Electronic device including support structure

Abstract

According to an embodiment disclosed in the present document, an electronic device may be provided. The electronic device may comprise: a housing forming a part of the exterior of the electronic device and including a support structure and a rear plate, wherein the support structure includes a first area, a second area, and a partition wall between the first area and the second area and including an opening; a battery between the second area of the support structure and the rear plate; a protective member arranged to block at least a part of the opening; and a heat dissipation member arranged from a part of the first area to a part of the second area through the opening. The heat dissipation member may be arranged between the second area and the battery.

Description

Electronic device including a support structure

[0001] Examples of the present disclosure relate to electronic devices including a support structure.

[0002] Advances in information and communication technology and semiconductor technology are integrating diverse functions into a single portable electronic device. For example, electronic devices can implement not only communication functions but also entertainment functions such as gaming, multimedia functions such as music and video playback, communication and security functions for mobile banking, or even calendar management and electronic wallet functions. These electronic devices are becoming smaller and more portable for users.

[0003] The above information may be provided as background information to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0004] According to one embodiment disclosed in the present document, an electronic device may be provided. The electronic device may include a housing forming a part of an exterior of the electronic device, the housing including a support structure and a back plate, the support structure including a first region, a second region, and a partition wall disposed between the first region and the second region and including an opening, a battery disposed between the second region of the support structure and the back plate, a protective member disposed to block at least a part of the opening, and a heat dissipation member disposed from a part of the first region through the opening to a part of the second region. The heat dissipation member may be disposed between the second region and the battery.

[0005] According to one embodiment disclosed in the present document, an electronic device may be provided. The electronic device may include a housing including a support structure and a rear plate facing the support structure, wherein the support structure includes a first region and a second region spaced apart from the first region, a battery disposed between the second region of the support structure and the rear plate, a protective member disposed between the first region and the second region, and a heat dissipation member disposed from a portion of the first region to a portion of the second region through the protective member.

[0006] The above-described aspects or other aspects, configurations and / or advantages of one embodiment of the present disclosure may be further clarified by the following detailed description taken in conjunction with the accompanying drawings.

[0007] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment disclosed in this document.

[0008] FIG. 2 is a drawing illustrating an unfolded state of an electronic device (101) according to one embodiment of the present disclosure.

[0009] FIG. 3 is a drawing illustrating a folded state of an electronic device (101) according to one embodiment of the present disclosure.

[0010] FIG. 4 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0011] FIG. 5A is a rear view of an electronic device according to one embodiment of the present disclosure.

[0012] FIG. 5b is a cross-sectional side view taken along line A-A' of FIG. 5a according to one embodiment of the present disclosure.

[0013] FIG. 5c is a cross-sectional side view taken along line B-B' of FIG. 5a according to one embodiment of the present disclosure.

[0014] Figure 6 is an exploded perspective view of an electronic device according to one embodiment.

[0015] FIG. 7A is a rear view illustrating a support structure and a heat dissipation structure of an electronic device according to one embodiment of the present disclosure.

[0016] FIG. 7b is a drawing for explaining a support structure and a heat dissipation structure of an electronic device according to one embodiment of the present disclosure.

[0017] FIG. 7c is a perspective view illustrating a protective member arranged in a support structure of an electronic device according to one embodiment of the present disclosure.

[0018] FIG. 8 is a cross-sectional view illustrating a laminated structure of a protective member of an electronic device according to one embodiment of the present disclosure.

[0019] FIG. 9A is a rear view illustrating a support structure and a heat dissipation structure of an electronic device according to one embodiment of the present disclosure.

[0020] FIG. 9b is an enlarged view of portion C of FIG. 9a according to one embodiment of the present disclosure.

[0021] FIG. 9c is an enlarged view of portion D of FIG. 9a according to one embodiment of the present disclosure.

[0022] FIG. 10A is a rear view of an electronic device according to one embodiment of the present disclosure.

[0023] FIG. 10b is a cross-sectional side view taken along line G-G' of FIG. 10a according to one embodiment of the present disclosure.

[0024] FIG. 10c is a perspective view illustrating a support structure according to one embodiment of the present disclosure.

[0025] FIG. 10d is a perspective view illustrating a protective member according to one embodiment of the present disclosure.

[0026] FIG. 11A is a rear view of an electronic device according to one embodiment of the present disclosure.

[0027] FIG. 11b is a side cross-sectional view taken along line I-I' of FIG. 11a according to one embodiment of the present disclosure.

[0028] FIG. 11c is a perspective view illustrating a support structure according to one embodiment of the present disclosure.

[0029] FIG. 11d is a perspective view illustrating a protective member according to one embodiment of the present disclosure.

[0030] Throughout the attached drawings, similar reference numbers may be assigned to similar parts, components and / or structures.

[0031] The following description, with reference to the accompanying drawings, is provided to facilitate a comprehensive understanding of various embodiments of the present invention as defined by the claims and their equivalents. While the following description includes numerous specific details to aid understanding, these should be considered merely illustrative. Accordingly, those skilled in the art will recognize that various modifications and variations of the various embodiments described herein may be made without departing from the scope and spirit of the present disclosure. Furthermore, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0032] The terms and words used in the following description and claims are not intended to be limited by their bibliographic meanings, but are merely used by the inventors to ensure a clear and consistent understanding of the disclosure. Therefore, it will be apparent to those skilled in the art that the following description of various embodiments of the present invention is provided solely for illustrative purposes, not for the purpose of limiting the present invention, which is defined by the appended claims and their equivalents.

[0033] The singular forms "a," "an," and "the" should be understood to include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to "a surface of a part" includes reference to one or more of these surfaces.

[0034] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment disclosed in this document.

[0035] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In one embodiment, the electronic device (101) may have at least one of these components (e.g., the connection terminal (178)) omitted, or one or more other components added. In one embodiment, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0036] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0037] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0038] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0039] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0040] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0041] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0042] The display module (160) can visually provide information to an external device (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a hall area program device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0043] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0044] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0045] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0046] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0047] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0048] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0049] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0050] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0051] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0052] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0053] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In one embodiment, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0054] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent to a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0055] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0056] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0057] In the detailed description below, the longitudinal direction, the width direction, and / or the thickness direction of the electronic device may be mentioned, and the longitudinal direction may be defined as the 'Y-axis direction', the width direction as the 'X-axis direction', and / or the thickness direction as the 'Z-axis direction'. In one embodiment, with respect to the direction that a component is oriented, 'negative / positive (- / +)' may be mentioned together with the orthogonal coordinate system illustrated in the drawings. For example, the front of the electronic device or the housing may be defined as the 'side facing the +Z direction', and the back side may be defined as the 'side facing the -Z direction'. In one embodiment, the side of the electronic device or the housing may include a region facing the +X direction, a region facing the +Y direction, a region facing the -X direction, and / or a region facing the -Y direction. Also, in one embodiment, the 'X-axis direction' may mean both the '-X direction' and the '+X direction'. It should be noted that this is based on the orthogonal coordinate system illustrated in the drawings for the sake of brevity of description, and that the description of these directions or components does not limit the one embodiment disclosed in this document. For example, the aforementioned front or rear facing direction may vary depending on whether the electronic device is unfolded or folded, and the aforementioned direction may be interpreted differently depending on the user's gripping habits.

[0058] FIG. 2 is a diagram illustrating an unfolded state of an electronic device according to an embodiment of the present disclosure. FIG. 3 is a diagram illustrating a folded state of an electronic device according to an embodiment of the present disclosure. The electronic device (101) may be a foldable or bendable electronic device, as an example of the electronic device (101) illustrated in FIG. 1.

[0059] Referring to FIGS. 2 and 3, in one embodiment, the electronic device (101) may include a foldable housing (201) and a flexible or foldable display (250) (hereinafter, simply referred to as “display” 250) (e.g., the display device (160) of FIG. 1) disposed within a space formed by the foldable housing (201). According to one embodiment, the surface on which the display (250) is disposed (or the surface on which the display (250) is visible from the outside of the electronic device (101)) may be defined as the front surface of the electronic device (101). The surface opposite to the front surface may be defined as the back surface of the electronic device (101). In addition, the surface surrounding the space between the front surface and the back surface may be defined as the side surface of the electronic device (101).

[0060] According to one embodiment, the foldable housing (201) may include a first housing portion (210), a second housing portion (220) including a sensor area (222), a first rear plate (215), a second rear plate (225), and a hinge structure (230). Here, the hinge structure (230) may include a hinge cover that covers a foldable portion of the foldable housing (201). The foldable housing (201) of the electronic device (101) is not limited to the shape and combination shown in FIGS. 2 and 3, and may be implemented by a combination and / or combination of other shapes or parts. For example, the first housing portion (210) and the first rear plate (215) may be formed integrally, and the second housing portion (220) and the second rear plate (225) may be formed integrally.

[0061] According to one embodiment, the first housing portion (210) is connected to the hinge structure (230) and may include a first front surface facing a first direction and a first rear surface facing in a direction opposite to the first direction. The second housing portion (220) is connected to the hinge structure (230) and may include a second front surface facing a second direction and a second rear surface facing in a direction opposite to the second direction. The second housing portion (220) may rotate relative to the first housing portion (210) about the hinge structure (230). The electronic device (101) may be variable between a folded state and an unfolded state.

[0062] According to one embodiment, the first housing portion (210) may include a first side surface (211a) spaced apart from and arranged parallel to the folding axis (A) of the hinge structure (230) between the first front surface and the first rear surface, and the second housing portion (220) may include a second side surface (221a) spaced apart from and arranged parallel to the folding axis (A) of the hinge structure (230) between the second front surface and the second rear surface. In addition, the first housing portion (210) may include a third side (211b) that is perpendicular to the first side (211a), has one end connected to the first side (211a), and has the other end connected to a hinge structure (230), and a fourth side (211c) that is perpendicular to the first side (211a), has one end connected to the first side (211a), and has the other end connected to the hinge structure (230), and is spaced apart in a direction parallel to the third side (211b). The second housing portion (220) may include a fifth side (221b) that is perpendicular to the second side (221a), has one end connected to the second side (221a), and has the other end connected to the hinge structure (230), and a sixth side (221c) that is perpendicular to the second side (221a), has one end connected to the second side (221a), and has the other end connected to the hinge structure (230), and is spaced apart in a direction parallel to the fifth side (221b). When the second housing portion (220) is folded relative to the first housing portion (210) about the hinge structure (230), the first side (211a) can come closer to the second side (221a), and when the second housing portion (220) is unfolded relative to the first housing portion (210) about the hinge structure (230), the first side (211a) and the second side (221a) can move away from each other.

[0063] According to one embodiment, the electronic device (101) may have the first front side and the second front side facing each other in a fully folded state, and the second direction may be the same as the first direction in a fully unfolded state. In a fully unfolded state, the distance between the first side side (211a) and the second side side (221a) may be formed to be the greatest.

[0064] According to one embodiment, the first housing portion (210) and the second housing portion (220) may be arranged on both sides with respect to the folding axis (A) as the center, and may have a shape that is overall symmetrical with respect to the folding axis A. As described below, the angle or distance between the first housing portion (210) and the second housing portion (220) may vary depending on whether the state of the electronic device (101) is an unfolded state, a folded state, or a partially unfolded (or partially folded) intermediate state.

[0065] According to one embodiment, as illustrated in FIG. 2, the first housing portion (210) and the second housing portion (220) may together form a recess for accommodating the display (250). According to one embodiment, at least a portion of the first housing portion (210) and the second housing portion (220) may be formed of a metallic or non-metallic material having a rigidity of a selected size to support the display (250). At least a portion formed of the metallic material may provide a ground plane of the electronic device (101) and may be electrically connected to a ground line formed on a printed circuit board disposed within the foldable housing (201).

[0066] According to one embodiment, the first rear plate (215) is disposed on one side of the folding axis (A) on the rear surface of the electronic device (101) and may have, for example, a substantially rectangular periphery, the periphery of which may be wrapped by the first housing portion (210). Similarly, the second rear plate (225) is disposed on the other side of the folding axis (A) on the rear surface of the electronic device (101) and the periphery of which may be wrapped by the second housing portion (220).

[0067] According to one embodiment, the first rear plate (215) and the second rear plate (225) may have substantially symmetrical shapes with respect to the folding axis (A). However, the first rear plate (215) and the second rear plate (225) do not necessarily have mutually symmetrical shapes. According to one embodiment, the electronic device (101) may include the first rear plate (215) and the second rear plate (225) of various shapes. According to one embodiment, the first rear plate (215) may be formed integrally with the first housing portion (210), and the second rear plate (225) may be formed integrally with the second housing portion (220).

[0068] According to one embodiment, the first back plate (215), the second back plate (225), the first housing portion (210), and the second housing portion (220) may form a space in which various components of the electronic device (101) (e.g., a printed circuit board or a battery) may be placed. According to one embodiment, one or more components may be placed or visually exposed on the back of the electronic device (101). For example, at least a portion of the sub-display may be visually exposed through the first back area (216) of the first back plate (215). According to one embodiment, one or more components or sensors may be visually exposed through the second back area (226) of the second back plate (225). In various embodiments, the sensors may include a proximity sensor and / or a rear camera.

[0069] In one embodiment, a front camera exposed on a front side (e.g., a second front side) of the electronic device (101) or a rear camera exposed through a second rear area (226) of a second rear plate (225) may include one or more lenses, an image sensor, and / or an image signal processor. A flash may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (an infrared camera, a wide-angle lens, and a telephoto lens) and image sensors may be arranged on one side of the electronic device (101).

[0070] Referring to FIG. 3, the hinge cover may be configured to be disposed between the first housing portion (210) and the second housing portion (220) so as to cover an internal component (e.g., a hinge structure (230)). According to one embodiment, the hinge structure (230) may be covered by a portion of the first housing portion (210) and the second housing portion (220) or exposed to the outside depending on the state of the electronic device (101) (unfolded state, intermediate state, or folded state).

[0071] According to one embodiment, as illustrated in FIG. 2, when the electronic device (101) is in an unfolded state (e.g., a fully unfolded state), the hinge structure (230) may be covered by the first housing portion (210) and the second housing portion (220) and not exposed. According to one embodiment, as illustrated in FIG. 3, when the electronic device (101) is in a folded state (e.g., a fully folded state), the hinge structure (230) may be exposed to the outside between the first housing portion (210) and the second housing portion (220). According to one embodiment, when the first housing portion (210) and the second housing portion (220) are in an intermediate state where they are folded at a certain angle, the hinge structure (230) may be partially exposed to the outside between the first housing portion (210) and the second housing portion (220). However, in this case, the exposed area may be less than that in the completely folded state. In one embodiment, the hinge structure (230) may include a curved surface.

[0072] According to one embodiment, the display (250) may be disposed on a space formed by the foldable housing (201). For example, the display (250) may be mounted on a recess formed by the foldable housing (201) and may be externally visible through a front surface (e.g., a first front surface and / or a second front surface) of the electronic device (101). For example, the display (250) may constitute a majority of the front surface (e.g., the first front surface and / or the second front surface) of the electronic device (101). Accordingly, the front surface (e.g., the first front surface and / or the second front surface) of the electronic device (101) may include the display (250) and a portion of the first housing portion (210) adjacent to the display (250) and a portion of the second housing portion (220). And, the back surface (e.g., the first back surface and / or the second back surface) of the electronic device (101) may include a first back surface plate (215), a portion of a first housing portion (210) adjacent to the first back surface plate (215), a second back surface plate (225), and a portion of a second housing portion (220) adjacent to the second back surface plate (225).

[0073] According to one embodiment, the display (250) may refer to a display in which at least a portion of the display can be transformed into a flat or curved surface. According to one embodiment, the display (250) may include a folding area (253), a first area (251) positioned on one side (e.g., the left side of the folding area (253) illustrated in FIG. 2) with respect to the folding area (253), and a second area (252) positioned on the other side (e.g., the right side of the folding area (253) illustrated in FIG. 2).

[0074] However, the division of the regions of the display (250) illustrated in FIG. 2 is exemplary, and the display (250) may be divided into a plurality of regions (for example, four or more or two) depending on the structure or function. For example, in the embodiment illustrated in FIG. 2, the regions of the display (250) may be divided by a folding region (253) extending parallel to the folding axis (A). According to one embodiment, the display (250) may also be divided into regions based on another folding axis (for example, a folding axis parallel to the width direction of the electronic device).

[0075] According to one embodiment of the present disclosure, the display (250) may be coupled with or disposed adjacent to a touch panel equipped with a touch detection circuit and a pressure sensor capable of measuring the intensity (pressure) of a touch. For example, the display (250) may be coupled with or disposed adjacent to a touch panel that detects an electromagnetic resonance (EMR) stylus pen, as an example of a touch panel.

[0076] According to one embodiment, the first region (251) and the second region (252) may have an overall symmetrical shape centered around the folding region (253).

[0077] Hereinafter, the operation of the first housing part (210) and the second housing part (220) and each area of ​​the display (250) according to the state of the electronic device (101) (e.g., folded state, unfolded state, or intermediate state) will be described.

[0078] According to one embodiment, when the electronic device (101) is in an unfolded state (e.g., FIG. 2), the first housing portion (210) and the second housing portion (220) may be arranged to form an angle of 180 degrees and face the same direction. The surface of the first region (251) and the surface of the second region (252) of the display (250) may form an angle of 180 degrees with each other and face the same direction (e.g., toward the front of the electronic device). In this case, the folding region (253) may form the same plane as the first region (251) and the second region (252).

[0079] According to one embodiment, when the electronic device (101) is in a folded state (e.g., FIG. 3), the first housing portion (210) and the second housing portion (220) may be arranged to face each other. The surface of the first region (251) and the surface of the second region (252) of the display (250) may form a narrow angle (e.g., between 0 and 10 degrees) with each other and may face each other. The folding region (253) may be formed as a curved surface having at least a portion of a predetermined curvature.

[0080] According to one embodiment, when the electronic device (101) is in an intermediate state, the first housing portion (210) and the second housing portion (220) may be arranged at a certain angle with respect to each other. The surface of the first region (251) and the surface of the second region (252) of the display (250) may form an angle that is greater than an angle in a folded state and less than an angle in an unfolded state. The folding region (253) may be formed as a curved surface having at least a portion of a certain curvature, and the curvature at this time may be less than that in a folded state.

[0081] FIG. 4 is an exploded perspective view of an electronic device (101) according to one embodiment of the present disclosure.

[0082] The drawings below in FIG. 4 illustrate a spatial coordinate system defined by an X-axis, a Y-axis, and a Z-axis that are orthogonal to each other. Here, the X-axis may represent the width direction of the electronic device, the Y-axis may represent the length direction of the electronic device, and the Z-axis may represent the height (or thickness) direction of the electronic device. In describing various embodiments of the present disclosure, the 'first direction and the second direction' may mean a direction parallel to the Z-axis.

[0083] In describing the components of the electronic device (101) illustrated in FIG. 4, descriptions of the components described above in FIGS. 2 and 3 are omitted to the extent of overlap.

[0084] According to one embodiment of the present disclosure, an electronic device (101) may include various electronic components arranged in an internal or external space of a first housing portion (210) and a second housing portion (220). Various electronic components include, for example, a processor (e.g., a processor (120) of FIG. 1), a memory (e.g., a memory (130) of FIG. 1), an input module (e.g., an input module (150) of FIG. 1), an audio output module (e.g., an audio output module (155) of FIG. 1), a display (250) (e.g., a display module (160) of FIG. 1), an audio module (e.g., an audio module (170) of FIG. 1), a sensor (e.g., a sensor module (176) of FIG. 1), an interface (e.g., an interface (177) of FIG. 1), a connection terminal (e.g., a connection terminal (178) of FIG. 1), a haptic module (e.g., a haptic module (179) of FIG. 1), a camera module (e.g., a camera module (180) of FIG. 1), a power management module (188)), a battery (261, 262) (e.g., a battery (189) of FIG. 1), a communication module (e.g., a communication module of FIG. 1) The electronic device (101) may include a module (190)), a subscriber identification module (e.g., a subscriber identification module (196) of FIG. 1), or an antenna module (e.g., an antenna module (197) of FIG. 1), and the electronic components may be appropriately separated and arranged in the internal or external space of the first housing portion (210) and the second housing portion (220). In the electronic device (101), at least one of these components (e.g., a connection terminal (178)) may be omitted, or one or more other components may be added. In addition, some of these components may be integrated into one component.

[0085] According to one embodiment, the electronic device (101) is a foldable electronic device and may include a plurality of batteries to supply and store power required for operation to electronic components. For example, the electronic device may include a first battery (261) and a second battery (262) disposed in each of the first housing portion (210) and the second housing portion (220).

[0086] According to one embodiment, the electronic device (101) is a foldable electronic device and may include a plate (240) for arranging components in each of a first housing portion (210) and a second housing portion (220). Various electronic components and / or printed circuit boards (271, 272) may be arranged on the plate (240). According to one embodiment, the plate (240) may include a plurality of plates (241, 242). For example, a first support structure (241) and a first printed circuit board (271) may be arranged in the first housing portion (210), and a second support structure (242) and a second printed circuit board (272) may be arranged in the second housing portion (220). The first support structure (241) may include a first surface (241a) facing a first direction, and the second support structure (242) may include a second surface (242a) facing a second direction. The first support structure (241) and the second support structure (242) may be folded or unfolded relative to each other by a hinge structure (230) formed corresponding to a folding area (253) of the flexible display (250), and may be formed to face each other in a folded state, and the directions in which the first surface (241a) and the second surface (242a) face each other may be formed to be the same in an unfolded state. The hinge structure (230) may include a hinge plate (231) and / or a hinge cover (232), and a first support structure (241) and a second support structure (242) may be arranged on one side and the other side with the hinge plate (231) of the hinge structure (230) as the center.

[0087] Signals of a processor for implementing various functions and operations of an electronic device (101) can be transmitted to electronic components through various conductive lines and / or connectors (273) formed on printed circuit boards (271, 272).

[0088] FIG. 5A is a rear view of an electronic device according to an embodiment of the present disclosure. FIG. 5B is a side cross-sectional view taken along line A-A' of FIG. 5A according to an embodiment of the present disclosure. FIG. 5C is a side cross-sectional view taken along line B-B' of FIG. 5A according to an embodiment of the present disclosure. FIG. 6 is an exploded perspective view of an electronic device according to an embodiment of the present disclosure. FIG. 7A is a rear view for explaining a support structure and a heat dissipation structure of an electronic device according to an embodiment of the present disclosure. FIG. 7B is a drawing for explaining a support structure and a heat dissipation structure of an electronic device according to an embodiment of the present disclosure. FIG. 7C is a perspective view for explaining a protective member arranged on a support structure of an electronic device according to an embodiment of the present disclosure.

[0089] All or part of the configuration of the electronic device (101) of FIG. 5a may be identical to or similar to all or part of the configuration of the electronic device (101) of FIGS. 1 to 4.

[0090] FIG. 5A may illustrate a state in which a back plate (e.g., the back plate (215) of FIGS. 2, 3, and 4) is removed from the electronic device (101). Hereinafter, the housing portion (or second housing portion) (301) of the electronic device (101) is exemplified by one of the first housing portion (210) or the second housing portion (220) of FIGS. 2 to 4 (e.g., the second housing portion (220)), and internal components (e.g., a partition wall (312), a heat dissipation member (340), and / or a protection member (350)) according to embodiments of the present disclosure disposed therein are described, but this is not limiting, and the description of the internal components may be applied identically or similarly to the remaining housing (e.g., the first housing portion (210)) of the electronic device (101).

[0091] Referring to FIGS. 5A to 7C , in one embodiment, the electronic device (101) may include a housing portion (301) (e.g., the housing (201) of FIG. 2 ), a flexible display (320) (e.g., the flexible display (250) of FIGS. 2 and 4 ), a battery (360) disposed within the housing portion (301) (e.g., the batteries (261, 262) of FIG. 4 ), a circuit board (370), a heat dissipation member (340), and a protection member (350). According to one embodiment, the housing portion (301) may include a support structure (310) and a back plate (391) (e.g., the back plate (225) of FIGS. 2 to 4 ) disposed to face the support structure (310). For example, other electrical / electronic components of the electronic device (101) (e.g., circuit board (370), battery (360), heat dissipation member (340), and / or protection member (350)) may be placed in the space surrounded by the support structure (310) and the back plate (391) of the housing portion (301).

[0092] According to one embodiment, the support structure (310) may include a first region (310a) and a second region (310b) surrounding the first region (310a). According to one embodiment, the support structure (310) may further include a partition wall (312) disposed between the first region (310a) and the second region (310b). According to one embodiment, the partition wall (312) may include an opening (313) connecting the first region (310a) and the second region (310b). However, according to one embodiment (e.g., FIGS. 11A to 12D), the partition wall (312) may be omitted from the support structure (310), and the first region (310a) and the second region (310b) may be structurally separated by a protective member (350) disposed to cross therebetween.

[0093] In one embodiment, a battery (360) (e.g., batteries 261 and 262 of FIG. 4) may be disposed in a second region (310b) of the support structure (310). Referring to FIG. 6, for example, the support structure (310) may include a concave portion or recess in which at least a portion of the battery (360) disposed in the second region (310b) may be disposed or received. For example, the support structure (310) may include at least one partition wall facing side surfaces (e.g., a +X-direction side, a -X-direction side, and / or a -Y-direction side) of the battery (360) at an edge of the second region (310b). Referring to FIG. 6, in one embodiment, the support structure (310) may further include a mounting portion (311) for positioning, receiving, and / or mounting a heat dissipation member (340). For example, the mounting portion (311) may be formed to at least partially correspond to the shape of the heat dissipation member (340). For example, the mounting portion (311) may be formed from a portion of the first region (310a) to a portion of the second region (310b). For example, the mounting portion (311) may include a recess and / or a hole.

[0094] Referring to FIG. 6, in one embodiment, a flexible display (320) (e.g., the flexible display (250) of FIGS. 2 to 4) may be disposed in a housing (e.g., the housing (201) of FIGS. 2 to 4) including a housing portion (301). For example, the flexible display (320) may include a first display area (321) disposed in a first housing portion (e.g., the first housing portion (210) of FIGS. 2 to 4), a second display area (322) disposed in a housing portion (or a second housing portion) illustrated in FIG. 6 (e.g., the second housing portion (220) of FIGS. 2 to 4), and a folding area (323) disposed between the first display area (321) and the second display area (322). According to one embodiment, a heat dissipation member (340) may be positioned between the support structure (310) and a portion of the flexible display (320), such as the second display area (322).

[0095] According to one embodiment, a circuit board (370) (e.g., a second printed circuit board (272)) may be disposed in the first region (310a). According to one embodiment, the electronic device (101) may further include a heat source (371) disposed on the circuit board (370). For example, the heat source (371) may be an electrical / electronic component, such as a processor (e.g., the processor (120) of FIG. 1). For example, the circuit board (370) may be a main printed circuit board, and the heat source (371) may be a main processor (e.g., the main processor (121) of FIG. 1) (e.g., a central processing unit or an application processor). Referring to FIG. 5b, according to one embodiment, the heat source (371) may be disposed between the circuit board (370) and the support structure (310), or in other words, may be disposed on a surface (e.g., a +Z direction surface) of the circuit board (370) that faces the support structure (310).

[0096] Referring to FIG. 5b and FIG. 7a to FIG. 7c, according to one embodiment, the heat dissipation member (340) may be disposed from a portion of the first region (310a) of the support structure (310) through the opening (313) of the partition wall (312) to a portion of the second region (310b). According to one embodiment, at least a portion of the heat dissipation member (340) may be disposed to face a heat source (371) disposed on the circuit board (370). For example, the heat dissipation member (340) may be in at least partial contact with the heat source (371). According to one embodiment, the heat dissipation member (340) may be configured to transfer heat transferred from the heat source (371) to the battery (360). Referring to FIG. 5b, according to one embodiment, a portion or an end of the heat dissipation member (340) may be disposed between the support structure (310) and the circuit board (370). For example, a part or a portion of a heat dissipation member (340) may be placed between a heat source (371) disposed on a circuit board (370) and a support structure (310).

[0097] Referring to FIGS. 5A to 5C, 7B and 7C, according to one embodiment, the protective member (350) may be positioned to block at least a portion of the opening (313) of the partition wall (312) of the support structure (310). According to one embodiment, the protective member (350) may include a portion positioned between the battery (360) and the partition wall (312) and a portion positioned between the battery (360) and the opening (313). According to one embodiment, the protective member (350) may be positioned on the second region (310b) side with respect to the partition wall (312) (e.g., the first rib (312a) and / or the second rib (312b)). Referring to FIG. 5c, according to one embodiment, the protective member (350) may be disposed on all or a portion of one side (e.g., the -Y direction side) of the bulkhead (312) (e.g., the first rib (312a) and / or the second rib (312b)). Referring to FIGS. 5b and 5c, according to one embodiment, the protective member (350) may be disposed to face one side (e.g., the +Y direction side) of the battery (360) and may be disposed spaced apart from one side (e.g., the +Y direction side) of the battery (360). For example, the protective member (350) may be disposed spaced apart from the circuit board (370).

[0098] According to one embodiment, the protective member (350) is positioned so that the battery (360) does not directly contact the edges of the ends of the first rib (312a) and the second rib (312b) of the bulkhead (312), thereby preventing or reducing damage to the battery (360) that may occur due to direct contact with the edges of the ends of the first rib (312a) and the second rib (312b). According to one embodiment, the protective member (350) can limit movement or displacement of the battery (360) toward the first region (310a) of the support structure (310). According to one embodiment, the protective member (350) (e.g., the buffer portion (351)) can protect the battery (360) by alleviating the shock transmitted to the battery (360) when an external shock is applied to the electronic device (101). For example, the protective member (350) can prevent damage to the battery (360) by absorbing at least a portion of the shock transmitted from the battery (360) when the battery (360) is displaced toward the first region (310a) of the support structure (310), and can prevent a fire phenomenon due to damage to the battery (360).

[0099] Referring to FIG. 5b, according to one embodiment, the protective member (350) may be disposed facing and spaced from the surface or bottom surface (e.g., -Z direction surface) of the support structure (310). According to one embodiment, the protective member (350) may be disposed spaced from the surface or bottom surface (e.g., -Z direction surface) of the support structure (310) by being coupled to the partition wall (312) (e.g., the first rib (312a) and the second rib (312b)). Referring to FIGS. 5b and 7c, according to one embodiment, the heat dissipation member (340) may be disposed to pass through the gap between the protective member (350) and the surface of the support structure (310). For example, the height of the gap (e.g., height in the Z-axis direction) between the surface of the protective member (350) and the support structure (310) may be greater than the thickness (e.g., thickness in the Z-axis direction) of the heat dissipation member (340). According to one embodiment of the present disclosure, the protective member (350) is arranged so that a gap is formed between the protective member (350) and the support structure (310) through which the heat dissipation member (340) can pass while restricting the movement of the battery (360) and protecting the battery (360) from external impact, so that the heat dissipation member (340) can be arranged across the first region (310a) and the second region (310b) of the support structure (310), and the heat dissipation member (340) can transfer the heat of the heat source (371) to the battery (360) having a relatively large zero capacity, thereby improving the heat dissipation performance of the entire electronic device (101).

[0100] FIG. 8 is a cross-sectional view illustrating a laminated structure of a protective member of an electronic device according to an embodiment of the present disclosure. FIG. 9a is a rear view illustrating a support structure and a heat dissipation structure of an electronic device according to an embodiment of the present disclosure. FIG. 9b is an enlarged view of portion C of FIG. 9a according to an embodiment of the present disclosure. FIG. 9c is an enlarged view of portion D of FIG. 9a according to an embodiment of the present disclosure.

[0101] The first rib (312a), the second rib (312b), and the protective member (350) of the embodiment of Fig. 8 may be referred to as the first rib (312a), the second rib (312b), and the protective member (350) of Figs. 5a to 7c. The support structure (310) and the heat dissipation member (340) of the embodiment of Figs. 9a to 9c may be referred to as the support structure (310) and the heat dissipation member (340) of Figs. 5a to 8.

[0102] Referring to FIG. 8, according to one embodiment, the protective member (350) may include a buffer portion (351), a support portion (352), an adhesive layer (353), and / or a non-adhesive portion (354).

[0103] According to one embodiment, the buffer portion (351) may be configured to be elastically deformable. According to one embodiment, the buffer portion (351) may be disposed to face the battery (360), for example, to face a side (e.g., a +Y direction side or an upper side) facing the direction in which the first region (310a) of the battery (360) is positioned. According to one embodiment, the buffer portion (351) may be disposed so as to be closest to the battery (360) in the protective member (350) and to be in direct contact with the battery (360) when it moves, thereby protecting the battery (360) by alleviating the shock transmitted to the battery (360) when an external shock is applied to the electronic device (101). For example, the buffer portion (351) can prevent damage to the battery (360) by absorbing at least a portion of the shock transmitted from the battery (360) when the battery (360) flows toward the first region (310a) of the support structure (310), and can prevent a fire phenomenon due to damage to the battery (360).

[0104] In one embodiment, the support portion (352) may have a relatively greater strength than the remaining portion of the protective member (350) (e.g., the buffer portion (351)). For example, the support portion (352) may have a greater strength than the buffer portion (351), the adhesive layer (353) and / or the non-adhesive portion (354). For example, the support portion (352) may include a synthetic resin (e.g., polycarbonate (PC), polyethylene terephthalate (PET)) and may be, for example, a sheet-shaped member. For example, the support portion (352) may act as a rigid body to prevent the protection member (350) from being damaged, moved (e.g., pushed) or detached due to deformation of the protection member (350) or movement of the battery (360).

[0105] In one embodiment, the adhesive layer (353) (or bonding layer, adhesive member) can bond the protective member (350) to all or part of the partition wall (312) (e.g., the first rib (312a) and / or the second rib (312b)). In one embodiment, the adhesive layer (353) (e.g., a double-sided tape) can have at least partial adhesiveness on both sides (e.g., the Y-direction side). For example, a non-adhesive portion (354) can be bonded to a portion of one side (e.g., the +Y-direction side) of the adhesive layer (353), and the remaining portion of the side can be bonded or attached to a side (e.g., the -Y-direction side) of the first rib (312a) and / or the second rib (312b) facing the battery (360). For example, a support portion (352) can be disposed on the other side (e.g., the -Y-direction side) of the adhesive layer (353).

[0106] In one embodiment, all or part of the non-adhesive portion (354) may be disposed in the opening (313) of the partition wall (312). For example, the non-adhesive portion (354) may be disposed on one side of the adhesive layer (353). In one embodiment, the non-adhesive portion (354) may be attached to a portion of the adhesive layer (353) that is exposed to the opening (313) between the portions attached to the first rib (312a) and / or the second rib (312b) on one side (e.g., the +Y direction side) having adhesive force. For example, the non-adhesive portion (354) may cover a portion of the adhesive layer (353) that is exposed to the opening (313), thereby preventing or reducing contamination or damage to other structures or electrical / electronic components in the vicinity due to the adhesive force of the portion.

[0107] Referring to FIGS. 9b and 9c, according to one embodiment, the first rib (312a) of the support structure (310) may include a curved surface at an end facing the second rib (312b). For example, all corners of the end facing the second rib (312b) of the first rib (312a) that may come into contact with the battery (360) as the battery (360) moves may be processed or formed as curved surfaces. According to one embodiment, the second rib (312b) of the support structure (310) may include a curved surface at an end facing the first rib (312a). For example, all corners of the end facing the first rib (312a) of the second rib (312b) that may come into contact with the battery (360) as the battery (360) moves may be processed or formed as curved surfaces. For example, by forming the corners of the ends of the first rib (312a) and the second rib (312b) facing each other to include curved surfaces, damage that may occur to the battery (360) due to the battery (360) coming into contact with the corners can be reduced or prevented.

[0108] FIG. 10A is a rear view of an electronic device according to an embodiment of the present disclosure. FIG. 10B is a side cross-sectional view taken along line E-E' of FIG. 10A according to an embodiment of the present disclosure. FIG. 10C is a perspective view illustrating a support structure according to an embodiment of the present disclosure. FIG. 10D is a perspective view illustrating a protective member according to an embodiment of the present disclosure.

[0109] The support structure (310), battery (360), circuit board (370), and heat dissipation member (340) of the embodiments of FIGS. 10A to 10D may be referred to as the support structure (310), battery (360), circuit board (370), and heat dissipation member (340) of the embodiments of FIGS. 5A to 9C. The description given above with reference to the embodiments of FIGS. 5A to 9C regarding components assigned the same reference numerals may be omitted below.

[0110] Referring to FIG. 10c, according to one embodiment, the support structure (310) may include a first region (310a) and a second region (310b) surrounding the first region (310a). According to one embodiment, the first region (310a) and the second region (310b) may be structurally separated by a protective member (350) arranged to cross therebetween. According to one embodiment, the protective member (450) may be arranged to face one side of the battery (360) (e.g., the +Y direction side) and may be arranged spaced apart from one side of the battery (360) (e.g., the +Y direction side). Referring to FIG. 10c, according to one embodiment, the support structure (310) may include a coupling portion (315) arranged between the first region (310a) and the second region (310b) and for supporting the protective member (450). According to one embodiment, the coupling portion (315) may include a first coupling portion (351a) and a second coupling portion (315b) for coupling to opposite ends of the longitudinal direction (e.g., X-axis direction) of the protection member (450), respectively. For example, the first coupling portion (351a) and the second coupling portion (315b) may be in a form that protrudes from an edge region of the support structure (310) toward the center of the support structure (310) or the protection member (450). According to one embodiment, the coupling portion (315) may be omitted and the protection member (450) may be coupled only to the circuit board (370).

[0111] In one embodiment, the protective member (450) can be coupled to a first edge (e.g., a -Y direction edge) of the circuit board (370) facing the battery (360). In one embodiment, the protective member (450) can include a structure that engages the first edge (e.g., a -Y direction edge) of the circuit board (370) facing the battery (360), for example, a structure that surrounds at least a portion of the first edge. In one embodiment, the protective member (450) can include a non-conductive material (e.g., a synthetic resin). For example, the protective member (450) can be formed by injection molding.

[0112] Referring to FIG. 10B, according to one embodiment, the protective member (450) may be disposed facing and spaced from the surface or bottom surface (e.g., -Z-direction surface) of the support structure (310). According to one embodiment, the protective member (450) may be disposed spaced from the surface of the support structure (310) by being coupled to a first edge (e.g., -Y-direction edge) of the circuit board (370) facing the battery (360). According to one embodiment, the heat dissipation member (340) may be disposed to pass through the gap between the protective member (450) and the surface of the support structure (310). For example, the height (e.g., Z-axis height) of the gap between the protective member (450) and the surface of the support structure (310) may be greater than the thickness (e.g., Z-axis thickness) of the heat dissipation member (340).

[0113] FIG. 11A is a rear view of an electronic device according to an embodiment of the present disclosure. FIG. 11B is a side cross-sectional view taken along line F-F' of FIG. 11A according to an embodiment of the present disclosure. FIG. 11C is a perspective view illustrating a support structure according to an embodiment of the present disclosure. FIG. 11D is a perspective view illustrating a protective member according to an embodiment of the present disclosure.

[0114] The support structure (310), battery (360), circuit board (370), and heat dissipation member (340) of the embodiments of FIGS. 11A to 11D may be referred to as the support structure (310), battery (360), circuit board (370), and heat dissipation member (340) of the embodiments of FIGS. 5A to 9C. The description given above with reference to the embodiments of FIGS. 5A to 9C regarding components assigned the same reference numerals may be omitted below.

[0115] Referring to FIGS. 11C and 11D , according to one embodiment, the support structure (310) may include a first region (310a) and a second region (310b) surrounding the first region (310a). According to one embodiment, the first region (310a) and the second region (310b) may be structurally separated by a protective member (350) disposed to cross therebetween. Referring to FIG. 11C , according to one embodiment, the support structure (310) may include a coupling portion (315) disposed between the first region (310a) and the second region (310b) and configured to support the protective member (550). According to one embodiment, the coupling portion (315) may include a first coupling portion (351a) and a second coupling portion (315b) for respectively coupling to opposite ends of the protective member (550) in the longitudinal direction (e.g., in the X-axis direction). For example, the first coupling portion (351a) and the second coupling portion (315b) may be in a form that protrudes from the edge region of the support structure (310) toward the center of the support structure (310) or the protective member (550). According to one embodiment, the shape of the coupling portion (315) is not limited, and may be in a form that allows both ends of the longitudinal direction (e.g., X-axis direction) of the protective member (550) to be coupled and supported.

[0116] In one embodiment, the protective member (550) may be disposed facing one side (e.g., the +Y direction side) of the battery (360) and may be disposed spaced apart from one side (e.g., the +Y direction side) of the battery (360). For example, the protective member (550) may be disposed spaced apart from the circuit board (370).

[0117] According to one embodiment, the protective member (550) may be disposed across the width direction (e.g., X-axis direction) of the support structure (310) between the first region (310a) and the second region (310b). According to one embodiment, both ends (e.g., X-axis direction ends) of the protective member (550) may be coupled to the support structure (310). According to one embodiment, the protective member (550) may include a conductive material (e.g., metal), and may include a metal such as stainless steel, for example. For example, referring to FIG. 12b, the width direction cross section of the protective member (550) may have a 'C' shape or a 'ㄷ' shape. For example, the protective member (550) may be manufactured by bending a plate member made of a metal material.

[0118] Referring to FIG. 11B, according to one embodiment, the protective member (550) can be disposed facing and spaced from the surface or bottom surface (e.g., the -Z-direction surface) of the support structure (310). According to one embodiment, the protective member (550) can be disposed spaced from the surface of the support structure (310) by having a longitudinal end (e.g., an X-axis end) coupled to a portion of the support structure (310). According to one embodiment, the heat dissipation member (340) can be disposed to pass through the gap between the protective member (550) and the surface of the support structure (310). For example, the height of the gap (e.g., the Z-axis height) between the protective member (550) and the surface of the support structure (310) can be greater than the thickness (e.g., the Z-axis thickness) of the heat dissipation member (340).

[0119] In one embodiment, the protective member (450, 550) can limit movement or displacement of the battery (360) toward the first region (310a) of the support structure (310). In one embodiment, the protective member (450, 550) can protect the battery (360) by alleviating shock transmitted to the battery (360) when an external shock is applied to the electronic device (101). For example, the protective member (450, 550) can prevent damage to the battery (360) by absorbing at least a portion of the shock transmitted from the battery (360) when the battery (360) is displaced toward the first region (310a) of the support structure (310), and can prevent a fire phenomenon due to damage to the battery (360).

[0120] According to the embodiments of FIGS. 10a to 11d, the protection member (450, 550) is arranged so that a gap is formed between the protection member (450) and the support structure (310) to allow the heat dissipation member (340) to pass therethrough while restricting the movement of the battery (360) and protecting the battery (360) from external impact, so that the heat dissipation member (340) can be arranged across the first region (310a) and the second region (310b) of the support structure (310), and the heat dissipation member (340) can transfer the heat of the heat source (371) to the battery (360) having a relatively large zero capacity, thereby improving the heat dissipation performance of the entire electronic device (101).

[0121] The aspects of the present disclosure are intended to address at least the problems and / or shortcomings described above and provide at least the advantages described below. However, the problems addressed by the present disclosure are not limited to the aforementioned problems and may be varied without departing from the spirit and scope of the present disclosure.

[0122] According to one embodiment of the present disclosure, the protection member (350, 450, 550) is arranged so that a gap is formed between the protection member (350) and the support structure (310) to allow the heat dissipation member (340) to pass therethrough while restricting the movement of the battery (360) and protecting the battery (360) from external impact, so that the heat dissipation member (340) can be arranged over the entire area of ​​the support structure (310) (e.g., the first area (310a) and the second area (310b)), and the heat dissipation member (340) transfers the heat of the heat source (371) to the battery (360) having a relatively large zero capacity, thereby improving the heat dissipation performance of the entire electronic device (101).

[0123] The effects that can be obtained from this disclosure are not limited to the effects mentioned above, and various effects that can be directly or indirectly identified through this document may be provided.

[0124] The support structure, heat dissipation member, and protection member of the present disclosure described above and the electronic device including the same are not limited to the above-described embodiments and drawings, and it will be apparent to a person skilled in the art to which the present disclosure pertains that various substitutions, modifications, and changes are possible within the technical scope of the present disclosure.

[0125] While this disclosure has been described by way of example and example, it should be understood that the specific embodiment is intended to be illustrative and not limiting. It will be apparent to those skilled in the art that various changes in form and detail may be made without departing from the overall scope of this disclosure, including the appended claims and their equivalents.

[0126] According to one embodiment disclosed in the present document, an electronic device (101) may be provided. The electronic device may include a housing (201) forming a part of an exterior of the electronic device and including a support structure (310) and a rear plate (215; 390), wherein the support structure includes a first region (310a), a second region (310b) and a partition wall (312) disposed between the first region and the second region and including an opening (313), a battery (360) disposed between the second region of the support structure and the rear plate, a protection member (350) disposed to block at least a part of the opening, and a heat dissipation member (340) disposed from a part of the first region through the opening to a part of the second region and disposed between the second region and the battery.

[0127] According to one embodiment, the housing may include a first housing portion (210); and a second housing portion (220; 301) rotatably connected to the first housing portion, the second housing portion including the support structure and the back plate. The electronic device may further include a flexible display (250; 320) disposed in the housing, and the support structure may be disposed between a portion of the flexible display and the heat dissipation member.

[0128] In one embodiment, the protective member may be disposed at a distance from the surface of the support structure, and the heat dissipation member may be disposed to pass through the distance between the protective member and the surface of the support structure.

[0129] According to one embodiment, the protective member may include a buffer portion (351) that is arranged to face one side of the battery and is configured to be elastically deformable.

[0130] According to one embodiment, the protective member may include a support portion (352) having greater strength than the buffer portion, the support portion being positioned facing the one side of the battery with the buffer portion interposed therebetween.

[0131] In one embodiment, the protective member may include a non-adhesive portion (354) at least partially disposed in the opening.

[0132] According to one embodiment, the protective member further comprises an adhesive layer (353) bonded to a portion of the bulkhead, and the non-adhesive portion may be disposed on one surface of the adhesive layer.

[0133] In one embodiment, the protective member may be disposed facing and spaced apart from one side of the battery.

[0134] According to one embodiment, the bulkhead comprises a first rib (312a) and a second rib (312b) arranged facing each other to reopen the opening, and a portion of the protective member may be arranged on at least one of the first rib or the second rib.

[0135] In one embodiment, the protective member may include a curved surface at an end of the first rib facing the second rib and the second rib may include a curved surface at an end of the second rib facing the first rib.

[0136] According to one embodiment, the circuit board may further be disposed on the first region and a heat source (371) disposed on the circuit board.

[0137] According to one embodiment, at least a portion of the heat dissipation member may be configured to face the heat source and transfer heat transferred from the heat source to the battery.

[0138] According to one embodiment, a portion of the heat dissipation member may be disposed between the support structure and the circuit board, and the heat source may be disposed between the heat dissipation member and the circuit board.

[0139] According to one embodiment disclosed in the present document, an electronic device (101) may be provided. The electronic device may include a housing (301) including a support structure (310) and a rear plate (215) disposed facing the support structure, wherein the support structure includes a first region (310a) and a second region (310b) disposed spaced apart from the first region, a battery (360) disposed between the second region of the support structure and the rear plate, a protection member (450, 550) disposed between the first region and the second region, and a heat dissipation member (340) disposed from a portion of the first region to a portion of the second region through the protection member.

[0140] In one embodiment, the protective member may be disposed facing the surface of the support structure with a gap therebetween, and the heat dissipation member may be disposed to pass through the gap.

[0141] In one embodiment, the protective member may be disposed facing and spaced apart from one side of the battery.

[0142] According to one embodiment, the device further includes a circuit board disposed in the first region and a heat source disposed on the circuit board, and at least a portion of the heat dissipation member may be disposed facing the heat source and configured to transfer heat transferred from the heat source to the battery.

[0143] In one embodiment, the protective member may include a structure that engages the first edge of the circuit board so as to be coupled to the first edge facing the battery.

[0144] In one embodiment, the protective member may comprise a non-conductive material.

[0145] According to one embodiment, the protective member is disposed across the width direction of the support structure between the first region and the second region, and both ends of the protective member can be coupled to the support structure.

[0146] Electronic devices according to embodiments of the present disclosure may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments of the present disclosure are not limited to the aforementioned devices.

[0147] It should be understood that the embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to a specific embodiment, but include various modifications, equivalents, or substitutes of the embodiment. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the item, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0148] The term "module" used in one embodiment of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0149] An embodiment of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0150] According to one embodiment, the method according to one embodiment of the present disclosure may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0151] According to one embodiment, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to one embodiment, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to one embodiment, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In an electronic device (101), A housing (201) forming a part of the exterior of the electronic device and including a support structure (310) and a back plate (215; 390), wherein the support structure includes a first region (310a), a second region (310b) and a partition wall (312) disposed between the first region and the second region and including an opening (313); A battery (360) disposed between the second region of the support structure and the rear plate; A protective member (350) arranged to block at least a portion of the above opening; and An electronic device comprising a heat dissipation member (340) disposed from a portion of the first region through the opening to a portion of the second region, wherein a portion of the heat dissipation member (340) is disposed between the second region and the battery.

2. In paragraph 1, The housing comprises a first housing portion (210); and a second housing portion (220; 301) rotatably connected to the first housing portion, the second housing portion including the support structure and the rear plate, An electronic device further comprising a flexible display (250; 320) disposed in the housing, wherein the support structure is disposed between a portion of the flexible display and the heat dissipation member.

3. In paragraph 1 or 2, An electronic device wherein the protective member is disposed at a distance from the surface of the support structure, and the heat dissipation member is disposed to pass through the distance between the protective member and the surface of the support structure.

4. In any one of paragraphs 1 to 3, An electronic device, wherein the protective member includes a buffer portion (351) that is arranged to face one side of the battery and is configured to be elastically deformable.

5. In paragraph 4, An electronic device in which the protective member includes a support portion (352) having greater strength than the buffer portion and is positioned facing the one side of the battery with the buffer portion interposed therebetween.

6. In any one of paragraphs 1 to 5, An electronic device, wherein the protective member comprises a non-adhesive portion (354) at least partially disposed in the opening.

7. In paragraph 6, An electronic device wherein the protective member further comprises an adhesive layer (353) bonded to a portion of the bulkhead, and the non-adhesive portion is disposed on one surface of the adhesive layer.

8. In any one of paragraphs 1 to 7, An electronic device wherein the protective member is disposed facing one side of the battery and spaced apart from the other side.

9. In any one of paragraphs 1 to 8, An electronic device wherein the bulkhead comprises a first rib (312a) and a second rib (312b) that are arranged to face each other by reopening the opening, and a part of the protective member is arranged on at least one of the first rib or the second rib.

10. In paragraph 9, An electronic device wherein the protective member has a curved surface at an end of the first rib facing the second rib and the second rib has a curved surface at an end of the second rib facing the first rib.

11. In any one of paragraphs 1 to 10, An electronic device further comprising a circuit board disposed on the first region and a heat source (371) disposed on the circuit board.

12. In paragraph 11, An electronic device, wherein at least a portion of the heat dissipation member is arranged to face the heat source and is configured to transfer heat transferred from the heat source to the battery.

13. In paragraph 11 or 12, An electronic device wherein a portion of the heat dissipation member is disposed between the support structure and the circuit board, and the heat source is disposed between the heat dissipation member and the circuit board.

14. In any one of paragraphs 1 to 13, An electronic device in which the above support structure (310) further includes a mounting portion (311) on which the heat dissipation member (340) is positioned.

15. In paragraph 14, An electronic device in which the above-mentioned mounting portion (311) corresponds at least partially to the shape of the above-mentioned heat dissipation member (340).

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