Electronic device for performing NFC by using plurality of antennas

The electronic device optimizes power transfer to multiple antennas using a matching circuit to resolve power dissipation and interference issues, enhancing NFC communication range and reliability.

WO2026023782A1PCT designated stage Publication Date: 2026-01-29SAMSUNG ELECTRONICS CO LTD
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Patent Information

Application Number
PCT/KR2025/002339
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-09-02
Filing Date
2025-02-18
Publication Date
2026-01-29

AI Technical Summary

Technical Problem

Existing electronic devices using multiple antennas for NFC face issues of power dissipation and signal interference, particularly when a single IC is used for both data communication and authentication, limiting the communication range and causing misrecognition due to interference between NFC and cellular signals.

Method used

The electronic device employs a matching circuit to optimize the impedance of multiple antennas, adjusting inductance (L) and capacitance (C) to maximize power transfer to specific antennas based on response conditions, minimizing interference and enhancing communication range.

Benefits of technology

This solution effectively addresses power dissipation and signal interference, ensuring reliable and expanded NFC communication range by optimizing power distribution to multiple antennas.

✦ Generated by Eureka AI based on patent content.

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Abstract

An electronic device disclosed herein includes: a first antenna; a second antenna; a wireless communication circuit configured to transmit and receive RF signals of a frequency band designated for use in NFC communication; a matching circuit configured to selectively match the impedance of the wireless communication circuit to the impedance of at least one of the first antenna or the second antenna; a processor; and a memory for storing instructions. The instructions, when executed by the processor, may cause the electronic device to set the inductance (L) and capacitance (C) of the matching circuit to a first optimized value so that maximum power is transmitted from the wireless communication circuit to the first antenna. The instructions may cause the electronic device to output RF signals from the wireless communication circuit to the matching circuit while the matching circuit is in a first state having the first optimized value. The instructions may cause the electronic device to set the L and C of the matching circuit to a second optimized value, so that power is transmitted to both the first antenna and the second antenna from the wireless communication circuit, on the basis of there being no response from an external electronic device within a given first time after the matching circuit is set to the first state. The instruction may cause the electronic device to keep the matching circuit in a second state having the second optimized value for a given second time.
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Description

An electronic device that performs NFC using multiple antennas

[0001] The present disclosure relates to an electronic device that performs near field communication (NFC) using multiple antennas.

[0002] Electronic devices can wirelessly communicate with other nearby electronic devices using standard protocols for NFC. For example, file sharing and secure connections between electronic devices can be achieved via NFC.

[0003] Electronic devices can implement card emulation and point-of-sale (POS) functionality using NFC. This allows financial transactions between electronic devices via NFC even without a POS terminal. Card emulation and reader mode can be used to facilitate data communication (e.g., file or ticket transfer) and financial transactions (e.g., remittances).

[0004] The above information is provided as background information to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0005] An electronic device (e.g., a user terminal) can transmit or receive data requiring security, such as files, tickets, or financial information, to or from another electronic device (e.g., another user terminal or reader) via NFC. An electronic device (e.g., a smartphone) can authenticate another electronic device (e.g., a smartphone cover or accessory) via NFC. The antenna and NFC communication circuit (e.g., an integrated circuit (IC)) used for authentication may be different from the antenna and NFC communication circuit used for data communication. The location of the authentication antenna and the data communication antenna in the electronic device may be different. For example, a conductor located on the side of the electronic device may be used as the authentication antenna. A coil located on the back of the electronic device may be used as the data communication antenna.

[0006] A single IC and a single antenna (e.g., a coil located at the rear) can be used for both data communication and authentication. However, the spatial range of NFC may be limited. To expand the communication range, a single IC and multiple antennas (e.g., a side-mounted antenna and a rear-mounted antenna) may be used. However, there is a problem that the power of the RF signal is distributed from the IC to the multiple antennas. Among the multiple antennas, for example, the radiator of the side antenna may be used for cellular communication (e.g., LTE or NR (new radio)). When a card is recognized through the rear antenna, the IC can output an NFC signal to the rear antenna in reader mode. When the side antenna is used for cellular communication and an NFC signal is received at the side antenna, interference occurs between the NFC signal and the RF signal of the cellular communication received from the outside (or transmitted to the outside), and this interference may cause misrecognition of the card.

[0007] In embodiments of the present disclosure, an electronic device can address power dissipation and signal interference issues in a single IC and a multi-antenna structure. The technical challenges addressed by the present disclosure are not limited to the aforementioned technical challenges, and other technical challenges not mentioned herein will be readily apparent to those skilled in the art, based on the description below.

[0008] According to one embodiment, an electronic device (e.g., the electronic device (400) of FIG. 4) includes a first antenna; a second antenna; a wireless communication circuit configured to transmit and receive an RF signal in a frequency band designated to be used for NFC communication; a matching circuit (e.g., the matching circuit (450) of FIG. 4) configured to selectively match an impedance of the wireless communication circuit to an impedance of at least one of the first antenna and the second antenna; a processor (e.g., the processor (499) of FIG. 4); and a memory storing instructions. The instructions, when executed by the processor, may cause the electronic device to set an inductance (L) and a capacitance (C) of the matching circuit to a first optimized value such that maximum power is transferred from the wireless communication circuit to the first antenna. The instructions may cause the electronic device to output an RF signal from the wireless communication circuit to the matching circuit while the matching circuit is in a first state having the first optimized value. The command may cause the electronic device to set L and C of the matching circuit to a second optimal value so that power is delivered to both the first antenna and the second antenna in the wireless communication circuit based on the absence of a response from the external electronic device within a given first time period after the matching circuit is set to the first state. The command may cause the electronic device to maintain the matching circuit in a second state having the second optimal value for a given second time period.

[0009] According to one embodiment, an electronic device (e.g., the electronic device (400) of FIG. 4) includes a first antenna; a second antenna; a wireless communication circuit configured to transmit and receive an RF signal in a frequency band designated to be used for NFC communication; a matching circuit (e.g., the matching circuit (450) of FIG. 4) configured to selectively match an impedance of the wireless communication circuit to an impedance of at least one of the first antenna and the second antenna; a processor (e.g., the processor (499) of FIG. 4); and a memory storing instructions. The instructions, when executed by the processor, may cause the electronic device to set L (inductance) and C (capacitance) of the matching circuit to a first optimized value so that maximum power is transferred from the wireless communication circuit to the first antenna. The instructions may cause the electronic device to output an RF signal from the wireless communication circuit to the matching circuit while the matching circuit is in a first state having the first optimized value. The instructions may cause the electronic device to set the matching circuit to the first state. The wireless communication circuit may set L and C of the matching circuit to a third optimal value so that maximum power is transferred to the second antenna based on the fact that there is no response from an external electronic device within a given time period after being set and the number of times the matching circuit is set to the first state during a given period is less than a threshold, and the wireless communication circuit may output an RF signal to the matching circuit while the matching circuit is in a third state having the third optimal value. The command may cause the electronic device to change the state of the matching circuit to the first state based on the fact that there is no response from an external electronic device within a given time period after the matching circuit is set to the third state.The command may cause the electronic device to set L and C of the matching circuit to a second optimal value so that power is delivered to both the first antenna and the second antenna in the wireless communication circuit based on the fact that there is no response from the external electronic device within a given time period after the matching circuit is set to the first state and the number of times the matching circuit is set to the first state during one cycle reaches a threshold. The command may cause the electronic device to change the state of the matching circuit to the first state based on the fact that no RF signal is received from the external electronic device within a given time period after the matching circuit is set to the second state having the second optimal value.

[0010] According to one embodiment, a method of operating an electronic device (e.g., electronic device (400) of FIG. 4) is provided. The electronic device includes a first antenna; a second antenna; a wireless communication circuit configured to transmit and receive an RF signal in a frequency band designated to be used for NFC communication; and a matching circuit configured to selectively match an impedance of the wireless communication circuit to an impedance of at least one of the first antenna and the second antenna. The method may include an operation of setting an inductance (L) and a capacitance (C) of the matching circuit to a first optimized value so that maximum power is transferred from the wireless communication circuit to the first antenna. The method may include an operation of outputting an RF signal from the wireless communication circuit to the matching circuit while the matching circuit is in a first state having the first optimized value. The method may include setting L and C of the matching circuit to a second optimal value so that power is delivered to both the first antenna and the second antenna in the wireless communication circuit based on the absence of a response from an external electronic device within a given first time period after the matching circuit is set to the first state. The method may include maintaining the matching circuit in a second state having the second optimal value for a given second time period.

[0011] According to embodiments of the present disclosure, an electronic device can resolve issues of power dissipation and signal interference when performing NFC communication using multiple antennas. Furthermore, various benefits, directly or indirectly identified through this document, may be provided.

[0012] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0013] FIG. 2 is an exploded perspective view of an electronic device having a bar-type housing structure according to one embodiment.

[0014] FIGS. 3a, 3b, and 3c illustrate an electronic device having a foldable housing structure in an in-folding manner, according to one embodiment.

[0015] FIG. 4 is a block diagram of an electronic device (400) configured to perform NFC using a first antenna and a second antenna, according to one embodiment.

[0016] Figures 5a, 5b, and 5c are diagrams illustrating input / output paths of RF signals according to the state of a matching circuit in an electronic device.

[0017] FIG. 6 is a diagram for explaining an operation of periodically changing the state of a matching circuit in an electronic device according to one embodiment.

[0018] FIG. 7 is a flowchart illustrating operations performed in an electronic device according to one embodiment.

[0019] FIG. 8 is a flowchart illustrating operations performed in an electronic device according to one embodiment.

[0020] FIG. 9 is a flowchart illustrating operations performed in an electronic device according to one embodiment.

[0021] Fig. 10 is a drawing illustrating a detailed configuration of a matching circuit in the electronic device of Fig. 4.

[0022] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings so that those skilled in the art can easily implement the present disclosure. However, the present disclosure may be implemented in various different forms and is not limited to the embodiments described herein. In connection with the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Furthermore, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0023] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments. Referring to FIG. 1, in the network environment (100), the electronic device (101) may communicate with the electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of the electronic device (104) or the server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0024] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0025] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0026] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0027] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0028] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0029] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0030] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0031] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0032] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0033] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0034] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0035] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0036] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0037] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0038] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0039] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0040] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0041] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0042] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0043] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0044] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0045] Hereinafter, for the convenience of explanation, the surface of the display (e.g., a flexible display) that is visually exposed to the user may be referred to as the front surface of the electronic device (101). And, the surface opposite the front surface may be referred to as the back surface of the electronic device (101). In addition, the surface surrounding the space between the front surface and the back surface may be referred to as the side surface of the electronic device (101). The term “state” may refer to the structural form, posture, shape, or appearance of the electronic device (101) (or the display, slider, or housing constituting the electronic device (101). In addition, in this document, the “state” may be used as a term indicating the state of a matching circuit used to efficiently transfer power of an RF signal between a wireless communication circuit (e.g., an NFC (near field communication) communication circuit) and an antenna. According to one embodiment, the matching circuit may be configured such that an L (inductance) value and / or a C (capacitance) value can be changed. The state of the matching circuit can be defined according to the configurable L and C.

[0046] A bar-type housing structure can be applied to an electronic device (e.g., a smart phone, a tablet PC) (101). For example, the bar-type housing structure can include a plate (or front cover) forming a front surface of the electronic device (101), a plate (or rear cover) forming a rear surface of the electronic device (101), and a bezel structure (or side cover) forming a side surface surrounding the front and rear surfaces. A display area of ​​a display can be exposed through the front surface. According to one embodiment, the electronic device (101) can include a first antenna. The first antenna can be disposed inside the electronic device (101) adjacent to the rear surface. The first antenna can be a spiral-type coil wound multiple times clockwise or counterclockwise around an axis perpendicular to the rear surface. The first antenna (rear antenna) can be connected to a wireless communication circuit through a matching circuit and can be used as an antenna for transmitting and receiving an RF signal of a specified frequency band (e.g., a frequency band for NFC). A portion of the side bezel structure may include a conductor (or metal). At least a portion of the conductor may be used as a second antenna (side antenna) for transmitting and receiving RF signals in a designated frequency band (e.g., a frequency band for NFC and / or a frequency band for cellular communications (e.g., LTE, 5G)).

[0047] A foldable housing structure may be applied to an electronic device (e.g., a smart phone, a tablet PC, a notebook PC) (101). For example, the electronic device (101) may have a foldable housing structure that is divided into two housings centered on a folding axis. The first housing may include a first front cover forming a part of the front (a first front), a second rear cover forming a part of the rear (or a second rear), and a first side bezel structure forming a part of the side (or a first side). The second housing may include a second front cover forming another part of the front (or a second front), a second rear cover forming another part of the rear (or a second rear), and a second side bezel structure forming another part of the side (or a second side). A part of a display (e.g., a flexible display) may be disposed in the first housing and another part may be disposed in the second housing. A first display area of ​​the display may be exposed through the first front surface in the first housing. The second display area of ​​the display can be exposed through the second front side of the second housing. The foldable housing structure can be implemented in an in-folding manner in which the first display area and the second display area face each other when the electronic device (101) is in a folded state. Alternatively, the foldable housing structure can be implemented in an out-folding manner in which the first display area and the second display area face each other when the electronic device (101) is in a folded state. The electronic device (101) can further include a sub-display. For example, the flexible display, which is the main display, can be exposed through the entire front side of the electronic device (101), and the sub-display can be disposed in the first housing or the second housing and exposed through the rear side (the first rear side or the second rear side) of the housing. According to one embodiment, the electronic device (101) can include a first antenna.The first antenna may be disposed inside the first housing (or inside the second housing) adjacent to the first rear surface (or the second rear surface). The first antenna may be a spiral-type coil wound multiple times clockwise or counterclockwise around an axis perpendicular to the first rear surface (or the second rear surface). The first antenna (rear antenna) may be connected to a wireless communication circuit via a matching circuit and may be used as an antenna for transmitting and receiving RF signals in a designated frequency band (e.g., a frequency band for NFC). A portion of the first side bezel structure and / or a portion of the second side bezel structure may include a conductor (or metal). At least a portion of the conductor may be used as a second antenna (side antenna) for transmitting and receiving RF signals in a designated frequency band (e.g., a frequency band for NFC and / or a frequency band for cellular communication (e.g., LTE, 5G)).

[0048] A slidable (or rollable) housing structure can be applied to an electronic device (e.g., a smart phone, a tablet PC, a notebook PC) (101). The electronic device (101) can include a slidable housing including a housing (or a first housing) and a slider (or a second housing), a rail structure (e.g., a rail structure by gear engagement between a rack gear and a pinion gear) that allows the slider to be inserted into the housing and the slider to be extracted from the housing, and a rollable display (e.g., a flexible display). The slider can be divided into a portion that can be inserted into the housing (hereinafter, referred to as an inlet portion) and a portion that remains exposed to the outside. When the inlet portion of the slider is completely extracted from the housing in a slide-out state (in other words, a first state, an open state, an extended state, a roll-out state), the entire display (or a majority of the display area) can be exposed to the outside through the front. As the slider's inlet portion is retracted into the housing, the display can also be retracted into the housing. The display can also be divided into a portion that remains exposed to the outside (e.g., a first display area, a first section) and a portion that can be retracted into the housing (e.g., a second display area, a second section, a bendable section). When the entire slider's inlet portion is switched to a slide-in state (in other words, a second state, a closed state, a reduced state, a roll-in state) in which the slider's inlet portion is retracted into the housing, the entire second display area of ​​the display can be retracted into the housing. When switching from a slide-out state to a slide-in state, a part of the display (e.g., a second display area) may be moved to the side and toward the rear without being retracted into the housing.As exemplified above, the electronic device (101) may have a sliding structure in which a portion of the display is retracted into the housing, or a sliding structure in which a portion of the display is moved from the front to the rear. Only a portion exposed through the front of the display may be determined as an activated display area (hereinafter, referred to as an active area) that displays visual information. A portion retracted into the housing or moved to the rear may be determined as an inactive area in which no visual information is displayed. According to one embodiment, the electronic device (101) may include a first antenna. The first antenna may be disposed within the housing (or slider) adjacent to the rear. The first antenna may be a spiral-type coil wound multiple times clockwise or counterclockwise around an axis perpendicular to the rear. The first antenna (rear antenna) may be connected to a wireless communication circuit through a matching circuit and may be used as an antenna for transmitting and receiving an RF signal of a specified frequency band (e.g., a frequency band for NFC). The side bezel structure may include a first side bezel structure surrounding the front and rear sides of the housing and a second side bezel structure surrounding the front and rear sides of the slider. A portion of the first side bezel structure and / or a portion of the second side bezel structure may include a conductor (or metal). At least a portion of the conductor may be used as a second antenna (side antenna) for transmitting and receiving RF signals in a designated frequency band (e.g., a frequency band for NFC and / or a frequency band for cellular communication (e.g., LTE, 5G)).

[0049] FIG. 2 is an exploded perspective view of an electronic device (300) having a bar-type housing structure according to one embodiment.

[0050] Referring to FIG. 2, an electronic device (200) (e.g., the electronic device (101) of FIG. 1) may include a side bezel structure (or side frame) (210), a first support member (or first support frame) (211), a front cover (or window) (220), a display (230) (e.g., the display module (160) of FIG. 1), at least one printed circuit board (240, 241), a battery (250) (e.g., the battery (189) of FIG. 1), a second support member (or second support frame) (260), and a rear cover (280). The front cover (220) may form a front side (or first side) of the electronic device (200) facing a first direction, and the rear cover (280) may form a rear side (or second side) of the electronic device (200) facing a second direction opposite to the first direction. The side bezel structure (210) may be formed of a combination of metal (e.g., SUS) and polymer. The side bezel structure (210) may form a side that surrounds a space between the front and the back. A structure including the front, the back, and the side may be referred to as a housing (or housing structure). According to one embodiment, a first antenna (rear antenna) may be disposed inside the housing adjacent to the back cover (280) (e.g., between the battery (250) and the back cover (280). According to one embodiment, the side bezel structure (210) may include a conductor (or metal). The conductor may be used as the first antenna (side antenna) described above. For example, the side bezel structure (210) may be divided into a left side (210a), a right side (210b), a top side (210c), and a bottom side (210d). At least a portion of the conductor forming at least a portion of the upper side (210c) and / or at least a portion of the conductor forming at least a portion of the left side (210a) may be used as a second antenna.

[0051] The printed circuit board (240, 241) may be arranged to be supported by the first support member (211) and / or the second support member (260). The first support member (211) may be coupled to the side bezel structure (210). The first support member (211) may also include a structure (e.g., metal, polymer) extending from the side bezel structure (210). The first support member (211) may be formed of, for example, a metal and / or a non-metallic material (e.g., polymer). A display (230) may be coupled to one surface of the second support member (260) and a printed circuit board (240, 241) may be coupled to the other surface. A processor (120), a memory (130), and / or an interface (177) may be mounted on the printed circuit board (240, 241). According to one embodiment, the printed circuit board (240, 241) may include a main substrate (240) and a sub-substrate (241). The first support member (211) may include a main substrate support member (211a) that supports the main substrate (240) and a sub-substrate support member (211b) that supports the sub-substrate (241). The battery (250) may be arranged to be supported by the first support member (211) and / or the second support member (260). According to one embodiment, the main substrate (240) may include a wireless communication circuit (e.g., an NFC circuit). In addition, the main substrate (240) may include a matching circuit that connects the wireless communication circuit to a first antenna (rear antenna) and a second antenna (side antenna).

[0052] FIGS. 3A, 3B, and 3C illustrate an electronic device (300) having a foldable housing structure in an in-folding manner, according to one embodiment. Specifically, FIG. 3A illustrates a front view of the electronic device (300) in an unfolded (flat or open) state. FIG. 3B illustrates a rear view of the electronic device (300) in an unfolded state. FIG. 3C illustrates a front view of the electronic device (300) in a partially folded state (in other words, a partially unfolded state, or an intermediate state (freestop state) between a fully folded state and a fully unfolded state).

[0053] Referring to FIGS. 3A, 3B, and 3C, an electronic device (300) (e.g., the electronic device (101) of FIG. 1) may include a foldable housing including a first housing (310), a second housing (320), and a hinge assembly (340) connecting the first housing (310) and the second housing (320) such that the second housing (320) is rotatable relative to the first housing (310). The electronic device (300) may include a flexible or foldable display (399) disposed within a space formed by the foldable housings (310, 320).

[0054] The display (399) can be arranged across the hinge assembly (340) from the first housing (310) to the second housing (320). The display (399) can be divided into a first display area (311) arranged in the internal space of the first housing (310) and a second display area (321) arranged in the internal space of the second housing (320) based on the folding axis (A).

[0055] The hinge assembly (340) may be implemented in an in-folding manner so that the two display areas (311, 321) face each other when the electronic device (300) is switched from an unfolded state (e.g., the state of FIG. 3A) to a folded state. For example, when the electronic device (300) is in an unfolded state, the two display areas (311, 321) may face substantially the same direction. As the state is switched from an unfolded state to a folded state, the two display areas (311, 321) may rotate in a direction where they face each other. The hinge assembly (340) may be configured so that the foldable housing (310, 320) has a resistance to rotation. When an external force exceeding the resistance is applied to the foldable housing (310, 320), the foldable housing (310, 320) may rotate.

[0056] The first housing (310), when unfolded, may include a first front surface (first display area) (311) facing a first direction (e.g., front direction) (z-axis direction) and a first rear surface (312) facing a second direction (e.g., rear direction) (-z-axis direction) opposite to the first front surface (311). The second housing (320), when unfolded, may include a second front surface (second display area) (321) facing a first direction (e.g., z-axis direction) and a second rear surface (322) facing a second direction (e.g., -z-axis direction). The electronic device (300) can be operated in such a manner that, in an unfolded state, the first front surface (311) of the first housing (310) and the second front surface (321) of the second housing (320) face the same first direction (e.g., z-axis direction), and in a folded state, the first front surface (311) and the second front surface (321) face each other. The electronic device (300) can be operated in such a manner that, in an unfolded state, the first rear surface (312) of the first housing (310) and the second rear surface (322) of the second housing (320) face the same second direction (- z-axis direction), and in a folded state, the first rear surface (312) and the second rear surface (322) face opposite directions.

[0057] The first housing (310) may include a first side frame (or, first side bezel structure) (313) that at least partially forms an exterior of the electronic device (300) and a first rear cover (314) that is coupled to the first side frame (313) and forms at least a portion of the first rear surface (312) of the electronic device (300). The first side frame (313) may include a first side (or, upper side) (313a), a second side (or, first left side) (313b) extending from one end of the first side (313a), and a third side (or, first right side) (313c) extending from the other end of the first side (313a). The first side frame (313) may be formed into a rectangular (e.g., square or rectangular) shape through the first side (313a), the second side (313b), and the third side (313c). According to one embodiment, a first antenna (rear antenna) may be disposed inside the first housing (310) adjacent to the first rear cover (314). For example, a battery may be disposed inside the first housing (310) and the first antenna may be positioned between the battery and the first rear cover (314). According to one embodiment, the first side frame (313) may include a conductor (or metal). The conductor may be used as the second antenna (side antenna) described above. For example, at least one of the conductor forming at least a portion of the first side (313a), the conductor forming at least a portion of the second side (313b), and the conductor forming at least a portion of the third side (313c) can be used as the second antenna (side antenna).

[0058] The second housing (320) may include a second side frame (or second side bezel structure) (323) that at least partially forms an exterior of the electronic device (300) and a second rear cover (324) that is coupled to the second side frame (323) and forms at least a portion of the second rear surface (322) of the electronic device (300). The second side frame (323) may include a fourth side surface (or lower side) (323a), a fifth side surface (or second left side) (323b) that extends from one end of the fourth side surface (323a), and a sixth side surface (or second right side) (323c) that extends from the other end of the fourth side surface (323a). The second side frame (323) may be formed into a rectangular shape through the fourth side (323a), the fifth side (323b), and the sixth side (323c). According to one embodiment, a first antenna (rear antenna) may be disposed inside the second housing (320) adjacent to the second rear cover (324). For example, a battery may be disposed inside the second housing (320) and the first antenna may be positioned between the battery and the second rear cover (324). According to one embodiment, the second side frame (323) may include a conductor (or metal). The conductor may be used as the second antenna (side antenna) described above. For example, at least one of a conductor forming at least a portion of the fourth side (323a), a conductor forming at least a portion of the fifth side (323b), and a conductor forming at least a portion of the sixth side (323c) may be used as the second antenna (side antenna).

[0059] The electronic device (300) may include a first protective cover (315) (e.g., a first protective frame or a first decorative member) coupled along an edge of the first housing (310). The electronic device (300) may include a second protective cover (325) (e.g., a second protective frame or a second decorative member) coupled along an edge of the second housing (320).

[0060] The electronic device (300) may include a sub-display (331) that is positioned separately from the display (399). The sub-display (331) may be positioned to be at least partially exposed on the first rear surface (312) of the first housing (310), thereby displaying status information of the electronic device (300) when in a folded state. The sub-display (331) may be positioned to be visible from the outside through at least a portion of the first rear cover (314). In some embodiments, the sub-display may be positioned on the second rear surface (322) of the second housing (320). In this case, the sub-display may be positioned to be visible from the outside through at least a portion of the second rear cover (324).

[0061] The electronic device (300) may include at least one of an input device (303), an audio output device (301, 302), a camera module (305, 308), a key input device (306), and a connector port (307).

[0062] The electronic device (300) may include a first printed circuit board and a first battery arranged in a first space between a first front surface (first display area) (311) and a first rear surface (312). The electronic device (300) may include a second printed circuit board and a second battery arranged in a second space between a second front surface (second display area) (321) and a first rear surface (322). The electronic device (300) may include a wiring member (e.g., a flexible printed circuit board (FPCB)) disposed within the housing (310, 320) and crossing the hinge assembly (340). The wiring member may provide an electrical connection between an electronic component disposed on a first printed circuit board and an electronic component disposed on a second printed circuit board. According to one embodiment, the first printed circuit board or the second printed circuit board may include a wireless communication circuit (e.g., an NFC circuit). In addition, the first printed circuit board or the second printed circuit board may include a matching circuit that connects the wireless communication circuit to a first antenna (rear antenna) and a second antenna (side antenna).

[0063] FIG. 4 is a block diagram of an electronic device (400) configured to perform NFC using a first antenna and a second antenna, according to one embodiment. Referring to FIG. 4, the electronic device (400) (e.g., the electronic device (200) of FIG. 2 or the electronic device (300) of FIG. 3) may include a first antenna (410), a second antenna (420), a first wireless communication circuit (430) supporting NFC, a second wireless communication circuit (440) supporting cellular communication, a configurable matching circuit (450), a memory (488), and a processor (499). The processor (499) may include an application processor (AP) (460) and a communication processor (CP) (470). FIGS. 5A, 5B, and 5C are diagrams illustrating input / output paths of RF signals according to the state of the matching circuit (450) in the electronic device (400). FIG. 6 is a drawing for explaining an operation of periodically changing the state of a matching circuit (450) in an electronic device (400) according to one embodiment.

[0064] In one embodiment, the first antenna (410) may be configured to include a coil and may be positioned to radiate an RF signal toward the rear of the electronic device (400). As an example (see FIG. 2), the first antenna (410) may be positioned between the battery (250) and the rear cover (280). The first antenna (410) may include a coil wound around the Z-axis. As another example (see FIG. 3), the first antenna (410) may include a coil wound around the Z-axis, positioned between the battery and the second rear cover (324) within the second housing (320).

[0065] According to one embodiment, the first antenna (410) is connected to the first wireless communication circuit (430) through a matching circuit (450) and can transmit and receive RF signals of a frequency band designated to be used for NFC.

[0066] According to one embodiment, the second antenna (420) may include a portion of a metal forming a side surface of the electronic device (400) (e.g., the side bezel structure (210) of FIG. 2). As an example (see FIG. 2), the second antenna (420) may include at least a portion of a conductor forming at least a portion of an upper side surface (210c) and / or at least a portion of a conductor forming at least a portion of a left side surface (210a). As another example (see FIG. 3), the second antenna (420) may include at least one of a conductor forming at least a portion of a first side surface (313a), a conductor forming at least a portion of a second side surface (313b), and a conductor forming at least a portion of a third side surface (313c).

[0067] According to one embodiment, the second antenna (420) is connected to the first wireless communication circuit (430) through a matching circuit (450) and can transmit and receive RF signals in a frequency band designated to be used for NFC. The radiator of the second antenna (420) is connected to the second wireless communication circuit (440) and can transmit and receive RF signals in a frequency band designated to be used for cellular communication (e.g., LTE or 5G). A matching circuit for impedance matching may be additionally arranged between the radiator of the second antenna (420) and the second wireless communication circuit (440).

[0068] In one embodiment, the electronic device (400) may further include a third antenna (not shown) connected to the second wireless communication circuit (440) and designated for cellular communication and utilizing at least a portion of the radiator of the second antenna (420). In this document, the connection of the second wireless communication circuit (440) to the second antenna (420) may be understood as connection to the third antenna utilizing the radiator of the second antenna (420).

[0069] The first wireless communication circuit (430) can support the establishment of an NFC channel (or NFC session) corresponding to a frequency band (e.g., about 13.56 MHz) designated to be used for NFC with an external electronic device (e.g., the electronic device (102) of FIG. 1). The first wireless communication circuit (430) can support NFC with the external electronic device through the NFC channel. According to one embodiment, the first wireless communication circuit (430) can include a first RFFE (radio frequency frontend) and a first RFIC (radio frequency integrated circuit) (or transceiver) for supporting NFC.

[0070] In the first wireless communication circuit (430), the first RFFE may be configured to preprocess (e.g., amplify) an RF signal. For example, the first RFFE may include a first power amplifier configured to amplify an RF signal received from the first RFIC and output the amplified signal to the first antenna (410) or the second antenna (420) via the matching circuit (450). The first RFFE may include a low-noise amplifier configured to amplify an RF signal received from the first antenna (410) and / or the second antenna (420) via the matching circuit (450) and output the amplified signal to the first RFIC.

[0071] In the first wireless communication circuit (430), the first RFIC may, upon transmission, convert a baseband signal (or data signal) received from the processor (499) (e.g., AP (460)) into an RF signal and output the RF signal to the first antenna (410) or the second antenna (420) via the first RFFE. Upon reception, the first RFIC may convert an RF signal received from the first antenna (410) and / or the second antenna (420) via the first RFFE into a baseband signal (or data signal) and output the same to the processor (499) (e.g., AP (460)).

[0072] The second wireless communication circuit (440) may support the establishment of a cellular communication channel corresponding to a frequency band designated for cellular communication. The second wireless communication circuit (440) may support cellular communication with an external electronic device (e.g., the electronic device (104) or server (108) of FIG. 1 ) via the cellular communication channel. According to one embodiment, the second wireless communication circuit (440) may include a second RFFE and a second RFIC for supporting cellular communication.

[0073] In the second wireless communication circuit (440), the second RFFE may be configured to preprocess (e.g., amplify) an RF signal. For example, the second RFFE may include a second power amplifier configured to amplify an RF signal received from the second RFIC and output the amplified signal to the second antenna (420) through the matching circuit (450). The second RFFE may include a low-noise amplifier configured to amplify an RF signal received from the second antenna (420) through the matching circuit (450) and output the amplified signal to the second RFIC.

[0074] In the second wireless communication circuit (440), the second RFIC may, upon transmission, convert a baseband signal (or data signal) received from the processor (499) (e.g., CP (470)) into an RF signal and output the RF signal to the second antenna (420) via the second RFFE. Upon reception, the second RFIC may convert an RF signal received from the second antenna (420) via the second RFFE into a baseband signal (or data signal) and output the same to the processor (499) (e.g., CP (470)).

[0075] The memory (488) (e.g., the memory (130) of FIG. 1) can store instructions. The instructions, when executed by the processor (499), can cause the electronic device (400) to perform a given operation (e.g., an operation of setting a state of a matching circuit (450)).

[0076] According to one embodiment, the matching circuit (450) may be configured to selectively match the impedance of the first wireless communication circuit (430) to the impedance of at least one antenna among the first antenna (410) and the second antenna (420) based on control of the processor (499) (e.g., AP (460)) and / or the first wireless communication circuit (430).

[0077] According to one embodiment, the processor (499) may set the L (inductance) value and the C (capacitance) value of the matching circuit (450) so that the impedance between the first wireless communication circuit (430) and the first antenna (410) is matched. According to the impedance matching between the first wireless communication circuit (430) and the first antenna (410), the power of the RF signal may be maximally transferred from the first wireless communication circuit (430) to the first antenna (410) through the matching circuit (450). Hereinafter, the L value and the C value that cause the impedance matching between the first wireless communication circuit (430) and the first antenna (410) may be referred to as a first optimization value. Ideally, while the L value and C value in the matching circuit (450) are set to the first optimized value (hereinafter, the first state), the matching circuit (450) can output the RF signal (510; see FIG. 5A) received from the first wireless communication circuit (430) to the first antenna (410), not the second antenna (420). While the matching circuit (450) is in the first state having the first optimized value, the first wireless communication circuit (430) can output the RF signal to the first antenna (410) through the matching circuit (450).

[0078] According to one embodiment, the processor (499) may set the L value and the C value of the matching circuit (450) so that the impedances between the first wireless communication circuit (430), the first antenna (210), and the second antenna (420) are matched. According to the impedance matching between the first wireless communication circuit (430), the first antenna (410), and the second antenna (420), the first wireless communication circuit (430) may receive an RF signal from the first antenna (410) and the second antenna (420) through the matching circuit (450). Hereinafter, the L value and the C value that cause the impedances between the first wireless communication circuit (430), the first antenna (410), and the second antenna (420) to be matched may be referred to as a second optimization value. While the L value and the C value are set to the second optimized value in the matching circuit (450) (hereinafter, the second state), the first wireless communication circuit (430) can receive an RF signal (521; see FIG. 5b) from the first antenna (410) through the matching circuit (450). While the matching circuit (450) is in the second state, the first wireless communication circuit (430) can receive an RF signal (522; see FIG. 5b) from the second antenna (420) through the matching circuit (450).

[0079] According to one embodiment, the processor (499) may set the L value and the C value of the matching circuit (450) so that the impedance between the first wireless communication circuit (430) and the second antenna (420) is matched. According to the impedance matching between the first wireless communication circuit (430) and the second antenna (420), the power of the RF signal may be maximally transferred from the first wireless communication circuit (430) to the second antenna (420) through the matching circuit (450). Hereinafter, the L value and the C value that cause the impedance matching between the first wireless communication circuit (430) and the second antenna (420) may be referred to as a third optimization value. Ideally, while the L value and C value in the matching circuit (450) are set to the third optimized value (hereinafter, the third state), the matching circuit (450) can output the RF signal (530; see FIG. 5C) received from the first wireless communication circuit (430) to the second antenna (420), not the first antenna (410). While the matching circuit (450) is in the third state with the third optimized value, the first wireless communication circuit (430) can output the RF signal to the second antenna (420) through the matching circuit (450).

[0080] As described with reference to FIGS. 5A, 5B, and 5C, while the matching circuit (450) is in the first state, the electronic device (400) can operate as an NFC reader. While the electronic device (400) is set to operate as an NFC reader (hereinafter, referred to as a first reader mode) in the first state, the first wireless communication circuit (430) can output an RF signal (e.g., a polling signal) to the first antenna (410) through the matching circuit (450) to detect the presence of a peripheral terminal device (e.g., an NFC tag, a smart card, or a smart phone). The peripheral terminal device can respond to this RF signal by transmitting an RF signal including designated information (e.g., payment information or information for authenticating a cover or accessory) to the electronic device (400). For example, a smart card can be woken up by an RF signal received from an electronic device (400) through a first antenna (410), and, using the power of the received RF signal, transmit an RF signal including designated information (e.g., card information) to the electronic device (400). The first wireless communication circuit (430) can receive an RF signal transmitted by a peripheral terminal device from the first antenna (410) through a matching circuit (450).

[0081] According to one embodiment, while the matching circuit (450) is in the second state, the electronic device (400) can operate as a terminal device responding to a request from an NFC reader. While the electronic device (400) is set to operate as a terminal device (hereinafter, referred to as a card mode) in the second state, the first wireless communication circuit (430) can receive an RF signal (e.g., a polling signal) transmitted by an external electronic device (e.g., an NFC reader) from the first antenna (410) or the second antenna (420) through the matching circuit (450). The first wireless communication circuit (430) can react to the received RF signal. For example, the first wireless communication circuit (430) can output an RF signal including designated information (e.g., payment information) to the matching circuit (450) in response to the received RF signal. The power of the RF signal is divided in the matching circuit (450), and accordingly, the RF signal can be transmitted externally through the first antenna (410) and the second antenna (420). An external electronic device can recognize the RF signal output from the first antenna (410) or the RF signal output from the second antenna (420).

[0082] According to one embodiment, while the matching circuit (450) is in the third state, the electronic device (400) can operate as an NFC reader. While the electronic device (400) is set to operate as an NFC reader (hereinafter, referred to as a second reader mode) in the third state, the first wireless communication circuit (430) can output an RF signal (e.g., a polling signal) to the second antenna (420) through the matching circuit (450) to detect the presence of a peripheral terminal device (e.g., an NFC tag, a smart card, or a smart phone). The peripheral terminal device (e.g., an NFC tag, a smart card, or a smart phone) can respond to this RF signal by transmitting an RF signal including designated information (e.g., payment information or information for authenticating a cover or accessory) to the electronic device (400). For example, the smart card can be woken up by an RF signal received from the electronic device (400) through the second antenna (420) and transmit an RF signal including designated information (e.g., card information) to the electronic device (400) using the power of the received RF signal. The first wireless communication circuit (430) can receive an RF signal transmitted by a peripheral terminal device from the second antenna (420) through the matching circuit (450).

[0083] According to one embodiment, the electronic device (400) (e.g., the AP (460) or the first wireless communication circuit (430)) can change the state of the matching circuit (450) in a specified order at a specified period (T; see FIG. 6). As an example (see FIG. 6), the electronic device (400) can change the state of the matching circuit (450) in the following order during one period (T): a first state, a third state, a first state, a third state, a first state, and a second state. The electronic device (400) can maintain the first state for a time interval t1. The electronic device (400) can maintain the third state for a time interval t2. For example, t1 and t2 may be the same or different. The electronic device (400) can maintain the second state for a time interval t3. For example, t3 may be set to a longer time than t1 and t2. For example, in one cycle (T), t2 can be set to a time longer than the sum of the times for maintaining the first state and the second state (t1*3 + t2*2; see Fig. 6).

[0084] According to one embodiment, while the matching circuit (450) is in the first state, a first input / output path (610) may be formed between the first antenna (410) and the first wireless communication circuit (430). The first wireless communication circuit (430) may operate in a first leader mode through the first input / output path (610).

[0085] According to one embodiment, while the matching circuit (450) is in the third state, a second input / output path (620) may be formed between the second antenna (420) and the first wireless communication circuit (430). The first wireless communication circuit (430) may operate in a second leader mode through the second input / output path (620).

[0086] In one embodiment, while the matching circuit (450) is in the second state, both the first input / output path (610) and the second input / output path (620) can be formed. The first wireless communication circuit (430) can operate in card mode via the first input / output path (610) and the second input / output path (620).

[0087] FIG. 7 is a flowchart illustrating operations performed in an electronic device (400) according to one embodiment. Instructions stored in a memory (488), when executed by a processor (499), may cause the electronic device (400) (e.g., the processor (499) and / or the first wireless communication circuit (430)) to perform the operations of FIG. 7. The instructions may cause the electronic device (400) to perform the operations of FIG. 7 based on the activation of the first wireless communication circuit (430). For example, when the electronic device (400) is turned on, the processor (499) may activate the first wireless communication circuit (430). As another example, the electronic device (400) may display a settings menu that allows a user to select whether to activate the first wireless communication circuit (430). When the user selects NFC activation through the settings menu, the processor (499) may activate the first wireless communication circuit (430).

[0088] In operation 710, the electronic device (400) can set the matching circuit (450) to a first state (see FIG. 6) and transmit an RF signal to an external electronic device through a first input / output path (610; see FIG. 6).

[0089] In operation 720, the electronic device (400) can check whether there is a response (RF signal) from the external electronic device through the first input / output path (610) within a given time after the matching circuit (450) is set to the first state. If there is a response within the given time, the electronic device (400) can perform the first reader mode in operation 725. For example, the electronic device (400) can request information (e.g., card information) from the external electronic device through the first input / output path (610), and in response, the external electronic device can transmit the information to the electronic device (400). If the first reader mode is completed by receiving the requested information from the external electronic device through the first input / output path (610), the electronic device can perform the operation again from operation 710.

[0090] If there is no response within a given time after the matching circuit (450) is set to the first state, in operation 730, the electronic device (400) can set the matching circuit (450) to the second state (see FIG. 6).

[0091] In operation 730, the electronic device (400) can determine whether an RF signal is received from an external electronic device through the first input / output path (610) and / or the second input / output path (620; see FIG. 6) within a given time after the matching circuit (450) is set to the second state. If an RF signal is received within the given time, the electronic device (400) can perform card mode in operation 745. For example, the external electronic device can request information (e.g., card information) from the electronic device (400). The electronic device (400) can respond to the request. For example, the electronic device (400) can transmit information corresponding to the request to the external electronic device through the first input / output path (610) and the second input / output path (620). If the card mode is completed by transmitting the requested information to the external electronic device, the electronic device can perform operation 710 again.

[0092] If there is no response within a given time after the matching circuit (450) is set to the second state, the electronic device (400) can perform the operation again from operation 710.

[0093] In one embodiment, the above-described operation 710 may be replaced with an operation of setting the matching circuit (450) to a third state (see FIG. 6) and transmitting an RF signal to an external electronic device via the second input / output path (620).

[0094] FIG. 8 is a flowchart illustrating operations performed in an electronic device (400) according to one embodiment. Instructions stored in a memory (488), when executed by a processor (499), may cause the electronic device (400) (e.g., the processor (499) and / or the first wireless communication circuit (430)) to perform the operations of FIG. 8. The instructions may cause the electronic device (400) to perform the operations of FIG. 8 based on the activation of the first wireless communication circuit (430). For example, when the electronic device (400) is turned on, the processor (499) may activate the first wireless communication circuit (430). As another example, the electronic device (400) may display a settings menu that allows a user to select whether to activate the first wireless communication circuit (430). When the user selects NFC activation through the settings menu, the processor (499) may activate the first wireless communication circuit (430). In the description of Fig. 8, any content overlapping with Fig. 7 may be omitted or briefly described.

[0095] In operation 810, the electronic device (400) may set the matching circuit (450) to a first state (see FIG. 6) and transmit an RF signal to an external electronic device through a first input / output path (610; see FIG. 6).

[0096] In operation 820, the electronic device (400) can check whether there is a response (RF signal) from an external electronic device through the first input / output path (610) within a given time after the matching circuit (450) is set to the first state. If there is a response within the given time, the electronic device (400) can perform the first leader mode in operation 825. When the first leader mode is completed, the electronic device can perform again from operation 810.

[0097] If there is no response within a given time after the matching circuit (450) is set to the first state, in operation 830, the electronic device (400) can set the matching circuit (450) to the third state (see FIG. 6) and transmit an RF signal to an external electronic device through the second input / output path (620; see FIG. 6).

[0098] In operation 840, the electronic device (400) can check whether there is a response (RF signal) from the external electronic device through the second input / output path (6220) within a given time after the matching circuit (450) is set to the third state. If there is a response within the given time, in operation 845, the electronic device (400) can perform the second reader mode. When the second reader mode is completed, the electronic device can perform the operation again from operation 810.

[0099] If there is no response within a given time after the matching circuit (450) is set to the third state, in operation 850, the electronic device (400) can set the matching circuit (450) to the second state (see FIG. 6).

[0100] In operation 860, the electronic device (400) can determine whether an RF signal is received from an external electronic device through the first input / output path (610) and / or the second input / output path (620) within a given time after the matching circuit (450) is set to the second state. If an RF signal is received within the given time, the electronic device (400) can perform card mode in operation 865. If the performance of card mode is completed, the electronic device can perform operation 810 again.

[0101] If there is no response within a given time after the matching circuit (450) is set to the second state, the electronic device (400) can perform the operation again from operation 810.

[0102] According to one embodiment, operations 830, 840, and 845 may be performed when a specified condition is satisfied. For example, the electronic device (400) may determine that wireless communication is not being performed in the second wireless communication circuit (440) and, based on this, may perform operations 830, 840, and 845. The electronic device (400) may determine that wireless communication (e.g., data transmission or reception) is being performed in the second wireless communication circuit (440) and, based on this, may omit operations 830, 840, and 845.

[0103] FIG. 9 is a flowchart illustrating operations performed in an electronic device (400) according to one embodiment. Instructions stored in a memory (488), when executed by a processor (499), may cause the electronic device (400) (e.g., the processor (499) and / or the first wireless communication circuit (430)) to perform the operations of FIG. 9. The instructions may cause the electronic device (400) to perform the operations of FIG. 9 based on the activation of the first wireless communication circuit (430). For example, when the electronic device (400) is turned on, the processor (499) may activate the first wireless communication circuit (430). As another example, the electronic device (400) may display a settings menu that allows a user to select whether to activate the first wireless communication circuit (430). When the user selects NFC activation through the settings menu, the processor (499) may activate the first wireless communication circuit (430). In the description of Fig. 9, content overlapping with Figs. 7 and 8 may be omitted or briefly described.

[0104] In operation 910, the electronic device (400) may set the matching circuit (450) to a first state (see FIG. 6) and transmit an RF signal to an external electronic device through a first input / output path (610; see FIG. 6).

[0105] At operation 920, the electronic device (400) can check whether there is a response (RF signal) from an external electronic device through the first input / output path (610) within a given time (e.g., t1 (see FIG. 6)) after the matching circuit (450) is set to the first state. If there is a response within the given time, at operation 925, the electronic device (400) can perform the first leader mode. When the first leader mode is completed, the electronic device can perform again from operation 910.

[0106] If there is no response within a given time after the matching circuit (450) is set to the first state, in operation 930, the electronic device (400) can check the number of times the first state is set during one cycle (e.g., T (see FIG. 6)).

[0107] In operation 940, the electronic device (400) can check whether the number of times confirmed has reached a threshold (e.g., 3 times (see FIG. 6)).

[0108] If the threshold is not reached, at operation 950, the electronic device (400) may set the matching circuit (450) to the third state (see FIG. 6) and transmit the RF signal to the external electronic device via the second input / output path (620; see FIG. 6).

[0109] At operation 960, the electronic device (400) can check whether there is a response (RF signal) from the external electronic device through the second input / output path (6220) within a given time (e.g., t2 (see FIG. 6)) after the matching circuit (450) is set to the third state. If there is a response within the given time, at operation 965, the electronic device (400) can perform the second reader mode. When the second reader mode is completed, the electronic device can perform again from operation 910.

[0110] In operation 940, if the number of times the verification result is set reaches the threshold, in operation 970, the electronic device (400) can set the matching circuit (450) to the second state (see FIG. 6).

[0111] In operation 980, the electronic device (400) can determine whether an RF signal is received from an external electronic device through the first input / output path (610) and / or the second input / output path (620) within a given time after the matching circuit (450) is set to the second state. If an RF signal is received within the given time, the electronic device (400) can perform card mode in operation 985. If the performance of card mode is completed, the electronic device can perform operation 910 again.

[0112] If there is no response within a given time after the matching circuit (450) is set to the second state, the electronic device (400) can perform the operation again from operation 910.

[0113] While the embodiment of FIG. 9 described above performs the setting of the first state first, in one embodiment, the setting of the third state may be performed first. In this embodiment, operation 930 may be replaced with an operation for checking the number of times the third state is set during one cycle.

[0114] FIG. 10 is a diagram illustrating a detailed configuration of a matching circuit (450) in the electronic device (400) of FIG. 4. Referring to FIG. 10, the matching circuit (450) may include a first matching circuit (1010), a second matching circuit (1020), a third matching circuit (1030), a fourth matching circuit (1040), and a balun (1050). The configuration of the matching circuit (450) illustrated in FIG. 10 is merely an example. Therefore, the various embodiments of the present disclosure described with reference to FIGS. 1 to 9 are not limited to the configuration illustrated in FIG. 10.

[0115] Referring to FIG. 10, the second matching circuit (1020) may be configured to selectively match the impedance of the first wireless communication circuit (430) to the impedance of at least one antenna among the first antenna (410) and the second antenna (420). According to one embodiment, the control of the second matching circuit (1020) may be performed by the processor (499) (e.g., the AP (460)). According to one embodiment, the control of the second matching circuit (1020) may be performed by the first wireless communication circuit (430). According to one embodiment, the processor (499) may also control the selective impedance matching of the second matching circuit (1020) through the first wireless communication circuit (430).

[0116] According to one embodiment, the first matching circuit (1010) may have a fixed impedance value and may be positioned between the second matching circuit (1020) and the first wireless communication circuit (430). The third matching circuit (1030) may have a fixed impedance value and may be positioned between the second matching circuit (1020) and the first antenna (410). The fourth matching circuit (1040) may have a fixed impedance value and may be positioned between the second antenna (420) and the balun (1050). The balun (1050) may have a fixed impedance value and may be positioned between the second matching circuit (1020) and the fourth matching circuit (1040). The balun (1050) can convert a balance signal (RF signal) received from the first wireless communication circuit (430) through the second matching circuit (1020) into an unbalance signal and output the same to the second antenna (420) through the fourth matching circuit (1040). The balun (1050) can convert an unbalance signal (RF signal) received from the second antenna (420) through the fourth matching circuit (1040) into a balance signal and output the same to the first wireless communication circuit (430) through the second matching circuit (1020). According to one embodiment, the balun (1050) can be omitted from the matching circuit (450). Instead, the second antenna (420) can be formed as a loop antenna having two electrodes, like the first antenna (410), and can be connected to the second matching circuit (1020) through the fourth matching circuit (1040).

[0117] According to one embodiment, the second matching circuit (1020) may include one or more switches (1060) and one or more variable capacitors (1070). The processor (499) (or the first wireless communication circuit (430)) may set the matching circuit (450) to one of the first state, the second state, and the third state described above by changing a switching state of at least one of the one or more switches (1060) or adjusting a capacitance of at least one of the one or more variable capacitors (1070).

[0118] According to one embodiment, an electronic device (e.g., the electronic device (400) of FIG. 4) includes a first antenna; a second antenna; a wireless communication circuit configured to transmit and receive an RF signal in a frequency band designated to be used for NFC communication; a matching circuit (e.g., the matching circuit (450) of FIG. 4) configured to selectively match an impedance of the wireless communication circuit to an impedance of at least one of the first antenna and the second antenna; a processor (e.g., the processor (499) of FIG. 4); and a memory storing instructions. The instructions, when executed by the processor, may cause the electronic device to set an inductance (L) and a capacitance (C) of the matching circuit to a first optimized value such that maximum power is transferred from the wireless communication circuit to the first antenna. The instructions may cause the electronic device to output an RF signal from the wireless communication circuit to the matching circuit while the matching circuit is in a first state having the first optimized value. The command may cause the electronic device to set L and C of the matching circuit to a second optimal value so that power is delivered to both the first antenna and the second antenna in the wireless communication circuit based on the absence of a response from the external electronic device within a given first time period after the matching circuit is set to the first state. The command may cause the electronic device to maintain the matching circuit in a second state having the second optimal value for a given second time period.

[0119] The command may cause the electronic device to output an RF signal from the wireless communication circuit to the matching circuit based on receiving an RF signal from an external electronic device while the matching circuit is set to the second state. The command may cause the electronic device to change the matching circuit from the second state to the first state based on not receiving an RF signal from the external electronic device within the second time period.

[0120] The command may cause the electronic device to set L and C of the matching circuit to a third optimal value so that maximum power is transferred from the wireless communication circuit to the second antenna based on the absence of a response from the external electronic device within the first time period after the matching circuit is set to the first state, and to output an RF signal from the wireless communication circuit to the matching circuit while the matching circuit is in the third state having the third optimal value. The command may cause the electronic device to set the matching circuit to the second state based on the absence of a response from the external electronic device within the given third time period after the matching circuit is set to the third state.

[0121] The above command may cause the electronic device to output an RF signal from the wireless communication circuit to the matching circuit based on receiving an RF signal from an external electronic device while the matching circuit is set to the third state.

[0122] The electronic device may further include a second wireless communication circuit connected to the second antenna. The command may cause the electronic device to determine whether the second wireless communication circuit is performing wireless communication using the second antenna. The command may cause the electronic device to set the matching circuit to the third state based on the second wireless communication circuit not performing wireless communication.

[0123] The electronic device may further include a housing including a cover forming a front surface of the electronic device; a cover forming a rear surface of the electronic device; and a frame forming a side surface surrounding the front surface and the rear surface. The frame may include a conductor. The first antenna may include a coil disposed on the rear surface within the housing. The second antenna may include at least a portion of the conductor.

[0124] According to one embodiment, an electronic device (e.g., the electronic device (400) of FIG. 4) includes a first antenna; a second antenna; a wireless communication circuit configured to transmit and receive an RF signal in a frequency band designated to be used for NFC communication; a matching circuit (e.g., the matching circuit (450) of FIG. 4) configured to selectively match an impedance of the wireless communication circuit to an impedance of at least one of the first antenna and the second antenna; a processor (e.g., the processor (499) of FIG. 4); and a memory storing instructions. The instructions, when executed by the processor, may cause the electronic device to set L (inductance) and C (capacitance) of the matching circuit to a first optimized value so that maximum power is transferred from the wireless communication circuit to the first antenna. The instructions may cause the electronic device to output an RF signal from the wireless communication circuit to the matching circuit while the matching circuit is in a first state having the first optimized value. The instructions may cause the electronic device to set the matching circuit to the first state. The wireless communication circuit may set L and C of the matching circuit to a third optimal value so that maximum power is transferred to the second antenna based on the fact that there is no response from an external electronic device within a given time period after being set and the number of times the matching circuit is set to the first state during a given period is less than a threshold, and the wireless communication circuit may output an RF signal to the matching circuit while the matching circuit is in a third state having the third optimal value. The command may cause the electronic device to change the state of the matching circuit to the first state based on the fact that there is no response from an external electronic device within a given time period after the matching circuit is set to the third state.The command may cause the electronic device to set L and C of the matching circuit to a second optimal value so that power is delivered to both the first antenna and the second antenna in the wireless communication circuit based on the fact that there is no response from the external electronic device within a given time period after the matching circuit is set to the first state and the number of times the matching circuit is set to the first state during one cycle reaches a threshold. The command may cause the electronic device to change the state of the matching circuit to the first state based on the fact that no RF signal is received from the external electronic device within a given time period after the matching circuit is set to the second state having the second optimal value.

[0125] According to one embodiment, a method of operating an electronic device (e.g., electronic device (400) of FIG. 4) is provided. The electronic device includes a first antenna; a second antenna; a wireless communication circuit configured to transmit and receive an RF signal in a frequency band designated to be used for NFC communication; and a matching circuit configured to selectively match an impedance of the wireless communication circuit to an impedance of at least one of the first antenna and the second antenna. The method may include an operation of setting an inductance (L) and a capacitance (C) of the matching circuit to a first optimized value so that maximum power is transferred from the wireless communication circuit to the first antenna. The method may include an operation of outputting an RF signal from the wireless communication circuit to the matching circuit while the matching circuit is in a first state having the first optimized value. The method may include setting L and C of the matching circuit to a second optimal value so that power is delivered to both the first antenna and the second antenna in the wireless communication circuit based on the absence of a response from an external electronic device within a given first time period after the matching circuit is set to the first state. The method may include maintaining the matching circuit in a second state having the second optimal value for a given second time period.

[0126] The method may further include: outputting an RF signal from the wireless communication circuit to the matching circuit based on receiving an RF signal from an external electronic device while the matching circuit is set to the second state; and changing the matching circuit from the second state to the first state based on not receiving an RF signal from the external electronic device within the second time period.

[0127] The operation of setting L and C of the above matching circuit to the second optimal value may include: setting L and C of the above matching circuit to a third optimal value so that maximum power is transferred from the wireless communication circuit to the second antenna based on the absence of a response from an external electronic device within a given first time period after the above matching circuit is set to the first state; and outputting an RF signal from the wireless communication circuit to the above matching circuit while the above matching circuit is in a third state having the third optimal value; and the operation of setting the above matching circuit to the second state based on the absence of a response from an external electronic device within a given third time period after the above matching circuit is set to the third state.

[0128] The method may further include an operation of outputting an RF signal from the wireless communication circuit to the matching circuit based on an RF signal being received from an external electronic device while the matching circuit is set to the third state.

[0129] The electronic device may further include a second wireless communication circuit connected to the second antenna. The operation of setting the matching circuit to the third state may be performed based on the second wireless communication circuit not performing wireless communication.

[0130] In the above explanation, the prefixes “first,” “second,” and “third” are only used to distinguish between the same names and do not have any special meaning in themselves, such as importance or order.

[0131] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0132] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0133] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. In one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0134] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0135] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0136] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In electronic devices, 1st antenna; Second antenna; A wireless communication circuit configured to transmit and receive RF signals in a frequency band designated for use in NFC communication; A matching circuit configured to selectively match the impedance of the wireless communication circuit to the impedance of at least one of the first antenna and the second antenna; processor; and Contains memory that stores instructions, The above instructions, when executed by the processor, cause the electronic device to: In the wireless communication circuit, L (inductance) and C (capacitance) of the matching circuit are set to the first optimized value so that maximum power is transmitted to the first antenna, While the above matching circuit is in a first state having the first optimization value, the wireless communication circuit outputs an RF signal to the matching circuit, Based on the absence of a response from an external electronic device within a given first time after the matching circuit is set to the first state, L and C of the matching circuit are set to a second optimized value so that power is transmitted to both the first antenna and the second antenna in the wireless communication circuit, An electronic device that maintains the matching circuit in a second state having the second optimized value for a given second time period.

2. In the first paragraph, when the command is executed by the processor, the electronic device, Based on the RF signal received from the external electronic device while the above matching circuit is set to the second state, the wireless communication circuit outputs an RF signal to the above matching circuit, An electronic device that changes the matching circuit from the second state to the first state based on the fact that no RF signal is received from an external electronic device within the second time period.

3. In the first paragraph, when the command is executed by the processor, the electronic device, Based on the absence of a response from an external electronic device within the first time after the matching circuit is set to the first state, L and C of the matching circuit are set to a third optimized value so that maximum power is transferred from the wireless communication circuit to the second antenna, and while the matching circuit is in the third state having the third optimized value, an RF signal is output from the wireless communication circuit to the matching circuit. An electronic device that sets the matching circuit to the second state based on the absence of a response from an external electronic device within a given third time after the matching circuit is set to the third state.

4. In the third paragraph, when the command is executed by the processor, the electronic device, An electronic device that outputs an RF signal from the wireless communication circuit to the matching circuit based on the RF signal being received from an external electronic device while the matching circuit is set to the third state.

5. In the third paragraph, further comprising a second wireless communication circuit connected to the second antenna, wherein the command, when executed by the processor, causes the electronic device to: The second wireless communication circuit checks whether wireless communication is being performed using the second antenna, An electronic device that sets the matching circuit to the third state based on the fact that wireless communication is not being performed in the second wireless communication circuit.

6. In any one of paragraphs 1 to 5, Further comprising a housing including a cover forming the front side of the electronic device; a cover forming the back side of the electronic device; and a frame forming a side surface surrounding between the front side and the back side, The above frame includes a conductor, The first antenna includes a coil disposed at the rear surface inside the housing, An electronic device wherein the second antenna comprises at least a portion of the conductor.

7. In any one of paragraphs 1 to 5, The above processor is an electronic device including an application processor.

8. In electronic devices, 1st antenna; Second antenna; A wireless communication circuit configured to transmit and receive RF signals in a frequency band designated for use in NFC communication; A matching circuit configured to selectively match the impedance of the wireless communication circuit to the impedance of at least one of the first antenna and the second antenna; a processor; and Contains memory that stores instructions, The above instructions, when executed by the processor, cause the electronic device to: In the wireless communication circuit, L (inductance) and C (capacitance) of the matching circuit are set to the first optimized value so that maximum power is transmitted to the first antenna, While the above matching circuit is in a first state having the first optimization value, the wireless communication circuit outputs an RF signal to the matching circuit, Based on the fact that there is no response from an external electronic device within a given time after the matching circuit is set to the first state and the number of times the matching circuit is set to the first state during a given period is less than a threshold, L and C of the matching circuit are set to a third optimal value so that maximum power is transferred from the wireless communication circuit to the second antenna, and while the matching circuit is in a third state having the third optimal value, an RF signal is output from the wireless communication circuit to the matching circuit. After the matching circuit is set to the third state, based on the absence of a response from an external electronic device within a given time, the state of the matching circuit is changed to the first state, Based on the fact that there is no response from an external electronic device within a given time after the matching circuit is set to the first state and the number of times the matching circuit is set to the first state during one cycle reaches a threshold, L and C of the matching circuit are set to a second optimized value so that power is transmitted to both the first antenna and the second antenna in the wireless communication circuit, An electronic device that changes the state of the matching circuit to the first state based on the fact that no RF signal is received from an external electronic device within a given time after the matching circuit is set to the second state having the second optimization value.

9. In paragraph 8, Further comprising a housing including a cover forming the front side of the electronic device; a cover forming the back side of the electronic device; and a frame forming a side surface surrounding between the front side and the back side, The above frame includes a conductor, The first antenna includes a coil disposed at the rear surface inside the housing, An electronic device wherein the second antenna comprises at least a portion of the conductor.

10. In paragraph 8, The above processor is an electronic device including an application processor.

11. In a method of operating an electronic device, The electronic device comprises a first antenna; a second antenna; a wireless communication circuit configured to transmit and receive an RF signal of a frequency band designated to be used for NFC communication; and a matching circuit configured to selectively match an impedance of the wireless communication circuit to an impedance of at least one of the first antenna and the second antenna. An operation of setting L (inductance) and C (capacitance) of the matching circuit to a first optimized value so that maximum power is transmitted to the first antenna in the wireless communication circuit; An operation of outputting an RF signal from the wireless communication circuit to the matching circuit while the matching circuit is in a first state having the first optimization value; An operation of setting L and C of the matching circuit to a second optimized value so that power is transmitted to both the first antenna and the second antenna in the wireless communication circuit based on the absence of a response from an external electronic device within a given first time after the matching circuit is set to the first state; and A method comprising the action of maintaining the matching circuit in a second state having the second optimized value for a given second time period.

12. In paragraph 11, An operation of outputting an RF signal from the wireless communication circuit to the matching circuit based on the RF signal being received from an external electronic device while the matching circuit is set to the second state; and A method further comprising an operation of changing the matching circuit from the second state to the first state based on the fact that no RF signal is received from the external electronic device within the second time period.

13. In the 11th paragraph, the operation of setting L and C of the matching circuit to the second optimization value is as follows: An operation of setting L and C of the matching circuit to a third optimized value so that maximum power is transferred from the wireless communication circuit to the second antenna based on the absence of a response from an external electronic device within a given first time after the matching circuit is set to the first state, and outputting an RF signal from the wireless communication circuit to the matching circuit while the matching circuit is in a third state having the third optimized value; and A method comprising an action of setting the matching circuit to the second state based on the absence of a response from an external electronic device within a given third time after the matching circuit is set to the third state.

14. In paragraph 13, A method further comprising outputting an RF signal from the wireless communication circuit to the matching circuit based on an RF signal being received from an external electronic device while the matching circuit is set to the third state.

15. In the 13th paragraph, the electronic device further includes a second wireless communication circuit connected to the second antenna, A method in which the operation of setting the above matching circuit to the third state is performed based on the fact that wireless communication is not being performed in the second wireless communication circuit.

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