Housing structure and electronic device including same

Abstract

A housing of an electronic device according to various embodiments may comprise: a body; a vapor chamber disposed in a first area of the body; a plurality of first fins connected to one surface of the vapor chamber; a plurality of second fins disposed in a second area of the body; and a rear cover connected to the first fins and the body. The rear cover may be connected to the main body to form a space in which the plurality of second fins are located, and a first inner space formed in the vapor chamber, second inner spaces formed in the first fins, and third inner spaces formed in the rear cover may be connected to each other to form a sealed space.

Description

Housing structure and electronic device including the same

[0001] The present disclosure relates to a housing structure for heat dissipation and an electronic device including the same.

[0002] The housing of a network communication device protects the printed board assembly (PBA) and the electronic components mounted on the PBA from the external environment. To dissipate heat generated within the housing to the outside air during operation of the communication device, the housing may have a large surface area and include heat sink fins. The electronic components mounted on the PBA contact the underside of the housing, and the heat generated by the electronic components during network device operation can be dissipated to the outside air through the underside of the housing and the heat sink fins.

[0003] As mobile data traffic surges, the need for mobile network construction grows, leading to a growing demand for lightweight network equipment. Typically, the housing of network equipment accounts for more than half of the total weight of the equipment. Therefore, reducing the weight of the housing can reduce manufacturing, transportation, and operating costs.

[0004] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art in connection with the present disclosure.

[0005] In one embodiment, a housing of an electronic device according to one embodiment may include a body; a vapor chamber disposed in a first region of the body; a plurality of first fins connected to one surface of the vapor chamber; a plurality of second fins disposed in a second region of the body; and a rear cover connected to the first fins and the body. The rear cover may be connected to the body to form a space in which the plurality of second fins are located, and a first internal space formed in the vapor chamber, second internal spaces formed in the first fins, and third internal spaces formed in the rear cover may be connected to form a sealed space.

[0006] An electronic device according to one embodiment may include a housing; and a printed board assembly (PBA) on which high-heat electronic components and low-heat electronic components are mounted. The high-heat electronic components and the low-heat electronic components may be in contact with the housing. The electronic device may include a body; a vapor chamber disposed in a first region of the body; a plurality of first fins connected to one surface of the vapor chamber; a plurality of second fins disposed in a second region of the body; and a rear cover connected to the first fins and the body. The rear cover may be connected to the body to form a space in which the plurality of second fins are located, and a first internal space formed in the vapor chamber, second internal spaces formed in the first fins, and a third internal space formed in the rear cover may be connected to form a sealed space.

[0007] Figure 1 illustrates network communication equipment according to one embodiment.

[0008] FIG. 2 is a drawing for explaining the concept of a rear cover (back cover) in a housing of network communication equipment according to one embodiment.

[0009] FIG. 3 illustrates a housing including a rear cover according to one embodiment.

[0010] Figure 4 illustrates a housing of network equipment according to one embodiment.

[0011] Figure 5 illustrates a rear cover according to one embodiment.

[0012] Figure 6 is an enlarged view of a rear cover according to one embodiment.

[0013] Figure 7 is a cross-sectional view of a first region of a housing according to one embodiment.

[0014] FIG. 8 illustrates a process of connecting a vapor chamber, a first pin, and a rear cover of a housing according to one embodiment.

[0015] Figure 9 illustrates a rear cover according to one embodiment.

[0016] Figure 10 illustrates a rear cover according to one embodiment.

[0017] Fig. 11 illustrates a rear cover according to one embodiment.

[0018] Fig. 12 is an enlarged view of a rear cover according to one embodiment. Fig. 13 illustrates a connecting tube according to one embodiment.

[0019] Figure 13 illustrates a connecting tube according to one embodiment.

[0020] Figure 14 illustrates a rear cover according to one embodiment.

[0021] Figure 15 illustrates a process for manufacturing a first pin according to one embodiment.

[0022] FIG. 16 illustrates a housing including a rear cover according to one embodiment.

[0023] Fig. 17 is a cross-sectional view of an opening formed in a housing according to one embodiment.

[0024] FIG. 18 illustrates a housing including a rear cover according to one embodiment.

[0025] FIG. 19 illustrates a housing including a rear cover according to one embodiment.

[0026] FIG. 20 illustrates a housing of a network device including a rear cover according to one embodiment.

[0027] FIG. 21 illustrates a housing including a rear cover according to one embodiment.

[0028] FIG. 22 illustrates a housing including a rear cover according to one embodiment.

[0029] FIG. 23 illustrates a functional configuration of an electronic device according to one embodiment of the present disclosure.

[0030] Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings so that those skilled in the art can easily implement the present invention. However, the disclosed embodiments may be implemented in various different forms and are not limited to the embodiments described herein.

[0031] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0032] According to various embodiments, each of the components described above may include one or more entities, and some of the entities may be separately arranged in other components. According to various embodiments, one or more of the components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, the plurality of components may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components in a manner identical to or similar to that performed by the corresponding component among the plurality of components prior to the integration.

[0033] Below, each drawing is intended to illustrate an example of the configuration of a housing according to one embodiment. The housing may be configured by omitting some of the components illustrated in each drawing or replacing them with other components. The housing may also include other components in addition to the illustrated components.

[0034] Figure 1 illustrates network communication equipment according to one embodiment.

[0035] The housing structure for heat dissipation disclosed in this document can be applied to various types of electronic devices. For example, the electronic devices may include network communication equipment, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. The electronic devices according to the embodiments of this document are not limited to the aforementioned devices. In order to explain the housing structure for heat dissipation in this disclosure, network communication equipment may be used as an example, as shown in FIG. 1.

[0036] Referring to FIG. 1, the network communication equipment may include a cover (110), an antenna module (120), a PBA (printed board assembly), and a housing (130). At least a portion of the cover (110) may be formed of plastic to allow radiated antenna signals to penetrate the cover. The antenna module (120) may include an antenna radome for protecting the antenna and its operation. The PBA has electronic components mounted thereon, and the electronic components mounted on the PBA may generate heat during operation. The housing (130) may include a shielding structure for protecting the PBA embedded in the network communication equipment and simultaneously blocking electromagnetic waves generated from the PBA from leaking to the outside. In addition, the housing (130) may include a heat sink structure for dissipating heat generated from the PBA to the outside. Since most of the weight of the network communication equipment is occupied by the weight of the embedded housing, the weight of the entire network communication equipment can be reduced by reducing the weight of the housing (130). The network communication equipment of the present disclosure may include a lightweight housing with improved heat dissipation performance.

[0037] FIG. 2 is a drawing for explaining the concept of a rear cover in a housing of network communication equipment according to one embodiment.

[0038] A housing of a network communication device may include a main body, heat dissipation fins arranged on the main body, and a rear cover. The rear cover may be coupled to the housing main body to partition the exterior and interior of the housing, and heat dissipation fins may be positioned on the interior of the housing. The rear cover may prevent the heat dissipation fins arranged on the housing from detaching from the housing main body.

[0039] When network communication equipment operates, the air surrounding the heat sink fins can become heated by the heat radiated by the fins. To prevent overheating, a continuous supply of fresh air is required around the fins. Conventional rear covers trap the air surrounding the fins within the housing, potentially hindering convection of the heated air and the fins' heat dissipation performance.

[0040] In addition, various conventional methods (e.g., laser bonding method, bonding method, etc.) used to bond the rear cover to the main body of the housing also had the problem of increasing the interface thermal resistance and reducing the heat dissipation performance.

[0041] FIG. 3 illustrates a housing including a rear cover according to one embodiment.

[0042] The housing (300) may include a housing body (310) and a rear cover (350). The housing (300) may protect a printed board assembly (PBA) and electronic components mounted on the PBA from the external environment. The housing body (310) may receive heat through a contact surface with the electronic components of the PBA and radiate the received heat into the air. In order for the heat generated by the operation of the electronic components to be discharged to the external environment through the housing body (310), the housing (300) may further include a heat sink structure such as a heat dissipation fin and a refrigerant circulation type heat conductor such as a vapor chamber. The vapor chamber and the heat dissipation fin increase the heat dissipation area, thereby improving heat dissipation performance.

[0043] The more fins included in the housing, the greater the heat dissipation surface area, but at the same time, the closer the fins may be to each other. A narrower fin spacing can inhibit convection in the space between the fins, and air heated by the fins can stagnate around the fins. To improve the heat dissipation performance of the housing, it is necessary to determine the optimal number by considering the trade-off between increasing the fin surface area and decreasing the fin spacing. Furthermore, a larger fin surface area (e.g., a larger number of fins or a larger area per fin) increases the weight of the housing and the electronic device. Therefore, the number of fins can be limited to achieve optimal heat dissipation performance while satisfying given requirements, such as a balance between the heat dissipation surface area and the convection space, and the weight of the housing.

[0044] The present disclosure proposes a method for improving the heat dissipation performance of a housing without increasing the number of heat dissipation fins or the weight of network equipment. Specifically, the present disclosure proposes a housing that extends the concept of a conventional refrigerant-circulating heat conductor and applies the heat dissipation fins and rear cover. According to one embodiment, the heat dissipation fins and rear cover include a space for containing a refrigerant fluid therein, thereby dramatically increasing the heat dissipation area without increasing the number of heat dissipation fins.

[0045] Additionally, according to one embodiment, the housing may be provided with openings to generate draft power or a cooling effect by a chimney effect. When the network equipment is in operation, the temperature inside the housing (300) gradually increases. As the temperature of the air inside the housing (300) increases, the density of the internal air decreases. Draft power is generated depending on the temperature and air pressure difference between the inside and outside of the housing (300).

[0046] The air heated by the heat dissipation fins inside the housing (300) has a low density and can move (i.e., rise) to the upper part of the main body (310). As the air rises, a pressure difference is formed inside the main body (310), causing convection to occur, causing the air at a lower level to move upward.

[0047] As shown in Fig. 3, openings for air flow may be formed in the upper and lower portions of the housing (300) or the rear cover (350). Heated air inside the housing (300) may rise and then be discharged to the outside of the housing through the openings formed in the upper portion of the housing (300). As the air moves to the outside through the openings in the upper portion, the air pressure inside the upper portion may further decrease, so that the upward flow may be strengthened to fill the void left by the upper portion. As the internal air pressure in the lower portion of the housing decreases, relatively cold and high-pressure air outside the openings in the lower portion and / or the rear cover (350) may be introduced into the inside of the housing (300). The discharge of internal air through the openings in the upper portion and the introduction of external air through the openings in the lower portion and / or the rear cover (350) may chain-reinforce each other. In addition, the discharge of internal air through the opening reduces the air pressure at the upper part of the housing (300), and the inflow of external air through the opening increases the air pressure at the lower part of the housing (300), thereby strengthening the upward flow.

[0048] Since cold outside air flows into the interior of the housing (300) through the openings formed in the lower portion of the housing (300) and / or the rear cover (350), the openings in the lower portion and / or the rear cover (350) may be referred to as intake ports. The openings in the upper portion may be referred to as exhaust ports since they serve as passages through which the inside air is discharged to the outside.

[0049] The housing including the rear cover of the present disclosure may be spherical in various different shapes and is not limited to the rear cover described in FIG. 3. For example, a rear cover without an opening and a rear cover having an opening formed only in the upper area of ​​the network device are described below.

[0050] Figure 4 illustrates a housing of network equipment according to one embodiment.

[0051] According to FIG. 4, the housing may include a main body, a vapor chamber, heat dissipation fins, and a rear cover. The housing may be referred to as a body because it protects the built-in electronic components, or as a heat sink because it performs the heat dissipation function of the built-in electronic components.

[0052] The degree of heat generation of electronic components used in network communication equipment varies depending on the electronic component. An electronic component with a high heat generation or a region on a PBA where such electronic component is placed may be referred to as a "high heat generation region." An area of ​​a housing or housing body that contacts a high heat generation region, receives heat from it, and radiates it may be referred to as a first region or a region corresponding to the high heat generation region. An electronic component with a low heat generation compared to the high heat generation region or a region on a PBA where such electronic component is placed may be referred to as a "low heat generation region." An area of ​​a housing or housing body that contacts a low heat generation region, receives heat from it, and radiates it may be referred to as a second region that is distinct from the first region. The second region may be referred to as a low heat generation region.

[0053] A housing according to one embodiment can dramatically increase its heat dissipation area by applying a novel refrigerant circulation heat conductor. Referring to FIG. 4, the novel refrigerant circulation heat conductor can include a vapor chamber, a plurality of heat dissipation fins coupled to the vapor chamber, and a rear cover coupled to the heat dissipation fins.

[0054] In the present disclosure, the heat dissipation fin may include a first fin and a second fin. The first fin and the second fin may differ in their structure, material, or heat dissipation performance. For example, the first fin may have an internal space (or chamber) formed therein that can accommodate a refrigerant fluid, so that the heat dissipation performance of the first fin may be superior to that of the second fin. The novel refrigerant circulation heat conductor may include the first fin. Unlike the first fin, the second fin may include a typical heat dissipation fin that does not include a chamber therein.

[0055] As shown in Fig. 4, in the novel refrigerant circulation heat conductor, the first fin is connected to the vapor chamber and the rear cover, the internal space of the vapor chamber is connected to the internal space of the first fin, and the internal space of the first fin can be connected to the internal space of the rear cover. Accordingly, the refrigerant fluid of the vapor chamber can move not only to the internal space of the vapor chamber, but also to the internal space of the chamber of the first fin and the internal space of the rear cover.

[0056] When an electronic component in contact with the vapor chamber generates heat, heat is conducted to the contact area of ​​the vapor chamber and can be transferred to a refrigerant fluid in the internal space of the vapor chamber. The heated fluid can disperse in the internal space of the vapor chamber and move to the internal space of the first fin, and the thermal energy can be transferred to the air around the first fin through the first fin. Furthermore, the fluid that is not cooled by the first fin can move to the internal space of the rear cover, and the remaining thermal energy can be transferred to the air around the rear cover through the rear cover.

[0057] When the rear cover is added, the air heated by the heat dissipation fins arranged in the first and second regions of the housing is at least temporarily trapped in the internal space of the housing formed by the rear cover. First, the rear cover can be coupled with the main body of the housing to cover the heat dissipation fins. For example, when the rear cover is connected to the heat dissipation fins arranged in the first region in FIG. 4, the rear cover can cover the heat dissipation fins in the second region. By connecting the rear cover to the heat dissipation fins formed in the first region of the main body, a space distinct from the exterior of the housing can be formed. In addition, when the housing of FIG. 4 is actually mounted on a network communication device and functions, the first side is located at the top of the network device, so the upward flow inside the housing moves toward the first side. And, if there is no other factor, the upward flow inside the housing moves in a direction opposite to gravity. In the case of Fig. 4, air heated by the heat dissipation fins arranged in the first region can rise through the internal space of the housing formed by the rear cover.

[0058] However, in the new refrigerant circulation heat conductor, since the rear cover forms an internal space capable of accommodating a fluid, even if heated air inside the housing is temporarily trapped due to the presence of the rear cover, the heat dissipation performance may not be reduced. For example, the internal space of the rear cover may be formed by joining metal plates with at least a portion of the metal plates. The internal space of the rear cover may be connected to the internal space of the first fin. The refrigerant fluid may move from the internal space of the rear cover to the internal space of the first fin and from the internal space of the first fin to the internal space of the rear cover through a connecting portion connecting the internal space of the rear cover and the internal space of the first fin. In addition, the internal space of the first fin may be connected to the internal space of the vapor, and the vapor chamber-first fin-rear cover may form a single sealed chamber. When heat is generated from an electronic component in contact with a portion of the vapor chamber, the fluid that has received the heat energy may move to the rear cover via the chamber of the first fin. Thermal energy is distributed through the vapor chamber to a plurality of first fins, and some of the distributed thermal energy can move from the first fins to the air around the first fins, and another part of the distributed thermal energy can move from the rear cover to the air around the rear cover through the first fins.

[0059] Additionally, according to one embodiment, an opening may be formed in the housing or rear cover to generate a cooling effect within the housing. To this end, an opening for exhaust may be formed in the upper portion of the housing, and an opening for intake may be formed in the rear cover and / or lower portion of the housing.

[0060] In a housing according to one embodiment, a new refrigerant circulation type heat conductor is selectively arranged in a high heat generation area (e.g., the first area of ​​FIG. 4) and a general aluminum heat dissipation fin is used in a low heat generation area (e.g., the second area of ​​FIG. 4), thereby achieving goals such as process efficiency, weight reduction, and improved heat dissipation performance. For example, at least one of a plurality of heat dissipation fins arranged (or formed) in the first area may be a first fin. A vapor chamber may not be arranged in the second area. At least one of a plurality of heat dissipation fins arranged (or formed) in the second area of ​​the main body may be a second fin. According to one embodiment, since the first area corresponds to a high heat generation area, more first fins having better heat dissipation performance may be arranged in the first area than the second fins.

[0061] In summary, a housing according to one embodiment may include a vapor chamber disposed in a first region, a plurality of first fins disposed in the first region and connected to the vapor chamber, and a rear cover connected to the first fins. The vapor chamber may distribute thermal energy absorbed from the first region (e.g., a high-heat area) to the plurality of first fins. The plurality of first fins and the rear cover may radiate heat into the surrounding air.

[0062] Fig. 5 illustrates a rear cover according to one embodiment. Fig. 6 is an enlarged view of a rear cover according to one embodiment. Fig. 7 is a cross-sectional view of a first region of a housing according to one embodiment. For convenience, a case in which a plurality of first pins (530) are arranged in the first region of the housing body (510) is described. Fig. 7 illustrates a cross-sectional view of the body (510), the first pins (530), and the rear cover (550) when cut along the boundary line (650) of Fig. 6.

[0063] According to one embodiment, the rear cover and the first pin may be directly connected. At this time, the portion of the first pin that is directly connected to the rear cover may be referred to as the first surface. When at least a portion of the first surface and the rear cover are connected, the rear cover (550) may cover the first pin (530), as shown in FIGS. 5 and 6 . Referring to FIG. 7 , by performing a metal bonding process while assembling the first pin to the rear cover, the rear cover and the first pin may be directly connected.

[0064] In the present disclosure, the metal plates and connecting tubes constituting the rear cover, the first fin, and the vapor chamber can be manufactured through a process that does not create micropores (e.g., a forging process). Therefore, even when the components are assembled and a metal bonding process (e.g., a brazing process) is performed, the plates are not deformed, and fluid leakage through the internal micropores is prevented. Furthermore, since the components are joined through a brazing process, the problem of increased interfacial thermal resistance is improved, and thus the problem of reduced heat dissipation performance due to increased interfacial thermal resistance is also improved.

[0065] Referring to FIG. 7, an electronic component (777) is placed on a PBA, a vapor chamber is placed on the electronic component (777), and a plurality of first fins can be connected to the vapor chamber. A rear cover can be connected to a first surface of the first fin. The electronic component (777) can be an electronic component that generates a lot of heat. An internal space (710) formed in the vapor chamber, internal spaces (720) formed in the first fins, and internal spaces (730) formed in the rear cover can be connected to form a sealed space. The sealed space can accommodate a refrigerant fluid. By connecting the first fins and the rear cover to the vapor chamber, the sealed space in which the refrigerant fluid can move can be expanded, and the heat dissipation area can be expanded.

[0066] When network communication equipment operates and heat is generated from electronic components, the heat is transferred to the vapor chamber in contact with the electronic components. The heat concentrated in the area where the electronic components and the vapor chamber come into contact is transferred to the fluid within the vapor chamber, and the heated fluid can disperse the heat by undergoing a phase change (e.g., vaporization) and dispersing throughout the internal space (710) of the vapor chamber. Furthermore, the phase-changed fluid can move through the internal space (710) of the vapor chamber, the internal spaces (720) of the first fins, and the internal spaces (730) of the rear cover.

[0067] Thermally conductive materials (e.g., thermal interface materials, TIM) may be used at the interface between electronic components and the vapor chamber to reduce thermal resistance.

[0068] When at least a portion of the first surface of the first fin and the rear cover are directly connected, the rear cover can cover at least a portion of the first fin. Referring to Fig. 6, the rear cover covers the first fins. The rear cover can also cover the heat dissipation fins arranged in the second region. The rear cover can prevent the heat dissipation fins covered by the rear cover from being separated from the housing body. In Figs. 5 to 7, the rear cover is connected to the heat dissipation fins of the first region and is spaced apart from the heat dissipation fins of the second region. When the network device is in operation, the air in the space covered by the rear cover can be heated by the heat dissipation fins arranged in the first fin and the second region. The heated, low-density air can move in a direction opposite to gravity (i.e., toward the top of the housing) in the space covered by the rear cover. The heated air, which has moved in a direction opposite to gravity inside the housing, can move to the outside of the housing through an opening formed in the top of the housing. The opening can be referred to as an exhaust port. At least one opening may be formed in the lower portion of the housing to allow relatively cold and heavy outside air to flow into the interior of the housing. The lower portion of the housing includes the portion positioned downward when the network communication equipment is in operation.

[0069] Referring to FIG. 6, one or more openings may be formed in at least a portion of the rear cover, and external air may also be introduced into the interior of the housing through the openings formed in the rear cover. According to one embodiment, the openings may be formed in at least a portion of the rear cover. For example, an opening may be formed in the lower portion of the rear cover corresponding to the first portion in FIG. 5. In this case, cold air may be introduced from the outside of the housing into the interior of the housing (i.e., the space of the second portion where the heat dissipation fins are arranged) through the openings formed in the rear cover. The introduction of cold air into the first portion of the housing may strengthen an upward flow within the housing.

[0070] As another example, an opening may be formed in the upper portion of the rear cover corresponding to the third region in FIG. 4. Air surrounding the first fins, heated by heat radiated from the first fins in the first region (i.e., the region corresponding to the high-heat generation portion), may move (i.e., rise) in a direction opposite to gravity. The rising air may be discharged to the outside of the housing through the opening formed in the upper portion of the rear cover.

[0071] FIGS. 5 and 6 are provided to explain examples of the configuration of the housing. The housing may be configured by omitting some of the components illustrated in FIG. 5 or replacing them with other components. The housing may further include other components in addition to the components illustrated in FIG. 5. For example, the main body of the housing may be extended further than in FIG. 5 and connected to the rear cover. When the main body of the housing and the rear cover are connected, the inside and the outside of the housing may be isolated. An opening may be formed in the housing that penetrates the inside and the outside of the housing. Cool air may be introduced from the outside of the housing into the inside of the housing (i.e., the space of the second region where the heat dissipation fins are arranged) through the opening formed in the lower part of the housing. It may be discharged to the outside of the housing through the opening formed in the upper part of the housing. However, the present invention is not limited thereto.

[0072] FIG. 8 illustrates a process for connecting a vapor chamber, a first fin, and a rear cover of a housing according to one embodiment. The internal space formed in the vapor chamber, the internal spaces formed in the first fins, and the internal spaces formed in the rear cover may be interconnected. Each of the vapor chamber, the first fin, and the rear cover may be manufactured by combining two plates to form an internal space.

[0073] As shown in Fig. 8, the plates constituting the vapor chamber may be referred to as a base (810) and a top cover (820), respectively. The base (810) and the top cover (820) may be combined to form an internal space of the vapor chamber. As shown in Fig. 8, a plurality of support members (812) may be further formed on the base (810) to be combined with the top cover to strengthen the combination between the base and the top cover.

[0074] In order to connect the internal space of the vapor chamber and the internal spaces of the first fins to each other, an opening through which the internal space of the vapor chamber communicates with the outside may be connected to an opening through which the internal space of the first fin communicates with the outside. As shown in Fig. 8, when manufacturing the vapor chamber, a slit (822) may be formed in the top cover (820) constituting the vapor chamber. In addition, when manufacturing the first fin, an opening may be formed on the third surface (832) of the first fin to communicate the internal space of the first fin with the outside.

[0075] Likewise, in order to connect the internal spaces of the first pins and the internal spaces of the rear cover to each other, an opening through which the internal space of the first pin communicates with the outside can be connected to an opening through which the internal spaces of the rear cover communicate with the outside.

[0076] The vapor chamber, the first fin, and the rear cover may be formed of a metal material. Referring to FIG. 8, the base (810), the top cover (820), the first fin (830), and the rear cover (850) may be formed of a metal plate. Since each component is formed of a metal material, a metal material bonding process (e.g., welding, brazing, or soldering) may be used to form a bonding structure of the vapor chamber, the first fin, and the rear cover. By performing the bonding process while the base (810) and the top cover (820) are placed over each other, the base and the top cover are bonded, thereby producing a vapor chamber. In addition, by performing the bonding process while the first pins are inserted into the slits (822) so that the slits (822) of the top cover (820) and the openings of the third surface (832) of the first pins (830) are in communication with each other, the vapor chamber and the first pins can be connected, and the internal space of the vapor chamber and the internal spaces of the first pins can be connected. By performing the bonding process while the first pins are inserted into the slits (855) so that the openings of the first surface (831) of the first pins (830) and the slits (855) of the rear cover are in communication with each other, the first pins and the rear cover can be connected, and the internal spaces of the first pins and the internal spaces of the rear cover can be connected.

[0077] The metal plates constituting the base (810), the top cover (820), the first fin (830), and the rear cover (850) do not contain micropores, and therefore do not deform during the bonding process. To this end, the metal plates constituting the base (810), the top cover (820), the first fin (830), and the rear cover (850) can be formed using a method that does not create micropores. For example, a method that does not create micropores may include forging or high-density die casting (HDDC). However, this is merely an example and does not limit the present disclosure. The forging process may refer to a process of heating solid metal, applying high pressure while fixing it in a die, and forming the metal. In addition, the forging process is faster than the die casting process, and provides higher rigidity and uniformity.

[0078] Since the metal plates constituting the base (810), top cover (820), first pin (830), and rear cover 50) are not deformed even during the bonding process, each component can be joined by heating after assembling each.

[0079] Referring to FIG. 8, the base (810) includes a step structure (814), and a top cover is placed on a high portion of the step structure, and this high portion can be joined to the top cover through a bonding process. The space surrounded by the low portion of the step structure of the base (810) and the top cover (820) can form an internal space of a vapor chamber.

[0080] A support member (812) may be further included in a low-step portion of the base (810) to maintain the structure of the vapor chamber. When the refrigerant fluid vaporizes, its volume suddenly increases and vapor pressure is generated, which may increase the internal pressure of the vapor chamber. The internal pressure of the vapor chamber may act in a direction to separate the base and the top cover constituting the vapor chamber from each other. Since the support member (812) connects the base (810) and the top cover (820), the bonding force between the base and the top cover may increase as the support member is added. Therefore, the support member may support the bonding between the base and the top cover to maintain the structure of the vapor chamber. The support member (812) may also be referred to as a boss or a filler.

[0081] When a top cover (820) is placed on a base (810) on which a support member (812) is formed, the upper end of the support member (812) can be in contact with the top cover. When the base and the top cover are heated while the support member (812) and the top cover are in contact, a bond between the support member and the top cover (820) can be formed. The height of the support member (812) should be adjusted so that when the top cover (820) is placed on the base (410), the upper end of the support member (412) is in contact with the top cover (820).

[0082] The support member can form a bond between the base and the top cover when the base, top cover, first pins, and rear cover are joined together through a brazing process. For example, when forming the base through forging, the base including the support member can be formed. Alternatively, the support member can be formed separately from the base. In this case, the support member can be joined to the base and top cover by brazing while covering the base and top cover and placing the support member therebetween.

[0083] By joining the base and the top cover positioned over the base through a brazing process, a housing with an internal space can be obtained. When the vapor chamber receives heat from a heat source, the fluid undergoes a phase change, increasing the internal pressure (i.e., vapor pressure) of the vapor chamber. The support connecting the base and the top cover can provide a force to resist the internal pressure of the pocket formed by the base and the top cover when the internal pressure increases.

[0084] As the number of supports increases, more supports can resist the pressure inside the pocket, and the allowable vapor pressure within the vapor chamber also increases, so the durability of the vapor chamber can be improved.

[0085] The support member not only resists pocket pressure but can also transfer heat between the base and the top cover. The support member comprises metal and is incorporated into the base through a metal forming method such as forging, or is joined to the top cover and / or the base through a metal joining method such as brazing, so that the support member can be connected to the base and the top cover through a metal bond. Since the support member is connected to the base and the top cover through a metal bond, heat transferred from the base can be transferred to the top cover.

[0086] The greater the number of supports, the more supports can transfer heat from the base to the top cover, thus improving the thermal conductivity of the housing.

[0087] The support can also facilitate the vaporization and movement of the fluid within the pocket by preventing the fluid from pooling within the pocket. For example, the surface of the support can be treated to disperse the fluid. Because the surface-treated support disperses the fluid, it can evaporate more quickly than if the fluid were pooled in one location, even under the same heat.

[0088] Referring to Fig. 4, a slot may be formed in the top cover for inserting a first pin. When a joining process such as brazing is performed with the first pin inserted into the top cover, the portion where the top cover and the first pin come into contact may be joined. The slit formed in the top cover prevents the pocket of the first pin from being closed during the brazing process, thereby forming a three-dimensional vapor chamber.

[0089] Since the top cover has a slot formed therein, it is preferable that the support be joined to the top cover rib portion where the slot is not formed. Accordingly, the top cover rib portion is positioned on the top of the support portion so that the top of the support portion can be in contact with the top cover rib portion.

[0090] Additionally, the second fin may include an aluminum metal plate. The second fin may include a heat sink fin formed using a die-casting method. The heat sink fin may be manufactured using an aluminum die-casting method. When an aluminum die-casting method is used, the heat sink fin is prone to deformation or breakage during the process of releasing the fin from the mold. To prevent the heat sink fin from being released poorly, a mold having a sloped cross-section (or draft gradient) may be used. Due to the draft gradient, the lower portion of the heat sink fin may be formed thicker and heavier than the upper portion. The second fin may be formed integrally with the main body of the housing using a die-casting method. When forming using a die-casting method, the molding of the second fin and the main body is simple, but the draft gradient of the second fin narrows the space between the fins, which may weaken convection between the second fins (especially the lower portion). In addition, the thick lower portion may increase the weight of the entire housing. The second fin may use a heat sink fin of a different shape in addition to the shape described.

[0091] Fig. 9 illustrates a rear cover according to one embodiment. Fig. 10 illustrates a rear cover according to one embodiment.

[0092] In FIGS. 9 and 10, one surface of the first pin where the connection portion of the rear cover (950 or 1050) and the first pin (930 or 1030) is formed may be referred to as the second surface (1032) of the first pin. At this time, at least a portion of the second surface (1032) and the rear cover are connected.

[0093] Referring to FIG. 10, the vapor chamber (1005) may be placed in the first region (or the region corresponding to the high-heat generation part). The PBA and electronic components mounted on the PBA may be placed below the vapor chamber (1005). A plurality of first pins (1030a, 1030b, 1030c, 1030d, 1030e, 1030f, 1030g) may be connected to the vapor chamber (1005), and the internal space of the vapor chamber (1005) and the internal spaces of the first pins (1030a to 1030g) may also be connected. At least a portion of the second surface (1032) of the first pin (1030a) and the rear cover (1050) can be connected, and the internal spaces of the first pins (1030a to 1030g) and the internal spaces of the rear cover (1050) can also be connected.

[0094] According to one embodiment, a housing may include a plurality of connecting pipes connecting the internal spaces of the first fins and the internal spaces of the rear cover. Referring to FIG. 10, a connecting pipe (1040) may be connected to at least a portion of a second surface (1032) of the first fin (1030a). The connecting pipe (1040) is connected to the rear cover (1050). The internal space formed in the vapor chamber (1005), the internal spaces formed in the first fins (1030a to 1030g), the connecting pipes, and the internal spaces formed in the rear cover (1050) may be connected to form a sealed space. The sealed space may contain a refrigerant fluid.

[0095] By connecting the first fins and the rear cover to the vapor chamber, the sealed space in which the refrigerant fluid can flow can be expanded, and the heat dissipation area can be expanded. When the network communication equipment operates and heat is generated from the electronic components, the heat is transferred to the vapor chamber in contact with the electronic components. The heated fluid can be distributed between the internal space of the vapor chamber and the internal spaces of the first fins. The heated fluid can move from the internal space of the first fin to the internal space of the rear cover through the connecting pipe. The fluid cooled in the internal space of the first fin can move back to the vapor chamber. The fluid cooled in the internal space of the rear cover can move back to the first fin.

[0096] The number of connecting tubes can be adjusted considering the weight of the connecting tube and the complexity of the process. For example, a connecting tube (1040a) can be connected to a first pin (1030a) included in the housing, thereby connecting the first pin (1030a) and the rear cover (1050). For example, a connecting tube can be connected to at least one of the first pins included in the housing, and some of the other first pins can be directly connected to the rear cover, as shown in FIGS. 5 to 7 .

[0097] According to one embodiment, a plurality of connecting tubes may be connected to a single first pin. Referring to FIG. 10, a first connecting tube (1041a) and a second connecting tube (1042a) are connected to a first pin (1030a), and the first pin (1030a) may be connected to an internal space of a rear cover (1050) by the first connecting tube (1041a) and the second connecting tube (1042a).

[0098] The connecting tube may be composed of a metal material. As in Fig. 8, where the bonding process was performed while the individual metal plates were assembled, in Fig. 10, the housing may be manufactured by performing the bonding process while the connecting tube is assembled together with other metal plates.

[0099] Fig. 11 illustrates a rear cover according to one embodiment. Fig. 12 is an enlarged view of a rear cover according to one embodiment. Fig. 13 illustrates a connecting tube according to one embodiment.

[0100] Referring to FIGS. 11 and 12, the rear cover (1150) may be composed of a plurality of metal plates (1250a, 1250b, 1250c, ..., 1250n). An internal space (or chamber) capable of accommodating a fluid may be formed inside the metal plates (1250). In FIGS. 11 and 12, the internal spaces of the rear cover may include the internal spaces of the metal plates (1250a, 1250b, 1250c, ..., 1250n).

[0101] As shown in FIGS. 9 and 10, the first fin (1130 or 1330) and the rear cover (11050) in FIGS. 11 to 14 may be connected through a connecting tube (1140 or 1340). Referring to FIG. 13, one end of the connecting tube (1340) may be connected to at least a portion of the second surface (1332) of the first fin (1330), and the other end of the connecting tube (1340) may be connected to a metal plate (1350). The internal space of the first fin (1330) and the internal space of the metal plate (1350) may be connected through the connecting tube (1340). The refrigerant fluid may move from the internal space of the first fin (1330) to the internal space of the metal plate (1350) or vice versa through the connecting tube (1340).

[0102] According to one embodiment, a plurality of connecting tubes may be connected to a single first pin. As shown in FIG. 13, two connecting tubes (1341, 1342) may be connected to the first pin (1330). The heated fluid may move from the first pin (1330) to the metal plate (1350) through the connecting tube (1341), and the cooled fluid from the metal plate (1350) may move to the first pin (1330) through the connecting tube (1342).

[0103] In FIGS. 11 to 13, heated air inside the housing can escape to the outside of the housing through at least one opening formed in the upper portion of the housing. At least one opening can be formed in the lower portion of the housing for air outside the housing to move into the inside of the housing.

[0104] Referring to FIG. 12, the rear cover may be composed of a plurality of spaced apart metal plates (1250a, 1250b, 1250c, ..., 1250n). Outside air may be introduced into the interior of the housing through the gaps between the metal plates. Outside air may be introduced into the interior of the housing through a gap between one metal plate and an adjacent metal plate. For example, outside air may be introduced through the gaps between the metal plates at the lower portion of the rear cover. Additionally, inside air of the housing may be discharged to the outside through the spaces between adjacent metal plates. For example, inside air may be discharged through the gaps between the metal plates at the upper portion of the rear cover.

[0105] Figure 14 illustrates a rear cover according to one embodiment. The rear cover can be formed by joining two metal materials, and the interior space of the rear cover (1450) is created by preventing the metal plates from joining in that area. Part of the interior space can be eliminated by joining certain areas. For example, by joining two metal plates along a boundary (1491), the interior space can be divided into two areas along the boundary (1491).

[0106] As shown in Fig. 14, a flow path for fluid movement can be formed by dividing an area according to a boundary. By blocking at least a portion of the internal space of the rear cover (1450), areas divided by, for example, a wall (1491) can be referred to as flow paths (A) and (B). Areas divided by a wall (1493) can be referred to as flow paths (A) and (B). Areas divided by a wall (1495) can be referred to as flow paths (A) and (B). Areas divided by a wall (1497) can be referred to as flow paths (A) and (B).

[0107] Referring to FIG. 14, the heated fluid (1470) moves in the opposite direction of gravity, so it can move from the first fin (1430) to the rear cover (1450). The fluid rising from the first fin (1430c, 1430d, 1430e, 1430f or 1430g) to the rear cover (1450) can rise through the region (B) along the boundary (1491) or the boundary (1493), which is natural. The fluid (1470) rising from the first fin (1430i, 1430j, 1430k, 1430l or 1430m) to the rear cover (1450) can naturally rise through the region (D) along the boundary (1495) or the boundary (1497). Because of the diagonally formed boundary, most of the heated fluid moving from the first fin to the rear cover (1450) can rise through area (B) and area (D).

[0108] The cooled fluid can fall freely due to gravity and move from the rear cover (1450) to the first fin (1430). If the fluid (1480) descending in the direction of gravity is blocked by the boundary (1491), the fluid can descend through the region (A) along the boundary (1491) and move to the first fin (1430a or 1430b). If the fluid descending in the direction of gravity is blocked by the boundary (1493) or the boundary (1495), the fluid can descend through the region (C) along the boundary (1493) or the boundary (1495) and move to the first fin (1430h). If the fluid descending in the direction of gravity is blocked by the boundary (1497), the fluid can descend through the region (E) along the boundary (1497) and move to the first fin (1430n). Because of the diagonally formed boundary, most of the cooled fluid moving from the rear cover (1450) to the first fin can descend through area (A), area (C), or area (E).

[0109] The diagonally formed boundary enhances the upward flow of the heated fluid through regions (B) and (D). Since the upward flow through the outlets of regions (B) and (D) is strong, even if some of the cooling fluid was descending toward the outlets of regions (B) and (D), the upward flow may change its direction toward region (A), region (C), or region (E) and eventually be intercepted by the boundary (1491, 1493, 1495, or 1497). As a result, some of the cooling fluid descends through region (A), region (C), or region (E). The strength of the downward flow through region (A), region (C), or region (E) may in turn weaken the upward flow through region (A), region (C), or region (E).

[0110] Additionally, the diagonally formed boundary enhances the downward flow of the cooled fluid through region (A), region (C), or region (E). As a result, the downward flow through the first fin (1430a, 1430b, 1430h, or 1430n) is enhanced. As a result, more heated fluid can rise through the first fin (1430c, 1430d, 1430e, 1430f, 1430g, 1430i, 1430j, 1430k, 1430l, or 1430m). The enhanced upward flow through region (B) and region (D) can in turn enhance the downward flow through region (A), region (C), or region (E).

[0111] Figure 15 illustrates a process for manufacturing a first pin according to one embodiment.

[0112] It is desirable that there be no gaps in the joints of the metal plates forming the sealed space to prevent the fluid injected inside the vapor chamber from leaking to the outside, and that the metal plates surrounding the sealed space have no micropores.

[0113] The metal sheet that constitutes the first fin is manufactured using a forming process that does not create micropores within the molded product, such as forging. Metal sheets manufactured using forging methods do not contain micropores within their interiors, so there is no concern that fluids present within the internal space will leak through the material's micropores.

[0114] The first fin can be manufactured by bonding two metal plates. To create an internal space of the first fin capable of containing refrigerant fluid, the two metal plates are bonded so that their facing surfaces, excluding the area surrounding the internal space, are joined together. One surface of the metal plates may include a bonding surface that bonds to another metal and a non-bonding surface that does not bond to another metal.

[0115] Referring to process (1510) of FIG. 15, a pattern (1545) for forming an internal space may be printed on a metal plate (1540). The patterns (1545, 1560) printed on one side of the metal plate may distinguish a bonding surface that is bonded to another metal plate and a non-bonding surface that is not bonded. For example, a pattern (1560) may be printed on one side of the metal plate (1540) in the shape of a non-bonding surface that is not bonded to another metal plate (1550), and an area of ​​the metal plate (1540) on which the pattern (1560) is printed may not be bonded to another metal plate (1550).

[0116] Referring to process (1520) of FIG. 15, two metal plates can be joined to each other through a heating and pressurizing process. The heating and pressurizing process may include a process of heating two metal plates to a temperature below the melting point of the metal while overlapping and closely contacting each other. The remaining joining surface, excluding the patterned non-joining surface of the metal plate (1540), can be joined to another metal plate (1550) through a heating and pressurizing process.

[0117] The remaining area of ​​the metal plate (1540) except for the area where the pattern (1545, 1560) is printed is bonded to the metal plate (1550). The area (1570) where the metal plates are bonded in the process (1530) includes a portion of the edge of the first pin. The area (1580) where the metal plates are not bonded in the process (1530) corresponds to the area where the pattern (1560) is not printed in the process (1510) and includes a portion of the edge of the first pin (the indicated area (1590) and the indicated area (1535) or the indicated areas (1593 and 1595)).

[0118] At the corners included in the region (1570), the joints of the metal plates (1540) and the metal plates (1550) are joined without a gap, so that the metal plates can confine a fluid in their internal space. All corners of the joined region (1570) except for the indicated region (1590) and the indicated region (1535) or the indicated regions (1593 and 1595) can be joined.

[0119] The metal plates are not joined in the indicated area (1590) and the indicated area (1535) or in the indicated areas (1593 and 1595). The internal space of the first fin and the internal space of the vapor chamber can be connected through the indicated area (1590). For this purpose, the patterns (1545, 1560) of the metal plate (1540) can include a pattern corresponding to the indicated area (1590). The internal space of the first fin and the internal space of the rear cover can be connected through the indicated area (1535). Alternatively, the internal space of the first fin and the internal space of the rear cover can be connected through the indicated areas (1593 and 1595).

[0120] The two facing surfaces of the metal plates forming the first fin are not joined to each other in the indicated area (1590) and the indicated area (1535) or in the areas corresponding to the indicated areas (1593 and 1595). When the first fin is inserted into the top cover, the indicated area (1590) comes into close contact with the slit of the top cover. When heated in this state, the indicated area (1590) can become a passage (or, connecting portion) between the internal space of the first fin and the internal space of the vapor chamber.

[0121] Likewise, when the indicated area (1535) is heated while inserted into the slit of the rear cover, the indicated area (1535) can connect the internal space of the first fin and the internal space of the rear cover. Alternatively, when the indicated areas (1593 and 1595) are heated while the connecting tube is coupled, the indicated areas (1593 and 1595) can connect the internal space of the first fin and the internal space of the rear cover.

[0122] According to one embodiment, a first fin may include multiple passages through which fluid may flow within its internal space. The fluid may be dispersed within the internal space while flowing along the multiple narrow passages. To create the multiple passages, an additional process of printing a pattern to distinguish between areas through which fluid may flow and areas through which fluid may not flow may be performed. Ink may be printed on areas that are not to be joined or areas through which fluid may flow. Then, through a heating and pressurizing process, two metal sheets may be joined in areas other than the multiple passages through which fluid may flow. Referring to process (1530), an area of ​​a metal sheet (1540) where a pattern (1560) is printed is not joined to another metal sheet (550).

[0123] The first fin manufactured using the method of FIG. 5 can be inserted into a slot in the top cover and joined to the top cover to connect to the vapor chamber. Since the metal plate is manufactured using a forming method, such as a forging method, that does not form micropores within the molded product, the first fin formed from the metal plate has no micropores within the material and may not be warped during the metal bonding process. The metal bonding process may include, for example, a brazing process.

[0124] FIG. 16 illustrates a housing including a rear cover according to one embodiment.

[0125] The housing (1600) may include a main body (1610), heat dissipation fins, and a rear cover (1650). Referring to FIG. 16, electronic components (1660) with low heat generation and electronic components (1666) with high heat generation may be mounted on the PBA. A vapor chamber (1620) may be placed in a first region where the electronic components (1666) with high heat generation are mounted. The vapor chamber (1620) may be connected to first fins (1630), and the first fins (1630) may be connected to the rear cover (1650).

[0126] The rear cover (1650) of FIG. 16 can be connected to the first surface of the first pin (1630) (e.g., the first surface (831) of FIG. 8, the first surface (1031) of FIG. 10, or the first surface (1331) of FIG. 13). The indicated area (1622) of the rear cover is an internal space of the rear cover, and can be connected to the internal space of the first pin (1630) and the internal space of the vapor chamber.

[0127] As shown in Fig. 16, holes for airflow may be formed at the upper and lower portions of the housing (1600). The area of ​​the opening formed at the upper portion of the housing may be larger than the area of ​​the opening formed at the lower portion. By forming sufficient openings at the upper portion of the housing, hot air heated within the housing (1600) may be prevented from stagnating within the housing (1600). For example, the number of openings formed at the upper portion may be larger than the number of openings formed at the lower portion. The area of ​​one opening formed at the upper portion may be larger than the area of ​​one opening formed at the lower portion.

[0128] The difference in the opening area of ​​the upper and lower portions may refer to the difference in the total area of ​​the exhaust port and the total area of ​​the intake port, and the greater the difference, the more the velocity of the air rising inside the housing (1600) may accelerate. To increase this difference, the rear cover (1650) may not have an opening formed therein.

[0129] According to one embodiment, the heat dissipation fins of the second region may be spaced apart from the rear cover (1650) by a distance (g). Referring to FIG. 16, a plurality of heat dissipation fins (1610) may also be arranged in the second region, which receives heat from electronic components (1660) with low heat generation. The distance may serve as a passage for air to move within the housing. The size of the opening for air discharge and inflow may be adjusted depending on the distance (g). This will be described in detail below.

[0130] Fig. 17 is a cross-sectional view of an opening formed in a housing according to one embodiment.

[0131] The cross-sectional shape of the opening may have a predetermined gradient. Referring to FIG. 17, the cross-sections of the opening (1710) formed at the upper portion of the housing and the cross-sections of the opening (1720) formed at the lower portion of the housing may have a gradient, and the inlet of the opening may be larger than the outlet. Heated air inside the housing may rise through the opening (1710) formed at the upper portion and move to the outside of the housing. As the heated air inside the housing passes through the wide inlet (diameter: d2) of the opening (1710) and the narrow outlet (diameter: d1), the passage gradually narrows, so that the air flow rate may gradually increase. The gradient effect facilitates the discharge of air through the opening (1710) formed at the upper portion, and prevents the heated air from stagnating at the upper portion of the housing. Additionally, as the additionally ascending air passes through the opening located at the top of the housing (e.g., the housing (1600) of FIG. 16), a pressure difference is generated inside and outside the exhaust port, and the pressure difference may increase the flow rate through the exhaust port.

[0132] Since the air pressure inside the opening (1720) formed at the bottom is low due to the upward flow inside the housing, relatively cool air outside the housing can move into the inside of the housing through the opening (1720). As the outside air passes through the wide inlet (diameter: d4) of the opening (1720) and the narrow outlet (diameter: d3), the passage gradually narrows, so that the air flow rate can gradually increase. Due to the effect of the gradient, the inflow of air through the opening (1720) formed at the bottom becomes easier, and since the inflowing outside air is relatively lower in temperature than the air inside the housing, the heat dissipation effect of the housing can be improved.

[0133] FIG. 18 illustrates a housing including a rear cover according to one embodiment.

[0134] The network communication equipment (1800) can be installed in a tilted state at a predetermined angle (θ, for example, from 0 degrees to 15 degrees) with respect to the vertical plane. If the rear cover (1850) of FIG. 18 is blocked as in FIG. 16 and an opening for exhaust is formed only at the upper part of the equipment (1800), when the equipment (1800) is tilted 15 degrees as in FIG. 18, the internal upward flow is blocked by the rear cover (1850) and rises inside the housing (1810) along the rear cover until it reaches the top of the rear cover (1850). As in FIG. 18, when an opening for exhaust is formed in at least a portion of the rear cover (1850), the upward flow heated inside the housing (1810) can be immediately discharged to the outside of the housing when it reaches at least a portion of the rear cover (1850).

[0135] FIG. 19 illustrates a housing including a rear cover according to one embodiment. The housing may be composed of a housing body (1910) and a rear cover (1950). Referring to FIG. 19, the rear cover (1950) may be connected to the housing body (1910) to separate the interior of the housing from the exterior. A plurality of heat dissipation fins may be present within the interior of the housing. The plurality of heat dissipation fins may include a first fin and / or a second fin.

[0136] Openings (1905) for intake may be formed in the lower portion of the housing, and openings (1915) for exhaust may be formed in the upper portion of the housing. Referring to Fig. 19, openings (1955) for exhaust may also be formed in at least a portion of the rear cover.

[0137] A flow path for fluid flow may be formed in the internal spaces formed in the rear cover (1950). For example, a flow path may be formed in the internal space by joining some areas of the metal plates forming the rear cover (1950) to prevent fluid from passing through. In one embodiment, an opening penetrating the interior and exterior of the housing may be formed in some areas where the metal plates are joined. The formed opening may include openings (1955) for exhaust.

[0138] According to one embodiment, when openings (1955) are formed in some areas of the rear cover (1950), a flow path through which a fluid can flow is formed between the openings (1955).

[0139] FIG. 20 illustrates a housing of a network device including a rear cover according to one embodiment.

[0140] A plurality of heat dissipation fins (e.g., second fins) may be arranged in a second region of the housing body, and the heat dissipation fins and the rear cover are spaced apart by a distance (g). The heat dissipation fins are spaced apart by a gap (w), and the sum of the height (h) of the heat dissipation fins and the distance (g) may represent the height (h+g) of the internal space of the housing.

[0141] Fig. 20 proposes a housing structure that enhances convection of air within the housing.

[0142] The size of the opening formed at the top and bottom of the housing (e.g., the diameter in Fig. 17) can be adjusted according to h+g and w. The height of the opening may be smaller than the height of the internal space of the housing (h+g), and the width of the opening may be smaller than the spacing between the heat dissipation fins (w). For example, if the front shape of the opening is circular, the diameter of the opening may be smaller than the smaller of the height of the internal space (h+g) and the spacing between the heat dissipation fins (w).

[0143] Additionally, according to the description of Fig. 16, the area of ​​the upper opening may be larger than the area of ​​the lower opening. For example, the diameter (d1, d2) of the upper opening in Fig. 17 is larger than the diameter (d3, d4) of the lower opening, and is smaller than the smaller of the height (h+g) and the spacing (w).

[0144] The frontal shape of the opening can be implemented in many different forms and is not limited to the circular shape described in Fig. 20.

[0145] Fig. 21 illustrates a housing including a rear cover according to one embodiment. Fig. 22 illustrates a housing including a rear cover according to one embodiment.

[0146] According to one embodiment, by reducing the spacing (w) of the heat dissipation fins or the height of the internal space in some areas by less than the height (h+g), the air flow rate passing through the area can be increased. Referring to FIG. 21, the rear cover may further include a protrusion (2159) that occupies some area between the heat dissipation fins. Air passing through the space of the spacing (w) passes through a space narrowed by the diameter of the protrusion (2159) when passing through the area where the protrusion (2159) is formed, and the air flow rate can increase. Air passing through the space of the height (h+g) passes through a space lowered by the height of the protrusion (2159) when passing through the area where the protrusion (2159) is formed, and the air flow rate can increase. Additionally, the air flow rate in the area where the protrusion is formed can be controlled by adjusting the diameter and height of the protrusion (2159).

[0147] The embodiment of FIG. 21 can be implemented in various different forms and is not limited to the embodiment in which a protrusion is added to the rear cover. In another example, the housing body may further include a protrusion to reduce the height of the internal space.

[0148] Furthermore, the embodiment of FIG. 21 is not limited to a protrusion having a shape of a fin with a slope. As shown in FIG. 22, the protrusion formed on the rear cover (2250a or 2250b) may be implemented as a rib shape or a boss shape. It is preferable that the front portion of the protrusion (2259a or 2259b) be a curved streamlined shape so that the flow of rising air is not obstructed and resistance is minimized.

[0149] FIG. 23 illustrates a functional configuration of an electronic device according to one embodiment of the present disclosure.

[0150] Referring to FIG. 23, an exemplary functional configuration of an electronic device (2300) is illustrated. The electronic device (2300) may include an antenna unit (2310), a filter unit (2320), an RF (radio frequency) processing unit (2330), and a control unit (2340).

[0151] The antenna unit (2310) may include a plurality of antennas. The antenna performs functions for transmitting and receiving signals through a wireless channel. The antenna may include a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). The antenna may radiate an upconverted signal on a wireless channel or acquire a signal radiated by another device. Each antenna may be referred to as a radiator, an antenna element, or an antenna element. In some embodiments, the antenna unit (2310) may include an antenna array (e.g., a sub-array) in which a plurality of antenna elements form an array. The antenna unit (2310) may be electrically connected to the filter unit (2320) via RF signal lines. The antenna unit (2310) may be mounted on a PCB including a plurality of antenna elements. The PCB may include a plurality of RF signal lines connecting each antenna element to a filter of the filter unit (2320). These RF signal lines may be referred to as a feeding network. The antenna unit (2310) may provide the received signal to the filter unit (2320) or radiate the signal provided from the filter unit (2320) into the air. An antenna having a structure according to an embodiment of the present disclosure may be included in the antenna unit (2310).

[0152] The antenna unit (2310) according to various embodiments may include at least one antenna module having a dual polarization antenna. The dual polarization antenna may transmit and receive signals having different polarizations. For example, the dual polarization antenna may transmit and receive a first signal having a polarization of +45° and a second signal having a polarization of -45°. Of course, the polarizations may be formed of other orthogonal polarizations other than +45° and -45°. Each antenna element may be connected to a feeding line or indirectly connected by coupling, and may be electrically connected to a filter unit (2320), an RF processing unit (2330), and a control unit (2340) described below.

[0153] According to one embodiment, the dual polarization antenna may be a patch antenna (or a microstrip antenna). Since the dual polarization antenna has the form of a patch antenna, it may be easily implemented and integrated into an array antenna. Two signals having different polarizations may be input to each antenna port. Each antenna port corresponds to an antenna element. For high efficiency, it is required to optimize the relationship between the co-pol characteristics and the cross-pol characteristics between the two signals having different polarizations. In the dual polarization antenna, the co-pol characteristics represent characteristics for a specific polarization component, and the cross-pol characteristics represent characteristics for a different polarization component from the specific polarization component.

[0154] An antenna (e.g., an antenna element, a sub-array, an antenna array) of an antenna device according to an embodiment of the present disclosure may be included in an antenna unit (2310). For example, a radiator or balun of a dipole metal patch antenna-horizontal balun structure according to an embodiment of the present disclosure may be included in the antenna unit (2310) of FIG. 23.

[0155] The filter unit (2320) may perform filtering to transmit a signal of a desired frequency. The filter unit (2320) may perform a function to selectively identify a frequency by forming a resonance. In some embodiments, the filter unit (2320) may form a resonance through a cavity that structurally includes a dielectric. Furthermore, in some embodiments, the filter unit (2320) may form a resonance through elements that form inductance or capacitance. Furthermore, in some embodiments, the filter unit (2320) may include an elastic filter such as a bulk acoustic wave (BAW) filter or a surface acoustic wave (SAW) filter. The filter unit (2320) may include at least one of a band pass filter, a low pass filter, a high pass filter, or a band reject filter. That is, the filter unit (2320) may include RF circuits for obtaining signals in a frequency band for transmission or a frequency band for reception. The filter unit (2320) according to various embodiments may electrically connect the antenna unit (2310) and the RF processing unit (2330).

[0156] The RF processing unit (2330) may include a plurality of RF paths. An RF path may be a unit of a path through which a signal received through an antenna or a signal radiated through an antenna passes. At least one RF path may be referred to as an RF chain. The RF chain may include a plurality of RF components. The RF components may include amplifiers, mixers, oscillators, DACs, ADCs, etc. For example, the RF processing unit (2330) may include an up converter that up-converts a baseband digital transmission signal to a transmission frequency, and a digital-to-analog converter (DAC) that converts the up-converted digital transmission signal to an analog RF transmission signal. The up converter and the DAC form part of a transmission path. The transmission path may further include a power amplifier (PA) or a coupler (or combiner). Also, for example, the RF processing unit (2330) may include an analog-to-digital converter (ADC) that converts an analog RF reception signal into a digital reception signal and a down converter that converts the digital reception signal into a baseband digital reception signal. The ADC and the down converter form part of a receiving path. The receiving path may further include a low-noise amplifier (LNA) or a coupler (or divider). The RF components of the RF processing unit may be implemented on a PCB. The antennas and the RF components of the RF processing unit may be implemented on the PCB, and filters may be repeatedly connected between the PCBs to form a plurality of layers.

[0157] A radio frequency integrated circuit (RFIC) and a package board (PKG) of an electronic device including an antenna element according to an embodiment of the present disclosure may be included in the RF processing unit (2330) of FIG. 23. That is, the RF processing unit (2330) may include a radio frequency integrated circuit (RFIC) as an RF component for mmWave. As described above in the present disclosure, the RFIC may be formed as an RFIC chip combined with a package board and coupled to the RU board, or the RFIC may be directly coupled by the RU board.

[0158] The control unit (2340) can control the overall operations of the electronic device (2300). The control unit (2340) can include various modules for performing communication. The control unit (2340) can include at least one processor, such as a modem. The control unit (2340) can include modules for digital signal processing. For example, the control unit (2340) can include a modem. When transmitting data, the control unit (2340) generates complex symbols by encoding and modulating a transmission bit stream. In addition, for example, when receiving data, the control unit (2340) restores a reception bit stream by demodulating and decoding a baseband signal. The control unit (2340) can perform functions of a protocol stack required by a communication standard.

[0159] FIG. 23 illustrates the functional configuration of an electronic device (2300) as a device to which various embodiments of the present disclosure may be applied. However, the example illustrated in FIG. 23 is merely an exemplary configuration of a device for the structure according to various embodiments of the present disclosure described through FIGS. 1 to 22 , and embodiments of the present disclosure are not limited to the components of the device illustrated in FIG. 23 . Accordingly, the antenna element structure itself and the electronic device including the structure may also be understood as embodiments of the present disclosure.

[0160] In the specific embodiments of the present disclosure described above, components included in the invention are expressed in the singular or plural form, depending on the specific embodiment presented. However, the singular or plural expressions are selected to suit the presented situation for convenience of explanation, and the present disclosure is not limited to singular or plural components. Components expressed in the plural form may be composed of singular elements, or components expressed in the singular form may be composed of plural elements.

[0161] Meanwhile, the embodiments of the present disclosure disclosed in this specification and drawings are merely specific examples to easily explain the technical contents of the present disclosure and to help understand the present disclosure, and are not intended to limit the scope of the present disclosure. In other words, it will be apparent to those skilled in the art that other modifications based on the technical idea of ​​the present disclosure are possible. In addition, each embodiment can be combined and operated with each other as needed. For example, parts of one embodiment of the present disclosure and parts of another embodiment can be combined with each other to operate a base station and a terminal. For example, parts of one embodiment of the present disclosure and parts of another embodiment can be combined with each other to configure an antenna element or an electronic device including the same.

[0162] The drawings illustrating the method of the present invention may omit some components and include only some components within a scope that does not harm the essence of the present invention.

[0163] In addition, the method of the present invention may be implemented by combining some or all of the contents included in each embodiment within a scope that does not harm the essence of the invention.

[0164] Various embodiments of the present disclosure have been described above. The foregoing description of the present disclosure is for illustrative purposes only, and the embodiments of the present disclosure are not limited to the disclosed embodiments. Those skilled in the art will appreciate that the present disclosure can be readily modified into other specific forms without altering the technical spirit or essential characteristics of the present disclosure. The scope of the present disclosure is indicated by the claims below rather than the detailed description, and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included within the scope of the present disclosure.

[0165] The technical problems to be achieved in this document are not limited to the technical problems mentioned above, and other technical problems not mentioned can be clearly understood by a person having ordinary skill in the technical field to which the present invention belongs from the description below.

[0166] According to one embodiment, a housing of an electronic device (e.g., a housing (130, 330, ..., 1600 or 1810) of FIGS. 1 to 22) may include: a body; a vapor chamber disposed in a first region of the body; a plurality of first fins connected to one surface of the vapor chamber; a plurality of second fins disposed in a second region of the body; and a rear cover connected to the first fins and the body. The rear cover may be connected to the body to form a space in which the plurality of second fins are located, and a first internal space formed in the vapor chamber, second internal spaces formed in the first fins, and a third internal space formed in the rear cover may be connected to form a sealed space.

[0167] In one embodiment, it may include a plurality of connecting pipes connecting the second internal spaces and the third internal spaces.

[0168] In one embodiment, one second internal space and one third internal space are connected through a first connecting pipe and a second connecting pipe, a fluid is contained within the sealed space, and the fluid can move from the one second internal space to the one third internal space through the first connecting pipe, and can move from the one third internal space to the one second internal space through the second connecting pipe.

[0169] In one embodiment, the rear cover has a first flow path and a second flow path formed therein through which the fluid moves, and the fluid can move from the one second internal space to the first flow path of the one third internal space through the first connecting pipe, and can move from the second flow path of the one third internal space to the one second internal space through the second connecting pipe.

[0170] In one embodiment, the rear cover has a first flow path and a second flow path formed therein through which the fluid moves, and the fluid can move from the second internal spaces to the third internal spaces through the first flow path, and can move from the third internal spaces to the second internal spaces through the second flow path.

[0171] In one embodiment, the first euro may correspond to a high-heat section.

[0172] In one embodiment, the rear cover may include a plurality of plates, and may include a plurality of third internal spaces independent of each other within the plurality of plates.

[0173] In one embodiment, at least one first opening (hole) is formed on a first surface of the main body, and at least one second opening (hole) is formed on a second surface of the main body, and air can enter the space where the plurality of second fins are positioned from the outside of the housing through the at least one second opening, and air can exit the space where the plurality of second fins are positioned to the outside of the housing through the at least one first opening.

[0174] In one embodiment, the first surface of the body is disposed in a third region of the body, and the at least one second opening may be formed in the second surface corresponding to the second region.

[0175] In one embodiment, the rear cover and the plurality of second pins may be positioned a specified distance apart.

[0176] An electronic device (e.g., a network communication device of FIGS. 1 to 22 or an electronic device (2300) of FIG. 23) according to one embodiment may include a housing (e.g., a housing (130, 330, ..., 1600 or 1810) of FIGS. 1 to 22); and a printed board assembly (PBA) on which high-heat electronic components and low-heat electronic components are mounted. The high-heat electronic components and the low-heat electronic components may be in contact with the housing. The electronic device may include a body; a vapor chamber disposed in a first region of the body; a plurality of first fins connected to one surface of the vapor chamber; a plurality of second fins disposed in a second region of the body; and a rear cover connected to the first fins and the body. The rear cover is connected to the body to form a space in which the plurality of second fins are located, and a first internal space formed in the vapor chamber, the The second internal spaces formed in the first pins and the third internal spaces formed in the rear cover can be connected to form a sealed space.

[0177] In one embodiment, it may include a plurality of connecting pipes connecting the second internal spaces and the third internal spaces.

[0178] In one embodiment, one second internal space and one third internal space are connected through a first connecting pipe and a second connecting pipe, a fluid is contained within the sealed space, and the fluid can move from the one second internal space to the one third internal space through the first connecting pipe, and can move from the one third internal space to the one second internal space through the second connecting pipe.

[0179] In one embodiment, the rear cover has a first flow path and a second flow path formed therein through which the fluid moves, and the fluid can move from the one second internal space to the first flow path of the one third internal space through the first connecting pipe, and can move from the second flow path of the one third internal space to the one second internal space through the second connecting pipe.

[0180] In one embodiment, the rear cover has a first flow path and a second flow path formed therein through which the fluid moves, and the fluid can move from the second internal spaces to the third internal spaces through the first flow path, and can move from the third internal spaces to the second internal spaces through the second flow path.

[0181] In one embodiment, the first euro may correspond to a high-heat section.

[0182] In one embodiment, the rear cover may include a plurality of plates, and may include a plurality of third internal spaces independent of each other within the plurality of plates.

[0183] In one embodiment, at least one first opening (hole) is formed on a first surface of the main body, and at least one second opening (hole) is formed on a second surface of the main body, and air can enter the space where the plurality of second fins are positioned from the outside of the housing through the at least one second opening, and air can exit the space where the plurality of second fins are positioned to the outside of the housing through the at least one first opening.

[0184] In one embodiment, the first surface of the body is disposed in a third region of the body, and the at least one second opening may be formed in the second surface corresponding to the second region.

[0185] In one embodiment, the rear cover and the plurality of second pins may be positioned a specified distance apart.

[0186] According to various embodiments, a housing and electronic device having a significantly increased heat dissipation area can be provided through a refrigerant circulation heat conductor extending from a vapor chamber, heat dissipation fins, and a rear cover.

[0187] According to various embodiments, a housing and electronic device that generate natural ventilation and cool the inside of the housing can be provided by forming an opening in a rear cover or housing and controlling the position, number, size, total area, cross-sectional shape, etc. of the formed opening.

[0188] According to various embodiments, a housing and an electronic device are provided that generate an efficient cooling effect by adjusting the position of an opening depending on the position of an electronic component that generates a lot of heat.

[0189] The cooling system of the present disclosure does not require mechanical components such as fans, making it stable and reducing maintenance costs and risk of failure. Furthermore, it is highly energy efficient as it does not use electricity.

[0190] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0191] The methods according to the embodiments described in the claims or specification of the present disclosure may be implemented in the form of hardware, software, or a combination of hardware and software.

[0192] When implemented in software, a computer-readable storage medium storing one or more programs (software modules) may be provided. The one or more programs stored in the computer-readable storage medium are configured for execution by one or more processors within an electronic device. The one or more programs include instructions that cause the electronic device to execute methods according to embodiments described in the claims or specification of the present disclosure.

[0193] In the present disclosure, the functions or operations performed by the electronic device may be performed by one or more processors executing one or more instructions stored in a memory. The functions or operations of the electronic device mentioned in the present disclosure may be performed by one processor executing one or more instructions, or may be performed by a combination of multiple processors executing one or more instructions. The processor mentioned in the present disclosure may be understood to include circuitry for performing calculations or controlling other components of the electronic device. For example, the one or more processors may include a central processing unit (CPU), a microprocessor unit (MPU), an application processor (AP), a communication processor (CP), a neural processing unit (NPU), a system on a chip (SoC), or an integrated circuit (IC) configured to execute one or more instructions. The one or more processors may be configured to perform the operations of the electronic device described above.

[0194] In the present disclosure, a program (software module, software) may be stored in a non-volatile memory including a random access memory (RAM), a flash memory, a read only memory (ROM), an electrically erasable programmable read only memory (EEPROM), a magnetic disc storage device, a compact disc ROM (CD-ROM), digital versatile discs (DVDs) or other forms of optical storage devices, a magnetic cassette. Or, it may be stored in a memory formed by a combination of some or all of these. The memory may be formed by a single storage medium, or may be formed by a combination of a plurality of storage media. The one or more commands may be stored in a single storage medium, or may be distributed and stored in a plurality of storage media.

[0195] Additionally, the program may be stored on an attachable storage device that is accessible via a communication network such as the Internet, an intranet, a local area network (LAN), a wide LAN (WLAN), or a storage area network (SAN), or a combination thereof. Such a storage device may be connected to a device performing an embodiment of the present disclosure via an external port. Additionally, a separate storage device on the communication network may be connected to a device performing an embodiment of the present disclosure.

[0196] In the specific embodiments of the present disclosure described above, components included in the disclosure are expressed in the singular or plural form, depending on the specific embodiment presented. However, the singular or plural expressions are selected to suit the presented situation for convenience of explanation, and the present disclosure is not limited to singular or plural components. Components expressed in the plural form may be composed of singular elements, or components expressed in the singular form may be composed of plural elements.

[0197] Additionally, in the present disclosure, terms such as “part”, “module”, etc. may refer to a hardware component such as a processor or circuit, and / or a software component executed by a hardware component such as a processor.

[0198] A "component" or "module" may be implemented by a program stored in an addressable storage medium and executed by a processor. For example, a "component" or "module" may be implemented by components such as software components, object-oriented software components, class components, and task components, as well as processes, functions, attributes, procedures, subroutines, segments of program code, drivers, firmware, microcode, circuitry, data, databases, data structures, tables, arrays, and variables.

[0199] The specific implementations described in this disclosure are merely exemplary and do not limit the scope of the present disclosure in any way. For the sake of brevity, descriptions of conventional electronic components, control systems, software, and other functional aspects of the systems may be omitted.

[0200] Additionally, in the present disclosure, “comprising at least one of a, b, or c” may mean “comprising only a, comprising only b, comprising only c, comprising both a and b, comprising both b and c, comprising both a and c, or comprising all of a, b, and c.”

[0201] While the detailed description of this disclosure has described specific embodiments, it should be understood that various modifications are possible without departing from the scope of this disclosure. Therefore, the scope of this disclosure should not be limited to the described embodiments, but should be defined not only by the scope of the claims described below, but also by equivalents thereof.

Claims

1. In the housing of an electronic device, body; A vapor chamber disposed in the first region of the main body; A plurality of first fins connected to one side of the vapor chamber; A plurality of second pins arranged in a second region of the main body; and It includes a rear cover connected to the first pins and the main body, and the rear cover is connected to the main body to form a space where the plurality of second pins are located, The first internal space formed in the vapor chamber, the second internal spaces formed in the first fins, and the third internal spaces formed in the rear cover are connected to form a sealed space. Housing of an electronic device.

2. In claim 1, It includes a plurality of connecting pipes connecting the second internal spaces and the third internal spaces. Housing of an electronic device.

3. In claim 2, One second internal space and one third internal space are connected through the first connecting pipe and the second connecting pipe. A fluid is contained within the above-mentioned closed space, The fluid moves from the second internal space to the third internal space through the first connecting pipe, and moves from the third internal space to the second internal space through the second connecting pipe. Housing of an electronic device.

4. In claim 3, The above rear cover has a first flow path and a second flow path formed through which the fluid moves, The fluid moves from the second internal space to the first flow path of the third internal space through the first connecting pipe, and moves from the second flow path of the third internal space to the second internal space through the second connecting pipe. Housing of an electronic device.

5. In claim 1, The above rear cover has a first flow path and a second flow path formed through which the fluid moves, The fluid moves from the second internal spaces to the third internal spaces through the first flow path, and moves from the third internal spaces to the second internal spaces through the second flow path. The above first euro corresponds to the high-heat section. Housing of an electronic device.

6. In claim 1, The back cover comprises multiple plates, Including a plurality of third internal spaces independent of each other inside the plurality of plates Housing of an electronic device.

7. In claim 1, At least one first opening (hole) is formed on the first surface of the above body, At least one second opening (hole) is formed on the second surface of the above body, Air enters the space where the plurality of second pins are located from the outside of the housing through at least one second opening, Air is discharged to the outside of the housing through the space where the plurality of second pins are located through at least one of the first openings, The first side of the above body is arranged in the third area of ​​the above body, The at least one second opening is formed on the second surface corresponding to the second area. Housing of an electronic device.

8. In claim 1, The above rear cover and the plurality of second pins are arranged at a specified distance apart. Housing of an electronic device.

9. In electronic devices, Housing; and A PBA (printed board assembly) is included in which high-heat electronic components and low-heat electronic components are mounted, and the high-heat electronic components and low-heat electronic components are in contact with the housing. The above housing, body; A vapor chamber disposed in the first region of the main body; A plurality of first fins connected to one side of the vapor chamber; A plurality of second pins arranged in a second region of the main body; and It includes a rear cover connected to the first pins and the main body, and the rear cover is connected to the main body to form a space where the plurality of second pins are located, The first internal space formed in the vapor chamber, the second internal spaces formed in the first fins, and the third internal spaces formed in the rear cover are connected to form a sealed space. Electronic devices.

10. In claim 9, It includes a plurality of connecting pipes connecting the second internal spaces and the third internal spaces. Electronic devices.

11. In claim 10, One second internal space and one third internal space are connected through a first connecting pipe and a second connecting pipe, A fluid is contained within the above-mentioned closed space, The fluid moves from the second internal space to the third internal space through the first connecting pipe, and moves from the third internal space to the second internal space through the second connecting pipe. The above rear cover has a first flow path and a second flow path formed through which the fluid moves, The fluid moves from the second internal space to the first flow path of the third internal space through the first connecting pipe, and moves from the second flow path of the third internal space to the second internal space through the second connecting pipe. Electronic devices.

12. In claim 9, The above rear cover has a first flow path and a second flow path formed through which the fluid moves, The fluid moves from the second internal spaces to the third internal spaces through the first flow path, and moves from the third internal spaces to the second internal spaces through the second flow path. The above first euro corresponds to the high-heat section. Electronic devices.

13. In claim 9, The back cover comprises multiple plates, Including a plurality of third internal spaces independent of each other inside the plurality of plates Electronic devices.

14. In claim 9, At least one first opening (hole) is formed on the first surface of the above body, At least one second opening (hole) is formed on the second surface of the above body, Air enters the space where the plurality of second pins are located from the outside of the housing through at least one second opening, Air is discharged to the outside of the housing through the space where the plurality of second pins are located through at least one of the first openings, The first side of the above body is arranged in the third area of ​​the above body, The at least one second opening is formed on the second surface corresponding to the second area. Electronic devices.

15. In claim 11, The above rear cover and the plurality of second pins are arranged at a specified distance apart. Electronic devices.

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