Display panel and manufacturing method therefor, and display device

Abstract

The present application relates to a display panel and a manufacturing method thereof, and a display device. The display panel comprises: a substrate; a pixel defining structure disposed on one side of the substrate, wherein a plurality of pixel openings are arranged at intervals on the pixel defining structure; and isolation structures disposed on the side of the substrate close to the pixel defining structure, wherein the isolation structures are provided between at least some of the adjacent pixel openings, and each isolation structure comprises a first isolation portion and a second isolation portion stacked in a direction away from the substrate; the orthographic projection of the first isolation portion on the substrate is within the orthographic projection of the second isolation portion on the substrate; both the first isolation portion and the second isolation portion are made of an organic material; and under a preset etching condition, the etching rate of the material of the first isolation portion is greater than the etching rate of the material of the second isolation portion. The present application can reduce lateral leakage current and improve the display effect of the display panel and the display device.

Description

Display panel, preparation method thereof and display device

[0001] Cross-reference to related applications

[0002] This application claims priority to Chinese Patent Application No. 2024111334508, filed on August 16, 2024, entitled "Display panel, preparation method thereof and display device", the entire contents of which are incorporated herein by reference. TECHNICAL FIELD

[0003] The present application relates to the technical field of display, in particular to a display panel, a preparation method thereof and a display device. BACKGROUND

[0004] Organic Light Emitting Diode (OLED) has the advantages of simple preparation process, low cost, high contrast, wide viewing angle, low power consumption, etc., and is one of the most concerned technologies in current flat panel display technology. Among them, the laminated Organic Light Emitting Diode (OLED) display panel can reduce the power consumption of the screen body and at the same time can improve the service life, and has application prospects in small, medium and large size OLED display fields. The lateral leakage of the laminated OLED display panel is relatively serious, resulting in poor display effect.

[0005] SUMMARY

[0006] Therefore, it is necessary to provide a display panel, a preparation method thereof and a display device, aiming to improve the leakage problem of the OLED display panel.

[0007] In a first aspect, an embodiment of the present application provides a display panel, comprising:

[0008] a substrate;

[0009] a pixel definition structure arranged on one side of the substrate, wherein a plurality of pixel openings are arranged on the pixel definition structure in a spaced manner;

[0010] an isolation structure arranged on one side of the substrate close to the pixel definition structure, wherein the isolation structure is arranged between at least part of adjacent pixel openings;

[0011] The isolation structure comprises a first isolation portion and a second isolation portion arranged in a stacked manner away from the substrate; the orthographic projection of the first isolation portion on the substrate is located within the orthographic projection range of the second isolation portion on the substrate; the first isolation portion and the second isolation portion are both organic materials, and the etching rate of the material of the first isolation portion is greater than the etching rate of the material of the second isolation portion under a preset etching condition.

[0012] In one of the embodiments, the pixel defining structure is configured as a single film layer structure; the second isolation portion is made of the same material as the pixel defining structure and is arranged in the same layer.

[0013] In one of the embodiments, the display panel further comprises a planarization layer arranged between the substrate and the pixel defining structure; the first isolation portion is made of the same material as the planarization layer.

[0014] In one of the embodiments, the planarization layer is provided with a first recess on the side away from the substrate, and a first protrusion is arranged on the bottom wall of the first recess; the first protrusion constitutes the first isolation portion.

[0015] In one of the embodiments, the pixel defining structure comprises a first pixel defining layer and a second pixel defining layer arranged in a stacked manner away from the substrate;

[0016] The second isolation portion is made of the same material as the second pixel defining layer and is arranged in the same layer; the first isolation portion is made of the same material as the first pixel defining layer.

[0017] In one of the embodiments, the first pixel defining layer is provided with a second recess on the side away from the substrate, and a second protrusion is arranged on the bottom wall of the second recess; the second protrusion constitutes the first isolation portion.

[0018] In one of the embodiments, in any two adjacent pixel openings, the periphery of at least one of the pixel openings is surrounded by the isolation structure.

[0019] In one of the embodiments, the periphery of each of the pixel openings is surrounded by the isolation structure.

[0020] In one of the embodiments, the pixel defining structure is provided with a plurality of first opening rows and a plurality of second opening rows arranged alternately in a first direction, and each of the first opening rows and the second opening rows comprises a plurality of pixel openings arranged at intervals in a second direction; the first direction and the second direction are both perpendicular to the thickness direction of the substrate, and the first direction and the second direction intersect.

[0021] In one of the embodiments, the periphery of each of the pixel openings in the first opening row is surrounded by the isolation structure.

[0022] In one of the embodiments, the isolation structure comprises a plurality of sub-segments arranged at intervals, and the plurality of sub-segments surround the periphery of the corresponding pixel openings.

[0023] In one of the embodiments, the periphery of each of the pixel openings is surrounded by the isolation structure.

[0024] In the same isolation structure, a space between two adjacent sub-segments is a gap; in two adjacent isolation structures, part of the gap of one isolation structure is arranged opposite to part of the sub-segment of another isolation structure.

[0025] In one of the embodiments, the display panel further comprises a support column, which is arranged on the side of the pixel defining structure away from the substrate and is spaced apart from the isolation structure; in the same isolation structure, a space between two adjacent sub-segments is a gap;

[0026] At least one gap of the isolation structure adjacent to the support column is directed towards the support column.

[0027] In one of the embodiments, the display panel further comprises a first common layer, which comprises a first sub-part and a second sub-part, the first sub-part is arranged on the side of the pixel defining structure away from the substrate, and the second sub-part is arranged on the side of the isolation structure away from the substrate.

[0028] In one of the embodiments, the display panel further comprises a plurality of light emitting devices, which are arranged one-to-one corresponding to the plurality of pixel openings, at least part of each light emitting device is arranged in the corresponding pixel opening;

[0029] The light emitting device comprises a first light emitting layer and a second light emitting layer arranged in a stacked manner away from the substrate, and part of the first sub-part is located between the first light emitting layer and the second light emitting layer.

[0030] In one of the embodiments, the pixel defining structure further comprises an isolation opening arranged corresponding to the isolation structure; at least part of the number of pixel openings is surrounded by the isolation opening; at least part of the isolation structure is arranged in the corresponding isolation opening.

[0031] In a second aspect, the embodiments of the present application provide a preparation method of a display panel, comprising:

[0032] providing a substrate;

[0033] forming a first organic material layer and a second organic material layer in a stacked manner on one side of the substrate;

[0034] The first organic material layer and the second organic material layer are etched under preset etching conditions, and a pixel defining structure and an isolation structure are formed; the pixel defining structure is provided with a plurality of pixel openings arranged at intervals; the isolation structure is arranged between at least part of adjacent pixel openings; the isolation structure comprises a first isolation portion and a second isolation portion arranged in a stacked manner away from the substrate; the orthographic projection of the first isolation portion on the substrate is located within the orthographic projection range of the second isolation portion on the substrate; under the preset etching conditions, the etching rate of the first organic material layer is greater than the etching rate of the second organic material layer.

[0035] In one of the embodiments, the preset etching conditions are: chamber pressure of 50-150 mTorr, source power of 8-16 KW, bias power of 2-6 KW, oxygen flow of 800-1600 sccm, and etching time of 25-45 s.

[0036] The step of forming the first organic material layer and the second organic material layer in a stacked manner on one side of the substrate comprises:

[0037] The first organic material layer is formed on one side of the substrate.

[0038] A plurality of first sub-pixel openings are formed on the first organic material layer.

[0039] A second organic material layer is formed on the side of the first organic material layer away from the substrate.

[0040] A plurality of second sub-pixel openings are formed on the second organic material layer; the plurality of second sub-pixel openings and the plurality of first sub-pixel openings correspond one by one in communication, and the corresponding first sub-pixel opening and the second sub-pixel opening constitute the pixel opening.

[0041] In one of the embodiments, the preset etching conditions are: chamber pressure of 50-150 mTorr, source power of 8-16 KW, bias power of 0 KW, oxygen flow of 1600-3200 sccm, and etching time of 25-45 s.

[0042] After the step of forming the first organic material layer and the second organic material layer in a stacked manner on one side of the substrate, and before the step of etching the first organic material layer and the second organic material layer under preset etching conditions and forming a pixel defining structure and an isolation structure, the step comprises:

[0043] The plurality of pixel openings are formed on the second organic material layer.

[0044] In a third aspect, an embodiment of the present application provides a display device, comprising the display panel in the first aspect.

[0045] The display panel and the manufacturing method thereof and the display device provided by the embodiments of the present application can partially block the common layer by arranging the isolation structure between at least some adjacent pixel openings, the isolation structure comprising a first isolation part and a second isolation part, and the orthographic projection of the first isolation part on the substrate is located within the orthographic projection range of the second isolation part on the substrate. In this way, the isolation structure can partially block the common layer, so that the common layers on both sides of the isolation structure are not connected, thereby weakening the horizontal leakage phenomenon and improving the display effect of the display panel and the display device. In addition, by making the first isolation part and the second isolation part both be organic materials, it is not only beneficial to utilize the original film layer material in the display panel, but also the isolation structure can be formed by utilizing the etching rate difference between the first isolation part and the second isolation part, thereby reducing the manufacturing difficulty of the display panel and the display device. BRIEF DESCRIPTION OF DRAWINGS

[0046] In order to more clearly illustrate the technical solutions in the embodiments or the exemplary embodiments of the present application, the drawings needed to be used in the description of the embodiments or the exemplary embodiments will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without any creative effort on the basis of these drawings.

[0047] FIG. 1 is a plan view of a display panel according to an embodiment of the present application.

[0048] FIG. 2 is a schematic view of a partial cross-sectional structure of a display panel according to an embodiment of the present application.

[0049] FIG. 3 is a schematic view of a partial cross-sectional structure of another display panel according to an embodiment of the present application.

[0050] FIG. 4 is a schematic view of a partial cross-sectional structure of still another display panel according to an embodiment of the present application.

[0051] FIG. 5 is a schematic view of a partial plan view of a display panel according to an embodiment of the present application.

[0052] FIG. 6 is a schematic view of a partial plan view of another display panel according to an embodiment of the present application.

[0053] FIG. 7 is a schematic view of the arrangement of the isolation structure and the pixel openings of the display panel shown in FIG. 5 or FIG. 6.

[0054] FIG. 8 is a flowchart of a manufacturing method of a display panel according to an embodiment of the present application.

[0055] FIGS. 9-11 are schematic views of the cross-sectional structure of the display panel shown in FIG. 3 during the manufacturing process.

[0056] FIG. 12 is a structural schematic diagram of a display device according to an embodiment of the present application.

[0057] Reference signs:

[0058] 1, display device; 10, display panel; 10a, display area; 10b, non-display area;

[0059] 11, substrate; 12, pixel defining structure; 12a, pixel opening; 12b, isolation opening; 12c, first opening row; 12d, second opening row; 121, first pixel defining layer; 1211, second pit; 1212, second protrusion; 122, second pixel defining layer; 13, isolation structure; 13a, sub-section; 13b, notch; 131, first isolation portion; 132, second isolation portion; 14, planarization layer; 141, first pit; 142, first protrusion; 15, light emitting device; 151, first common layer; 1511, first sub-portion; 1512, second sub-portion; 152, first light emitting layer; 153, second light emitting layer; 154, second common layer; 155, third common layer; 156, first electrode; 157, second electrode; 16, support column; 17, pixel unit; 20, mask. DETAILED DESCRIPTION

[0060] For the purpose of promoting an understanding of the present application, the present application will be described in greater detail below with reference to the drawings. In the drawings, preferred embodiments of the present application are shown. However, the present application can be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and fully convey the scope of the application to those skilled in the art.

[0061] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0062] In describing a position relationship, unless otherwise defined, when an element, such as a layer, film or substrate, is referred to as being "on" another element, it can be directly on the other element or intervening elements can also be present. Further, when a layer is referred to as being "under" another layer, it can be directly under the other layer, or one or more intervening layers can also be present. It will also be understood that when a layer is referred to as being "between" two layers, it can be the only layer between the two layers, or one or more intervening layers can also be present.

[0063] In the case of using "include", "have", and "contain" described in this document, another component can be added unless an explicit limiting term such as "only", "consisting of", etc. is used. Unless otherwise mentioned, the singular form of the term can include the plural form and cannot be understood as one in number.

[0064] It should be understood that although the terms "first", "second", etc. can be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, without departing from the scope of the present application, a first element can be called a second element, and similarly, a second element can be called a first element.

[0065] It should also be understood that when interpreting elements, although not explicitly described, the elements are interpreted to include an error range that should be within an acceptable deviation range of a specific value determined by a person skilled in the art. For example, "about", "approximately", or "essentially" can mean within one or more standard deviations, without limitation here.

[0066] In addition, in the specification, the phrase "plan view diagram" refers to a figure when the target portion is viewed from above, and the phrase "cross-sectional view diagram" refers to a figure when a section is taken by cutting the target portion vertically and viewed from the side.

[0067] In addition, the drawings are not drawn to scale 1:1, and the relative sizes of the elements are only drawn by example in the drawings, not necessarily in true proportion.

[0068] Reducing the power consumption of display panels has always been one of the research directions of display technology. In display panels, the laminated organic light emitting diode (OLED) display panel technology can reduce the power consumption of the screen body, and at the same time can improve the service life, and has application prospects in small size, medium size, and large size OLED display fields. Due to the introduction of the common layer, the laminated OLED technology causes the horizontal flow of electrons in the common layer, thereby causing unnecessary lighting of the surrounding pixels, resulting in crosstalk phenomenon, affecting the display quality.

[0069] To solve the above problems, the present application provides a display panel and a preparation method thereof, and a display device, which will be described below in conjunction with the drawings.

[0070] In a first aspect, referring to FIG. 1, an embodiment of the present application provides a display panel 10, which can be an organic light-emitting diode display panel for example. The display panel 10 includes a display area 10a and a non-display area 10b, and a plurality of pixel units 17 are arranged in the display area 10a. Each pixel unit 17 includes a pixel driving circuit (not shown in the figure) and a light-emitting device 15, and the light-emitting device 15 emits light under the driving of the pixel driving circuit. The non-display area 10b is provided with a peripheral driving circuit, such as a light-emitting control circuit (not shown in the figure) and a gate driving circuit (not shown in the figure), and the light-emitting control circuit can provide a light-emitting control signal to the pixel driving circuit, and the gate driving circuit can provide a gate driving signal to the pixel driving circuit.

[0071] Specifically, referring to FIGS. 2 and 3, the display panel 10 includes a substrate 11, a planarization layer 14, a light-emitting device 15, a pixel definition structure 12, and an isolation structure 13. The substrate 11 can be an array substrate. From bottom to top, the substrate 11 can include a driving array formed by a plurality of film layers such as a gate layer, an active layer, an etching stop layer, a passivation layer, and the like, and the driving array includes, for example, pixel driving circuits in the display area 10a and peripheral driving circuits in the non-display area 10b.

[0072] Exemplarily, the light emitting device 15 comprises a first electrode 156, a light emitting layer group (not labeled in the figure) and a second electrode 157 arranged in a stack, the first electrode 156 can be an anode, the second electrode 157 can be a cathode, and the light emitting device 15 can be a single-layer light emitting structure or a stacked light emitting structure. Referring to FIG. 4, when the light emitting device 15 is a stacked light emitting structure, the light emitting layer group can comprise a second common layer 154, a first light emitting layer 152, a first common layer 151, a second light emitting layer 153 and a third common layer 155 arranged in a stack in a direction away from the substrate 11. When the light emitting device 15 is a single-layer light emitting structure, the light emitting layer group can comprise a second common layer 154, a first light emitting layer 152 and a third common layer 155 arranged in a stack in a direction away from the substrate 11. It should be noted that the display panel 10 comprises light emitting devices 15 for emitting different colors respectively, for example, a red light emitting device for emitting red light, a blue light emitting device for emitting blue light, and a green light emitting device for emitting green light. The light emitting layers (such as the first light emitting layer 152 and the second light emitting layer 153) of the light emitting devices 15 of different colors are different. The first common layer 151, the second common layer 154 and the third common layer 155 are common film layers. The first common layer 151 can comprise a charge generation layer (CGL), the second common layer 154 can comprise one or more of a hole injection layer (HIL), a hole transport layer (HTL) and an electron block layer (EBL). The third common layer 155 can comprise one or more of an electron injection layer (EIL), an electron transport layer (ETL) and a hole block layer (HBL).

[0073] Further, the planarization layer 14 is located on the side of the substrate 11 facing the pixel defining structure 12. The first electrode 156 is located on the planarization layer 14, and the pixel defining structure 12 is provided on one side of the substrate 11; the pixel defining structure 12 is provided with a plurality of pixel openings 12a arranged at intervals to expose part of the first electrode 156, and the pixel driving circuit in the driving array is electrically connected to the corresponding first electrode 156 respectively for driving the light emitting device 15 to emit light. The isolation structure 13 is provided on the side of the substrate 11 close to the pixel defining structure 12; the isolation structure 13 is provided between at least part of the adjacent pixel openings 12a.

[0074] The isolation structure 13 includes a first isolation portion 131 and a second isolation portion 132 which are stacked in a direction away from the substrate 11. A normal projection of the first isolation portion 131 on the substrate 11 is located within a range of a normal projection of the second isolation portion 132 on the substrate 11. The first isolation portion 131 and the second isolation portion 132 are both organic materials, and under a preset etching condition, an etching rate of the material of the first isolation portion 131 is greater than an etching rate of the material of the second isolation portion 132.

[0075] In the embodiments of the present application, the isolation structure 13 is arranged between at least some adjacent pixel openings 12a. This includes at least two cases. In a first case, the isolation structure 13 is arranged between some adjacent pixel openings 12a, but not between other adjacent pixel openings 12a. In a second case, the isolation structure 13 is arranged between any adjacent pixel openings 12a.

[0076] Further, the isolation structure 13 is an undercut structure which is large at the top and small at the bottom. The second isolation portion 132 extends towards the pixel opening 12a from a side end of the second isolation portion 132 close to the pixel opening 12a, and protrudes from a side wall of the first isolation portion 131 close to the pixel opening 12a. An undercut is formed below the protruding end of the second isolation portion 132. In this way, when a common film layer (such as the first common layer 151, the second common layer 154 or the third common layer 155 described above) is evaporated, the isolation structure 13 can block the common film layer on both sides of the isolation structure 13, thereby playing a role of isolation.

[0077] The display panel 10 provided by the embodiments of the present application can partially block the common film layer by arranging the isolation structure 13 between at least some adjacent pixel openings 12a. The isolation structure 13 includes a first isolation portion 131 and a second isolation portion 132, and a normal projection of the first isolation portion 131 on the substrate 11 is located within a range of a normal projection of the second isolation portion 132 on the substrate 11. In this way, the isolation structure 13 can block the common film layer on both sides of the isolation structure 13, so as to weaken the horizontal leakage phenomenon and improve the display effect of the display panel 10 and the display device 1. In addition, by making the first isolation portion 131 and the second isolation portion 132 both organic materials, it is not only beneficial to use the original film layer material in the display panel 10, but also the isolation structure 13 can be formed by using the difference in etching rate between the first isolation portion 131 and the second isolation portion 132, thereby reducing the process difficulty and the preparation difficulty of the display panel 10 and the display device 1.

[0078] In one of the embodiments, the pixel defining structure 12 is configured as a single film layer structure, i.e., the pixel defining structure 12 is composed of a single film layer. The second isolation portion 132 is made of the same material as the pixel defining structure 12 and is disposed in the same layer.

[0079] In this way, the second isolation portion 132 is disposed in the same layer as the pixel defining structure 12, which is equivalent to reusing the original pixel defining structure 12, patterning part of the original pixel defining structure 12, and then reusing the patterned part as the second isolation portion 132. In this way, on the one hand, the thickness of the display panel 10 can be reduced, and on the other hand, when manufacturing the second isolation portion 132, no new material needs to be deposited, and the pixel defining structure 12 can be directly patterned to obtain the second isolation portion 132, thereby reducing the manufacturing process of the display panel 10 and thus reducing the manufacturing cost and difficulty.

[0080] In one of the embodiments, the display panel 10 further includes a planarization layer 14 disposed between the substrate 11 and the pixel defining structure 12. The first isolation portion 131 is made of the same material as the planarization layer 14. It can be understood that the material of the planarization layer 14 is an organic material. By making the material of the first isolation portion 131 the same as the material of the planarization layer 14, the original film layer material in the display panel 10 can be used when manufacturing the first isolation portion 131, thereby helping to reduce the manufacturing cost and difficulty of the isolation structure 13.

[0081] In one of the embodiments, as shown in FIG. 2, the planarization layer 14 is provided with a first recess 141 on the side away from the substrate 11, and a first protrusion 142 is protruding from the bottom wall of the first recess 141, and the first protrusion 142 constitutes the first isolation portion 131.

[0082] In this way, the first isolation portion 131 is equivalent to reusing the original planarization layer 14, patterning part of the original planarization layer 14, and then reusing the patterned part as the first isolation portion 131. In this way, on the one hand, the thickness of the display panel 10 can be reduced, and on the other hand, when manufacturing the first isolation portion 131, no new material needs to be deposited, and the planarization layer 14 can be directly patterned to obtain the first isolation portion 131, thereby reducing the manufacturing process of the display panel 10 and thus reducing the manufacturing cost and difficulty.

[0083] In one of the embodiments, the material of the single-layer pixel defining structure 12 is a silicon-based pixel defining material. In this way, the pixel defining structure 12 and the planarization layer 14 can have a relatively obvious etching rate difference, and when manufacturing the isolation structure 13, the etching rate difference between the two film layers can be used to form an undercut structure with a large top and a small bottom.

[0084] In one of the embodiments, the material of the single-layer pixel defining structure 12 includes carbon, oxygen, silicon, etc. Specifically, a certain proportion of silicon oxide can be added in the organic material to form the material of the pixel defining structure 12.

[0085] In one of the embodiments, as shown in FIG. 2, the cross-sectional shape of the first isolation portion 131 and the cross-sectional shape of the second isolation portion 132 can both be a right trapezoid in the direction perpendicular to the paper plane. It can be understood that the cross-sectional shape of the first isolation portion 131 and the second isolation portion 132 can also be other shapes.

[0086] In one of the embodiments, the distance between the side surface of the isolation structure 13 away from the substrate 11 and the substrate 11 is not greater than the distance between the side surface of the pixel defining structure 12 away from the substrate 11 and the substrate 11. In this way, it is equivalent to making the top surface height of the isolation structure 13 not greater than the top surface height of the pixel defining structure 12. In this way, after adding the isolation structure 13 on the pixel defining structure 12, the thickness of the display panel 10 is not increased, which is conducive to the thinning of the display panel 10.

[0087] In one of the embodiments, the pixel defining structure 12 is a laminated structure formed by different film layers. As shown in FIG. 3, the pixel defining structure 12 includes a first pixel defining layer 121 and a second pixel defining layer 122 which are laminated in the direction away from the substrate 11. The second isolation portion 132 is made of the same material as the second pixel defining layer 122 and is arranged in the same layer; the first isolation portion 131 is made of the same material as the first pixel defining layer 121.

[0088] In this way, it is equivalent to reusing the original pixel defining structure 12. After patterning part of the original pixel defining structure 12, the original pixel defining structure 12 is reused as the isolation structure 13. In this way, on the one hand, it is conducive to reducing the thickness of the display panel 10, and on the other hand, when manufacturing the isolation structure 13, there is no need to deposit new materials. The isolation structure 13 can be obtained by directly patterning the pixel defining structure 12, which reduces the manufacturing process of the display panel 10, thereby reducing the preparation cost and difficulty.

[0089] In one of the embodiments, as shown in FIG. 3, the first pixel defining layer 121 is provided with a second recess 1211 away from the substrate 11, and a second protrusion 1212 is protrudingly arranged on the bottom wall of the second recess 1211, and the second protrusion 1212 constitutes the first isolation portion 131.

[0090] Thus, the original first pixel definition layer 121 is reused, and a part of the original first pixel definition layer 121 is patterned and reused as the first isolation portion 131. In this way, on the one hand, the thickness of the display panel 10 is reduced, and on the other hand, when the first isolation portion 131 is manufactured, no new material needs to be deposited, and the first pixel definition layer 121 is directly patterned to obtain the first isolation portion 131, thereby reducing the manufacturing process of the display panel 10 and reducing the manufacturing cost and difficulty.

[0091] Further, the original second pixel definition layer 122 is reused, and a part of the original second pixel definition layer 122 is patterned and reused as the second isolation portion 132. In this way, on the one hand, the thickness of the display panel 10 is reduced, and on the other hand, when the second isolation portion 132 is manufactured, no new material needs to be deposited, and the second pixel definition layer 122 is directly patterned to obtain the second isolation portion 132, thereby reducing the manufacturing process of the display panel 10 and reducing the manufacturing cost and difficulty.

[0092] In one of the embodiments, the first pixel definition layer 121 includes one or more of acrylic, phenolic resin, and polyimide, and the first pixel definition layer 121 is doped with a light-absorbing material. Further, the second pixel definition layer 122 includes one or more of acrylic, phenolic resin, and polyimide. Exemplarily, the first pixel definition layer 121 can be a black pixel definition film layer.

[0093] By doping the light-absorbing material in the first pixel definition layer 121, on the one hand, the first pixel definition layer 121 can absorb stray light, reduce the reflection of the array film layer, and improve the display performance of the display panel 10; on the other hand, it is beneficial to make the etching rate of the first pixel definition layer 121 greater than the etching rate of the second pixel definition layer 122, so as to facilitate the formation of the isolation structure 13 with the upper part being large and the lower part being small.

[0094] In one of the embodiments, the first pixel definition layer 121 includes one or more of acrylic, phenolic resin, and polyimide. The second pixel definition layer 122 includes carbon, oxygen, silicon, etc. Exemplarily, a certain proportion of silicon oxide can be added to the organic material to form the material of the second pixel definition layer 122.

[0095] In this way, it is beneficial to make the etching rate of the first pixel definition layer 121 greater than the etching rate of the second pixel definition layer 122, so as to facilitate the formation of the isolation structure 13 with the upper part being large and the lower part being small.

[0096] In one of the embodiments, referring to FIG. 4, the display panel 10 includes a first common layer 151, the first common layer 151 includes a first sub-portion 1511 and a second sub-portion 1512, the first sub-portion 1511 is arranged on a side of the pixel defining structure 12 away from the substrate 11, and the second sub-portion 1512 is arranged on a side of the isolation structure 13 away from the substrate 11. It can be understood that the first common layer 151 can include at least one of an electron transport layer, an electron injection layer, a hole transport layer, a hole injection layer, and a charge generation layer.

[0097] In one of the embodiments, the display panel 10 includes a plurality of light emitting devices 15, the plurality of light emitting devices 15 are arranged one-to-one corresponding to the plurality of pixel openings 12a, and at least part of each light emitting device 15 is arranged in the corresponding pixel opening 12a. Specifically, the light emitting device 15 includes a first light emitting layer 152 and a second light emitting layer 153 arranged in a stack away from the substrate 11, and part of the first sub-portion 1511 is located between the first light emitting layer 152 and the second light emitting layer 153. Specifically, the first common layer 151 can be a charge generation layer.

[0098] It should be noted that the leakage current of the charge generation layer is usually large, by arranging the isolation structure 13 between the adjacent two light emitting devices 15, so that the isolation structure 13 can block the first common layer 151 of the light emitting device 15 on both sides of the isolation structure 13, so that the leakage current cannot be directly transmitted from the first common layer 151 on one side of the isolation structure 13 to the first common layer 151 on the other side of the isolation structure 13, thereby reducing the leakage path between the adjacent two light emitting devices 15, improving the horizontal leakage phenomenon, and improving the display effect.

[0099] In one of the embodiments, the first common layer 151 includes a first doped layer and a second doped layer arranged in a stack away from the substrate 11. Specifically, the first doped layer can be a P-type semiconductor material, and the second doped layer can include an N-type semiconductor material.

[0100] Specifically, the P-type semiconductor material can be a P-type inorganic semiconductor material, a P-type metal dopant or a P-type organic semiconductor material, and the N-type semiconductor material can be an N-type inorganic semiconductor material, an N-type metal dopant or an N-type organic semiconductor material. In actual applications, the dopants of the first doped layer and the second doped layer are not limited, and the P-type semiconductor material and the N-type semiconductor material can be the same type of material or different types of materials. For example, the P-type semiconductor material of the first doped layer can be a P-type inorganic semiconductor material, and the N-type semiconductor material of the second doped layer can also be an N-type inorganic semiconductor material; or the P-type semiconductor material of the first doped layer can be a P-type metal dopant, and the N-type semiconductor material of the second doped layer can be an N-type organic semiconductor material. Here, the dopants of the first doped layer and the second doped layer are not listed one by one, and a person skilled in the art can design and select the dopants of the first doped layer and the second doped layer.

[0101] In one of the embodiments, the display panel 10 further includes a second common layer 154, a third common layer 155, a first electrode 156 and a second electrode 157. Among them, the first electrode 156, the second common layer 154, the first light-emitting layer 152, the first common layer 151, the second light-emitting layer 153, the third common layer 155 and the second electrode 157 are sequentially stacked in the direction away from the substrate 11. One of the first electrode 156 and the second electrode 157 is an anode, and the other is a cathode. In the embodiments of the present application, the first electrode 156 is an anode, and the second electrode 157 is a cathode.

[0102] It can be understood that the isolation structure 13 can also separate the second common layer 154, the third common layer 155 and the second electrode 157.

[0103] In one of the embodiments, in any two adjacent pixel openings 12a, the periphery of at least one pixel opening 12a is surrounded by the isolation structure 13. It can be understood that the light-emitting device 15 is arranged in each pixel opening 12a.

[0104] The above arrangement is equivalent to that the isolation structure 13 only needs to be arranged at the periphery of at least one of the two adjacent light-emitting devices 15. In this way, the common film layer of the two light-emitting devices 15 can be blocked, so as to weaken the lateral leakage phenomenon and improve the display effect of the display panel 10 and the display device 1.

[0105] In one of the embodiments, the periphery of each pixel opening 12a is surrounded by the isolation structure 13. In this way, the blocking effect of the isolation structure 13 on the common film layer is better, which is beneficial to further weaken the lateral leakage phenomenon.

[0106] In one of the embodiments, referring to FIGS. 5, 6 and 7, the isolation structure 13 comprises a plurality of sub-segments 13a arranged in intervals and surrounding the periphery of the corresponding pixel opening 12a. In this way, the isolation structure 13 can only partially isolate the common film layer (e.g., the first common layer 151, the second common layer 154 or the third common layer 155), but cannot completely isolate the common film layer. In this way, on the one hand, the leakage path of the common film layer can be reduced, thereby weakening the lateral leakage phenomenon; on the other hand, after the second electrode 157 is evaporated, the second electrode 157 is isolated in the region where the isolation structure 13 is arranged, and the second electrode 157 remains continuous in the region where the isolation structure 13 is not arranged. In this way, the structural integrity (or structural continuity) of the entire second electrode 157 will not be affected by the isolation structure 13, so as not to affect the transmission of the electrical signal on the second electrode 157.

[0107] In one of the embodiments, the orthogonal projection of the isolation structure 13 on the periphery of the pixel opening 12a on the substrate 11 is a ring structure. In this way, the common film layer can be completely isolated, thereby further reducing the leakage path of the common film layer, avoiding the lateral leakage phenomenon, and improving the display effect of the display panel 10.

[0108] In this case, the second electrode 157 will also be completely isolated, and the second electrode 157 is divided into a plurality of sub-electrode blocks, each of which corresponds to a light emitting device 15, and the sub-electrode blocks corresponding to each light emitting device 15 are not connected to each other. It can be understood that the sub-electrode blocks corresponding to each light emitting device 15 can be electrically connected to a fixed potential through an auxiliary electrode. Exemplarily, the auxiliary electrode can be arranged on the side of the second electrode 157 away from the substrate 11, and each sub-electrode block is electrically connected to the auxiliary electrode through a conductive column.

[0109] In one of the embodiments, referring to FIG. 5, the pixel defining structure 12 is provided with a plurality of first opening rows 12c and a plurality of second opening rows 12d arranged alternately along a first direction X, and each of the first opening row 12c and the second opening row 12d comprises a plurality of pixel openings 12a arranged in intervals along a second direction Y; the first direction X and the second direction Y are both perpendicular to the thickness direction of the substrate 11, and the first direction X and the second direction Y intersect. Wherein, the periphery of each pixel opening 12a in the first opening row 12c is surrounded by the isolation structure 13.

[0110] The above arrangement is equivalent to arranging the isolation structure 13 at the periphery of the pixel opening 12a in the first opening row 12c, and not arranging the isolation structure 13 at the periphery of the pixel opening 12a in the second opening row 12d. In this way, on the one hand, the isolation structure 13 can only partially separate the common film layer (such as the first common layer 151), and cannot completely separate the common film layer, thereby reducing the electric leakage path of the common film layer, weakening the horizontal electric leakage phenomenon, and improving the display effect of the display panel 10 and the display device 1; on the other hand, not arranging the isolation structure 13 in the second opening row 12d can make the second electrode form a continuous film layer structure in the region where the second opening row 12d is located, which is conducive to reducing the resistance of the second electrode. Further, the electrode signal in the second electrode is usually transmitted from one side of the second direction Y of the display panel 10 to the other side of the second direction Y. The above arrangement facilitates the transmission of the electrode signal in the second electrode along the second direction Y, thereby facilitating the reduction of voltage drop and improving the display effect.

[0111] In one of the embodiments, the first direction X and the second direction Y are perpendicular. For example, the first direction X is the width direction of the display panel 10, and the second direction Y is the length direction of the display panel 10.

[0112] In one of the embodiments, as shown in FIG. 6, the periphery of each pixel opening 12a is surrounded by the isolation structure 13. In the same isolation structure 13, the space between the two adjacent sub-segments 13a is a gap 13b; and in the two adjacent isolation structures 13, part of the gap 13b of one isolation structure 13 is arranged opposite to part of the sub-segment 13a of the other isolation structure 13.

[0113] In this way, the gaps 13b of the two adjacent isolation structures 13 can be avoided, which is conducive to increasing the electric leakage path and improving the horizontal electric leakage phenomenon. Compared with the arrangement in FIG. 5, the arrangement in FIG. 6 can better reduce the electric leakage path, thereby further weakening the electric leakage phenomenon.

[0114] In one of the embodiments, as shown in FIGS. 5 and 6, the display panel 10 further includes a support column 16, which is arranged on the side of the pixel limiting structure 12 away from the substrate 11 and is arranged in a spaced manner with the isolation structure 13; in the same isolation structure 13, the space between the two adjacent sub-segments 13a is a gap 13b. At least one gap 13b of the isolation structure 13 adjacent to the support column 16 faces the support column 16. It should be noted that the support column 16 can be used to support the mask plate when the light emitting device 15 is manufactured.

[0115] The notch 13b is arranged towards the support column 16, which is equivalent to arranging the notch 13b adjacent to the support column 16. In this way, the distance between the sub-segment 13a of the isolation structure 13 and the support column 16 can be large, so that, on the one hand, in the process of manufacturing the support column 16, it is helpful to prevent the material of the support column 16 from filling the undercut of the sub-segment 13a of the isolation structure 13, thereby affecting the isolation performance of the isolation structure 13; on the other hand, the support column 16 has a certain height, and the common film layer (such as the first common layer 151, the second common layer 154, or the third common layer 155) will cover the support column 16. Taking two adjacent isolation structures 13 as an example, one support column 16 is arranged between the two isolation structures 13. One notch 13b of one isolation structure 13 is opposite to one notch 13b of the other isolation structure 13, and the support column 16 is located between the two notches 13b, and the two notches 13b are both towards the support column 16. In this way, when the leakage current is transmitted from one notch 13b to the other notch 13b, it will pass through the support column 16 with a higher height, so that the support column 16 increases the transmission path between the two notches 13b, thereby increasing the leakage path, and further helping to weaken the lateral leakage.

[0116] In one of the embodiments, referring to FIGS. 2 and 3, the pixel defining structure 12 further comprises isolation openings 12b arranged corresponding to the isolation structures 13; at least part of the pixel openings 12a are surrounded by the isolation openings 12b; and at least part of the isolation structures 13 are arranged in the corresponding isolation openings 12b. In this way, the isolation structures 13 are arranged in the isolation openings 12b, which is helpful to reduce the thickness of the display panel 10. It can be understood that the arrangement of the isolation openings 12b matches the arrangement of the isolation structures 13.

[0117] In a second aspect, referring to FIG. 8, the present application provides a preparation method of a display panel, which comprises the following steps:

[0118] S10: providing a substrate 11.

[0119] S20: forming a first organic material layer and a second organic material layer on one side of the substrate 11.

[0120] S30: etching the first organic material layer and the second organic material layer under a preset etching condition, and forming the pixel defining structure 12 and the isolation structure 13. The pixel defining structure 12 is provided with a plurality of pixel openings 12a arranged at intervals; the isolation structure 13 is arranged between at least some adjacent pixel openings 12a; the isolation structure 13 comprises a first isolation portion 131 and a second isolation portion 132 arranged in a stacked manner away from the substrate 11; a normal projection of the first isolation portion 131 on the substrate 11 is located within a normal projection range of the second isolation portion 132 on the substrate 11; under the preset etching condition, the etching rate of the first organic material layer is greater than the etching rate of the second organic material layer.

[0121] The preparation method of the display panel provided by the embodiments of the present application sets the isolation structure 13 between at least some adjacent pixel openings 12a, the isolation structure 13 comprises a first isolation portion 131 and a second isolation portion 132, and a normal projection of the first isolation portion 131 on the substrate 11 is located within a normal projection range of the second isolation portion 132 on the substrate 11. In this way, the isolation structure 13 can partially block the common film layer, so that the common film layers on both sides of the isolation structure 13 are not connected, thereby weakening the lateral leakage phenomenon and improving the display effect of the display panel 10 and the display device 1. In addition, the pixel defining structure 12 and the isolation structure 13 are formed by etching the first organic material layer and the second organic material layer, which is equivalent to reusing the original pixel defining structure 12, patterning part of the original pixel defining structure 12, and then reusing it as the isolation structure 13. In this way, on the one hand, it is beneficial to reduce the thickness of the display panel 10, and on the other hand, when manufacturing the isolation structure 13, there is no need to deposit new materials, and the pixel defining structure 12 can be directly patterned to obtain the isolation structure 13, thereby reducing the manufacturing process of the display panel 10 and thus reducing the preparation cost and difficulty.

[0122] It should be noted that the pixel defining structure 12 can be a single-film-layer structure or a stacked structure.

[0123] In one of the embodiments, the pixel defining structure 12 is a stacked structure. It should be noted that when the pixel defining structure 12 is a stacked structure, a first electrode 156 needs to be formed on the substrate 11 before S20.

[0124] Specifically, S20: forming a first organic material layer and a second organic material layer in a stacked manner on one side of the substrate 11, specifically comprising the following steps:

[0125] S21: forming the first organic material layer on one side of the substrate 11.

[0126] S22: forming a plurality of first sub-pixel openings on the first organic material layer. Referring to FIG. 9, the first organic material layer is patterned to form the first sub-pixel openings.

[0127] S23: Forming a second organic material layer on the side of the first organic material layer away from the substrate 11.

[0128] In one example, the first organic material layer comprises one or more of acrylic, phenolic resin, polyimide, and the first organic material layer is doped with light-absorbing material. Further, the second organic material layer comprises one or more of acrylic, phenolic resin, polyimide.

[0129] In another example, the first organic material layer comprises one or more of acrylic, phenolic resin, polyimide. The second organic material layer comprises carbon, oxygen, silicon, etc. Illustratively, a certain proportion of silicon oxide can be added to the organic material to form the material of the second organic material layer.

[0130] S24: Forming a plurality of second sub-pixel openings on the second organic material layer. Referring to FIG. 10, the plurality of second sub-pixel openings correspond to the plurality of first sub-pixel openings one by one, and the corresponding first sub-pixel opening and second sub-pixel opening constitute a pixel opening 12a.

[0131] After the pixel opening 12a is formed, S30 is performed, and referring to FIG. 11, a mask 20 can be formed on the second organic material layer. The first organic material layer and the second organic material layer are subjected to patterning treatment using a preset etching condition, and the structure after the patterning treatment is shown in FIG. 3. Illustratively, the material of the mask 20 can be IZO (indium zinc oxide), ITO (indium tin oxide), IGZO (indium gallium zinc oxide), etc. The mask 20 using the above-mentioned material can provide better protection for the first electrode 156.

[0132] Specifically, the preset etching condition is that the chamber pressure is between 50 mTorr and 150 mTorr, illustratively, the chamber pressure can be 50 mTorr, 80 mTorr, 100 mTorr, 150 mTorr, etc. The source power is between 8 KW and 16 KW. Illustratively, the source power can be 8 KW, 10 KW, 12 KW, 15 KW, 16 KW, etc. The bias power is between 2 KW and 6 KW, illustratively, the bias power can be 2 KW, 4 KW, 6 KW, etc. The oxygen flow rate is between 800 sccm and 1600 sccm, illustratively, the oxygen flow rate can be 800 sccm, 1000 sccm, 1300 sccm, 1600 sccm, etc. The etching time is between 25 s and 45 s, illustratively, the etching time can be 25 s, 30 s, 40 s, 45 s, etc.

[0133] In one of the embodiments, the pixel defining structure 12 is a single-layer structure. S20: Forming a first organic material layer and a second organic material layer in a stack on one side of the substrate 11, specifically comprising the following steps:

[0134] S21: forming a first organic material layer on the substrate 11.

[0135] S22: forming a first electrode 156 on the first organic material layer.

[0136] S23: forming a second organic material layer on the first electrode 156 and the first organic material layer.

[0137] Further, after S20: forming the stacked first organic material layer and second organic material layer on one side of the substrate 11, and before S30: etching the first organic material layer and the second organic material layer under a preset etching condition, and forming the pixel defining structure 12 and the isolation structure 13, the method further includes the following step:

[0138] S25: forming a plurality of pixel openings 12a on the second organic material layer. That is, the second organic material layer is subjected to a patterning process to form the pixel openings 12a on the second organic material layer.

[0139] After the pixel openings 12a are formed, S30 is performed. Specifically, a mask 20 can be formed on the second organic material layer, and the first organic material layer and the second organic material layer are subjected to a patterning process under the preset etching condition. The structure after the patterning process is shown in FIG. 2. Exemplarily, the mask 20 can be made of IZO (indium zinc oxide), ITO (indium tin oxide), IGZO (indium gallium zinc oxide), etc. The mask 20 made of the above-mentioned materials can provide better protection for the first electrode 156.

[0140] Specifically, the preset etching condition is that the chamber pressure is between 50 mTorr and 150 mTorr. Exemplarily, the chamber pressure can be 50 mTorr, 80 mTorr, 100 mTorr, 150 mTorr, etc. The source power is between 8 KW and 16 KW. Exemplarily, the source power can be 8 KW, 10 KW, 12 KW, 15 KW, 16 KW, etc. The bias power is 0 KW. The oxygen flow is between 1600 sccm and 3200 sccm. Exemplarily, the oxygen flow can be 1600 sccm, 2000 sccm, 2800 sccm, 3200 sccm, etc. The etching time is between 25 s and 45 s. Exemplarily, the etching time can be 25 s, 30 s, 40 s, 45 s, etc.

[0141] It can be understood that after the isolation structure 13 is completed, an organic material can be evaporated to manufacture a light emitting element. The process is not described in detail in the embodiments of the present application.

[0142] In a third aspect, referring to FIG. 12, the embodiments of the present application provide a display device 1, which includes the display panel 10 in the first aspect.

[0143] The display device 1 can be a notebook computer, a mobile phone, a wireless device, a personal data assistant (PDA), a handheld or portable computer, a GPS receiver / navigator, a camera, an MP4 video player, a video camera, a game console, a watch, a clock, a calculator, a TV monitor, a flat panel display, a computer monitor, an automobile display (e.g., a speedometer display, etc.), a navigator, a cockpit controller and / or display, a display of a camera view (e.g., a display of a rearview camera in a vehicle), an electronic photo, an electronic billboard or sign, a projector, etc.

[0144] The display device 1 provided by the embodiments of the present application can partially block the common film layer by arranging the isolation structure 13 between at least some adjacent pixel openings 12a, the isolation structure 13 including a first isolation portion 131 and a second isolation portion 132, the orthographic projection of the first isolation portion 131 on the substrate 11 being located within the orthographic projection range of the second isolation portion 132 on the substrate 11. In this way, the isolation structure 13 can partially block the common film layer, so that the common film layers on both sides of the isolation structure 13 are not in communication, thereby weakening the lateral leakage phenomenon and improving the display effect of the display device 1. In addition, by making the first isolation portion 131 and the second isolation portion 132 both be organic materials, not only is it beneficial to utilize the original film layer materials in the display panel 10, but also the isolation structure 13 can be formed by utilizing the difference in etching rates of the first isolation portion 131 and the second isolation portion 132, thereby reducing the difficulty of manufacturing the display device 1.

[0145] The technical features of the above-described embodiments can be combined in any manner. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described, however, as long as the combinations of the technical features do not contradict each other, they should be considered to be within the scope of the present disclosure.

[0146] The above-described embodiments only express several implementation manners of the present application, and the description is relatively specific and detailed, but it should not be understood as a limitation on the scope of the present application. It should be noted that, for those skilled in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which are all within the protection scope of the present application. Therefore, the protection scope of the present application patent should be subject to the appended claims.

Claims

A display panel comprises: a substrate; a pixel defining structure disposed on one side of the substrate; a plurality of pixel openings are disposed on the pixel defining structure in a spaced manner; an isolation structure is disposed on the substrate close to the pixel defining structure; the isolation structure is disposed between at least some adjacent pixel openings; wherein the isolation structure comprises a first isolation portion and a second isolation portion which are disposed in a stacked manner away from the substrate; a normal projection of the first isolation portion on the substrate is located within a normal projection range of the second isolation portion on the substrate; the first isolation portion and the second isolation portion are both organic materials, and under a preset etching condition, the etching rate of the material of the first isolation portion is greater than the etching rate of the material of the second isolation portion. The display panel according to claim 1, wherein, The pixel defining structure is configured as a single film layer structure; the second isolation portion is made of the same material as the pixel defining structure and is disposed in the same layer. The display panel according to claim 2, wherein, The display panel further comprises a planarization layer disposed between the substrate and the pixel defining structure; the first isolation portion is made of the same material as the planarization layer. The display panel according to claim 3, wherein, The side of the planarization layer away from the substrate is provided with a first recess, and a first protrusion is protrudingly disposed on the bottom wall of the first recess, and the first protrusion constitutes the first isolation portion. The display panel according to claim 1, wherein, The pixel defining structure comprises a first pixel defining layer and a second pixel defining layer which are disposed in a stacked manner away from the substrate; The second isolation portion is made of the same material as the second pixel defining layer and is disposed in the same layer; the first isolation portion is made of the same material as the first pixel defining layer. The display panel according to claim 5, wherein, The side of the first pixel defining layer away from the substrate is provided with a second recess, and a second protrusion is protrudingly disposed on the bottom wall of the second recess, and the second protrusion constitutes the first isolation portion. The display panel according to any one of claims 1-6, wherein In any two adjacent pixel openings, the periphery of at least one of the pixel openings is surrounded by the isolation structure. The display panel according to claim 7, wherein The periphery of each pixel opening is surrounded by the isolation structure. The display panel according to any one of claims 1-6, wherein The pixel defining structure is provided with a plurality of first opening rows and a plurality of second opening rows which are alternately arranged along a first direction, each of the first opening rows and the second opening rows comprises a plurality of pixel openings arranged in a spaced manner along a second direction; the first direction and the second direction are both perpendicular to the thickness direction of the substrate, and the first direction and the second direction intersect; the periphery of each pixel opening in the first opening row is surrounded by the isolation structure. The display panel according to any one of claims 1-6, wherein The isolation structure comprises a plurality of sub-segments which are disposed in a spaced manner and surround the periphery of the corresponding pixel opening. The display panel according to claim 10, wherein The periphery of each pixel opening is surrounded by the isolation structure; In the same isolation structure, the space between two adjacent sub-segments is a gap; in two adjacent isolation structures, part of the gaps of one isolation structure are oppositely disposed with part of the sub-segments of the other isolation structure. The display panel according to claim 10, wherein The display panel further comprises a support column which is disposed on the side of the pixel defining structure away from the substrate and is spaced apart from the isolation structure; in the same isolation structure, the space between two adjacent sub-segments is a gap; At least one gap of the isolation structure adjacent to the support column faces the support column. The display panel according to any one of claims 1-6, wherein The display panel further comprises a first common layer, the first common layer comprises a first sub-portion and a second sub-portion, the first sub-portion is arranged on a side of the pixel defining structure away from the substrate, and the second sub-portion is arranged on a side of the isolation structure away from the substrate. The display panel according to claim 13, wherein, The display panel further comprises a plurality of light emitting devices, the plurality of light emitting devices are arranged one-to-one corresponding to the plurality of pixel openings, at least part of each light emitting device is arranged in the corresponding pixel opening. The light emitting device comprises a first light emitting layer and a second light emitting layer arranged in a stacked manner away from the substrate, and part of the first sub-portion is located between the first light emitting layer and the second light emitting layer. The pixel defining structure is further provided with an isolation opening corresponding to the isolation structure; at least part of the number of pixel openings is surrounded by the isolation opening; and at least part of the isolation structure is arranged in the corresponding isolation opening. The display panel according to any one of claims 1-6, wherein A preparation method of a display panel comprises: providing a substrate; forming a first organic material layer and a second organic material layer in a stacked manner on one side of the substrate; etching the first organic material layer and the second organic material layer under a preset etching condition, and forming a pixel defining structure and an isolation structure; the pixel defining structure is provided with a plurality of pixel openings arranged at intervals; at least part of the adjacent pixel openings is provided with the isolation structure; the isolation structure comprises a first isolation portion and a second isolation portion arranged in a stacked manner away from the substrate; the orthographic projection of the first isolation portion on the substrate is located within the orthographic projection range of the second isolation portion on the substrate; under the preset etching condition, the etching rate of the first organic material layer is greater than the etching rate of the second organic material layer. The preset etching condition is: chamber pressure is between 50 mTorr and 150 mTorr, source power is between 8 KW and 16 KW, bias power is between 2 KW and 6 KW, oxygen flow is between 800 sccm and 1600 sccm, and etching time is between 25 s and 45 s. The method of claim 16, wherein The step of forming the first organic material layer and the second organic material layer in a stacked manner on one side of the substrate comprises: forming the first organic material layer on one side of the substrate; forming a plurality of first sub-pixel openings on the first organic material layer; forming a second organic material layer on a side of the first organic material layer away from the substrate; forming a plurality of second sub-pixel openings on the second organic material layer; the plurality of second sub-pixel openings and the plurality of first sub-pixel openings are one-to-one corresponding and in communication, and the corresponding first sub-pixel opening and the second sub-pixel opening constitute the pixel opening. The preset etching condition is: chamber pressure is between 50 mTorr and 150 mTorr, source power is between 8 KW and 16 KW, bias power is 0 KW, oxygen flow is between 1600 sccm and 3200 sccm, and etching time is between 25 s and 45 s. The method of claim 16, wherein ​ After the step of forming the first organic material layer and the second organic material layer in a stack on one side of the substrate, and before the step of etching the first organic material layer and the second organic material layer under a preset etching condition, and forming a pixel defining structure and an isolation structure, the method comprises: forming the plurality of pixel openings on the second organic material layer. A display device comprising the display panel of any one of claims 1-15.

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