Optical module

Abstract

The present disclosure provides an optical module, wherein an output pin of an MCU outputs a first voltage or a second voltage, and the optical module comprises: a control circuit, an enable control pin being connected to the output pin of the MCU, a first output pin being connected to a temperature regulator, and a second output pin outputting a third voltage; and a switching transistor, a gate electrode thereof being connected to the output pin of the MCU, a source electrode thereof being connected to the second output pin of the control circuit, and a drain electrode thereof being connected to a temperature detector. When the first voltage is greater than the third voltage, the source electrode and the drain electrode are connected, so that the third voltage can be transmitted to the temperature detector by means of the switching transistor, causing the temperature detector and the temperature regulator to operate. When second voltage is less than the third voltage, the source electrode and the drain electrode are disconnected, so that the third voltage cannot be transmitted to the temperature detector by means of the switching transistor, causing the temperature detector and the temperature regulator to stop operating. Both the temperature regulator and the temperature detector operate or stop operating, thereby preventing the temperature detector from being short-circuited due to condensation.

Description

Optical module

[0001] This application claims priority to the application filed on November 20, 2024 with the China National Intellectual Property Office and application number 202422838438.9; the application filed on July 15, 2024 with the China National Intellectual Property Office and application number 202421670577.9; the application filed on September 27, 2024 with the China National Intellectual Property Office and application number 202422377073.4; the entire contents of which are incorporated herein by reference. TECHNICAL FIELD

[0002] The present disclosure relates to the field of optical fiber communication technology, in particular to an optical module. BACKGROUND

[0003] With the development of new business and application modes such as cloud computing, mobile Internet, video, etc., the development and progress of optical communication technology become increasingly important. In optical communication technology, optical modules are tools for converting optical signals and electrical signals, and are one of the key devices in optical communication equipment. With the development of optical communication technology, the transmission rate of optical modules is continuously increasing. SUMMARY

[0004] An optical module provided by an embodiment of the present disclosure includes:

[0005] A circuit board, a surface of the circuit board being provided with:

[0006] A first high-frequency signal line;

[0007] A second high-frequency signal line located on one side of the first high-frequency signal line; the second high-frequency signal line and the first high-frequency signal line are used for transmitting differential signals;

[0008] A first capacitor connected in series with the first high-frequency signal line;

[0009] A second capacitor connected in series with the second high-frequency signal line and arranged in parallel with the first capacitor;

[0010] A barrier located between the first capacitor and the second capacitor and arranged in parallel with the first capacitor and the second capacitor; both ends of the barrier are grounded;

[0011] An optical transmitting component electrically connected with the circuit board, including:

[0012] A laser chip used for emitting optical signals;

[0013] A temperature regulator located below the laser chip;

[0014] A temperature detector used for detecting temperature;

[0015] The circuit board is provided with:

[0016] The MCU outputs a first voltage or a second voltage through an output pin;

[0017] The control circuit is connected to the output pin of the MCU through an enable control pin, and a first output pin is connected to the temperature regulator to output different working currents to the temperature regulator; a second output pin outputs a third voltage, which is a constant value;

[0018] The switch tube is connected to the output pin of the MCU through a gate, connected to the second output pin of the control circuit through a source, and connected to the temperature detector through a drain;

[0019] The first voltage is greater than the third voltage, and the second voltage is less than the third voltage;

[0020] The electric connector comprises:

[0021] The first connecting part is provided with a ground layer on the upper surface;

[0022] The second connecting part is located above the first connecting part and comprises:

[0023] The ground pin is electrically connected to the laser chip;

[0024] The ground via is connected between the ground pin and the ground layer.

[0025] The present disclosure also provides an optical module, comprising:

[0026] The circuit board;

[0027] The optical emitting component is electrically connected to the circuit board and comprises:

[0028] The laser chip is used for emitting optical signals;

[0029] The temperature regulator is located below the laser chip;

[0030] The temperature detector is used for detecting temperature;

[0031] The circuit board is provided with:

[0032] The MCU outputs a first voltage or a second voltage through an output pin;

[0033] The control circuit is connected to the output pin of the MCU through an enable control pin, and a first output pin is connected to the temperature regulator to output different working currents to the temperature regulator; a second output pin outputs a third voltage, which is a constant value;

[0034] The switch tube has a gate connected to an output pin of the MCU, a source connected to a second output pin of the control circuit, and a drain connected to the temperature detector.

[0035] The first voltage is greater than the third voltage, and the second voltage is less than the third voltage. BRIEF DESCRIPTION OF DRAWINGS

[0036] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings needed to be used in the embodiments or prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present disclosure, and other drawings can be obtained by those skilled in the art without creative effort on the basis of these drawings.

[0037] FIG. 1 is a partial structure diagram of an optical communication system according to some embodiments;

[0038] FIG. 2 is a partial structure diagram of a host computer according to some embodiments;

[0039] FIG. 3A is a structure diagram one of an optical module according to some embodiments;

[0040] FIG. 3B is a structure diagram two of an optical module according to some embodiments of the present disclosure;

[0041] FIG. 3C is a structure diagram three of an optical module according to some embodiments;

[0042] FIG. 4A is an exploded view one of an optical module according to some embodiments;

[0043] FIG. 4B is an exploded view two of an optical module according to some embodiments of the present disclosure;

[0044] FIG. 5 is an internal structure diagram of an optical module according to some embodiments;

[0045] FIG. 6 is a schematic diagram of an internal structure of an optical module according to some embodiments from another perspective;

[0046] FIG. 7 is a schematic diagram one of an internal structure of an optical module according to some embodiments;

[0047] FIG. 8 is a schematic diagram two of an internal structure of an optical module according to some embodiments;

[0048] FIG. 9 is a schematic diagram three of an internal structure of an optical module according to some embodiments;

[0049] FIG. 10 is a schematic diagram four of an internal structure of an optical module according to some embodiments;

[0050] FIG. 11 is a schematic diagram of a light emitting component and a circuit board structure according to some embodiments of the present disclosure;

[0051] FIG. 12 is a partial schematic diagram of a light emitting component and a circuit board according to some embodiments of the present disclosure;

[0052] FIG. 13 is an exploded schematic diagram of a light emitting component and a circuit board according to some embodiments of the present disclosure;

[0053] FIG. 14 is an exploded schematic diagram of a light emitting component according to some embodiments;

[0054] FIG. 15 is a schematic diagram of a structure of an electrical connector according to some embodiments;

[0055] FIG. 16 is a partial cross-sectional schematic diagram of a light emitting component and a circuit board according to some embodiments;

[0056] FIG. 17 is a cross-sectional schematic diagram of a connection of a light emitting component and a circuit board according to some embodiments;

[0057] FIG. 18 is an exploded diagram of a light module according to some embodiments;

[0058] FIG. 19 is an internal structure diagram of a light module according to some embodiments;

[0059] FIG. 20 is a partial equivalent circuit diagram of a circuit board according to some embodiments;

[0060] FIG. 21 is a partial structure diagram of a circuit board according to some embodiments;

[0061] FIG. 22 is an exploded diagram of a partial structure of a circuit board according to some embodiments;

[0062] FIG. 23 is a partial exploded diagram of a partial structure of a circuit board according to some embodiments;

[0063] FIG. 24 is a cross-sectional view of a partial structure of a circuit board according to some embodiments;

[0064] FIG. 25 is a partial structure diagram of another circuit board according to some embodiments;

[0065] FIG. 26 is a partial exploded diagram of a partial structure of another circuit board according to some embodiments;

[0066] FIG. 27 is a frequency response curve simulation diagram of an insertion loss according to some embodiments. DETAILED DESCRIPTION

[0067] Some embodiments of the present disclosure will be described in detail below with reference to the drawings. However, the described embodiments are only some embodiments of the present disclosure, not all embodiments. Based on the embodiments provided in the present disclosure, all other embodiments obtained by those of ordinary skill in the art belong to the scope of protection of the present disclosure.

[0068] Unless otherwise required by the context, throughout the specification and claims, the term "comprising" is interpreted to mean "including, but not limited to"; the terms "first", "second", etc. are not used to denote or imply relative importance or an upper limit on the number; the term "multiple" means two or more; the term "connected" should be interpreted broadly, for example, "connected" can be fixedly connected, or detachably connected, or integrated, can be directly connected, or indirectly connected through an intermediate medium; the use of the terms "adapted to" or "configured to" means open and inclusive language, which does not exclude devices adapted to or configured to perform additional tasks or steps; the terms "parallel", "vertical", "same", "consistent", "flush" and the like are not limited to absolute mathematical relationships, but also include acceptable error ranges generated in practice, and differences formed based on the same design concept but due to manufacturing reasons.

[0069] In optical communication technology, in order to establish information transmission between information processing devices, information is loaded onto light, and the transmission of information is carried out by using the propagation speed of light. Such information-loaded light is an optical signal. The optical signal can reduce the loss of optical power when transmitted in an optical information transmission device, and realize long-distance transmission of the optical signal. At the same time, the cost of optical information transmission devices such as optical fibers is lower than that of electrical information transmission devices such as copper wires. Therefore, optical communication technology can realize high-speed, long-distance, and low-cost information transmission.

[0070] Information processing devices usually include optical network terminals (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., and optical information transmission devices usually include optical fibers and optical waveguides, etc. The signals that information processing devices can recognize and process are electrical signals, while optical communication technology uses optical signals for transmission, which requires optical modules to convert optical signals and electrical signals.

[0071] The optical module can realize mutual conversion between optical signals and electrical signals between the information processing device and the optical information transmission device. In some embodiments, at least one of the optical signal input end or the optical signal output end of the optical module is connected with an optical fiber, and at least one of the electrical signal input end or the electrical signal output end of the optical module is connected with an optical network terminal; a first optical signal from the optical fiber is transmitted to the optical module, the optical module converts the first optical signal into a first electrical signal, and transmits the first electrical signal to the optical network terminal; a second electrical signal from the optical network terminal is transmitted to the optical module, the optical module converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber.

[0072] Since the information transmission between multiple information processing devices can be realized through electrical signals, at least one of the multiple information processing devices needs to be directly connected with the optical module, without the need of directly connecting all the information processing devices with the optical module. Here, the information processing device directly connected with the optical module is also referred to as the host computer of the optical module. In addition, the optical signal input end or the optical signal output end of the optical module is referred to as an optical port, and the electrical signal input end or the electrical signal output end of the optical module is referred to as an electrical port.

[0073] FIG. 1 is a partial structure diagram of an optical communication system according to some embodiments. As shown in FIG. 1, the optical communication system mainly includes a remote information processing device 1000, a local information processing device 2000, a host computer 100 of an optical module, an optical module 200, an optical fiber 101, and a network cable 103, wherein the optical fiber 101 belongs to an optical information transmission device, and the network cable 103 belongs to an electrical information transmission device.

[0074] In some embodiments, one end of the optical fiber 101 extends to the direction of the remote information processing device 1000, and the other end of the optical fiber 101 is connected with the optical module 200 through the optical port of the optical module 200. The optical signal can be totally reflected in the optical fiber 101, and the propagation of the optical signal in the totally reflected direction can almost maintain the original optical power. The optical signal is totally reflected in the optical fiber 101 for multiple times, so as to transmit the optical signal from the remote information processing device 1000 to the optical module 200, or transmit the optical signal from the optical module 200 to the remote information processing device 1000, thereby realizing long-distance information transmission based on low power loss.

[0075] The optical communication system includes one or more optical fibers 101. In some embodiments, the optical fiber 101 is detachably connected with the optical module 200; in some embodiments, the optical fiber 101 is non-detachably connected with the optical module 200.

[0076] The host computer 100 is configured to provide a data signal to the optical module 200, or receive a data signal from the optical module 200, or monitor or control the working state of the optical module 200.

[0077] The host computer 100 includes a housing accommodating the optical module 200, and an optical module interface 102 disposed on the housing. The optical module 200 is inserted into the housing through the optical module interface 102, so that the host computer 100 and the optical module 200 establish a unidirectional or bidirectional electrical signal connection.

[0078] The host computer 100 further includes an external electrical interface that can access an electrical signal network. In some embodiments, the external electrical interface includes a Universal Serial Bus (USB) or a network cable interface 104. The network cable interface 104 is configured to access a network cable 103, so that the host computer 100 and the network cable 103 establish a unidirectional or bidirectional electrical signal connection.

[0079] One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so that an electrical signal connection is established between the local information processing device 2000 and the host computer 100 through the network cable 103. In some embodiments, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103, the host computer 100 generates a second electrical signal according to the third electrical signal, the second electrical signal from the host computer 100 is transmitted to the optical module 200, the optical module 200 converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber 101, and the second optical signal is transmitted to the remote information processing device 1000 in the optical fiber 101.

[0080] In some embodiments, the first optical signal from the remote information processing device 1000 propagates through the optical fiber 101, the first optical signal from the optical fiber 101 is transmitted to the optical module 200, the optical module 200 converts the first optical signal into a first electrical signal, the optical module 200 transmits the first electrical signal to the host computer 100, the host computer 100 generates a fourth electrical signal according to the first electrical signal, and transmits the fourth electrical signal to the local information processing device 2000.

[0081] In some embodiments, the optical module is a tool for converting optical signals and electrical signals, and in the conversion process of the optical signals and the electrical signals, the information does not change, and the encoding or decoding method of the information changes.

[0082] The host computer 100 includes an Optical Line Terminal (OLT), an Optical Network Terminal (ONT), or a data center server, in addition to the optical network terminal.

[0083] Figure 2 is a partial structural diagram of a host computer according to some embodiments. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 only shows the structure of the host computer 100 related to the optical module 200. As shown in Figure 2, in some embodiments, the host computer 100 further comprises a PCB circuit board 105 arranged in the accommodation cavity, and a cage 106 arranged on the surface of the PCB circuit board 105; the optical module 200 is inserted into the cage 106 and fixed by the cage 106.

[0084] In some embodiments, the cage 106 is provided with a heat sink 107, which can dissipate heat for the optical module; in some embodiments, the heat sink 107 has a protruding structure such as fins to increase the heat dissipation area.

[0085] In some embodiments, the cage 106 is internally provided with an electrical connector configured to access the electrical port of the optical module 200.

[0086] In some embodiments, the optical module 200 is inserted into the cage 106 of the host computer 100, and the optical module 200 is fixed by the cage 106. The heat generated by the optical module 200 is conducted to the cage 106, and then diffused through the heat sink 107.

[0087] In some embodiments, the optical module 200 is inserted into the cage 106 of the host computer 100, and the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, so that the optical module 200 and the host computer 100 establish electrical signal connection.

[0088] In some embodiments, the optical port of the optical module 200 is connected to the optical fiber 101, so that the optical module 200 and the optical fiber 101 establish optical signal connection.

[0089] Figure 3A is a structural diagram of an optical module according to some embodiments, Figure 3B is a structural diagram of an optical module according to some embodiments of the present disclosure, Figure 3C is a structural diagram of an optical module according to some embodiments, Figure 4A is an exploded view of an optical module according to some embodiments, and Figure 4B is an exploded view of an optical module according to some embodiments of the present disclosure. As shown in Figures 3A to 4B, in some embodiments, the optical module 200 comprises a shell comprising an upper shell 201 and a lower shell 202. The upper shell 201 covers the lower shell 202 to form a shell having two openings 204 and 205, one of which is an electrical port and the other of which is an optical port. In some embodiments, the shell forms an opening which is both an electrical port and an optical port.

[0090] In some embodiments, the outer contour of the shell generally presents a square body.

[0091] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal material, which is conducive to electromagnetic shielding and heat dissipation.

[0092] The upper shell 201 and the lower shell 202 are combined to facilitate the installation of the circuit board 300, the light emitting component 400 and the like into the shells, and the shells can encapsulate and protect the components. In addition, when the circuit board 300, the light emitting component 400 and the light receiving component 500 and the like are assembled, the positioning components, the heat dissipation components and the electromagnetic shielding components of the components can be arranged, which is conducive to the automatic production.

[0093] The direction of the line connecting the two openings 204 and 205 can be consistent with the length direction of the optical module 200, or can be inconsistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 (the right end of FIG. 3A or FIG. 3B), and the opening 205 is also located at the end of the optical module 200 (the left end of FIG. 3A or FIG. 3B). Alternatively, the opening 204 is located at the end of the optical module 200, and the opening 205 is located at the side of the optical module 200.

[0094] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the shell.

[0095] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and perpendicular to the cover plate 2011, and the two upper side plates and the two lower side plates 2022 are combined to cover the lower shell 202 by the upper shell 201.

[0096] As shown in FIGS. 3A-4B, in some embodiments, the optical module includes a circuit board 300 disposed in the housing, which includes circuit traces, electronic components, and chips, etc. The electronic components and chips are connected according to the circuit design through the circuit traces to achieve the functions of power supply, electrical signal transmission, and grounding, etc. The electronic components may, for example, include capacitors, resistors, transistors, metal-oxide-semiconductor field-effect transistors (MOSFETs). The chips may, for example, include microcontroller units (MCUs), laser drive chips, transimpedance amplifiers (TIAs), limiting amplifiers (LAs), clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0097] In some embodiments, the circuit board includes a rigid circuit board, which, due to its relatively hard material, can also achieve a bearing function, such as the rigid circuit board can stably bear the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0098] In some embodiments, the circuit board further includes a flexible circuit board, which can be used independently; it can also be used in cooperation with the rigid circuit board. The light emitting component 400 and / or the light receiving component 500 are located on the side of the circuit board 300 away from the gold finger 301; in some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300, and then are electrically connected to the circuit board 300 through the corresponding flexible circuit board or electrical connector; in some embodiments, the light emitting component and / or the light receiving component can be directly disposed on the circuit board 300, which can be disposed on the surface of the circuit board or on the side of the circuit board.

[0099] In some embodiments, the circuit board further includes a gold finger 301 formed on the surface of the end thereof, which is composed of a plurality of pins independent of each other. The circuit board 300 is inserted into the cage 106, and the gold finger 301 is in conduction with the electrical connector in the cage 106. The gold finger 301 can be disposed only on the surface (e.g., the upper surface shown in FIG. 4A) on one side of the circuit board 300, or can be disposed on the surfaces on both upper and lower sides of the circuit board 300 to provide more pins. The gold finger 301 is configured to establish electrical connection with the host computer to achieve the functions of power supply, grounding, I2C signal transmission, data signal transmission, etc.

[0100] In some embodiments, the gold fingers are arranged on the surface of one side of the circuit board 300 (e.g., the upper surface shown in FIG. 4A); in some embodiments, the gold fingers are arranged on the surfaces of both upper and lower sides of the circuit board 300 to provide a larger number of pins to accommodate situations where a large number of pins are required.

[0101] In some embodiments, the openings 204 are electrical ports through which the gold fingers 301 of the circuit board 300 extend and are inserted into the electrical connectors of the host computer 100; the circuit board is inserted into the cage 106 and is electrically connected to the electrical connectors in the cage 106 via the gold fingers. The gold fingers are configured to establish electrical connections with the host computer and enable electrical connection functions such as power supply, grounding, Inter-Integrated Circuit (I2C) signal transmission, data signal transmission, and the like.

[0102] In some embodiments, the openings 205 are optical ports configured to access the optical fiber 101 so that the optical fiber 101 is connected to the optical transmitting component 400 and / or the optical receiving component 500 in the optical module 200.

[0103] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside the housing of the optical module 200. The unlocking component 600 is configured to enable or disable the fixed connection between the optical module 200 and the host computer.

[0104] For example, the unlocking component 600 is located outside the two lower side plates 2022 of the lower housing 202 and includes a clamping component that matches the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the clamping component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the clamping component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the clamping component and the host computer to disable the fixation of the optical module 200 to the host computer, so that the optical module 200 can be pulled out of the cage 106.

[0105] In some embodiments, the optical module includes an optical transmitting component 400, as shown in FIGS. 3A-4B. The optical transmitting component 400 is configured to transmit optical signals.

[0106] FIG. 5 is a diagram of the internal structure of an optical module according to some embodiments. FIG. 6 is a diagram of the internal structure of an optical module according to some embodiments, viewed from another perspective. As shown in FIGS. 5 and 6, in some embodiments, the optical module includes an optical receiving component 500. The optical receiving component 500 is configured to receive optical signals and convert the optical signals into electrical signals.

[0107] In some embodiments, at least one of the optical transmitting component 400 or the optical receiving component 500 is located on the side of the circuit board 300 that is away from the gold fingers.

[0108] In some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300, and then are electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors, respectively.

[0109] In some embodiments, at least one of the light emitting component 400 or the light receiving component 500 can be directly disposed on the circuit board 300. For example, the light receiving component 500 can be disposed on a surface of the circuit board 300.

[0110] In some embodiments, the light emitting component 400 can be disposed on a surface of the circuit board 300.

[0111] In some embodiments, the circuit board 300 can have an embedding entrance 3401. The light emitting component 400 can be placed at the embedding entrance 3401 of the circuit board 300. The light module can include a support plate 900. The support plate 900 can be embedded at the embedding entrance 3401 of the circuit board 300. The support plate 900 can support the light emitting component 400, so that the light emitting component 400 can be embedded at the embedding entrance 3401 of the circuit board 300.

[0112] As shown in FIG. 5, in some embodiments, the light emitting component 400 can include a laser chip array 4100, which can emit light signals. The laser chip array 4100 can include at least one laser chip 4110. For example, the laser chip 4110 is a 100G EML laser chip, and one 100G EML laser chip emits one wavelength of 100G light signals according to a driving current, so that the laser chip array 4100 emits 8 channels of 100G light signals.

[0113] In some embodiments, the light emitting component 400 can include a lens array 420, which can converge the light signals. The lens array 420 can include at least one lens 421. One lens 421 corresponds to one laser chip 4110.

[0114] In some embodiments, the light emitting component 400 can include an optical fiber array 4301, which can receive the light signals converged by the lens array 420. The optical fiber array 4301 includes a plurality of optical fibers. One focusing lens corresponds to one optical fiber. For example, the lens array 420 focuses 8 channels of 100G light signals into respective optical fibers in the optical fiber array 4301.

[0115] In some embodiments, the light emitting component 400 can include a temperature regulator 440. The temperature regulator 440 can be a Thermo Electric Cooler (TEC). The temperature regulator 440 can be disposed on the support plate 900. The laser chip array 4100 can be placed on the temperature regulator 440, so that the working temperature of the laser chip array 4100 can be controlled within a target temperature range. The lens array 420 can be placed on the temperature regulator 440, so that the lens array 420 is at a stable temperature, and the center axis of the lens array 420 is less likely to move up or down due to a large temperature change, and thus the center axis of the lens array 420 can be aligned with the light exit port of the laser chip array 4100.

[0116] In some embodiments, the temperature regulator 440 can include a first electrode column 441 and a second electrode column 442. The first electrode column 441 and the second electrode column 442 can receive working current, so that the temperature regulator 440 can work to achieve refrigeration or heating.

[0117] In some embodiments, the light emitting component 400 can include a temperature detector 450. The temperature detector 450 can be disposed on the side of the laser chip array 4100, such as the temperature detector 450 can be placed on the temperature regulator 440. The temperature detector 450 is a temperature sensitive element, and its resistance value changes with temperature, so the temperature around the temperature detector can be determined by the resistance value of the temperature detector, and thus the working temperature of the laser chip array 4100 can be monitored. For example, the temperature detector 450 detects the temperature of the temperature regulator 440, and the temperature of the temperature regulator 440 is identified as the working temperature of the laser chip array 4100.

[0118] FIG. 7 is a schematic diagram of an internal structure of a light module according to some embodiments. As shown in FIGS. 5 and 7, in some embodiments, the surface of the circuit board 300 can be provided with a control circuit 320. The first output pin 322 of the control circuit 320 can be connected with the temperature regulator 440, to provide different working current to the temperature regulator 440, so that the temperature regulator 440 can work or stop working, or the temperature regulator 440 can work to heat or cool according to the working current, so that the temperature of the laser chip array 4100 can be controlled within a target temperature range. For example, the control circuit 320 can be a TEC control chip.

[0119] In some embodiments, the first output pin 322 of the control circuit 320 can include a first sub-output pin 3221 and a second sub-output pin 3222, the first sub-output pin 3221 can be connected with the first electrode column 441, and the second sub-output pin 3222 can be connected with the second electrode column 442, so as to facilitate the control circuit 320 to provide the operating current to the temperature regulator 440.

[0120] In some embodiments, the second output pin 323 of the control circuit 320 can be connected with the temperature detector 450, so as to provide a reference voltage to the temperature detector 450, so that the temperature detector 450 can work. The reference voltage is the third voltage, and the third voltage is a constant value.

[0121] In some embodiments, the surface of the circuit board 300 can be provided with the MCU 310. The output pin 311 of the MCU 310 is connected with the enable control pin 321 of the control circuit 320, so that the MCU 310 can control the first output pin 322 of the control circuit 320 to output the operating current, thereby realizing the heating or cooling of the temperature regulator 440, so that the working temperature of the laser chip array 4100 can be controlled within the target temperature range.

[0122] The voltage signal output by the output pin 311 of the MCU 310 is variable, and the voltage signal output by the output pin 311 of the MCU 310 changes between the first voltage and the second voltage. The first voltage is greater than the second voltage, the first voltage is greater than the third voltage, and the second voltage is less than the third voltage. For example, the first voltage is 303V, the second voltage is 0V, and the third voltage is 2.5V.

[0123] After the optical module enters the low-power consumption mode, the control circuit 320 stops working. However, since the temperature detector 450 is continuously powered, the temperature detector 450 is always in the working state. When the difference between the ambient temperature and the temperature of the temperature detector 450 is large, condensation is formed on the surface of the temperature detector 450, thereby causing the temperature detector 450 to be short-circuited and burned out.

[0124] The second output pin 323 of the control circuit 320 is not controlled by the voltage signal received by the enable control pin 321 of the control circuit 320. Therefore, whether the voltage signal output by the output pin 311 of the MCU 310 is the first voltage or the second voltage, the second output pin 323 of the control circuit 320 can output the third voltage. If the second output pin 323 of the control circuit 320 is directly connected with the temperature detector 450, then the temperature detector 450 can work no matter whether the output pin 311 of the MCU 310 outputs the first voltage or the second voltage.

[0125] But the first output pin 322 of the control circuit 320 is controlled by the voltage signal received by the enable control pin 321 of the control circuit 320. When the voltage signal received by the enable control pin 321 of the control circuit 320 is the first voltage, the control circuit 320 can work, the first output pin 322 of the control circuit 320 can output working current which is not zero, the temperature regulator 440 can receive the working current which is not zero, so that the temperature regulator 440 can work. When the voltage signal received by the enable control pin 321 of the control circuit 320 is the second voltage, the control circuit 320 stops working, the first output pin 322 of the control circuit 320 cannot output working current, i.e. the first output pin 322 of the control circuit 320 outputs working current which is zero, the temperature regulator 440 cannot receive the working current, so that the temperature regulator 440 stops working.

[0126] The output pin 311 of the MCU 310 can output the first voltage or the second voltage, and the voltage signal received by the enable control pin 321 of the control circuit 320 can be the first voltage or the second voltage. In order to solve this problem, in some embodiments, the first voltage output by the output pin 311 of the MCU 310 can be controlled, so that the control circuit 320 and the temperature regulator 440 can work, the difference between the ambient temperature and the temperature of the temperature detector 450 is small, and the temperature detector 450 is prevented from being short-circuited due to condensation.

[0127] When the output pin 311 of the MCU 310 outputs the first voltage, the temperature detector 450 can work, the first voltage is received by the enable control pin 321 of the control circuit 320, so that the control circuit 320 works, and the temperature regulator 440 also works. When the temperature regulator 440 and the temperature detector 450 work, the difference between the ambient temperature and the temperature of the temperature detector 450 is small, and the temperature detector 450 surface will not form condensation, so that the temperature detector 450 is prevented from being short-circuited.

[0128] Figure 8 is a schematic diagram of the internal structure of a light module according to some embodiments. As shown in Figure 8, in order to solve this problem, in some embodiments, a switch tube 330 can be provided between the control circuit 320 and the temperature detector 450. A first voltage can be output by the output pin 311 of the MCU 310 to make the control circuit 320, the temperature regulator 440 and the temperature detector 450 all work, or a second voltage can be output by the output pin 311 of the MCU 310 to make the control circuit 320, the temperature regulator 440 and the temperature detector 450 all stop working. Both the control circuit 320, the temperature regulator 440 and the temperature detector 450 working or the control circuit 320, the temperature regulator 440 and the temperature detector 450 stopping working can avoid the difference between the ambient temperature and the temperature of the temperature detector 450 being large, thereby avoiding the temperature detector 450 being short-circuited due to condensation. The control circuit 320, the temperature regulator 440 and the temperature detector 450 stopping working can also reduce the working time of the temperature regulator 440, thereby reducing the overall power consumption of the light module.

[0129] In some embodiments, the switch tube 330 can include a gate 331, which can be connected with the output pin 311 of the MCU 310 to receive the signal output by the output pin 311 of the MCU 310.

[0130] The switch tube 330 can include a source 332. The source 332 can be connected with the second output pin 323 of the control circuit 320 to receive the third voltage output by the second output pin 323 of the control circuit 320.

[0131] The switch tube 330 can include a drain 333. The drain 333 can be connected with the power supply pin 451 of the temperature detector 450 to provide the third voltage for the temperature detector 450.

[0132] The switch tube 330 is an N-MOS tube. The N-MOS tube is turned on when the voltage of the gate is greater than the voltage of the source, and is turned off when the voltage of the gate is less than the voltage of the source. Therefore, when the gate 331 of the switch tube 330 is the first voltage and the source 332 of the switch tube 330 is the third voltage, the first voltage is greater than the third voltage, the source 332 of the switch tube 330 and the drain 333 of the switch tube 330 are turned on, so that the reference voltage of the source 332 of the switch tube 330 can be transmitted to the temperature detector 450 through the switch tube 330, and the temperature detector 450 works. When the gate 331 of the switch tube 330 is the second voltage and the source 332 of the switch tube 330 is the third voltage, the second voltage is less than the third voltage, the source 332 of the switch tube 330 and the drain 333 of the switch tube 330 are turned off, so that the reference voltage of the source 332 of the switch tube 330 cannot be transmitted to the temperature detector 450 through the switch tube 330, and the temperature detector 450 stops working.

[0133] The output pin 311 of the MCU 310 outputs the second voltage, the enable control pin 321 of the control circuit 320 receives the second voltage, so that the control circuit 320 stops working, and the temperature regulator 440 also stops working. The output pin 311 of the MCU 310 outputs the second voltage, the gate 331 of the switch tube 330 receives the second voltage, the source 332 of the switch tube 330 is the third voltage, the second voltage is less than the third voltage, the source 332 and the drain 333 of the switch tube 330 are turned off, the reference voltage output by the second output pin 323 of the control circuit 320 cannot be transmitted to the temperature detector 450 through the switch tube 330, and the temperature detector 450 also stops working. Since the temperature regulator 440 stops working, the temperature detector 450 also stops working, the difference between the ambient temperature and the temperature of the temperature detector 450 is small, and condensation is not formed on the surface of the temperature detector 450, so that the temperature detector 450 is prevented from being short-circuited.

[0134] FIG. 9 is a schematic diagram III of the internal structure of the optical module according to some embodiments. As shown in FIG. 9, in some embodiments, the output pin 452 of the temperature detector 450 can be connected to the input pin 312 of the MCU 310, so that the MCU 310 can obtain the resistance value of the temperature detector 450. The MCU 310 can calculate the actual temperature of the temperature detector 450 according to the resistance value of the temperature detector 450.

[0135] In some embodiments, the MCU 310 can include a first clock pin 313 and a first data pin 314, the control circuit 320 can include a second clock pin 325 and a second data pin 326, the first clock pin 313 of the MCU 310 can be connected with the second clock pin 325 of the control circuit 320, and the first data pin 314 of the MCU 310 can be connected with the second data pin 326 of the control circuit 320, so that the MCU and the control circuit can be connected through the I2C 350.

[0136] The MCU 310 can obtain a control signal according to the actual temperature and the preset temperature, and transmit the control signal to the control circuit 320 through the I2C 350. The control circuit 320 can adjust the working current of the temperature regulator 440 according to the control signal.

[0137] Alternatively, the MCU 310 can transmit the actual temperature and the preset temperature to the control circuit 320 through the I2C 350. The control circuit 320 adjusts the working current of the temperature regulator 440 according to the actual temperature and the preset temperature.

[0138] FIG. 10 is a schematic diagram of the internal structure of an optical module according to some embodiments. As shown in FIG. 10, in some embodiments, the output pin 452 of the temperature detector 450 can be connected with the input pin 324 of the control circuit 320, so that the control circuit 320 can obtain the resistance value of the temperature detector 450. The control circuit 320 can calculate the actual temperature of the temperature detector 450 according to the resistance value of the temperature detector 450. The control circuit 320 can adjust the working current of the temperature regulator 440 according to the actual temperature and the preset temperature. The preset temperature can be stored in the control circuit 320, or transmitted to the control circuit 320 by the MCU 310 through the I2C.

[0139] In order to improve the signal transmission quality of the optical transmitting assembly, the application further discloses an electrical connector which can shorten the return path of high-speed signals, thereby facilitating the ground return of high-speed signals and improving the signal transmission quality.

[0140] FIG. 11 is a schematic diagram of an optical transmitting assembly and a circuit board structure according to some embodiments of the present disclosure. FIG. 12 is a schematic diagram of a partial circuit board of an optical transmitting assembly according to some embodiments of the present disclosure. FIG. 13 is an exploded schematic diagram of a circuit board of an optical transmitting assembly according to some embodiments of the present disclosure. As shown in FIGS. 11 to 13, the circuit board 300 is provided with a first avoiding opening 3001, and the optical transmitting assembly is located in the first avoiding opening 3001.

[0141] In some embodiments, the first avoiding opening 3001 is located on one side of the circuit board, and the opening thereof is in communication with the outside. The circuit board is provided with a signal pin area, and the optical transmitting assembly is wire-bonded with the signal pin area.

[0142] In some embodiments, the first avoiding port 3001 is located in the middle of the circuit board width, and the circuit board is provided around the four sides of the first avoiding port 3001.

[0143] FIG. 14 is an exploded schematic view of a light emitting component according to some embodiments. As shown in FIG. 14, the light emitting component can include: the light emitting component includes an emitting shell 410 and an electrical connector 430. One side wall of the emitting shell 410 is provided with a first through hole 4103, and the opposite side wall of the first through hole 4103 is provided with the electrical connector 430. The emitting shell 410 is provided with a light emitting assembly.

[0144] The other side wall of the emitting shell 410 can be provided with a first opening 4101. The electrical connector 430 can be arranged at the first opening 4101.

[0145] The first through hole 4103 is arranged on the emitting shell 410, the first through hole 4103 communicates the inner cavity of the emitting shell 410, and the first through hole 4103 is connected with the fiber optic adapter 700.

[0146] Exemplarily, the emitting shell 410 is an emitting tube shell, and the light emitting assembly arranged inside includes: a laser array 411, a lens array 412, and a light multiplexing assembly 413. The laser array 411 emits light of different wavelengths, and each light beam is sequentially processed by the converging lenses in the lens array 412, and is converted from a diverging state to a converging state, and then is processed by the light multiplexing assembly 413 to combine the light of different wavelengths into a light beam. After the collimating processing of the collimating lens in the fiber optic adapter 700, the light is converted into parallel light, and is emitted from the emitting shell 410 in the form of parallel light.

[0147] In some embodiments, the shell bottom 4102 of the emitting shell 410 is connected with the electrical connector 430 to support the electrical connector 430. In some embodiments, the lower surface of the electrical connector 430 can be higher than the shell bottom 4102.

[0148] FIG. 15 is a structural schematic view of an electrical connector according to some embodiments. As shown in FIG. 15, the electrical connector 430 can be located at the first opening 4101.

[0149] The first opening 4101 is arranged on the emitting shell 410, and the first through hole 4103 and the first opening 4101 are respectively located on opposite sides of the emitting shell.

[0150] In some embodiments, the electrical connector 430 is located at the first opening 4101, one side of the electrical connector 430 is inserted into the emission shell 410, and the other side is exposed outside the emission shell 410, so that the emission shell 410 and the electrical connector are assembled to form a light emission cavity. One end of the electrical connector 430 located inside the emission shell is connected to the laser array 411 through a gold wire, and the other end of the electrical connector 430 located outside the emission shell is connected to the circuit board through a flexible circuit board 320, which transmits the electrical signals, working signals and the like generated by the circuit board 300 to the laser array 411 to drive each laser chip to emit laser beams of different wavelengths. Or the other end of the electrical connector 430 located outside the emission shell is connected to the circuit board through wire bonding.

[0151] FIG. 16 is a partial cross-sectional view of a light emission component and a circuit board according to some embodiments. FIG. 17 is another partial cross-sectional view of a light emission component and a circuit board according to some embodiments. As shown in FIGS. 16 and 17, the electrical connector 430 can include a first connecting portion 431 and a second connecting portion 432. The second connecting portion 432 is located above the first connecting portion 431.

[0152] One end of the first connecting portion 431 protrudes from the second connecting portion 432. For convenience of description, the end of the first connecting portion 431 protruding from the second connecting portion 432 is referred to as a support plane 4311.

[0153] In some embodiments, the first end of the second connecting portion 432 is flush with the first end of the first connecting portion 431, and the first end of the second connecting portion 432 and the first end of the first connecting portion 431 are located inside the emission shell 410.

[0154] The second end of the second connecting portion 432 protrudes from the second end of the first connecting portion 431, and the second end of the second connecting portion 432 and the second end of the first connecting portion 431 are located outside the emission shell 410.

[0155] The upper surface of the second connecting portion 432 is provided with a ground layer 434.

[0156] In some embodiments, the ground layer 434 is provided between the first connecting portion 431 and the second connecting portion 432. The ground layer 434 covers the surface of the second connecting portion 432.

[0157] The electrical connector 430 can include a third connecting portion 433. The third connecting portion 433 is located above the second connecting portion 432, and the third connecting portion 433 is connected to the first opening 4101. The width of the third connecting portion 433 is smaller than the width of the second connecting portion 432, so that part of the second connecting portion 432 is located inside the emission shell 410, and the other part of the second connecting portion 432 is located outside the emission shell 410.

[0158] The part of the second connecting portion 432 inside the emitting shell 410 forms an inner connecting portion 4321. The inner connecting portion 4321 is electrically connected with the laser array 411. The part of the second connecting portion 432 outside the emitting shell 410 forms an outer connecting portion 4322. The outer connecting portion 4322 is electrically connected with the circuit board.

[0159] In some embodiments, the inner connecting portion 4321 is provided with a first grounding pin, which is electrically connected with the laser array 411.

[0160] In some embodiments, the first grounding pin is wire-bonded with the laser array 411.

[0161] The first grounding pin can be connected with the second grounding pin; or the first grounding pin and the second grounding pin can be a piece of metal wire.

[0162] The outer connecting portion 4322 can be provided with a second grounding pin, which is electrically connected with the circuit board. In some embodiments, the upper surface of the circuit board can be provided with a grounding pad, and the second grounding pin is connected with the grounding pad.

[0163] In some embodiments, the upper surface of the second connecting portion 432 can be provided with a grounding pin, wherein the first end of the grounding pin is located inside the emitting shell 410, and the first end of the grounding pin can be electrically connected with the laser array 411. The second end of the grounding pin is located outside the emitting shell 410, and the second end of the grounding pin can be electrically connected with the grounding pad of the circuit board.

[0164] In some embodiments, the second connecting portion 432 can be provided with a grounding via 435. One end of the grounding via 435 is connected with the grounding pin, and the other end of the grounding via 435 is connected with the grounding layer 434.

[0165] In some embodiments, the grounding via 435 can be located in the inner connecting portion 4321, or the grounding via 435 can be located in the outer connecting portion 4322; or the grounding via 435 can be located in the inner connecting portion 4321 and the outer connecting portion 4322.

[0166] The second end of the first connecting portion 431 protrudes from the second connecting portion 432, and the lower surface of the circuit board 300 can be electrically connected with the first connecting portion 431. In some embodiments, the second end of the first connecting portion 431 is electrically connected with the lower surface of the circuit board 300. The conductive glue 3301 is provided between the second end of the first connecting portion 431 and the lower surface of the circuit board 300.

[0167] In some embodiments, the thickness of the circuit board body 310 is greater than the thickness of the second connecting portion 432, so the circuit board 300 can include a first extension portion 320. The thickness of the first extension portion 320 is less than the thickness of the circuit board body 310.

[0168] The second end of the first connecting portion 431 is connected with the lower surface of the first extending portion 320. The lower surface of the first extending portion 320 is concave upward, so that the thickness of the first extending portion 320 is less than the thickness of the circuit board body 310. The second end of the first connecting portion 431 is located below the first extending portion 320.

[0169] The second connecting portion 432 can abut against the side wall of the first extending portion 320.

[0170] The upper surface of the second connecting portion 432 is flush with the upper surface of the first extending portion 320. The upper surface of the first extending portion 320 can be provided with a first ground pad, and the second end of the ground pin can be electrically connected with the first ground pad.

[0171] The lower surface of the first extending portion 320 can be provided with a ground metal layer, and the ground metal layer can be connected with the ground layer 434 through conductive glue.

[0172] The first extending portion 320 can include a circuit through hole 340, one end of the circuit through hole 340 can be connected with the first ground pad, and the other end of the circuit through hole 340 can be connected with the ground metal layer.

[0173] In some embodiments of the present application, the sum of the thickness of the first connecting portion 431 and the thickness of the second connecting portion 432 is greater than or equal to the thickness of the circuit board body 310.

[0174] The thickness of the circuit board body can be 0.9mm-1.1mm. The thickness of the second connecting portion is 0.45mm-0.55mm. The thickness of the first connecting portion 431 can be 0.6mm-1.1mm.

[0175] The thickness of the first extending portion 320 can be 0.45mm-0.55mm.

[0176] In some embodiments, the thickness of the circuit board body can be greater than or equal to 2 times the thickness of the second connecting portion. The thickness of the circuit board body can be greater than or equal to 2 times the thickness of the first extending portion 320.

[0177] In some embodiments of the present application, the ground wire of the laser array is connected with the ground pin of the second connecting portion through wire bonding, and the ground pin is connected with the ground layer 434 of the first connecting portion through the ground via hole 435. The ground layer 434 can be electrically connected with the ground metal layer on the lower surface of the circuit board through conductive glue 3200, and the ground metal layer is connected with the ground pad on the upper surface of the circuit board through the circuit through hole 340, and is connected with the gold finger through the internal wire of the circuit board.

[0178] The signal return path of the laser array can be returned to the ground pin of the second connecting part through the ground wire, conducted to the ground layer 434 through the ground via 435, and returned to the ground pad on the upper surface of the circuit board through the conductive adhesive 3200, the ground metal layer on the lower surface of the circuit board, and the circuit via 340.

[0179] In the embodiments of the present application, the electrical connector 430 has a full-surface ground layer 434, which increases the area of signal return and is beneficial to the ground return of high-speed signals and improves the signal transmission quality. The vertical distance between the ground layer 434 and the upper surface of the second connecting part 432 is less than the thickness of the circuit board body, so that the return path of high-speed signals is shortened, which is beneficial to the ground return of high-speed signals and improves the signal transmission quality.

[0180] In some embodiments, the electrical connector 430 can be connected with flexible circuit boards, and specific examples can be set according to actual needs. For example, the first connecting part is connected with a first flexible circuit board, and the second connecting part is connected with a second flexible circuit board. The first flexible circuit board is connected with the lower surface of the circuit board, and the second flexible circuit board is connected with the upper surface of the circuit board.

[0181] In order to reduce the influence of parasitic capacitance on the circuit board on signal transmission, in some embodiments, a blocking piece is further arranged on the circuit board to reduce the parasitic capacitance generated by the coupling of electrical devices on the circuit board.

[0182] FIG. 18 is an exploded view III of an optical module according to some embodiments, and FIG. 19 is an internal structure diagram of an optical module according to some embodiments. As shown in FIGS. 18 and 19, in some embodiments, the surface of the circuit board 300 is provided with a high-frequency signal processing piece 302. The high-frequency signal processing piece 302 can receive high-frequency signals and process the high-frequency signals. For example, the high-frequency signal processing piece 302 can be a driving chip, which can receive high-frequency signals and emit driving signals according to the high-frequency signals. The high-frequency signal processing piece 302 can be a DSP chip, which can receive high-frequency signals, process the high-frequency signals, and emit the processed high-frequency signals.

[0183] In some embodiments, the circuit board 300 can have a high-frequency signal line, a first end of the high-frequency signal line is connected with a source end, and a second end of the high-frequency signal line is connected with a terminal end. For example, the source end can be the gold finger 301, the terminal end can be the high-frequency signal processing piece 302, the first end of the high-frequency signal line is connected with the gold finger 301, and the second end of the high-frequency signal line is connected with the high-frequency signal processing piece 302.

[0184] The high-frequency signal line can be a single-ended signal line or a differential signal line. The differential signal line has the advantages of strong anti-interference ability, effective suppression of electromagnetic interference, and low power consumption, and therefore, the high-frequency signal processing piece 302 can be connected with the gold finger 301 through a differential signal line.

[0185] In some embodiments, the high-frequency signal lines can include a first high-frequency signal line 306 and a second high-frequency signal line 307, the second high-frequency signal line 307 being located on one side of the first high-frequency signal line 306, the first high-frequency signal line 306 being used to transmit a first high-frequency signal, and the second high-frequency signal line 307 being used to transmit a second high-frequency signal.

[0186] In some embodiments, the first high-frequency signal and the second high-frequency signal are not related, and the first high-frequency signal line 306 and the second high-frequency signal line 307 are two independent single-ended signal lines.

[0187] In some embodiments, the first high-frequency signal and the second high-frequency signal have equal amplitudes and opposite phases, so as to transmit a differential signal by the differential signal line. One end of the first high-frequency signal line 306 can be connected with the gold finger 301, and the other end of the first high-frequency signal line 306 can be connected with the high-frequency signal processing piece 302. One end of the second high-frequency signal line 307 can be connected with the gold finger 301, and the other end of the second high-frequency signal line 307 can be connected with the high-frequency signal processing piece 302.

[0188] In some embodiments, a differential capacitor is arranged on the differential signal line. The differential capacitor is a circuit composed of two capacitors in parallel, and the electrode plates of the two capacitors are opposite, that is, they are symmetrically arranged. The differential capacitor can effectively filter out common-mode noise in the differential signal and improve the anti-interference ability of the signal. For example, the first high-frequency signal line 306 is connected in series with a first capacitor 303, the second high-frequency signal line 307 is connected in series with a second capacitor 304, the first capacitor 303 and the second capacitor 304 have the same size, the first capacitor 303 and the second capacitor 304 have the same capacitance value, and the first capacitor 303 and the second capacitor 304 are arranged side by side along the width direction of the circuit board, that is, the first end face of the first capacitor 303 is flush with the first end face of the second capacitor 304, and the second end face of the first capacitor 303 is flush with the second end face of the second capacitor 304.

[0189] To ensure the integrity of the signal during transmission, the first high-frequency signal line 306 and the second high-frequency signal line 307 are required to have a preset differential line impedance. The differential line impedance is related to the distance between the differential signal lines, that is, the distance between the differential signal lines increases, and the differential signal line impedance also increases accordingly. When the differential impedance of the first high-frequency signal line 306 and the second high-frequency signal line 307 reaches the preset differential line impedance, the distance between the first high-frequency signal line 306 and the second high-frequency signal line 307 is close, and the distance between the first capacitor 303 and the second capacitor 304 is close. The first high-frequency signal line 306 and the second high-frequency signal line 307 are coupled to each other to generate a parasitic capacitance, and the first electrode plate of the first capacitor 303 and the first electrode plate of the second capacitor 304 generate a parasitic capacitance, and the second electrode plate of the first capacitor 303 and the second electrode plate of the second capacitor 304 generate a parasitic capacitance. The parasitic capacitance will increase the loss, thereby affecting the bandwidth.

[0190] However, the coupling plane (i.e. thickness) of the first high-frequency signal line 306 and the second high-frequency signal line 307 is much smaller than the coupling plane (i.e. thickness) of the first capacitor 303 and the second capacitor 304, that is, the parasitic capacitance generated by the mutual coupling of the first high-frequency signal line 306 and the second high-frequency signal line 307 is much smaller than the parasitic capacitance generated by the mutual coupling of the first capacitor 303 and the second capacitor 304, so only the parasitic capacitance generated by the mutual coupling of the first capacitor 303 and the second capacitor 304 needs to be considered.

[0191] When the distance between the first capacitor 303 and the second capacitor 304 is greater than the first preset value, the parasitic capacitance generated by the mutual coupling of the first capacitor 303 and the second capacitor 304 is not considered. When the distance between the first capacitor 303 and the second capacitor 304 is less than the first preset value 3W, the parasitic capacitance generated by the mutual coupling of the first capacitor 303 and the second capacitor 304 is considered. For example, the first preset value is 3W, and W refers to the width of the first electrode plate of the first capacitor 303.

[0192] To solve this problem, in some embodiments, a barrier 305 can be provided between the first capacitor 303 and the second capacitor 304, and the barrier 305 and the first capacitor 303 and the second capacitor 304 can be arranged side by side along the width direction of the circuit board 300 to separate the first capacitor 303 and the second capacitor 304, reduce the parasitic capacitance generated by the mutual coupling of the first capacitor 303 and the second capacitor 304, and thereby reduce the loss, thereby increasing the bandwidth.

[0193] In some embodiments, the height of the bottom surface of the barrier 305 can be lower than or equal to the height of the bottom surface of the first capacitor 303 and the second capacitor 304, and the height of the top surface of the barrier 305 can be higher than or equal to the height of the top surface of the first capacitor 303 and the second capacitor 304, so that the barrier 305 can completely separate the first capacitor 303 and the second capacitor 304 in the height direction, reducing the parasitic capacitance generated by the mutual coupling of the first capacitor 303 and the second capacitor 304. Here, the bottom surface of the barrier 305 refers to the lowest surface of the barrier 305, the bottom surface of the first capacitor 303 refers to the lowest surface of the first capacitor 303, and the bottom surface of the second capacitor 304 refers to the lowest surface of the second capacitor 304.

[0194] In some embodiments, the first end surface of the barrier 305 can be outwardly convex or flush with the first end surface of the first capacitor 303 and the second capacitor 304, and the second end surface of the barrier 305 can be outwardly convex or flush with the second end surface of the first capacitor 303 and the second capacitor 304, so that the barrier 305 can completely separate the first capacitor 303 and the second capacitor 304 in the length direction, reducing the parasitic capacitance generated by the mutual coupling of the first capacitor 303 and the second capacitor 304. For example, the first end surface of the barrier 305 is closer to the gold finger 301 than the first end surface of the first capacitor 303 and the second capacitor 304, and the second end surface of the barrier 305 can be farther away from the gold finger 301 than the second end surface of the first capacitor 303 and the second capacitor 304, where the first end surface of the first capacitor 303 refers to the end surface of the first end of the first capacitor 303, i.e., the outer surface of the first electrode plate of the first capacitor 303.

[0195] In some embodiments, the distance between the position in the first high-frequency signal line 306 away from the first capacitor 303 and the position in the second high-frequency signal line 307 away from the second capacitor 304 is less than a second preset value, and the distance between the position in the first high-frequency signal line 306 away from the first capacitor 303 and the position in the second high-frequency signal line 307 away from the second capacitor 304 is less than the distance between the position in the first high-frequency signal line 306 connected to the first capacitor 303 and the position in the second high-frequency signal line 307 connected to the second capacitor 304 (i.e., the distance between the first capacitor 303 and the second capacitor 304), so that the distance between the first capacitor 303 and the second capacitor 304 is greater than or equal to the second preset value, and the distance between the first capacitor 303 and the second capacitor 304 is sufficient to accommodate the barrier 305, facilitating the installation of the barrier 305. The second preset value is (2 x the minimum installation distance of the capacitor and the barrier arranged side by side) + the width dimension of the barrier.

[0196] In some embodiments, the distance between the first high-frequency signal line 306 far away from the first capacitor 303 and the second high-frequency signal line 307 far away from the second capacitor 304 is greater than or equal to a second preset value, that is, the distance between the first capacitor 303 and the second capacitor 304 is greater than or equal to the second preset value, and the distance between the first capacitor 303 and the second capacitor 304 is sufficient to accommodate the barrier 305.

[0197] FIG. 20 is a partial equivalent circuit diagram of a circuit board according to some embodiments. As shown in FIG. 20, in some embodiments, the barrier 305 can be grounded, so that the first parasitic capacitance C2 generated by the mutual coupling between the first end of the first capacitor 303 and the first end of the barrier 305 flows to the ground, and the second parasitic capacitance Cl generated by the mutual coupling between the second end of the first capacitor 303 and the second end of the barrier 305 flows to the ground, reducing the influence of the parasitic capacitance on the high-frequency signal transmitted by the first capacitor 303.

[0198] In some embodiments, the barrier 305 can be a metal block. The metal block can play a shielding and isolating role. By arranging a metal block between the differential capacitors, the coupling between the first capacitor 303 and the second capacitor 304 can be effectively prevented, thereby reducing the formation of parasitic capacitance.

[0199] In some embodiments, the barrier 305 can be a third capacitor 351. The third capacitor 351 is externally wrapped with an anti-static shell having anti-static properties to avoid the transmission of static electricity to the circuit board 300 and reduce the damage of static electricity to electronic components on the circuit board 300. For example, the material of the anti-static shell can be a ceramic material.

[0200] In addition, the size of the barrier 305 is related to the size of the first capacitor 303 and the second capacitor 304, and only needs to select a third capacitor 351 with a size greater than or equal to the size of the first capacitor 303 and the second capacitor 304 as the barrier 305, without the need to redesign the pre-designed size of the metal shielding cover or shielding tape. For example, the size of the third capacitor 351 is the same as the size of the first capacitor 303 and the second capacitor 304.

[0201] FIG. 21 is a partial structural diagram of a circuit board according to some embodiments. FIG. 22 is an exploded view of a partial structure of a circuit board according to some embodiments. FIG. 23 is a partial exploded view of a partial structure of a circuit board according to some embodiments. As shown in FIGS. 21-23, in some embodiments, the circuit board 300a can include a signal layer 3011. The signal layer 3011 can have a first capacitor 303, a second capacitor 304, and a third capacitor 351 located between the first capacitor 303 and the second capacitor 304, the third capacitor 351 being arranged in parallel with the first capacitor 303 and the second capacitor 304 along the width direction of the circuit board to block the first capacitor 303 and the second capacitor 304, reducing the parasitic capacitance generated by the mutual coupling of the first capacitor 303 and the second capacitor 304.

[0202] In some embodiments, the signal layer 3011 can have a first high-frequency signal line 306. The first high-frequency signal line 306 can include a first sub-high-frequency signal line 361, a first end of the first sub-high-frequency signal line 361 being connectable to the gold finger 301, and a second end of the first sub-high-frequency signal line 361 being connectable to a first end of the first capacitor 303.

[0203] The signal layer 3011 can have a first pad 3115. The second end of the first sub-high-frequency signal line 361 can be connected to the first pad 3115, and the first pad 3115 can be connected to the first end of the first capacitor 303, so that the second end of the first sub-high-frequency signal line 361 can be connected to the first end of the first capacitor 303.

[0204] The first high-frequency signal line 306 can include a second sub-high-frequency signal line 362, a first end of the second sub-high-frequency signal line 362 being connectable to a second end of the first capacitor 303, and a second end of the second sub-high-frequency signal line 362 being connectable to the high-frequency signal processing piece 302.

[0205] The signal layer 3011 can have a second pad 3116. The first end of the second sub-high-frequency signal line 362 can be connected to the second pad 3116, and the second pad 3116 can be connected to the second end of the first capacitor 303, so that the second end of the second sub-high-frequency signal line 362 can be connected to the second end of the first capacitor 303.

[0206] The first sub-high-frequency signal line 361 and the second sub-high-frequency signal line 362 are not connected, so that the DC bias component of the first high-frequency signal cannot be transmitted between the first sub-high-frequency signal line 361 and the second sub-high-frequency signal line 362.

[0207] In some embodiments, the signal layer 3011 can have a second high-frequency signal line 307. The second high-frequency signal line 307 can include a third sub-high-frequency signal line 371, a first end of the third sub-high-frequency signal line 371 can be connected with the golden finger 301, and a second end of the third sub-high-frequency signal line 371 can be connected with a first end of the second capacitor 304.

[0208] The signal layer 3011 can have a third pad 3113. The second end of the third sub-high-frequency signal line 371 can be connected with the third pad 3113, and a top of the third pad 3113 can be connected with the first end of the second capacitor 304, so that the second end of the third sub-high-frequency signal line 371 can be connected with the first end of the second capacitor 304.

[0209] The second high-frequency signal line 307 can include a fourth sub-high-frequency signal line 372, a first end of the fourth sub-high-frequency signal line 372 can be connected with a second end of the second capacitor 304, and a second end of the fourth sub-high-frequency signal line 372 can be connected with the high-frequency signal processing piece 302.

[0210] The signal layer 3011 can have a fourth pad 3114. The first end of the fourth sub-high-frequency signal line 372 can be connected with the fourth pad 3114, and a top of the fourth pad 3114 can be connected with the second end of the second capacitor 304, so that the second end of the fourth pad 3114 can be connected with the second end of the second capacitor 304.

[0211] The third sub-high-frequency signal line 371 and the fourth sub-high-frequency signal line 372 are not connected, so that the direct current bias component of the second high-frequency signal cannot be transmitted between the third sub-high-frequency signal line 371 and the fourth sub-high-frequency signal line 372.

[0212] In some embodiments, the signal layer 3011 can have a first grounding area 3111. The first grounding area 3111 can be located between the second end of the first sub-high-frequency signal line 361 and the second end of the third sub-high-frequency signal line 371. The first grounding area 3111 can be connected with a first end of the third capacitor 351, so that the first end of the third capacitor 351 is grounded.

[0213] The signal layer 3011 can have a second grounding area 3112. The second grounding area 3112 can be located between the first end of the second sub-high-frequency signal line 362 and the first end of the fourth sub-high-frequency signal line 372. The second grounding area 3112 can be connected with a second end of the third capacitor 351, so that the second end of the third capacitor 351 is grounded.

[0214] The two ends of the third capacitor 351 are grounded, which can make the parasitic capacitance generated by the mutual coupling of the third capacitor 351, the first capacitor 303, and the second capacitor 304 flow to the ground, reducing the influence of the parasitic capacitance on the high-frequency signals transmitted by the first capacitor 303 and the second capacitor 304.

[0215] As shown in FIG. 23, the distance between the first capacitor 303 and the second capacitor 304, or the distance between the first pad 3115 and the third pad 3113, is smaller than the second preset value, and the distance d1 between the first pad 3115 and the third pad 3113 is larger than the distance d2 between the first high-frequency signal line 306 far from the first capacitor 303 and the second high-frequency signal line 307 far from the second capacitor 304.

[0216] The first high-frequency signal line 306 and the second high-frequency signal line 307 are located in the signal layer of the circuit board 300, and the upper layer or the lower layer of the signal layer is the reference plane of the first high-frequency signal line 306 and the second high-frequency signal line 307.

[0217] In some embodiments, the circuit board 300a can include the intermediate layer 3012. The intermediate layer 3012 can be the lower layer of the signal layer 3011, and the intermediate layer 3012 can be the reference plane of the first high-frequency signal line 306 and the second high-frequency signal line 307.

[0218] The first capacitor 303 is disposed on the first high-frequency signal line 306, and the intermediate layer 3012 is also the reference plane of the first capacitor 303. The coupling plane of the first capacitor 303 is higher than the coupling plane of the first high-frequency signal line 306, so that the impedance of the circuit in which the first high-frequency signal line 306 is located is reduced in the region of the first capacitor 303, resulting in impedance mismatch. To solve this problem, in some embodiments, the intermediate layer 3012 can have a first hollow region 3122. The first hollow region 3122 can include the projection region of the first capacitor 303 on the intermediate layer 3012. The reference plane of the first high-frequency signal line 306 is still the intermediate layer 3012, and the reference plane of the first capacitor 303 is no longer the intermediate layer 3012, but the lower layer of the intermediate layer 3012. Therefore, the projection region of the first capacitor 303 on the intermediate layer 3012 can increase the impedance of the circuit in which the first high-frequency signal line 306 is located in the region of the first capacitor 303 by increasing the distance between the first capacitor 303 and the reference plane, so that the impedance of the circuit in which the first high-frequency signal line 306 is located is matched.

[0219] The intermediate layer 3012 can have a second hollow region 3121. The second hollow region 3121 can include the projection region of the second capacitor 304 on the intermediate layer 3012. The impedance of the circuit in which the first high-frequency signal line 306 is located in the region of the second capacitor 304 can be increased by increasing the distance between the second capacitor 304 and the reference plane, so that the impedance of the circuit in which the first high-frequency signal line 306 is located is matched.

[0220] In some embodiments, the circuit board 300a can include an intermediate layer 3013. The intermediate layer 3013 can be a next layer of the intermediate layer 3012, and then the intermediate layer 3013 can be a reference plane of the first capacitor 303 and the second capacitor 304.

[0221] FIG. 24 is a sectional view of a partial structure of a circuit board according to some embodiments. As shown in FIG. 24, in some embodiments, the third capacitor 351 can include a first electrode plate 3512. The first electrode plate 3512 can be a first end of the third capacitor 351, and then the first electrode plate 3512 can be connected with the first land 3111 by soldering, and after the soldering solidifies, the first land 3111 forms a first soldering area 3117.

[0222] The third capacitor 351 can include a second electrode plate 3511. The second electrode plate 3511 can be a second end of the third capacitor 351, and then the second electrode plate 3511 can be connected with the second land 3112 by soldering, and after the soldering solidifies, the second land 3112 forms a second soldering area 3118. The third capacitor 351 can include a dielectric area 3513, which can be located between the first electrode plate 3512 and the second electrode plate 3511. In some embodiments, the first land 3111 can be connected with the intermediate layer 3013 through a first via 315, so that the first land 3111 is at the same potential as the intermediate layer 3013, that is, the first land 3111 is ground.

[0223] In some embodiments, the second land 3112 can be connected with the intermediate layer 3013 through a second via 3014, so that the second land 3112 is at the same potential as the intermediate layer 3013, that is, the second land 3112 is ground.

[0224] FIG. 25 is a partial structure diagram of another circuit board according to some embodiments. FIG. 26 is a partial exploded view of a partial structure of another circuit board according to some embodiments. As shown in FIGS. 25 and 26, in some embodiments, the width dimension of the first pad 3115 of the circuit board 300b is greater than the width dimension of the first sub-high-frequency signal line 361, and the width dimension of the first capacitor 303 is greater than the width dimension of the first high-frequency signal line 305, so that the width dimension of the first pad 3115 is greater than or equal to the width dimension of the first capacitor 303, and thus the first pad 3115 can completely support the first end of the first capacitor 303.

[0225] In some embodiments, the width dimension of the first pad 3115 of the circuit board 300b is equal to the width dimension of the first sub-high-frequency signal line 361, and the width dimension of the first capacitor 303 is equal to the width dimension of the first high-frequency signal line 305, so that the width dimension of the first pad 3115 is equal to the width dimension of the first capacitor 303, and thus the first pad 3115 can completely support the first end of the first capacitor 303.

[0226] In some embodiments, the distance D2 between the first high-frequency signal line 306 away from the first capacitor 303 and the second high-frequency signal line 307 away from the second capacitor 304 can be greater than or equal to a second preset value, the width dimension of the first pad 3115 is greater than the width dimension of the first sub-high-frequency signal line 361, and the distance D1 between the first pad 3115 and the third pad 3113 is greater than the distance D2 between the first high-frequency signal line 306 away from the first capacitor 303 and the second high-frequency signal line 307 away from the second capacitor 304.

[0227] In some embodiments, the distance D2 between the first high-frequency signal line 306 away from the first capacitor 303 and the second high-frequency signal line 307 away from the second capacitor 304 can be greater than or equal to a second preset value, the width dimension of the first pad 3115 is equal to the width dimension of the first sub-high-frequency signal line 361, and the distance D1 between the first pad 3115 and the third pad 3113 is equal to the distance D2 between the first high-frequency signal line 306 away from the first capacitor 303 and the second high-frequency signal line 307 away from the second capacitor 304.

[0228] The circuit board 300b can be the same as the circuit board 300a in other aspects except for the above differences, and details are not repeated here.

[0229] FIG. 27 is a simulation diagram of a frequency response curve of an insertion loss according to some embodiments. The curve a in FIG. 27 is a frequency response curve of an insertion loss without the third capacitor 351 between the first capacitor 303 and the second capacitor 304, and the curve b in FIG. 27 is a frequency response curve of an insertion loss with the third capacitor 351 between the first capacitor 303 and the second capacitor 304. The 3dB bandwidth in the optical module refers to the frequency range when the signal is attenuated to half of the original amplitude. As shown in FIG. 27, the 3dB bandwidth of the curve a is less than the 3dB bandwidth of the curve b. It is concluded from the results of FIG. 27 that the third capacitor 351 between the first capacitor 303 and the second capacitor 304 can reduce the loss and increase the bandwidth.

[0230] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure rather than limit them; and although the foregoing disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that the technical solutions recorded in the foregoing embodiments can be modified, or some technical features thereof can be replaced by equivalents; and such modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present disclosure.

Claims

1. An optical module, wherein, The application relates to an optical module. The application relates to an optical module. The application relates to an optical module. The application relates to an optical module. The application relates to an optical module. The application relates to an optical module. The application relates to an optical module. The application relates to an optical module. The application relates to an optical module. The application relates to an optical module. The application relates to an optical module. The application relates to an optical module. The application relates to an optical module. The application relates to an optical module. The application relates to an optical module. The application relates to an optical module. The application relates to an optical module. The application relates to an optical module. The application relates to an optical module. The application relates to an optical module. The application relates to an optical module. The application relates to an optical module.

2. The optical module according to claim 1, wherein The application relates to an optical module.

3. The optical module according to claim 1, wherein The application relates to an optical module.

4. The optical module according to claim 2, wherein The application relates to an optical module. The application relates to an optical module. The application relates to an optical module. The application relates to an optical module. The application relates to an optical module. The application relates to an optical module.

5. The optical module of claim 1, wherein, The application relates to an optical module. The application relates to an optical module. The application relates to an optical module. The application relates to an optical module. The application relates to an optical module. The application relates to an optical module.

6. The optical module of claim 1, wherein, The application relates to an optical module. The application relates to an optical module. The application relates to an optical module. The application relates to an optical module. The application relates to an optical module. The application relates to an optical module. The application relates to an optical module. The application relates to an optical module. The application relates to an optical module. The application relates to an optical module. The application relates to an optical module. The application relates to an optical module. The application relates to an optical module. The application relates to an optical module. The application relates to an optical module. The application relates to an optical module. The application relates to an optical module. The application relates to an optical module. The application relates to an optical module. The application relates to an optical module. 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The first end of the first connecting part is inside the transmitting shell, and the second end of the first connecting part is outside the transmitting shell; the first end of the first connecting part is flush with the first end of the second connecting part; the second end of the first connecting part protrudes from the first end of the second connecting part; The ground layer covers the first connecting part; The ground pin is located on the upper surface of the second connecting part; One end of the ground via is connected with the ground pin, and the other end is connected with the ground layer.

9. The optical module according to claim 8, wherein The circuit board is included: the upper surface of the first connecting part is connected with the lower surface of the circuit board; The second connecting part is electrically connected with the upper surface of the circuit board.

10. The optical module according to claim 9, wherein The upper surface of the circuit board is provided with a ground pad, and the ground pad is wire-connected with the ground pin; The lower surface of the circuit board is provided with a ground metal layer, and the ground layer is electrically connected with the ground metal layer.

11. The optical module according to claim 10, wherein The circuit board includes: a circuit via, one end of the circuit via is connected with the ground pad, and the other end is connected with the ground metal layer.

12. The optical module of claim 8, wherein, The circuit board includes: The circuit board body; The thickness of the first extension part is smaller than the thickness of the circuit board body; the first connecting part is located below the first extension part, and one end of the second connecting part abuts against the side wall of the first extension part.

13. The optical module of claim 12, wherein, The sum of the thickness of the first connecting part and the thickness of the second connecting part is greater than or equal to the thickness of the circuit board body.

14. The optical module of claim 12, wherein, The thickness of the circuit board body is greater than or equal to 0.9mm, and the thickness of the circuit board body is less than or equal to 1.1mm; the thickness of the second connecting part is greater than or equal to 0.45mm, and the thickness of the second connecting part is less than or equal to 0.55mm; the thickness of the first connecting part is greater than or equal to 0.6mm, and the thickness of the first connecting part is less than or equal to 1.1mm.

15. The optical module of claim 14, wherein, It includes: Conductive glue between the first connecting part and the first extension part; The circuit board includes: The ground pad is located on the upper surface of the circuit board, and the ground pad is wire-connected with the ground pin; The ground metal layer is located on the lower surface of the circuit board, and the ground layer is electrically connected with the ground metal layer circuit via, one end of the circuit via is connected with the ground pad, and the other end is connected with the ground metal layer.

16. The optical module of claim 12, wherein, The thickness of the circuit board body is greater than or equal to twice the thickness of the second connecting part.

17. The optical module of claim 12, wherein, The thickness of the circuit board body is greater than or equal to twice the thickness of the first extension part.

18. The optical module of claim 1, wherein, The distance between the first capacitor and the second capacitor is less than a first preset value; The bottom surface of the barrier is lower than or equal to the bottom surface of the first capacitor, and the bottom surface of the barrier is lower than or equal to the bottom surface of the second capacitor; the top surface of the barrier is higher than or equal to the first capacitor, and the top surface of the barrier is higher than or equal to the top surface of the second capacitor.

19. The optical module of claim 18, wherein, The first end face of the barrier protrudes outward or is flush with the first end face of the first capacitor and the second capacitor, and the second end face of the barrier protrudes outward or is flush with the second end face of the first capacitor and the second capacitor.

20. The optical module of claim 18, wherein, The distance between the position far from the first capacitor in the first high-frequency signal line and the position far from the second capacitor in the second high-frequency signal line is less than a second preset value, and the distance between the connection position of the first capacitor in the first high-frequency signal line and the connection position of the second capacitor in the second high-frequency signal line is greater than the distance between the position far from the first capacitor in the first high-frequency signal line and the position far from the second capacitor in the second high-frequency signal line.

21. The optical module of claim 18, wherein, The circuit board comprises: a signal layer formed with: a first grounding area connected with the first end of the barrier piece; a second grounding area connected with the second end of the barrier piece; a grounding layer connected with the first grounding area and the second grounding area through a via.

22. The optical module of claim 21, wherein, The next layer of the signal layer is formed with: a first hollowed-out area corresponding to the first capacitor; the first hollowed-out area comprises a projection area of the first capacitor on the next layer of the signal layer; a second hollowed-out area corresponding to the second capacitor; the second hollowed-out area comprises a projection area of the second capacitor on the next layer of the signal layer.

23. The optical module of claim 18, wherein the first high-frequency signal line comprises: a first sub-high-frequency signal line connected with the first end of the first capacitor; a second sub-high-frequency signal line connected with the second end of the first capacitor and not connected with the first sub-high-frequency signal line; the second high-frequency signal line comprises: a third sub-high-frequency signal line connected with the first end of the second capacitor; a fourth sub-high-frequency signal line connected with the second end of the second capacitor and not connected with the third sub-high-frequency signal line.

24. The optical module of claim 23, wherein, The circuit board comprises: a first pad connected with the first sub-high-frequency signal line and connected with the first end of the first capacitor; a second pad connected with the second sub-high-frequency signal line and connected with the second end of the first capacitor; a third pad connected with the third sub-high-frequency signal line and connected with the first end of the second capacitor; a fourth pad connected with the fourth sub-high-frequency signal line and connected with the second end of the second capacitor.

25. The optical module of claim 18, wherein, comprises: a golden finger connected with one end of the first high-frequency signal line and connected with one end of the second high-frequency signal line; a high-frequency signal processing piece connected with the other end of the first high-frequency signal line and connected with the other end of the second high-frequency signal line, used for processing the differential signal.

26. The optical module of claim 25, wherein, comprises: a light emitting component connected with the high-frequency signal processing piece; the high-frequency signal processing piece is used for emitting a driving signal according to the differential signal, and the light emitting component is used for emitting a light signal according to the driving signal.

27. An optical module, wherein, comprises: a circuit board; a light emitting component electrically connected with the circuit board, comprising: a laser chip used for emitting a light signal; a temperature regulator located below the laser chip; a temperature detector used for detecting temperature; wherein the circuit board is provided with: an MCU, an output pin of which outputs a first voltage or a second voltage; The control circuit has an enable control pin connected to an output pin of the MCU, a first output pin connected to the temperature regulator to output different working currents to the temperature regulator, and a second output pin outputting a third voltage which is a constant value; The switch tube has a gate connected to an output pin of the MCU, a source connected to the second output pin of the control circuit, and a drain connected to the temperature detector. The first voltage is greater than the third voltage, and the second voltage is less than the third voltage.

28. The optical module of claim 27, wherein, The temperature detector comprises an output pin, and the MCU comprises an input pin, wherein the output pin is connected to the input pin.

29. The optical module of claim 27, wherein, The temperature detector comprises an output pin, and the control circuit comprises an input pin, wherein the output pin is connected to the input pin.

30. The optical module of claim 28, wherein, The MCU comprises: a first clock pin; a first data pin; The control circuit comprises: a second clock pin connected to the first clock pin; a second data pin connected to the first data pin.

31. The optical module of claim 27, wherein, The first output pin of the control circuit comprises: a first sub-output pin; a second sub-output pin; The temperature regulator comprises: a first electrode column connected to the first sub-output pin; a second electrode column connected to the second sub-output pin.

32. The optical module of claim 27, wherein, The light emitting component comprises a lens located in the light emitting direction of the laser chip, and the lens is located above the temperature regulator.

33. The optical module of claim 27, further comprising: a light receiving component located on the surface of the circuit board and configured to receive an optical signal.

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