Carrier ring designs

Abstract

A carrier ring comprises an annular member and N grooves arranged on a surface of the annular member, where N is an integer greater than 1. The N groves extend radially from an inner edge of the surface of the annular member towards an outer edge of the surface of the annular member. A carrier ring comprises an annular member comprising N grooves, where N is an integer greater than 1; and N support assemblies mated with the N grooves, respectively, and configured to support a substrate. A carrier ring kit comprises an annular member comprising a surface and N grooves situated on the surface, where N is an integer greater than 1; and N support assemblies configured to mate with the N grooves, respectively, and to support a substrate.

Description

CARRIER RING DESIGNSCROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims the benefit of U.S. Provisional Application No. 63 / 666,913, filed on July 2, 2024. The entire disclosure of the above application is incorporated herein by reference.FIELD

[0002] The present disclosure relates generally to substrate processing systems and more particularly to carrier ring designs.BACKGROUND

[0003] The background description provided here is for the purpose of generally presenting the context of the disclosure. Work of the presently named inventors, to the extent it is described in this background section, as well as aspects of the description that may not otherwise qualify as prior art at the time of filing, are neither expressly nor impliedly admitted as prior art against the present disclosure.

[0004] A substrate processing system (also called a tool) typically comprises a plurality of processing chambers (also called stations) in which processes such as deposition, etching, and other treatments are performed on substrates such as semiconductor wafers. Examples of processes that may be performed on a substrate comprise a chemical vapor deposition (CVD) process, a chemically enhanced plasma vapor deposition (CEPVD) process, a plasma enhanced chemical vapor deposition (PECVD) process, a sputtering physical vapor deposition (PVD) process, atomic layer deposition (ALD), and plasma enhanced ALD (PEALD). Additional examples of processes that may be performed on a substrate comprise etching (e.g., chemical etching, plasma etching, reactive ion etching, etc.) and cleaning processes.

[0005] During processing, a substrate is arranged on a substrate support such as a pedestal in a station. During deposition, gas mixtures comprising one or more precursors are introduced into the station, and plasma may be optionally struck to activate chemical reactions. During etching, gas mixtures comprising etch gases are introduced into the station, and plasma may be optionally struck to activate chemical reactions. A computer-controlled robot typically transfers substrates from one station to another in a sequence in which the substrates are to be processed.

[0006] In ALD, a gaseous chemical process sequentially deposited a thin film on a surface of a material (e.g., a surface of a substrate such as a semiconductor wafer). Most ALD reactions use at least two chemicals called precursors (reactants) that react with the surface of the material one precursor at a time in a sequential, self-limiting manner. Through repeated exposure to separate precursors, a thin film is gradually deposited on the surface of the material. Thermal ALD (T-ALD) is carried out in a heated station. The station is maintained at a sub-atmospheric pressure using a vacuum pump and a controlled flow of an inert gas. The substrate to be coated with an ALD film is placed in the station and is allowed to equilibrate with the temperature of the station before starting the ALD process.SUMMARY

[0007] A carrier ring comprises an annular member and N grooves arranged on a surface of the annular member, where N is an integer greater than 1 . The N groves extend radially from an inner edge of the surface of the annular member towards an outer edge of the surface of the annular member.

[0008] In additional features, a longitudinal edge of each of the N grooves extends in a radial direction.

[0009] In additional features, the N grooves are circumferentially spaced from one another.

[0010] In additional features, the carrier ring further comprises N projections extending radially outward from the outer edge of the carrier ring. The N grooves are situated in the N projections, respectively.

[0011] In additional features, the carrier ring further comprises N holes situated in the N projections, respectively. Each of the N holes is located between an end point of the respective groove and an end point of the respective projection.

[0012] In additional features, each of the N holes extends from the surface of the annular member to an opposing surface of the annular member.

[0013] In additional features, each of the N grooves comprises a C-shaped portion and a U-shaped portion. An open end of the U-shaped portion extends from an open end ofthe C-shaped portion. A rounded portion of the U-shaped portion faces the outer edge of the surface of the annular member. A closed portion of the C-shaped portion faces the inner edge of the surface of the annular member.

[0014] In additional features, the carrier ring further comprises N projections and N holes situated in the N projections, respectively. The N projections extend radially outward from the outer edge of the carrier ring. The N grooves are situated in the N projections, respectively. Each the N holes is located between the rounded portion of the U-shaped portion of the respective groove and an end point of the respective projection.

[0015] In still other features, an assembly comprises a base portion comprising a first surface and a second surface, a dovetail portion situated on the first surface of the base portion, a finger extending outwardly from the second surface of the base portion, and a roller situated on the finger.

[0016] In additional features, the second surface is perpendicular to the first surface, and the finger extends parallel to the first surface.

[0017] In additional features, a surface of the dovetail portion that is opposite to the first surface is flat and is parallel to the first surface of the base portion.

[0018] In additional features, the dovetail portion comprises a rounded edge and a flat edge that is opposite to the rounded edge. The flat edge is flush with the second surface of the base portion.

[0019] In additional features, the dovetail portion comprises a rounded edge, a flat edge, and two side edges. The flat edge is opposite to the rounded edge. The flat edge is flush with the second surface of the base portion. The two side edges extend between the rounded and flat edges. The two side edges slope inwards towards the first surface of the base portion. The two side edges are parallel to respective sides of the first surface of the base portion.

[0020] In additional features, the assembly further comprises a hole situated on the first surface of the base portion. The hole is situated between a rounded end of the dovetail portion and an edge of the first surface of the base portion.

[0021] In additional features, the edge of the first surface of the base portion is away from the second surface of the base portion.

[0022] In additional features, the roller is situated proximate to a distal end of the finger. The roller is situated along a longitudinal axis of the finger. The finger comprises a projection situated at the distal end of the finger.

[0023] In additional features, the first surface is parallel to a first axis. The second surface is parallel to a second axis that is perpendicular to the first axis. A height of the finger along the second axis is less than a height of the second surface along the second axis. A length of the finger along the first axis is greater than a length of the first surface along the first axis. A width of the finger along a third axis that is perpendicular to the first and second axes is less than or equal to a width of the second surface along the third axis.

[0024] In still other features, a carrier ring comprises an annular member comprising N grooves, where N is an integer greater than 1 ; and N support assemblies mated with the N grooves, respectively, and configured to support a substrate.

[0025] In additional features, a longitudinal edge of each of the N grooves extends in a radial direction.

[0026] In additional features, the N grooves are circumferentially spaced from one another.

[0027] In additional features, each of the N support assemblies is configured to slidably couple to a respective one of the N grooves.

[0028] In additional features, each of the N support assemblies comprises a dovetail portion and a finger. The dovetail portion is configured to mate with a respective one of the N grooves. The finger extends radially inward from the annular member and is configured to support the substrate when the dovetail portion is mated with the respective one of the N grooves.

[0029] In still other features, a carrier ring kit comprises an annular member comprising a surface and N grooves situated on the surface, where N is an integer greater than 1 ; and N support assemblies configured to mate with the N grooves, respectively, and to support a substrate.

[0030] In additional features, each of the N support assemblies comprises an attachment member comprising a dovetail portion configured to couple the respective one of the N support assemblies to the annular member.

[0031] In additional features, each of the N grooves comprises a first portion configured to receive a respective one of the dovetail portions and a second portion configured to mate with the respective one of the dovetail portions.

[0032] In additional features, when a respective one of the dovetail portions is received within the first portion of one of the N grooves. The dovetail portion is configured to move relative to the annular member from the first portion to the second portion and mate with the second portion.

[0033] In additional features, the second portion comprises a curved end sized and shaped to receive and mate with the dovetail portion.

[0034] In additional features, each of the N support assemblies comprises a finger extending outward from the attachment member and configured to support the substrate.

[0035] In additional features, when the N support assemblies are mated with the N grooves, respectively, the fingers of the N support assemblies extend radially inward from the annular member.

[0036] In additional features, the annular member further comprises N openings on the surface. The kit further comprises N fasteners configured to mate with pairs of the N openings and the N support assemblies, respectively, to secure the N support assemblies to the annular member when the N support assemblies are mated with the N grooves.

[0037] In additional features, each of the N support assemblies comprises an opening on an upper portion of the attachment member configured to receive one of the N fasteners.

[0038] In still other features, a carrier ring comprises an annular member and N slots arranged on a surface of the annular member, where N is an integer greater than 1 . A longitudinal edge of each of the N slots extends in a circumferential direction.

[0039] In additional features, the N slots are oblong with two sides that extend circumferentially being straight and parallel to each other and two other sides that extend in a radial direction being arcuate.

[0040] In additional features, the annular member comprises N circular holes on an opposite surface that align with the N slots, respectively. Each of the N slots comprises two stops located at diametrically opposite ends. The stops extend from opposite ends of opposite sides of each of the N slots to a circumference of respective ones of the N circular holes.

[0041] In additional features, the N slots are circumferentially spaced from one another.

[0042] In additional features, the carrier ring further comprises N projections extending radially outward from an outer edge of the carrier ring. The N slots are situated in the N projections, respectively.

[0043] In additional features, the carrier ring further comprises N holes situated in the N projections, respectively. Each the N holes is located between an end point of the respective slot and an end point of the respective projection.

[0044] In additional features, each of N holes extends from the surface of the annular member towards an opposite surface of the annular member.

[0045] In still other features, an assembly comprises a base portion comprising a first surface and a second surface, an oblong portion coupled to the first surface of the base portion, a finger extending from the second surface of the base portion, and a roller situated on the finger.

[0046] In additional features, the second surface is perpendicular to the first surface, and the finger extends parallel to the first surface.

[0047] In additional features, the assembly further comprises a support portion situated on the first surface of the base portion and under the oblong portion.

[0048] In additional features, the oblong portion is parallel to the first surface of the base portion, and the oblong portion lies within a perimeter of the first surface of the base portion.

[0049] In additional features, a surface of the oblong portion that is opposite to the first surface is flat and is parallel to the first surface of the base portion.

[0050] In additional features, the oblong portion has two sides that straight and parallel to each other and two other sides that are arcuate.

[0051] In additional features, the first surface is parallel to a first axis. The second surface is parallel to a second axis that is perpendicular to the first axis. The two sides of the oblong portion that straight and parallel to each other are parallel to the first axis. The finger extends parallel to the first axis. One of the two other sides of the oblong portion that are arcuate faces the finger. The other of the two other sides of the oblong portion that are arcuate faces away from the finger.

[0052] In additional features, the assembly further comprises a hole situated on the first surface of the base portion. The hole is situated between a rounded end of the oblong portion and an edge of the first surface of the base portion.

[0053] In additional features, the edge of the first surface of the base portion is away from the second surface of the base portion.

[0054] In additional features, the roller is situated proximate to a distal end of the finger. The roller is situated along a longitudinal axis of the finger. The finger comprises a projection situated at the distal end of the finger.

[0055] In additional features, the first surface is parallel to a first axis. The second surface is parallel to a second axis that is perpendicular to the first axis. A height of the finger along the second axis is less than a height of the second surface along the second axis. A length of the finger along the first axis is greater than a length of the first surface along the first axis. A width of the finger along a third axis that is perpendicular to the first and second axes is less than or equal to a width of the second surface along the third axis.

[0056] In still other features, a carrier ring kit comprises an annular member comprising a surface and N slots situated on the surface, where N is an integer greater than 1 ; and N support assemblies configured to mate with the N slots, respectively, and to support a substrate.

[0057] In additional features, each of the N support assemblies comprises an attachment member comprising an oblong portion configured to couple the respective one of the N support assemblies to the annular member.

[0058] In additional features, each of the N slots is sized and shaped to receive a respective one of the oblong portions.

[0059] In additional features, when a respective one of the oblong portions is received within the one of the N slots, the oblong portion is configured to move within the one of the N slots relative to the annular member from a first position to a second position and lock into the one of the N slots.

[0060] In additional features, the first and second positions are 90 degrees apart.

[0061] In additional features, the annular member comprises N holes on an opposite surface that align with the N slots, respectively. Each of the N slots comprises two stops located at diametrically opposite ends. The stops extend from opposite ends of oppositesides of each of the N slots to a circumference of respective ones of the N holes. When the oblong portion of one of the N support assemblies is moved within the one of the N slots from the first position to the second position, the two stops lock the oblong portion into the one of the N slots.

[0062] In additional features, when the N support assemblies are mated with the N slots, respectively, top surfaces of the oblong portions of the N support assemblies are flush with the surface of the annular member.

[0063] In additional features, each of the N support assemblies comprises an attachment member and a finger extending outward from the attachment member and configured to support the substrate.

[0064] In additional features, when the N support assemblies are mated with the N slots, respectively, the fingers of the N support assemblies extend radially inward from the annular member.

[0065] In additional features, the annular member further comprises N openings on the surface. The kit further comprises N fasteners configured to mate with pairs of the N openings and the N support assemblies, respectively, to secure the N support assemblies to the annular member when the N support assemblies are mated with the N slots.

[0066] In additional features, each of the N support assemblies comprises an opening on an upper portion of the attachment member configured to receive one of the N fasteners.

[0067] In additional features, the N slots are circumferentially spaced from one another.

[0068] In additional features, each of the N support assemblies is configured to rotatably couple to a respective one of the N slots.

[0069] In additional features, each of the N support assemblies comprises an oblong portion and a finger. The oblong portion is configured to mate with a respective one of the N slots. The finger extends radially inward from the annular member and is configured to support the substrate when the oblong portion is mated with the respective one of the N slots.

[0070] Further areas of applicability of the present disclosure will become apparent from the detailed description, the claims and the drawings. The detailed description and specific examples are intended for purposes of illustration only and are not intended to limit the scope of the disclosure.BRIEF DESCRIPTION OF THE DRAWINGS

[0071] The present disclosure will become more fully understood from the detailed description and the accompanying drawings, wherein:

[0072] FIG. 1 schematically shows an example of a substrate processing tool comprising multiple stations for processing substrates;

[0073] FIG. 2 shows an example of a substrate processing system comprising a station configured to process a substrate;

[0074] FIG. 3 shows a perspective view of a pedestal;

[0075] FIG. 4 shows a top view of the pedestal;

[0076] FIGS. 5 and 6 show top and bottom perspective views of a first carrier ring without support assemblies, respectively;

[0077] FIGS. 7 and 8 show top and bottom plan views of the first carrier ring without support assemblies; respectively;

[0078] FIG. 9 shows an example of a groove in the first carrier ring in which a support assembly slides;

[0079] FIG. 10 shows a perspective view of the support assembly that slides into the groove in the first carrier ring;

[0080] FIGS. 11 and 12 show top and bottom perspective views of the first carrier ring with the support assemblies installed in the first carrier ring, respectively;

[0081] FIGS. 13 and 14 show top and bottom plan views of the first carrier ring with the support assemblies installed in the first carrier ring, respectively;

[0082] FIG. 15 shows another bottom perspective view of the first carrier ring with the support assemblies installed in the first carrier ring;

[0083] FIG. 16 shows an expanded view of a portion of the bottom of the first carrier ring with the support assembly inserted into the groove in the first carrier ring;

[0084] FIGS. 17 and 18 show top and bottom perspective views of a second carrier ring without support assemblies, respectively;

[0085] FIGS. 19 and 20 show top and bottom plan views of the second carrier ring without support assemblies, respectively;

[0086] FIG. 21 shows an example of a slot in the second carrier ring in which a support assembly is inserted;

[0087] FIG. 22 shows a perspective view of the support assembly that is inserted into the slot in the second carrier ring;

[0088] FIGS. 23 and 24 show top and bottom perspective views of the second carrier ring with the support assemblies installed in the second carrier ring, respectively;

[0089] FIGS. 25 and 26 show top and bottom plan views of the second carrier ring with the support assemblies installed in the second carrier ring, respectively;

[0090] FIG. 27 shows another bottom perspective view of the second carrier ring with the support assemblies installed in the second carrier ring; and

[0091] FIG. 28 shows an expanded view of a portion of the bottom of the second carrier ring with the support assembly inserted, rotated, and locked in the slot in the second carrier ring.

[0092] In the drawings, reference numbers may be reused to identify similar and / or identical elements.DETAILED DESCRIPTION

[0093] In substrate processing systems (tools), a carrier ring is used to transport a substrate to and from a station. The carrier ring is generally annular. The carrier ring comprises a plurality of projections that extend radially outwards from a periphery of the carrier ring. A plurality of support assemblies are disposed on a bottom side of the carrier ring to support the substrate. The support assemblies are attached to the carrier ring under the respective projections. The support assemblies are generally L-shaped. Each support assembly comprises an attachment member and a finger-like structure (called a finger). The attachment members are attached to the bottom side of the respective projections of the carrier ring. The fingers extend radially inwards from the respective attachment members. The fingers extend radially inwards farther than an inner edge of the carrier ring. The substrate rests on the fingers. The projections and the support assemblies are spaced apart from each other by equal circumferential distance. Each support assembly is typically fastened to the carrier ring using two screws and two washers. Once the support assemblies are fastened to the carrier ring, the fingers of the support assemblies lie in a horizontal plane that is parallel to the top surface of the pedestal, which is also the plane of the carrier ring.

[0094] A transfer robot transfers the carrier ring along with the substrate to and from the station. The transfer robot comprises an end effector that slides under the carrier ring through the space between the support assemblies to pick up the carrier ring and the substrate. During transfer, the fingers hold the substrate in the horizontal plane that is parallel to the top surface of the pedestal. Using the end effector, the transfer robot places the carrier ring and the substrate on a pedestal in the station and retracts. During processing, the carrier ring and the support assemblies lie in respective pockets arranged around the periphery of a top surface of the pedestal, and the substrate lies on the top surface of the pedestal.

[0095] After the substrate is processed in the station, an actuator actuates a plurality of lift pins in the substrate support that lift the carrier ring. The fingers hold the substrate in the horizontal plane that is parallel to the top surface of the pedestal. Using the end effector, the transfer robot picks up the carrier ring and the substrate from the pedestal and removes the carrier ring and the substrate from the station. Since the fingers hold the substrate in the horizontal plane that is parallel to the top surface of the pedestal during placement and removal of the carrier ring and the substrate, the end effector of the transfer robot does not contact the substrate during placement and removal of the carrier ring and the substrate.

[0096] The carrier ring, the support assemblies, and the screws are made of a ceramic material. During processing, the carrier ring and the support assemblies absorb heat from the pedestal, which is heated, and from plasma when used to process the substrate. Over time, some of the screws used to attach the support assemblies to the carrier ring tend to become loose. As a result, one or more support assemblies tend to tilt downwards, and the substrate is no longer held in the horizontal plane that is parallel to the top surface of the pedestal. Rather, the substrate is also tilted downwards relative to the horizontal plane that is parallel to the top surface of the pedestal. Consequently, the end effector of the transfer robot can scratch the substrate during placement and removal of the carrier ring and the substrate. In some instances, the substrate can strike the top surface of the pedestal and can chip or break. The scratching and / or breaking of the substrate can lower the yield, which can be costly. To prevent these problems, the screws can be tightened further. However, tightening the screws further only delays occurrence of the failure. The screws become loose, and the problem persists.

[0097] The present disclosure solves the above problems by providing two different designs of the carrier ring and the support assemblies. The designs are described below in detail. Briefly, in a first design, the carrier ring comprises N radial grooves (i.e., N grooves for N support assemblies, N>1 ) on the bottom of the carrier ring. The grooves are located under the projections of the carrier erring. Accordingly, the grooves are also spaced apart from each other by equal circumferential distance similar to the projections of the carrier ring. In each support assembly, the attachment member comprises a portion that slides into the respective groove. Once the support assemblies slide int the grooves, the fingers remain in the horizontal plane that is parallel to the top surface of the pedestal. As an additional safety measure, to prevent the support assemblies from moving in the radial direction along the groove, one screw and one washer are used to fasten each support assembly to the carrier ring. Since the support assemblies securely fit into the respective grooves, the support assemblies do not tilt downwards even if the respective screws become loose over time. During placement and removal of the carrier ring and the substrate, the substrate remains on the fingers in the horizontal plane that is parallel to the top surface of the pedestal. As a result, the scratching and / or breaking of the substrate is prevented.

[0098] In a second design, the carrier ring comprises N slots (i.e., N slots for N support assemblies, N>1 ) on the bottom of the carrier ring. The slots are located under the projections of the carrier erring. Accordingly, the slots are also spaced apart from each other by equal circumferential distance similar to the projections of the carrier ring. Above each slot, the carrier ring comprises a hole on the top surface of the carrier ring. In each support assembly, the attachment member comprises a portion that aligns with and fits into the slot. To attach the support assembly to the carrier ring, the portion of the attachment member is aligned with and inserted into the slot by holding the support assembly along a tangent to the annular carrier ring. The support assembly is then rotated by 90 degrees along the horizontal plane that is parallel to the top surface of the pedestal. When rotated, the portion of the attachment member is locked in the slot. The top end of the portion of the attachment member is flat and is level (flush) with the top surface of the carrier ring.

[0099] Once the support assemblies are locked in the respective slots, the fingers remain in the horizontal plane that is parallel to the top surface of the pedestal. As an additional safety measure, to prevent the support assemblies from moving laterally along the horizontal plane that is parallel to the top surface of the pedestal, one screw and onewasher are used to fasten each support assembly to the carrier ring. Since the support assemblies securely fit in the slots, the fingers do not tilt downwards even if the respective screws becomes loose over time. During placement and removal of the carrier ring and the substrate, the substrate remains on the fingers in the horizontal plane that is parallel to the top surface of the pedestal. As a result, the scratching and / or breaking of the substrate is prevented.

[0100] Accordingly, in both designs, even if the screw on one or more support assemblies becomes loose, the fingers and the substrate on the fingers still remain in the horizontal plane that is parallel to the top surface of the pedestal. The support assemblies in the first design may move radially, and the support assemblies in the second design may move laterally, but the fingers in both designs do not tilt downwards vertically (i.e., perpendicularly to the horizontal plane that is parallel to the top surface of the pedestal). Thus, even if the screws on one or more support assemblies become loose, the end effector of the transfer robot cannot and does not scratch the substrate during placement and removal of the carrier ring and the substrate. The substrate also cannot and does not strike the top surface of the pedestal and cannot chip or break.

[0101] The present disclosure is organized as follows. Initially, to provide context, an example of a substrate processing tool comprising multiple stations is shown and described with reference to FIG. 1. An example of a substrate processing system comprising a station configured to process a substrate using the first design or the second of the carrier ring and the support assemblies is shown and described with reference to FIG. 2. An example of a pedestal with which the first design or the second of the carrier ring and the support assemblies can be used is shown and described with reference to FIGS. 3 and 4. The first design of the carrier ring and the support assemblies is shown and described with reference to FIGS. 5-16. The second design of the carrier ring and the support assemblies is shown and described with reference to FIGS. 17-28.EXAMPLES OF TOOL AND STATION

[0102] FIG. 1 schematically shows an example of a substrate processing tool 10. For example, the substrate processing tool 10 comprises four (or any number of) stations: a first station 12, a second station 14, a third station 16, and a fourth station 18. For example, each of the stations 12, 14, 16, and 18 may be configured to perform one or more processes on a substrate. A transfer robot 20 transfers the substrate between thestations 12, 14, 16, and 18 using a carrier ring (shown at 1 1 1 in FIG. 2) depending on the processes performed on the substrate in each station.

[0103] For example, in some processes, the transfer robot 20 transfers the substrate from the first station 12 to the second station 14, from the second station 14 to the third station 16, and from the third station 16 to the fourth station 18 for processing. After the substrate is processed in the fourth station 18, the transfer robot 20 transfers the substrate to the first station 12. Then the substrate is removed from the first station 12, a new substrate is loaded into the first station 12, and the above cycle is repeated.

[0104] FIG. 2 shows an example of a substrate processing system 100 comprising a station 102 configured to process a substrate using a process such as thermal atomic layer deposition (T-ALD) or chemical vapor deposition (CVD). In some examples, the process may include plasma-enhanced (PE) ALD (PEALD) or PECVD. For example, the station 102 comprises any of the stations 12, 14, 16, and 18 of the substrate processing tool 10 shown in FIG. 1 in which any of these processes can be performed.

[0105] The station 102 comprises a substrate support (e.g., a pedestal) 104. The pedestal 104 comprises a base portion 106 and a stem portion 108. The pedestal 104 may be made of a metallic material such as aluminum (or an alloy) or a ceramic material. The base portion 106 is generally cylindrical and comprises pockets (shown at 200 in FIG. 3) arranged around an outer periphery of the base portion 106. The stem portion 108 is generally Y-shaped as shown or can be cylindrical. The transfer robot 20 (shown in FIG. 1 ) transports a substrate 110 and a carrier ring 1 1 1 and support assemblies (not shown in FIG. 2 but shown in subsequent figures) into the station 102 as described above with reference to FIG. 1 .

[0106] During processing, the support assemblies of the carrier ring 11 1 lie in the pockets (shown at 200 in FIG. 3) of the base portion 106 of the pedestal 104, and the substrate 1 10 lies on the base portion 106 of the pedestal 104. For example, the substrate 1 10 may be clamped to the base portion 106 of the pedestal 104 using a clamping mechanism such as vacuum clamping (not shown). The carrier ring 1 1 1 and the support assemblies are described in further detail with reference to subsequent figures. A plurality of lift pins (only one lift pin 1 13 is shown) is used to lift and lower the carrier ring 1 1 1. One or more actuators 1 15 actuate the lift pins 113. A heater 1 12 is disposed in the base portion 106 to heat the substrate 1 10 during processing. One or more temperaturesensors 1 14 are disposed in the base portion 106 to sense the temperature of the pedestal 104.

[0107] The station 102 comprises a gas distribution device 120 such as a showerhead. The showerhead 120 is used to introduce and distribute process gases into the station 102. The showerhead 120 may be made of a metallic material such as aluminum (or an alloy) or a ceramic material. The showerhead 120 comprises a base portion 122 and a stem portion 126. The base portion 122 and the stem portion 126 are generally cylindrical. The base portion 122 is greater in diameter than the stem portion 126. The stem portion 126 extends from the base portion 122 and is attached to a top plate of the station 102. A substrate-facing surface of the base portion 122 comprises a plurality of outlets or features (e.g., slots or through holes) through which the process gases flow into the station 102. While not shown, the showerhead 120 may also comprise a heater, a cooling channel, and one or more temperature sensors.

[0108] A gas delivery system 130 comprises a plurality of gas sources 132-1 , 132-2, ... , and 132-N (collectively, the gas sources 132), where N is a positive integer. The gas sources 132 are connected by valves 134-1 , 134-2, ..., and 134-N (collectively, the valves 134) to mass flow controllers 136-1 , 136-2, ..., and 136-N (collectively, the mass flow controllers or MFCs 136). The gas sources 132 may supply process gases, purge gases, inert gases, cleaning gases, and so on to the station 102 through the showerhead 120. The MFCs 136 control mass flow rates of the gases supplied to the station 102 through the showerhead 120.

[0109] The gas delivery system 130 further comprises a vapor delivery system 138 to supply one or more vaporized precursors (e.g., in CVD processes) to the station 102 through the showerhead 120. The gases from the gas sources 132 and the vaporized precursors from the vapor delivery system 138 (when used) are mixed in a manifold 140. The manifold 140 supplies the gas mixture to the showerhead 120 via the stem portion 126. The showerhead 120 supplies the gas mixture to the station 102.

[0110] When the gas mixture is supplied to the station 102, a radio-frequency (RF) power supply 142 supplies RF power to the showerhead 120 to generate plasma in the station 102 (e.g., when PEALD or PECVD is used to process the substrate 1 10). Plasma can also be used during a cleaning process used to clean the station 102 and components within the station 102.

[0111] A cooling assembly 150 is mounted at the base of the stem portion 108 of the pedestal 104. A coolant supply 152 supplies a coolant (e.g., water) to the cooling assembly 150 through a valve 154. The coolant flowing through the cooling assembly 150 draws heat from the stem portion 108 of the pedestal 104. The coolant supply 152 also supplies the coolant to the cooling channel in the showerhead 120. A pedestal lift assembly 155 is attached to cooling assembly 150. The pedestal lift assembly 155 moves the pedestal 104 vertically up and down relative to the showerhead 120.

[0112] A controller 160 controls the components of the substrate processing system 100 including the transfer robot 20 shown in FIG. 1. The controller 160 is connected to the heater 1 12 in the pedestal 104, the heater in the showerhead 120, and the temperature sensors 1 14 in the pedestal 104 and the showerhead 120. The controller 160 controls the power supplied to the heaters in the pedestal 104 and showerhead 120 to control the temperatures of the pedestal 104 and the showerhead 120. The controller 160 controls the power supplied to the heaters in the pedestal 104 and the showerhead 120 based on feedback received from the temperature sensors in the pedestal 104 and the showerhead 120, respectively.

[0113] The controller 160 controls the supply of the coolant from the coolant supply 152 to the cooling assembly 150 by controlling the valve 154 based on the temperature of the pedestal 104 sensed by the temperature sensor 1 14. Although not shown, the controller 160 also controls the supply of the coolant from the coolant supply 152 to the showerhead 120 based on the temperature of the showerhead 120 sensed by the temperature sensor in the showerhead 120. The controller 160 controls the pedestal lift assembly 155 to control a gap between the pedestal 104 (and the substrate 1 10) and the showerhead 120. The controller 160 controls the actuators 1 15 to lift and lower the carrier ring 11 1 along with the substrate 1 10 using the lift pins 1 13..

[0114] A vacuum pump 158 maintains sub-atmospheric pressure inside the station 102 during substrate processing. A valve 156 is connected to an exhaust port of the station 102. The valve 156 and the vacuum pump 158 are used to control pressure in the station 102 and to evacuate reactants from the station 102 via the valve 156. The controller 160 controls the vacuum pump 158 and the valve 156.EXAMPLE OF PEDESTAL

[0115] FIGS. 3 and 4 show the pedestal 104 in further detail. FIG. 3 shows a perspective view of the pedestal 104. FIG. 4 shows a top view of the pedestal 104. The views showfeatures described below that support both carrier ring designs shown and described with reference to subsequent figures. In the description of the views shown in FIGS. 3 and 4, elements such as the carrier ring, the support assemblies, and the substrate are referenced. These elements are not shown in the views shown in FIGS. 3 and 4 but are shown in subsequent figures with reference to which the carrier ring designs are described below in detail. Specifically, in the description of the views shown in FIGS. 3 and 4, the carrier ring and the support assemblies are referenced only generally, and the two different designs of the carrier ring and the support assemblies are shown and described in detail with reference to subsequent figures. The general description applies to both the designs.

[0116] In FIGS. 3 and 4, the pedestal 104 comprises the base portion 106 and the stem portion 108, which are already described above with reference to FIG. 2. The base portion 106 comprises a plurality of pockets 200-1 , 200-2, 200-3 (individually called the pocket 200 and collectively called the pockets 200). The pockets 200 are formed along an outer diameter (OD) (e.g., along an outer upper edge or periphery) of the base portion 106 of the pedestal 104. The pockets 200 are formed about 120 degrees apart from each other. The pockets 200 protrude or extend radially outwards from the OD of the of the base portion 106 of the pedestal 104.

[0117] Each pocket 200 comprises a slot 202 that extends radially into the outer periphery of the base portion 106 of the pedestal 104. The slots are shown at 202-1 , 202- 2, 202-3 (individually called the slot 202 and collectively called the slots 202). The top ends of the pockets 200 are flush or level with (i.e., lie in the same plane as) the top surface of the base portion 106 of the pedestal 104.

[0118] A plurality support assemblies (see FIGS. 5 onwards) are attached to the bottom of the carrier ring 1 1 1 as shown and described below with references to FIGS. 5 onwards. The support assemblies are also disposed on the bottom side of the carrier ring 1 1 1 about 120 degrees apart from each other. When the carrier ring 1 1 1 comprising the support assemblies is placed on the top surface of the base portion 106 of the pedestal 104, the support assemblies align with and lie in respective slots 202 in the pockets 200. Thus, the pockets 200 support the carrier ring 1 1 1 and the support assemblies when the carrier ring 1 1 1 with the substrate 1 10 is transported to and from the pedestal 104.

[0119] Each support assembly comprises a finger-like protrusion (see FIGS. 5 onwards) that supports the substrate 110 when the substrate 1 10 is transported to and from thepedestal 104 with the carrier ring 1 11. The protrusions (called fingers) extend radially inwards from the carrier ring 1 1 1 and lie in the respective slots 202 in the pockets 200. After the transfer robot 20 moves the carrier ring 1 1 1 comprising the support assemblies holding the substrate 1 10 into the station 102, the carrier ring 1 1 1 with the support assemblies is lowered (e.g., by the lift pins 1 13 shown in FIG. 2). The support assemblies lie in the pockets 200, and the fingers lie in the slots 202 in the pockets 200. The substrate 1 10 lies on the top surface of the base portion 106 of the pedestal 104. The support assemblies lie in a plane lower than the top surface of the base portion 106 of the pedestal 104. The fingers do not contact the substrate 1 10. After processing, the carrier ring 1 1 1 with the support assemblies is lifted up, the substrate 1 10 is picked by the fingers, and the transfer robot 20 removes the carrier ring 1 1 1 with the substrate 1 10 resting on the fingers of the support assemblies.

[0120] When vacuum clamping is used, the top surface of the pedestal 104 also comprises a plurality of grooves 210 to clamp the substrate 1 10 to the top surface of the pedestal 104 using vacuum clamping. The grooves 210 comprise radial grooves, circular grooves, and so on. The grooves 210 are connected to each other. The grooves 210 are distributed within a circular region of the base portion 106 of the pedestal 104. The diameter of the circular region is less than the diameter of the substrate 1 10. The grooves 210 near the center of the base portion 106 of the pedestal 104 are in fluid communication with a conduit (not shown) disposed in the stem portion 108 of the pedestal 104. The conduit is in fluid communication with the vacuum pump 158 shown in FIG. 2.

[0121] The base portion 106 of the pedestal 104 also comprises a circular groove 220 that lies outside the circular region comprising the grooves 210. An inner diameter (ID) of the groove 220 is greater than the diameter of the circular region comprising the grooves 210. The ID of the groove 220 is also greater than a diameter of the substrate 1 10. The groove 220 intersects the radially inner ends of the slots 202 in the pockets 200. An edge gas is supplied through the groove 220 to prevent deposition on the backside of the substrate 1 10 during processing.

[0122] The carrier ring 1 1 1 comprises holes along a circle on an inner edge of the carrier ring 1 11 , which are shown at 301 and 401 in subsequent figures. The edge gas from the groove 220 flows through the holes in the edge ring 1 1 1 and flows radially outwards from under the substrate 1 1 10. The radially outward flow of the edge gas prevents diffusion of process gases into areas under the substrate 1 10, which prevents deposition on thebackside of the substrate 1 10. The radially outward flow of the edge gas also minimizes corrosion caused by process chemistries in radially inner portions of the top surface of the base portion 106 of the pedestal 104.FIRST EXAMPLE OF CARRIER RING AND SUPPORT ASSEMBLIES

[0123] FIGS. 5-16 show examples of the first design of the carrier ring (a carrier ring 300) and corresponding support assemblies (shown at 350 in FIG. 10) according to the present disclosure. The carrier ring 300 and the corresponding support assemblies 350 can be used as the carrier ring 1 1 1 in FIG. 2. FIGS. 5 and 6 respectively show top and bottom perspective views of the carrier ring 300 without the support assemblies 350. FIGS. 7 and 8 respectively show top and bottom plan views of the carrier ring 300 without the support assemblies 350. FIG. 9 shows an example of a groove 310 in the carrier ring 300 in which a support assembly 350 shown in FIG. 10 slides as described below in detail. FIG. 10 shows a perspective view of the support assembly 350 that slides into a groove 310 in the carrier ring 300. FIGS. 1 1 and 12 respectively show top and bottom perspective views of the carrier ring 300 with the support assemblies 350 installed in the carrier ring 300. FIGS. 13 and 14 respectively show top and bottom plan views of the carrier ring 300 with the support assemblies 350 installed in the carrier ring 300. FIG. 15 shows another bottom perspective view of the carrier ring 300 with the support assemblies 350 installed in the carrier ring 300. FIG. 16 shows an expanded view of a portion of the bottom of the carrier ring 300 with the support assembly 350 inserted into the groove 310 in the carrier ring 300.

[0124] Throughout the present disclosure, the pockets 200 in the pedestal 104; projections 302, 402 of carrier rings 300, 400; and support assemblies 350, 450 are shown and described as spaced apart by equal circumferential distance from each other. However, in some examples, these elements can be spaced apart from each other by unequal distances. Further, the number N of these elements can be any number greater than or equal to 3.

[0125] Throughout the following description, three axes are used when describing structural details of the carrier rings 300, 400 and the support assemblies 350, 450. A first axis is parallel to the plane of the carrier rings 300, 400. A second axis is perpendicular to the first axis and is therefore perpendicular to the plane of the carrier rings 300, 400. A third axis is perpendicular to both the first and second axes. The three axes are shown in figures where needed. Further, spatial references such as radial andcircumferential in the description of structures are made assuming that the support assemblies are attached to the respective carrier rings 300, 400.

[0126] FIGS. 5 and 6 respectively show top and bottom perspective views of the carrier ring 300 without the support assemblies 350. The carrier ring 300 is annular. The carrier ring 300 comprises an inner edge having an ID and an outer edge having an OD. The carrier ring 300 comprises a plurality of through holes 301 along the inner edge. The through holes 301 lie along a circle whose diameter matches the diameter of the groove 220 (shown in FIGS. 3 and 4) in the base portion 106 of the pedestal 104. The carrier ring 300 comprises projections 302-1 , 302-2, 302-3 (collectively called the projections 302 and individually called the projection 302). The projections 302 extend radially outwards from the outer edge of the carrier ring 300. The projections 302 are spaced apart by equal circumferential distance along the circumference of the carrier ring 300.

[0127] In FIG. 5, the carrier ring 300 comprises holes 304-1 , 304-2, 304-2 (collectively called the holes 304 and individually called the hole 304). One hole 304 is located on each projection 302. The holes 304 extend through the projections 302. As described below, only one fastener and one washer (not shown) are inserted into each hole 304 from the top side of the projection 302 to fasten the support assembly 350 (shown in FIG. 10) to the bottom side of the projection 302. The fasteners are shown at 307-1 , 307-2, 307-3 in FIGS. 11 and 13 (collectively called the fasteners 307 and individually called the fastener 307). The fastener 307 fastens the support assembly 350 to the carrier ring 300 after the support assembly 350 is inserted in a groove (shown at 310 in FIG. 6) on the bottom side of each projection 302 as described below in detail.

[0128] In FIG. 6, the carrier ring 300 comprises a groove 310 on the bottom side of each projection 302. The grooves on each projection 302 are shown at 310-1 , 310-2, 310-3 (collectively called the grooves 310 and individually called the groove 310). The groove 310 is shown and described below in further detail with reference to FIG. 9. One support assembly 350 (shown in FIG. 10) is inserted in each groove 310 by sliding the support assembly 350 into the groove 310 as described below in detail. Accordingly, the carrier ring 300 comprises N projections 302, N grooves 310, and N holes 304, where N>1 . For example, N=3; and the N projections 302, N grooves 310, and N holes 304 are circumferentially spaced apart from each other by 120 degrees.

[0129] FIGS. 7 and 8 respectively show the top and bottom views of the carrier ring 300 without the support assemblies 350. The annular shape of the carrier ring 300 is shownin the top and bottom plan view shown in FIGS. 7 and 8. In FIG. 7, the top side of the projections 302, the holes 304 in the projections 302, and the through holes 301 in the carrier ring 300 are shown. In FIG. 8, the bottom side of the projections 302, the grooves 310 at the bottom of the projections 302, the holes 304 in the projections 302, and the through holes 301 in the carrier ring 300 are shown. The projections 302, the holes 304 in the projections 302, and the grooves 310 in the projections 302 are spaced apart from each other by equal circumferential distance along the circumference of the carrier ring 300. In FIGS. 7 and 8, the through holes 301 lie in a circle whose diameter matches the diameter of the groove 220 (shown in FIGS. 3 and 4) in the base portion 106 of the pedestal 104.

[0130] FIG. 9 shows an expanded view of a portion of the carrier ring 300 shown by dashed lines at 340 in FIG. 6. FIG. 9 shows an example of the groove 310 in the carrier ring 300 in which one support assembly 350 slides. One groove 310 is located on the bottom side of each projection 302. The following description of the groove 310 applies to each of the N grooves 310. A length of the groove 310 extends in a radial direction in the projection 302. The groove 310 comprises a C-shaped portion 312 and a U-shaped portion 314. The C-shaped portion 312 is wider (measured circumferentially) than the U- shaped portion 314. A longitudinal edge of the C-shaped portion 312 and a longitudinal edge of the U-shaped portion 314 extend in the radial direction. The U-shaped portion 314 extends radially outwards from the C-shaped portion 312 as follows.

[0131] The C-shaped portion 312 has a closed end of the letter C and an open end of the letter C. The closed end of the C-shaped portion 312 is located radially inwards in the projection 302. The closed end of the C-shaped portion 312 faces the inner edge of the carrier ring 300. The open end of the C-shaped portion 312 is located radially outwards in the projection 302. The open end of the C-shaped portion 312 faces the outer edge of the projection 302.

[0132] The U-shaped portion 314 extends radially outwards from the open end of the C- shaped portion 312 towards the outer edge of the projection 302. The U-shaped portion 314 also has a closed end of the letter U and an open end of the letter U. The closed end of the U-shaped portion 314 is located radially outwards in the projection 302. The closed end of the U-shaped portion 314 faces the outer edge of the projection 302. The open end of the U-shaped portion 314 is located radially inwards in the projection 302. The open end of the U-shaped portion 314 extends from the open end of the C-shaped portion312. The open end of the U-shaped portion 314 faces the inner edge of the carrier ring 300. A depth of the groove 310 is less than the thickness of the projection 302 (all measured along the second axis). The groove 310 does not extend through the top end of the projection 302. Therefore, the grooves 310 are not visible in any of the top views of the carrier ring 300 shown in FIGS. 5-8.

[0133] In each projection 302, the hole 304 lies between the groove 310 and the outer edge of the projection 302. Specifically, the hole 304 lies between the closed end of the U-shaped portion 314 and the outer edge of the projection 302. The hole 304 extends through the top and bottom ends of the projection 302. The shape of the groove 310 and location of the hole 304 in the projection 302 are designed to attach the support assembly 350 to the carrier ring 300 as described below.

[0134] FIG. 10 shows a perspective view of the support assembly 350 that slides into the groove 310 in the carrier ring 300. The support assembly 350 comprises an attachment member 352 and a finger 354. The attachment member 352 attached the support assembly 350 to the carrier ring 300. The finger 354 extends radially inwards from the attachment member 352. A length of the finger 354 (measured radially) is greater than a length of the attachment member 352. The attachment member 352 and the finger 354 are described below in detail.

[0135] The attachment member 352 is generally rectangular and comprises a total of six surfaces. For example, the attachment member 352 is comprises a first surface (top surface) 360 and a second surface 364. The second surface 364 is perpendicular to the first surface 360. The second surface 364 is located radially inwards from the first surface 360. The second surface 364 extends vertically downwards from a radially inner end of the first surface 360. The first surface 360 is parallel to the first axis and is parallel to the plane of the carrier ring 300. The second surface 364 is parallel to the second axis that is perpendicular to the first axis. The second surface 364 is perpendicular to the plane of the carrier ring 300.

[0136] On the first surface 360, the attachment member 352 comprises a dovetail portion 362 and a hole 305. The dovetail portion 362 is located radially inwards on the first surface 360, and the hole 305 is located radially outwards on the first surface 360. The dovetail portion 362 is generally rectangular with a radially outer side 366 of the rectangle being curved radially outwards towards the hole 305. The radially outer side 366 of the dovetail portion 362 can also be called a curved edge 366, a curved end 366,or a rounded end 366 of the dovetail portion 362. Thus, the dovetail portion 362 comprises a rectangular portion and a curved (or an arcuate) portion. The hole 305 is located between the rounded end 366 (i.e., the curved edge 366) of the dovetail portion 362 and a radially outer edge of the first surface 360. A side 368 of the dovetail portion 362 that is opposite to the curved edge 366 is flush with an upper end of the second surface 364.

[0137] Two other opposite sides of the rectangular portion of the dovetail portion 362 are straight, are parallel to each other, and are parallel to corresponding sides of the first surface 360 of the attachment member 352. The two other opposite sides of the rectangular portion of the dovetail portion 362 slope inwards from a top surface of the dovetail portion 362. The two other opposite sides extend downwards from the top surface of the dovetail portion 362 towards the first surface 360 at an angle relative to the second axis. The top surface of the dovetail portion 362 is flat and is parallel to the first surface 360 of the attachment member 352. The top surface of the dovetail portion 362 is also parallel to the first axis and is parallel to the plane of the carrier ring 300. A perimeter of the dovetail portion 362 lies within a perimeter of the first surface 360 of the attachment member 352. A height of the dovetail portion 362 is equal to the depth of the groove 310, which is less than the thickness of the projection 302 (all measured along the second axis). The height of the dovetail portion 362 is therefore also less than the thickness of the projection 302 (all measured along the second axis).

[0138] The finger 354 extends from a bottom end of the second surface 364 of the attachment member 352. The finger 354 extends parallel to the first surface 360 of the attachment member 352. The finger 354 extends parallel the first axis, parallel to the plane of the carrier ring 300, parallel to the top surface of the dovetail portion 362, and perpendicularly to the second surface 364 of the attachment member 352.

[0139] A height of the finger 354 along the second axis is less than a height of the second surface 364 along the second axis. A length of the finger 354 along the first axis is greater than a length of the first surface 360 along the first axis. A width of the finger 354 along a third axis that is perpendicular to the first and second axes is less than or equal to a width of the second surface 364 along the third axis.

[0140] The finger 354 comprises a roller 370 located proximate to a distal end of the finger 354. The roller 370 is located along a longitudinal axis of the finger 354, which is parallel to the first axis and parallel to the plane of the carrier ring 300. The roller 370faces upwards towards the dovetail portion 362 and away from a bottom side of the finger 354 along the second axis.

[0141] The finger 354 further comprises a projection 372 located at the distal end of the finger 354. The projection 372 is located radially inwards from the roller 370. The projection 372 is located at a lower height than the roller 370 on the finger 354. During transport, the substrate 1 10 rests on the projections 372 of the fingers 354 of the support assemblies 350. The rollers 370, being taller than the projections 372, prevent the substrate 110 from sliding and falling from the carrier ring 300.

[0142] FIGS. 1 1 and 12 respectively show top and bottom perspective views of the carrier ring 300 with the support assemblies 350 attached to the carrier ring 300. FIGS. 13 and 14 respectively show top and bottom plan views of the carrier ring 300 with the support assemblies 350 attached to the carrier ring 300. In FIGS. 1 1 -15, the support assemblies are shown at 350-1 , 350-2, 350-3, which are installed under the projections 302-1 , 302-2, 302-3, respectively. The support assemblies 350-1 , 350-2, 350-3 are collectively called the support assemblies 350 and individually called the support assembly 350. FIG. 14 shows that the fingers 354 of the support assemblies 350 extend radially inwards from the carrier ring 300. FIG. 13 shows that projections 372 of the fingers 354 of the support assemblies 350 extend beyond (i.e., radially inwards farther than) the inner edge of the carrier ring 300.

[0143] FIG. 15 shows another bottom perspective view of the carrier ring 300 with the support assemblies 350 attached to the carrier ring 300. FIG. 16 shows an expanded view of a portion of the bottom of the carrier ring 300 shown by dashed lines at 380 in FIG. 15. In FIG. 16, the support assembly 350 is inserted into the groove 310 in the carrier ring 300. The dovetail portion 362 of the support assembly 350 is inserted into the groove 310 and is therefore not visible.

[0144] Referring to FIGS. 9, 10, and 16, the dovetail portion 362 of the support assembly 350 is inserted through the C-shaped portion 312 of the groove 310. The dovetail portion 362 slides through the C-shaped portion 312 into the U-shaped portion 314 of the groove 310. The dovetail portion 362 mates with the U-shaped portion 314 of the groove 310. The dovetail portion 362 of the support assembly 350 and the U-shaped portion 314 of the groove 310 have matching dimensions and geometries as described above. Therefore, once the support assembly 350 slides into the groove 310, the support assembly 350 does not tilt downwards.

[0145] Additionally, the support assembly 350 is further secured in the groove by one fastener 307 and one washer (both not shown). When the support assembly 350 slides into the groove 310, the hole 305 on the first surface 360 of the support assembly 350 aligns with the hole 304 on the projection 302 of the carrier ring 300. The fastener 307 and the washer are inserted through the hole 304 on the projection 302 of the carrier ring 300 into the hole 305 on the first surface 360 of the support assembly 350. The hole 305 on the first surface 360 of the support assembly 350 is threaded. The fastener 307 (e.g., a screw) is screwed into the hole 305 and fastens the support assembly 350 to the projection 302 of the carrier ring 300. The fastener 307 further prevents support assembly 350 from moving radially within the groove 310. As described above, even if the fastener 307 becomes loose, the support assembly 350 remains secured in the groove 310 and does not tilt downwards.SECOND EXAMPLE OF CARRIER RING AND SUPPORT ASSEMBLIES

[0146] FIGS. 17-28 show examples of the second design of the carrier ring (a carrier ring 400) and corresponding support assemblies (shown at 450 in FIG. 22) according to the present disclosure. The carrier ring 400 and the corresponding support assemblies 450 can be used as the carrier ring 1 1 1 in FIG. 2. FIGS. 17 and 18 respectively show top and bottom perspective views of the carrier ring 400 without the support assemblies 450. FIGS. 19 and 20 respectively show top and bottom plan views of the carrier ring 400 without the support assemblies 450. FIG. 21 shows an example of a slot 410 in the carrier ring 400 in which a support assembly 450 shown in FIG. 22 is inserted, and the support assembly 450 is then twisted (rotated) and locked as described below in detail. FIG. 22 shows a perspective view of the support assembly 450 that is inserted into a slot 410 in the carrier ring 400. FIGS. 23 and 24 respectively show top and bottom perspective views of the carrier ring 400 with the support assemblies 450 installed in the carrier ring 400. FIGS. 25 and 26 respectively show top and bottom plan views of the carrier ring 400 with the support assemblies 450 installed in the carrier ring 400. FIG. 27 shows another bottom perspective view of the carrier ring 400 with the support assemblies 450 installed in the carrier ring 400. FIG. 28 shows an expanded view of a portion of the bottom of the carrier ring 400 with the support assembly 450 inserted, rotated, and locked in the slot 410 in the carrier ring 400.

[0147] FIGS. 17 and 18 respectively show top and bottom perspective views of the carrier ring 400 without the support assemblies 450. The carrier ring 400 is annular. Thecarrier ring 400 comprises an inner edge having an ID and an outer edge having an OD. The carrier ring 400 comprises a plurality of through holes 401 along the inner edge. The through holes 401 lie along a circle whose diameter matches the diameter of the groove 220 (shown in FIGS. 3 and 4) in the base portion 106 of the pedestal 104. The carrier ring 400 comprises projections 402-1 , 402-2, 402-3 (collectively called the projections 402 and individually called the projection 402). The projections 402 extend radially outwards from the outer edge of the carrier ring 400. The projections 402 are spaced apart by equal circumferential distance along the circumference of the carrier ring 400.

[0148] In FIG. 17, the carrier ring 400 comprises holes 404-1 , 404-2, 404-2 (collectively called the holes 404 and individually called the hole 404). One hole 404 is located on each projection 402. The holes 404 extend through the projections 402. As described below, only one fastener and one washer (not shown) are inserted in each hole 404 from the top side of the projection 402 to fasten the support assembly 450 (shown in FIG. 22) to the bottom side of the projection 402. The fasteners are shown at 407-1 , 407-2, 407- 3 in FIGS. 23 and 25 (collectively called the fasteners 407 and individually called the fastener 407). The fastener 407 fastens the support assembly 450 after the support assembly 450 is inserted in a slot (shown at 410 in FIG. 18), rotated, and locked in the slot 410 on the bottom side of each projection 402 as described below in detail.

[0149] In FIG. 18, the carrier ring 400 comprises a slot 410 on the bottom side of each projection 402. The slots on the bottom side of each projection 402 are shown at 410-1 , 410-2, 410-3 (collectively called the slots 410 and individually called the slot 410). The slot 410 is shown and described below in further detail with reference to FIG. 21. One support assembly 450 (shown in FIG. 22) is inserted in each slot 410 by inserting the support assembly 450 into the slot 410 and by rotating the support assembly 450 in the slot 410 by 90 degrees and locking the support assembly 450 in the slot 410 as described below in detail. Accordingly, the carrier ring 400 comprises N projections 402, N slots 410, and N holes 404, where N>1 . For example, N=3; and the N projections 402, N slots 410, and N holes 404 are circumferentially spaced apart from each other by 120 degrees.

[0150] FIGS. 19 and 20 respectively show the top and bottom views of the carrier ring400 without the support assemblies 450. The annular shape of the carrier ring 400 is shown in the top and bottom plan view shown in FIGS. 19 and 20. In FIG. 19, the top side of the projections 402, the holes 404 in the projections 402, and the through holes401 in the carrier ring 400 are shown. In addition, each projection 402 comprises a hole406 on the top side of the projection 402. The holes 406 in respective projections 402 are shown at 406-1 , 406-2, 406-3 (collectively called the holes 406 and individually called the hole 406). The holes 406 are circular. The holes 406 are aligned with the slots 410, which are described below in detail. The holes 406 and the slots 410 extend through the projection 402 and form an opening that extends through the top and bottom ends of the projection 402. The slots 410, which are oblong as described below in detail, and which are formed on the bottom side of the projections 402, are visible in the top view shown in FIG. 19.

[0151] In FIG. 20, the bottom side of the projections 402, the slots 410 at the bottom of the projections 402, the holes 404 in the projections 402, and the through holes 401 in the carrier ring 400 are shown. The projections 402, the holes 404 in the projections 402, and the slots 410 in the projections 402 are spaced apart from each other by equal circumferential distance along the circumference of the carrier ring 400. The through holes 401 lie in a circle whose diameter matches the diameter of the groove 220 (shown in FIGS. 3 and 4) in the base portion 106 of the pedestal 104.

[0152] FIG. 21 shows an expanded view of a portion of the carrier ring 400 shown by dashed lines at 440 in FIG. 18. FIG. 21 shows an example of the slot 410 in the carrier ring 400 in which one support assembly 450 shown in FIG. 22 is inserted. One slot 410 is located on the bottom side of each projection 402. The following description of the slot 410 applies to each of the N slots 410. The slot 410 is generally rectangular or oblong. The slot 410 comprises two longer sides and two shorter sides. The two longer sides are straight and parallel to each other. The two shorter sides are curved (arcuate). The two shorter sides are of the shape of open and closed parentheses. The radius of curvature of the two shorter sides is the same as the radius of the hole 406. The two longer sides define a width of the slot 410, which is a distance between the two longer sides of the slot 410 measured along a radial direction. The two shorter sides define a length of the slot 410, which is a distance between centers of the two shorter curved sides measured along a circumferential direction.

[0153] The slot 410 extends through the thickness of the projection 402. A depth or height of the slot 410 is the same as the thickness of the projection 402. The slot 410 aligns with the corresponding hole 406 in the projection 402. At about half the depth of the slot 410 from the bottom surface of the projection 402, the opposite ends of the two longer sides of the slot 410 extend vertically upwards towards the top surface of theprojection 402 forming two stops 412. The two raised extensions of the opposite ends of the two longer sides of the slot 410 are called the stops 412. Only one of the two stops 412 is visible in the view shown in FIG. 21 and is shown at 412. A top view of the hole 406 is shown on the side of FIG. 21 . The top view shows both the stops at 412-1 , 412-2 (collectively called the stops 412), which are visible through the hole 406.

[0154] Thus, each slot 410 comprises two stops 412. The top ends of the stops 412 are flush (level) with the top surface of the projection 402 and the hole 406 on the top surface of the projection 402. The stops 412 mechanically stop an attachment member (described below) of the support assembly 410 when the attachment member of support assembly 410 is inserted into the slot 410 from the bottom side of the projection 402 and the support assembly 410 is then rotated by 90 degrees to lock the support assembly 410 in the slot 410. The stops 412 align the support assembly 410 in the slot 410 such that the support assembly 410 is radially aligned with the carrier ring 400 (i.e., the support assembly 410 is aligned with a radius of the carrier ring 400).

[0155] In each projection 402, the hole 404 lies between the slot 410 and the outer edge of the projection 402. The hole 404 extends through the top and bottom ends of the projection 402. The shape of the slot 410 and the locations of the holes 404, 406 in the projection 402 are designed to attach the support assembly 450 to the carrier ring 400 as follows.

[0156] FIG. 22 shows a perspective view of the support assembly 450 that is inserted into the slot 410 in the carrier ring 400. The support assembly 450 comprises an attachment member 452 and a finger 454. The attachment member 452 attached the support assembly 450 to the carrier ring 400. The finger 454 extends radially inwards from the attachment member 452. A length of the finger 454 (measured radially) is greater than a length of the attachment member 452. The attachment member 452 and the finger 454 are described below in detail.

[0157] The attachment member 452 is generally rectangular and comprises a total of six surfaces. For example, the attachment member 452 comprises a first surface (top surface) 460 and a second surface 464. The second surface 464 is perpendicular to the first surface 460. The second surface 464 is located radially inwards from the first surface 460. The second surface 464 extends vertically downwards from a radially inner end of the first surface 460. The first surface 460 is parallel to the first axis and is parallel to the plane of the carrier ring 400. The second surface 464 is parallel to the second axis thatis perpendicular to the first axis. The second surface 464 is perpendicular to the plane of the carrier ring 400.

[0158] On the first surface 460, the attachment member 452 comprises an oblong portion 462 and a hole 405. The oblong portion 462 is located radially inwards on the first surface 460, and the hole 405 is located radially outwards on the first surface 460. The oblong portion 462 is generally rectangular. The oblong portion 462 is shaped and designed to match the oblong shape of the slot 410 and to fit in the slot 410 as follows.

[0159] The geometry of the oblong portion 462 similar to the geometry of the slot 410. The oblong portion 462 comprises two shorter side and two longer sides. The two longer sides are straight and parallel to each other, and extend parallel to the first axis. The two longer sides are also parallel to corresponding sides of the first surface 460 of the attachment member 452. The two shorter sides are curved (arcuate) and include a radially outer side 466 and a radially inner side 467. The side 466 is curved radially outwards towards the hole 405. The side 467 is curved radially inwards towards the second surface 464. The radius of curvature of the sides 466, 467 is the same as the radius of the hole 406. The radius of curvature of the sides 466, 467 is the same as the radius of the two shorter sides of the slot 410. The sides 466, 467 are also called curved sides, curved ends, or rounded ends of the oblong portion 462. The hole 405 is located between the rounded end 466 (i.e., the side 466) of the oblong portion 462 and a radially outer edge of the first surface 460. A midpoint of the side 467 of the oblong portion 462 is flush with an upper end of the second surface 464.

[0160] The oblong portion 462 is raised from the first surface 460 by a circular portion 463 along the second axis. The circular portion 463 is at the base of the oblong portion 462. The circular portion 463 can also be called a base portion 463 of the oblong portion 462. In some examples, the circular portion 463 can be of any other shape. A diameter of the circular portion 463 is the same as the distance between the two longer sides of the oblong portion 462. In some examples, the diameter of the circular portion 463 may be less than the distance between the two longer sides of the oblong portion 462.

[0161] The distance between the two longer sides of the oblong portion 462 can be called a width of the oblong portion 462. A distance between midpoints of the sides 466, 467 can be called a length of the oblong portion 462. The length of the oblong portion 462 is the same as the length of the slot 410. The width of the oblong portion 462 is the same as the width of the slot 410. A sum of heights or thicknesses of the oblong portion462 and the circular portion 463 is equal to the depth of the slot 410 (all measured along the second axis). The sum of the heights of the oblong portion 462 and the circular portion463 is also equal to the thickness of the projection 402 (all measured along the second axis) as shown in a side view of elements 462, 463, 402 on the side of FIG. 22. The height or thickness of the oblong portion 462 is equal to the height of the stops 412 (all measured along the second axis).

[0162] A top surface of the oblong portion 462 is flat and is parallel to the first surface 460 of the attachment member 452. The top surface of the oblong portion 462 is also parallel to the first axis and is parallel to the plane of the carrier ring 400. A perimeter of the oblong portion 462 and a perimeter of the circular portion 463 lie within a perimeter of the first surface 460 of the attachment member 452.

[0163] The finger 454 extends from a bottom end of the second surface 464 of the attachment member 452. The finger 454 extends parallel to the first surface 460 of the attachment member 452. The finger 454 extends parallel the first axis, parallel to the plane of the carrier ring 400, parallel to the top surface of the oblong portion 462, and perpendicular to the second surface 464 of the attachment member 452.

[0164] A height of the finger 454 along the second axis is less than a height of the second surface 464 along the second axis. A length of the finger 454 along the first axis is greater than a length of the first surface 460 along the first axis. A width of the finger 454 along a third axis that is perpendicular to the first and second axes is less than or equal to a width of the second surface 464 along the third axis.

[0165] The finger 454 comprises a roller 370 located proximate to a distal end of the finger 454. The roller 370 is located along a longitudinal axis of the finger 454, which is parallel to the first axis and parallel to the plane of the carrier ring 400. The roller 370 faces upwards towards the oblong portion 462 and away from a bottom side of the finger 454 along the second axis.

[0166] The finger 454 further comprises a projection 372 located at the distal end of the finger 454. The projection 372 is located radially inwards from the roller 370. The projection 372 is located at a lower height than the roller 370 on the finger 454. During transport, the substrate 1 10 rests on the projections 372 of the fingers 454 of the support assemblies 450. The rollers 370, being taller than the projections 372, prevent the substrate 110 from sliding and falling from the carrier ring 400.

[0167] FIGS. 23 and 24 respectively show top and bottom perspective views of the carrier ring 400 with the support assemblies 450 attached to the carrier ring 400. FIGS. 25 and 26 respectively show top and bottom plan views of the carrier ring 400 with the support assemblies 450 attached to the carrier ring 400. In FIGS. 23-27, the support assemblies are shown at 450-1 , 450-2, 450-3, which are installed under the projections 402-1 , 402-2, 402-3, respectively. The support assemblies 450-1 , 450-2, 450-3 are collectively called the support assemblies 450 and individually called the support assembly 450. FIG. 26 shows that the fingers 454 of the support assemblies 450 extend radially inwards from the carrier ring 400. FIG. 25 shows that projections 372 of the fingers 454 of the support assemblies 450 extend beyond (i.e., radially inwards farther than) the inner edge of the carrier ring 400. FIG. 25 also shows that the top surface of the oblong portion 462 is flush (level) with the top surface of the projections 402.

[0168] FIG. 27 shows another bottom perspective view of the carrier ring 400 with the support assemblies 450 attached to the carrier ring 400. FIG. 28 shows an expanded view of a portion of the bottom of the carrier ring 400 shown by dashed lines at 480 in FIG. 27. In FIG. 28, the support assembly 450 is shown inserted into the slot 410 and rotated by 90 degrees in the slot 410. The oblong portion 462 of the support assembly 450 is inserted into the slot 410 and is therefore not visible.

[0169] Referring to FIGS. 21 , 22, and 28, the oblong portion 462 of the support assembly 450 mates with the oblong portion of the slot 410. The oblong portion 462 of the support assembly 450 and the oblong portion of the slot 410 have matching dimensions and geometries as described above. The support assembly 450 is attached to the carrier ring 400 as follows.

[0170] The oblong portion 462 is inserted into the slot 410. At this point, the support assembly 450 is parallel to a tangent drawn along the circumference of the carrier ring 400 at the projection 402. The support assembly 450 is then rotated by 90 degrees towards the carrier ring 400. The diagonally opposite ends of the sides 466, 467 mate with the stops 412, and the support assembly 450 is locked into the slot 410. As described above, the sum of heights or thicknesses of the oblong portion 462 and the circular portion 463 is equal to the depth of the slot 410, which is equal to the thickness of the projection 402 (all measured along the second axis). Further, the top surface of the oblong portion 462 is flat. Accordingly, when the support assembly 450 is inserted into the slot 410 and is rotated by 90 degrees inwards towards the carrier ring 400, the topsurface of the oblong portion 462 is flush (level) with the top surface of the projections as shown in FIGS. 23 and 25. The finger 454 is radially aligned with the carrier ring 400 (i.e., the finger 454 is aligned with a radius of the carrier ring 400) as shown in FIGS. 23 and 25. The hole 405 on attachment member 452 of the support assembly 450 is aligned with the hole 404 on the projection 402 of the carrier ring 400.

[0171] After inserting and rotating the support assembly 450 into the slot 410, the support assembly 450 is securely attached to the carrier ring 400. The support assembly 450 cannot tilt downwards because the oblong portion 462 of the support assembly 450 rests on top of the slot 410 with the oblong portion 462 being at right angle to the oblong shape of the slot 410 similar to the two elements of a plus (+) sign as shown on the side of FIG. 22. Specifically, the sides 466, 467 of the oblong portion 462 of the support assembly 450 rest on top of the two longer side of the slot 410 between the stops 412 of the slot 410. Thus, the support assembly 450 cannot tilt downwards even if the support assembly 450 is not fastened to the carrier ring 400 using a fastener 407.

[0172] Additionally, the support assembly 450 is further secured in the slot 410 using one fastener 407 and one washer (both not shown) as follows. When the support assembly 450 is inserted into the slot 410 and rotated, the hole 405 on the first surface 460 of the support assembly 450 aligns with the hole 404 on the projection 402 of the carrier ring 400. The fastener 407 and the washer are inserted through the hole 404 on the projection 402 of the carrier ring 400 into the hole 405 on the first surface 460 of the support assembly 450. The hole 405 on the first surface 460 of the support assembly 450 is threaded. The fastener (e.g., a screw) 407 is screwed into the hole 405 and fastens the support assembly 450 to the projection 402 of the carrier ring 400. The fastener 407 further prevents support assembly 450 from moving circumferentially (laterally) within the slot 410 between the stops 412. As described above, even if the fastener 407 becomes loose, the support assembly 450 remains secured in the slot 410 and does not tilt downwards.EXAMPLES

[0173] A carrier ring comprises an annular member and N grooves arranged on a surface of the annular member, where N is an integer greater than 1 . The N groves extend radially from an inner edge of the surface of the annular member towards an outer edge of the surface of the annular member.

[0174] A longitudinal edge of each of the N grooves extends in a radial direction.

[0175] The N grooves are circumferentially spaced from one another.

[0176] The carrier ring further comprises N projections extending radially outward from the outer edge of the carrier ring. The N grooves are situated in the N projections, respectively.

[0177] The carrier ring further comprises N holes situated in the N projections, respectively. Each of the N holes is located between an end point of the respective groove and an end point of the respective projection.

[0178] Each of the N holes extends from the surface of the annular member to an opposing surface of the annular member.

[0179] Each of the N grooves comprises a C-shaped portion and a U-shaped portion. An open end of the U-shaped portion extends from an open end of the C-shaped portion. A rounded portion of the U-shaped portion faces the outer edge of the surface of the annular member. A closed portion of the C-shaped portion faces the inner edge of the surface of the annular member.

[0180] The carrier ring further comprises N projections and N holes situated in the N projections, respectively. The N projections extend radially outward from the outer edge of the carrier ring. The N grooves are situated in the N projections, respectively. Each the N holes is located between the rounded portion of the U-shaped portion of the respective groove and an end point of the respective projection.

[0181] An assembly comprises a base portion comprising a first surface and a second surface, a dovetail portion situated on the first surface of the base portion, a finger extending outwardly from the second surface of the base portion, and a roller situated on the finger.

[0182] The second surface is perpendicular to the first surface, and the finger extends parallel to the first surface.

[0183] A surface of the dovetail portion that is opposite to the first surface is flat and is parallel to the first surface of the base portion.

[0184] The dovetail portion comprises a rounded edge and a flat edge that is opposite to the rounded edge. The flat edge is flush with the second surface of the base portion.

[0185] The dovetail portion comprises a rounded edge, a flat edge, and two side edges. The flat edge is opposite to the rounded edge. The flat edge is flush with the secondsurface of the base portion. The two side edges extend between the rounded and flat edges. The two side edges slope inwards towards the first surface of the base portion. The two side edges are parallel to respective sides of the first surface of the base portion.

[0186] The assembly further comprises a hole situated on the first surface of the base portion. The hole is situated between a rounded end of the dovetail portion and an edge of the first surface of the base portion.

[0187] The edge of the first surface of the base portion is away from the second surface of the base portion.

[0188] The roller is situated proximate to a distal end of the finger. The roller is situated along a longitudinal axis of the finger. The finger comprises a projection situated at the distal end of the finger.

[0189] The first surface is parallel to a first axis. The second surface is parallel to a second axis that is perpendicular to the first axis. A height of the finger along the second axis is less than a height of the second surface along the second axis. A length of the finger along the first axis is greater than a length of the first surface along the first axis. A width of the finger along a third axis that is perpendicular to the first and second axes is less than or equal to a width of the second surface along the third axis.

[0190] A carrier ring comprises an annular member comprising N grooves, where N is an integer greater than 1 ; and N support assemblies mated with the N grooves, respectively, and configured to support a substrate.

[0191] A longitudinal edge of each of the N grooves extends in a radial direction.

[0192] The N grooves are circumferentially spaced from one another.

[0193] Each of the N support assemblies is configured to slidably couple to a respective one of the N grooves.

[0194] Each of the N support assemblies comprises a dovetail portion and a finger. The dovetail portion is configured to mate with a respective one of the N grooves. The finger extends radially inward from the annular member and is configured to support the substrate when the dovetail portion is mated with the respective one of the N grooves.

[0195] A carrier ring kit comprises an annular member comprising a surface and N grooves situated on the surface, where N is an integer greater than 1 ; and N supportassemblies configured to mate with the N grooves, respectively, and to support a substrate.

[0196] Each of the N support assemblies comprises an attachment member comprising a dovetail portion configured to couple the respective one of the N support assemblies to the annular member.

[0197] Each of the N grooves comprises a first portion configured to receive a respective one of the dovetail portions and a second portion configured to mate with the respective one of the dovetail portions.

[0198] When a respective one of the dovetail portions is received within the first portion of one of the N grooves. The dovetail portion is configured to move relative to the annular member from the first portion to the second portion and mate with the second portion.

[0199] The second portion comprises a curved end sized and shaped to receive and mate with the dovetail portion.

[0200] Each of the N support assemblies comprises a finger extending outward from the attachment member and configured to support the substrate.

[0201] When the N support assemblies are mated with the N grooves, respectively, the fingers of the N support assemblies extend radially inward from the annular member.

[0202] The annular member further comprises N openings on the surface. The kit further comprises N fasteners configured to mate with pairs of the N openings and the N support assemblies, respectively, to secure the N support assemblies to the annular member when the N support assemblies are mated with the N grooves.

[0203] Each of the N support assemblies comprises an opening on an upper portion of the attachment member configured to receive one of the N fasteners.

[0204] A carrier ring comprises an annular member and N slots arranged on a surface of the annular member, where N is an integer greater than 1 . A longitudinal edge of each of the N slots extends in a circumferential direction.

[0205] The N slots are oblong with two sides that extend circumferentially being straight and parallel to each other and two other sides that extend in a radial direction being arcuate.

[0206] The annular member comprises N circular holes on an opposite surface that align with the N slots, respectively. Each of the N slots comprises two stops located atdiametrically opposite ends. The stops extend from opposite ends of opposite sides of each of the N slots to a circumference of respective ones of the N circular holes.

[0207] The N slots are circumferentially spaced from one another.

[0208] The carrier ring further comprises N projections extending radially outward from an outer edge of the carrier ring. The N slots are situated in the N projections, respectively.

[0209] The carrier ring further comprises N holes situated in the N projections, respectively. Each the N holes is located between an end point of the respective slot and an end point of the respective projection.

[0210] Each of N holes extends from the surface of the annular member towards an opposite surface of the annular member.

[0211] An assembly comprises a base portion comprising a first surface and a second surface, an oblong portion coupled to the first surface of the base portion, a finger extending from the second surface of the base portion, and a roller situated on the finger.

[0212] The second surface is perpendicular to the first surface, and the finger extends parallel to the first surface.

[0213] The assembly further comprises a support portion situated on the first surface of the base portion and under the oblong portion.

[0214] The oblong portion is parallel to the first surface of the base portion, and the oblong portion lies within a perimeter of the first surface of the base portion.

[0215] A surface of the oblong portion that is opposite to the first surface is flat and is parallel to the first surface of the base portion.

[0216] The oblong portion has two sides that straight and parallel to each other and two other sides that are arcuate.

[0217] The first surface is parallel to a first axis. The second surface is parallel to a second axis that is perpendicular to the first axis. The two sides of the oblong portion that straight and parallel to each other are parallel to the first axis. The finger extends parallel to the first axis. One of the two other sides of the oblong portion that are arcuate faces the finger. The other of the two other sides of the oblong portion that are arcuate faces away from the finger.

[0218] The assembly further comprises a hole situated on the first surface of the base portion. The hole is situated between a rounded end of the oblong portion and an edge of the first surface of the base portion.

[0219] The edge of the first surface of the base portion is away from the second surface of the base portion.

[0220] The roller is situated proximate to a distal end of the finger. The roller is situated along a longitudinal axis of the finger. The finger comprises a projection situated at the distal end of the finger.

[0221] The first surface is parallel to a first axis. The second surface is parallel to a second axis that is perpendicular to the first axis. A height of the finger along the second axis is less than a height of the second surface along the second axis. A length of the finger along the first axis is greater than a length of the first surface along the first axis. A width of the finger along a third axis that is perpendicular to the first and second axes is less than or equal to a width of the second surface along the third axis.

[0222] A carrier ring kit comprises an annular member comprising a surface and N slots situated on the surface, where N is an integer greater than 1 ; and N support assemblies configured to mate with the N slots, respectively, and to support a substrate.

[0223] Each of the N support assemblies comprises an attachment member comprising an oblong portion configured to couple the respective one of the N support assemblies to the annular member.

[0224] Each of the N slots is sized and shaped to receive a respective one of the oblong portions.

[0225] When a respective one of the oblong portions is received within the one of the N slots, the oblong portion is configured to move within the one of the N slots relative to the annular member from a first position to a second position and lock into the one of the N slots.

[0226] The first and second positions are 90 degrees apart.

[0227] The annular member comprises N holes on an opposite surface that align with the N slots, respectively. Each of the N slots comprises two stops located at diametrically opposite ends. The stops extend from opposite ends of opposite sides of each of the N slots to a circumference of respective ones of the N holes. When the oblong portion of one of the N support assemblies is moved within the one of the N slots from the firstposition to the second position, the two stops lock the oblong portion into the one of the N slots.

[0228] When the N support assemblies are mated with the N slots, respectively, top surfaces of the oblong portions of the N support assemblies are flush with the surface of the annular member.

[0229] Each of the N support assemblies comprises an attachment member and a finger extending outward from the attachment member and configured to support the substrate.

[0230] When the N support assemblies are mated with the N slots, respectively, the fingers of the N support assemblies extend radially inward from the annular member.

[0231] The annular member further comprises N openings on the surface. The kit further comprises N fasteners configured to mate with pairs of the N openings and the N support assemblies, respectively, to secure the N support assemblies to the annular member when the N support assemblies are mated with the N slots.

[0232] Each of the N support assemblies comprises an opening on an upper portion of the attachment member configured to receive one of the N fasteners.

[0233] The N slots are circumferentially spaced from one another.

[0234] Each of the N support assemblies is configured to rotatably couple to a respective one of the N slots.

[0235] Each of the N support assemblies comprises an oblong portion and a finger. The oblong portion is configured to mate with a respective one of the N slots. The finger extends radially inward from the annular member and is configured to support the substrate when the oblong portion is mated with the respective one of the N slots.

[0236] The foregoing description is merely illustrative in nature and is not intended to limit the disclosure, its application, or uses. The broad teachings of the disclosure can be implemented in a variety of forms. Therefore, while this disclosure includes particular examples, the true scope of the disclosure should not be so limited since other modifications will become apparent upon a study of the drawings, the specification, and the following claims.

[0237] It should be understood that one or more steps within a method may be executed in different order (or concurrently) without altering the principles of the present disclosure. Further, although each of the examples is described above as having certain features,any one or more of those features described with respect to any one of the examples of the disclosure can be implemented in and / or combined with features of any of the other examples, even if that combination is not explicitly described. In other words, the described examples are not mutually exclusive, and permutations of one or more examples with one another remain within the scope of this disclosure.

[0238] Spatial and functional relationships between elements (for example, between modules, circuit elements, semiconductor layers, etc.) are described using various terms, including “connected,” “engaged,” “coupled,” “adjacent,” “next to,” “on top of,” “above,” “below,” and “disposed.” Unless explicitly described as being “direct,” when a relationship between first and second elements is described in the above disclosure, that relationship can be a direct relationship where no other intervening elements are present between the first and second elements, but can also be an indirect relationship where one or more intervening elements are present (either spatially or functionally) between the first and second elements. As used herein, the phrase at least one of A, B, and C should be construed to mean a logical (A OR B OR C), using a non-exclusive logical OR, and should not be construed to mean “at least one of A, at least one of B, and at least one of C.”

[0239] In some implementations, a controller is part of a system, which may be part of the above-described examples. Such systems can comprise semiconductor processing equipment, including a processing tool or tools, chamber or chambers, a platform or platforms for processing, and / or specific processing components (a substrate support, a gas flow system, etc.). These systems may be integrated with electronics for controlling their operation before, during, and after processing of a semiconductor wafer or substrate.

[0240] The electronics may be referred to as the “controller,” which may control various components or subparts of the system or systems. The controller, depending on the processing requirements and / or the type of system, may be programmed to control any of the processes disclosed herein, including the delivery of processing gases, temperature settings (e.g., heating and / or cooling), pressure settings, vacuum settings, power settings, radio frequency (RF) generator settings, RF matching circuit settings, frequency settings, flow rate settings, fluid delivery settings, positional and operation settings, wafer transfers into and out of a tool and other transfer tools and / or load locks connected to or interfaced with a specific system.

[0241] Broadly speaking, the controller may be defined as electronics having various integrated circuits, logic, non-transitory memory, and / or software that receive instructions, issue instructions, control operation, enable cleaning operations, enable endpoint measurements, and the like. The integrated circuits may include chips in the form of firmware that store program instructions, digital signal processors (DSPs), chips defined as application specific integrated circuits (ASICs), and / or one or more microprocessors, or microcontrollers that execute program instructions (e.g., software).

[0242] Program instructions may be instructions communicated to the controller in the form of various individual settings (or program files), defining operational parameters for carrying out a particular process on or for a semiconductor wafer or to a system. The operational parameters may, in some examples, be part of a recipe defined by process engineers to accomplish one or more processing steps during the fabrication of one or more layers, materials, metals, oxides, silicon, silicon dioxide, surfaces, circuits, and / or dies of a wafer.

[0243] The controller, in some implementations, may be a part of or coupled to a computer that is integrated with the system, coupled to the system, otherwise networked to the system, or a combination thereof. For example, the controller may be in the “cloud” or all or a part of a fab host computer system, which can allow for remote access of the wafer processing. The computer may enable remote access to the system to monitor current progress of fabrication operations, examine a history of past fabrication operations, examine trends or performance metrics from a plurality of fabrication operations, to change parameters of current processing, to set processing steps to follow a current processing, or to start a new process.

[0244] In some examples, a remote computer (e.g., a server) can provide process recipes to a system over a network, which may include a local network or the Internet. The remote computer may include a user interface that enables entry or programming of parameters and / or settings, which are then communicated to the system from the remote computer. In some examples, the controller receives instructions in the form of data, which specify parameters for each of the processing steps to be performed during one or more operations. It should be understood that the parameters may be specific to the type of process to be performed and the type of tool that the controller is configured to interface with or control.

[0245] Thus, as described above, the controller may be distributed, such as by comprising one or more discrete controllers that are networked together and working towards a common purpose, such as the processes and controls described herein. An example of a distributed controller for such purposes would be one or more integrated circuits on a chamber in communication with one or more integrated circuits located remotely (such as at the platform level or as part of a remote computer) that combine to control a process on the chamber.

[0246] Without limitation, example systems may include a plasma etch chamber or module, a deposition chamber or module, a spin-rinse chamber or module, a metal plating chamber or module, a clean chamber or module, a bevel edge etch chamber or module, a physical vapor deposition (PVD) chamber or module, a chemical vapor deposition (CVD) chamber or module, an atomic layer deposition (ALD) chamber or module, an atomic layer etch (ALE) chamber or module, an ion implantation chamber or module, a track chamber or module, and any other semiconductor processing systems that may be associated or used in the fabrication and / or manufacturing of semiconductor wafers.

[0247] As noted above, depending on the process step or steps to be performed by the tool, the controller might communicate with one or more of other tool circuits or modules, other tool components, cluster tools, other tool interfaces, adjacent tools, neighboring tools, tools located throughout a factory, a main computer, another controller, or tools used in material transport that bring containers of wafers to and from tool locations and / or load ports in a semiconductor manufacturing factory.

Claims

CLAIMSWhat is claimed is:1 . A carrier ring comprising: an annular member; andN grooves arranged on a surface of the annular member, where N is an integer greater than 1 , wherein the N groves extend radially from an inner edge of the surface of the annular member towards an outer edge of the surface of the annular member.

2. The carrier ring of claim 1 wherein a longitudinal edge of each of the N grooves extends in a radial direction.

3. The carrier ring of claim 1 wherein the N grooves are circumferentially spaced from one another.

4. The carrier ring of claim 1 further comprising N projections extending radially outward from the outer edge of the carrier ring, wherein the N grooves are situated in the N projections, respectively.

5. The carrier ring of claim 4 further comprising N holes situated in the N projections, respectively; wherein each of the N holes is located between an end point of the respective groove and an end point of the respective projection.

6. The carrier ring of claim 5 wherein each of the N holes extends from the surface of the annular member to an opposing surface of the annular member.

7. The carrier ring of claim 1 wherein each of the N grooves comprises: a C-shaped portion; and a U-shaped portion; wherein an open end of the U-shaped portion extends from an open end of the C- shaped portion; a rounded portion of the U-shaped portion faces the outer edge of the surface of the annular member; and a closed portion of the C-shaped portion faces the inner edge of the surface of the annular member.

8. The carrier ring of claim 7 further comprising:N projections extending radially outward from the outer edge of the carrier ring, wherein the N grooves are situated in the N projections, respectively; andN holes situated in the N projections, respectively; wherein each the N holes is located between the rounded portion of the U-shaped portion of the respective groove and an end point of the respective projection.

9. An assembly comprising: a base portion comprising a first surface and a second surface; a dovetail portion situated on the first surface of the base portion; a finger extending outwardly from the second surface of the base portion; and a roller situated on the finger.

10. The assembly of claim 9 wherein the second surface is perpendicular to the first surface and wherein the finger extends parallel to the first surface.1 1 . The assembly of claim 9 wherein a surface of the dovetail portion that is opposite to the first surface is flat and is parallel to the first surface of the base portion.

12. The assembly of claim 9 wherein the dovetail portion comprises a rounded edge and a flat edge that is opposite to the rounded edge, and wherein the flat edge is flush with the second surface of the base portion.

13. The assembly of claim 9 wherein the dovetail portion comprises: a rounded edge; a flat edge that is opposite to the rounded edge, wherein the flat edge is flush with the second surface of the base portion; two side edges extending between the rounded and flat edges, wherein the two side edges slope inwards towards the first surface of the base portion; and the two side edges are parallel to respective sides of the first surface of the base portion.

14. The assembly of claim 9 further comprising a hole situated on the first surface of the base portion, wherein the hole is situated between a rounded end of the dovetail portion and an edge of the first surface of the base portion.

15. The assembly of claim 14 wherein the edge of the first surface of the base portion is away from the second surface of the base portion.

16. The assembly of claim 9 wherein: the roller is situated proximate to a distal end of the finger; the roller is situated along a longitudinal axis of the finger; and the finger comprises a projection situated at the distal end of the finger.

17. The assembly of claim 9 wherein: the first surface is parallel to a first axis; the second surface is parallel to a second axis that is perpendicular to the first axis; a height of the finger along the second axis is less than a height of the second surface along the second axis; a length of the finger along the first axis is greater than a length of the first surface along the first axis; and a width of the finger along a third axis that is perpendicular to the first and second axes is less than or equal to a width of the second surface along the third axis.

18. A carrier ring comprising: an annular member comprising N grooves, where N is an integer greater than 1 ; andN support assemblies mated with the N grooves, respectively, and configured to support a substrate.

19. The carrier ring of claim 18, wherein: a longitudinal edge of each of the N grooves extends in a radial direction; wherein the N grooves are circumferentially spaced from one another; and each of the N support assemblies is configured to slidably couple to a respective one of the N grooves.

20. The carrier ring of claim 18, wherein: each of the N support assemblies comprises: a dovetail portion configured to mate with a respective one of the N grooves; anda finger extending radially inward from the annular member and configured to support the substrate when the dovetail portion is mated with the respective one of the N grooves.

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