Test fixture for printed circuit board components

Abstract

This document describes a test fixture for PCB components. The test fixture includes a pad with holes configured to direct RF energy from the component on the PCB through an end of the PCB to a top clamp of the test fixture. The end of the PCB may correspond to a cut line for destructive testing. The test fixture also includes a top clamp with a test port and a tapered shape configured to direct RF energy from the holes to the test port. The test fixture also includes a bottom clamp attached to the top clamp to hold the PCB between the top and bottom clamps for testing. The test fixture allows for rapid mounting of the PCB and test component without modifying the PCB design or requiring specific drilling of the PCB.

Description

Background Technology

[0001] Many printed circuit boards (PCBs) used for radio frequency (RF) signal propagation (e.g., RADAR) are hybrid PCBs, where components such as monolithic microwave integrated circuits (MMICs), substrate integrated waveguides (SIWs), matching circuits, and microstrip and / or ball grid array (BGA) to SIW converters are integrated into a single layer (e.g., an antenna substrate layer). Designing PCBs in this way allows components to operate more efficiently and effectively (e.g., achieving a higher signal-to-noise ratio). However, troubleshooting and failure mode analysis of PCBs often require component isolation, which can be difficult on hybrid PCBs due to the inherent challenges in separating and / or isolating their various components from each other. Summary of the Invention

[0002] This document relates to a test fixture for PCB components, and a PCB configured for testing using the test fixture. The test fixture is configured to test at least one component of the PCB. The PCB may be a portion of a parent PCB cut for testing.

[0003] In one implementation, the test fixture includes a spacer having an end having a thickness corresponding to the thickness of the PCB near its end. The end of the spacer has a hole configured to direct RF energy from a component via the end of the PCB to a top clamp of the test fixture. The test fixture also includes a top clamp providing: a standard test port configured for testing a component; and a tapered shape configured to direct RF energy from the hole in the spacer to the standard test port. The test fixture also includes a bottom clamp configured to attach to the top clamp to hold the PCB between the top and bottom clamps for testing.

[0004] In another implementation, the test fixture includes a top clamp providing contact legs configured to contact a component. The top clamp also includes a pyramid-shaped probe connected to the contact legs and configured to deliver RF energy from the component to a standard test port of the test fixture via the contact legs and the pyramid-shaped probe. The test fixture also includes a bottom clamp configured to attach to the top clamp to hold the PCB between the top and bottom clamps for testing. The bottom clamp provides: a standard test port; and a support for supporting the PCB within the test fixture.

[0005] This invention provides a simplified concept for a test fixture for PCB components, which is further described in the detailed description and accompanying drawings. This invention is not intended to identify essential features of the claimed subject matter, nor is it intended to define the scope of the claimed subject matter. Attached Figure Description

[0006] The following figures illustrate a test fixture for PCB components, its components, and aspects of a PCB configured for testing using the test fixture. Some of the same reference numerals are used throughout the figures to refer to examples of similar objects or features and components.

[0007] Figure 1 An example environment is shown in which a test fixture for PCB components can be implemented according to this disclosure.

[0008] Figure 2 An example test fixture for a PCB component is shown according to this disclosure.

[0009] Figure 3 The following is shown in accordance with this disclosure: Figure 2 Example of a test fixture top clamp.

[0010] Figure 4 The following is shown in accordance with this disclosure: Figure 2 Example of a test fixture, lower clamp.

[0011] Figure 5 The following is shown in accordance with this disclosure: Figure 2 Example shim for the test fixture.

[0012] Figure 6 Another example test fixture for PCB components according to this disclosure is shown.

[0013] Figure 7 The following is shown in accordance with this disclosure: Figure 6 Example of a test fixture top clamp.

[0014] Figure 8 The following is shown in accordance with this disclosure: Figure 6 Example of a test fixture, lower clamp.

[0015] Figure 9 The following is illustrated for use according to this disclosure. Figure 2 The example PCB specification is used for testing with a test fixture.

[0016] Figure 10 The following is illustrated for use according to this disclosure. Figure 2 and Figure 6An example method for testing PCBs using a test fixture. Detailed Implementation

[0017] Overview

[0018] RF PCBs are increasingly being developed and manufactured as hybrid PCBs that integrate multiple components (e.g., MMIC, SIW, microstrip) on a single layer. While this allows components to operate more efficiently and effectively, the integration can make it difficult to determine the correct failure mode.

[0019] For example, conventional techniques may be unable to diagnose whether an MMIC or antenna / SIW is causing poor or faulty RF signals. Furthermore, conventional techniques often require modifications to components or the PCB (e.g., modifying the SIW, adding additional waveguides, or drilling holes in the PCB for mounting and testing). Such modifications can not only increase manufacturing costs and complexity but may also reduce the functionality of the device itself.

[0020] This document describes a test fixture for PCB components. In its implementation, the test fixture includes a pad with holes configured to direct RF energy from the component on the PCB via an end of the PCB to a top clamp of the test fixture. The end of the PCB may correspond to a cut line for destructive testing. The test fixture also includes a top clamp with a test port and a tapered shape configured to direct RF energy from the holes to the test port. The test fixture also includes a bottom clamp attached to the top clamp to hold the PCB between the top and bottom clamps for testing.

[0021] In another implementation, the test fixture includes a top clamp providing contact legs configured to contact a component. The top clamp also includes a pyramid-shaped probe connected to the contact legs and configured to deliver RF energy from the component to a standard test port of the test fixture via the contact legs and the pyramid-shaped probe. The test fixture also includes a bottom clamp configured to attach to the top clamp to hold the PCB between the top and bottom clamps for testing. The bottom clamp provides a standard test port and a support for supporting the PCB within the test fixture.

[0022] Test fixtures allow for the rapid mounting of PCBs and test components. Furthermore, test fixtures allow for the testing of other components (e.g., another component on the PCB or a component opposite a cut line on the parent PCB). By achieving these features, test fixtures can provide testing of individual components without requiring specific drilling of the PCB or modifications to the PCB design (e.g., the parent PCB).

[0023] Example Environment

[0024] Figure 1 An example environment 100 is shown in which a test fixture 102 for PCB components can be implemented. The example environment 100 includes a mother PCB 104, which includes the component to be tested (e.g., a RADAR component, an RF transmission component). The mother PCB 104 may be a hybrid PCB, which may be faulty, malfunctioning, under development, or in any other situation where testing of components on it may be necessary.

[0025] To perform the test, the mother PCB 104 can be cut, split, disassembled, separated, or otherwise modified to create at least one PCB 106 for testing (e.g., PCB106-1 and PCB106-2). Because the mother PCB 104 is a hybrid PCB, the test is a destructive test to effectively test the various components on it. That is, once PCB 106 is created, the mother PCB 104 will no longer function as designed.

[0026] In example environment 100, the mother PCB 104 is cut along cut line 108. Cut line 108 is shown as being between antenna 110 and SIW 112, which propagates the signal generated by MMIC 114. The signal from MMIC 114 passes through RF circuitry 116 (e.g., a BGA to SIW converter). Thus, PCB 106-1 includes the antenna 110 to be tested, while PCB 106-2 includes the MMIC 114 (and RF circuitry 116) to be tested.

[0027] PCB 106 has clamping interfaces 118 along cut line 108 (e.g., clamping interface 118-1 of PCB 106-1 and clamping interface 118-2 of PCB 106-2). Clamping interfaces 118 are located on the edges of PCB 106 corresponding to cut line 108. In example environment 100, clamping interfaces 118 correspond to the connection between SIW 112 and antenna 110.

[0028] PCBs 106 (one or two individually) can then be placed in test fixture 102 to test components. PCBs 106 are oriented in test fixture 102 according to the position of their clamping interfaces 118. The fixture has test ports 120 configured to interface with computing system 122 to evaluate one or more parameters of the corresponding component. Test port 120 can be any non-standard or standard port (e.g., a waveguide interface). Computing system 122 can be any system configured to use test port 120 to analyze one or more parameters (e.g., a smart device, computer, laptop, desktop computer, server). For example, computing system 122 can have sensors configured to mate with test port 120 and software configured to use the sensors to evaluate the performance of one or more components of PCB 106.

[0029] Example test fixture

[0030] Figure 2 It shows Figure 1 An example of a test fixture 102 (e.g., test fixture 102-1). Test fixture 102-1 can be configured to test multiple components (e.g., antennas, SIW, MMIC, BGA-SIW converters). Test fixture 102-1 includes a top clamp 200, a bottom clamp 202, and a pad 204. For reference, a coordinate system 206 is shown. Coordinate system 206 includes a front / rear axis 208, an upper / lower axis 210, and a left / right axis 212. Arrows in coordinate system 206 indicate the rear, right, and upper directions, respectively.

[0031] The top clamp 200 includes a test port 120 (e.g., test port 120-1) facing the rear side of the test fixture 102-1. In other words, the test port 120-1 is parallel to the normal axis of the PCB end. The top clamp 200 also includes a tapered section 214 connecting the bottom side of the top clamp 200 to the test port 120-1. A portion of the tapered section 214 abuts against a hole 216 in the pad 204.

[0032] Hole 216 also mates with clamp interfaces 118 (e.g., clamp interfaces 118-1 and 118-2). Specifically, PCB 106 (e.g., PCB 106-1 or PCB 106-2) can be aligned on the left / right axis 212 such that clamp interfaces 118-1 or 118-2 are within the length of hole 216. When PCB 106-1 or 106-2 is placed in test fixture 102-1, signals can be transmitted between clamp interfaces 118-1 or 118-2 and test port 120-1 via hole 216 in pad 204 and taper 214 of top clamp 200.

[0033] The gasket 204 is located between the top clamp 200 and the bottom clamp 202. The gasket 204 may be attached to the top clamp 200 or the bottom clamp 202, be part of the top clamp 200 or the bottom clamp 202, or be held between the top clamp 200 and the bottom clamp 202 when the top clamp 200 is secured to the bottom clamp 202 (e.g., via screws, bolts, nuts, press-fit, clamps, pins, guides, actuators).

[0034] Spacer 204 provides a positioning end 218 for positioning PCB 106-1 or PCB 106-2 in the front / rear axis 208. Specifically, PCB 106-1 or 106-2 is inserted such that the end with clamp interface 118-1 or 118-2 is flush with the positioning end 218. Spacer 204 is located in the upper / lower axis 210 and the left / right axis 212 such that hole 216 is aligned with tapered 214 of top clamp 200. Alignment such that hole 216 is centered relative to tapered 214 on left / right axis 212 and that tapered 214 covers hole 216 on upper / lower axis 210.

[0035] The positioning end 218 has a thickness corresponding to the thickness of PCB 106-1 or 106-2. Therefore, when PCB 106-1 or 106-2 is not inserted, the gap between the bottom surface of the top clamp 200 and the top surface of the bottom clamp 202 is essentially the thickness of PCB 106-1 or 106-2. The spacer 204 can be of a different thickness (more specifically, the positioning end 218) to accommodate different thicknesses of PCB 106-1 or 106-2.

[0036] In some implementations, a gasket material may be disposed between the gasket 204 and the bottom clamp 202 and / or between the PCB 106-1 or 106-2 and the bottom clamp 202. For example, the gasket material may be a compressible material (e.g., rubber, polyurethane, plastic). The gasket material ensures the secure holding of the PCB 106-1 or 106-2 and / or accommodates variations in the thickness of the PCB 106-1 or 106-2 or the gasket 204.

[0037] Example Components

[0038] Figure 3 It shows Figure 2 An example of a top clamp 200. The top clamp 200 can be made of any conductive material (e.g., metal, conductive plastic) and can be shaped and / or machined.

[0039] The top clamp 200 includes a test port 120-1 and a cone 214. As discussed above, the cone 214 connects the bottom surface of the top clamp 200 to the test port 120-1. The length of the cone 214 (e.g., the length of the inclined surface between the bottom surface and the test port 120-1) can be configured for the bandwidth of (multiple) components under test. The test port 120-1 can be a rectangular standard test port (e.g., a WR12 waveguide interface, a WRXX waveguide interface).

[0040] Since test port 120-1 has a fixed height (e.g., standard height), the length of taper 214 defines the angle of taper 214 (e.g., the normal axis relative to the main planes of PCBs 106-1 and 106-2). Steeper angles (e.g., shorter tapers) can be configured for narrow-band impedance matching, while gentler angles (e.g., longer tapers) can be configured for wide-band impedance matching.

[0041] The top clamp 200 includes a sensor feature 300 and an assembly feature 302. The sensor feature 300 is configured to secure a sensor or other device to the top clamp 200 (and therefore, to the test fixture 102-1), enabling the sensor to test a component using the test port 120-1. The sensor feature 300 may include holes, slots, threads, pins, and / or latches. The assembly feature 302 is configured to secure the top clamp 200, the bottom clamp 202, and the gasket 204 together as the test fixture 102-1. The assembly feature 302 may include holes, slots, threads, pins, and / or latches.

[0042] Figure 4 It shows Figure 2 An example of the bottom clamp 202. The bottom clamp 202 can be made of any material (e.g., metal, plastic) and can be shaped and / or machined.

[0043] The bottom clamp 202 includes component feature 400. Component feature 400 is configured to secure the top clamp 200, bottom clamp 202, and gasket 204 together as a test fixture 102-1. Component feature 400 may include holes, slots, threads, pins, and / or latches. In the test fixture 102-1, the gasket 204 is configured to mate with the bottom clamp 202. Therefore, component feature 302 may include a slot 402 such that the corresponding shape of the gasket 204 can be placed in the slot 402. This allows for the use of different gaskets 204 without adjusting the bottom clamp 202.

[0044] Figure 5 It shows Figure 2Example of gasket 204. Gasket 204 can be made of any conductive material (e.g., metal, conductive plastic) and can be shaped and / or processed.

[0045] The pad 204 includes a hole 216. As discussed above, the hole 216 is configured to guide signals between the clamp interface 118-1 or 118-2 (e.g., from the end of PCB 106-1 or 106-2) and the tapered section 214 of the top clamp 200. The hole can be configured to guide RF energy such that the RF energy enters the top clamp perpendicular to the normal axis of the PCB end. The length of the hole 216 generally corresponds to the width of the tapered section 214, and the depth of the hole 216 generally corresponds to the depth of the top layer (e.g., the antenna substrate layer) of PCB 106-1 or 106-2.

[0046] Hole 204 includes sensor feature 500 and component feature 502. Sensor feature 500 is configured to secure a sensor to pad 204 (and therefore, to test fixture 102-1), enabling the sensor to test a component using test port 120-1. Sensor feature 500 may include holes, slots, threads, pins, and / or latches. Component feature 502 is configured to mate with component features 400 and 302 to secure top clamp 200, bottom clamp 202, and pad 204 together as test fixture 102-1. Component feature 502 may include holes, slots, threads, pins, and / or latches.

[0047] The gasket 204 also includes a protrusion 504 configured to mate with the groove 402 to support the gasket and sensor feature 500 in the test fixture 102. The protrusion 504 includes the sensor feature 500 so that the same sensor mounting can be used with different gaskets 204 regardless of the corresponding thickness of the positioning end 218.

[0048] The configuration and / or design of the components discussed above may vary without departing from the scope of this disclosure. For example, the gasket 204 may be integrated with the bottom clamp 202 to form a two-part assembly. Furthermore, features not specifically pointed out are not limited to the examples shown and may be of any shape and / or size depending on manufacturing requirements, hardware limitations, packaging, availability, ergonomics, etc.

[0049] Another example test fixture

[0050] Figure 6 The diagram shows components (e.g., radar components, RF transmission components) that can be used to test a PCB. Figure 1Another example of the test fixture 102 (e.g., test fixture 102-2). Test fixture 102-2 can be configured to test components that are the same as or different from those in test fixture 102-1 (e.g., microstrips). Test fixture 102-2 includes a top clamp 600 and a bottom clamp 602. For reference, a coordinate system 206 identical to that of test fixture 102-1 is shown.

[0051] The bottom clamp 602 includes a test port 120 (e.g., test port 120-2) facing the bottom side of the test fixture 102-2. The top clamp 600 includes a pyramid-shaped probe 604 that connects a contact leg 606 to the test port 120-2. The contact leg 606 is configured to contact the component under test (e.g., a microstrip).

[0052] Although not shown, the clamping interface 118 for PCB 106 used in test fixture 102-2 (e.g., clamping interface 118-3 for PCB 106-3) may be along cut line 108 that passes through or is adjacent to the microstrip of mother PCB 104 (or the microstrip of another mother PCB). The clamping interface 118-3 may be on top of PCB 106-3, rather than at the end (e.g., for SIW 112 of PCBs 106-1 and 106-2).

[0053] PCB 106-3 can be aligned on the left / right axes 212 so that the clamp interface 118-3 is within the width of the contact leg 606. When PCB 106 is placed in the test fixture 102-2, signals can be transmitted between the clamp interface 118-3 and the test port 120-2 via the pyramid probe 604. About Figure 7 The pyramid-shaped probe is described in further detail.

[0054] In some implementations, gasket material may be disposed between PCB 106-3 and bottom clamp 602 (e.g., on the holder 608 of bottom clamp 602). For example, the gasket material may be a compressible material (e.g., rubber, polyurethane, plastic). The gasket material ensures the secure holding of PCB 106-3 and / or accommodates variations in the thickness of PCB 106-3 or tolerances of top clamp 600. Furthermore, gasket materials of different thicknesses may be used for PCBs 106-3 of different thicknesses (e.g., for testing different boards).

[0055] Other example components

[0056] Figure 7 It shows Figure 6Example of a top clamp 600. The top clamp 600 can be made of any conductive material (e.g., metal, conductive plastic) and can be shaped and / or machined.

[0057] The top clamp 600 includes a pyramid-shaped probe 604 and a contact leg 606 electrically coupled to each other. Adjacent to the contact leg 606 is a clamping leg 700. The clamping leg 700 is configured to hold and secure the PCB 106-3 within the test fixture 102-2.

[0058] The top clamp 600 includes a cavity 702 surrounding the pyramidal probe 604. The cavity 702 may have dimensions corresponding to the test port 120-2 (e.g., a WR10 waveguide interface, a WRXX waveguide interface). The cavity 702 defines a front wall 704 and a top wall 706. The pyramidal probe 604 is connected to the front wall 704 but not to the top wall 706. In other words, the pyramidal probe 604 may be connected to the front wall 704 via an extension of contact leg 606 and may not contact the top wall 706. For example, as shown, the contact leg 606 may extend partially into the cavity 702 (e.g., the bottom of the contact leg 606 extends into the cavity 702, while the top of the contact leg 606 does not). This allows the pyramidal probe 604 to "float" within the cavity 702 while still not contacting the top wall 706. The offset (e.g., tilt) of the pyramid-shaped probe from the front wall 704 can be configured for optimal performance of the pyramid-shaped probe 604 (e.g., to achieve good bandwidth matching (S11) at both the component (microstrip) and the test port 120-2). The bottom surface of the pyramid-shaped probe 604 can be flush with the bottom surface of the top clamp 600.

[0059] The top clamp 600 also includes a notch 708 configured to isolate contacts and components (e.g., microstrips) from the PCB 106-3. The top clamp also includes component feature 710 configured to connect the top clamp 600 and the bottom clamp 602 around the PCB 106-3. Component feature 710 may include holes, slots, threads, pins, and / or latches.

[0060] Figure 8 It shows Figure 6 An example of a bottom clamp 602. The bottom clamp 602 may be made of any conductive material (e.g., metal, conductive plastic) and may be shaped and / or machined. Furthermore, although shown as a single piece, the bottom clamp 602 may comprise multiple pieces without departing from the scope of this disclosure.

[0061] The bottom clamp 602 includes a test port 120-2. The test port 120-2 is configured such that the pyramid-shaped probe 604 is aligned with the test port 120-1. The test port 120-2 can be a rectangular standard test port (e.g., a WR10 waveguide interface).

[0062] The bottom clamp 602 includes a sensor feature 800 and a component feature 802. The sensor feature 800 is configured to secure a sensor or other device to the bottom clamp 602 (and therefore, to the test fixture 102-2), enabling the sensor to test the component using the test port 120-2. Depending on the specific sensor and / or its mounting requirements (e.g., bolted configuration), the sensor feature 800 may include holes, slots, threads, pins, and / or latches. The component feature 802 is configured to secure the top clamp 600 to the bottom clamp 602 to form the test fixture 102-2. The component feature 802 may include holes, slots, threads, pins, and / or latches.

[0063] A mounting surface 804 is formed on the top of test port 120-2. Mounting surface 804 is configured to mate with the bottom surface of top clamp 600 (e.g., surrounding cavity 702). Bottom clamp 602 includes a holder 608 offset from mounting surface 804. The offset may correspond to the thickness of PCB 106-3 with or without gasket material. If gasket material is used, the offset may correspond to the thickness of both PCB 106-3 and the gasket material.

[0064] The bottom clamp 602 also includes a notch 806 configured to isolate the contacts of the PCB 106-3 from components (e.g., microstrips). The notch 806 can be cut into the mounting surface 804 to provide relief for attachment to the component.

[0065] Example PCB provision

[0066] Figure 9 An example of a PCB specification that can be used to further test components using test fixture 102-1 is shown at 900. The specification can be used as a through-reflection line (TRL) calibration standard for SIW. Calibration allows for mitigation of mismatches between test fixture 102-1 and the PCB under test (e.g., PCB 106-1 or PCB 106-2).

[0067] Figure 9Two corners 902 (e.g., corners 902-1 and 902-2) of the mother PCB 104 are shown. Corners 902 can be on any two corners of the mother PCB 104. Standards are arranged radially on corners 902 such that test fixtures 102-1 can be used at both ends of the respective standard (e.g., two port calibrations). Test fixtures 102-1 can be used for each standard in the test standards (one on each port of the respective standard).

[0068] The standards include a through standard 904 at angle 902-1 and a short standard 906 at angle 902-2. Both through standard 904 and short standard 906 have the same radius. Adjacent to through standard 904 is line standard 908. The line standard has a larger radius than both through standard 904 and short standard 906 to achieve delay during signal propagation. Standards generally include SIWs similar to SIW 112.

[0069] The standard has a pair of corresponding clamp interfaces 118. For example, through standard 904 has clamp interface 118-4, short standard 906 has clamp interface 118-5, and line standard 908 has clamp interface 118-6.

[0070] Although not shown, a SIW stub resonator can be added across standard 904 and line standard 908 to determine the effective dielectric constant of the SIW (and therefore SIW 112). Similarly, an SIW-to-microstrip converter can be added to the mother PCB 104 for calibration of microstrip testing in test fixture 102-2. The SIW-to-microstrip converter can be used to determine the effective dielectric constant of the substrate.

[0071] By using such a specification, the test fixture 102-1 can be used to characterize the substrate material of the mother PCB 104 (and therefore, PCB 106). Doing so allows for the calibration of a specific mother PCB 104 (rather than a generic mother PCB 104), which can lead to more accurate testing and characterization of the components.

[0072] Example Method

[0073] Figure 10 A diagram for use is shown at 1000. Figure 2 and Figure 6 This is an example method for testing a PCB using a test fixture. The method can test at least one component of a mother PCB. At point 1002, the mother PCB is cut to create two or more PCBs for testing. For example, the mother PCB 104 can be cut along cut line 108 to create PCBs 106-1 and 106-2.

[0074] At point 1004, one of the PCBs containing the components is inserted into the test fixture. For example, PCB 106-1 can be inserted into test fixture 102-1, or PCB 106-3 can be inserted into test fixture 102-2. Test fixture 102-1 or test fixture 102-2 can be partially or completely removed to allow for insertion.

[0075] If test fixture 102-1 is used, PCB 106-1 can be inserted such that clamp interface 118-1 abuts against pad 204, with clamp interface 118-1 within the length of hole 216. If test fixture 102-2 is used, PCB 106-3 can be inserted such that PCB 106-3 is on holder 608, and clamp interface 118-3 is close to cutout 806 (and therefore, below contact leg 606). Test fixture 102-1 or test fixture 102-2 can then be assembled / clamped around PCB 106-1 or PCB 106-3.

[0076] At 1006, the test port of the test fixture is used to perform component testing. For example, the computing system 122 can be connected to test port 120-1 or test port 120-2 to test components on PCB 106-1 or PCB 106-3.

[0077] Example

[0078] Example 1: A test fixture configured for testing at least one component of a printed circuit board (PCB), the test fixture comprising: a pad having an end having a thickness corresponding to the thickness of the PCB near an end of the PCB, the end of the pad having an aperture configured to direct RF energy from the component via the end of the PCB to a top clamp of the test fixture; a top clamp having: a standard test port of the test fixture configured for testing the component; and a cone configured to direct RF energy from the aperture of the pad to the standard test port; and a bottom clamp configured to attach to the top clamp to hold the PCB between the top clamp and the bottom clamp for testing.

[0079] Example 2: The test fixture of Example 1, wherein the component is a radar component.

[0080] Example 3: Test fixture of Example 2, wherein the radar component includes a substrate integrated waveguide (SIW).

[0081] Example 4: The test fixture of Example 2, wherein the radar component includes a monolithic microwave integrated circuit (MMIC).

[0082] Example 5: The test fixture of Example 2, wherein the radar component includes an antenna.

[0083] Example 6: A test fixture in any of the previous examples, wherein: the test fixture is configured for destructive testing of a mother PCB; the PCB is part of the mother PCB; and the ends of the PCB correspond to the cut lines of the mother PCB.

[0084] Example 7: Test fixture of Example 6, wherein the cut line is located between the substrate integrated waveguide (SIW) and the antenna on the mother PCB.

[0085] Example 8: Any of the test fixtures in the previous examples, wherein the depth of the hole in the end of the gasket corresponds to the depth of the top layer of the PCB.

[0086] Example 9: The test fixture of Example 8, wherein the top layer includes an antenna substrate layer.

[0087] Example 10: A test fixture for any of the previous examples, where the standard test port is a standard rectangular waveguide interface.

[0088] Example 11: Test fixture of Example 10, wherein the standard test port is a WR12 waveguide interface.

[0089] Example 12: Any of the test fixtures in the previous examples, wherein the standard test port is parallel to the normal axis of the end of the PCB.

[0090] Example 13: A test fixture in any of the previous examples, wherein the holes are configured to guide RF energy such that the RF energy enters the top clamp perpendicular to the normal axis of the end of the PCB.

[0091] Example 14: Any of the test fixtures in the previous examples, wherein the angle or length of the cone corresponds to the bandwidth of the component.

[0092] Example 15: Any of the test fixtures in the previous examples, wherein the conical and standard test ports form a cavity along the edge of the top clamp.

[0093] Example 16: A test fixture in any of the previous examples, wherein the pad is configured to: attach to the top clamp or the bottom clamp; and to the end of the tapered positioning PCB.

[0094] Example 17: A test fixture in any of the previous examples, wherein a tapered cover hole is provided when the gasket, top clamp, and bottom clamp are assembled around the PCB.

[0095] Example 18: A test fixture of any of the previous examples, wherein a gasket is attached to a bottom clamp.

[0096] Example 19: A test fixture in any of the previous examples, wherein the gasket, top clamp, and bottom clamp are made of conductive material.

[0097] Example 20: A test fixture in any of the preceding examples, wherein the test fixture further includes a gasket material configured to hold the PCB within the test fixture for testing, and to provide for variations in the thickness of the PCB or the thickness of the gasket ends.

[0098] Example 21: A test fixture configured for testing at least one component of a printed circuit board (PCB), the test fixture comprising: a top clamp providing contact legs configured to contact the component; a pyramid-shaped probe connected to the contact legs and configured to provide RF energy from the component to a standard test port of the test fixture via the contact legs and the pyramid-shaped probe; a bottom clamp configured to attach to the top clamp to hold the PCB between the top clamp and the bottom clamp for testing, the bottom clamp providing a standard test port; and a frame for supporting the PCB within the test fixture.

[0099] Example 22: Test fixture of Example 21, wherein the component is a radar component.

[0100] Example 23: A test fixture for Example 21 or 22, wherein the components include a microstrip.

[0101] Example 24: A test fixture for any of Examples 21 to 23, wherein a component includes a microstrip converter.

[0102] Example 25: Test fixture of Example 24, wherein the transition is a substrate integrated waveguide (SIW) to microstrip transition.

[0103] Example 26: A test fixture of any of Examples 21 to 25, wherein: the test fixture is configured for destructive testing of a mother PCB; the PCB is part of the mother PCB; and the PCB corresponds to a cut line of the mother PCB.

[0104] Example 27: Test fixture of Example 26, wherein the cutting line passes through the microstrip or adjacent microstrip.

[0105] Example 28: A test fixture of any of Examples 21 to 27, wherein the offset between the bracket of the bottom fixture and the mounting surface of the bottom fixture configured to mate with the top fixture corresponds to the depth of the PCB.

[0106] Example 29: A test fixture of any of Examples 21 to 28, wherein the top fixture further provides clamping legs configured to support the PCB in the test fixture.

[0107] Example 30: A test fixture for any of Examples 21 to 29, wherein the standard test port is a standard rectangular waveguide interface.

[0108] Example 31: Test fixture of Example 30, wherein the standard test port is a WR10 waveguide interface.

[0109] Example 32: A test fixture for any of Examples 21 to 31, wherein the standard test port is parallel to the normal axis of the plane of the PCB.

[0110] Example 33: A test fixture for any of Examples 21 to 32, wherein the pyramid-shaped probe does not contact the top wall of the top clamp.

[0111] Example 34: A test fixture for any of Examples 21 to 33, wherein the shape of the pyramid-shaped probe corresponds to the bandwidth of the component.

[0112] Example 35: A test fixture for any of Examples 21 to 34, wherein the pyramid-shaped probe is smaller than the standard test port.

[0113] Example 36: A test fixture of any of Examples 21 to 35, further comprising washer material disposed on the frame.

[0114] Example 37: Test fixture of Example 36, wherein the thickness of the gasket material corresponds to the thickness of the PCB.

[0115] Example 38: The test fixture of Example 37, wherein when the test fixture is assembled around the PCB, the thickness of the gasket provides contact between the contact leg and the component.

[0116] Example 39: A test fixture for any of Examples 36 to 38, wherein the washer material is compressible.

[0117] Example 40: Any of the test fixtures in the previous examples, wherein the pyramid-shaped probe is connected to the front wall of the top clamp via an extension of a contact leg that enters the cavity of the top clamp.

[0118] Example 41: A method for testing at least one component of a mother printed circuit board (PCB), the method comprising: cutting the mother PCB to create two or more PCBs for testing; inserting a PCB containing the component into a test fixture according to any of the preceding examples; and performing testing on the component using a test port of the test fixture.

[0119] Conclusion

[0120] While various embodiments of the present disclosure have been described in the foregoing description and illustrated in the accompanying drawings, it should be understood that the present disclosure is not limited thereto, but can be practiced in various ways within the scope of the following claims. It will be apparent from the foregoing description that various modifications can be made without departing from the spirit and scope of the present disclosure as defined by the following claims.

[0121] Unless the context explicitly states otherwise, the use of "or" and grammatically related terms indicates an unrestricted, non-exclusive alternative. As used herein, the phrase referring to "at least one" of a list of items means any combination of those items, including a single member. As an example, "at least one of a, b, or c" is intended to cover: a, b, c, ab, ac, bc, and abc, as well as any combination with multiple identical elements (e.g., aa, aaa, aab, aac, abb, acc, bb, bbb, bbc, cc, and ccc, or any other ordering of a, b, and c).

Claims

1. A test fixture configured for testing at least one component of a printed circuit board, the test fixture comprising: A spacer having an end having a thickness corresponding to the thickness of the printed circuit board near the end of the printed circuit board, the end of the spacer having a hole configured to direct radio frequency energy from the component via the end of the printed circuit board to the top clamp of the test fixture; The top clamp, the top clamp being provided with: The standard test port of the test fixture is configured to test the component; as well as A cone shape, the cone being configured to direct the radio frequency energy from the hole in the pad to the standard test port; as well as A bottom clamp is configured to attach to the top clamp to hold the printed circuit board between the top clamp and the bottom clamp for testing.

2. The test fixing device as described in claim 1, characterized in that, The component in question is a radar component.

3. The test fixing device as described in claim 2, characterized in that, The radar component includes a substrate-integrated waveguide.

4. The test fixing device as described in claim 2, characterized in that, The radar component includes a monolithic microwave integrated circuit.

5. The test fixing device as described in claim 2, characterized in that, The radar component includes an antenna.

6. The test fixing device as described in claim 1, characterized in that: The test fixture is configured for destructive testing of the mother printed circuit board; The printed circuit board is part of the parent printed circuit board; and The end of the printed circuit board corresponds to the cut line of the mother printed circuit board.

7. The test fixing device as described in claim 6, characterized in that, The cutting line is located between the substrate integrated waveguide and the antenna on the mother printed circuit board.

8. The test fixing device as described in claim 1, characterized in that, The depth of the hole in the end of the gasket corresponds to the depth of the top layer of the printed circuit board.

9. The test fixing device as described in claim 8, characterized in that, The top layer includes an antenna substrate layer.

10. The test fixing device as described in claim 1, characterized in that, The standard test port is a standard rectangular waveguide interface.

11. The test fixing device as described in claim 10, characterized in that, The standard test port is the WR12 waveguide interface.

12. The test fixing device as described in claim 1, characterized in that, The standard test port is parallel to the end of the printed circuit board.

13. The test fixing device as described in claim 1, characterized in that, The hole is configured to guide the radio frequency energy such that the radio frequency energy enters the top clamp perpendicular to the end of the printed circuit board.

14. The test fixing device as described in claim 1, characterized in that, The angle or length of the cone corresponds to the bandwidth of the component.

15. The test fixing device as described in claim 1, characterized in that, The cone and the standard test port form a cavity along the edge of the top clamp.

16. The test fixing device as described in claim 1, characterized in that, The gasket is configured to: Attached to the top clamp or the bottom clamp; and The end of the printed circuit board is positioned relative to the cone.

17. The test fixing device as claimed in claim 1, characterized in that, The test fixture further includes a gasket material configured to hold the printed circuit board within the test fixture for testing, and to provide thickness variations of the printed circuit board or the ends of the gasket.

18. A test fixture configured for testing at least one component of a printed circuit board, the test fixture comprising: Top clamp, the top clamp providing: A contact leg, the contact leg being configured to contact the component; as well as A pyramid-shaped probe, connected to the contact leg, and configured to provide radio frequency energy from the component to the standard test port of the test fixture via the contact leg and the pyramid-shaped probe; as well as A bottom clamp configured to attach to the top clamp to hold the printed circuit board between the top clamp and the bottom clamp for testing, the bottom clamp providing: The standard test port; as well as A frame, which is used to support the printed circuit board in the test fixture.

19. The test fixing device as described in claim 18, characterized in that, The component includes a microstrip.

20. The test fixing device as described in claim 18, characterized in that: The pyramid-shaped probe is connected to the front wall of the top clamp via an extension of the contact leg that enters the cavity of the top clamp; and The pyramid-shaped probe does not contact the top wall of the top clamp.

21. A method for testing at least one component of a mother printed circuit board, the method comprising: Cut the mother printed circuit board to create two or more printed circuit boards for testing; Insert a plurality of the printed circuit boards containing the components into the test fixture according to any one of the preceding claims; as well as The component is tested using the test port of the test fixture.

Images