LED package device, LED light board, and manufacturing method for LED package device

Abstract

The present application relates to the technical field of LED manufacturing, and provides an LED package device, an LED light board, and a manufacturing method for the LED package device. The LED package device comprises: a substrate, wherein the substrate is in the shape of a flat plate and comprises a positive electrode structure, an isolation band structure, and a negative electrode structure, the isolation band structure is disposed between the positive electrode structure and the negative electrode structure to separate the positive electrode structure from the negative electrode structure, and the light transmittance of the isolation band structure is less than 10%; a dam that is disposed on the upper surface of the substrate and forms a recess together with the substrate, wherein the light transmittance of the dam is greater than 80%; an LED chip disposed in the recess, wherein the LED chip is electrically connected to the positive electrode structure and the negative electrode structure separately, and the height of the dam is greater than that of the LED chip; and a phosphor resin that is provided in the recess and covers the LED chip. The isolation band structure of the present application has relatively low light transmittance, thereby reducing light loss; moreover, the light emitted by the LED chip can exit through the phosphor resin and the dam, thereby increasing the light emission angle and the light utilization rate. Therefore, the present application can reduce the light loss while increasing the light emission angle.

Description

LED packaging device, LED lamp panel and manufacturing method of LED packaging device TECHNICAL FIELD

[0001] The present application belongs to the technical field of LED manufacturing, and particularly relates to an LED packaging device, an LED lamp panel and a manufacturing method of the LED packaging device. BACKGROUND

[0002] An LED (Light Emitting Diode) is a kind of solid-state semiconductor device, which has the advantages of high brightness, small size, high efficiency and long service life, and is currently widely used in the field of lamps and lanterns. The current LED packaging device generally comprises an LED chip, a dam and a fluorescent glue, the dam is formed by molding resin on a metal lead frame, and the dam and the isolation belt structure on the metal lead frame are generally integrally formed by the same kind of resin material. In the past, reflective resin material was used, and currently, in order to increase the light emitting angle, the reflective resin is replaced by transparent PPA\PCT resin. Although this increases the light emitting angle, it also reduces the light efficiency. SUMMARY

[0003] The present application aims to at least overcome one of the deficiencies of the prior art, and provides an LED packaging device, an LED lamp panel and a manufacturing method of the LED packaging device, which can increase the light emitting angle while reducing light loss.

[0004] The technical solution of the present application is: an LED packaging device, comprising: a substrate, the substrate is flat, comprising a positive structure, an isolation belt structure and a negative structure, the isolation belt structure is arranged between the positive structure and the negative structure to separate the positive structure and the negative structure; the light transmittance of the isolation belt structure is less than 10%; a dam is arranged on the upper surface of the substrate, and the dam and the substrate form a groove together, the light transmittance of the dam is greater than 80%; an LED chip is arranged in the groove, and the LED chip is electrically connected to the positive structure and the negative structure respectively, the height of the dam is greater than the height of the LED chip; a fluorescent glue is arranged in the groove and covers the LED chip.

[0005] As a further improvement of the technical solution, a diffusion layer is arranged above the dam and the fluorescent glue;

[0006] The diffusion layer is formed by transparent glue containing glass beads, the glass beads are located above the transparent glue, and the outer side surface of the diffusion layer is coplanar with the outer side surface of the dam.

[0007] The present application also provides an LED lamp panel, comprising a circuit board and the LED packaging device of any one of the above, a plurality of the LED packaging devices are arranged in an array on the circuit board.

[0008] As a further improvement of the technical solution, each of the LED packaging devices is covered with a lens, and there is no gap between the LED packaging device and the lens, and the lens is formed by a dispensing process.

[0009] The application also provides a manufacturing method of an LED packaging device, comprising the following steps:

[0010] S1: providing a lead frame, the lead frame being flat and comprising a plurality of mutually connected substrates, each of the substrates comprising a positive electrode structure, an isolation belt structure and a negative electrode structure, the isolation belt structure being arranged between the positive electrode structure and the negative electrode structure to separate the positive electrode structure and the negative electrode structure, and the light transmittance of the isolation belt structure being less than 10%;

[0011] S2: integrally forming a plurality of dams on the upper surface of the lead frame, each of the dams and each of the substrates forming a groove, the positive electrode structure, the isolation belt structure and the negative electrode structure being arranged in the groove, and the light transmittance of each of the dams being greater than 80%;

[0012] SA: fixing a plurality of LED chips on the substrates, each of the LED chips being connected to the corresponding positive electrode structure and negative electrode structure.

[0013] S3: filling the groove with fluorescent glue;

[0014] S4: cutting along the connection between the plurality of substrates to obtain a plurality of LED packaging devices.

[0015] The application also provides another manufacturing method of an LED packaging device, comprising the following steps:

[0016] S1: providing a lead frame, the lead frame being flat and comprising a plurality of mutually connected substrates, each of the substrates comprising a positive electrode structure, an isolation belt structure and a negative electrode structure, the isolation belt structure being arranged between the positive electrode structure and the negative electrode structure to separate the positive electrode structure and the negative electrode structure, and the light transmittance of the isolation belt structure being less than 10%;

[0017] SA: fixing a plurality of LED chips on the substrates, each of the LED chips being connected to the corresponding positive electrode structure and negative electrode structure.

[0018] S2: integrally forming a plurality of dams on the upper surface of the lead frame, each of the dams and each of the substrates forming a groove, the positive electrode structure, the isolation belt structure, the negative electrode structure and the LED chips being arranged in the groove, and the light transmittance of each of the dams being greater than 80%;

[0019] S3: filling the groove with fluorescent glue;

[0020] S4: cutting along the junctions between the plurality of substrates to obtain a plurality of LED packaging devices.

[0021] As a further improvement of the above technical solution, the following step is further included between S3 and S4:

[0022] SB: molding a diffusion layer above the dam and the fluorescent glue, the diffusion layer is formed by transparent glue containing glass beads, and after the diffusion layer is cured, the glass beads are above the transparent glue.

[0023] The present application provides an LED packaging device, an LED lamp panel and a manufacturing method of the LED packaging device. Since the light transmittance of the isolation belt structure is low, only a small amount of light can be transmitted through the isolation belt structure when the LED chip emits light, thereby reducing light loss, and the light emitted by the LED chip can be emitted not only from above the LED chip but also through the fluorescent glue and the dam, thereby increasing the light emission angle and light utilization rate. Therefore, the present application can increase the light emission angle while reducing light loss. BRIEF DESCRIPTION OF DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0025] FIG. 1a is a cross-sectional schematic view of an LED packaging device provided by an embodiment of the present application;

[0026] FIG. 1b is another cross-sectional schematic view of an LED packaging device provided by an embodiment of the present application;

[0027] FIG. 2 is a top view (in the direction from the LED chip to the substrate) of an LED packaging device (the recess and the LED chip are square) provided by an embodiment of the present application;

[0028] FIG. 3 is a top view (in the direction from the LED chip to the substrate) of an LED packaging device (the recess and the LED chip are square) provided by an embodiment of the present application;

[0029] FIG. 4 is a cross-sectional schematic view of an LED packaging device (including a diffusion layer) provided by an embodiment of the present application;

[0030] FIG. 5 is a cross-sectional schematic view of an LED lamp panel provided by an embodiment of the present application;

[0031] FIG. 6 is a flowchart of a first embodiment of the manufacturing method provided by an embodiment of the present application;

[0032] Fig. 7a and Fig. 7b are respectively a top view and a sectional view of a lead frame in a manufacturing method according to an embodiment of the present application;

[0033] Fig. 7c is a sectional view of a lead frame provided with an LED chip in a manufacturing method according to an embodiment of the present application;

[0034] Fig. 7d is a sectional view of a lead frame provided with a dam in a manufacturing method according to an embodiment of the present application;

[0035] Fig. 7e is a sectional view of a lead frame, an LED chip and a dam in a manufacturing method according to an embodiment of the present application;

[0036] Fig. 7f is a top view of a lead frame, an LED chip and a dam in a manufacturing method according to an embodiment of the present application;

[0037] Fig. 7g is a sectional view of a lead frame, an LED chip, a dam and a fluorescent glue in a manufacturing method according to an embodiment of the present application;

[0038] Fig. 7h is a sectional view of a lead frame, an LED chip, a dam, a fluorescent glue and a diffusion layer in a manufacturing method according to an embodiment of the present application;

[0039] Fig. 8 is a flow chart of a second embodiment of a manufacturing method according to an embodiment of the present application;

[0040] Fig. 9 is a flow chart of a third embodiment of a manufacturing method according to an embodiment of the present application. DETAILED DESCRIPTION

[0041] In order to make the objects, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and should not be used to limit the present application.

[0042] It should be noted that the terms "provided" and "connected" should be understood broadly, for example, can be directly provided and connected, or indirectly provided and connected through a center component or a center structure.

[0043] In addition, if there are terms indicating the orientation or position relationship such as "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like in the embodiments of the present application, the orientation or position relationship is based on the orientation or position relationship shown in the drawings or the conventional placement state or use state, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the structure, feature, device or element referred to must have a specific orientation or position relationship, nor must be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise specified.

[0044] In the specific technical features and embodiments described in the specific embodiments, any suitable combination can be combined without contradiction, for example, different specific technical features / embodiments can form different embodiments. In order to avoid unnecessary repetition, the various possible combinations of the specific technical features / embodiments in the present application are not described again.

[0045] The present application provides an LED packaging device, please refer to figure 1a to figure 4, LED packaging device 10 includes substrate 1, dam 2, LED chip 3 and fluorescent glue 4;The substrate 1 is flat, the substrate 1 includes positive structure 11, isolation strip structure 12 and negative structure 13, the isolation strip structure 12 is arranged between the positive structure 11 and the negative structure 13, so as to separate the positive structure 11 and the negative structure 13;The light transmittance of the isolation strip structure 12 is less than 10%, which can reduce the bottom light leakage;The dam 2 is arranged on the upper surface of the substrate 1, and the substrate 1 forms a groove 6 together;The light transmittance of the dam 2 is greater than 80%, which is convenient for light transmission;The LED chip 3 is arranged in the groove 6, and the LED chip 3 is electrically connected to the positive structure 11 and the negative structure 13 respectively, so as to realize the connection of positive and negative;The fluorescent glue 4 is arranged in the groove 6 and covers the LED chip 3, when the light emitted by the LED chip 3 irradiates the fluorescent glue 4, the fluorescent glue 4 occurs fluorescent reaction, which changes the color of the light;The height of the dam 2 is greater than the height of the LED chip 3, and the dam 2 surrounds the periphery of the LED chip 3 and the fluorescent glue 4, which protects the LED chip 3 and the fluorescent glue 4. Because the light transmittance of the isolation strip structure 12 is low, when the LED chip 3 emits light, only a small amount of light can transmit through the isolation strip structure 12 and emit light, thereby reducing the bottom light leakage and reducing the light loss, and the light emitted by the LED chip 3 can not only emit light from the top of the LED chip 3 (away from the substrate 1), but also emit light from the side (towards the direction of transmitting through the fluorescent glue 4 and the dam 2), thereby increasing the light emitting angle and improving the light utilization rate, so that the present application can increase the light emitting angle while reducing the light loss.

[0046] It can be understood that the dam and isolation band of the prior art LED packaging device adopts transparent PPA\PCT resin, and the light leakage problem caused by the light stealing structure of the isolation band reduces the light efficiency. Unlike the structure of the prior art dam and isolation band, the material of the isolation band of the present application is different from that of the dam, and is not integrally formed. The isolation band structure 12 of the present application adopts a resin material with low light transmittance, and the dam 2 adopts a resin material with high light transmittance. In this way, the present application can increase the light emitting angle of the LED packaging device 10, protect the fluorescent glue 4 with the dam 2 (to enhance the reliability), and also avoid bottom light leakage and reduce light loss.

[0047] Preferably, referring to FIG. 1a, the light transmittance of the isolation band structure 12 can be less than 3%, so as to further reduce the bottom light leakage and reduce the light loss; the light transmittance of the dam 2 is greater than 90%, further increasing the light emitting angle and improving the light utilization rate.

[0048] Preferably, the substrate 1 further comprises a bonding portion 15, which surrounds the periphery of the substrate, and the function is to bond the positive electrode structure 11 and the negative electrode structure 13 together. The material of the bonding portion is preferably the same as that of the isolation band structure, which is convenient for manufacturing by the integral molding process. At least part of the bonding portion is embedded in the positive electrode structure 11 and the negative electrode structure 13 to strengthen the bonding force. For example, in FIG. 1a, part of the bonding portion 15 is embedded below the positive electrode structure 11 and the negative electrode structure 13. For example, in FIG. 1b, part of the bonding portion 15 is embedded above and below the positive electrode structure 11 and the negative electrode structure 13. In addition, part of the bonding portion 15 can also surround the outer side of the positive electrode structure 11 and the negative electrode structure 13. Of course, if the bonding strength of the isolation band structure 12 and the dam 2 with the positive electrode structure 11 and the negative electrode structure 13 is sufficient to meet the product design requirements, the bonding portion 15 can also not be required.

[0049] Optionally, referring to FIG. 2 and FIG. 3, in a preferred embodiment, the LED chip 3 is arranged at the center of the groove 6. In an embodiment, the groove 6 and the LED chip 3 can be square-shaped (as shown in FIG. 2, i.e., the opening shape of the groove 6 and the LED chip 3 are square-shaped) in the top view (in the direction from the LED chip 3 to the substrate 1), and the gap between each side of the LED chip 3 and the groove 6 is the same (i.e., the shortest distance between each side of the LED chip 3 and the sidewall of the groove 6 is the same), which not only facilitates the processing, but also makes the thickness of the fluorescent glue 4 through which the light emitted by the LED chip 3 passes in the horizontal direction H and the vertical direction V (the length or width direction of the substrate 1) the same, so that the color difference of the emitted light is small; or in another embodiment, the groove 6 and the LED chip 3 are circular in the top view, and the gap between each side of the LED chip 3 and the groove 6 is the same, and the thickness of the fluorescent glue 4 through which the light emitted by the LED chip 3 passes in each direction is the same, which not only facilitates the processing, but also makes the color difference of the emitted light of the LED packaging device 10 small.

[0050] It can be understood that in some embodiments of the present application, the groove and the LED chip 3 can also be square-shaped (as shown in FIG. 3, the corners are rounded), rectangular, triangular, or polygonal, etc., as long as the thickness of the fluorescent glue 4 through which the light emitted by the LED chip 3 passes is substantially the same in the horizontal direction H and the vertical direction V (the difference can be not more than 10 mm in specific applications) after the fluorescent glue 4 is arranged, so that the thickness of the fluorescent glue 4 through which the LED chip 3 passes is also substantially the same, and the color difference of the emitted light is small. The above embodiments are only preferred embodiments of the present application, but the present application does not specifically limit the shape of the groove 6 and the LED chip 3, as long as it does not affect the use of the LED packaging device 10.

[0051] For the dam 2, referring to FIG. 1a to FIG. 4, optionally, the dam 2 can be a silicone member. The transparent PPA\PCT resin material is commonly used in the prior art for the dam 2, which is prone to yellowing, while the dam 2 of the present application can use silicone, which not only has high light transmittance, but also has a slow oxidation and yellowing speed.

[0052] Optionally, the light refraction rate of the dam 2 can be less than or equal to the light refraction rate of the fluorescent glue 4. According to n=sinα / sinβ (wherein n is the relative light refraction rate of the fluorescent glue 4 and the dam 2, α is the incidence angle of light from the fluorescent glue 4 into the dam 2 when refraction occurs, and β is the refraction angle), when the light refraction rate of the dam 2 is less than or equal to the light refraction rate of the fluorescent glue 4, the refraction angle β is greater than or the same as the incidence angle α, thereby increasing or maintaining the light emitting angle of the LED packaging device 10, which is beneficial to improve the light emitting efficiency.

[0053] Optionally, the roughness of the outer surface of the dam 2 (the surface away from the substrate 1) can be greater than the roughness of the inner surface of the dam 2, and the light emitting surface of the dam 2 is rougher, which can make the light emitting more uniform.

[0054] Optionally, the inner surface of the dam 2 can be an arc-shaped curved surface. In manufacturing, the dam 2 can be formed by dispensing or molding. After forming, the dam 2 can be in the shape of a water droplet, and the inner surface of the dam 2 after cutting is an arc-shaped curved surface. This not only facilitates processing, but also increases the light emitting angle through the refraction of light by the arc-shaped curved surface, which is conducive to improving the light emitting efficiency.

[0055] Optionally, the outer side surface of the dam 2 can be coplanar with the outer side surface of the substrate 1, that is, the outer side surface of the dam 2 is connected to and parallel to the outer side surface of the substrate 1. In manufacturing, the outer side surface of the dam 2 and the outer side surface of the substrate 1 can be directly cut to form, which facilitates processing.

[0056] In some embodiments, in combination with FIG. 4, a diffusion layer 5 can be provided above the dam 2 and the fluorescent glue 4, and the diffusion layer 5 can be used to uniformly diffuse light.

[0057] Specifically, the diffusion layer 5 can be formed of transparent glue containing glass beads, the glass beads are located above the transparent glue, the outer side surface of the diffusion layer 5 is coplanar with the outer side surface of the dam 2, and in manufacturing, the outer side surface of the diffusion layer 5 and the outer side surface of the dam 2 can be directly cut to form, which facilitates processing.

[0058] The application also provides an LED lamp panel 20, as shown in FIG. 5, which includes a circuit board 21 and the above-mentioned LED packaging device 10. A plurality of LED packaging devices 10 can be arranged in an array on the circuit board 21 to achieve multi-light source illumination.

[0059] Optionally, each LED packaging device 10 can be covered with a lens 22, and there is no gap between the LED packaging device 10 and the lens 22. The lens 22 is formed by a dispensing process, which facilitates processing.

[0060] The application also provides a manufacturing method of an LED packaging device. The first embodiment of the application is shown in FIG. 6. The manufacturing method can include the following steps:

[0061] S1: (in combination with FIGS. 7a and 7b) providing a lead frame 31, which is a flat plate and includes a plurality of mutually connected substrates 1. Each substrate 1 includes a positive electrode structure 11, an isolation belt structure 12, and a negative electrode structure 13. The isolation belt structure 12 is arranged between the positive electrode structure 11 and the negative electrode structure 13 to separate the positive electrode structure 11 and the negative electrode structure 13. The light transmittance of the isolation belt structure 12 is less than 10%.

[0062] In one embodiment, the positive electrode structure 11 of one substrate 1 is connected to the nearest positive electrode structure 11 and negative electrode structure 14 in the adjacent other substrate 1 through the connecting rib 14; the negative electrode structure 13 of one substrate 1 is connected to the nearest positive electrode structure and negative electrode structure of the other substrate 1 through the connecting rib 14, and there is no connecting rib at the position of the isolation belt structure, and the outer frame part 310 of the lead frame is connected to the connecting rib outside each substrate 1. The positive electrode structure 11 and the negative electrode structure 13 are connected through the connecting rib 14, which is convenient for processing and manufacturing. The gap between the positive electrode structure 11, the negative electrode structure 13 and the connecting rib 14 is filled with the bonding part 15, so as to connect the positive electrode structure 11 and the negative electrode structure 14 into one body, and at the same time, the isolation belt structure is formed. In a preferred embodiment, the material of the bonding part 15 is a resin material mixed with white reflective particles, which has the functions of light blocking and light reflection, and can reduce light loss.

[0063] FIG. 7a only shows the structure of the connection of four substrates 1, and it can be understood that there can be more substrates 1 connected to each other in one lead frame 31, and the present application is not limited thereto.

[0064] S2: (Please refer to FIG. 7d) The plurality of dams 2 are integrally formed corresponding to the upper surface of the lead frame 31, each of the dams 2 and each of the substrates 1 jointly form a groove, the positive electrode structure 11, the isolation belt structure 12 and the negative electrode structure 13 are located in the groove, and the light transmittance of the dam 2 is greater than 80%;

[0065] SA: (Please refer to FIG. 7e and FIG. 7f) A plurality of LED chips 3 are fixed corresponding to the substrate 1, each LED chip 3 is connected to the corresponding positive electrode structure 11 and negative electrode structure 13.

[0066] S3: (Please refer to FIG. 7g) The fluorescent glue 4 is filled in the groove;

[0067] S4: (Please refer to FIG. 7g) Cutting is performed along the connecting part (connecting line A-A) between the plurality of substrates 1, and a plurality of LED packaging devices 10 are obtained.

[0068] Preferably, the light transmittance of the isolation belt structure 12 can be less than 3%, so as to further reduce the bottom light leakage and reduce the light loss; the light transmittance of the dam 2 is greater than 90%, so as to further increase the light emitting angle and improve the light utilization rate.

[0069] For step S2, the plurality of dams 2 can be integrally formed on the lead frame 31 through a dispensing process or a molding process, so as to conveniently and quickly manufacture a plurality of dams 2 at the same time.

[0070] In some embodiments, step S4 can further include step S5: fixing the plurality of LED packaging devices 10 to the circuit board 21, and dispensing the LED packaging devices 10 to form the lens 22, to obtain the LED lamp panel 20.

[0071] The manufacturing method provided by the first embodiment of the present application can conveniently obtain the plurality of LED packaging devices 10, and the LED packaging devices 10 can not only reduce the bottom light leakage and reduce the light loss, but also increase the light emitting angle and light utilization.

[0072] Referring to FIG. 8, the manufacturing method provided by the second embodiment of the present application is different from the embodiment shown in FIG. 6. In the second embodiment, referring to FIG. 7c, step SA is located between S1 and S2, that is, the LED chip is installed before the dam 2 is formed, and after the dam 2 is formed in step S2, the positive electrode structure 11, the isolation belt structure 12, the negative electrode structure 13, and the LED chip are located in the groove 6:

[0073] In the SA step, when each LED chip 3 is installed, the middle part of each LED chip 3 can be arranged corresponding to the isolation belt structure 12, and the two sides of the LED chip 3 are fixed to the positive electrode structure 11 and the negative electrode structure 13, so as to realize the connection of the positive and negative electrodes of the LED chip 3.

[0074] Optionally, referring to FIGS. 1a, 2, 7d, 7e, 7f, and 7g, the plurality of dams 2 can be integrally formed by the dispensing process, and the dispensing process forms a grid structure along the connection between the substrates 1. In the top view, the groove 6 and the LED chip 3 are square, the gap between each side of the LED chip 3 and the groove 6 is the same, so that the thickness of the fluorescent glue 4 through which the light emitted by the LED chip 3 needs to pass in the horizontal direction H and the vertical direction V (the length or width direction of the substrate 1) is the same, thereby making the color difference of the light emitted by the LED packaging device 10 very small.

[0075] It can be known from the two manufacturing methods provided by the embodiments of the present application that the LED chip 3 can be installed before or after the dam 2 is formed.

[0076] Referring to FIG. 9, as the third embodiment of the manufacturing method of the present application, on the basis of the above two manufacturing methods of the LED packaging device, the following steps can be further included between S3 and S4:

[0077] SB: (please refer to FIG. 7h) A diffusion layer 5 is arranged above the dam 2 and the fluorescent glue 4. The diffusion layer 5 can be arranged by a molding process or a coating process. The diffusion layer 5 is formed by transparent glue 52 containing glass beads 51. After the diffusion layer 5 is cured, the glass beads 51 are located above the transparent glue 52. The glass beads 51 are preferably hollow glass beads, which are lighter in mass and are easy to float above the transparent glue 52.

[0078] The diffusion layer 5 is arranged above the LED packaging device 10, and the light emitted by the LED chip 3 can be refracted after passing through the glass beads of the diffusion layer 5, thereby playing a role of uniform light.

[0079] The LED packaging device 10, the LED lamp plate 20 and the manufacturing method of the LED packaging device provided by the present application. Since the light transmittance of the isolation belt structure 12 is low, only a small amount of light can be emitted through the isolation belt structure 12 when the LED chip 3 emits light, thereby reducing light loss, and the light emitted by the LED chip 3 can not only be emitted from above the LED chip 3, but also be emitted through the fluorescent glue 4 and the dam 2, thereby increasing the light emission angle and light utilization rate. Therefore, the present application can increase the light emission angle while reducing light loss.

[0080] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. Any modification, equivalent replacement or improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. An LED package device, comprising: The application relates to an LED packaging device, which comprises the following steps: A substrate is provided, the substrate is flat, and the substrate comprises a positive electrode structure, an isolation strip structure and a negative electrode structure; the isolation strip structure is arranged between the positive electrode structure and the negative electrode structure to separate the positive electrode structure and the negative electrode structure; and the light transmittance of the isolation strip structure is less than 10%. A dam is arranged on the upper surface of the substrate, and the dam and the substrate jointly form a groove; and the light transmittance of the dam is greater than 80%. An LED chip is arranged in the groove, and the LED chip is electrically connected to the positive electrode structure and the negative electrode structure respectively; and the height of the dam is greater than the height of the LED chip. Fluorescent glue is arranged in the groove and covers the LED chip.

2. The LED packaging device according to claim 1, wherein, The light transmittance of the isolation strip structure is less than 3%, and the light transmittance of the dam is greater than 90%.

3. The LED packaging device according to claim 1, wherein, The LED chip is located at the center of the groove; the groove and the LED chip are square in a top view, the clearance between each side of the LED chip and the groove is the same; or the groove and the LED chip are circular in a top view, and the center of the LED chip coincides with the center of the groove.

4. The LED encapsulating device according to claim 1, wherein, The dam is made of silicone; the light refraction rate of the outer surface of the dam is less than or equal to the light refraction rate of the fluorescent glue. The roughness of the outer surface of the dam is greater than the roughness of the inner surface of the dam; the inner surface of the dam is an arc-shaped curved surface; and the outer side surface of the dam is coplanar with the outer side surface of the substrate.

5. The LED encapsulating device according to claim 1, wherein, A diffusion layer is arranged above the dam and the fluorescent glue. The diffusion layer is formed by transparent glue containing glass beads; the glass beads are located above the transparent glue; and the outer side surface of the diffusion layer is coplanar with the outer side surface of the dam.

6. The LED encapsulating device according to claim 1, wherein The substrate further comprises a bonding portion which surrounds the substrate.

7. An LED light panel, characterized by The application further relates to a circuit board and the LED packaging device as claimed in any one of claims 1 to 5; and a plurality of the LED packaging devices are arranged in an array on the circuit board.

8. The LED lamp panel of claim 7, wherein, Each of the LED packaging devices is covered with a lens, and there is no gap between the LED packaging device and the lens.

9. A method for manufacturing an LED packaged device, characterized in that, The application further relates to a method for manufacturing an LED packaging device, which comprises the following steps: S1: providing a lead frame, the lead frame is flat, and the lead frame comprises a plurality of substrates which are connected to each other; each of the substrates comprises a positive electrode structure, an isolation strip structure and a negative electrode structure; the isolation strip structure is arranged between the positive electrode structure and the negative electrode structure to separate the positive electrode structure and the negative electrode structure; and the light transmittance of the isolation strip structure is less than 10%. S2: integrally forming a plurality of dams on the upper surface of the lead frame; each of the dams and each of the substrates jointly form a groove; the positive electrode structure, the isolation strip structure and the negative electrode structure are located in the groove; and the light transmittance of the dam is greater than 80%. SA: fixing a plurality of LED chips on the substrates; each of the LED chips is connected to the corresponding positive electrode structure and negative electrode structure.

10. S3: filling the groove with fluorescent glue. S4: cutting along the connecting portions between the substrates to obtain a plurality of LED packaging devices.

11. A method of manufacturing an LED encapsulation device, characterized by, The application further relates to a method for manufacturing an LED packaging device, which comprises the following steps: S1: providing a lead frame, the lead frame being flat plate-shaped, comprising a plurality of mutually connected substrates, the substrates comprising positive electrode structures, isolation belt structures and negative electrode structures, the isolation belt structures being arranged between the positive electrode structures and the negative electrode structures to separate the positive electrode structures and the negative electrode structures; the light transmittance of the isolation belt structures being less than 10%; SA: fixing a plurality of LED chips corresponding to the substrates, each of the LED chips being connected to corresponding positive electrode structures and negative electrode structures; S2: integrally forming a plurality of dams corresponding to the upper surface of the lead frame, each of the dams and each of the substrates forming a groove, the positive electrode structures, the isolation belt structures, the negative electrode structures and the LED chips being located in the groove, the light transmittance of the dams being greater than 80%; S3: filling the groove with fluorescent glue; S4: cutting along the connections between the plurality of substrates to obtain a plurality of LED packaging devices.

12. The method of manufacturing an LED encapsulation device according to claim 8 or 9, wherein Between S3 and S4, the following steps are further included: SB: molding a diffusion layer above the dams and the fluorescent glue; the diffusion layer is formed by transparent glue containing glass beads, and after the diffusion layer is cured, the glass beads are located above the transparent glue.

13. The method of claim 9, wherein the step of forming the LED package device further comprises the step of: forming a plurality of LED chips on the substrate. In step S2, the plurality of dams are integrally formed by a dispensing process, the dispensing process forms a grid structure along the connections between the substrates, the groove and the LED chips are square in the top view, and the gap between each side of the LED chip and the groove is the same.

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