Plating device

Abstract

Provided is a technology capable of inhibiting scattering of a plating solution to the outside of a plating tank when the plating solution is stirred.　A plating device 1000 comprises: a plating tank 10; a substrate holder 30; a paddle 70; and a scattering inhibition member 60a. The scattering inhibition member has a first member 61 and a second member 62. The first member is disposed in a region above the paddle and below an upper end 10ba of an outer circumferential wall 10b of the plating tank and between the substrate holder and the outer circumferential wall 10b of the plating tank, and extends vertically in a curved surface-like manner in the circumferential direction of the outer circumferential wall. The second member is disposed above the upper end of the outer circumferential wall and above the first member with a space SP1 interposed therebetween, and has a lower surface 62a that extends horizontally.

Description

Plating Equipment

[0001] The present invention relates to a plating apparatus.

[0002] Conventionally, plating devices capable of plating a substrate have been known (see, for example, Patent Document 1). Such plating devices generally include a plating tank that stores a plating solution and in which an anode is disposed, a substrate holder that holds a substrate as a cathode facing the anode, and a paddle that is disposed in a region inside the plating tank above the anode and below the substrate holder and is configured to agitate the plating solution.

[0003] Patent No. 7079388

[0004] In the conventional plating apparatus described above, when the plating solution is stirred, the plating solution may splash up and splash outside the plating tank. In this respect, the conventional plating apparatus has room for improvement.

[0005] The present invention has been made in consideration of the above, and one of its objects is to provide a technology that can prevent plating solution from splashing outside the plating tank when the plating solution is stirred.

[0006] (Aspect 1) In order to achieve the above-mentioned object, a plating apparatus according to one aspect of the present invention comprises a plating tank configured to store plating solution and in which an anode is disposed, a substrate holder for holding a substrate as a cathode facing the anode, a paddle disposed in a region inside the plating tank above the anode and below the substrate holder and configured to stir the plating solution, and a scattering suppression member configured to suppress the plating solution from splashing up and scattering outside the plating tank when the plating solution is stirred by the paddle, wherein the scattering suppression member has a first member and a second member, wherein the first member is disposed in a region above the paddle and below an upper end of an outer peripheral wall of the plating tank, and is disposed in a region between the outer peripheral wall and the substrate holder, and extends in a vertical direction and in a curved shape circumferentially of the outer peripheral wall, and the second member is disposed above the upper end of the outer peripheral wall, has a space between it and the first member, and has a lower surface extending horizontally.

[0007] According to this aspect, when the plating solution is agitated by the paddle, it is possible to prevent the plating solution from splashing outside the plating tank.

[0008] (Aspect 2) In the above aspect 1, the anti-scattering member may further include a third member that is arranged in a region above the paddle and below the upper end of the outer peripheral wall, and that is arranged in a region closer to the center of the plating tank than the outer peripheral wall and closer to the outer periphery than the first member, and the third member may have a lower surface that extends horizontally.

[0009] According to this aspect, it is possible to effectively prevent the plating solution from scattering outside the plating tank.

[0010] (Aspect 3) In the above aspect 2, the anti-scattering member may further include a fourth member that is positioned above the paddle, with a portion positioned in a region above the upper end of the outer peripheral wall and another portion positioned in a region below the upper end of the outer peripheral wall, and that is positioned in a region closer to the center of the plating tank than the outer peripheral wall and closer to the outer periphery than the first member, and the fourth member may have an outer peripheral surface that extends in the vertical direction.

[0011] According to this aspect, it is possible to effectively prevent the plating solution from scattering outside the plating tank.

[0012] (Aspect 4) In any one of Aspects 1 to 3 above, the first member may have at least one opening configured to pass through the first member.

[0013] (Aspect 5) In the aspect 2, the third member may have at least one opening configured to pass through the third member.

[0014] (Aspect 6) In the aspect 3, the fourth member may have at least one opening configured to pass through the fourth member.

[0015] (Aspect 7) In the aspect 3, the fourth member may extend in a curved shape in the circumferential direction of the outer circumferential wall.

[0016] (Aspect 8) In the aspect 3, the fourth member may extend in a tangential direction of the first member that extends in the curved shape.

[0017] 7A and 7B are schematic perspective views of a plating apparatus according to an embodiment; a plan view of the overall configuration of a plating apparatus according to an embodiment; a schematic view of a plating module according to an embodiment; a schematic view of a substrate immersed in a plating solution according to an embodiment; a schematic view for explaining a paddle and a drive device according to an embodiment; a flow diagram for explaining a series of operations from supplying a plating solution to starting a plating process according to an embodiment; FIGS. 7A and 7B are schematic perspective views of a scattering suppression member according to an embodiment; a schematic enlarged cross-sectional view showing a state in which a scattering suppression member according to an embodiment is arranged in a plating tank; a schematic enlarged cross-sectional view showing the flow of plating solution around the scattering suppression member according to an embodiment; a schematic view for explaining a plating apparatus according to a first modified embodiment; a schematic plan view of a plating tank according to a second modified embodiment viewed from above; a schematic view for explaining a paddle connecting member; a schematic view for explaining a scattering suppression member according to a third modified embodiment; a schematic view for explaining a scattering suppression member according to a fourth modified embodiment; a schematic perspective view of an overflow tank according to an embodiment; a schematic perspective view for explaining a scattering suppression member according to a fifth modified embodiment. 18A and 18B are schematic diagrams illustrating a scattering suppression member 60a according to a sixth modification of the embodiment. Fig. 18A and Fig. 18B are schematic diagrams illustrating a scattering suppression member according to a seventh modification of the embodiment.

[0018] Hereinafter, embodiments of the present invention will be described with reference to the drawings. Note that the drawings are diagrammatically illustrated to facilitate understanding of the characteristics of the components, and the dimensional ratios of the components may not be the same as those in reality. In addition, some of the drawings show an X-Y-Z Cartesian coordinate system for reference. In these Cartesian coordinate systems, the Z direction corresponds to the upward direction, and the -Z direction corresponds to the downward direction (the direction in which gravity acts).

[0019] Fig. 1 is a perspective view showing the overall configuration of a plating apparatus 1000 according to this embodiment. Fig. 2 is a plan view (top view) showing the overall configuration of the plating apparatus 1000 according to this embodiment. As shown in Figs. 1 and 2, the plating apparatus 1000 includes a load port 100, a transfer robot 110, an aligner 120, a pre-wet module 200, a pre-soak module 300, a plating module 400, a cleaning module 500, a spin rinse dryer 600, a transfer device 700, and a control module 800.

[0020] The load port 100 is a module for loading substrates stored in a cassette such as a FOUP (not shown) into the plating apparatus 1000 and unloading substrates from the plating apparatus 1000 to the cassette. In this embodiment, four load ports 100 are arranged horizontally, but the number and arrangement of the load ports 100 are optional. The transfer robot 110 is a robot for transporting substrates, and is configured to transfer substrates between the load port 100, the aligner 120, the pre-wet module 200, and the spin rinse dryer 600. When transferring substrates between the transfer robot 110 and the transfer device 700, the transfer robot 110 and the transfer device 700 can transfer the substrates via a temporary stage (not shown).

[0021] The aligner 120 is a module for aligning the positions of the substrate's orientation flat, notch, and the like in a predetermined direction. In this embodiment, two aligners 120 are arranged horizontally, but the number and arrangement of the aligners 120 are optional. The prewet module 200 wets the surface of the substrate to be plated with a treatment liquid such as pure water or degassed water before plating, thereby replacing air within a pattern formed on the substrate surface with the treatment liquid. The prewet module 200 is configured to perform a prewet process that replaces the treatment liquid within the pattern with a plating liquid during plating, thereby making it easier to supply the plating liquid within the pattern. In this embodiment, two prewet modules 200 are arranged vertically, but the number and arrangement of the prewet modules 200 are optional.

[0022] The presoak module 300 is configured to perform a presoak process, which involves etching away, for example, an oxide film with high electrical resistance present on the surface of a seed layer formed on the surface of a substrate to be plated before plating, using a treatment solution such as sulfuric acid or hydrochloric acid to clean or activate the surface of the substrate to be plated. In this embodiment, two presoak modules 300 are arranged vertically, but the number and arrangement of the presoak modules 300 are optional. The plating module 400 performs plating on the substrate. In this embodiment, two sets of 12 plating modules 400 are arranged vertically, three vertically and four horizontally, for a total of 24 plating modules 400, but the number and arrangement of the plating modules 400 are optional.

[0023] The cleaning module 500 is configured to perform a cleaning process on the substrate to remove plating solution and the like remaining on the substrate after plating. In this embodiment, two cleaning modules 500 are arranged vertically, but the number and arrangement of the cleaning modules 500 are optional. The spin rinse dryer 600 is a module for drying the substrate after cleaning by rotating it at high speed. In this embodiment, two spin rinse dryers 600 are arranged vertically, but the number and arrangement of the spin rinse dryers 600 are optional. The transport device 700 is a device for transporting substrates between multiple modules within the plating apparatus 1000. The control module 800 is configured to control the multiple modules of the plating apparatus 1000 and can be configured, for example, as a general computer or a dedicated computer equipped with an input / output interface with an operator.

[0024] An example of a series of plating processes performed by the plating apparatus 1000 will be described. First, a substrate stored in a cassette is loaded into the load port 100. Next, the transfer robot 110 removes the substrate from the cassette in the load port 100 and transfers the substrate to the aligner 120. The aligner 120 aligns the positions of the orientation flat, notch, and the like of the substrate to a predetermined direction. The transfer robot 110 delivers the substrate, whose direction has been aligned by the aligner 120, to the pre-wet module 200.

[0025] The pre-wet module 200 performs a pre-wet process on the substrate. The transport device 700 transports the substrate that has been subjected to the pre-wet process to the pre-soak module 300. The pre-soak module 300 performs a pre-soak process on the substrate. The transport device 700 transports the substrate that has been subjected to the pre-soak process to the plating module 400. The plating module 400 performs a plating process on the substrate.

[0026] The transfer device 700 transfers the substrate after plating to the cleaning module 500. The cleaning module 500 performs a cleaning process on the substrate. The transfer device 700 transfers the substrate after cleaning to the spin rinse dryer 600. The spin rinse dryer 600 dries the substrate. The transfer robot 110 receives the substrate from the spin rinse dryer 600 and transfers the dried substrate to a cassette on the load port 100. Finally, the cassette containing the substrate is removed from the load port 100.

[0027] It should be noted that the configuration of the plating apparatus 1000 described in FIGS. 1 and 2 is merely an example, and the configuration of the plating apparatus 1000 is not limited to the configurations shown in FIGS.

[0028] Next, a description will be given of the plating module 400. Since the multiple plating modules 400 included in the plating apparatus 1000 according to this embodiment have the same configuration, only one plating module 400 will be described.

[0029] Fig. 3 is a schematic diagram showing the configuration of the plating module 400 in the plating apparatus 1000 according to this embodiment. Specifically, Fig. 3 shows the plating module 400 in a state before the substrate Wf is immersed in the plating solution Ps. Fig. 4 is a schematic diagram showing the state after the substrate Wf is immersed in the plating solution Ps.

[0030] The plating apparatus 1000 illustrated in Figures 3 and 4 is, for example, a plating apparatus of the type in which the substrate Wf is immersed in the plating solution Ps with its surface oriented horizontally (a so-called cup-type plating apparatus).

[0031] 3 and 4 includes a plating module 400, a plating tank 10, an overflow tank 20, a substrate holder 30, and a paddle 70. The plating module 400 may also include a rotation mechanism 40, a tilt mechanism 45, and a lifting mechanism 50, as shown in FIG.

[0032] The plating tank 10 according to this embodiment is a bottomed container with an opening at the top. Specifically, the plating tank 10 has a bottom wall 10a and an outer peripheral wall 10b extending upward from the outer periphery of the bottom wall 10a, with the upper portion of the outer peripheral wall 10b being open. The shape of the outer peripheral wall 10b of the plating tank 10 is not particularly limited, but the outer peripheral wall 10b according to this embodiment has a cylindrical shape, for example. A plating solution Ps is stored inside the plating tank 10.

[0033] The plating solution Ps may be any solution containing ions of the metal elements that make up the plating film, and specific examples thereof are not particularly limited. In this embodiment, copper plating is used as an example of plating, and a copper sulfate solution is used as an example of plating solution Ps. The plating solution Ps may also contain certain additives.

[0034] An anode 11 is disposed inside the plating tank 10. The specific type of the anode 11 is not particularly limited, and may be an insoluble anode or a soluble anode. In the present embodiment, an insoluble anode is used as an example of the anode 11. The specific type of the insoluble anode is not particularly limited, and platinum, iridium oxide, or the like may be used.

[0035] As illustrated in Figures 3 and 4, an ion resistor 12 may be disposed above the anode 11 inside the plating tank 10. Specifically, as illustrated in the partially enlarged view of Figure 4, the ion resistor 12 is configured as a porous plate member having a plurality of holes 12a (pores). The holes 12a are provided so as to connect the lower surface and the upper surface of the ion resistor 12.

[0036] The ion resistor 12 is provided to homogenize the electric field formed between the anode 11 and the substrate Wf serving as the cathode. By disposing the ion resistor 12 in the plating tank 10 as in this embodiment, it is possible to easily homogenize the thickness of the plating film (plating layer) formed on the substrate Wf.

[0037] As illustrated in Figures 3 and 4, a membrane 16 may be disposed inside the plating tank 10 above the anode 11 and below the ionic resistor 12. In this case, the membrane 16 divides the interior of the plating tank 10 into an anode chamber 17a below the membrane 16 and a cathode chamber 17b above the membrane 16. The anode 11 is disposed in the anode chamber 17a, and the ionic resistor 12 and the substrate Wf are disposed in the cathode chamber 17b. The membrane 16 is configured to allow ionic species, including metal ions, contained in the plating solution Ps to pass through the membrane 16 while inhibiting non-ionic plating additives contained in the plating solution Ps from passing through the membrane 16. For example, an ion exchange membrane can be used as such a membrane 16.

[0038] The plating tank 10 is provided with a supply port for supplying the plating solution Ps to the plating tank 10. Specifically, the outer wall 10b of the plating tank 10 according to this embodiment is provided with a first supply port 13a for supplying the plating solution Ps to the anode chamber 17a and a second supply port 13b for supplying the plating solution Ps to the cathode chamber 17b.

[0039] The plating tank 10 is also provided with a first outlet 14a for discharging the plating solution Ps in the anode chamber 17a to the outside of the plating tank 10. The plating solution Ps discharged from the first outlet 14a is pressure-fed by a pump (not shown) and supplied again to the anode chamber 17a from the first supply port 13a.

[0040] The overflow tank 20 is a bottomed container disposed outside the plating tank 10. The overflow tank 20 is provided to temporarily store the plating solution Ps that has exceeded the upper end of the outer wall 10b of the plating tank 10 (i.e., the plating solution Ps that has overflowed from the plating tank 10). The plating solution Ps stored in the overflow tank 20 is discharged from the second outlet 14b, then pressure-fed by a pump (not shown), and supplied again to the cathode chamber 17b from the second supply port 13b.

[0041] The substrate holder 30 holds the substrate Wf as a cathode so that the surface Wfa to be plated of the substrate Wf faces the anode 11. In this embodiment, the surface Wfa to be plated of the substrate Wf is specifically provided on the surface (lower surface) facing downward of the substrate Wf.

[0042] The substrate holder 30 is connected to a rotation mechanism 40. The rotation mechanism 40 is a mechanism for rotating the substrate holder 30. "R1" illustrated in FIG. 3 is an example of the rotation direction of the substrate holder 30. A known rotation motor or the like can be used as the rotation mechanism 40. The tilt mechanism 45 is a mechanism for tilting the rotation mechanism 40 and the substrate holder 30. The lifting mechanism 50 is supported by a support shaft 51 extending in the vertical direction. The lifting mechanism 50 is a mechanism for raising and lowering the substrate holder 30, the rotation mechanism 40, and the tilting mechanism 45 in the vertical direction. A known lifting mechanism such as a linear actuator can be used as the lifting mechanism 50.

[0043] The control module 800 includes a microcomputer, which includes a processor 801, a storage device 802 as a non-transitory storage medium, etc. The control module 800 controls the operation of the plating module 400 by operating the processor 801 based on instructions from a program stored in the storage device 802.

[0044] 5 is a schematic diagram illustrating the paddle 70 and a driving device 90, which will be described later. Referring to FIGS. 4 and 5, the paddle 70 is disposed in a region above the anode 11 and below the substrate holder 30 inside the plating tank 10. Specifically, the paddle 70 according to this embodiment is disposed between the ion resistor 12, which is disposed above the anode 11, and the substrate holder 30.

[0045] 5, the paddle 70 is an "agitation member" configured to be driven by a drive device 90 to agitate the plating solution Ps. As an example, the drive device 90 according to this embodiment receives instructions from a control module 800 and alternately drives the paddle 70 in a "first direction (1st)" parallel to the anode 11 (or the substrate Wf) and in a "second direction (2nd)" opposite to the first direction. That is, the paddle 70 according to this embodiment reciprocates in the first direction and the second direction.

[0046] It should be noted that known technology can be applied to the mechanical mechanism itself of such drive device 90. Specifically, drive device 90 according to this embodiment includes an electric motor 91 and a power conversion mechanism 92 that is connected to paddle 70 and is configured to convert the rotational motion of electric motor 91 into linear reciprocating motion and transmit the motion to paddle 70.

[0047] The first direction and the second direction are not limited to the above-mentioned directions. The direction perpendicular to the reciprocating direction of the paddle 70 is referred to as the "third direction (3rd)." Figure 5 also illustrates, as central axes of the paddle 70, a first central axis XL1 extending in the third direction and a second central axis XL2 extending in the reciprocating direction of the paddle 70.

[0048] The paddle 70 only needs to be located inside the plating tank 10 at least when stirring the plating solution Ps, and does not need to be located inside the plating tank 10 all the time. For example, when the driving of the paddle 70 is stopped and the plating solution Ps is not stirred by the paddle 70, the paddle 70 may be configured to be located outside the plating tank 10.

[0049] The specific configuration of the paddle 70 is not particularly limited as long as it can agitate the plating solution Ps. As an example, the paddle 70 shown in FIG. 5 includes a honeycomb structure portion 71 having a honeycomb structure and a pair of outer frames (a first outer frame 72a and a second outer frame 72b) connected to the third direction ends of the honeycomb structure portion 71. As an example, the first outer frame 72a and the second outer frame 72b according to this embodiment are made of flat plate-like members. At least one of the first outer frame 72a and the second outer frame 72b is connected to a driving device 90.

[0050] The honeycomb structure section 71 has a plurality of polygonal holes 74 partitioned by beam members 73. The holes 74 according to this embodiment penetrate in the vertical direction so as to connect the upper and lower surfaces of the honeycomb structure section 71. The honeycomb structure section 71 also has a first peripheral wall 75 facing in a first direction and a second peripheral wall 76 facing in a second direction. The first peripheral wall 75 and the second peripheral wall 76 are formed by the beam members 73.

[0051] The specific polygonal shape of the hole 74 is not particularly limited, and various N-sided shapes (N is a natural number equal to or greater than 3) such as a triangle, a square, a pentagon, a hexagon, a heptagon, an octagon, etc. can be used. In this modification, a hexagon is used as an example of a polygon.

[0052] As an example, the paddle 70 illustrated in Fig. 5 has a portion in which the "paddle width D1 (the length in the reciprocating movement direction of the paddle 70)" of the honeycomb structure portion 71 changes along the third direction in plan view. Specifically, the paddle 70 has a shape in which the paddle width D1 at the center in the third direction is wider than the paddle width D1 at the end in the third direction. In other words, the paddle 70 has a shape in which the portion closer to the center than the end in the third direction protrudes in the first and second directions more than the end.

[0053] Moreover, the paddle 70 according to the present embodiment has, as an example, a shape that is line-symmetric (bilaterally symmetric) with respect to the second central axis line XL2.

[0054] The honeycomb structure portion 71 of the paddle 70 according to this embodiment includes a first outer peripheral wall 75 facing a first direction and a second outer peripheral wall 76 facing a second direction. The first outer peripheral wall 75 and the second outer peripheral wall 76 are formed by beam members 73.

[0055] The specific manufacturing method of the paddle 70 is not particularly limited, but as an example, the paddle 70 according to this embodiment can be manufactured using a known three-dimensional printing machine such as a 3D printer.

[0056] The configuration of the paddle 70 is not limited to the above-described configuration, and may be any other known configuration (e.g., various configurations such as those exemplified in Patent Document 1) as long as it is capable of stirring the plating solution Ps. As another example, the paddle 70 may include, instead of the honeycomb structure portion 71, a plurality of beam members extending linearly in the third direction.

[0057] 6 is a flow diagram illustrating a series of operations from supplying the plating solution to starting the plating process according to this embodiment. First, the plating solution Ps is supplied to the plating tank 10 (step S10). Specifically, the plating solution Ps is supplied to the plating tank 10 so that the anode 11 and the ion resistor 12 are immersed in the plating solution Ps. More specifically, in this embodiment, the plating solution Ps is supplied to the plating tank 10 through the first supply port 13a and the second supply port 13b.

[0058] Next, the substrate Wf is immersed in the plating solution Ps (step S20). Specifically, in this embodiment, the lifting mechanism 50 lowers the substrate holder 30, thereby immersing at least the plating surface Wfa of the substrate Wf in the plating solution Ps.

[0059] Next, the driving device 90 starts driving the paddle 70, thereby causing the paddle 70 to start stirring the plating solution Ps (step S30).

[0060] Next, a current is applied between the anode 11 and the substrate Wf by a current applying device (not shown), thereby starting the plating process on the substrate Wf (step S40). This starts the formation of a plating film on the plating surface Wfa of the substrate Wf. Specifically, in this embodiment, even during the plating process on the substrate Wf in step S40, the plating solution Ps is being agitated by the paddle 70 in step S30 (i.e., the plating solution Ps is being agitated while the plating film is being formed on the plating surface Wfa).

[0061] Preferably, the control module 800 starts the rotation of the substrate holder 30 when performing step S20, step S30, or step S40, so that the substrate holder 30 can be rotated at least during the plating process in step S40.

[0062] The timing at which the paddle 70 stirs the plating solution Ps is not limited to the above-mentioned timing. For example, the plating solution Ps may be stirred by the paddle 70 between steps S10 and S20 (i.e., after the plating solution Ps is supplied to the plating tank 10 and before the substrate Wf is immersed in the plating solution Ps).

[0063] 3 and 4, the plating module 400 of the plating apparatus 1000 according to this embodiment further includes a scattering suppression member 60a (i.e., a first scattering suppression member) and a scattering suppression member 60b (i.e., a second scattering suppression member).

[0064] Fig. 7(A) is a schematic perspective view of the scattering suppression member 60a. Fig. 7(B) is a schematic perspective view of the scattering suppression member 60b. Fig. 8 is a schematic enlarged cross-sectional view showing the scattering suppression member 60a disposed in the plating tank 10 (Fig. 8 corresponds to the enlarged cross-sectional view of part A1 in Fig. 4). Fig. 9 is a schematic enlarged cross-sectional view showing the flow of plating solution Ps around the scattering suppression member 60a.

[0065] 7 to 9, the anti-scattering members 60a, 60b are configured to prevent the plating solution Ps from splashing up and scattering outside the plating tank 10 when the plating solution Ps is stirred by the paddle 70. Specifically, the anti-scattering members 60a, 60b are disposed in the plating tank 10 and used at least when the plating solution Ps is stirred by the paddle 70 (i.e., at least when the paddle 70 is driven). The anti-scattering members 60a, 60b can be referred to as "anti-scattering cover members."

[0066] The specific manner in which the anti-scattering members 60a, 60b are connected to the plating apparatus 1000 is not particularly limited, but as an example, the anti-scattering members 60a, 60b in this embodiment are connected to the outer wall 21 of the overflow tank 20 (i.e., the outer tank).

[0067] Specifically, as illustrated in Fig. 15 , the outer peripheral wall 21 of the overflow tank 20 according to this embodiment has a rectangular shape in plan view, for example. The upper end of the outer peripheral wall 21 of the overflow tank 20 is located higher than the upper end of the outer peripheral wall 10b of the plating tank 10. With reference to Figs. 7(A), 7(B), and 15 , the scattering suppression member 60a is placed on the upper end of the outer peripheral wall 21 of the overflow tank 20 such that the predetermined position C1a of the scattering suppression member 60a corresponds to the predetermined position C1b of the outer peripheral wall 21 of the overflow tank 20, and the predetermined position C2a of the scattering suppression member 60a corresponds to the predetermined position C2b of the outer peripheral wall 21. Similarly, the scattering suppression member 60b is placed on the upper end of the outer peripheral wall 21 of the overflow tank 20 so that the predetermined location C3a of the scattering suppression member 60b corresponds to the predetermined location C3b of the outer peripheral wall 21 of the overflow tank 20, and the predetermined location C4a of the scattering suppression member 60b corresponds to the predetermined location C4b of the outer peripheral wall 21.

[0068] The anti-scattering members 60a, 60b connected to the outer peripheral wall 21 of the overflow tank 20 may be fixed to the outer peripheral wall 21 by detachable fastening members such as bolts or pins.

[0069] 7 to 9, the scattering suppression member 60a and the scattering suppression member 60b each include a first member 61 and a second member 62. The scattering suppression member 60a and the scattering suppression member 60b may each further include a third member 63 or a fourth member 64. The configuration of the scattering suppression member 60b is similar to the configuration of the scattering suppression member 60a, so from here on, the scattering suppression member 60a will be described in detail.

[0070] 8 and 9 , the first member 61 is disposed in a region above the paddle 70 and below the upper end 10ba of the outer peripheral wall 10b of the plating tank 10. Specifically, the first member 61 according to this embodiment is disposed in a region above the paddle 70 and below the liquid level Ls of the plating solution Ps. The first member 61 is also disposed in a region between the outer peripheral wall 10b of the plating tank 10 and the substrate holder 30. The first member 61 according to this embodiment is, for example, formed of a plate member (a plate-shaped member). The first member 61 has an inner peripheral surface 61a on the side facing the substrate holder 30 and an outer peripheral surface 61b on the side facing the outer peripheral wall 10b.

[0071] Furthermore, the first member 61 extends in the vertical direction and also in a curved shape in the circumferential direction of the outer peripheral wall 10b (or in the circumferential direction of the substrate holder 30). Specifically, the first member 61 according to this embodiment extends in a curved shape in the circumferential direction of the outer peripheral wall 10b so as to follow the shape of the inner circumferential surface of the outer peripheral wall 10b of the plating tank 10 (in this embodiment, the shape extends in a curved shape in the circumferential direction of the outer peripheral wall 10b).

[0072] According to this configuration, when the plating solution Ps is stirred by the paddle 70 (or when the substrate holder 30 is further rotated), for example, the momentum of the plating solution Ps flowing from the outer peripheral wall 10b of the plating tank 10 toward the center of the plating tank 10, or the momentum of the plating solution Ps flowing from the center of the plating tank 10 toward the outer peripheral wall 10b, can be reduced by the first member 61. This makes it possible to prevent the plating solution Ps from colliding forcefully with the substrate holder 30 or the outer peripheral wall 10b. As a result, it is possible to prevent the plating solution Ps from splashing outside the plating tank 10.

[0073] The second member 62 is disposed above the upper end 10ba of the outer peripheral wall 10b of the plating tank 10. A space SP3 may be provided between the second member 62 and the upper end 10ba of the outer peripheral wall 10b. This allows the plating solution Ps that overflows from the outer peripheral wall 10b of the plating tank 10 to pass through this space SP3 and flow into the overflow tank 20. Furthermore, the second member 62 according to this embodiment is disposed above the liquid level Ls of the plating solution Ps.

[0074] The second member 62 is disposed above the first member 61, with a space SP1 between them. That is, the space SP1 is provided between the first member 61 and the second member 62. As illustrated in Fig. 7A, the second member 62 according to this embodiment is connected to both ends of the first member 61 in the circumferential extension direction via connecting members 65. The second member 62 according to this embodiment is formed of a plate member, for example.

[0075] 8 and 9, the second member 62 has a lower surface 62a extending in the horizontal direction. Referring to Fig. 9, the lower surface 62a of the second member 62 is configured to allow the plating solution Ps that has splashed upward along the first member 61 to abut against the lower surface 62a. Specifically, the lower surface 62a of the second member according to this embodiment is located directly above the first member 61 and extends from the point directly above the first member 61 a predetermined distance toward the center of the plating tank 10 and also a predetermined distance toward the outer periphery of the plating tank 10.

[0076] The space SP1 provided between the first member 61 and the second member 62 is provided primarily to allow the plating solution Ps that has come into contact with the lower surface 62a of the second member 62 to escape horizontally.

[0077] If the space SP1 were not provided between the first member 61 and the second member 62, the flow of the plating solution Ps would be concentrated between the substrate holder 30 and the scattering suppression member 60a (particularly the first member 61). In this case, the plating solution Ps would be likely to spurt upward from between the substrate holder 30 and the scattering suppression member 60a. In contrast, according to the present embodiment, the space SP1 is provided between the first member 61 and the second member 62, so that such a problem can be effectively prevented from occurring.

[0078] 8, the second member 62 is preferably disposed at a position where it does not come into contact with the substrate holder 30. Specifically, in this case, a space SP4 is provided between the second member 62 and the substrate holder 30.

[0079] According to this embodiment, when the plating solution Ps stirred and flowing by the paddle 70 splashes upward along the first member 61, the lower surface 62a of the second member 62 can receive the splashed plating solution Ps. The plating solution Ps received by the lower surface 62a can then be released horizontally in the space SP1. This effectively prevents the plating solution Ps from scattering outside the plating tank 10.

[0080] 8 and 9 , the third member 63 is disposed above the paddle 70 and in a region below the upper end 10ba of the outer peripheral wall 10b of the plating tank 10. Specifically, the third member 63 is disposed above the paddle 70 and below the liquid level Ls of the plating solution Ps. The third member 63 is disposed in a region closer to the center of the plating tank 10 than the outer peripheral wall 10b of the plating tank 10 and closer to the outer periphery than the first member 61. Specifically, the third member 63 according to this embodiment extends a predetermined distance toward the outer periphery of the plating tank 10 from the upper end of the outer peripheral surface 61b of the first member 61. The third member 63 according to this embodiment is, for example, formed of a plate member.

[0081] 9, the third member 63 has a lower surface 63a extending horizontally. The lower surface 63a of the third member 63 is configured to come into contact with the lower surface 63a when the plating solution Ps between the outer peripheral wall 10b of the plating tank 10 and the first member 61 flows upward along the first member 61.

[0082] With this configuration, when the plating solution Ps is agitated by the paddle 70 and the plating solution Ps between the outer wall 10b of the plating tank 10 and the first member 61 flows upward along the first member 61, the flowing plating solution Ps can be prevented from splashing upward above the lower surface 63a of the third member 63. This effectively prevents the plating solution Ps from scattering outside the plating tank 10.

[0083] Referring to Figures 8 and 9, the fourth member 64 is positioned above the paddle 70, with a portion thereof positioned in an area above the upper end 10ba of the outer peripheral wall 10b of the plating tank 10, and another portion thereof positioned in an area below the upper end 10ba of the outer peripheral wall 10b.

[0084] Specifically, the fourth member 64 according to this embodiment is disposed above the paddle 70, with a portion of the fourth member 64 disposed in a region above the liquid level Ls of the plating solution Ps and another portion disposed in a region below the liquid level Ls. Furthermore, the fourth member 64 is disposed in a region closer to the center of the plating tank 10 than the outer peripheral wall 10b of the plating tank 10 and closer to the outer periphery than the first member 61. Specifically, the fourth member 64 according to this embodiment extends upward a predetermined distance from the outer peripheral end of the third member 63 as a starting point.

[0085] In the present embodiment, a space SP1 may be provided between the upper end of the fourth member 64 and the lower surface 62a of the second member 62. This allows the plating solution Ps in the plating tank 10 to easily flow over the upper end of the fourth member 64 into the overflow tank 20.

[0086] In addition, the fourth member 64 according to the present embodiment is formed, for example, of a plate member. The fourth member 64 has an outer peripheral surface 64a extending in the vertical direction. Referring to Fig. 9, the outer peripheral surface 64a of the fourth member 64 is configured so that the plating solution Ps flowing from the outer peripheral wall 10b side of the plating tank 10 toward the center of the plating tank 10 abuts against the outer peripheral surface 64a.

[0087] This configuration allows the plating solution Ps flowing from the outer peripheral wall 10b side of the plating tank 10 toward the center of the plating tank 10 to abut against the outer peripheral surface 64a of the fourth member 64, thereby preventing the plating solution Ps flowing from the outer peripheral wall 10b side of the plating tank 10 toward the center from colliding with, for example, the substrate holder 30 and splashing upward. This effectively prevents the plating solution Ps from scattering outside the plating tank 10.

[0088] In a configuration in which the paddle 70 agitates the plating solution Ps while the substrate holder 30 rotates during plating of the substrate Wf, as in the present embodiment, the rotation of the substrate holder 30 causes the plating solution Ps in the plating tank 10 to rotate, which facilitates a flow of the plating solution Ps from the outer peripheral wall 10b side toward the center of the plating tank 10. According to the present embodiment, the provision of the fourth member 64 described above makes it possible to effectively suppress scattering of the plating solution Ps caused by the plating solution P flowing from the outer peripheral wall 10b side toward the center of the plating tank 10.

[0089] According to the present embodiment as described above, since the above-mentioned first member 61 and second member 62 are provided, when the plating solution Ps is stirred by the paddle 70, it is possible to prevent the plating solution Ps from scattering outside the plating tank 10.

[0090] This makes it possible to prevent problems such as corrosion or contamination of the plating apparatus 1000 due to plating solution Ps scattered outside the plating tank 10, for example.

[0091] Furthermore, according to this embodiment, since the third member 63 and the fourth member 64 described above are also provided, scattering of the plating solution Ps outside the plating tank 10 can be effectively prevented.

[0092] It should be noted that this embodiment may also be configured without the third member 63 and the fourth member 64 described above.

[0093] (Modification 1) Fig. 10 is a schematic diagram illustrating a plating apparatus 1000 according to Modification 1 of the embodiment. Specifically, Fig. 10 is a schematic enlarged cross-sectional view showing the state in which the anti-scattering member 60a of the plating apparatus 1000 according to this modification is disposed in the plating tank 10. Note that in Fig. 10, the second member 62 of the anti-scattering member 60a is not shown.

[0094] 10 , the first member 61 of the shatter-suppression member 60a according to this modification may include at least one opening 66 configured to penetrate the first member 61. That is, the first member 61 may include only one opening 66, or may include multiple openings 66.

[0095] Similarly, the third member 63 of the shatterproof member 60a may have at least one opening 66 configured to pass through the third member 63. That is, the third member 63 may have only one opening 66 or may have multiple openings 66.

[0096] Similarly, the fourth member 64 of the shatter-reducing member 60a may include at least one opening 66 configured to pass through the fourth member 64. That is, the fourth member 64 may include only one opening 66, or may include multiple openings 66.

[0097] This modification also has the same effects as the above-described embodiment.

[0098] The scattering suppression member 60b may also have the same configuration as the scattering suppression member 60a according to this modified example.

[0099] (Variation 2) In the above-described embodiment and Variation 1, the specific locations of the anti-scattering members 60a, 60b in the plating tank 10 are not limited to the locations illustrated in Fig. 4 etc. Preferably, the anti-scattering members 60a, 60b are located in locations where scattering of the plating solution Ps is particularly likely to occur, depending on the shape of the plating tank 10 etc. For example, the anti-scattering members 60a, 60b may be located as in this variation described below.

[0100] 11 is a schematic plan view of the plating tank 10 of the plating apparatus 1000 according to the second modification of the embodiment, viewed from above. In FIG. 11, of the anti-scattering members 60a, 60b, only the first member 61 is illustrated by a solid line, and the second member 62 is illustrated by a dotted line. Also, the third member 63, the fourth member 64, etc. are not shown.

[0101] As illustrated in Fig. 11 , the paddle 70 according to this modification agitates the plating solution Ps by reciprocating in a first direction (1st) and a second direction (2nd). Fig. 11 illustrates a first central axis XL1 and a second central axis XL2 perpendicular to the first central axis XL1 as central axes of the plating tank 10. The second central axis XL2 extends in a direction parallel to the movement direction of the paddle 70 in a plan view, and the first central axis XL1 extends in a direction perpendicular to the movement direction of the paddle 70 (third direction (3rd)) in a plan view.

[0102] 11 , the plating apparatus 1000 according to this modification has, as an example, a configuration in which the interior of the overflow tank 20 (i.e., the "outer tank") is partitioned by a first inner tank wall 15a and a second inner tank wall 15b. The upper end of the overflow tank 20 is located higher than the upper ends of the first inner tank wall 15a and the second inner tank wall 15b. The plating solution Ps is stored in the area surrounded by the first inner tank wall 15a, the second inner tank wall 15b, and the overflow tank 20. Note that the first inner tank wall 15a and the second inner tank wall 15b according to this modification correspond to the "outer peripheral wall 10b of the plating tank 10" described above, and the upper ends of the first inner tank wall 15a and the second inner tank wall 15b correspond to the "upper end 10ba of the outer peripheral wall 10b of the plating tank 10" described above.

[0103] The first inner tank wall 15a and the second inner tank wall 15b extend generally in a direction (third direction) perpendicular to the movement direction of the paddle 70. The first inner tank wall 15a and the second inner tank wall 15b have flat portions 15c formed by a plane extending linearly in a direction perpendicular to the movement direction of the paddle 70 in regions near the ends in the extension direction (regions located a predetermined distance from the ends toward the center of the plating tank 10).

[0104] FIG. 12 is a schematic diagram illustrating a paddle connecting member 77, which will be described later. Specifically, FIG. 12 is a schematic cross-sectional view of a region in the vicinity of region B1 in FIG. 11, which will be described later. Note that the illustration of the scattering suppression members 60a and 60b is omitted in FIG. 12. As illustrated in FIG. 12, a paddle connecting member 77 may be connected to the paddle 70. This paddle connecting member 77 is a member for connecting the paddle 70 to a drive unit 90 for the paddle 70 (see FIG. 5 described above). Specifically, one end of the paddle connecting member 77 is connected to an end of the paddle 70 inside the plating tank 10, and the other end is connected to the drive unit 90 outside the plating tank 10.

[0105] The paddle connecting member 77 includes, for example, a first portion 77a extending upward and a second portion 77b extending horizontally. The lower end of the first portion 77a is connected to the end of the paddle 70, and the upper end of the first portion 77a is connected to one end of the second portion 77b. The second portion 77b is disposed so as to pass through a hole 21a formed in the outer peripheral wall 21 of the overflow tank 20. The other end of the second portion 77b (the end opposite to the end connected to the first portion 77a) is connected to the drive device 90 described above.

[0106] Referring to Figure 11, when the paddle 70 arranged in the plating tank 10 as described above moves back and forth in the first direction (1st) and the second direction (2nd) to agitate the plating solution Ps, the plating solution Ps that comes into contact with the flat portion 15c of the first inner tank wall 15a and the flat portion 15c of the second inner tank wall 15b tends to bounce back toward the center of the plating tank 10 (toward the first central axis XL1), which tends to cause the plating solution Ps to splash up.

[0107] In this plating tank 10, the anti-scattering members 60a, 60b are preferably disposed near the flat portion 15c, as illustrated in FIG. 11 . Specifically, the anti-scattering members 60a, 60b are preferably disposed so that the second member 62 covers at least the region B1 between the flat portion 15c of the first inner tank wall 15a and the opposing flat portion 15c of the second inner tank wall 15b. Furthermore, the anti-scattering members 60a, 60b are more preferably disposed so that the first member 61 faces the outer peripheral wall 21 of the overflow tank 20, which connects the flat portion 15c of the first inner tank wall 15a and the flat portion 15c of the second inner tank wall 15b. This configuration effectively prevents the plating solution Ps from scattering outside the plating tank 10.

[0108] 13 is a schematic diagram illustrating a scattering suppression member 60a of a plating apparatus 1000 according to a third modification of the embodiment. Specifically, FIG. 13 schematically illustrates a top view of the first member 61 and the fourth member 64 of the scattering suppression member 60a according to this modification.

[0109] 7 to 9 in that the fourth member 64 extends in a curved shape in the circumferential direction of the outer peripheral wall 10b (or in the circumferential direction of the substrate holder 30) similarly to the first member 61. Specifically, the fourth member 64 in this modification extends in a curved shape in the circumferential direction of the outer peripheral wall 10b so as to follow the outer peripheral surface 61b of the first member 61.

[0110] This modification also has the same effects as the above-described embodiment.

[0111] Furthermore, according to this modification, for example, when the rotation of the substrate holder 30 causes the plating solution Ps in the plating tank 10 to rotate around the center of the plating tank 10, causing the plating solution Ps to flow from the side of the outer peripheral wall 10b of the plating tank 10 toward the center, or from the center toward the side of the outer peripheral wall 10b of the plating tank 10, the flowing plating solution Ps can be made to flow along the fourth member 64. In this respect as well, scattering of the plating solution Ps can be effectively suppressed.

[0112] 13, the shatter-suppression member 60a according to this modification includes two fourth members 64. In this case, a space SP2 may be provided between two adjacent fourth members 64 (i.e., between the first fourth member and the second fourth member) in plan view.

[0113] According to this configuration, for example, a portion of the plating solution Ps flowing from the outer peripheral wall 10b side toward the center of the plating tank 10 can pass through the space SP2 of the fourth member 64. As a result, compared to a case where this space SP2 is not provided, it is possible to effectively prevent the plating solution Ps flowing from the outer peripheral wall 10b side toward the center of the plating tank 10 from colliding with the fourth member 64 with force and splashing upward.

[0114] The number of fourth members 64 included in the scattering suppression member 60a according to this modified example is not limited to two, but may be one, or may be three or more.

[0115] The shatter suppression member 60b may also have a configuration similar to the fourth member 64 of the shatter suppression member 60a according to this modified example. Furthermore, the shatter suppression members 60a and 60b according to the above-described modified examples 1 and 2 may further have the features of the fourth member 64 according to this modified example.

[0116] 14 is a schematic diagram illustrating a scattering suppression member 60a of a plating apparatus 1000 according to a fourth modification of the embodiment. Specifically, FIG. 14 schematically illustrates a state in which the first member 61 and the fourth member 64 of the scattering suppression member 60a according to this modification are viewed from above.

[0117] The scattering suppression member 60a of this modified example differs from the embodiment described above in Figures 7 to 9 mainly in that the fourth member 64 extends tangentially to the first member 61 (which extends in a curved shape).

[0118] This modification also has the same effects as the third modification described above.

[0119] Furthermore, when comparing Modification 3 (FIG. 13) with this Modification (FIG. 14), the shatter-suppression member 60a can be manufactured at a lower cost in this Modification than in Modification 3. In other words, this Modification can also reduce manufacturing costs compared to Modification 3.

[0120] 14, the shatter-suppression member 60a according to this modified example includes two fourth members 64. In this case, a space SP2 may be provided between two adjacent fourth members 64 in a plan view.

[0121] Furthermore, the number of fourth members 64 included in the scattering suppression member 60a according to this modified example is not limited to two, but may be one, or may be three or more.

[0122] The shatter suppression member 60b may also have a configuration similar to the fourth member 64 of the shatter suppression member 60a according to this modified example. Furthermore, the shatter suppression members 60a and 60b according to the above-described modified examples 1 and 2 may further have the features of the fourth member 64 according to this modified example.

[0123] 16 is a schematic perspective view illustrating a scattering suppression member 60a of a plating apparatus 1000 according to a fifth modification of the embodiment. In the scattering suppression member 60a as illustrated in FIG. 7A described above, if the central portion of the third member 63 is thin and its strength is considered to be insufficient, the first member 61, the third member 63, and the fourth member 64 may have a space SP5 formed in their central portions, as illustrated in FIG.

[0124] Specifically, in this case, the first member 61 of the shatter-suppression member 60a includes a first member piece 61-1 arranged on one side of the space SP5 and a first member piece 61-2 arranged on the other side. The third member 63 includes a third member piece 63-1 arranged on one side of the space SP5 and a third member piece 63-2 arranged on the other side. The fourth member 64 includes a fourth member piece 64-1 arranged on one side of the space SP5 and a fourth member piece 64-2 arranged on the other side.

[0125] The scattering suppression member 60b may also have the same configuration as the scattering suppression member 60a according to this modified example.

[0126] 17 is a schematic diagram illustrating a scattering suppression member 60a of a plating apparatus 1000 according to a sixth modification of the embodiment. The scattering suppression member 60a according to this modification differs from the scattering suppression member 60a illustrated in FIG. 8 in that the lower surface 63a of the third member 63 extends further downward. Specifically, in the scattering suppression member 60a according to this modification illustrated in FIG. 17, the third member 63 extends downward so that the lower surface 63a of the third member 63 coincides with the position of the lower end of the first member 61.

[0127] For example, if the configuration of the anti-scattering member 60a illustrated in FIG. 8 is not easy to manufacture, the anti-scattering member 60a according to this modified example illustrated in FIG. 17 may be used.

[0128] The scattering suppression member 60b may also have the same configuration as the scattering suppression member 60a according to this modified example.

[0129] 18(A) and 18(B) are schematic diagrams illustrating a scattering suppression member 60a of a plating apparatus 1000 according to a seventh modification of the embodiment. In the plating apparatus 1000 according to the second modification described above, the scattering suppression member 60a may be configured without the connecting member 65 connecting the first member 61 and the second member 62, as illustrated in FIG. 18(A). In other words, the scattering suppression member 60a according to this modification is configured as being divided into two parts: a "second member 62" and a "first member 61, a third member 63, and a fourth member 64."

[0130] Furthermore, as illustrated in Figure 18 (B), the first member 61 of the scattering suppression member 60a in this modified example may be fixed to the first inner tank wall 15a and the second inner tank wall 15b by having its circumferential ends connected to the inner surfaces of the first inner tank wall 15a and the second inner tank wall 15b.

[0131] The scattering suppression member 60b may also have the same configuration as the scattering suppression member 60a according to this modified example.

[0132] Although the embodiments and modifications of the present invention have been described in detail above, the present invention is not limited to such specific embodiments and modifications, and various further modifications and changes are possible within the scope of the gist of the present invention.

[0133] REFERENCE SIGNS LIST 10 Plating tank 10b Outer peripheral wall 10ba Upper end 11 Anode 30 Substrate holder 60a, 60b Scattering suppression member 61 First member 61b Outer peripheral surface 62 Second member 62a Lower surface 63 Third member 63a Lower surface 64 Fourth member 66 Opening 70 Paddle 1000 Plating device Ps Plating solution Ls Liquid surface SP1 Space Wf Substrate

Claims

1. A plating apparatus comprising: a plating tank configured to store plating solution and in which an anode is disposed; a substrate holder for holding a substrate as a cathode facing the anode; a paddle disposed in a region inside the plating tank above the anode and below the substrate holder and configured to agitate the plating solution; and a scattering suppression member configured to prevent the plating solution from splashing up and scattering outside the plating tank when the plating solution is agitated by the paddle, wherein the scattering suppression member has a first member and a second member, wherein the first member is disposed in a region above the paddle and below an upper end of an outer peripheral wall of the plating tank, and is disposed in a region between the outer peripheral wall and the substrate holder, and extends in a vertical direction and in a curved shape circumferentially around the outer peripheral wall, and the second member is disposed above the upper end of the outer peripheral wall, and is disposed above the first member with a space between it and the first member, and has a lower surface extending in a horizontal direction.

2. The plating apparatus of claim 1, wherein the anti-scattering member is arranged in a region above the paddle and below the upper end of the outer peripheral wall, and further comprises a third member arranged in a region closer to the center of the plating tank than the outer peripheral wall and closer to the outer periphery than the first member, and the third member has a lower surface extending horizontally.

3. The plating apparatus of claim 2, wherein the anti-scattering member is further provided with a fourth member that is positioned above the paddle, with one portion positioned in a region above the upper end of the outer peripheral wall and the other portion positioned in a region below the upper end of the outer peripheral wall, and that is positioned in a region closer to the center of the plating tank than the outer peripheral wall and closer to the outer periphery than the first member, and the fourth member has an outer peripheral surface that extends in the vertical direction.

4. The plating apparatus of claim 1, wherein said first member has at least one opening configured to extend through said first member.

5. The plating apparatus of claim 2, wherein said third member has at least one opening configured to extend through said third member.

6. The plating apparatus of claim 3, wherein said fourth member has at least one opening configured to extend through said fourth member.

7. The plating apparatus according to claim 3, wherein the fourth member extends in a curved shape in the circumferential direction of the outer peripheral wall.

8. The plating apparatus according to claim 3, wherein the fourth member extends in a tangential direction of the first member extending in the shape of the curved surface.

Images