Method for acquiring correction value, method for controlling temperature, method for producing semiconductor device, substrate processing device, and program

Abstract

The present invention provides technology that makes it possible to precisely control the temperature inside a processing space.　The present invention comprises: a step for detecting, with first temperature sensors that are attached to a holder which holds a substrate, the temperature of a processing space for processing the substrate; a step for detecting, with a second temperature sensor disposed between the first temperature sensors, the temperature of the processing space; a step for causing the temperature of the processing space detected by the first temperature sensors to either match a target temperature, which is obtained by adding a correction value to a set temperature, or to converge to within a first set range; and a step for determining the correction value to be a correction temperature on the basis of the temperature detected by the second temperature sensor when the temperature of the processing space detected by the first temperature sensors matches the target temperature or has converged to within the first set range.

Description

Correction value acquisition method, temperature control method, semiconductor device manufacturing method, substrate processing apparatus, and program

[0001] The present disclosure relates to a correction value acquisition method, a temperature control method, a semiconductor device manufacturing method, a substrate processing apparatus, and a program.

[0002] There is a technology (see, for example, Patent Document 1) for acquiring a correction value used to control a predetermined process performed on a wafer (hereinafter also referred to as a substrate). In this technology, the thermocouple used to acquire the correction value is attached to the substrate, and is therefore removed when processing an actual product. The acquired correction value is then used to control the temperature of the processing space, but there are cases where the temperature of the entire processing space cannot be controlled accurately.

[0003] Japanese Patent Application Laid-Open No. 2002-175123

[0004] The present disclosure provides a technique that can accurately control the temperature in a processing space.

[0005] According to one aspect of the present disclosure, there is provided a technology comprising the steps of: detecting the temperature of a processing space in which a substrate is processed using a first temperature sensor attached to a holder that holds the substrate; detecting the temperature of the processing space using a second temperature sensor disposed between the first temperature sensors; causing the temperature of the processing space detected by the first temperature sensor to match a target temperature obtained by adding a correction value to a set temperature or to converge within a first set range; and determining the correction value as a correction temperature based on the temperature detected by the second temperature sensor when the temperature of the processing space detected by the first temperature sensor matches the target temperature or converges within the first set range.

[0006] According to the present disclosure, the temperature in the processing space can be controlled with high precision.

[0007] FIG. 3A is a front cross-sectional view of a substrate processing apparatus according to an embodiment of the present disclosure. FIG. 3B is a side view of the substrate processing apparatus according to an embodiment of the present disclosure. FIG. 3A is a top view showing a state in which a substrate is stored in the substrate processing apparatus according to an embodiment of the present disclosure. FIG. 3B is a side view showing a state in which a substrate is stored in the substrate processing apparatus according to an embodiment of the present disclosure. FIG. 3B is a diagram showing a hardware configuration of a controller in the substrate processing apparatus according to an embodiment of the present disclosure and a functional block diagram of a temperature control unit. FIG. 3C is a diagram for explaining temperature control performed in the substrate processing apparatus according to an embodiment of the present disclosure. FIG. 3D is a diagram for explaining a substrate processing sequence performed in the substrate processing apparatus according to an embodiment of the present disclosure. FIG. 3D is a diagram for explaining a substrate processing sequence performed in the substrate processing apparatus according to an embodiment of the present disclosure, and is a graph showing temperatures at each step of the processing sequence. FIG. 3E is a diagram for explaining a substrate processing sequence performed in the substrate processing apparatus according to an embodiment of the present disclosure. FIG. 3F is a diagram for explaining a substrate processing sequence performed in the substrate processing apparatus according to an embodiment of the present disclosure. FIG. 3G is a diagram for explaining a substrate processing sequence performed in the substrate processing apparatus according to an embodiment of the present disclosure, and is a graph showing temperatures at each step of the processing sequence. FIG. 3G is a diagram for explaining a substrate processing sequence performed in the substrate processing apparatus according to an embodiment of the present disclosure ... 10A to 10C are diagrams illustrating a correction value acquisition method performed in a substrate processing apparatus according to an embodiment of the present disclosure, and are diagrams illustrating temperature fluctuations between substrates when a plurality of auxiliary thermocouples are arranged in the substrate processing apparatus according to an embodiment of the present disclosure.

[0008] An embodiment of the present disclosure will be described below with reference to the drawings. Note that all drawings used in the following description are schematic, and the dimensional relationships, ratios, etc. of elements shown in the drawings do not necessarily correspond to the actual ones. Furthermore, the dimensional relationships, ratios, etc. of elements between multiple drawings do not necessarily correspond to the actual ones. Furthermore, substantially identical elements between multiple drawings are denoted by the same reference numerals, and each element is described in the drawing in which it first appears, and its description is omitted in subsequent drawings unless particularly necessary.

[0009] As shown in Fig. 1, the substrate processing apparatus 10 includes a process tube 11 as a supported vertical reaction tube, which is composed of an outer tube 12 as an outer tube and an inner tube 13 as an inner tube, which are concentrically arranged. The outer tube 12 is made of quartz (SiO ２ ) is used and is integrally molded into a cylindrical shape with a closed upper end and an open lower end. The inner pipe 13 is formed into a cylindrical shape with both upper and lower ends open. The cylindrical hollow portion of the inner pipe 13 forms a processing chamber 14 into which a boat 31 serving as a holder is carried, and the lower end side (opening space) of the inner pipe 13 forms a furnace throat portion (furnace throat space) 15 for loading and unloading the boat 31. As will be described later, the boat 31 is configured to hold a plurality of substrates (hereinafter also referred to as wafers) 1 in a long, aligned state. Therefore, the inner diameter of the inner pipe 13 is set to be larger than the maximum outer diameter of the substrates 1 to be handled.

[0010] The lower end between the outer tube 12 and the inner tube 13 is hermetically sealed by a manifold 16 constructed in a substantially cylindrical shape as a furnace throat flange. The manifold 16 is detachably attached to the outer tube 12 and the inner tube 13, respectively, for the purpose of replacing the outer tube 12 and the inner tube 13, etc. The manifold 16 is supported by the housing 2 of the substrate processing apparatus 10, so that the process tube 11 is installed vertically. Hereinafter, in the drawings, the inner tube 13 may be omitted from the description of the process tube 11.

[0011] The gap between the outer pipe 12 and the inner pipe 13 forms an exhaust path 17 having a circular ring-like cross section with a constant width. As shown in Fig. 1, one end of an exhaust pipe 18 is connected to the upper part of the side wall of the manifold 16, and the exhaust pipe 18 is connected to the lowermost end of the exhaust path 17. The other end of the exhaust pipe 18 is connected to an exhaust device 19 controlled by a pressure controller 21, and a pressure sensor 20 is connected midway along the exhaust pipe 18. The pressure controller 21 is configured to perform feedback control of the exhaust device 19 based on the measurement results from the pressure sensor 20.

[0012] A lid (hereinafter also referred to as a seal cap) 25 that closes the lower end opening contacts the manifold 16 from below in the vertical direction. The lid 25 is constructed in a disk shape with approximately the same outer diameter as the manifold 16 and is configured to be raised and lowered vertically by a boat elevator 26 protected by a boat cover 37 installed in the transfer chamber 3 of the housing 2. The boat elevator 26 is configured to include a motor-driven feed screw shaft device and bellows, and the motor 27 of the boat elevator 26 is configured to be controlled by a drive controller 28. A rotating shaft 30 is disposed on the centerline of the lid 25 and rotatably supported, and is configured to be rotationally driven by a motor 29 controlled by the drive controller 28. A boat 31 is supported vertically at the upper end of the rotating shaft 30. In this embodiment, the rotating shaft 30 and the motor 29 constitute a rotation mechanism.

[0013] A gas inlet pipe 22 is disposed below the manifold 16 (in the present embodiment, the lid 25) so as to communicate with the furnace opening 15 of the inner pipe 13, and a source gas supply device, a reactive gas supply device, and an inert gas supply device (hereinafter referred to as a gas supply device) 23 are connected to the gas inlet pipe 22. The gas supply device 23 is configured to be controlled by a gas flow controller 24. The gas introduced from the gas inlet pipe 22 to the furnace opening 15 flows through the processing chamber 14 of the inner pipe 13, passes through the exhaust path 17, and is exhausted by the exhaust pipe 18.

[0014] The boat 31 includes a pair of upper and lower end plates 32, 33 and three support columns 34 (pillars) serving as holding members, which are vertically disposed between the end plates. Numerous holding grooves 35 are cut into the three support columns 34 at equal intervals along the longitudinal direction. The holding grooves 35 cut into the same row of the three support columns 34 face each other. The boat 31 is configured to hold multiple substrates 1 aligned horizontally and with their centers aligned by inserting substrates 1 between the holding grooves 35 of the same row of the three support columns 34. Furthermore, the boat 31 is configured to hold multiple insulating plates 120 aligned horizontally and with their centers aligned by inserting insulating plates 120 between the holding grooves 39 of the same row of the three support columns 34.

[0015] That is, the boat 31 is configured to distinguish between a substrate processing region between the end plates 32 and 38, where a plurality of substrates 1 are held, and an insulating plate region between the end plates 38 and 33, where a plurality of insulating plates 120 are held, and is configured so that the insulating plate region is located below the substrate processing region. The insulating plates 120 held between the end plates 38 and 33 form the insulating section 36.

[0016] The rotating shaft 30 is configured to support the boat 31 in a state in which it is lifted from the upper surface of the lid body 25. The heat insulating section 36 is provided in the furnace throat section 15 and is configured to insulate the furnace throat section 15. In addition, a motor 29 that rotates the boat 31 is located below the lid body 25. The motor 29 has a hollow motor structure, and the rotating shaft 30 passes through the motor 29.

[0017] A heating unit (hereinafter also referred to as a heater unit) 40 is concentrically arranged outside the process tube 11 and is supported by the housing 2. A heater thermocouple 65 serving as a third temperature sensor is provided near the heating unit 40, and a temperature control unit (hereinafter also referred to as a temperature controller) 64 is configured to feedback control the heating unit 40 based on the measurement results from the heater thermocouple 65. This allows the heating unit 40 to heat the substrates 1 held in the substrate processing region in the boat 31. The heating unit 40 also includes a case 41. The case 41 is made of stainless steel (SUS) and is formed in a tubular shape, preferably a cylindrical shape, with a closed top and an open bottom. The inner diameter and overall length of the case 41 are set larger than the outer diameter and overall length of the outer tube 12.

[0018] A heat insulating structure 42 is installed inside the case 41. The heat insulating structure 42 includes an outer sidewall layer disposed on the outside and an inner sidewall layer disposed on the inside, and is formed in a tubular, preferably cylindrical, shape, with a sidewall portion 43 of the cylinder formed in a multi-layer structure. Cooling air 90 flows through a gas supply passage (not shown) provided in the inner layer and is supplied to the space 75 via a supply path including the gas supply passage.

[0019] 1 , a ceiling wall 80 serving as a ceiling portion is placed over the upper end of the side wall 43 of the thermal insulation structure 42 so as to close the space 75. An exhaust hole 81 is formed in the ceiling wall 80 in a ring shape as part of an exhaust path for exhausting the atmosphere in the space 75, and the lower end, which is the upstream end of the exhaust hole 81, communicates with the inner space 75. The downstream end of the exhaust hole 81 is connected to an exhaust duct 82. The cooling air 90 blown into the space 75 is configured to be exhausted through the exhaust hole 81 and the exhaust duct 82.

[0020] As shown in Fig. 2 (in Fig. 2, the substrate to be processed is designated "1" and is not shown), the heating unit 40 is configured so that it can be divided into multiple zones (multiple regions) in the vertical direction (also called the vertical direction) for control (divided into five zones in Fig. 2), with a heater provided for each zone, and multiple heaters are stacked on top of each other. A heater thermocouple 65 is provided for each zone to measure the heater temperature.

[0021] Substrate thermocouple 211, which serves as a first temperature sensor for measuring the temperature of substrate 1, is configured to rotate together with substrate 1 when boat 31 rotates and substrate 1 rotates. Substrate thermocouple 211 includes temperature measuring part 211b, which serves as a first temperature measuring part for measuring (also referred to as detecting) the substrate temperature, and cable 211c including wires that make up temperature measuring part 211b. Here, the substrate temperature in this specification refers to the temperature of the processing space in which temperature measuring part 211b of substrate thermocouple 211 and the like are placed.

[0022] The substrate thermocouple 211 is an example of a "temperature sensor rotatably provided together with the holder" in the technology of the present disclosure. Note that the temperature sensor is not limited to a thermocouple and may be any other sensor such as a resistance thermometer as long as it can measure temperature as an electrical signal.

[0023] As shown in FIGS. 3A and 3B, the temperature measuring portion 211b of the substrate thermocouple 211 is disposed on the periphery of the substrate 1 (inside the periphery). Specifically, it is disposed so as to be sandwiched between the substrates 1 in the vertical direction. Also, in FIG. 3A, the temperature measuring portion 211b of the substrate thermocouple 211 may be disposed near the support 34. Here, "near the support 34" means that, when the substrate 1 is held by the support 34, it is disposed at a position closer to the support 34 than the midpoint between the support 34 and the center of the substrate 1. As shown in FIGS. 3A and 3B, the substrate thermocouple 211 (temperature measuring portion 211b) is disposed in the space where the substrate 1 is processed. This allows it to measure the temperature of a space closer to the substrate 1 than the heater thermocouple 65, thereby enabling more accurate measurement of the temperature of the substrate 1. Although not shown here to clarify the location of the temperature measuring unit 211b, a protective tube 211d is provided to isolate the temperature measuring unit 211b from the processing space. The protective tube 211d is made of, for example, quartz. The location of the temperature measuring unit 211b will be described later.

[0024] 2, the rotating shaft 30 has a hole through which the cable 211c passes, and is configured so that the cable 211c can be drawn out to the transmitter 221 outside the processing chamber 14 (for example, below the rotating shaft 30) while being vacuum-sealed using a hermetic seal or the like. The cable 211c is connected to the transmitter 221 below the lid 25.

[0025] The transmitter 221 is fixed to the rotating shaft 30 and configured to move together with the rotating shaft 30. The transmitter 221 converts the electrical signal (voltage) input from the substrate thermocouple 211 via the cable 211c into a digital signal, and transmits it wirelessly via radio waves.

[0026] 2, the temperature control unit 64 and the receiver 222 are connected as an integral structure. However, this configuration is not limiting, and the receiver 222 may be located anywhere as long as it is possible to send and receive data to and from the temperature control unit 64. The receiver 222 receives a signal emitted by the transmitter 221, converts the received digital signal into an analog signal, and outputs it. For example, the receiver 222 is connected to the temperature control unit 64 by a cable, and inputs temperature data to the temperature control unit 64.

[0027] 4, a controller 200, which is a control computer serving as a control unit, has a computer main body 203 including a CPU (Central Processing Unit) 201 and a memory 202, a communication IF (Interface) 204 serving as a communication unit, a storage device 205 serving as a storage unit, and a display / input device 206 serving as an operation unit. In other words, the controller 200 includes components of a general computer.

[0028] The CPU 201 constitutes the core of the operation unit, executes a control program stored in the storage device 205, and executes a recipe (e.g., a process recipe) recorded in the storage device 205 in accordance with instructions from the display / input device 206. The memory 202, which serves as a temporary storage unit, also functions as a work area for the CPU 201.

[0029] The communication IF 204 is electrically connected to the pressure controller 21, the gas flow controller 24, the drive controller 28, and the temperature control unit 64 (these may be collectively referred to as the sub-controller). The controller 200 can exchange data related to the operation of each component with the sub-controller via the communication IF 204.

[0030] The storage device 205 is composed of, for example, a flash memory, a hard disk drive (HDD), a solid state drive (SSD), etc. A control program for controlling the operation of the substrate processing apparatus 10, a process recipe describing the procedures and conditions of the processes described below, etc., are readably recorded and stored in the storage device 205. The process recipe is a combination of procedures that causes the controller 200 to execute the procedures of the processes described below and that can obtain a predetermined result, and functions as a program (or program product). Hereinafter, the process recipe and the control program, etc., are collectively referred to simply as a program (or program product). The process recipe is also simply referred to as a recipe. In this specification, the term "program" may include only a recipe, only a control program, or both.

[0031] The controller 200 can be configured by installing the above-mentioned program recorded and stored in an external storage device (for example, a magnetic disk such as a hard disk, an optical disk such as a CD (Compact Disk), or a semiconductor memory such as a USB (Universal Serial Bus) memory) into a computer. The storage device 205 and the external storage device are configured as computer-readable recording media. Hereinafter, these will be collectively referred to as recording media. When the term recording media is used in this specification, it may include only the storage device 205 alone, only the external storage device alone, or both. Note that the program may be provided to the computer using a communication means such as the Internet or a dedicated line, without using an external storage device.

[0032] As shown in FIG. 4, the temperature control unit 64 includes a processing unit 64a, a communication interface (IF) 64b, a thermocouple input unit 64c, and a control output unit 64d.

[0033] The processing unit 64a has a hardware configuration as a general computer including a CPU, memory, etc., and by executing a control program, performs control calculations in accordance with a temperature control algorithm described below using information acquired by the communication IF 64b and the thermocouple input unit 64c, and outputs the calculation results to the control output unit 64d.

[0034] The communication IF 64 b has a wired IF for connecting to the controller 200 or the like, which is a higher-level controller, and a receiver 222 which is a wireless IF for connecting to a transmitter 221 fixed to the boat 31 .

[0035] The communication IF 64b receives information such as a set temperature and control parameters (to be described later) from the controller 200, and transmits control calculation results and temperature information. The communication IF 64b also receives boat position information from the drive controller 28 of the boat elevator 26. The communication IF 64b also receives the temperature of the substrate thermocouple 211 via the transmitter 221 and the receiver 222.

[0036] The thermocouple input unit 64c receives an electric signal corresponding to the temperature from the heater thermocouple 65, converts it into a digital signal, and outputs it to the processing unit 64a.

[0037] The control output unit 64d outputs a heater control signal for controlling the temperature of the heating unit 40 based on the calculation result received from the processing unit 64a.

[0038] In the following description, the heater thermocouple 65 may be referred to as a heater TC, and the substrate thermocouple 211 may be referred to as a boat TC.

[0039] Next, an example of a control block diagram of the temperature control unit 64 in this embodiment will be described with reference to Fig. 5. Note that the control block diagram shown in Fig. 5 is configured for each zone, and temperature control is performed individually in each zone.

[0040] 5, "target temperature" indicates the target temperature obtained from the controller 200 via the communication IF 64b included in the temperature control unit 64, which corresponds to the zone to be controlled among the multiple zones into which the heating unit 40 is divided. The "target temperature" is input to the positive input terminal of the first subtractor. The target temperature will be described in more detail below.

[0041] The "boat TC detection temperature" indicates the temperature (temperature near the substrate) measured by the substrate thermocouple 211 corresponding to the zone to be controlled. The "boat TC detection temperature" will hereinafter be referred to as the substrate temperature. The substrate temperature is input to the negative input terminal of the first subtractor. This allows the substrate temperature measured by the substrate thermocouple 211 to be controlled so as to approach the corresponding target temperature.

[0042] The first subtractor calculates the deviation from the output of the target temperature and outputs it to the PID calculation unit 1 .

[0043] The deviation from the first subtractor is input to the PID calculation unit 1, which performs a known PID calculation. The result of the PID calculation is input to the positive input terminal of the second subtractor.

[0044] "Heater TC detected temperature" indicates the heater temperature measured by the heater thermocouple 65 corresponding to the zone to be controlled. The heater temperature is input to the negative input terminal of the second subtractor.

[0045] The second subtractor calculates the deviation between the calculation result of the PID calculation unit 1 and the heater temperature, and outputs the deviation to the PID calculation unit 2 .

[0046] The deviation from the second subtractor is input to the PID calculation unit 2, which performs a known PID calculation. The PID parameters used in the PID calculation unit 2 are different from those used in the PID calculation unit 1. The PID calculation result is output as a "manipulated variable."

[0047] It is desirable that the PID parameters used when performing PID calculations in PID calculation unit 1 and PID calculation unit 2 are adjustable. The PID parameters are an example of "control parameters of the heating unit" in the technology of the present disclosure. PID calculation unit 1 and PID calculation unit 2 are configured to allow the PID parameters to be set arbitrarily. Temperature control unit 64 is configured to be able to obtain information on the PID parameters from controller 200 via the included communication IF 64b.

[0048] The "operation amount" indicates a value output to the control output unit 64d as a control calculation result corresponding to the zone to be controlled. This value is converted into a signal for heating the zone to be controlled by the heating unit 40 via the control output unit 64d and is output.

[0049] As described above, the temperature control unit 64 of this embodiment is configured to execute a control calculation (so-called feedback control) and control the substrate temperature measured by the substrate thermocouple 211 so that it matches (or approaches) the corresponding target temperature, as shown in Fig. 5. Note that in Fig. 5, the feedback control is based on the temperatures detected by both the substrate thermocouple 211 and the heater thermocouple 65, but this is not limitative, and the feedback control may be based on the temperature of at least one of the substrate thermocouple 211 and the heater thermocouple 65.

[0050] Next, an example of a substrate processing sequence performed in the substrate processing apparatus will be described with reference to FIGS.

[0051] Step S101 (standby step) is a process for stabilizing the temperature inside the furnace (processing chamber 14) at a standby temperature T0. In step S101, the substrate 1 has not yet been placed in the furnace.

[0052] Step S102 (boat loading step) is a process of loading the substrate 1 held in the boat 31 into the furnace. Because the temperatures of the boat 31 and the substrate 1 are lower than the furnace temperature at this point, and because the atmosphere outside the furnace (room temperature) is introduced into the furnace as a result of loading the substrate 1 into the furnace, the temperature inside the furnace temporarily drops below the furnace temperature. Thereafter, the temperature inside the furnace stabilizes at the furnace temperature after a short time under control of the temperature control unit 64. Note that after the substrate to be processed is loaded into the furnace, the target temperature in the next step S103 may be equal to the furnace temperature in step S101. Furthermore, the target temperature after loading the substrate to be processed may be lower depending on the requirements of step S103.

[0053] Step S103 (processing step) is configured to be performed after a stable state is achieved, in which the furnace temperature is within a predetermined micro-temperature range and this state continues for a predetermined time or more. Step S103 (processing step) includes a temperature increase step for increasing the furnace temperature from the target temperature, a maintenance step for maintaining and stabilizing the furnace temperature at the target temperature to perform the specified processing on the substrate 1, and a temperature decrease step for decreasing the furnace temperature from the target temperature to the furnace temperature. The maintenance step is configured to be performed after a stable state is achieved, in which the furnace temperature is within a predetermined micro-temperature range from the target temperature and this state continues for a predetermined time or more. Hereinafter, the above-mentioned stable state will also be referred to as converging to the furnace temperature.

[0054] Step S104 (boat unloading step) is a process of unloading the processed substrate 1 together with the boat 31 from the furnace.

[0055] If there are any unprocessed substrates 1 remaining to be processed, the processed substrates 1 are removed from the boat 31 and replaced with unprocessed substrates 1, and the series of steps S101 to S104 are repeated.

[0056] The correction values ​​(hereinafter also referred to as correction temperatures) used in temperature control will be explained using Figures 7(A) and 7(B). The left side of Figures 7(A) and 7(B) shows simplified diagrams of the substrate processing apparatus 10 shown in Figure 2 for the purpose of explanation. The right side of Figures 7(A) and 7(B) shows exaggerated diagrams of the temperature distribution (hereinafter also referred to as temperature fluctuations) within the furnace of the processing chamber 14 of the substrate processing apparatus 10.

[0057] FIG. 7A shows the temperature distribution in the processing chamber 14 due to temperature fluctuations when the set temperature is detected by the substrate thermocouple 211. Here, the substrate thermocouple 211 can detect the set temperature with a correction value of zero, as described below. However, slight temperature fluctuations occur between the substrate thermocouples 211 and 211. This means that the substrate thermocouple 211 cannot detect the substrate temperature at a position not in close proximity, which may result in inaccurate control of the substrate temperature throughout the processing space. Thus, if this temperature fluctuation is not taken into account, deviations in the temperature uniformity in the vertical direction (as shown in FIG. 7A, which are deviations in the direction lower than the set temperature) may not be detected. For example, in this case, this temperature deviation may result in variations in the quality of the film formed on the substrate 1.

[0058] 7B, auxiliary thermocouples 212 are provided as second temperature sensors between the substrate thermocouples 211 to measure the temperature distribution in the processing chamber 14. As a result, as also shown in FIG. 7B, the set temperature is measured to be between the temperatures detected by the substrate thermocouples 211 and the auxiliary thermocouples 212, that is, between the maximum and minimum values. At this time, the temperature measured by the substrate thermocouples 211 is the target temperature, which is obtained by adding the set temperature and the correction temperature.

[0059] Therefore, before actually processing the substrate 1 as a product substrate with the substrate thermocouple 211, an auxiliary thermocouple 212 is attached to the processing chamber 14 as shown in Figure 7(B). Then, the temperature distribution in the processing chamber 14 is measured, and a correction temperature is obtained to be used for temperature control when actually processing the substrate 1 as a product substrate with the substrate thermocouple 211. In this way, by detecting minute temperature fluctuations in the processing chamber 14, the temperature of the processing chamber 14 can be controlled with high precision.

[0060] Next, acquisition of the correction temperature as the correction value in the present disclosure will be described with reference to FIGS. 8 to 10. FIG.

[0061] Fig. 8 shows an overview of the substrate processing apparatus 10 when acquiring the correction temperature. Fig. 8 is a diagram showing the substrate processing apparatus shown in Fig. 2 only with an auxiliary thermocouple 212 attached. Therefore, the same configuration as in Fig. 2 will not be described here.

[0062] 8 , the auxiliary thermocouple 212 includes a temperature measuring part 212b as a second temperature measuring part that measures (also referred to as detecting) the substrate temperature, and a cable 212c including wires that constitute the temperature measuring part 212b. The cable 212c of the auxiliary thermocouple 212 is disposed below the manifold 16 (in the present embodiment, the lid 25) so as to lead between the outer tube 12 and the inner tube 13, and the temperature measuring part 212b of the auxiliary thermocouple 212 is disposed between the temperature measuring parts 211b of the substrate thermocouples 211. In practice, the substrate thermocouple 211 and the auxiliary thermocouple 212 are covered by protective tubes 211d and 212d made of, for example, quartz, respectively, but the protective tubes 211d and 212d are omitted here.

[0063] The lid 25 is provided with an attachment portion 213 for attaching an auxiliary thermocouple 212. This attachment portion 213 is provided with a sealant 214 therein, and is configured to maintain the airtightness of the processing chamber 14 by this sealant 214. In other words, the auxiliary thermocouple 212 is attached to the lid 25 and configured to operate together with the boat 31. Note that the auxiliary thermocouple 212 may be an F-type thermocouple as shown in the figure, an existing L-type thermocouple, or a combination of these. Furthermore, a comb-type thermocouple having more temperature measuring portions than the F-type may also be used.

[0064] This auxiliary thermocouple 212 (its temperature measuring part 212b) is arranged in the processing space between the substrate thermocouples 211 (its temperature measuring part 211b) so that it is sandwiched between the substrates 1 in the vertical direction, so that it is possible to detect the temperature near the substrate 1 arranged in the processing space and obtain a correction value.

[0065] 8, the heating unit 40 is divided into multiple regions in the vertical direction and heats the substrates 1, and the substrate thermocouples 211 are provided to correspond to the multiple regions. Furthermore, the boat 31 includes a substrate holding area on which multiple substrates 1 are loaded, and the substrate thermocouples 211 are disposed at least at the upper and lower ends of the substrate holding area. At least one auxiliary thermocouple 212 is disposed between the substrate thermocouples 211 disposed at the upper and lower ends of the substrate holding area. In other words, the temperature measuring units 211b and 212b are disposed at approximately the same position along the vertical direction.

[0066] Specifically, the substrate thermocouples 211 are disposed at least at the upper end or the lower end of the substrate holding area, and the auxiliary thermocouples 212 are disposed between the plurality of substrate thermocouples 211. At least one auxiliary thermocouple 212 is disposed at least either between the substrate thermocouples 211 disposed at the center and upper end of the substrate holding area, or between the substrate thermocouples 211 disposed at the center and lower end of the substrate holding area.

[0067] The auxiliary thermocouples 212 may be configured not to be disposed at least one of between the substrate thermocouples 211 disposed at the center and upper end of the substrate holding area and between the substrate thermocouples 211 disposed at the center and lower end of the substrate holding area. In other words, if the width between the substrate thermocouples 211 is such that the influence of temperature fluctuations is small, for example, if the spacing between the substrate thermocouples 211 is narrow, there is no need to dispose the auxiliary thermocouples 212.

[0068] 9(A) and 9(B) are diagrams showing the relative positions of the temperature measuring unit 211b of the substrate thermocouple 211 and the temperature measuring unit 212b of the auxiliary thermocouple 212 in the present disclosure. Also, FIGS. 9(A) and 9(B) are plan views (viewpoints along the vertical direction), and each of the temperature measuring units 211b, 212b is disposed between the center of the substrate 1 and the peripheral edge of the substrate 1. For the sake of explanation, other components are omitted. Also, in the present disclosure, FIGS. 9(A) and 9(B) show only one of the temperature measuring units 211b, 212b to indicate that they are disposed at approximately the same position along the vertical direction.

[0069] In addition, Figure 9 (A) shows that the temperature measuring units 211b and 212b surrounded by the protective tubes 211d and 212d are arranged on the periphery of the substrate 1, and Figure 9 (B) shows that the temperature measuring units 211b and 212b surrounded by the protective tubes 211d and 212d are arranged in the center of the substrate 1.

[0070] As shown in Figures 9(A) and 9(B), the temperature measuring units 211b and 212b face the surface of the substrate 1 via the protective tubes 211d and 212d, respectively. Therefore, compared to the conventional method, during substrate processing as well as during temperature control, temperature control is performed based on the temperature measured by the substrate thermocouple 211 that faces directly to the substrate 1. This makes it possible to improve the reliability of the correction value (correction temperature) and to improve the accuracy of temperature control of the processing space in which the substrate 1 is placed.

[0071] Comparing FIGS. 9A and 9B, it is clear that the substrate thermocouple 211 and auxiliary thermocouple 212 in FIG. 9B extend far into the processing space. Therefore, there is concern about the influence on temperature control by the protective tubes 211d and 212d of the substrate thermocouple 211 and auxiliary thermocouple 212. On the other hand, in FIG. 9A, the substrate thermocouple 211 and auxiliary thermocouple 212 do not extend far into the processing space, thereby minimizing the influence on temperature control by the protective tubes 211d and 212d. Furthermore, in FIG. 9A, the temperature measuring units 211b and 212b are preferably positioned within 10 mm or less from the peripheral edge of the substrate 1. Positioning the temperature measuring units 211b and 212b around the substrate periphery (e.g., within 10 mm or less from the peripheral edge of the substrate 1) in this way reduces the length (or area) of the units protruding into the processing space opposite the substrate 1, thereby minimizing the influence on substrate processing. Furthermore, since it is positioned almost at the boundary between areas where fine patterns are created (formed) on the surface of substrate 1 and areas where they are not created (formed), it is thought that the impact on substrate transportation and substrate processing can be suppressed.

[0072] In this way, the configuration includes a temperature measuring unit 211b that is arranged so as to be sandwiched between the substrates 1 in the vertical direction and detects the temperature of the processing space in which the substrates 1 are processed, and a temperature measuring unit 212b that is similarly arranged so as to be sandwiched between the substrates 1 in the vertical direction and detects the temperature of the processing space in which the substrates 1 are processed.Since the temperature measuring units 211b and 212b are each arranged at approximately the same position along the vertical direction, a correction value that takes into account temperature fluctuations in the processing space near the substrates 1 can be obtained.

[0073] 8, one auxiliary thermocouple 212 is disposed in the processing space between the substrate thermocouples 211 in the vertical direction, but this is not limitative and multiple auxiliary thermocouples 212 may be disposed. On the other hand, as shown in FIG. 8, if the spacing between the substrate thermocouples 211 is narrow, the auxiliary thermocouple 212 is not necessary.

[0074] Needless to say, the substrate thermocouple 211 and the auxiliary thermocouple 212 are attached so that a transport device (not shown) does not interfere with part of the boat 31 when transporting the substrate 1 .

[0075] Next, a sequence for obtaining the correction temperature will be described, as shown in Fig. 10. The sequence shown in Fig. 10 basically adds the steps of attaching and detaching the auxiliary thermocouple 212 to the substrate processing sequence shown in Fig. 6 described above, and therefore, explanations of parts that are the same as or overlap with the previously described substrate processing sequence will be omitted, and differences from the previously described substrate processing sequence will be mainly described.

[0076] <Attaching the auxiliary thermocouple> As shown in Fig. 8, the auxiliary thermocouple 212 is attached to the lid 25. At this time, as shown in Fig. 8, the auxiliary thermocouple 212 is arranged between the substrate thermocouples 211 at approximately the same position in the vertical direction. Specifically, the temperature measuring unit 212b is arranged directly below the temperature measuring unit 211b.

[0077] For example, a step of loading (also referred to as transporting) a pseudo substrate (dummy substrate) into the boat 31 as a plate-shaped workpiece may be performed. Either step may be performed first or last. At this time, the temperature is room temperature. However, the temperature may be maintained at the same temperature (standby temperature) as step S101 in the substrate processing sequence before proceeding to the next step. Here, the pseudo substrate (dummy substrate) is a substrate with a clean surface, known as a bare wafer, with no fine pattern formed on its surface. However, it is preferable that the pseudo substrate (dummy substrate) has some kind of fine pattern formed on its surface, similar to the product substrate described below.

[0078] <Boat Loading> This is the same as step S102 in FIG. 6, and so a description thereof will be omitted.

[0079] <Controlling the Furnace to a Predetermined Temperature> This step is the same as the temperature increase step and temperature decrease step in step S103 of FIG. 6. The temperature increase step is carried out using an inert gas (e.g., N ２The temperature control is controlled so that the difference between the temperature detected by the substrate thermocouple 211 and the set temperature converges within a predetermined range. The temperature detected by the auxiliary thermocouple 212 is not used in this temperature control, but is used in the process of determining a correction value after temperature control to the set temperature is completed. At this time, the validity of the feedback control is determined based on the auxiliary thermocouple 212. For example, it is determined whether a statistical value (average value, standard deviation, etc.) calculated by the statistical processing unit 63 based on the temperatures detected by at least one of the substrate thermocouple 211 and the auxiliary thermocouple 212 satisfies a predetermined criterion. Specifically, the average value of the temperatures of the processing space detected by the substrate thermocouple 211 and the auxiliary thermocouple 212 is used as the statistical value, and it is determined whether this average value satisfies a predetermined criterion. Furthermore, the standard deviation of the temperature of the processing space detected by each of the substrate thermocouple 211 and the auxiliary thermocouple 212 is used as a statistical value to determine whether this standard deviation satisfies a predetermined criterion. If the predetermined criterion is satisfied, a correction temperature is determined based on the target temperature used in the temperature control. If the predetermined criterion is not satisfied, the target temperature is changed and temperature control is performed again. Here, the predetermined criterion is whether, when an average value is used as the statistical value, the average value (statistical value) matches the set temperature corresponding to the temperature of the processing space, or whether the difference between the average value and the set temperature corresponding to the temperature of the processing space is within a predetermined range. Furthermore, when a standard deviation is used as the statistical value, the predetermined criterion is whether the standard deviation (statistical value) is zero or within a threshold value. Meanwhile, the process in the temperature-lowering step is similar to the temperature-lowering step in step S103 of FIG. 6 , and therefore a description thereof will be omitted. However, unlike FIG. 6 , the temperature is lowered to room temperature instead of the standby temperature. Since it is sufficient to perform the next step, boat unloading, the temperature may be lowered to the standby temperature as in FIG. 6 . Here, the processing time refers to the time the process continues. The same applies to the following description.

[0080] In this process, the maintenance step of step S103 in FIG. 6 is performed by maintaining a predetermined temperature and a predetermined pressure for a processing time (step time) in accordance with a process recipe used when actually processing a product substrate on which at least a part of the surface is formed with a fine pattern for a semiconductor device. ２ The maintenance step of step S103 in FIG. 6 may be omitted.

[0081] The temperature control in this step will be described in detail later.

[0082] <Boat Unloading> This is the same as step S104 in FIG. 6, and therefore a description thereof will be omitted.

[0083] <Removing the auxiliary thermocouple> After the boat is unloaded and the cooling of the workpieces is completed, the workpieces are recovered and the auxiliary thermocouple 212 is removed from the lid 25. Note that it does not matter which of the workpieces is recovered first and the auxiliary thermocouple 212 is removed from the lid 25 first.

[0084] <Acquisition of Correction Values> Figure 11 illustrates a specific example of the procedure for acquiring correction values, which is performed in the "processing" of step S103 in step S13 "Controlling the Furnace to a Predetermined Temperature" in Figure 10. However, explanations of the configuration of the control block enclosed by the dotted line, which is the same as that of Figure 5, and explanations of the same parts of the control block enclosed by the dotted line that are the same as those for temperature control during substrate processing, will also be omitted. Figure 11 differs from Figure 5 in that it uses the temperature detected by the auxiliary thermocouple 212, and this difference will be mainly described here. Specifically, the determination of the acquisition of correction values ​​using temperature data (boat TC detection temperature, auxiliary TC detection temperature, etc.) output from the data logger 61 serving as a recording unit and the statistical processing unit 63 will be described.

[0085] The data logger 61 collects the temperature (auxiliary TC detected temperature) detected by the auxiliary thermocouple 212 and outputs it to the statistical processing unit 63 and the temperature control unit 64. The statistical processing unit 63 calculates the average value and standard deviation from the temperature (boat TC detected temperature) detected by the substrate thermocouple 211 and the temperature (auxiliary TC detected temperature) acquired from the data logger 61. The temperature control unit 64 sets the target temperature (the sum of the set temperature and the correction temperature). Note that the correction temperature is initially zero.

[0086] In step S13 of FIG. 10 , in which the furnace interior is controlled to a predetermined temperature, the temperature control unit 64 outputs a target temperature and executes temperature control (feedback control) according to the control block enclosed by the dotted line. The time required to reach the target temperature is determined based on the step time of the process recipe used for actual substrate processing. For example, when the temperature detected by the substrate thermocouple (boat TC detection temperature) 211 coincides with the target temperature or converges within a set range (within a predetermined threshold, also referred to as a first set range) during this step time, the feedback control terminates. That is, the correction value is determined by bringing the temperature of the processing space detected by the substrate thermocouple 211 closer to the target temperature obtained by adding a correction value to the set temperature. In other words, when the temperatures detected by the substrate thermocouple 211 and the auxiliary thermocouple 212 converge from the target temperature to below the set temperature (threshold), the correction value added to the target temperature is determined as the correction temperature. That is, when the temperature of the processing space detected by the substrate thermocouple 211 matches the target temperature or converges within the set range, a correction value added to the target temperature is determined as the correction temperature based on the temperature detected by the auxiliary thermocouple 212.

[0087] On the other hand, in the "processing" of step S103 of step S13 in FIG. 10 for controlling the temperature inside the furnace to a predetermined temperature, if even after a preset time (e.g., step time) for reaching the target temperature has elapsed, any one of the temperatures detected by substrate thermocouple 211 does not match the target temperature or is outside the set range (outside the predetermined threshold), the PID parameters of PID calculation unit 1 and PID calculation unit 2 are inappropriate and are appropriately corrected, and the "processing" of step S103 of step S13 in FIG. 10 is performed again.

[0088] Here, the correction temperature may be set so that the average value calculated by the statistical processing unit 63 approaches the set temperature, or may be set so that the standard deviation calculated by the statistical processing unit 63 becomes small (minimum). Note that the correction temperature is preferably set so that the average value calculated by the statistical processing unit 63 becomes the same as the set temperature and so that the standard deviation calculated by the statistical processing unit 63 becomes small. Specifically, the correction temperature is preferably set so that the average value of the temperatures of the processing space detected by the substrate thermocouple 211 and the auxiliary thermocouple 212 matches (becomes) the set temperature and so that the standard deviation becomes small. Note that the standard deviation value is ideally 0 (zero), but is preferably set to, for example, within a small threshold value close to 0 (zero).

[0089] The compensation temperature is set individually for each zone. Specifically, the compensation temperature is set appropriately taking into consideration thermal interference between zones, temperature fluctuations along the vertical direction, etc. Therefore, the compensation temperature may be set by an operator based on their knowledge and experience each time feedback control by the temperature control unit 64 is completed.

[0090] Furthermore, even if the temperature detected by the substrate thermocouple 211 matches the target temperature or converges within a set range (within a predetermined threshold), if the difference between the average value calculated by the statistical processing unit 63 and the set temperature and the standard deviation calculated by the statistical processing unit 63 do not satisfy a predetermined criterion, a new correction temperature may be set, the target temperature may be changed as a result, and feedback control by the temperature control unit 64 may be continued. On the other hand, if at least one of the difference between the average value calculated by the statistical processing unit 63 and the set temperature and the standard deviation calculated by the statistical processing unit 63 satisfies a predetermined criterion, feedback control by the temperature control unit 64 may be terminated. Note that hereinafter, feedback control by the temperature control unit 64 may sometimes be simply referred to as feedback temperature control.

[0091] When the temperature detected by the substrate thermocouple 211 matches the target temperature or converges within the set range, but the temperature detected by the auxiliary thermocouple 212 does not converge within the set range of the set temperature, the correction temperature is changed, a new target temperature is set, and feedback control is repeated, the process corresponding to step S103 in the substrate processing sequence shown in Fig. 6 (the step of controlling the inside of the furnace to a predetermined temperature) among step S13 in Fig. 10 is repeated. The set range at this time is set to an arbitrary value individually for each of the substrate thermocouple 211 and the auxiliary thermocouple 212.

[0092] Furthermore, the temperature detected by substrate thermocouple 211 coincides with the target temperature or converges within a predetermined range, completing temperature control in temperature control unit 64. At this time, the difference between the average value calculated by statistical processing unit 63 and the set temperature is considered to be 0 (zero) or within a predetermined range, and the standard deviation calculated by statistical processing unit 63 is considered to be 0 (zero) or within a threshold value (a set value very close to 0 (zero)). This is because the correction temperature is set appropriately taking into account thermal interference between zones, temperature fluctuations along the vertical direction, and the like.

[0093] In this way, the compensation temperature is set so that the statistical values ​​of the temperatures in the processing space detected by the substrate thermocouple 211 and the auxiliary thermocouple 212 satisfy a predetermined standard. Specifically, the compensation temperature is set individually for each zone so that the difference between the average value of the temperatures detected by the substrate thermocouple 211 and the auxiliary thermocouple 212 and the set temperature, and the standard deviation are minimized (close to zero). According to the embodiment of the present disclosure, the compensation temperature is determined by performing temperature control so that the temperature detected by the substrate thermocouple 211 matches the target temperature or is within a set range (within a predetermined threshold). Therefore, a highly reliable temperature compensation value can be obtained that takes into account thermal interference between zones and temperature fluctuations that exist along the vertical direction.

[0094] According to the embodiment of the present disclosure, the reliability of the correction value (correction temperature) is increased because temperature control is performed using the temperature detected by the substrate thermocouple 211 (temperature measuring unit 211b) that directly faces the substrate 1, both during substrate processing as well as during correction value acquisition, and therefore the accuracy of temperature control of the processing space in which the substrate 1 is placed can be improved.

[0095] According to the embodiment of the present disclosure, the correction temperature is set individually for each zone so that the difference between the average value of the temperatures detected by the substrate thermocouple 211 and the auxiliary thermocouple 212 and the set temperature, and the standard deviation are minimized (close to zero), respectively, and therefore a highly reliable temperature correction value can be obtained.

[0096] Furthermore, according to the embodiment of the present disclosure, the correction value can be obtained when the temperatures detected by the substrate thermocouple 211 and the auxiliary thermocouple 212 are facing the substrate 1 at a location other than the protective tubes 211d and 212d, and during substrate processing, the correction value at this time is used to control the temperature detected by the substrate thermocouple 211, so that the substrate thermocouple 211 used when obtaining the correction value and when processing the substrate can be positioned exactly the same to control the temperature.

[0097] <Modification 1> Fig. 12 shows an example in which a plurality of auxiliary thermocouples 212 are arranged. As shown in Fig. 12, the auxiliary thermocouples 212 are arranged in the processing space between the substrate thermocouples 211 in the vertical direction. This modification also achieves the same effects as the above-described embodiment. Furthermore, this modification can detect minute temperature fluctuations in the vertical direction in detail, thereby improving the reliability of the correction value (correction temperature) that is acquired so that the difference between the average value of these temperature detection values ​​and the set temperature is small and the standard deviation is small.

[0098] <Modification 2> In the embodiment disclosed above, the processing temperature is higher than the standby temperature, but this is not limited to this embodiment. The temperature detection value detected by the substrate thermocouple 211 may be configured to be the same as the processing temperature set in the step of processing the substrate 1. In this case, the temperature detection value detected by the substrate thermocouple 211 may be configured to be the same as or lower than the standby temperature maintained when the substrate 1 is not placed in the process tube 11. This modification also achieves the same effects as the above embodiment. In this modification, high-precision temperature control is also possible even in a process in a low-temperature region that is the same as or even lower than the standby temperature maintained when the substrate 1 is not placed.

[0099] In this specification, the processing temperature refers to the temperature in the process, and means the temperature of the processing chamber 14. Therefore, in this specification, the processing temperature is used in a broad sense to include the temperature of the substrate 1 (substrate temperature).

[0100] <Effects> According to this embodiment, one or more of the following effects can be obtained.

[0101] Using the substrate thermocouple 211 and auxiliary thermocouple 212 that detect the temperature near the substrate 1 placed in the processing space, it is possible to obtain a correction value (correction temperature) that minimizes (i.e., 0 (zero)) the difference and standard deviation between the average value calculated by the statistical processing unit 63 and the set temperature. Therefore, just as when obtaining the correction value, temperature control is performed using the substrate thermocouple 211 that directly faces the substrate 1 during substrate processing, so the correction value (correction temperature) is highly reliable, and the accuracy of temperature control in the processing space in which the substrate 1 is placed can be improved.

[0102] By arranging the temperature measuring parts 211b, 212b of each thermocouple on the peripheral edge of the substrate (for example, 10 mm or less from the peripheral edge of the substrate 1), it is possible to reduce the area that protrudes into the processing space facing the substrate 1, thereby suppressing the influence on the substrate processing. In addition, since they are arranged almost at the boundary between areas where a fine pattern has been created (formed) and areas where it has not been created (formed), it is possible to suppress the influence on the transportation of the substrate 1 and the substrate processing.

[0103] Since the temperature measuring units 211b and 212b are arranged at approximately the same position along the vertical direction, it is possible to realize precise temperature control that takes into account minute fluctuations in temperature that exist along the vertical direction.

[0104] By obtaining the correction value in the same condition as when the product substrate is actually held in the boat 31, the correction value can be made more reliable, and the accuracy of temperature control of the processing space in which the substrate 1 is placed can be improved.

[0105] The correction values ​​can be obtained when the temperatures detected by the substrate thermocouple 211 and the auxiliary thermocouple 212 are facing the substrate 1 other than the protective tubes 211d and 212d, and during substrate processing, the correction values ​​at this time are used to control the temperature detected by the substrate thermocouple 211. This makes the correction values ​​highly reliable, and improves the accuracy of temperature control in the processing space where the substrate 1 is placed.

[0106] By correcting the target temperature using the correction temperature, it is possible to realize precise temperature control that takes into account minute temperature fluctuations that exist along the vertical direction. Therefore, since the temperature is controlled using the correction temperature that takes into account temperature fluctuations that exist in the processing space, it is possible to improve the accuracy of temperature control of the processing space in which the substrate 1 is placed.

[0107] Other Embodiments The embodiments of the present disclosure have been specifically described above. However, the present disclosure is not limited to the above-described embodiments, and various modifications are possible without departing from the spirit and scope of the present disclosure.

[0108] The above-described embodiments and modifications can be used in appropriate combination. The processing procedures and processing conditions in such cases can be, for example, the same as those of the above-described embodiments and modifications. Furthermore, unless otherwise specified in the specification, each element is not limited to one, and multiple elements may be present.

[0109] For example, in the above embodiment, when the temperature detected by the substrate thermocouple 211 matches the target temperature or falls within a set range (within a predetermined threshold) (converges), a judgment is made using a statistical value calculated by the statistical processing unit 63. However, when feedback temperature control is terminated based on the temperature detected by the substrate thermocouple 211, the judgment may be made based on the temperature detected by the auxiliary thermocouple 212 without calculation by the statistical processing unit 63 (without using the statistical processing unit 63).

[0110] (1) If at least one of the temperatures detected by the auxiliary thermocouple 212 is outside a predetermined range, an NG judgment is made. (2) If the minimum or maximum value of the temperatures detected by the auxiliary thermocouple 212 is outside a predetermined range, an NG judgment is made. (3) If the temperatures detected by the auxiliary thermocouple 212 are all lower or all higher than the temperatures detected by the substrate thermocouple 211, an NG judgment is made.

[0111] These rules (1) to (3) may be established, and each of (1) to (3) may be used alone for judgment, or, for example, judgment may be made using both (1) or (2) and (3), or judgment may be made using all of (1) to (3). In the case of an NG judgment, the correction value is changed (the target temperature is changed) and feedback temperature control is performed using the temperature detected by the substrate thermocouple 211.

[0112] Furthermore, because the auxiliary thermocouple 212 provided between the substrate thermocouple 211 and the substrate thermocouple 211 only monitors, it is expected that the temperature detected by the auxiliary thermocouple 212 will fluctuate even if the temperature detected by the substrate thermocouple 211 converges. Therefore, it is preferable to make the above determination after a predetermined time has elapsed since the temperature detected by the substrate thermocouple 211 converged.

[0113] Furthermore, if the temperature change amount detected by the auxiliary thermocouple 212 in a specified time period exceeds a specified change amount (threshold value), the above-mentioned feedback temperature control is repeated as an NG judgment, and if the change amount converges to less than the specified change amount (threshold value), a judgment may be made using the above (1) to (3).

[0114] This makes it possible to simply detect the temperatures using the substrate thermocouple 211 and the auxiliary thermocouple 212 and monitor these temperatures, eliminating the need for a configuration such as the statistical processing unit 63 and resulting in cost reduction.

[0115] For example, in the above embodiment, an example of performing a predetermined process using a substrate processing apparatus that is a batch-type vertical apparatus that processes multiple substrates at a time is described, but the present disclosure is not limited to this and can also be suitably applied to film formation using a single-wafer type substrate processing apparatus that processes one substrate at a time.

[0116] Furthermore, the substrate processing apparatus according to the embodiment of the present disclosure can be applied not only to semiconductor manufacturing apparatuses that manufacture semiconductors, but also to apparatuses that process glass substrates, such as LCD (Liquid Crystal Display) apparatuses. The substrate processing includes, for example, CVD, PVD, processes for forming oxide films and nitride films, processes for forming films containing metals, annealing, oxidation, nitriding, and diffusion. It goes without saying that the present disclosure can also be applied to various substrate processing apparatuses, such as exposure apparatuses, coating apparatuses, drying apparatuses, and heating apparatuses.

[0117] When using these substrate processing apparatuses, each process can be performed using the same processing procedures and conditions as in the above-described embodiments and modifications, and the same effects as in the above-described embodiments and modifications can be obtained.

[0118] 1 Substrate (wafer) 31 Boat (holding tool) 211 Substrate thermocouple (first temperature sensor) 212 Auxiliary thermocouple (second temperature sensor)

Claims

1. A method for obtaining a correction value, comprising the steps of: detecting the temperature of a processing space in which a substrate is processed by a first temperature sensor attached to a holder that holds the substrate; detecting the temperature of the processing space by a second temperature sensor disposed between the first temperature sensors; causing the temperature of the processing space detected by the first temperature sensor to match a target temperature obtained by adding a correction value to a set temperature or to converge within a first set range; and determining the correction value as a correction temperature based on the temperature detected by the second temperature sensor when the temperature of the processing space detected by the first temperature sensor matches the target temperature or converges within the first set range.

2. A correction value acquisition method according to claim 1, further comprising determining whether the statistical values ​​of the temperatures of the processing space detected by each of the first temperature sensor and the second temperature sensor satisfy a predetermined standard in the process of determining the correction value as the correction temperature.

3. A correction value acquisition method as described in claim 2, wherein in the process of determining the correction value as the correction temperature, the statistical value is the average value of the temperatures of the processing space detected by each of the first temperature sensor and the second temperature sensor, and it is determined whether the average value satisfies the specified standard.

4. A correction value acquisition method as described in claim 2, wherein in the process of determining the correction value as the correction temperature, the statistical value is the standard deviation of the temperature of the processing space detected by each of the first temperature sensor and the second temperature sensor, and it is determined whether the standard deviation satisfies the specified criterion.

5. A correction value acquisition method as described in claim 3, wherein the specified criterion is whether the average value matches the set temperature corresponding to the temperature of the processing space, or whether the difference between the average value and the set temperature corresponding to the temperature of the processing space is within a specified range.

6. The correction value acquisition method according to claim 4, wherein the predetermined criterion is whether the standard deviation is zero or within a threshold value.

7. The correction value acquisition method according to claim 1, further comprising a heating unit that is divided into a plurality of regions in the vertical direction and heats the substrate, and the first temperature sensor is provided to correspond to the plurality of regions.

8. A correction value acquisition method according to claim 1, wherein the holder includes a substrate holding area for loading a plurality of substrates, and the first temperature sensor is configured to be positioned at least at the upper and lower ends of the substrate holding area.

9. A correction value acquisition method according to claim 8, wherein at least one of the second temperature sensors is arranged between the first temperature sensors arranged at the upper and lower ends of the substrate holding area.

10. A correction value acquisition method according to claim 1, wherein the holder includes a substrate holding area for loading a plurality of substrates, the first temperature sensor is positioned at least at the upper end of the substrate holding area or the lower end of the substrate holding area, and the second temperature sensor is configured to be positioned between the plurality of first temperature sensors.

11. A correction value acquisition method as described in claim 10, wherein the second temperature sensor is configured to be positioned at least one between the first temperature sensors positioned at the center and upper end of the substrate holding area, and at least one between the first temperature sensors positioned at the center and lower end of the substrate holding area.

12. A correction value acquisition method as described in claim 10, wherein the second temperature sensor is configured so as not to be positioned at least one of between the first temperature sensor positioned at the center and upper end of the substrate holding area and between the first temperature sensor positioned at the center and lower end of the substrate holding area.

13. The correction value acquisition method according to claim 1, further comprising the step of transporting the substrate to the holder.

14. A method for obtaining a correction value according to claim 1, further comprising the steps of: detecting the temperature using third temperature sensors, which are divided into a plurality of regions in the vertical direction and measure the temperature in the vicinity of a heating section that heats the substrate; and controlling the temperature of the processing space to approach the target temperature based on the temperatures detected by the first temperature sensor and the third temperature sensor.

15. The correction value acquisition method according to claim 1, further comprising: the first temperature sensor including a first temperature measuring unit that detects the temperature of the processing space in which the substrate is processed; the second temperature sensor including a second temperature measuring unit that detects the temperature of the processing space in which the substrate is processed; and the first temperature measuring unit and the second temperature measuring unit being arranged so as to be sandwiched between a plurality of the substrates.

16. A correction value acquisition method according to claim 15, wherein the first temperature measuring unit and the second temperature measuring unit are arranged on the periphery of the substrate in a plan view.

17. A correction value acquisition method according to claim 15, wherein the first temperature measuring unit and the second temperature measuring unit are arranged within a range of 10 mm or less from the peripheral edge of the substrate in a plan view.

18. A correction value acquisition method according to claim 15, wherein the first temperature measuring unit and the second temperature measuring unit are disposed at approximately the same position along the vertical direction.

19. The correction value acquisition method according to claim 1, further comprising a lid that operates together with the holder, and the second temperature sensor is attached to the lid.

20. The correction value acquisition method according to claim 1, wherein the second temperature sensor is an F-type thermocouple, an L-type thermocouple, or a combination thereof.

21. The correction value acquisition method according to claim 1, wherein the substrate is a pseudo substrate.

22. A temperature control method for adjusting the processing space between a plurality of product substrates to a set temperature based on a correction value acquired by the correction value acquisition method according to any one of claims 1 to 21 and the temperature detected by at least the first temperature sensor.

23. A method for manufacturing a semiconductor device, in which the processing space is adjusted to a set temperature by the temperature control method set forth in claim 22, and the product substrate is processed.

24. A substrate processing apparatus comprising: a control unit configured to adjust the processing space to a set temperature and process the product substrate by the temperature control method set forth in claim 22.

25. A program that causes a computer to execute the following steps: detecting the temperature of a processing space in which a substrate is processed using a first temperature sensor attached to a holder that holds the substrate; detecting the temperature of the processing space using a second temperature sensor disposed between the first temperature sensors; causing the temperature of the processing space detected by the first temperature sensor to match a target temperature obtained by adding a correction value to a set temperature or to converge within a first set range; and determining the correction value as a correction temperature based on the temperature detected by the second temperature sensor when the temperature of the processing space detected by the first temperature sensor matches the target temperature or converges within the first set range.

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