Electronic device, operation method thereof, and storage medium

Abstract

An electronic device is disclosed. The electronic device comprises: one or more temperature sensors corresponding to one or more components included in the electronic device, respectively; one or more processors including a processing circuit; and a memory storing instructions and including one or more storage media. The instructions, when individually or collectively executed by the one or more processor, cause the electronic device to: identify a first temperature corresponding to a first component among the one or more components on the basis of sensing data obtained through the one or more temperature sensors; identify a surface temperature of the electronic device, which is predicted from the identified first temperature; identify a first scenario related to the first component among a plurality of scenarios related to the state of the electronic device; identify whether a first detection condition set in response to the identified first scenario is satisfied; correct the surface temperature to a second temperature on the basis of the first detection condition being satisfied; and control at least one operation for heat generation control of the electronic device on the basis of the corrected second temperature.

Description

Electronic devices and their operating methods and storage media

[0001] The present disclosure relates to an electronic device for performing a heat control operation, an operating method thereof, and a storage medium.

[0002] When the surface temperature of an electronic device reaches a level that may negatively affect the operation of the hardware, the electronic device may control the heat generation using a fixed control method to protect the chipset, or may control the heat generation of the electronic device using a control method determined in advance based on the surface temperature of the electronic device.

[0003] For example, as the performance of application processors (APs) used in electronic devices such as mobile devices increases, their power consumption also increases significantly. This can lead to a rapid increase in the device's surface temperature under high load conditions. If the surface temperature of an electronic device cannot be accurately predicted, controlling its heat generation can become difficult.

[0004] An electronic device according to one embodiment of the present disclosure includes at least one temperature sensor corresponding to each of at least one component included in the electronic device, at least one processor including a processing circuit, and a memory storing instructions, including one or more storage media, wherein the instructions, when individually or collectively executed by the at least one processor, can cause the electronic device to determine a first temperature corresponding to a first component among the at least one component based on sensing data acquired through the at least one temperature sensor.

[0005] The above instructions may cause the electronic device to determine a surface temperature of the electronic device predicted from the determined first temperature.

[0006] The above instructions may cause the electronic device to identify a first scenario associated with the first component among a plurality of scenarios associated with a state of the electronic device.

[0007] The above instructions may cause the electronic device to determine whether a first detection condition set in response to the identified first scenario is satisfied.

[0008] The above instructions may cause the electronic device to compensate the surface temperature of the electronic device predicted from the first temperature to a second temperature based on satisfaction of the first detection condition.

[0009] The above instructions may cause the electronic device to control at least one operation for controlling heat generation of the electronic device based on the compensated second temperature.

[0010] A method of operating an electronic device according to one embodiment may include an operation of checking a first temperature corresponding to a first component among at least one component based on sensing data acquired through at least one temperature sensor corresponding to each of at least one component included in the electronic device.

[0011] A method of operating an electronic device according to one embodiment may include an operation of checking a surface temperature of the electronic device predicted from the checked first temperature.

[0012] A method of operating an electronic device according to one embodiment may include an operation of identifying a first scenario related to the first component among a plurality of scenarios related to a state of the electronic device.

[0013] A method of operating an electronic device according to one embodiment may include an operation of confirming whether a first detection condition set in response to the confirmed first scenario is satisfied.

[0014] A method of operating an electronic device according to one embodiment may include an operation of correcting a surface temperature of the electronic device predicted from the first temperature to a second temperature based on satisfaction of the first detection condition.

[0015] A method of operating an electronic device according to one embodiment may include an operation of controlling at least one operation for controlling heat generation of the electronic device based on the corrected second temperature.

[0016] In a storage medium storing computer-readable instructions according to one embodiment, the instructions, when individually or collectively executed by at least one processor of an electronic device, can cause the electronic device to determine a first temperature corresponding to a first component among the at least one component based on sensing data acquired through at least one temperature sensor corresponding to each of the at least one component included in the electronic device.

[0017] The above instructions may cause the electronic device to determine a surface temperature of the electronic device predicted from the determined first temperature.

[0018] The above instructions may cause the electronic device to identify a first scenario associated with the first component among a plurality of scenarios associated with a state of the electronic device.

[0019] The above instructions may cause the electronic device to determine whether a first detection condition set in response to the identified first scenario is satisfied.

[0020] The above instructions may cause the electronic device to compensate the surface temperature of the electronic device predicted from the first temperature to a second temperature based on satisfaction of the first detection condition.

[0021] The above instructions may cause at least one operation for controlling heat generation of the electronic device based on the compensated second temperature.

[0022] In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar components.

[0023] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment.

[0024] FIG. 2 is a block diagram of configurations of an electronic device according to one embodiment.

[0025] FIG. 3 is a flowchart illustrating an operating method of an electronic device according to one embodiment.

[0026] FIG. 4 is a flowchart illustrating a method for confirming a first temperature and a first threshold temperature according to one embodiment.

[0027] FIG. 5 is a flowchart illustrating a method for controlling the operation of an electronic device based on surface temperature according to one embodiment.

[0028] FIG. 6 is a flowchart illustrating a method for determining a surface temperature corresponding to an electronic device based on a plurality of compensated temperatures according to one embodiment.

[0029] Figure 7 is a flowchart illustrating a method for checking surface temperature according to one embodiment.

[0030] FIG. 8 is a flowchart illustrating a method for confirming a corrected second temperature according to one embodiment.

[0031] FIG. 9 is a flowchart illustrating a method for controlling the operation of at least one component according to one embodiment.

[0032] FIG. 10 is a flowchart illustrating a method for controlling the operation of an electronic device based on context information according to one embodiment.

[0033] FIG. 11 is a block diagram of an electronic device including a plurality of modules according to one embodiment.

[0034] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings so that those skilled in the art can easily implement the present disclosure. However, the present disclosure may be implemented in various different forms and is not limited to the embodiments described herein. In connection with the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Furthermore, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0035] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to one embodiment. Referring to FIG. 1, in the network environment (100), the electronic device (101) may communicate with the electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of the electronic device (104) or the server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0036] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0037] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0038] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0039] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0040] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0041] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0042] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0043] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0044] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0045] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0046] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0047] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0048] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0049] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0050] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0051] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0052] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0053] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the at least one selected antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0054] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0055] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0056] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0057] In the detailed description below, reference numerals in the drawings may be used interchangeably or omitted for components that can be easily understood through the preceding embodiments, and their detailed descriptions may also be omitted. An electronic device according to an embodiment disclosed in this document may be implemented by selectively combining components of different embodiments, and components of one embodiment may be replaced by components of another embodiment. For example, it should be noted that the present invention is not limited to specific drawings or embodiments.

[0058] FIG. 2 is a block diagram of configurations of an electronic device according to one embodiment.

[0059] According to FIG. 2, according to one embodiment, an electronic device (200, e.g., electronic device (101) of FIG. 1) may include at least one temperature sensor (210, e.g., sensor module (176) of FIG. 1) corresponding to each of at least one component included in the electronic device, at least one processor (220, or processor) including a processing circuit, and a memory (230, e.g., memory (130) of FIG. 1) storing instructions and including one or more storage media.

[0060] According to one embodiment, at least one temperature sensor (210) may correspond to each of at least one component included in the electronic device (200). According to one example, the at least one component may be at least one hardware included in the electronic device. According to one example, the at least one component may include various types of components, including an application processor (AP), a battery, a charger (or a battery charging module), an amplifier (e.g., a power amplifier (PA)), a communication processor (CP), and a wireless fidelity (or wi-fi) communication module.

[0061] In one example, at least one temperature sensor (210) may be implemented as a thermistor (or a thermistor circuit). In one example, the temperature sensors (210) corresponding to each of at least one components included in the electronic device may be respectively positioned on one side of the components. Alternatively, the temperature sensors (210) may be positioned at adjacent locations within a certain distance from the corresponding components.

[0062] According to one embodiment, at least one processor (220, hereinafter, processor) may have at least a portion of the same or similar configuration as the processor (120) of FIG. 1. According to one embodiment, the processor (220) may include one or more processors.

[0063] According to one embodiment, the memory (230) may have at least a portion of the same or similar configuration as the memory (130) of FIG. 1. For example, the memory (230) may be configured to temporarily or permanently store digital data and may include at least a portion of the configuration and / or functions of the memory (130) of FIG. 1.

[0064] The memory (230) according to one embodiment can store various instructions that can be executed by at least one processor (220). In addition, the memory (230) can store at least a portion of the program (140) of FIG. 1. Such instructions can include control commands such as logical operations and data input / output that can be recognized and executed by the processor (220). There is no limitation on the type and / or amount of data that the memory (230) can store, but this document will describe the configuration and function of the memory related to the operation of the processor (220) that performs the method and the method for confirming a user command according to various embodiments. The memory (230) can store various information, and the various information stored by the memory (230) will be described in detail below.

[0065] According to one embodiment, when sensing data is acquired through at least one temperature sensor (210, or temperature sensor), the processor (220) may determine a temperature (or component temperature) corresponding to at least one component of the electronic device (200) based on the acquired sensing data. According to one example, the temperature sensors (210) corresponding to each of at least one component included in the electronic device (200) may be respectively disposed on one side of the at least one component. According to one example, the electronic device (200) may acquire sensing data from a first temperature sensor provided on one side of a first component included in the electronic device (200). According to one example, the electronic device (200) may determine a first temperature (or first component temperature) corresponding to the first component through sensing data acquired from the first temperature sensor corresponding to the first component.

[0066] According to one embodiment, the processor (220) may determine a predicted temperature corresponding to at least one component based on a temperature corresponding to at least one component. According to one example, the predicted temperature corresponding to the first component may be a temperature predicted based on the first temperature. According to one example, the predicted temperature corresponding to the first component may be a temperature (e.g., a surface temperature) corresponding to a zone (or area) on the surface of the electronic device (200) corresponding to a location of the first component. According to one example, the processor (220) may obtain a first predicted temperature (e.g., a first surface temperature) of the first zone corresponding to the first component from the first temperature using a specified algorithm. The first predicted temperature will be described later.

[0067] According to one embodiment, the processor (220) may identify a first scenario related to the first component among a plurality of scenarios related to the state of the electronic device. Examples of the plurality of scenarios will be described below.

[0068] According to one embodiment, the processor (220) may determine whether a first detection condition set in response to the identified first scenario among a plurality of detection conditions is satisfied. According to one embodiment, the processor (220) may determine, as an example of the detection condition, whether a temperature corresponding to any one of at least one component exceeds a critical temperature. According to one example, the processor (220) may determine whether a first temperature corresponding to the first component exceeds the first critical temperature. According to one example, the first critical temperature may be a reference value for determining whether to correct a first predicted temperature corresponding to the first component. According to one example, the first critical temperature may be defined based on a temperature corresponding to at least a portion of the at least one component. According to one example, the processor (220) may determine the first temperature at a specified period (e.g., 10 seconds) to determine whether the first temperature exceeds the first critical temperature. The first temperature and the first critical temperature will be described in detail with reference to FIG. 4.

[0069] According to one embodiment, the processor (220) may cause the predicted temperature (e.g., surface temperature) of the electronic device predicted from the first temperature to be corrected to a second temperature based on satisfaction of the first detection condition.

[0070] According to one embodiment, the processor (220) may identify one of a plurality of scenarios related to the state of the electronic device (200) (or the operating state of the electronic device (200)) as described above. According to one example, the plurality of scenarios related to the state of the electronic device (200) may be states related to heat generation of the electronic device (200). The plurality of scenarios may include various types of heat generation-related scenarios, including, for example, a high performance (or high use) scenario of an application processor, a fast charging scenario, a high volume scenario, an uplink operation scenario of a Wi-Fi communication module, and an uplink operation scenario of an RF (radiofrequency) circuit.

[0071] For example, the processor (220) may determine whether a first temperature corresponding to a first component exceeds a first threshold temperature as a detection condition for the first scenario. For example, if the first component is identified as an application processor, the first scenario may be a high-performance (or high-use) scenario of the application processor.

[0072] According to one embodiment, when a detection condition for any one of a plurality of scenarios is satisfied, the processor (220) may identify parameters related to any one of the scenarios for which the detection condition is satisfied. According to one example, information about the scenario corresponding to each of at least one component may be stored in a memory (e.g., memory (230) of FIG. 2). According to one example, the information about the scenario may include information about components related to the scenario and information about parameters related to the scenario.

[0073] For example, it may be assumed that a first scenario related to a first component is confirmed. For example, a parameter related to the first scenario may be a parameter included in a mathematical expression (e.g., mathematical expression 1) used to correct a first predicted temperature corresponding to the first component. For example, the first parameter related to the first scenario may be a parameter related to the first component corresponding to the first scenario. For example, parameters related to each of a plurality of scenarios (or parameters corresponding to each of at least one component included in the electronic device (200)) may be stored in the memory (230). Alternatively, for example, the processor (220) may obtain parameters related to each of a plurality of scenarios from an external device (e.g., at least one of the electronic device (102), the electronic device (104), or the server (108) of FIG. 1).

[0074] According to one embodiment, the processor (220) may correct the surface temperature predicted from the first temperature to the second temperature based on the identified first parameter. According to one example, when the first temperature corresponding to the first component and the first parameter corresponding to the first scenario related to the first component are obtained, the processor (220) may perform correction on the surface temperature predicted from the first temperature corresponding to the first component using at least one of the following mathematical expressions (1) and (2).

[0075]

[0076]

[0077] For example, is a first predicted temperature (e.g., surface temperature of the first zone) of a first zone corresponding to a first component related to a first scenario, and the processor (220) can obtain the first predicted temperature (or first surface temperature) from the first temperature using a specified algorithm. According to an example, is a correction value for correcting the first predicted temperature, may be a reference temperature of the first zone. In one example, scale may be a proportional constant of the first zone, and offset may be an additive constant of the first zone. In one example, the first parameter corresponding to the first component related to the first scenario is, in mathematical expression 1, scale, and offset can be at least one of: may be a second temperature corrected from the surface temperature predicted from the first temperature. For example, may be the corrected surface temperature of the first zone.

[0078] In one example, at least one zone within the electronic device (200) corresponding to a component associated with the scenario may be identified. In one example, the at least one zone may be a zone on the surface of the electronic device (200) corresponding to the location of the component. In one example, there may be more than one zone corresponding to a component.

[0079] For example, if multiple zones corresponding to the first part related to the first scenario are identified, the first parameter corresponding to the first part may have multiple values. For example, if the zones corresponding to the first part are zone 'A' and zone 'B', the first parameter corresponding to zone 'A' and zone 'B' may have multiple values. The value, scale value and offset value can be confirmed respectively. For example, the 'A' zone can be set as a zone corresponding to the first component among the first side (e.g., front) of the electronic device, and the 'B' zone can be set as a zone corresponding to the first component among the second side (e.g., back) facing the first side of the electronic device. In one example, even in the case of the 'A' zone and the 'B' zone corresponding to the same component, the predicted temperature (or surface temperature) corresponding to each zone can be different. In one example, the predicted temperature (or surface temperature) corresponding to each of the 'A' zone and the 'B' zone can be set as a zone corresponding to the 'A' zone and the 'B' zone, respectively. and The values ​​may vary. This will be explained later.

[0080] For example, when a first detection condition set in response to a first scenario is satisfied (e.g., a first temperature exceeds a first threshold temperature), and a first parameter corresponding to a first scenario related to a first component is confirmed, the processor (220) may obtain a correction value corresponding to the first scenario from mathematical expression 1 to which the confirmed first parameter is applied, and may check a second temperature to which the surface temperature is corrected by mathematical expression 2 to which the obtained correction value is applied.

[0081] According to one embodiment, the processor (220) may control at least one operation for controlling heat generation of the electronic device (200) based on the second temperature for which the surface temperature is corrected. According to one example, the processor (220) may determine a control level for controlling heat generation of the electronic device (200) based on the second temperature for which the surface temperature is corrected, and control the operation of at least one component of the electronic device (200) based on the determined control level. This will be described in detail with reference to FIG. 10.

[0082] FIG. 3 is a flowchart illustrating an operating method of an electronic device according to one embodiment.

[0083] Hereinafter, an operating method of an electronic device (e.g., an electronic device (200) of FIG. 2) according to various embodiments will be described in detail. According to various embodiments, operations performed by the electronic device described below may be executed by a processor (e.g., at least one processor (220) of FIG. 2) including at least one processing circuitry of the electronic device. According to one embodiment, the operations performed by the electronic device may be stored in a memory (e.g., a memory (230) of FIG. 2) and, when executed, may be executed by instructions that cause the processor (220) to operate. In the following embodiments, each operation may be performed sequentially, but is not necessarily performed sequentially. For example, the order of each operation may be changed, and at least two operations may be performed in parallel. Depending on the implementation, certain operations may be omitted.

[0084] Referring to FIG. 3, according to one embodiment, in operation 301, the electronic device can determine a first temperature (e.g., the first temperature of FIG. 2) corresponding to a first component (e.g., the first component of FIG. 2) among at least one component (e.g., the at least one component of FIG. 2) based on sensing data (e.g., the sensing data of FIG. 2) acquired through at least one temperature sensor (e.g., at least one temperature sensor (210) of FIG. 2) corresponding to each of at least one component included in the electronic device.

[0085] According to one embodiment, in operation 303, the electronic device may identify a first scenario related to a first component among a plurality of scenarios related to a state of the electronic device (e.g., the plurality of scenarios of FIG. 2). According to one example, the electronic device may identify whether a first detection condition set corresponding to the identified first scenario is satisfied. According to one example, the electronic device may identify whether the first detection condition is satisfied by comparing the identified first temperature with a first threshold temperature set corresponding to the first scenario and identifying whether the first temperature exceeds the first threshold temperature. According to various embodiments, the aforementioned operation 303 may be omitted. For example, the electronic device may identify whether the first detection condition corresponding to the first component is satisfied without identifying the first temperature corresponding to the first component and the first scenario related to the first component.

[0086] According to one embodiment, in operation 305, the electronic device may correct a predicted temperature (e.g., a surface temperature) of the electronic device predicted from a first temperature to a second temperature (e.g., the second temperature of FIG. 2) based on satisfying a first detection condition set in response to the identified first scenario.

[0087] In one example, the electronic device may check a first parameter (e.g., the first parameter of FIG. 2) related to the first scenario when a first detection condition set corresponding to the first scenario is satisfied. In one example, the electronic device may check a first predicted temperature (e.g., the first predicted temperature of FIG. 2) (e.g., a surface temperature) of a first zone (e.g., at least one zone of FIG. 2) corresponding to the first component from the first temperature. In one example, the electronic device may apply the checked first parameter to Equation 1 to obtain a correction value (e.g., the correction value of FIG. 2) corresponding to the first predicted temperature, and may apply the obtained correction value to Equation 2 to correct the first predicted temperature (e.g., the surface temperature) predicted from the first temperature to a second temperature.

[0088] According to one embodiment, in operation 307, the operating method may control at least one operation for controlling heat generation of the electronic device based on the corrected second temperature. According to one example, the electronic device may determine the corrected second temperature of the first zone corresponding to the first component as a surface temperature. According to one example, the electronic device may determine a control level for controlling heat generation of the electronic device based on the determined surface temperature (e.g., the surface temperature corrected to the second temperature). According to one example, the electronic device may control the operation of at least one component of the electronic device based on the determined control level. This will be described later.

[0089] FIG. 4 is a flowchart illustrating a method for confirming a first temperature and a first threshold temperature according to one embodiment.

[0090] Referring to FIG. 4, according to one embodiment, in operation 401, the electronic device may determine a first temperature (e.g., the first temperature of FIG. 2) corresponding to the first component based on sensing data (e.g., the sensing data of FIG. 2) acquired through a first temperature sensor corresponding to the first component (e.g., the first component of FIG. 2). According to one example, the first temperature sensor may be any one of at least one temperature sensor (e.g., at least one temperature sensor (210) of FIG. 2) included in the electronic device (e.g., the electronic device (200) of FIG. 2). According to one example, the first temperature sensor may be provided on one side of the first component, or may be provided at a location adjacent to the first component.

[0091] According to one embodiment, in operation 403, the electronic device may determine a threshold temperature (e.g., the first threshold temperature of FIG. 2) based on sensing data acquired through at least some of at least one temperature sensor. According to one example, the first threshold temperature corresponding to the first component may be determined through Table 1 below.

[0092] Scenario Components Critical Temperatures Corresponding to Components (℃) High Performance Application Processor Max (USB, BAT) + 2℃ Fast Charging Battery Charging Module Max (others) + 4℃ High Volume Speaker Max (USB, BAT) + 10℃ Uplink Operation of Wi-Fi Communication Module Wi-Fi Communication Module Max (others) + 4℃ Uplink Operation of RF (radio frequency) Circuit Amplifier Max (others) + 4℃

[0093] For example, it may be assumed that the first component is an application processor. For example, referring to Table 1, the electronic device may determine a value that adds 2℃ to the maximum value among the temperature corresponding to the battery (or BAT) obtained through a temperature sensor corresponding to the battery and the temperature corresponding to the connection module (or USB (universal serial bus)) obtained through a temperature sensor corresponding to the connection module, as the threshold temperature corresponding to the application processor (e.g., the first threshold temperature). For example, when the temperature corresponding to the application processor (e.g., the first temperature) is determined based on sensing data obtained from the temperature sensor corresponding to the application processor, the electronic device may determine whether the determined temperature exceeds the threshold temperature corresponding to the application processor (e.g., the first threshold temperature). For example, the electronic device may determine that a first detection condition set corresponding to a high-performance scenario (e.g., a first scenario) of the application processor is satisfied when the determined temperature exceeds a threshold temperature corresponding to the application processor, and may determine a parameter related to the scenario (e.g., the first scenario). For example, the electronic device may correct a predicted temperature (e.g., a surface temperature) for a zone (e.g., at least one zone of FIG. 2) corresponding to the application processor using the determined parameter. For example, it may be assumed that the first component is a battery charging module. For example, the electronic device may determine a value that adds 4°C to a maximum value of temperatures corresponding to components other than the battery charging module (indicated as 'others' in Table 1) among temperatures corresponding to at least one component (e.g., at least one component of FIG. 2) acquired based on sensing data acquired through at least one temperature sensor, as the threshold temperature corresponding to the battery charging module.For example, when a temperature corresponding to a battery charging module is identified based on sensing data acquired from a temperature sensor corresponding to the battery charging module, the electronic device may compare the identified temperature with a threshold temperature corresponding to the battery charging module to determine whether a predicted temperature (or a predicted temperature of a zone corresponding to the battery charging module) (e.g., a surface temperature) corresponding to the battery charging module is to be corrected. For example, when the identified temperature exceeds the threshold temperature corresponding to the battery charging module, the electronic device may determine that a detection condition set corresponding to a fast charging scenario among a plurality of scenarios is satisfied, and may check a parameter related to the scenario. For example, the electronic device may correct a predicted temperature (e.g., a surface temperature) for a zone corresponding to the battery charging module using the identified parameter.

[0094] For example, it may be assumed that the first component is a speaker. For example, the electronic device may determine a threshold temperature corresponding to the speaker as a value that is 10°C added to the maximum value of the temperature corresponding to the battery (or BAT) and the temperature corresponding to the connection module (or USB). For example, the electronic device may compare the temperature corresponding to the speaker with the threshold temperature corresponding to the speaker to determine whether to correct the predicted temperature corresponding to the speaker (or the predicted temperature of the area corresponding to the speaker) (e.g., surface temperature). For example, if the determined temperature exceeds the threshold temperature corresponding to the speaker, the electronic device may determine that a detection condition set for a high volume scenario among a plurality of scenarios is satisfied, and may check a parameter related to the scenario. For example, the electronic device may correct the predicted temperature (e.g., surface temperature) for the area corresponding to the speaker using the checked parameter.

[0095] For example, it can be assumed that the first component is a Wi-Fi communication module. For example, the electronic device can determine a value that adds 4℃ to the maximum value of the temperature (indicated as 'others' in Table 1) corresponding to a component excluding the Wi-Fi communication module among at least one component (e.g., at least one component of FIG. 2), as the threshold temperature corresponding to the Wi-Fi communication module. For example, the electronic device can compare the temperature corresponding to the Wi-Fi communication module with the threshold temperature corresponding to the Wi-Fi communication module to determine whether the predicted temperature (or the predicted temperature of the area corresponding to the Wi-Fi communication module) (e.g., the surface temperature) corresponding to the Wi-Fi communication module is corrected. For example, if the determined temperature exceeds the threshold temperature corresponding to the Wi-Fi communication module, the electronic device can determine that the detection condition set corresponding to an uplink operation scenario of the Wi-Fi communication module among a plurality of scenarios is satisfied, and can determine a parameter related to the scenario. In one example, the electronic device may use the identified parameters to calibrate an estimated predicted temperature (e.g., surface temperature) for an area corresponding to the Wi-Fi communication module.

[0096] For example, it may be assumed that the first component is an amplifier (e.g., a power amplifier). For example, the amplifier may be an amplifier included in a radio frequency front end (RFFE) circuit included in an electronic device. For example, the electronic device may determine a threshold temperature corresponding to the amplifier as a value obtained by adding 4°C to the maximum value of temperatures corresponding to components (indicated as 'others' in Table 1) excluding the amplifier among at least one component (e.g., at least one component of FIG. 2). For example, the electronic device may compare the temperature corresponding to the amplifier with the threshold temperature corresponding to the amplifier to determine whether a predicted temperature (or a predicted temperature of a region corresponding to the amplifier) ​​(e.g., a surface temperature) corresponding to the amplifier is corrected. For example, if the determined temperature exceeds the threshold temperature corresponding to the amplifier, the electronic device may determine that a detection condition set corresponding to an uplink operation scenario of the RF circuit among a plurality of scenarios is satisfied, and may determine a parameter related to the scenario. In one example, the electronic device may use the identified parameters to compensate for the temperature of a region corresponding to the amplifier (or radio frequency front end (RFFE) circuit).

[0097] For example, the electronic device may determine whether compensation is necessary by further considering the time for which the identified temperature remains above the threshold temperature. This will be described in detail with reference to FIG. 9.

[0098] FIG. 5 is a flowchart illustrating a method for controlling the operation of an electronic device based on surface temperature according to one embodiment.

[0099] Referring to FIG. 5, according to one embodiment, in operation 501, an electronic device (e.g., electronic device (200) of FIG. 2) may check the predicted temperature (e.g., predicted temperature of FIG. 2) of each zone of the electronic device (e.g., zone of FIG. 2) excluding a first zone (e.g., first zone of FIG. 2).

[0100] In one example, the electronic device may determine a first predicted temperature corresponding to a first zone (or a predicted temperature of the first zone) based on a first temperature corresponding to a first component among at least one zone of the electronic device. In one example, if the zone of the electronic device corresponding to a second component is a second zone, the electronic device may determine a second predicted temperature corresponding to a second zone (or a predicted temperature of the second zone) based on a temperature corresponding to the second component.

[0101] In one embodiment, at operation 503, the electronic device may determine a surface temperature corresponding to the electronic device based on at least a portion of the corrected second temperature and the predicted temperature of the remaining zone.

[0102] For example, the surface temperature corresponding to the electronic device may be a predicted temperature for the entire surface of the electronic device. For example, the electronic device may determine the surface temperature corresponding to the electronic device based on a predicted temperature corresponding to each of at least one zone (e.g., at least one zone of FIG. 2 ) obtained based on a temperature corresponding to each of at least one component, and a second temperature corresponding to the first zone, which is a corrected first predicted temperature. Accordingly, the accuracy of the calculated surface temperature may be improved compared to a case where the surface temperature corresponding to the electronic device is calculated based on the first predicted temperature.

[0103] For example, the electronic device may be configured to calculate the overall surface temperature using a specified algorithm, when the compensated second temperature and the predicted temperature of the remaining zones of the electronic device, excluding the first zone, are identified.

[0104] In one example, the electronic device can determine the surface temperature by inputting the corrected second temperature and the predicted temperatures of the remaining zones into a learned artificial intelligence model. In one example, the learned artificial intelligence model may be a model trained to output the surface temperature corresponding to the electronic device when the temperature corresponding to each of at least one zone of the electronic device is input. In one example, the learned artificial intelligence model may be an artificial intelligence model trained using supervised or unsupervised machine learning.

[0105] For example, the electronic device corresponding to the first component associated with the first scenario (e.g., the first scenario of FIG. 2) may have multiple zones. For example, if the zones corresponding to the first component are zone 'A' and zone 'B', each of zones 'A' and 'B' may be identified based on the temperature corresponding to the first component.

[0106] For example, referring to Table 2, a first parameter associated with a first scenario (e.g., the first parameter of FIG. 2) may have multiple values ​​corresponding to each of a plurality of zones corresponding to the first component.

[0107] Scenario Parts Zone T REFscaleoffset High performance application processor 'A' zone, 'B' zone 430, 4301.05, 1.042, 5 Fast charging battery charging module 'C' zone, 'D' zone 350, 3501.0, 1.021, 2 High volume speaker 'E' zone, 'F' zone 350, 3501.0, 1.05, 3 Uplink operation of Wi-Fi communication module Wi-Fi communication module 'G' zone, 'H' zone 350, 3501.0, 1.020, 10 Uplink operation of radio frequency (RF) circuit amplifier 'A' zone, 'B' zone 350, 3501.0, 1.022, 10

[0108] For example, it can be assumed that the first scenario is a case where the application processor is high-performance. Since the areas corresponding to the application processors related to the first scenario are area 'A' and area 'B', corresponding to area 'A' and area 'B' respectively Value (e.g., in Fig. 2) The value), scale value (e.g., scale value of Fig. 2) and offset value (e.g., offset value of Fig. 2) can be verified. The electronic device, when the temperature corresponding to the application processor exceeds the threshold temperature corresponding to the application processor (e.g., threshold temperature of Fig. 2), corresponds to the 'A' zone. By applying the value, scale value and offset value to Equation 1 and Equation 2, the corrected second temperature corresponding to the 'A' zone can be confirmed. In this case, in Equation 1, The value is a predicted temperature based on the temperature corresponding to the application processor, and may be a predicted value considering the location of the 'A' zone. The electronic device may be located in the corresponding 'B' zone. By applying the value, scale value and offset value to Equation 1 and Equation 2, the corrected second temperature corresponding to the 'B' zone can be confirmed. In this case, in Equation 1, The value is a predicted temperature based on the temperature corresponding to the application processor, and may be a predicted value considering the location of the 'B' zone. In one example, the electronic device may obtain the surface temperature corresponding to the electronic device based on the corrected temperature corresponding to each zone. In one example, when the corrected temperatures corresponding to multiple components are respectively obtained, the electronic device may obtain the surface temperature based on the zones corresponding to the multiple components and the priorities between the multiple components. This will be described in detail with reference to FIG. 7. In one embodiment, in operation 505, the electronic device may control at least one operation for controlling heat generation of the electronic device based on the identified surface temperature. In one example, the electronic device may control the operation of hardware included in the electronic device according to a control level specified for each of the multiple temperature sections. In one example, when the surface temperature corresponding to the electronic device is identified, the electronic device may identify a temperature section in which the identified surface temperature is included. In one example, the electronic device may control the operation of hardware (e.g., at least one component of FIG. 2) according to the control level corresponding to the identified temperature section.

[0109] FIG. 6 is a flowchart illustrating a method for determining a surface temperature corresponding to an electronic device based on a plurality of compensated temperatures according to one embodiment.

[0110] Referring to FIG. 6, according to one embodiment, in operation 601, the electronic device may determine, based on sensing data acquired through at least one temperature sensor (e.g., at least one temperature sensor of FIG. 2), whether a third temperature corresponding to a second component among at least one component (e.g., at least one component of FIG. 2) exceeds a second threshold temperature (e.g., the threshold temperature of FIG. 4).

[0111] In one example, an electronic device (e.g., the electronic device (200) of FIG. 2) may determine a third temperature corresponding to a second component based on sensing data acquired through a temperature sensor corresponding to the second component. In one example, the electronic device may determine a second threshold temperature based on a temperature corresponding to at least some of the components, excluding the second component, among at least one component. In one example, the second threshold temperature may be a threshold temperature corresponding to the second component. In one example, the electronic device may determine a predicted temperature of a second zone corresponding to the second component based on the third temperature.

[0112] According to one embodiment, in operation 603, the electronic device may identify a second scenario related to the second component among a plurality of scenarios (e.g., the plurality of scenarios of FIG. 2 ) based on whether the third temperature exceeds the second threshold temperature. According to one example, information about a scenario corresponding to each of at least one component may be stored in a memory (e.g., the memory 230 of FIG. 2 ). According to one example, the information about the scenario may include information about a component related to the scenario and information about a parameter related to the scenario (e.g., the parameter of FIG. 2 ). According to one example, the electronic device may identify a second scenario related to the second component among the plurality of scenarios based on the information stored in the memory.

[0113] According to one embodiment, in operation 605, the electronic device can determine a fourth temperature corrected from the third temperature using a second parameter associated with the second scenario. According to one example, the electronic device can compare the determined third temperature with the determined second threshold temperature to determine whether the third temperature exceeds the second threshold temperature. According to one example, if the third temperature exceeds the second threshold temperature, the electronic device can determine a second parameter corresponding to the second zone as a parameter associated with the second component. For example, the electronic device can determine a fourth temperature corrected from the third temperature using a second parameter associated with the second scenario. Value (e.g. in Fig. 2) The scale value corresponding to the second zone (e.g., the scale value in Fig. 2) and the offset value corresponding to the second zone (e.g., the offset value in Fig. 2) can be respectively identified as parameters related to the second scenario.

[0114] For example, the electronic device can determine a fourth temperature corrected from the third temperature by applying a second parameter related to the second scenario to Equations 1 and 2. For example, when the predicted temperature of the second zone is determined from the third temperature, the electronic device can determine the corrected fourth temperature using the predicted temperature of the second zone and the second parameter corresponding to the second zone.

[0115] In one embodiment, at operation 607, the electronic device may determine a surface temperature of the electronic device based on the compensated second temperature (e.g., the second temperature of FIG. 2) and the compensated fourth temperature.

[0116] In one example, the electronic device may determine a surface temperature (e.g., the overall surface temperature of FIG. 5 ) corresponding to the electronic device based on the corrected second temperature, the corrected fourth temperature, and the predicted temperature corresponding to each of at least one zone. For example, the electronic device may determine a surface temperature corresponding to the electronic device by inputting the temperature (or predicted temperature) corresponding to each of at least one zone including the corrected second temperature and the corrected fourth temperature into a learned artificial intelligence model (e.g., the learned artificial intelligence model of FIG. 5 ).

[0117] Figure 7 is a flowchart illustrating a method for checking surface temperature according to one embodiment.

[0118] Referring to FIG. 7, according to one embodiment, in operation 701, the electronic device can verify whether at least a portion of a first zone (e.g., zone of FIG. 2) of the electronic device corresponding to a first component (e.g., the first component of FIG. 2) and a second zone (e.g., zone of FIG. 2) of the electronic device corresponding to a second component (e.g., the second component of FIG. 6) are the same.

[0119] For example, as shown in Table 2 above, there may be multiple zones corresponding to each component. For example, an electronic device (e.g., electronic device (200) of FIG. 2) may identify a first zone corresponding to a first component among at least one component corresponding to the electronic device, and may identify a second zone corresponding to a second component among at least one component corresponding to the electronic device. For example, the electronic device may identify whether at least a portion of the first zone corresponding to the first component and the second zone corresponding to the second component are the same.

[0120] In one embodiment, at operation 703, the electronic device can determine a priority between the first component and the second component based on determining that at least some of them are identical.

[0121] In one example, rank information corresponding to each of at least one component may be stored in a memory (e.g., memory (230) of FIG. 2). Alternatively, in one example, the electronic device may obtain rank information corresponding to each of at least one component from an external device (e.g., electronic device (102) of FIG. 1 or server (108)). In one example, when the zone corresponding to the first component includes an 'A' zone (e.g., at least one zone of FIG. 2) and the zone corresponding to the second component includes an 'A' zone, the electronic device may determine the priority between the first component and the second component based on the information stored in the memory.

[0122] In one embodiment, at operation 705, the electronic device can determine a surface temperature (e.g., surface temperature of FIG. 5) using at least one of a compensated second temperature (e.g., second temperature of FIG. 2) and a compensated fourth temperature (e.g., fourth temperature of FIG. 6) based on prioritizing the first component.

[0123] For example, if the first component is identified as the priority, the electronic device may identify the second temperature, which is the temperature corresponding to the first component as the priority, as the compensated temperature corresponding to the 'A' zone. Alternatively, for example, if the second component is identified as the priority, the electronic device may identify the fourth temperature, which is the temperature corresponding to the second component as the priority (e.g., the fourth temperature in FIG. 6), as the compensated temperature corresponding to the 'A' zone.

[0124] For example, the electronic device may determine the corrected temperature corresponding to Zone 'A' based on the specified weights. For example, if the first component is determined to be a priority, the electronic device may multiply the second temperature by the first weight corresponding to the priority, and multiply the fourth temperature by the second weight corresponding to the subsequent priority, thereby obtaining the corrected temperature corresponding to Zone 'A'.

[0125] FIG. 8 is a flowchart illustrating a method for confirming a corrected second temperature according to one embodiment.

[0126] Referring to FIG. 8, according to one embodiment, in operation 801, the electronic device may determine whether a time period during which a first temperature (e.g., the first temperature of FIG. 2) exceeds a first threshold temperature (e.g., the first threshold temperature of FIG. 2) is greater than or equal to a first time period.

[0127] In one example, an electronic device (e.g., electronic device (200) of FIG. 2) may, when it is determined that a first temperature corresponding to a first component (e.g., the first component of FIG. 2) exceeds a first threshold temperature corresponding to the first component, determine a time for which the first temperature exceeds the first threshold temperature. In one example, the electronic device may determine the first temperature at a specified interval (e.g., 10 seconds). The electronic device may determine whether the first temperature exceeds the first threshold temperature at a specified interval. In one example, the electronic device may determine whether the time for which the first temperature exceeds the first threshold temperature is 30 seconds or longer. Alternatively, in one example, the electronic device may determine whether the time for which the first temperature exceeds the first threshold temperature is 1 minute or longer. In one example, the magnitude of the first time may be different for at least one component (e.g., at least one component of FIG. 2).

[0128] In one embodiment, at operation 803, the electronic device may determine a compensated second temperature (e.g., the second temperature of FIG. 2) using the determined first parameter (e.g., the first parameter of FIG. 2) based on the exceeding time being greater than or equal to the first time.

[0129] For example, the electronic device may use the first parameter corresponding to the first component to determine a second temperature corrected for the first temperature, if the time for which the first temperature corresponding to the first component exceeds the first threshold temperature is greater than or equal to a first time. The electronic device may use the corrected second temperature to control the operation of at least one component included in the electronic device.

[0130] FIG. 9 is a flowchart illustrating a method for controlling the operation of at least one component according to one embodiment.

[0131] Referring to FIG. 9, according to one embodiment, in operation 901, the electronic device may determine a control level (e.g., a control level in FIG. 5) associated with at least one operation for heat control of the electronic device (e.g., the electronic device (200) in FIG. 2) based on the determined surface temperature (e.g., the overall surface temperature in FIG. 5).

[0132] For example, an electronic device may control the operation of hardware (e.g., at least one component of FIG. 2) included in the electronic device based on a control level specified for each of a plurality of temperature ranges. For example, when a surface temperature corresponding to the electronic device is identified, the electronic device may identify a temperature range that includes the identified surface temperature. The electronic device may identify a control level corresponding to the identified temperature range.

[0133] According to one embodiment, at operation 903, the electronic device may control the operation of at least one component (e.g., at least one component of FIG. 2) based on the identified control level.

[0134] For example, the electronic device may limit the clock usage of the hardware by lowering the minimum value of the limit clock (or max clock) of the hardware (e.g., a central processing unit (CPU) or a graphic processing unit (GPU)) of the electronic device as the control level increases. Alternatively, for example, the electronic device may adjust the operating clock of a Wi-Fi communication module (e.g., the Wi-Fi communication module of FIG. 4) depending on the identified control level. Alternatively, for example, the electronic device may control the operation of at least one of the above-described components, for example, at least one of the application processor, the speaker, the Wi-Fi communication module, and the amplifier, depending on the identified control level.

[0135] FIG. 10 is a flowchart illustrating a method for controlling the operation of an electronic device based on context information according to one embodiment.

[0136] Referring to FIG. 10, according to one embodiment, in operation 1001, the electronic device may verify a third parameter having a different value from a first parameter (e.g., the first parameter of FIG. 2) based on satisfying a first condition related to context information of the electronic device (e.g., the electronic device (200) of FIG. 2).

[0137] For example, the context information of an electronic device may be information related to at least one of a holding state of the electronic device or a folding state of the electronic device. Alternatively, for example, the context information may be information related to a sliding state of the electronic device. For example, if the electronic device is implemented as a foldable smartphone, the folding state of the electronic device may refer to whether the smartphone is folded. For example, if the electronic device is implemented as a slidable smartphone, the sliding state of the electronic device may refer to the degree of sliding of the smartphone.

[0138] In one example, the electronic device may determine at least one of a first parameter or a third parameter corresponding to the first component, considering a first threshold temperature (e.g., the first threshold temperature of FIG. 2) and a first condition corresponding to the first component (e.g., at least one component of FIG. 2). In one example, the first condition may be a condition related to the context of the electronic device. For example, referring to Table 3 below, within the same scenario, the electronic device may determine different parameter values ​​corresponding to the first scenario depending on whether the first temperature (e.g., the first temperature of FIG. 2) exceeds the first threshold temperature and whether the electronic device is folded.

[0139] Scenario Parts Condition Zone T REF scaleoffsetFast charging battery charging moduleFolding X and,CHG > max(others) +4°C'A' zone,'B' zone350, 3501.0, 1.021, 2Fast charging battery charging moduleFolding O and,CHG > max(others) +4°C'B' zone3801.13

[0140] For example, referring to Table 3, CHG may mean a temperature corresponding to a battery charging module, obtained through a temperature sensor corresponding to the battery charging module (e.g., at least one temperature sensor (210) of FIG. 2). For example, a threshold temperature corresponding to the battery charging module may be a value obtained by adding 4°C to the maximum value of the temperature corresponding to a component excluding the battery charging module among at least one component (e.g., at least one component of FIG. 2). For example, it may be assumed that the temperature corresponding to the battery charging module exceeds the threshold temperature corresponding to the battery charging module. For example, if the electronic device determines that the electronic device is not folded based on context information, the electronic device may identify the zones corresponding to the battery charging module as zone 'A' and zone 'B'. The electronic device may determine the zone corresponding to the battery charging module as zone 'A' and zone 'B' among the parameter values ​​corresponding to the battery charging module. Value (e.g. in Fig. 2) The electronic device can check the scale value (e.g., the scale value in Fig. 2) corresponding to the 'A' zone as '350', the scale value (e.g., the scale value in Fig. 2) corresponding to the 'A' zone as '1.0', and the offset value (e.g., the offset value in Fig. 2) corresponding to the 'A' zone as '1'. The electronic device can check the parameter values ​​corresponding to the 'B' zone among the parameter values ​​corresponding to the battery charging module. The value can be confirmed as '350', the scale value corresponding to the 'B' zone (e.g., the scale value of Fig. 2) can be confirmed as '1.02', and the offset value corresponding to the 'B' zone can be confirmed as '2'. As an example, it can be assumed that the temperature corresponding to the battery charging module exceeds the threshold temperature corresponding to the battery charging module. The electronic device can confirm the zone corresponding to the battery charging module as the 'B' zone if it is confirmed that the electronic device is in a folded state based on context information. The electronic device can confirm the zone corresponding to the battery charging module as the 'B' zone among the parameter values ​​corresponding to the 'B' zone. You can check the value as '380', the scale value corresponding to the 'B' zone (e.g., the scale value in Figure 2) as '1.1', and the offset value corresponding to the 'B' zone as '3'.

[0141] Accordingly, even for the same component (or the same scenario), parameter values ​​may vary depending on whether the electronic device is folded or not.

[0142] Or, for example, based on the state of the electronic device, corresponding to the same component. The value, scale value, and offset value may be different. For example, when a user uses an application requiring high performance while holding an electronic device, or uses an application requiring high performance while leaving the electronic device on the floor, the compensation value (e.g., the compensation value in FIG. 2) for calculating the compensation temperature (e.g., the second temperature in FIG. 2) may be different. For example, when the electronic device is left on the floor, the electronic device may set the parameter value so that the compensation value is calculated relatively low, thereby delaying the entry into the thermal mitigation operation of the electronic device. For example, when the electronic device is not fixed and the user holds the electronic device, the electronic device may set the parameter value so that the compensation value is calculated relatively high, thereby speeding up the entry into the thermal mitigation operation of the electronic device.

[0143] In one embodiment, at operation 1003, the electronic device can determine a fifth temperature corrected from the first temperature based on the determined third parameter.

[0144] For example, it may be assumed that a temperature corresponding to a battery charging module exceeds a threshold temperature corresponding to the battery charging module. If the electronic device is determined to be in an unfolded state based on context information, the electronic device may obtain a corrected temperature corresponding to the 'A' zone from the temperature corresponding to the battery charging module by using mathematical expressions 1 and 2 to which parameter values ​​corresponding to the identified 'A' zone are applied. The electronic device may obtain a corrected temperature corresponding to the 'B' zone from the temperature corresponding to the battery charging module by using mathematical expressions 1 and 2 to which parameter values ​​corresponding to the identified 'B' zone are applied.

[0145] For example, it may be assumed that the temperature corresponding to the battery charging module exceeds the threshold temperature corresponding to the battery charging module. If the electronic device determines that the electronic device is in a folded state based on context information, the electronic device may obtain a corrected temperature corresponding to the 'B' zone from the temperature corresponding to the battery charging module using Equations 1 and 2 to which the parameter values ​​corresponding to the determined 'B' zone are applied.

[0146] In one embodiment, at operation 1005, the electronic device may control the operation of the electronic device based on the compensated fifth temperature.

[0147] For example, if the temperature corresponding to the battery charging module exceeds the threshold temperature corresponding to the battery charging module and the electronic device is determined to be in a folded state, the electronic device may determine a surface temperature (e.g., the surface temperature of FIG. 5) corresponding to the electronic device based on the compensated temperature corresponding to the 'B' zone, and control the operation of the hardware of the electronic device according to a control level corresponding to the determined surface temperature.

[0148] For example, if the electronic device determines that the temperature corresponding to the battery charging module exceeds the threshold temperature corresponding to the battery charging module but the electronic device is not in a folded state, the electronic device may determine the surface temperature corresponding to the electronic device based on the corrected temperature corresponding to the 'A' zone and the corrected temperature corresponding to the 'B' zone, and control the operation of the hardware of the electronic device according to the control level corresponding to the determined surface temperature.

[0149] FIG. 11 is a block diagram of an electronic device including a plurality of modules according to one embodiment.

[0150] Referring to FIG. 11, according to one embodiment, an electronic device (e.g., the electronic device (200) of FIG. 2) may include a plurality of modules. According to one example, the electronic device may include a temperature management module (1100), a temperature prediction module (1110), and a plurality of kernels (1130).

[0151] According to one embodiment, the temperature management module (1100) may include a surface temperature manager (1101). According to one example, the surface temperature manager (1101) is a module that manages the surface temperature of an electronic device. When temperatures of at least one component (e.g., at least one component of FIG. 2) included in the electronic device are received or an estimated surface temperature of the electronic device (e.g., the entire surface temperature of FIG. 5) is received, the surface temperature manager (1101) may control the performance and function of a system (e.g., a plurality of hardware blocks) within the electronic device according to a specified temperature condition. According to one example, the surface temperature manager (1101) may control the performance of a CPU (e.g., a limited clock), the performance of a GPU (e.g., a limited clock), the charging speed of the electronic device, the brightness of a display (e.g., the display module (160) of FIG. 1), etc., based on the estimated surface temperature of the electronic device, thereby managing the surface temperature of the electronic device.

[0152] According to one embodiment, the temperature prediction module (1110) may include a surface temperature transmission module (1111, temperature sender), a temperature correction module (1112, temperature corrector), a scenario checking module (1113, scenario checker), a hardware temperature reading module (1114, hardware thermal sensor reader), and a surface temperature prediction module (1115, surface temperature predictor).

[0153] For example, when a surface temperature corresponding to an electronic device is acquired from a temperature compensation module (1112), the surface temperature transmission module (1111) can transmit the acquired surface temperature to the temperature management module (1100).

[0154] For example, the temperature compensation module (1112) may be a module that performs compensation for the entire surface temperature corresponding to the electronic device. For example, the temperature compensation module (1112) may obtain information from the scenario checking module (1113) on whether a specified condition (for example, confirming that the temperature corresponding to the first component exceeds the first threshold temperature (for example, the first threshold temperature of FIG. 2)) is satisfied. Alternatively, for example, the temperature compensation module (1112) may obtain parameter values ​​(for example, the parameters of FIG. 2) for performing temperature compensation from the scenario checking module (1113). For example, the temperature compensation module (1112) may obtain a predicted temperature (for example, the predicted temperature of FIG. 2) corresponding to each of at least one zone (for example, at least one zone of FIG. 2) of the electronic device from the surface temperature prediction module (1115). For example, the temperature compensation module (1112) may perform compensation on the predicted temperature based on the acquired predicted temperature and the acquired parameter values, and may acquire a surface temperature corresponding to the electronic device based on the temperature of each zone where compensation was performed. For example, the temperature compensation module (1112) may transmit information on the acquired surface temperature to the surface temperature transmission module (1111).

[0155] In one example, the scenario checking module (1113) may transmit information about a scenario (e.g., multiple scenarios of FIG. 2) for compensating the temperature of at least one component to the temperature compensation module (1112). In one example, the information about the scenario may be, for example, information about whether a scenario or a condition (e.g., the first condition of FIG. 11) is satisfied. In one example, the scenario checking module (1113) may transmit information about the confirmed scenario to the temperature compensation module (1112) when a specific scenario is confirmed. In one example, the scenario checking module (1113) may obtain a temperature corresponding to each of at least one component from the hardware temperature reading module (1114). In one example, when it is confirmed that a first temperature corresponding to a first component among at least one component exceeds a first threshold temperature, the scenario checking module (1113) may confirm the first scenario and transmit information about the same to the temperature compensation module (1112). For example, along with information about the scenario, a parameter value corresponding to the scenario (e.g., the first parameter in FIG. 2) may be transmitted to the temperature compensation module (1112), and the temperature compensation module (1112) may determine the surface temperature of the electronic device based on the received parameter value.

[0156] For example, the electronic device may correct (or tune) parameters related to the scenario (e.g., parameters of FIG. 2). For example, after adding a scenario, for verification purposes, the electronic device may first perform a test for the problematic scenario without adding the scenario, and measure the surface temperature with a thermal imaging camera, and obtain the maximum error and mean squared error (MSE) between the predicted temperature and the actual temperature, respectively. The electronic device may add a specific scenario and obtain the maximum error and mean squared error between the predicted temperature and the actual temperature based on the added scenario. The electronic device may compare each error value to determine whether the improvement has been made to the intended level. If the improvement is insufficient, the scenario checking module (1113) may further adjust (or tune) the parameter values ​​of the scenario.

[0157] According to an example, the hardware temperature reading module (1114) may obtain a temperature (e.g., a temperature corresponding to the first component of FIG. 2) corresponding to each of at least one component (1131, 1132, 1133, 1134, 1135, 1136) from a plurality of kernels (1130) included in the electronic device, which is identified through a temperature sensor (e.g., at least one temperature sensor (210) of FIG. 2) corresponding to each of at least one component (1131, 1132, 1133, 1134, 1135, 1136). According to an example, the hardware temperature reading module (1114) may transmit a signal requesting a temperature corresponding to each of at least one component (1131, 1132, 1133, 1134, 1135, 1136) to the plurality of kernels (1130).

[0158] For example, the surface temperature prediction module (1115) may predict the temperature of at least one zone (or the surface temperature corresponding to at least one zone) based on the temperature corresponding to at least one component including a plurality of kernels (1130). For example, the surface temperature may not be a value of a specific point within the electronic device, but may refer to predicted values ​​of the temperature of each zone by dividing the entire surface of the electronic device into zones. This module may include a formula created by learning in advance the relationship between the surface temperature and the pattern of the sensed data values ​​output from all temperature sensors. For example, when the surface temperature prediction module (1115) obtains the sensed values ​​from the temperature sensors as real-time input, it may calculate the predicted surface temperature value through the formula and transmit the calculated value to the temperature compensation module (1112). For example, the scenario checking module (1113) may obtain the temperature corresponding to at least one component from the hardware temperature reading module (1114).

[0159] According to an example, the plurality of kernels (1130) may include a temperature sensor corresponding to each of at least one component included in the electronic device. According to an example, the plurality of kernels (1130) may include temperature sensors corresponding to various types of components, including a temperature sensor (1131) corresponding to an application processor (AP), a temperature sensor (1132) corresponding to a battery, a temperature sensor (1130) corresponding to a battery charger, a temperature sensor (1134) corresponding to an amplifier (e.g., a power amplifier), a temperature sensor (1135) corresponding to a communication processor (CP), and a temperature sensor (1136) corresponding to a wireless fidelity (or wi-fi) communication module. According to an example, the plurality of kernels (1130) may transmit temperature information acquired from each temperature sensor to a temperature prediction module (1110).

[0160] An electronic device according to one embodiment of the present disclosure includes at least one temperature sensor corresponding to each of at least one component included in the electronic device, at least one processor including a processing circuit, and a memory storing instructions, including one or more storage media, wherein the instructions, when individually or collectively executed by the at least one processor, can cause the electronic device to determine a first temperature corresponding to a first component among the at least one component based on sensing data acquired through the at least one temperature sensor.

[0161] In one embodiment, the instructions may cause the electronic device to determine a surface temperature of the electronic device predicted from the determined first temperature.

[0162] In one embodiment, the instructions may cause the electronic device to identify a first scenario associated with the first component among a plurality of scenarios associated with a state of the electronic device.

[0163] In one embodiment, the instructions may cause the electronic device to determine whether a first detection condition set in response to the identified first scenario is satisfied.

[0164] In one embodiment, the instructions may cause the electronic device to compensate the surface temperature to a second temperature based on satisfaction of the first detection condition.

[0165] In one embodiment, the instructions may cause the electronic device to determine a first critical temperature set in response to the first scenario, and to determine that the first detection condition is satisfied based on the first temperature exceeding the first critical temperature.

[0166] In one embodiment, the first threshold temperature may be determined based on a third temperature measured from at least one temperature sensor corresponding to each of at least one component.

[0167] According to one embodiment, the first scenario may be a scenario in which an application processor among the at least one processor operates at high performance.

[0168] In one embodiment, the instructions may cause the electronic device to determine a first parameter associated with the identified first scenario based on satisfaction of the first detection condition, and to correct the surface temperature to the second temperature based on the first parameter.

[0169] In one embodiment, the instructions may cause the electronic device to determine a first predicted temperature of a first zone of the electronic device corresponding to the first component based on the first temperature, and to determine a corrected second temperature based on the determined first predicted temperature and the determined first parameter.

[0170] In one embodiment, the instructions may cause the electronic device to check predicted temperatures of each of the remaining zones of the electronic device, excluding the first zone, based on at least a portion of the corrected second temperature and the predicted temperatures of the remaining zones, check a surface temperature corresponding to the electronic device, and control at least one operation for controlling heat generation of the electronic device based on the checked surface temperature.

[0171] In one embodiment, the instructions may cause the electronic device to input at least a portion of the corrected second temperature and the predicted temperature of the remaining zone into a learned artificial intelligence model to determine the surface temperature.

[0172] In one embodiment, the instructions may cause the electronic device to determine, based on sensing data acquired through the at least one temperature sensor, whether a third temperature corresponding to a second component among the at least one component exceeds a second threshold temperature, determine a second scenario related to the second component among the plurality of scenarios based on the third temperature exceeding the second threshold temperature, determine a fourth temperature corrected from the third temperature using a second parameter related to the second scenario, and determine a surface temperature of the electronic device based on the corrected second temperature and the corrected fourth temperature.

[0173] In one embodiment, the instructions may cause the electronic device to determine whether at least a portion of a first region of the electronic device corresponding to the first component and a second region of the electronic device corresponding to the second component are identical, determine a priority between the first component and the second component based on determining whether the at least portions are identical, and determine the surface temperature using at least one of the corrected second temperature and the corrected fourth temperature based on determining the first component as having priority.

[0174] In one embodiment, the instructions may cause the electronic device to determine whether the time for which the first temperature exceeds the first threshold temperature is greater than or equal to a first time, and, based on the time for which the exceeding time is greater than or equal to the first time, determine that the first detection condition is satisfied.

[0175] In one embodiment, the instructions may cause the electronic device to determine, based on the determined surface temperature, a control level associated with at least one operation for controlling heat generation of the electronic device, and to control an operation of the at least one component based on the determined control level.

[0176] In one embodiment, the instructions may cause the electronic device to determine a third parameter having a different value from the first parameter based on satisfying a first condition related to context information of the electronic device, determine a fifth temperature corrected from the first temperature based on the determined third parameter, and control an operation of the electronic device based on the corrected fifth temperature.

[0177] According to one embodiment, the context information of the electronic device is information related to at least one of a holding state of the electronic device or a folding state of the electronic device, and the instructions may cause the electronic device to check the second temperature based on the first parameter and control an operation of the electronic device based on the second temperature, based on not satisfying a first condition related to the context information of the electronic device.

[0178] A method of operating an electronic device according to one embodiment may include an operation of checking a first temperature corresponding to a first component among at least one component based on sensing data acquired through at least one temperature sensor corresponding to each of at least one component included in the electronic device.

[0179] A method of operating an electronic device according to one embodiment may include an operation of checking a surface temperature of the electronic device predicted from the checked first temperature.

[0180] A method of operating an electronic device according to one embodiment may include an operation of identifying a first scenario related to the first component among a plurality of scenarios related to a state of the electronic device.

[0181] A method of operating an electronic device according to one embodiment may include an operation of confirming whether a first detection condition set in response to the confirmed first scenario is satisfied.

[0182] A method of operating an electronic device according to one embodiment may include an operation of correcting the surface temperature to a second temperature based on satisfaction of the first detection condition.

[0183] A method of operating an electronic device according to one embodiment may include an operation of controlling at least one operation for controlling heat generation of the electronic device based on the corrected second temperature.

[0184] An operating method of an electronic device according to one embodiment may include: an operation of confirming a first critical temperature set in response to the first scenario; and an operation of confirming that the first detection condition is satisfied based on the first temperature exceeding the first critical temperature.

[0185] In one embodiment, the first threshold temperature may be determined based on a third temperature measured from at least one temperature sensor corresponding to each of at least one component.

[0186] According to one embodiment, the first scenario may be a scenario in which an application processor among the at least one processor operates at high performance.

[0187] An operating method of an electronic device according to one embodiment may include an operation of confirming a first parameter related to the confirmed first scenario based on satisfaction of the first detection condition, and correcting the surface temperature to the second temperature based on the first parameter.

[0188] In a storage medium storing computer-readable instructions according to one embodiment, the instructions, when individually or collectively executed by at least one processor of an electronic device, can cause the electronic device to determine a first temperature corresponding to a first component among the at least one component based on sensing data acquired through at least one temperature sensor corresponding to each of the at least one component included in the electronic device.

[0189] The instructions according to one embodiment may cause the electronic device to determine a surface temperature of the electronic device predicted from the determined first temperature.

[0190] The instructions according to one embodiment may cause the electronic device to identify a first scenario related to the first component among a plurality of scenarios related to a state of the electronic device.

[0191] The instructions according to one embodiment may cause the electronic device to determine whether a first detection condition set corresponding to the identified first scenario is satisfied.

[0192] The instructions according to one embodiment may cause the electronic device to compensate the surface temperature to a second temperature based on satisfaction of the first detection condition.

[0193] The instructions according to one embodiment may cause the electronic device to control operation of the electronic device based on the compensated second temperature.

[0194] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned will be clearly understood by a person having ordinary skill in the art to which the present disclosure pertains.

[0195] As used herein, the term "if" will be understood to mean "when, upon," "in response to determining," or "in response to detecting," depending on the context. Similarly, "if it is determined to," or "if [the stated condition or event] is detected," will optionally be understood to mean "upon determining," or "in response to determining," "upon detecting [the stated condition or event]," or "in response to detecting [the stated condition or event]."

[0196] The devices described above may be implemented as hardware components, software components, and / or a combination of hardware components and software components. For example, the devices and components described in the embodiments may be implemented using one or more general-purpose computers or special-purpose computers, such as a processor, a controller, an arithmetic logic unit (ALU), a digital signal processor, a microcomputer, a field programmable gate array (FPGA), a programmable logic unit (PLU), a microprocessor, or any other device capable of executing instructions and responding to them. A processing device (or processing circuit) may execute an operating system (OS) and one or more software applications running on the operating system. In addition, the processing device may access, store, manipulate, process, and generate data in response to the execution of the software. For ease of understanding, the processing device is sometimes described as being used alone; however, one of ordinary skill in the art will recognize that the processing device may include multiple processing elements and / or multiple types of processing elements. For example, a processing unit may include multiple processors, or a processor and a controller. Other processing configurations, such as parallel processors, are also possible.

[0197] Software may include a computer program, code, instructions, or a combination of one or more of these, which may configure a processing device to perform a desired operation or may independently or collectively command the processing device. The software and / or data may be embodied in any type of machine, component, physical device, computer storage medium, or device for interpretation by the processing device or for providing instructions or data to the processing device. The software may also be distributed over networked computer systems and stored or executed in a distributed manner. The software and data may be stored on one or more computer-readable recording media.

[0198] The method according to the embodiment may be implemented in the form of program commands that can be executed through various computer means and recorded on a computer-readable medium. In this case, the medium may be one that continuously stores a computer-executable program or one that temporarily stores it for execution or download. In addition, the medium may be various recording or storage means in the form of a single or multiple hardware combinations, and is not limited to a medium directly connected to a computer system, but may also be distributed over a network. Examples of the medium may include magnetic media such as hard disks, floppy disks, and magnetic tapes, optical recording media such as CD-ROMs and DVDs, magneto-optical media such as floptical disks, and those configured to store program commands, including ROM, RAM, and flash memory. In addition, examples of other media may include an app store that distributes applications, a site that supplies or distributes various software, or a recording or storage medium managed by a server.

[0199] Although the embodiments described above have been described by way of limited examples and drawings, those skilled in the art will appreciate that various modifications and variations can be made based on the above teachings. For example, appropriate results can still be achieved even if the described techniques are performed in a different order than described, and / or components such as the described systems, structures, devices, and circuits are combined or combined in a different manner than described, or are replaced or substituted with other components or equivalents.

[0200] Therefore, other implementations, other embodiments, and equivalents to the claims also fall within the scope of the claims described below.

[0201] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0202] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0203] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0204] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0205] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0206] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separately arranged in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In electronic devices, At least one temperature sensor corresponding to each of at least one component included in the electronic device; At least one processor comprising a processing circuit; and A memory storing instructions and including one or more storage media; The above instructions, when individually or collectively executed by the at least one processor, cause the electronic device to: Based on the sensing data acquired through the at least one temperature sensor, a first temperature corresponding to a first component among the at least one component is determined, Check the surface temperature of the electronic device predicted from the first temperature confirmed above, Among a plurality of scenarios related to the state of the electronic device, a first scenario related to the first component is identified, Check whether the first detection condition set in response to the first scenario confirmed above is satisfied, Based on satisfying the above first detection condition, the surface temperature is corrected to a second temperature, An electronic device that causes at least one operation for controlling heat generation of the electronic device to be controlled based on the second temperature that has been corrected.

2. In paragraph 1, The above instructions cause the electronic device to: Check the first critical temperature set in response to the first scenario above, An electronic device that causes the first detection condition to be determined to be satisfied based on the first temperature exceeding the first threshold temperature.

3. In the second paragraph, the first critical temperature is An electronic device, wherein the third temperature is determined based on a third temperature measured from at least one temperature sensor corresponding to each of at least one component.

4. In any one of paragraphs 1 to 3, the first scenario is: An electronic device, wherein at least one of the above processors is an application processor that operates at high performance.

5. In any one of paragraphs 1 to 4, The above instructions cause the electronic device to: Based on satisfying the above first detection condition, the first parameter related to the confirmed first scenario is confirmed, An electronic device that causes the surface temperature to be corrected to the second temperature based on the first parameter.

6. In paragraph 5, The above instructions cause the electronic device to: Based on the first temperature, a first predicted temperature of a first zone of the electronic device corresponding to the first component is determined, An electronic device that causes the corrected second temperature to be determined based on the confirmed first predicted temperature and the confirmed first parameter.

7. In paragraph 6, The above instructions cause the electronic device to: Check the predicted temperature of each zone of the electronic device except for the first zone, Based on at least a portion of the corrected second temperature and the predicted temperature of the remaining zone, a surface temperature corresponding to the electronic device is determined, An electronic device that causes at least one operation for controlling heat generation of the electronic device to be controlled based on the surface temperature identified above.

8. In paragraph 7, The above instructions cause the electronic device to: An electronic device that causes the surface temperature to be determined by inputting at least a portion of the corrected second temperature and the predicted temperature of the remaining zone into a learned artificial intelligence model.

9. In paragraph 7, The above instructions cause the electronic device to: Based on the sensing data acquired through the at least one temperature sensor, it is determined whether a third temperature corresponding to a second component among the at least one component exceeds a second threshold temperature, Based on the third temperature exceeding the second critical temperature, a second scenario related to the second component is identified among the plurality of scenarios, Using the second parameter related to the second scenario, the fourth temperature corrected from the third temperature is confirmed, An electronic device that causes the surface temperature of the electronic device to be determined based on the corrected second temperature and the corrected fourth temperature.

10. In paragraph 9, The above instructions cause the electronic device to: Verify that at least a part of the first zone of the electronic device corresponding to the first component and the second zone of the electronic device corresponding to the second component are identical, Based on the confirmation that at least some of the above are identical, the priority between the first part and the second part is confirmed, An electronic device that causes the surface temperature to be determined using at least one of the corrected second temperature and the corrected fourth temperature based on the priority determination of the first component.

11. In paragraph 2, The above instructions cause the electronic device to: Check whether the time for which the first temperature exceeds the first threshold temperature is greater than or equal to the first time, An electronic device that causes the first detection condition to be satisfied based on the time exceeding the first time being greater than the first time.

12. In any one of paragraphs 1 to 11, The above instructions cause the electronic device to: Based on the surface temperature confirmed above, a control level related to at least one operation for controlling heat generation of the electronic device is confirmed, An electronic device that causes the operation of at least one component to be controlled based on the identified control level.

13. In paragraph 5, The above instructions cause the electronic device to: Based on satisfying a first condition related to context information of the electronic device, a third parameter having a different value from the first parameter is identified, Based on the third parameter confirmed above, the fifth temperature corrected from the first temperature is confirmed, An electronic device that causes the operation of the electronic device to be controlled based on the above-mentioned fifth temperature.

14. In the method of operating an electronic device, An operation of confirming a first temperature corresponding to a first component among the at least one component based on sensing data acquired through at least one temperature sensor corresponding to each of at least one component included in the electronic device; An operation of checking the surface temperature of the electronic device predicted from the first temperature confirmed above; An action of identifying a first scenario related to the first component among a plurality of scenarios related to the state of the electronic device; An operation to check whether the first detection condition set in response to the first scenario confirmed above is satisfied; An operation of correcting the surface temperature to a second temperature based on satisfying the first detection condition; and An operating method comprising: an operation of controlling at least one operation for controlling heat generation of the electronic device based on the corrected second temperature.

15. In a storage medium storing computer-readable instructions, the instructions, when individually or collectively executed by at least one processor of an electronic device, cause the electronic device to: Based on sensing data acquired through at least one temperature sensor corresponding to each of at least one component included in the electronic device, a first temperature corresponding to a first component among the at least one component is determined, Check the surface temperature of the electronic device predicted from the first temperature confirmed above, Among a plurality of scenarios related to the state of the electronic device, a first scenario related to the first component is identified, Confirm whether the first detection condition set in response to the first scenario confirmed above is satisfied, Based on satisfying the above first detection condition, the surface temperature is corrected to a second temperature, A storage medium that causes the operation of the electronic device to be controlled based on the second temperature that has been corrected.

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