Electronic device comprising battery protection module

Abstract

The present invention relates to an electronic device comprising: a housing; an antenna disposed on a portion of the side surface of the housing; a battery which is disposed in the housing and which includes at least one battery cell and a battery protection module disposed between the at least one battery cell and the antenna; a first PCB disposed in the vicinity of the battery in the housing and connected to the battery protection module and the antenna; and a first FPCB connecting the battery protection module to the first PCB, wherein the battery protection module includes: a second PCB; at least one electronic element disposed on one surface of the second PCB; an electrode connecting the second PCB to a battery cell; and a molding member formed on one surface of the second PCB so as to cover the at least one electronic element, and the first FPCB is connected to one side of the battery protection module and extends from one side to the other side of the battery protection module.

Description

Electronic device including a battery protection module

[0001] The present disclosure relates to an electronic device including a battery protection module.

[0002] Electronic devices, such as portable terminals, need to be miniaturized and multifunctional. To this end, electronic devices include printed circuit boards (e.g., printed circuit boards (PCBs), printed board assemblies (PBAs), and flexible printed circuit boards (FPCBs)) on which various components are mounted. Printed circuit boards may include processors, memory, cameras, and communication modules required for electronic devices (e.g., smartphones). Printed circuit boards may include circuit wiring that connects multiple mounted electronic components.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art in connection with the present disclosure.

[0004] An electronic device of the disclosed embodiment may include a housing. The electronic device may include an antenna disposed on a portion of a side surface of the housing and configured to transmit and receive a wireless signal through the portion of the side surface of the housing. The electronic device may include a battery disposed within the housing. The battery may include at least one battery cell and a battery protection module disposed between the at least one battery cell and the antenna and configured to control power of the battery cell. The electronic device may include a first printed circuit board (PCB) disposed around the battery within the housing and connected to the battery protection module and the antenna. The electronic device may include a first FPCB connecting the battery protection module and the first PCB. The battery protection module may include a second PCB, at least one electronic component disposed on one surface of the second PCB, and an electrode connecting the second PCB to the battery cell. The battery protection module may include a molding member formed on one surface of the second PCB to cover the at least one electronic component. The first FPCB may be connected to one side of the battery protection module and may extend from one side of the battery protection module to the other side.

[0005] FIG. 1 is a block diagram illustrating an electronic device within a network environment according to various embodiments.

[0006] FIG. 2 is a drawing for explaining the structure of an electronic device according to one embodiment.

[0007] FIG. 3 is a drawing for explaining a battery protection module of an electronic device according to one embodiment.

[0008] FIG. 4 is a drawing for explaining the structure of an electronic device according to one embodiment.

[0009] FIG. 5 is a drawing for explaining a battery protection module of an electronic device according to one embodiment.

[0010] FIG. 6 is a drawing for explaining a battery protection module of an electronic device according to one embodiment.

[0011] FIG. 7 is a drawing for explaining a molding member of a battery protection module of an electronic device according to another embodiment.

[0012] FIG. 8 is a drawing for explaining a molding member of a battery protection module of an electronic device according to another embodiment.

[0013] As the internal structure of electronic devices becomes more complex, space for arranging components may become insufficient. For example, the display driver integrated circuit (DDI) of an electronic device may partially overlap with the battery. Consequently, the electronic device may have a thin battery due to insufficient space for the battery. This thin battery may reduce the battery capacity of the electronic device. This reduced battery capacity may shorten the operating time of the electronic device. To maximize battery capacity, the display driver circuit may be designed to overlap with the battery protection module. Furthermore, to maximize battery capacity, the printed circuit board of the electronic device may be designed to overlap with the battery protection module. The structure of the battery protection module, intended to protect the electronic components, may result in a thicker electronic device or a thinner battery.

[0014] Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings so that those skilled in the art can easily implement the present invention. However, the disclosed embodiments may be implemented in various different forms and are not limited to the embodiments described herein.

[0015] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments. Referring to FIG. 1, in the network environment (100), the electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0016] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculation, the processor (120) may store a command or data received from another component (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the command or data stored in the volatile memory (132), and store the resulting data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0017] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0018] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0019] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0020] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0021] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0022] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0023] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0024] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0025] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0026] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0027] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0028] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0029] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0030] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0031] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0032] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0033] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0034] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band.

[0035] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0036] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0037] FIG. 2 is a drawing for explaining the structure of an electronic device according to one embodiment. At least one of the electronic device (200) and components of FIG. 2 may correspond to at least one of the electronic device (101) and components described above with reference to FIG. 1.

[0038] Referring to FIG. 2, an electronic device (200) according to one embodiment may include a battery including at least one battery cell (210) and a battery protection module (220), an antenna (230), a first PCB (240), a first display (280), and a second display (290). The components of the electronic device (200) illustrated in FIG. 2 are for explaining one embodiment, and the electronic device (200) may include more components than the components illustrated in FIG. 2, or may include other components that can replace at least some of the components.

[0039] According to one embodiment, the electronic device (200) may include a first housing (200a), a second housing (200b), and a hinge assembly (200c) that couples the first housing (200a) and the second housing (200b). The first housing (200a) and the second housing (200b) may be rotatably coupled via the hinge assembly (200c). For example, the first housing (200a) may be coupled with the second housing (200b) such that a first surface of the first housing (200a) rotates toward a first surface of the second housing (200b).

[0040] According to one embodiment, the first housing (200a) may have a first display (280) and a second display (290) disposed thereon. For example, the first housing (200a) may have a first portion of the first display (280) disposed on a first surface. For example, the first housing (200a) may have a second display (290) disposed on a second surface. The first surface of the first housing (200a) may face the second surface of the first housing (200a). At least one of a battery including at least one battery cell (210) and a battery protection module (220), an antenna (230), and a first PCB (240) may be disposed between the first surface and the second surface of the first housing (200a).

[0041] According to one embodiment, the electronic device (200) may include a first display (280) that may be arranged across a first housing (200a) and a second housing (200b). For example, a first portion of the first display (280) may be arranged on a first surface of the first housing (200a), and a second portion of the first display (280) may be arranged on a first surface of the second housing (200b). The first display (280) may be a flexible display.

[0042] According to one embodiment, the second display (290) may include a protective layer (291), an organic layer (292), and a driving circuit (293). For example, the protective layer (291) may protect the second display (290) from the outside. For example, the protective layer (291) may protect the second display (290) from at least one of moisture, oxygen, and contaminants. For example, the organic layer (292) may include a substrate, an electron transport layer, a light-emitting layer, and an electrode. For example, the organic layer (292) may emit light by combining holes and electrons based on the control of the driving circuit (293). For example, the driving circuit (293) may generate a control signal that controls each of the pixels of the second display (290).

[0043] According to one embodiment, a battery including at least one battery cell (210) and a battery protection module (220) may be placed within a housing. For example, the battery may be placed within a first housing (200a). For example, the battery may be placed within a second housing (200b). For example, a plurality of batteries may be configured and placed within each of the first housing (200a) and the second housing (200b).

[0044] According to one embodiment, the size of the battery cell (210) may be determined to fit the space within the housing. For example, the length and width of the battery cell (210) may be determined based on the length and width of the housing. For example, the thickness of the battery cell (210) may be determined based on the thickness of the housing. For example, the thickness of the battery cell (210) may be determined based on the difference between the thickness of the housing and the thickness of a component (e.g., a circuit board) of the electronic device (200) stacked on the battery cell (210). Accordingly, the thickness of the battery cell (210) may become thinner as the components are stacked in one direction (e.g., the +z direction) of the battery cell (210). As the thickness of the battery cell (210) becomes thinner, the capacity of the battery cell (210) may become smaller. Accordingly, the components may be stacked minimally on the upper portion (e.g., the +z direction) of the battery cell (210).

[0045] According to one embodiment, the driving circuit (293) of the second display (290) may overlap with at least a portion of the battery protection module (220). For example, when looking at the first side of the battery protection module (220), at least a portion of the driving circuit (293) may overlap with at least a portion of the battery protection module (220). For example, in order to maximize the capacity of the battery cell (210) mounted in the electronic device (200), at least a portion of the driving circuit (293) may overlap with at least a portion of the battery protection module (220).

[0046] In one embodiment, the battery protection module (220) can control the battery cell (210) so that the battery cell (210) operates safely. For example, the battery protection module (220) can control the power of the battery cell (210). For example, the battery protection module (220) can protect the battery cell (210) from being overcharged. For example, the battery protection module (220) can prevent the battery cell (210) from being charged above a set voltage. For example, the battery protection module (220) can protect the battery cell (210) from being overdischarged. For example, the battery protection module (220) can prevent the battery cell (210) from being discharged below an allowable voltage. For example, the battery protection module (220) can prevent excessive current from being applied to the battery cell (210). For example, the battery protection module (220) can prevent excessive current from being drawn from the battery cell (210). For example, the battery protection module (220) can prevent the electrodes of the battery cell (210) from being connected to each other. For example, the battery protection module (220) can manage the usage history (e.g., history regarding charging and discharging) of the battery cell (210).

[0047] According to one embodiment, the battery protection module (220) may be disposed on one side of the battery cell (210). For example, the battery protection module (220) may be disposed in a first direction (e.g., +x direction) from the battery cell (210). For example, the battery protection module (220) may be disposed between one side of the first housing (200a) and the battery cell (210). For example, the battery protection module (220) may be disposed between the battery cell (210) and the antenna (230).

[0048] According to one embodiment, the battery protection module (220) may include a second PCB (221), electronic components (222), and electrodes (223). The components of the battery protection module (220) are for illustrative purposes only, and the battery protection module (220) may include more components than those illustrated in FIG. 2, or may include other components that can replace at least some of the components.

[0049] According to one embodiment, the second PCB (221) of the battery protection module (220) may be disposed within the first housing (200a). For example, the second PCB (221) may be disposed on a first surface (e.g., a surface formed by the x-axis and the y-axis) of the first housing (200a) facing a first direction (e.g., a +z direction). For example, the second PCB (221) may be disposed parallel to the first display (280) and the second display (290).

[0050] According to one embodiment, the battery protection module (220) may include at least one electronic component (222) that controls the battery cell (210) so that the battery cell (210) operates safely. For example, the battery protection module (220) may include at least one electronic component (222) that is used to monitor at least one of a voltage and a current of the battery cell (210). For example, the battery protection module (220) may control the battery cell (210) using an electronic component (222) such as a field effect transistor (FET) or an integrated circuit (IC).

[0051] According to one embodiment, the electronic component (222) of the battery protection module (220) may be disposed on the second PCB (221). For example, the electronic component (222) may be disposed on a first side (e.g., a side formed by the x-axis and the y-axis) of the second PCB (221) facing the first direction (e.g., the +z direction).

[0052] In one embodiment, the battery protection module (220) may include an electrode (223) connected to the battery cell (210). For example, the battery protection module (220) may include a first electrode connected to the positive electrode of the battery cell (210) and a second electrode connected to the negative electrode of the battery cell (210). For example, the electrode (223) may include a conductive material. For example, the first electrode may include nickel. For example, the second electrode may include aluminum.

[0053] According to one embodiment, the battery protection module (220) may be connected to a first PCB (240). For example, the first PCB (240) may be a main board constituting a printed circuit board assembly (PBA). For example, the battery protection module (220) may be connected to the first PCB (240) through a first FPCB (229). For example, the battery protection module (220) may be connected to the first PCB (240) to provide power output from the battery cell (210) to the electronic device (200).

[0054] According to one embodiment, the first FPCB (229) may be connected to the battery protection module (220). For example, one end of the first FPCB (229) may be connected to one end of the battery protection module (220) extending in the longitudinal direction (e.g., y-axis direction) of the electronic device (200). For example, one end of the first FPCB (229) may be connected to a connector disposed on one end of the battery protection module (220). For example, the first FPCB (229) may be drawn out from one end of the battery protection module (220).

[0055] According to one embodiment, the first FPCB (229) may be connected to the first PCB (240). For example, the first FPCB (229) may be connected to the first PCB (240) positioned adjacent to one side of the battery protection module (220). For example, the other end (239a) of the first FPCB (229) may be connected to a connector of the first PCB (240).

[0056] According to one embodiment, the antenna (230) may be disposed on a portion of a side surface (201) of the housing. For example, the antenna (230) may be formed along a longitudinal direction (e.g., y-axis direction) of the electronic device (200). For example, the antenna (230) may be disposed on a side surface (201) of the housing along a longitudinal direction (e.g., y-axis direction) of the electronic device (200). For example, the antenna (230) may transmit and receive signals using a portion of the side surface (201) of the first housing (200a). For example, the antenna (230) may radiate or receive mmWave signals through a portion of the side surface (201) of the first housing (200a).

[0057] According to one embodiment, the antenna (230) may be connected to the first PCB (240). For example, the antenna (230) may be connected to the first PCB (240) via the second FPCB (239). For example, the antenna (230) may transmit and receive signals based on power supplied from the first PCB (240).

[0058] According to one embodiment, the antenna (230) can transmit and receive signals based on the direction in which the second FPCB (239) is connected. For example, the antenna (230) can radiate a signal in the direction in which one end (239b) of the second FPCB (239) is coupled. For example, the antenna (230) can radiate a mmWave signal in a second direction (e.g., the x-axis direction) based on the one end (239b) of the second FPCB (239) being coupled in a second direction (e.g., the x-axis direction) perpendicular to the first direction (e.g., the y-axis direction) in which the antenna (230) is arranged.

[0059] According to one embodiment, the second FPCB (239) can connect the antenna (230) and the first PCB (240). For example, one end (239b) of the second FPCB (239) can be connected to the antenna (230). For example, one end (239b) of the second FPCB (239) can be connected to a connector disposed on one side of the antenna (230). For example, the other end (239a) of the second FPCB (239) can be connected to the first PCB (240). For example, the other end (239a) of the second FPCB (239) can be connected to a connector disposed on the first PCB (240).

[0060] In one embodiment, the second FPCB (239) may extend toward the battery protection module (220). For example, the second FPCB (239) may extend from one side of the antenna (230) toward the battery protection module (220) positioned adjacent to one side of the antenna (230). For example, the second FPCB (239) may extend from one side of the antenna (230) toward the battery protection module (220) positioned opposite the side of the first housing (200a) with respect to the antenna (230).

[0061] According to one embodiment, the second FPCB (239) may overlap at least a portion of the battery protection module (220). For example, since the internal space of the housing is narrow, the second FPCB (239) may overlap at least a portion of the battery protection module (220) positioned near one side of the antenna (230). For example, when looking at the first side of the battery protection module (220), the second FPCB (239) may overlap at least a portion of the first side of the battery protection module (220).

[0062] According to one embodiment, the second FPCB (239) may be overlapped with the battery protection module (220) so as to be spaced apart by a predetermined distance. For example, the second FPCB (239) may be overlapped with the battery protection module (220) so as to be spaced apart by a predetermined distance above the battery protection module (220) (e.g., in the +z direction). For example, the second FPCB (239) may be attached to a tape (271) that is arranged so as to be spaced apart by a predetermined distance above the battery protection module (220) (e.g., in the +z direction) so as to form an air layer (270) to prevent damage to the electronic component (222) of the battery protection module (220) due to pressure applied to the electronic component (222).

[0063] In one embodiment, the second FPCB (239) may extend toward the first PCB (240). For example, a portion of the second FPCB (239) extending from one side of the antenna (230) may be bent so as to extend toward the first PCB (240). For example, the second FPCB (239) may be bent on the first side of the battery protection module (220). For example, the second FPCB (239) may extend from one side of the antenna (230) in a first direction (e.g., -x direction) and a portion of the second FPCB (239) may be bent on the first side of the battery protection module (220) so as to extend in a second direction (e.g., +y direction).

[0064] According to one embodiment, the second FPCB (239) may overlap at least a portion of the first FPCB (229). For example, the second FPCB (239) may overlap at least a portion of the first FPCB (229) extending in a first direction (e.g., +y direction) from one side of the battery protection module (220). For example, when looking at the first side of the battery protection module (220), at least a portion of the second FPCB (239) may overlap at least a portion of the first FPCB (229). For example, the second FPCB (239) may be disposed on an upper portion (e.g., +z direction) of the first FPCB (229).

[0065] According to one embodiment, the second FPCB (239) may include a protection circuit (not shown). For example, the second FPCB (239) may include a protection circuit to prevent a short and a surge that may occur when connected to the first PCB (240). For example, the second FPCB (239) may include a protection circuit to prevent a short and a surge that may occur when the second FPCB (239) is connected to the first PCB (240) while power is being supplied to the electronic device (200). For example, since the second FPCB (239) is positioned on top of the first FPCB (229) (e.g., in the +z direction), the second FPCB (239) can be connected to the first PCB (240) after the first FPCB (229) is connected to the first PCB (240). For example, since the first FPCB (229) is connected to the first PCB (240), the second FPCB (239) can be connected to the first PCB (240) while power is being supplied to the electronic device (200).

[0066] FIG. 3 is a drawing illustrating a battery protection module of an electronic device according to one embodiment. The battery protection module (320) of FIG. 3 may correspond to the battery protection module (220) described above with reference to FIG. 2.

[0067] Referring to FIG. 3, the battery protection module (320) may include a second PCB (321), an electronic component (322), and an electrode (323). The components of the battery protection module (320) are for illustrating one embodiment, and the battery protection module (320) may include more components than the components illustrated in FIG. 3, or may include other components that can replace at least some of the components.

[0068] According to one embodiment, the second PCB (321) may extend along the first direction. For example, the second PCB (321) may extend in the first direction (e.g., the y-axis direction) with a predetermined thickness and a predetermined width.

[0069] According to one embodiment, the electronic component (322) of the battery protection module (320) may be disposed on the second PCB (321). For example, the electronic component (322) may be disposed on a first surface of the second PCB (321) facing a first direction (e.g., +z direction).

[0070] In one embodiment, the battery protection module (320) may include an electrode (323) connected to a battery cell. For example, the battery protection module (320) may include a first electrode connected to a positive electrode of the battery cell and a second electrode connected to a negative electrode of the battery cell. For example, the electrode (323) may include a conductive material. For example, the first electrode may include nickel. For example, the second electrode may include aluminum. For example, the electrode (323) may be disposed on a second surface of the second PCB (321) facing a second direction (e.g., the -z direction). For example, the first surface of the second PCB (321) may face the second surface.

[0071] According to one embodiment, the battery protection module (320) may include a first region (390). The first region (390) may include a region of the first surface corresponding to the electrode (323) disposed on the second surface. For example, the first region (390) may include a region that is symmetrical with respect to the region where the electrode (323) is disposed with respect to the second PCB (321).

[0072] According to one embodiment, the first region (390) may not have an electronic component (322) disposed therein. For example, when the electrode (323) is coupled to a battery cell (e.g., 210 of FIG. 2), pressure may be applied to the first region (390), thereby damaging the electronic component (322) disposed in the first region (390). To prevent the electronic component (322) disposed in the first region (390) from being damaged, the electronic component (322) may not be disposed in the first region (390). The first region (390) may be designed as a component placement restriction region.

[0073] FIG. 4 is a drawing for explaining the structure of an electronic device according to one embodiment. At least one of the electronic device (400) and components of FIG. 4 may correspond to at least one of the electronic device (101) and components described above with reference to FIG. 1.

[0074] Referring to FIG. 4, an electronic device (400) according to one embodiment may include a battery including at least one battery cell (410) and a battery protection module (420), an antenna (430), a first PCB (440), a first display (480), and a second display (490). The components of the electronic device (400) illustrated in FIG. 4 are for explaining one embodiment, and the electronic device (400) may include more components than the components illustrated in FIG. 4, or may include other components that can replace at least some of the components.

[0075] According to one embodiment, the electronic device (400) may include a first housing (400a), a second housing (400b), and a hinge assembly (400c) that couples the first housing (400a) and the second housing (400b). The first housing (400a), the second housing (400b), and the hinge assembly (400c) may be analogously applied to the first housing (200a), the second housing (200b), and the hinge assembly (200c) described above with reference to FIG. 2. Duplicate details are omitted.

[0076] According to one embodiment, the first housing (400a) may have a first display (480) and a second display (490) arranged therein. The first display (480) and the second display (490) may be analogously applied to the first display (280) and the second display (290) described above with reference to FIG. 2. Duplicate details are omitted.

[0077] According to one embodiment, a battery including at least one battery cell (410) and a battery protection module (420) may be placed within a housing. For example, the battery may be placed within a first housing (400a). For example, the battery may be placed within a second housing (400b). For example, a plurality of batteries may be configured and placed within each of the first housing (400a) and the second housing (400b).

[0078] According to one embodiment, the size of the battery cell (410) may be determined to fit the space within the housing. For example, the length and width of the battery cell (410) may be determined based on the length and width of the housing. For example, the thickness of the battery cell (410) may be determined based on the thickness of the housing. For example, the thickness of the battery cell (410) may be determined based on the difference between the thickness of the housing and the thickness of a component (e.g., a circuit board) of the electronic device (400) stacked on the battery cell (410). Accordingly, the thickness of the battery cell (410) may become thinner as the components are stacked in one direction (e.g., the +z direction) of the battery cell (410). As the thickness of the battery cell (410) becomes thinner, the capacity of the battery cell (410) may become smaller. Accordingly, the components may be stacked minimally on the upper portion (e.g., the +z direction) of the battery cell (410).

[0079] According to one embodiment, the driving circuit (493) of the second display (490) may overlap with at least a portion of the battery protection module (420). For example, when looking at the first side of the battery protection module (420), at least a portion of the driving circuit (493) may overlap with at least a portion of the battery protection module (420). For example, in order to maximize the capacity of the battery cell (410) mounted in the electronic device (400), at least a portion of the driving circuit (493) may overlap with at least a portion of the battery protection module (420).

[0080] In one embodiment, the battery protection module (420) can control the battery cell (410) so that the battery cell (410) operates safely. For example, the battery protection module (420) can control the power of the battery cell (410). For example, the battery protection module (420) can protect the battery cell (410) from being overcharged. For example, the battery protection module (420) can prevent the battery cell (410) from being charged above a set voltage. For example, the battery protection module (420) can protect the battery cell (410) from being overdischarged. For example, the battery protection module (420) can prevent the battery cell (410) from being discharged below an allowable voltage. For example, the battery protection module (420) can prevent excessive current from being applied to the battery cell (410). For example, the battery protection module (420) can prevent excessive current from being drawn from the battery cell (410). For example, the battery protection module (420) can prevent the electrodes of the battery cell (410) from being connected to each other. For example, the battery protection module (420) can manage the usage history (e.g., history regarding charging and discharging) of the battery cell (410).

[0081] According to one embodiment, the battery protection module (420) may be disposed on one side of the battery cell (410). For example, the battery protection module (420) may be disposed in a first direction (e.g., +x direction) from the battery cell (410). For example, the battery protection module (420) may be disposed between one side of the first housing (400a) and the battery cell (410). For example, the battery protection module (420) may be disposed between the battery cell (410) and the antenna (430).

[0082] According to one embodiment, the battery protection module (420) may include a second PCB (421), electronic components (422), and electrodes (423). The components of the battery protection module (420) are for illustrative purposes only, and the battery protection module (420) may include more components than those illustrated in FIG. 4, or may include other components that can replace at least some of the components.

[0083] According to one embodiment, the second PCB (421) of the battery protection module (420) may be disposed within the first housing (400a). For example, the second PCB (421) may be disposed on a first surface (e.g., a surface formed by the x-axis and the y-axis) of the first housing (400a). For example, the second PCB (421) may be disposed parallel to the first display (480) and the second display (490).

[0084] In one embodiment, the battery protection module (420) may include an electrode (423) connected to the battery cell (410). For example, the battery protection module (420) may include a first electrode connected to the positive electrode of the battery cell (410) and a second electrode connected to the negative electrode of the battery cell (410). For example, the electrode (423) may include a conductive material. For example, the first electrode may include nickel. For example, the second electrode may include aluminum. For example, the electrode (423) may be disposed on a second surface of the second PCB (421) facing a second direction (e.g., the -z direction). For example, the first surface of the second PCB (321) may face the second surface.

[0085] According to one embodiment, the battery protection module (420) may include at least one electronic component (422) that controls the battery cell (410) so that the battery cell (410) operates safely. For example, the battery protection module (420) may include at least one electronic component (422) that is used to monitor at least one of a voltage and a current of the battery cell (410). For example, the battery protection module (420) may control the battery cell (410) using an electronic component (422) such as a field effect transistor (FET) or an integrated circuit (IC).

[0086] According to one embodiment, the electronic component (422) of the battery protection module (420) may be disposed on the second PCB (421). For example, the electronic component (422) may be disposed on a first surface (e.g., a surface formed by the x-axis and the y-axis) of the second PCB (421) facing a first direction (e.g., a +z direction). For example, the electronic component (422) may be disposed in an area corresponding to an electrode (423) disposed on a second surface (e.g., a surface formed by the x-axis and the y-axis) of the second PCB (421) facing a second direction (e.g., a -z direction). For example, the electronic component (422) may be disposed in an area symmetrical with respect to an area where the electrode (423) is disposed with respect to the second PCB (421).

[0087] According to one embodiment, the battery protection module (420) may further include a molding member (425). For example, the molding member (425) may be disposed on a first surface (e.g., a surface formed by the x-axis and the y-axis) of the second PCB (421) facing a first direction (e.g., a +z direction). For example, the molding member (425) may be formed to cover an electronic component (422) disposed on the first surface of the second PCB (421). For example, the molding member (425) may be formed to be thicker than a thickest electronic component among the electronic components (422). For example, the molding member (425) may be formed of a non-conductive material (e.g., a synthetic resin). Since the molding member (425) protects the electronic element (422), an air layer (e.g., 270 in FIG. 2) for protecting the electronic element (422) may not exist.

[0088] In one embodiment, the battery protection module (420) may further include a tape (426). For example, the tape (426) may be disposed on an upper portion (e.g., in the +z direction) of the molding member (425). For example, the tape (426) may attach at least a portion of the first FPCB (429) to at least a portion of the molding member (425). For example, the tape (426) may attach at least a portion of the second FPCB (439) to at least a portion of the molding member (425).

[0089] According to one embodiment, the battery protection module (420) may be connected to the first PCB (440). For example, the first PCB (440) may be a main board constituting a printed circuit board assembly (PBA). For example, the battery protection module (420) may be connected to the first PCB (440) through the first FPCB (429). For example, the battery protection module (420) may be connected to the first PCB (440) to provide power output from the battery cell (410) to the electronic device (400).

[0090] According to one embodiment, the first FPCB (429) may be connected to the battery protection module (420). For example, one end of the first FPCB (429) may be connected to one side of the battery protection module (420) extending in the longitudinal direction (e.g., y-axis direction) of the electronic device (400). The one side of the battery protection module (420) may refer to a side of the battery protection module (420) located at the end in the second direction (e.g., -y direction) when looking at the first side of the battery protection module facing the first direction (e.g., +z direction). For example, one end of the first FPCB (429) may be connected to one side of the battery protection module (420) through a connector. For example, the first FPCB (429) may be drawn out from one side of the battery protection module (420).

[0091] According to one embodiment, the first FPCB (429) may be connected to the first PCB (440). For example, the first FPCB (429) may be connected to the first PCB (440) positioned near the other side of the battery protection module (420). The other side of the battery protection module (420) may refer to a side of the battery protection module (420) located at the end in the third direction (e.g., the +y direction) when looking at the first side of the battery protection module (420) facing the first direction (e.g., the +z direction). For example, the other end (439a) of the first FPCB (429) may be connected to a connector of the first PCB (440).

[0092] According to one embodiment, the first FPCB (429) may extend from one side of the battery protection module (420) to the other side of the battery protection module (420). For example, the first FPCB (429) may extend from one side of the battery protection module (420) to the other side of the battery protection module (420) across the upper portion (e.g., in the +z direction) of the molding member (425). For example, the first FPCB (429) may be drawn out toward the second direction (e.g., in the -y direction) of the battery protection module (420) and then bent in the third direction (e.g., in the +y direction) to thereby extend to the other side of the battery protection module (420).

[0093] In one embodiment, the first FPCB (429) may overlap at least a portion of one side of the molding member (425). For example, the first FPCB (429) may overlap at least a portion of the first side of the molding member when looking at the first side of the battery protection module (420) facing in the first direction (e.g., +z direction). The first side of the molding member (425) may include a side of the molding member facing in the first direction (e.g., +z direction). For example, the first FPCB (429) may extend from one side of the battery protection module (420) to the other side of the battery protection module (420) such that the first FPCB (429) overlaps at least a portion of an upper portion (e.g., +z direction) of the molding member (425). For example, the first FPCB (429) may be attached to at least a portion of an upper portion of the molding member (425) via a tape (426). For example, the first FPCB (429) can be attached to the upper portion near one side of the molding member (425).

[0094] According to one embodiment, the antenna (430) may be disposed on a portion of a side surface (401) of the housing. For example, the antenna (430) may be formed along a longitudinal direction (e.g., y-axis direction) of the electronic device (400). For example, the antenna (430) may be disposed on a side surface (401) of the housing along a longitudinal direction (e.g., y-axis direction) of the electronic device (400). For example, the antenna (430) may transmit and receive signals using a portion of the side surface (401) of the first housing (400a). For example, the antenna (430) may radiate or receive mmWave signals through a portion of the side surface (401) of the first housing (400a).

[0095] According to one embodiment, the antenna (430) may be connected to the first PCB (440). For example, the antenna (430) may be connected to the first PCB (440) via the second FPCB (439). For example, the antenna (430) may transmit and receive signals based on power supplied from the first PCB (440).

[0096] According to one embodiment, the antenna (430) can transmit and receive signals based on the direction in which the second FPCB (439) is connected. For example, the antenna (430) can radiate a signal in the direction in which one end (439b) of the second FPCB (439) is coupled. For example, the antenna (430) can radiate a mmWave signal in a second direction (e.g., the x-axis direction) based on one end (439b) of the second FPCB (439) being coupled in a second direction (e.g., the x-axis direction) perpendicular to the first direction (e.g., the y-axis direction) in which the antenna (430) is arranged.

[0097] According to one embodiment, the second FPCB (439) can connect the antenna (430) and the first PCB (440). For example, one end (439b) of the second FPCB (439) can be connected to the antenna (430). For example, one end (439b) of the second FPCB (439) can be connected to a connector disposed on one side of the antenna (430). For example, the other end (439a) of the second FPCB (439) can be connected to the first PCB (440). For example, the other end (439a) of the second FPCB (439) can be connected to a connector disposed on the first PCB (440).

[0098] In one embodiment, the second FPCB (439) may extend toward the battery protection module (420). For example, the second FPCB (439) may extend from one side of the antenna (430) toward the battery protection module (420) positioned adjacent to one side of the antenna (430). For example, the second FPCB (439) may extend from one side of the antenna (430) toward the battery protection module (420) positioned opposite the side (401) of the first housing (400a) with respect to the antenna (430).

[0099] According to one embodiment, the second FPCB (439) may overlap at least a portion of the molding member (425) of the battery protection module (420). For example, the second FPCB (439) may overlap at least a portion of the molding member (425) of the battery protection module (420) disposed near one side of the antenna (430) because the internal space of the housing is narrow. For example, the second FPCB (439) may overlap at least a portion of the first surface of the molding member (425) when looking at the first surface of the molding member (425) facing the first direction (e.g., +z direction). For example, the second FPCB (439) may overlap at least a portion of the first surface near the other side of the molding member (425). For example, the second FPCB (439) can be attached to the upper side (e.g., in the +z direction) of the other side of the molding member (425) via tape (426).

[0100] In one embodiment, the second FPCB (439) may extend toward the first PCB (440). For example, a portion of the second FPCB (439) extending from one side of the antenna (430) may be bent so as to extend toward the first PCB (440). For example, the second FPCB (439) may be bent on the first surface of the molding member (425). For example, the second FPCB (439) may extend from one side of the antenna (430) in a first direction (e.g., -x direction) and a portion of the second FPCB (439) may be bent on the first surface of the molding member (425) so as to extend in a second direction (e.g., +y direction).

[0101] In one embodiment, the second FPCB (439) may overlap at least a portion of the first FPCB (429). For example, when looking at the first side of the battery protection module (420), at least a portion of the second FPCB (439) may overlap at least a portion of the first FPCB (429). For example, the first FPCB (429) may be disposed on an upper portion (e.g., in the +z direction) of the second FPCB (439). For example, the first FPCB (429) may overlap at least a portion of an upper portion (e.g., in the +z direction) of the second FPCB (439) that is laminated on an upper portion (e.g., in the +z direction) of the molding member (425). For example, the second FPCB (439) may be disposed between the molding member (425) of the battery protection module (420) and the first FPCB (429).

[0102] According to one embodiment, after the second FPCB (439) is connected to the first PCB (440), the first FPCB (429) may be connected to the first PCB (440). For example, the first FPCB (429) may be disposed on the upper side (e.g., in the +z direction) of the second FPCB (439), so that after the second FPCB (439) is connected to the first PCB (440), the first FPCB (429) may be connected to the first PCB (440). Accordingly, the second FPCB (239) may be connected to the first PCB (240) while power is not supplied to the electronic device (200). Short circuits and surges that may occur when the second FPCB (239) is connected to the first PCB (240) may not occur. Therefore, the second FPCB (439) may not have a protection circuit to prevent shorts and surges. Since the second FPCB (439) does not include a protection circuit, the thickness of the electronic device (400) may be reduced.

[0103] According to the disclosed embodiment, the electronic device (400) of FIG. 4, compared to the electronic device (200) of FIG. 2, may include a molding member (425) in the battery protection module (420). The molding member (425) may be formed of a non-conductive material (e.g., synthetic resin). The molding member (425) may be formed to cover the electronic element (422) of the battery protection module (420), thereby preventing the electronic element (422) from being damaged. For example, the molding member (425) may prevent the electronic element (422) from being damaged due to pressure applied to the electronic element (422). The battery protection module (420) may have the molding member (425) disposed such that the first FPCB (429) may be disposed on the upper portion (e.g., in the +z direction) of the battery protection module (420). For example, the first FPCB (429) may extend from one side of the battery protection module (420) to the other side of the battery protection module (420). For example, the first FPCB (429) may be attached to the upper part of the molding member (425). When the molding member (425) is disposed in the battery protection module (420), an air layer (e.g., 270 of FIG. 2) for protecting the electronic element (422) may not be formed. By not forming the air layer (e.g., 270 of FIG. 2), the thickness of the electronic device (400) may be reduced.

[0104] According to the disclosed embodiment, the electronic device (200) of FIG. 2 has the second FPCB (239) disposed on top of the first FPCB (229) (e.g., in the +z direction), but the electronic device (400) of FIG. 4 may have the first FPCB (429) disposed on top of the second FPCB (439) (e.g., in the +z direction). Since the electronic device (400) of FIG. 4 has the first FPCB (429) disposed on top of the second FPCB (439) (e.g., in the +z direction), unlike the second FPCB (239) of FIG. 2, the second FPCB (439) of FIG. 4 may not have a protection circuit to prevent short and surge. When the second FPCB (439) does not include a protection circuit, the thickness of the electronic device (400) may be reduced.

[0105] FIG. 5 is a diagram illustrating a battery protection module of an electronic device according to one embodiment. The battery protection module (520) of FIG. 5 may correspond to the battery protection module (420) described above with reference to FIG. 4.

[0106] Referring to FIG. 3, the battery protection module (520) may include a second PCB (521), electronic components (522), and electrodes (523). The components of the battery protection module (520) are for illustrating one embodiment, and the battery protection module (520) may include more components than those illustrated in FIG. 3, or may include other components that can replace at least some of the components.

[0107] According to one embodiment, the second PCB (521) may extend along the first direction. For example, the second PCB (521) may extend in the first direction (e.g., the y-axis direction) with a predetermined thickness and a predetermined width.

[0108] In one embodiment, the battery protection module (520) may include an electrode (523) connected to a battery cell. For example, the battery protection module (520) may include a first electrode connected to a positive electrode of the battery cell and a second electrode connected to a negative electrode of the battery cell. For example, the electrode (523) may include a conductive material. For example, the first electrode may include nickel. For example, the second electrode may include aluminum. For example, the electrode (523) may be disposed on a second surface of a second PCB (521) facing a second direction (e.g., the -z direction). For example, the first surface of the second PCB (521) may face the second surface.

[0109] According to one embodiment, the battery protection module (520) may further include a molding member (525). For example, the molding member (525) may be disposed on a first surface (e.g., a surface formed by the x-axis and the y-axis) of the second PCB (521) facing a first direction (e.g., a +z direction). For example, the molding member (525) may be formed to cover an electronic component (522) disposed on the first surface of the second PCB (521). For example, the molding member (525) may be formed to be thicker than a thickest electronic component among the electronic components (522). For example, the molding member (525) may be formed of a non-conductive material (e.g., a synthetic resin).

[0110] According to one embodiment, the electronic components (522) of the battery protection module (520) may be disposed on the second PCB (521). For example, the electronic components (522) may be disposed on a first surface (e.g., a surface formed by the x-axis and the y-axis) of the second PCB (521) facing a first direction (e.g., a +z direction).

[0111] According to one embodiment, the electronic element (522) may be disposed in an area symmetrical to the area where the electrode (523) is disposed. For example, the electronic element (522) may be disposed in an area symmetrical to the area where the electrode (523) is disposed on a second surface (e.g., a surface formed by the x-axis and the y-axis) of the second PCB (521) facing the second direction (e.g., the -z direction) with respect to the second PCB (521). For example, since the molding member (525) protects the electronic element (522), the electronic element (522) may not be damaged, and thus the electronic element (522) may be disposed in an area symmetrical to the area where the electrode (523) is disposed.

[0112] The battery protection module (520) described with reference to FIG. 5 can have electronic components (522) freely arranged on the second PCB (521) compared to the battery protection module (320) described with reference to FIG. 3. As the degree of freedom in the arrangement of the electronic components (522) increases, the electronic components (522) may not be arranged on the battery protection module (520) overlapping with the first FPCB (e.g., 429 of FIG. 4) or the second FPCB (e.g., 439 of FIG. 4).

[0113] According to the disclosed embodiment, since the electronic element (522) is not disposed on the battery protection module (520) overlapping the first FPCB (e.g., 429 of FIG. 4) or the second FPCB (e.g., 439 of FIG. 4), the thickness of the battery protection module (520) can be reduced. For example, a molding member formed on a first area of ​​a first surface of the battery protection module (520) overlapping the first FPCB (e.g., 429 of FIG. 4) or the second FPCB (e.g., 439 of FIG. 4) can be formed thinner than a molding member formed on another area. For example, since the molding member (525) is not formed on the first area overlapping the first FPCB (e.g., 429 of FIG. 4) or the second FPCB (e.g., 439 of FIG. 4) among the first surfaces of the battery protection module (520), the thickness of the battery protection module (520) in the first area can be formed thin. Since at least a portion of the area of ​​the battery protection module (520) is formed thin, the thickness of the electronic device (e.g., 400 of FIG. 4) can be reduced.

[0114] FIG. 6 is a drawing for explaining the structure of an electronic device according to one embodiment. The electronic device (600) of FIG. 6 may correspond to the electronic device (400) described above with reference to FIG. 4.

[0115] Referring to FIG. 6, the electronic device (600) may include a battery including at least one battery cell (610) and a battery protection module (620), an antenna (630), a first FPCB (629), and a second FPCB (639). The components of the electronic device (600) illustrated in FIG. 6 are for describing one embodiment, and the electronic device (600) may include more components than the components illustrated in FIG. 6, or may include other components that can replace at least some of the components.

[0116] The battery protection module (620) of the electronic device (600) of FIG. 6 may be different from the battery protection module (420) of FIG. 4. Components of the electronic device (600) other than the battery protection module (620) of FIG. 6 may be analogously applied to components of the electronic device (400) of FIG. 4. For example, the battery cell (610) of FIG. 6 may be analogically applied to the battery cell (410) of FIG. 4. For example, the antenna (630) of FIG. 6 may be analogically applied to the antenna (630) of FIG. 4.

[0117] According to one embodiment, the battery protection module (620) can control the battery cell (610) to ensure safe operation of the battery cell (610). The operation of the battery protection module (620) can be analogized to the operation of the battery protection module (420) described above with reference to FIG. 4. Duplicate details are omitted.

[0118] In one embodiment, the battery protection module (620) may be disposed on one side of the battery cell (610). For example, the one side of the battery cell (610) may include an end of the battery cell (610) in a first direction (e.g., +x direction). For example, the battery protection module (620) may be disposed in the first direction (e.g., +x direction) from the battery cell (610).

[0119] In one embodiment, the battery protection module (620) may be positioned between the battery cell (610) and the antenna (630). For example, the battery protection module (620) may be positioned between one side of the battery cell (610) and one side of the antenna (630). The one side of the antenna may include an end of the antenna (630) in a second direction (e.g., the -x direction).

[0120] According to one embodiment, the battery protection module (620) may include a second PCB (621), electronic components (622), and electrodes (623). The components of the battery protection module (620) are for illustrative purposes only, and the battery protection module (620) may include more components than those illustrated in FIG. 4, or may include other components that can replace at least some of the components.

[0121] According to one embodiment, the second PCB (621) of the battery protection module (620) may be disposed within the first housing (600a). For example, the second PCB (621) may be disposed on a first surface of the first housing (600a) facing a first direction (e.g., +z direction).

[0122] According to one embodiment, the battery protection module (620) may include an electrode (not shown) connected to the battery cell (610). The electrode (not shown) may be analogously applied to the electrode described above with reference to FIG. 4 (e.g., 423 of FIG. 4). Duplicate details are omitted.

[0123] According to one embodiment, the battery protection module (620) may include at least one electronic component (622) that controls the battery cell (610) so that the battery cell (610) operates safely. The electronic component (622) may be analogously applied to the electronic component described above with reference to FIG. 4 (e.g., 422 of FIG. 4). Duplicate details are omitted.

[0124] According to one embodiment, the electronic component (622) of the battery protection module (620) may be disposed on the second PCB (621). For example, the electronic component (622) may be disposed on a first surface (e.g., a surface formed by the x-axis and the y-axis) of the second PCB (621) facing a first direction (e.g., a +z direction). The electronic component (622) disposed on the second PCB (621) may be analogously applied to the electronic component (422) described above with reference to FIG. 4. Duplicate details are omitted.

[0125] According to one embodiment, the first FPCB (629) can connect the battery protection module (620) and the first PCB (e.g., 640 of FIG. 6). For example, one end of the first FPCB (629) can be connected to one side of the battery protection module (620). The one side of the battery protection module (620) can include an end of the battery protection module (620) in the first direction (e.g., +y direction). The first FPCB (629) can extend in the first direction (e.g., +y direction). The other end (629a) of the first FPCB (629) can be connected to the first PCB (e.g., 640 of FIG. 6).

[0126] According to one embodiment, the second FPCB (639) can connect the antenna (630) and the first PCB (e.g., 640 of FIG. 6). For example, one end (639b) of the second FPCB (639) can be connected to the antenna (630). For example, one end (639b) of the second FPCB (639) can be connected to a connector disposed on one side of the antenna (630). For example, the other end (639a) of the second FPCB (639) can be connected to the first PCB (640). For example, the other end (639a) of the second FPCB (639) can be connected to a connector disposed on the first PCB (640).

[0127] In one embodiment, the second FPCB (639) may extend toward the battery protection module (620). For example, the second FPCB (639) may extend from one side of the antenna (630) toward the battery protection module (620) positioned adjacent to one side of the antenna (630). For example, the second FPCB (639) may extend from one side of the antenna (630) toward the battery protection module (620) positioned opposite the side (601) of the first housing (600a) with respect to the antenna (630).

[0128] In one embodiment, the second FPCB (639) may extend toward the first PCB (640). For example, a portion of the second FPCB (639) extending from one side of the antenna (630) may be bent so as to extend toward the first PCB (640). For example, the second FPCB (639) may be bent in the first region (620a) of the battery protection module (620). For example, the second FPCB (639) may extend from one side of the antenna (630) in a first direction (e.g., -x direction) and a portion may be bent on the first surface of the molding member (625) so as to extend in a second direction (e.g., +y direction).

[0129] In one embodiment, the second FPCB (639) may overlap at least a portion of the first FPCB (629). For example, when facing the first side of the battery protection module (620), at least a portion of the second FPCB (639) may overlap at least a portion of the first FPCB (629). For example, the first FPCB (629) may be disposed on an upper portion (e.g., in the +z direction) of the second FPCB (639). For example, the first FPCB (629) may overlap at least a portion of an upper portion (e.g., in the +z direction) of the second FPCB (639) that is laminated on an upper portion (e.g., in the +z direction) of the molding member (625). For example, the second FPCB (639) may be disposed between the molding member (625) of the battery protection module (620) and the first FPCB (629).

[0130] According to one embodiment, after the second FPCB (639) is connected to the first PCB (640), the first FPCB (629) may be connected to the first PCB (640). For example, the first FPCB (629) may be disposed on the upper side (e.g., in the +z direction) of the second FPCB (639), so that after the second FPCB (639) is connected to the first PCB (640), the first FPCB (629) may be connected to the first PCB (640). Accordingly, the second FPCB (239) may be connected to the first PCB (240) while power is not supplied to the electronic device (200). Short circuits and surges that may occur when the second FPCB (239) is connected to the first PCB (240) may not occur. Therefore, the second FPCB (639) may not have a protection circuit to prevent shorts and surges. Since the second FPCB (639) does not include a protection circuit, the thickness of the electronic device (600) may be reduced.

[0131] According to one embodiment, the battery protection module (620) may further include a molding member (625). For example, the molding member (625) may be disposed on a first surface (e.g., a surface formed by the x-axis and the y-axis) of the second PCB (621) facing a first direction (e.g., a +z direction). For example, the molding member (625) may be formed to cover an electronic component (622) disposed on the first surface of the second PCB (621). For example, the molding member (625) may be formed to be thicker than a thickest electronic component among the electronic components (622). For example, the molding member (625) may be formed of a non-conductive material (e.g., a synthetic resin).

[0132] According to one embodiment, the molding member (625) may be formed with different thicknesses. For example, the molding member formed on the first area (620a) of the first surface of the second PCB (621) may be formed thinner than the molding member formed on another area of ​​the first surface. The first area (620a) may include an area where the battery protection module (620) overlaps the first FPCB (629) or the second FPCB (639).

[0133] According to one embodiment, the electronic component (622) may be placed only on a portion of the second PCB (621). For example, the electronic component (622) may not be placed in the first area (620a) where the battery protection module (620) overlaps the first FPCB (629) or the second FPCB (639).

[0134] According to one embodiment, the molding member (625) may be formed only on a portion of the second PCB (621). For example, the molding member (625) may be formed only on a portion of the second PCB (621) where the electronic component (622) is disposed. For example, the molding member (625) may be disposed on a portion of the first surface of the second PCB (621) other than the first portion (620a). The first portion (620a) may include a portion where the battery protection module (620) overlaps the first FPCB (629) or the second FPCB (639). For example, the molding member (625) may not be formed on the first portion (620a) where the electronic component (622) is not disposed.

[0135] According to the disclosed embodiment, the thickness of the first region (620a) of the battery protection module (620) can be formed thinly. By forming the first region (620a) of the battery protection module (620) thinly, the thickness of the electronic device (600) can be reduced. Based on the difference between the thickness of the molding member (625) of FIG. 6 and the thickness of the molding member (425) of FIG. 4, the thickness of the electronic device (600) described with reference to FIG. 6 can be thinner than the thickness of the electronic device (400) described with reference to FIG. 4.

[0136] FIG. 7 is a drawing for explaining a molding member of a battery protection module of an electronic device according to one embodiment. The battery protection module (720) of FIG. 7 may correspond to the battery protection module (420) described above with reference to FIG. 4.

[0137] According to one embodiment, the battery protection module (720) may include a second PCB (721), electronic components (722a, 722b, 722c, 722d), wiring (724), and molding members (725a, 725b). The components of the battery protection module (720) are for illustrative purposes only, and the battery protection module (720) may include more components than those illustrated in FIG. 3, or may include other components that can replace at least some of the components.

[0138] According to one embodiment, the second PCB (721) may extend along the first direction. For example, the second PCB (721) may extend in the first direction (e.g., the y-axis direction) with a predetermined thickness and a predetermined width.

[0139] According to one embodiment, the electronic components (722a, 722b, 722c, 722d) may be disposed on a first surface of the second PCB (721). For example, the electronic components (722a, 722b, 722c, 722d) may be disposed on a first surface of the second PCB (721) facing a first direction (e.g., a +z direction). For example, the electronic components (722a, 722b, 722c, 722d) may be disposed on a wiring (724) formed on the first surface of the second PCB (721).

[0140] According to one embodiment, the molding members (725a, 725b) may be disposed on a first surface of the second PCB (721). For example, the molding members (725a, 725b) may be disposed on a first surface of the second PCB (721) facing a first direction (e.g., +z direction). For example, the molding members (725a, 725b) may be formed of a non-conductive material (e.g., synthetic resin).

[0141] According to one embodiment, the molding members (725a, 725b) may be formed to cover the electronic elements (722) disposed on the first surface of the second PCB (721). For example, the molding members (725a, 725b) may be formed to be thicker than the thickest electronic element (722a, 722d) among the electronic elements (722a, 722b, 722c, 722d). For example, the molding members (725a, 725b) may be formed to be thicker by a than the electronic elements (722a, 722d). For example, a may be a value that is at least twice the thickness of the raw material forming the molding members (725a, 725b). For example, the molding members (725a, 725b) may be formed to have a thickness of c. For example, c may be a value that is the sum of the height of the wiring (724), the thickness of the thickest electronic element (722a, 722d), and a.

[0142] According to one embodiment, the molding members (725a, 725b) may be formed only in a portion of the second PCB (721). For example, the molding members (725a, 725b) may be formed only in a portion of the second PCB (721) where the electronic components (722) are disposed. For example, the molding members (725a, 725b) may not be formed on the first portion (726) where the electronic components (722) are not disposed. For example, the molding members (725a, 725b) may be disposed on a portion of the first surface of the second PCB (721) other than the first portion (726). For example, the first portion (726) may be formed to have a length of d. For example, d may include a minimum length of an area where the molding members (725a, 725b) are not disposed.

[0143] According to one embodiment, the first region (726) may be spaced apart from the elements (722b, 722c) by a predetermined distance. For example, the first region (726) may be spaced apart by b from one side of the elements (722b, 722c). For example, considering that the molding members (725a, 725b) may flow into the first region (726), the first region (726) may be spaced apart by b from one side of the elements (722b, 722c). For example, b may be a value determined in consideration of the characteristics of the raw material forming the molding members (725a, 725b). For example, b may be a value determined based on the curing time of the raw material forming the molding members (725a, 725b) and the viscosity of the raw material. For example, the first region (726) may be spaced apart from one side of the elements (722b, 722c) by b based on the length (d) of the first region (726). For example, the first region (726) may be spaced apart from one side of the elements (722b, 722c) by b, which corresponds to about 1 / 3 of the length (d) of the first region (726).

[0144] FIG. 8 is a drawing for explaining a molding member of a battery protection module of an electronic device according to one embodiment. The battery protection module (820) of FIG. 8 may correspond to the battery protection module (420) described above with reference to FIG. 4.

[0145] According to one embodiment, the battery protection module (820) may include a second PCB (821), electronic components (822a, 822b, 822c, 822d, 822e), wiring (824), and a molding member (825). The components of the battery protection module (820) are for illustrative purposes only, and the battery protection module (820) may include more components than those illustrated in FIG. 3, or may include other components that may replace at least some of the components.

[0146] According to one embodiment, the second PCB (821) may extend along the first direction. For example, the second PCB (821) may extend in the first direction (e.g., the y-axis direction) with a predetermined thickness and a predetermined width.

[0147] According to one embodiment, the electronic components (822a, 822b, 822c, 822d, 822e) may be disposed on a first surface of the second PCB (821). For example, the electronic components (822a, 822b, 822c, 822d, 822e) may be disposed on a first surface of the second PCB (821) facing a first direction (e.g., a +z direction). For example, the electronic components (822a, 822b, 822c, 822d, 822e) may be disposed on a wiring (824) formed on the first surface of the second PCB (821).

[0148] According to one embodiment, the molding member (825) may be disposed on a first surface of the second PCB (821). For example, the molding member (825) may be disposed on a first surface of the second PCB (821) facing a first direction (e.g., a +z direction). For example, the molding member (825) may be formed of a non-conductive material (e.g., a synthetic resin).

[0149] According to one embodiment, the molding member (825) may be formed to cover the electronic element (822) disposed on the first surface of the second PCB (821). For example, the molding member (825) may be formed to be thicker than the thickest electronic element (822a, 822d) among the electronic elements (822a, 822b, 822c, 822d). For example, the molding member (825) may be formed to be thicker by a than the electronic elements (822a, 822d). For example, a may be a value that is at least twice the thickness of the raw material forming the molding member (825). For example, the molding member (825) may be formed to have a thickness of c. For example, c may be a value that is the sum of the height of the wiring (824), the thickness of the thickest electronic element (822a, 822d), and a.

[0150] According to one embodiment, the molding member (825) may be formed to have different thicknesses. For example, the molding member (825) may be formed to have a first region (826) thinner than other regions. For example, the molding member (825) may be formed to have a thickness d thinner than other regions. For example, the thickness (d) of the first region (826) of the molding member (825) may be determined based on the thickness (c) of the molding member (825). For example, the thickness (d) of the first region (826) may be determined to be within about 1 / 3 of the thickness (c) of the molding member (825).

[0151] According to one embodiment, the molding member (825) may be formed to cover the element (822c) positioned at the lower portion (e.g., in the -z direction) of the first region (826). For example, the molding member (825) may be formed to be thicker than the element (822c) by b. For example, b may be a value that is at least twice the thickness of the raw material forming the molding member (825).

[0152] An electronic device of the disclosed embodiment may include a housing. The electronic device may include an antenna disposed on a portion of a side surface of the housing and configured to transmit and receive a wireless signal through the portion of the side surface of the housing. The electronic device may include a battery disposed within the housing. The battery may include at least one battery cell and a battery protection module disposed between the at least one battery cell and the antenna and configured to control power of the battery cell. The electronic device may include a first printed circuit board (PCB) disposed around the battery within the housing and connected to the battery protection module and the antenna. The electronic device may include a first FPCB connecting the battery protection module and the first PCB. The battery protection module may include a second PCB, at least one electronic component disposed on one surface of the second PCB, and an electrode connecting the second PCB to the battery cell. The battery protection module may include a molding member formed on one surface of the second PCB to cover the at least one electronic component. The first FPCB may be connected to one side of the battery protection module and may extend from one side of the battery protection module to the other side.

[0153] According to one embodiment, the first PCB may be positioned adjacent to the other side of the battery protection module and may include a first connector connected to the first FPCB.

[0154] According to one embodiment, the first FPCB extends from one side of the battery protection module to the other side of the battery protection module such that it overlaps at least a portion of one side of the molding member when viewed from one side of the second PCB.

[0155] In one embodiment, a housing may include a first housing and a second housing. An electronic device may include a hinge assembly that rotatably couples the first housing and the second housing. The electronic device may include a first display including a first portion disposed on a first surface of the first housing and a second portion disposed on a first surface of the second housing. The first display may be rotatable toward the second portion when the first surface of the first housing is rotated toward the first surface of the second housing. The electronic device may include a second display disposed on a second surface of the first housing opposite the first surface of the first housing. When facing one surface of the second PCB, the first display and the second display may overlap at least a portion of a battery cell. A driving circuit of the second display may overlap at least a portion of a battery protection module.

[0156] In one embodiment, the electrodes may be positioned on a surface opposite to one surface of the second PCB. At least one electronic component may be positioned at a location corresponding to at least one of the electrodes.

[0157] According to one embodiment, the electronic device may include a second FPCB connecting the antenna and the first PCB. The second FPCB may extend in a first direction perpendicular to a portion of a side surface of the housing from the antenna. The second FPCB may extend in a second direction toward the other side of the battery protection module on the battery protection module and may be connected to a second connector of the first PCB disposed near the other side of the battery protection module.

[0158] According to one embodiment, the second FPCB may be disposed between the battery protection module and the first FPCB on the battery protection module.

[0159] According to one embodiment, the molding member may not be formed on a portion of one side of the second PCB that overlaps with the second FPCB.

[0160] According to one embodiment, at least one electronic component may not be formed on a portion of one side of the second PCB that overlaps with the second FPCB.

[0161] In one embodiment, the molding member may be formed of a non-conductive material. The molding member may be formed to a thickness greater than a thickness of at least one electronic element.

[0162] In the specific embodiments of the present disclosure described above, components included in the disclosure are expressed in the singular or plural form, depending on the specific embodiment presented. However, the singular or plural expressions are selected to suit the presented situation for convenience of explanation, and the present disclosure is not limited to singular or plural components. Components expressed in the plural form may be composed of singular elements, or components expressed in the singular form may be composed of plural elements.

[0163] The specific implementations described in this disclosure are merely exemplary and do not limit the scope of the present disclosure in any way. For the sake of brevity, descriptions of conventional electronic components, control systems, software, and other functional aspects of the systems may be omitted.

[0164] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0165] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0166] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0167] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0168] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0169] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and arranged in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0170] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0171] Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings so that those skilled in the art can easily implement the present invention. However, the disclosed embodiments may be implemented in various different forms and are not limited to the embodiments described herein.

[0172] The methods according to the embodiments described in the claims or specification of the present disclosure may be implemented in the form of hardware, software, or a combination of hardware and software.

[0173] When implemented in software, a computer-readable storage medium storing one or more programs (software modules) may be provided. The one or more programs stored in the computer-readable storage medium are configured for execution by one or more processors within an electronic device. The one or more programs include instructions that cause the electronic device to execute methods according to embodiments described in the claims or specification of the present disclosure.

[0174] In the present disclosure, the functions or operations performed by the electronic device may be performed by one or more processors executing one or more instructions stored in a memory. The functions or operations of the electronic device mentioned in the present disclosure may be performed by one processor executing one or more instructions, or may be performed by a combination of multiple processors executing one or more instructions. The processor mentioned in the present disclosure may be understood to include circuitry for performing calculations or controlling other components of the electronic device. For example, the one or more processors may include a central processing unit (CPU), a microprocessor unit (MPU), an application processor (AP), a communication processor (CP), a neural processing unit (NPU), a system on a chip (SoC), or an integrated circuit (IC) configured to execute one or more instructions. The one or more processors may be configured to perform the operations of the electronic device described above.

[0175] In the present disclosure, a program (software module, software) may be stored in a non-volatile memory including a random access memory (RAM), a flash memory, a read only memory (ROM), an electrically erasable programmable read only memory (EEPROM), a magnetic disc storage device, a compact disc ROM (CD-ROM), digital versatile discs (DVDs) or other forms of optical storage devices, a magnetic cassette. Or, it may be stored in a memory formed by a combination of some or all of these. The memory may be formed by a single storage medium, or may be formed by a combination of a plurality of storage media. The one or more commands may be stored in a single storage medium, or may be distributed and stored in a plurality of storage media.

[0176] Additionally, the program may be stored on an attachable storage device that is accessible via a communication network such as the Internet, an intranet, a local area network (LAN), a wide LAN (WLAN), or a storage area network (SAN), or a combination thereof. Such a storage device may be connected to a device performing an embodiment of the present disclosure via an external port. Additionally, a separate storage device on the communication network may be connected to a device performing an embodiment of the present disclosure.

[0177] In the specific embodiments of the present disclosure described above, components included in the disclosure are expressed in the singular or plural form, depending on the specific embodiment presented. However, the singular or plural expressions are selected to suit the presented situation for convenience of explanation, and the present disclosure is not limited to singular or plural components. Components expressed in the plural form may be composed of singular elements, or components expressed in the singular form may be composed of plural elements.

[0178] Additionally, in the present disclosure, terms such as “part”, “module”, etc. may refer to a hardware component such as a processor or circuit, and / or a software component executed by a hardware component such as a processor.

[0179] A "component" or "module" may be implemented by a program stored in an addressable storage medium and executed by a processor. For example, a "component" or "module" may be implemented by components such as software components, object-oriented software components, class components, and task components, as well as processes, functions, attributes, procedures, subroutines, segments of program code, drivers, firmware, microcode, circuitry, data, databases, data structures, tables, arrays, and variables.

[0180] The specific implementations described in this disclosure are merely exemplary and do not limit the scope of the present disclosure in any way. For the sake of brevity, descriptions of conventional electronic components, control systems, software, and other functional aspects of the systems may be omitted.

[0181] Additionally, in the present disclosure, “comprising at least one of a, b, or c” may mean “comprising only a, including only b, including only c, or including a combination of two or more (including a and b, including b and c, including a and c, or including all of a, b, and c).

[0182] While the detailed description of this disclosure has described specific embodiments, it should be understood that various modifications are possible without departing from the scope of this disclosure. Therefore, the scope of this disclosure should not be limited to the described embodiments, but should be defined not only by the scope of the claims described below, but also by equivalents thereof.

Claims

1. In electronic devices, housing; An antenna disposed on a portion of a side surface of the housing and transmitting and receiving wireless signals through the portion of the side surface of the housing; A battery disposed within the housing, the battery comprising at least one battery cell and a battery protection module disposed between the at least one battery cell and the antenna, the battery controlling power of the at least one battery cell; A first PCB disposed around the battery within the housing and connected to the battery protection module and the antenna; and Including a first FPCB connecting the battery protection module and the first PCB, The above battery protection module, 2nd PCB; At least one electronic element arranged on one surface of the second PCB; an electrode connecting the second PCB to the battery cell; and Including a molding member formed on the one surface of the second PCB to cover the at least one electronic element; The above first FPCB Connected to one side of the above battery protection module, Extending from one side to the other side of the above battery protection module, Electronic devices.

2. In paragraph 1, The above first PCB, Placed near the other side of the above battery protection module, Including a first connector connected to the first FPCB, Electronic devices.

3. In paragraph 1, The above first FPCB, By extending from one side of the battery protection module to the other side of the battery protection module, when looking at the one side of the second PCB, it overlaps with at least a part of one side of the molding member. Electronic devices.

4. In paragraph 1, The above housing includes a first housing and a second housing, The above electronic device, A hinge assembly that connects the first housing and the second housing so that they can rotate; A first display including a first part disposed on a first surface of the first housing and a second part disposed on a first surface of the second housing, wherein the first part is rotated toward the second part by rotating the first surface of the first housing toward the first surface of the second housing. A second display is disposed on a second surface of the first housing opposite to the first surface of the first housing, When looking at the above-mentioned one side of the above-mentioned second PCB, the above-mentioned first display and the above-mentioned second display overlap with at least a portion of the above-mentioned at least one battery cell, The driving circuit of the second display overlaps at least a portion of the battery protection module. Electronic devices.

5. In paragraph 1, The above electrode is placed on the other side facing one side of the second PCB, wherein at least one electronic element is arranged at a position corresponding to at least one of the electrodes; Electronic devices.

6. In paragraph 1, The above electronic device, Including a second FPCB connecting the antenna and the first PCB, The above second FPCB extending in a first direction perpendicular to the part of the side surface of the housing from the antenna, Extending in a second direction toward the other side of the battery protection module on the battery protection module and connected to the second connector of the first PCB arranged near the other side of the battery protection module, Electronic devices.

7. In paragraph 6, The above second FPCB, On the above battery protection module, between the battery protection module and the first FPCB Electronic devices.

8. In paragraph 6, The above molding member, Among the surfaces of the second PCB, the one that is not formed on the part overlapping the second FPCB, Electronic devices.

9. In paragraph 6, At least one electronic component above Among the surfaces of the second PCB, not formed on the portion overlapping with the second FPCB, Electronic devices.

10. In paragraph 1, The above molding member, It is formed of non-conductive material, Formed to be thicker than the thickness of at least one electronic element, Electronic devices.

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