Detection device and method for manufacturing detection device

Abstract

This detection device comprises: a detection region in which an insulating layer, an electrode layer, a first buffer layer, an active layer, a second buffer layer, an adhesive insulating layer, and a substrate are laminated so as to function as an optical sensor; and a non-detection region in which the insulating layer, the adhesive insulating layer, and the substrate are laminated. A terminal part that, within the non-detection region, is provided with a first terminal electrically connected to the electrode layer does not overlap the adhesive insulating layer or the substrate.

Description

Detection device and method for manufacturing the detection device

[0001] The present invention relates to a detection device and a method for manufacturing a detection device.

[0002] Optical sensors capable of detecting fingerprint patterns and vein patterns are known (see, for example, Patent Document 1). Among such optical sensors, sensors having an organic photodiode (OPD) using an organic semiconductor material as an active layer are known.

[0003] Japanese Patent Application Laid-Open No. 2022-121297

[0004] In order to provide flexibility to an organic photodiode, a configuration is sometimes adopted in which a flexible substrate on which the organic photodiode is formed and a substrate on which a circuit connected to the organic photodiode is mounted are provided separately, and terminals on each of these substrates are pressure-bonded to each other from the flexible substrate on which the organic photodiode is formed. In such a configuration, the flexible substrate and the substrate on which the circuit is mounted overlap each other due to the pressure bonding, resulting in an increase in thickness.

[0005] It is an object of the present invention to provide thinner sensing devices and methods for manufacturing thinner sensing devices.

[0006] A detection device according to one embodiment of the present invention comprises a detection region in which an insulating layer, an electrode layer, a first buffer layer, an active layer, a second buffer layer, an adhesive insulating layer, and a substrate are stacked to function as an optical sensor, and a non-detection region in which the insulating layer, the adhesive insulating layer, and the substrate are stacked, and a terminal portion in the non-detection region in which a first terminal electrically connected to the electrode layer is provided does not overlap the adhesive insulating layer or the substrate.

[0007] A method for manufacturing a detection device of one embodiment of the present invention includes the steps of: forming a substrate having a first substrate, a first adhesive insulating layer, an insulating layer, an electrode layer, a first buffer layer, an active layer, a second buffer layer, a second adhesive insulating layer, and a second substrate arranged in this order from one side to the other in a stacking direction; crimping a plurality of terminals formed in areas of the substrate where the first buffer layer, the active layer, the second buffer layer, the second adhesive insulating layer, and the second substrate are not stacked, to a plurality of external terminals provided on an external substrate; and peeling the first substrate and the first adhesive insulating layer from the substrate, wherein the first adhesive insulating layer has an adhesive portion that abuts the first substrate on one side and abuts the insulating layer on the other side, and a non-adhesive portion that is a gap between the first substrate and the insulating layer, alternately arranged in a direction perpendicular to the stacking direction.

[0008] FIG. 1 is a schematic diagram showing an example of the appearance of a detection device according to an embodiment, when a finger is placed inside the detection device, as viewed from the side of the housing. FIG. 2 is a schematic cross-sectional view taken along the line II-II' in FIG. 1. FIG. 3 is a developed view showing an example of the optical sensor of the detection device shown in FIG. 1. FIG. 4 is a diagram showing a schematic layered structure of the base portion 610 side and the pressure-bonded portion side of the sensor substrate. FIG. 5 is a more enlarged plan view of the sensor substrate. FIG. 6 is a schematic plan view showing the layered structure of the non-detection region in the embodiment. FIG. 7 is a cross-sectional view taken along line VII-VII in the "terminal portion" of FIG. 6. FIG. 8 is a cross-sectional view taken along line VIII-VIII in the "terminal portion" of FIG. 6. FIG. 9 is a plan view showing the layered structure of the non-detection region in a comparative example. FIG. 10 is a cross-sectional view taken along line X-X in the "terminal portion" of FIG. 9. FIG. 11 is a plan view showing the layered structure of the non-detection region 599 in the sensor substrate after the step of peeling off the first substrate and the first adhesive insulating layer from the sensor substrate. Fig. 12 is a cross-sectional view taken along line XII-XII in Fig. 11. Fig. 13 is a cross-sectional view taken along line XIII-XIII in Fig. 11. Fig. 14 is a diagram showing a configuration example in which the first adhesive insulating layer 350 shown in Fig. 6 is replaced with a first adhesive insulating layer 357. Fig. 15 is a diagram showing a configuration example in which the first adhesive insulating layer 350 shown in Fig. 6 is replaced with a first adhesive insulating layer 356. Fig. 16 is a diagram showing the relationship between the shape of the sensor substrate in a plan view and the shape of the first adhesive insulating layer that bonds the first substrate and the insulating layer in the sensor substrate in a plan view.

[0009] Modes for carrying out the invention (embodiments) will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. Furthermore, the components described below include those that can be easily imagined by a person skilled in the art and those that are substantially identical. Furthermore, the components described below can be combined as appropriate. The disclosure is merely an example, and appropriate modifications that a person skilled in the art can easily conceive while maintaining the gist of the invention are naturally included within the scope of the present invention. Furthermore, for clarity of explanation, the drawings may show the width, thickness, shape, etc. of each part schematically compared to the actual embodiment. However, these are merely examples and are not intended to limit the interpretation of the present invention. Furthermore, in this specification and each figure, elements similar to those described above with reference to the previous figures may be designated by the same reference numerals, and detailed descriptions may be omitted as appropriate.

[0010] In this specification and claims, when expressing an aspect of placing another structure on top of a certain structure, the term "on top" is used, unless otherwise specified, to include both a case in which another structure is placed directly on top of a certain structure so as to be in contact with the certain structure, and a case in which another structure is placed above a certain structure via yet another structure.

[0011] (Embodiment) Fig. 1 is a schematic diagram showing an example of the appearance of a detection device according to an embodiment when a finger is placed inside the detection device as viewed from the side of the housing. Fig. 2 is a schematic cross-sectional view taken along line II-II' shown in Fig. 1. Fig. 3 is a development view showing an example of the development of the optical sensor of the detection device shown in Fig. 1.

[0012] The detection device 1 shown in FIG. 1 is a ring-shaped device that can be attached to and detached from the human body, and is worn on a finger Fg of the human body. The finger Fg includes the thumb, index finger, middle finger, ring finger, little finger, etc. The human body is an individual to be authenticated, whose identity is verified by the detection device 1. The detection device 1 can detect biometric information about a living body from the finger Fg on which it is worn. The finger Fg is an example of a measurement target. The measurement target is a living body or part of a living body, and is a measurement target. The detection device 1 is made into a ring or wristband, making it easy for the user to carry. In the following description, it is assumed that the detection device 1 is used as a ring.

[0013] 2, the detection device 1 includes a housing 200, a light source 60, a first optical sensor 10A, and a second optical sensor 10B. The detection device 1 includes a battery (not shown) inside the housing 200 and is operated by power from the battery.

[0014] The housing 200 is formed in a ring shape (annular shape) that can be worn on a finger Fg and is a wearable member that is worn on a living body. In the example shown in FIG. 2 , the housing 200 includes a sealing film 210 and an exterior part 220. The sealing film 210 and the exterior part 220 are integrally formed into a ring shape. The sealing film 210 houses the light source 60, the first optical sensor 10A, the second optical sensor 10B, etc. inside. The sealing film 210 is formed in a ring shape using a housing material such as a transparent synthetic resin or silicone. The exterior part 220 has a surface of the housing 200 that covers the outer peripheral surface 210A of the sealing film 210. The exterior part 220 is formed in a ring shape using a material such as a metal or a non-transparent synthetic resin. The housing 200 houses a circuit board 70 on which the light source 60, the first optical sensor 10A, the second optical sensor 10B, etc. are mounted inside the sealing film 210. The circuit board 70 is housed inside the housing 200 by, for example, forming the housing 200 in a ring shape in a mold and filling a filling material around the circuit board 70 .

[0015] As shown in FIG. 3 , the circuit board 70 is formed in a deformable band shape, and is formed into a ring shape by connecting one end 71 and the other end 72. The circuit board 70 has a first mounting area 73 and a second mounting area 74. The first mounting area 73 is an area where the light source 60 and the like are mounted. The second mounting area 74 is an area where the control circuit 122, the power supply circuit 123, and the like are mounted. The sensor board 21 is mounted on the circuit board 70 so as to straddle the vicinity of the light source 60 in the first mounting area 73. More specifically, the circuit board 70 of the embodiment is a flexible PCB (Printed Circuit Board). Note that the circuit board 70 may be configured using a board commonly used as an FPC (Flexible Printed Circuit).

[0016] In this embodiment, the first optical sensor 10A and the second optical sensor 10B are provided so as to sandwich the light source 60 in the circumferential direction 200C. That is, the detection device 1 is arranged in the circumferential direction 200C with the first optical sensor 10A, the light source 60, and the second optical sensor 10B lined up in this order. By arranging the first optical sensor 10A and the second optical sensor 10B so as to sandwich the light source 60 in the circumferential direction 200C, the first optical sensor 10A and the second optical sensor 10B can detect light emitted by the light source 60 over a wide range of the housing 200.

[0017] The sensor substrate 21 is a deformable substrate on which the first optical sensor 10A and the second optical sensor 10B are mounted. The sensor substrate 21 can be bent in the third direction Dz. When the sensor substrate 21 is attached to the circuit board 70, the first optical sensor 10A and the second optical sensor 10B are positioned on both sides of the light source 60 in the circumferential direction 200C of the housing 200. The sensor substrate 21 has a first region 21A on which the first optical sensor 10A is mounted and a second region 21B on which the second optical sensor 10B is mounted. The sensor substrate 21 is formed as a single substrate having the first region 21A and the second region 21B.

[0018] 2 , the circuit board 70 is housed inside the housing 200 so that the surface on which the first optical sensor 10A, the second optical sensor 10B, and the light source 60 are mounted faces the inner circumferential surface 200B of the housing 200. If the circuit board 70 is translucent, the first optical sensor 10A, the second optical sensor 10B, and the light source 60 may be mounted on the back surface opposite the front surface. In this case, the light source 60 may be disposed so that it emits light toward the circuit board 70 and the light that has passed through the circuit board 70 is emitted toward the outside of the housing 200.

[0019] As shown in FIG. 2 , the light source 60 is provided inside the sealing film 210 of the housing 200 and is configured to be able to irradiate light toward a detection object such as a finger Fg worn on the ring-shaped housing 200. For example, an inorganic LED (Light Emitting Diode) or an organic EL (Organic Light Emitting Diode) is used as the light source 60. The light source 60 irradiates light of a predetermined wavelength. In this embodiment, the light source 60 has a plurality of light sources capable of irradiating near-infrared light, red light, and green light.

[0020] Light emitted from the light source 60 is reflected by the surface of the object to be detected, such as a finger Fg, and enters the first optical sensor 10A and the second optical sensor 10B. This allows the detection device 1 to detect a fingerprint by detecting the shape of the projections and recesses on the surface of the finger Fg. Alternatively, the light emitted from the light source 60 may be reflected inside the finger Fg or pass through the finger Fg before entering the first optical sensor 10A and the second optical sensor 10B. This allows the detection device 1 to detect information about a living body inside the finger Fg. Examples of information about a living body include pulse waves, pulse rates, and blood vessel images of the finger or palm. That is, the detection device 1 may be configured as a fingerprint detection device that detects fingerprints, or a vein detection device that detects vascular patterns such as veins.

[0021] Each of the first optical sensor 10A and the second optical sensor 10B detects light emitted by the light source 60 and reflected by a finger Fg or the like, directly incident light, etc. The first optical sensor 10A and the second optical sensor 10B are organic photodiodes. The first optical sensor 10A is provided on the housing 200 so as to be adjacent to one end 61 of the light source 60 in the circumferential direction 200C of the housing 200. The second optical sensor 10B is provided on the housing 200 so as to be adjacent to the other end 62 of the light source 60 in the circumferential direction 200C of the housing 200.

[0022] As shown in FIG. 3 , the first optical sensor 10A and the second optical sensor 10B each have an organic photodiode OPD (see FIG. 4 ). Each of the first optical sensor 10A and the second optical sensor 10B has two electrodes 11 aligned along the circumferential direction 200C. The first optical sensor 10A and the second optical sensor 10B are mounted on a single sensor substrate 21 and electrically connected to the circuit board 70 via the sensor substrate 21. The sensor substrate 21 has a cutout portion 22 (see FIG. 4 ) between the first optical sensor 10A and the second optical sensor 10B in the circumferential direction 200C of the housing 200. In other words, the detection device 1 is a detection device that detects light using an organic photodiode OPD.

[0023] In the following description, the first direction Dx is a direction in a plane parallel to the sensor substrate 21. The second direction Dy is a direction in a plane parallel to the sensor substrate 21 and is the same direction as the circumferential direction 200C. In the embodiment, the first direction Dx and the second direction Dy are perpendicular to each other, but the intersection angle between the first direction Dx and the second direction Dy does not necessarily have to be strictly perpendicular, and the first direction Dx and the second direction Dy may intersect without being perpendicular. The third direction Dz is a direction perpendicular to the second direction Dy and the first direction Dx. The third direction Dz is a normal direction to the sensor substrate 21. The term "planar view" refers to the positional relationship when viewed from a direction perpendicular to the sensor substrate 21. The term "lateral" refers to a direction (such as the first direction Dx or the second direction Dy) that intersects with the third direction Dz.

[0024] In the following description, the sensor substrate 21 will be described by distinguishing between the base 610 side and the pressure-bonded portion 620 side. The base 610 side is the side on which organic photodiodes OPD (see FIG. 4 ) such as the first optical sensor 10A and the second optical sensor 10B are formed. The pressure-bonded portion 620 side is the side on which terminals of wiring connected to the organic photodiodes OPD (e.g., terminals 503, 504, ..., 511, described below) are formed. The boundary between the portion of the sensor substrate 21 on the base 610 side and the portion of the sensor substrate 21 on the pressure-bonded portion 620 side is indicated as a boundary line 600.

[0025] FIG. 4 is a diagram showing a schematic stacked structure on each of the base portion 610 side and the pressure-bonded portion 620 side of the sensor substrate 21. Note that FIG. 4 is merely a schematic diagram for specifically explaining the stacked structure, and the layout, shape, size, and other aspects of each component from a planar perspective are more accurately shown in FIG. 5 , which will be described later. A stacked structure constituting an organic photodiode OPD is formed on the base portion 610 side. Specifically, the organic photodiode OPD includes an active layer 301, a hole injection layer 302, and an electron injection layer 303. More specifically, the organic photodiode OPD has a stacked structure in which the hole injection layer 302 and the electron injection layer 303 sandwich the active layer 301 in the third direction Dz.

[0026] The characteristics (e.g., voltage-current characteristics and resistance value) of the active layer 301 change depending on the light irradiated thereto. An organic material is used as the material of the active layer 301. The hole injection layer 302 is a so-called HIL (Hole Injection Layer) and corresponds to a second buffer layer. The electron injection layer 303 is a so-called EIL (Electron Injection Layer) and corresponds to a first buffer layer.

[0027] More specifically, the active layer 301 has a bulk heterostructure in which a p-type organic semiconductor and an n-type organic semiconductor, an n-type fullerene derivative (PCBM), are mixed together. For example, low-molecular-weight organic materials such as C60 (fullerene), PCBM (phenyl C61-butylic acid methyl ester), CuPc (copper phthalocyanine), F16CuPc (fluorinated copper phthalocyanine), rubrene (rubrene: 5,6,11,12-tetraphenyltetracene), and PDI (perylene derivative) can be used as the active layer 301.

[0028] The active layer 301 can be formed using these low-molecular-weight organic materials by a vapor deposition (dry process). In this case, the active layer 301 may be, for example, a laminated film of CuPc and F16CuPc, or a laminated film of rubrene and C60. The active layer 301 can also be formed by a coating (wet process). In this case, the active layer 301 is made of a material that combines the above-mentioned low-molecular-weight organic material with a high-molecular-weight organic material. Examples of high-molecular-weight organic materials that can be used include P3HT (poly(3-hexylthiophene)) and F8BT (F8-alt-benzothiadiazole). The active layer 301 can be a film in which P3HT and PCBM are mixed, or a film in which F8BT and PDI are mixed.

[0029] Furthermore, a conductive polymer such as a composite (PEDOT:PSS) made of poly(3,4-ethylenedioxythiophene) and polystyrene sulfonic acid (PSS) is used as the material for the hole injection layer 302. Furthermore, an alkali metal with a small work function, such as lithium (Li), is used as the material for the electron injection layer 303.

[0030] Although not shown in FIG. 4 , a hole transport layer may be further formed between the hole injection layer 302 and the active layer 301. Furthermore, an electron transport layer may be further formed between the active layer 301 and the electron injection layer 303. A metal oxide layer is used as the material for the hole transport layer. Examples of such metal oxide layers include tungsten oxide (WO3) and molybdenum oxide. For example, ethoxylated polyethyleneimine (PEIE) is used as the material for the electron transport layer. Furthermore, the hole transport layer and the electron transport layer are not limited to single-layer films, and may be formed as a laminated film including an electron blocking layer or a hole blocking layer.

[0031] The hole injection layer 302 abuts against the electrode 312 that functions as an anode. Specifically, the hole injection layer 302 includes a connection portion 3021. The connection portion 3021 is a part of the hole injection layer 302, and is formed to extend from the active layer 301 in the third direction Dz on a side of the active layer 301 and the electron injection layer 303. The connection portion 3021 abuts against the electrode 312, thereby causing the hole injection layer 302 to abut against the electrode 312.

[0032] The electron injection layer 303 is in contact with the electrode 11 that functions as a cathode. The electrode 11 is disposed to face the active layer 301 in the third direction Dz, with the electron injection layer 303 sandwiched between them.

[0033] The electrode 11 and the hole injection layer 302 are each connected to a conductive material layer that functions as a wiring. Specifically, the electrode 11 is connected to the wiring 331. The hole injection layer 302 is connected to the wiring base 3300. The wiring 331 and the wiring base 3300 are the same conductive material layer. This conductive material layer is formed of a light-transmitting conductive material such as indium tin oxide (ITO), but is not limited thereto and may be formed of other conductive materials. The wiring 331 and the wiring base 3300 are separated by an insulating layer 320. More specifically, the insulating layer 320 is interposed between the electrode layer including the electrode 11 and the electrode 312 and the conductive material layer including the wiring 331 and the wiring base 3300. This electrode layer is formed of a light-transmitting conductive material such as ITO. The insulating layer 320 has a through hole 391 formed therein for electrically connecting the electrode 11 and the wiring 331. The insulating layer 320 also has a through hole 392 formed therein for electrically connecting the electrode 312 and the wiring base 3300.

[0034] 4, the wiring 331 extends to both the base 610 side and the crimped portion 620 side across the boundary line 600 so as to connect the base 610 side and the crimped portion 620 side. The insulating layer 320 also extends to both the base 610 side and the crimped portion 620 side.

[0035] A laminated structure for providing a terminal of the sensor substrate 21 is formed on the side of the crimped portion 620. Specifically, the terminal is formed on one end side in the second direction Dy of the end electrode 110 connected to the wiring 331 extending toward the crimped portion 620. The end electrode 110 is in the same layer as the electrode layer including the electrode 11 and the electrode 312. An insulating layer 320 is interposed between the end electrode 110 and the wiring 331, and a through hole 393 is provided to electrically connect the end electrode 110 and the wiring 331.

[0036] In addition, when the term wiring portion 33 is used, it refers to the laminated structure included in the sensor substrate 21, as shown in Figure 4, which is formed of a conductive material layer including wiring 331 and wiring base 3300, an insulating layer 320, and an electrode layer including electrode 11, electrode 312, and end electrode 110.

[0037] One end of the end electrode 110 in the second direction Dy is exposed to the outside. This exposed portion functions as a terminal. Furthermore, the wiring 331 included in the wiring portion 33 is continuous on the base portion 610 side and the crimped portion 620 side across the boundary line 600, and functions as a wiring that electrically connects the electrode 11 or the electrode 312 to the terminals (terminals 503, 504, ..., 511) provided on the crimped portion 620 side.

[0038] The wiring 331 shown in FIG. 4 is connected to the electrode 11 via a through hole 391, but a plurality of components that function as wiring, such as the wiring 331, are provided on the sensor substrate 21.

[0039] Fig. 5 is a more enlarged plan view of the sensor substrate 21. As shown in Fig. 3 and Fig. 5, four electrodes 11 are provided on the sensor substrate 21. Specifically, two electrodes 11 are provided on each of the first optical sensor 10A and the second optical sensor 10B.

[0040] As shown in FIG. 5 , one of the four electrodes 11 is connected to a wiring portion 3311 via a through hole 391. Another of the four electrodes 11 is connected to a wiring portion 3312 via a through hole 391. Another of the four electrodes 11 is connected to a wiring portion 3313 via a through hole 391. Another of the four electrodes 11 is connected to a wiring portion 3314 via a through hole 391. The wiring portions 3311, 3312, 3313, and 3314 are each individual wirings 331. The wiring portion 3311 is connected to the through hole 391 on the base 610 side and to the terminal 504 on the crimped portion 620 side. The wiring portion 3312 is connected to the through hole 391 on the base 610 side and to the terminal 503 on the crimped portion 620 side. The wiring portion 3313 is connected to the through hole 391 on the side of the base portion 610, and is connected to the terminal 509 on the side of the crimped portion 620. The wiring portion 3314 is connected to the through hole 391 on the side of the base portion 610, and is connected to the terminal 510 on the side of the crimped portion 620. The terminals 503, 504, 509, and 510 are each individual terminals.

[0041] The wiring base 3300 of the first optical sensor 10A is connected to the wiring portion 3310. The wiring base 3300 of the second optical sensor 10B is connected to the wiring portion 3315. The wiring portions 3310 and 3315 are each an individual wiring 331. The wiring portion 3310 is connected to the wiring base 3300 on the base portion 610 side and to the terminals 505 and 507 on the crimped portion 620 side. The wiring portion 3315 is connected to the wiring base 3300 on the base portion 610 side and to the terminal 511 on the crimped portion 620 side. The terminals 505, 507, and 511 are each an individual terminal. As described with reference to FIG. 4 , the electrode 312 abuts the wiring base 3300. Therefore, like the electrode 11, the electrode 312 is also connected to a terminal via the wiring 331.

[0042] 4 , the wiring 331, wiring base 3300, and insulating layer 320 are in contact with one surface of the insulating layer 340. The other surface of the insulating layer 340 is in contact with a first adhesive insulating layer 350. The first adhesive insulating layer 350 is interposed between the insulating layer 340 and the first substrate 360.

[0043] On one side of the first substrate 360, a first adhesive insulating layer 350, an insulating layer 340, a conductive material layer including wiring 331 and wiring base 3300, an insulating layer 320, an electrode layer including electrode 11, electrode 312 and end electrode 110, an electron injection layer 303, an active layer 301, and a hole injection layer 302 are stacked in this order, thereby forming a main stacked structure including an organic photodiode OPD and a terminal electrically connected to the organic photodiode OPD.

[0044] Furthermore, the sensor substrate 21 includes a configuration for structurally protecting and reinforcing the organic photodiode OPD. Specifically, the sensor substrate 21 includes an adhesive layer 410 and an additional structural maintaining portion 450. The adhesive layer 410 is provided at the base 610 so as to cover the organic photodiode OPD from the hole injection layer 302 side. The additional structural maintaining portion 450 has a structure in which a second adhesive insulating layer 430 and an insulating layer 420 are laminated on the second substrate 440. The second adhesive insulating layer 430 is interposed between the second substrate 440 and the insulating layer 420. The insulating layer 420 side of the additional structural maintaining portion 450 abuts against the adhesive layer 410. The structure for structurally protecting and reinforcing the organic photodiode OPD is formed by forming an adhesive layer 410 to cover the organic photodiode OPD after the formation of the main laminated structure described above, and then adhering the additional structure maintaining portion 450 to the adhesive layer 410 with the insulating layer 420 facing the adhesive layer 410 side.

[0045] Note that the term "intermediate portion 400" refers to a laminated structure formed by the organic photodiode OPD and the adhesive layer 410. Therefore, it can be said that the sensor substrate 21 has a structure in which, when viewed from the additional structure-maintaining portion 450 side, the additional structure-maintaining portion 450, intermediate portion 400, wiring portion 33, insulating layer 340, first adhesive insulating layer 350, and first substrate 360 ​​are laminated in this order.

[0046] The insulating layer 340 and the insulating layer 420 are insulating layers and are formed using, for example, colorless and transparent polyimide (CPI). The first adhesive insulating layer 350 is an adhesive layer that bonds the insulating layer 340 and the first substrate 360. The second adhesive insulating layer 430 is an adhesive layer that bonds the insulating layer 420 and the second substrate 440. The first adhesive insulating layer 350 and the second adhesive insulating layer 430 are formed using, for example, an adhesive film (OCA: Optically Clear Adhesive) that has insulating and light-transmitting properties. For example, an acrylic-based OCA is used, but a silicone-based or urethane-based OCA may also be used. The first substrate 360 ​​and the second substrate 440 are structural maintenance members and are formed using, for example, polyethylene terephthalate (PET: Poly Ethylene Terephthalate). The adhesive layer 410 is formed using, for example, an encapsulation adhesive.

[0047] Here, the region on the base 610 side where the organic photodiode OPD is formed is referred to as the detection region 680. The detection region 680 is formed by stacking a first substrate 360, a first adhesive insulating layer 350, an insulating layer 340, an electrode layer including the electrode 312 and the end electrode 110, an electron injection layer 303 corresponding to the first buffer layer, an active layer 301, a hole injection layer 302 corresponding to the second buffer layer, a second adhesive insulating layer 430, and a second substrate 440. The detection region 680 includes the organic photodiode OPD and can be said to be a region that functions as a photosensor that detects light.

[0048] 5 have the same configuration as terminals 503, 504, 505, 506, 507, 508, 509, 510, and 511, except that they are not connected to the configuration corresponding to wiring 331 shown in FIG. Hereinafter, when referred to as terminal section 500, it refers to the portion where terminals 503, 504, 505, 506, 507, 508, 509, 510, and 511 and unwired terminals 501, 502, and 512 are provided. Note that all of the terminals included in terminal section 500 may be connected to the configuration corresponding to wiring 331, or some of them may not be connected to the configuration corresponding to wiring 331, such as unwired terminals 501, 502, and 512. However, one or more of the terminals included in terminal section 500 are connected to the configuration corresponding to wiring 331. Terminals such as terminals 503, 504, 505, 506, 507, 508, 509, 510, and 511 that are connected to components corresponding to the wiring 331 correspond to first terminals.

[0049] In the embodiment, the end electrode 110 functioning as a terminal of the terminal portion 500 and the electrodes 11 and 312 functioning as electrodes connected to the organic photodiode OPD are both included in the same electrode layer laminated on the insulating layer 320. That is, in the embodiment, the conductive portions of the terminals 503, 504, ..., 511 functioning as first terminals and the unwired terminals 501, 502, 512 are in the same layer as the electrode layer of the organic photodiode OPD.

[0050] 4, the pressure-bonded portion 620 side is composed of the wiring portion 33, the insulating layer 340, the first adhesive insulating layer 350, and the first substrate 360. In other words, the pressure-bonded portion 620 side does not include the organic photodiode OPD, the adhesive layer 410, or the additional structure-maintaining portion 450. Therefore, a step is generated across the boundary line 600 between the base portion 610 side, which includes the organic photodiode OPD, the adhesive layer 410, and the additional structure-maintaining portion 450, and the terminal, on which the organic photodiode OPD, the adhesive layer 410, and the additional structure-maintaining portion 450 are not stacked. A gap 670 indicates the presence of this step.

[0051] In addition, in the description of the embodiment, the configuration on the side of the pressure-bonded portion 620 from the reference position 630 shown in FIG. 4 will be particularly described in FIG. 6 and subsequent figures. The reference position 630 is the boundary between the portion on the base portion 610 side of the boundary line 600 that satisfies the first and second conditions and the portion that does not satisfy the first condition. The first condition is that the electrode 11, the electrode 312, and the organic photodiode OPD are not included. The second condition is that the additional structure-maintaining portion 450 and the insulating layer 340 are not included. The portion between the boundary line 600 and the reference position 630 satisfies the first and second conditions. Furthermore, most of the portion between the boundary line 600 and the reference position 630 includes the adhesive layer 410. However, even in the portion between the boundary line 600 and the reference position 630, there is a portion near the boundary line 600 that does not have the adhesive layer 410.

[0052] The organic photodiode OPD is electrically connected to the control circuit 122 and the power supply circuit 123 provided on the circuit board 70 by crimping a terminal arranged on the terminal portion 500 of the sensor substrate 21 to a terminal 720 formed on the circuit board 70 (see FIG. 7 , etc.). This crimping is performed on the crimped portion 620 side of the reference position 630. After this crimping, the sensor substrate 21 and the circuit board 70 overlap in plan view, as shown in FIG. 3 . If the circuit board 70 is considered a third substrate, the terminal 720 corresponds to the second terminal. Furthermore, the terminals 503, 504, 505, 506, 507, 508, 509, 510, and 511, which correspond to the first terminals, can be said to be connected to the second terminals. Furthermore, the detection region 680 in which the organic photodiode OPD is provided, as in the first optical sensor 10A and the second optical sensor 10B, overlaps the circuit board 70. Hereinafter, when the term "crimping of the terminal portion 500 and the terminal 720" is used, it refers to the crimping of the terminal arranged on the terminal portion 500 of the sensor board 21 and the terminal 720 formed on the circuit board 70.

[0053] In Figure 4 and other figures, the position in the second direction Dy of the end of the electrode 11 closest to the boundary line 600 in this embodiment is shown as a reference position 630. Hereinafter, the configuration on the pressure-bonded portion 620 side of the reference position 630 will be described with reference to Figures 6 to 9. In the following description, the term "non-detection region 599" refers to a portion of the sensor substrate 21 on the pressure-bonded portion 620 side of the reference position 630. As shown in Figure 4, the non-detection region 599 is formed by stacking the first substrate 360, the first adhesive insulating layer 350, the insulating layer 340, the second adhesive insulating layer 430, and the second substrate 440. The non-detection region 599 does not have a configuration that functions as a photosensor that detects light, such as an organic photodiode OPD, and therefore corresponds to a non-detection region that does not function as a photosensor. The non-detection region 599 can also be said to have a terminal portion 500 provided with terminals 503, 504, ..., 511 that function as first terminals electrically connected to the portions of the electrode layer that are provided on the organic photodiode OPD (electrode 11, electrode 312). The non-detection region 599 includes the entire pressure-bonded portion 620 side and a part of the base portion 610 side.

[0054] FIG. 6 is a plan view schematically illustrating the layered structure of the non-detection region 599 in the embodiment. In FIG. 6 and FIGS. 9 , 11 , 14 , and 15 described below, a “first layer,” a “second layer,” a “third layer,” a “fourth layer,” a “fifth layer,” and a “terminal portion” are illustrated side by side. The “first layer” refers to the first substrate 360 ​​in the layered structure of the sensor substrate 21 described with reference to FIG. 4 , which is closer to the pressure-bonded portion 620 than the reference position 630, from a planar perspective. The “second layer” refers to the first adhesive insulating layer 350 in the layered structure of the sensor substrate 21 described with reference to FIG. 4 , which is closer to the pressure-bonded portion 620 than the reference position 630, from a planar perspective. The “third layer” refers to the insulating layer 340 in the layered structure of the sensor substrate 21 described with reference to FIG. 4 , which is closer to the pressure-bonded portion 620 than the reference position 630, from a planar perspective. The "fourth layer" indicates, from a planar perspective, the adhesive layer 410 on the pressure-bonded portion 620 side of the reference position 630 in the laminated structure of the sensor substrate 21 described with reference to FIG. 4 . The "fifth layer" indicates, from a planar perspective, the additional structure-retaining portion 450 on the pressure-bonded portion 620 side of the reference position 630 in the laminated structure of the sensor substrate 21 described with reference to FIG. 4 . The "terminal portion" indicates, from a planar perspective, the non-detection region 599. As shown in FIG. 4 , the configuration illustrated as the "terminal portion" is a configuration in which the first substrate 360, the first adhesive insulating layer 350, the insulating layer 340, the wiring portion 33, the adhesive layer 410, and the additional structure-retaining portion 450 are laminated in this order in the third direction Dz from the first substrate 360 ​​side toward the additional structure-retaining portion 450 side. Hereinafter, when referring to FIG. 6 and the like, unless otherwise specified, this refers to FIG. 6 as well as FIGS. 9, 11, 14, and 15 described below.

[0055] 6, the first substrate 360 ​​of the embodiment has a rectangular shape in a plan view on the side of the pressure-bonded portion 620 from the reference position 630. Specifically, the first substrate 360 ​​has dimensions in the first direction Dx and the second direction Dy that cover the entire rectangular non-detection region 599 in a plan view.

[0056] As shown by "second layer" in FIG. 6 , the first adhesive insulating layer 350 of the embodiment has a stripe shape in a plan view. Specifically, the first adhesive insulating layer 350 has three or more adhesive portions whose longitudinal directions are along the first direction Dx and arranged in the second direction Dy. A gap is provided between two of the three or more adhesive portions that are adjacent in the second direction Dy. The longitudinal direction of the gap is along the second direction Dy. The number of gaps is the number of adhesive portions arranged in the second direction Dy minus one. In the embodiment, the first substrate 360 ​​and the insulating layer 340 are bonded by the adhesive portions of the first adhesive insulating layer 350. The gaps in the first adhesive insulating layer 350 function as non-adhesive portions in the first adhesive insulating layer 350.

[0057] In the non-detection region 599, the widths in the first direction Dx of the adhesive portions and non-adhesive portions of the first adhesive insulating layer 350 are the same as those of the first substrate 360. Furthermore, the widths D1 and D2 shown in FIG. 6 are smaller than the width D3. The width D1 is the width in the arrangement direction of the adhesive portions of the first adhesive insulating layer 350, i.e., the width of the adhesive portions in the second direction Dy. The width D2 is the width in the arrangement direction of the non-adhesive portions of the first adhesive insulating layer 350, i.e., the width in the second direction Dy of the gaps between the adhesive portions of the first adhesive insulating layer 350. The width D3 is the width in the arrangement direction of the multiple terminals (terminals 503, 504, ..., 511 and unwired terminals 501, 502, 512) provided as the terminal unit 500, i.e., the width of the multiple terminals in the first direction Dx. Note that width D3 is, for example, about 1 millimeter (mm), and width D1 and width D2 are less than 1 millimeter (for example, about 0.5 millimeters), but these are merely examples and are not limited to the widths exemplified here and can be changed as appropriate.

[0058] 6, the insulating layer 340 of the embodiment has a rectangular shape in plan view in the direction of the reference position 630 toward the pressure-bonded portion 620. Specifically, the insulating layer 340 has dimensions in the first direction Dx and the second direction Dy that cover the entire rectangular non-detection region 599 in plan view.

[0059] As shown by "fourth layer" in FIG. 6 , the adhesive layer 410 of the embodiment, closer to the pressure-bonded portion 620 than the reference position 630, has a rectangular shape in a plan view. Regarding the shape of the adhesive layer 410, the portion closer to the pressure-bonded portion 620 than the reference position 630 will be described in comparison with the insulating layer 340. The adhesive layer 410 has the same dimension in the first direction Dx as the insulating layer 340, but is shorter in the second direction Dy than the insulating layer 340. In other words, the width of the adhesive layer 410 in the second direction Dy, with the reference position 630 as one end, is smaller than that of the insulating layer 340. The width in the second direction Dy, with the reference position 630 as one end, can be said to be the degree of extension in the second direction Dy from the reference position 630 toward the pressure-bonded portion 620.

[0060] As shown by "fifth layer" in Figure 6, the portion of the additional structure-retaining portion 450 of the embodiment closer to the pressure-bonded portion 620 than the reference position 630 is rectangular in plan view. Regarding the portion closer to the pressure-bonded portion 620 than the reference position 630, the shape of the additional structure-retaining portion 450 will be described in comparison with the insulating layer 340 and the adhesive layer 410. The additional structure-retaining portion 450 has the same dimension in the first direction Dx as the insulating layer 340 and the adhesive layer 410, but is shorter than the insulating layer 340 and longer than the adhesive layer 410 in the second direction Dy. In other words, the width of the additional structure-retaining portion 450 in the second direction Dy, with one end at the reference position 630, is smaller than that of the insulating layer 340 and larger than that of the adhesive layer 410.

[0061] As shown in the “terminal portion” of FIG. 6 , the non-detection region 599 of the embodiment has a first portion 515 , a second portion 520 , and a third portion 530 .

[0062] Explaining the correspondence with Fig. 4 , the first portion 515 and the second portion 520 are closer to the base portion 610 than the boundary line 600. The terminal portion 500 and the third portion 530 are closer to the crimped portion 620 than the boundary line 600. The boundary between the second portion 520 and the third portion 530 corresponds to the boundary line 600. Note that Fig. 6 and other figures schematically illustrate only the portion of the wiring extending from the terminal portion 500 toward the reference position 630, that is, the wiring formed by the end electrode 110 and the wiring 331 described with reference to Figs. 4 and 5 , up to the second portion 520, and the portion within the range of the first portion 515 is not illustrated.

[0063] The first portion 515 is a portion where the first substrate 360, first adhesive insulating layer 350, insulating layer 340, wiring portion 33, adhesive layer 410, and additional structural maintaining portion 450 overlap. The second portion 520 is a portion where the first substrate 360, first adhesive insulating layer 350, insulating layer 340, wiring portion 33, and additional structural maintaining portion 450 overlap. That is, the second portion 520 does not include the adhesive layer 410. The third portion 530 is a portion where the first substrate 360, first adhesive insulating layer 350, insulating layer 340, and wiring portion 33 overlap. That is, the third portion 530 does not include the adhesive layer 410 and the additional structural maintaining portion 450. The terminal portion 500 is located within the third portion 530 in a plan view. Therefore, the terminal portion 500 does not overlap with the adhesive layer 410 and the additional structural maintaining portion 450. Here, the additional structure-maintaining portion 450 includes the insulating layer 420, the second adhesive insulating layer 430, and the second substrate 440. Therefore, the terminal portion 500 does not overlap the second adhesive insulating layer 430 and the second substrate 440.

[0064] Fig. 7 is a cross-sectional view taken along line VII-VII of the "terminal portion" in Fig. 6. Fig. 7 includes a Dy-Dz cross-sectional view of terminal portion 500. Note that Fig. 7 is a cross-sectional view at the position of terminal 504 in terminal portion 500, and therefore terminal 504 is illustrated as an example, but the Dy-Dz cross-sectional views of terminal portion 500 other than terminal 504 are similar to the Dy-Dz cross-sectional view of terminal 504.

[0065] 4, the terminal portion 500 is formed in the wiring portion 33. Also, as described with reference to Fig. 6, the third portion 530 where the terminal portion 500 is located overlaps the first substrate 360, the first adhesive insulating layer 350, and the insulating layer 340.

[0066] 7, the first substrate 360, the first adhesive insulating layer 350, and the insulating layer 340 are aligned along one end 71 of the circuit board 70, together with the adhesive layer 410 and the additional structural maintaining portion 450, on the side of the base portion 610 closer to the boundary line 600. Also, the first substrate 360, the first adhesive insulating layer 350, and the insulating layer 340 are aligned along one end 71 of the circuit board 70, on the side of the crimped portion 620 closer to the boundary line 600, in a curved shape, and the portion relatively farther from the boundary line 600 is aligned along the one end 71. This is because the terminal portion 500 and the terminal 720 are crimped together by the pressure 901 from the crimping head 900.

[0067] Fig. 8 is a cross-sectional view of the "terminal portion" taken along line VIII-VIII in Fig. 6. Fig. 8 includes a cross-sectional view of the terminal portion 500 taken along line Dx-Dz.

[0068] The one end 71 has a plurality of terminals 720. The pitch of the plurality of terminals 720 arranged in one direction (the first direction Dx shown in FIGS. 7 and 8 ) corresponds to the pitch of the plurality of terminals arranged in one direction (the first direction Dx shown in FIGS. 7 and 8 ) in the terminal section 500. In the embodiment, the terminal section 500 is provided with 12 terminals (nine of which are connected to the wiring 331), and therefore the number of terminals 720 is also 12. Note that the number of terminals in the terminal section 500 and the number of terminals 720 are not limited to 12, and may be 11 or less, or 13 or more.

[0069] The terminal 720 is electrically connected to the conductive layer 703 of the one end 71. The one end 71 has a layered structure including a conductive layer such as the conductive layer 703 and insulating layers such as the insulating layers 701 and 702 that face each other across the conductive layer. In FIG. 8 , the insulating layers 701 and 702 face each other in the third direction Dz, sandwiching one conductive layer 703, and the one end 71 has a single conductive layer. However, the specific configuration of the one end 71 is not limited to this. The one end 71 may have multiple conductive layers. An insulating layer is interposed between the multiple conductive layers. Wiring is formed in the conductive layer such as the conductive layer 703. The wiring electrically connects the terminal 720 to circuits such as the control circuit 122 and the power supply circuit 123.

[0070] In the embodiment, a recess 800 is formed around the terminal 720. The recess 800 is an insulating layer that is exposed on the sensor substrate 21 side out of the insulating layer provided at the one end 71, and is a recess in the third direction Dz that is formed in the range where the terminal 720 is formed and around this range when viewed from a plan view. In the example shown in FIGS. 8 and 9 , the insulating layer that is exposed on the sensor substrate 21 side is the insulating layer 701. It can be said that the terminal 720 protrudes in the third direction Dz towards the sensor substrate 21 side, with the Dx-Dy plane of the recess 800 as the reference.

[0071] The terminal portion 500 and the terminal 720 are pressure-bonded with an intervening layer 730 sandwiched therebetween. The intervening layer 730 is an anisotropic conductive film, for example, an anisotropic conductive film (ACF). The intervening layer 730 includes, for example, a plurality of conductive particles. The conductive particles are minute particulate conductors. When the conductive particles are considered as spheres, their diameter is, for example, about 5 μm. Note that the thickness of the intervening layer 730 in the third direction Dz before pressure-bonding is, for example, about 25 μm, but becomes about 5 μm after pressure-bonding.

[0072] In FIG. 8 , a configuration including an intervening layer 730 and an unwired terminal 501 crimped to a terminal 720 via the intervening layer 730 is shown as a crimped portion 801. The crimped portion 80n has the same configuration as the crimped portion 801, except that the unwired terminal 501 is replaced with the unwired terminal 50n or a symbol attached to the terminal. For example, when n = 2, the crimped portion 802 has the same configuration as the crimped portion 801, except that the unwired terminal 501 is replaced with the unwired terminal 502. In an embodiment, n is a natural number ranging from 2 to 12. The maximum value of n corresponds to the total number of terminals and unwired terminals provided in the terminal portion 500 and the number of terminals 720. In an embodiment, when n is a natural number ranging from 3 to 11, the description of the unwired terminal 50n is replaced with the description of the terminal (terminals 503, 504, ..., 511).

[0073] When crimping the terminal portion 500 and the terminals 720, the crimping head 900 is pressed against the sensor substrate 21 from the side where the terminal portion 500 on the sensor substrate 21 faces the plurality of terminals 720 on one end 71.

[0074] In this embodiment, as shown in FIGS. 7 and 8 , the crimping head 900 is a crimping head that is pressed against the sensor substrate 21 on the side of the crimped portion 620 relative to the boundary line 600. The crimping head 900 is disposed opposite the terminal portion 500 across the first substrate 360, the first adhesive insulating layer 350, and the insulating layer 340, and applies a pressing force 901 to the sensor substrate 21 to press the sensor substrate 21 toward the one end 71. Although not shown in FIGS. 7 and 8 , the one end 71 is placed on a work table that is aligned with the Dx-Dy plane. The one end 71 is in contact with the work table on the insulating layer 702 side, so that the one end 71 is supported so that it is aligned entirely along the Dx-Dy plane. In this state, the crimping head 900 applies the pressing force 901 to the sensor substrate 21 between the one end 71 and the crimping head 900, thereby crimping the terminal portion 500 and the terminal 720 together.

[0075] When crimping the terminal portion 500 and the terminal 720, the crimping head 900 is heated to a temperature significantly higher than room temperature and pressed against the sensor substrate 21. To give a specific example, the temperature of the crimping head 900 when crimping the terminal portion 500 and the terminal 720 is about 240°C. When the crimping head 900 at this temperature is pressed against the sensor substrate 21, the intervening layer 730 between the terminal portion 500 and the terminal 720 is heated to about 170°C, and the terminal portion 500 and the terminal 720 are joined together.

[0076] As an example of the thickness in the third direction Dz of each of the components included in the sensor substrate 21, the first substrate 360 ​​is approximately 20 μm. The first adhesive insulating layer 350 is approximately 20 μm. The insulating layer 340 is approximately 10 μm. The adhesive layer 410 is approximately 20 μm. That is, the thickness in the third direction Dz of the laminated structure of an insulating layer such as the insulating layer 340, an adhesive insulating layer such as the first adhesive insulating layer 350, and a substrate such as the first substrate 360 ​​is approximately 50 μm in this embodiment. The thickness in the third direction Dz of the additional structure maintaining portion 450 is also approximately 50 μm in this embodiment.

[0077] In the embodiment, the first substrate 360 ​​and the first adhesive insulating layer 350 are provided on the sensor substrate 21 during the crimping process of bonding the terminal portion 500 and the terminal 720. The first substrate 360 ​​and the first adhesive insulating layer 350 suppress warping of the insulating layer 340 and the wiring portion 33 on the side of the boundary line 600 that is closer to the crimped portion 620. Specifically, in the sensor substrate 21, substrates that function as structure maintaining layers, such as the first substrate 360 ​​and the second substrate 440, have rigidity that maintains the overall shape of the sensor substrate 21 in a state that is generally along the Dx-Dy plane. Meanwhile, on the side of the sensor substrate 21 that is closer to the crimped portion 620 than the boundary line 600 where the additional structure maintaining portion 450 is not provided, the first substrate 360 ​​maintains the structure with its rigidity.

[0078] Furthermore, the first adhesive insulating layer 350 has a striped pattern and is not in contact over the entire surface with the insulating layer 340 and the first substrate 360. That is, the first adhesive insulating layer 350 has "adhesive portions that are in contact with the first substrate 360 ​​on one side and with the insulating layer 340 on the other side" and "non-adhesive portions that are gaps between the first substrate 360 ​​and the insulating layer 340" that are alternately arranged along a direction perpendicular to the stacking direction (third direction Dz) in the stacked structure that constitutes the sensor substrate 21.

[0079] According to this embodiment, it is possible to more reliably crimp the terminal portion 500 and the terminal 720. Hereinafter, a comparative example in which the first adhesive insulating layer 350 is located within the range in which the pressing force 901 is applied from the crimping head 900 will be described with reference to FIGS.

[0080] 9 is a plan view schematically showing the layered structure of a non-detection region 599 in a comparative example. In the comparative example, the first adhesive insulating layer 350 of the embodiment is replaced with a first adhesive insulating layer 359. The first adhesive insulating layer 359 has the same configuration as the first adhesive insulating layer 350, except for its shape in a plan view.

[0081] As shown by "Terminal Portion" in Figure 9, the non-detection region 599 of this embodiment has a first portion 519, a second portion 529, and a third portion 539. The first portion 519 is similar to the first portion 515, except that the first adhesive insulating layer 350 has been replaced with the first adhesive insulating layer 359. The second portion 529 is similar to the second portion 520, except that the first adhesive insulating layer 350 has been replaced with the first adhesive insulating layer 359. The third portion 539 is similar to the third portion 530, except that the first adhesive insulating layer 350 has been replaced with the first adhesive insulating layer 359.

[0082] Specifically, in the embodiment, the first adhesive insulating layer 350 is striped and has adhesive and non-adhesive portions, but in the comparative example, the first adhesive insulating layer 359 is rectangular and has the same dimensions as the first substrate 360 ​​and insulating layer 340, and has no gaps, as shown as the "second layer" in Figure 9.

[0083] FIG. 10 is an X-X cross-sectional view of the "terminal portion" in FIG. 9 . In the comparative example, as shown in the relationship between the "second layer" and the "terminal portion" in FIG. 10 and in FIG. 11 , the first adhesive insulating layer 359 and the terminal portion 500 overlap with no gaps in a plan view. That is, within the range where the pressing force 901 is applied from the crimping head 900, the first adhesive insulating layer 359 bonds the first substrate 360 ​​and the insulating layer 340 without any gaps. In this comparative example, the first adhesive insulating layer 359 interposed between the crimping head 900 and the terminal portion 500 softens due to the heat from the crimping head 900 and deforms under the pressing force 901. This deformation of the first adhesive insulating layer 359 disperses part of the pressing force 901 to a vector in a direction different from the vector in the direction in which the terminal of the terminal portion 500 and the terminal 720 are crimped together. For this reason, in the comparative example, the terminal of the terminal portion 500 may not be sufficiently crimped together with the terminal 720.

[0084] In contrast, in the embodiment, as described above, the first adhesive insulating layer 350 has a structure in which "adhesive portions that abut on one side with the first substrate 360 ​​and on the other side with the insulating layer 340" and "non-adhesive portions that are gaps between the first substrate 360 ​​and the insulating layer 340" are alternately arranged along a direction perpendicular to the stacking direction (third direction Dz) in the stacked structure that constitutes the sensor substrate 21. In other words, the first adhesive insulating layer 350 within the range where the pressing force 901 is applied from the crimping head 900 is smaller than in the comparative example. This makes it easier to prevent the pressing force 901 from dispersing into vectors in other directions than in the comparative example. Therefore, more reliable crimping between the terminal portion 500 and the terminal 720 can be achieved.

[0085] In the embodiment, after the crimping step of bonding the terminal portion 500 and the terminal 720 to each other, the first substrate 360 ​​and the first adhesive insulating layer 350 are peeled off from the sensor substrate 21. That is, after the crimping step, a step of peeling off the first substrate 360 ​​and the first adhesive insulating layer 350 from the sensor substrate 21 occurs. To give a specific example, an operator grasps the ends of the first substrate 360 ​​and the first adhesive insulating layer 350 of the sensor substrate 21 and physically peels off the first substrate 360 ​​and the first adhesive insulating layer 350 from the sensor substrate 21, thereby peeling off the first substrate 360 ​​and the first adhesive insulating layer 350 from the sensor substrate 21. The sensor substrate 21 after the first substrate 360 ​​and the first adhesive insulating layer 350 have been peeled off includes a detection region 680 functioning as an optical sensor, in which the insulating layer 340, the electrode layer including the electrode 312, the electron injection layer 303 corresponding to the first buffer layer, the active layer 301, the hole injection layer 302 corresponding to the second buffer layer, the second adhesive insulating layer 430, and the second substrate 440 are stacked, and a non-detection region 599 in which the insulating layer 340, the second adhesive insulating layer 430, and the second substrate 440 are stacked. In addition, in the sensor substrate 21, a terminal portion 500 in the non-detection region 599 is provided with terminals 503, 504, ..., 511 functioning as first terminals electrically connected to the electrode 312, and does not overlap the second adhesive insulating layer 430 and the second substrate 440.

[0086] Fig. 11 is a plan view schematically showing the layered structure of the non-detection area 599 in the sensor substrate 21 after the step of peeling off the first substrate 360 ​​and the first adhesive insulating layer 350 from the sensor substrate 21. Fig. 12 is a cross-sectional view taken along XII-XII in Fig. 11. Fig. 13 is a cross-sectional view taken along XIII-XIII in Fig. 11.

[0087] 6, the first substrate 360 ​​and the first adhesive insulating layer 350 are still present on the sensor substrate 21, but in Fig. 11, the first substrate 360 ​​and the first adhesive insulating layer 350 have been peeled off and are therefore not provided. That is, after the step of peeling off the first substrate 360 ​​and the first adhesive insulating layer 350 from the sensor substrate 21, it is the insulating layer 340 that is exposed to the outside on the opposite side of the wiring portion 33 from the organic photodiode OPD.

[0088] In the "first layer" of Fig. 11, the first substrate 360 ​​has been peeled off and is shown by a dashed rectangle 368. In the "second layer" of Fig. 11, the first adhesive insulating layer 350 has been peeled off and is shown by a dashed rectangle 358.

[0089] As shown in the "terminal portion" of Figure 11, the non-detection area 599 after the process of peeling off the first substrate 360 ​​and the first adhesive insulating layer 350 from the sensor substrate 21 has a first portion 518, a second portion 528, and a third portion 538.

[0090] The first portion 518 is an overlapping portion of the insulating layer 340, the wiring portion 33, the adhesive layer 410, and the additional structural maintaining portion 450. The second portion 528 is an overlapping portion of the insulating layer 340, the wiring portion 33, and the additional structural maintaining portion 450. The third portion 538 is an overlapping portion of the insulating layer 340 and the wiring portion 33. In other words, the third portion 538 does not include the adhesive layer 410 or the additional structural maintaining portion 450.

[0091] Before the terminal portion 500 and the terminal 720 are crimped together, the first substrate 360 ​​maintains the structure of the sensor substrate 21 on the side of the crimped portion 620 relative to the boundary line 600, where the additional structure maintaining portion 450 is not provided. In contrast, after the terminal portion 500 and the terminal 720 are crimped together, the insulating layer 340 including the terminal portion 500 is supported by the one end 71, thereby stabilizing the shape of the insulating layer 340. Therefore, after the terminal portion 500 and the terminal 720 are crimped together, the first substrate 360 ​​for maintaining the structure on the side of the crimped portion 620 relative to the boundary line 600 is no longer necessary. By peeling off the first substrate 360 ​​and the first adhesive insulating layer 350, the thickness in the third direction Dz of the "structure in which the sensor substrate 21 and the circuit board 70 overlap" integrated by the crimping of the terminal portion 500 and the terminal 720 can be made thinner.

[0092] Before the terminal portion 500 and the terminal 720 are crimped together, the sensor substrate 21 is formed in a state in which the first substrate 360 ​​is adhered to the insulating layer 340 by the first adhesive insulating layer 350. That is, a substrate formation process is performed to form a substrate in which the first substrate 360, the first adhesive insulating layer 350, the insulating layer 340, the electrode layer including the electrode 312, the electron injection layer 303 corresponding to the first buffer layer, the active layer 301, the hole injection layer 302 corresponding to the second buffer layer, the second adhesive insulating layer 430, and the second substrate 440 are arranged in this order from one side to the other in the stacking direction. After the substrate formation process, a crimping process is performed in which a plurality of terminals 503, 504, ..., 511 formed in "an area where the first buffer layer, the active layer 301, the second buffer layer, the second adhesive insulating layer 430, and the second substrate 440 are not stacked" (non-detection area 599) of the sensor substrate 21 are crimped to a plurality of external terminals (terminals 720) provided on an external substrate (circuit board 70). After the crimping process, a process is performed in which the first substrate 360 ​​and the insulating layer 340 are peeled off from the sensor substrate 21.

[0093] As described above, according to the embodiment, the detection device 1 includes a detection region 680 that functions as an optical sensor and is formed by stacking the insulating layer 340, the electrode layer including the electrode 312 and the end electrode 110, the electron injection layer 303 corresponding to the first buffer layer, the active layer 301, the hole injection layer 302 corresponding to the second buffer layer, the second adhesive insulating layer 430, and the second substrate 440, and a non-detection region 599 that is formed by stacking the insulating layer 340, the second adhesive insulating layer 430, and the second substrate 440. Of the non-detection region 599, a terminal section 500 that includes first terminals (terminals 503, 504, ..., 511) electrically connected to the electrode layer (electrode 11, electrode 312) does not overlap the second adhesive insulating layer 430 and the second substrate 440. This allows for a thinner detection device 1 to be provided than the comparative example that includes the first substrate 360 ​​and the first adhesive insulating layer 350.

[0094] Furthermore, the first terminals (terminals 503, 504, ..., 511) are connected to second terminals (terminals 720) provided on an external substrate (circuit substrate 70), and the detection area 680 overlaps with the circuit substrate 70. This allows the substrate provided in the detection device 1 to be made more compact in plan view.

[0095] Furthermore, the first terminals (terminals 503, 504, ..., 511) are in the same layer as the electrode layer including the electrodes 11 and 312. This allows the process of forming the first terminals to be combined with the process of forming the electrodes 11 and 312 when manufacturing the sensor substrate 21. This allows the number of manufacturing processes for the sensor substrate 21 to be reduced.

[0096] The optical sensor in the detection region 680 is an organic photodiode OPD. This makes it possible to detect multiple wavelengths of light without using a color filter. The organic photodiode OPD has advantages over other types of optical sensors in that it can be formed on a flexible substrate such as the sensor substrate 21 and it is relatively easy to enlarge the detection region 680.

[0097] Furthermore, according to the embodiment, the manufacturing method of the detection device 1 includes the steps of: forming a substrate in which the first substrate 360, the first adhesive insulating layer 350, the insulating layer 340, the electrode layer including the electrode 312, the electron injection layer 303 corresponding to the first buffer layer, the active layer 301, the hole injection layer 302 corresponding to the second buffer layer, the second adhesive insulating layer 430, and the second substrate 440 are arranged in this order from one side to the other in the stacking direction (third direction Dz); crimping a plurality of terminals 503, 504, ..., 511 formed in "a region of the sensor substrate 21 where the first buffer layer, the active layer 301, the second buffer layer, the second adhesive insulating layer 430, and the second substrate 440 are not stacked" (non-detection region 599) to a plurality of external terminals (terminals 720) provided on the external substrate (circuit board 70); and peeling off the first substrate 360 ​​and the insulating layer 340 from the sensor substrate 21. The first adhesive insulating layer 350 has an adhesive portion that abuts the first substrate 360 ​​on one side and an adhesive portion that abuts the insulating layer 340 on the other side, and a non-adhesive portion that is a gap between the first substrate 360 ​​and the insulating layer 340, which are alternately arranged in a direction perpendicular to the stacking direction (e.g., the second direction Dy). In this way, by peeling off the first substrate 360 ​​and the first adhesive insulating layer 350, it is possible to manufacture a detection device 1 that is thinner than the comparative example that has the first substrate 360 ​​and the first adhesive insulating layer 350. Furthermore, because the first substrate 360 ​​overlaps the terminal portion 500 when the multiple terminals 503, 504, ..., 511 are crimped to the multiple external terminals (terminals 720), crimping can be performed under favorable conditions that suppress deformation of the insulating layer 340, such as warping of the insulating layer 340 in the non-detection region 599 including the terminal portion 500, which may hinder crimping.

[0098] Furthermore, the width D1 of the adhesive portion and the width D2 of the non-adhesive portion of the first adhesive insulating layer 350 are smaller than the width D3, which is the width in the arrangement direction of the terminals 503, 504, ..., 511. Here, the width D1 and the width D2 are the widths in the arrangement direction of the adhesive portion and the non-adhesive portion. This makes it easier to apply the pressing force 901 to the sensor substrate 21 more uniformly.

[0099] Furthermore, since the first adhesive insulating layer 350 has a striped shape, the first substrate 360 ​​and the first adhesive insulating layer 350 can be more easily peeled off from the sensor substrate 21 .

[0100] 12 and 13 , it is also possible to apply a pressing force 901 by pressing a crimping head 900 from the sensor substrate 21 side against the insulating layer 340 in a state where the first substrate 360 ​​and the first adhesive insulating layer 350 are not provided. In this case, however, if the insulating layer 340 warps and no longer conforms to the plate surface (Dx-Dy plane) of the circuit board 70, it becomes relatively difficult to crimp the terminal portion 500 and the terminal 720. For this reason, as described above, the first substrate 360 ​​is attached to the insulating layer 340 with the first adhesive insulating layer 350 before crimping, and then the first substrate 360 ​​and the first adhesive insulating layer 350 are peeled off from the insulating layer 340 after crimping, thereby enabling crimping to be performed under better conditions.

[0101] The structure of the first adhesive insulating layer 350 that bonds the first substrate 360 ​​and the insulating layer 340 together is not limited to a striped shape. Other examples of such a structure will be described below with reference to FIGS. 14 and 15 .

[0102] FIG. 14 is a diagram showing a configuration example in which the first adhesive insulating layer 350 shown in FIG. 6 has been replaced with a first adhesive insulating layer 357. In the example shown in FIG. 14 , as indicated by “second layer,” the first adhesive insulating layer 350 of the “second layer” in FIG. 6 has been replaced with the first adhesive insulating layer 357. The first adhesive insulating layer 357 has adhesive portions and non-adhesive portions arranged alternately in a checkerboard pattern when viewed from a plan view. Specifically, the first adhesive insulating layer 357 has an adhesive portion 3571 that abuts the first substrate 360 ​​on one side in the third direction Dz and abuts the insulating layer 340 on the other side. The first adhesive insulating layer 357 also has a non-adhesive portion 3572 that is a gap between the first substrate 360 ​​and the insulating layer 340. The adhesive portions 3571 and the non-adhesive portions 3572 are arranged alternately along the first direction Dx and the second direction Dy. The direction in which the adhesive portion 3571 and the non-adhesive portion 3572 are aligned may be a direction intersecting the first direction Dx and the second direction Dy. The width of the adhesive portion 3571 and the width of the non-adhesive portion 3572 in the alignment direction of the adhesive portion 3571 and the non-adhesive portion 3572 may be smaller than the width D3 or larger than the width D3.

[0103] As shown in "Terminal portion" in FIG. 14 , the non-detection region 599 of the embodiment has a first portion 517, a second portion 527, and a third portion 537. The first portion 517 is similar to the first portion 515, except that the first adhesive insulating layer 350 is replaced with the first adhesive insulating layer 357. The second portion 527 is similar to the second portion 520, except that the first adhesive insulating layer 350 is replaced with the first adhesive insulating layer 357. The third portion 537 is similar to the third portion 530, except that the first adhesive insulating layer 350 is replaced with the first adhesive insulating layer 357. As described above, except for points noted otherwise, the configuration of the example shown in FIG. 14 is similar to the configuration described with reference to FIG. 6 .

[0104] FIG. 15 is a diagram showing a configuration example in which the first adhesive insulating layer 350 shown in FIG. 6 has been replaced with a first adhesive insulating layer 356. In the example shown in FIG. 15 , as indicated by “second layer,” the first adhesive insulating layer 350 of the “second layer” in FIG. 6 has been replaced with the first adhesive insulating layer 356. The first adhesive insulating layer 356 in the non-detection region 599 has adhesive portions along three sides of the edge of the non-detection region 599 that are the outer periphery of the sensor substrate 21. In other words, a non-adhesive portion 3561 on the inside of the three sides is a gap between the first substrate 360 ​​and the insulating layer 340. Therefore, the first adhesive insulating layer 356 has one of two sides that face each other in the first direction Dx, with the non-adhesive portion 3561 sandwiched therebetween, aligned with the other of the two sides. Here, the two sides are adhesive portions that abut on one side with the first substrate 360 ​​and on the other side with the insulating layer 340. Therefore, the adhesive portion that is one of the two sides, the non-adhesive portion 3561, and the adhesive portion that is the other of the two sides are arranged alternately. Furthermore, it can be said that the first adhesive insulating layer 356 has two sides that face each other across the terminal portion 500 on which a plurality of terminals (503, 504, ..., 511) are arranged, and one side that connects one ends of the two sides together.

[0105] As shown by "terminal portion" in FIG. 15 , the non-detection region 599 of this embodiment has a first portion 516, a second portion 526, a third portion 536, and a fourth portion 546. The first portion 516 is similar to the first portion 515 except that the first adhesive insulating layer 350 is replaced with a non-adhesive portion 3561. The second portion 526 is similar to the second portion 520 except that the first adhesive insulating layer 350 is replaced with a non-adhesive portion 3561. The third portion 536 is similar to the third portion 530 except that the first adhesive insulating layer 350 is replaced with a non-adhesive portion 3561. The fourth portion 546 is a portion along the outer periphery of the non-detection region 599, where the first substrate 360 ​​and the insulating layer 340 are adhered by the first adhesive insulating layer 356. As described above, except for the points specifically mentioned, the configuration according to the example shown in FIG. 15 is the same as the configuration described with reference to FIG.

[0106] 6 , 14 , and 15 have shown the shape of the first adhesive insulating layer, which adheres the first substrate 360 ​​and the insulating layer 340 in the non-detection area 599, in a plan view, but the shape of the first adhesive insulating layer is common to the entire sensor substrate 21. Even if the first adhesive insulating layer has a checkerboard pattern, a dot pattern, or a frame shape, it becomes easier to peel the first substrate 360 ​​and the first adhesive insulating layer 350 from the sensor substrate 21, just like when it has a stripe pattern.

[0107] 16 is a diagram showing the relationship between the shape of the sensor substrate 21 in plan view and the shape, in plan view, of the first adhesive insulating layer that bonds the first substrate 360 ​​and the insulating layer 340 in the sensor substrate 21. The "sensor substrate" in Fig. 16 schematically shows the shape, in plan view, of the sensor substrate 21 described with reference to Figs. 3 and 5.

[0108] "First adhesive insulating layer" in Figure 16 schematically shows the shape of the first adhesive insulating layer bonding the first substrate 360 ​​and the insulating layer 340 in a plan view. The "frame-shaped" first adhesive insulating layer 356 in "first adhesive insulating layer" in Figure 16 has an adhesive portion shaped to trace the outer periphery of the sensor substrate 21 shown in "sensor substrate" in Figure 16. Therefore, when viewed only from the side of the pressure-bonded portion 620 relative to the boundary line 600, there is no adhesive layer in the portion overlapping the boundary line 600, and a non-adhesive portion 3561 is present. Therefore, as described with reference to Figure 15, the first adhesive insulating layer 356 in the non-detection region 599 has a shape that traces three sides excluding the portion overlapping the boundary line 600.

[0109] The form of the first adhesive insulating layer that bonds the first substrate 360 ​​and the insulating layer 340 is not limited to the first adhesive insulating layers 350, 357, and 356. For example, as shown in a "striped" form in FIG. 16 , adhesive portions 3541 and non-adhesive portions 3542 along the second direction Dy may be alternately arranged in the first direction Dx. The width of the adhesive portions 3541 and non-adhesive portions 3542 in the first direction Dx may be smaller than the width D3 or may be equal to or greater than the width D3. The arrangement direction of the striped adhesive portions and non-adhesive portions may be a direction intersecting the first direction Dx and the second direction Dy. The widths D1 and D2 described above may be equal to or greater than the width D3.

[0110] 16 , the first substrate 360 ​​and the insulating layer 340 may be bonded by a first adhesive insulating layer 355 having adhesive portions scattered throughout an area that overlaps the entire sensor substrate 21. The portions of the first adhesive insulating layer 355 shown as a dot pattern are adhesive portions, and the white portions are non-adhesive portions. Note that such dot-shaped adhesive portions are formed, for example, by a method of forming a thin film of the first adhesive insulating layer 355 using the first substrate 360 ​​as a base material.

[0111] Although not shown, the first adhesive insulating layer 350 described with reference to Figure 6 and the first adhesive insulating layer 357 described with reference to Figure 14 are also arranged to cover the entire sensor substrate 21 from a planar perspective, similar to the first adhesive insulating layers 354 and 355.

[0112] The form of the detection device 1 is not limited to the ring-shaped form described with reference to Figures 1 and 2, and any form of device in which light detection by an organic photodiode OPD is expected may be applied.

[0113] Furthermore, in the above-described embodiment, the first optical sensor 10A and the second optical sensor 10B are provided, but the number of organic photodiodes OPD provided in the detection device is not limited to the number exemplified in the embodiment, and may be one or more.

[0114] The components of each of the above-described embodiments can be combined as appropriate. Furthermore, other effects and advantages brought about by the aspects described in the present embodiments that are obvious from the description in this specification or that can be conceived by a person skilled in the art are naturally understood to be brought about by the present invention.

[0115] REFERENCE SIGNS LIST 1 Detector 11, 312 Electrode 21 Sensor substrate 70 Circuit substrate 110 End electrode 350, 354, 355, 356, 357 First adhesive insulating layer 360 First substrate 430 Second adhesive insulating layer 440 Second substrate 500 Terminal portion 503, 504, 505, 506, 507, 508, 509, 510, 511 Terminal 720 Terminal OPD Organic photodiode

Claims

1. A detection device comprising: a detection region that functions as an optical sensor and is made up of an insulating layer, an electrode layer, a first buffer layer, an active layer, a second buffer layer, an adhesive insulating layer, and a substrate; and a non-detection region that is made up of the insulating layer, the adhesive insulating layer, and the substrate, wherein a terminal portion of the non-detection region that is provided with a first terminal electrically connected to the electrode layer does not overlap with the adhesive insulating layer or the substrate.

2. The detection device according to claim 1, wherein the first terminal is connected to a second terminal provided on an external substrate, and the detection area and the external substrate overlap.

3. The detection device according to claim 1 or 2, wherein the first terminal is in the same layer as the electrode layer.

4. The detection device according to claim 1 or 2, wherein the optical sensor is an organic photodiode.

5. A method for manufacturing a detection device, comprising: a step of forming a substrate in which a first substrate, a first adhesive insulating layer, an insulating layer, an electrode layer, a first buffer layer, an active layer, a second buffer layer, a second adhesive insulating layer, and a second substrate are arranged in this order from one side to the other in the stacking direction; a step of crimping a plurality of terminals formed in areas of the substrate where the first buffer layer, the active layer, the second buffer layer, the second adhesive insulating layer, and the second substrate are not stacked, to a plurality of external terminals provided on an external substrate; and a step of peeling the first substrate and the first adhesive insulating layer from the substrate, wherein the first adhesive insulating layer has an adhesive portion that abuts the first substrate on one side and abuts the insulating layer on the other side, and a non-adhesive portion that is a gap between the first substrate and the insulating layer, which are arranged alternately along an arrangement direction perpendicular to the stacking direction.

6. The method for manufacturing a detection device according to claim 5, wherein the width of the adhesive portions in the arrangement direction and the width of the non-adhesive portions in the arrangement direction are smaller than the width of the plurality of terminals in the arrangement direction.

7. The method for manufacturing a detection device according to claim 5 or 6, wherein the first adhesive insulating layer is striped.

8. The method for manufacturing a detection device according to claim 5 or 6, wherein the first adhesive insulating layer has a checkerboard pattern.

9. A method for manufacturing a detection device as described in claim 5 or 6, wherein the first adhesive insulating layer has two sides that face each other with the plurality of terminals interposed therebetween, and one side that connects one end of the two sides together.

10. The method for manufacturing a detection device according to claim 9, wherein the first adhesive insulating layer is formed along the outer periphery of the substrate.

11. The method for manufacturing a detection device according to claim 5 or 6, wherein the plurality of terminals are in the same layer as the electrode layer.

12. The method for manufacturing a detection device according to claim 5 or 6, wherein the optical sensor having the first buffer layer, the active layer and the second buffer layer is an organic photodiode.

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