Resistivity measurement of silicon material using four point probes on industrial anthropomorphic robots

Abstract

A resistivity measurement system (10) for semiconductor workpieces (30) includes an anthropomorphic arm (110) movable about at least six axes, a sled (102) connected to the anthropomorphic arm, and a semiconductor workpiece support (20). The anthropomorphic arm includes an end effector (118) and a resistivity probe (120). The resistivity probe is connected to the end effector and is configured to measure an electrical resistivity of a semiconductor workpiece. The sled is selectively movable along a seventh axis extending along a length of the sled. The anthropomorphic arm and the sled cooperate to define a working volume. The semiconductor workpiece support is configured to support a semiconductor workpiece within the working volume.

Description

RESISTIVITY MEASUREMENT OF SILICON MATERIAL USING FOUR POINT PROBES ON INDUSTRIAL ANTHROPOMORPHIC ROBOTSCROSS-REFERENCE TO RELATED APPLICATION

[0001] This application claims the benefit of priority to U.S. Provisional Patent Application No. 63 / 669,944, filed on July 11, 2024, the disclosure of which is hereby incorporated by reference herein in its entirety.FIELD

[0002] The field of the disclosure relates to semiconductor wafer manufacture and, more particularly, to systems for measuring the electrical resistivity of a semiconductor workpiece using multi-axis anthropomorphic arms.BACKGROUND

[0003] Silicon material must undergo certifications in order to be accepted by the customer. This process is done through the so called “four-point probe” method, which is a way to measure resistivity on silicon slugs or chucks / ingots. This method is described in some industry standards, such as SEMI MF43-0705, SEMI MF84-0312, SEMI MF43-0316, F 84-02. The standards provide general information regarding the type of probe to use, the electrical parametrization the measuring system must have, the compensations to apply, etc. However, these standards do not specify the means by which the measurements are obtained, such as, for example, a mechanical system, a measurement device, a machine, etc. Several machines and systems are offered on the market to perform resistivity measurements, and many manufacturers have also developed their own solutions to conform to the standards.

[0004] One drawback of existing resistivity measurement systems is limited flexibility. For example, some known systems include simple manual lever mechanisms or basic cartesian automated systems that provide only three or four degrees of freedom. Because of this, available machines are often very large or are limited in their functionality.

[0005] This section is intended to introduce the reader to various aspects of art that may be related to various aspects of the disclosure, which are described and / or claimed below. Thisdiscussion is believed to be helpful in providing the reader with background information to facilitate a better understanding of the various aspects of the present disclosure. Accordingly, it should be understood that these statements are to be read in this light, and not as admissions of prior art.BRIEF SUMMARY

[0006] One aspect of the present disclosure is directed to a resistivity measurement system for semiconductor workpieces. The resistivity measurement system includes an anthropomorphic arm that is movable about at least six axes, a sled connected to the anthropomorphic arm, and a semiconductor workpiece support. The anthropomorphic arm includes an end effector connected to a distal segment of the anthropomorphic arm and a resistivity probe. The resistivity probe is connected to the end effector and is configured to measure an electrical resistivity of a semiconductor workpiece. The sled is selectively movable along a seventh axis extending along a length of the sled and the anthropomorphic arm and the sled cooperate to define a working volume. The semiconductor workpiece support is configured to support a semiconductor workpiece within the working volume.

[0007] Another aspect of the present disclosure is directed to a resistivity measurement system for semiconductor workpieces. The resistivity measurement system includes an anthropomorphic arm movable about at least six axes, a sled connected to the anthropomorphic arm, a first semiconductor workpiece support, and a second semiconductor workpiece support. The anthropomorphic arm includes a resistivity probe that is configured to measure an electrical resistivity of a semiconductor workpiece. The sled is selectively movable along a seventh axis extending along a length of the sled, and the anthropomorphic arm and the sled cooperate to define a working volume. The first semiconductor workpiece support is positioned on a first slide of the sled and within the working volume. The first semiconductor workpiece support is configured to support a first semiconductor workpiece having first geometry. The second semiconductor workpiece support is positioned on a second, opposite side of the sled and within the working volume. The second semiconductor workpiece support is configured to support a second semiconductor workpiece having a second geometry that is different from the first geometry.

[0008] Another aspect of the present disclosure is directed to a method of measuring resistivity of a semiconductor workpiece. The method includes manipulating an anthropomorphic arm within a working volume defined by the anthropomorphic arm to contact a first semiconductor workpiece supported within the working volume with a resistivity probe connected to a distal segment of the anthropomorphic arm. The anthropomorphic arm is movable about at least six axes. The method also includes measuring a resistivity of the first semiconductor workpiece in contact with the resistivity probe, manipulating the anthropomorphic arm to remove contact between the resistivity probe and the first semiconductor workpiece, manipulating the anthropomorphic arm to contact a second semiconductor workpiece supported within the working volume with the resistivity probe, and measuring an electrical resistivity of the second semiconductor workpiece in contact with the resistivity probe.

[0009] Various refinements exist of the features noted in relation to the above-mentioned aspects of the present disclosure. Further features may also be incorporated in the above- mentioned aspects of the present disclosure as well. These refinements and additional features may exist individually or in any combination. For instance, various features discussed below in relation to any of the illustrated embodiments of the present disclosure may be incorporated into any of the above-described aspects of the present disclosure, alone or in any combination.BRIEF DESCRIPTION OF THE DRAWINGS

[0010] FIG. 1 is a schematic diagram of an example resistivity measurement system for semiconductor workpieces in accordance with the disclosure.

[0011] FIG. 2 is a schematic diagram of an example anthropomorphic arm of the resistivity measurement system of FIG. 1.

[0012] FIG. 3 is a schematic diagram of the anthropomorphic arm of FIG. 2 illustrating a working volume of the anthropomorphic arm.

[0013] FIG. 4 is a perspective view of an example resistivity probe of the resistivity measurement system of FIG. 1.

[0014] FIG. 5 is a block diagram of an example embodiment of a controller of the resistivity measurement system of FIG. 1.

[0015] FIG. 6A is a flow diagram of an example method of measuring resistivity of semiconductor workpieces in accordance with the disclosure.

[0016] FIG. 6B is a continuation of the flow diagram of FIG. 6A.

[0017] Corresponding reference characters indicate corresponding parts throughout the drawings.DETAILED DESCRIPTION

[0018] Provisions of the present disclosure relate to systems and methods for measuring electrical resistivity of semiconductor workpieces. Resistivity measurement systems for semiconductor workpieces of the present disclosure increase the flexibility of resistivity measuring machines by introducing industrial robots (anthropomorphic arms) in the scenario. Attaching a four-point resistivity probe to an end-effector of the anthropomorphic arm enables the resistivity probe to approach points of the semiconductor workpieces to measure in any direction or orientation. The resistivity measurement systems of the present disclosure may include up to seven degrees of freedom and can be designed with higher compactness compared to their counterparts, in addition to being able to measure different types of material coming from several production lines. As a result, production plants use the same workstation to measure the electrical resistivity of all types of semiconductor materials, such as, for example, slugs, chucks or even whole ingot crystals (e.g., grown by the batch or continuous Czochralski method), for all the produced diameter sizes (e.g., 6 in., 8 in., 12 in.), both raw or grinded.

[0019] For exemplary methods of measuring the electrical resistivity of semiconductor workpieces capable of use with the resistivity measurement systems of the present disclosure, reference can be made to U.S. Publication No. 2020 / 0199774, published on June 25, 2020, U.S. Publication No. 2020 / 0002836, published on January 2, 2020, now U.S. Patent No. 10,793,969, and U.S. Publication No. 2020 / 0002835, published on January 2, 2020, now U.S. Patent No. 10,781,532, the disclosures of which are incorporated by reference in their entirety.

[0020] With reference to FIG. 1, an example resistivity measurement system for measuring resistivity of semiconductor workpieces or materials is illustrated and generally identified by reference numeral 10. The example system 10 is shown and described herein as a semiconductor workpiece resistivity measurement system, although it is envisioned that the system 10 may be a component or station of a larger system, such as a manufacturing or production line for producing semiconductor wafers. The system 10 measures the resistivity of semiconductor workpieces in seven axes, which reduces or otherwise removes constraints on the position of the semiconductor workpiece relative to the measurement device and / or reduces the size of the system 10 due to a reduction in constraints with respect to the size and shape of the semiconductor workpiece.

[0021] In the example embodiment, the system 10 includes a workstation 12. The workstation 12 includes a base 14, upon which a semiconductor workpiece support 20 and a semiconductor workpiece measurement device 100 are supported. The semiconductor workpiece support 20 is configured to operably support a semiconductor workpiece 30, such as for example, a slug, an ingot, a chuck, whole Czochralski (CZ) crystals or Continuous Czochralski (CCZ) crystals, and / or segments of whole CZ or CCZ crystals. In some embodiments, the semiconductor workpiece support 20 may support a semiconductor workpiece 30 having a diameter of 6 in., 8 in., or 12 in., and the semiconductor workpiece 30 may be raw or grinded without departing from the scope of the disclosure. In the example embodiment, the semiconductor workpiece support 20 includes one or more support blocks 22 configured to selectively engage the semiconductor workpiece 30 and operatively support the semiconductor workpiece adjacent to the semiconductor workpiece measurement device 100. Although generally illustrated and described as including one or more support blocks, it is envisioned that the semiconductor workpiece support 20 may be any support device or system configured to support the semiconductor workpiece 30 as described herein, such as a cradle, one or more live centers, one or more chucks, etc. In some embodiments, the semiconductor workpiece support 20 may selectively rotate the semiconductor workpiece 30 about a longitudinal axis A-A defined by the semiconductor workpiece 30.

[0022] With additional reference to FIGS. 2 and 3, the semiconductor workpiece measurement device 100 includes a sled 102. The sled 102 is supported on the base 14 and extends along a longitudinal axis B-B. In the example embodiment, the longitudinal axis B-B extends parallel to the longitudinal axis A-A of the semiconductor workpiece 30, although the longitudinal axis B-B may extend in any direction relative to the semiconductor workpiece 30 without departing from the scope of the disclosure. The sled 102 includes a movable base or baseplate 104 that is configured to translate along the longitudinal axis B-B. In one non- limiting embodiment, the movable baseplate 104 is slidably supported by a pair of rails 106 that are operatively connected to the base 14. Although generally illustrated and described as being supported by the pair of rails 106, it is envisioned that the movable baseplate 104 may be slidably supported by any suitable means, such as for example, a conveyor, one or more linear rails, etc., and combinations thereof. The movable baseplate 104 is operatively connected to a drive motor 108, which is configured to selectively translate the movable baseplate 104 along the longitudinal axis B-B. The drive motor 108 may be operatively connected to the movable baseplate 104 using any suitable means, such as for example, one or more ball screws, one or more lead screws, one or more belts, one or more rack and pinions, etc. and combinations thereof (not labeled).

[0023] The semiconductor workpiece measurement device 100 includes a manipulatable arm 110 that is supported by the baseplate 104 of the sled 102. In the example embodiment, the manipulatable arm 110 is an anthropomorphic arm having at least six degrees of freedom, although the manipulatable arm 110 may be any suitable type of manipulatable arm having any suitable number of degrees of freedom capable of operating as described herein. The manipulatable arm 110 includes a plurality of segments 112 that are selectively manipulatable relative to one another about a plurality of joints 114. In the example embodiment, the manipulatable arm 110 includes six segments 112 and six joints 114, although any number of segments and any number of joints may be used by the manipulatable arm 110 without departing from the scope of the disclosure. A first segment 112a is rotatably connected to the baseplate 104 by a first joint 114a. The first segment 112a rotates about a first axis Ai defined by the first joint 114a. The first axis Ai is oriented in a generally vertical direction relative to the baseplate 104. A second segment 112b is rotatably connected to the first segment 112a by a second joint 114b.The second segment 112b rotates about a second axis A2 defined by the second joint 114b. The second axis A2 is oriented in a generally perpendicular direction relative to the first axis Ai. A third segment 112c is rotatably connected to the second segment 112b by a third joint 114c. The third segment 112c rotates about a third axis A3 defined by the third joint 114c. The third axis A3 is oriented in a generally parallel direction relative to the second axis A2. A fourth segment 112d is rotatably connected to the third segment 112c by a fourth joint 114d. The fourth segment 112d rotates about a fourth axis A4 defined by the fourth joint 114d. The fourth axis A4 is oriented in a generally perpendicular direction relative to the third axis A3. A fifth segment 112e is rotatably connected to the fourth segment 112e by a fifth joint 114e. The fifth segment 112e rotates about a fifth axis As defined by the fifth joint 114e. The fifth axis As is oriented in a generally perpendicular direction relative to the fourth axis A4. A sixth segment 112f is rotatably connected to the fifth segment 112f by a sixth joint 114f. The sixth segment 112f rotates about a sixth axis Ae defined by the sixth joint 114f. The sixth axis Ae is oriented in a generally perpendicular direction relative to the fifth axis As. In some embodiments, one or more of the plurality of segments 112 may rotate 360 degrees about respective joints of the plurality of joints 114, although any one of the plurality of segments 112 may rotate more or less than 360 degrees about respective joints of the plurality of joints 114 without departing from the scope of the disclosure.

[0024] By using six degrees of freedom, the manipulatable arm 110 is able to reach any, or almost any point within its working volume. For example, the reach of the manipulatable arm 110 may define a spherical or otherwise globe shaped working volume Vi, (see FIG. 3) within which the manipulatable arm 110 defines a plurality of sub-working volumes V2, V3, . . . Vn, depending upon the position and orientation of each segment of the plurality of segments 112 relative to one another. The addition of a seventh axis, defined by the longitudinal axis B-B, further increases the working volume in which the manipulatable arm 110 can reach, thereby increasing the size and shape of the semiconductor workpiece 30 that can be measured using the system 10.

[0025] With additional reference to FIG. 4, the manipulatable arm 110 includes an end effector 118 that is operatively connected to the sixth segment 112f. In the example embodiment,a resistivity probe 120 is operatively connected to the end effector 118 that is configured to measure an electrical resistivity of the semiconductor workpiece 30. The resistivity probe 120 may be any suitable type of resistivity probe capable of performing the functions described herein, such as for example, a four-point probe, a two-point probe, a toroidal probe, an eddy current probe, a conductivity probe, etc. In one non-limiting embodiment, the resistivity probe 120 is a four-point probe. In some embodiments, the resistivity probe 120 is selected in accordance with one or more standards, such as for example, SEMI MF43-0705, SEMI MF84- 0312, EMI MF43-0316, and F 84-02

[0026] The end effector 118 is configured to minimize any mechanical and electrical instabilities of the manipulatable arm 110 and for measurements of differing semiconductor workpieces 30 by changing or otherwise varying a stiffness of the end effector 118, a geometry of the end effector 118, etc., and combinations thereof. Minimizing the mechanical and electrical instabilities of the manipulatable arm 110 increases the accuracy and reliability of the resistivity measurements as compared to end effectors that have not been optimized for the manipulatable arm 110 and / or the type of semiconductor workpiece 30. Additionally, the properties of the end effector 118 enable the use of the six degree of freedom and seven degree of freedom manipulatable arms 110 described herein while conforming to the one or more standards described above. In some embodiments, the end effector 118 is compliant and / or deformable and / or includes a compliant mount 118a that is configured to selectively connect the resistivity probe 120 to the end effector 118. The compliant mount 118a is deformable to maintain contact between the resistivity probe 120 and the semiconductor workpiece 30 as the resistivity probe 120 traverses the semiconductor workpiece 30. In this manner, the compliant mount 118a deforms due to forces imparted on the resistivity probe 120 by irregularities or roughness present on the outside surface of the semiconductor workpiece 30.

[0027] Referring back to FIG. 1, in some embodiments, additional semiconductor workpieces 30 may be stored or otherwise positioned within the workstation 12. For example, a second semiconductor workpiece 30 may be stored in a remote area of the workstation 12, which is within the reach of the manipulatable arm 110 (e.g. , within the working volume of the manipulatable arm 110 and the sled 102). In this manner, once measurements are completed on afirst semiconductor workpiece 30, the manipulatable arm 110 is manipulated or otherwise controlled to measure the electrical resistivity of the second semiconductor workpiece 30, without manual intervention by a user. In some embodiments, the workstation 12 includes a first staging area 40 that is configured to receive semiconductor workpieces 30 from a first production line (not labeled) that produces a first type of semiconductor workpiece 30 and a second staging area 42 that is configured to receive semiconductor workpieces 30 from a second production line (not labeled) that produces a second type of semiconductor workpiece 30. The first staging area 40 may be positioned on a first side of the manipulatable arm 110 and sled 102 and the second staging area 42 may be positioned on a second, opposite side of the manipulatable arm 110 and sled 102. In this manner, the manipulatable arm 110 may rotate or otherwise maneuver the resistivity probe 120 from the first side including the first semiconductor workpiece 30 to the second side including the second semiconductor workpiece 30 and measure a resistivity of each semiconductor workpiece 30 without manual intervention by a user. Although generally illustrated and described as having two semiconductor workpiece staging areas 40, 42, the workstation 12 may include any number of semiconductor workpiece staging areas for receiving semiconductor workpieces from any number of production lines without departing from the scope of the disclosure.

[0028] In one non-limiting embodiment, the workstation 12 may include one or more calibration samples 32 positioned at a remote area within the working volume of the manipulatable arm 110 and the sled 102. When calibration of the resistivity probe 120 is need or desired, the manipulatable arm 110 and the sled 102 cooperate to allow the resistivity probe 120 to contact the one or more calibration samples 32, thereby eliminating the need for a user to manually load and unload the calibration samples 32 and increasing the throughput of the workstation 12.

[0029] With continued reference to FIG. 1, the workstation 12 includes or is in communication with a controller 16 that is configured to control the manipulatable arm 110 and / or the sled 102 and generate one or more metrics related to the resistivity of the semiconductor workpiece 30 based on the output of the probe 120. The controller 16 may be a computer system. Computer systems, as described herein, refer to any known computer deviceand computer system. As described herein, all such computer systems include a processor and a memory. However, any processor in a computer system referred to herein may also refer to one or more processors wherein the processor may be in one computing device or a plurality of computing devices acting in parallel. Additionally, any memory in a computer device referred to herein may also refer to one or more memories wherein the memories may be in one computing device or a plurality of computing devices acting in parallel.

[0030] The term processor, as used herein, refers to central processing units, microprocessors, microcontrollers, reduced instruction set circuits (RISC), application specific integrated circuits (ASIC), logic circuits, and any other circuit or processor capable of executing the functions described herein. The above are examples only and are thus not intended to limit in any way the definition and / or meaning of the term “processor.”

[0031] The term “database” may refer to either a body of data, a relational database management system (RDBMS), or to both and a database may include any collection of data including hierarchical databases, relational databases, flat file databases, object-relational databases, object-oriented databases, and any other structured collection of records or data that is stored in a computer system. The above are examples only, and thus are not intended to limit in any way the definition and / or meaning of the term database. Examples of RDBMS’s include, but are not limited to including, Oracle® Database, MySQL, IBM@ DBS, Microsoft® SQL Server, Sybase®, and PostgreSQL. However, any database may be used that enables the systems and methods described herein. (Oracle is a registered trademark of Oracle Corporation, Redwood Shores, California; IBM is a registered trademark of International Business Machines Corporation, Armonk, New York; Microsoft is a registered trademark of Microsoft Corporation, Redmond, Washington; and Sybase is a registered trademark of Sybase, Dublin, California.)

[0032] In one non-limiting embodiment, a computer program is provided to enable the controller 16, and this program is embodied on a computer readable medium. In an example embodiment, the computer system is executed on a single computer system, without requiring a connection to a server computer. In a further embodiment, the computer system is run in a Windows® environment (Windows is a registered trademark of Microsoft Corporation, Redmond, Washington). In yet another embodiment, the computer system is run on a mainframeenvironment and a UNIX® server environment (UNIX is a registered trademark of X / Open Company Limited located in Reading, Berkshire, United Kingdom). Alternatively, the computer system is run in any suitable operating system environment. The computer program is flexible and designed to run in various different environments without compromising any major functionality. In some embodiments, the computer system includes multiple components distributed among a plurality of computing devices. One or more components may be in the form of computer-executable instructions embodied in a computer-readable medium.

[0033] The computer systems and processes are not limited to the specific embodiments described herein. In addition, components of each computer system and each process can be practiced independent and separate from other components and processes described herein. Each component and process also can be used in combination with other assembly packages and processes.

[0034] In another embodiment, the memory included in the computer system of the controller 16 may include a plurality of modules. Each module may include instructions configured to execute using at least one processor. The instructions contained in the plurality of modules may implement at least part of the methods described herein when executed by the one or more processors of the computing device.

[0035] The computer system of one embodiment includes at least one media output component for presenting information to a user. The media output component is any component capable of conveying information (e.g., such as metrics associated with the semiconductor workpiece) to a user. In some embodiments, the media output component includes an output adapter such as a video adapter, and audio adapter, and / or a haptic feedback adapter. An output adapter is operatively coupled to a processor and is further configured to be operatively coupled to an output device such as a display device (e.g., a liquid crystal display (LCD), organic light emitting diode (OLED) display, cathode ray tube (CRT), or “electronic ink” display), an audio output device (e.g., a speaker or headphones), or a haptic feedback device.

[0036] FIG. 5 is a block diagram of an example embodiment of a computing device 200 suitable for use as the controller 16 (FIG. 1). The manipulatable arm 110 may include all or a subset of the components of the computing device 200. The computing device 200 includes aprocessor 202 for executing instructions. In some embodiments, the executable instructions are stored in a memory area 204. The processor 202 may include one or more processing units e.g., in a multi-core configuration). The memory area 204 is any device allowing information such as executable instructions and / or data to be stored and retrieved. The memory area 204 may include one or more computer readable storage devices or other computer readable media, including transitory and non-transitory computer readable media.

[0037] In at least some implementations, the computing device 200 also includes at least one media output component 206 for presenting information to a user 208. The media output component 206 is any component capable of conveying information to the user 208. In some embodiments, the media output component 206 includes an output adapter such as a video adapter, an audio adapter, and / or a haptic feedback adapter. The output adapter is operatively connected to the processor 202 and operatively connectable to an output device such as a display device (e.g. , a liquid crystal display (LCD), organic light emitting diode (OLED) display, cathode ray tube (CRT), or “electronic ink” display), an audio output device (e.g., a speaker or headphones), or a haptic feedback device. In some embodiments, at least one such display device, audio device, and / or haptic feedback device is included in the media output component.

[0038] In the example embodiment, the computing device 200 includes an input device 210 for receiving input from the user 208. The input device 210 may include, for example, a keyboard, a pointing device, a mouse, a stylus, a touch sensitive panel (e.g. a touch pad or a touch screen), a gyroscope, an accelerometer, a position detector, or an audio input device. A single component such as a touch screen may function as both an output device of the media output component 206 and the input device 210.

[0039] The computing device 200 may also include a communication interface 212, which may be communicatively connected to one or more remote devices, such as the manipulatable arm 110. The communication interface 212 may include for example, a wired or wireless network adapter or a wireless data transceiver for use with a mobile phone network (e.g, Global System for Mobile communications (GSM), 3G, 4G, 5G, or Bluetooth®) or other mobile data network (e.g., Worldwide Interoperability for Microwave access (WIMAX)). In some embodiments, the communication interface 212 may communicate over the Internet via awired or wireless configuration. Additionally, or alternatively, the communication may be via an ad-hoc Bluetooth® or wireless network enabling communication with a wide-area network (WAN) and / or a local area network (LAN). The communication interface 212 may connected to the Internet via one or more gateways, routers, and network address translation (NAT) devices. The communication interface 212 may communicate with a cloud storage system (not labeled), which may be remote from or on the premises of the production facility, such as in a control or information technology room.

[0040] Stored in the memory area 204 are, for example, processor-executable instructions for providing a user interface to the user 208 via the media output component 206 and, optionally, receiving and processing input from the input device 210. The memory area 204 may include, but is not limited to, any computer-operated hardware suitable for storing and / or retrieving processor-executable instructions and / or data. The memory area 204 may include random access memory (RAM) such as dynamic RAM (DRAM) or static RAM (SRAM), readonly memory (ROM), erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), and non-volatile RAM (NVRAM). Further, the memory area 204 may include multiple storage units such as hard disks or solid-state disks in a redundant array of inexpensive disks (RAID) configuration. The memory area 204 may include a storage area network (SAN) and / or a network attached storage (NAS) system. In some embodiments, the memory area 204 includes a memory that is integrated into the computing device 200. For example, the computing device 200 may include one or more hard disk drives as the memory area 204. The memory area 204 may also include memory that is external to the computing device 200 and may be access by a plurality of computing devices. The above memory types are exemplary only and are thus not limiting as to the types of memory usable for storage of processor-executable instructions and / or data.

[0041] With reference to FIGS. 6A and 6B, an example embodiment of a method of measuring resistivity of semiconductor workpieces is illustrated and generally identified by reference numeral 600. Optionally, before measurements are taken, the anthropomorphic arm and / or the sled supporting the anthropomorphic arm may be manipulated 602 within the working volume to contact a calibration sample supported within the working volume with a resistivityprobe connected to a distal segment of the anthropomorphic arm and the resistivity probe is calibrated using the calibration sample. The anthropomorphic arm and / or the sled is then manipulated 604 within the working volume to contact a semiconductor workpiece supported at a first position within the working volume with the resistivity probe, where the first position is different than the position of the calibration sample within the working volume. The resistivity of the semiconductor workpiece in contact with the resistivity probe is measured 606 and the anthropomorphic arm and / or the sled is manipulated 608 to remove contact between the resistivity probe and the semiconductor workpiece. Optionally, the resistivity probe may be recalibrated 602. The anthropomorphic arm and / or the sled is manipulated 610 to contact a second semiconductor workpiece supported at the first position or a second position within the working volume with the resistivity probe, where the second position is different from the first position. The resistivity of the second semiconductor workpiece in contact with the resistivity probe is measured 612 and the anthropomorphic arm and / or the sled is manipulated 614 to remove contact between the resistivity probe and the second semiconductor workpiece. Optionally, the resistivity probe may be re-calibrated 602. At any point during the method, it is determined 616 if there are additional semiconductor workpieces to measure. If there are no further semiconductor workpieces to measure, the method ends 618. If there are further semiconductor workpieces to measure, the method repeats as many times as necessary.

[0042] Compared to conventional systems for measuring the electrical resistivity of semiconductor workpieces, the resistivity measurement systems for semiconductor workpieces of the present disclosure have several advantages. By employing the use of a manipulatable or anthropomorphic arm to perform electrical resistivity tests in accordance with applicable standards, constraints on the placement of the semiconductor workpieces relative to the resistivity probe are lifted. The six degrees of freedom afforded by the anthropomorphic arm enable measurements of the semiconductor workpiece in any direction or position within the anthropomorphic arms working volume, thereby reducing the size of electrical resistivity measurement machines for semiconductor workpieces. Additionally, the flexibility of the resistivity measurement systems of the present disclosure enables the semiconductor workpieces to remain stationary while the resistivity probe traverses the outer surface of the semiconductor workpiece. Calibration samples may be stored at a remote location within the working volume ofthe anthropomorphic arm, eliminating the need for users to manually load the calibrations samples. The resistivity measurement systems of the present disclosure are able to accommodate irregularities and surface roughness of the semiconductor workpiece, as well as semiconductor workpieces formed from different materials and having differing geometric shapes. As a result, a single resistivity measurement system, or a single resistivity probe, is able to measure the electrical resistivity of different types of material coming from several production lines, increasing the efficiency of the electrical resistivity measurement process, reducing the number of resistivity measurement systems required to measure differing material types, reducing cost, and decreasing the time to produce a semiconductor wafer.

[0043] As used herein, the terms “about,” “substantially,” “essentially,” and “approximately” when used in conjunction with ranges of dimensions, concentrations, temperatures, or other physical or chemical properties or characteristics is meant to cover variations that may exist in the upper and / or lower limits of the ranges of the properties or characteristics, including, for example, variations resulting from rounding, measurement methodology, or other statistical variation.

[0044] When introducing elements of the present disclosure or the embodiment(s) thereof, the articles “a,” “an,” “the,” and “said” are intended to mean that there are one or more of the elements. The terms “comprising,” “including,” “containing,” and “having” are intended to be inclusive and mean that there may be additional elements other than the listed elements. The use of the terms indicating a particular orientation (e.g., “top,” “bottom,” “side,” etc.) is for convenience of description and does not require any particular orientation of the item described.

[0045] As various changes could be made in the above constructions and methods without departing from the scope of the disclosure, it is intended that all matter contained in the above description and shown in the accompanying drawing(s) shall be interpreted as illustrative and not in a limiting sense.

Claims

WHAT IS CLAIMED IS:

1. A resistivity measurement system for semiconductor workpieces, the system comprising: an anthropomorphic arm movable about at least six axes, the anthropomorphic arm comprising: an end effector connected to a distal segment of the anthropomorphic arm; and a resistivity probe connected to the end effector, wherein the resistivity probe is configured to measure an electrical resistivity of the semiconductor workpiece; a sled connected to the anthropomorphic arm, wherein the sled is selectively movable along a seventh axis extending along a length of the sled, wherein the anthropomorphic arm and the sled cooperate to define a working volume; and a semiconductor workpiece support, wherein the semiconductor workpiece support is configured to support the semiconductor workpiece within the working volume.

2. The resistivity measurement system according to claim 1, further comprising at least two semiconductor workpiece supports positioned within the working volume of the anthropomorphic arm and the sled.

3. The resistivity measurement system according to claim 2, wherein the semiconductor workpiece support is positioned on a first side of the anthropomorphic arm and the sled, and a second semiconductor workpiece support is positioned on a second, opposite side of the anthropomorphic arm and the sled.

4. The resistivity measurement system according to claim 3, wherein the semiconductor workpiece support supports a first semiconductor workpiece having a first outerdimension, and the second semiconductor workpiece support supports a second semiconductor workpiece having a second outer dimension that is different than the first outer dimension.

5. The resistivity measurement system according to claim 4, wherein the first semiconductor workpiece includes an outer diameter of 8 inches, and the second semiconductor workpiece includes an outer diameter of 12 inches.

6. The resistivity measurement system according to claim 3, wherein the semiconductor workpiece support supports a slug, and the second semiconductor workpiece support supports an ingot.

7. The resistivity measurement system according to claim 3, wherein the semiconductor workpiece support supports a whole Czochralski silicon crystal, and the second semiconductor workpiece support supports a raw silicon ingot.

8. The resistivity measurement system according to claim 1, further comprising a first semiconductor workpiece staging area, wherein the first semiconductor workpiece staging area is configured to receive a plurality of semiconductor workpieces from a plurality of production lines, wherein the plurality of semiconductor workpieces is selected from the group consisting of slugs, chucks, whole Czochralski silicon crystals, whole Continuous Czochralski silicon crystals, ingots, and segments of whole Czochralski silicon crystals or whole Continuous Czochralski silicon crystals.

9. The resistivity measurement system according to claim 8, further comprising a controller connected to the anthropomorphic arm and the sled, wherein the controller includes aprocessor and a memory, wherein the memory has instructions stored thereon that, when executed, cause the processor to: manipulate the anthropomorphic arm to maintain contact between the resistivity probe and a slug of the plurality of semiconductor workpieces; measure an electrical resistivity of the slug in contact with the resistivity probe; manipulate the anthropomorphic arm to remove contact between the resistivity probe and the slug; manipulate the anthropomorphic arm to maintain contact between the resistivity probe and an ingot of the plurality of semiconductor workpieces; and measure an electrical resistivity of the ingot in contact with the resistivity probe.

10. The resistivity measurement system according to claim 8, further comprising: a second semiconductor workpiece staging area positioned on a first side of the anthropomorphic arm, wherein the second semiconductor workpiece staging area is configured to receive a plurality of semiconductor workpieces from a first production line, wherein the first semiconductor workpiece staging area is positioned on a second, opposite side of the anthropomorphic arm, wherein the plurality of semiconductor workpieces received by the first semiconductor workpiece staging area is received from a second production line that is different than the first production line; and a controller connected to the anthropomorphic arm and the sled, wherein the controller includes a processor and a memory, wherein the memory has instructions stored thereon that, when executed, cause the processor to: manipulate the anthropomorphic arm towards the first side of the anthropomorphic arm to maintain contact between the resistivity probe and a first semiconductor workpiece received from the first semiconductor workpiece staging area;measure an electrical resistivity of the first semiconductor workpiece in contact with the resistivity probe; manipulate the anthropomorphic arm to remove contact between the resistivity probe and the first semiconductor workpiece and towards the second side of the anthropomorphic arm; manipulate the anthropomorphic arm to maintain contact between a second semiconductor workpiece received from the second semiconductor workpiece staging area; and measure an electrical resistivity of the second semiconductor workpiece in contact with the resistivity probe.

11. A resistivity measurement system for semiconductor workpieces, the system comprising: an anthropomorphic arm movable in at least six axes, the anthropomorphic arm comprising a resistivity probe configured to measure an electrical resistivity of a semiconductor workpiece; a sled connected to the anthropomorphic arm, wherein the sled is selectively movable along a seventh axis extending along a length of the sled, wherein the anthropomorphic arm and the sled cooperate to define a working volume; a first semiconductor workpiece support positioned on a first side of the sled and within the working volume, wherein the first semiconductor workpiece support is configured to support a first semiconductor workpiece having first geometry; and a second semiconductor workpiece support positioned on a second, opposite side of the sled and within the working volume, wherein the second semiconductor workpiece support is configured to support a second semiconductor workpiece having second geometry that is different from the first geometry.

12. The resistivity measurement system according to claim 11, wherein the first geometry of the first semiconductor workpiece is a first outer dimension, and the second geometry of the second semiconductor workpiece is a second outer dimension that is different than the first outer dimension.

13. The resistivity measurement system according to claim 11 , wherein the first semiconductor workpiece support is configured to support the first semiconductor workpiece formed from a first material, and the second semiconductor workpiece support is configured to support the first semiconductor workpiece formed from a second material that is different than the first material.

14. The resistivity measurement system according to claim 13, wherein the first material is a chuck, and the second material is a whole Czochralski silicon crystals.

15. The resistivity measurement system according to claim 11, further comprising a first semiconductor workpiece staging area, wherein the first semiconductor workpiece staging area is configured to receive a plurality of semiconductor workpieces from a plurality of production lines, wherein the plurality of semiconductor workpieces is selected from the group consisting of slugs, chucks, whole Czochralski silicon crystals, whole Continuous Czochralski silicon crystals, ingots, and segments of whole Czochralski silicon crystals or whole Continuous Czochralski silicon crystals.

16. A method of measuring resistivity of a semiconductor workpiece, comprising: manipulating an anthropomorphic arm within a working volume defined by the anthropomorphic arm to contact a first semiconductor workpiece supported within the workingvolume with a resistivity probe connected to a distal segment of the anthropomorphic arm, wherein the anthropomorphic arm is movable about at least six axes; measuring a resistivity of the first semiconductor workpiece in contact with the resistivity probe; manipulating the anthropomorphic arm to remove contact between the resistivity probe and the first semiconductor workpiece; manipulating the anthropomorphic arm to contact a second semiconductor workpiece supported within the working volume with the resistivity probe; and measuring an electrical resistivity of the second semiconductor workpiece in contact with the resistivity probe.

17. The method according to claim 16, wherein the first semiconductor workpiece is supported at a first position within the working volume, and wherein the second semiconductor workpiece is supported at a second position within the working volume that is different from the first position.

18. The method according to claim 17, further comprising: manipulating the anthropomorphic arm to contact a calibration sample supported at a third location within the working volume with the resistivity probe, wherein the third location is different from each of the first location and the second location; and calibrating the resistivity probe using the calibration sample.

19. The method according to claim 17, wherein the first semiconductor workpiece and the second semiconductor workpiece are formed from a material selected from the group consisting of slugs, chucks, whole Czochralski silicon crystals, whole Continuous Czochralskisilicon crystals, ingots, and segments of whole Czochralski silicon crystals or whole Continuous Czochralski silicon crystals, wherein the first semiconductor is formed from a material that is different from the material forming the second semiconductor workpiece.

20. The method according to claim 16, wherein manipulating the anthropomorphic arm includes manipulating the anthropomorphic arm and a sled connected to the anthropomorphic arm to maintain contact between the resistivity probe and the semiconductor workpiece, wherein the sled is selectively movable along a seventh axis, wherein the anthropomorphic arm and the sled cooperate to define the working volume.

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