Apparatus and method for manufacturing cleaning water for electronic device

Abstract

This apparatus for manufacturing cleaning water for an electronic device comprises: a pH adjusting device that prepares pH adjusting water by adding a pH adjusting agent to ultrapure water; a deaerator that deaerates the pH adjusting water; a gas dissolving film type device that prepares cleaning water by dissolving a functional gas in the deaerated pH adjusting water through a gas permeable membrane; and a transportation line that can transport the ultrapure water, the pH adjusting water, and the cleaning water at a flow rate of 25L / min or higher.

Description

Apparatus for producing cleaning water for electronic devices and method for producing said cleaning water

[0001] The present disclosure relates to an apparatus for producing cleaning water for electronic devices and a method for producing the cleaning water.

[0002] In the manufacturing process of electronic devices such as semiconductor devices, contaminants on the surfaces of electronic devices can lead to deterioration of the performance of the electronic devices or a decrease in the yield of the manufacturing line. For this reason, the surfaces of electronic devices are cleaned using ultrapure water or cleaning water prepared by dissolving chemicals in ultrapure water. Conventionally, cleaning water prepared by dissolving ammonia, hydrogen gas, etc. in ultrapure water as raw water has been used as the cleaning water (see, for example, Patent Documents 1 to 3).

[0003] JP 10-064867 A JP 2000-354729 A JP 2018-022749 A

[0004] In recent years, with the improvement in the performance of electronic devices, the miniaturization of circuit fabrication technology has progressed significantly. Since even small amounts of contaminants can become a problem, the amount of cleaning water used is increasing year by year. The present disclosure aims to provide a manufacturing apparatus capable of producing cleaning water for electronic devices at a large flow rate.

[0005] One aspect of the apparatus for producing cleaning water for electronic devices according to the present disclosure includes: a pH adjusting device that adds a pH adjuster to ultrapure water to prepare pH-adjusted water; a degassing device that degasses the pH-adjusted water; a gas-dissolving membrane type apparatus that prepares cleaning water by dissolving a functional gas in the degassed pH-adjusted water via a gas-permeable membrane; and transfer lines that can transport the ultrapure water, the pH-adjusted water, and the cleaning water at a flow rate of 25 L / min or more.

[0006] The apparatus for producing cleaning water for electronic devices according to the present disclosure can produce cleaning water at a large flow rate.

[0007] Fig. 1 is a block diagram showing an outline of an embodiment of a cleaning water production device. Fig. 2 is a block diagram showing an outline of an embodiment of a cleaning water production device. Fig. 3 is a block diagram showing an outline of an embodiment of a cleaning water production device.

[0008] In this specification, the numerical range N1 to N2 means N1 or more and N2 or less. In this specification, when the units of the numerical values ​​written before and after "to" indicating a numerical range are the same, the unit of the numerical value written before "to" may be omitted.

[0009] [Apparatus for Producing Cleaning Water for Electronic Devices] Embodiments of the present disclosure will now be described in detail with reference to the drawings. The apparatus for producing cleaning water for electronic devices of the present disclosure (hereinafter also simply referred to as the "production apparatus of the present disclosure") includes a pH adjuster that adds a pH adjuster to ultrapure water to prepare pH-adjusted water, a degassing apparatus that degasses the pH-adjusted water, a gas-dissolved membrane type apparatus that prepares cleaning water by dissolving a functional gas in the degassed pH-adjusted water via a gas-permeable membrane, and transfer lines that can transport the ultrapure water, the pH-adjusted water, and the cleaning water at a flow rate of 25 L / min or more.

[0010] The manufacturing apparatus of the present disclosure produces cleaning water for electronic devices from ultrapure water. Ultrapure water is produced, for example, by removing ionic substances, organic matter, dissolved gases, and particulates from raw water. Examples of raw water include city water, well water, river water, lake water, and industrial water. For example, ultrapure water preferably has a resistivity of 18.1 MΩ·cm or more, particulates with a particle size of 50 nm or more and 1,000 particles / L or less, viable bacteria of 1 / L or less, total organic carbon (TOC) of 1 μg / L or less, total silicon of 0.1 μg / L or less, metals of 1 ng / L or less, ions of 10 ng / L or less, hydrogen peroxide of 30 μg / L or less, and a water temperature of 25±2°C, but is not particularly limited thereto.

[0011] The cleaning water for electronic devices (hereinafter simply referred to as "cleaning water") produced using the manufacturing apparatus of the present disclosure is transported to a point of use (UP), such as a cleaning apparatus provided in an electronic device manufacturing process for manufacturing semiconductor devices or the like.

[0012] The manufacturing apparatus of the present disclosure includes a pH adjuster, a degasser, and a gas dissolved film device in this order on the transfer line. Ultrapure water as raw water flowing through the transfer line passes through the pH adjuster to become pH-adjusted water, which passes through the degasser to be degassed, and the degassed pH-adjusted water passes through the gas dissolved film device to become cleaning water.

[0013] The manufacturing apparatus of the present disclosure preferably further comprises a switching device for switching the flow path of the cleaning water, located on the transfer line downstream of the gas dissolved film device. At the switching device, the transfer line branches into, for example, a transfer line connected to a use point of the cleaning water, and a drain line for draining the cleaning water, or a circulation line that joins the transfer line at a junction located upstream of the transfer line and uses the circulated cleaning water.

[0014] <Flow paths> In the manufacturing apparatus of the present disclosure, the flow paths (e.g., transfer lines or supply lines) through which ultrapure water, pH-adjusted water, cleaning water, pH adjuster, oxidation-reduction potential adjuster, functional gas, etc. flow are configured, for example, with piping. The flow paths may be provided with equipment such as tanks, pumps, joints, and valves.

[0015] Examples of materials for piping include polymeric materials such as polyvinyl chloride (PVC), polyphenylene sulfide (PPS), polyvinylidene fluoride (PVDF), tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA), and polypropylene (PP), as well as fiber-reinforced plastics (FRP) and stainless steel. Of these, PVDF is preferred.

[0016] The raw water, i.e., ultrapure water, pH-adjusted water, and cleaning water, is transferred via a transfer line. The transfer line can deliver water at a flow rate of 25 L / min or more, preferably 25 to 700 L / min, more preferably 30 to 500 L / min, even more preferably 40 to 300 L / min, and particularly preferably 50 to 200 L / min. In the manufacturing apparatus of the present disclosure, the flow rate is preferably set within the above range. A manufacturing apparatus equipped with such a transfer line can produce cleaning water at a large flow rate. The inner diameter of the piping constituting the transfer line is, for example, 55 to 300 mm, preferably 60 to 250 mm, and even more preferably 70 to 130 mm.

[0017] Electronic device manufacturing process equipment is shifting to a single-wafer processing system, where semiconductor wafers are processed one at a time, with each wafer sometimes processed in a separate chamber. Processing wafers one at a time significantly increases manufacturing lead time, so multiple chambers are sometimes installed in a single electronic device manufacturing process equipment to process wafers simultaneously. As a result, the flow rate of cleaning water required in electronic device manufacturing process equipment is also increasing. The manufacturing apparatus disclosed herein can produce cleaning water at a high flow rate of 25 L / min or more, meeting such requirements.

[0018] <pH Adjustment Device> The manufacturing apparatus of the present disclosure includes a pH adjustment device that adds a pH adjuster to ultrapure water to prepare pH-adjusted water. The pH adjustment device is an apparatus that measures and supplies the pH adjuster to a transfer line for ultrapure water to prepare pH-adjusted water having a desired pH. The pH adjustment device includes, for example, a tank containing the pH adjuster, a supply line that supplies the pH adjuster from the tank to the transfer line, and, if desired, a pump that adjusts the supply rate of the pH adjuster.

[0019] The pH-adjusted water obtained by adding a pH adjuster to ultrapure water has a higher electrical conductivity than ultrapure water, which can prevent charging of the pipes and the liquid flowing through them, and can prevent particles from being mixed into the cleaning water.

[0020] The tank containing the pH adjuster may be equipped with at least one device selected from the group consisting of a device for purging the inside of the tank with an inert gas (e.g., N2 gas) and a degassing membrane for removing dissolved gas (e.g., dissolved oxygen) in the pH adjuster in the tank.

[0021] The pump may be, for example, a diaphragm pump. Alternatively, a pressure extrusion pump may be used, in which the pH adjuster is placed in a tank together with an inert gas (e.g., N2 gas) and the pH adjuster is extruded by the pressure of the inert gas.

[0022] When adjusting the pH of ultrapure water to 7 or higher, examples of the pH adjuster include an aqueous solution of an alkaline compound and a gaseous alkaline compound. The alkaline compound is the active ingredient of the pH adjuster. Examples of the alkaline compound include ammonia, tetramethylammonium hydroxide, 2-hydroxyethyltrimethylammonium hydroxide, sodium hydroxide, and potassium hydroxide. Examples of the gaseous alkaline compound include ammonia gas. One type of alkaline compound may be used, or two or more types may be used.

[0023] Among these, an aqueous ammonia solution or ammonia gas is preferred, and an aqueous ammonia solution is more preferred. By dissolving a small amount of ammonia in ultrapure water, for example, the effect of suppressing dissolution and charging of semiconductor materials can be obtained.

[0024] The concentration of an alkaline compound (e.g., ammonia) in the pH-adjusted water obtained by the pH adjuster is preferably 2 to 100 mg / L, more preferably 5 to 80 mg / L, and even more preferably 10 to 50 mg / L. When an aqueous ammonia solution is used as the pH adjuster, the aqueous ammonia solution is preferably added so that the ammonia concentration in the pH-adjusted water is 2 to 100 mg / L.

[0025] When adjusting the pH of ultrapure water to less than 7, examples of pH adjusters include aqueous solutions of acidic compounds such as hydrochloric acid, nitric acid, sulfuric acid, formic acid, acetic acid, and citric acid, as well as gases such as CO2 gas. The acidic compounds and carbon dioxide gas (CO2 gas) are active ingredients of the pH adjuster. One or more types of acidic compounds may be used.

[0026] The pH adjuster is preferably a liquid, more preferably an aqueous solution of an alkaline compound, and even more preferably an aqueous ammonia solution. The mass concentration of the alkaline compound in the aqueous solution of the pH adjuster, for example, the mass concentration of the aqueous ammonia solution, is not particularly limited, but is preferably 20 to 40%, more preferably 25 to 30%.

[0027] When the pH adjuster is a gas, a direct gas-liquid contact device such as a gas permeable membrane module or an ejector may be used as the pH adjuster.

[0028] In one embodiment, the pH adjuster prepares pH-adjusted water having a pH of preferably 8 to 11, more preferably 9 to 11. A pH of 8 or higher tends to suppress the generation of static electricity in various devices located downstream of the pH adjuster. A pH of 11 or lower tends to suppress corrosion of the surface to be cleaned and deterioration of membranes and the like included in degassing devices or gas-dissolved membrane devices.

[0029] In recent years, with the improvement in the performance of electronic devices, there has been great progress in miniaturization of circuit fabrication technology. Because even the smallest amount of contaminants can be a problem, the amount of cleaning water used is increasing year by year. Because cleaning water is produced from ultrapure water, efforts to conserve water are required.

[0030] Cleaning water is produced, for example, by mixing a pH adjuster or dissolving a functional gas in ultrapure water. After the start of cleaning water production, it takes a certain amount of time for the quality of the cleaning water (e.g., the concentration of the active ingredient of the pH adjuster and the concentration of the functional gas) to reach the water quality required by the electronic device manufacturing process equipment (hereinafter also referred to as the "set water quality"). Therefore, when cleaning water is supplied to an electronic device manufacturing process equipment that requires a flow rate of, for example, several tens of L / min or more, the cleaning water may be disposed of as wastewater without being supplied to the process equipment until the quality of the cleaning water reaches the set water quality.

[0031] Here, the supply rate (flow rate) of the pH adjuster in the pH adjuster can be calculated, for example, from the set concentration of the active ingredient of the pH adjuster in the cleaning water, the concentration of the active ingredient in the pH adjuster, and the transfer rate (flow rate) of the ultrapure water. The set concentration of the active ingredient of the pH adjuster in the cleaning water means the concentration of the active ingredient in the cleaning water required at the point of use of the cleaning water, such as in electronic device manufacturing process equipment.

[0032] In one embodiment, the pH adjuster supplies the pH adjuster for a predetermined time at a flow rate (hereinafter also referred to as the "initial flow rate") higher than the flow rate of the pH adjuster calculated from the set concentration, etc., during the initial stage of cleaning water production, and then supplies the pH adjuster at the flow rate (hereinafter also referred to as the "set flow rate") of the pH adjuster calculated from the set concentration, etc., after the predetermined time has elapsed. The timing for changing the flow rate of the pH adjuster from the initial flow rate to the set flow rate may be when the concentration of the active ingredient of the pH adjuster in the cleaning water reaches the set concentration, or may be before that point. The timing for changing the flow rate of the pH adjuster may be, for example, when the concentration of the active ingredient of the pH adjuster in the cleaning water reaches preferably 50% or more, more preferably 60% or more, even more preferably 70% or more, even more preferably 80% or more, and particularly preferably 90% or more of the set concentration. The above-mentioned predetermined time is not particularly limited, but is preferably within 10 minutes, more preferably within 7 minutes, and even more preferably within 5 minutes.

[0033] This allows for a shorter rise time (time required for the concentration of the active ingredient of the pH adjuster in the cleaning water to reach the set concentration) even when ultrapure water is flowed at a high flow rate to produce cleaning water at a high flow rate. Therefore, the cleaning water producing apparatus of the present disclosure can accommodate the cleaning water flow rates (especially high flow rates) required by electronic device manufacturing process equipment, and can reduce the amount of cleaning water produced in which the concentration of the active ingredient of the pH adjuster has not yet reached the set concentration, thereby reducing the amount of wastewater. These points also apply to the oxidation-reduction potential adjuster and functional gas described below.

[0034] The ratio of the initial flow rate of the pH adjuster to the set flow rate in producing wash water (initial flow rate / set flow rate) is preferably more than 1.0 and not more than 10.0, more preferably 1.1 to 8.0, even more preferably 1.2 to 6.0, still more preferably 1.3 to 4.0, and particularly preferably 1.4 to 3.0.

[0035] <Oxidation-Reduction Potential Adjusting Device> The manufacturing apparatus of the present disclosure may further include an oxidation-reduction potential adjusting device (hereinafter also referred to as "ORP adjusting device") that adjusts the oxidation-reduction potential (hereinafter also referred to as "ORP adjusting device") of the ultrapure water or pH-adjusted water. The ORP adjusting device is preferably located downstream of the pH adjusting device and upstream of the degassing device on the transfer line. Therefore, the ORP of the pH-adjusted water may be adjusted by the ORP adjusting device.

[0036] The ORP adjuster is a device that adjusts the ORP of ultrapure water or pH-adjusted water by measuring and supplying an oxidation-reduction potential adjuster (hereinafter also referred to as "ORP adjuster") to the transfer line. The ORP adjuster includes, for example, a tank containing the ORP adjuster, a supply line that supplies the ORP adjuster from the tank to the transfer line, and, if desired, a pump that adjusts the supply rate of the ORP adjuster.

[0037] The tank containing the ORP adjuster may be equipped with at least one device selected from the group consisting of a device for purging the inside of the tank with an inert gas (e.g., N2 gas) and a degassing membrane for removing dissolved gas (e.g., dissolved oxygen) from the ORP adjuster in the tank.

[0038] The pump may be, for example, a diaphragm pump. Alternatively, a pressure extrusion pump may be used, in which the ORP adjuster is placed in a tank together with an inert gas (e.g., N2 gas) and the pressure of the inert gas is used to extrude the ORP adjuster.

[0039] Examples of ORP adjusters that adjust the oxidation-reduction potential of the target water higher (positive side) include aqueous solutions such as hydrogen peroxide solution, and gases such as ozone gas and oxygen gas. Examples of ORP adjusters that adjust the oxidation-reduction potential of the target water lower include aqueous solutions of compounds such as oxalic acid, hydrogen sulfide, and potassium iodide, and gases such as hydrogen gas. One or more of the above compounds may be used. One or more of the above gases may be used.

[0040] When the ORP adjuster is a gas, a direct gas-liquid contact device such as a gas permeable membrane module or an ejector may be used as the ORP adjuster.

[0041] The supply rate (flow rate) of the ORP adjuster in the ORP adjuster can be calculated, for example, from the set concentration of the active ingredient of the ORP adjuster in the cleaning water, the concentration of the active ingredient in the ORP adjuster, and the transfer rate (flow rate) of the ultrapure water or pH-adjusted water. The set concentration of the active ingredient of the ORP adjuster in the cleaning water means the concentration of the active ingredient in the cleaning water required at the point of use of the cleaning water, such as in electronic device manufacturing process equipment.

[0042] In one embodiment, the ORP regulator supplies the ORP adjuster for a predetermined time at a flow rate (hereinafter also referred to as the "initial flow rate") higher than the flow rate of the ORP adjuster calculated from the set concentration, etc., during the initial stage of cleaning water production, and then supplies the ORP adjuster at the flow rate (hereinafter also referred to as the "set flow rate") of the ORP adjuster calculated from the set concentration, etc., after the predetermined time has elapsed. The timing for changing the flow rate of the ORP adjuster from the initial flow rate to the set flow rate may be when the concentration of the active ingredient of the ORP adjuster in the cleaning water reaches the set concentration, or may be before that point. The timing for changing the flow rate of the ORP adjuster may be, for example, when the concentration of the active ingredient of the ORP adjuster in the cleaning water reaches preferably 50% or more, more preferably 60% or more, even more preferably 70% or more, even more preferably 80% or more, and particularly preferably 90% or more of the set concentration. The above-mentioned predetermined time is not particularly limited, but is preferably within 10 minutes, more preferably within 7 minutes, and even more preferably within 5 minutes.

[0043] The ratio of the initial flow rate of the ORP adjuster to the set flow rate in the production of cleaning water (initial flow rate / set flow rate) is preferably more than 1.0 and not more than 10.0, more preferably 1.1 to 8.0, even more preferably 1.2 to 6.0, still more preferably 1.3 to 4.0, and particularly preferably 1.4 to 3.0.

[0044] <Hydrogen Peroxide Removal Device> The manufacturing apparatus of the present disclosure may further include a hydrogen peroxide removal device. For example, it is preferable that at least a portion of the hydrogen peroxide has been removed from the ultrapure water or pH-adjusted water to which the ORP adjuster is supplied. Therefore, the hydrogen peroxide removal device is preferably located upstream of the ORP adjuster on the transfer line, and more preferably upstream of the pH adjuster and the ORP adjuster. By providing the hydrogen peroxide removal device, the ORP adjuster can accurately control the ORP of the cleaning water.

[0045] The hydrogen peroxide removal device includes, for example, a platinum group metal-supported resin column. The platinum group metal-supported resin column includes a resin (hereinafter also referred to as "support resin") and a platinum group metal supported on the resin. Examples of the support resin include ion exchange resins. Among ion exchange resins, anion exchange resins are preferred. Platinum group metals are negatively charged, so they are stably supported on anion exchange resins and are less likely to fall off. The exchange groups of the anion exchange resin are preferably in the OH form. OH-form anion exchange resins have an alkaline resin surface, which promotes the decomposition of hydrogen peroxide. Examples of platinum group metals include ruthenium, rhodium, palladium, osmium, iridium, and platinum. Platinum group metals may be used alone or in combination, or as an alloy of two or more metals. Purified products of naturally occurring mixtures may also be used without separating them into individual elements. Among these, platinum, palladium, platinum / palladium alloys, or mixtures of two or more of these, are preferably used because of their strong catalytic activity. Nano-sized particles of these metals can also be preferably used.

[0046] <Pump> The manufacturing apparatus of the present disclosure may further include a pump. By using a pump, it becomes easy to increase the flow rate and water pressure and produce cleaning water at a large flow rate. The pump pressurizes, for example, ultrapure water, pH-adjusted water, or cleaning water to a predetermined water pressure. The pump is preferably a pump that can control the amount of pressure applied. The manufacturing apparatus of the present disclosure preferably includes a pump on the transfer line between the pH adjuster and the degasser. If the manufacturing apparatus includes an ORP adjuster, it is preferable to include a pump between the ORP adjuster and the degasser.

[0047] Examples of pumps include rotary positive displacement pumps that continuously suck in and discharge by changing the volume, reciprocating positive displacement pumps that repeatedly suck in and discharge by changing the volume, and centrifugal pumps that discharge liquid by using centrifugal force or thrust generated by the rotation of an impeller or propeller inside the pump.

[0048] Examples of rotary positive displacement pumps include tube pumps, rotary pumps, gear pumps, and snake pumps. Examples of reciprocating positive displacement pumps include diaphragm pumps and plunger pumps. Examples of centrifugal pumps include volute pumps. Among these, rotary positive displacement pumps and centrifugal pumps are preferred, centrifugal pumps are more preferred, and volute pumps, which are centrifugal pumps, are even more preferred, in that they cause less fluid pulsation and maintain a substantially constant and stable discharge pressure.

[0049] The pressure of the ultrapure water, pH-adjusted water, or cleaning water pressurized by the pump is preferably 0.1 MPa or higher, more preferably 0.2 to 1.0 MPa, even more preferably 0.3 to 0.8 MPa, and particularly preferably 0.4 to 0.6 MPa. If the pressure is 0.1 MPa or higher, a sufficient flow rate of the ultrapure water, pH-adjusted water, or cleaning water is easily obtained. If the pressure is 1.0 MPa or lower, static electricity is less likely to be generated within the pump.

[0050] <Degassing Device> The manufacturing apparatus of the present disclosure includes a degassing device that degasses the pH-adjusted water. The degassing device removes at least a portion of the dissolved gases in the pH-adjusted water to reduce the amount of dissolved gas. This removal can increase the solubility of functional gases in the pH-adjusted water, for example, in a gas-dissolved film type apparatus. Examples of dissolved gases include dissolved oxygen and dissolved nitrogen.

[0051] The degassing device is preferably located downstream of the pH adjuster or downstream of the pH adjuster and ORP adjuster on the transfer line. Although this manufacturing system includes a degassing device, it can suppress static electricity and prevent fine particles from accumulating on the gas-permeable membrane surface. This prevents fine particles from getting into the cleaning water.

[0052] The degassing device is preferably a membrane degassing device, and more preferably a membrane degassing device equipped with a gas-permeable membrane. In one embodiment, the membrane degassing device flows pH-adjusted water through one side (liquid phase chamber) of the gas-permeable membrane and reduces the pressure on the other side (gas phase chamber) with a vacuum pump, thereby causing at least a portion of the dissolved gas to permeate through the gas-permeable membrane and migrate to the gas phase chamber for removal. The degassing device, for example, reduces the dissolved oxygen concentration in the pH-adjusted water supplied to the gas-dissolved membrane device to 0.1 mg / L or less.

[0053] The gas-permeable membrane may be any membrane that allows gases such as oxygen, nitrogen, and steam to pass through but does not allow water to pass through. Examples of materials constituting the gas-permeable membrane include polymeric materials such as silicone rubber, polytetrafluoroethylene, polyvinylidene fluoride, polyolefins (e.g., polypropylene and poly(4-methylpentene-1)), and polyurethane. One type of polymeric material may be used, or two or more types may be used. Among these, at least one selected from the group consisting of poly(4-methylpentene-1), polypropylene, and polyvinylidene fluoride is preferred.

[0054] <Gas-Dissolved Film Type Apparatus> The manufacturing apparatus of the present disclosure includes a gas-dissolved film type apparatus. The gas-dissolved film type apparatus is preferably located downstream of the degassing device on the transfer line. The gas-dissolved film type apparatus dissolves a functional gas in degassed pH-adjusted water via a gas-permeable membrane.

[0055] A functional gas is a gas that imparts a specific function to cleaning water. Examples of functional gases include hydrogen gas, ozone gas, carbon dioxide gas, and rare gases. Among these, hydrogen gas is preferred. The concentration of hydrogen gas in cleaning water obtained using a gas-dissolved film type device is preferably 1.0 to 1.6 mg / L. By using cleaning water in which hydrogen gas is dissolved, a good effect of removing particulates from electronic devices can be obtained. One type of functional gas may be used, or two or more types may be used.

[0056] The functional gas is supplied from a functional gas supply device. The functional gas supply device includes, for example, a functional gas storage device that generates or stores the functional gas and a mass flow controller that adjusts the supply rate of the functional gas. The functional gas supply device is connected to the gas dissolved film type device by a functional gas supply line and supplies the functional gas to the gas dissolved film type device.

[0057] The supply rate (flow rate) of the functional gas in the functional gas supply device can be calculated, for example, from the set concentration of the functional gas in the cleaning water and the transfer rate (flow rate) of the degassed pH-adjusted water. The set concentration of the functional gas in the cleaning water means the concentration of the functional gas in the cleaning water required at the point of use of the cleaning water, such as in an electronic device manufacturing process equipment.

[0058] In one embodiment, the functional gas supply device supplies the functional gas to the gas dissolved film type device at a flow rate (hereinafter also referred to as the "initial flow rate" of the functional gas) higher than the flow rate of the functional gas calculated from the set concentration and the like for a predetermined time during the initial stage of cleaning water production, and after the predetermined time has elapsed, supplies the functional gas to the gas dissolved film type device at the flow rate (hereinafter also referred to as the "set flow rate" of the functional gas) calculated from the set concentration and the like. The timing for changing the flow rate of the functional gas from the initial flow rate to the set flow rate may be when the concentration of the functional gas in the cleaning water reaches the set concentration or may be before this is reached. The timing for changing the flow rate of the functional gas may be, for example, when the concentration of the functional gas in the cleaning water reaches preferably 50% or more, more preferably 60% or more, even more preferably 70% or more, even more preferably 80% or more, and particularly preferably 90% or more of the set concentration. The above-mentioned predetermined time is not particularly limited, but is preferably within 10 minutes, more preferably within 7 minutes, and even more preferably within 5 minutes.

[0059] The ratio of the initial flow rate of the functional gas to the set flow rate in producing cleaning water (initial flow rate / set flow rate) is preferably more than 1.0 and not more than 10.0, more preferably 1.1 to 8.0, even more preferably 1.2 to 6.0, still more preferably 1.2 to 4.0, and particularly preferably 1.2 to 3.0.

[0060] In one embodiment, the gas-dissolved membrane device flows degassed pH-adjusted water on one side (liquid phase chamber) of a gas-permeable membrane and supplies a functional gas to the other side (gas phase chamber), allowing the functional gas to permeate the gas-permeable membrane, migrate to the liquid phase chamber, and dissolve in the pH-adjusted water.

[0061] Examples of materials constituting the gas-permeable membrane are as described above, and will not be further illustrated in this section. Among the above materials, at least one selected from the group consisting of poly(4-methylpentene-1), polypropylene, and polyvinylidene fluoride is preferred.

[0062] The gas-permeable membrane may be, for example, a hollow fiber membrane. In this case, the gas-dissolved membrane device includes a hollow fiber membrane unit containing a hollow fiber membrane. Connected to the interior of the hollow fiber membrane unit are a liquid supply pipe for supplying degassed pH-adjusted water to the hollow fiber membrane unit, a gas supply pipe for supplying a functional gas to the hollow fiber membrane unit, and a drain pipe for discharging the cleaning water in which the functional gas has been dissolved.

[0063] <Water Quality or Flow Rate Monitoring Device> The manufacturing apparatus of the present disclosure preferably further includes a water quality monitoring device for the cleaning water. The water quality monitoring device is a device for measuring the quality of the cleaning water. The water quality monitoring device is preferably located downstream of the gas dissolved film device on the transfer line. The water quality monitoring device measures at least one selected from the group consisting of the concentration of the active ingredient of the pH adjuster and the concentration of the functional gas in the cleaning water, and preferably measures at least one selected from the group consisting of the concentration of the active ingredient of the pH adjuster, the concentration of the active ingredient of the ORP adjuster, pH, oxidation-reduction potential (ORP), and the concentration of the functional gas in the cleaning water, and monitors whether the concentration of the active ingredient, pH, ORP, or the concentration of the functional gas is at a desired value.

[0064] The pH of the cleaning water can be measured using a known pH meter. The ORP of the cleaning water can be measured using a known ORP meter. The concentration of the active ingredient in the cleaning water can be measured using a known conductivity meter. The concentration of the functional gas in the cleaning water can be measured using a known gas concentration meter (e.g., a DH meter for hydrogen gas).

[0065] The manufacturing apparatus of the present disclosure preferably further includes a flow rate monitor for the cleaning water. The flow rate monitor is a device for measuring the flow rate of the cleaning water. The flow rate monitor is preferably located downstream of the gas dissolved film device on the transfer line. Examples of the flow rate monitor include a known flow meter.

[0066] <Control Device> The manufacturing apparatus of the present disclosure preferably further includes a control device in addition to either or both of a water quality monitor and a flow rate monitor for the cleaning water. The control device is, for example, a computer. The water quality monitor or the flow rate monitor may be connected to the control device, for example, electrically or wirelessly. The control device may be connected to at least one device selected from the group consisting of a pH adjuster, an ORP adjuster, and a gas dissolved film device, for example, electrically or wirelessly.

[0067] The control device is, for example, a device that controls at least one selected from the group consisting of the supply rate of a pH adjuster in a pH adjuster and the supply rate of a functional gas in a gas dissolved film type device based on the water quality measured by a cleaning water quality monitoring device, and is preferably a device that controls at least one selected from the group consisting of the supply rate of the pH adjuster, the supply rate of an ORP adjuster in an ORP adjuster, and the supply rate of the functional gas.The control device can control the cleaning water to have at least one selected from the group consisting of a set concentration of an active ingredient, a set pH value, a set ORP value, and a set concentration of a functional gas.The control of at least one selected from the group consisting of the concentration of an active ingredient, pH, ORP, and concentration of a functional gas by such a control device can be controlled by, for example, feedback control such as PI control or PID control, as well as by well-known methods.

[0068] The control device can transmit a signal to the pH adjustment device based on the water quality (e.g., the concentration of the active ingredient of the pH adjuster or the pH) measured by the cleaning water quality monitoring device, and control the supply rate of the pH adjuster in the pH adjustment device using a pump, etc. The control device can transmit a signal to the ORP adjustment device based on the water quality (e.g., the concentration of the active ingredient of the ORP adjuster or the ORP) measured by the cleaning water quality monitoring device, and control the supply rate of the ORP adjuster in the ORP adjustment device using a pump, etc. The control device can transmit a signal to the functional gas mass flow controller based on the water quality (e.g., the concentration of the functional gas) measured by the cleaning water quality monitoring device, and control the supply rate of the functional gas supplied from the functional gas supply device using a mass flow controller, etc.

[0069] The control device, for example, controls the supply of the adjuster, etc. at a flow rate greater than the flow rate of the adjuster, etc. calculated from the set concentration, etc. at the point of use of the cleaning water for a predetermined time based on the water quality (e.g., the concentration of the active ingredient of the pH adjuster, the active ingredient of the ORP adjuster, or the functional gas) measured by a cleaning water quality monitoring device, and after the predetermined time has elapsed, controls the supply of the adjuster, etc. in the adjuster, etc. at the flow rate calculated from the set concentration, etc. The adjuster, etc. is, for example, a pH adjuster, an ORP adjuster, or a functional gas. The adjuster, etc. is, for example, a pH adjuster, an ORP adjuster, or a gas-dissolved film type device.

[0070] In one embodiment, the control device controls at least one selected from the group consisting of the transfer rate of the ultrapure water, which is the raw water, the supply rate of the pH adjuster in the pH adjuster, the supply rate of the ORP adjuster in the ORP adjuster, and the supply rate of the functional gas supplied from the functional gas supply device, based on the flow rate measured by the cleaning water flow rate monitoring device.

[0071] The control device can transmit a signal to the pH adjustment device based on, for example, the flow rate measured by the cleaning water flow rate monitoring device, and control the supply rate of the pH adjuster in the pH adjustment device using a pump, etc. The control device can transmit a signal to the ORP adjustment device based on, for example, the flow rate measured by the cleaning water flow rate monitoring device, and control the supply rate of the ORP adjuster in the ORP adjustment device using a pump, etc. The control device can transmit a signal to the functional gas mass flow controller based on, for example, the flow rate measured by the cleaning water flow rate monitoring device, and control the supply rate of the functional gas supplied from the functional gas supply device using a mass flow controller, etc.

[0072] The control device is preferably a device that further controls the flow path of the cleaning water. Note that the function of controlling at least one selected from the group consisting of the supply rate of the pH adjuster in the pH adjuster and the supply rate of the functional gas in the gas dissolved film type device based on the water quality measured by the water quality monitoring device, and the function of controlling the flow path of the cleaning water may be possessed by the same control device or different control devices.

[0073] In one embodiment, after the manufacturing apparatus starts operating, the control device controls the flow path switching device in accordance with the quality of the wash water measured by the water quality monitoring device. Specifically, the control device (1) controls the switching device so that the wash water is not transferred to the use point but is transferred to a drain line or a circulation line, for example, if the quality of the wash water measured by the water quality monitoring device has not reached the set water quality at the use point; (2) if the quality of the wash water measured by the water quality monitoring device has reached the set water quality at the use point, the control device sends a signal to the switching device to switch the wash water flow path, thereby controlling the switching device to transfer the wash water to the use point.

[0074] <Device for switching the flow path of cleaning water> The manufacturing apparatus of the present disclosure preferably further includes a device for switching the flow path of cleaning water (flow path switching device) between the monitoring device and the point of use of cleaning water. The switching device is preferably located downstream of the water quality monitoring device on the transfer line. An example of such a device is a three-way switching valve.

[0075] The transfer line branches at the switching device into, for example, a transfer line connected to the point of use of cleaning water, and a drainage line for draining cleaning water, or a circulation line for circulating and using cleaning water, which joins at a junction located upstream on the transfer line. Circulating cleaning water can reduce the amount of produced cleaning water discharged. The junction is located, for example, upstream of a pH adjustment device or a hydrogen peroxide removal device on the transfer line. The switching device switches the flow path of cleaning water based on a signal sent from the control device or manually, thereby transferring cleaning water to the point of use.

[0076] 1 to 3 are block diagrams schematically illustrating a manufacturing apparatus according to the present disclosure. The manufacturing apparatus 1 in FIG. 1 includes a transfer line L1 for ultrapure water W, pH-adjusted water W1, or cleaning water W2, a pH adjuster 12, a degassing device 14, and a gas-dissolved film type device 16. The transfer line L1 connects the pH adjuster 12 and the degassing device 14, and also connects the degassing device 14 and the gas-dissolved film type device 16. The manufacturing apparatus 1 in FIG. 1 may further include a pump (not shown) on the transfer line L1 between the pH adjuster 12 and the degassing device 14.

[0077] The manufacturing apparatus 1 in Fig. 2 includes a transfer line L1, a pH adjusting device 12, a degassing device 14, a gas-dissolved film type device 16, a water quality monitoring device 18, a cleaning water flow path switching device 20, a control device 22, a transfer line L2, and a drain line L3. The manufacturing apparatus 1 in Fig. 2 may further include a pump (not shown) on the transfer line L1 between the pH adjusting device 12 and the degassing device 14.

[0078] The transfer line L1 connects the pH adjusting device 12 and the degassing device 14, connects the degassing device 14 and the gas dissolved film type device 16, connects the gas dissolved film type device 16 and the water quality monitoring device 18, and connects the water quality monitoring device 18 and the switching device 20. The transfer line L2 connects the switching device 20 and the point of use (UP).

[0079] The control device 22 controls the supply rate of the pH adjuster in the pH adjuster 12 and the supply rate of the functional gas supplied to the gas dissolved film type device 16 based on the water quality obtained by the water quality monitoring device 18.

[0080] The production apparatus 1 in Figure 3 includes a transfer line L1, a hydrogen peroxide remover 11, a pH adjuster 12, an ORP adjuster 13, a degasser 14, a gas dissolved film type device 16, a water quality monitor 18, a cleaning water flow path switching device 20, a control device 22, a transfer line L2, and a drain line L3. The production apparatus 1 in Figure 3 may further include a pump (not shown) on the transfer line L1 between the ORP adjuster 13 and the degasser 14.

[0081] 1 to 3, pH adjuster 12 includes tank 12A containing a pH adjuster, supply line 12L connecting tank 12A to transfer line L1, and pump 12B located on supply line 12L. In Fig. 3, ORP adjuster 13 includes tank 13A containing an ORP adjuster, supply line 13L connecting tank 13A to transfer line L1, and pump 13B located on supply line 13L. In Fig. 1 to 3, gas dissolved film type device 16 is connected to functional gas supply device 16A via supply line 16L.

[0082] 2 and 3, a circulation line (not shown) for circulating the cleaning water for reuse may be provided. The circulation line merges with the transfer line L1 at a junction located upstream of the pH adjuster 12, for example.

[0083] The cleaning water manufacturing apparatus of the present disclosure has been described above based on the above embodiment with reference to the attached drawings, but the cleaning water manufacturing apparatus of the present disclosure is not limited to the above embodiment and various modifications can be made.

[0084] [Method for Producing Cleaning Water for Electronic Devices] The method for producing cleaning water for electronic devices of the present disclosure (hereinafter also referred to simply as the "production method of the present disclosure") includes a pH adjustment step of adding a pH adjuster to ultrapure water to prepare pH-adjusted water, a degassing step of degassing the pH-adjusted water, and a gas dissolution step of dissolving a functional gas in the degassed pH-adjusted water via a gas-permeable membrane to prepare cleaning water. The production method of the present disclosure may further include at least one step selected from the group consisting of an ORP adjustment step of adjusting the oxidation-reduction potential (ORP) of the ultrapure water or the pH-adjusted water, and a hydrogen peroxide removal step of removing hydrogen peroxide. The production method of the present disclosure can be carried out, for example, using the production apparatus described above.

[0085] In the above production method, the ultrapure water, pH-adjusted water, and cleaning water are each transferred at a flow rate of 25 L / min or more, preferably 25 to 700 L / min, more preferably 30 to 500 L / min, even more preferably 40 to 300 L / min, and particularly preferably 50 to 200 L / min.

[0086] The above production method preferably further comprises a step of adjusting the pressure of the ultrapure water, pH-adjusted water, or cleaning water to 0.1 MPa or more. The pressure is preferably 0.1 MPa or more, more preferably 0.2 to 1.0 MPa, even more preferably 0.3 to 0.8 MPa, and particularly preferably 0.4 to 0.6 MPa.

[0087] The above-mentioned manufacturing method preferably includes a water quality monitoring step of measuring the quality of the cleaning water. For example, based on the concentration of the active ingredient of the pH adjuster or ORP adjuster in the cleaning water measured in the water quality monitoring step, in the initial stage of cleaning water production, the pH adjuster or ORP adjuster is supplied for a predetermined time in the pH adjustment step or ORP adjustment step at a flow rate higher than the flow rate of the pH adjuster or ORP adjuster calculated from the set concentration etc. at the point of use of the cleaning water, and after the predetermined time has elapsed, the pH adjuster or ORP adjuster is supplied in the pH adjustment step or ORP adjustment step at the flow rate of the pH adjuster or ORP adjuster calculated from the set concentration etc.

[0088] For example, based on the concentration of the functional gas in the cleaning water measured in the water quality monitoring process, in the initial stage of cleaning water production, the functional gas is supplied in the gas dissolution process for a predetermined time at a flow rate greater than the flow rate of the functional gas calculated from the above-mentioned set concentration, etc. at the point of use of the cleaning water, and after the above-mentioned predetermined time has elapsed, the functional gas is supplied in the gas dissolution process at the flow rate of the functional gas calculated from the above-mentioned set concentration, etc.

[0089] If the water quality of the cleaning water measured in the water quality monitoring process does not reach the set water quality at the use point, it is preferable not to transfer the cleaning water to the use point, and if the water quality of the cleaning water measured in the water quality monitoring process reaches the set water quality at the use point, it is preferable to transfer the cleaning water to the use point.

[0090] Regarding the details of the above production method and the conditions of each step, the conditions described in the above section [Apparatus for producing cleaning water for electronic devices] can be applied, and description thereof will be omitted here.

[0091] The cleaning water produced by the manufacturing apparatus or manufacturing method of the present disclosure is supplied to a cleaning apparatus provided in a process apparatus for manufacturing electronic devices such as semiconductor devices. Examples of the cleaning apparatus include a cleaning apparatus that immerses an object to be cleaned in cleaning water in a cleaning tank to clean it, and a cleaning apparatus that sprays cleaning water onto the object in a shower-like manner and washes it by letting it flow over the object.

[0092] [Example Aspects] The present disclosure relates to, for example, the following [1] to

[14] . [1] An apparatus for producing cleaning water for electronic devices, comprising: a pH adjuster that adds a pH adjuster to ultrapure water to prepare pH-adjusted water; a degassing apparatus that degasses the pH-adjusted water; a gas-dissolved membrane apparatus that prepares cleaning water by dissolving a functional gas in the degassed pH-adjusted water via a gas-permeable membrane; and transfer lines that can transport the ultrapure water, the pH-adjusted water, and the cleaning water at a flow rate of 25 L / min or more. [2] The apparatus for producing cleaning water for electronic devices according to [1], further comprising a pump that adjusts the pressure of the pH-adjusted water to 0.1 MPa or more. [3] The apparatus for producing cleaning water for electronic devices according to [1] or [2], further comprising a water quality monitoring device for the cleaning water and a control device, the water quality monitoring device being located downstream of the gas dissolved film type apparatus, the water quality monitoring device being a device for measuring the water quality of the cleaning water, and the control device being a device for controlling at least one selected from the group consisting of a supply rate of the pH adjuster in the pH adjustment device and a supply rate of the functional gas in the gas dissolved film type apparatus based on the water quality measured by the water quality monitoring device. [4] The apparatus for producing cleaning water for electronic devices described in [3], wherein the control device controls the pH adjustment device to supply the pH adjuster at a flow rate greater than the flow rate of the pH adjuster calculated from the set concentration of the cleaning water at the point of use for a predetermined time in the initial stage of cleaning water production based on the concentration of the active ingredient of the pH adjuster in the cleaning water measured by the water quality monitoring device, and controls the pH adjustment device to supply the pH adjuster at the flow rate of the pH adjuster calculated from the set concentration after the predetermined time has elapsed. [5] The apparatus for producing cleaning water for electronic devices described in [3] or [4], wherein the control device controls, based on the concentration of the functional gas in the cleaning water measured by the water quality monitoring device, to supply the functional gas to the gas dissolved film type device for a predetermined time at a flow rate greater than the flow rate of the functional gas calculated from the set concentration at the point of use of the cleaning water in the initial stage of cleaning water production, and controls to supply the functional gas to the gas dissolved film type device at the flow rate of the functional gas calculated from the set concentration after the predetermined time has elapsed.[6] The apparatus for producing cleaning water for electronic devices according to any one of [3] to [5], wherein the manufacturing apparatus further comprises a switching device for the flow path of the cleaning water, the switching device being located downstream of the water quality monitoring device, the transfer line for the cleaning water branching at the switching device into a transfer line connected to a use point of the cleaning water, and a drain line for draining the cleaning water, or a circulation line which joins at a junction located upstream on the transfer line, and the control device controls the switching device to transfer the cleaning water to the drain line or the circulation line when the water quality of the cleaning water measured by the water quality monitoring device has not reached the set water quality at the use point; and when the water quality of the cleaning water measured by the water quality monitoring device has reached the set water quality at the use point, the control device sends a signal to the switching device to switch the flow path of the cleaning water, thereby controlling the switching device to transfer the cleaning water to the use point. [7] The apparatus for producing cleaning water for electronic devices according to any one of [1] to [6], wherein the pH adjuster prepares pH-adjusted water having a pH of 8 to 11. [8] The apparatus for producing cleaning water for electronic devices according to any one of [1] to [7], wherein the pH adjuster adds an aqueous solution of at least one alkaline compound selected from the group consisting of ammonia, tetramethylammonium hydroxide, 2-hydroxyethyltrimethylammonium hydroxide, sodium hydroxide, and potassium hydroxide to the ultrapure water as the pH adjuster. [9] The apparatus for producing cleaning water for electronic devices according to any one of [1] to [8], wherein the functional gas is at least one selected from the group consisting of hydrogen gas, ozone gas, carbon dioxide gas, and a rare gas.

[10] A method for producing cleaning water for electronic devices, comprising: a pH adjustment step of adding a pH adjuster to ultrapure water to prepare pH-adjusted water; a degassing step of degassing the pH-adjusted water; and a gas dissolution step of dissolving a functional gas in the degassed pH-adjusted water via a gas-permeable membrane to prepare cleaning water, wherein the ultrapure water, the pH-adjusted water, and the cleaning water are each transported at a flow rate of 25 L / min or more.

[11] The method for producing cleaning water for electronic devices according to

[10] above, further comprising a step of adjusting the pressure of the pH-adjusted water to 0.1 MPa or more.

[12] The method for producing cleaning water for electronic devices according to

[10] above, further comprising a water quality monitoring step of measuring the quality of the cleaning water, wherein, based on the concentration of the active ingredient of the pH adjuster in the cleaning water measured in the water quality monitoring step, in an initial stage of cleaning water production, the pH adjuster is supplied for a predetermined time in the pH adjustment step at a flow rate higher than a flow rate of the pH adjuster calculated from a set concentration at the point of use of the cleaning water, and after the predetermined time has elapsed, the pH adjuster is supplied in the pH adjustment step at the flow rate of the pH adjuster calculated from the set concentration.

[13] The method for producing cleaning water for electronic devices according to any one of

[10] to

[12] , further comprising a water quality monitoring step of measuring the quality of the cleaning water, wherein, in an initial stage of cleaning water production, the functional gas is supplied in the gas dissolving step for a predetermined time at a flow rate higher than a flow rate of the functional gas calculated from a set concentration of the functional gas at the point of use of the cleaning water based on the concentration of the functional gas in the cleaning water measured in the water quality monitoring step, and after the predetermined time has elapsed, the functional gas is supplied in the gas dissolving step at the flow rate of the functional gas calculated from the set concentration.

[14] The method for producing cleaning water for electronic devices according to

[12] or

[13] , further comprising:

[0093] The cleaning water producing device of the present disclosure will be described based on examples. The cleaning water producing device of the present disclosure is not limited to the following examples.

[0094] Example 1 Using an apparatus for producing cleaning water for electronic devices similar to that shown in Figure 2 (which further includes a pump, not shown, between the pH adjusting device 12 and the degassing device 14), cleaning water was obtained by dissolving ammonia and hydrogen gas in ultrapure water, as described below. In the above-mentioned production apparatus, polyvinylidene fluoride (PVDF) pipes with an outer diameter of approximately 105 mm and an inner diameter of approximately 100 mm were used as the pipes constituting the transfer line and supply line.

[0095] The cleaning water was produced using the above manufacturing equipment, and the supply method was evaluated on the assumption that the cleaning water was supplied to a semiconductor device manufacturing process equipment that required cleaning water at a flow rate of 5 L / min per chamber.

[0096] From the start of production of the resulting cleaning water, the rise time of the concentration of the active ingredient of the pH adjuster in the cleaning water and the rise time of the concentration of the functional gas in the cleaning water were evaluated. The concentration rise time refers to the time it takes for the concentration of the target component in the cleaning water to reach the set concentration. In this evaluation, an aqueous ammonia solution (containing ammonia as the active ingredient) was used as the pH adjuster, and hydrogen gas was used as the functional gas. Ammonia in the cleaning water was evaluated by converting the measured value into ammonia concentration using a conductivity meter, and hydrogen gas was evaluated using a DH meter. ◎: The rise time of the concentration of the target component was within 5 minutes. ○: The rise time of the concentration of the target component was more than 5 minutes but less than 10 minutes. ×: The rise time of the concentration of the target component was more than 10 minutes.

[0097] The concentration of ammonia in the final wash water was set to 30 mg / L, and the concentration of hydrogen gas (H2) was set to 1.4 mg / L.

[0098] Ultrapure water was supplied to the manufacturing equipment at a flow rate of 25 L / min. Ammonia was dissolved in ultrapure water to prepare an aqueous ammonia solution (ammonia concentration: 28%). The above aqueous ammonia solution was added to the ultrapure water flowing through the transfer line to obtain pH-adjusted water. The pH-adjusted water was pressurized to 0.3 MPa using a pump. The pH-adjusted water was supplied to a degassing device (water degassing / aeration module, model number: EF-020-A30, material: poly-4-methylpentene-1, manufactured by DIC) at a flow rate of 25 L / min. Hydrogen gas was supplied to the gas-dissolved film device (the above water degassing / aeration module), and the degassed pH-adjusted water was supplied at a flow rate of 25 L / min to dissolve the hydrogen gas in the pH-adjusted water, producing cleaning water.

[0099] In the initial stage of the manufacturing process, the aqueous ammonia solution (ammonia concentration: 28%) was added to the ultrapure water flowing through the transfer line at a flow rate of 5 mL / min for 1 minute. After 1 minute had elapsed, the flow rate of the aqueous ammonia solution was changed to the flow rate (3 mL / min, stable flow rate) required for the set ammonia concentration (30 mg / L) in the wash water.

[0100] In the initial stage of the manufacturing process, hydrogen gas was supplied to the gas dissolved film device at a flow rate of 500 sccm for 3 minutes, after which the flow rate was changed to the flow rate (400 sccm, steady state flow rate) required for the set concentration of hydrogen gas in the rinse water (1.4 mg / L).

[0101] The pressure of the water flowing through the transfer line was measured to be 0.3 MPa.

[0102] The rise time of the ammonia concentration in the cleaning water was 2 minutes, and the rise time of the hydrogen gas concentration in the cleaning water was 3 minutes.

[0103] [Examples 2 to 4 and Comparative Example 1] Cleaning water was produced in the same manner as in Example 1, except that the conditions were changed as shown in Table 1. The evaluation results are shown in Table 1. In Comparative Example 1, the supply rates of the aqueous ammonia solution and hydrogen gas were maintained at the supply rates required for the set concentrations. Furthermore, in Comparative Example 1, a pipe capable of transporting ultrapure water at a flow rate of less than 25 L / min but not at a flow rate of 25 L / min or more was used.

[0104]

[0105] DESCRIPTION OF SYMBOLS 1...apparatus for producing cleaning water for electronic devices, 11...hydrogen peroxide removal apparatus, 12...pH adjustment apparatus, 12A...tank containing pH adjuster, 12B...pump, 12L...pH adjuster supply line, 13...ORP adjustment apparatus, 13A...tank containing ORP adjuster, 13B...pump, 13L...ORP adjuster supply line, 14...deaerator, 16...gas dissolved film type apparatus, 16A...functional gas supply apparatus, 16L...functional gas supply line, 18...water quality monitoring apparatus, 20...flow path switching apparatus, 22...control apparatus, W...ultrapure water, W1...pH adjusted water, W2...cleaning water, L1...transfer line for ultrapure water, pH adjusted water or cleaning water, L2...transfer line, L3...drainage line, UP...point of use

Claims

1. An apparatus for producing cleaning water for electronic devices, comprising: a pH adjusting apparatus that adds a pH adjuster to ultrapure water to prepare pH-adjusted water; a degassing apparatus that degasses the pH-adjusted water; a gas-dissolving membrane type apparatus that dissolves a functional gas in the degassed pH-adjusted water via a gas-permeable membrane to prepare cleaning water; and transfer lines that can transport the ultrapure water, the pH-adjusted water, and the cleaning water at a flow rate of 25 L / min or more.

2. The apparatus for producing cleaning water for electronic devices according to claim 1, further comprising a pump for adjusting the pressure of the pH-adjusted water to 0.1 MPa or more.

3. The apparatus for producing cleaning water for electronic devices according to claim 1, wherein the production apparatus further comprises a water quality monitoring device for the cleaning water and a control device, the water quality monitoring device being located downstream of the gas dissolved film type apparatus, the water quality monitoring device being a device for measuring the water quality of the cleaning water, and the control device being a device for controlling at least one selected from the group consisting of a supply rate of the pH adjuster in the pH adjustment device and a supply rate of the functional gas in the gas dissolved film type apparatus based on the water quality measured by the water quality monitoring device.

4. The apparatus for producing cleaning water for electronic devices as described in claim 3, wherein the control device controls the pH adjustment device to supply the pH adjuster at a flow rate greater than the flow rate of the pH adjuster calculated from the set concentration of the cleaning water at the point of use for a predetermined time in the initial stage of cleaning water production based on the concentration of the active ingredient of the pH adjuster in the cleaning water measured by the water quality monitoring device, and controls the pH adjustment device to supply the pH adjuster at the flow rate of the pH adjuster calculated from the set concentration after the predetermined time has elapsed.

5. The apparatus for producing cleaning water for electronic devices described in claim 3, wherein the control device controls, based on the concentration of the functional gas in the cleaning water measured by the water quality monitoring device, to supply the functional gas to the gas-dissolved film type device for a predetermined time at a flow rate greater than the flow rate of the functional gas calculated from the set concentration of the cleaning water at the point of use, during the initial stage of cleaning water production, and controls, after the predetermined time has elapsed, to supply the functional gas to the gas-dissolved film type device at the flow rate of the functional gas calculated from the set concentration.

6. The apparatus for manufacturing cleaning water for electronic devices according to any one of claims 3 to 5, wherein the manufacturing apparatus further comprises a switching device for switching the flow path of the cleaning water, the switching device being located downstream of the water quality monitoring device, the transfer line for the cleaning water branching at the switching device into a transfer line connected to a use point of the cleaning water, and a drain line for draining the cleaning water, or a circulation line joining the transfer lines at a junction located upstream, the control device controlling the switching device to transfer the cleaning water to the drain line or the circulation line when the water quality of the cleaning water measured by the water quality monitoring device has not reached the set water quality at the use point; and controlling the switching device to transfer the cleaning water to the use point by sending a signal to the switching device and switching the flow path of the cleaning water when the water quality of the cleaning water measured by the water quality monitoring device has reached the set water quality at the use point.

7. The apparatus for producing cleaning water for electronic devices according to claim 1, wherein the pH adjuster prepares pH-adjusted water having a pH of 8 to 11.

8. The apparatus for producing cleaning water for electronic devices according to claim 1, wherein the pH adjuster adds an aqueous solution of at least one alkaline compound selected from the group consisting of ammonia, tetramethylammonium hydroxide, 2-hydroxyethyltrimethylammonium hydroxide, sodium hydroxide, and potassium hydroxide to the ultrapure water as the pH adjuster.

9. The apparatus for producing cleaning water for electronic devices according to claim 1, wherein the functional gas is at least one selected from the group consisting of hydrogen gas, ozone gas, carbon dioxide gas, and rare gases.

10. A method for producing cleaning water for electronic devices, comprising: a pH adjustment step of adding a pH adjuster to ultrapure water to prepare pH-adjusted water; a degassing step of degassing the pH-adjusted water; and a gas dissolution step of dissolving a functional gas in the degassed pH-adjusted water via a gas-permeable membrane to prepare cleaning water, wherein the ultrapure water, the pH-adjusted water, and the cleaning water are each transported at a flow rate of 25 L / min or more.

11. The method for producing cleaning water for electronic devices according to claim 10, further comprising a step of adjusting the pressure of the pH-adjusted water to 0.1 MPa or more.

12. A method for producing cleaning water for electronic devices as described in claim 10, further comprising a water quality monitoring step of measuring the quality of the cleaning water, wherein, based on the concentration of the active ingredient of the pH adjuster in the cleaning water measured in the water quality monitoring step, in an initial stage of cleaning water production, the pH adjuster is supplied for a predetermined time in the pH adjustment step at a flow rate greater than the flow rate of the pH adjuster calculated from a set concentration at the point of use of the cleaning water, and after the predetermined time has elapsed, the pH adjuster is supplied in the pH adjustment step at the flow rate of the pH adjuster calculated from the set concentration.

13. A method for producing cleaning water for electronic devices as described in claim 10, further comprising a water quality monitoring step of measuring the water quality of the cleaning water, wherein, based on the concentration of the functional gas in the cleaning water measured in the water quality monitoring step, in an initial stage of cleaning water production, the functional gas is supplied in the gas dissolution step for a predetermined time at a flow rate greater than the flow rate of the functional gas calculated from a set concentration at the point of use of the cleaning water, and after the predetermined time has elapsed, the functional gas is supplied in the gas dissolution step at the flow rate of the functional gas calculated from the set concentration.

14. A method for producing cleaning water for electronic devices as described in claim 12 or 13, wherein if the water quality of the cleaning water measured in the water quality monitoring process does not reach the set water quality at the use point, the cleaning water is not transferred to the use point, and if the water quality of the cleaning water measured in the water quality monitoring process reaches the set water quality at the use point, the cleaning water is transferred to the use point.

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