Mounting device and mounting method

Abstract

This mounting device comprises: a component supply unit that supplies components; a mounting unit that picks the components in the component supply unit using a picking member and places the components on an object; an object imaging unit that images the side of the object; and a control unit that performs a correction of the picking position, which is where the components are picked by the mounting unit, and causes the mounting unit to pick the components from the component supply unit, said correction being performed using a position correction value for correcting the position where the mounting unit has placed the component as determined from an image captured by the object imaging unit once a simulation component has been placed on a simulation object.

Description

Mounting device and mounting method

[0001] This specification discloses a mounting apparatus and a mounting method.

[0002] Conventionally, as a mounting device for mounting components on an object such as a board, there has been proposed a device that performs multiple inspections including a first inspection that performs a mounting operation by controlling a mounting head and a board processing unit as a moving device to inspect whether the mounting is successful, and a second inspection that performs a calibration measurement of the mounting head to inspect whether the measurement is successful, and determines whether there is a malfunction including the mounting head and the board processing unit and the location of the malfunction based on a combination of the results of the multiple inspections (see, for example, Patent Document 1). This device is capable of judging the location of the malfunction.

[0003] International Publication No. 2021 / 171416

[0004] However, although the above-mentioned Patent Document 1 performs multiple inspections, such as an inspection using dummy components, this is still not sufficient, and there is a demand for further improvement in mounting accuracy.

[0005] The present disclosure has been made in consideration of such problems, and has as its main object to provide a mounting apparatus and a mounting method that can further improve mounting accuracy.

[0006] The mounting apparatus and mounting method disclosed in this specification employ the following means to achieve the above-mentioned main object.

[0007] The mounting device of the present disclosure includes a component supply unit that supplies components; a mounting unit that uses a pickup member to pick up components from the component supply unit and place them on an object; an object imaging unit that images the object; and a control unit that places a simulated component on the simulated object, corrects the pickup position at which the mounting unit picks up the component using a placement correction value that corrects the placement position of the mounting unit obtained from the image captured by the object imaging unit, and causes the mounting unit to pick up the component from the component supply unit.

[0008] In this mounting device, the corrections made by performing mounting operations using simulated components and simulated objects are applied to the correction of the component pick-up position, so that position corrections can be performed when picking up the components, thereby further improving mounting accuracy.

[0009] 1 is a schematic explanatory diagram showing an example of a mounting system 10. An explanatory diagram of an example of imaging a holding member 51 with an object imaging unit 34. An explanatory diagram of an example of an image of a mounting unit 30 by the mounting imaging unit 24. An explanatory diagram of an example regarding the tilt of a collection member 33. A schematic explanatory diagram showing an example of a simulation unit 40. An explanatory diagram showing an example of information stored in a memory unit 27. A flowchart showing an example of a mounting processing routine. An explanatory diagram of an example of a correction result when the mounting imaging unit 24 is fixed at an angle.

[0010] This embodiment will be described below with reference to the drawings. FIG. 1 is a schematic diagram illustrating an example of a mounting system 10. FIG. 2 is an explanatory diagram illustrating an example of imaging a holding member 51 using an object imaging unit 34. FIG. 3 is an explanatory diagram illustrating an example of imaging a mounting unit 30 using a mounting imaging unit 24. FIG. 4 is an explanatory diagram illustrating an example of the inclination of the collection member 33. FIG. 4A is a diagram of the mounting head 32 imaged from below, FIG. 4B is a diagram of the collection member 33 without inclination, and FIG. 4C is an explanatory diagram of an example of the collection member 33 with inclination. FIG. 5 is a schematic diagram illustrating an example of a simulation unit 40. FIG. 5A is a perspective view of the simulation unit 40, and FIG. 5B is a diagram of simulated components 45 and 46 arranged in a placement area 42. FIG. 6 is an explanatory diagram illustrating an example of mounting condition information 28 and correction information 29 stored in a storage unit 27. Note that in this embodiment, the left-right direction (X-axis), the front-back direction (Y-axis), and the up-down direction (Z-axis) are as shown in FIGS. 1 to 4. The containers 43 and 44 are collectively referred to simply as containers, and the dummy parts 45 and 46 are collectively referred to simply as dummy parts.

[0011] The mounting system 10 is configured, for example, as a production line in which mounting devices 13 that mount components P on a substrate S as an object are arranged in the transport direction of the substrate S. Here, the object of the mounting process is described as a substrate S, but is not particularly limited as long as it is something on which components P can be mounted, and it may also be a three-dimensional substrate. As shown in FIG. 1 , the mounting system 10 is configured to include a printing device 11, a print inspection device 12, a mounting device 13, a mounting inspection device 14, and a management device 18. The printing device 11 is a device that prints a viscous fluid such as solder paste on the substrate S. Note that the printing device 11 may also be a device that prints an adhesive, conductive paste, or the like as the viscous fluid. The print inspection device 12 is a device that inspects the condition of the printed viscous fluid. The mounting device 13 is a device that mounts components P on the substrate S. The mounting inspection device 14 is a device that inspects the condition of the components P mounted by the mounting device 13. Note that the mounting device 13 may also be a mounting-inspection device that has the functionality of the mounting inspection device 14. The management device 18 is a computer that manages information about each device in the mounting system 10 .

[0012] The mounting device 13 is an apparatus that picks up components P from a component supply unit 22 that supplies components P and mounts them on a substrate S as a target object before or after printing processing. As shown in FIG. 1 , the mounting device 13 includes a substrate processing unit 21, a component supply unit 22, a mounting imaging unit 24, a control device 25, a mounting unit 30, and a simulation unit 40. The substrate processing unit 21 is a unit that loads, transports, fixes at a mounting position, and unloads the substrate S. The component supply unit 22 has multiple feeders 23 with reels and a tray unit, and is detachably attached to the front side of the mounting device 13. Tape is wound around each reel as a holding member 51, and multiple components P are held along the longitudinal direction of the tape. The holding member 51 is unwound rearward from the reel, and with the components P exposed, is sent by the feeder 23 to a picking position where the components P are picked up by the picking member 33. As shown in FIG. 2 , the holding member 51 has a holding portion 52 and a feed hole 53 formed thereon. The holding portion 52 is a storage portion that stores the component P. Note that the holding portion 52 is not limited to a portion that stores the component P, and may be a portion that affixes the component P to its surface. The feed hole 53 is a through-hole that is used when a sprocket of the feeder 23 is inserted and the holding member 51 is fed in the feed direction F.

[0013] As shown in FIGS. 1 and 3 , the mounting imaging unit 24 is a unit that captures images of the mounting unit 30. The mounting imaging unit 24 is a parts camera that captures images of one or more components P picked up by the mounting head 32. The mounting imaging unit 24 includes an illumination unit that irradiates light onto the mounting unit 30 and an imaging element serving as an image sensor that converts the input light into an electrical signal. The mounting imaging unit 24 captures an image of the mounting head 32 holding the component P as it passes above the mounting imaging unit 24, and outputs the captured image data to the control device 25. The control device 25 processes the captured image to inspect whether the shape and location of the component P are normal and to detect any misalignment, such as the position or rotation, of the component P when it was picked up.

[0014] The control device 25 is configured as a microprocessor centered on a control unit 26 and controls the entire device. The control device 25 includes a memory unit 27 for storing various data. The control device 25 has the function of controlling the entire mounting device 13. The control device 25 outputs control signals to each unit of the mounting device 13 and inputs signals from each unit. As shown in FIG. 6 , the memory unit 27 stores mounting condition information 28 and correction information 29. The mounting condition information 28 includes information such as the mounting order for mounting components P on the board S, the picking and placement positions of components P, and the type of picking member 33 that can pick up the components P. The correction information 29 stores correction values ​​used to correct misalignment when picking and placing components P on the board S. The correction values ​​include a placement correction value A, a tilt correction value B, a holding correction value C, and a picking correction value D. The correction values ​​of the correction information 29 may be calculated after the mounting process has begun. The placement correction value A is a correction value used to correct the placement position of the mounting unit 30, which is determined from the image captured by the object imaging unit 34, when an actual mounting operation is performed, in which simulated components 45 and 46 of the simulation unit 40 are placed on the simulated object 41 (see FIG. 5). The tilt correction value B is a correction value used to correct the positional deviation of the picking member 33 when it is raised and lowered, which is determined from the image captured by the mounting imaging unit 24 (see FIG. 4). The holding correction value C is a correction value used to correct the holding position of the component P of the component supply unit 22, which is determined from the image captured by the object imaging unit 34 of the holding member 51 of the component supply unit 22 (see FIG. 2). The picking correction value D is a correction value used to correct the positional deviation of the component P in the picked state, which is determined from the image captured by the mounting imaging unit 24 (see FIG. 3). Note that the correction information 29 may omit one or more of these correction values, or may include other correction values. Furthermore, the mounting condition information 28 may be associated with the holding correction value C, the collection correction value D, and the like after the mounting process is started.

[0015] The mounting unit 30 is a unit that uses a pickup member 33 to pick up components P from the component supply unit 22 and place them on a board S fixed to the board processing unit 21. The mounting unit 30 includes a head moving unit 31, a mounting head 32, the pickup member 33, an object imaging unit 34, and an elevator unit 35. The head moving unit 31 includes a slider that moves in the X and Y directions along a guide rail, and a motor that drives the slider. The mounting head 32 is removably attached to the slider and moved in the X and Y directions by the head moving unit 31. One or more pickup members 33 are removably attached to the underside of the mounting head 32. The pickup member 33 may be a suction nozzle that uses negative pressure to pick up components or a mechanical chuck that grips the components P. The object imaging unit 34 is a unit that images the board S side as the object. The object imaging unit 34 is a mark camera disposed on the underside of the mounting head 32, and captures images of the substrate S, the marks formed on the substrate S, the simulation portion 40, etc. from above. The object imaging unit 34 moves in the X and Y directions in conjunction with the movement of the mounting head 32. The lifting unit 35 is a unit that moves up and down a cylinder to which the collection member 33 is attached. As shown in FIG. 3 , the lifting unit 35 is a mechanism that moves linearly in the Z-axis direction, and may be a ball screw mechanism, a linear motor, or the like.

[0016] The simulation unit 40 is a unit used to cause the mounting unit 30 to perform a mounting operation similar to an actual mounting operation and detect deviations in the placement position. As shown in FIG. 5 , the simulation unit 40 includes a simulated object 41, a simulated component 45, and a simulated component 46. The simulated object 41 is a plate-shaped member having a placement area 42 for placing the simulated component and storage areas 43 and 44 for storing the simulated component. The simulated object 41 may be a transparent member. The simulated object 41 is removably disposed at a position where the mounting unit 30 can pick up and place the simulated component and where the object imaging unit 34 can capture an image of the placement area 42. The storage area 43 is a space for storing the simulated component 45. The storage area 44 is a space for storing the simulated component 46. The simulated component 45 is a three-dimensional object that simulates a relatively small component P, such as a chip component. The simulated component 46 is a three-dimensional object that simulates a relatively large component P having, for example, bumps. The simulated components 45, 46 are used depending on the type of collection member 33. The mounting unit 30 collects the simulated component stored in the storage unit and places it in the placement area 42. The control device 25 sets a placement correction value A that corrects placement position deviation depending on the placement position of the simulated component. The simulated object 41 may be an object actually used in production, or a dedicated simulated object may be prepared. The simulated components 45, 46 may be the component P actually used in production, or dedicated simulated components may be prepared.

[0017] Next, the operation of the mounting system 10 of this embodiment configured as described above will be described, firstly, the process of placing components P on the board S by the mounting device 13. FIG. 6 is a flowchart showing an example of a mounting process routine executed by the control device 25 of the mounting device 13. This routine is stored in the storage unit 27 of the mounting device 13, and is executed by the control unit 26 of the control device 25 after the mounting system 10 is started. When this routine starts, the control unit 26 first reads and acquires mounting condition information 28 for the board S to be produced this time from the storage unit 27 (S100). Note that the control unit 26 may also acquire the mounting condition information 28 from the management device 18.

[0018] Next, the control unit 26 determines whether it is time to acquire the tilt correction value B (S110). The control unit 26 may determine that it is time to acquire the tilt correction value B at the time of calibration after the mounting head 32 is attached, at the start of the mounting process, when switching production processes, or after a predetermined time has elapsed. When it is time to acquire the tilt correction value B, the control unit 26 raises and lowers the collection member 33 above the mounting image capturing unit 24 to acquire the tilt correction value B and stores the acquired value in the correction information 29 (S120). Specifically, the control unit 26 attaches the collection member 33 to the mounting head 32, moves the mounting head 32 above the mounting image capturing unit 24, and causes the mounting image capturing unit 24 to capture images with the collection member 33 in the raised state and images with the collection member 33 in the lowered state, thereby determining the tilt correction value B that cancels out the misalignment between the positions of the collection member 33 (see FIG. 4 ). By using the tilt correction value B, the mounting device 13 can place the component P at a more accurate position by canceling out positional deviations that occur when the component P is raised or lowered.

[0019] After S120, or if it is not time to acquire the tilt correction value B in S110, the control unit 26 determines whether it is time to acquire the placement correction value A (S130). The control unit 26 may determine that it is time to acquire the placement correction value A at the start of the mounting process, when switching production processes, or after a predetermined time has passed. If it is time to acquire the placement correction value A, the control unit 26 acquires the placement correction value A using the simulation unit 40 and stores the acquired value in the correction information 29 (S140). Specifically, the control unit 26 attaches the collection member 33 to the mounting head 32, causes the collection member 33 to collect the simulated component contained in the container of the simulated object 41, and places the simulated component at the target position set in the placement area 42. At this time, the control unit 26 uses the tilt correction value B to execute the collection and placement processes of the simulated component. Next, the control unit 26 causes the object imaging unit 34 to capture an image of the simulated component placed in the placement area 42, acquires the position of the simulated component relative to a predetermined reference position, and acquires the amount of deviation (x, y) between the target position and the placement position (see FIG. 5B ). The control unit 26 then sets a placement correction value A that cancels this deviation. By using the placement correction value A obtained by performing the mounting operation, the mounting device 13 can place the component P in a more accurate position.

[0020] After S140, or if it is not time to acquire the placement correction value A in S130, the control unit 26 causes the board processing unit 21 to transport the board S to the mounting position and perform the fixation process (S150). Next, the control unit 26 causes the feeder 23 to feed the holding member 51 (S160) and determines whether it is time to acquire the holding correction value C (S170). The control unit 26 may determine that it is time to acquire the holding correction value C at the start of the mounting process, when switching production processes, or when replacing the reel of the feeder 23. Furthermore, because the value of the holding correction value C is unlikely to change for the holding member 51, it may be acquired only for the first predetermined number of components P, such as three or five. When it is time to acquire the holding correction value C, the control unit 26 causes the object imaging unit 34 to capture an image of the holding member 51 of the component supply unit 22, acquire the holding correction value C from the captured image, and store the acquired value in the correction information 29 (S180). Specifically, the control unit 26 moves the object imaging unit 34 of the mounting head 32 above the holding member 51 of the component supply unit 22, causes the object imaging unit 34 to capture an image of the holding unit 52 holding the component P, and calculates a holding correction value C that cancels out any deviation in the picking position based on a predetermined reference position. By using the holding correction value C, the mounting device 13 can cancel out any deviation in the picking position of the component P and pick the component P at a more accurate position.

[0021] After S180, or when it is not time to acquire the holding correction value C in S170, the control unit 26 causes the pickup member 33 to pick up the component P set based on the mounting condition information 28 using the placement correction value A, the tilt correction value B, and the holding correction value C (S190). Next, the control unit 26 moves the mounting head 32 above the mounting image capturing unit 24 and causes the mounting image capturing unit 24 to capture an image of the component P picked up by the mounting head 32 (S200). Next, the control unit 26 acquires a relationship between the predetermined reference position formed on the mounting head 32 and the position of the component P based on the captured image, acquires a pickup correction value D that cancels out the amount of misalignment in the picked state, and stores the acquired value in the correction information 29 (S210). By using the pickup correction value D, the mounting device 13 can subsequently cancel out the positional misalignment of the component P in the picked state and pick up and place the component P in a more accurate position.

[0022] Next, for components P that are found to have no shape or collection abnormalities based on the captured image, the control unit 26 corrects the positional deviation using the placement correction value A, tilt correction value B, and collection correction value D, and places the components P on the target board S (S220). By using the placement correction value A, tilt correction value B, and collection correction value D, the mounting device 13 can cancel the misalignment of the components P in their collection position and placement position, thereby picking and placing the components P in extremely accurate positions. After S220, the control unit 26 determines whether there are any components P to be picked and placed next (S230). If there are any components P to be picked and placed next, the control unit 26 executes the processing from S150 onward. On the other hand, if there are no components P to be picked and placed next in S230, the control unit 26 determines whether production of the board S has been completed (S240). If production of the board S has not been completed, the control unit 26 executes the processing from S110 onward. On the other hand, if production of the board S has been completed in S240, the control unit 26 ends this routine. In this way, the control unit 26 corrects the picking position of the component P by the picking member 33 using the placement correction value A, the tilt correction value B, and the holding correction value C, and corrects the placement position by the picking member 33 using the placement correction value A, the tilt correction value B, and the picking correction value D, thereby enabling the component P to be placed in a more accurate position with fewer placement attempts.

[0023] FIG. 8 is an explanatory diagram of an example of the correction result when the mounting imaging unit 24 is fixed at an angle. FIG. 8A shows an example when the pickup member 33 is not tilted, and FIGS. 8B and subsequent figures show examples when the mounting imaging unit 24 is tilted. FIG. 8C shows an example of recognition by the control device 25. FIG. 8D shows an example of tilt correction using tilt correction value B. FIG. 8E shows an example of operation after correction. The mounting device 13 sometimes uses placement correction value A when placing a component P. Alternatively, the placement position may be corrected using tilt correction value B, taking into account the tilt of the pickup member 33. Here, the control device 25 can correctly correct the Z-axis tilt if the mounting imaging unit 24 is not tilted ( FIG. 8A ). However, if the mounting imaging unit 24 is tilted ( FIG. 8B ), the control device 25 erroneously recognizes that the Z-axis of the pickup member 33 is tilted ( FIG. 8C ), resulting in a deviation in the pickup position or placement position of the component P ( FIG. 8E ). Regarding the misalignment of the placement position of the component P, position correction using placement correction value A allows the component P to be placed in a more appropriate position. However, with regard to component P pick-up position deviation, for example, position correction using the holding correction value C results in a pick-up position deviation due to misrecognition caused by tilt correction. Furthermore, in the mounting device 13, when performing auto-pickup offset processing that corrects the pick-up position using a pick-up correction value D that reflects the pick-up state of the component P, it is possible to correct misrecognition that may occur due to the tilt of the mounting image capture unit 24 after placing the component P several times, but pick-up position deviation occurs until then. Furthermore, in a function that recognizes the position of the top surface of the component P using the object image capture unit 34 and performs mounting processing using that as the placement reference, pick-up position deviation occurs due to misrecognition that may occur due to the tilt of the mounting image capture unit 24, which then directly results in placement position deviation. In this mounting device 13, the control unit 26 uses the placement correction value A to cause the mounting unit 30 to pick the component P, thereby suppressing misrecognition caused by the tilt correction value B, which may occur when the mounting image capture unit 24 is placed at an angle. Here, an example has been described in which the mounting imaging unit 24 is arranged at an angle, but this is not limited to this, and if the placement correction value A is taken into account in the collection process of the component P, the component P can be placed in a more accurate placement position.

[0024] Here, the correspondence between the components of this embodiment and the components of the present disclosure will be clarified. The component supply unit 22 of this embodiment is an example of a component supply unit of the present disclosure, the mounting unit 30 is an example of a mounting unit, the collection member 33 is an example of a collection member, the mounting image capture unit 24 is an example of a mounting image capture unit, the object image capture unit 34 is an example of an object image capture unit, the lifting unit 35 is an example of a lifting unit, the simulation unit 40 is an example of a simulation unit, the simulated object 41 is an example of a simulated object, the simulated components 45 and 46 are examples of simulated components, and the control unit 26 is an example of a control unit. Also, the component P is an example of a component, the board S is an example of an object, the placement correction value A is an example of a placement correction value, the tilt correction value B is an example of a tilt correction value, the retention correction value C is an example of a retention correction value, and the collection correction value D is an example of a collection correction value. Note that this embodiment also clarifies an example of a mounting method of the present disclosure by explaining the operation of the mounting device 13.

[0025] The mounting apparatus 13 of the present embodiment described above includes a component supply unit 22 that supplies components P, a mounting unit 30 that uses a pickup member 33 to pick up components P from the component supply unit 22 and place them on a substrate S serving as a target, an object imaging unit 34 that images the substrate S, and a control unit 26 that places simulated components 45 and 46 on the simulated target 41, corrects the picking position at which the mounting unit 30 picks up the components P using a placement correction value A that corrects the placement position of the mounting unit 30 obtained from the image captured by the object imaging unit 34, and causes the mounting unit 30 to pick up the components P from the component supply unit 22. In this mounting apparatus 13, the correction is made to the picking position of the components P using the placement correction value A obtained by performing a mounting operation using the simulated components 45 and 46 and the simulated target 41, so that position correction can be performed when the components P are picked up, thereby further improving mounting accuracy.

[0026] The mounting device 13 also includes a mounting imaging unit 24 that captures an image of the mounting unit 30. The mounting unit 30 includes an elevation unit 35 that raises and lowers the pickup member 33. The control unit 26 executes the mounting process using a tilt correction value B, determined from the image captured by the mounting imaging unit 24, to correct for positional deviations during elevation of the pickup member 33. The mounting device 13 enhances mounting accuracy by correcting the tilt of the pickup member 33, and further improves mounting accuracy by applying corrections to the mounting operation using the simulated components 45 and 46 and the simulated target 41 when picking the component P. Furthermore, the control unit 26 controls the mounting unit 30 to pick the component P using the placement correction value A, thereby suppressing erroneous recognition due to the tilt correction value B that occurs when the mounting imaging unit 24 is tilted. This mounting device can appropriately perform position correction when the mounting imaging unit is tilted. Furthermore, the control unit 26 may also control the mounting unit to place the component on the target using the placement correction value. In this mounting apparatus, the mounting accuracy can be further improved by applying correction of the mounting operation using the simulated component and simulated object when placing the component.

[0027] The mounting device 13 also includes a mounting imaging unit 24 that captures an image of the mounting unit 30, and the control unit 26 corrects the pickup position at which the mounting unit 30 picks up the component P using a pickup correction value D obtained from the image captured by the mounting imaging unit 24, which corrects for misalignment of the component P when the mounting unit 30 picks up the component P, and causes the mounting unit 30 to pick up the component P from the component supply unit 22. The mounting device 13 improves mounting accuracy by correcting for misalignment of the component P when it is picked up, and can further improve mounting accuracy by applying a placement correction value A obtained during the mounting operation using the simulated components 45, 46 and the simulated object 41 during pickup. Furthermore, the control unit 26 corrects the pickup position at which the mounting unit 30 picks up the component P using a holding correction value C obtained from the image captured by the object imaging unit 34, which corrects the holding position of the component P in the component supply unit 22, and causes the mounting unit 30 to pick up the component P from the component supply unit 22. In this mounting device 13, mounting accuracy is improved by grasping the component positions of the component supply unit 22 and performing position correction, and by applying the placement correction value A obtained during the mounting operation using the simulated components 45, 46 and the simulated object 41 at the time of collection. Furthermore, the mounting device 13 includes a simulation unit 40 having the simulated components 45, 46 and the simulated object 41, and the control unit 26 determines the placement correction value A for correcting the placement position of the mounting unit 30 using the simulated components 45, 46 and the simulated object 41 of the simulation unit 40. In this mounting device 13, determining the placement correction value A using the simulated components 45, 46 and the simulated object 41 further improves mounting accuracy.

[0028] It goes without saying that the mounting apparatus and mounting method disclosed in this specification are in no way limited to the above-described embodiments, and can be implemented in various forms as long as they fall within the technical scope of the present invention.

[0029] For example, in the above-described embodiment, the control unit 26 performs collection position correction and placement correction using the placement correction value A, the tilt correction value B, the holding correction value C, and the collection correction value D. However, as long as the placement correction value A is used for collection position correction, this is not particularly limited, and one or more of the tilt correction value B, the holding correction value C, and the collection correction value D may be omitted, or other correction values ​​may be used instead of or in addition to these. Even if the use of correction values ​​other than the placement correction value A is omitted, the placement correction value A can be used to perform position correction when collecting the component P, thereby further improving mounting accuracy.

[0030] In the above-described embodiment, the mounting device 13 is equipped with the simulation unit 40 and automatically acquires and uses the placement correction value A, but this is not particularly limited, and the mounting device 13 may be configured such that an operator feeds the simulated object 41 containing the simulated component to the board processing unit 21 and manually acquires and uses the placement correction value A. This mounting device 13 can also use the placement correction value A to perform position correction when picking up the component, thereby further improving mounting accuracy.

[0031] In the above-described embodiment, the simulation unit 40 includes two types of simulated components, the simulated component 45 and the simulated component 46. However, this is not limited thereto and the simulation unit 40 may include one type of simulated component or three or more types of simulated components. Furthermore, the simulation unit 40 includes one type of simulated object 41, but may include two or more types of simulated objects 41. Furthermore, the simulated object 41 includes the accommodation portions 43 and 44 for accommodating the simulated components 45 and 46. However, this is not limited thereto and the simulation unit 40 may include accommodation portions corresponding to the simulated components, or the accommodation portions may be provided in separate components, and the accommodation portion for the simulated object 41 may be omitted. This mounting device 13 can also use the placement correction value A to perform position correction when picking components, thereby further improving mounting accuracy.

[0032] In the above-described embodiment, the control unit 26 has been described as acquiring each correction value in an implementation processing routine, but this is not limited to this, and the correction values ​​may be executed separately in a separate routine, such as a calibration process.

[0033] In the above-described embodiment, the present disclosure has been described as a mounting system 10 and a mounting device 13, but is not limited to this and may also be a control method or mounting method for the mounting device 13, or a program that realizes these methods.

[0034] Here, the information processing method of the present disclosure may be configured as follows: For example, the mounting method of the present disclosure is a mounting method executed by a computer of a mounting device including a component supply unit that supplies components, a mounting unit that picks up components from the component supply unit using a picking member and places the components on an object, and an object imaging unit that images the object, the method including the steps of: placing simulated components on the simulated object; correcting a picking position for the mounting unit to pick up the components using a placement correction value that corrects the placement position of the mounting unit obtained from an image captured by the object imaging unit; and having the mounting unit pick up the components from the component supply unit.

[0035] In this mounting method, similar to the above-described mounting device, the correction performed by performing the mounting operation using the simulated component and simulated object is applied to the correction of the component picking position, so that the position correction can be performed when picking the component, thereby further improving the mounting accuracy. Note that this mounting method may employ various aspects of any of the above-described mounting devices, or may include steps that realize the functions of the above-described mounting device.

[0036] This specification also discloses the technical idea of ​​changing "the mounting device according to claim 1 or 2" to "the mounting device according to any one of claims 1 to 3" in claim 4 as originally filed, the technical idea of ​​changing "the mounting device according to claim 1 or 2" to "the mounting device according to any one of claims 1 to 4" in claim 5 as originally filed, the technical idea of ​​changing "the mounting device according to claim 1 or 2" to "the mounting device according to any one of claims 1 to 5" in claim 6 as originally filed, and the technical idea of ​​changing "the mounting device according to claim 1 or 2" to "the mounting device according to any one of claims 1 to 6" in claim 7 as originally filed.

[0037] The present disclosure is applicable to the technical field of devices that perform processes such as picking and placing parts.

[0038] 10 Mounting system, 11 Printing device, 12 Printing inspection device, 13 Mounting device, 14 Mounting inspection device, 18 Management device, 21 Board processing unit, 22 Component supply unit, 23 Feeder, 24 Mounting imaging unit, 25 Control device, 26 Control unit, 27 Memory unit, 28 Mounting condition information, 29 Correction information, 30 Mounting unit, 31 Head moving unit, 32 Mounting head, 33 Collection member, 34 Object imaging unit, 35 Lifting unit, 40 Simulation unit, 41 Simulated object, 42 Placement area, 43, 44 Storage unit, 45, 46 Simulated component, 51 Holding member, 52 Holding unit, 53 Feed hole, A Placement correction value, B Tilt correction value, C Holding correction value, D Collection correction value, F Supply direction, P Component, S Board.

Claims

a parts supply unit that supplies parts; a mounting unit that uses a pickup member to pick up components from the component supply unit and place them on an object; an object imaging unit that images the object side; a control unit that arranges simulated components on a simulated object, corrects a pickup position at which the mounting unit picks up the components using a placement correction value that corrects the placement position of the mounting unit obtained from the image captured by the object imaging unit, and causes the mounting unit to pick up the components from the component supply unit; and A mounting device comprising: 　 The mounting device according to claim 1, a mounting imaging unit that images the mounting unit side, The mounting unit includes a lifting unit that lifts and lowers the collection member, The control unit executes the mounting process using an inclination correction value that corrects positional deviation of the collection member when it is raised and lowered, the inclination correction value being determined from the image captured by the mounting imaging unit. 　 The mounting device according to claim 2 , wherein the control unit causes the mounting unit to pick the components using the placement correction value, thereby suppressing erroneous recognition caused by the tilt correction value that occurs when the mounting imaging unit is disposed at an angle. 　 The mounting apparatus according to claim 1 , wherein the control unit causes the mounting unit to place the component on the target object using the placement correction value. 　 The mounting device according to claim 1 or 2, a mounting imaging unit that images the mounting unit side, The control unit corrects the picking position at which the mounting unit picks the component using a picking correction value obtained from the image captured by the mounting imaging unit to correct the positional deviation of the component when it is picked up, and causes the mounting unit to pick up the component from the component supply unit.

3. The mounting device according to claim 1, wherein the control unit corrects the picking position at which the mounting unit picks the component using a holding correction value that corrects the holding position of the component in the component supply unit obtained from an image captured by the object imaging unit of the component supply unit, and causes the mounting unit to pick the component from the component supply unit. 　 The mounting device according to claim 1 or 2, a simulation unit having the simulated part and the simulated object, The control unit determines the placement correction value for correcting the placement position of the mounting unit using the simulated component and the simulated object of the simulation unit. 　 A mounting method executed by a computer of a mounting device including a component supply unit that supplies components, a mounting unit that picks up components from the component supply unit using a picking member and places the components on an object, and an object imaging unit that takes an image of the object, a step of placing a simulated component on a simulated object, correcting a picking position for picking the component by the mounting unit using a placement correction value for correcting the placement position of the mounting unit obtained from the image captured by the object imaging unit, and causing the mounting unit to pick the component from the component supply unit; Implementation methods including:

Images