Manufacturing device for disk-shaped substrate and manufacturing method for disk-shaped substrate

Abstract

This manufacturing device for a disk-shaped substrate includes: a lower surface plate on which a carrier having a storage hole into which a disk-shaped substrate is loaded is placed on an upper side; an upper surface plate disposed on an upper side of the lower surface plate so as to be close to or away from the lower surface plate; a processing liquid supply part for supplying a processing liquid related to grinding processing or polishing processing between the lower surface plate and the upper surface plate; and a processing liquid discharge mechanism for discharging the processing liquid remaining in the storage hole of the carrier on which the disk-shaped substrate is not loaded.

Description

Disk-shaped substrate manufacturing apparatus and disk-shaped substrate manufacturing method

[0001] The present disclosure relates to a disk-shaped substrate manufacturing apparatus and a disk-shaped substrate manufacturing method.

[0002] Conventionally, in the manufacturing process of disk-shaped substrates used as substrates for magnetic disks, it is known that a grinding process is performed in which the disk-shaped substrate is ground using a grinding device, and a polishing process is performed in which the surface of the disk-shaped substrate is polished using a polishing device. After the grinding process or the polishing process, the grinding fluid or the polishing fluid remaining on the surface of the disk-shaped substrate during each process is removed from the surface of the disk-shaped substrate by a cleaning process for post-processing in the manufacturing process.

[0003] In the polishing apparatus disclosed in JP 2007-283457 A, a series of processes including polishing, cleaning, and drying is repeatedly performed using a transfer device. Specifically, a disk-shaped substrate is transferred from a cassette case by a loader unit, which is a transfer device located upstream of the polishing apparatus, and loaded into a storage hole of a carrier placed on the upper surface of the polishing pad of the lower surface plate. Next, the loaded disk-shaped substrate is polished by the upper surface plate and the lower surface plate, at least one of which rotates, while a polishing liquid is supplied while the substrate is in contact with the polishing pad of the upper surface plate and the polishing pad of the lower surface plate.

[0004] After polishing, a cleaning liquid is supplied to the disk-shaped substrate placed in the carrier's storage hole to remove the polishing liquid remaining on the surface of the disk-shaped substrate. The disk-shaped substrate that has undergone the polishing process is transferred from the carrier's storage hole to the cleaning and drying section by an unloader section, which is a transfer device located downstream of the polishing apparatus. Then, the next disk-shaped substrate, transferred using the loader section, is loaded into the carrier's storage hole above the polishing pad on the lower surface plate.

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 2007-283457

[0006] In a polishing apparatus, after a polished disk-shaped substrate is transferred to a cleaning and drying section, cleaning liquid may remain in the storage hole of the carrier. If cleaning liquid remains in the storage hole of the carrier, the thin and light disk-shaped substrate tends to float on the remaining cleaning liquid. When the disk-shaped substrate floating on the cleaning liquid comes into contact with the polishing pad of the upper surface plate adjacent to the lower surface plate for the next polishing process, the disk-shaped substrate tends to come off the storage hole.

[0007] If the detached disk-shaped substrate overlaps the carrier outside the storage hole, the disk-shaped substrate will contact the polishing pad at a position higher than the predetermined position due to the thickness of the carrier, which may cause problems such as damage to the disk-shaped substrate. Also, in a grinding device that uses a grinding fluid, if a carrier having a storage hole similar to that of a polishing device is used, the disk-shaped substrate will similarly easily become detached from the storage hole due to processing fluid such as a cleaning fluid remaining in the storage hole of the carrier.

[0008] The present disclosure has been made in light of the above, and provides a technique that can prevent a disk-shaped substrate from coming off a storage hole of a carrier due to processing liquid remaining in the storage hole.

[0009] Specific means for achieving the above object are as follows: <1> A manufacturing device for a disk-shaped substrate, comprising: a lower surface plate on which a carrier having storage holes into which disk-shaped substrates are loaded is placed, an upper surface plate arranged above the lower surface plate so as to be able to move toward or away from the lower surface plate, a processing liquid supply unit that supplies processing liquid related to a grinding process or a polishing process between the lower surface plate and the upper surface plate, and a processing liquid discharge mechanism that discharges the processing liquid remaining in the storage holes of the carrier when no disk-shaped substrates are loaded.

[0010] <2> The disk-shaped substrate manufacturing apparatus described in <1>, further comprising: a rotation mechanism that rotates the carrier; and a control unit that is connected to the rotation mechanism and rotates the carrier when the disk-shaped substrate is not loaded in the storage hole, wherein the control unit and the rotation mechanism constitute the treatment liquid discharge mechanism.

[0011] <3> The disk-shaped substrate manufacturing apparatus according to <1>, further comprising: an air injection mechanism that injects air toward the carrier; and a control unit that is connected to the air injection mechanism and injects air toward the carrier when the disk-shaped substrate is not loaded in the storage hole, wherein the control unit and the air injection mechanism constitute the treatment liquid discharge mechanism.

[0012] <4> The disk-shaped substrate manufacturing apparatus according to <3>, wherein the air injection mechanism has an air supply system that supplies separation air for separating the disk-shaped substrate.

[0013] <5> The disk-shaped substrate manufacturing apparatus according to <3>, further comprising a transfer device that transfers the disk-shaped substrate, the transfer device having an air nozzle as the air injection mechanism.

[0014] <6> The disk-shaped substrate manufacturing apparatus according to <1>, wherein the processing liquid discharge mechanism includes a suction mechanism having a suction port that opens facing the storage hole of the carrier, and the suction mechanism discharges the processing liquid by sucking the processing liquid remaining in the storage hole of the carrier when the disk-shaped substrate is not loaded in the storage hole.

[0015] <7> A method for manufacturing a disk-shaped substrate, comprising: a step of sandwiching the disk-shaped substrate between a lower surface plate and an upper surface plate, on which a carrier having a storage hole into which the disk-shaped substrate is loaded is placed, and polishing or grinding the disk-shaped substrate while supplying a processing liquid; and a step of draining the processing liquid remaining in the storage hole of the carrier when the disk-shaped substrate is not loaded.

[0016] According to the present disclosure, it is possible to prevent the disk-shaped substrate from coming off the storage hole of the carrier due to the processing liquid remaining in the storage hole.

[0017] Fig. 2 is a front view illustrating the configuration of the disk-shaped substrate manufacturing apparatus according to the first embodiment of the present disclosure; Fig. 3 is a plan view illustrating the disk-shaped substrate manufacturing apparatus according to the first embodiment; Fig. 4 is a cross-sectional view taken along line 3-3 in Fig. 2; Fig. 5 is a perspective view illustrating the disk-shaped substrate manufacturing apparatus according to a modified example of the second embodiment;

[0018] Embodiments of the present disclosure will be described below. However, the present disclosure is not limited to the following embodiments. When embodiments are described with reference to drawings in the present disclosure, the configuration of the embodiment is not limited to the configuration shown in the drawings. Furthermore, the sizes of components in each drawing are conceptual, and the relative size relationships between components are not limited to these.

[0019] In the following description of the drawings, like parts are designated by like reference numerals. However, the drawings are schematic, and the relationship between thickness and planar dimensions, and the thickness ratio of each device and each component, differ from the actual ones. Therefore, specific thicknesses and dimensions should be determined by taking into consideration the following explanation. Furthermore, there are parts in which the dimensional relationships and ratios differ between the drawings. Furthermore, unless otherwise specified in the specification, the number of each component element of the present disclosure is not limited to one, and multiple elements may be present.

[0020] In the following embodiments, components (including element steps, etc.) are not essential unless otherwise specified. The same applies to numerical values ​​and their ranges, and do not limit the present disclosure. In the present disclosure, numerical ranges indicated using "to" include the numerical values ​​before and after "to" as the minimum and maximum values, respectively. In the numerical ranges described in stages in the present disclosure, the upper or lower limit value described in one numerical range may be replaced with the upper or lower limit value of another numerical range described in stages. Furthermore, in the numerical ranges described in the present disclosure, the upper or lower limit value of that numerical range may be replaced with the value shown in the examples.

[0021] In the present disclosure, when a component is contained, each component may contain multiple types of corresponding substance. When multiple types of substances corresponding to each component are present in a composition, the content or amount of each component means the total content or amount of the multiple types of substances present in the composition, unless otherwise specified. In the present disclosure, particles corresponding to each component may contain multiple types of particles. When multiple types of particles corresponding to each component are present in a composition, the particle size of each component means the value for a mixture of the multiple types of particles present in the composition, unless otherwise specified. In the present disclosure, the terms "layer" and "film" include cases where the layer or film is formed over the entire area when the area where the layer or film is present is observed, as well as cases where the layer or film is formed only in a part of the area.

[0022] -First embodiment- <Disk-shaped substrate manufacturing apparatus> A disk-shaped substrate manufacturing apparatus 1 according to a first embodiment will be described with reference to Figures 1 to 3. Note that Figures 1 to 3 disclose common configurations between the first and second embodiments of the present disclosure, and therefore Figures 1 to 3 will be used in describing each embodiment. Configurations in the first embodiment that differ from the second embodiment will be described later, mainly with reference to Figure 2.

[0023] As shown in FIG. 1 , the disk-shaped substrate manufacturing apparatus 1 may be configured to include one or more other devices necessary for manufacturing disk-shaped substrates. Specifically, it may include a grinding device that grinds disk-shaped substrates upstream of the polishing device, a bulk transfer device for unprocessed or processed disk-shaped substrates, a standby device for waiting unprocessed or processed disk-shaped substrates, etc. FIG. 1 illustrates a loader unit 90 as a bulk transfer device upstream of the processing unit 10 of the polishing apparatus, and an unloader unit 98 as a bulk transfer device downstream of the processing unit 10. While the processing unit 10 of the first embodiment is a polishing device, in the present disclosure, the processing unit may also be a grinding device.

[0024] In addition, these may include, independently or in combination, a storage rack for storing unprocessed or processed disk-shaped substrates, a cleaning device for cleaning the disk-shaped substrates, a drying device for drying the disk-shaped substrates, etc. Figure 1 illustrates a supply unit 92 having a cassette case C as a storage rack in the upstream stage of the processing unit 10 of the polishing apparatus, and a discharge unit 96 having a cassette case C as a storage rack in the downstream stage of the processing unit 10. Figure 1 also illustrates a cleaning and drying unit 94 having the functions of both the cleaning device and the drying device in the downstream stage of the processing unit 10.

[0025] (Disc-shaped substrate) The disc-shaped substrate of the first embodiment is, for example, an aluminum substrate or an aluminum alloy substrate, but the present disclosure is not limited thereto and a glass substrate or the like may also be employed. Hereinafter, aluminum substrates, aluminum alloy substrates, glass substrates, etc. are also collectively referred to as "substrates." Furthermore, aluminum substrates and aluminum alloy substrates are also collectively referred to as "aluminum substrates." A plating layer may be formed on the surface of the aluminum substrate. In this case, the surface to be polished can be the plating layer. Aluminum substrates are advantageous in that they are easy to process and can reduce manufacturing costs.

[0026] On the other hand, a glass reinforced layer may be formed on the surface of the glass substrate. In this case, the surface to be polished may be the glass reinforced layer. Formation of the glass reinforced layer is not essential for the glass substrate. The present disclosure is also applicable to polishing the surface of a pure glass substrate on which no glass reinforced layer is formed. Glass substrates are superior to aluminum substrates in strength, surface flatness, heat resistance, etc., and therefore, it is easy to achieve miniaturization and high density of disk-shaped substrates.

[0027] Although the disk-shaped substrate of the first embodiment is for a magnetic recording medium, the present disclosure is not limited to this. The disk-shaped substrate of the present disclosure may be for other information recording disks, such as optical disks.

[0028] During polishing, the disk-shaped substrates are loaded into the storage holes 52A of the carriers 52. In the polishing device of the processing unit 10, the disk-shaped substrates rotate about their own axes, i.e., spin around their own axes, and also rotate around the sun gear 16 about its axis, i.e., revolve around the sun gear 16. As shown in FIG. 2 , the first embodiment illustrates a case in which three disk-shaped substrates are stored in one carrier 52, but the present disclosure is not limited to this, and the number of stored disk-shaped substrates may be one or any multiple number. Similarly, the first embodiment illustrates a case in which four carriers 52 are placed on the lower surface plate 12, but the present disclosure is not limited to this, and the number of carriers placed may be one or any multiple number.

[0029] As shown in FIG. 3, the processing unit 10 includes a lower surface plate 12, an upper surface plate 14, a polishing liquid supply unit 30, a first air supply system 41, a second air supply system 42, and a cleaning liquid supply unit 80.

[0030] (Lower Surface Plate) As shown in FIG. 3 , the lower surface plate 12 has a disk-shaped lower base 12A and a disk-shaped lower polishing pad 12B provided on the lower base 12A in FIG. 3 . A known polishing material, such as a polishing cloth, can be used as the lower polishing pad 12B. In this disclosure, the term "lower surface plate" may be used as a general term including the lower polishing pad. A carrier 52 for storing a disk-shaped substrate is placed above the lower polishing pad 12B of the lower surface plate 12. As shown in FIG. 1 , a sun gear 16 is disposed in the center of the lower surface plate 12 and engages with the gears on the peripheries of the four carriers 52. The lower surface plate 12 can be rotated by the rotation of the sun gear 16. A single internal gear 18 is disposed around the periphery of the lower surface plate 12 and engages with the gears on the peripheries of the four carriers 52. As shown in FIG. 3 , a discharge path D for discharging the polishing liquid is formed between the lower surface plate 12 and the internal gear 18.

[0031] (Upper surface plate) As shown in FIG. 3 , the upper surface plate 14 has a disc-shaped upper base 14A and a disc-shaped upper polishing pad 14B disposed below the upper base 14A in FIG. 3 . Like the lower polishing pad 12B, a known polishing material such as a polishing cloth can be used for the upper polishing pad 14B. In this disclosure, the term "upper surface plate" may be used as a general term including the upper polishing pad. The upper surface plate 14 is rotatably disposed above the lower surface plate 12 while facing the lower surface plate 12. In the second embodiment, both the lower surface plate 12 and the upper surface plate 14 are connected to a hydraulic drive unit, an electric drive unit, or the like, so that they can be raised and lowered. Therefore, the upper surface plate 14 can be moved toward or away from the lower surface plate 12. In this disclosure, at least one of the lower surface plate 12 and the upper surface plate 14 can be raised and lowered, so that the upper surface plate 14 can be positioned toward or away from the lower surface plate 12. The upper surface plate 14 has a first nozzle hole 21 and a second nozzle hole 22. The first nozzle hole 21 is formed in a portion facing the disk-shaped substrate, penetrating the upper base 14A and the upper polishing pad 14B. The second nozzle hole 22 is formed in a portion facing the carrier 52, penetrating the upper base 14A and the upper polishing pad 14B.

[0032] 2 , the first embodiment illustrates a state in which two first nozzle holes 21 are formed in a portion facing one disk-shaped substrate and six second nozzle holes 22 are formed in a portion facing the carrier 52, but the present disclosure is not limited to this. In the present disclosure, the respective numbers of first nozzle holes 21 and second nozzle holes 22 can be changed as appropriate.

[0033] 2, for the sake of explanation, the first nozzle holes 21 formed in a portion of the upper surface plate facing the disk-shaped substrate inside the storage hole 52A of the carrier 52, and the second nozzle holes 22 formed in a portion facing the region of the carrier 52 having a thickness, are illustrated by dashed lines. In the first embodiment, a state in which two first nozzle holes 21 and two second nozzle holes 22 are arranged on a straight line in a plan view is illustrated, but the present disclosure is not limited to this. The arrangement pattern of the first nozzle holes 21 and the second nozzle holes 22 can be changed as appropriate.

[0034] (Polishing Liquid Supply Unit) The polishing liquid supply unit 30 includes a polishing liquid tank 30A storing a polishing liquid and a polishing liquid pipe 30B connected between the polishing liquid tank 30A and the upper surface plate 14. The polishing liquid supply unit 30 supplies the polishing liquid between the lower surface plate 12 and the upper surface plate 14. Specifically, for example, the polishing liquid may be dropped onto the upper surface of the upper base 14A of the upper surface plate 14 in FIG. 3 and moved along the surface from the upper surface side to the lower side of the upper surface plate 14, thereby supplying the polishing liquid between the lower surface plate 12 and the upper surface plate 14. A through-hole may be formed through the upper base 14A and the upper polishing pad 14B as a path for the polishing liquid to flow. The polishing liquid supply unit 30 of this embodiment corresponds to the processing liquid supply unit of the present disclosure.

[0035] (Cleaning Liquid) In the polishing process, in the processing unit 10, the disc-shaped substrate sandwiched between the upper surface plate 14 and the lower surface plate 12 is polished while being supplied with a polishing liquid. After the polishing process, in order to clean the polishing liquid remaining on the surface of the disc-shaped substrate, a cleaning liquid W is supplied to the disc-shaped substrate placed in the storage hole 52A of the carrier 52, as shown in FIG.

[0036] 3, the cleaning liquid supply unit 80 includes a cleaning liquid tank 80A that stores the cleaning liquid W and a cleaning liquid pipe 80B through which the cleaning liquid W flows. The cleaning liquid supply unit 80 supplies the cleaning liquid W between the lower surface plate 12 and the upper surface plate 14. Specifically, for example, the cleaning liquid W can be supplied between the lower surface plate 12 and the upper surface plate 14 by being dropped onto the upper surface of the upper base 14A of the upper surface plate 14 in FIG. 3 and moving across the surface from the upper surface side toward the lower side of the upper surface plate 14.

[0037] 3, the first air supply system 41 has a first air supply source 41A and a first pipe 41B. A first drive unit P1, such as a pump, is disposed between the first air supply source 41A and the control unit 44. The first air supply source 41A stores first separation air 71 that separates the disk-shaped substrate from the upper surface plate 14. The first pipe 41B is connected between the first air supply source 41A and the first nozzle hole 21. The first air supply source 41A includes a storage device, such as a tank, that can store the first separation air.

[0038] (Second Air Supply System) The second air supply system 42 includes a second air supply source 42A and a second pipe 42B. A second drive unit P2, such as a pump, is disposed between the second air supply source 42A and the control unit 44. The second air supply source 42A stores second separation air for separating the carrier 52 from the upper surface plate 14. The second separation air is not shown in FIG. 3 . The second pipe 42B is connected between the second air supply source 42A and the second nozzle hole 22. Other configurations of the second air supply source 42A are similar to those of the first air supply source 41A, and therefore, redundant description will be omitted. The second air supply system 42 is provided independently of the first air supply system 41. In the first embodiment, the first air supply source 41A of the first air supply system 41 and the second air supply source 42A of the second air supply system 42 are independent sources. However, this is not limited to this, and a common supply source may be used for two or more air supply systems.

[0039] (Strip Air) In the first embodiment, the first separation air 71 and the second separation air are air, but the separation air in the present disclosure may be a gas other than air. The types of the first separation air and the second separation air may be the same or different from each other.

[0040] The first air supply source 41A of the first air supply system 41 and the second air supply source 42A of the second air supply system 42 have different supply sources, which allows the first peeling air 71 to be selectively sprayed toward the storage hole 52A of the carrier 52. Here, the fact that the supply systems are independent of each other includes both the fact that the supply paths are not connected to each other and the fact that the supply sources are different from each other.

[0041] 3, the control unit 44 causes the polishing apparatus to execute one or more processes included in the polishing process. In the present disclosure, the one or more processes included in the polishing process may be provided to the control unit 44 in the form of, for example, a program.

[0042] The control unit 44 is connected to the first drive unit P1 of the first air supply system 41 and the second drive unit P2 of the second air supply system 42. After the polishing process, the control unit 44 controls the first drive unit P1 to spray first peeling air 71 from the first nozzle hole 21 toward the disk-shaped substrate. This allows the disk-shaped substrate to be peeled off from the upper surface plate 14. Furthermore, after the polishing process, the control unit 44 controls the second drive unit P2 to spray second peeling air from the second nozzle hole 22 toward the carrier 52. This allows the carrier 52 to be peeled off from the upper surface plate 14.

[0043] In the present disclosure, the number of control units can be set arbitrarily to one or more, and for example, one control unit may be connected to each of the first air supply system 41 and the second air supply system 42. Regardless of the number of control units provided in the processing unit 10, the first air supply system 41 and the second air supply system 42 can be configured independently of each other.

[0044] 2, the disk-shaped substrate manufacturing apparatus 1 according to the first embodiment includes a processing liquid discharge mechanism A1. The processing liquid discharge mechanism A1 discharges the cleaning liquid W remaining inside the storage hole 52A of the carrier 52. The processing liquid discharge mechanism A1 according to the first embodiment is composed of a control unit 44 and a rotation mechanism.

[0045] (Rotation mechanism) The lower surface plate 12, sun gear 16, and internal gear 18 of the processing unit 10 correspond to the rotation mechanism of the present disclosure that rotates the carrier 52. In the present disclosure, at least one of the lower surface plate 12, sun gear 16, and internal gear 18 may constitute the rotation mechanism that rotates the carrier 52. The control unit 44 is connected to each of the lower surface plate 12, sun gear 16, and internal gear 18. In the present disclosure, the control unit may be connected to at least one of the lower surface plate 12, sun gear 16, and internal gear 18.

[0046] <Method for Manufacturing Disk-Shaped Substrate> Next, a method for manufacturing a disk-shaped substrate using the disk-shaped substrate manufacturing apparatus 1 according to the first embodiment will be described with reference to Fig. 2. The method for manufacturing a disk-shaped substrate according to the first embodiment includes the steps of: (A) placing a carrier 52 having storage holes 52A into which disk-shaped substrates are loaded, between the lower surface plate 12 and the upper surface plate 14; (B) sandwiching the disk-shaped substrate between the lower surface plate 12 and the upper surface plate 14 and polishing the disk-shaped substrate while supplying a polishing liquid between the lower surface plate 12 and the upper surface plate 14; (C) supplying a cleaning liquid W to wash the polishing liquid off the surface of the disk-shaped substrate; and (D) using a processing liquid discharge mechanism A1 to discharge, from the storage holes 52A, the cleaning liquid W remaining in the storage holes 52A of the carrier 52 when no disk-shaped substrate is loaded. In the first embodiment, a case where the method for manufacturing a disk-shaped substrate including steps (A) to (D) is implemented by operating the control unit 44 using a program for implementing the method for manufacturing a disk-shaped substrate is described as an example. In the present disclosure, the method for manufacturing a disk-shaped substrate may be implemented by operating the control unit 44 by an operator of the processing unit 10.

[0047] In the first embodiment, the method for manufacturing a disk-shaped substrate includes, in a series of polishing processes, a discharge process for discharging the cleaning liquid W from the storage hole 52A of the carrier 52. In the present disclosure, the method for manufacturing a disk-shaped substrate may be configured to include one or more other commonly known processes required for manufacturing a disk-shaped substrate, depending on the type of the disk-shaped substrate.

[0048] For example, in the case of an aluminum substrate, a method for manufacturing a disk-shaped substrate includes the following steps: Blank substrate preparation step: An aluminum substrate of desired dimensions is prepared. The aluminum substrate of desired dimensions is obtained, for example, by rolling an aluminum alloy ingot to obtain an aluminum alloy plate material of approximately 2 mm or less in thickness, and then punching the obtained aluminum alloy plate material into a disk shape. Cutting step: The prepared aluminum substrate is subjected to chamfering of the inner and outer diameters and cutting of both main surfaces. Grinding step: In order to reduce the surface roughness and waviness of the aluminum substrate after cutting, both main surfaces of the aluminum substrate are subjected to grinding with a grinding wheel. Plating step: The ground substrate is plated with electroless nickel plating (NiP) or the like to impart surface hardness and suppress surface defects. Polishing step: Both main surfaces of the aluminum substrate on which the plating film has been formed are polished.

[0049] In the case of a glass substrate, a method for manufacturing a disk-shaped substrate includes, for example, the following steps: Blank substrate preparation step: A glass blank substrate of desired dimensions is prepared. The glass blank substrate of desired dimensions is produced, for example, by press molding a glass blank that serves as a material for a plate-shaped glass substrate for a magnetic recording medium having a pair of main surfaces. The produced glass blank is formed into an annular shape by forming a circular hole in the center of the glass blank. Next, a glass substrate having a chamfered surface is obtained by shaping the glass blank. A grinding step and a polishing step are performed on the inner and outer peripheral end surfaces of the shaped glass substrate. Grinding step: The main surfaces of the glass substrate after the end surface polishing are ground using fixed abrasive grains. Polishing step: The main surfaces of the glass substrate after the grinding step are polished using a predetermined abrasive. During the polishing step, the glass substrate may be subjected to a chemical strengthening treatment.

[0050] The details of the discharge process according to the first embodiment will be described below, along with the polishing process that precedes the discharge process. [Polishing Process] In the polishing process, the lower surface plate 12 and the upper surface plate 14 are in contact with the disk-shaped substrate, and the disk-shaped substrate is rotated while a polishing liquid is supplied between the lower surface plate 12 and the upper surface plate 14, so that the surface of the disk-shaped substrate is polished by the lower surface plate 12 and the upper surface plate 14. The polishing liquid used when polishing an aluminum substrate is not particularly limited as long as it is a commonly used liquid, and examples thereof include slurries containing aluminum oxide, colloidal silica, etc. The polishing liquid used when polishing a glass substrate is not particularly limited as long as it is a commonly used liquid, and examples thereof include slurries containing cerium oxide, zirconia, colloidal silica, etc.

[0051] In the second embodiment, after polishing the disk-shaped substrate, first peeling air 71 is supplied by the first air supply system 41 to between the upper surface plate 14 and the disk-shaped substrate from the outside via first nozzle holes 21 provided in the upper surface plate 14, independently of the second air supply system 42. Furthermore, second peeling air is supplied by the second air supply system 42 to between the upper surface plate 14 and the carrier 52 from the outside via second nozzle holes 22 provided in the upper surface plate 14, independently of the first air supply system 41. As a result, the disk-shaped substrate is peeled off from the upper surface plate 14 even when the upper surface plate 14 is raised.

[0052] The timing at which the first air supply system 41 starts applying a driving force to the first peeling air 71 to supply the first peeling air 71 may be before or after the upper platen 14 starts to rise. The timing at which the application of the driving force to the first peeling air 71 is stopped may be before or after the upper platen 14 has completed rising to a preset height.

[0053] The timing at which the second air supply system 42 starts applying a driving force to the second separation air to supply the second separation air may be before or after the upper platen 14 starts to rise. The timing at which the application of a driving force to the second separation air stops may be before or after the upper platen 14 has completely risen to a predetermined height. The present disclosure does not exclude the supply of the first separation air 71 and the second separation air without the process of raising the upper platen 14.

[0054] By supplying the first and second separation air streams 71 and 72 independently, the polishing liquid that adsorbs the polished disk-shaped substrate and carrier 52 to the upper surface plate 14 is discharged through the discharge path D between the lower surface plate 12 and the internal gear 18. This causes both the disk-shaped substrate and the carrier 52 to be separated from the upper surface plate 14. After the polishing process, a cleaning liquid W is supplied to the disk-shaped substrate placed in the storage hole 52A of the carrier 52 to clean the polishing liquid remaining on the surface of the disk-shaped substrate. The cleaning liquid W that overflows from the storage hole 52A is discharged through the discharge path D, along with the polishing liquid. The cleaned disk-shaped substrates are then removed from the inside of the storage hole 52A of the carrier 52 by the unloader unit 98 in FIG. 1 and transferred en bloc from the processing unit 10 to a downstream process. As a result, the carrier 52, without any disk-shaped substrates loaded inside the storage hole 52A, is left on the lower polishing pad 12B of the lower surface plate 12.

[0055] [Process for Discharging Residual Cleaning Liquid] The control unit 44 rotates the carrier 52 in which no disk-shaped substrate is loaded inside the storage hole 52A by controlling the lower surface plate 12, the sun gear 16, and the internal gear 18. The rotation speed of the carrier 52 for discharging the cleaning liquid W to the outside of the storage hole 52A is preset to be faster than the rotation speed set during normal polishing.

[0056] The processing liquid discharge mechanism A1 rotates the carrier 52 to discharge the cleaning liquid W remaining in the storage holes 52A of the carrier 52 to the outside of the storage holes 52A. Then, when a plurality of disk-shaped substrates to be subjected to the next polishing process are transferred collectively to the processing unit 10 by the loader unit 90, each disk-shaped substrate is loaded into the storage holes 52A from which the cleaning liquid W has been discharged to the outside.

[0057] In the present disclosure, the polishing process and the residual cleaning liquid discharge process may each be performed independently multiple times. When the polishing process is performed multiple times, the type of polishing liquid used in each polishing process may be different. Furthermore, for example, a chemical strengthening process may be performed on the disk-shaped substrate between multiple polishing processes to improve the impact resistance of the disk-shaped substrate. Then, predetermined processes such as cleaning, magnetic film formation, and cooling are performed on the transferred disk-shaped substrate, thereby manufacturing a magnetic recording medium with desired specifications.

[0058] In the first embodiment, the processing liquid discharge mechanism A1 discharges the cleaning liquid W remaining in the storage hole 52A of the carrier 52 to the outside of the storage hole 52A. This prevents the disk-shaped substrate to be loaded next into the storage hole 52A from becoming dislodged from the storage hole 52A due to the remaining cleaning liquid W. This eliminates the need to stop the operation of the apparatus and return the dislodged disk-shaped substrate to its original storage hole 52A each time a disk-shaped substrate becomes dislodged from the storage hole 52A during the series of processes for manufacturing disk-shaped substrates. Furthermore, the series of processes is less likely to stagnate.

[0059] In the first embodiment, the control unit 44 can discharge the cleaning solution W remaining in the storage hole 52A to the outside of the storage hole 52A simply by rotating the carrier 52 using the lower surface plate 12, sun gear 16, and internal gear 18. The lower surface plate 12, sun gear 16, and internal gear 18 are components of the processing unit 10 that are generally included in the disk-shaped substrate manufacturing apparatus 1, and therefore the burden of separately preparing devices that constitute the processing solution discharge mechanism A1, excluding the control unit 44, is small.

[0060] Second Embodiment <Disk-Shaped Substrate Manufacturing Apparatus> A disk-shaped substrate manufacturing apparatus 1 according to the second embodiment differs from the processing liquid discharge mechanism A1 of the first embodiment mainly in the configuration of the processing liquid discharge mechanism A2. Therefore, the configuration of the processing liquid discharge mechanism A2 will be described below mainly with reference to FIG.

[0061] As shown in FIG. 3 , in the second embodiment, the control unit 44 and the first air supply system 41 constitute a treatment liquid discharge mechanism A2. The first air supply system 41 in the second embodiment injects first peeling air 71 toward the storage holes 52A of the carrier 52 when no disk-shaped substrate is loaded in the storage holes 52A. The first air supply system 41 in the second embodiment corresponds to the air injection mechanism of the present disclosure. In the present disclosure, the treatment liquid can be discharged using only the air supply as the treatment liquid discharge mechanism A2 of the second embodiment or using only the rotation mechanism as the treatment liquid discharge mechanism A1 of the first embodiment. In the present disclosure, an air injection mechanism different from the first air supply system 41 may be used as the treatment liquid discharge mechanism A2. In the present disclosure, an auxiliary device or auxiliary equipment for injecting air toward the storage holes 52A of the carrier 52, other than the first air supply system 41, may be included in the air injection mechanism.

[0062] The control unit 44 controls the first drive unit P1 to spray first peeling air 71 from the first nozzle hole 21 toward the storage hole 52A when no disk-shaped substrate is loaded. The spray of the first peeling air 71 causes the cleaning solution W remaining inside the storage hole 52A to fly outward. The other configurations of the disk-shaped substrate manufacturing apparatus 1 according to the second embodiment are the same as those of the first embodiment, and therefore will not be described again.

[0063] <Method for manufacturing a disk-shaped substrate> Next, a method for manufacturing a disk-shaped substrate using a disk-shaped substrate manufacturing apparatus according to the second embodiment will be described. The method for manufacturing a disk-shaped substrate according to the second embodiment includes the same steps (A), (B), (C), and (D) as those in the first embodiment. In the second embodiment, steps (A) to (C) are the same as those in the first embodiment except for step (D) in which the residual cleaning liquid discharge process is performed. Therefore, the following will specifically describe the residual cleaning liquid discharge process (D), and will not repeat the explanation of steps (A) to (C).

[0064] [Process for Discharging Residual Cleaning Liquid] In the manufacturing apparatus 1 for disk-shaped substrates, after the polishing process, the upper surface plate 14 approaches the carrier 52 having the storage holes 52A in which the cleaning liquid W remains after the disk-shaped substrate has been removed, to a height that forms a predetermined gap. The first air supply system 41 sprays first peeling air 71 through the first nozzle holes 21 provided in the upper surface plate 14 toward the storage holes 52A of the carrier 52 in which no disk-shaped substrate is loaded, between the upper surface plate 14 and the disk-shaped substrate. The force of the sprayed air causes the cleaning liquid W remaining in the storage holes 52A to be discharged to the outside of the storage holes 52A.

[0065] In the present disclosure, the first peeling air 71 may be sprayed while the upper surface plate 14 remains stationary and not approaching the carrier 52, as long as the cleaning solution W is discharged to the outside of the storage hole 52A. The cleaning solution W discharged from the storage hole 52A is discharged through the discharge path D. Then, a plurality of disk-shaped substrates to be subjected to the next polishing process are transferred collectively to the processing unit 10 by the loader unit 90, and each disk-shaped substrate is loaded into the corresponding storage hole 52A after the cleaning solution W has been discharged to the outside. The processes subsequent to the residual cleaning solution discharge process in the second embodiment are the same as those in the first embodiment.

[0066] In the second embodiment, as in the first embodiment, the processing liquid discharge mechanism A2 discharges the cleaning liquid W remaining in the storage hole 52A of the carrier 52 to the outside of the storage hole 52A. This prevents the disk-shaped substrate to be loaded next into the storage hole 52A from coming off the storage hole 52A due to the remaining cleaning liquid W.

[0067] In the second embodiment, the control unit 44 controls the first air supply system 41, so that the cleaning liquid W remaining in the storage hole 52A can be discharged to the outside of the storage hole 52A simply by spraying the first peeling air 71 toward the storage hole 52A. Because the first air supply system 41 is a component of the processing unit 10 that is generally included in the disk-shaped substrate manufacturing apparatus 1, the burden of separately providing devices that constitute the processing liquid discharge mechanism A2, except for the control unit 44, is small. Other effects of the second embodiment are similar to those of the first embodiment.

[0068] <Modification: Treatment Liquid Discharge Mechanism> A disk-shaped substrate manufacturing apparatus according to a modification of the second embodiment has an air injection mechanism that is different from the first air supply system 41. As shown in FIG. 4 , the air injection mechanism of the modification has an air nozzle 91, a third air supply system 43, and a third drive unit P3. The air nozzle 91 is attached to a mounting plate 53 of a loader unit 90 of a transfer device. In the present disclosure, the transfer device may be the unloader unit 98 in FIG. 1 , or may be both the loader unit 90 and the unloader unit 98. The air nozzle and the transfer device constitute a treatment liquid discharge mechanism of the modification.

[0069] (Transfer Device) In Fig. 4 , a mounting shaft 55, which is the rotation axis of the mounting plate 53, is attached to the upper surface of the disk-shaped mounting plate 53, and five gripping units 54, which grip the disk-shaped substrate during transfer, are attached to the lower surface of the mounting plate 53 at equal intervals in the circumferential direction around the outer periphery of the mounting plate 53. Although not shown, the gripping units 54 extend in the vertical direction in Fig. 4 and have a pair of claws that face each other in the horizontal direction. The gripping units 54 are attached to the mounting plate 53 so as to be slidable in the vertical direction in Fig. 4 . The disk-shaped substrate is gripped by the pair of claws of the gripping units 54 being inserted into a central through-hole of the disk-shaped substrate and moving apart from each other in the horizontal direction. Furthermore, the gripping of the disk-shaped substrate is released by the pair of claws of the gripping units 54 being inserted into a central through-hole of the disk-shaped substrate and moving closer to each other in the horizontal direction. In FIG. 4, for ease of viewing, only the upper portions of the two gripping portions 54 are partially shown, and the other three gripping portions are not shown.

[0070] As shown in FIG. 4 , five air nozzles 91 are attached to the outer periphery of the mounting plate 53 at equal intervals along the circumferential direction. In a modified example, the number of air nozzles 91 is five, but in the present disclosure, the number of air nozzles is arbitrary. Each of the five air nozzles 91 is arranged between adjacent gripping portions 54 in the circumferential direction, with the nozzle hole at the lower end of the main pipe portion 91A facing the portion surrounding the storage hole 52A on the periphery of the carrier 52. Of the five air nozzles 91, the air nozzle 91 located at the rightmost side in FIG. 4 has a main pipe portion 91A extending in the vertical direction in FIG. 4 and a branch pipe portion 91B extending approximately horizontally from the outer periphery of the main pipe portion 91A. The branch pipe portion 91B extends from the outside toward the inside in the radial direction of the disc-shaped carrier 52 and bends downward in FIG. 4 from the center of the carrier 52. The nozzle holes at the lower end of the branch pipe portion 91B in Figure 4 face the surrounding area of ​​the storage hole 52A in the center of the carrier 52. Six nozzle holes, consisting of the nozzle holes of the main pipe portions 91A of the five air nozzles 91 and the nozzle hole of the branch pipe portion 91B of one air nozzle 91, are formed facing the surrounding area of ​​the storage hole 52A of the carrier 52. In the present disclosure, the number of nozzle holes in the main pipe portion and the number of nozzle holes in the branch pipe portions are arbitrary. In the present disclosure, it is not excluded that an air nozzle may be formed by one or more main pipe portions without providing a branch pipe portion.

[0071] The five air nozzles 91 are connected via a third pipe 43B to a third air supply source 43A that stores air 73 to be supplied to the air nozzles 91. The third air supply source 43A and the third pipe 43B constitute a third air supply system 43. The first separation air 71 from the first air supply system 41 or the second separation air from the second air supply system 42 may be used as the air 73 for the third air supply system 43. This allows the overall air supply system to be configured more compactly. A third drive unit P3, such as a pump, is connected to the third air supply source 43A. A control unit 44 is connected to the third drive unit P3. The control unit 44 controls the third drive unit P3 to cause the air nozzles 91 to spray air 73 toward the area surrounding the storage hole 52A of the carrier 52 when no disk-shaped substrate is loaded. Other configurations in this modified example are similar to those of the same components in the second embodiment, and therefore will not be described again.

[0072] In this modification, an air nozzle 91 is used when the loader unit 90 transfers the disk-shaped substrate to the processing unit 10 before polishing. While the gripping unit 54 is gripping the disk-shaped substrate, air 73 is sprayed from each of the six nozzle holes of the air nozzle 91 directly onto the area surrounding the storage hole 52A of the carrier 52 when no disk-shaped substrate is loaded. The force of the sprayed air 73 can cause the cleaning liquid W remaining in the storage hole 52A to be discharged to the outside of the storage hole 52A. After the cleaning liquid W is discharged, the gripping unit 54 releases its grip on the disk-shaped substrate, thereby loading the disk-shaped substrate into the storage hole 52A. Other effects of the modification are similar to those of the second embodiment.

[0073] Third Embodiment <Disk-Shaped Substrate Manufacturing Apparatus> The disk-shaped substrate manufacturing apparatus of the third embodiment differs from the disk-shaped substrate manufacturing apparatus 1 of the first and second embodiments in that it further includes, as a treatment liquid discharge mechanism, a suction mechanism having a suction port that opens facing the storage hole of the carrier. The other configuration of the disk-shaped substrate manufacturing apparatus of the third embodiment is the same as that of the first or second embodiment, so repeated explanation will be omitted.

[0074] The suction mechanism may be, for example, a cylindrical suction member having a suction port at its lower end located near the storage hole of the carrier placed on the lower surface plate. A vacuum pipe connected to a vacuum pump or the like is inserted into the suction member, and a reduced pressure is created by the vacuum pipe, thereby sucking out the cleaning liquid remaining inside the storage hole at the position opposite the suction port. The device to which the suction member is attached may be a loader or unloader unit of a transfer device, or may be another device. The cylindrical suction member may be disposed, for example, in the gap between a pair of claws of a gripper of the transfer device. By disposing the cylindrical suction member in the gap between the pair of claws of the gripper, the suction mechanism can be configured more compactly than, for example, when the cylindrical suction member is disposed next to one of the pair of claws of the gripper.

[0075] <Method for manufacturing a disk-shaped substrate> Next, a method for manufacturing a disk-shaped substrate using an apparatus for manufacturing a disk-shaped substrate according to the third embodiment will be described. When a suction member is provided in the gripping section of the loader section, the method for manufacturing a disk-shaped substrate according to the third embodiment includes step (Aa) corresponding to step (A) of the first embodiment, and steps (B) and (C) similar to those of the first embodiment. Specifically, in step (Aa) of the third embodiment, a process corresponding to the residual cleaning liquid discharge step (D) of the first embodiment is performed after the disk-shaped substrates have been transferred en bloc from the previous stage to the processing section and before the disk-shaped substrates are loaded into the storage holes of the carrier.

[0076] In the third embodiment, when the suction member is provided in the gripping portion of the unloader portion, a process corresponding to the residual cleaning liquid discharge step (D) in the first embodiment is carried out after the same step as (C), when the disk-shaped substrates are removed from the storage holes of the carrier and then transferred en bloc from the processing portion to a subsequent stage. In either case, when the suction member is provided in the gripping portion of the loader portion or the unloader portion, the suction mechanism discharges the cleaning liquid by sucking up the cleaning liquid remaining in the storage holes of the carrier when no disk-shaped substrates are loaded in the storage holes.

[0077] [Residual Cleaning Liquid Discharge Process] In the third embodiment, step (Aa) will be described as an example when the suction member is provided on the gripper of the loader. Step (Aa) of the third embodiment includes, during step (A) of the first embodiment, the following process, which corresponds to the residual cleaning liquid discharge process: (a) a process of discharging, by a processing liquid discharge mechanism, cleaning liquid remaining in the storage holes of the carrier when no disk-shaped substrate is loaded.

[0078] In step (Aa), first, in the disk-shaped substrate manufacturing apparatus 1, with the gripping unit gripping the disk-shaped substrate, the suction port of the suction mechanism is positioned opposite the storage hole of the carrier placed on the lower surface plate. Next, the suction mechanism is driven to suck out the cleaning liquid remaining in the storage hole. By suction, the cleaning liquid remaining in the storage hole can be discharged to the outside of the storage hole. After the cleaning liquid is discharged, the suction port of the suction mechanism is moved away from the storage hole of the carrier, and the gripping unit releases the grip of the disk-shaped substrate, thereby loading the disk-shaped substrate into the storage hole. Thereafter, steps (B) and (C) similar to those of the first embodiment are performed. Duplicate explanations of steps (B) and (C) will be omitted.

[0079] (Polishing Pad Cleaning Process) Here, in polishing processing, a cleaning process for cleaning the disk-shaped substrate mounting surface of the lower polishing pad of the lower surface plate may be performed separately from the cleaning process for the disk-shaped substrate surface. Specifically, a cleaning liquid such as water is sprayed onto the mounting surface of the lower polishing pad. In the third embodiment, after the polishing pad cleaning process, the suction mechanism of the processing liquid discharge mechanism sucks up the cleaning liquid remaining in the carrier storage hole, thereby discharging not only the cleaning liquid for cleaning the disk-shaped substrate but also the cleaning liquid for cleaning the polishing pad to the outside of the storage hole. Other configurations of the third embodiment, other than the suction mechanism, are the same as the configurations of the same-named components in the first and second embodiments, so repeated explanations will be omitted.

[0080] In the third embodiment, as in the first and second embodiments, the processing liquid discharge mechanism discharges the cleaning liquid remaining in the storage hole of the carrier to the outside of the storage hole, thereby preventing the disk-shaped substrate to be loaded next from becoming dislodged from the storage hole due to the remaining cleaning liquid.

[0081] In the third embodiment, the suction mechanism serving as the treatment liquid discharge mechanism discharges the cleaning liquid remaining in the storage hole, whether the suction member is provided in the gripping portion of the loader or the gripping portion of the unloader. The suction mechanism allows the remaining cleaning liquid to be removed to a location away from the processing unit, eliminating the need to use the discharge path (see discharge path D in FIG. 3 ) formed in the processing unit. Other advantages of the third embodiment are similar to those of the first and second embodiments.

[0082] <Other Embodiments> The present disclosure has been described with reference to the above disclosed embodiments, but the descriptions and drawings forming part of this disclosure should not be understood to limit the present disclosure.

[0083] For example, in the above embodiment, a case where multiple disk-shaped substrates are polished collectively by rotating and revolving the carrier 52 using the internal gear 18 and the sun gear 16 is illustrated, but the present disclosure is not limited to this. In the present disclosure, for example, the multiple disk-shaped substrates may be held in a state where they protrude upward, and a polishing plate may be brought into contact with the surfaces of the disk-shaped substrates from above. Then, the upper polishing plate may be rotated to polish the multiple disk-shaped substrates collectively. The polishing plate may also rotate and revolve without rotating the disk-shaped substrates.

[0084] (Grinding Device) In the above embodiment, the processing unit 10 is described as a polishing device, but the present disclosure is not limited to this, and the processing unit may be a grinding device. In the first embodiment, a method for manufacturing a polished disk-shaped substrate using a polishing device as the processing unit is exemplified as the method for manufacturing a disk-shaped substrate, but in the present disclosure, the method for manufacturing a disk-shaped substrate may be a method for manufacturing a ground disk-shaped substrate using a grinding device as the manufacturing device.

[0085] When the processing unit of the disk-shaped substrate manufacturing apparatus is a grinding device, grindstones are applied to the lower polishing pad 12B on the lower surface plate 12 of the processing unit 10 in FIG. 3 and the upper polishing pad 14B on the upper surface plate 14. In this case, the terms "upper surface plate" and "lower surface plate" may be used as generic terms including grindstones. Furthermore, in the grinding process in the grinding device, the grinding process is performed by supplying, for example, coolant as the grinding fluid instead of the polishing fluid. Therefore, the polishing fluid tank 30A, the polishing fluid piping 30B, etc. in the first embodiment may be appropriately read as a coolant tank, a coolant piping, etc., respectively. The processing fluid used in the grinding process is not limited to coolant, and may be any other liquid supplied between the upper and lower surface plates.

[0086] When the processing unit is a grinding device, the grinding fluid remaining on the surface of the disk-shaped substrate is removed by the cleaning fluid. Then, as in the first to third embodiments, the processing fluid discharge mechanism discharges the cleaning fluid W remaining in the storage hole 52A of 52 when no disk-shaped substrate is loaded. This prevents the disk-shaped substrate to be loaded next into the storage hole 52A from falling out of the storage hole 52A due to the remaining cleaning fluid W.

[0087] (Manufacturing Method) The method for manufacturing a ground disk-shaped substrate of the present disclosure includes steps similar to the steps (A), (B), (C), and (D) in the methods for manufacturing a ground disk-shaped substrate of the first and second embodiments, and specifically may include the following steps in a grinding device: (A1) a step of placing a carrier for storing a disk-shaped substrate between a lower surface plate and an upper surface plate; (B1) a step of processing the disk-shaped substrate while sandwiching the disk-shaped substrate between the lower surface plate and the upper surface plate and supplying a grinding fluid between the lower surface plate and the upper surface plate; (C1) a step of supplying a cleaning fluid for washing the grinding fluid; and (D1) a step of discharging the cleaning fluid remaining in the storage hole of the carrier when no disk-shaped substrate is loaded, using a grinding processing fluid discharge mechanism.

[0088] The method for manufacturing a ground disk-shaped substrate of the present disclosure may include the following steps, which correspond to step (A) including the process (a) in the method for manufacturing a polished disk-shaped substrate of the third embodiment: (A1a) a step of placing a carrier for storing disk-shaped substrates between a lower surface plate and an upper surface plate, which step includes a process of discharging cleaning liquid remaining in the storage hole of the carrier when no disk-shaped substrate is loaded, using a processing liquid discharge mechanism, and the above steps (B1) and (C1).

[0089] The method for manufacturing a disk-shaped substrate according to the present disclosure may include, for example, the steps (A1), (B1), (C1), and (D1) in the method for manufacturing a ground disk-shaped substrate described above as the processing steps in the grinding apparatus, and the steps (A), (B), (C), and (D) in the first and second embodiments as the processing steps in the polishing apparatus. The method for manufacturing a disk-shaped substrate according to the present disclosure may include, for example, the steps (A1a), (B1), and (C1) in the method for manufacturing a ground disk-shaped substrate described above as the processing steps in the grinding apparatus, and the steps (A), (B), and (C) in the third embodiment as the processing steps in the polishing apparatus. This allows for the efficient production of ground and polished disk-shaped substrates while obtaining the advantages of both the method for manufacturing a ground disk-shaped substrate and the method for manufacturing a polished disk-shaped substrate over time.

[0090] The present disclosure may be formed, for example, by partially combining the respective configurations included in the above-described multiple embodiments. For example, when a polishing process combines rough polishing and finish polishing, the respective cleaning liquids can be discharged by rotating the carrier after the rough polishing process as in the first embodiment, and by spraying air after the finish polishing process as in the second embodiment. By performing the cleaning liquid discharge process multiple times in a single polishing or grinding process, the cleaning liquid removal effect can be enhanced. A partial combination of the respective configurations included in the multiple embodiments can also be employed when the processing steps in the grinding device and the polishing device are consecutive. In each embodiment of the present disclosure, the cleaning liquid remaining in the carrier's storage hole is discharged to the outside of the storage hole by the processing liquid discharge mechanism. However, in the present disclosure, the object to be discharged is not limited to the cleaning liquid. The processing liquid of the present disclosure may be any processing liquid related to the polishing process, such as a polishing liquid, grinding liquid, cleaning water, or coolant.

[0091] The present disclosure includes various embodiments not described above, and the technical scope of the present disclosure is defined by the invention-specifying matters in the claims that are appropriate from the above description.

[0092] The disclosure of Japanese Patent Application No. 2024-112059, filed on July 11, 2024, is incorporated herein by reference in its entirety. In addition, all documents, patent applications, and technical standards described herein are incorporated herein by reference to the same extent as if each individual document, patent application, and technical standard was specifically and individually indicated to be incorporated by reference.

[0093] REFERENCE SIGNS LIST 1 Disk-shaped substrate manufacturing apparatus 10 Processing section 12 Lower surface plate (rotation mechanism) 14 Upper surface plate 16 Sun gear (rotation mechanism) 18 Internal gear (rotation mechanism) 30 Polishing liquid supply section (treatment liquid supply section) 41 First air supply system (air injection mechanism) 44 Control section 52 Carrier 52A Storage hole 73 Air 90 Loader section (transfer device) 91 Air nozzle 98 Unloader section (transfer device) A1 Treatment liquid discharge mechanism A2 Treatment liquid discharge mechanism W Cleaning liquid (treatment liquid)

Claims

1. A manufacturing device for disk-shaped substrates, comprising: a lower surface plate on which a carrier having storage holes into which disk-shaped substrates are loaded is placed; an upper surface plate positioned above the lower surface plate so as to be able to move toward or away from the lower surface plate; a processing liquid supply unit that supplies processing liquid for grinding or polishing between the lower surface plate and the upper surface plate; and a processing liquid discharge mechanism that discharges the processing liquid remaining in the storage holes of the carrier when no disk-shaped substrates are loaded.

2. The disk-shaped substrate manufacturing apparatus of claim 1, further comprising: a rotation mechanism that rotates the carrier; and a control unit connected to the rotation mechanism that rotates the carrier when no disk-shaped substrate is loaded in the storage hole, wherein the control unit and the rotation mechanism constitute the processing liquid discharge mechanism.

3. The disk-shaped substrate manufacturing apparatus according to claim 1, further comprising: an air injection mechanism that injects air toward the carrier; and a control unit that is connected to the air injection mechanism and injects air toward the carrier when the disk-shaped substrate is not loaded in the storage hole, wherein the control unit and the air injection mechanism constitute the processing liquid discharge mechanism.

4. The disk-shaped substrate manufacturing device according to claim 3, wherein the air injection mechanism has an air supply system that supplies peeling air for peeling the disk-shaped substrate.

5. The disk-shaped substrate manufacturing apparatus according to claim 3, further comprising a transfer device for transferring the disk-shaped substrate, the transfer device having an air nozzle as the air injection mechanism.

6. The disk-shaped substrate manufacturing device according to claim 1, wherein the processing liquid discharge mechanism comprises a suction mechanism having a suction port that opens facing the storage hole of the carrier, and the suction mechanism discharges the processing liquid by sucking out the processing liquid remaining in the storage hole of the carrier when the disk-shaped substrate is not loaded in the storage hole.

7. A method for manufacturing a disk-shaped substrate, comprising: a step of sandwiching a disk-shaped substrate between a lower surface plate and an upper surface plate, on which a carrier having a storage hole into which the disk-shaped substrate is loaded is placed, and polishing or grinding the disk-shaped substrate while supplying a processing liquid; and a step of draining the processing liquid remaining in the storage hole of the carrier when the disk-shaped substrate is not loaded.

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