strength, the thickness of the fiber layer 22 can still be thinned, so that the cortex layer 20 can provide a certain strength and puncture resistance while being thinned. Therefore, the shell assembly 200 is applied to the back cover 130, and the back cover 130 can provide sufficient strength and puncture resistance while achieving thinning design, and can meet the use requirements.

[0061] In order to make the back cover 130 have a richer appearance, in some embodiments, a pattern is generally formed on the side surface of the polyurethane resin layer 21 away from the fiber layer 22. In some embodiments, it can be achieved by mechanical pressing through a release paper 300 with a textured effect. Of course, it can also be achieved by other means, such as through a process of rolling or printing, etc.

[0062] In some possible implementations, the tensile breaking strength of the cortex layer 20 can be greater than 100 N / cm, so that the cortex layer 20 provides certain support strength and puncture resistance, so that the thinned shell assembly 200 has sufficient strength, and thus the shell assembly 200 can be designed to be thinned.

[0063] It can be understood that when the tensile breaking strength of the cortex layer 20 is greater than 100 N / cm, the cortex layer 20 not only provides certain support strength and puncture resistance, but also controls the thickness of the cortex layer 20 within a reasonable range to achieve the thinned design of the shell assembly 200.

[0064] The specific value of the tensile breaking strength of the cortex layer 20 is not limited herein. Exemplarily, the tensile breaking strength of the cortex layer 20 can be 101 N / cm, 105 N / cm, 110 N / cm, 115 N / cm, 115.95 N / cm or 120 N / cm, etc.

[0065] In the embodiments of the present application, the specific thickness of the cortex layer 20 is not limited herein. Exemplarily, the thickness of the cortex layer 20 can be 0.2 mm.

[0066] In the embodiments of the present application, the specific thickness of the polyurethane resin layer 21 is not limited herein. Exemplarily, the thickness of the polyurethane resin layer 21 can be 0.1 mm.

[0067] In the embodiments of the present application, the specific thickness of the fiber layer 22 is not limited herein. Exemplarily, the thickness of the fiber layer 22 can be 0.1 mm.

[0068] In the embodiments of the present application, the fiber yarn 221 refers to a yarn made of fibers, and the tensile modulus of the yarn is greater than 60 Gpa.

[0069] The fiber yarn 221 can be made of one or more of glass fibers, high-modulus glass fibers, poly-p-phenylene benzobisoxazole fibers (PBO fibers), polyimide fibers (PI fibers) and aramid fibers. The fiber yarn 221 with a tensile modulus greater than 60 Gpa can be obtained by using these fibers, so that the fiber layer 22 can provide certain support strength to achieve the thinned design of the shell assembly 200.

[0070] The tensile modulus of the fiber yarn 221 is not limited herein. The tensile modulus of the fiber yarn 221 can be 61 Gpa, 69 Gpa, 70 Gpa, 74.6 Gpa, 90 Gpa, etc.

[0071] In the embodiments of the present application, the fiber layer 22 is made of a plurality of fiber yarns 221. The fiber layer 22 can be made of fiber yarns 221 of the same material, or the fiber layer 22 can also be made of fiber yarns 221 of different materials. The fiber layer 22 made of one or more fiber yarns 221 can provide a certain support strength, so that the cortex layer 20 can provide support strength and puncture resistance, thereby ensuring that the thinned shell assembly 200 provides sufficient strength and puncture resistance.

[0072] The type of the fiber layer 22 made of a plurality of fiber yarns 221 is not limited herein. Several types of fiber layer 22 are described below.

[0073] In some possible implementations, the fiber layer 22 can be a woven cloth (or called woven fabric), which is a mesh structure composed of warp and weft (for example, as shown in FIG. 3), and the warp and weft are woven into each other. That is, a part of the plurality of fiber yarns 221 serves as the warp, and another part serves as the weft. Alternatively, it can also be understood that the plurality of fiber yarns 221 are arranged in cross. The woven cloth can be formed by knitting or weaving processes, etc.

[0074] It should be noted that the structure of the woven cloth shown in FIG. 3 is a schematic diagram, and the specific structure of the woven cloth can also be other structures, which will not be described herein.

[0075] In some embodiments, the count of the woven cloth can be greater than or equal to 100D and less than or equal to 150D. By limiting the count of the woven cloth to 100D-150D, not only can the fiber layer 22 provide a certain support strength, but also the thickness of the fiber layer 22 can be controlled within a reasonable range to achieve the thinning design of the shell assembly 200.

[0076] The specific count of the woven cloth is not limited herein. Exemplarily, the count of the woven cloth can be 100D, 105D, 110D, 120D, 130D, 140D or 150D, etc.

[0077] In another possible implementation, the fiber layer 22 can also be a unidirectional cloth (or called unidirectional fabric). The unidirectional cloth (uni-directional cloth), referred to as UD cloth, is composed of a series of parallel arranged core wires, and the core wires are parallel to each other in the plane. One of them is a base wire, and the rest of the core wires are perpendicular to it.

[0078] In some embodiments, the areal weight of the unidirectional fabric can be greater than or equal to 100D and less than or equal to 250D. By limiting the areal weight of the unidirectional fabric to be between 100D and 250D, not only can the fiber layer 22 provide a certain support strength, but also the thickness of the fiber layer 22 can be controlled within a reasonable range to achieve a thin design of the shell assembly 200.

[0079] The specific areal weight of the unidirectional fabric is not limited herein. Exemplarily, the areal weight of the unidirectional fabric can be 100D, 105D, 110D, 120D, 130D, 140D, 150D, 155D, 160D, 170D, 180D, 190D, 200D, 210D, 230D, or 250D, etc.

[0080] In order to adhere the cortex layer 20 to the base layer 10, referring to FIG. 3, the shell assembly 200 can further include a hot melt adhesive layer 30 located between the base layer 10 and the fiber layer 22, and the hot melt adhesive layer 30 is connected with the fiber layer 22 and the base layer 10 respectively, so that the base layer 10 is adhered to the cortex layer 20 through the hot melt adhesive layer 30. Thus, the cortex layer 20 is bonded to the base layer 10 through the hot melt adhesive layer 30, and the process is simple.

[0081] The specific type of the hot melt adhesive layer 30 is not limited herein. The hot melt adhesive layer 30 can be a polyurethane hot melt adhesive layer or an epoxy resin hot melt adhesive layer, etc., which can firmly connect the base layer 10 and the cortex layer 20.

[0082] The thickness of the hot melt adhesive layer 30 is not limited herein. Exemplarily, the hot melt adhesive layer 30 can be 80um. Of course, the thickness of the hot melt adhesive layer 30 can also be other values.

[0083] In order to make the base layer 10 and the fiber layer 22 more firmly connected, one or more of the viscosity, melting point, molecular weight, etc. of the hot melt adhesive layer 30 can be controlled to make the performance of the hot melt adhesive layer 30 better.

[0084] In some possible implementations, the viscosity of the hot melt adhesive layer 30 can be greater than or equal to 900cps and less than or equal to 1100cps. Since the specific surface area of the fiber layer 22 is small, by controlling the viscosity of the hot melt adhesive layer 30 to be between 900cps and 1100cps, the hot melt adhesive has high flowability, so that more hot melt adhesive can penetrate into the fiber layer 22 when the hot melt adhesive layer 30 is dissolved, and the hot melt adhesive layer 30 and the fiber layer 22 are more firmly connected.

[0085] The viscosity of the hot melt adhesive layer 30 is not limited herein. The viscosity of the hot melt adhesive layer 30 can be 900 cps, 950 cps, 980 cps, 1000 cps, 1050 cps, 1100 cps, etc.

[0086] In some possible implementation manners, the melting point of the hot melt adhesive layer 30 can be greater than or equal to 80°C and less than or equal to 90°C. By controlling the melting point of the hot melt adhesive layer 30 to be 80°C to 90°C, the difficulty of dissolving the hot melt adhesive layer 30 can be reduced, and the hot melt adhesive layer 30 can be changed from a solid state to a liquid state more quickly, thereby reducing the difficulty of connecting the hot melt adhesive layer 30 and the fiber layer 22. In addition, the temperature of the hot melt adhesive layer 30 can be prevented from being too high to cause the fiber layer 22 to be deformed or damaged by heat.

[0087] The melting point of the hot melt adhesive layer 30 is not limited herein. The melting point of the hot melt adhesive layer 30 can be 80°C, 81°C, 81.5°C, 83°C, 86°C, 89.65°C, etc.

[0088] In some possible implementation manners, the molecular weight of the hot melt adhesive layer 30 can be greater than or equal to 5W and less than or equal to 5.5W. By controlling the molecular weight of the hot melt adhesive layer 30 to be 5W to 5.5W, the viscosity and flowability of the hot melt adhesive layer 30 can be improved, the hot melt adhesive layer 30 can flow more easily and solidify more quickly, and in addition, the adhesion strength of the hot melt adhesive layer 30 and the fiber layer 22 can be improved.

[0089] The molecular weight of the hot melt adhesive layer 30 is not limited herein. The molecular weight of the hot melt adhesive layer 30 can be 5W, 5.1W, 5.13W, 5.2W, 5.3W, 5.35W, 5.45W, 5.49W, etc.

[0090] In the embodiments of the present application, the specific material of the substrate layer 10 is not limited herein. The material of the substrate layer 10 can include one or more of glass fiber epoxy composite material, aramid fiber composite material, poly-p-phenylene benzobisoxazole fiber composite material, polyimide fiber composite material, polycarbonate (PC) composite material, or polymethyl methacrylate (PMMA) composite material, etc. The substrate layer 10 formed by the above-mentioned materials has the characteristics of high strength and high modulus, and the above-mentioned materials are used in the shell assembly 200, which has high strength and light and thin material.

[0091] In the embodiments of the present application, the specific thickness of the substrate layer 10 is not limited herein. For example, the thickness of the substrate layer 10 can be 0.4 mm. Of course, the thickness of the substrate layer 10 can also be other values.

[0092] In summary, since the fiber layer 22 can be made of the fiber yarn 221 made of one or more of glass fiber, high modulus glass fiber, poly-p-phenylene benzobisoxazole fiber, polyimide fiber and aramid fiber, and the base layer 10 can be made of one or more of glass fiber epoxy composite material, aramid fiber composite material, poly-p-phenylene benzobisoxazole fiber composite material, polyimide fiber composite material, polycarbonate composite material or polymethyl methacrylate composite material, therefore, the fiber layer 22 made of different fiber materials can be freely combined with the base layer 10 made of different materials. In addition, the fiber layer 22 can be woven cloth or unidirectional cloth, and can also be freely combined with the base layer 10 made of different materials (for example, examples 1 to 4 below). Similarly, different types of hot melt adhesive layer 30 can also be freely combined with the fiber layer 22 made of different materials and the base layer 10 made of different materials.

[0093] FIG. 4 is a flowchart of a method for preparing a shell assembly according to an embodiment of the present application.

[0094] Referring to FIG. 4, the present application further provides a method for preparing a shell assembly 200, which comprises the following steps:

[0095] S10, respectively forming a base layer 10 and a cortex layer 20, the cortex layer 20 comprising a fiber layer 22 and a polyurethane resin layer 21 stacked.

[0096] The material of the base layer 10 can include one or more of the following materials: glass fiber epoxy composite material, aramid fiber composite material, poly-p-phenylene benzobisoxazole fiber composite material, polyimide fiber composite material, polycarbonate composite material or polymethyl methacrylate composite material. The base layer 10 of the corresponding thickness is made of these materials.

[0097] The fiber layer 22 is made of a plurality of fiber yarns 221, and the tensile modulus of each fiber yarn 221 is greater than 60 GPa. The fiber layer 22 can be woven cloth or unidirectional cloth. The fiber yarn 221 can be made of one or more of glass fiber, high modulus glass fiber, poly-p-phenylene benzobisoxazole fiber, polyimide fiber and aramid fiber.

[0098] FIG. 5 is a flowchart of a method for preparing a cortex layer according to an embodiment of the present application, and FIG. 6 is a schematic diagram of a preparation process of a polyurethane resin stack according to an embodiment of the present application.

[0099] In some embodiments, referring to FIG. 5, the cortex layer 20 can be formed by the following steps:

[0100] S101, provide a polyurethane resin stack and a fiber layer 22, the polyurethane resin stack comprising a polyurethane resin layer 21 and a release paper 300 arranged in layers.

[0101] Specifically, referring to FIG. 6, a first polyurethane resin coating layer 211 of a first thickness is applied on one side of the release paper 300 and is subjected to drying treatment. Then, a second polyurethane resin coating layer 212 of a second thickness is applied on the surface of the side of the first polyurethane resin coating layer 211 away from the release paper 300 and is subjected to drying treatment. Subsequently, a third polyurethane resin coating layer 213 of a third thickness is applied on the surface of the side of the second polyurethane resin coating layer 212 away from the first polyurethane resin coating layer 211 and is subjected to drying treatment, thereby forming the polyurethane resin stack.

[0102] The first thickness, the second thickness and the third thickness can be different, or at least two of the first thickness, the second thickness and the third thickness can be the same.

[0103] S102, adhere the polyurethane resin layer 21 to one side of the fiber layer 22 to form a cortex layer 20.

[0104] Specifically, the fiber layer 22 is adhered to the polyurethane resin layer 21 in the polyurethane resin stack, and the release paper 300 is removed to form the cortex layer 20.

[0105] S103, after the polyurethane resin layer 21 is adhered to the fiber layer 22 to form the cortex layer 20, a pattern can also be formed on the side of the polyurethane resin layer 21 away from the fiber layer 22.

[0106] Specifically, the surface of the side of the polyurethane resin layer 21 away from the fiber layer 22 can be treated by processes such as rolling or printing, so that the pattern is formed on the side of the polyurethane resin layer 21 away from the fiber layer 22, and the surface of the polyurethane resin layer 21 can form a structure similar to the surface of leather.

[0107] It should be noted that in addition to forming a pattern by processes such as rolling or printing, in some embodiments, a textured structure can be provided on the side of the release paper 300 in contact with the first polyurethane resin coating layer 211, which is used to form a pattern on the surface of the polyurethane resin layer 21.

[0108] S20, adhere the base layer 10 to the side of the fiber layer 22 away from the polyurethane resin layer 21.

[0109] The fiber layer 22 can be adhered to the base layer 10 by a hot melt adhesive layer 30. Specifically, the hot melt adhesive layer 30 can be placed between the fiber layer 22 and the base layer 10, and then the hot melt adhesive layer 30 is firmly connected to the fiber layer 22 and the base layer 10 by hot pressing.

[0110] The shell assembly provided by the embodiment of the present application will be described below in combination with specific embodiments.

[0111] Embodiment one:

[0112] The shell assembly 200 provided by the embodiment can include a base layer 10, a hot melt adhesive layer 30, and a cortex layer 20 arranged in layers. The hot melt adhesive layer 30 is a polyurethane hot melt adhesive layer 30. The material of the base layer 10 is glass fiber composite material, and the thickness of the base layer 10 can be 0.4 mm. The cortex layer 20 includes a polyurethane resin layer 21 and a fiber layer 22. The thickness of the polyurethane resin layer 21 can be 0.1 mm, and the fiber layer 22 can be made of fiber yarn 221 made of E-grade glass fiber, and the thickness of the fiber layer 22 can be 0.1 mm.

[0113] When the shell assembly 200 is applied to the rear cover 130, the thickness of the rear cover 130 can be 0.65 mm. According to the GB / T10004-2008 puncture test standard, the puncture test is performed, the puncture force of the rear cover 130 is 130 N, and the puncture strength of the rear cover 130 is 200 N / mm. It can be known that after the rear cover 130 is thinned, sufficient strength and puncture resistance can be improved, and the safety of the battery 140 can be ensured.

[0114] Embodiment two:

[0115] The shell assembly 200 provided by the embodiment can include a base layer 10, a hot melt adhesive layer 30, and a cortex layer 20 arranged in layers. The hot melt adhesive layer 30 is a polyurethane hot melt adhesive layer 30. The material of the base layer 10 is glass fiber composite material, and the thickness of the base layer 10 can be 0.3 mm. The cortex layer 20 includes a polyurethane resin layer 21 and a fiber layer 22. The thickness of the polyurethane resin layer 21 can be 0.1 mm, and the fiber layer 22 can be made of fiber yarn 221 made of S-grade glass fiber, and the thickness of the fiber layer 22 can be 0.1 mm.

[0116] When the shell assembly 200 is applied to the rear cover 130, the thickness of the rear cover 130 can be 0.65 mm. According to the GB / T10004-2008 puncture test standard, the puncture test is performed, the puncture force of the rear cover 130 is 130 N, and the puncture strength of the rear cover 130 is 200 N / mm. It can be known that after the rear cover 130 is thinned, sufficient strength and puncture resistance can be improved, and the safety of the battery 140 can be ensured.

[0117] Embodiment three:

[0118] The shell assembly 200 provided by the embodiment can include the base layer 10, the hot melt adhesive layer 30 and the cortex layer 20 arranged in layers. The hot melt adhesive layer 30 is a polyurethane hot melt adhesive layer 30. The material of the base layer 10 is glass fiber composite material, and the thickness of the base layer 10 can be 0.25 mm. The cortex layer 20 includes a polyurethane resin layer 21 and a fiber layer 22. The thickness of the polyurethane resin layer 21 can be 0.1 mm, and the fiber layer 22 can be made of fiber yarn 221 made of poly-p-phenylene benzobisoxazole fiber (PBO fiber). The thickness of the fiber layer 22 can be 0.1 mm.

[0119] When the shell assembly 200 is applied to the rear cover 130, the thickness of the rear cover 130 can be 0.55 mm. According to the GB / T10004-2008 puncture test standard, the puncture test is performed, the puncture force of the rear cover 130 is 150 N, and the puncture strength of the rear cover 130 is 272.73 N / mm. Therefore, after the rear cover 130 is thinned, sufficient strength and puncture resistance can be improved, and the safety of the battery 140 can be ensured.

[0120] Embodiment four:

[0121] The shell assembly 200 provided by the embodiment can include the base layer 10, the hot melt adhesive layer 30 and the cortex layer 20 arranged in layers. The hot melt adhesive layer 30 is a polyurethane hot melt adhesive layer 30. The material of the base layer 10 is poly-p-phenylene benzobisoxazole composite material, and the thickness of the base layer 10 can be 0.25 mm. The cortex layer 20 includes a polyurethane resin layer 21 and a fiber layer 22. The thickness of the polyurethane resin layer 21 can be 0.1 mm, and the fiber layer 22 can be made of fiber yarn 221 made of polyimide fiber (PI fiber). The thickness of the fiber layer 22 can be 0.1 mm.

[0122] When the shell assembly 200 is applied to the rear cover 130, the thickness of the rear cover 130 can be 0.55 mm. According to the GB / T10004-2008 puncture test standard, the puncture test is performed, the puncture force of the rear cover 130 is 170 N, and the puncture strength of the rear cover 130 is 309 N / mm. Therefore, after the rear cover 130 is thinned, sufficient strength and puncture resistance can be improved, and the safety of the battery 140 can be ensured.

[0123] It should be noted that the combination of the fiber layer 22 made of different materials and the base layer 10 made of different materials is not limited to the above four embodiments, but can also be other combinations, which will not be described here.

[0124] In the related art, the back cover 600 includes a cortex layer 620 and a base layer 610, the cortex layer 620 includes a polyurethane resin layer 621 and a polyester woven fabric layer 622. The material of the polyurethane resin layer 621 is polyurethane (PU) material. The polyester woven fabric layer 622 is connected with the base layer 610, and the material of the base layer 610 is glass fiber composite material. The thickness of the back cover 600 is 0.7 mm. According to the puncture test standard of GB / T10004-2008, the puncture test is performed, the puncture force of the back cover 600 is 100 N, and the puncture strength of the back cover 600 is 142 N / mm.

[0125] In summary, the puncture strength of the back cover 130 provided in the first embodiment to the fourth embodiment is greater than that of the back cover 600 in the related art, and the thickness is less than that of the back cover 600 in the related art. In addition, by changing the material of the fiber yarn 221, the thickness of the back cover 130 can be further reduced, and the puncture strength can be further improved. Therefore, the shell assembly 200 provided in the embodiments of the present application is applied to the back cover 130, and the thinned back cover 130 can provide sufficient strength and puncture resistance.

[0126] In the description of the embodiments of the present application, it should be noted that, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting" should be understood in a broad sense, for example, it can be fixedly connected, indirectly connected through an intermediate medium, or the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0127] In the embodiments of the present application or the devices or elements implied by the present application must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the embodiments of the present application. In the description of the embodiments of the present application, the meaning of "a plurality of" is two or more, unless otherwise specified and limited.

[0128] The terms "first", "second", "third", "fourth" etc. (if any) in the description and claims of the present application and above drawings are used to distinguish similar objects, and do not have to be used to describe a specific order or sequence. It should be understood that the data thus used can be interchanged under appropriate circumstances, so that the embodiments of the present application described herein can be implemented, for example, in an order other than that illustrated or described herein. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion, for example, a process, method, system, product or device that includes a series of steps or units does not have to be limited to those steps or units clearly listed, but can include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0129] The term "a plurality of" herein refers to two or more. The term "and / or" herein is merely a description of the association relationship between the associated objects, which means that there can be three relationships, for example, A and / or B can represent the three cases of A existing alone, A and B existing together, and B existing alone. In addition, the character " / " herein generally represents that the associated objects before and after it are in an "or" relationship; in formulas, the character " / " represents that the associated objects before and after it are in a "division" relationship.

[0130] It can be understood that the various numerical numbers involved in the embodiments of the present application are only distinguished for convenience of description, and do not limit the scope of the embodiments of the present application.

[0131] It can be understood that the size of the serial number of each process in the embodiments of the present application does not mean the order of execution, and the execution order of each process should be determined according to its function and inherent logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

Claims

1. A housing assembly, characterized by, The shell assembly comprises a base layer and a cortex layer arranged in a stack; The cortex layer comprises a fiber layer and a polyurethane resin layer arranged in a stack, the fiber layer is located between the base layer and the polyurethane resin layer, and the fiber layer is made of fiber yarns with a tensile modulus greater than 60 Gpa; The shell assembly further comprises a hot melt adhesive layer located between the base layer and the fiber layer, and the base layer and the cortex layer are attached through the hot melt adhesive layer, wherein the melting point of the hot melt adhesive layer is greater than or equal to 80℃ and less than or equal to 90℃.

2. The housing assembly of claim 1, wherein, The tensile breaking strength of the cortex layer is greater than 100 N / cm.

3. The housing assembly of claim 1 or 2, wherein, The fiber layer is made of fiber yarns of the same material, or the fiber layer is made of fiber yarns of different materials.

4. The housing assembly of any one of claims 1 to 3, wherein, The fiber layer is woven cloth, and the denier of the woven cloth is greater than or equal to 100D and less than or equal to 150D.

5. The housing assembly of any one of claims 1 to 3, wherein, The fiber layer is unidirectional cloth, and the denier of the unidirectional cloth is greater than or equal to 100D and less than or equal to 250D.

6. The housing assembly of any one of claims 1 to 5, wherein, The fiber yarns comprise at least one of the following fibers: glass fiber, high modulus glass fiber, poly-p-phenylene benzobisoxazole fiber, polyimide fiber, aramid fiber.

7. The housing assembly of any one of claims 1-6, wherein, The viscosity of the hot melt adhesive layer is greater than or equal to 900 cps and less than or equal to 1100 cps.

8. The housing assembly of any one of claims 1-7, wherein, The molecular weight of the hot melt adhesive layer is greater than or equal to 5W and less than or equal to 5.5W.

9. The housing assembly of any of claims 1-8, wherein, The hot melt adhesive layer is a polyurethane hot melt adhesive layer or an epoxy resin hot melt adhesive layer.

10. The housing assembly of any one of claims 1 to 9, wherein, The material of the base layer comprises at least one of the following materials: glass fiber epoxy composite material, aramid fiber composite material, poly-p-phenylene benzobisoxazole fiber composite material, polyimide fiber composite material, polycarbonate composite material or polymethyl methacrylate composite material.

11. An electronic device, comprising: The shell assembly comprises a base layer and a cortex layer arranged in a stack; The cortex layer comprises a fiber layer and a polyurethane resin layer arranged in a stack, the fiber layer is located between the base layer and the polyurethane resin layer, and the fiber layer is made of fiber yarns with a tensile modulus greater than 60 Gpa; The shell assembly further comprises a hot melt adhesive layer located between the base layer and the fiber layer, and the base layer and the cortex layer are attached through the hot melt adhesive layer, wherein the melting point of the hot melt adhesive layer is greater than or equal to 80℃ and less than or equal to 90℃. The tensile breaking strength of the cortex layer is greater than 100 N / cm. The fiber layer is made of fiber yarns of the same material, or the fiber layer is made of fiber yarns of different materials. The fiber layer is woven cloth, and the denier of the woven cloth is greater than or equal to 100D and less than or equal to 150D. The fiber layer is unidirectional cloth, and the denier of the unidirectional cloth is greater than or equal to 100D and less than or equal to 250D. The fiber yarns comprise at least one of the following fibers: glass fiber, high modulus glass fiber, poly-p-phenylene benzobisoxazole fiber, polyimide fiber, aramid fiber. The viscosity of the hot melt adhesive layer is greater than or equal to 900 cps and less than or equal to 1100 cps. The molecular weight of the hot melt adhesive layer is greater than or equal to 5W and less than or equal to 5.5W. The hot melt adhesive layer is a polyurethane hot melt adhesive layer or an epoxy resin hot melt adhesive layer. The material of the base layer comprises at least one of the following materials: glass fiber epoxy composite material, aramid fiber composite material, poly-p-phenylene benzobisoxazole fiber composite material, polyimide fiber composite material, polycarbonate composite material or polymethyl methacrylate composite material. The shell assembly comprises a base layer and a cortex layer arranged in a stack; The cortex layer comprises a fiber layer and a polyurethane resin layer arranged in a stack, the fiber layer is located between the base layer and the polyurethane resin layer, and the fiber layer is made of fiber yarns with a tensile modulus greater than 60 Gpa;

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