Photocurable adhesive composition, adhesive, member having adhesive, adhesive production method, cured body, member, and cured body production method

By using a photocurable pressure-sensitive adhesive composition with high (meth)acrylic monomers, a photoinitiator, and a thermal initiator, the curing issues of photocurable adhesives are addressed, enhancing their performance and suitability for electronic devices.

WO2026028958A1PCT designated stage Publication Date: 2026-02-05NITTO DENKO CORP
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Patent Information

Application Number
PCT/JP2025/026515
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-07-30
Filing Date
2025-07-25
Publication Date
2026-02-05

AI Technical Summary

Technical Problem

Photocurable pressure-sensitive adhesive compositions are prone to poor curing, which affects their performance and reliability in applications such as electronic devices.

Method used

Incorporating a monomer component M with a high content of (meth)acrylic monomers, a photoinitiator, and a thermal initiator, along with specific monomers like phenoxybenzyl acrylate, to enhance curing efficiency and stability.

Benefits of technology

The solution significantly reduces residual monomer content and improves the curing process, resulting in adhesives with improved brightness, chromaticity, and refractive index, suitable for optical applications.

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Abstract

A photocurable adhesive composition provided herein contains a monomer component M, a photoinitiator, and a thermal initiator. The photocurable adhesive composition is suitable for suppressing curing defects. The amount of a (meth)acrylic monomer in the monomer component M may be 50 wt% or more. The monomer component M may contain a monomer having a double bond–containing ring. The photocurable adhesive composition may further contain a colorant.
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Citation Information

Patent Citations

  • Production of solvent-based acrylic pressure-sensitive adhesive

    JP1992220485A

  • Production of pressure-sensitive adhesive tape

    JP1994256735A

  • Optical use adhesive resin composition

    JP2012046673A

  • Adhesive sheet and display body

    JP2020007500A

  • Adhesive sheet and method for producing the same, and method for producing laminate

    JP2022143329A