Housing component comprising heterogeneous materials

Abstract

The present disclosure relates to an electronic device. An electronic device including a housing component, according to one embodiment of the present disclosure, comprises: a first portion including a first body and a first cavity formed in the first body; and a second portion including a second body and a coupling part coupled to the first portion, wherein the first cavity includes a first opening formed on the surface of the first portion, a second opening formed on the surface of the first portion and spaced apart from the first opening, and a first connection hole formed between the first opening and the second opening, and the coupling part is disposed in the first connection hole via the first opening and / or the second opening of the first cavity.

Description

Housing components containing dissimilar materials

[0001] Embodiments of the present disclosure relate to a housing component of an electronic device comprising heterogeneous materials.

[0002] Thanks to remarkable advancements in information and communication technology and semiconductor technology, the proliferation and use of various electronic devices is rapidly increasing. In particular, recent electronic devices are being developed to enable portability and communication.

[0003] Electronic devices can refer to devices that perform specific functions based on the programs installed on them, such as home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, audio / video devices, desktop / laptop computers, and car navigation systems. For example, these electronic devices can output stored information as audio or video. As electronic device integration increases and ultra-high-speed, high-capacity wireless communications become more widespread, a single electronic device, such as a mobile communication terminal, can now be equipped with a variety of functions. For example, in addition to communication functions, entertainment functions such as games, multimedia functions such as music / video playback, communication and security functions such as mobile banking, and functions such as schedule management and electronic wallets are being integrated into a single electronic device. These electronic devices are becoming smaller and more portable for users.

[0004] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art in connection with the present disclosure.

[0005] The present disclosure relates to an electronic device. According to one embodiment of the present disclosure, an electronic device including a housing part may be provided, the electronic device including a first part including a first body and a first cavity formed in the first body, and a second part including a second body and a coupling portion coupled to the first part, wherein the first cavity includes a first opening formed in a surface of the first part, a second opening formed in a surface of the first part and spaced apart from the first opening, and a first connecting hole formed between the first opening and the second opening, the coupling portion penetrating the first opening and / or the second opening of the first cavity and being disposed in the first connecting hole.

[0006] The present disclosure relates to a housing component. According to one embodiment, the housing component may include a first part including a first body and a first cavity formed in the first body, and a second part including a second body and a coupling portion coupled to the first part, wherein the first part surrounds at least a portion of the second part, the first cavity includes a first opening formed in a surface of the first part, a second opening formed in a surface of the first part and spaced apart from the first opening, and a first connecting hole formed between the first opening and the second opening, and the coupling portion may be disposed in the first connecting hole by penetrating the first opening and the second opening of the first cavity.

[0007] The present disclosure relates to a method for manufacturing a housing component. According to one embodiment, the method for manufacturing a housing component may include the steps of: providing a first part in which a first cavity including a first opening and a second opening is formed; arranging a mold in which a third cavity is formed adjacent to the first part in which the first cavity is formed; injecting a molten material into the first cavity and the third cavity; and solidifying the molten material injected into the first cavity and the third cavity to provide a second part joined to the first part.

[0008] The above-described aspects or other aspects, configurations and / or advantages of one embodiment of the present disclosure may be further clarified by the following detailed description taken in conjunction with the accompanying drawings.

[0009] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment of the present disclosure.

[0010] FIG. 2 is a perspective view showing the front of an electronic device according to one embodiment of the present disclosure.

[0011] FIG. 3 is a perspective view showing the rear side of an electronic device according to one embodiment of the present disclosure.

[0012] FIG. 4 is an exploded perspective view showing the front of an electronic device according to one embodiment of the present disclosure.

[0013] FIG. 5 is an exploded perspective view showing the rear side of an electronic device according to one embodiment of the present disclosure.

[0014] FIG. 6 is a cross-sectional view showing a portion of a housing component according to one embodiment of the present disclosure.

[0015] FIG. 7 is a perspective view of a first portion according to one embodiment of the present disclosure.

[0016] FIG. 8 is a drawing showing a portion of a housing component according to one embodiment of the present disclosure.

[0017] FIG. 9 is a cross-sectional view showing a portion of a housing component of an electronic device along line A-A' of FIG. 6, according to one embodiment of the present disclosure.

[0018] FIG. 10 is a perspective view of a first portion according to one embodiment of the present disclosure.

[0019] FIG. 11 is a drawing showing a part of the first portion cut along line A-A' of FIG. 8 according to one embodiment of the present disclosure.

[0020] FIG. 12 is a diagram showing a state before a second part is coupled with a first part and after a second part is coupled with a first part, according to one embodiment of the present disclosure.

[0021] FIG. 13 is a cross-sectional view of a comparative example of a housing component according to one embodiment of the present disclosure.

[0022] FIG. 14 is a cross-sectional view of a comparative example of a housing component according to one embodiment of the present disclosure.

[0023] FIG. 15 is a drawing showing a portion of a housing component according to one embodiment of the present disclosure.

[0024] FIG. 16 is a cross-sectional view showing a portion of a housing component of an electronic device along line B-B' of FIG. 13, according to one embodiment of the present disclosure.

[0025] FIG. 17 is a cross-sectional view of a first portion according to one embodiment of the present disclosure.

[0026] FIG. 18 is a perspective view showing a portion of a housing component according to one embodiment of the present disclosure.

[0027] FIG. 19 is a cross-sectional view showing a portion of a housing component of an electronic device along line C-C' of FIG. 16, according to one embodiment of the present disclosure.

[0028] FIG. 20 is a cross-sectional view showing a portion of a housing component of an electronic device along line D-D' of FIG. 16, according to one embodiment of the present disclosure.

[0029] FIG. 21 is a cross-sectional view of a housing component according to one embodiment of the present disclosure.

[0030] FIG. 22 is a cross-sectional view of a housing component according to one embodiment of the present disclosure.

[0031] Throughout the attached drawings, similar reference numbers may be assigned to similar parts, components and / or structures.

[0032] As miniaturization and lightweighting of electronic devices become more important, research is being conducted to ensure the durability of miniaturized components in the housing that forms the exterior of the electronic device.

[0033] More specifically, a variety of materials can be used for the housing of electronic devices. For example, housings can be made using materials such as magnesium, aluminum, and titanium, and combinations of these materials can create durable and lightweight housings.

[0034] The following description of the accompanying drawings may provide an understanding of various exemplary implementations of the present disclosure, including the claims and their equivalents. While the exemplary embodiments disclosed in the following description include numerous specific details to aid understanding, they are to be considered as one example of various exemplary embodiments. Accordingly, those skilled in the art will appreciate that various modifications and variations of the various implementations described in this disclosure may be made without departing from the scope and spirit of the disclosure. Furthermore, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0035] The terms and words used in the following description and claims are not limited to their reference meanings and can be used to clearly and consistently describe one embodiment of the present disclosure. Therefore, it will be apparent to those skilled in the art that the following description of various implementations of the disclosure is provided for illustrative purposes, not for the purpose of limiting the scope of the disclosure and its equivalents.

[0036] Unless the context clearly dictates otherwise, the singular forms of "a," "an," and "the" should be understood to include plural meanings. Thus, for example, "a component surface" could be understood to include one or more of the surfaces of the component.

[0037] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to one embodiment of the present disclosure.

[0038] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0039] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0040] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0041] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0042] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0043] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0044] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0045] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0046] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0047] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0048] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0049] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0050] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0051] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0052] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0053] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0054] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0055] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0056] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0057] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0058] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0059] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0060] Electronic devices according to the disclosed embodiments of the present disclosure may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the disclosed embodiments are not limited to the aforementioned devices.

[0061] The embodiments of the present disclosure and the terminology used therein are not intended to limit the described technical features of the present disclosure to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly dictates otherwise. In the present disclosure, each of the phrases "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or via a third component. Furthermore, when a component (e.g., a first component) is referred to as being "(functionally or communicatively) connected" or "connected" to another component (e.g., a second component), the component can be directly connected to the other component, or can be connected via another component (e.g., a third component).

[0062] The term "module" used in embodiments of the present disclosure may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0063] One embodiment of the present disclosure may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0064] According to one embodiment, a method according to one embodiment of the present disclosure may be provided as a computer program product. The computer program product may be traded as a commodity between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0065] According to one embodiment, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to one embodiment, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to one embodiment, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0066] FIG. 2 is a perspective view showing the front side of an electronic device according to one embodiment of the present disclosure. FIG. 3 is a perspective view showing the rear side of an electronic device according to one embodiment of the present disclosure.

[0067] In the detailed descriptions below in FIGS. 2 and 3, the length direction of the electronic device (100) may be defined as the 'Y-axis direction', the width direction as the 'X-axis direction', and / or the height direction (thickness direction) as the 'Z-axis direction'. In the detailed description below, references to the length direction, the width direction, and / or the height direction (or thickness direction) may indicate the length direction, the width direction, and / or the height direction (or thickness direction) of the electronic device (100). In some embodiments, with respect to the direction in which a component is oriented, 'negative / positive (- / +)' may be mentioned together with the rectangular coordinate system illustrated in the drawings. According to one embodiment, the arrangement relationship in the height direction of a certain component or another component, i.e., the reference of up / down, may follow the Z-axis direction. That is, when a component is said to be placed above another component, it can mean that the component is placed along the Z-axis with respect to the other component, and when a component is said to be placed below another component, it can mean that the component is placed in the direction opposite to the Z-axis with respect to the other component. On the other hand, it should be noted that even if a component is placed above or below another component, it does not mean that the entire component is located above or below all of the other components. For example, a part of a component may be placed above a part of another component, but another part of the component may be placed below a part of another component. It should be noted that when a component is said to overlap (or stack) another component in the following description, the description of the arrangement relationship in the height direction described above can be applied. In the description of the direction, if 'yin / yang (- / +)' is not stated, it can be interpreted as facing the + direction unless otherwise defined.For example, 'Z-axis direction' can be interpreted as pointing toward the +Z direction, 'X-axis direction' can be interpreted as pointing toward the +X-axis direction, and 'Y-axis direction' can be interpreted as pointing toward the +Y-axis direction. In describing directions, pointing toward any one of the three axes of the orthogonal coordinate system can include pointing in a direction parallel to the axis. According to one embodiment of the present disclosure, 'X-axis direction' can be referred to as a 'first direction', and 'Z-axis direction' can be referred to as a 'second direction'. This is based on the orthogonal coordinate system described in the drawings for the sake of brevity of description, and it should be noted that the description of such directions or components does not limit one embodiment of the present disclosure.

[0068] The embodiments of FIGS. 2 to 3 may be combined with the embodiments of FIG. 1 or the embodiments of FIGS. 4 to 20.

[0069] Referring to FIGS. 2 and 3, an electronic device (101) according to one embodiment (e.g., the electronic device (101) of FIG. 1) may include a housing (210) that includes a first side (or front side) (210A), a second side (or back side) (210B), and a side surface (210C) that surrounds a space between the first side (210A) and the second side (210B). In one embodiment (not shown), the housing (210) may also refer to a structure that forms a portion of the first side (210A) of FIG. 2, the second side (210B) of FIG. 3, and the side surface (210C). According to one embodiment, the first side (210A) may be formed by a front plate (202) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (210B) may be formed by a substantially opaque back plate (211). The back plate (211) may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side surface (210C) may be formed by a side structure (or “side bezel structure”) (218) that is joined to the front plate (202) and the back plate (211) and comprises a metal and / or a polymer. In one embodiment, the back plate (211) and the side structure (218) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0070] Although not shown, the front plate (202) may include a seamlessly extending region(s) that curves toward the back plate (211) at least along a portion of an edge. In one embodiment, the front plate (202) (or the back plate (211)) may include only one of the curved extending regions toward the back plate (211) (or the front plate (202)) at one edge of the first surface (210A). In some embodiments, the front plate (202) or the back plate (211) may be substantially flat. For example, the curved extending region may not be included. If the curved extending region is included, the thickness of the electronic device (101) in the portion that includes the curved extending region may be less than that of the other portions.

[0071] According to one embodiment, the electronic device (101) may include at least one of a display (220), an audio module (203, 207, 214), a sensor module (204, 219), a camera module (205, 212, 213), a key input device (217), a light emitting element (206), and a connector hole (208, 209). In one embodiment, the electronic device (101) may omit at least one of the components (e.g., the key input device (217) or the light emitting element (206)) or may additionally include other components.

[0072] The display (220) may be visually exposed, for example, through a significant portion of the front plate (202). In one embodiment, at least a portion of the display (220) may be visually exposed through the front plate (202) forming the first surface (210A) or through a portion of a side surface (210C). In one embodiment, the edge of the display (220) may be formed to be substantially the same as an adjacent outer shape of the front plate (202). In one embodiment (not shown), the gap between the outer edge of the display (220) and the outer edge of the front plate (202) may be formed to be substantially the same in order to expand the area over which the display (220) is visually exposed.

[0073] In one embodiment (not shown), a recess or opening may be formed in a portion of a screen display area of ​​the display (220), and at least one of an audio module (214), a sensor module (204), a camera module (205), and a light-emitting element (206) may be included that are aligned with the recess or opening. In one embodiment (not shown), at least one of an audio module (214), a sensor module (204), a camera module (205), a fingerprint sensor (not shown), and a light-emitting element (206) may be included on a back surface of the screen display area of ​​the display (220). In one embodiment (not shown), the display (220) may be coupled to or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field-type stylus pen. In one embodiment, at least a portion of the sensor modules (204, 219) and / or at least a portion of the key input device (217) may be disposed in the first areas (210D) and / or the second areas (210E).

[0074] The audio module (203, 207, 214) may include a microphone hole (203) and a speaker hole (207, 214). The microphone hole (203) may have a microphone disposed therein for acquiring external sound, and in one embodiment, multiple microphones may be disposed so as to detect the direction of the sound. The speaker hole (207, 214) may include an external speaker hole (207) and a receiver hole (214) for calls. In one embodiment, the speaker hole (207, 214) and the microphone hole (203) may be implemented as a single hole, or a speaker may be included without the speaker hole (207, 214) (e.g., a piezo speaker).

[0075] The sensor module (204, 219) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. The sensor module (204, 219) may include, for example, a first sensor module (204) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or a third sensor module (219) and / or a fourth sensor module (e.g., a fingerprint sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor may be disposed on not only the first surface (210A) (e.g., the display (220)) of the housing (210), but also the second surface (210B) or the side surface (210C). The electronic device (101) may further include, for example, at least one of a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0076] The camera modules (205, 212, 213) may include a first camera device (205) disposed on a first side (210A) of the electronic device (101), a second camera device (212) disposed on a second side (210B), and / or a flash (213). The camera devices (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (213) may include, for example, a light-emitting diode or a xenon lamp. In one embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device (101). In one embodiment, the flash (213) may emit infrared light, and the infrared light emitted by the flash (213) and reflected by the subject may be received through the third sensor module (219). The electronic device (101) or the processor of the electronic device (101) may detect depth information of the subject based on the point in time when the infrared light is received by the third sensor module (219).

[0077] The key input device (217) may be disposed on a side surface (210C) of the housing (210). In one embodiment, the electronic device (101) may not include some or all of the above-mentioned key input devices (217), and the key input devices (217) that are not included may be implemented in another form, such as a soft key, on the display (220). In one embodiment, the key input device may include a sensor module disposed on a second surface (210B) of the housing (210).

[0078] The light-emitting element (206) may be disposed, for example, on the first surface (210A) of the housing (210). The light-emitting element (206) may provide, for example, status information of the electronic device (101) in the form of light. In one embodiment, the light-emitting element (206) may provide a light source that is linked to the operation of, for example, the camera module (205). The light-emitting element (206) may include, for example, an LED, an IR LED, and a xenon lamp.

[0079] The connector holes (208, 209) may include a first connector hole (208) that can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (e.g., an earphone jack) (209) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.

[0080] FIG. 4 is an exploded perspective view showing the front side of an electronic device according to one embodiment of the present disclosure. FIG. 5 is an exploded perspective view showing the rear side of an electronic device according to one embodiment of the present disclosure.

[0081] Referring to FIGS. 4 and 5, the electronic device (101) (e.g., the electronic device (101) of FIG. 1 or 2) may include a side structure (310), a first support member (311) (e.g., a bracket), a front plate (320) (e.g., the front plate (202) of FIG. 1), a display (330) (e.g., the display (220) of FIG. 1), at least one printed circuit board (or board assembly) (340a, 340b), a battery (350), a second support member (360) (e.g., a rear case), an antenna, a camera assembly (307), and a rear plate (380) (e.g., the rear plate (211) of FIG. 2). When including a plurality of printed circuit boards (340a, 340b), the electronic device (101) can electrically connect different printed circuit boards by including at least one flexible printed circuit board (340c). For example, the printed circuit boards (340a, 340b) can include a first circuit board (340a) positioned above (e.g., in the +Y-axis direction) the battery (350) and a second circuit board (340b) positioned below (e.g., in the -Y-axis direction), and the flexible printed circuit board (340c) can electrically connect the first circuit board (340a) and the second circuit board (340b).

[0082] According to one embodiment, the electronic device (101) may omit at least one of the components (e.g., the first support member (311) or the second support member (360)) or may additionally include other components. At least one of the components of the electronic device (101) may be identical or similar to at least one of the components of the electronic device (101) of FIG. 1 or FIG. 2, and any redundant description thereof will be omitted below.

[0083] The first support member (311) may be provided in a flat shape at least in part. In one embodiment, the first support member (311) may be disposed inside the electronic device (101) and connected to the side structure (310), or may be formed integrally with the side structure (310). The first support member (311) may be formed of, for example, a metallic material and / or a non-metallic (e.g., polymer) material. When the first support member (311) is formed at least partially of a metallic material, the side structure (310) or a portion of the first support member (311) may function as an antenna. The first support member (311) may have a display (330) coupled to one surface and a printed circuit board (340a, 340b) coupled to the other surface. A printed circuit board (340a, 340b) may be equipped with a processor (e.g., processor (120) of FIG. 1), a memory (e.g., memory (130) of FIG. 1), and / or an interface (e.g., interface (177) of FIG. 1). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0084] In one embodiment, the housing (301) may include a first support member (311) and a side structure (310). In one embodiment, the housing (301) may be understood as a structure for accommodating, protecting, or arranging a printed circuit board (340a, 340b) or a battery (350). In one embodiment, the housing (301) may be understood as including structures that can be visually or tactilely perceived by a user in the appearance of the electronic device (101), for example, a side structure (310), a front plate (320), and / or a rear plate (380). For example, the housing (301) may include structures forming the appearance of the electronic device (101), for example, the side structure (310), the front plate (320), and the rear plate (380). The housing (301) may be the same as the housing (210) described with reference to FIGS. 2 and 3 . In one embodiment, the 'front or rear side of the housing (301)' may refer to the first side (210A) of FIG. 1 or the second side (210B) of FIG. 2. In one embodiment, the first support member (311) is disposed between the front plate (320) (e.g., the first side (210A) of FIG. 1) and the rear plate (380) (e.g., the second side (210B) of FIG. 2), and may function as a structure for arranging electrical / electronic components such as printed circuit boards (340a, 340b) or camera assemblies (307).

[0085] The memory may include, for example, volatile memory or non-volatile memory.

[0086] The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (101) to an external electronic device, for example, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0087] The second support member (360) may include, for example, an upper support member (360a) or a lower support member (360b). In one embodiment, the upper support member (360a) may be arranged to surround a printed circuit board (340a, 340b) (e.g., the first circuit board (340a)) together with a portion of the first support member (311). For example, the upper support member (360a) of the second support member (360) may be arranged to face the first support member (311) with the first circuit board (340a) interposed therebetween. In one embodiment, the lower support member (360b) of the second support member (360) may be arranged to face the first support member (311) with the second circuit board (340b) interposed therebetween. Circuit devices implemented in the form of integrated circuit chips (e.g., processors, communication modules, or memories) or various electrical / electronic components may be placed on printed circuit boards (340a, 340b), and according to an embodiment, the printed circuit boards (340a, 340b) may be provided with an electromagnetic shielding environment from the second support member (360). In one embodiment, the lower support member (360b) may be utilized as a structure on which electrical / electronic components such as a speaker module or an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be placed. In one embodiment, electrical / electronic components such as a speaker module or an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be placed on an additional printed circuit board (not shown). For example, the lower support member (360b) may be arranged to surround an additional printed circuit board (e.g., a second printed circuit board (340b)) together with another portion of the first support member (311). An additional printed circuit board not shown or a speaker module or interface arranged on the lower support member (360b) may be arranged corresponding to the audio module (207) or connector holes (208, 309) of FIG. 2.

[0088] The battery (350) is a device for supplying power to at least one component of the electronic device (101), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (350) may be disposed substantially on the same plane as, for example, the printed circuit boards (340a, 340b). The battery (350) may be disposed integrally within the electronic device (101), or may be disposed detachably from the electronic device (101).

[0089] Although not shown, the antenna may include a conductive pattern implemented on the surface of the second support member (360), for example, through a laser direct structuring process. In one embodiment, the antenna may include a printed circuit pattern formed on the surface of a thin film, and the thin film-type antenna may be disposed between the back plate (380) and the battery (350). The antenna may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In one embodiment, another antenna structure may be formed by the side structure (310) and / or a portion or combination of the first support member (311).

[0090] In one embodiment, the camera assembly (307) may include at least one camera module. Within the electronic device (101), the camera assembly (307) (or at least one camera module) may receive at least a portion of light incident through an optical hole or camera window. In one embodiment, the camera assembly (307) may be disposed on the first support member (311) at a location adjacent to the printed circuit board (340a, 340b). In one embodiment, the camera module(s) of the camera assembly (307) may be generally aligned with one of the camera windows and may be at least partially wrapped around the second support member (360) (e.g., the upper support member (360a)).

[0091] In one embodiment, the first support member (311) may be referred to as a “support member.” The support member (311) may include a mounting portion (3111). The mounting portion (3111) may include a recess recessed from one surface of the support member (311). For example, the battery (350) may be placed in the mounting portion (3111). The mounting portion (3111) may be a portion of the support member (311) that provides a space in which the battery (350) is placed. The mounting portion (3111) may have a groove shape recessed from one surface of the support member (311).

[0092] Referring to FIGS. 6 to 22 below, each component included in the electronic device will be described in more detail.

[0093] FIG. 6 is a cross-sectional view of a portion of a housing component according to one embodiment of the present disclosure. FIG. 7 is a perspective view of a first portion according to one embodiment of the present disclosure.

[0094] Referring to FIGS. 6 and 7, the housing part (400) may include a first portion (410) and a second portion (420).

[0095] According to one embodiment, the first part (410) may be a part that can be visually and / or tactilely recognized by a user on the exterior of the electronic device (101). According to one embodiment, at least a part of the first part (410) may be in a form that surrounds at least a part of the second part (420). Therefore, in order to secure the rigidity of the electronic device (101), the first part (410) may include a metal material. For example, the metal material of the first part (410) may be, for example, stainless steel (SS 316, SS 316L), a titanium alloy material (e.g., TI6AL4V, TI6AL4V ELI, etc.), pure titanium (CpTi), or an aluminum alloy (e.g., AlSi10Mg). However, the present invention is not necessarily limited thereto, and according to an embodiment, the first part (410) may also include a non-metallic (e.g., resin) material.

[0096] According to one embodiment, the second part (420) may be disposed relatively inside the electronic device (101) compared to the first part (410) forming the exterior of the electronic device (101). According to one embodiment, the second part (420) may correspond to the inner surface of the housing part (400) surrounding the interior space of the electronic device (101). According to one embodiment, the second part (420) may include a material having a lower rigidity than the first part (410). According to one embodiment, the second part (420) may include a material having a lower density than the material of the first part (410). The second part (420) may include a material such as a metal material such as aluminum (AL), stainless steel (SUS), titanium (TiTan), ceramic, and an amorphous metal, and / or a non-metallic (e.g., resin) material.

[0097] According to one embodiment, the first part (410) may be formed of a metallic material, and the second part (420) may be formed of a non-metallic material, thereby providing a housing component (400) in which different materials are joined by a joining portion (422). According to another embodiment, both the first part (410) and the second part (420) may be formed of a metallic material, or both the first part (410) and the second part (420) may be formed of a non-metallic material. In this case, even if the first part (410) and the second part (420) are the same metal or non-metal, they may be formed of different metallic materials (e.g., the first part (410) is formed of a metallic material having higher rigidity than the second part (420), or they may be formed of different non-metallic materials (e.g., the first part (410) is formed of a non-metallic material having higher rigidity than the second part (420).

[0098] The second part (420) may be formed by injecting a molten material (e.g., molten metal or molten resin) into the first cavity (412) to form the second part (420), thereby joining the first part (410) and the second part (420) and thereby forming a joining portion (422) of the second part (420) to be described later. As described above, the first part (410) and the second part (420) may be joined to form a housing part (400).

[0099] According to one embodiment, since the first part (410) and the second part (420) having differences in rigidity and / or density are joined together, the housing part (400) can effectively protect the internal components of the electronic device (101), while the electronic device (101) can be made lighter by using lightweight materials inside.

[0100] In the embodiments of FIGS. 6 and 7 and below, the first cavity (412) is formed in the first part (410) constituting the exterior of the electronic device (101), but the present invention is not limited thereto. For example, the housing component (400) of the present disclosure may have a cavity (e.g., the first cavity (412, 512)) formed in the second part (420). According to one embodiment, a molten material for forming the first part (410) may be injected into the cavity (e.g., the first cavity (412, 512)) formed in the second part (420) and then solidified, so that the second part (420) and the first part (410) may be combined.

[0101] Referring to FIGS. 6 and 7, the first portion (410) may include a first body (411) and a first cavity (412).

[0102] According to one embodiment, the first body (411) may include a first body frame (4111) in which a first cavity (412) is formed. According to one embodiment, the first body (411) may further include a protrusion (4112) formed to protrude in a first direction (e.g., -X direction) from the first body frame (4111). The first body frame (4111) may include a rigid metal material to protect the interior of the electronic device (101). The protrusion (4112) may be formed to protrude in the first direction (e.g., -X direction) from the first body frame (4111). The protrusion (4112) may prevent the second part (420) from contacting other internal components of the electronic device (101) when the second part (420) is coupled with the first part (410). Specifically, when a molten material is injected into the first cavity (412) to form a shape of the second part (420), the molten material can be prevented from coming into contact with a part other than the first part (410).

[0103] According to one embodiment, the first cavity (412) may refer to a space formed inside the first part (410). The first cavity (412) may include a first opening (4121), a second opening (4122) spaced apart from the first opening (4121), and a first connecting hole (4123) formed between the first opening (4121) and the second opening (4122).

[0104] According to one embodiment, the first opening (4121) and the second opening (4122) may be formed by being sunken in the first direction (e.g., + X direction) of the first portion (410), and a molten material for forming the second portion (420) may be injected into the first portion (410) through the first opening (4121) and / or the second opening (4122), and the molten material may be solidified in the first cavity (412) to form a joining portion (422) to be described later.

[0105] According to one embodiment, the diameter of the cross-section of the first cavity (412) may be from 0.01 mm to 10 mm.

[0106] If the cross-sectional diameter of the first cavity (412) is 0.01 mm or less, it may be difficult to inject molten material to form the shape of the second part (420), and if the cross-sectional diameter of the first cavity (412) is 10 mm or more, as the electronic device (101) is miniaturized and lightweight, it may be difficult to utilize the housing component (400) in the miniaturized electronic device (101).

[0107] However, in the present embodiment and the following examples, the diameter of the cross-section of the first cavity (412) is described as being 0.01 mm to 10 mm, but depending on the size and type of the electronic device (101), the diameter of the cross-section of the first cavity (412) may be 0.1 mm or less or 10 mm or more.

[0108] In addition, although the cross-sectional diameters of the first opening (4121), the second opening (4122) and / or the first connection hole (4123) are described as being the same in the present embodiment and the following embodiments, this is not limited thereto, and the cross-sectional diameters of the first opening (4121), the second opening (4122) and / or the first connection hole (4123) may be different.

[0109] According to one embodiment, at least a portion of the first connection hole (4123) may include a curve. If at least a portion of the first connection hole (4123) includes a curve, the surface area of ​​the first inner peripheral surface of the first portion (410) may be formed to be wider than if at least a portion of the first connection hole (4123) does not include a curve.

[0110] As the surface area of ​​the first inner surface of the first part (410) increases, the bonding area between the first cavity (412) and the bonding portion (422) described later can increase. As a result, the first part (410) and the second part (420) can be bonded more strongly.

[0111] According to one embodiment, if at least a portion of the first cavity (412) is formed as a curve, the molten material for forming the shape of the second portion (420) can be easily injected into the first cavity (412), and if the first cavity (412) is formed as a whole curve, the molten material for forming the shape of the second portion (420) can easily fill the entire first cavity (412).

[0112] According to one embodiment, the first connecting hole (4123) is described as a first cavity (412) having a circular shape, and two openings (e.g., a first opening (4121) and a second opening (4122)) are formed in each of the first cavities (412), but the present invention is not limited thereto. For example, as shown in FIG. 21 and / or FIG. 22 described below, at least some of the cavities among the plurality of cavities (e.g., the first cavities (612, 712) of FIGS. 21 and 22) may be formed in a shape including two or more openings (e.g., the first openings (6121, 7121) of FIGS. 21 and 22).

[0113] In addition, when the joining portion (422) to be described later fills the entire first cavity (412) and the first cavity (412) and the joining portion (422) to be described later are joined, the joining area between the first cavity (412) and the joining portion (422) to be described later increases, so the first part (410) and the second part (420) can be joined more strongly.

[0114] According to one embodiment, the present invention and the following embodiments may be exemplified by the molten material for forming the second portion (420) filling the entire first cavity (412), but the present invention is not limited thereto, and may also fill a portion of the first cavity (412) depending on the shape of the first cavity (412).

[0115] According to one embodiment, the second part (420) may include a second body (421) and a connecting portion (422). The second body (421) may have a connecting portion (422) formed on one side thereof, and the connecting portion (422) may be disposed in the first connecting hole (4123) by penetrating the first opening (4121) and the second opening (4122) of the first cavity (412).

[0116] According to one embodiment, a molten material for forming a shape of the second part (420) is injected into the first cavity (412) and solidified, and a portion of the solidified second part (420) penetrating the first cavity (412) may be referred to as a joining part (422), and the joining part (422) may be formed according to the shape of the first cavity (412). Accordingly, the joining area between the first part (410) and the second part (420) may vary depending on the shape of the first cavity (412), and thus the joining force between the first part (410) and the second part (420) may vary.

[0117] According to one embodiment, in FIGS. 6 and 7, one first cavity (412) may be formed in the first part (410) of the housing component (400), but this is not limited thereto, and in the embodiments described below, a plurality of cavities (e.g., the first cavity (512)) may be formed in the first part (e.g., the first part (510)).

[0118] FIG. 8 is a drawing showing a portion of a housing component according to one embodiment of the present disclosure.

[0119] Referring to FIG. 8, the housing component (500) may include a first portion (510) and a second portion (520, 530). In FIG. 8, the first portion (510) is illustrated as a part of the side structure (310) and the second portion (520, 530) is illustrated as a part of the rear plate (380), but the present invention is not limited thereto, and the housing component (500) may be a part of a structure that a user can visually or tactilely perceive on the exterior of the electronic device (101). For example, it may be a part of structures forming the exterior of the electronic device (101) (e.g., the side structure (310), the front plate (320), the rear plate (380)).

[0120] FIG. 9 is a cross-sectional view illustrating a portion of a housing component of an electronic device along line A-A' of FIG. 8, according to one embodiment of the present disclosure. FIG. 10 is a perspective view of a first portion, according to one embodiment of the present disclosure.

[0121] Referring to FIGS. 9 and 10, the housing component (500) may include a first portion (510) and a second portion (520) including a plurality of first cavities (512).

[0122] According to one embodiment, the first portion (510) may include a first body (511) and a first cavity (512). In addition, the first body (511) may include a first body frame (5111) and a protrusion (5112), and the first cavity (512) may include a first opening (5121) and a second opening (5122) spaced apart from the first opening (5121).

[0123] According to one embodiment, a plurality of first cavities (512) having a regular structure may be repeatedly formed in the first portion (510), and some of the first cavities (512) may intersect each other, but the shape of the first cavities (512) is not limited thereto. For example, as shown in FIG. 21 and / or FIG. 22 described below, the plurality of cavities (e.g., the first cavities (612, 712) of FIG. 21 and FIG. 22) may have an irregular shape, and at least some of the cavities among the plurality of cavities may have a shape in which they intersect each other.

[0124] FIG. 11 is a drawing showing a portion of the first part cut along line A-A' of FIG. 10 according to one embodiment of the present disclosure.

[0125] Referring to FIG. 11, the first cavity (512) may include a first opening (5121), a second opening (5122), a first connecting hole (5123), a first inner surface (5124) of the first portion (510), and a first intersection area (5125).

[0126] According to one embodiment, each of the internal spaces of the plurality of first cavities (512) may be referred to as a first connecting hole (5123), and a molten material for forming a shape of the second part (520) is injected into the first cavity (512) through the plurality of first openings (5121) and / or second openings (5122), and the molten material is combined with the first inner surface (5124) of the first part (510), so that the first part (510) and the second part (520) may be combined.

[0127] According to one embodiment, at least a portion of a plurality of first connection holes (5123) may intersect, and at this time, the space where the first connection holes (5123) intersect may be referred to as a first intersection area (5125). When the first intersection area (5125) is formed, the surface area of ​​the first inner peripheral surface (5124) of the first part (510) increases, and thus the first part (510) and the second part (520) may be more strongly coupled. Therefore, as the number of first intersection areas (5125) increases, the first part (510) and the second part (520) may be more strongly coupled.

[0128] FIG. 12 is a diagram showing a state before a second part is coupled with a first part and after a second part is coupled with a first part, according to one embodiment of the present disclosure.

[0129] Referring to FIG. 12, in relation to the combination of the first part (510) and the second part (520), the state before and after the second part (520) is combined with the first part (510) can be identified.

[0130] According to one embodiment, the shape of the first part (510) can be formed through a lamination process. If the shape of the first part (510) is formed through a lamination process, the first cavity (512) can be implemented not only on the surface of the first part (510) but also inside the first part (510), and the first cavity (512) of various shapes can be implemented inside the first part (510) without any separate restrictions.

[0131] According to one embodiment, when utilizing a lamination process, a first cavity (512) for bonding with a second portion (520) can be formed without performing any additional pretreatment on the first portion (510).

[0132] According to one embodiment, in order to implement the first cavity (512) inside, a high-precision layer-by-layer method may be applied, and among them, a PBF (Powder Bed Fusion) process may be applied.

[0133] The PBF process is a layering process that selectively melts or sinteres powdered materials to solidify them. After the shape of the first part (510) is layered through the PBF process, a heat treatment process may be performed to improve the durability and corrosion resistance of the layered first part (510). The roughness of the shape formed through the PBF process can generally have a value of 0.05 to 2 μm, and thus, the roughness of the first part (510) can have a value of 0.05 to 2 μm.

[0134] In the present invention and the following embodiments, a lamination process is used to form the shape of the first part (510), but the present invention is not limited thereto, and other processes (e.g., injection molding process, cutting process) may be used as long as the first part (510) including a plurality of first cavities (512) of the present invention can be implemented.

[0135] According to one embodiment, after forming the shape of the first part (510), a molten material for forming the shape of the second part (520) may be injected into the first cavity (512) of the first part (510) and then solidified to form the shape of the second part (520).

[0136] More specifically, a mold in which a third cavity is formed to form a second part (520) is placed adjacent to the first part (510) in which a first cavity (512) is formed, and a molten material is injected into the first cavity (512) and the third cavity, and then solidified to form the second part (520).

[0137] In one embodiment, an insert die casting process may be used to form the shape of the second portion (520). Specifically, through the insert die casting process, the molten material may be solidified in the first cavity (512) and the third cavity, thereby joining the first portion (510) and the second portion (520).

[0138] In the present invention and the following examples, the shape of the second part (520) is formed by an insert die casting process, but the present invention is not limited thereto. If at least a portion of the second part (520) is injected into the first cavity (512) of the first part (510) of the present invention so that the first part (510) and the second part (520) can be joined, the second part (520) can be formed by another process (e.g., a lamination process, an injection process).

[0139] In addition, when different materials are combined in the housing manufacturing process of an electronic device (101), a bonding force between the different materials is generally required to be at least 20 MPa in all areas. As shown in FIG. 12, when a molten material for forming the shape of the second part (520) is injected into the first cavity (512) and combined, the first part (510) and the second part (520) of the housing component (500) can be combined with a bonding force of at least 20 MPa, which is a bonding force generally required in the housing of an electronic device (101).

[0140] Fig. 13 is a cross-sectional view of a comparative example of a housing component according to one embodiment of the present disclosure. Fig. 14 is a cross-sectional view of a comparative example of a housing component according to one embodiment of the present disclosure.

[0141] Referring to FIGS. 13 and 14, these are illustrations for determining the difference in bonding strength depending on the shape of the first part (510), the second part (520), and / or the first cavity (512). Comparing the comparative examples and the embodiment of FIG. 10, when two or more openings (e.g., the first opening (5121) and the second opening (5122)) are formed in the first cavity (512), the first part (510) and the second part (520) can be bonded more strongly.

[0142] Specifically, when the materials of the first part (510; 510a; 510b) and the second part (520; 520a; 520b) and the depth of the first cavity (512; 512a; 512b) are the same, the bonding force of the embodiment of FIG. 8 can be 1.2 times stronger than the bonding force of the comparative example of FIG. 13, and 1.65 times stronger than the bonding force of the comparative example of FIG. 14.

[0143] For example, when the material of the first part is titanium, the material of the second part is aluminum, and the depth of the first cavity is 0.5 mm to 2.0 mm, the bonding force of the embodiment of Fig. 10 may be 132 MPa, the bonding force of the comparative example of Fig. 13 may be 110 MPa, and the bonding force of the comparative example of Fig. 14 may be 80 MPa.

[0144] In addition, since the first cavity (512a; 512b) of the comparative examples of FIGS. 13 and 14 has a shape implemented on the surface, a process of pre-processing the surface may be necessary after implementing the shape of the first cavity (512a; 512b), and the first part (510a; 510b) and the second part (520) may be separated even after joining.

[0145] FIG. 15 is a drawing showing a portion of a housing component according to one embodiment of the present disclosure. FIG. 16 is a drawing showing a portion of a housing component of an electronic device cut along line B-B' of FIG. 15 according to one embodiment of the present disclosure.

[0146] Referring to FIGS. 15 and 16, the first portion (510) of the housing component (500) may further include a second cavity (513) formed in the first cavity (512).

[0147] In one embodiment, as the second cavity (513) is further formed in the first portion (510), the depth of injection of the molten material for forming the shape of the second portion (520) can be increased. This allows for stronger bonding between the first portion (510) and the second portion (520).

[0148] FIG. 17 is a cross-sectional view of a first portion according to one embodiment of the present disclosure.

[0149] Referring to FIG. 17, the second cavity (513) may include a first connection hole opening (5131), a second connection hole opening (5132), a second connection hole (5133), a second inner surface (5134) of the first portion (510), and a second intersection area (5135).

[0150] According to one embodiment, the second cavity (513) may refer to a space formed inside the first cavity (512). In addition, a plurality of second cavities (513) may be formed in the first portion (510), and at least some of the plurality of second cavities (513) may be partially formed in a curved shape. In addition, at least some of the plurality of second cavities (513) may include two or more openings (e.g., a first connection hole opening (5131), a second connection hole opening (5132)).

[0151] In the present embodiment and the following embodiments, at least a portion of the second cavity (513) is formed in a circular shape, and two openings (e.g., a first connection hole opening (5131), a second connection hole opening (5132)) are formed in each of the second cavities (513), but this is not limited thereto. For example, a cavity formed inside the first part (510) excluding a cavity formed on the surface of the first part (510) (e.g., a first cavity (512)) and into which a molten material for forming a shape of the second part (520) can be injected may be referred to as a second cavity (513).

[0152] According to one embodiment, the first connection hole opening (5131) and the second connection hole opening (5132) may be formed on the first inner surface (5124) of the first portion (510). In addition, each inner space of the plurality of second cavities (513) may be referred to as a second connection hole (5133).

[0153] According to one embodiment, a molten material for forming a second portion (520) is injected into the second connecting hole (5133) and is combined with the second inner surface (5134) of the first portion (510) so that the first portion (510) and the second portion (520) can be combined.

[0154] In addition, at least a portion of a plurality of second connecting holes (5133) may intersect, and at this time, the space where the second connecting holes (5133) intersect may be referred to as a second intersection area (5135). When the second intersection area (5135) is formed, the area where the connecting portion (522) is connected may be wider, like the first intersection area (5125), and accordingly, the first part (510) and the second part (520) may be connected more strongly.

[0155] When a second cavity (513) is additionally implemented in the first part (510), the first part (510) and the second part (520) can be more strongly coupled. Specifically, the second cavity (513) can be additionally formed in the first part (510) to prevent the first part (510) and the second part (520) from being separated when the electronic device (101) is dropped.

[0156] FIG. 18 is a perspective view illustrating a portion of a housing component according to an embodiment of the present disclosure. FIG. 19 is a cross-sectional view illustrating a portion of a housing component of an electronic device along line C-C' of FIG. 18 according to an embodiment of the present disclosure. FIG. 20 is a cross-sectional view illustrating a portion of a housing component of an electronic device along line D-D' of FIG. 18 according to an embodiment of the present disclosure.

[0157] Referring to FIGS. 18 to 20, the second portions (520, 530) may include different materials.

[0158] According to one embodiment, a part of the second part (520, 530), for example, the 2-1 part (520), may be made of a metal material, and the 2-2 part (530) may be made of a non-metal material through an injection molding process. In addition, regardless of the material of the second part (520, 530), the first cavity (512) of the first part (510) may be formed, or the first cavity (512) and the second cavity (513) may be formed, and a molten material for forming the second part (520, 530) may be injected into the first cavity (512), or injected into the first cavity (512) and the second cavity (513), so that the first part (510) and the second part (520, 530) may be joined.

[0159] FIG. 21 is a cross-sectional view of a housing component according to one embodiment of the present disclosure. FIG. 22 is a cross-sectional view of a housing component according to one embodiment of the present disclosure.

[0160] Referring to FIGS. 21 and 22, an irregular cavity (612; 712) as illustrated may be implemented in the first portion (610; 710).

[0161] According to one embodiment, as shown in FIGS. 21 and 22, even when a high-strength metal is used for the frame of the electronic device (101), the cavity (612; 712) can be formed in an irregular shape in order to reduce material costs and reduce the weight of the electronic device (101).

[0162] Referring to FIG. 21, since the shape of the cavity (612) has an irregular shape, the embodiment of FIG. 21 has a bonding force similar to the comparative example of FIG. 13, but the injection depth of the molten material for forming the second portion (620) may be reduced.

[0163] Specifically, even though the embodiment of FIG. 21 and the comparative example of FIG. 13 have similar bonding strengths of about 110 MPa, the injection depth of the molten material for forming the second part (620) of the embodiment of FIG. 21 may be about 0.5 mm shorter than that of the comparative example of FIG. 13.

[0164] When the injection depth of the molten material is shortened, the width of the housing part (600) can be reduced, thereby miniaturizing and / or reducing the weight of the electronic device (101).

[0165] Referring to FIG. 22, by changing the shape of the cavity (712), the embodiment of FIG. 22 has the injection depth of the molten material for forming the second portion (720) as the comparative example of FIG. 13, but the embodiment of FIG. 22 can have a bonding force that is 1.2 times greater.

[0166] Specifically, even though the embodiment of FIG. 22 and the comparative example of FIG. 13 have similar injection depths of the molten material to form the second portion (720), the embodiment of FIG. 22 can have a bonding strength that is 1.2 times greater than that of the comparative example of FIG. 13.

[0167] Referring to FIGS. 21 and 22, if the bonding force is the same, since the shape of the cavity (612, 712) has an irregular shape, the depth at which the molten material for forming the second part (620; 720) penetrates can be shortened, thereby reducing the width of the housing part (600; 700), thereby miniaturizing and / or reducing the weight of the electronic device (101).

[0168] The present disclosure relates to an electronic device. According to one embodiment of the present disclosure, an electronic device including a housing part (400; 500) comprises a first part (410; 510) including a first body (411; 511) and a first cavity (412; 512) formed in the first body, and a second part (420; 520) including a second body (421; 521) and a coupling part (422; 522) coupled to the first part (410; 520), wherein the first cavity (412; 512) comprises a first opening (4121; 5121) formed in a surface of the first part (410, 510) and a second opening (4122; 5122) formed in a surface of the first part (410, 510) and spaced apart from the first opening; An electronic device may be provided, comprising a first connection hole (4123; 5123) formed between the first opening and the second opening, and the coupling portion (422; 522) is disposed in the first connection hole (4123; 5123) by penetrating the first opening (4121; 5121) and / or the second opening (4122; 5122) of the first cavity (412; 512).

[0169] According to one embodiment, the electronic device may further include a first intersection area (5125) in which a plurality of the first cavities (512) are formed and at least a portion of the plurality of first cavities (512) intersect.

[0170] According to one embodiment, the first part (410; 510) may include a first inner surface (4124; 5124) corresponding to a first connecting hole, and the coupling part (422; 522) may be an electronic device that couples with the first inner surface (4124; 5124) of the first part.

[0171] According to one embodiment, the first part (510) further includes a second cavity (513), the second cavity (513) including a first connection hole opening (5131) formed in a first inner surface (5124) of the first part, a second connection hole opening (5132) spaced apart from the first connection hole opening (5131), and a second connection hole (5133) formed between the first connection hole opening and the second connection hole opening, and the coupling portion (522) may be an electronic device disposed in the first connection hole (5123) and / or the second connection hole (5133).

[0172] According to one embodiment, the electronic device may have at least a portion of the first connecting hole (4123; 5123) formed in a curved shape.

[0173] According to one embodiment, the second cavity (513) may be an electronic device including a plurality of second cavities (513), and further including a second intersection area (5135) where two adjacent second cavities among the plurality of second cavities (513) intersect.

[0174] According to one embodiment, the electronic device may have at least a portion of the second connecting hole (5133) formed in a curved shape.

[0175] According to one embodiment, the second part may be an electronic device including a 2-1 part (420; 520) made of a metallic material and a 2-2 part (430; 530) made of a non-metallic material.

[0176] According to one embodiment, the electronic device may be configured to form the shape of the first part through a lamination process.

[0177] According to one embodiment, the electronic device may be formed to have a shape of the first part through a PBF (Powder Bed Fusion) lamination process.

[0178] According to one embodiment, the electronic device may have a cross-sectional diameter of the first opening (4121; 5121) and the second opening (4122; 5122) of 0.01 mm to 10 mm.

[0179] According to one embodiment, the electronic device may have a cross-sectional diameter of the first cavity of 0.01 mm to 10 mm.

[0180] In one embodiment, the electronic device may have a density of the first portion greater than a density of the second portion.

[0181] According to one embodiment, the second part may be an electronic device comprising at least one of aluminum (AL), stainless steel (SUS), titanium (TiTan), ceramic, and amorphous metal.

[0182] According to one embodiment, an electronic device according to any one of claims 1 to 14 may include at least one electronic component and a housing component according to claims 1 to 14, wherein the housing component is arranged to surround the at least one electronic component.

[0183] The present disclosure relates to a housing component (400; 500). According to one embodiment of the present disclosure, a housing component (400; 500) comprises a first part (410; 510) including a first body (411; 511) and a first cavity (412; 512) formed in the first body, and a second part (420; 520) including a second body (421; 521) and a coupling part (422; 522) coupled to the first part (410; 520), wherein the first part surrounds at least a part of the second part, and the first cavity (412; 512) comprises a first opening (4121; 5121) formed in a surface of the first part (410, 510) and a second opening formed in a surface of the first part (410, 510) and spaced apart from the first opening. An opening (4122; 5122); a first connection hole (4123; 5123) formed between the first opening and the second opening, and the coupling portion (422; 522) can be provided as a housing component disposed in the first connection hole (4123; 5123) by penetrating the first opening (4121; 5121) and the second opening (4122; 5122) of the first cavity (412; 512).

[0184] According to one embodiment, the housing part may be formed with a plurality of first cavities (512), and further includes a first intersection area (5125) where at least a portion of the plurality of first cavities (512) intersect.

[0185] According to one embodiment, the connecting hole includes a first inner peripheral surface (5124) of a first part that is coupled with a coupling portion, the first part further includes a second cavity (513), the second cavity (513) includes a first connecting hole opening (5131) formed in the first inner peripheral surface (5124) of the first part, a second connecting hole opening (5132) spaced apart from the first connecting hole opening (5131), and a second connecting hole (5133) formed between the first connecting hole opening and the second connecting hole opening, and the coupling portion (522) may be a housing part disposed in the first connecting hole (5123) and the second connecting hole (5133).

[0186] The present disclosure relates to a method for manufacturing a housing component (400; 500). According to one embodiment of the present disclosure, a manufacturing method can be provided, including the steps of: providing a first part having a first cavity formed therein, including a first opening and a second opening; arranging a mold having the first cavity formed therein adjacent to the first part; injecting a molten material into the first cavity and the third cavity; and solidifying the molten material injected into the first cavity and the third cavity to provide a second part joined to the first part.

[0187] According to one embodiment, the act of providing a first part having a first cavity formed therein, which includes a first opening and a second opening, may be a manufacturing method including an act of depositing powder on a mold for forming a shape of the first part, an act of melting the powder, and an act of heat-treating the first part after forming the shape of the first part.

[0188] According to one embodiment, when manufacturing a housing of an electronic device, a phenomenon of weight increase can be prevented when using a metal having a higher density than a metal generally used to improve the strength of the electronic device.

[0189] In one embodiment, a cavity structure including two or more openings may be used in the first portion to provide a higher bonding strength than conventional dissimilar metal joining methods.

[0190] The electronic device described through the embodiments of the present disclosure described above is not limited to the above-described embodiments and drawings, and it will be apparent to a person having ordinary skill in the art to which the present invention pertains that various substitutions, modifications, and changes are possible within the technical scope of the present invention.

Claims

1. In an electronic device including a housing part (400; 500), A first part (410; 510) including a first body (411; 511) and a first cavity (412; 512) formed in the first body; and A second part (420; 520) including a second body (421; 521) and a coupling part (422; 522) coupled to the first part (410; 520); The first cavity (412; 512) includes a first opening (4121; 5121) formed on the surface of the first part (410, 510) and a second opening (4122; 5122) formed on the surface of the first part (410, 510) and spaced apart from the first opening; and a first connection hole (4123; 5123) formed between the first opening and the second opening. An electronic device in which the above-mentioned connecting portion (422; 522) is disposed in the first connecting hole (4123; 5123) through the first opening (4121; 5121) and / or the second opening (4122; 5122) of the first cavity (412; 512).

2. In paragraph 1, The above first cavity (512) is formed in multiple numbers, An electronic device further comprising a first intersection area (5125) in which at least a portion of the plurality of first cavities (512) intersect.

3. In paragraph 1 or 2, The first part (410; 510) includes a first inner surface (4124; 5124) corresponding to the first connecting hole, An electronic device in which the above-mentioned connecting portion (422; 522) is connected to the first inner surface (4124; 5124) of the first part.

4. In any one of paragraphs 1 to 3, The above first part (510) is, Including a second cavity (513), The second cavity (513) includes a first connection hole opening (5131) formed on the first inner surface (5124) of the first portion, a second connection hole opening (5132) spaced apart from the first connection hole opening (5131), and a second connection hole (5133) formed between the first connection hole opening and the second connection hole opening. An electronic device in which the above-mentioned connecting portion (522) is disposed in the first connecting hole (5123) and / or the second connecting hole (5133).

5. In any one of paragraphs 1 to 4, An electronic device, wherein at least a portion of the first connecting hole (4123; 5123) is curved.

6. In any one of paragraphs 1 to 5 The above second cavity (513) is Containing a plurality of second cavities (513), An electronic device further comprising a second intersection area (5135) in which two adjacent second cavities among the plurality of second cavities (513) intersect.

7. In any one of paragraphs 1 to 6 An electronic device, wherein at least a portion of the second connecting hole (5133) is curved.

8. In any one of paragraphs 1 to 7, Part 2, Part 2-1 (420; 520) made of metal material; and An electronic device comprising a second-second portion (430; 530) made of a non-metallic material.

9. In any one of paragraphs 1 to 8, An electronic device that forms the shape of the first part through a lamination process.

10. In any one of paragraphs 1 to 9 An electronic device in which the shape of the first part is formed through a PBF (Powder Bed Fusion) lamination process.

11. In any one of paragraphs 1 to 10 An electronic device, wherein the cross-sectional diameters of the first opening (4121; 5121) and the second opening (4122; 5122) are 0.01 mm to 10 mm.

12. In any one of paragraphs 1 to 11 An electronic device, wherein the cross-sectional diameter of the first cavity is 0.01 mm to 10 mm.

13. In any one of paragraphs 1 to 12, An electronic device wherein the density of the first portion is greater than the density of the second portion.

14. In any one of paragraphs 1 to 13, An electronic device, wherein the second part comprises at least one of aluminum (AL), stainless steel (SUS), titanium (TiTan), ceramic, and amorphous metal.

15. In any one of paragraphs 1 to 14, At least one electronic component; and Containing a housing component according to claims 1 to 14, An electronic device wherein the housing component is arranged to surround at least one electronic component.

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