Laminate, laminated board, printed wiring board, and semiconductor package

Abstract

Provided are: a laminate having a low difference between a dielectric loss tangent (Df) at 10 GHz and a dielectric loss tangent (Df) at 80 GHz, and having a low dielectric loss tangent (Df) at 80 GHz; and a laminated board, a printed wiring board, and a semiconductor package that include the aforementioned laminate. Specifically, provided is a laminate in which a thermosetting resin composition layer (A), a core material, and a thermosetting resin composition layer (B) are laminated in the stated order, wherein the core material is a thermosetting resin film, the difference (ΔDf) between the dielectric loss tangent (Df) at 10 GHz and the dielectric loss tangent (Df) at 80 GHz of a cured product of the laminate is 0.0010 or less, and the dielectric loss tangent (Df) of the cured product of the laminate at 80 GHz is 0.0020 or less.

Description

Laminate, laminate, printed wiring board and semiconductor package

[0001] The present embodiment relates to a laminate, a laminate, a printed wiring board, and a semiconductor package.

[0002] In electronic devices and communication devices, such as mobile communication devices (e.g., mobile phones) and their base station equipment, network infrastructure devices (e.g., servers and routers), and mainframe computers, the speed and capacity of signals used are increasing year by year. Fifth-generation mobile communication systems (5G), which are seeing accelerating speed increases, have been required to have a small dielectric loss tangent (Df) in the 5 to 30 GHz band in order to reduce transmission loss. Furthermore, the next-generation sixth-generation mobile communication systems (6G) will also be required to have a small dielectric loss tangent (Df) in higher frequency bands (e.g., 80 GHz or higher). Therefore, substrate materials that can be used in both fifth-generation mobile communication systems (5G) and sixth-generation mobile communication systems (6G), i.e., substrate materials that are little affected by changes in Df with frequency bands and that also have a small dielectric loss tangent (Df) in higher frequency bands (e.g., 80 GHz or higher), will be required in the future.

[0003] As a substrate material that can achieve a low dielectric loss tangent (Df) that can be used in fifth-generation mobile communication systems (5G), a metal-clad laminate including a fiber substrate such as glass cloth and a prepreg containing a specific low-dielectric resin composition has been used (see, for example, Patent Document 1).

[0004] International Publication No. 2014 / 203511

[0005] However, the inventors' investigations have revealed that prepregs containing a fiber substrate such as glass cloth often have a difference in Df between 10 GHz and Df in higher frequency bands (e.g., 80 GHz or higher). Therefore, although they can be used as substrate materials for fifth-generation mobile communication systems (5G), they may not be suitable as substrate materials for sixth-generation mobile communication systems (6G).

[0006] An object of the present embodiment is to provide a laminate in which the difference between the dielectric dissipation factor (Df) at 10 GHz and the dielectric dissipation factor (Df) at 80 GHz is small and the dielectric dissipation factor (Df) is low at 80 GHz, as well as a laminate, a printed wiring board, and a semiconductor package each including the laminate.

[0007] The present inventors have conducted extensive research to solve the above-mentioned problems and have found that the laminate of the present disclosure can achieve the above-mentioned object. The present disclosure includes the following embodiments [1] to

[10] . [1] A laminate comprising a thermosetting resin composition layer (A), a core material, and a thermosetting resin composition layer (B) laminated in this order, wherein the core material is a thermosetting resin film, and the difference (ΔDf) between the dielectric loss tangent (Df) at 10 GHz and the dielectric loss tangent (Df) at 80 GHz of the cured product of the laminate is 0.0010 or less, and the dielectric loss tangent (Df) at 80 GHz of the cured product of the laminate is 0.0020 or less. [2] The laminate according to [1] above, wherein the core material does not crack when the mandrel diameter is 10 mm in a cylindrical mandrel test in accordance with JIS K5600-5-1 (1999). [3] The laminate according to [1] or [2] above, wherein the thermosetting resin composition layer (A) and the thermosetting resin composition layer (B) contain the same thermosetting resin. [4] The laminate according to [1] or [2] above, wherein the thermosetting resin composition layer (A) and the thermosetting resin composition layer (B) contain different thermosetting resins. [5] The laminate according to any one of [1] to [3] above, wherein the components contained in the thermosetting resin composition layer (A) and the components contained in the thermosetting resin composition layer (B) are the same. [6] The laminate according to any one of [1] to [5] above, wherein the thermosetting resin film serving as a core material contains one or more resins selected from the group consisting of cycloolefin-based polymers, styrene-based polymers, ethylene-based polymers, and propylene-based polymers. [7] The laminate according to any one of [1] to [6] above, wherein, when the core material is replaced with a fiber substrate (excluding quartz glass cloth), the difference (ΔDf) between the dielectric dissipation factor (Df) at 10 GHz and the dielectric dissipation factor (Df) at 80 GHz of the cured product of the laminate exceeds 0.0010, or the dielectric dissipation factor (Df) at 80 GHz of the cured product of the laminate exceeds 0.0020. [8] A laminate plate having a cured product of the laminate according to any one of [1] to [7] above and a metal foil. [9] A printed wiring board having a cured product of the laminate according to any one of [1] to [7] above.

[10] A semiconductor package having the printed wiring board according to [9] above and a semiconductor element.

[0008] According to this embodiment, it is possible to provide a laminate in which the difference between the dielectric dissipation factor (Df) at 10 GHz and the dielectric dissipation factor (Df) at 80 GHz is small and the dielectric dissipation factor (Df) is low at 80 GHz, as well as a laminate, a printed wiring board, and a semiconductor package each including the laminate.

[0009] 1 is a cross-sectional view of a laminate produced in Examples 1 to 3 and Comparative Example 1. FIG. 2 is a cross-sectional view of a laminate produced in Comparative Examples 2 and 3. FIG. 3 is a cross-sectional view of a laminate produced in Comparative Example 4.

[0010] In the numerical ranges described in this disclosure, the upper or lower limit of the numerical range may be replaced with the values ​​shown in the examples. Furthermore, the lower and upper limits of a numerical range can be arbitrarily combined with the lower or upper limit of another numerical range. In the expression "AA to BB," the numerical values ​​AA and BB at both ends are included as the lower and upper limits, respectively, within the numerical range. In this disclosure, for example, the expression "10 or more" means 10 and a value greater than 10, and this also applies when the numerical values ​​are different. Furthermore, for example, the expression "10 or less" means a value less than 10 and a value greater than 10, and this also applies when the numerical values ​​are different.

[0011] Unless otherwise specified, each component and material exemplified in this disclosure may be used alone or in combination of two or more. In this disclosure, when a resin composition contains multiple substances corresponding to each component, the content of each component in the resin composition means the total amount of the multiple substances present in the resin composition, unless otherwise specified.

[0012] In this disclosure, "solid content" refers to components other than the solvent, and components that are liquid at 25°C are also considered to be solid content. In this disclosure, "cured product" is synonymous with a resin composition in a C-stage state as defined in JIS K6800 (1985).

[0013] The weight average molecular weight (Mw) and number average molecular weight (Mn) in this disclosure refer to values ​​measured in terms of polystyrene by gel permeation chromatography (GPC). Specifically, the weight average molecular weight (Mw) and number average molecular weight (Mn) in this disclosure can be measured by the method described in the examples.

[0014] In the present disclosure, when a "layer" is used, such as a thermosetting resin composition layer, the term "layer" includes not only a solid layer, but also a layer that is not a solid layer but at least a portion of which is in the form of islands, a layer in which the interface with an adjacent layer is unclear, etc. The solid layer refers to a sheet-like layer that has not been subjected to any particular processing.

[0015] Any combination of the descriptions in this disclosure is also included in this embodiment.

[0016] [Laminate] The laminate of this embodiment is as follows: A laminate having a thermosetting resin composition layer (A), a core material, and a thermosetting resin composition layer (B) laminated in this order, wherein the core material is a thermosetting resin film, and wherein the difference (ΔDf) between the dielectric loss tangent (Df) at 10 GHz and the dielectric loss tangent (Df) at 80 GHz of a cured product of the laminate is 0.0010 or less, and the dielectric loss tangent (Df) at 80 GHz of the cured product of the laminate is 0.0020 or less.

[0017] As described above, the cured product of the laminate of this embodiment has a small difference (ΔDf) between the dielectric loss tangent (Df) at 10 GHz and the dielectric loss tangent (Df) at 80 GHz, and the dielectric loss tangent (Df) itself at 80 GHz is also small. Therefore, a substrate material compatible with both fifth-generation mobile communication systems (5G) and sixth-generation mobile communication systems (6G) can be provided. The reason for this effect is believed to be as follows. Unlike prepregs containing fiber substrates such as glass cloth, the laminate of this embodiment has a thermosetting resin film as a core material instead of a fiber substrate. Prepregs containing fiber substrates such as glass cloth (excluding quartz glass cloth) tend to have a high dielectric loss tangent (Df) at 80 GHz due to the influence of the fiber substrate. However, the laminate of this embodiment, which has a thermosetting resin film as a core material, can avoid the adverse effects of the fiber substrate, and it is presumed that the dielectric loss tangent (Df) at 80 GHz can be kept low. From this perspective, when the core material in the laminate of this embodiment is replaced with a fiber substrate (excluding quartz glass cloth), the difference (ΔDf) between the dielectric loss tangent (Df) at 10 GHz of the cured product of the laminate and the dielectric loss tangent (Df) at 80 GHz of the cured product of the laminate is greater than 0.0010, or the dielectric loss tangent (Df) at 80 GHz of the cured product of the laminate is greater than 0.0020 (see Comparative Examples 2 and 3). Examples of the fiber substrate include glass cloth such as E-glass cloth, S-glass cloth, C-glass cloth, and D-glass cloth. E-glass cloth, NER-glass cloth (IPC style; #1078, manufactured by Nitto Boseki Co., Ltd.) or NE-glass cloth (IPC style; #1078, manufactured by Nitto Boseki Co., Ltd.) may also be used. The thickness of the fiber substrate may be 1.0 to 2.5 times, 1.0 to 2.0 times, or 1.5 to 2.0 times the thickness of the core material before replacement. The laminate of the present embodiment is not particularly limited, but it is preferable that it does not contain a fiber base material such as glass cloth (excluding quartz glass cloth).Even if the laminate contains a fiber base material such as a cellulose ester, the content thereof is preferably 10% by mass or less, more preferably 5% by mass or less, even more preferably 3% by mass or less, particularly preferably 1% by mass or less, and most preferably 0.5% by mass or less, based on the total mass of the laminate. In the present disclosure, the dielectric loss tangent (Df) is a value measured in accordance with the balanced disc resonator method (BCDR method), and more specifically, is a value measured by the method described in the examples.

[0018] The core material preferably has good roll transportability, and specifically, it is preferable that no cracks occur even in a cylindrical mandrel test (mandrel diameter: 10 mm) in accordance with JIS K5600-5-1 (1999).

[0019] In the laminate of this embodiment, the thermosetting resin film serving as the core material preferably contains one or more resins (hereinafter sometimes referred to as resin (I)) selected from the group consisting of cycloolefin-based polymers, styrene-based polymers, ethylene-based polymers, and propylene-based polymers, from the viewpoint of reducing both the ΔDf and the dielectric loss tangent (Df) at 80 GHz. The content of resin (I) in the thermosetting resin film is not particularly limited, but is preferably 10 to 100% by mass, more preferably 20 to 100% by mass, and even more preferably 40 to 100% by mass, relative to the total amount (100% by mass) of the thermosetting resin film. The upper limit of this numerical range is not particularly limited, and may be 95% by mass or less, or may be 90% by mass or less.

[0020] The cycloolefin polymer may be a homopolymer or a copolymer. The cycloolefin polymer preferably contains structural units of one or more monomers selected from the group consisting of monocyclic olefin monomers, norbornene monomers, etc. The monomers may be substituted or unsubstituted with hydrocarbon groups such as alkyl groups, alkenyl groups, alkylidene groups, and aryl groups, polar groups, etc.

[0021] The monocyclic olefin preferably includes a cyclic monoolefin having 4 to 20 carbon atoms (more preferably 4 to 10 carbon atoms) or a cyclic diolefin preferably having 4 to 20 carbon atoms (more preferably 4 to 10 carbon atoms). Examples of the cyclic monoolefin include cyclobutene, cyclopentene, methylcyclopentene, cyclohexene, methylcyclohexene, cycloheptene, and cyclooctene. Examples of the cyclic diolefin include cyclohexadiene, methylcyclohexadiene, cyclooctadiene, methylcyclooctadiene, and phenylcyclooctadiene.

[0022] Examples of the norbornene-based monomer include substituted or unsubstituted polycyclic norbornenes having two or more rings. Examples of the norbornene-based monomer include bicyclic norbornene compounds which may have a functional group, such as norbornene, norbornadiene, methylnorbornene, dimethylnorbornene, ethylnorbornene, chlorinated norbornene, ethylidenenorbornene, chloromethylnorbornene, trimethylsilylnorbornene, phenylnorbornene, cyanonorbornene, dicyanonorbornene, methoxycarbonylnorbornene, pyridylnorbornene, nadic anhydride, and nadic imide; dicyclopentadiene, dihydrodicyclopentadiene, and compounds in which these are substituted with one or more selected from the group consisting of alkyl groups, alkenyl groups, alkylidene groups, aryl groups, hydroxy groups, acid anhydride groups, carboxyl groups, and alkoxycarbonyl groups. tetracyclic norbornene compounds such as dimethanohexahydronaphthalene, dimethanooctahydronaphthalene, 1,4-methano-1,4,4a,9a-tetrahydro-9H-fluorene, and compounds thereof substituted with one or more groups selected from the group consisting of alkyl groups, alkenyl groups, alkylidene groups, aryl groups, hydroxy groups, acid anhydride groups, carboxyl groups, and alkoxycarbonyl groups; pentacyclic norbornene compounds such as tricyclopentadiene; hexacyclic norbornene compounds such as hexacycloheptadecene; norbornene ring-containing compounds such as dinorbornene, compounds in which two norbornene rings are bonded via a hydrocarbon or ester group, and alkyl- or aryl-substituted versions of these. The norbornene-based monomer is not particularly limited, but is preferably a norbornene-based monomer having a carboxyl group or an acid anhydride group. The content of the norbornene-based monomer having a carboxyl group or an acid anhydride group relative to the total amount of the cyclic olefin monomers is preferably 1 mol % or more, more preferably 5 mol % or more.

[0023] The thermosetting resin film containing a cycloolefin polymer may be commercially available, such as "ZEONORFILM" (manufactured by Zeon Corporation).

[0024] The styrene-based polymer may have a structural unit derived from a styrene-based compound. From the viewpoint of reducing both the ΔDf and the dielectric loss tangent (Df) at 80 GHz and from the viewpoint of heat resistance and low thermal expansion, the styrene-based polymer is preferably one or more selected from the group consisting of polystyrene (atactic polystyrene, syndiotactic polystyrene, etc.), hydrogenated styrene-butadiene-styrene block copolymer (SEBS or SBBS), hydrogenated styrene-isoprene-styrene block copolymer (SEPS), and styrene-maleic anhydride copolymer (SMA); more preferably one or more selected from the group consisting of polystyrene (atactic polystyrene, syndiotactic polystyrene, etc.), hydrogenated styrene-butadiene-styrene block copolymer (SEBS), and hydrogenated styrene-isoprene-styrene block copolymer (SEPS); and even more preferably hydrogenated styrene-butadiene-styrene block copolymer (SEBS).

[0025] In the styrene-based polymer, the content of styrene-derived structural units [hereinafter, sometimes referred to as "styrene content"] is not particularly limited, but from the viewpoint of reducing both the ΔDf and the dielectric dissipation factor (Df) at 80 GHz, and from the viewpoint of heat resistance and low thermal expansion, it is preferably 5 to 100% by mass, more preferably 5 to 80% by mass, even more preferably 10 to 75% by mass, particularly preferably 15 to 60% by mass, and most preferably 20 to 45% by mass. The weight-average molecular weight (Mw) of the styrene-based polymer is not particularly limited, and may be 12,000 to 1,000,000, 30,000 to 500,000, 50,000 to 120,000, or 70,000 to 100,000. In the present disclosure, the weight-average molecular weight (Mw) refers to a value measured in terms of polystyrene by gel permeation chromatography (GPC). The melt flow rate (MFR) of the styrene-based polymer is not particularly limited, but may be 0.1 to 20 g / 10 min, 1 to 15 g / 10 min, or 2 to 10 g / 10 min under measurement conditions of 230°C and a load of 2.16 kgf (21.2 N).

[0026] The thermosetting resin film serving as the core material may or may not contain other components besides the resin (I) as necessary. Examples of other components include resins other than the resin (I), inorganic fillers, curing accelerators, other additives, organic solvents, etc. The inorganic fillers, curing accelerators, other additives, and organic solvents are described in the same manner as in the description of the thermosetting resin composition layer (A) and the thermosetting resin composition layer (B) below. Each of the other components may be used alone, or two or more may be used in combination. The content of the other components is not particularly limited, but may be 0 to 30% by mass, 0 to 15% by mass, 1 to 10% by mass, or 1 to 5% by mass relative to the total amount (100% by mass) of the thermosetting resin film.

[0027] The ethylene-based polymer is not particularly limited as long as it has structural units derived from ethylene, and examples thereof include homopolyethylene and an ethylene-propylene copolymer having an ethylene-derived structural unit content of 50 mol% or more (preferably 80 mol% or more, more preferably 90 mol% or more, with an upper limit of 99 mol% or less). The weight-average molecular weight (Mw) of the ethylene-based polymer is not particularly limited and may be 5,000 to 1,000,000, 10,000 to 300,000, or 30,000 to 100,000.

[0028] The propylene-based polymer is not particularly limited as long as it is a polymer having structural units derived from propylene, and examples thereof include homopolypropylene and an ethylene-propylene copolymer having a content of structural units derived from propylene of more than 50 mol% (preferably 80 mol% or more, more preferably 90 mol% or more, with an upper limit of 99 mol% or less). The homopolypropylene may be any of isotactic polypropylene, syndiotactic polypropylene, and atactic polypropylene. The weight-average molecular weight (Mw) of the propylene-based polymer is not particularly limited and may be 5,000 to 1,000,000, 10,000 to 300,000, or 30,000 to 100,000.

[0029] There is no particular limitation on the thickness of the thermosetting resin film that is the core material, but it is preferably 5 to 100 μm, more preferably 10 to 80 μm, and even more preferably 15 to 50 μm.

[0030] In the laminate of this embodiment, the thermosetting resin composition layer (A) and the thermosetting resin composition layer (B) may contain the same thermosetting resin, or the thermosetting resin composition layer (A) and the thermosetting resin composition layer (B) may contain different thermosetting resins. In addition, in the laminate of this embodiment, an embodiment in which the components contained in the thermosetting resin composition layer (A) and the components contained in the thermosetting resin composition layer (B) are the same is also preferred, but the components contained in the thermosetting resin composition layer (A) and the components contained in the thermosetting resin composition layer (B) may be partially different or entirely different.

[0031] The thermosetting resin composition layer (A) and the thermosetting resin composition layer (B) each contain a thermosetting resin. The thermosetting resin is not particularly limited, but preferably contains at least one selected from the group consisting of an epoxy resin, a phenolic resin, a maleimide resin, a modified polyphenylene ether resin, a cyanate resin, an isocyanate resin, a benzoxazine resin, an oxetane resin, an amino resin, an unsaturated polyester resin, an allyl resin, a silicone resin, a triazine resin, and a melamine resin, more preferably contains at least one selected from the group consisting of an epoxy resin, a phenolic resin, a maleimide resin, a modified polyphenylene ether resin, a cyanate resin, and an isocyanate resin, and even more preferably contains at least one selected from the group consisting of an epoxy resin, a phenolic resin, a maleimide resin, and a modified polyphenylene ether resin.

[0032] The content of the thermosetting resin in the thermosetting resin composition layer (A) and the thermosetting resin composition layer (B) is not particularly limited, but is preferably 10 to 90 mass%, more preferably 15 to 85 mass%, and even more preferably 20 to 80 mass%, relative to the total amount (100 mass%) of the thermosetting resin composition layer (A) or the thermosetting resin composition layer (B).

[0033] The thermosetting resin composition layer (A) and the thermosetting resin composition layer (B) may further contain other components. Examples of the other components include resins other than the thermosetting resins, elastomers, inorganic fillers, curing accelerators, other additives, organic solvents, etc. One type of each of the other components may be used alone, or two or more types may be used in combination.

[0034] Examples of resins other than thermosetting resins include compounds having a vinylbenzyl group (hereinafter also referred to as "vinylbenzyl compound"). The vinylbenzyl compound contains one or more compounds selected from the group consisting of (I) compounds having three or more vinylbenzyl groups bonded to an oxygen atom, and (II) compounds having one or more vinylbenzyl groups bonded to a carbon atom. Compounds that satisfy both (I) and (II) are classified as (I). The vinylbenzyl group contained in the vinylbenzyl compound may be an o-vinylbenzyl group, an m-vinylbenzyl group, or a p-vinylbenzyl group. However, from the viewpoints of the relative dielectric constant (Dk) and the dielectric loss tangent (Df), the p-vinylbenzyl group is preferred. The content of p-vinylbenzyl groups among all the vinylbenzyl groups contained in the vinylbenzyl compound is not particularly limited, but from the viewpoint of low dielectric loss tangent, it is preferably 10 to 100% by mass, more preferably 15 to 95% by mass, even more preferably 20 to 90% by mass, and particularly preferably 25 to 85% by mass.

[0035] The weight-average molecular weight (Mw) of the (I) compound having three or more vinylbenzyl groups bonded to oxygen atoms is not particularly limited, but from the viewpoints of moldability and handleability, it is preferably 300 to 50,000, more preferably 500 to 30,000, and even more preferably 1,000 to 10,000. Furthermore, the weight-average molecular weight (Mw) of the (II) compound having one or more vinylbenzyl groups bonded to a carbon atom is not particularly limited, but from the viewpoints of moldability and handleability, it is preferably 200 to 800, more preferably 250 to 750, and even more preferably 300 to 700.

[0036] The compound (I) having three or more vinylbenzyl groups bonded to oxygen atoms is preferably a compound containing a structural unit represented by the following formula:

[0037]

[0038] The (II) compound having one or more vinylbenzyl groups bonded to a carbon atom is preferably a compound having a fused polycyclic structure containing an aromatic ring and a non-aromatic ring. Examples of the fused polycyclic structure containing an aromatic ring and a non-aromatic ring include a fluorene ring, an indene ring, an indane ring, a phenanthrene ring, and an acenaphthylene ring. Among these, from the viewpoints of the relative dielectric constant (Dk) and the dielectric loss tangent (Df), a fluorene ring and an indene ring are preferred, and an indene ring is more preferred.

[0039] As the vinylbenzyl compound containing an indene ring, from the viewpoint of the dielectric loss tangent (Df), a vinylbenzyl compound represented by the following general formula (II-1) is preferred.

[0040] (In the formula, R １ are each independently a vinylbenzyl group, and n1 is an integer of 1 to 3.

[0041] The vinylbenzyl compound represented by the general formula (II-1) may be any of a compound having one vinylbenzyl group, a compound having two vinylbenzyl groups, and a compound having three vinylbenzyl groups, or a mixture thereof. When the vinylbenzyl compound is a mixture, the average number of vinylbenzyl groups per molecule of the vinylbenzyl compound represented by the general formula (II-1) is preferably 1.4 to 2.8, more preferably 1.6 to 2.7, and even more preferably 1.8 to 2.6.

[0042] Examples of the elastomer include styrene-based elastomers, olefin-based elastomers, urethane-based elastomers, polyester-based elastomers, polyamide-based elastomers, acrylic-based elastomers, and silicone-based elastomers.

[0043] Examples of inorganic fillers include silica, alumina, titanium oxide, mica, beryllia, barium titanate, potassium titanate, strontium titanate, calcium titanate, aluminum carbonate, magnesium hydroxide, aluminum hydroxide, aluminum silicate, calcium carbonate, calcium silicate, magnesium silicate, silicon nitride, boron nitride, clay (e.g., calcined clay), molybdic acid compounds (e.g., zinc molybdate), talc, aluminum borate, and silicon carbide. The shape and particle size of the inorganic filler are not particularly limited, but the particle size is preferably 0.01 to 20 μm, more preferably 0.1 to 10 μm, even more preferably 0.2 to 1 μm, and particularly preferably 0.3 to 0.8 μm. Here, particle size refers to the average particle size, which is the particle size at the point corresponding to 50% volume when a cumulative frequency distribution curve of particle size is calculated, assuming the total volume of the particles to be 100%. The particle size of the inorganic filler can be measured using a particle size distribution analyzer using a laser diffraction / scattering method.

[0044] Examples of the curing accelerator include amine-based curing accelerators, imidazole-based curing accelerators, phosphorus-based curing accelerators, organic metal salts, acid catalysts, and organic peroxides.

[0045] Examples of the other additives include flame retardants, polymerization initiators, antioxidants, heat stabilizers, antistatic agents, ultraviolet absorbers, pigments, colorants, and lubricants.

[0046] Examples of the organic solvent include alcohol-based solvents such as ethanol, propanol, butanol, methyl cellosolve, butyl cellosolve, and propylene glycol monomethyl ether; ketone-based solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone; ether-based solvents such as tetrahydrofuran; aromatic hydrocarbon-based solvents such as toluene, xylene, and mesitylene; nitrogen-containing solvents such as dimethylformamide, dimethylacetamide, and N-methylpyrrolidone; sulfur-containing solvents such as dimethyl sulfoxide; and ester-based solvents such as γ-butyrolactone.

[0047] The content of the other components is not particularly limited, but may be 5 to 80% by mass, 10 to 70% by mass, 15 to 60% by mass, or 30 to 55% by mass, relative to the total amount (100% by mass) of the thermosetting resin film.

[0048] Among the thermosetting resins contained in the thermosetting resin composition layer (A) and the thermosetting resin composition layer (B), the maleimide-based resin will be briefly described below. (Maleimide-Based Resin) The maleimide-based resin is one or more types selected from the group consisting of maleimide resins having one or more N-substituted maleimide groups and derivatives of such maleimide resins. One type of maleimide-based resin may be used alone, or two or more types may be used in combination.

[0049] From the viewpoints of conductor adhesion and heat resistance, the maleimide resin having one or more N-substituted maleimide groups is preferably a maleimide resin having two or more N-substituted maleimide groups, more preferably an aromatic maleimide resin having two or more N-substituted maleimide groups, and even more preferably an aromatic bismaleimide resin having two N-substituted maleimide groups. Note that "aromatic maleimide resin" refers to a compound having an N-substituted maleimide group directly bonded to an aromatic ring. Also, "aromatic bismaleimide resin" refers to a compound having two N-substituted maleimide groups directly bonded to an aromatic ring.

[0050] In a maleimide resin having two or more N-substituted maleimide groups, the nitrogen atoms of the two maleimide groups are preferably bonded via an organic group. Examples of the organic group include aromatic hydrocarbon groups; aliphatic hydrocarbon groups; groups in which an aromatic hydrocarbon group and an aliphatic hydrocarbon group are combined; and groups in which an aromatic hydrocarbon group is combined with one or more groups selected from the group consisting of an ether group, a sulfide group, a sulfonyl group, a carbonyloxy group, a keto group, and the like. The aromatic hydrocarbon group may or may not be substituted with an aliphatic hydrocarbon group having 1 to 5 carbon atoms, a halogen atom, or the like. The aliphatic hydrocarbon group may or may not be substituted with a halogen atom, or the like.

[0051] The maleimide resin is preferably a maleimide resin containing an indane skeleton, and more preferably a maleimide resin having two or more N-substituted maleimide groups containing an indane skeleton and containing an indane skeleton.

[0052] The maleimide resin derivative is preferably an aminomaleimide resin containing the above-mentioned structural unit derived from the maleimide resin and a structural unit derived from a diamine compound. The aminomaleimide resin can be produced, for example, by reacting the maleimide resin with the diamine compound (specifically, by a Michael addition reaction).

[0053] Examples of the diamine compound include aromatic diamine compounds such as 4,4'-diaminodiphenylmethane, 3,3'-dimethyl-4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenylsulfone, 3,3'-diaminodiphenylsulfone, 4,4'-diaminodiphenylketone, 4,4'-diaminobiphenyl, 2,2-bis(3-amino-4-hydroxyphenyl)propane, 3,3'-dimethyl-5,5'-diethyl-4,4'-diaminodiphenylmethane, 2,2-bis[4-(4-aminophenoxy)phenyl]propane, 1,3-bis(3-aminophenoxy)benzene, and 1,3-bis(4-aminophenoxy)benzene; and silicone compounds having two primary amino groups. Note that "aromatic diamine compound" refers to a compound having two amino groups directly bonded to an aromatic ring.

[0054] (Method for Producing Laminate) The method for producing the laminate of this embodiment is not particularly limited, but an example is described below. For example, first, a thermosetting resin film for the thermosetting resin composition layer (A) (hereinafter referred to as the thermosetting resin film (A)) and a thermosetting resin film for the thermosetting resin composition layer (B) (hereinafter referred to as the thermosetting resin film (B)) are prepared. However, if the thermosetting resin composition layer (A) and the thermosetting resin composition layer (B) are the same, it is sufficient to prepare two thermosetting resin films (A). The thermosetting resin film (A) and the thermosetting resin film (B) can be produced by applying a thermosetting resin composition containing an organic solvent (so-called resin varnish) to a support and then heating and drying it. The application method is not particularly limited, and can be carried out using a known coating device such as a comma coater, bar coater, kiss coater, roll coater, gravure coater, or die coater. Examples of the support include a plastic film, metal foil, and release paper. The temperature and time of the heat drying are not particularly limited, but from the viewpoints of productivity and adequately B-staging the resin composition of this embodiment, they can be 50 to 200°C (preferably 80 to 150°C) and 1 to 30 minutes (preferably 1 to 15 minutes). Next, a thermosetting resin film (A) is laminated onto the core side of the core material with the protective film, and then the protective film is peeled off from the core material. The thermosetting resin film (B) is laminated onto the newly exposed core material, thereby obtaining the laminate of this embodiment. The lamination conditions are not particularly limited, but the lamination temperature is preferably 80 to 180°C, and the lamination pressure is preferably 0.05 to 1.0 MPa. Lamination may be performed under normal pressure or under vacuum.

[0055] [Laminate] The laminate of the present embodiment is a laminate having a cured product of the laminate of the present embodiment and a metal foil. Note that a laminate having a metal foil is sometimes called a metal-clad laminate.

[0056] The metal of the metal foil is not particularly limited, and examples thereof include copper, gold, silver, nickel, platinum, molybdenum, ruthenium, aluminum, tungsten, iron, titanium, chromium, and alloys containing one or more of these metal elements.

[0057] The laminate of this embodiment can be produced, for example, by placing a metal foil on one or both sides of the laminate of this embodiment and then hot-pressing it. Typically, this hot-pressing process hardens the B-stage laminate, resulting in a C-stage laminate. When hot-pressing, a single laminate of this embodiment may be used, or two or more (preferably 2 to 20, more preferably 2 to 10) may be stacked together. Hot-pressing can be performed using, for example, a multi-stage press, a multi-stage vacuum press, a continuous molding machine, an autoclave molding machine, or the like. The hot-pressing conditions are not particularly limited, but can be, for example, a temperature of 100 to 300°C (preferably 180 to 280°C), a time of 10 to 300 minutes (preferably 40 to 150 minutes), and a pressure of 1.5 to 5 MPa.

[0058] [Printed Wiring Board] The printed wiring board of this embodiment is a printed wiring board having a cured product of the laminate of this embodiment. The printed wiring board of this embodiment can be produced, for example, by forming a conductor circuit on one or more materials selected from the group consisting of the cured product of the laminate of this embodiment and the laminate of this embodiment by a known method. Furthermore, if necessary, a multilayer printed wiring board can also be produced by further performing a multilayer adhesive process. The conductor circuit can be formed, for example, by appropriately performing a hole drilling process, a metal plating process, an etching process of a metal foil, or the like.

[0059] [Semiconductor Package] The semiconductor package of this embodiment is a semiconductor package including the printed wiring board of this embodiment and a semiconductor element. The semiconductor package of this embodiment can be manufactured, for example, by mounting semiconductor elements such as semiconductor chips and memories at predetermined positions on the printed wiring board of this embodiment by a known method, and then encapsulating the semiconductor elements with an encapsulating resin or the like.

[0060] The present embodiment will be specifically described below with reference to examples, although the present embodiment is not limited to the following examples.

[0061] In each example, the weight average molecular weight (Mw) and number average molecular weight (Mn) were measured by the following procedure. (Method for measuring weight average molecular weight (Mw) and number average molecular weight (Mn)) The weight average molecular weight (Mw) and number average molecular weight (Mn) were calculated by gel permeation chromatography (GPC) from a calibration curve using standard polystyrene. The calibration curve was approximated by a cubic equation using standard polystyrene: TSKstandard POLYSTYRENE (Types: A-2500, A-5000, F-20, F-80) [manufactured by Tosoh Corporation]. The GPC measurement conditions are shown below. Apparatus: High-speed GPC apparatus HLC-8320GPC Detector: Ultraviolet absorption detector UV-8320 [manufactured by Tosoh Corporation] Column: Guard column; TSKgel guard column Super (HZ)-M + Column; TSKgel SuperMultipore HZ-M (2 columns), Reference column; TSKgel Super H-RC (2 columns) (all manufactured by Tosoh Corporation) Column size: 4.6 x 20 mm (guard column), 4.6 x 150 mm (column), 6.0 x 150 mm (reference column) Eluent: Tetrahydrofuran Sample concentration: 10 mg / 1 mL Injection volume: 20 μL or 2 μL Flow rate: 0.35 mL / min Measurement temperature: 40°C

[0062] [Production of Vinylbenzyl Compounds] Production Example 1 (Production of Vinylbenzyl Compound 1) A reaction vessel equipped with a stirrer, thermometer, reflux condenser, and nitrogen inlet was charged with 36 parts by mass of indene, 76 parts by mass of chloromethylstyrene (CMS-P), 23 parts by mass of α-chloro-p-xylene (CPX), 7 parts by mass of tetra-n-butylammonium bromide as a phase transfer catalyst, 0.1 parts by mass of phenothiazine as a polymerization inhibitor, and 76 parts by mass of toluene as a solvent. The mixture was heated and stirred at 40°C while blowing in nitrogen at a flow rate of 50 mL / min. Next, 97 parts by mass of aqueous sodium hydroxide was added dropwise over 20 minutes, and the mixture was further stirred at 60°C for 9 hours. Nitrogen blowing was continued during the reaction. The mixture was cooled to room temperature (25°C) and neutralized with a 10% aqueous hydrochloric acid solution. It was then washed twice with pure water, the toluene was distilled off under reduced pressure, and the resulting viscous liquid was washed with methanol and then dried in vacuo. In this manner, vinylbenzyl compound 1 was obtained.

[0063] Details of the compounds used in Production Example 1 are as follows: Indene: manufactured by Tokyo Chemical Industry Co., Ltd. Chloromethylstyrene (CMS-P): manufactured by AGC Seimi Chemical Co., Ltd., a mixture of m- and p-isomers, with an m-isomer content of 50% by mass and a p-isomer content of 50% by mass α-chloro-p-xylene (CPX): manufactured by Tokyo Chemical Industry Co., Ltd. Tetra-n-butylammonium bromide: manufactured by Kanto Chemical Co., Ltd. Phenothiazine: manufactured by Tokyo Chemical Industry Co., Ltd. Sodium hydroxide: manufactured by Kanto Chemical Co., Ltd., a 48% by mass aqueous solution

[0064] The obtained vinylbenzyl compound 1 was subjected to chromatographic analysis using "ECX400II" (manufactured by JEOL RESONANCE Co., Ltd.). １ H-NMR spectrum (0.2 Hz, CDCl ３ , standard substance: tetramethylsilane (TMS)). As a result, a shift or disappearance of the H peak at position 1 of indene, a shift or disappearance of the H peaks at positions 2 and 3 of indene, a shift in the methylene peaks of CMS-P and CPX, a shift in the vinyl peak of CMS-P, and a shift in the methyl peak of CPX were confirmed, which indicated that a reaction had occurred in which a vinylbenzyl group was bonded to one of positions 1 to 3 of the indene ring, and a methylbenzyl group was bonded to one of positions 1 to 3 of the indene ring.

[0065] Furthermore, gel permeation chromatography (GPC) analysis confirmed that vinylbenzyl compound 1 was a mixture of compounds having one substituent selected from the group consisting of a vinylbenzyl group and a methylbenzyl group introduced therein (mono-substituted compounds), two substituents introduced therein (di-substituted compounds), and three substituents introduced therein (tri-substituted compounds).

[0066] The yield of vinylbenzyl compound 1 was 87.2%. GPC analysis revealed that the proportions (intensity ratios) of the tri-substituted, di-substituted, and mono-substituted compounds were 50.5, 39.4, and 10.1, respectively, and the weight-average molecular weight (Mw) and number-average molecular weight (Mn) were 226 and 273, respectively.

[0067] [Production of Modified Polyphenylene Ether Resin] Production Example 2: Production of Modified Polyphenylene Ether Resin 1 A reaction vessel equipped with a stirrer, thermometer, reflux condenser, and nitrogen inlet was charged with 200 parts by mass of polyphenylene ether SA90, 30 parts by mass of chloromethylstyrene (CMS), 1.2 parts by mass of tetra-n-butylammonium bromide as a phase transfer catalyst, 0.1 parts by mass of phenothiazine as a polymerization inhibitor, and 400 parts by mass of toluene as a solvent. While blowing in nitrogen at a flow rate of 50 mL / min, the mixture was heated and stirred at 75 ° C. Next, 500 parts by mass of aqueous sodium hydroxide was added dropwise over 20 minutes, and the mixture was further stirred at 75 ° C. for 4 hours. Nitrogen blowing was continued during the reaction. The mixture was cooled to room temperature (25 ° C.) and neutralized with a 10% aqueous hydrochloric acid solution. It was then washed twice with pure water, and the toluene was distilled off under reduced pressure. The resulting viscous liquid was then washed with methanol and vacuum dried. In this way, modified polyphenylene ether resin 1 was obtained.

[0068] Details of the compounds used in Production Example 2 are as follows: Polyphenylene ether SA90: manufactured by SABIC Innovative Plastics, number of terminal hydroxyl groups: 1.8, Mw=1,700 Chloromethylstyrene (CMS): manufactured by Linchuan Chemical Co., Ltd., a mixture of ortho- and para-isomers, ortho-isomer content: 17% by mass, para-isomer content: 83% by mass Tetra-n-butylammonium bromide: manufactured by Kanto Chemical Co., Ltd. Phenothiazine: Tokyo Chemical Industry Co., Ltd. Sodium hydroxide: manufactured by Kanto Chemical Co., Ltd., a 48% by mass aqueous solution

[0069] The obtained modified polyphenylene ether resin 1 was subjected to a polymerization reaction using "ECX400II" (manufactured by JEOL RESONANCE Co., Ltd.). １ H-NMR spectrum (0.2 Hz, CDCl ３ , standard substance: tetramethylsilane (TMS)) was measured. As a result, a peak derived from a vinylbenzyl group (ethenylbenzyl group) was confirmed at 5 to 7 ppm. This confirmed that the obtained solid was modified polyphenylene ether resin 1 having a vinylbenzyl group as the substituent at the molecular terminal in the molecule.

[0070] [Production of Thermosetting Resin Composition 1 and Thermosetting Resin Film 1] Production Example 3 90 parts by mass of the vinylbenzyl compound 1 obtained in Production Example 1, 10 parts by mass of hydrogenated styrene-based thermoplastic elastomer "KRATON MD1653", 1 part by mass of azo polymerization initiator "VR-110" (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.), 4 parts by mass of flame retardant "PQ-60" (manufactured by Dai-ichi Kogyo Seiyaku Co., Ltd.), and 100 parts by mass of fused silica (manufactured by Admatechs Co., Ltd.) were stirred and mixed with toluene at 25 ° C. to prepare a thermosetting resin composition 1 (resin varnish 1) having a solids concentration of 65% by mass. The obtained thermosetting resin composition 1 was applied to a PET film "G2" (manufactured by Toyobo Film Solutions Co., Ltd., thickness: 50 μm, release film) using a comma coater, and then heated and dried at 110 ° C. for 3 minutes to produce a B-stage thermosetting resin film 1 (thickness: 25 μm).

[0071] [Production of Thermosetting Resin Composition 2 and Thermosetting Resin Film 2] Production Example 4 60 parts by mass of the modified polyphenylene ether resin 1 obtained in Production Example 2, 20 parts by mass of butadiene homopolymer "B-1000" (manufactured by Nippon Soda Co., Ltd.), 20 parts by mass of multifunctional vinyl resin "LF310", 1 part by mass of organic peroxide "Perbutyl P", 15 parts by mass of flame retardant "SAYTEX8010" (manufactured by Albemarle Corporation), and 100 parts by mass of fused silica (manufactured by Admatechs Co., Ltd.) were stirred and mixed together with toluene at 25°C to prepare a thermosetting resin composition 2 (resin varnish 2) having a solids concentration of 65% by mass. The obtained thermosetting resin composition 2 was applied to a PET film "G2" (manufactured by Toyobo Film Solutions Co., Ltd., thickness: 50 μm, release film) using a comma coater, and then heated and dried at 110°C for 3 minutes to produce a B-stage thermosetting resin film 2 (thickness: 25 μm).

[0072] Example 1 (Preparation of Laminate) A 25 μm thick cycloolefin polymer "ZEONORFILM ZF16" (with protective film) was prepared as a core material. After peeling off the protective film, two thermosetting resin films 1 obtained in Production Example 3 were laminated on each side to form the laminate shown in FIG. 1 . The lamination conditions were a lamination temperature of 120°C and a lamination pressure of 0.5 MPa, and the lamination was performed under normal pressure. In a cylindrical mandrel test in accordance with JIS K5600-5-1 (1999), the core material did not crack when the mandrel diameter was set to 10 mm. In the obtained laminate, the thermosetting resin layer (A) and the thermosetting resin layer (B) were identical. In the obtained laminate, the thermosetting resin layer (A), core material, and thermosetting resin layer (B) each had a thickness of 25 μm.

[0073] Example 2 (Preparation of Laminate) The laminate shown in Figure 1 was prepared by the same procedure as in Example 1, except that the thermosetting resin film 2 obtained in Production Example 4 was used instead of the thermosetting resin film 1. In the obtained laminate, the thermosetting resin layer (A) and the thermosetting resin layer (B) are the same. In the obtained laminate, the thicknesses of the thermosetting resin layer (A), the core material, and the thermosetting resin layer (B) are each 25 µm.

[0074] Example 3 (Preparation of Laminate) The laminate shown in FIG. 1 was prepared by the same procedure as in Example 1, except that a 25 μm thick "TSU510" (manufactured by Toyochem Co., Ltd.) was used as the core material instead of the cycloolefin polymer "ZEONORFILM ZF16." The core material did not crack when tested using a 10 mm mandrel diameter in a cylindrical mandrel test in accordance with JIS K5600-5-1 (1999). In the resulting laminate, the thermosetting resin layer (A) and the thermosetting resin layer (B) were identical. In the resulting laminate, the thermosetting resin layer (A), the core material, and the thermosetting resin layer (B) each had a thickness of 25 μm.

[0075] Comparative Example 1 (Preparation of Laminate) A laminate shown in Fig. 1 was prepared by carrying out the same procedure as in Example 1, except that a 25 µm thick polyphenylene sulfide "Torelina" (manufactured by Toray Industries, Inc.) was used as the core material instead of the cycloolefin polymer "ZEONORFILM ZF16". In the obtained laminate, the thermosetting resin layer (A) and the thermosetting resin layer (B) are the same.

[0076] Comparative Example 2 (Preparation of Laminate (Prepreg)) The laminate (prepreg) shown in Figure 2 was prepared by the same procedure as in Example 1, except that a 43 µm thick NER glass cloth (IPC style; #1078, manufactured by Nitto Boseki Co., Ltd.) was used as the core material instead of the cycloolefin polymer "ZEONORFILM ZF16" and the lamination conditions were changed to a lamination temperature of 120°C and a lamination pressure of 0.5 MPa. In the obtained laminate, the thermosetting resin layer (A) and the thermosetting resin layer (B) are the same.

[0077] Comparative Example 3 (Preparation of Laminate (Prepreg)) The laminate (prepreg) shown in Figure 2 was prepared by the same procedure as in Example 1, except that a 43 µm thick NE glass cloth (IPC style; #1078, manufactured by Nitto Boseki Co., Ltd.) was used as the core material instead of the cycloolefin polymer "ZEONORFILM ZF16" and the lamination conditions were changed to a lamination temperature of 120°C and a lamination pressure of 0.5 MPa. In the obtained laminate, the thermosetting resin layer (A) and the thermosetting resin layer (B) are the same.

[0078] Comparative Example 4 (Preparation of Laminate) A laminate shown in Fig. 3 was prepared by the same procedure as in Example 1, except that a 250 µm thick glass film "EAGLE XG" (manufactured by Corning Incorporated) was used as the core material instead of the cycloolefin polymer "ZEONORFILM ZF16". Note that, in a cylindrical mandrel test in accordance with JIS K5600-5-1 (1999), the core material cracked when the mandrel diameter was set to 10 mm, and therefore the evaluations and measurements described below were not carried out.

[0079] [Evaluation and Measurement Methods] The laminates obtained in the above Examples and Comparative Examples were subjected to measurements and evaluations according to the following methods. The results are shown in Table 1. (Method for Measuring Dielectric Loss Tangent (Df)) The copper foil of the laminate obtained in each Example was removed by immersion in a copper etching solution (a 10% by mass solution of ammonium persulfate), and then two pieces with a diameter of 45 mm were cut out to serve as test specimens. Using these test specimens, the dielectric loss tangent (Df) at 10 GHz and 80 GHz was measured using the balanced disc resonator method (BCDR method) in a constant temperature environment of 25°C. Measurements were made in the range of 10-110 GHz using a network analyzer (Keysight Technologies: PNA N5222B) and a millimeter wave controller (Keysight Technologies: PNA N5292A). The test piece was dried at 105°C for 30 minutes. The dried test piece was placed in the sample holder of a 1.0 mm coaxial resonator in the following order: measurement sample (φ45 mm), copper plate fixing sheet, copper plate, and test piece, and the resonator was clamped and fixed with a pressure of 4.5 kN / m. After calibration using a calibration kit (Agilent Technologies "85059A"), measurements and analysis were carried out. Measurements were made with n=3, and the average value was taken as the measured value.

[0080]

[0081] As can be seen from the results shown in Table 1, the laminates produced in the examples have a difference (ΔDf) between the dielectric loss tangent (Df) at 10 GHz and the dielectric loss tangent (Df) at 80 GHz of 0.0010 or less, and the dielectric loss tangent (Df) at 80 GHz of the cured laminate is 0.0020 or less, so it can be said that they can be used in both fifth-generation mobile communication systems (5G) and sixth-generation mobile communication systems (6G). On the other hand, the laminates produced in the comparative examples all have a difference (ΔDf) between the dielectric loss tangent (Df) at 10 GHz and the dielectric loss tangent (Df) at 80 GHz of more than 0.0010, and the dielectric loss tangent (Df) at 80 GHz of the cured laminate is more than 0.0020, so they are difficult to use in sixth-generation mobile communication systems (6G).

[0082] REFERENCE SIGNS LIST 1 Thermosetting resin layer (A) 2 Core material (thermosetting resin film) 3 Thermosetting resin layer (B) 4 Core material (fiber substrate) 5 Core material (glass film)

Claims

1. A laminate comprising a thermosetting resin composition layer (A), a core material, and a thermosetting resin composition layer (B) laminated in this order, wherein the core material is a thermosetting resin film, and the difference (ΔDf) between the dielectric loss tangent (Df) at 10 GHz and the dielectric loss tangent (Df) at 80 GHz of the cured product of the laminate is 0.0010 or less, and the dielectric loss tangent (Df) at 80 GHz of the cured product of the laminate is 0.0020 or less.

2. The laminate according to claim 1, wherein the core material does not crack when the mandrel diameter is 10 mm in a cylindrical mandrel test in accordance with JIS K5600-5-1 (1999).

3. The laminate according to claim 1, wherein the thermosetting resin composition layer (A) and the thermosetting resin composition layer (B) contain the same thermosetting resin.

4. The laminate according to claim 1, wherein the thermosetting resin composition layer (A) and the thermosetting resin composition layer (B) contain different thermosetting resins.

5. The laminate according to claim 1, wherein the components contained in the thermosetting resin composition layer (A) and the components contained in the thermosetting resin composition layer (B) are the same.

6. The laminate according to claim 1, wherein the thermosetting resin film serving as the core material contains one or more resins selected from the group consisting of cycloolefin-based polymers, styrene-based polymers, ethylene-based polymers, and propylene-based polymers.

7. The laminate according to claim 1, wherein, when the core material is replaced with a fiber substrate (excluding quartz glass cloth), the difference (ΔDf) between the dielectric dissipation factor (Df) at 10 GHz and the dielectric dissipation factor (Df) at 80 GHz of the cured product of the laminate exceeds 0.0010, or the dielectric dissipation factor (Df) at 80 GHz of the cured product of the laminate exceeds 0.0020.

8. A laminate plate comprising a cured product of the laminate according to any one of claims 1 to 7 and a metal foil.

9. A printed wiring board having a cured product of the laminate according to any one of claims 1 to 7.

10. A semiconductor package comprising the printed wiring board according to claim 9 and a semiconductor element.

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