Nozzle flow test fixture

Abstract

One example provides a method for nozzle gas flow testing. The method comprises supplying test gas to a gas flow inlet of a nozzle flow test fixture; measuring a first gas flow rate of the test gas exiting the nozzle flow test fixture through a test nozzle affixed to a test gas flow outlet; concurrently measuring a second gas flow rate of the test gas exiting the nozzle flow test fixture through a reference nozzle affixed to a reference gas flow outlet; and comparing the first gas flow rate to the second gas flow rate to determine that the test nozzle satisfies a predetermined flow condition relative to the reference nozzle.

Description

NOZZLE FLOW TEST FIXTUREBACKGROUND

[0001] Semiconductor processing tools can include components designed to emit processing chemicals through an arrangement of outlet holes distributed over an area to expose a substrate to the processing chemicals. Such components are commonly referred to in the industry as “showerheads.”SUMMARY

[0002] This Summary is provided to introduce a selection of concepts in a simplified form that are further described below in the Detailed Description. This Summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter. Furthermore, the claimed subject matter is not limited to implementations that solve any or all disadvantages noted in any part of this disclosure.

[0003] One example provides a method for nozzle gas flow testing. The method comprises supplying test gas to a gas flow inlet of a nozzle flow test fixture; measuring a first gas flow rate of the test gas exiting the nozzle flow test fixture through a test nozzle affixed to a test gas flow outlet; concurrently measuring a second gas flow rate of the test gas exiting the nozzle flow test fixture through a reference nozzle affixed to a reference gas flow outlet; and comparing the first gas flow rate to the second gas flow rate to determine that the test nozzle satisfies a predetermined flow condition relative to the reference nozzle.

[0004] In some such examples, supply of the test gas to the nozzle flow test fixture is regulated by a mass flow controller.

[0005] In some such examples, alternatively or additionally the first gas flow rate is measured by a first mass flow meter (MFM), and wherein the second gas flow rate is concurrently measured by a second MFM.

[0006] In some such examples, alternatively or additionally the method further comprises, prior to measuring the first gas flow rate, attaching a nozzle interface socket to the test nozzle, wherein the nozzle interface socket includes a socket gas outlet attached to a gas flow tube.

[0007] In some such examples, alternatively or additionally the test nozzle is one of two or more different nozzle types having different respective sizes, and wherein the nozzle interface socket is compatible with each of the two or more different nozzle types.

[0008] In some such examples, alternatively or additionally the test nozzle is sized and shaped for attachment to a showerhead of a substrate processing tool.

[0009] In some such examples, alternatively or additionally the test nozzle is associated with a designated attachment position on a faceplate of the showerhead of the substrate processing tool, and wherein the predetermined flow condition for the test nozzle is determined based on the designated attachment position.

[0010] In some such examples, alternatively or additionally the method further comprises testing a plurality of additional test nozzles associated with different designated attachment positions on the faceplate of the showerhead, and wherein each of the plurality of additional test nozzles are associated with different predetermined flow conditions relative to the reference nozzle based on the different designated attachment positions.

[0011] In some such examples, alternatively or additionally the predetermined flow condition includes the first gas flow rate differing from the second gas flow rate by less than a threshold difference.

[0012] In some such examples, alternatively or additionally the test gas is N2.

[0013] Another example provides a nozzle flow testing system. The nozzle flow testing system comprises a nozzle flow test fixture. The nozzle flow test fixture comprises a gas flow inlet to receive test gas; a test gas flow outlet configured to release test gas from the nozzle flow test fixture through a test nozzle affixed to the test gas flow outlet; and a reference gas flow outlet to release test gas from the nozzle flow test fixture through a reference nozzle affixed to the reference gas flow outlet. The nozzle flow test system further comprises a first mass flow meter (MFM) to measure a first gas flow rate of the test gas exiting the nozzle flow test fixture through the test nozzle; and a second MFM to measure a second gas flow rate of the test gas exiting the nozzle flow test fixture through the reference nozzle.

[0014] In some such examples, the nozzle flow test system further comprises a mass flow controller to regulate supply of the test gas to the nozzle flow test fixture.

[0015] In some such examples, alternatively or additionally a nozzle interface socket is attached to the test nozzle, the nozzle interface socket including a socket gas outlet attached to a gas flow tube.

[0016] In some such examples, alternatively or additionally the test nozzle is one of two or more different nozzle types having different respective sizes, and wherein the nozzle interface socket is compatible with each of the two or more different nozzle types.

[0017] In some such examples, alternatively or additionally the test nozzle is sized and shaped for attachment to a showerhead of a substrate processing tool.

[0018] Another example provides a method for performing nozzle gas flow testing. The method comprises supplying test gas to a gas flow inlet of a nozzle flow test fixture using a mass flow controller; using a first mass flow meter (MFM), measuring a first gas flow rate of the test gas exiting the nozzle flow test fixture through a test nozzle affixed to a test gas flow outlet; using a second MFM, concurrently measuring a second gas flow rate of the test gas exiting the nozzle flow test fixture through a reference nozzle affixed to a reference gas flow outlet; and comparing the first gas flow rate to the second gas flow rate to determine that the test nozzle satisfies a predetermined flow condition relative to the reference nozzle.

[0019] In some such examples, alternatively or additionally the test nozzle is sized and shaped for attachment to a showerhead of a substrate processing tool, wherein the test nozzle is associated with a designated attachment position on a faceplate of the showerhead of the substrate processing tool, and wherein the predetermined flow condition for the test nozzle is determined based on the designated attachment position.

[0020] In some such examples, alternatively or additionally the method further comprises test a plurality of additional test nozzles associated with different designated attachment positions on the faceplate of the showerhead, and wherein each of the plurality of additional test nozzles are associated with different predetermined flow conditions relative to the reference nozzle based on the different designated attachment positions.

[0021] In some such examples, alternatively or additionally, a nozzle interface socket is attached to the test nozzle, the nozzle interface socket including a socket gas outlet attached to a gas flow tube.

[0022] In some such examples, alternatively or additionally, the test nozzle is one of two or more different nozzle types having different respective sizes, and whereinthe nozzle interface socket is compatible with each of the two or more different nozzle types.BRIEF DESCRIPTION OF THE DRAWINGS

[0023] FIG. 1 shows a schematic depiction of an example substrate processing tool comprising a showerhead.

[0024] FIG. 2 schematically shows aspects of an example showerhead including a plurality of nozzles affixed to a faceplate.

[0025] FIG. 3 schematically depicts aspects of an example nozzle flow test system including a nozzle flow test fixture.

[0026] FIG. 4 schematically depicts different attachment positions of nozzles relative to the faceplate of a showerhead.

[0027] FIG. 5 schematically illustrates how predetermined flow conditions for different nozzles may vary depending on attachment position.

[0028] FIGS. 6 A and 6B schematically show an example nozzle interface socket.

[0029] FIGS. 7A and 7B schematically show another example nozzle interface socket.

[0030] FIG. 8 illustrates an example method for nozzle gas flow test.

[0031] FIG. 9 schematically shows an example computing system.DETAILED DESCRIPTION

[0032] The term “backplate” generally represents a component part of a showerhead. The backplate, together with a faceplate, defines a plenum of the showerhead. The backplate faces away from a substrate holder of a processing tool.

[0033] The term “faceplate” generally represents a part of a showerhead that faces toward a substrate holder of a processing tool. A faceplate includes openings to emit processing chemicals from the showerhead. Nozzles can be affixed to openings in the faceplate to control the emission of the processing chemicals in some showerheads.

[0034] The term “film” or “film layer” generally represents refer to a thin layer of material deposited on the substrate (e.g., semiconductor wafer), and may include dielectrics, conductive materials, and / or semiconductor materials.

[0035] The term “nozzle” generally represents an apparatus that allows a gas to pass through.

[0036] The term “nozzle flow test fixture” generally refers to an apparatus configured to test nozzle flow characteristics. The nozzle flow test fixture may include a gas flow inlet to receive test gas, and two or more gas flow outlets to which nozzles can be attached..

[0037] The term “processing chamber” generally represents an enclosure in which chemical and / or physical processes are performed on substrates.

[0038] The term “showerhead” generally represents a structure for distributing processing chemicals into a processing chamber.

[0039] Showerheads are used in many semiconductor processing tools to distribute processing chemicals in a suitably uniform manner across a substrate. Processing chemicals are introduced to the showerhead through one or more inlets. The processing chemicals flow through a plurality of openings distributed across a faceplate of the showerhead toward the substrate. Nozzles can be attached to at least some of the openings on the faceplate to control the direction and the flow rate of the processing chemicals exiting the showerhead.

[0040] Differences in flow characteristics between different nozzles used in this manner can influence the chemical reactions taking place in the processing chamber. For instance, the flow rate of a given nozzle can influence the thickness of a film deposited at a corresponding position on the substrate, thereby influencing the uniformity of film deposition. Thus, structural differences between different nozzles, including intentional structural differences and unintentional differences resulting from manufacturing defects, can have a significant effect on substrate processing. In some scenarios, it can be desirable for the film to have a relatively uniform thickness distribution. Conversely, in some scenarios, it can be desirable for the film to have a predetermined non-uniform thickness profile, such as concentric rings of different thicknesses.

[0041] Accordingly, the present disclosure describes example techniques for testing the performance and characteristics of showerhead nozzles by utilizing a nozzle flow test fixture. Test gas is supplied to a gas flow inlet of a nozzle flow test fixture. Subsequently, a first gas flow rate of the test gas is measured as the test gas exits the nozzle flow test fixture through a test nozzle affixed to a test gas flow outlet. This measurement may be taken using calibrated mass flow meters (MFMs) or similar measurement devices that provide accurate and reliable data on the volume of gas passing through the test nozzle over a given time period. Concurrently, a second gasflow rate is measured for the test gas as it exits the nozzle flow test fixture through a reference nozzle. This reference nozzle is affixed to a separate reference gas flow outlet and serves as a standard or benchmark for comparison to the performance of the test nozzle.

[0042] In this manner, the gas flow rate of the test nozzle can be compared to the gas flow rate of the reference nozzle to determine if the test nozzle satisfies a predetermined flow condition. This can include determining that the gas flow rate of the test nozzle differs from the gas flow rate of the reference nozzle by less than a threshold difference. This can indicate that the performance of the test nozzle is within predetermined specifications. In some examples, different nozzles are associated with different attachment positions on the faceplate of the showerhead, and each nozzle has a different predetermined flow condition based on its attachment position. This can be used, for instance, to deposit films on substrates such that the films have predetermined non-uniform thickness profiles, by selectively placing nozzles with different flow rates at different attachment positions on the showerhead faceplate. The techniques described herein can be applied to test whether each nozzle is consistent with its predetermined flow condition. This beneficially enables faster and more efficient test of showerhead nozzles, and results in more consistent substrate processing operations.

[0043] Referring now to FIG. 1 , an example processing tool 100 for processing a substrate is schematically shown. The processing tool 100 can be configured for thermal or plasma-enhanced chemical vapor deposition (CVD), thermal or plasma- enhanced atomic layer deposition (ALD), and / or other substrate processes. It will be understood that, in other examples, a showerhead as described herein may alternatively or additionally be used for suitable substrate etching processes, and is not limited to deposition processes.

[0044] The processing tool 100 comprises a processing chamber 102 including a showerhead 106. As described in more detail below, the showerhead 106 can include a plurality of attached nozzles to control emission of processing chemicals from the showerhead. It will be understood that the specific configuration shown in FIG. 1 is non-limiting, and that the arrangements described herein can be applied to a wide variety of different suitable showerheads and substrate processing scenarios.

[0045] The processing tool 100 further includes a pedestal 108. The depicted pedestal 108 can be configured as a ceramic pedestal in some examples. Duringoperation, a substrate 110 is arranged on the pedestal 108. In other examples, other types of pedestals, such as an electrostatic chuck pedestal, can be used.

[0046] The processing tool receives processing chemicals, such as precursors 112 and process gases 114 (e.g. oxidants and / or inert gases) for substrate processing operations. As non-limiting examples, this may include deposition and / or etching processes. The process gases 114 are introduced into a remote plasma chamber 115. The processing tool 100 includes a radio frequency (RF) inductive coil 116, which is used to ionize the process gases 114 to form a remote inductively coupled plasma containing reactive species. The reactive species formed in the remote plasma chamber 115 pass through the showerhead 106 toward substrate 110. Precursor 112 also is emitted by the showerhead by the showerhead 106 toward the substrate. The precursor 112 and reactive species formed by the remote plasma in remote plasma chamber 115 then react to form a film on the substrate. Various components of processing tool 100, such as processing chemical sources, processing chemical flow hardware, power supplies and connections, electronic controllers, and exhaust system hardware are omitted from the schematic depiction of FIG. 1.

[0047] FIG. 2 shows aspects of an example showerhead 200 in detail. It will be understood that the specific appearance and configuration of showerhead 200 is simplified and non-limiting. As shown, showerhead 200 includes a faceplate 202, and a plurality of nozzles attached to different attachment positions on the faceplate. Three of these nozzles are labeled as nozzles 204 A, 204B, and 204C. A showerhead may include any suitable number of nozzles. Further, each nozzle can have a same configuration as other nozzles, or a different configuration from one or more other nozzles.

[0048] As will be described in more detail below, the nozzles are removable from the showerhead faceplate, such that their flow characteristics can be tested in a nozzle flow test fixture. In other words, each nozzle is sized and shaped for attachment to a showerhead of a substrate processing tool, but may be removed from the showerhead for testing, cleaning, and / or for any other purpose. In some examples, different specific showerheads are associated with different designated attachment positions on the faceplate. In this manner, nozzles having intentionally different flow characteristics may be attached to different positions on the faceplate to create a desired thickness profile of a film deposited on a substrate.

[0049] In this example, each of the openings in the faceplate are associated with a different corresponding nozzle. It will be understood that this is not limiting, and that in other scenarios, the showerhead faceplate may include one or more openings for emission of processing chemicals using different types of nozzles. For instance, in some substrate processing scenarios, the same showerhead may be used to emit multiple different types of processing chemicals toward a substrate through different types of nozzles.

[0050] Nonetheless, as discussed above, processing chemicals may enter the showerhead through one or more inlets, and exit the showerhead toward the substrate through the plurality of nozzles. The flow characteristics of each nozzle influences the direction and flow rate of processing chemicals exiting the showerhead through that nozzle, and this can influence the chemical reactions taking place in the processing chamber.

[0051] To this end, showerhead nozzles may be tested to confirm that their flow characteristics are consistent with predefined flow conditions - e.g., to confirm that the nozzles will behave as intended when used in substrate processing operations. FIG. 3 shows aspects of an example nozzle flow test system 300. It will be understood that the specific arrangement of components and devices depicted in FIG. 3 is non-limiting and highly simplified for the sake of explanation.

[0052] Nozzle flow test system 300 includes a nozzle flow test fixture 301. In general, the nozzle flow test fixture takes the form of any suitable structure that can receive test gas, and cause such test gas to be released from two or more showerhead nozzles affixed to the test fixture to measure each nozzle’s respective gas flow rate. In some examples, the nozzle flow test fixture has a substantially similar configuration to a showerhead as discussed above, to better emulate the configuration in which nozzles are used for substrate processing. In general, however, the nozzle flow test fixture may have any shape, size, and appearance suitable for facilitating the nozzle flow test techniques described herein.

[0053] As shown in FIG. 3, the test fixture receives test gas 302 from a test gas supply 304 through a gas flow inlet 306. In other words, test gas is supplied to the gas flow inlet of the nozzle flow test fixture. Any suitable gas or mixture of gases may be used as a “test gas” for the purpose of the present disclosure. As one non-limiting example, the test gas may include nitrogen gas (N2). Additionally, or alternatively, thetest gas may include air, helium, carbon dioxide, argon, and / or other suitable gases or gas mixtures.

[0054] Though not specifically shown in FIG. 3, test gas may be carried between different components of the nozzle flow test system in any suitable way. For instance, the test gas may be carried using suitable tubing, pipes, or other structures suitable for gas flow. As one non-limiting example, test gas may be carried into and out of the nozzle flow test fixture using polyurethane tubing.

[0055] In some examples, supply of the test gas to the nozzle flow test fixture is regulated to achieve a predetermined flow rate. This is the case in FIG. 3, where a flow controller 308 is used to control and measure the flow of test gas into the nozzle flow test fixture. The flow controller may take the form of any suitable device useable to control and measure the flow of a gas through a closed system. As one non-limiting example, the flow controller may take the form of a mass flow controller (MFC). In the example of FIG. 3, flow controller 308 outputs a supply flow measurement 310 of the rate of gas flow into the nozzle flow test fixture. This measurement may be output in any suitable way - e.g., by displaying the measurement on a digital display, writing the supply flow measurement to a file, transmitting the supply flow management to a separate device, etc.

[0056] As shown, the nozzle flow test fixture includes a test gas flow outlet 312 to which a test nozzle 314 is affixed. A portion of the test gas supplied to the nozzle flow test fixture exits the fixture through the test nozzle affixed to the test gas flow outlet. Similarly, the nozzle flow test fixture includes a reference gas flow outlet 316 to which a reference nozzle 318 is affixed. A portion of the test gas supplied to the nozzle flow test fixture exits the fixture through the reference nozzle affixed to the reference gas flow outlet.

[0057] In this example, the nozzle flow test fixture includes two outlets and two corresponding nozzles. It will be understood that this is non-limiting, and that a nozzle flow test fixture may include any suitable number of outlets, and nozzles may be affixed to any or all such outlets. For instance, in some examples, two different test nozzles may be attached to the nozzle flow test fixture, to simultaneously measure the gas flow rates of each of the two or more different test nozzles against a reference nozzle. In some examples, the nozzle flow test fixture may have a number of outlets equal to the number of nozzles that would ordinarily be attached to a showerhead. Thus, as one non-limiting example, the nozzle flow test fixture may include 85 outlets for 85 different nozzles.

[0058] In the example of FIG. 3, the nozzles affixed to the nozzle flow test fixture are referred to as a “test” nozzle and a “reference” nozzle. The reference nozzle refers to a nozzle that is known to meet predetermined specifications (e.g., from prior testing). The reference nozzle may be described as a “golden” nozzle that is known to have an intended flow rate and / or other flow characteristics. A test nozzle refers to any nozzle that is under test to determine or confirm its flow rate. As examples, this could be done to confirm the quality of a newly manufactured nozzle, diagnose a potentially faulty nozzle, perform random testing on production nozzles that are used for substrate processing, etc.

[0059] In FIG. 3, the nozzle flow testing system includes a flow rate sensor 320 configured to measure a first gas flow rate 322 of the test gas exiting the nozzle flow testing fixture through the test nozzle. The flow rate sensor may take the form of any suitable device usable for measuring the flow rate of a gas in a closed system. As one non-limiting example, the first gas flow rate of the test gas may be measured by a mass flow meter (MFM). Concurrently, a second flow rate sensor 324 measures a second gas flow rate 326 of the test gas exiting the nozzle flow testing fixture through the reference nozzle affixed to the reference gas flow outlet. As one non-limiting example, the second flow rate sensor may also take the form of an MFM, or may be implemented as any other suitable device.

[0060] Testing the test nozzle and reference nozzle concurrently can beneficially improve the accuracy of the testing process, by making it easier to determine when gas supply fluctuations and / or other variations over time are affecting the test results. In one example approach, testing may begin by controlling the supply of test gas to the nozzle flow test fixture while measuring the gas flow rate of test gas exiting the reference nozzle. The supply rate of the test gas may be varied until the measured flow rate of gas from the reference nozzle is equal to, or within a threshold distance of, a predetermined value. At this time, the gas flow rates of test gas exiting the test nozzle and reference nozzle may be measured concurrently, to determine the relative flow rate of the test nozzle as compared to the reference nozzle.

[0061] As with the supply flow measurement described above, the first gas flow rate and the second gas flow rate can be reported in any suitable way. For instance,these measurements may be displayed on a digital display, written to a file, transmitted to a separate device, and / or otherwise output for comparison.

[0062] As discussed above, the first gas flow rate is compared to the second gas flow rate to determine whether the test nozzle satisfies a predetermined flow condition relative to the reference nozzle. The predetermined flow condition may take any suitable form depending on the implementation - e.g., depending on the type of substrate processing operations for which the nozzle is intended. In some examples, the predetermined flow condition includes the first gas flow rate differing from the second gas flow rate by less than a threshold difference. In other words, if the predetermined flow condition is satisfied, then the performance of the test nozzle is sufficiently similar to the performance of the reference nozzle to determine that the test nozzle is operating according to a predefined specification. In such cases, any suitable difference threshold may be used - e.g., depending on measuring variance and the desired degree of tolerance for variance between different nozzles.

[0063] As another example, as discussed above, different nozzles may be associated with different designated attachment positions on the faceplate of a showerhead. In such cases, the predetermined flow condition for the test nozzle may be determined based on the designated attachment position. In this manner, nozzles having intentionally different flow rates can be attached to different positions on the showerhead to deposit a film on the substrate having an intended non-uniform thickness profile. In other words, after testing a particular test nozzle, a plurality of additional test nozzles may be tested, each associated with different designated attachment positions on the faceplate of the showerhead. Each of the plurality of additional test nozzles may be associated with different predetermined flow conditions based on their different designated attachment positions on the showerhead.

[0064] These scenarios are schematically illustrated with respect to FIGS. 4 and 5. Specifically, FIG. 4 schematically shows a grid 400 that represents different nozzle attachment positions of nozzles on a showerhead. Three of these attachment positions are labeled as positions 402, 404, and 406. In this example, each of the different nozzles attached to the showerhead are intended to have substantially similar flow rates (e.g., falling within a threshold distance of a reference nozzle when tested), and thus each of the positions shown in grid 400 are colored black to indicate that they have the same predetermined flow condition.

[0065] By contrast, FIG. 5 represents a scenario where the intended flow rate of each nozzle, and thus the predetermined flow condition for each nozzle, varies depending on the nozzle’s designated attachment position on the showerhead. This is indicated by the different fill patterns used for different attachment positions on the showerhead. Specifically, FIG. 5 shows another grid 500 representing different nozzle attachment positions on a showerhead. Three of these are labeled as positions 502, 504, and 506. However, each of these positions is associated with a different intended nozzle flow rate, and thus a different predetermined flow condition, to achieve a desired result during substrate processing. For instance, by intentionally varying the flow rates of different nozzles, a film may be deposited on the substrate that has an intentionally non- uniform thickness distribution. This may include a symmetrical thickness distribution - e.g., two or more concentric rings having different thicknesses - or an asymmetrical thickness distribution, depending on the implementation.

[0066] In some scenarios, nozzle testing may include attaching tubing (or another structure suitable for gas flow) directly to each nozzle, where the tubing carries test gas from the nozzle to a flow sensor (such as an MFM) to measure the gas flow rate. However, this can potentially introduce variance into the testing process depending on how the tubing is attached to each nozzle. Differences in the angle and / or placement of the tube on each nozzle can affect the measured gas flow rate. As such, in some examples, testing accuracy can be improved by attaching a nozzle interface socket to each nozzle, where the nozzle interface socket includes a socket gas outlet to which the tubing may be attached. This can beneficially standardize the manner in which tubing is attached to nozzles under test. In other words, in some examples, prior to measuring the first gas flow rate, a nozzle interface socket is attached to the test nozzle. A similar nozzle interface socket may be attached to the reference nozzle.

[0067] Non-limiting examples of suitable nozzle interface sockets will now be described with respect to FIGS. 6 A and 6B, and FIGS. 7 A and 7B. FIG. 6 A schematically shows an example nozzle interface socket 600. The nozzle interface socket may be attached to an example nozzle 602, which may itself be attached to a nozzle flow test fixture as discussed above. In this manner, the nozzle interface socket receives test gas emitted from the nozzle flow test fixture via the nozzle. Nozzle interface socket 600 includes a socket gas outlet 604 attached to a gas flow tube 606, which serves to carry test gas out of the nozzle interface socket and toward a flow sensor for gas flow rate measurement.

[0068] FIG. 6B shows an exploded view of nozzle interface socket 600. The nozzle interface socket may include any suitable internal structures to removably attach the socket to the nozzle, and form an airtight seal with the nozzle. For instance, the nozzle interface socket may include one or more internal O-rings to reduce the amount of test gas that escapes from the nozzle without entering the nozzle interface socket.

[0069] FIG. 7A schematically shows another example nozzle interface socket 700. The nozzle interface socket may be attached to an example nozzle 702, which may itself be attached to a nozzle flow test fixture as discussed above. In this manner, the nozzle interface socket receives test gas emitted from the nozzle flow test fixture via the nozzle. Nozzle interface socket 700 includes a socket gas outlet 704 attached to a gas flow tube 706, which serve to carry test gas out of the nozzle interface socket and toward a flow sensor for gas flow rate measurement.

[0070] FIG. 7B shows an exploded view of nozzle interface socket 600. Structural differences between different nozzle interface sockets may enable compatibility with different types of nozzles. For instance, the nozzle 702 in FIG. 7A is different from the nozzle 602 of FIG. 6A. Different types of nozzles, having different shapes, sizes, and / or other characteristics, may be used in the same or different showerheads depending on the implementation - e.g., depending on the type of substrate processing operations that are applied. In other words, in some examples, the test nozzle is one of two or more different nozzle types having different respective sizes. In some examples, the nozzle interface socket is beneficially compatible with each of the two or more different nozzle types. For instance, nozzle interface socket 700 may in some cases be compatible with both of nozzles 602 and 702, which can simplify nozzle testing.

[0071] FIG. 8 illustrates an example method 800 for nozzle gas flow testing. Steps of method 800 may be initiated, terminated, and / or repeated at any suitable time and in response to any suitable condition. In some examples, one or more steps of method 800 may be carried out by, and / or with the assistance of, a computing system of one or more computing devices. A computing device implementing one or more steps of method 800 may have any suitable capabilities, hardware configuration, and form factor. In some examples, one or more steps of method 800 may be carried out by computing system 900 of FIG. 9.

[0072] At 802, method 800 includes supplying test gas to a gas flow inlet of a nozzle flow test fixture. The test gas may include nitrogen gas (N2), as one non-limitingexample. At 804, method 800 optionally includes controlling gas input to the nozzle flow test fixture to achieve a predetermined flow rate at the reference nozzle. This can be done to ensure that the gas flow has stabilized and that the reference nozzle is performing as expected, prior to testing the performance of the test nozzle.

[0073] At 806, method 800 includes measuring a first gas flow rate of the test gas exiting the nozzle flow test fixture through a test nozzle. At 808, method 800 includes concurrently measuring a second gas flow rate of the testing gas exiting the nozzle flow testing fixture through a reference nozzle affixed to a reference gas flow outlet. These gas flow rates may be measured using any suitable flow sensors, such as MFMs as discussed above.

[0074] At 810, method 800 includes comparing the first gas flow rate to the second gas flow rate to determine that the test nozzle satisfies a predetermined flow condition relative to the reference nozzle. The predetermined flow condition takes any suitable form. For instance, the predetermined flow condition may include the first gas flow rate being less than a threshold difference from the second gas flow rate. Additionally, or alternatively, the predetermined flow condition may be based at least in part on a designated attachment position of the test nozzle to the showerhead.

[0075] After comparison of the gas flow rates, in some examples, additional nozzles may be tested. For instance, the test nozzle may be removed and replaced with a second test nozzle. In some examples, a plurality of different nozzles are tested - e.g., each of the nozzles intended for use with a given showerhead. In some examples, test nozzles are tested in batches. For instance, a batch of five test nozzles may be tested sequentially, and then replaced with another batch of five test nozzles. Additionally, or alternatively, in some examples, two or more test nozzles may be tested at the same time.

[0076] The examples described herein can beneficially enable faster and more accurate nozzle testing by comparing the flow rate of a test nozzle against the flow rate of a reference nozzle having known flow characteristics. This can have the result of improving the consistency of substrate processing operations. These flow rates are measured by affixing the test nozzle and reference nozzle to a nozzle flow test fixture, to which test gas is supplied. Further, some examples, the accuracy and consistency of the flow testing process can be further improved by affixing nozzle interface sockets to the test nozzle and reference nozzle, which can standardize the interface between the nozzles and the tubing used to carry test gas out of the test fixture.

[0077] FIG. 9 schematically shows a non-limiting example of a computing system 900 that can enact one or more of the methods and processes described above. Computing system 900 is shown in simplified form. Computing system 900 may take the form of one or more personal computers, workstations, computers integrated with substrate processing tools, and / or network accessible server computers.

[0078] Computing system 900 includes a logic machine 902 and a storage machine 904. Computing system 900 may optionally include a display subsystem 906, input subsystem 908, communication subsystem 910, and / or other components not shown in FIG. 9.

[0079] Logic machine 902 includes one or more physical devices configured to execute instructions. For example, the logic machine may be configured to execute instructions that are part of one or more applications, services, programs, routines, libraries, objects, components, data structures, or other logical constructs. Such instructions may be implemented to perform a task, implement a data type, transform the state of one or more components, achieve a technical effect, or otherwise arrive at a desired result.

[0080] The logic machine may include one or more processors configured to execute software instructions. Additionally or alternatively, the logic machine may include one or more hardware or firmware logic machines configured to execute hardware or firmware instructions. Processors of the logic machine may be single-core or multi-core, and the instructions executed thereon may be configured for sequential, parallel, and / or distributed processing. Individual components of the logic machine optionally may be distributed among two or more separate devices, which may be remotely located and / or configured for coordinated processing. Aspects of the logic machine may be virtualized and executed by remotely accessible, networked computing devices configured in a cloud-computing configuration.

[0081] Storage machine 904 includes one or more physical devices configured to hold instructions 902 executable by the logic machine to implement the methods and processes described herein. When such methods and processes are implemented, the state of storage machine 904 may be transformed — e.g., to hold different data.

[0082] Storage machine 904 may include removable and / or built-in devices. Storage machine 904 may include optical memory (e.g., CD, DVD, HD-DVD, Blu-Ray Disc, etc.), semiconductor memory (e.g., RAM, EPROM, EEPROM, etc.), and / or magnetic memory (e.g., hard-disk drive, floppy-disk drive, tape drive, MRAM, etc.),among others. Storage machine 904 may include volatile, nonvolatile, dynamic, static, read / write, read-only, random-access, sequential-access, location-addressable, file- addressable, and / or content-addressable devices.

[0083] It will be appreciated that storage machine 904 includes one or more physical devices. However, aspects of the instructions described herein alternatively may be propagated by a communication medium (e.g., an electromagnetic signal, an optical signal, etc.) that is not held by a physical device for a finite duration.

[0084] Aspects of logic machine 902 and storage machine 904 may be integrated together into one or more hardware-logic components. Such hardware-logic components may include field-programmable gate arrays (FPGAs), program- and application-specific integrated circuits (PASIC / ASICs), program- and applicationspecific standard products (PSSP / ASSPs), system-on-a-chip (SOC), and complex programmable logic devices (CPLDs), for example.

[0085] When included, display subsystem 906 may be used to present a visual representation of data held by storage machine 904. This visual representation may take the form of a graphical user interface (GUI). As the herein described methods and processes change the data held by the storage machine, and thus transform the state of the storage machine, the state of display subsystem 906 may likewise be transformed to visually represent changes in the underlying data. Display subsystem 906 may include one or more display devices utilizing virtually any type of technology. Such display devices may be combined with logic machine 902 and / or storage machine 904 in a shared enclosure, or such display devices may be peripheral display devices.

[0086] When included, input subsystem 908 may comprise or interface with one or more user-input devices such as a keyboard, mouse, or touch screen. In some examples, the input subsystem may comprise or interface with selected natural user input (NUI) componentry. Such componentry may be integrated or peripheral, and the transduction and / or processing of input actions may be handled on- or off- board. Example NUI componentry may include a microphone for speech and / or voice recognition, and an infrared, color, stereoscopic, and / or depth camera for machine vision and / or gesture recognition.

[0087] When included, communication subsystem 910 may be configured to communicatively couple computing system 900 with one or more other computing devices. Communication subsystem 910 may include wired and / or wireless communication devices compatible with one or more different communicationprotocols. As non-limiting examples, the communication subsystem may be configured for communication via a wireless telephone network, or a wired or wireless local- or wide-area network. In some examples, the communication subsystem may allow computing system 900 to send and / or receive messages to and / or from other devices via a network such as the Internet.

[0088] It will be understood that the configurations and / or approaches described herein are exemplary in nature, and that these specific examples or examples are not to be considered in a limiting sense, because numerous variations are possible. The specific routines or methods described herein may represent one or more of any number of processing strategies. As such, various acts illustrated and / or described may be performed in the sequence illustrated and / or described, in other sequences, in parallel, or omitted. Likewise, the order of the above-described processes may be changed.

[0089] The subject matter of the present disclosure includes all novel and non- obvious combinations and sub-combinations of the various processes, systems and configurations, and other features, functions, acts, and / or properties disclosed herein, as well as any and all equivalents thereof.

Claims

CLAIMS:

1. A method for nozzle gas flow testing, the method comprising: supplying test gas to a gas flow inlet of a nozzle flow test fixture; measuring a first gas flow rate of the test gas exiting the nozzle flow test fixture through a test nozzle affixed to a test gas flow outlet; concurrently measuring a second gas flow rate of the test gas exiting the nozzle flow test fixture through a reference nozzle affixed to a reference gas flow outlet; and comparing the first gas flow rate to the second gas flow rate to determine that the test nozzle satisfies a predetermined flow condition relative to the reference nozzle.

2. The method of claim 1, wherein supply of the test gas to the nozzle flow test fixture is regulated by a mass flow controller.

3. The method of claim 1, where the first gas flow rate is measured by a first mass flow meter (MFM), and wherein the second gas flow rate is concurrently measured by a second MFM.

4. The method of claim 1, further comprising, prior to measuring the first gas flow rate, attaching a nozzle interface socket to the test nozzle, wherein the nozzle interface socket includes a socket gas outlet attached to a gas flow tube.

5. The method of claim 4, wherein the test nozzle is one of two or more different nozzle types having different respective sizes, and wherein the nozzle interface socket is compatible with each of the two or more different nozzle types.

6. The method of claim 1, wherein the test nozzle is sized and shaped for attachment to a showerhead of a substrate processing tool.

7. The method of claim 1, wherein the test nozzle is associated with a designated attachment position on a faceplate of the showerhead of the substrate processing tool, and wherein the predetermined flow condition for the test nozzle is determined based on the designated attachment position.

8. The method of claim 7, further comprising testing a plurality of additional test nozzles associated with different designated attachment positions on the faceplate of the showerhead, and wherein each of the plurality of additional test nozzles are associated with different predetermined flow conditions relative to the reference nozzle based on the different designated attachment positions.

9. The method of claim 1, wherein the predetermined flow condition includes the first gas flow rate differing from the second gas flow rate by less than a threshold difference.

10. The method of claim 1, wherein the test gas is N2.

11. A nozzle flow test system, comprising: a nozzle flow test fixture, comprising: a gas flow inlet configured to receive test gas; a test gas flow outlet configured to release test gas from the nozzle flow test fixture through a test nozzle affixed to the test gas flow outlet; and a reference gas flow outlet to release test gas from the nozzle flow test fixture through a reference nozzle affixed to the reference gas flow outlet; a first mass flow meter (MFM) to measure a first gas flow rate of the test gas exiting the nozzle flow test fixture through the test nozzle; and a second MFM to measure a second gas flow rate of the test gas exiting the nozzle flow test fixture through the reference nozzle.

12. The nozzle flow test system of claim 11, further comprising a mass flow controller to regulate supply of the test gas to the nozzle flow test fixture.

13. The nozzle flow test system of claim 11, wherein a nozzle interface socket is attached to the test nozzle, the nozzle interface socket including a socket gas outlet attached to a gas flow tube.

14. The nozzle flow test system of claim 13, wherein the test nozzle is one of two or more different nozzle types having different respective sizes, and wherein the nozzle interface socket is compatible with each of the two or more different nozzle types.

15. The nozzle flow test system of claim 11, wherein the test nozzle is sized and shaped for attachment to a showerhead of a substrate processing tool.

16. A method for nozzle gas flow testing, the method comprising: supplying test gas to a gas flow inlet of a nozzle flow test fixture using a mass flow controller; using a first mass flow meter (MFM), measuring a first gas flow rate of the test gas exiting the nozzle flow test fixture through a test nozzle affixed to a test gas flow outlet; using a second MFM, concurrently measuring a second gas flow rate of the test gas exiting the nozzle flow test fixture through a reference nozzle affixed to a reference gas flow outlet; and comparing the first gas flow rate to the second gas flow rate to determine that the test nozzle satisfies a predetermined flow condition relative to the reference nozzle.

17. The method of claim 16, wherein the test nozzle is sized and shaped for attachment to a showerhead of a substrate processing tool, wherein the test nozzle is associated with a designated attachment position on a faceplate of the showerhead of the substrate processing tool, and wherein the predetermined flow condition for the test nozzle is determined based on the designated attachment position.

18. The method of claim 16, further comprising test a plurality of additional test nozzles associated with different designated attachment positions on the faceplate of the showerhead, and wherein each of the plurality of additional test nozzles are associated with different predetermined flow conditions relative to the reference nozzle based on the different designated attachment positions.

19. The method of claim 16, wherein a nozzle interface socket is attached to the test nozzle, the nozzle interface socket including a socket gas outlet attached to a gas flow tube.

20. The method of claim 19, wherein the test nozzle is one of two or more different nozzle types having different respective sizes, and wherein the nozzle interface socket is compatible with each of the two or more different nozzle types.

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